Video equipment

Abstract

To provide a video shooting device.SOLUTION: A video shooting device according to the present invention includes: an image sensor part; a first housing which includes the image sensor part and in which an open part is formed on the lower side; a second housing which is provided in the lower part of the first housing; a drive part which is provided in the second housing and moves the first housing in at least one direction with respect to the second housing; at least two couplers which penetrate the upper surface part of the second housing and connect the drive part with the bottom surface end of the first housing; and a cooling part which is connected to the upper surface part of the second housing and cools the image sensor part.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an image capturing apparatus, and more particularly to an image capturing apparatus having improved cooling performance. [Background technology]

[0002] In general, an image capturing apparatus is an apparatus for capturing an image of a subject. The image capturing apparatus may be applied to various inspection equipment, imaging equipment, communication equipment, etc. For example, the image capturing apparatus may be applied to display inspection equipment, semiconductor inspection equipment, printed circuit board inspection equipment, solar panel inspection equipment, etc.

[0003] As an example, Korean Patent No. 1391176 filed by the present applicant discloses an image capturing device that captures images by pixel-shifting an image sensor using a driving unit including a piezoelectric element, while cooling the image sensor using a cooling device that uses a thermoelectric module such as a Peltier element.

[0004] However, the prior art structure has a drawback in that the heat in the thermoelectric module is dissipated to the outside through the first and second housings, resulting in a long heat path. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Korean Patent No. 1391176 Summary of the Invention [Problem to be solved by the invention]

[0006] In order to solve the above problems, the present invention aims to provide an image capturing device that enables micro-operation of an image sensor while shortening a thermal path for dissipating heat generated in the image sensor to the outside, thereby improving the cooling performance of the image sensor. [Means for solving the problem]

[0007] The present invention provides an image capturing device including: an image sensor unit; a first housing having the image sensor unit therein and an opening formed on a lower side; a second housing provided at a lower part of the first housing; a driving unit provided in the second housing for moving the first housing in at least one direction relative to the second housing; at least two couplers penetrating an upper surface of the second housing and connecting the driving unit to a bottom end of the first housing; and a cooling unit coupled to the upper surface of the second housing for cooling the image sensor unit.

[0008] In an embodiment, the second housing has a drive unit accommodating space for accommodating the drive unit.

[0009] The second housing may have a plurality of coupler through-holes that communicate between the actuator accommodating space and an upper surface of the second housing and allow the couplers to pass through.

[0010] In an embodiment, the actuator may further include a coupler part coupled to an upper portion of the actuator in the actuator receiving space, the coupler being formed in the coupler part.

[0011] Also, the lower surface of the first housing does not need to be in direct contact with the upper surface of the second housing.

[0012] In one embodiment, a thermally conductive medium is provided between the cooling unit and the image sensor unit, the thermally conductive medium being in contact with the cooling unit and the image sensor unit.

[0013] The image sensor unit may be provided so as to be slightly movable while being in contact with the thermally conductive medium.

[0014] In one embodiment, the cooling unit is coupled to the image sensor unit via a sensor block, and a thermally conductive medium is provided between the sensor block and the image sensor unit.

[0015] In an embodiment, the first housing includes a first upper housing having a transparent window formed therein, and a first lower housing coupled to a lower portion of the first upper housing.

[0016] An image sensor board on which the image sensor unit is mounted may be sandwiched and fixed to a joining surface between the first upper housing and the first lower housing.

[0017] The image sensor board may also include an extension portion exposed to an outside of the first housing.

[0018] The housing may further include an upper image sensor board cover and a lower image sensor board cover that are coupled to the outside of the first housing to cover the extension or that are integrally formed with the first upper housing and the first lower housing, respectively.

[0019] Also, a cable may be connected to the extension, and the cable may be connected to a main board provided in the second housing through a cable through hole formed in an upper surface of the second housing.

[0020] In one embodiment, a protrusion is formed on an upper surface of the second housing, and a lower opening of the first housing is coupled to an outer circumferential surface of the protrusion.

[0021] In one embodiment, the cooling portion may be coupled to an upper surface of the second housing inside the protrusion.

[0022] A sealing member may be provided on an outer circumferential surface of the protrusion, and the sealing member may be provided to be elastically deformable, thereby allowing the first housing to move in the one direction.

[0023] The coupler may also couple the drive portion and the end of the first housing outside the protrusion. Effect of the Invention

[0024] According to the present invention, it is possible to obtain an image capturing apparatus which can further improve the cooling performance of the image sensor portion and has an improved structure and thus improved manufacturing characteristics. [Brief description of the drawings]

[0025] [Figure 1] 1 is a perspective view of an image capturing apparatus according to a first embodiment of the present invention. [Diagram 2] 2 is a cross-sectional view of the image capturing apparatus according to the first embodiment of the present invention, taken along the line AA' of FIG. [Diagram 3] 2 is a perspective view of a second housing of the image capturing device according to the first embodiment of the present invention. FIG. [Figure 4] 3 is a front view of a second housing of the image capturing device according to the first embodiment of the present invention. FIG. [Diagram 5] 2 is a partially cutaway view of a first housing of an image shooting device according to a first embodiment of the present invention. [Figure 6] 11 is a view showing another embodiment of the second housing in the image shooting device according to the first embodiment of the present invention. [Figure 7] FIG. 5 is a cross-sectional view of an image capturing apparatus according to a second embodiment of the present invention. [Figure 8] 13 is an exploded perspective view of a second housing, a first lower housing, a drive unit, and a coupler unit in an image capturing device according to a second embodiment of the present invention. FIG. [Figure 9] 13 is a view showing a coupling configuration of a board cover coupled to an outer side of a first housing in an image shooting device according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, when adding reference symbols to components in each drawing, it should be noted that the same symbols are used for the same components even when they are displayed in other drawings. In addition, when describing the present invention, detailed descriptions of related known configurations or functions are omitted if it is determined that such descriptions may obscure the gist of the present invention. In addition, although preferred embodiments of the present invention will be described below, the technical idea of ​​the present invention is not limited thereto, and may be modified and variously implemented by those skilled in the art.

[0027] Fig. 1 is a perspective view of an image shooting device according to a first embodiment of the present invention, Fig. 2 is a cross-sectional view of the image shooting device according to the first embodiment of the present invention, taken along the line A-A' in Fig. 1. Fig. 3 is a perspective view of a second housing of the image shooting device according to the first embodiment of the present invention, Fig. 4 is a front view of the second housing of the image shooting device according to the first embodiment of the present invention, and Fig. 5 is a cutaway view of a part of the first housing of the image shooting device according to the first embodiment of the present invention.

[0028] A video imaging device 1 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 5.

[0029] The image capturing device 1 according to the first embodiment of the present invention includes a first housing 10, a second housing 40, an image sensor unit 20, a cooling unit 30, and a driving unit 50. A cooling fan 60 for circulating air for cooling may be further provided below the heat dissipation pins 46 of the second housing 40.

[0030] The first housing 10 is coupled to the upper part of the second housing 40 in a state in which it can be micro-driven. A transparent window 12 through which light can enter may be provided at an upper opening of the first housing 10. Also, the first housing 10 is provided with an image sensor unit 20 below the transparent window 12. In one embodiment, the image sensor unit 20 may be configured in a form in which an image sensor is mounted or installed on a printed circuit board.

[0031] The lower part of the first housing 10 is open. In one embodiment, a housing coupling part 14 is formed on the inner lower part of the first housing 10, which is coupled to the outside of a protrusion 42 formed on the upper part of the second housing 40, which will be described later. The housing coupling part 14 may be hollow and have a shape corresponding to the outer shape of the protrusion 42.

[0032] In one embodiment, the lower surface of the first housing 10 is not in direct contact with the upper surface of the second housing 40, allowing the first housing 10 to be micro-moved.

[0033] 3 and 4, the second housing 40 includes a drive unit accommodating space 48 that accommodates the drive unit 50. In one embodiment, at least one side of the drive unit accommodating space 48 may be formed to be open.

[0034] The second housing 40 may have a protrusion 42 formed to protrude upward on an upper surface thereof. A sealing member insertion groove 41 may be formed on an outer circumferential surface of the protrusion 42. In one embodiment, the protrusion 42 may be formed in a ring shape.

[0035] A plurality of coupler through holes 44 are formed to communicate between the drive unit accommodating space 48 of the second housing 40 and the upper surface of the second housing 40. The coupler through holes 44 may be formed on the outside of the protruding portion 42. Although first to fourth coupler through holes 44a, 44b, 44c, and 44d are illustrated in FIG. 3, in the practice of the present invention, a plurality of coupler through holes, at least two or more, may be provided. In FIG. 3, the coupler through holes 44 are arranged in the angular direction on the upper surface of the second housing 40, but the formation position of the coupler through holes 44 is not limited to that shown in FIG. 3.

[0036] The second housing 40 has a bottom surface provided with heat dissipation pins 46 for improving heat dissipation performance. Although the heat dissipation pins 46 are shown to be formed on the bottom surface of the second housing 40 in Figs. 3 and 4, the heat dissipation pins 46 may be formed on the outer side surface of the second housing 40.

[0037] In the embodiment of Fig. 3 and Fig. 4, the second housing 40 including the heat dissipation pin 46 except for the protrusion 42 is formed to have the same profile. As a result, the second housing 40 can be integrally formed by extruding a material such as aluminum and then cutting it, simplifying the process and reducing manufacturing costs. It is also possible to manufacture the second housing 40 excluding the protrusion 42 by extrusion, and then bond the protrusion 42 to the upper part of the second housing 40. In addition, the second housing 40 can be manufactured by extruding the entire profile including the height of the protrusion 42, and then machining a shape corresponding to the protrusion 42.

[0038] 2 and 5, the actuator 50 is accommodated in the actuator accommodating space 48 of the second housing 40, and a plurality of couplers 52 are provided on the upper side of the actuator 50, which penetrate the upper part of the second housing 40 through the coupler through-holes 44 and are coupled to the bottom end of the first housing 10. The plurality of couplers 52 may be coupled to the upper side of the actuator 50 and the bottom end of the first housing 10 by using methods such as welding, adhesive, forced fitting, or screw coupling.

[0039] The multiple couplers 52 may be provided as first to fourth couplers 52a, 52b, 52c, and 52d corresponding to the first to fourth coupler through-holes 44. However, due to the characteristics of the illustrations in Figures 2 and 5, the third coupler 52c is not shown. It is preferable that the cross-sectional size of the coupler through-hole 44 is formed larger than the cross-section of the coupler 52, so that the coupler 52 can move slightly in the horizontal direction within the coupler through-hole 44.

[0040] In one embodiment, the actuator 50 may be a nano-stage including a piezoelectric element. The piezoelectric element constituting the actuator 50 may be configured in a form in which a plurality of piezoelectric element panels are stacked. The actuator 50 may slightly move the first housing 10 in at least one horizontal direction via the coupler 52. As a result, the image sensor unit 20 coupled inside the first housing 10 may also be slightly moved in the horizontal direction.

[0041] Meanwhile, since the lower portion of the first housing 10 is open, a sealing member 43 such as an O-ring or a quad-ring is provided in a sealing member insertion groove 41 formed on the outer circumferential surface of the protrusion 42 of the second housing 40 in order to keep the internal space of the first housing 10, which houses the image sensor unit 20, airtight. In one embodiment, it is preferable that the sealing member 43 is configured to be elastically deformable in the horizontal direction so that the airtightness is maintained even when the first housing 10 is slightly moved in the horizontal direction by the driving unit 50.

[0042] The cooling unit 30 is provided between the upper surface of the second housing 40 and the image sensor unit 20. In one embodiment, the cooling unit 30 may be a thermoelectric module such as a Peltier element. The cooling unit 30 cools a surface (cooling surface) facing the image sensor unit 20 by supplying electricity, absorbs heat generated in the image sensor unit 20, and then releases the heat to the second housing 40 through the opposite surface (heat generating surface).

[0043] In the present invention, the heat generating surface of the cooling unit 30 is in direct contact with the upper surface of the second housing 40. As a result, the heat of the cooling unit 30 is directly dissipated through the second housing 40, and thus the heat path for dissipating the heat generated in the image sensor unit 20 to the outside is shortened, and the cooling performance of the image sensor unit 20 can be improved. Meanwhile, since the lower end of the first housing 10 is not directly connected to the upper part of the second housing 40, the transfer of the heat of the second housing 40 to the first housing 10 is minimized during the process in which the heat generated in the cooling unit 30 is dissipated through the second housing 40. As a result, the heat dissipated to the second housing 40 can be prevented from returning to the image sensor unit 20. In addition, in one embodiment, the first housing 10 may be preferably made of a material having a lower thermal conductivity than the second housing 40.

[0044] A thermally conductive medium 32 is provided between the cooling unit 30 and the image sensor unit 20 so as to be in contact with the cooling unit 30 and the image sensor unit 20. The thermally conductive medium 32 may be thermal grease or a thermal pad. In the present invention, since the cooling unit 30 is coupled to an upper surface of the second housing 40 and the first housing 10 is formed to be slightly movable by the driving unit 50, it is preferable that the thermally conductive medium 32 contacts the bottom surface of the image sensor unit 20 while allowing the image sensor unit 20 to move slightly.

[0045] FIG. 6 is a view showing another embodiment of the second housing in the image shooting device according to the first embodiment of the present invention.

[0046] 6, the protrusion 42' formed on the upper part of the second housing 40 may be substantially rectangular, but is not limited thereto and may be another polygonal shape other than a rectangle. Also, the shape of the housing coupling part 14 formed on the lower inside part of the first housing 10 is formed to correspond to the protrusion 42'. A sealing member insertion groove 41' is formed on the outer circumferential surface of the protrusion 42'.

[0047] Furthermore, the coupler through-hole 44' may be disposed so as to be located approximately in the center of a side of the upper surface of the second housing 140, rather than on a corner side.

[0048] Fig. 7 is a cross-sectional view of an image capturing device according to a second embodiment of the present invention, Fig. 8 is an exploded perspective view of a second housing, a first lower housing, a driving unit, and a coupler unit in the image capturing device according to the second embodiment of the present invention, and Fig. 9 is a view showing a coupling structure of a board cover coupled to the outside of a first housing in the image capturing device according to the second embodiment of the present invention.

[0049] The image shooting device 100 according to the second embodiment of the present invention includes a first housing 110, a second housing 140, an image sensor unit 120, a cooling unit 130, and a driving unit 150. A heat dissipation pin 146 provided on one side of the second housing 140 may further include a cooling fan 160 for circulating air for cooling. The image shooting device 100 according to the second embodiment has the same basic technical concept as the image shooting device 1 according to the first embodiment, and is provided with an image sensor board 124 for the image sensor unit 120, and the first housing 110 is configured to fix the image sensor board 124, and is partially different in the configuration of a coupler unit 170 for transmitting the driving force of the driving unit 150 to the first housing 110. In addition, a cover 102 for covering an upper portion of the first housing 110 may be further provided.

[0050] The cover 102 has a central opening 104 , and a lower end of the cover 102 may be coupled to an upper portion of the second housing 140 .

[0051] The first housing 110 may include a first upper housing 110A and a first lower housing 110B. The first upper housing 110A may include a transparent window 112 through which light can enter. The first upper housing 110A may be coupled to an upper portion of the first lower housing 110B. In one embodiment, an image sensor board 124 for the image sensor unit 120 may be sandwiched and fixed between the first upper housing 110A and the first lower housing 110B. In this case, board sealing members 111a and 111b may be provided on a surface of the image sensor board 124 that contacts the first upper housing 110A and the first lower housing 110B to improve airtightness. For example, referring to FIG. 8, a groove 106 for the board sealing member 111b may be formed on an upper surface of the first lower housing 110B.

[0052] The first lower housing 110B has a shape that is open at the top and bottom, and a housing coupling part 114 is formed on an inner lower part of the first lower housing 110B, which is coupled to an outer circumferential surface of a protrusion 142 formed on an upper part of the second housing 140. The housing coupling part 114 may have a hollow shape that corresponds to the outer shape of the protrusion 142.

[0053] The protrusion 142 formed on the upper part of the second housing 140 may be formed in a ring shape, and a sealing member insertion groove 141 is formed on the outer circumferential surface of the protrusion 142, and a sealing member 143 such as an O-ring or a quad ring is provided in the sealing member insertion groove 141.

[0054] In one embodiment, the image sensor unit 120 may be coupled to the image sensor socket 122 of the image sensor board 124 and disposed in the internal space of the first housing 110. The image sensor board 124 may be sandwiched and fixed between the first upper housing 110A and the first lower housing 110B, while an extension 124a of the image sensor board 124 may protrude to the outside of the first housing 110. A circuit element 125 for the image sensor unit 120 may be provided on the extension 124a of the image sensor board 124. In addition, a cable 129 may be coupled to the extension 124a, and the cable 129 may be connected to a main board 180 provided in the second housing 140 through a cable through hole 145 formed in the second housing 140.

[0055] On the other hand, when the extension portion 124a of the image sensor board 124 is exposed to the outside of the first housing 110, the extension portion 124a minimizes heat exchange with the outer space of the first housing 110, and an image sensor board cover 126, 128 for covering the extension portion 124a may be provided on the outside of the first housing 110.

[0056] 7 and 9, the image sensor board cover may be divided into a lower image sensor board cover 126 and an upper image sensor board cover 128, but the lower image sensor board cover 126 and the upper image sensor board cover 128 may be provided as separate parts from the first housing 110. Also, the lower image sensor board cover 126 and the upper image sensor board cover 128 may be formed of a plastic or rubber material having low thermal conductivity. However, in one embodiment, the lower image sensor board cover 126 may be formed integrally with the first lower housing 110B, and the upper image sensor board cover 128 may be formed integrally with the first upper housing 110A.

[0057] The cooling unit 130 is provided between the upper surface of the second housing 140 and the image sensor unit 120. The cooling unit 130 is coupled to and in contact with the upper surface of the second housing 140. In one embodiment, the cooling unit 130 may be a thermoelectric module such as a Peltier element. The cooling unit 130 is cooled on a surface (cooling surface) facing the image sensor unit 120 by electricity supply, absorbs heat generated in the image sensor unit 120, and then releases the heat to the second housing 140 through the opposite surface (heat generating surface).

[0058] In an embodiment, the cooling unit 130 may be connected to a bottom surface of the image sensor unit 120 via the sensor block 134. The sensor block 134 may function as a kind of cold finger. A thermally conductive medium 132 may be provided between the sensor block 134 and the image sensor unit 120. Adhesive parts 136a and 136b are provided on the upper and lower surfaces of the cooling unit 130 so that the cooling unit 130 can be firmly attached to the upper surface of the second housing 140 and the lower surface of the sensor block 134. In an embodiment, the adhesive parts 136a and 136b may be formed using an adhesive. A through-hole is formed in the image sensor board 124 on the bottom side of the image sensor unit 120 so that the cooling unit 130 and the sensor block 134 can pass through.

[0059] The actuator accommodating space 148 of the second housing 140 accommodates the actuator 150, and a coupler unit 170 for transmitting the micro-actuation of the actuator 150 to the first housing 110 is provided on the upper side of the actuator 150. The coupler unit 170 may be fixed to the upper side of the actuator 150 by a fixing screw 151. In one embodiment, at least a portion of the actuator 150 is fixed to the second housing 140, and the coupler unit 170 may be micro-actuated by the actuation of the actuator 150.

[0060] 8, the coupler unit 170 includes a fixed plate 172 and a plurality of couplers 174 provided on the fixed plate 172. The fixed plate 172 is fixed to an upper portion of the driving unit 150, and the couplers 174 may be configured to protrude in a direction perpendicular to the fixed plate 172.

[0061] A coupler through-hole 144 is formed in the upper surface of the second housing 140, penetrating vertically, and the coupler 174 is coupled to the bottom surface of the first lower housing 110B through the coupler through-hole 144. In one embodiment, a fixing screw (not shown) is coupled to a coupling hole 176 formed in the upper part of the coupler 174 through a coupler fixing screw hole 108 formed in the first lower housing 110B, so that the coupler 174 can be coupled to the first lower housing 110B.

[0062] The above description is merely illustrative of the technical idea of ​​the present invention, and various modifications, changes, and substitutions can be made by a person having ordinary knowledge in the technical field to which the present invention belongs, without departing from the essential characteristics of the present invention. Therefore, the embodiments and accompanying drawings disclosed in the present invention are for the purpose of explaining, not limiting, the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by such embodiments and accompanying drawings. The scope of protection of the present invention should be interpreted by the claims, and all technical ideas within the equivalent range should be interpreted as being included in the scope of the present invention. [Explanation of symbols]

[0063] 1, 100 ···Video equipment 10, 110...First housing 12, 112 Transparent window 20, 120: Image sensor section 30, 130...Cooling section 32, 132 Thermally conductive medium 40, 140...Second housing 42, 142...Protrusion 44, 144 Coupler through hole 46, 146 Heat dissipation pin 48, 148 Drive unit housing space 50, 150 ... Drive unit 52, 174 ··· Coupler 60, 160... Cooling fan 170 ···Coupler section

Claims

1. Image sensor section; a first housing having the image sensor unit therein and an opening formed on a lower side; a second housing provided below the first housing; a drive portion provided in the second housing for moving the first housing relative to the second housing in at least one direction; at least two couplers that extend through a top surface of the second housing and connect the drive section to a bottom end of the first housing; and a cooling unit coupled to an upper surface of the second housing and configured to cool the image sensor unit; Including, The second housing has an upper surface provided with a protrusion, and the lower opening of the first housing is coupled to an outer circumferential surface of the protrusion.

2. The image capturing apparatus according to claim 1 , wherein the second housing has a drive unit receiving space for receiving the drive unit.

3. The image capturing apparatus according to claim 2 , wherein the second housing is formed with a plurality of coupler through-holes that communicate the drive unit accommodating space with an upper surface of the second housing and through which the couplers pass.

4. a coupler part coupled to an upper part of the driving part in the driving part receiving space, 4. The video photographing apparatus according to claim 3, wherein the coupler is formed in the coupler section.

5. 2. The image capturing device of claim 1, wherein a lower surface of the first housing does not contact an upper surface of the second housing.

6. The image capturing apparatus according to claim 1 , further comprising a thermally conductive medium disposed between the cooling unit and the image sensor unit and in contact with the cooling unit and the image sensor unit.

7. 7. The video photographing device according to claim 6, wherein the image sensor unit is capable of slight movement while being in contact with the thermally conductive medium.

8. The image capturing apparatus of claim 1 , wherein the cooling unit is coupled to the image sensor unit via a sensor block, and a thermally conductive medium is provided between the sensor block and the image sensor unit.

9. The image capturing apparatus of claim 1 , wherein the first housing comprises a first upper housing having a transparent window formed therein, and a first lower housing coupled to a lower portion of the first upper housing.

10. 10. The image capturing apparatus of claim 9, wherein an image sensor board on which the image sensor unit is mounted is sandwiched and fixed to a joining surface between the first upper housing and the first lower housing.

11. The image capturing apparatus of claim 10 , wherein the image sensor board includes an extension portion exposed to an outside of the first housing.

12. 12. The image capturing device of claim 11, further comprising an upper image sensor board cover and a lower image sensor board cover coupled to an outside of the first housing to cover the extension or integrally formed with the first upper housing and the first lower housing, respectively.

13. 12. The image capturing device of claim 11, wherein a cable is connected to the extension, and the cable is connected to a main board provided in the second housing through a cable through hole formed on an upper surface of the second housing.

14. The image capturing apparatus of claim 1 , wherein the cooling part is coupled to an upper surface of the second housing inside the protrusion.

15. The image capturing apparatus according to claim 1 , wherein a sealing member is provided on an outer circumferential surface of the protrusion in an elastically deformable manner to enable the first housing to move in the one direction.

16. The image capturing apparatus of claim 1 , wherein the coupler couples the driving part and the end of the first housing on an outer side of the protrusion.

Images