Plasma processing apparatus, substrate processing system and fixture
The fastener system with a movable holding member and spherical member guided by a tapered portion simplifies component attachment and detachment in plasma processing apparatuses, enhancing assembly efficiency and reducing maintenance time.
Patent Information
- Application Number
- JP2025511419
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2024-04-09
- Filing Date
- 2024-06-13
- Publication Date
- 2025-05-21
- Estimated Expiration
- 2044-06-13
AI Technical Summary
Existing plasma processing apparatuses face challenges in facilitating easy attachment and detachment of components, which complicates assembly, maintenance, and replacement of consumables.
A fastener system is introduced comprising a male and female member with a movable holding member and spherical member, guided by a tapered portion, allowing for easy attachment and detachment of components by mechanical operation without screws, utilizing fluid or elastic forces for movement.
Facilitates quick and efficient assembly and disassembly of plasma processing apparatus components, reducing labor hours and maintenance time, while maintaining electrical connectivity between components.
Smart Images

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Abstract
Description
[Technical field]
[0001] SUMMARY Exemplary embodiments of the present disclosure relate to plasma processing apparatus, substrate processing systems and fixtures. [Background technology]
[0002] Patent Document 1 discloses that the electrostatic chuck and the electrostatic chuck mounting plate are fastened by a plurality of first fasteners, and a mounting table for mounting a substrate thereon is fastened to a support member by a plurality of second fasteners. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] JP 2019-197830 A Summary of the Invention [Problem to be solved by the invention]
[0004] The present disclosure provides a technique for facilitating attachment and detachment between components of a plasma processing apparatus or a substrate processing system. [Means for solving the problem]
[0005] In one exemplary embodiment of the present disclosure, a plasma processing apparatus including a chamber includes a first member, a second member, and a fastener configured to detachably fasten the first member and the second member along an axial direction, the fastener including a male member fixed to the first member, and a female member fixed to the second member and configured to receive the male member, the male member including a shaft member extending in the axial direction and expanding in diameter at a tip, the female member including a housing member fixed to the second member, a holding member disposed within the housing member, and a holding member and a spherical member held in the accommodating member, the accommodating member having an opening for receiving the axial member of the male member and an accommodating space for accommodating the holding member and the spherical member, an inner wall of the accommodating member defining the accommodating space having a tapered portion that reduces in diameter in the radial direction, the holding member being configured to be movable along the axial direction within the accommodating space while holding the spherical member, the spherical member being guided by the tapered portion of the inner wall to move radially inward when the holding member moves in a first direction which is the axial direction toward the opening. Effect of the Invention
[0006] According to one exemplary embodiment of the present disclosure, a technique for facilitating attachment and detachment between components of a plasma processing apparatus or a substrate processing system can be provided. [Brief description of the drawings]
[0007] [Figure 1] FIG. 1 is a diagram for explaining a configuration example of a plasma processing system. [Diagram 2] FIG. 1 is a diagram for explaining a configuration example of a capacitively coupled plasma processing apparatus. [Diagram 3] FIG. 2 is a diagram illustrating an example of a fixing structure FS. [Figure 4A] 11A and 11B are diagrams for explaining an example of a moving position of a spherical member. [Figure 4B] 11A and 11B are diagrams for explaining an example of a moving position of a spherical member. [Diagram 5] 11A to 11C are diagrams showing an example of a method of using the fixing tool F. [Figure 6A] 13A and 13B are diagrams illustrating another example of a drive mechanism for a holding member. [Figure 6B] 13A and 13B are diagrams illustrating another example of a drive mechanism for a holding member. [Figure 7] 13 is a diagram for explaining another example of the fixing device F. FIG. [Figure 8] 13A to 13C are diagrams for explaining another example of the fixing device F and its operation. [Figure 9] 13A to 13C are diagrams for explaining another example of the fixing device F and its operation. [Figure 10] FIG. 2 is a diagram for explaining an example of the configuration of a substrate processing system PS. [Figure 11] 13A to 13C are diagrams for explaining application examples of the fixing device F. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0008] Each embodiment of the present disclosure will be described below.
[0009] In one exemplary embodiment, there is provided a plasma processing apparatus having a chamber, the plasma processing apparatus including: a first member; a second member; and a fastener configured to detachably fasten the first member and the second member along an axial direction, the fastener including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, the male member including an axial member extending in the axial direction and expanding in diameter at a tip, the female member including an accommodating member fixed to the second member, a holding member disposed within the accommodating member, and a spherical member held by the holding member, the accommodating member including an opening for receiving the axial member of the male member and an accommodating space for accommodating the holding member and the spherical member, an inner wall of the accommodating member defining the accommodating space including a tapered portion that reduces in diameter in the radial direction, the holding member configured to be movable along the axial direction within the accommodating space while holding the spherical member, and the spherical member configured to be guided by the tapered portion of the inner wall to move radially inward when the holding member moves in a first direction which is the axial direction and toward the opening.
[0010] In one exemplary embodiment, the retaining member is moved in the first direction by a resilient member disposed within the receiving space.
[0011] In one exemplary embodiment, the retaining member is moved in a first direction by a first fluid flowing into the receiving space.
[0012] In one exemplary embodiment, the retaining member is moved in a second direction opposite to the first direction by a second fluid flowing into the receiving space.
[0013] In one exemplary embodiment, the storage space includes a first space into which a first fluid is flowed and a second space into which a second fluid is flowed, and the space between the first space and the second space is sealed by a sealing member.
[0014] In one exemplary embodiment, the second space is provided closer to the opening than the first space, and a gap between the second space and the opening is sealed by a seal member.
[0015] In one exemplary embodiment, the holding member is configured to receive a force in a first direction or a force in a second direction opposite to the first direction via a cylinder or a motor.
[0016] In one exemplary embodiment, the retaining member further comprises a locking structure that restricts radially inward movement of the spherical member.
[0017] In one exemplary embodiment, at least one of the first member and the second member is a member disposed within the chamber.
[0018] In one exemplary embodiment, at least one of the first member and the second member is a member that constitutes the chamber or is a member that is disposed outside the chamber.
[0019] In one exemplary embodiment, the device further includes a seal member that seals between the opening and an external space of the chamber when the first member and the second member are fixed by the fastener.
[0020] In one exemplary embodiment, at least one of the first member and the second member constitutes an electrode of a plasma processing apparatus, and the fixture is configured such that when the first member and the second member are fixed by the fixture, the male member and the female member are electrically connected to each other to provide a conductive path to the electrode.
[0021] In one exemplary embodiment, a plasma processing apparatus is provided that has a chamber, the plasma processing apparatus including: a first member, a second member; and a fastener configured to removably fasten the first member and the second member along an axial direction, the fastener including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, the female member including a first moving body configured to be freely movable along the axial direction between a clamped position and an unclamped position; and a second moving body held by the first moving body, configured to move to a position that restricts axial movement of the male member in the clamped position, and to move to a position that does not hinder axial movement of the male member in the unclamped position.
[0022] In one exemplary embodiment, at least one of the first and second members forms an electrode of a plasma processing apparatus, and the fixture is configured such that, in the clamped position, the male and female members are electrically connected to each other to provide a conductive path to the electrode.
[0023] In one exemplary embodiment, a substrate processing system having one or more chambers includes a first member, a second member, and a fixture configured to detachably fix the first member and the second member along an axial direction, the fixture including a male member fixed to the first member, and a female member fixed to the second member and configured to receive the male member, the male member including a shaft member extending in the axial direction and expanding at a tip, the female member including a housing member fixed to the second member, a holding member disposed within the housing member, and a holding portion. a spherical member held by a support member, the support member having an opening for receiving the axial member of the male member and a support space for supporting the holding member and the spherical member, an inner wall of the support member defining the support space having a tapered portion that narrows in diameter in the radial direction, the support member being configured to be movable axially within the support space while holding the spherical member, the spherical member being guided by the tapered portion of the inner wall to move radially inward when the support member moves in a first direction which is the axial direction toward the opening.
[0024] In one exemplary embodiment, the substrate processing system includes a transport chamber having a wall with an opening communicating with the chamber, and an opening / closing device configured to be movable inside the transport chamber and having a blocking portion that blocks the opening, wherein the wall of the transport chamber constitutes one of the first member and the second member, and the blocking portion of the opening / closing device constitutes the other of the first member and the second member.
[0025] In one exemplary embodiment, a fixture for a substrate processing system is provided, the fixture comprising: a male member having an axial member; and a female member configured to removably fix the axial member of the male member, the female member comprising: a first moving body configured to be movable between a clamped position and an unclamped position along an axial direction; a second moving body held by the first moving body, the second moving body configured to move to a position that restricts the axial movement of the male member in the clamped position, and to move to a position that does not hinder the axial movement of the male member in the unclamped position; and a third moving body configured to press the axial member of the male member to move it along the axial direction in the unclamped position.
[0026] In one exemplary embodiment, there is provided a fixture for a substrate processing system comprising: a female member having an inner wall that defines a storage space and an engagement portion provided on a portion of the inner wall; a male member having an axial member configured to be freely movable along the axial direction inside the storage space; and a movable body configured to move between a clamped position in which the axial member engages with the engagement portion of the female member and an unclamped position in which the axial member does not engage with the engagement portion of the female member as the axial member moves in the axial direction, and the fixture for a substrate processing system comprises: a male member having an inner wall that defines a storage space and an engagement portion provided on a portion of the inner wall;
[0027] In one exemplary embodiment, a substrate processing system is provided that includes the above-mentioned fixture, a transport chamber having a wall with an opening communicating with the chamber, and an opening / closing device configured to be movable inside the transport chamber and having a blocking portion that blocks the opening, wherein one of the male member or the female member is provided on the wall of the transport chamber and the other of the male member or the female member is directed toward the blocking portion of the opening / closing device.
[0028] Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same or similar elements are given the same reference numerals, and duplicated explanations will be omitted. Unless otherwise specified, the positional relationship such as up, down, left, right, etc. will be described based on the positional relationship shown in the drawing. The dimensional ratio of the drawings does not indicate the actual ratio, and the actual ratio is not limited to the illustrated ratio.
[0029] <Example of plasma processing system configuration> FIG. 1 is a diagram for explaining a configuration example of a plasma processing system. In one embodiment, the plasma processing system includes a plasma processing device 1 and a control unit 2. The plasma processing system is an example of a substrate processing system, and the plasma processing device 1 is an example of a substrate processing device. The plasma processing device 1 includes a plasma processing chamber 10, a substrate support unit 11, and a plasma generation unit 12. The plasma processing chamber 10 has a plasma processing space. The plasma processing chamber 10 also has at least one gas supply port for supplying at least one processing gas to the plasma processing space, and at least one gas exhaust port for exhausting gas from the plasma processing space. The gas supply port is connected to a gas supply unit 20 described later, and the gas exhaust port is connected to an exhaust system 40 described later. The substrate support unit 11 is disposed in the plasma processing space, and has a substrate support surface for supporting a substrate.
[0030] The plasma generating unit 12 is configured to generate plasma from at least one processing gas supplied into the plasma processing space. The plasma formed in the plasma processing space may be a capacitively coupled plasma (CCP), an inductively coupled plasma (ICP), an electron-cyclotron-resonance plasma (ECR plasma), a helicon wave plasma (HWP), a surface wave plasma (SWP), or the like. Also, various types of plasma generating units may be used, including an alternating current (AC) plasma generating unit and a direct current (DC) plasma generating unit. In one embodiment, the AC signal (AC power) used in the AC plasma generating unit has a frequency in the range of 100 kHz to 10 GHz. Thus, the AC signal includes a radio frequency (RF) signal and a microwave signal. In one embodiment, the RF signal has a frequency in the range of 100 kHz to 150 MHz.
[0031] The control unit 2 processes computer-executable instructions that cause the plasma processing apparatus 1 to execute various steps described in the present disclosure. The control unit 2 may be configured to control each element of the plasma processing apparatus 1 to execute various steps described herein. In one embodiment, a part or all of the control unit 2 may be included in the plasma processing apparatus 1. The control unit 2 may include a processing unit 2a1, a storage unit 2a2, and a communication interface 2a3. The control unit 2 is realized, for example, by a computer 2a. The processing unit 2a1 may be configured to perform various control operations by reading a program from the storage unit 2a2 and executing the read program. This program may be stored in the storage unit 2a2 in advance, or may be acquired via a medium when necessary. The acquired program is stored in the storage unit 2a2 and is read from the storage unit 2a2 by the processing unit 2a1 and executed. The medium may be various storage media readable by the computer 2a, or may be a communication line connected to the communication interface 2a3. The processing unit 2a1 may be a CPU (Central Processing Unit). The storage unit 2a2 may include a random access memory (RAM), a read only memory (ROM), a hard disk drive (HDD), a solid state drive (SSD), or a combination thereof. The communication interface 2a3 may communicate with the plasma processing apparatus 1 via a communication line such as a local area network (LAN).
[0032] The following describes a configuration example of a capacitively coupled plasma processing apparatus as an example of the plasma processing apparatus 1. Fig. 2 is a diagram for explaining the configuration example of a capacitively coupled plasma processing apparatus.
[0033] The capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply 20, a power supply 30, and an exhaust system 40. The plasma processing apparatus 1 also includes a substrate support 11 and a gas inlet. The gas inlet is configured to introduce at least one processing gas into the plasma processing chamber 10. The gas inlet includes a showerhead 13. The substrate support 11 is disposed in the plasma processing chamber 10. The showerhead 13 is disposed above the substrate support 11. In one embodiment, the showerhead 13 forms at least a part of a ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the showerhead 13, a sidewall 10a of the plasma processing chamber 10, and the substrate support 11. The plasma processing chamber 10 is grounded. The showerhead 13 and the substrate support 11 are electrically insulated from a housing of the plasma processing chamber 10.
[0034] The substrate support 11 includes a main body 111 and a ring assembly 112. The main body 111 has a central region 111a for supporting the substrate W and an annular region 111b for supporting the ring assembly 112. A wafer is an example of the substrate W. The annular region 111b of the main body 111 surrounds the central region 111a of the main body 111 in a plan view. The substrate W is disposed on the central region 111a of the main body 111, and the ring assembly 112 is disposed on the annular region 111b of the main body 111 so as to surround the substrate W on the central region 111a of the main body 111. Therefore, the central region 111a is also called a substrate support surface for supporting the substrate W, and the annular region 111b is also called a ring support surface for supporting the ring assembly 112.
[0035] In one embodiment, the main body 111 includes a base 1110 and an electrostatic chuck 1111. The base 1110 includes a conductive member. The conductive member of the base 1110 may function as a lower electrode. The electrostatic chuck 1111 is disposed on the base 1110. The electrostatic chuck 1111 includes a ceramic member 1111a and an electrostatic electrode 1111b disposed within the ceramic member 1111a. The ceramic member 1111a has a central region 111a. In one embodiment, the ceramic member 1111a also has an annular region 111b. Note that other members surrounding the electrostatic chuck 1111, such as an annular electrostatic chuck or an annular insulating member, may have the annular region 111b. In this case, the ring assembly 112 may be disposed on the annular electrostatic chuck or the annular insulating member, or may be disposed on both the electrostatic chuck 1111 and the annular insulating member. Also, at least one RF / DC electrode coupled to an RF power source 31 and / or a DC power source 32 described later may be disposed in the ceramic member 1111a. In this case, the at least one RF / DC electrode functions as a lower electrode. When a bias RF signal and / or a DC signal described later is supplied to the at least one RF / DC electrode, the RF / DC electrode is also called a bias electrode. Note that the conductive member of the base 1110 and the at least one RF / DC electrode may function as multiple lower electrodes. Also, the electrostatic electrode 1111b may function as a lower electrode. Thus, the substrate support 11 includes at least one lower electrode.
[0036] The ring assembly 112 includes one or more annular members. In one embodiment, the one or more annular members include one or more edge rings and at least one cover ring. The edge rings are formed of a conductive or insulating material, and the cover rings are formed of an insulating material.
[0037] The substrate support 11 may also include a temperature adjustment module configured to adjust at least one of the electrostatic chuck 1111, the ring assembly 112, and the substrate to a target temperature. The temperature adjustment module may include a heater, a heat transfer medium, a flow passage 1110a, or a combination thereof. A heat transfer fluid such as a brine or a gas flows through the flow passage 1110a. In one embodiment, the flow passage 1110a is formed in the base 1110, and one or more heaters are disposed in the ceramic member 1111a of the electrostatic chuck 1111. The substrate support 11 may also include a heat transfer gas supply configured to supply a heat transfer gas to a gap between the back surface of the substrate W and the central region 111a.
[0038] The shower head 13 is configured to introduce at least one processing gas from the gas supply unit 20 into the plasma processing space 10s. The shower head 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and multiple gas inlets 13c. The processing gas supplied to the gas supply port 13a passes through the gas diffusion chamber 13b and is introduced into the plasma processing space 10s from the multiple gas inlets 13c. The shower head 13 also includes at least one upper electrode. Note that the gas introduction unit may include, in addition to the shower head 13, one or more side gas injectors (SGIs) attached to one or more openings formed in the sidewall 10a.
[0039] The gas supply 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply 20 is configured to supply at least one process gas from a respective gas source 21 through a respective flow controller 22 to the showerhead 13. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Additionally, the gas supply 20 may include at least one flow modulation device to modulate or pulse a flow rate of the at least one process gas.
[0040] The power source 30 includes an RF power source 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power source 31 is configured to supply at least one RF signal (RF power) to at least one lower electrode and / or at least one upper electrode. This causes a plasma to be formed from at least one processing gas supplied to the plasma processing space 10s. Thus, the RF power source 31 can function as at least a part of the plasma generating unit 12. In addition, by supplying a bias RF signal to the at least one lower electrode, a bias potential is generated on the substrate W, and ion components in the formed plasma can be attracted to the substrate W.
[0041] In one embodiment, the RF power supply 31 includes a first RF generating unit 31a and a second RF generating unit 31b. The first RF generating unit 31a is coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matching circuit, and is configured to generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 10 MHz to 150 MHz. In one embodiment, the first RF generating unit 31a may be configured to generate a plurality of source RF signals having different frequencies. The generated one or more source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.
[0042] The second RF generating unit 31b is coupled to at least one lower electrode via at least one impedance matching circuit and configured to generate a bias RF signal (bias RF power). The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency lower than the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 100 kHz to 60 MHz. In one embodiment, the second RF generating unit 31b may be configured to generate a plurality of bias RF signals having different frequencies. The generated one or more bias RF signals are supplied to at least one lower electrode. Also, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.
[0043] The power supply 30 may also include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generator 32a and a second DC generator 32b. In one embodiment, the first DC generator 32a is connected to at least one lower electrode and configured to generate a first DC signal. The generated first DC signal is applied to the at least one lower electrode. In one embodiment, the second DC generator 32b is connected to at least one upper electrode and configured to generate a second DC signal. The generated second DC signal is applied to the at least one upper electrode.
[0044] In various embodiments, the first and second DC signals may be pulsed. In this case, a sequence of voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. The voltage pulses may have a rectangular, trapezoidal, triangular or combination of these pulse waveforms. In one embodiment, a waveform generator for generating a sequence of voltage pulses from the DC signal is connected between the first DC generator 32a and at least one lower electrode. Thus, the first DC generator 32a and the waveform generator constitute a voltage pulse generator. When the second DC generator 32b and the waveform generator constitute a voltage pulse generator, the voltage pulse generator is connected to at least one upper electrode. The voltage pulses may have a positive polarity or a negative polarity. Also, the sequence of voltage pulses may include one or more positive polarity voltage pulses and one or more negative polarity voltage pulses in one period. The first and second DC generating units 32a, 32b may be provided in addition to the RF power supply 31, or the first DC generating unit 32a may be provided in place of the second RF generating unit 31b.
[0045] The exhaust system 40 may be connected to, for example, a gas exhaust port 10e provided at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s is adjusted by the pressure regulating valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.
[0046] <An example of fixture F> FIG. 3 is a diagram illustrating an example of a fixing device F according to an embodiment. In an embodiment, the fixing device F may be used to fix components of the plasma processing device 1 illustrated in FIG. 1 or FIG. 2. The fixing device F is configured to detachably fix two components of the plasma processing device 1 along an axial direction (Z-axis direction in FIG. 3). The axial direction may vary depending on the arrangement of the components fixed by the fixing device F. The axial direction may be perpendicular (up-down direction in FIG. 2) to the horizontal plane (main surface of the substrate support part 11) of the plasma processing device 1, may be parallel (left-right direction in FIG. 2), or may be oblique.
[0047] 3, the fixture F includes a male member F1 and a female member F2. The male member F1 is fixed to a first member CP1 (not shown) which is a component of the plasma processing apparatus 1. The female member F2 is fixed to a second member CP2 (not shown) which is a component of the plasma processing apparatus 1.
[0048] In an embodiment, at least one of the first member CP1 and the second member CP2 may be a member (e.g., an electrostatic chuck 1111 or a base 1110) disposed in a plasma processing chamber 10 (hereinafter also referred to as "chamber 10"). For example, the first member CP1 may be the electrostatic chuck 1111, and the second member CP2 may be the base 1110. Also, for example, the first member CP1 may be the base 1110, and the second member CP2 may be the electrostatic chuck 1111. In an embodiment, the first member CP1 and / or the second member CP2 may constitute a lower electrode of the plasma processing apparatus 1. In an embodiment, at least one of the first member CP1 and the second member CP2 may be a member (e.g., a shower head 13 or a side wall 10a) constituting the chamber 10. For example, the first member CP1 may be the shower head 13, and the second member CP2 may be the side wall 10a. For example, the first member CP1 may be the side wall 10a, and the second member CP2 may be the shower head 13. For example, when the shower head 13 is composed of a plurality of members, the first member CP1 may be one member of the shower head 13 (for example, a top plate facing the plasma processing space 10s), and the second member CP2 may be another member of the shower head 13 (for example, a support for supporting the top plate). In one embodiment, the first member CP1 and / or the second member CP2 may form an upper electrode of the plasma processing apparatus 1. In one embodiment, at least one of the first member CP1 and the second member CP2 may be a member outside the chamber 10 (for example, the gas supply unit 20, the exhaust system 40, etc.).
[0049] In one embodiment, the first member CP1 and the second member CP2 may be composed of one or more parts. In one embodiment, at least one of the first member CP1 and the second member CP2 may be a part that is replaced due to wear, modification, or the like.
[0050] As shown in Fig. 3, the male member F1 includes a shaft member F10 extending along the axial direction (z direction). The shaft member F10 includes a head member F102 that expands in diameter at one axial end. The male member F1 may include a support member F12 that supports the other end of the shaft member F10. In one embodiment, the support member F12 may be fixed to a first member CP1 (not shown) to fix the male member F1 to the first member CP1. In one embodiment, a first seal member SL1 may be provided on a surface of the support member F12.
[0051] In one embodiment, the male member F1 does not need to include the support member F12. In this case, the other end of the shaft member F10 is fixed to the first member CP1, thereby fixing the male member F1 to the first member CP1.
[0052] As shown in FIG. 3, the female member F2 includes a housing member F20, a holding member F22 disposed in the housing member F20, and a spherical member F24 held by the holding member F22.
[0053] The containing member F20 includes an outer wall W1 and an inner wall W2. In one embodiment, at least a portion of the outer wall W1 of the containing member F20 is fixed to a second member CP2 (not shown).
[0054] In one embodiment, a part of the second member CP2 may form a part of the outer wall W1 and the inner wall W2 of the storage member F20. For example, the upper end F200 of the storage member F20 in Fig. 3 may be a part of the second member CP2 or may be integrated with the second member CP2. In this case, a second seal member SL2 may be provided to seal between the upper end F200 of the storage member F20 and the remaining portion thereof.
[0055] The inner wall W2 of the containing member F20 defines a containing space SP and an opening OP. The holding member F22, the spherical member F24, and the like are contained in the containing space SP. In one embodiment, the containing space SP may be divided into a plurality of spaces that are sealed from each other. For example, in the example shown in FIG. 3, the containing space SP is divided into a first space SP1, a second space SP2, and a third space SP3 from the distal side to the proximal side of the opening OP. The first space SP1 and the second space SP2 may be configured to receive a first fluid FL1 and a second fluid FL2, respectively, which will be described later. In this case, the first space SP1 communicates with an opening through which the first fluid FL1 flows in and / or flows out. The second space SP2 communicates with an opening through which the second fluid FL2 flows in and / or flows out. The third space SP3 is a space in which the spherical member F24 is disposed. In one embodiment, a third seal member SL3 may be provided between the first space SP1 and the second space SP2. In one embodiment, a fourth seal member SL4 may be provided between the second space SP2 and the third space SP3.
[0056] The opening OP communicates with the third space SP3. The opening OP has a diameter larger than the head F102 of the shaft member F10. This allows the shaft member F10 to be inserted into and removed from the accommodation space SP through the opening OP. A tapered portion TP is provided on the inner wall W2 that defines the third space SP3. As shown in FIG. 3, the tapered portion TP reduces in diameter along a first direction (direction indicated by Z1 in FIG. 3) that is the axial direction toward the opening OP. The tapered portion TP functions as a guide member that guides the spherical member F24 along the radial direction (Y-axis direction in FIG. 3), as described below.
[0057] The holding member F22 is configured to be movable along the axial direction within the storage space SP while holding the spherical member F24. Specifically, the holding member F22 is movable in both a first direction toward the opening OP within the storage space SP and a second direction (direction indicated by Z2 in FIG. 3) that is opposite to the first direction. That is, the holding member F22 is capable of reciprocating along the axial direction within the storage space SP. The holding member F22 is an example of a first movable body.
[0058] In one embodiment, the second fluid FL2 may be flowed into the second space SP2. The movement of the holding member F22 in the second direction may be caused by the second fluid FL2 flowing into the second space SP2 pressing the first surface F220 (the surface facing the first direction) of the holding member F22.
[0059] In one embodiment, an elastic member F26 (e.g., a compression spring) may be disposed in the first space SP1. The movement of the holding member F22 in the first direction may be caused by the elastic member F26 pressing the second surface F222 (surface facing the second direction) of the holding member F22. In one embodiment, a first fluid FL1 may be flowed into the first space SP1. The movement of the holding member F22 in the first direction may be caused by the first fluid FL1 flowing into the first space SP1 pressing the second surface F222 of the holding member F22. In one embodiment, the movement of the holding member F22 in the first direction may be caused by the elastic member F26 and the second fluid FL2 pressing the second surface F222 of the holding member F22.
[0060] In one embodiment, the holding member F22 may include a locking structure that restricts the inward movement of the spherical member F24 in the radial direction (Y axis in FIG. 3). The locking structure may be, for example, a protrusion F224 as shown in FIG.
[0061] The spherical member F24 is held by the holding member F22. When the spherical member F24 is moved axially (Z-axis direction in FIG. 3) by the movement of the holding member F22, it is simultaneously guided by the tapered portion TP of the inner wall W2 and moves radially (Y-axis direction in FIG. 3). The spherical member F24 is an example of a second moving body. In one embodiment, two or more spherical members F24 are provided.
[0062] As described above, the first member CP1 and the second member CP2 may constitute a part of the electrode (upper electrode or lower electrode) of the plasma processing apparatus 1. In one embodiment, including such a case, the male member F1 and the female member F2 of the fixing tool F may be configured to be electrically connectable to each other. For example, the support member F12 of the male member F1, the shaft member F10, the spherical member F24 of the female member F2, the holding member F22, the elastic member F26, and the upper end F200 of the housing member F20 may be made of conductive materials. As shown in FIG. 5(c) described later, when the male member F1 is fixed to the female member F2 so as not to move in the axial direction, the shaft member F10 and the spherical member F24 come into contact with each other. Then, a conductive path for current is formed by the support member F12 of the male member F1, the shaft member F10, the spherical member F24 of the female member F2, the holding member F22, the elastic member F26, and the upper end F200 of the housing member F20. This electrically connects the male member F1 and the female member F2. That is, the fastener F can function as a conductive path between the first member CP1 and the second member CP2 in a state where the first member CP1 and the second member CP2 are fastened. For example, in a state where the first member CP1 and the second member CP2 are fastened, a current supplied to the first member CP1 can be supplied to the second member CP2 via the fastener F. Also, for example, in a state where the first member CP1 and the second member CP2 are fastened, a current supplied to the second member CP2 can be supplied to the first member CP1 via the fastener F.
[0063] 4A and 4B are diagrams for explaining an example of a moving position of the spherical member. Fig. 4A is an example of a state where the holding member F22 has moved to the maximum in the second direction (direction away from the opening OP) of the opening OP (hereinafter, this position is also referred to as the "unclamped position"). Fig. 4B is an example of a state where the holding member F22 has moved to the maximum in the first direction (direction approaching the opening OP) (hereinafter, this position is also referred to as the "clamped position").
[0064] As shown in FIG. 4A, in the unclamped position, the spherical members F24 abut on the upper portion (distal to the opening OP) of the tapered portion TP. At this time, the radial distance between the spherical members F24 is D1. D1 is greater than the maximum width of the head F102 of the shaft member F10. As shown in FIG. 4B, in the clamped position, the spherical members F24 abut on the lower portion (proximal to the opening OP) of the tapered portion TP. At this time, the radial distance between the spherical members F24 is D2. D2 is less than the maximum width of the head F102 of the shaft member F10.
[0065] <Example of using fixture F> Fig. 5 is a diagram showing an example of a method of using the fixing device F. Fig. 5 shows an example of a method of fixing the male member F1 (and the first member CP1 fixed to the male member F1) of the fixing device F to the female member F2 (and the second member CP2 fixed to the female member F2).
[0066] First, the male member F1 of the fixing tool F is moved in the second direction (the direction indicated by Z2 in FIG. 5) toward the female member F2. Alternatively, the female member F2 may be moved in the first direction toward the male member F1. Then, the shaft member F10 of the male member F1 is inserted toward the third space SP3 through the opening OP of the housing member F20 (see FIG. 5(a)). At this time, the holding member F22 of the female member F2 is in the unclamped position.
[0067] When the support member F12 of the male member F1 abuts against the outer wall W1 of the accommodating member F20 of the female member F2, the shaft member F10 of the male member F1 is disposed in the third space SP3 of the accommodating member F20 (see FIG. 5(b)). Next, the second fluid FL2 flows out from the second space SP2. Then, the holding member F22 of the female member F2 is moved in the first direction (the direction indicated by Z1 in FIG. 5) by the elastic member F26. At this time, the first fluid FL1 may flow into the first space SP1 to promote the movement in the first direction.
[0068] When the holding member F22 of the female member moves to the clamping position, the radial distance between the spherical members F24 narrows, and the head F102 of the shaft member F10 is sandwiched between the spherical members F24 (see FIG. 5(c)). The radial outward movement of the spherical member F24 is restricted by the tapered portion TP of the inner wall W2. Therefore, the axial movement of the shaft member F10 is restricted. This fixes the male member F1 to the female member F2 so that it cannot move in the axial direction. As a result, the first member CP1 is fixed to the second member CP2. When removing the male member F1 of the fixing tool F from the female member F2 (removing the first member CP1 from the second member CP2), the procedure may be reversed.
[0069] By using the fixing device F, the members of the plasma processing apparatus 1 can be attached and detached by mechanically operating the fixing device F without using fasteners (screws). This makes it easy to attach and detach the components of the plasma processing apparatus 1. By using the fixing device F, the labor hours and time required for assembling the plasma processing apparatus and for replacing consumables and performing maintenance such as modifications can be reduced compared to when fasteners are used.
[0070] <Another Example of Driving Mechanism for Holding Member> 6A and 6B are diagrams showing another example of the drive mechanism of the holding member. In one embodiment, the upper end of the holding member F22 of the female member F2 may be connected to a cylinder member F24 as shown in FIG. 6A. The cylinder member F24 may be configured to reciprocate along the axial direction, thereby applying a force in a first direction and a second direction to the holding member F22. In one embodiment, the upper end of the holding member F22 of the female member F2 may be connected to a rack of a rack-pinion system F29 as shown in FIG. 6B. The rack-pinion system F29 transmits the rotational motion of the motor to the rack via a pinion gear. The rack may be configured to reciprocate along the axial direction according to the rotational direction of the motor, thereby applying a force in a first direction and a second direction to the holding member F22. <Another example of Fixture F>
[0071] 7 is a diagram for explaining another example of the fixing device F. In the example shown in FIG. 7, the other end of the shaft member F10 of the male member F1 is fixed so as to be embedded in the first member CP1. The female member F2 is fixed so as to be entirely embedded in the second member CP2. In one embodiment, a first seal member SL1 may be disposed on the opposing surfaces of the first member CP1 and the second member CP2. The first seal member SL1 seals between the external space SPout (which may be, for example, the space outside the chamber 10) and the opening OP of the containing member F20.
[0072] In one embodiment, each component of the fixture F may be composed of a plurality of parts. For example, as shown in Fig. 7, the receiving member F20 of the female member F2 may be composed of a plurality of parts (F20A to F20C).
[0073] FIG. 8 is a diagram for explaining another example of the fixing tool F and its operation. In the example shown in FIG. 8, the female member F2 includes a pressing member F25 that presses the shaft member F10 of the male member F1. The pressing member F25 is disposed in the accommodation space SP of the accommodation member F20 and is configured to be movable in the axial direction. The pressing member F25 includes a head F250 and a shaft portion F252 that extends in the axial direction from the center of the head F250. The accommodation space SP includes a fourth space SP4 and a first space SP1 that are partitioned by the head F250. The tip of the shaft portion F252 is provided so as to penetrate the center of the holding member F22. The pressing member F25 is an example of a third moving body.
[0074] When the holding member F22 moves from the clamped position (see FIG. 8(a)) to the unclamped position (see FIG. 8(b)), the engagement between the spherical member F24 and the head F102 of the shaft member F10 is released. In this state, the fourth fluid FL4 flows into the fourth space SP4. Then, the pressing member F25 is moved in the first direction (the direction indicated by Z1 in FIG. 8(b)). At this time, the first fluid FL1 may be caused to flow out of the first space SP1, or the first space SP1 may be sealed to prevent the first fluid FL1 from flowing out.
[0075] As the pressing member F25 moves in the first direction, the shaft portion F252 comes into contact with the head portion F102 of the shaft member F10, and pushes the shaft member F10 along the first direction (see FIG. 8(c)). As a result, the female member F2 (and the second member CP2) and the male member F1 (and the first member CP1) are separated from each other (hereinafter, this position will be referred to as the "pushing position").
[0076] However, when the holding member F22 is in the unclamped position (FIG. 8(b)), the male member F1 and the female member F2 may become stuck to each other, for example, at their boundary surface TH1. In such a case, the two cannot be separated unless the sticking is released. In addition, it is difficult to detect in a non-contact manner whether or not such sticking has actually occurred.
[0077] In this regard, the configuration shown in Fig. 8 is provided with a pressing member F25 that presses the shaft member F10 of the male member F1 at the unclamped position (Fig. 8(b)). Therefore, even if the male member F1 and the female member F2 are stuck together, they can be separated (Fig. 8(c)).
[0078] In one embodiment, during the transition from the unclamped position (FIG. 8(b)) to the extrusion position (FIG. 8(c)), the first space SP1 may be sealed to detect the pressure in the first space SP1. This makes it possible to detect whether the pressing member F25 has actually reached the extrusion position. For example, if the pressure in the first space SP1 rises to a given pressure after a certain time has elapsed, it is determined that the pressing member F25 has moved to the extrusion position. Also, if the pressure in the first space SP1 does not reach the given pressure even after a certain time has elapsed, it is determined that the pressing member F25 has not moved to the extrusion position (the male member F1 and the female member F2 are firmly fixed). This makes it possible to detect whether the male member F1 and the female member F2 have actually been separated.
[0079] Fig. 9 is a diagram for explaining another example of the fastener F and its operation. In the example shown in Fig. 9, the fastener F includes a female member F3 and a male member F4. The female member F3 includes an inner wall W3 that defines the accommodation space SP5. A part of the inner wall W3 includes a tapered engagement portion EG that expands in the radial direction.
[0080] The male member F4 includes a support base F40, a shaft member F42, a spherical member F44, a holding member F46, and a housing member F48.
[0081] The support base F40 is provided in the accommodation space of the accommodation member F48, and defines a sixth space SP6 and a seventh space SP7. The support base F40 moves in a first direction (z1 direction) along the axial direction and in a second direction (z2 direction) opposite to the first direction in association with the inflow or outflow of fluid into the sixth space SP6 and the seventh space SP7, respectively. The shaft member F42 is fixed on the support base F40, and moves in the first and second directions inside the accommodation space SP5 in association with the movement of the support base F40. The shaft member F42 includes a neck portion F420 whose diameter decreases along the axial direction.
[0082] The spherical member F44 moves between a clamped position and an unclamped position in a state in which the female member F3 and the male member F4 are in contact with each other.
[0083] Specifically, when a fluid flows into the sixth space SP6 and the support base F40 and the shaft member F42 move in the first direction (z1 direction), the spherical member F44 moves radially outward (the axial movement of the spherical member F44 is restricted by the holding member F46). As a result, the spherical member F44 engages with the engagement portion EG of the female member F3 (see FIG. 9(a)). This position is the clamp position, and the female member F3 and the male member F4 are fixed to each other so as not to move in the axial direction.
[0084] Furthermore, when a fluid flows into the seventh space SP7 and the support base F40 and the shaft member F42 move in the second direction (z2 direction), the spherical member F44 moves radially inward along the neck portion F420 of the shaft member F42 (the axial movement of the spherical member F44 is restricted by the holding member F46). This disengages the spherical member F44 from the engagement portion EG of the female member F3 (see FIG. 9(b)). This position is the unclamped position, and the female member F3 and the male member F4 become movable relative to each other in the axial direction.
[0085] In this state, fluid may be further introduced into the seventh space SP7. Then, the support base F40 and the shaft member F42 move further in the second direction. At this time, the fluid may be caused to flow out of the sixth space SP6, or the sixth space SP6 may be sealed to prevent the fluid from flowing out. As the support base F40 and the shaft member F42 move in the second direction, the shaft member F42 pushes the inner wall W3 of the female member F3 along the second direction (see FIG. 9(c)). This causes the female member F3 and the male member F4 to be separated from each other (hereinafter, this position will be referred to as the "separation position").
[0086] However, even when the spherical member F44 is in the unclamped position (FIG. 9(b)), the female member F3 and the male member F4 may be stuck to each other, for example, at their boundary surface TH2. In such a case, they cannot be separated unless the sticking is released. In addition, it is difficult to detect in a non-contact manner whether or not such sticking has actually occurred.
[0087] In this regard, in the configuration shown in FIG. 9, by moving the support base F40 and the shaft member F42 in the second direction from the unclamped position (FIG. 9(b)), the inner wall W3 of the female member F3 can be pressed in the second direction (FIG. 9(c)). As a result, even if the female member F3 and the male member F4 are stuck to each other, they can be separated. In addition, in the transition from the unclamped position (FIG. 9(b)) to the separated position (FIG. 9(c)), the sixth space SP6 may be sealed and the pressure in the sixth space SP6 may be detected. Then, if the pressure in the sixth space SP6 rises to a given pressure after a certain time has elapsed, it is determined that the support base F40 and the shaft member F42 have moved to the separated position. Also, if the pressure in the sixth space SP6 does not reach the given pressure even after a certain time has elapsed, it is determined that the support base F40 and the shaft member F42 have not moved to the separated position (the female member F3 and the male member F4 are firmly stuck to each other). This makes it possible to detect whether the female member F3 and the male member F4 have actually been separated.
[0088] <Application example to substrate processing system> In one embodiment, the above-described fixture F may be used to fix components of a substrate processing system (hereinafter also referred to as a "substrate processing system PS") that includes one or more chambers.
[0089] 10 is a diagram for explaining a configuration example of the substrate processing system PS. The substrate processing system PS has substrate processing chambers PM1 to PM6 (hereinafter also collectively referred to as "substrate processing modules PM"), a transfer module TM, load lock modules LLM1 and LLM2 (hereinafter also collectively referred to as "load lock modules LLM"), a loader module LM, and load ports LP1 to LP3 (hereinafter also collectively referred to as "load ports LP"). A controller CT controls each component of the substrate processing system PS to perform a given process on a substrate W.
[0090] The substrate processing module PM has a chamber, and performs processes such as etching, trimming, film formation, annealing, doping, lithography, cleaning, and ashing on the substrate W. At least one of the substrate processing chambers PM1 to PM6 may be the chamber 10 of the plasma processing apparatus 1 shown in FIG. 1 or FIG. 2. At least one of the substrate processing chambers PM1 to PM6 may be a part of a plasma processing apparatus using any plasma source such as inductively coupled plasma or microwave plasma. At least one of the substrate processing chambers PM1 to PM6 may be a measurement module, and may measure the thickness of a film formed on the substrate W, the dimensions of a pattern formed on the substrate W, and the like, using, for example, an optical method.
[0091] The transfer module TM has a transfer device for transferring a substrate W, and transfers the substrate W between the substrate processing modules PM or between the substrate processing module PM and the load lock module LLM. The substrate processing module PM and the load lock module LLM are disposed adjacent to the transfer module TM. The transfer module TM, the substrate processing module PM, and the load lock module LLM are spatially isolated from or connected to each other by an openable and closable gate valve.
[0092] In one embodiment, a transport device included in the transport module TM transports a substrate W from the transport module TM to a plasma processing space 10s of a plasma processing apparatus 1, which is an example of a substrate processing module PM. The transport device places the substrate W on a central region 111a of a substrate support 11. The plasma processing apparatus 1 may have a lifter, and the transport device may place the substrate W on the lifter. The lifter is configured to be able to rise and fall inside a plurality of through holes provided in the substrate support 11. When the lifter rises, the tip of the lifter protrudes from the central region 111a of the substrate support 11, and the substrate W is held at this position. When the lifter descends, the tip of the lifter is accommodated in the substrate support 11, and the substrate W is placed in the central region 111a of the substrate support 11. As an example, the transport device may be a handler that transports a substrate such as a silicon wafer.
[0093] The load lock modules LLM1 and LLM2 are provided between the transfer module TM and the loader module LM. The load lock module LLM can switch its internal pressure between atmospheric pressure and vacuum. "Atmospheric pressure" may be the pressure outside each module included in the substrate processing system PS. Furthermore, "vacuum" may be a pressure lower than atmospheric pressure, for example, a medium vacuum of 0.1 Pa to 100 Pa. The load lock module LLM transfers the substrate W from the loader module LM, which is at atmospheric pressure, to the transfer module TM, which is at vacuum, and also transfers the substrate W from the transfer module TM, which is at vacuum, to the loader module LM, which is at atmospheric pressure.
[0094] The loader module LM has a transport device for transporting the substrate W, and transports the substrate W between the load lock module LLM and the load board LP. Inside the load port LP, for example, a FOUP (Front Opening Unified Pod) capable of storing 25 substrates W or an empty FOUP can be placed. The loader module LM takes out the substrate W from the FOUP in the load port LP and transports it to the load lock module LLM. The loader module LM also takes out the substrate W from the load lock module LLM and transports it to the FOUP in the load board LP.
[0095] The controller CT controls each component of the substrate processing system PS to perform a given process on the substrate W. The controller CT stores a recipe in which a process procedure, process conditions, transport conditions, etc. are set, and controls each component of the substrate processing system PS to perform a given process on the substrate W in accordance with the recipe. The controller CT may have some or all of the functions of the controller 2 shown in FIG.
[0096] 11 is a diagram for explaining an application example of the fixture F in the above-mentioned substrate processing system PS. As shown in FIG. 11, the transfer module TM has an opening TM100 in a part of a wall surface TM10 constituting a vacuum chamber. In one example, the opening TM100 communicates with the substrate processing module PM. In one example, the opening TM100 communicates with the load lock module LLM.
[0097] An opening / closing device M1 for opening and closing the opening TM100 is provided inside the transport module TM. The opening / closing device M1 includes a blocking part M10 and a base M12. The opening / closing device M1 moves on the floor surface TM12 of the transport module TM. The opening TM100 is sealed by the opening device M100 moving to the front of the opening TM100 and pressing the blocking part M10 against the opening TM100. When the opening / closing device M1 moves to another position, the sealing of the opening TM100 by the blocking part M10 is released.
[0098] In one embodiment, a plurality of coils may be arranged on the floor surface TM12 of the transport module TM, and a permanent magnet may be provided on the base M12 of the switchgear M1. In this case, when a current is supplied to each coil on the floor surface TM12, a magnetic field is generated on the floor surface TM12, and the switchgear M1 is magnetically levitated and moves on the floor surface TM12. The position, orientation, and levitation amount of the switchgear M1 are controlled by controlling the current value of each coil.
[0099] In one embodiment, the fixture F may be used to fix the wall surface TM10 of the transport module TM to the opening / closing device M1. For example, the female member F2 (F3) of the fixture F may be provided in an area TM102 surrounding the opening TM100 of the wall surface TM10, and the male member F1 (F4) may be provided at a corresponding position of the blocking portion M10. Also, for example, the male member F1 (F4) of the fixture F may be provided in the area TM102, and the female member F2 (F3) may be provided at a corresponding position of the blocking portion M10. Note that one or more fixtures F may be provided.
[0100] By using the fixing tool F, the blocking part M10 of the opening / closing device M1 and the wall surface TM10 can be fixed more firmly. This prevents fluid from leaking through the opening TM100 even if there is a large pressure difference between the communication destination of the opening TM100 and the transfer module TM. In addition, by using the fixing tool F, the blocking part M10 and the wall surface TM10 are mechanically fixed. This allows a reduction in the power required to fix the position of the opening / closing device M1, for example, when the opening / closing device M1 is magnetically driven.
[0101] The embodiments of the present disclosure further include the following aspects.
[0102] (Appendix 1) A plasma processing apparatus including a chamber, A first member; A second member; and a fastener configured to removably fasten the first member and the second member along an axial direction, the fastener including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member; The male member includes a shaft member extending in the axial direction and expanding in diameter at a tip end thereof, The female member is a housing member fixed to the second member, a holding member disposed within the housing member, and a spherical member held by the holding member; the housing member includes an opening for receiving the shaft member of the male member and a housing space for housing the holding member and the spherical member, and an inner wall of the housing member defining the housing space includes a tapered portion that reduces in diameter in a radial direction; the holding member is configured to be movable within the accommodation space along the axial direction while holding the spherical member, The spherical member is configured to move toward the inside in the radial direction while being guided by the tapered portion of the inner wall when the holding member moves in a first direction that is the axial direction and toward the opening. Plasma processing equipment.
[0103] (Appendix 2) 2. The plasma processing apparatus according to claim 1, wherein the holding member is moved in the first direction by an elastic member disposed in the accommodation space.
[0104] (Appendix 3) 3. The plasma processing apparatus according to claim 1, wherein the holding member is moved in the first direction by a first fluid flowing into the accommodation space.
[0105] (Appendix 4) 4. The plasma processing apparatus according to claim 1, wherein the holding member is moved in a second direction opposite to the first direction by a second fluid flowing into the accommodation space.
[0106] (Appendix 5) 5. The plasma processing apparatus according to claim 1, wherein the storage space includes a first space into which a first fluid flows and a second space into which a second fluid flows, and the space between the first space and the second space is sealed by a sealing member.
[0107] (Appendix 6) 6. The plasma processing apparatus according to claim 5, wherein the second space is provided closer to the opening than the first space, and a gap between the second space and the opening is sealed by a seal member.
[0108] (Appendix 7) 7. The plasma processing apparatus of claim 1, wherein the holding member is configured to receive a force in the first direction or a force in a second direction opposite to the first direction via a cylinder or a motor.
[0109] (Appendix 8) 8. The plasma processing apparatus according to claim 1, wherein the holding member further includes a locking structure that restricts the spherical member from moving radially inward.
[0110] (Appendix 9) 9. The plasma processing apparatus according to claim 1, wherein at least one of the first member and the second member is a member disposed in the chamber.
[0111] (Appendix 10) 10. The plasma processing apparatus according to claim 1, wherein at least one of the first member and the second member is a member that constitutes the chamber or is a member that is disposed outside the chamber.
[0112] (Appendix 11) 11. The plasma processing apparatus of claim 1, further comprising a sealing member that seals between the opening and a space outside the chamber when the first member and the second member are fixed by the fixing device.
[0113] (Appendix 12) 12. The plasma processing apparatus of any one of claims 1 to 11, wherein at least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixing device is configured such that when the first member and the second member are fixed by the fixing device, the male member and the female member are electrically connected to each other to provide a conductive path to the electrode.
[0114] (Appendix 13) A plasma processing apparatus including a chamber, a first member, a second member, and a fastener configured to removably fasten the first member and the second member along an axial direction, the fastener including a male member fixed to the first member, and a female member fixed to the second member and configured to receive the male member; The plasma processing apparatus includes: a first movable body configured to be freely movable along the axial direction between a clamped position and an unclamped position; and a second movable body held by the first movable body, the second movable body configured to move to a position that restricts the axial movement of the male member at the clamped position, and to move to a position that does not hinder the axial movement of the male member at the unclamped position.
[0115] (Appendix 14) 14. The plasma processing apparatus of claim 13, wherein at least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixture is configured such that, in the clamped position, the male member and the female member are electrically connected to each other to provide a conductive path to the electrode.
[0116] (Appendix 15) 1. A substrate processing system comprising one or more chambers, A first member; A second member; and a fastener configured to removably fasten the first member and the second member along an axial direction, the fastener including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member; The male member includes a shaft member extending in the axial direction and expanding in diameter at a tip end thereof, The female member is a housing member fixed to the second member, a holding member disposed within the housing member, and a spherical member held by the holding member; the housing member includes an opening for receiving the shaft member of the male member and a housing space for housing the holding member and the spherical member, and an inner wall of the housing member defining the housing space includes a tapered portion that reduces in diameter in a radial direction; the holding member is configured to be movable within the accommodation space along the axial direction while holding the spherical member, The spherical member is configured to move toward the inside in the radial direction while being guided by the tapered portion of the inner wall when the holding member moves in a first direction that is the axial direction and toward the opening. Substrate processing system.
[0117] (Appendix 16) The substrate processing system includes: a transfer chamber having a wall surface provided with an opening communicating with the chamber; an opening / closing device configured to be movable inside the transfer chamber and having a closing part that closes the opening, 16. The substrate processing system of claim 15, wherein the wall surface of the transport chamber constitutes one of the first member and the second member, and the closing portion of the opening / closing device constitutes the other of the first member and the second member.
[0118] (Appendix 17) 1. A fixture for a substrate processing system, comprising: a male member having an axial member; a female member configured to removably fasten the shaft member of the male member; The female member is A first movable body configured to be movable between a clamped position and an unclamped position along an axial direction; a second movable body held by the first movable body, the second movable body being configured to move to a position that restricts the axial movement of the shaft member of the male member at the clamped position, and to move to a position that does not hinder the axial movement of the male member at the unclamped position; and a third moving body configured to press the shaft member of the male member to move it along the axial direction at the unclamped position. Fixture fixture for substrate processing system.
[0119] (Appendix 18) 1. A fixture for a substrate processing system, comprising: A female member, An inner wall defining a storage space; a female member having an engagement portion provided on a part of the inner wall; A male member, A shaft member configured to be movable in the axial direction inside the accommodation space; a movable body configured to move between a clamped position where the shaft member engages with the engaging portion of the female member and an unclamped position where the shaft member does not engage with the engaging portion of the female member in response to movement of the shaft member in the axial direction, The shaft member includes a male member configured to be able to move in the axial direction and press the inner wall of the female member when the engagement portion is in the unclamped position. Fixture for substrate processing system.
[0120] (Appendix 19) 1. A substrate processing system, comprising: A fixing device according to claim 17 or 18; a transfer chamber having a wall surface provided with an opening communicating with the chamber; an opening / closing device configured to be movable inside the transfer chamber and having a closing part that closes the opening, one of the male member and the female member is provided on the wall surface of the transport chamber, and the other of the male member and the female member is directed toward the closing portion of the opening and closing device; Substrate processing system.
[0121] The above embodiments are described for the purpose of explanation and are not intended to limit the scope of the present disclosure. Various modifications can be made to the above embodiments without departing from the scope and spirit of the present disclosure. For example, some components in one embodiment can be added to other embodiments. Also, some components in one embodiment can be replaced with corresponding components in other embodiments. [Explanation of symbols]
[0122] Reference Signs List 1: Plasma processing apparatus, 10: Plasma processing chamber, CP1: First member, CP2: Second member, F: Fixture, F1, F4: Male member, F10: Shaft member, F2, F3: Female member, F20: Storage member, F22: Holding member, F24: Spherical member, OP: Opening, SP: Storage space, TP: Tapered portion, W2, W3: Inner wall
Claims
1. A plasma processing apparatus including a chamber, A first member; A second member; a fastener configured to removably fasten the first member and the second member along an axial direction, the fastener including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member; The male member includes a shaft member extending in the axial direction and expanding in diameter at a tip end thereof, The female member is a housing member fixed to the second member, a holding member disposed within the housing member, and a spherical member held by the holding member, the housing member includes an opening for receiving the shaft member of the male member and a housing space for housing the holding member and the spherical member, and an inner wall of the housing member defining the housing space includes a tapered portion that reduces in diameter in a radial direction; the holding member is configured to be movable within the accommodation space along the axial direction while holding the spherical member, the spherical member is configured to move toward the inside in the radial direction while being guided by the tapered portion of the inner wall when the holding member moves in a first direction that is the axial direction and toward the opening. Plasma processing equipment.
2. The plasma processing apparatus according to claim 1 , wherein the holding member is moved in the first direction by an elastic member disposed in the accommodation space.
3. The plasma processing apparatus according to claim 2 , wherein the holding member is moved in the first direction by a first fluid flowing into the accommodation space.
4. The plasma processing apparatus according to claim 3 , wherein the holding member is moved in a second direction opposite to the first direction by a second fluid flowing into the accommodation space.
5. 5. The plasma processing apparatus according to claim 4, wherein the accommodation space includes a first space into which the first fluid flows and a second space into which the second fluid flows, and the space between the first space and the second space is sealed by a seal member.
6. The plasma processing apparatus according to claim 5 , wherein the second space is provided closer to the opening than the first space, and a gap between the second space and the opening is sealed by a seal member.
7. The plasma processing apparatus according to claim 1 , wherein the holding member is configured to receive a force in the first direction or a force in a second direction opposite to the first direction via a cylinder or a motor.
8. The plasma processing apparatus according to claim 1 , wherein the holding member further comprises a locking structure that restricts movement of the spherical members toward the inside in the radial direction.
9. The plasma processing apparatus according to claim 1 , wherein at least one of the first member and the second member is a member disposed within the chamber.
10. 8. The plasma processing apparatus according to claim 1, wherein at least one of the first member and the second member is a member that constitutes the chamber or is a member that is disposed outside the chamber.
11. The plasma processing apparatus according to claim 10 , further comprising a seal member that seals between the opening and a space outside the chamber when the first member and the second member are fixed by the fixture.
12. 8. The plasma processing apparatus according to claim 1, wherein at least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixing device is configured such that when the first member and the second member are fixed by the fixing device, the male member and the female member are electrically connected to each other to provide a conductive path to the electrode.
13. A plasma processing apparatus including a chamber, a first member, a second member, and a fastener configured to removably fasten the first member and the second member along an axial direction, the fastener including a male member fixed to the first member, and a female member fixed to the second member and configured to receive the male member; The plasma processing apparatus includes: a first movable body configured to be freely movable along the axial direction between a clamped position and an unclamped position; and a second movable body held by the first movable body, the second movable body configured to move to a position that restricts the axial movement of the male member at the clamped position, and to move to a position that does not hinder the axial movement of the male member at the unclamped position.
14. 14. The plasma processing apparatus of claim 13, wherein at least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixture is configured such that, in the clamped position, the male member and the female member are electrically connected to each other to provide a conductive path to the electrode.
15. 1. A substrate processing system comprising one or more chambers, A first member; A second member; and a fastener configured to removably fasten the first member and the second member along an axial direction, the fastener including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member; The male member includes a shaft member extending in the axial direction and expanding in diameter at a tip end thereof, The female member is a housing member fixed to the second member, a holding member disposed within the housing member, and a spherical member held by the holding member, the housing member includes an opening for receiving the shaft member of the male member and a housing space for housing the holding member and the spherical member, and an inner wall of the housing member defining the housing space includes a tapered portion that reduces in diameter in a radial direction; the holding member is configured to be movable within the accommodation space along the axial direction while holding the spherical member, the spherical member is configured to move radially inwardly while being guided by the tapered portion of the inner wall when the holding member moves in a first direction that is the axial direction and toward the opening; Substrate processing system.
16. The substrate processing system includes: a transfer chamber having a wall surface provided with an opening communicating with the chamber; an opening / closing device configured to be movable inside the transfer chamber and having a closing part that closes the opening, The substrate processing system according to claim 15 , wherein the wall surface of the transfer chamber constitutes one of the first member and the second member, and the closing portion of the opening and closing device constitutes the other of the first member and the second member.
17. 1. A fixture for a substrate processing system, comprising: a male member having an axial member; a female member configured to removably fasten the shaft member of the male member; The female member is a first movable body configured to be movable between a clamped position and an unclamped position along an axial direction; a second movable body held by the first movable body, the second movable body being configured to move to a position that restricts the axial movement of the shaft member of the male member at the clamped position, and to move to a position that does not hinder the axial movement of the male member at the unclamped position; and a third moving body configured to press the shaft member of the male member to move it along the axial direction at the unclamped position. Fixture for substrate processing system.
18. 1. A fixture for a substrate processing system, comprising: A female member, An inner wall defining a storage space; a female member having an engagement portion provided on a part of the inner wall; A male member, A shaft member configured to be movable in the axial direction inside the accommodation space; a movable body configured to move between a clamped position where the shaft member engages with the engaging portion of the female member and an unclamped position where the shaft member does not engage with the engaging portion of the female member in response to movement of the shaft member in the axial direction, The shaft member includes a male member configured to be able to move in the axial direction and press the inner wall of the female member when the engagement portion is in the unclamped position. Fixture for substrate processing system.
19. 1. A substrate processing system, comprising: A fixture according to claim 17 or 18; a transfer chamber having a wall surface provided with an opening communicating with the chamber; an opening / closing device configured to be movable inside the transfer chamber and having a closing part that closes the opening, one of the male member and the female member is provided on the wall surface of the transport chamber, and the other of the male member and the female member is directed toward the closing portion of the opening and closing device; Substrate processing system.
Citation Information
Patent Citations
JP1989155189U
Clamped, integrated shower head electrode
JP2011521472A
Substrate processing device and maintenance method for the same
JP2023038169A
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KR102168313B1
Mounting table and plasma processing apparatus
JP2019197830A