Adhesive sheet application method, adhesive sheet application device, and semiconductor product manufacturing method

Abstract

To provide an adhesive sheet pasting method that can accurately paste an adhesive sheet to an annular convex portion forming surface of a semiconductor wafer on which an annular convex portion is formed while more reliably avoiding damage to the semiconductor wafer, an adhesive sheet pasting device, and a manufacturing method of a semiconductor product.SOLUTION: An adhesive sheet pasting method includes a pasting step of pasting an adhesive sheet DT to an annular convex portion forming surface of a wafer W having an annular convex portion Ka on the outer periphery of one surface by applying pressure higher than atmospheric pressure to a sheet composite M formed by adhering the adhesive sheet DT to the annular convex portion forming surface of the wafer W. In the pasting step, since sufficiently large pressing force V1 can be applied to the adhesive sheet DT, the adhesive force between the adhesive sheet DT and the wafer W can be greatly improved. Therefore, it is possible to prevent the adhesive sheet DT from peeling off from the wafer W even when the time has passed.SELECTED DRAWING: Figure 14

Description

[Technical field]

[0001] The present invention relates to an adhesive sheet application method and an adhesive sheet application device used to apply an adhesive sheet, e.g., a tape-like adhesive material, to a workpiece, e.g., a semiconductor wafer (hereinafter referred to as "wafer" as appropriate) or a substrate, and a method for manufacturing semiconductor products. [Background technology]

[0002] After a circuit pattern is formed on the front surface of the wafer, the rear surface of the wafer is ground in a back-grinding process, and the wafer is then divided into a large number of chip components in a dicing process. In the back grinding process, there are cases where only the central portion of the wafer is ground, leaving the outer periphery of the back surface, to form an annular convex portion on the outer periphery of the back surface of the wafer so as to surround the back grind area.

[0003] In this case, even if the central part of the wafer is thinned, the wafer is reinforced by the annular protrusion, so that distortion during handling can be avoided. After the back grinding process, the wafer having the annular protrusion is placed in the center of the ring frame, and a supporting adhesive tape (dicing tape) is attached to the ring frame and the back surface of the wafer. A mount frame is created by attaching the dicing tape, and the wafer is sent to the dicing process.

[0004] The following method has been proposed as an example of a method for attaching an adhesive sheet, for example a dicing tape, to a wafer having a step formed by an annular convex portion. That is, an adhesive sheet is sandwiched between the joint of a chamber consisting of a pair of upper and lower housings. Then, the pressure inside the chamber is reduced to generate a pressure difference between the two spaces partitioned by the adhesive sheet, and the adhesive tape is curved in a concave manner to attach the adhesive sheet to the back surface of the wafer. After the pressure difference in the chamber is eliminated, a second attachment process is performed by supplying gas from a first pressing member to the inner corner of the annular convex portion where the adhesive sheet is not fully adhered and is floating up (see Patent Document 1).

[0005] [Patent Document 1] JP 2013-232582 A DISCLOSURE OF THEINVENTION [Problem to be solved by the invention]

[0006] However, the above conventional device has the following problems. That is, in the conventional adhesive sheet attachment method, as time passes after the adhesive sheet is attached, the adhesive sheet peels off from the inner corner of the annular convex toward the center of the wafer. In addition, in the conventional adhesive sheet attachment method, there is also a problem that damage such as cracks and chips occurs in the wafer when the adhesive sheet is attached to the wafer. Damage to the wafer occurs relatively frequently in the thinned portion of the wafer, especially in the inner corner of the annular convex.

[0007] The present invention has been made in consideration of the above circumstances, and has as its main object to provide an adhesive sheet application method, an adhesive sheet application device, and a method for manufacturing a semiconductor product, which can precisely apply an adhesive sheet to the annular convex portion forming surface of a semiconductor wafer on which the annular convex portion is formed, while more reliably avoiding damage to the semiconductor wafer. [Means for solving the problem]

[0008] In order to solve the above problem, the present inventors have conducted research and have found the following. That is, in the conventional configuration in which the second bonding process is performed using the first pressing member, the force acting on the adhesive sheet is small. Therefore, it is difficult to sufficiently improve the adhesion between the wafer and the adhesive sheet, and it is considered that the adhesive sheet peels off from the wafer over time.

[0009] In addition, in the second bonding process, a relatively large pressing force acts on the inner corners of the annular convex portion of the wafer compared to the center of the wafer. It is believed that due to such bias in pressing force, cracks or chips occur frequently especially in the inner corners of the annular convex portion of the wafer where a relatively large pressing force acts.

[0010] The first pressing member is a columnar member having a gas supply hole and made of metal or resin. In the conventional configuration, the bottom surface of the first pressing member is brought close to the wafer to supply gas. By bringing the first pressing member close, the first pressing member may come into contact with the center of the wafer that has been thinned and become concave, causing damage to the thin concave portion of the wafer. If the bottom surface of the first pressing member is not flat enough, even if the first pressing member is close to the inner corner of the annular convex portion of the wafer, the first pressing member may come into contact with other portions of the wafer (e.g., the center), resulting in damage to the wafer.

[0011] In order to achieve the above object, the present invention has the following configuration. That is, the adhesive sheet application method according to the present invention includes a step of applying a pressure higher than atmospheric pressure to a sheet composite formed by attaching an adhesive sheet to a surface of a workpiece having an annular convex portion on the outer periphery of one surface, thereby applying the adhesive sheet to the surface of the annular convex portion; Equipped with 、 The bonding process includes: A first pressing force from the adhesive sheet toward the workpiece and a second pressing force from the workpiece toward the adhesive sheet are applied to the sheet composite in a state where the entire surface of the workpiece opposite to the surface on which the annular convex portion is formed is in contact with the space. It is characterized by the above.

[0012] (Action and Effect) According to this configuration, in the attachment process, a pressure higher than atmospheric pressure is applied to the sheet composite, so that the adhesive sheet is attached to the surface of the workpiece on which the annular convex portion is formed. In this case, a sufficiently large pressing force can be applied to the adhesive sheet, so that the adhesion between the adhesive sheet attached to the workpiece and the surface of the workpiece on which the annular convex portion is formed can be further improved. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the workpiece after the passage of time.

[0013] In addition, in the above-mentioned invention, it is preferable that the method further includes a storage process for storing the sheet composite in a chamber, and the attachment process includes, after the storage process, increasing the pressure in the internal space of the chamber to attach the adhesive sheet to the annular convex portion forming surface.

[0014] (Actions and Effects) According to this configuration, after the sheet composite is accommodated in the chamber, the pressure in the internal space of the chamber is increased to apply a pressure higher than atmospheric pressure to the sheet composite. In this case, the pressurization of the internal space allows the pressing force to be applied uniformly over the entire adhesive sheet. Therefore, it is possible to reliably prevent the occurrence of unevenness on the surface of the adhesive sheet due to bias in the force acting on the adhesive sheet, and therefore the flatness of the adhesive sheet when attached to the wafer can be more reliably improved. In addition, it is possible to prevent a situation in which the force acting on a part of the wafer is biased due to bias in the force acting on the adhesive sheet, causing damage to the wafer.

[0015] Furthermore, in the above-mentioned invention, it is preferable that the chamber comprises an upper housing and a lower housing, and the attachment process includes an upper and lower space forming process in which the adhesive sheet is sandwiched between the upper housing and the lower housing to divide the internal space of the chamber into a lower space in which the workpiece is placed with the annular convex portion forming surface facing upward, and an upper space facing the lower space via the adhesive sheet, and a space pressurizing process in which at least the upper space of the upper space and the lower space is pressurized, thereby attaching the adhesive sheet to the annular convex portion forming surface.

[0016] (Action and Effect) According to this configuration, the adhesive sheet is sandwiched between the upper housing and the lower housing, thereby dividing the internal space of the chamber into a lower space and an upper space. At this time, the adhesive sheet acts as a sealant, so that gas leakage between the lower space and the upper space in the internal space of the chamber can be prevented. Therefore, by pressurizing at least the upper space, the pressure in the upper space acts on the adhesive sheet with good precision. Therefore, the adhesion between the adhesive sheet attached to the workpiece and the annular convex portion forming surface of the workpiece can be further improved.

[0017] In addition, in the above-mentioned invention, it is preferable that the adhesive sheet has a predetermined shape corresponding to the annular convex portion forming surface of the workpiece and is held on a long conveying sheet, the chamber has an upper housing and a lower housing, and the attachment process includes an upper and lower space forming process in which the conveying sheet is sandwiched between the upper housing and the lower housing to divide the internal space of the chamber into a lower space in which the workpiece is placed with the annular convex portion forming surface facing upward, and an upper space facing the lower space via the adhesive sheet held on the conveying sheet, and a space pressurizing process in which at least the upper space of the upper space and the lower space is pressurized to attach the adhesive sheet to the annular convex portion forming surface.

[0018] (Function and Effect) According to this configuration, the adhesive sheet has a predetermined shape corresponding to the annular convex portion-forming surface of the workpiece in advance. Therefore, the adhesive sheet can be appropriately attached to the annular convex portion-forming surface of the workpiece in accordance with the position and shape of the annular convex portion-forming surface of the workpiece. In addition, since a process such as cutting the adhesive sheet into an appropriate predetermined shape is not required, the process of attaching the adhesive sheet can be shortened.

[0019] In addition, the adhesive sheet is held by a long conveying sheet, and the conveying sheet is sandwiched between the upper and lower housings to form a chamber. In this case, even if a highly adhesive material is used as the adhesive sheet to better adhere the workpiece and the adhesive sheet, the conveying sheet can be sandwiched between the two housings without coming into contact with the adhesive sheet. This makes it possible to avoid a situation in which the adhesive sheet adheres to the chamber and does not peel off, causing a disruption in the attachment process.

[0020] Furthermore, by holding the adhesive sheet on a long conveying sheet, even if the adhesive sheet is preformed into a predetermined shape, the adhesive sheet can be conveyed accurately along a predetermined path by unwinding and feeding the long conveying sheet along the predetermined path. In other words, the conveying accuracy of the adhesive sheet can be improved while avoiding unnecessary costs caused by making the adhesive sheet long.

[0021] Furthermore, in the above-mentioned invention, it is preferable that the upper housing is provided with a sheet-like elastic body arranged inside the upper housing, and the sheet-like elastic body is arranged so that the adhesive sheet is sandwiched between the upper housing and the lower housing during the process of forming the upper and lower spaces, thereby causing the sheet-like elastic body to abut against the adhesive sheet.

[0022] (Function and Effect) According to this configuration, the sheet-like elastic body is deformed into a convex shape with a more uniform curvature rate over the entire surface by the pressure difference. Therefore, the adhesive sheet is easily deformed according to the shape of the annular convex portion-forming surface of the workpiece, and the adhesion between the annular convex portion-forming surface and the adhesive sheet can be improved. Therefore, the adhesive sheet can be attached to the annular convex portion-forming surface with greater accuracy.

[0023] Furthermore, in the above-mentioned invention, it is preferable that the method further includes a heating process for heating the adhesive sheet by heating at least one of the lower space and the upper space, and the attaching process includes attaching the adhesive sheet to the annular convex portion forming surface by applying a pressure higher than atmospheric pressure to the adhesive sheet in a state heated by the heating process.

[0024] (Function and Effect) According to this configuration, the adhesive sheet becomes softer by heating the adhesive sheet in the heating process. In other words, the adhesive sheet becomes more easily deformed according to the shape of the annular convex portion-forming surface of the workpiece, so that the adhesion between the annular convex portion-forming surface and the adhesive sheet can be improved.

[0025] In order to achieve the above object, the present invention may have the following configuration. That is, the adhesive sheet application device according to the present invention includes a sheet composite formed by adhering an adhesive sheet to a surface of a workpiece having an annular convex portion on the outer periphery of one surface, and an application mechanism that applies a pressure higher than atmospheric pressure to the annular convex portion-forming surface of the sheet composite, thereby applying the adhesive sheet to the annular convex portion-forming surface. The joining mechanism applies a first pressing force from the adhesive sheet toward the workpiece and a second pressing force from the workpiece toward the adhesive sheet to the sheet composite in a state where the entire surface of the workpiece opposite to the annular convex portion forming surface is in contact with the space. It is characterized by the above.

[0026] (Function and Effect) The bonding mechanism according to the present invention bonds the adhesive sheet to the surface of the workpiece on which the annular convex portion is formed by applying a pressure higher than atmospheric pressure to the sheet composite. In this case, a sufficiently large pressing force can be applied to the adhesive sheet, so that the adhesion between the adhesive sheet bonded to the workpiece and the surface of the workpiece on which the annular convex portion is formed can be further improved. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the workpiece after a period of time.

[0027] In order to achieve the above object, the present invention may have the following configuration. That is, the manufacturing method of the semiconductor product according to the present invention is a manufacturing method of a semiconductor product in which a semiconductor product is manufactured in a state where an adhesive sheet is attached to a surface of a workpiece having an annular convex portion on an outer periphery of one surface, the surface being formed with the annular convex portion, a bonding process for bonding the adhesive sheet to the annular convex portion-forming surface of the workpiece by applying a pressure higher than atmospheric pressure to the sheet composite formed by adhering the adhesive sheet to the annular convex portion-forming surface of the workpiece; Equipped with 、 The bonding process includes: A first pressing force from the adhesive sheet toward the workpiece and a second pressing force from the workpiece toward the adhesive sheet are applied to the sheet composite in a state where the entire surface of the workpiece opposite to the surface on which the annular convex portion is formed is in contact with the space. It is characterized by the above.

[0028] (Action and Effect) According to this configuration, it is possible to suitably manufacture a semiconductor product in which an adhesive sheet is attached to the annular convex surface of a workpiece having an annular convex on the outer periphery of one side. That is, in the attachment process, a pressure higher than atmospheric pressure is applied to the sheet composite, thereby attaching the adhesive sheet to the annular convex surface of the workpiece. In this case, since a sufficiently large pressing force can be applied to the adhesive sheet, the adhesion between the adhesive sheet and the annular convex surface of the workpiece in the sheet composite can be further improved by going through the attachment process. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the workpiece after a period of time. Effect of the Invention

[0029] According to the adhesive sheet application method, adhesive sheet application device, and semiconductor product manufacturing method of the present invention, a pressure higher than atmospheric pressure is applied to the sheet composite, thereby applying the adhesive sheet to the annular convex portion-forming surface of the workpiece. In this case, a sufficiently large pressing force can be applied to the adhesive sheet, so that the adhesion between the adhesive sheet applied to the workpiece and the annular convex portion-forming surface of the workpiece can be further improved. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the workpiece after a period of time. In addition, since the large pressing force can be applied uniformly over the entire workpiece, it is possible to avoid damage such as cracks or chips on the workpiece due to uneven pressing force acting on the workpiece. [Brief description of the drawings]

[0030] [Figure 1]1A and 1B are diagrams illustrating a configuration of a semiconductor wafer according to Example 1. (a) is a partially cutaway perspective view of the semiconductor wafer, (b) is a perspective view of the back surface side of the semiconductor wafer, and (c) is a partial vertical cross-sectional view of the semiconductor wafer. [Diagram 2] 1 is a vertical cross-sectional view showing the configuration of a pressure-sensitive adhesive sheet according to Example 1. FIG. [Diagram 3] FIG. 1 is a plan view of an adhesive sheet joining device according to a first embodiment. [Figure 4] 1 is a front view of an adhesive sheet joining device according to a first embodiment. [Diagram 5] FIG. 2 is a front view of the joining unit according to the first embodiment. [Figure 6] FIG. 2 is a vertical cross-sectional view of a chamber according to the first embodiment. [Figure 7] 4 is a flowchart showing the operation of the adhesive sheet joining device according to the first embodiment. [Figure 8] FIG. 2 is a perspective view of a mount frame according to the first embodiment. [Figure 9] FIG. 11 is a diagram for explaining step S2 according to the first embodiment. [Figure 10] FIG. 11 is a diagram for explaining step S3 according to the first embodiment. [Figure 11] FIG. 11 is a diagram for explaining step S3 according to the first embodiment. [Figure 12] FIG. 11 is a diagram for explaining step S4 according to the first embodiment. [Figure 13] FIG. 11 is a diagram for explaining step S4 according to the first embodiment. [Figure 14] FIG. 11 is a diagram for explaining step S5 according to the first embodiment. [Figure 15] FIG. 11 is a diagram for explaining step S6 according to the first embodiment. [Figure 16] FIG. 11 is a diagram for explaining step S6 according to the first embodiment. [Figure 17] FIG. 11 is a diagram for explaining step S7 according to the first embodiment. [Figure 18]1 shows the configurations of an adhesive sheet and a conveying sheet according to Example 2, where (a) is a perspective view of the back side of the adhesive sheet and the conveying sheet, and (b) is a vertical cross-sectional view of the adhesive sheet and the conveying sheet. [Figure 19] 10 is a flowchart showing the operation of the adhesive sheet joining device according to the second embodiment. [Figure 20] FIG. 11 is a diagram for explaining step S1 according to the second embodiment. [Figure 21] FIG. 11 is a diagram for explaining step S2 according to the second embodiment. [Figure 22] FIG. 11 is a diagram for explaining step S3 according to the second embodiment. [Diagram 23] FIG. 11 is a diagram for explaining step S3 according to the second embodiment. [Figure 24] FIG. 11 is a diagram for explaining step S4 according to the second embodiment. [Diagram 25] FIG. 11 is a diagram for explaining step S4 according to the second embodiment. [Figure 26] FIG. 11 is a diagram for explaining step S5 according to the second embodiment. [Figure 27] FIG. 11 is a diagram for explaining step S6 according to the second embodiment. [Figure 28] FIG. 11 is a diagram for explaining step S6 according to the second embodiment. [Figure 29] FIG. 11 is a diagram for explaining step S7 according to the second embodiment. [Diagram 30] FIG. 13 is a diagram illustrating a configuration according to a modified example. [Diagram 31] 1A is a vertical cross-sectional view illustrating the configuration of an adhesive tape and a conveying sheet according to a modified example, and FIG. 1B is a vertical cross-sectional view illustrating the configuration of a sheet cutting device according to a modified example. [Diagram 32] 1A is a longitudinal sectional view showing a configuration including an elastic body according to a modified example, FIG. 1B is a diagram explaining problems that may occur in a configuration without an elastic body, and FIG. 1C is a diagram explaining advantages of a configuration including an elastic body. [Diagram 33]1A is a vertical cross-sectional view illustrating a configuration including a heating mechanism according to a modified example, and FIG. 1B is a vertical cross-sectional view illustrating an example of a process of heating an adhesive tape by the heating mechanism. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS EXAMPLES

[0031] A first embodiment of the present invention will be described below with reference to the drawings. In the adhesive sheet application device 1 according to the first embodiment, a supporting adhesive tape DT (dicing tape) is used as an adhesive sheet, and a semiconductor wafer W (hereinafter, referred to as "wafer W") and a ring frame f are used as a workpiece to which the adhesive sheet is applied. That is, in the adhesive sheet application device 1 according to the first embodiment, a mount frame MF is created by applying the adhesive tape DT across the wafer W and the ring frame f.

[0032] As shown in FIG. 1(a) to FIG. 1(c), the wafer W is back-ground with a protective tape PT for protecting the circuit attached to the surface on which the circuit pattern is formed. The back surface of the wafer W is ground (back-ground) with the outer periphery left about 3 mm in the radial direction. That is, the wafer W is used with a shape in which a flat concave He is formed on the back surface and an annular convex Ka remains along the outer periphery. As an example, the wafer is processed so that the grinding depth d in the flat concave He is several hundred μm and the wafer thickness J of the flat concave He is 30 μm to 50 μm. Therefore, the annular convex Ka formed on the outer periphery of the back surface functions as an annular rib that increases the rigidity of the wafer W and suppresses bending deformation of the wafer W during handling and other processing steps. The inner corner of the annular convex Ka is indicated by the symbol Kf. The inner corner Kf corresponds to the boundary between the annular convex Ka and the flat concave He. The back surface of the wafer W corresponds to the annular convex forming surface of the work in the present invention.

[0033] The adhesive tape DT used in this embodiment has a long structure in which a non-adhesive substrate Ta and an adhesive material Tb having adhesiveness are laminated, as shown in Fig. 2. A separator S is attached to the adhesive material Tb. That is, the separator S is attached to the adhesive surface of the adhesive tape DT, and the adhesive surface of the adhesive tape DT is exposed by peeling the separator S from the adhesive tape DT.

[0034] Examples of materials constituting the substrate Ta include polyolefin, polyethylene, ethylene-vinyl acetate copolymer, polyester, polyimide, polyurethane, vinyl chloride, polyethylene terephthalate, polybutylene terephthalate, polyethylene terenaphthalate, polyvinylidene chloride, polyethylene methacrylic acid copolymer, polypropylene, methacrylic acid terephthalate, polyamide imide, polyurethane elastomer, etc. A combination of two or more of the above-mentioned materials may be used as the substrate Ta. The substrate Ta may be a single layer, or may be a laminate of two or more layers.

[0035] The adhesive material Tb is preferably made of a material that can maintain the adhesive tape DT adhered to the wafer W and the ring frame f and prevent chip components from scattering in the subsequent dicing process. An example of a material that constitutes the adhesive material Tb is an acrylic acid ester copolymer. An example of the separator S is a long paper material or plastic. Note that an adhesive or a tacky adhesive may be used instead of the adhesive material Tb.

[0036] <Overall configuration> Here, the overall configuration of the adhesive sheet application device 1 according to the first embodiment will be described. Fig. 3 is a plan view showing the basic configuration of the adhesive sheet application device 1 according to the first embodiment. The adhesive sheet application device 1 is configured to include a horizontally long rectangular portion 1a and a protruding portion 1b. The protruding portion 1b is configured to be connected to the center of the rectangular portion 1a and protrude upward. In the following description, the longitudinal direction of the rectangular portion 1a will be referred to as the left-right direction (x-direction), and the horizontal direction (y-direction) perpendicular to the longitudinal direction will be referred to as the front-rear direction.

[0037] A wafer transfer mechanism 3 is provided to the right of the rectangular section 1a. Two containers 5 containing wafers W are placed in parallel at a position toward the lower right of the rectangular section 1a. Inside the containers 5, the wafers W with protective tape PT affixed to their surfaces are stored in multiple stages with their front sides facing downwards. A frame recovery unit 6 is provided at the left end of the rectangular section 1a for recovering the mount frame MF shown in FIG. 8 after mounting the wafers W.

[0038] Arranged from the right on the upper side of the rectangular portion 1a are an aligner 7, a lift table 8, a holding table 9, and a frame supply unit 12, in that order. Arranged on the protruding portion 1b is a joining unit 13 that joins a supporting adhesive tape DT (dicing tape) to the rear surface of the wafer W and the ring frame f.

[0039] 4, the wafer transfer mechanism 3 is provided with a wafer transfer device 16 supported on the right side of a guide rail 15 horizontally installed on the upper part of the rectangular section 2a so as to be movable back and forth in the left and right directions. Also, a frame transfer device 17 is supported on the left side of the guide rail 15 so as to be movable in the left and right directions.

[0040] The wafer transfer device 16 is configured to transfer the wafer W taken out from either one of the containers 5 in a left-right and front-back direction. The wafer transfer device 16 is equipped with a left-right movable base 18 and a front-back movable base 19.

[0041] The left-right movable base 18 is configured to be reciprocally movable in the left-right direction along the guide rail 15. The front-rear movable base 19 is configured to be reciprocally movable in the front-rear direction along a guide rail 20 provided on the left-right movable base 18.

[0042] Furthermore, a holding unit 21 that holds the wafer W is provided below the forward / backward movable platform 19. The holding unit 21 is configured to be capable of reciprocating in the up and down direction (z direction) along a vertically extending lift rail 22. The holding unit 21 is also capable of rotating around an axis in the z direction by a rotation shaft (not shown).

[0043] A horseshoe-shaped holding arm 23 is provided on the lower part of the holding unit 21. A plurality of slightly protruding suction pads are provided on the holding surface of the holding arm 23, and the wafer W is sucked and held via the suction pads. The holding arm 23 is also connected to a compressed air device via a flow path formed therein and a connecting flow path connected to the base end side of the flow path.

[0044] By utilizing the above-described movable structure, the wafer W held by suction can be moved back and forth, left and right, and rotated about the z-axis by the holding arm 23.

[0045] The frame transport device 17 includes a left-right movable base 24, a front-back movable base 25, an articulating link mechanism 26 connected to the lower portion of the left-right movable base 24, and a suction plate 27 attached to the lower end of the articulating link mechanism 26. The suction plate 27 suctions and holds the wafer W. A plurality of suction pads 28 for suction-holding the ring frame f are provided around the suction plate 27. Thus, the frame transport device 17 can suction-hold the ring frame f or the mount frame MF placed and held on the holding table 9, and transport it up and down and back and forth and left and right. The suction pad 28 can be adjusted to slide horizontally according to the size of the ring frame f.

[0046] The lift table 8 holds the wafer W, and is, for example, a metal chuck table having the same shape and size as the wafer W. In a preferred configuration of the lift table 8, the lift table 8 is configured to suction and hold the wafer W by a suction device provided inside. As shown in FIG. 5 and other figures, the lift table 8 is connected to one end of a rod 52 that penetrates a support base 51 that supports the lift table 8. The other end of the rod 52 is connected to and driven by an actuator 53 equipped with a motor or the like. The rod 52 and the actuator 53 enable the lift table 8 to move up and down.

[0047] 3 and 5, the lift table 8 is configured to be able to reciprocate between an initial position and a bonding position along rails 54 provided in the front-rear direction. The initial position is inside the rectangular portion 1a, and is the position where the lift table 8 is indicated by a solid line in Fig. 3. The wafer W is placed on the lift table 8 at the initial position.

[0048] The joining position is inside the protruding portion 1b, and is the position where the lift-up table 8 is indicated by a dotted line in Fig. 3. By moving the lift-up table 8 to the joining position, it becomes possible to bring the wafer W placed on the lift-up table 8 into contact with the adhesive tape DT.

[0049] 5 and 6, the holding table 9 is a metallic chuck table having a shape and size equal to or larger than that of the wafer W, and is connected in communication with a pressure device 32 disposed outside. The operation of the pressure device 32 is controlled by a control unit 33. The holding table 9 is also provided with a suction device therein, and is configured to suction and hold the wafer W.

[0050] In the first embodiment, the holding table 9 has an annular protrusion 9a on its outer periphery and is hollow as a whole. The protrusion 9a is arranged at a position that, in a plan view, substantially coincides with the arrangement of the annular protrusion Ka of the wafer W, and the protrusion 9a supports the annular protrusion Ka of the wafer W, so that the holding table 9 can hold the wafer W without coming into contact with the thin flat recess He.

[0051] 5, the holding table 9 is housed in a lower housing 29A that constitutes the chamber 29, and is connected to one end of a rod 35 that penetrates the lower housing 29A. The other end of the rod 35 is drivingly connected to an actuator 37 that includes a motor or the like. Therefore, the holding table 9 can move up and down inside the chamber 29.

[0052] The lower housing 29A includes a frame holding portion 38 that surrounds the lower housing 29A. The frame holding portion 38 is configured so that when the ring frame f is placed on the frame holding portion 38, the upper surface of the ring frame f and the cylindrical top of the lower housing 29A are flush with each other. In addition, it is preferable that the cylindrical top of the lower housing 29A is subjected to a release treatment.

[0053] As shown in Fig. 3, the holding table 9, together with the lower housing 29A, is configured to be able to move back and forth between an initial position and an attachment position along a rail 40 provided in the front-rear direction. The initial position is inside the rectangular portion 1a, and is the position where the holding table 9 is indicated by a solid line in Fig. 3. At the initial position, the ring frame f is placed on the holding table 9.

[0054] The joining position is inside the protruding portion 1b, and is the position where the holding table 9 is indicated by a dotted line in Fig. 3. By moving the holding table 9 to the joining position, it becomes possible to execute a joining step of joining the adhesive tape DT to the wafer W placed on the holding table 9.

[0055] The frame supply unit 12 stores a drawer-type cassette in which a predetermined number of ring frames f are stacked and stored.

[0056] As shown in Fig. 5, the joining unit 13 is composed of a sheet supply section 71, a separator recovery section 72, a sheet joining section 73, a sheet recovery section 74, etc. The sheet supply section 71 is equipped with a supply bobbin on which a roll of adhesive tape DT for support is wound. The sheet supply section 71 is configured to peel off the separator S by a peeling roller 75 in the process of supplying the adhesive tape DT from the supply bobbin of the sheet supply section 71 to the joining position. The supply bobbin provided in the sheet supply section 71 is interlocked with an electromagnetic brake to apply an appropriate rotational resistance. Therefore, excessive tape is prevented from being unwound from the supply bobbin.

[0057] The separator recovery section 72 is provided with a recovery bobbin that winds up the separator S peeled off from the adhesive tape DT. This recovery bobbin is controlled to rotate forward and backward by a motor.

[0058] The sheet pasting section 73 is composed of a chamber 29, a sheet pasting mechanism 81, a sheet cutting mechanism 82, and the like.

[0059] The chamber 29 is composed of a lower housing 29A and an upper housing 29B. The lower housing 29A is disposed so as to surround the holding table 9, and reciprocates in the front-rear direction between an initial position and a sealing position together with the holding table 9. The upper housing 29B is disposed on the protruding portion 1b, and is configured to be movable up and down.

[0060] 6, the lower housing 29A and the upper housing 29B are connected in communication with the pressurizing device 32 via a flow path 101. The flow path 101 on the upper housing 29B side is equipped with an electromagnetic valve 103. In addition, a flow path 109 equipped with electromagnetic valves 105 and 107 for opening to the atmosphere is connected in communication with both housings 29A and 29B, respectively.

[0061] Furthermore, a flow path 111 having an electromagnetic valve 110 that adjusts the internal pressure, once reduced, by leakage, is connected to the upper housing 29B. Note that the opening and closing of these electromagnetic valves 103, 105, 107, and 110, and the operation of the pressurizing device 32 are controlled by the control unit 33.

[0062] That is, the pressurizing device 32 is configured so as to be able to independently adjust the pressure in the space on the lower housing 29A side and the pressure in the space on the upper housing 29B side.

[0063] The sheet pasting mechanism 81 includes a movable base 84, a pasting roller 85, and a nip roller 86. The movable base 84 moves horizontally left and right along a guide rail 88 installed in the left and right direction. The pasting roller 85 is supported by a bracket connected to the tip of a cylinder provided on the movable base 84. The nip roller 86 is provided on the sheet recovery section 74 side, and includes a feed roller 89 driven by a motor and a pinch roller 90 that is raised and lowered by a cylinder.

[0064] The sheet cutting mechanism 82 is provided on an elevation drive table 91 that raises and lowers the upper housing 29B, and includes a support shaft 92 extending in the z direction and a boss portion 93 that rotates around the support shaft 92. The boss portion 93 includes a plurality of support arms 94 extending in the radial direction. A disk-shaped cutter 95 that cuts the adhesive tape DT along the ring frame f is provided at the tip of at least one of the support arms 94 so as to be movable up and down. A pressure roller 96 is provided at the tip of the other support arms 94 so as to be movable up and down.

[0065] The sheet recovery section 74 is provided with a recovery bobbin that winds up the unnecessary adhesive tape DT that has been cut and then peeled off. This recovery bobbin is controlled to rotate forward and backward by a motor (not shown).

[0066] 4, the frame recovery section 6 is equipped with a cassette 41 that loads and recovers the mount frame MF. This cassette 41 is equipped with a vertical rail 45 that is fixedly connected to the device frame 43, and a lifting platform 49 that is raised and lowered by a motor 47 along the vertical rail 45. Therefore, the frame recovery section 6 is configured to place the mount frame MF on the lifting platform 49 and lower it with a pitch feed.

[0067] <Overview of operation> Here, a description will be given of the basic operation of the adhesive sheet joining apparatus 1 according to the embodiment 1. Fig. 7 is a flow chart illustrating a series of steps for joining an adhesive tape DT to a wafer W using the adhesive sheet joining apparatus 1.

[0068] Step S1 (supply of workpiece) When a joining command is issued, the ring frame f is transferred from the frame supply unit 12 to the frame holding unit 38 of the lower housing 29A, and the wafer W is transferred from the container 5 to the lift table 8.

[0069] That is, the frame transport device 17 adsorbs the ring frame f from the frame supply unit 12 and transfers it to the frame holding unit 38. When the frame transport device 17 releases the adsorption of the ring frame f and rises, it aligns the position of the ring frame f. As an example, this alignment is performed by synchronously moving a plurality of support pins erected so as to surround the frame holding unit 38 toward the center. When the frame holding unit 38 holds the ring frame f, the lower housing 29A moves together with the holding table 9 along the rails 40 from the initial position to the joining position on the sheet joining mechanism 81 side.

[0070] While the frame transport device 17 transports the ring frame f, the wafer transport device 16 inserts the holding arm 23 between the wafers W stored in multiple stages inside the container 5. The holding arm 23 suction-holds the wafer W, carries it out, and transports it to the aligner 7. The aligner 7 suctions the center of the wafer W with a suction pad protruding from the center. At the same time, the wafer transport device 16 releases the suction of the wafer W and retreats upward. The aligner 7 holds the wafer W with the suction pad and rotates it to align it based on the notch, etc.

[0071] When the alignment is complete, the suction pad that has adsorbed the wafer W is caused to protrude from the surface of the aligner 7. The wafer transfer device 16 moves to that position and adsorbs and holds the wafer W. The suction pad releases the adsorption and descends.

[0072] The wafer transport device 16 moves above the lift table 8 and places the wafer W on the lift table 8 with the side to which the protective tape PT is attached facing downward. When the lift table 8 adsorbs and holds the wafer W, the lift table 8 moves along the rails 54 from the initial position to a joining position on the sheet joining mechanism 81 side. The state in which the lift table 8 and the holding table 9 have each moved to the joining position is shown in FIG.

[0073] Step S2 (supply of adhesive sheet) When a workpiece is supplied by the wafer transport device 16 or the like, the adhesive tape DT is supplied in the joining unit 13. That is, a predetermined amount of adhesive tape DT is fed from the sheet supply unit 71 while the separator S is peeled off. The adhesive tape DT, which is long overall, is guided above the joining position along a predetermined transport path.

[0074] Step S3 (first attachment process) When the workpiece and the adhesive tape DT are supplied, the first joining process is started. That is, the control unit 33 drives the actuator 53 to raise the lift table 8. By raising the lift table 8, the back surface of the wafer W comes into contact with the adhesive tape DT as shown in FIG. 10, and the back surface of the wafer W is covered with the adhesive tape DT.

[0075] This contact causes the back surface of the wafer W to adhere to the adhesive layer Tb, and the wafer W is held by the adhesive tape DT. The wafer W and the adhesive tape DT integrated together are hereinafter referred to as the sheet composite M. After the sheet composite M is formed, a predetermined amount of the adhesive tape DT is fed out, and the sheet composite M is transported above the holding table 9, as shown in FIG. 11. As the sheet composite M is transported, the lift table 8 descends and returns to its initial state. When the sheet composite M is formed and transported to the holding table 9, the first bonding process in step S3 is completed.

[0076] Step S4 (Formation of chamber) When the sheet composite body M is conveyed above the holding table 9, the joining roller 85 descends. Then, as shown in Fig. 12, the joining roller 85 rolls over the adhesive tape DT and joins the adhesive tape DT to the ring frame f and the top of the lower housing 29A.

[0077] When the adhesive tape DT is applied to the ring frame f, the application roller 85 is returned to its initial position and the upper housing 29B is lowered. With the lowering of the upper housing 29B, the portion of the adhesive tape DT applied to the top of the lower housing 29A is sandwiched between the upper housing 29B and the lower housing 29A, as shown in FIG. 13, to form the chamber 29.

[0078] At this time, the adhesive tape DT functions as a sealant, and the chamber 29 is divided into two spaces by the adhesive tape DT. That is, the chamber 29 is divided into a lower space H1 on the lower housing 29A side and an upper space H2 on the upper housing 29B side, with the adhesive tape DT in between. The wafer W located in the lower housing 29A faces the adhesive tape DT closely with a predetermined clearance therebetween.

[0079] Step S5 (second attachment process) After the chamber 29 is formed, the second bonding process is started. First, the control unit 33 controls the actuator 37 to lower the holding table 9 to the initial position. Next, the control unit 33 operates the pressurizing device 32 with the electromagnetic valves 105, 107, and 110 shown in FIG. 6 closed to supply gas to the lower space H1 and the upper space H2, thereby pressurizing the lower space H1 and the upper space H2 to a specific value. An example of the specific value is 0.3 MPa to 0.5 MPa. As a result of the pressurizing operation by the pressurizing device 32, the air pressure in the lower space H1 and the air pressure in the upper space H2 become higher than atmospheric pressure.

[0080] By pressurizing the upper space H2, as shown in FIG. 14, a pressing force V1 acts from the upper space H2 toward the adhesive tape DT. Since the entire upper space H2 is pressurized, the pressing force V1 acts uniformly over the entire adhesive tape DT. Furthermore, since the entire lower space H1 is pressurized, the pressing force V2 acts uniformly from the lower space H1 toward the lower surface of the wafer W (the front surface side of the wafer W in this embodiment). That is, the pressing forces V1 and V2 cause the adhesive tape DT to be attached to the rear surface of the wafer W with good accuracy. As a result, the adhesion between the wafer W and the adhesive tape DT is improved, and it is possible to prevent the adhesive tape DT from peeling off from the rear surface of the wafer W over time.

[0081] With the lower space H1 and the upper space H2 pressurized to a pressure higher than atmospheric pressure, a pressing force is applied between the adhesive tape DT and the wafer W for a predetermined time, and then the control unit 33 stops the pressurizing device 32. Then, the control unit 33 fully opens the electromagnetic valves 103, 105, 107, and 110 to open the lower space H1 and the upper space H2 to the atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29, and raises the holding table 9 to bring the surface of the wafer W into contact with the wafer holding surface of the holding table 9. The second joining process corresponds to the joining process in this invention.

[0082] Step S6 (Cutting the sheet) During the process of step S5 in the chamber 29, the sheet cutting mechanism 82 is operated to cut the adhesive tape DT. At this time, as shown in Fig. 15, the cutter 95 cuts the adhesive tape DT attached to the ring frame f into the shape of the ring frame f, and the pressing roller 96 follows the cutter 95 to press the sheet cut portion on the ring frame f while rolling.

[0083] Since the second joining process in step S5 is completed when the upper housing 29B is raised, the pinch roller 90 is raised to release the nip of the adhesive tape DT. Thereafter, as shown in Fig. 16, the nip roller 86 is moved to wind and collect the unnecessary adhesive tape DT after cutting toward the sheet collection section 74, and a predetermined amount of adhesive tape DT is paid out from the sheet supply section 71. Through each process up to step S6, the sheet composite body M is integrated with the ring frame f. As a result, a mount frame MF is formed in which the ring frame f and the wafer W are integrated via the adhesive tape DT.

[0084] When the unnecessary adhesive tape DT has been wound and collected, the nip roller 86 and the joining roller 85 return to their initial positions. Then, while holding the mount frame MF, the holding table 9 moves from the joining position to the initial position.

[0085] Step S7 (Recovery of the mount frame) When the holding table 9 returns to its initial position, as shown in Fig. 17, the suction pads 28 provided on the frame transport device 17 suction-hold the mount frame MF and remove the mount frame MF from the lower housing 29A. The frame transport device 17 that has suction-held the mount frame MF transports it to the frame collection section 6. The transported mount frame MF is loaded and stored in a cassette 41.

[0086] This completes one cycle of the operation of bonding the adhesive tape DT to the wafer W. Thereafter, the above process is repeated until a predetermined number of mount frames MF are reached. In this manner, the sheet composite M in which the adhesive tape DT is in intimate contact with and bonded to the wafer W is manufactured by the adhesive sheet bonding apparatus 1. The sheet composite M in which the adhesive tape DT is bonded to the wafer W by the second bonding process corresponds to the semiconductor product in the present invention.

[0087] <Effects of the configuration of the first embodiment> According to the device of the above-mentioned Example 1, after the adhesive tape DT is bonded to the wafer W by the first bonding process, the second bonding process is performed to bond the adhesive tape DT to the wafer W with even greater precision so that the adhesive tape DT is more closely attached to the wafer W. In the second bonding process according to the present invention, the air pressure in the lower space H1 and the upper space H2 is increased to be higher than atmospheric pressure, thereby bonding the adhesive tape DT to the rear surface of the wafer W with greater precision.

[0088] In the conventional configuration, the adhesive tape is attached to the wafer by a pressure difference generated by reducing the pressure inside the chamber using a vacuum device. However, the magnitude of the pressure difference generated by reducing the pressure from atmospheric pressure is equal to or lower than atmospheric pressure. In other words, when the adhesive tape DT is attached to the wafer W using the pressure difference, there is an upper limit to the magnitude of the force that presses the adhesive tape DT against the rear surface of the wafer W.

[0089] Therefore, when the adhesive tape DT is brought into contact with the wafer W using a pressure difference due to reduced pressure, the adhesion between the adhesive tape DT and the wafer W is low. Also, in the conventional configuration in which the second bonding is performed using the first pressing member, the pressing force can be applied only to a limited portion of the adhesive tape DT. Also, since the magnitude of the pressing force is insufficient, it is difficult to improve the adhesion between the adhesive tape DT and the wafer W.

[0090] In contrast, in the present invention, the pressure device 32 is used to pressurize the upper space H1 and the lower space H2 in the chamber 29 to a pressure higher than atmospheric pressure. That is, in the second joining process, pressing forces V1 and V2 sufficiently higher than the differential pressure generated by the reduced pressure can be applied to the adhesive tape DT and the wafer W. In addition, the pressing forces V1 and V2 act on the entire surface of the adhesive tape DT to be joined to the wafer W. Therefore, by performing the second joining process, the adhesion between the adhesive tape DT and the wafer W can be greatly improved, so that the adhesive tape DT can be prevented from peeling off from the wafer W even after a period of time has passed after the completion of a series of joining processes.

[0091] Moreover, in the second bonding process, the magnitudes of the pressing forces V1 and V2 can be adjusted to any value by appropriately controlling the pressure device 32. Therefore, even if various conditions such as the constituent material of the adhesive material Tb, or the size of the wafer W and the thickness of the annular convex portion Ka are changed, the magnitudes of the pressing forces V1 and V2 can be appropriately adjusted to reliably bond the adhesive tape DT to the surface of the wafer W on which the annular convex portion is formed. Furthermore, since pressing forces V1 and V2 of appropriate magnitudes are applied uniformly over the entire adhesive tape DT, it is possible to avoid a situation in which the wafer W is damaged due to the application of excessive pressing forces or biased pressing forces. EXAMPLES

[0092] A second embodiment of the present invention will be described below with reference to the drawings. In the first embodiment, a long adhesive tape DT is applied to the back surface of the wafer W and to the ring frame f, and then cut into a predetermined shape according to the shape of the work (here, the shape of the wafer W or the ring frame f). In the second embodiment, a configuration in which an adhesive tape having a predetermined shape according to the shape of the work is applied to the work will be described. Note that the same components as those in the adhesive sheet application device 1 of the first embodiment are denoted by the same reference numerals, and different components will be described in detail.

[0093] First, there will be described the configuration of the adhesive tape DT according to Example 2. Fig. 18(a) is a perspective view showing the back side of the carrying sheet P and the adhesive tape DT, and Fig. 18(b) is a vertical cross-sectional view of the carrying sheet P and the adhesive tape DT.

[0094] The adhesive tape DT according to the second embodiment is held by a long conveying sheet P, as shown in Fig. 18(a). That is, the adhesive tape DT of a predetermined shape is attached and held at a predetermined pitch on one surface of the long conveying sheet P. The adhesive tape DT is pre-cut into a predetermined shape according to the shape of the surface (back surface in this embodiment) of the wafer W on which the annular convex portion Ka is formed. In the second embodiment, the adhesive tape DT is pre-cut into a circular shape.

[0095] As shown in Fig. 18(b), the conveying sheet P has a structure in which a non-adhesive base material Pa and an adhesive material Pb having adhesiveness are laminated. Examples of materials constituting the base material Pa include polyolefin and polyethylene. Examples of materials constituting the adhesive material Pb include acrylic acid ester copolymer. The conveying sheet P holds the adhesive tape DT by attaching the base material Ta of the adhesive tape DT to the adhesive material Tb of the conveying sheet P. In this embodiment, the shape of the adhesive tape DT is circular, but can be changed as appropriate depending on the shape of the wafer W.

[0096] The adhesive sheet application device 1 according to the second embodiment has a basic configuration in common with the device according to the first embodiment shown in Figures 3 to 6. However, a conveying sheet P holding a plurality of adhesive tapes DT preformed into a predetermined shape is loaded into the sheet supply section 71. A sheet cutting mechanism 82 cuts the conveying sheet P from the portion attached to the ring frame f. A sheet recovery section 74 is configured to recover the unnecessary conveying sheet P remaining around the mount frame MF after the conveying sheet P is cut by the sheet cutting mechanism 82.

[0097] <Operation in Example 2> Here, a description will be given of the operation of the adhesive sheet application apparatus 1 according to Example 2. Fig. 19 is a flow chart for explaining a series of steps for applying an adhesive tape DT to a wafer W using the adhesive sheet application apparatus 1 according to Example 2. Explanations of steps that are the same as those in the operation of the adhesive sheet application apparatus 1 according to Example 1 will be simplified, and different steps will be described in detail.

[0098] Step S1 (supply of workpiece) When a joining command is issued, the wafer W and the ring frame f are supplied in the same manner as in Example 1. That is, the ring frame f stored in the frame supply unit 12 is transferred to the frame holding unit 38 by the frame transport device 17. When the frame holding unit 38 holds the ring frame f, the lower housing 29A moves together with the holding table 9 along the rails 40 from the initial position to the joining position on the sheet joining mechanism 81 side.

[0099] Then, the wafer W stored in the container 5 is transferred to the lift table 8 via the aligner 7 by the wafer transfer device 16. When the lift table 8 adsorbs and holds the substrate 10, the lift table 8 moves along the rails 54 from the initial position to a joining position on the side of the sheet joining mechanism 81. The state in which the lift table 8 and the holding table 9 have each moved to the joining position is shown in FIG.

[0100] Step S2 (Supplying adhesive sheet) When a workpiece is supplied by a wafer transfer device 16 or the like, the sticking unit 13 supplies an adhesive tape DT. That is, a predetermined amount of the adhesive tape DT is fed out from the sheet supply unit 71 together with the transfer sheet P while the separator S is peeled off. The transfer sheet P, which is long as a whole, is guided above the sticking position along a predetermined transfer path. At this time, as shown in FIG. 21, the adhesive tape DT held on the transfer sheet P is positioned above the wafer W placed on the elevating table 8.

[0101] Step S3 (first sticking process) When the workpiece and the wafer W are supplied, the first sticking process is executed in the same manner as in the first embodiment. That is, the control unit 33 drives the actuator 53 to raise the elevating table 8. Due to the raising of the elevating table 8, as shown in FIG. 22, the back surface of the wafer W comes into contact with the adhesive tape DT, and the back surface of the wafer W is covered with the adhesive tape DT.

[0102] Due to the contact, the back surface of the wafer W adheres to the adhesive layer Tb, and the wafer W is held by the adhesive tape DT. Then, a sheet composite M in which the wafer W and the adhesive tape DT are integrated is created. After the sheet composite M is created, by feeding out a predetermined amount of the adhesive tape DT, as shown in FIG. 23, the sheet composite M is conveyed above the holding table 9. As the sheet composite M is conveyed, the elevating table 8 descends and returns to the initial state.

[0103] Step S4 (formation of chamber) When the sheet composite M is conveyed above the holding table 9, a chamber 29 is formed. That is, as shown in FIG. 24, the sticking roller 85 descends. Then, while rolling on the transfer sheet P, the transfer sheet P is attached over the ring frame f and the top of the lower housing 29A. In conjunction with the movement of the sticking roller 85, a predetermined amount of the adhesive tape DT is fed out from the sheet supply unit 71 together with the transfer sheet P while the separator S is peeled off.

[0104] When the conveying sheet P is attached to the ring frame f, the joining roller 85 is returned to its initial position and the upper housing 29B is lowered. As the upper housing 29B is lowered, the portion of the conveying sheet P attached to the top of the lower housing 29A is sandwiched between the upper housing 29B and the lower housing 29A, as shown in Fig. 25, to form the chamber 29. At this time, the conveying sheet P functions as a sealant and the chamber 29 is divided into a lower space H1 and an upper space H2 by the conveying sheet P.

[0105] Step S5 (second attachment process) After the chamber 29 is formed, the second bonding process is executed in the same manner as in Example 1. First, the control unit 33 lowers the holding table 9 and operates the pressurizing device 32 to supply gas to the lower space H1 and the upper space H2, thereby pressurizing the lower space H1 and the upper space H2 to a specific value. As a result of the pressurizing operation by the pressurizing device 32, the air pressure in the lower space H1 and the upper space H2 both become higher than atmospheric pressure.

[0106] By pressurizing the upper space H2, as shown in Fig. 26, a pressing force V1 acts uniformly from the upper space H2 toward the adhesive tape DT. Moreover, by pressurizing the entire lower space H1, a pressing force V2 acts uniformly from the lower space H1 to the downward surface of the wafer W. That is, by the action of the pressing forces V1 and V2, which are sufficiently large forces, the adhesive tape DT is attached to the rear surface of the wafer W with good accuracy, and the adhesion between the wafer W and the adhesive tape DT is improved.

[0107] With the lower space H1 and the upper space H2 pressurized to a pressure higher than atmospheric pressure, a pressing force is applied between the adhesive tape DT and the wafer W for a predetermined time, and then the control unit 33 stops the pressurizing device 32. Then, the control unit 33 fully opens the electromagnetic valves 103, 105, 107, and 110 to open the lower space H1 and the upper space H2 to the atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29, and raises the holding table 9 to bring the surface of the wafer W into contact with the wafer holding surface of the holding table 9.

[0108] Step S6 (Cutting the conveying sheet) It should be noted that while the process relating to step S5 is being performed in chamber 29, sheet cutting mechanism 82 is operated. In the second embodiment, the process differs from that of the first embodiment in that sheet cutting mechanism 82 cuts conveying sheet P. That is, as shown in Fig. 27, cutter 95 cuts conveying sheet P attached to ring frame f into the shape of ring frame f, and pressure roller 96 follows cutter 95 to press the cut portion of the sheet on ring frame f while rolling.

[0109] After the conveying sheet P is cut into a circle, the upper housing 29B is raised. Since the process of step S5 is completed at the point when the upper housing 29B is raised, the pinch roller 90 is raised to release the nip of the adhesive tape DT. Thereafter, as shown in Fig. 28, the nip roller 86 is moved to wind up and collect the unnecessary conveying sheet P after the cut toward the sheet collection section 74, and a predetermined amount of adhesive tape DT is paid out from the sheet supply section 71 together with the conveying sheet P.

[0110] The mount frame MF is formed by the steps up to step S6. In the mount frame MF according to the second embodiment, the ring frame f and the wafer W are integrated via the adhesive tape DT and the conveying sheet P. When the unnecessary conveying sheet P is wound up and collected, the nip roller 86 and the joining roller 85 return to their initial positions. Then, while holding the mount frame MF, the holding table 9 moves from the joining position to the initial position.

[0111] Step S7 (Recovery of the mount frame) When the holding table 9 returns to its initial position, as shown in Fig. 29, the suction pads 28 provided on the frame transport device 17 suction-hold the mount frame MF and remove the mount frame MF from the lower housing 29A. The frame transport device 17 that has suction-held the mount frame MF transports it to the frame collection section 6. The transported mount frame MF is loaded and stored in a cassette 41.

[0112] This completes one cycle of operations for bonding the adhesive tape DT to the wafer W. Thereafter, the above process is repeated until the number of mount frames MF reaches a predetermined number. By using the adhesive sheet bonding device 1 according to the second embodiment, it is possible to obtain the same effect as in the first embodiment, even when using an adhesive tape DT that has been cut into a predetermined shape in advance. That is, when bonding the adhesive tape DT to the annular convex portion-forming surface of the wafer W having an annular convex portion, it is possible to bond the adhesive tape DT to the wafer W with high accuracy while avoiding damage to the wafer.

[0113] The embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the above embodiments, and includes all modifications (variations) within the meaning and scope of the claims. For example, the present invention can be modified as follows.

[0114] (2) In step S5 in each embodiment, the pressurizing device 32 pressurizes both the inside of the lower space H1 and the inside of the upper space H2, but this is not limited to the above. That is, the pressurizing device 32 may pressurize only the upper space H2 to a pressure higher than atmospheric pressure, and the adhesive tape DT may be attached more accurately by the pressing force V1.

[0115] (3) In step S5 in each embodiment, the pressure device 32 is used to make the air pressure inside the chamber 29 higher than atmospheric pressure, thereby generating a pressing force V1 that presses the adhesive tape DT to adhere closely to the wafer W. However, the process related to step S5 is not limited to a configuration that uses the chamber 29, so long as it is configured to generate a pressing force between the adhesive tape DT and the wafer W that is higher than atmospheric pressure.

[0116] As an example of a configuration in which the chamber 29 is omitted, there is a configuration in which a pressing plate 141 is disposed above a holding table 9, and the pressing plate 141 is lowered to press the sealing sheet S to apply a pressing force V1, as shown in FIG.

[0117] The pressing member 141 has a flat bottom surface and is disposed so as to be located above the adhesive tape DT. Therefore, by lowering the pressing member 141, the flat bottom surface of the pressing member 141 presses the adhesive tape DT, and the adhesive tape DT is deformed into a convex shape so as to come into contact with the wafer W.

[0118] (4) In each embodiment, a configuration in which a supporting adhesive tape DT is attached to the wafer W has been described as an example, but the adhesive sheet attached to the wafer W is not limited to this. The configuration according to each embodiment can be applied as long as it is a configuration in which a sheet-like adhesive material, such as an adhesive tape for protecting circuits, is attached.

[0119] (5) In each embodiment, the wafer W and the ring frame f are exemplified as the workpiece to which the adhesive sheet is attached, but the workpiece is not limited to this. As an example, the ring frame f may be omitted and the adhesive sheet may be attached only to the wafer W. Furthermore, the configuration according to this embodiment can be applied to various semiconductor materials such as substrates and panels as the workpiece. Furthermore, the shape of the workpiece may be circular, rectangular, polygonal, approximately circular, etc.

[0120] (6) In each embodiment, the holding table 9 is raised and lowered at a predetermined timing to bond the adhesive tape DT to the wafer W, but the raising and lowering of the holding table 9 may be changed as appropriate. As an example, the pressurization process in step S5 is not limited to being performed after the holding table 9 is lowered, and the pressurization process may be performed while the holding table 9 is maintained in an elevated state.

[0121] (7) In each embodiment, the frame holding part 38 is disposed outside the lower housing 29A, but the frame holding part 38 may be provided inside the lower housing 29A. In this case, the processes from step S4 onwards are performed with the ring frame f and the wafer W each housed inside the chamber 29.

[0122] (8) In the second embodiment, the adhesive tape DT is formed in advance into a predetermined shape corresponding to the shape of the annular convex forming surface of the wafer W, but is not limited to this. That is, the sheet supply unit 71 may be loaded with a long adhesive tape DT to which a long conveying sheet P is attached. The configuration of the long adhesive tape DT to which the long conveying sheet P is attached is as shown in FIG. 31(a). In this case, the adhesive sheet joining apparatus 1 includes a sheet cutting device 201 upstream of the chamber 29, and the sheet cutting device 201 forms the long adhesive tape DT into a predetermined shape.

[0123] The configuration of the sheet cutting device 201 is as shown in Fig. 31(b). The sheet cutting device 201 includes a support table 203, a cutter 205, and an adhesive sheet recovery unit 207. The adhesive tape DT and the conveying sheet P fed from the sheet supply unit 71 are inverted by an inverting device (not shown) and supplied to the sheet cutting device 201 in a state in which the adhesive tape DT is on the upper side of the conveying sheet P.

[0124] The support table 203 is disposed so as to horizontally receive the lower conveying sheet P of the long adhesive tape DT and conveying sheet P fed from the sheet feed unit 71 in the direction L. The cutter 205 is disposed above the support table 203 and can be raised and lowered by a movable base (not shown). An annular Thomson blade is used as an example of the cutter 205.

[0125] As the cutter 205 descends, the layer of the adhesive tape DT out of the adhesive tape DT and the conveying sheet P is cut out in the shape of a circular track K. The configuration in which the cutter 205 cuts the adhesive tape DT is not limited to this, and another example is a configuration in which the knife-shaped cutter 205 is moved along a circular track to cut out the adhesive tape DT in a circular shape.

[0126] The adhesive sheet recovery section 207 recovers unnecessary adhesive tape DTn remaining around the adhesive tape DT cut into a circle. The unnecessary portion of the adhesive tape DTn is peeled off from the conveying sheet P immediately after the feed roller 208. The peeled adhesive tape DTn is guided to a recovery bobbin 210 by a guide roller 209. The recovery bobbin 201 winds up and recovers the adhesive tape DTn peeled off from the conveying sheet P. Therefore, the sheet cutting device 201 leaves the adhesive tape DT formed into a circle by the cutter 205 on the conveying sheet P.

[0127] The adhesive tape DT cut into a circle is guided to the chamber 29 together with the conveying sheet P. The adhesive tape DT and the conveying sheet P are again inverted by an inverting device (not shown) downstream of the sheet cutting device 201, and are guided to the chamber 29 in a state in which the adhesive tape DT is on the lower side of the conveying sheet P.

[0128] (9) In each embodiment, the chamber 29 may include a sheet-shaped elastic body Ds as shown in Fig. 32(a). This modification will be described below by taking the configuration of the second embodiment as an example.

[0129] The elastic body Ds is disposed inside the upper housing 29B and is configured to be in contact with the inner diameter of the upper housing 29B. In addition, the lower surface of the elastic body Ds and the cylindrical bottom of the upper housing 29B are configured to be flush with each other. Therefore, when the lower housing 29A and the upper housing 29B sandwich the conveying sheet P to form the chamber 29, the elastic body Ds abuts against the conveying sheet P. Specifically, the elastic body Ds abuts against the side of the conveying sheet P opposite to the side that holds the adhesive tape DT (the upper side in the figure). By disposing the elastic body Ds in contact with the inner diameter of the lower housing 29A, the elastic body Ds is not sandwiched when the chamber 29 is formed, so that the airtightness of the chamber 29 can be prevented from being reduced by the elastic body Ds. Examples of materials that constitute the elastic body Ds include rubber, elastomer, and gel-like polymer materials.

[0130] By providing the chamber 29 with the elastic body Ds, the bending rate of the adhesive tape DT can be made more uniform when the adhesive tape DT is deformed into a convex shape in step S4. Here, the effect of the configuration including the elastic body Ds will be described. As an example, when the adhesive tape DT is made of a relatively hard material, the bending rate of the adhesive tape DT is likely to be non-uniform, as shown in FIG. 32(b).

[0131] That is, in an area P1 of the conveying sheet P where the adhesive tape DT is held by the conveying sheet P, the bending rate of the conveying sheet P due to the pressing force V1 is small due to the presence of the adhesive tape DT. On the other hand, in an area P2 of the conveying sheet P where the adhesive tape DT is not held by the conveying sheet P, the bending rate of the conveying sheet P due to the pressing force V1 is relatively large. That is, the area P2 is more easily deformed by the pressing force V1, and the bending rate of the conveying sheet P in the area P1 is further reduced.

[0132] Moreover, the bending rate of the adhesive tape DT is large on the side (periphery) of the adhesive tape DT close to the region P2, and is small in the center of the adhesive tape DT. In this way, the bending rate due to the pressing force V1 becomes non-uniform in each of the adhesive tape DT and the conveying sheet P. As a result, the adhesive tape DT attached to the wafer W has poor adhesion to the wafer W.

[0133] On the other hand, when the elastic body Ds is provided, the entire elastic body Ds is uniformly deformed into a convex shape by the pressing force V1, as shown in Fig. 32(c). Therefore, the bending rate of the conveying sheet P in the region P1 is improved and the difference with the bending rate in the region P2 is reduced, so that the bending rates of the conveying sheet P and the adhesive tape DT become uniform overall. In other words, the adhesive tape DT becomes easily deformed according to the shape of the annular convex portion forming surface of the wafer W, so that the adhesion between the adhesive tape DT and the wafer W can be further improved.

[0134] (10) In each embodiment, a configuration for heating the adhesive tape DT may be further provided. As an example of a configuration for heating the adhesive tape DT, the sheet joining mechanism 81 has a heating mechanism 120 inside the upper housing 29B, as shown in Fig. 33(a). The heating mechanism 120 has a cylinder 121 and a heating member 123. The cylinder 121 is connected to an upper part of the heating member 123, and the heating member 123 can be raised and lowered inside the chamber 29 by the operation of the cylinder 121. Note that the heating member 123 does not have to be configured to be able to move up and down as long as it is capable of heating the adhesive tape DT.

[0135] A heater 125 for heating the adhesive tape DT is embedded inside the heating member 123. The heating temperature by the heater 125 is adjusted to a temperature at which the adhesive tape DT becomes soft. An example of the heating temperature is about 50° C. to 70° C. The shape of the bottom surface of the heating member 123 may be changed according to the shape of the wafer W. As an example, the heating member 123 is cylindrical overall.

[0136] It is preferable to heat the upper space H2 in advance using the heating mechanism 120 before starting step S5. That is, the control unit 33 operates the heater 125 to heat the heating device 123 to a predetermined temperature. By heating the heating device 123, the upper space H2 is heated by the thermal conduction effect, and the adhesive tape DT is also heated.

[0137] Since the adhesive tape DT becomes soft when heated, the deformability of the adhesive tape DT due to the pressing force V1 is improved. That is, when the adhesive tape DT is made to cover the wafer W, the ability of the adhesive tape DT to follow the wafer W can be further improved. Note that, as shown in Fig. 33(b), the heating member 123 may be lowered so as to be close to or in contact with the adhesive tape DT, and the adhesive tape DT may be directly heated by the heating member 123.

[0138] (11) In the embodiment, the heating mechanism 120 is disposed on the side of the upper space H2 in the chamber 29 and is configured to heat the upper space H2, but this is not limited thereto. That is, the heating mechanism 120 may be configured to heat the lower space H1. As an example, a heater 125 is disposed inside the holding table 9, and the heater 125 heats the lower space H1, thereby heating the adhesive tape DT. Moreover, the heating mechanism 120 may be configured to heat both the upper space H1 and the lower space H2.

[0139] (12) In each embodiment, the first joining process in step S3 is performed in the adhesive sheet joining apparatus 1 to create the sheet composite M, but the sheet composite M is not limited to being created inside the adhesive sheet joining apparatus 1. In other words, the sheet composite M may be created in advance by attaching the wafer W to the adhesive tape DT, and the adhesive sheet joining apparatus 1 may be used to apply a pressure higher than atmospheric pressure to the sheet composite M, thereby joining the adhesive tape DT to the wafer W. [Explanation of symbols]

[0140] 1 ... Adhesive sheet application device 3 … Wafer transport mechanism 5 … Container 6 … Frame recovery section 7 ... Alaina 8 … Lift table 9 … Holding table 12 … Frame supply section 13 ... Pasting unit 16 ... Wafer transport device 17 ... Frame transport device 23 ... Holding arm 27 ... Suction plate 28 ... Suction pad 32 ... Pressurizing device 33 ... Control section 38 … Frame holder 71 … Sheet supply section 72 … Separator recovery section 73 ... Sheet attachment section 74 … Sheet collection section 81 ... Sheet pasting mechanism 82 ... Sheet cutting mechanism 85 ... Laminating roller 86 ... Nip roller 95 … cutter f … Ring frame DT: Adhesive tape P … Transport sheet M: Sheet complex MF...Mount frame Ta…Base material Tb … Adhesive material Pa...Base material Pb: Adhesive

Claims

1. a bonding process for bonding the adhesive sheet to the annular convex portion-forming surface of a workpiece having an annular convex portion on the outer periphery of one surface of the sheet composite, by applying a pressure higher than atmospheric pressure to the annular convex portion-forming surface of the sheet composite; Equipped with The bonding process includes: A first pressing force from the adhesive sheet toward the workpiece and a second pressing force from the workpiece toward the adhesive sheet are applied to the sheet composite in a state where the entire surface of the workpiece opposite to the surface on which the annular convex portion is formed is in contact with the space. A method for attaching an adhesive sheet comprising the steps of:

2. The method for attaching a pressure-sensitive adhesive sheet according to claim 1, A process of housing the sheet composite in a chamber, The bonding process includes: After the accommodation process, the pressure in the internal space of the chamber is increased to attach the adhesive sheet to the annular convex portion-forming surface. A method for attaching an adhesive sheet comprising the steps of:

3. The method for attaching a pressure-sensitive adhesive sheet according to claim 2, The chamber comprises an upper housing and a lower housing; The bonding process includes: a step of forming upper and lower spaces by sandwiching the adhesive sheet between the upper housing and the lower housing to divide the internal space of the chamber into a lower space in which the workpiece is placed with the annular convex portion-forming surface facing upward, and an upper space facing the lower space via the adhesive sheet; and a space pressurizing process for applying pressure to at least the upper space out of the upper space and the lower space, thereby attaching the adhesive sheet to the annular convex portion forming surface. A method for attaching an adhesive sheet comprising the steps of:

4. The method for attaching a pressure-sensitive adhesive sheet according to claim 2, The adhesive sheet has a predetermined shape corresponding to the annular convex portion forming surface of the workpiece and is held by a long conveying sheet, The chamber comprises an upper housing and a lower housing; The bonding process includes: a top-bottom space forming process for dividing the internal space of the chamber into a bottom space in which the workpiece is placed with the annular convex portion-forming surface facing upward and an top space facing the bottom space via the adhesive sheet held by the conveying sheet, by sandwiching the conveying sheet between the top housing and the bottom housing; and a space pressurizing process for applying pressure to at least the upper space out of the upper space and the lower space, thereby attaching the adhesive sheet to the annular convex portion forming surface. A method for attaching an adhesive sheet comprising the steps of:

5. The method for attaching a pressure-sensitive adhesive sheet according to claim 3, a sheet-like elastic body disposed inside the upper housing, The sheet-like elastic body is disposed so that the adhesive sheet is sandwiched between the upper housing and the lower housing in the process of forming the vertical space, and the sheet-like elastic body is brought into contact with the adhesive sheet. A method for attaching an adhesive sheet comprising the steps of:

6. The method for attaching a pressure-sensitive adhesive sheet according to any one of claims 3 to 5, a heating step of heating the adhesive sheet by heating at least one of the lower space and the upper space, The attaching step applies a pressure higher than atmospheric pressure to the adhesive sheet heated in the heating step, thereby attaching the adhesive sheet to the annular convex portion forming surface. A method for attaching an adhesive sheet comprising the steps of:

7. a bonding mechanism that bonds an adhesive sheet to a surface of a workpiece having an annular convex portion on an outer periphery of one surface thereof by applying a pressure higher than atmospheric pressure to the sheet composite, the adhesive sheet being attached to the surface of the annular convex portion; Equipped with The bonding mechanism includes: A first pressing force from the adhesive sheet toward the workpiece and a second pressing force from the workpiece toward the adhesive sheet are applied to the sheet composite in a state where the entire surface of the workpiece opposite to the surface on which the annular convex portion is formed is in contact with the space. An adhesive sheet application device comprising:

8. A method for manufacturing a semiconductor product, comprising the steps of: manufacturing a semiconductor product in which an adhesive sheet is attached to a surface of a workpiece having an annular convex portion on an outer periphery of one surface of the workpiece; a bonding process for bonding the adhesive sheet to the annular convex portion-forming surface of the workpiece by applying a pressure higher than atmospheric pressure to the sheet composite formed by adhering the adhesive sheet to the annular convex portion-forming surface of the workpiece; Equipped with The bonding process includes: A first pressing force from the adhesive sheet toward the workpiece and a second pressing force from the workpiece toward the adhesive sheet are applied to the sheet composite in a state where the entire surface of the workpiece opposite to the surface on which the annular convex portion is formed is in contact with the space.

1. A method for manufacturing a semiconductor product comprising the steps of:

Images