Electronic component and method for manufacturing the same

Abstract

This electric component comprises: an elemental body having a first flat surface and a second flat surface, and a ridgeline part that connects the first flat surface and the second flat surface to each other; and a conductive member provided so as to be contiguous to at least a portion of the first flat surface and to at least a portion of the ridgeline part. The first flat surface has a first contact surface in contact with the conductive member. The ridgeline part has a second contact surface in contact with the conductive member. In a cross section orthogonal to the first flat surface and to the second flat surface and intersecting the conductive member, the first contact surface, and the second contact surface, when a first thickness represents the thickness of the conductive member in the direction orthogonal to the first flat surface at the central portion of the first contact surface in the cross section, and when a second thickness represents the thickness of the conductive member in the direction orthogonal to the first flat surface at an end portion that is of the first contact surface and is on the side opposite from the ridgeline part relative to the central portion of the first contact surface in the cross section, the first thickness is at most 1.3 times the second thickness, and the second thickness is at most 1.3 times the first thickness.

Description

Technical Field

[0001] The present disclosure relates to an electronic component and a method for manufacturing the same.

Background Art

[0002] Conventionally, as an electronic component, there is one described in Japanese Patent Application Laid-Open No. 2006-114626 (Patent Document 1). This electronic component includes a rectangular parallelepiped-shaped body and a conductive member provided on the outer surface of the body. The body has a bottom surface and a top surface facing each other, and a first end surface and a second end surface connecting the bottom surface and the top surface and facing each other. The conductive member is continuously provided across the bottom surface and the first end surface. The conductive member has a first portion located on the first end surface side and a second portion located on the bottom surface side. The end portion on the top surface side of the first portion becomes thinner as it goes from the bottom surface side to the top surface side. The end portion on the second end surface side of the second portion becomes thinner as it goes from the first end surface side to the second end surface side.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the conventional electronic component, both end portions, i.e., the end portion on the top surface side of the first portion of the conductive member and the end portion on the second end surface side of the second portion of the conductive member, become thinner as they go from the bottom surface side to the top surface side or from the first end surface side to the second end surface side. When the thickness is thin, for example, a gas such as water vapor may enter from both end portions of the conductive member, causing problems such as damage to the conductive member.

[0005] Therefore, an object of the present disclosure is to provide an electronic component and a method for manufacturing the same that can suppress the intrusion of gas.

Means for Solving the Problems

[0006] To solve the above problems, an electronic component according to one aspect of the present disclosure includes: a body having a first plane and a second plane, and a ridge line portion connecting the first plane and the second plane; a conductive member provided continuously on at least a part of the first plane and at least a part of the ridge line portion; the first plane has a first contact surface that contacts the conductive member; the ridge line portion has a second contact surface that contacts the conductive member; in a cross section orthogonal to each of the first plane and the second plane and intersecting the conductive member, the first contact surface, and the second contact surface, at the central portion of the first contact surface in the cross section, the thickness of the conductive member in the direction orthogonal to the first plane is defined as a first thickness; when the thickness of the conductive member in the direction orthogonal to the first plane is defined as a second thickness at the end portion of the first contact surface on the side opposite to the ridge line portion with respect to the central portion of the first contact surface in the cross section, the first thickness is 1.3 times or less of the second thickness, and the second thickness is 1.3 times or less of the first thickness.

[0007] According to the above aspect, since the first thickness and the second thickness are made to be about the same, in the portion of the conductive member provided on at least a part of the first plane, the thickness of the end portion on the side opposite to the ridge line portion can be made thicker than before. Therefore, for example, intrusion of gas such as water vapor from the end portion can be suppressed.

[0008] Preferably, in one embodiment of the electronic component, the first plane is a mounting surface, in the cross section, when the thickness of the conductive member in the direction orthogonal to the plane contacting the central portion of the second contact surface through the central portion of the second contact surface in the cross section is defined as a third thickness, The first thickness is 1.3 times or less the third thickness, the second thickness is 1.3 times or less the third thickness, and the third thickness is 1.3 times or less each of the first thickness and the second thickness.

[0009] According to the embodiment, since the first to third thicknesses are about the same and the thickness of the entire conductive member is uniform, when the first plane is opposed to a circuit board or the like and an electronic component is mounted on the circuit board or the like, the posture of the electronic component can be stabilized. Further, since the thickness of the entire conductive member is uniform, the thickness of the end portion of the conductive member existing on the ridge line portion side can be made thicker than before. Therefore, for example, intrusion of gas such as water vapor can be further suppressed.

[0010] Preferably, in one embodiment of the electronic component, The first thickness is 1.2 times or less each of the second thickness and the third thickness, the second thickness is 1.2 times or less each of the first thickness and the third thickness, and the third thickness is 1.2 times or less each of the first thickness and the second thickness.

[0011] According to the embodiment, when the electronic component is mounted on a circuit board or the like, the posture of the electronic component can be further stabilized. Further, for example, intrusion of gas such as water vapor can be further suppressed.

[0012] Preferably, in one embodiment of the electronic component, In the cross section, the end portion of the first contact surface is located closer to the central portion of the first contact surface than the outermost end of the conductive member on the side opposite to the ridge line portion with respect to the central portion of the first contact surface.

[0013] When the electronic component is mounted, since the molten solder wets and spreads, it may wrap around the outermost end of the conductive member. According to the embodiment, it is possible to suppress the molten solder from excessively wetting and spreading into a region where the conductive member is not provided in the first plane of the element body.

[0014] Preferably, in one embodiment of the electronic component, The conductive member is provided continuously with at least a part of the first plane, at least a part of the ridge line portion, and at least a part of the second plane. The second plane has a third contact surface that contacts the conductive member. In the cross section, the end of the third contact surface on the side opposite to the ridge line portion with respect to the central portion of the third contact surface is located closer to the central portion of the third contact surface than the outermost end of the conductive member on the side opposite to the ridge line portion with respect to the central portion of the third contact surface.

[0015] When mounting an electronic component, since the molten solder spreads by wetting, it may wrap around the outermost end of the conductive member. According to the embodiment, it is possible to suppress the excessive spreading of the molten solder into the region of the second plane of the element body where the conductive member is not provided.

[0016] Preferably, in one embodiment of the electronic component, The conductive member is provided continuously with at least a part of the first plane, at least a part of the ridge line portion, and at least a part of the second plane. The second plane has a third contact surface that contacts the conductive member. In the cross section, when the thickness of the conductive member in the direction perpendicular to the second plane at the central portion of the third contact surface is defined as the fourth thickness, the first thickness is greater than the fourth thickness.

[0017] When the first plane side of the element body is the mounting surface side of the electronic component, when mounting the electronic component, the molten solder is pushed aside by a part of the conductive member provided on at least a part of the first plane and wraps around to the second plane side of the element body. The wrapped solder forms a fillet. According to the embodiment, since the thickness of the conductive member provided on at least a part of the first plane is relatively large, the amount of solder pushed aside becomes large, and the height of the fillet formed on the second plane side can be increased. As a result, the electronic component can be fixed more firmly to a circuit board or the like.

[0018] Preferably, in one embodiment of the electronic component, The conductive member is provided continuously with at least a part of the first plane, at least a part of the ridge line portion, and at least a part of the second plane. The second plane has a third contact surface that contacts the conductive member. In the cross section, when the thickness of the conductive member in the direction orthogonal to the second plane at the central portion of the third contact surface is defined as the fourth thickness, the thickness of the conductive member in the direction orthogonal to the second plane at the end portion of the third contact surface located on the ridge line portion side is defined as the fifth thickness, and the thickness of the conductive member in the direction orthogonal to the second plane at the end portion of the third contact surface located on the side opposite to the ridge line portion with respect to the central portion of the third contact surface is defined as the sixth thickness. Each of the fifth thickness and the sixth thickness is thicker than the fourth thickness.

[0019] According to the embodiment, compared with the case where the thickness of a part of the conductive member provided on at least a part of the second plane of the element body is uniform along the second plane, the contact area between the fillet formed during mounting and the conductive member can be increased. Therefore, an electronic component can be fixed more firmly to a circuit board or the like.

[0020] Preferably, in one embodiment of the electronic component, The conductive member is provided continuously with at least a part of the first plane, at least a part of the ridge line portion, and at least a part of the second plane. The second plane has a third contact surface that contacts the conductive member. In the cross section, when the thickness of the conductive member in the direction orthogonal to the second plane at the end portion of the third contact surface located on the ridge line portion side is defined as the fifth thickness, and the thickness of the conductive member in the direction orthogonal to the second plane at the end portion of the third contact surface located on the side opposite to the ridge line portion with respect to the central portion of the third contact surface is defined as the sixth thickness. The fifth thickness is thicker than the sixth thickness.

[0021] According to the above embodiment, when a part of the thickness of a conductive member provided on at least a part of the second plane of the base body is uniform along the second plane, the area of the conductive member that can contact the solder increases as compared with the case where the thickness is uniform. Therefore, an electronic component can be more firmly fixed to a circuit board or the like.

[0022] Preferably, in one embodiment of the electronic component, the conductive member is continuously provided on at least a part of the first plane, at least a part of the ridge line portion, and at least a part of the second plane. A plurality of the conductive members provided on at least a part of the second plane exist independently of each other electrically. When viewed from a direction orthogonal to the second plane, the plurality of conductive members extend in a first direction that is parallel to the second plane and from the ridge line portion toward the center of the second plane, and are arranged side by side in a direction orthogonal to the first direction and parallel to the second plane. In each of the plurality of conductive members, the width at the center in the extending direction is smaller than the widths at both ends in the extending direction.

[0023] According to the above embodiment, even when there are a plurality of conductive members provided on at least a part of the second plane, in each of the plurality of conductive members, since the width at the center in the extending direction is smaller than the widths at both ends in the extending direction, it is possible to suppress short - circuiting between adjacent conductive members due to solder that spreads and wets the base body during mounting of the electronic component.

[0024] Preferably, in one embodiment of the electronic component, the base body further includes a coil provided therein and electrically connected to the conductive member.

[0025] According to the above embodiment, a coil component having a conductive member capable of suppressing a local current flow can be obtained.

[0026] Preferably, in one embodiment of the electronic component, The conductive member is continuously provided only on at least a part of the first plane, at least a part of the ridge line portion, and at least a part of the second plane.

[0027] According to the embodiment, since the area of the region where the conductive member is provided in the element body can be reduced, the parasitic capacitance that may occur between the coil and the conductive member can be suppressed. Thereby, the high-frequency characteristics of the coil component can be improved.

[0028] Preferably, in one embodiment of the method for manufacturing an electronic component, a step of preparing an element body having a first plane and a second plane, and a ridge line portion connecting the first plane and the second plane; a step of forming a conductive member, the step of forming the conductive member continuously on at least a part of the first plane and at least a part of the ridge line portion such that the first plane has a first contact surface in contact with the conductive member and the ridge line portion has a second contact surface in contact with the conductive member; The step of forming the conductive member includes a step of applying a photosensitive conductive paste to at least a part of the first plane and at least a part of the ridge line portion; in a cross section orthogonal to each of the first plane and the second plane and intersecting the conductive member, the first contact surface, and the second contact surface, when the thickness of the conductive member in the direction orthogonal to the first plane at the central portion of the first contact surface in the cross section is defined as a first thickness and the thickness of the conductive member in the direction orthogonal to the first plane at the end portion of the first contact surface on the side opposite to the ridge line portion with respect to the central portion of the first contact surface in the cross section is defined as a second thickness, exposing the photosensitive conductive paste such that the first thickness is 1.3 times or less of the second thickness and the second thickness is 1.3 times or less of the first thickness; a step of developing the photosensitive conductive paste.

[0029] According to the embodiment, intrusion of a gas such as water vapor can be suppressed, for example.

[0030] Preferably, in one embodiment of the method for manufacturing an electronic component, In the exposure step, when the thickness of the conductive member in the direction perpendicular to the plane in contact with the central portion of the second contact surface through the central portion of the second contact surface in the cross section is defined as a third thickness, further, the first thickness is 1.3 times or less of the third thickness, the second thickness is 1.3 times or less of the third thickness, and the third thickness is 1.3 times or less of each of the first thickness and the second thickness, the photosensitive conductive paste is exposed.

[0031] According to the embodiment, an electronic component capable of stabilizing the posture when mounted can be manufactured. Further, for example, intrusion of a gas such as water vapor can be further suppressed.

[0032] Preferably, in one embodiment of the method for manufacturing an electronic component, In the exposure step, the photosensitive conductive paste is exposed by irradiating the photosensitive conductive paste with a laser.

[0033] According to the embodiment, the shape of the conductive member can be controlled with high precision.

[0034] Preferably, in one embodiment of the method for manufacturing an electronic component, The laser is irradiated so that the temperature of the element body becomes equal to or lower than the firing temperature of the element body.

[0035] According to the embodiment, damage to the element body due to laser irradiation can be suppressed.

Advantages of the Invention

[0036] According to one aspect of the present disclosure, an electronic component capable of suppressing gas intrusion can be realized.

Brief Description of the Drawings

[0037]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

[0038] Hereinafter, an electronic component which is an aspect of the present disclosure will be described in detail with reference to the illustrated embodiments. Note that the drawings include some schematic ones and may not reflect actual dimensions and ratios.

[0039] [First Embodiment] [Overall Configuration] FIG. 1 is a perspective view showing a first embodiment of the electronic component. FIG. 2 is a cross-sectional view taken along the line X-X (LT cross-sectional view) of FIG. 1. FIG. 3 is an exploded plan view of the electronic component. The electronic component is not particularly limited as long as it has a configuration in which external electrodes are provided on the outer surface of the element body. In this embodiment, the electronic component is a coil component.

[0040] The L direction is the length direction of the electronic component 1, the W direction is the width direction of the electronic component 1, and the T direction is the height direction of the electronic component 1. In this embodiment, the L direction is orthogonal to the W direction. The T direction is orthogonal to both the L direction and the W direction. Hereinafter, the forward direction of the T direction is also referred to as the upper side, and the reverse direction of the T direction is also referred to as the lower side. Further, the LT plane refers to a plane parallel to the L direction and the T direction. The WL plane refers to a plane parallel to the W direction and the L direction. The TW plane refers to a plane parallel to the T direction and the W direction.

[0041] As shown in FIGS. 1, 2, and 3, the electronic component 1 includes a body 10, a coil 20 provided inside the body 10, and a first external electrode 31 and a second external electrode 32 provided on the outer surface of the body 10 and electrically connected to the coil 20.

[0042] The electronic component 1 is electrically connected to the wiring of a circuit board (not shown) via the first and second external electrodes 31 and 32. The electronic component 1 is used, for example, as a noise removal filter and is used in electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, and car electronics.

[0043] The body 10 is preferably a sintered body of a plurality of magnetic layers 21. The magnetic layers 21 are laminated in the T direction. The magnetic layer 21 is made of a magnetic material. The magnetic material is not particularly limited. For example, Fe 2 O 3 , ZnO, CuO, and NiO, and a Ni-Cu-Zn-based ferrite material can be used. The thickness of the magnetic layer 21 is, for example, 5 μm or more and 30 μm or less. The body 10 may partially include a non-magnetic layer.

[0044] The shape of the body 10 is not particularly limited, but in this embodiment, it is formed in a substantially rectangular parallelepiped shape. The outer surface of the body 10 has a first end face 14 and a second end face 15 facing each other in the L direction, a first side face 12 and a second side face 13 facing each other in the W direction, and a bottom face 16 and a top face 17 facing each other in the T direction. The top face 17 is disposed above the bottom face 16. In this specification, the direction from the second end face 15 to the first end face 14 in the L direction is referred to as the "forward L direction", the opposite direction of the forward L direction is referred to as the "reverse L direction", the direction from the first side face 12 to the second side face 13 in the W direction is referred to as the "forward W direction", the opposite direction of the forward W direction is referred to as the "reverse W direction", the direction from the bottom face 16 to the top face 17 in the T direction is referred to as the "forward T direction", and the opposite direction of the forward T direction is referred to as the "reverse T direction".

[0045] The outer surface of the base body 10 has a first ridge line portion 11a connecting the first end face 14 and the bottom face 16, a second ridge line portion 11b connecting the second end face 15 and the bottom face 16, a third ridge line portion 11c connecting the second end face 15 and the top face 17, a fourth ridge line portion 11d connecting the first end face 14 and the top face 17, a fifth ridge line portion (not shown) connecting the first side face 12 and the bottom face 16, a sixth ridge line portion (not shown) connecting the second side face 13 and the bottom face 16, a seventh ridge line portion (not shown) connecting the second side face 13 and the top face 17, an eighth ridge line portion (not shown) connecting the first side face 12 and the top face 17, a ninth ridge line portion (not shown) connecting the first end face 14 and the first side face 12, a tenth ridge line portion (not shown) connecting the second end face 15 and the first side face 12, an eleventh ridge line portion (not shown) connecting the second end face 15 and the second side face 13, and a twelfth ridge line portion (not shown) connecting the first end face 14 and the second side face 13.

[0046] The first to twelfth ridge line portions are curved surfaces convex to the outside of the base body 10. The shape of the first to twelfth ridge line portions is not particularly limited as long as it is a curved surface convex to the outside of the base body 10. In this embodiment, in the cross section shown in FIG. 2, the shapes of the first to fourth ridge line portions 11a to 11d are arc-shaped. The radius of curvature of the arc is not particularly limited. The same applies to the fifth to twelfth ridge line portions. When the electronic component 1 is minute, the first to twelfth ridge line portions can be observed using an optical microscope, for example, at a magnification of 50 times to 500 times.

[0047] In this embodiment, any one of the first end face 14, the second end face 15, the first side face 12, the second side face 13, the bottom face 16, and the top face 17 corresponds to the "first plane" described in the claims. Any one of the first to twelfth ridge line portions connected to this "first plane" corresponds to the "ridge line portion" described in the claims. Any one of the first end face 14, the second end face 15, the first side face 12, the second side face 13, the bottom face 16, and the top face 17, excluding the above "first plane", connected to this "ridge line portion" corresponds to the "second plane" described in the claims. In this embodiment, each of the first end face 14, the second end face 15, the first side face 12, the second side face 13, the bottom face 16, and the top face 17 is a flat surface. However, when these surfaces have, for example, steps, the "first plane" refers to a flat surface continuously connected to the ridge line portion. The same applies to the "second plane". Also, in this embodiment, the shape of the base body 10 is a rectangular parallelepiped, but it is not limited thereto, and the angle formed by two intersecting surfaces among the first end face 14, the second end face 15, the first side face 12, the second side face 13, the bottom face 16, and the top face 17 does not have to be a right angle.

[0048] Hereinafter, for the sake of simplicity of explanation, the bottom face 16 will be described as the "first plane", the first end face 14 and the second end face 15 will be described as the "second plane", and the first ridge line portion 11a and the second ridge line portion 11b will be described as the "ridge line portion". In this case, the LT cross-section is the "cross-section orthogonal to each of the first plane and the second plane and intersecting the conductive member, the first contact surface, and the second contact surface" described in the claims.

[0049] The coil 20 includes a plurality of coil wirings 22 laminated along the T direction, a plurality of via conductors 24 extending along the T direction and connecting the coil wirings 22 adjacent to each other in the T direction, a first lead-out conductor 23A connected to the uppermost coil wiring 22, and a second lead-out conductor 23B connected to the lowermost coil wiring 22.

[0050] Each coil wiring 22 is provided on each of a plurality of magnetic layers 21 excluding the uppermost magnetic layer 21 and the lowermost magnetic layer 21. Each coil wiring 22 is wound along a plane parallel to the WL plane, arranged side by side in the T direction, and forms a helix while being electrically connected in series. Each coil wiring 22 is wound less than one turn. The via conductor 24 penetrates the magnetic layer 21 in the T direction. The coil wirings 22 adjacent to each other in the T direction are electrically connected in series via the via conductor 24. Note that each of the uppermost magnetic layer 21 and the lowermost magnetic layer 21 may be composed of a plurality of layers.

[0051] The first lead conductor 23A linearly extends from the end of the uppermost coil wiring 22 opposite to the end to which the via conductor 24 is connected to the first end face 14 of the element body 10. The first lead conductor 23A is exposed from the first end face 14 and connected to the first external electrode 31. The second lead conductor 23B linearly extends from the end of the lowermost coil wiring 22 opposite to the end to which the via conductor 24 is connected to the second end face 15 of the element body 10. The second lead conductor 23B is exposed from the second end face 15 and connected to the second external electrode 32.

[0052] The coil wiring 22 and the first and second lead conductors 23A and 23B are formed of a conductive material such as Ag or Cu, for example. The number of stacked layers of the coil wiring 22 is not particularly limited. By firing the element body 10, a coil 20 forming a helix along the T direction is obtained.

[0053] The first external electrode 31 includes a first conductive member 301 provided on the outer surface of the element body 10, a first plating layer 41 covering the outer surface of the first conductive member 301, and a second plating layer 42 covering the outer surface of the first plating layer 41. The second external electrode 32 includes a second conductive member 302 provided on the outer surface of the element body 10, a first plating layer 41 covering the outer surface of the second conductive member 302, and a second plating layer 42 covering the outer surface of the first plating layer 41.

[0054] The first plating layer 41 and the second plating layer 42 protect the first conductive member 301 and the second conductive member 302 from the external environment. The metal contained in the first plating layer 41 is not particularly limited, but for example, it is nickel. The metal contained in the second plating layer 42 is not particularly limited, but for example, it is tin. The thickness of each of the first plating layer 41 and the second plating layer 42 is not particularly limited, and for example, it is 2 μm or more and 15 μm or less. In this embodiment, the number of plating layers is two layers, but it is not limited thereto, and it may be one layer or three or more layers. Note that the first plating layer 41 and the second plating layer 42 may be provided as necessary, or may not be provided.

[0055] The first conductive member 301 is continuously provided on at least a part of the bottom surface 16 (the first plane) and at least a part of the first ridge portion 11a. In this embodiment, the first conductive member 301 is continuously provided on the entire surfaces of the first end surface 14, the first ridge portion 11a, the fourth ridge portion 11d, the ninth ridge portion, and the twelfth ridge portion, and on the end portions on the first end surface 14 side of the bottom surface 16, the top surface 17, the first side surface 12, and the second side surface 13. The first conductive member 301 is connected to the first lead-out conductor 23A and is electrically connected to the coil 20. The first conductive member 301 is made of a low-resistance metal material such as Ag, for example. For example, the first conductive member 301 is obtained by firing a photosensitive conductive paste containing conductive particles such as Ag powder and a resin composition containing a photosensitive resin.

[0056] As long as the first conductive member 301 is continuously provided with at least a part of the bottom surface 16 (the first plane) and at least a part of the first ridge line portion 11a, the position of the first conductive member 301 with respect to the outer surface of the base body 10 is not particularly limited. For example, the first conductive member 301 may be continuously provided only with a part of the L-direction side of the bottom surface 16 and a part of the first ridge line portion 11a. Further, for example, the first conductive member 301 may have an L-shape formed across the end portion of the bottom surface 16 on the L-direction side, the entire surface of the first ridge line portion 11a, and the end portion of the first end surface 14 on the reverse T-direction side. Further, for example, the first conductive member 301 may include a portion where a plurality of dots are provided on one or more surfaces among the first side surface 12, the second side surface 13, the first end surface 14, the second end surface 15, the bottom surface 16, and the top surface 17.

[0057] The second conductive member 302 is continuously provided with at least a part of the bottom surface 16 (the first plane) and at least a part of the second ridge line portion 11b. In this embodiment, the second conductive member 302 is continuously provided with the entire surfaces of the second end surface 15, the second ridge line portion 11b, the third ridge line portion 11c, the tenth ridge line portion, and the eleventh ridge line portion, and the end portions of the bottom surface 16, the top surface 17, the first side surface 12, and the second side surface 13 on the second end surface 15 side. The second conductive member 302 is connected to the second lead-out conductor 23B of the coil 20 and is electrically connected to the coil 20. The second conductive member 302 is made of a low-resistance metal material such as Ag, for example. The second conductive member 302 is obtained by firing a photosensitive conductive paste containing, for example, conductive particles such as Ag powder and a resin composition containing a photosensitive resin.

[0058] The position of the second conductive member 302 with respect to the outer surface of the base body 10 is not particularly limited as long as the second conductive member 302 is continuously provided on at least a part of the first plane (bottom surface 16) and at least a part of the second ridge line portion 11b. For example, the second conductive member 302 may be continuously provided only on a part of the reverse L direction side of the bottom surface 16 and a part of the second ridge line portion 11b. Further, for example, the second conductive member 302 may have an L shape formed across the end portion on the reverse L direction side of the bottom surface 16, the entire surface of the second ridge line portion 11b, and the end portion on the reverse T direction side of the second end surface 15. Further, for example, the second conductive member 302 may include a portion where a plurality of dots are provided in a dot shape on one or more surfaces among the first side surface 12, the second side surface 13, the first end surface 14, the second end surface 15, the bottom surface 16, and the top surface 17.

[0059] (Thickness of the conductive member) Next, the thickness of the conductive member will be described in detail. FIG. 4 is an enlarged view of part A in FIG. 2. Hereinafter, the thickness of the first conductive member 301 will be described, but the same applies to the thickness of the second conductive member 302. Therefore, a detailed description of the second conductive member 302 will be omitted.

[0060] As shown in FIG. 4, the bottom surface 16 (first plane) has a first contact surface S1 that contacts the first conductive member 301. The first ridge line portion 11a has a second contact surface S2 that contacts the first conductive member 301.

[0061] The thickness of the portion of the first conductive member 301 provided on the bottom surface 16 is uniform. In other words, the thickness of the portion of the first conductive member 301 provided on the bottom surface 16 is substantially the same. Specifically, in FIG. 4, the thickness of the first conductive member 301 in the direction perpendicular to the first contact surface S1 passing through the central portion of the first contact surface S1 is defined as the first thickness t1, and the thickness of the first conductive member 301 in the direction perpendicular to the first contact surface S1 passing through the end portion of the first contact surface S1 on the side opposite to the first ridge line portion 11a with respect to the central portion of the first contact surface S1 is defined as the second thickness t2. When this is the case, the first thickness t1 is 1.3 times or less of the second thickness t2, and the second thickness t2 is 1.3 times or less of the first thickness t1.

[0062] Note that the content described above is the same even when the first plane is a plane other than the bottom surface 16. For example, when the first plane is the first side surface 12 and the second plane is the top surface 17, the first side surface 12 has a first contact surface that contacts the first conductive member 301, and the eighth ridge line portion that connects the first side surface 12 and the top surface 17 has a second contact surface that contacts the first conductive member 301. In the TW cross-section that is orthogonal to the first side surface 12 and the top surface 17 and intersects the first conductive member 301, the first contact surface, and the second contact surface, when the thickness of the first conductive member 301 at the central portion of the first contact surface is defined as the first thickness, and the thickness of the first conductive member 301 at the end portion of the first contact surface on the side opposite to the eighth ridge line portion with respect to the central portion of the first contact surface is defined as the second thickness, the first thickness is 1.3 times or less of the second thickness, and the second thickness is 1.3 times or less of the first thickness.

[0063] According to the electronic component 1, since the first thickness t1 and the second thickness t2 are made to be about the same, in the portion of the first conductive member 301 provided on a part of the bottom surface 16, the thickness of the end portion on the side opposite to the first ridge line portion 11a side can be made thicker than before. Therefore, for example, it is possible to suppress gas such as water vapor from entering from the above-mentioned end portion on the side opposite to the first ridge line portion 11a side. As a result, for example, it is possible to suppress damage to the first conductive member 301, the coil 20, etc. by the gas. When the thickness of the above-mentioned end portion is thin, there is a possibility that the gas permeates through the above-mentioned end portion or the gas enters from the gap between the above-mentioned end portion and the body. Damage by gas means, for example, when the gas is water vapor, migration that can occur in the first conductive member 301, the lead conductors 23A and 23B of the coil 20, and the coil wiring 22. When the migration progresses, there is a possibility of a short circuit occurring between adjacent wirings. When the gas is, for example, hydrogen sulfide, it is corrosion that can occur in the first conductive member 301, the lead conductors 23A and 23B of the coil 20, and the coil wiring 22.

[0064] Preferably, the bottom surface 16 is a mounting surface. As shown in FIG. 4, when the thickness of the first conductive member 301 in the direction perpendicular to the plane that passes through the central portion of the second contact surface S2 and is in contact with the central portion of the second contact surface S2 is defined as the third thickness t3, the first thickness t1 is 1.3 times or less the third thickness t3, the second thickness t2 is 1.3 times or less the third thickness t3, and the third thickness t3 is 1.3 times or less the thicknesses of the first thickness t1 and the second thickness t2.

[0065] According to the above configuration, since the first to third thicknesses t1 to t3 are of the same degree and the overall thickness of the portion of the first conductive member 301 provided on the bottom surface 16 and the first ridge line portion 11a is uniform, when the bottom surface 16 is opposed to a circuit board or the like and the electronic component 1 is mounted on the circuit board or the like, the posture of the electronic component 1 can be stabilized.

[0066] Preferably, the first thickness t1 is 1.2 times or less the thicknesses of the second thickness t2 and the third thickness t3, the second thickness t2 is 1.2 times or less the thicknesses of the first thickness t1 and the third thickness t3, and the third thickness t3 is 1.2 times or less the thicknesses of the first thickness t1 and the second thickness t2. According to this configuration, when the electronic component 1 is mounted on a circuit board or the like, the posture of the electronic component 1 can be further stabilized.

[0067] Preferably, the first thickness t1 is 1.1 times or less the thicknesses of the second thickness t2 and the third thickness t3, the second thickness t2 is 1.1 times or less the thicknesses of the first thickness t1 and the third thickness t3, and the third thickness t3 is 1.1 times or less the thicknesses of the first thickness t1 and the second thickness t2. According to this configuration, when the electronic component 1 is mounted on a circuit board or the like, the posture of the electronic component 1 can be further stabilized.

[0068] (Manufacturing method) The electronic component 1 preparing a body 10 having a bottom surface 16 (first plane), a first end surface 14 (second plane), and a first ridge line portion 11a connecting the bottom surface 16 and the first end surface 14; A step of forming a first conductive member 301, wherein at least a part of the bottom surface 16 has a first contact surface S1 that contacts the first conductive member 301, and at least a part of the first ridge line portion 11a has a second contact surface S2 that contacts the first conductive member 301, and the first conductive member 301 is continuously formed on at least a part of the bottom surface 16 and at least a part of the first ridge line portion 11a. The step of forming the first conductive member 301 includes: Applying a photosensitive conductive paste to at least a part of the bottom surface 16 and at least a part of the first ridge line portion 11a; In a cross-section orthogonal to each of the bottom surface 16 and the first end surface 14 and intersecting the first conductive member 301, the first contact surface S1, and the second contact surface S2, when the thickness of the first conductive member 301 at the central portion of the first contact surface S1 is defined as a first thickness t1, and the thickness of the first conductive member 301 at the end portion of the first contact surface S1 on the side opposite to the first ridge line portion 11a with respect to the central portion of the first contact surface S1 is defined as a second thickness t2, exposing the photosensitive conductive paste such that the first thickness t1 is 1.3 times or less of the second thickness t2, and the second thickness t2 is 1.3 times or less of the first thickness t1; Developing the photosensitive conductive paste. It is manufactured by a method including these steps.

[0069] ≪Preparation of the base body≫ Prepare a base body 10. The base body 10 is obtained, for example, by laminating a plurality of magnetic layers 21 on which coil wiring 22 and first and second lead conductors 23A and 23B are formed, and firing them. The firing temperature is not particularly limited and may be appropriately set in consideration of the type of material used, etc. The configuration of the base body 10 including the coil 20 is as shown in FIG. 2.

[0070] The magnetic layer 21 is obtained by forming a paste containing a magnetic material in a sheet shape.

[0071] Examples of the magnetic material include Ni-Cu-Zn-based ferrite materials. The Ni-Cu-Zn-based ferrite material is, for example, Fe as Fe 2 O 3In terms of conversion to oxides, it contains 40 mol% or more and 49.5 mol% or less of Fe converted to FeO, 2 mol% or more and 35 mol% or less of Zn converted to ZnO, 6 mol% or more and 13 mol% or less of Cu converted to CuO, and 10 mol% or more and 45 mol% or less of Ni converted to NiO. The magnetic material may contain additives and unavoidable impurities as required. Examples of additives include Mn 3 O 4 , Co 3 O 4 , SnO 2 , Bi 2 O 3 and SiO 2 .

[0072] Specifically, the magnetic layer 21 is fabricated as follows. First, Fe 2 O 3 , ZnO, CuO, and NiO are weighed to have a predetermined composition. These, together with pure water and PSZ (partially stabilized zirconia) media, are placed in a ball mill and wet-mixed and pulverized for 4 to 8 hours. Then, the moisture is evaporated and dried, and calcined at a temperature of 700 °C or higher and 800 °C or lower for 2 to 5 hours. Thereby, a Ni-Cu-Zn-based ferrite material (magnetic material) is obtained.

[0073] The obtained magnetic material, an organic binder such as polyvinyl butyral, organic solvents such as ethanol and toluene, and a plasticizer are placed in a ball mill together with PSZ media and further mixed. Next, the obtained mixture is formed into a sheet shape with a film thickness of 20 μm or more and 30 μm or less by a doctor blade method or the like. Then, the magnetic layer 21 is obtained by punching this sheet into a predetermined shape (typically, a rectangle).

[0074] In the fabricated magnetic layer 21, via holes are formed at predetermined locations, for example, by laser irradiation.

[0075] Separately, a conductive paste containing a conductive material (typically, Ag powder) as a main component is prepared. The conductive paste may contain a solvent, a resin, a dispersant, etc. in addition to the conductive material. This conductive paste is applied to the magnetic layer 21 in which via holes are formed, for example, by a screen printing method. As a result, the via holes are filled with the conductive paste, and the coil wiring 22 and the first and second lead conductors 23A and 23B are formed.

[0076] Subsequently, a plurality of produced magnetic layers 21 are laminated in a predetermined order and thermocompression bonded to produce a laminated block. Next, the laminated block is cut with a dicing saw or the like and separated into individual pieces. This individual piece is fired at 900 °C or higher and 920 °C or lower for 2 to 4 hours using a firing furnace. The fired body is placed in a rotary barrel machine together with media and rotated to polish the ridges and corners of the fired body. As a result, a base body 10 having first to twelfth ridge portions is obtained.

[0077] ≪Formation of External Electrodes≫ Subsequently, a first conductive member 301 and a second conductive member 302 are formed on the entire first end face 14 and the entire second end face 15 of the base body 10, and on a part of each of the first side face 12, the second side face 13, the bottom face 16, and the top face 17. As a result, the first conductive member 301 and the second conductive member 302 are electrically connected to the coil 20.

[0078] As a method for forming the first conductive member 301 and the second conductive member 302, for example, first, a photosensitive conductive paste containing conductive particles such as Ag powder and a resin composition containing a photosensitive resin is applied to a predetermined portion of the base body 10. The application method is not particularly limited and may be, for example, a dipping method or a screen printing method.

[0079] Subsequently, the above-described first thickness t1 is set to be 1.3 times or less the thicknesses of the second thickness t2 and the third thickness t3, the second thickness t2 is set to be 1.3 times or less the thicknesses of the first thickness t1 and the third thickness t3, and the third thickness t3 is set to be 1.3 times or less the thicknesses of the first thickness t1 and the second thickness t2, and the photosensitive conductive paste is exposed. In other words, the photosensitive conductive paste is exposed so that the thicknesses of the first conductive member 301 and the second conductive member 302 become uniform.

[0080] The exposure method is not particularly limited. For example, the photosensitive conductive paste can be exposed by irradiating the photosensitive conductive paste with a laser having a wavelength of 355 nm. By using a laser capable of drawing with high precision, the shapes of the first conductive member 301 and the second conductive member 302 can be controlled with high precision. Preferably, the laser is irradiated so that the temperature of the base body 10 is equal to or lower than the firing temperature of the base body 10. Thereby, damage to the base body 10 due to laser irradiation can be suppressed.

[0081] As an example of a method of exposing the first conductive member 301 and the second conductive member 302 so that their thicknesses are uniform, for example, the following method can be mentioned. When a photosensitive conductive paste is applied to the bottom surface 16 and the first ridge portion 11a by a dipping method or screen printing, the thickness of the photosensitive conductive paste applied to the first ridge portion 11a and the thickness of the skirt portion of the photosensitive conductive paste applied to the bottom surface 16 are thinner than the thicknesses of the other portions. That is, the thickness of the photosensitive conductive paste becomes non-uniform. Therefore, after applying the photosensitive conductive paste in a range wider than the exposure range, the photosensitive conductive paste may be exposed except for the above-mentioned skirt portion where the thickness is relatively thin. Then, the unexposed skirt portion may be removed by development described later. Thereby, after development, the thickness of the end portion of the photosensitive conductive paste applied to the bottom surface 16 can be made thicker than before. Further, for the first ridge portion 11a where the thickness is relatively thin, the thickness at the first ridge portion 11a may be increased by applying the photosensitive conductive paste a plurality of times only to the first ridge portion 11a. As described above, the overall thickness of the first conductive member 301 may be made uniform. Also, by the same method, the overall thickness of the second conductive member 302 may be made uniform.

[0082] Subsequently, the body 10 is immersed in a developer and washed with pure water. The photosensitive conductive paste not irradiated with the laser is dissolved and removed by the developer. On the other hand, the exposed photosensitive conductive paste is cured and remains. Note that the photosensitive conductive paste may be a positive type that decomposes by the laser, or a negative type that polymerizes or crosslinks by the laser light. When using a positive type photosensitive resin, the portion irradiated with the laser is removed by the removal process. When using a negative type photosensitive resin, the portion not irradiated with the laser is removed by the removal process.

[0083] Subsequently, the base body 10 is fired at, for example, 800°C or higher and 820°C or lower. By firing, the conductive particles are sintered, and the first conductive member 301 and the second conductive member 302 are formed. The firing temperature is not particularly limited and may be appropriately set in consideration of the type of material used, etc. Note that the relative thickness relationship when comparing the thicknesses of each part of the first conductive member 301 does not change before and after firing. In other words, if the thickness of the first conductive member 301 after firing is uniform, the thickness of the photosensitive conductive paste before firing that becomes the first conductive member 301 is also uniform. Similarly, if the thickness of the second conductive member 302 after firing is uniform, the thickness of the photosensitive conductive paste before firing that becomes the second conductive member 302 is also uniform.

[0084] Subsequently, if necessary, a first plating layer 41 and a second plating layer 42 that cover the first conductive member 301 and the second conductive member 302, respectively, are formed. The method for forming the first plating layer 41 and the second plating layer 42 is not particularly limited and may be an electrolytic plating method or an electroless plating method. The first plating layer 41 and the second plating layer 42 are formed, for example, in the order of a Ni plating layer and a Sn plating layer by an electrolytic plating method.

[0085] In the above manner, the electronic component 1 is manufactured. As an example of the size of the electronic component 1, for example, L (length) = 0.6 mm, W (width) = 0.3 mm, and T (thickness) = 0.3 mm can be cited.

[0086] According to the manufacturing method, an electronic component 1 that can suppress the intrusion of gases such as water vapor, for example, can be obtained.

[0087] Also, as described above, when the conductive paste is applied by the dipping method and then fired as it is to form the electrode, the thickness of the central portion of the conductive paste becomes thicker than that of the end portion. Therefore, in order to ensure the overall thickness of the conductive paste by the dipping method, it is necessary to increase the area where the conductive paste is applied. Therefore, in order to thicken the thin portion and ensure the minimum thickness, it is necessary to make the thick portion even thicker. However, in this case, the outer dimensions of the electronic component also become larger. According to the manufacturing method, since the applied photosensitive conductive paste is patterned using a photolithography process, it is possible to ensure the overall thickness of the conductive paste while reducing the area where the conductive paste is applied. Therefore, the small electronic component 1 can be obtained.

[0088] [Second Embodiment] FIG. 5 is a cross-sectional view showing a second embodiment of the electronic component. FIG. 5 corresponds to FIG. 2. In FIG. 5, the description on the second end face side and the description of the coil and the plating layer are omitted. The second embodiment is different from the first embodiment in the configuration of the conductive member. This different configuration will be described below. Other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment are given and the description thereof is omitted.

[0089] In this embodiment, the bottom surface 16 corresponds to the "first plane" described in the claims. Any ridge line portion among the first ridge line portion 11a, the second ridge line portion 11b, the fifth ridge line portion, and the sixth ridge line portion connected to this "first plane" corresponds to the "ridge line portion" described in the claims. Any surface among the first end face 14, the second end face 15, the first side face 12, and the second side face 13 connected to this "ridge line portion" corresponds to the "second plane" described in the claims. Hereinafter, for the sake of simplicity of explanation, the first end face 14 and the second end face 15 will be described as the "second plane", and the first ridge line portion 11a and the second ridge line portion 11b will be described as the "ridge line portion".

[0090] Of the first conductive member 301A, the thickness of the portion provided on the bottom surface 16 side is thicker than the thickness of the other portions. Specifically, as shown in FIG. 5, the first end surface 14 (second plane) has a third contact surface S3 that contacts the first conductive member 301A. When the cross section orthogonal to each of the bottom surface 16 (first plane) and the first end surface 14 and intersecting the first conductive member 301A, that is, in FIG. 5, the thickness of the first conductive member 301A at the center of the third contact surface S3 is defined as the fourth thickness t4, the first thickness t1 is thicker than the fourth thickness t4.

[0091] Note that the second conductive member 302A (not shown) may have the same configuration as the first conductive member 301A. That is, the second end surface 15 (second plane) may have a third contact surface that contacts the second conductive member 302A. In the cross section orthogonal to each of the bottom surface 16 (first plane) and the second end surface 15 and intersecting the second conductive member 302A, when the thickness of the second conductive member 302A at the center of the third contact surface is defined as the fourth thickness, the first thickness may be thicker than the fourth thickness.

[0092] When the bottom surface 16 side of the base body 10 is the mounting surface side of the electronic component 1A, at the time of mounting the electronic component 1A, the molten solder is pushed aside by a part of the first conductive member 301A provided on the bottom surface 16 and flows around to the first end surface 14 side of the base body 10. The flowing-around solder forms a fillet. According to the present embodiment, since the thickness of a part of the first conductive member 301A provided on the bottom surface 16 is relatively thick, the amount of the pushed-aside solder increases, and the height of the fillet formed on the first end surface 14 side can be increased. As a result, the electronic component 1A can be more firmly fixed to a circuit board or the like.

[0093] [Third Embodiment] FIG. 6 is a cross-sectional view showing a third embodiment of an electronic component. FIG. 6 corresponds to FIG. 2. In FIG. 6, the description of the second end surface side and the description of the coil and the plating layer are omitted. The third embodiment is different from the first embodiment in the configuration of the conductive member. This different configuration will be described below. Other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment are given and the description thereof is omitted.

[0094] In this embodiment, the bottom surface 16 and the top surface 17 correspond to the "first plane" described in the claims. Any ridge line portion among the first to fourth ridge line portions 11a to 11d connected to this "first plane" corresponds to the "ridge line portion" described in the claims. Any surface among the first end surface 14 and the second end surface 15 connected to this "ridge line portion" corresponds to the "second plane" described in the claims. Hereinafter, for the sake of simplicity of explanation, the bottom surface 16 will be described as the first plane, the first end surface 14 as the "second plane", and the first ridge line portion 11a as the "ridge line portion".

[0095] As shown in FIG. 6, the first end surface 14 (second plane) has a third contact surface S3 that contacts the first conductive member 301B. A cross-section orthogonal to each of the bottom surface 16 (first plane) and the first end surface 14 and intersecting the first conductive member 301B, that is, in FIG. 6, the thickness of the first conductive member 301B at the central portion of the third contact surface S3 is defined as the fourth thickness t4, the thickness of the first conductive member 301B at the end portion of the third contact surface S3 located on the first ridge line portion 11a side is defined as the fifth thickness t5, and the thickness of the first conductive member 301B at the end portion of the third contact surface S3 located on the side opposite to the first ridge line portion 11a with respect to the central portion of the third contact surface S3 is defined as the sixth thickness t6. When this is the case, each of the fifth thickness t5 and the sixth thickness t6 is thicker than the fourth thickness t4.

[0096] Specifically, the first conductive member 301B includes a first-layer conductive member 3011B and a second-layer conductive member 3012B laminated on the first-layer conductive member 3011B. The first-layer conductive member 3011B has the same configuration as the first conductive member 301 described in the first embodiment. The second-layer conductive member 3012B is provided on the first end surface 14. The second-layer conductive member 3012B includes a first portion P1 arranged on the forward T direction side and a second portion P2 arranged on the reverse T direction side when viewed from the L direction.

[0097] The first part P1 is rectangular and extends along the edge on the forward T direction side of the first end face 14 when viewed from the L direction. The first part P1 overlaps with the edge on the forward T direction side of the first end face 14 when viewed from the L direction. The second part P2 is rectangular and extends along the edge on the reverse T direction side of the first end face 14 when viewed from the L direction. The second part P2 overlaps with the edge on the reverse T direction side of the first end face 14 when viewed from the L direction. The first part P1 and the second part P2 are arranged side by side along the T direction and are separated. Since the first conductive member 301B includes the second-layer conductive member 3012B, each of the fifth thickness t5 and the sixth thickness t6 is thicker than the fourth thickness t4. Note that a second conductive member 302B (not shown) may have the same configuration.

[0098] According to this embodiment, the thickness of the portion of the first conductive member 301B provided on the first end face 14 of the element body 10 is larger than the contact area between the fillet formed during mounting and the first conductive member 301B as compared with the case where the thickness is uniform within the plane of the first end face 14. Therefore, the electronic component 1B can be more firmly fixed to a circuit board or the like.

[0099] [Fourth Embodiment] FIG. 7 is a cross-sectional view showing a fourth embodiment of an electronic component. FIG. 7 corresponds to FIG. 2. In FIG. 7, the description on the second end face side and the description of the coil and the plating layer are omitted. The fourth embodiment is different from the first embodiment in the configuration of the conductive member. This different configuration will be described below. Other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment are given and the description thereof is omitted.

[0100] In this embodiment, the bottom face 16 corresponds to the "first plane" described in the claims. Any ridge line portion of the first ridge line portion 11a and the second ridge line portion 11b connected to this "first plane" corresponds to the "ridge line portion" described in the claims. Any face of the first end face 14 and the second end face 15 connected to this "ridge line portion" corresponds to the "second plane" described in the claims. Hereinafter, for the sake of simplicity of explanation, the first end face 14 will be described as the "second plane" and the first ridge line portion 11a will be described as the "ridge line portion".

[0101] As shown in FIG. 7, the first end face 14 (the second plane) has a third contact surface S3 that contacts the first conductive member 301C. A cross section that is orthogonal to each of the bottom face 16 (the first plane) and the first end face 14 and intersects the first conductive member 301C, that is, in FIG. 7, the thickness of the first conductive member 301C at the end of the third contact surface S3 located on the first ridge line portion 11a side is defined as a fifth thickness t5, and the thickness of the first conductive member 301C at the end of the third contact surface S3 located on the side opposite to the first ridge line portion 11a with respect to the central portion of the third contact surface S3 is defined as a sixth thickness t6. The fifth thickness t5 is thicker than the sixth thickness t6.

[0102] Specifically, the first conductive member 301C includes a first-layer conductive member 3011C, a second-layer conductive member 3012C laminated on the first-layer conductive member 3011C, and a third-layer conductive member 3013C laminated on the second-layer conductive member 3012C.

[0103] The first-layer conductive member 3011C has the same configuration as the first conductive member 301 described in the first embodiment. The second-layer conductive member 3012C is continuously provided across the end portion on the forward L direction side of the bottom face 16, the first ridge line portion 11a, and the portion from the end portion on the reverse T direction side to a position slightly on the forward T direction side from the central portion of the first end face 14. In the cross section shown in FIG. 7, the shape of the second-layer conductive member 3012C is substantially L-shaped. The thickness of the second-layer conductive member 3012C is uniform.

[0104] The third-layer conductive member 3013C is continuously provided across the end portion on the forward L direction side of the bottom face 16, the first ridge line portion 11a, and the portion from the end portion on the reverse T direction side to a position slightly on the reverse T direction side from the central portion of the first end face 14. In the cross section shown in FIG. 7, the shape of the third-layer conductive member 3013C is substantially L-shaped. The thickness of the third-layer conductive member 3013C is uniform.

[0105] With the configuration described above, the first conductive member 301C at the end of the third contact surface S3 located on the side of the first ridge line portion 11a is composed of the conductive members 3011C to 3013C from the first layer to the third layer. The first conductive member 301C at the end of the third contact surface S3 located on the side opposite to the first ridge line portion 11a with respect to the central portion of the third contact surface S3 is composed of only the conductive member 3011C of the first layer. Therefore, the fifth thickness t5 is thicker than the sixth thickness t6.

[0106] Also, with the configuration described above, the first conductive member 301C at the central portion of the third contact surface S3 is composed of the conductive member 3011C of the first layer and the conductive member 3012C of the second layer. Therefore, the fourth thickness t4, which is the thickness of the first conductive member 301C at the central portion of the third contact surface S3, is thinner than the fifth thickness t5 and thicker than the sixth thickness t6.

[0107] In this embodiment, the first conductive member 301C at the central portion of the first contact surface S1 and the first conductive member 301C at the central portion of the second contact surface S2 are each composed of the conductive members 3011C to 3013C from the first layer to the third layer. Similar to the first embodiment, when the thickness of the first conductive member 301C at the central portion of the first contact surface S1 is the first thickness t1 and the thickness of the first conductive member 301C at the central portion of the second contact surface S2 is the third thickness t3, the first thickness t1 is 1.3 times or less of the third thickness t3, and the third thickness t3 is 1.3 times or less of the first thickness t1.

[0108] According to this embodiment, the fifth thickness t5 is thicker than the sixth thickness t6. As a result, the area of the first conductive member 301C that can come into contact with solder increases as compared with the case where the thickness of the portion provided on the first end surface 14 of the first conductive member 301C is uniform. Therefore, the electronic component 1C can be more firmly fixed to a circuit board or the like.

[0109] [Fifth Embodiment] FIG. 8 is a perspective view showing a fifth embodiment of the electronic component. In FIG. 8, the description of the coil and the plating layer is omitted. The fifth embodiment mainly differs from the first embodiment in the configuration of the conductive member. This different configuration will be described below. Other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment are given and the description thereof is omitted.

[0110] In this embodiment, the bottom surface 16 corresponds to the "first plane" described in the claims. Any one of the first ridge line portion 11a and the second ridge line portion 11b connected to this "first plane" corresponds to the "ridge line portion" described in the claims. Any one of the first end surface 14 and the second end surface 15 connected to this "ridge line portion" corresponds to the "second plane" described in the claims. Hereinafter, for the sake of simplicity of explanation, the first end surface 14 will be described as the "second plane" and the first ridge line portion 11a will be described as the "ridge line portion".

[0111] As shown in FIG. 8, the first conductive member 301D and the third conductive member 303D are continuously provided on at least a part of the bottom surface 16 (first plane), at least a part of the first ridge line portion 11a, and at least a part of the first end surface 14 (second plane). Each of the first conductive member 301D and the third conductive member 303D is electrically independent of each other.

[0112] When viewed from the direction (L direction) orthogonal to the first end surface 14, each of the first conductive member 301D and the third conductive member 303D extends in a direction parallel to the first end surface 14 and in a direction from the first ridge line portion 11a toward the center of the first end surface 14 (hereinafter, this direction is referred to as the "first direction"). In this embodiment, the first direction is the T direction. When viewed from the direction (L direction) orthogonal to the first end surface 14, the first conductive member 301D and the third conductive member 303D are arranged side by side in a direction orthogonal to the first direction and parallel to the first end surface 14. In this embodiment, the direction orthogonal to the first direction and parallel to the first end surface 14 is the W direction.

[0113] Each of the first conductive member 301D and the third conductive member 303D has a width at the center in the extending direction (T direction) that is smaller than the widths at both ends in the extending direction. Specifically, the width W1 at the center of the first conductive member 301D in the T direction is smaller than the width W2 at the end on the forward T direction side of the first conductive member 301D and the width W3 at the end on the reverse T direction side of the first conductive member 301D. In this embodiment, when viewed from the L direction, the edge on the reverse W direction side of the first conductive member 301D has a first recess C1 that is recessed toward the forward W direction in a region excluding both ends of the first conductive member 301D in the T direction.

[0114] The width W1 at the center of the third conductive member 303D in the T direction is smaller than the width W2 at the end on the forward T direction side of the third conductive member 303D and the width W3 at the end on the reverse T direction side of the third conductive member 303D. In this embodiment, when viewed from the L direction, the edge on the forward W direction side of the third conductive member 303D has a second recess C2 that is recessed toward the reverse W direction in a region excluding both ends of the third conductive member 303D in the T direction.

[0115] The second conductive member 302D and the fourth conductive member 304D are provided continuously with at least a part of the bottom surface 16 (the first plane), at least a part of the second ridge line portion 11b, and at least a part of the second end surface 15 (the second plane). Each of the second conductive member 302D and the fourth conductive member 304D is electrically independent of each other. Since the shapes of the second conductive member 302D and the fourth conductive member 304D are the same as the shapes of the first conductive member 301D and the third conductive member 303D respectively, detailed description thereof is omitted.

[0116] In this embodiment, the electronic component 1D has a plurality of coils. Specifically, a first coil and a second coil (not shown) exist inside the element body 10. The first coil and the second coil are electrically independent. The first conductive member 301D is connected to one end of the first coil, and the second conductive member 302D is connected to the other end of the first coil. The third conductive member 303D is connected to one end of the second coil, and the fourth conductive member 304D is connected to the other end of the second coil.

[0117] According to the present embodiment, even when the electrically independent first conductive member 301D and the third conductive member 303D are provided at least on the first end face 14, in each of the first conductive member 301D and the third conductive member 303D, the width at the center in the extending direction is smaller than the widths at both end portions in the extending direction. Therefore, when the electronic component 1D is mounted, it is possible to suppress short - circuiting between the adjacent first conductive member 301D and the third conductive member 303D due to the solder spreading over the element body 10.

[0118] Also, even when the electrically independent second conductive member 302D and the fourth conductive member 304D are provided at least on the second end face 15, in each of the second conductive member 302D and the fourth conductive member 304D, the width at the center in the extending direction is smaller than the widths at both end portions in the extending direction. Therefore, when the electronic component 1D is mounted, it is possible to suppress short - circuiting between the adjacent second conductive member 302D and the fourth conductive member 304D due to the solder spreading over the element body 10.

[0119] [Sixth Embodiment] FIG. 9 is a cross - sectional view showing a sixth embodiment of the electronic component. FIG. 10 is an enlarged view of part A in FIG. 9. FIG. 9 corresponds to FIG. 2. In FIG. 9, the description of the plating layer is omitted. In FIG. 10, the description of the coil and the plating layer is omitted. The sixth embodiment mainly differs from the first embodiment in the configurations of the conductive members and the coil. This different configuration will be described below. Other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment are given and their descriptions are omitted.

[0120] In this embodiment, the bottom surface 16 corresponds to the "first plane" described in the claims. Any ridge line portion among the first ridge line portion 11a and the second ridge line portion 11b connected to this "first plane" corresponds to the "ridge line portion" described in the claims. Any surface among the first end surface 14 and the second end surface 15 connected to this "ridge line portion" corresponds to the "second plane" described in the claims. Hereinafter, for the sake of simplicity of explanation, the first end surface 14 and the second end surface 15 will be described as the "second plane", and the first ridge line portion 11a and the second ridge line portion 11b will be described as the "ridge line portion".

[0121] As shown in FIG. 9, the electronic component 1E is a horizontally wound coil component in which the axial direction of the coil 20E is parallel to the L direction. The coil 20E includes a plurality of coil wirings 22E arranged side by side in the L direction, a first lead conductor 23A connected to the coil wiring 22E arranged on the most forward L direction side, and a second lead conductor 23B connected to the coil wiring 22E arranged on the most reverse L direction side. Each coil wiring 22E is wound along a plane parallel to the TW plane. Each coil wiring 22E is preferably wound less than one turn. Adjacent coil wirings 22E are electrically connected via via conductors (not shown).

[0122] The first conductive member 301E is continuously provided only on at least a part of the bottom surface 16 (first plane), at least a part of the first ridge line portion 11a, and at least a part of the first end surface 14 (second plane). Specifically speaking, the first conductive member 301E is continuously provided only on the end portion on the reverse T direction side of the first end surface 14, the entire surface of the first ridge line portion 11a, and the end portion on the forward L direction side of the bottom surface 16. Thereby, since the area of the region where the first conductive member 301E is provided on the outer surface of the base body 10 can be reduced, the parasitic capacitance that may occur between the coil 20E and the first conductive member 301E can be suppressed. As a result, the high-frequency characteristics of the electronic component 1E can be improved. The first conductive member 301E is connected to the first lead conductor 23A and is electrically connected to the coil 20E.

[0123] The second conductive member 302E is continuously provided only on at least a part of the bottom surface 16 (the first plane), at least a part of the second ridge line portion 11b, and at least a part of the second end surface 15 (the second plane). Specifically speaking, the second conductive member 302E is continuously provided only on the end portion on the reverse T direction side of the second end surface 15, the entire surface of the second ridge line portion 11b, and the end portion on the reverse L direction side of the bottom surface 16. Thereby, since the area of the region where the second conductive member 302E is provided on the outer surface of the element body 10 can be reduced, the parasitic capacitance that may occur between the coil 20E and the second conductive member 302E can be suppressed. As a result, the high-frequency characteristics of the electronic component 1E can be improved. The second conductive member 302E is connected to the second lead-out conductor 23B and is electrically connected to the coil 20E.

[0124] As shown in FIG. 10, the end portion E1 of the first contact surface S1 on the side opposite to the first ridge line portion 11a with respect to the central portion of the first contact surface S1 is located closer to the central portion of the first contact surface S1 than the outermost end E2 of the first conductive member 301E on the side opposite to the first ridge line portion 11a with respect to the central portion of the first contact surface S1. Specifically speaking, the shape of the end portion of the first conductive member 301E on the bottom surface 16 side is an inverse taper shape. Thereby, when the electronic component 1E is mounted, it is possible to suppress the melted solder from excessively spreading and wetting the region of the bottom surface 16 of the element body 10 where the first conductive member 301E is not provided. Further, when the solder enters the gap between the inverse taper-shaped end portion and the bottom surface 16, an anchor effect occurs, and the electronic component 1E can be more reliably fixed to a circuit board or the like.

[0125] Also, the end E3 of the third contact surface S3 on the side opposite to the first ridge line portion 11a with respect to the central portion of the third contact surface S3 is located closer to the central portion side of the third contact surface S3 than the outermost end E4 of the first conductive member 301E on the side opposite to the first ridge line portion 11a with respect to the central portion of the third contact surface S3. Specifically speaking, the shape of the end on the forward L direction side in the portion provided on the first end surface 14 of the first conductive member 301E is an inverted taper shape. Thereby, when mounting the electronic component 1E, it is possible to suppress the molten solder from excessively wetting and spreading into the region of the first end surface 14 of the element body 10 where the first conductive member 301E is not provided. Further, since the solder enters the gap between the inverted taper-shaped end portion and the first end surface 14, an anchor effect is generated, and the electronic component 1E can be more reliably fixed to a circuit board or the like.

[0126] The same applies to the shape of the end of the second conductive member 302E. That is, the end of the first contact surface on the side opposite to the fourth ridge line portion 11d with respect to the central portion of the first contact surface that contacts the second conductive member 302E on the bottom surface 16 is located closer to the central portion side of the first contact surface than the outermost end of the second conductive member 302E on the side opposite to the fourth ridge line portion 11d with respect to the central portion of the first contact surface. Specifically speaking, the shape of the end on the bottom surface 16 side of the second conductive member 302E is an inverted taper shape. Also, the end of the third contact surface on the side opposite to the fourth ridge line portion 11d with respect to the central portion of the third contact surface that contacts the second conductive member 302E on the second end surface 15 is located closer to the central portion side of the third contact surface than the outermost end of the second conductive member 302E on the side opposite to the fourth ridge line portion 11d with respect to the central portion of the third contact surface. Specifically speaking, the shape of the end on the forward T direction side in the portion provided on the second end surface 15 of the second conductive member 302E is an inverted taper shape.

[0127] Note that the present disclosure is not limited to the above-described embodiments, and design changes can be made without departing from the gist of the present disclosure. For example, the respective feature points of the first to sixth embodiments may be combined in various ways.

[0128] In the above embodiment, the electronic component was a coil component, but the electronic component is not limited to a coil component. For example, the electronic component may be a capacitor, a resistor, or the like. Even in this case, according to the present disclosure, since the thickness of the end portion of the conductive member can be made thicker than before, it is possible to suppress the intrusion of a gas such as water vapor from the end portion.

[0129] In the above embodiment, the coil was in a form in which coil wirings wound less than one turn were laminated, but the form of the coil is not particularly limited. For example, the coil may be in a form in which coil wirings such as a straight shape and a meander shape are laminated.

[0130] In the above embodiment, the conductive member was provided on both the first end face side and the second end face side of the base body, but it may be provided only on either the first end face side or the second end face side.

[0131] In the third and fourth embodiments, the conductive member had a laminated configuration, but the conductive member may have an integrally formed configuration.

[0132] In the fifth embodiment, two conductive members, i.e., a first conductive member and a third conductive member that are electrically independent, were provided on the first end face side of the base body, but three or more conductive members may be provided. The same applies to the conductive member on the second end face side.

[0133] In the sixth embodiment, both the end portion on the first end face side and the end portion on the bottom face side of the first conductive member were reversely tapered, but either one of them may be reversely tapered.

Description of Reference Numerals

[0134] 1, 1A, 1B, 1C, 1D, 1E Electronic component 10 Base body 11a~11d First to fourth ridge lines 12 First side face 13 Second side face 14 First end face 15 Second end face 16 Bottom surface 17 Top surface 20, 20E Coils 21 Magnetic layer 22, 22E Coil wirings 23A First lead conductor 23B Second lead conductor 24 Via conductor 31 First external electrode 32 Second external electrode 301, 301A, 301B, 301C, 301D, 301E First conductive member 302, 302D, 302E Second conductive member 41 First plating layer 42 Second plating layer C1 First recess C2 Second recess E1 End of the first contact surface E3 End of the third contact surface E2, E4 Outermost ends of the first conductive member P1 First part P2 Second part S1~S3 First~third contact surfaces t1~t6 First~sixth thicknesses W1~W3 Widths

Claims

1. A base body having a first plane and a second plane, and a ridge line portion connecting the first plane and the second plane; A conductive member provided continuously on at least a part of the first plane and at least a part of the ridge line portion; The first plane has a first contact surface that contacts the conductive member; The ridge line portion has a second contact surface that contacts the conductive member; In a cross section orthogonal to each of the first plane and the second plane and intersecting the conductive member, the first contact surface, and the second contact surface, At the central portion of the first contact surface in the cross section, the thickness of the conductive member in the direction orthogonal to the first plane is defined as a first thickness; When the thickness of the conductive member in the direction orthogonal to the first plane is defined as a second thickness at the end portion of the first contact surface on the side opposite to the ridge line portion with respect to the central portion of the first contact surface in the cross section, The first thickness is 1.3 times or less the second thickness, and the second thickness is 1.3 times or less the first thickness; The conductive member includes conductive particles and a resin component containing a photosensitive resin; In the cross section, the end portion of the first contact surface is located closer to the central portion of the first contact surface than the outermost end of the conductive member on the side opposite to the ridge line portion with respect to the central portion of the first contact surface, an electronic component.

2. A base body having a first plane and a second plane, and a ridge line portion connecting the first plane and the second plane; A conductive member provided continuously on at least a part of the first plane and at least a part of the ridge line portion; The first plane has a first contact surface that contacts the conductive member; The ridge line portion has a second contact surface that contacts the conductive member; In a cross section orthogonal to each of the first plane and the second plane and intersecting the conductive member, the first contact surface, and the second contact surface, At the central portion of the first contact surface in the cross section, the thickness of the conductive member in the direction orthogonal to the first plane is defined as a first thickness; When the thickness of the conductive member in the direction orthogonal to the first plane is defined as a second thickness at the end portion of the first contact surface on the side opposite to the ridge line portion with respect to the central portion of the first contact surface in the cross section, The first thickness is 1.3 times or less the second thickness, and the second thickness is 1.3 times or less the first thickness; The conductive member includes conductive particles and a resin component containing a photosensitive resin; The conductive member is continuously provided on at least a part of the first plane, at least a part of the ridge line portion, and at least a part of the second plane. The second plane has a third contact surface that contacts the conductive member. In the cross section, an end portion of the third contact surface on the side opposite to the ridge line portion with respect to the central portion of the third contact surface is located closer to the central portion of the third contact surface than the outermost end of the conductive member on the side opposite to the ridge line portion with respect to the central portion of the third contact surface, an electronic component.

3. The first plane is a mounting surface. In the cross section, When the thickness of the conductive member in the direction orthogonal to the plane in contact with the central portion of the second contact surface through the central portion of the second contact surface in the cross section is defined as the third thickness, The first thickness is 1.3 times or less of the third thickness, the second thickness is 1.3 times or less of the third thickness, and the third thickness is 1.3 times or less of each of the first thickness and the second thickness, the electronic component according to claim 1 or 2.

4. The first thickness is 1.2 times or less of each of the second thickness and the third thickness, the second thickness is 1.2 times or less of each of the first thickness and the third thickness, and the third thickness is 1.2 times or less of each of the first thickness and the second thickness, the electronic component according to claim 3.

5. The conductive member is continuously provided on at least a part of the first plane, at least a part of the ridge line portion, and at least a part of the second plane. The second plane has a third contact surface that contacts the conductive member. In the cross section, when the thickness of the conductive member in the direction orthogonal to the second plane at the central portion of the third contact surface is defined as the fourth thickness, the first thickness is thicker than the fourth thickness, the electronic component according to claim 1 or 2.

6. The conductive member is continuously provided on at least a part of the first plane, at least a part of the ridge line portion, and at least a part of the second plane. The second plane has a third contact surface that contacts the conductive member. In the cross-section, when the thickness of the conductive member in the direction perpendicular to the second plane at the central portion of the third contact surface is defined as the fourth thickness, the thickness of the conductive member in the direction perpendicular to the second plane at the end portion of the third contact surface located on the ridge line portion side is defined as the fifth thickness, and the thickness of the conductive member in the direction perpendicular to the second plane at the end portion of the third contact surface located on the side opposite to the ridge line portion with respect to the central portion of the third contact surface is defined as the sixth thickness, The thicknesses of the fifth thickness and the sixth thickness are greater than the fourth thickness, and the electronic component according to claim 1 or 2.

7. The conductive member is continuously provided on at least a part of the first plane, at least a part of the ridge line portion, and at least a part of the second plane. The second plane has a third contact surface that contacts the conductive member. In the cross-section, when the thickness of the conductive member in the direction perpendicular to the second plane at the end portion of the third contact surface located on the ridge line portion side is defined as the fifth thickness, and the thickness of the conductive member in the direction perpendicular to the second plane at the end portion of the third contact surface located on the side opposite to the ridge line portion with respect to the central portion of the third contact surface is defined as the sixth thickness, The fifth thickness is greater than the sixth thickness, and the electronic component according to claim 1 or 2.

8. The conductive member is continuously provided on at least a part of the first plane, at least a part of the ridge line portion, and at least a part of the second plane. A plurality of the conductive members provided on at least a part of the second plane are electrically independent of each other. When viewed from the direction perpendicular to the second plane, The plurality of conductive members extend in a first direction that is parallel to the second plane and from the ridge line portion toward the center of the second plane, and are arranged side by side in a direction perpendicular to the first direction and parallel to the second plane. In each of the plurality of conductive members, the width at the center in the extending direction is smaller than the widths at both end portions in the extending direction, and the electronic component according to claim 1 or 2.

9. The electronic component according to claim 1 or 2, further comprising a coil provided in the element body and electrically connected to the conductive member.

10. The electronic component according to claim 9, wherein the conductive member is continuously provided only on at least a part of the first plane, at least a part of the ridge line portion, and at least a part of the second plane.

11. A step of preparing a base body having a first plane and a second plane, and a ridge line portion connecting the first plane and the second plane; A step of forming a conductive member, including continuously forming the conductive member on at least a part of the first plane and at least a part of the ridge line portion such that the first plane has a first contact surface that contacts the conductive member, and the ridge line portion has a second contact surface that contacts the conductive member; The step of forming the conductive member includes: A step of applying a photosensitive conductive paste to at least a part of the first plane and at least a part of the ridge line portion; In a cross section orthogonal to each of the first plane and the second plane and intersecting the conductive member, the first contact surface, and the second contact surface, when the thickness of the conductive member in the direction orthogonal to the first plane at the central portion of the first contact surface in the cross section is defined as a first thickness, and the thickness of the conductive member in the direction orthogonal to the first plane at the end portion of the first contact surface on the side opposite to the ridge line portion with respect to the central portion of the first contact surface in the cross section is defined as a second thickness, a step of exposing the photosensitive conductive paste such that the first thickness is 1.3 times or less of the second thickness, and the second thickness is 1.3 times or less of the first thickness; A step of developing the photosensitive conductive paste; In the cross section, the end portion of the first contact surface is located closer to the central portion of the first contact surface than the outermost end of the conductive member on the side opposite to the ridge line portion with respect to the central portion of the first contact surface, a method for manufacturing an electronic component.

12. A step of preparing a base body having a first plane and a second plane, and a ridge line portion connecting the first plane and the second plane; A step of forming a conductive member, including continuously forming the conductive member on at least a part of the first plane and at least a part of the ridge line portion such that the first plane has a first contact surface that contacts the conductive member, and the ridge line portion has a second contact surface that contacts the conductive member; The step of forming the conductive member includes: A step of applying a photosensitive conductive paste to at least a part of the first plane and at least a part of the ridge line portion; In a cross-section that is orthogonal to each of the first plane and the second plane and intersects the conductive member, the first contact surface, and the second contact surface, at the central portion of the first contact surface in the cross-section, the thickness of the conductive member in the direction orthogonal to the first plane is defined as the first thickness, and at the end portion of the first contact surface on the side opposite to the ridge line portion with respect to the central portion of the first contact surface in the cross-section, when the thickness of the conductive member in the direction orthogonal to the first plane is defined as the second thickness, the first thickness is 1.3 times or less of the second thickness, and the second thickness is 1.3 times or less of the first thickness, the step of exposing the photosensitive conductive paste; The step of developing the photosensitive conductive paste; The conductive member is continuously provided on at least a part of the first plane, at least a part of the ridge line portion, and at least a part of the second plane; The second plane has a third contact surface that contacts the conductive member; In the cross-section, the end portion of the third contact surface on the side opposite to the ridge line portion with respect to the central portion of the third contact surface is located closer to the central portion of the third contact surface than the outermost end of the conductive member on the side opposite to the ridge line portion with respect to the central portion of the third contact surface, a method for manufacturing an electronic component.

13. In the step of exposing, when the thickness of the conductive member in the direction orthogonal to the plane that passes through the central portion of the second contact surface in the cross-section and is in contact with the central portion of the second contact surface is defined as the third thickness, further, the first thickness is 1.3 times or less of the third thickness, the second thickness is 1.3 times or less of the third thickness, and the third thickness is 1.3 times or less of each of the first thickness and the second thickness, the method for manufacturing an electronic component according to claim 11 or 12, wherein the photosensitive conductive paste is exposed.

14. In the step of exposing, the method for manufacturing an electronic component according to claim 11 or 12, wherein the photosensitive conductive paste is exposed by irradiating the photosensitive conductive paste with a laser.

15. The method for manufacturing an electronic component according to claim 14, wherein the laser is irradiated so that the temperature of the element body is equal to or lower than the firing temperature of the element body.

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