Temperature control unit and processing device

Abstract

To provide a technique capable of adjusting the temperature of a gas valve in a short period of time.SOLUTION: A temperature control unit is for adjusting the temperature of a gas valve. The temperature control unit has a heat sink that is attached to the gas valve and an enclosure covering the heat sink and including an inlet into which a temperature control fluid is introduced.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a temperature control unit and a processing apparatus.

Background Art

[0002] In a semiconductor manufacturing process, a processing apparatus is used to supply a processing gas into a processing container containing a substrate and perform a predetermined process on the substrate. The processing apparatus is provided with a gas valve for controlling the supply and stop of the processing gas into the processing container (see, for example, Patent Documents 1 and 2).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of adjusting the temperature of a gas valve in a short time.

Means for Solving the Problems

[0005] A temperature control unit according to an aspect of the present disclosure is a temperature control unit that adjusts the temperature of a gas valve, and The gas valve includes a flow path block having a gas flow path formed therein, and the temperature control unit the flow path block has a heat sink attached to the

Effects of the Invention

[0006] According to the present disclosure, the temperature of the gas valve can be adjusted in a short time.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted.

[0009] 〔Processing apparatus〕 With reference to FIG. 1, an example of a processing apparatus according to an embodiment will be described. Hereinafter, the case where the processing apparatus is a batch-type apparatus that performs processing on a plurality of substrates at once will be described as an example. However, the processing apparatus is not limited to a batch-type processing apparatus. For example, the processing apparatus may be a single-wafer type apparatus that processes substrates one by one. Further, for example, the processing apparatus may be a semi-batch type apparatus that revolves a plurality of substrates arranged on a rotating table in a processing container by the rotating table, and passes through a region where a first gas is supplied and a region where a second gas is supplied in order to perform processing on the substrates.

[0010] The processing apparatus 1 includes a processing container 10, a gas supply unit 20, an exhaust unit 30, etc. In the processing apparatus 1, a processing gas is supplied into the processing container 10 by the gas supply unit 20, and a predetermined process (for example, film formation process) is performed on a plurality of substrates accommodated in the processing container 10. Further, in the processing apparatus 1, the processing gas supplied into the processing container 10 is exhausted by the exhaust unit 30.

[0011] The processing container 10 has a double tube structure including an inner tube 11 and an outer tube 12. The inner tube 11 has a substantially cylindrical shape with an open upper end. The outer tube 12 is provided around the inner tube 11 and has a substantially cylindrical shape with a closed upper end. Inside the inner tube 11, a boat 13 that holds the substrate W to be processed in a shelf shape is accommodated. An exhaust port 14 is formed at the lower part of the side wall of the outer tube 12.

[0012] The gas supply unit 20 includes a DCS supply source G1, an HF supply source G2, and an N 2 supply source G3.

[0013] The DCS supply source G1 supplies dichlorosilane (DCS; SiH 2 Cl 2 ) into the inner tube 11 via a gas supply line L1. In the gas supply line L1, a valve V1a, a mass flow controller M1, and a valve V1b are interposed in order from the side of the DCS supply source G1.

[0014] Also, the DCS supply source G1 supplies DCS into the inner tube 11 via a gas supply line L2. In the gas supply line L2, a valve V2a, a mass flow controller M2, and a valve V2b are interposed in order from the side of the DCS supply source G1.

[0015] The HF supply source G2 supplies hydrogen fluoride (HF) into an exhaust line 31 via a gas supply line L3. In the gas supply line L3, a valve V3a, a mass flow controller M3, and a valve V3b are interposed in order from the side of the HF supply source G2.

[0016] The HF supply source G2 supplies HF to the gas supply line L1 through gas supply lines L3 and L4. The gas supply line L4 connects the mass flow controller M3 and the valve V3b in the gas supply line L3 to the mass flow controller M1 and the valve V1b in the gas supply line L1. The valve V4 is provided in the gas supply line L4.

[0017] The HF supply source G2 supplies HF to the gas supply line L2 via gas supply lines L3 and L5. The gas supply line L5 connects the mass flow controller M3 and the valve V3b in the gas supply line L3 to the mass flow controller M2 and the valve V2b in the gas supply line L2. The valve V5 is provided in the gas supply line L5.

[0018] N 2 The supply source G3 supplies nitrogen (N 2 ) is supplied to the gas supply line L6. 2 From the supply source G3 side, a valve V6a, a mass flow controller M6, and a valve V6b are provided in this order.

[0019] Also, N 2 The supply source G3 supplies N to the gas supply line L2 via the gas supply line L7. 2 The gas supply line L7 is connected between the valve V2b in the gas supply line L2 and the processing chamber 10. The gas supply line L7 contains N 2 A valve V7a, a mass flow controller M7, and a valve V7b are provided in this order from the supply source G3 side.

[0020] Also, N 2 The supply source G3 supplies N 2 The gas supply line L8 is connected between the valve V1b in the gas supply line L1 and the processing chamber 10. The gas supply line L8 is supplied with N 2A valve V8a, a mass flow controller M8, and a valve V8b are provided in sequence from the side of the supply source G3.

[0021] Also, N 2 The supply source G3 supplies N to the gas supply line L1 via the gas supply line L9. 2 The gas supply line L9 is connected between the valve V1a and the mass flow controller M1 in the gas supply line L1. A mass flow controller M9 and a valve V9 are provided in sequence from the side of the supply source G3 in the gas supply line L9. 2 A valve V8a, a mass flow controller M8, and a valve V8b are provided in sequence from the side of the supply source G3.

[0022] Also, N 2 The supply source G3 supplies N to the gas supply line L2 via the gas supply line L10. 2 The gas supply line L10 is connected between the valve V2a and the mass flow controller M2 in the gas supply line L2. A mass flow controller M10 and a valve V10 are provided in sequence from the side of the supply source G3 in the gas supply line L10. 2 A valve V8a, a mass flow controller M8, and a valve V8b are provided in sequence from the side of the supply source G3.

[0023] Also, N 2 The supply source G3 supplies N to the gas supply line L3 via the gas supply line L11. 2 The gas supply line L11 is connected between the valve V3a and the mass flow controller M3 in the gas supply line L3. A mass flow controller M11 and a valve V11 are provided in sequence from the side of the supply source G3 in the gas supply line L11. 2 A valve V8a, a mass flow controller M8, and a valve V8b are provided in sequence from the side of the supply source G3.

[0024] Note that the gas supply lines L1 to L11 include, for example, gas supply pipes. Also, the valves V1b, V2b, V4, V5, V7b, and V8b constitute a gas valve group 100 described later.

[0025] The exhaust section 30 includes an exhaust line 31, a valve 32, a vacuum pump 33, etc. The exhaust line 31 includes, for example, an exhaust pipe and connects the exhaust port 14 and the vacuum pump 33. The valve 32 is provided in the exhaust line 31 and opens and closes the exhaust line 31. The vacuum pump 33 includes, for example, a dry pump, a turbo molecular pump, etc., and evacuates the inside of the processing vessel 10 through the exhaust line 31.

[0026] 〔Gas valve group〕 Referring to FIG. 2, an example of the gas valve group 100 provided in the processing apparatus 1 of FIG. 1 will be described. The gas valve group 100 includes six gas valves 110 (110a to 110f) arranged in a row. The six gas valves 110a to 110f correspond to the six valves V1b, V2b, V4, V5, V7b, and V8b provided in the processing apparatus 1 of FIG. 1.

[0027] Each gas valve 110 has a flow path block 111, a vent valve 112, a supply valve 113, a purge valve 114, a heater 115, etc. The flow path block 111 is formed by shaping a metal such as stainless steel into a substantially rectangular parallelepiped shape and forming a gas flow path by machining or the like. The vent valve 112, the supply valve 113, and the purge valve 114 are attached to the flow path block 111. Each gas valve 110 controls the supply and stop of the processing gas into the processing vessel 10 by opening and closing the flow path with the vent valve 112, the supply valve 113, and the purge valve 114. Further, a heater 115 (FIG. 4) is embedded in the flow path block 111. The heater 115 heats the flow path block 111.

[0028] In the processing apparatus of FIG. 1, the temperature of the gas valve group 100 may be changed according to the type of processing to be performed in the processing container 10. For example, when performing a film forming process in the processing container 10, all six gas valves 110a to 110f of the gas valve group 100 are heated to a film forming temperature, for example, 100° C. to 200° C., and a film forming gas is supplied into the processing container 10. For example, when performing a cleaning process in the processing container 10, at least one of the six gas valves 110a to 110f of the gas valve group 100 is cooled to a cleaning temperature, for example, 70° C. or lower, and a cleaning gas is supplied into the processing container 10.

[0029] By the way, when the number of gas valves 110 for cooling from the film forming temperature to the cleaning temperature is small (for example, one), the time required to cool the gas valve 110 is not so long. However, when the number of gas valves 110 for cooling from the film forming temperature to the cleaning temperature increases, the time required to cool the gas valve 110 becomes longer.

[0030] In the present embodiment, as shown in FIG. 2, a technique is provided in which the gas valve 110 can be cooled in a short time by attaching a cooling unit 200 to each of the six gas valves 110a to 110f. However, the cooling unit 200 only needs to be attached to at least the gas valve 110 whose temperature is changed.

[0031] 〔Cooling Unit〕 With reference to FIGS. 3 to 5, an example of the cooling unit 200 will be described. FIGS. 3, 4, and 5 are a perspective view, a side view, and a cross-sectional view showing an example of the cooling unit 200 attached to the gas valve 110, respectively.

[0032] The cooling unit 200 is attached to the lower surface of the gas valve 110 and cools the gas valve 110. The cooling unit 200 includes a heat sink 210, a heat conduction member 220, a housing 230, screws 240, and the like.

[0033] The heat sink 210 is attached to the lower surface of the flow path block 111. A plurality of insertion holes 211 penetrating in the vertical direction are formed in the heat sink 210. Screws 240 are inserted into each of the insertion holes 211. The heat sink 210 has a flange portion 212, and is fixed to the flow path block 111 by pressing the flange portion 212 against the housing 230.

[0034] The heat conductive member 220 is sandwiched between the gas valve 110 and the heat sink 210, and improves the heat conductivity between the gas valve 110 and the heat sink 210. The heat conductive member 220 is, for example, a heat conductive double-sided tape.

[0035] The housing 230 is provided so as to cover the heat sink 210. Thereby, when heating the gas valve 110, it is possible to suppress the deterioration of the heat uniformity due to the heat radiation from the heat sink 210 and the increase in the output of the heater 115. Openings 231 are formed in the housing 230 at positions corresponding to each of the plurality of insertion holes 211 formed in the heat sink 210. Screws 240 are inserted into each of the openings 231. The housing 230 includes an inlet 232 and an exhaust port 233.

[0036] The inlet 232 is provided for introducing refrigerant into the housing 230, and the refrigerant is introduced into the housing 230 through the inlet 232. The inlet 232 is provided on one side surface in the short side direction of the housing 230. However, the inlet 232 may be provided on other side surfaces of the housing 230. When cooling the gas valve 110, the refrigerant is introduced from the inlet 232, thereby promoting the heat dissipation of the heat sink 210. On the other hand, when heating the gas valve 110, the introduction of the refrigerant from the inlet 232 is stopped. By using the refrigerant in this way, unlike the case of using a cooling fan that can be a source of ignition, it can be used even in an atmosphere where flammable gas exists. The type of the refrigerant is not particularly limited, but the refrigerant is preferably compressed air. By selecting compressed air as the refrigerant, the compressed air remaining in the housing 230 forms an air insulation layer when heating the gas valve 110, suppressing the heat dissipation of the heat sink 210. However, the refrigerant may be cold air (hereinafter also simply referred to as "cold air") generated from compressed air by a jet cooler. By selecting cold air as the refrigerant, the heat dissipation of the heat sink 210 is further promoted. Also, the reason for selecting compressed air or cold air as the refrigerant is that, unlike liquid, flammable gas, and toxic gas, there is no danger when leaked. For example, when selecting compressed air or cold air as the refrigerant, since there is no danger when leaked, as the inlet 232, inexpensive parts such as one-touch joints can be used. Thereby, the air tube for introducing compressed air or cold air can be easily attached and detached. Note that the control of the supply and stop of compressed air or cold air can be performed by, for example, a solenoid valve. Also, the control of the flow rate of compressed air or cold air can be performed by, for example, an orifice and a regulator.

[0037] The exhaust port 233 is provided for exhausting the refrigerant from inside the housing 230, and the refrigerant inside the housing 230 is exhausted through the exhaust port 233. The exhaust port 233 is preferably provided on the side surface of the housing 230 that faces the side surface where the inlet port 232 is provided. Thereby, since the refrigerant flows from one end of the heat sink 210 toward the other end, the heat dissipation of the heat sink 210 is further promoted. When cooling the gas valve 110, the refrigerant inside the housing 230 is exhausted from the exhaust port 233, and thus new refrigerant is continuously introduced into the housing 230 from the inlet port 232, promoting the heat dissipation of the heat sink 210. On the other hand, when heating the gas valve 110, the exhaust of the refrigerant from the exhaust port 233 is stopped. For example, when selecting compressed air or cold air as the refrigerant, as the exhaust port 233, inexpensive components such as one-touch connectors can be used. Thereby, the air tube for exhausting the compressed air or cold air can be easily attached and detached. Also, when selecting compressed air or cold air as the refrigerant, as shown in FIG. 6, the exhaust port 233 may be an opening formed by opening one of the side surfaces of the housing 230. Note that FIG. 6 is a side view showing another example of the cooling unit attached to the gas valve.

[0038] The screw 240 passes through the opening 231 and the insertion hole 211 and fixes the housing 230 to the lower surface of the flow path block 111. However, the housing 230 may be fixed to the flow path block 111 by a method other than the screw 240, for example, an adhesive member such as an adhesive tape.

[0039] 〔Evaluation Results〕 With reference to FIGS. 7 and 8, the results of evaluating the cooling performance when the heated gas valve 110 is cooled by the cooling unit 200 of the embodiment will be described.

[0040] First, after heating the gas valve 110 to which the cooling unit 200 of the embodiment is attached with the heater 115 to stabilize it at 150° C. and then turning off the heater 115, the temperature change of the gas valve 110 when cold air is introduced into the housing 230 from the inlet port 232 was measured.

[0041] Further, for comparison, after heating the gas valve 110 without the cooling unit 200 attached thereto with the heater 115 to stabilize it at 150°C, the temperature change of the gas valve 110 when the heater 115 was turned off was measured.

[0042] FIG. 7 is a diagram showing the evaluation results of the cooling time of the gas valve 110. FIG. 7(a) shows the measurement results of the temperature change of the gas valve 110 with the cooling unit 200 of the embodiment attached thereto, and FIG. 7(b) shows the measurement results of the temperature change of the gas valve 110 without the cooling unit 200 attached thereto. In FIGS. 7(a) and 7(b), the horizontal axis represents time, and the vertical axis represents the temperature [°C] of the gas valve 110. Also, in FIGS. 7(a) and 7(b), the time when the heater 115 was turned off is indicated by t1.

[0043] As shown in FIG. 7(a), in the gas valve 110 with the cooling unit 200 attached thereto, the time from when the heater 115 was turned off until the temperature of the gas valve 110 dropped to 70°C was 19 minutes. Also, in the gas valve 110 with the cooling unit 200 attached thereto, the temperature of the gas valve 110 at the point in time when 60 minutes had elapsed after the heater 115 was turned off was 21°C.

[0044] On the other hand, as shown in FIG. 7(b), in the gas valve 110 without the cooling unit 200 attached thereto, the time from when the heater 115 was turned off until the temperature of the gas valve 110 dropped to 70°C was 42 minutes. Also, in the gas valve 110 without the cooling unit 200 attached thereto, the temperature of the gas valve 110 at the point in time when 60 minutes had elapsed after the heater 115 was turned off was 56°C.

[0045] From the above results, it was shown that by attaching the cooling unit 200 to the gas valve 110 and introducing cold air into the housing 230 from the inlet 232, the time required to cool the gas valve 110 can be shortened.

[0046] Next, when cooling the gas valve 110 to which the cooling unit 200 of the embodiment is attached from 150°C, the flow rate of the cold air introduced into the housing 230 from the inlet 232 was changed, and the influence of the flow rate of the cold air on the cooling time of the gas valve 110 was evaluated.

[0047] FIG. 8 is a diagram showing the evaluation results of the cooling time of the gas valve 110. In FIG. 8, the horizontal axis represents time [min], and the vertical axis represents the temperature [°C] of the gas valve 110. Also, in FIG. 8, the solid line, the broken line, the one-dot chain line, and the two-dot chain line respectively show the results when the flow rate of the cold air is 0 slm, 13 slm, 32 slm, and 45 slm.

[0048] As shown in FIG. 8, it can be seen that by increasing the flow rate of the cold air, the temperature drop rate of the gas valve 110 becomes faster. Specifically, when the flow rate of the cold air is 0 slm, 13 slm, 32 slm, and 45 slm, the time for the temperature of the gas valve 110 to drop from 150°C to 70°C was 112 minutes, 59 minutes, 39 minutes, and 28 minutes, respectively.

[0049] From the above results, it was shown that by increasing the flow rate of the cold air introduced into the housing 230 from the inlet 232, the time required to cool the gas valve 110 can be shortened.

[0050] In the above embodiment, the cooling unit 200 is an example of a temperature control unit, and the refrigerant is an example of a temperature control fluid.

[0051] The embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. The above embodiments may be omitted, substituted, or changed in various forms without departing from the scope and spirit of the appended claims.

[0052] In the above embodiment, as an example of a temperature control unit for adjusting the temperature of the gas valve 110, the cooling unit 200 that cools the gas valve 110 with a refrigerant has been described, but the present disclosure is not limited to this. For example, the temperature control unit may be a heating unit that heats the gas valve 110 with a heat medium.

Description of Symbols

[0053] 110 Gas valve 200 Cooling unit 210 Heat sink 230 Housing 232 Inlet

Claims

1. A temperature control unit for adjusting the temperature of a gas valve, wherein the gas valve includes a flow path block having a gas flow path formed therein, and the temperature control unit includes a heat sink attached to the flow path block, and a housing covering the heat sink and including an inlet through which a temperature control fluid is introduced, The temperature control unit having the above.

2. The housing includes an exhaust port for exhausting the temperature control fluid introduced from the inlet, The temperature control unit according to Claim 1.

3. The housing is attached to the gas valve, The temperature control unit according to Claim 1 or 2.

4. having a heat conductive member provided between the gas valve and the heat sink, The temperature control unit according to any one of Claims 1 to 3.

5. The temperature control fluid is compressed air, The temperature control unit according to any one of Claims 1 to 4.

6. The temperature control fluid is cold air generated from compressed air by a jet cooler, The temperature control unit according to any one of Claims 1 to 5.

7. The gas valve is heated by a heater, The temperature control unit according to any one of Claims 1 to 6.

8. A processing container, a gas supply pipe for supplying gas into the processing container, a gas valve interposed in the gas supply pipe, and a temperature control unit for adjusting the temperature of the gas valve, comprising, wherein the gas valve includes a flow path block having a gas flow path formed therein, and the temperature control unit includes a heat sink attached to the flow path block, and a housing covering the heat sink and including an inlet through which a temperature control fluid is introduced, having the above, A processing apparatus.

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