Electronic device and control method

Abstract

Economically realize the operation of a fan corresponding to the surface temperature with respect to the operating state of an electronic device. 【Solution means】A controller, a temperature sensor for detecting temperature, and a fan are housed inside a housing. The controller and the temperature sensor are arranged on a substrate. A model showing the correlation between the measured temperature, which is the temperature detected by the temperature sensor, and the surface temperature, which is the temperature at a reference point on the surface of the housing, is preset in the controller. The controller uses the model to calculate an estimated value of the surface temperature based on the measured temperature, and controls the operation of the fan based on the estimated value.

Description

Technical Field

[0001] The present application relates to an electronic device and a control method, for example, temperature control of an electronic device that houses various members inside a housing.

Background Art

[0002] An electronic device including a personal computer (PC) is configured to include a device that serves as a heat source. A device with high power consumption serves as a main heat source. Examples of the device that serves as a heat source include a processor such as a CPU (Central Processing Unit). In order to prevent failures and malfunctions due to temperature rise, many electronic devices are provided with a heat dissipation mechanism. For example, the information processing apparatus described in Patent Document 1 includes a temperature sensor disposed together with devices such as a CPU on a substrate, and a fan for dissipating heat generated in the device according to the temperature detected by the temperature sensor.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] With the miniaturization and multifunctionalization of electronic devices, various devices may be mounted on a substrate at high density. In a circuit where devices are arranged at high density, the amount of heat generated tends to increase. Also, depending on the usage state of the electronic device, the correlation between the measured temperature detected by the temperature sensor and the surface temperature may not be maintained. When controlling the operation of the fan based on the temperature detected on the substrate, the fan may operate even in a state where the surface temperature is relatively low. This operation may cause discomfort to the user.

Means for Solving the Problems

[0005] This application is made to solve the above problems. An electronic device according to one aspect of this application houses a controller, a temperature sensor that detects temperature, and a fan inside a housing. The controller and the temperature sensor are arranged on a substrate. A model showing the correlation between the measured temperature, which is the temperature detected by the temperature sensor, and the surface temperature, which is the temperature at a reference point on the surface of the housing, is preset in the controller. The controller uses the model to calculate an estimated value of the surface temperature based on the measured temperature, and controls the operation of the fan based on the estimated value.

[0006] The above electronic device includes a host system. The host system is arranged on the substrate and may control the power consumption of its own system based on the estimated value.

[0007] In the above electronic device, two or more of the temperature sensors are provided. The model shows the correlation between the set of measured temperatures detected for each temperature sensor and the surface temperature. The controller may use the model to calculate an estimated value of the surface temperature based on the set of measured temperatures.

[0008] In the above electronic device, the reference point may be the position on the surface of the housing where the temperature is the highest.

[0009] In the above electronic device, the reference point may be any one of the bottom surface of the housing, the periphery of the exhaust port of the housing, and the surface of the input device covering the housing.

[0010] In the above electronic device, a peripheral device is further housed inside the housing. The peripheral device is further arranged on the substrate. The model may be set with reference to the set of the measured temperature and the surface temperature detected for each scenario where the operating state of the peripheral device is different.

[0011] A control method according to an aspect of the present application accommodates a controller, a temperature sensor for detecting temperature, and a fan inside a housing, the controller and the temperature sensor are arranged on a substrate, and a model showing the correlation between the measured temperature, which is the temperature detected by the temperature sensor, and the surface temperature, which is the temperature at a reference point on the surface of the housing, is preset. The control method for an electronic device is such that the electronic device uses the model to calculate an estimated value of the surface temperature based on the measured temperature, and controls the operation of the fan based on the estimated value.

Advantages of the Invention

[0012] According to an embodiment of the present application, for the operating state of an electronic device, it is possible to economically realize the operation of the fan more corresponding to the surface temperature.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Modes for Carrying Out the Invention

[0014] Hereinafter, embodiments of the present application will be described with reference to the drawings. A configuration example of the electronic device 1 according to this embodiment will be described. FIG. 1 is an external view showing an external configuration example of the electronic device 1 according to this embodiment. In the example of FIG. 1, the electronic device 1 is configured as a notebook PC (which may be referred to as a "notebook" in this application). The electronic device 1 includes a first housing 102 and a second housing 104. The first housing 102 and the second housing 104 face each other in parallel on one side surface (which may be referred to as the "rear surface" in this application), and are rotatably engaged around a rotation axis A using hinges 108a and 108b. The first housing 102 and the second housing 104 rotate, and the angle formed between them varies. In a state where no external force is applied, the hinges 108a and 108b maintain the angle formed between the first housing 102 and the second housing 104 while being supported on the bottom surface of the first housing 102. The electronic device 1 is used in a state where the surfaces of the first housing 102 and the second housing 104 are open when the angle formed between the first housing 102 and the second housing 104 is an obtuse angle. In this application, the side surfaces of the first housing 102 and the second housing 104 that face their respective rear surfaces may be referred to as the "front surfaces".

[0015] On the surface of the first housing 102, a power switch 38, a keyboard 32k, and a track point 32t are arranged. The power switch 38 is arranged in proximity within a predetermined distance from one end of the rear surface. The keyboard 32k covers most of the surface of the first housing 102, and its periphery is supported by the first housing 102. The track point 32t is arranged at the center of the keyboard 32k. On the surface of the second housing 104, a display 24 is arranged. The display 24 covers most of the surface of the second housing 104.

[0016] Various members are accommodated in the first housing 102 and the second housing 104. As will be described later, inside the first housing 102, a host system 10, an EC (Embedded Controller) 31, temperature sensors 35-1 and 35-2, a fan 364, etc. are accommodated. Specific members that are a part of them are arranged in advance on a substrate. For example, the host system 10, the EC 31, the temperature sensors 35-1 and 35-2, etc. are arranged on the substrate.

[0017] Next, a hardware configuration example of the electronic device 1 according to the present embodiment will be described. FIG. 2 is a schematic block diagram showing a hardware configuration example of the electronic device 1 according to the present embodiment. The electronic device 1 includes a host system 10, a ROM (Read Only Memory) 22, a storage 23, a display 24, a WLAN (Wireless Local Area Network) module 25, an input / output I / F (Interface) 26, an EC 31, an input device 32, a battery 33, a power supply circuit 34, a temperature sensor 35, and a heat dissipation mechanism 36. In the example of FIG. 1, the electronic device 1 is provided with two temperature sensors 35-1 and 35-2. The heat dissipation mechanism 36 includes a drive circuit 362 and a fan 364.

[0018] The host system 10 is a computer system that forms the core of the electronic device 1. The host system 10 includes a CPU (Central Processing Unit) 11, a main memory 12, and a chipset 21.

[0019] The CPU 11 is a processor that executes various programs. For example, programs such as firmware, an OS (Operating System), utility software, and application programs are executed. In the present application, "executing a program" or "execution of a program" refers to executing the processing instructed by the instructions described in the program. The CPU 11 realizes the functions of the host system 10 in cooperation with the main memory 12 and other hardware by executing a program.

[0020] The main memory 12 is a writable memory that is used as a loading area for the execution program of the CPU 11 or as a working area for writing the processing data of the execution program. The main memory 12 is composed of, for example, a plurality of DRAM (Dynamic Random Access Memory) chips. The CPU 11 and the main memory 12 are the minimum hardware that constitutes the host system 10.

[0021] The chipset 21 includes a plurality of controllers and enables connection so that a plurality of devices and various data can be input and output. The controllers provided in the chipset 21 may be any of, for example, USB (Universal Serial Bus), SPI (Serial Peripheral Interface) bus, PCI-Express bus, etc. In the example of FIG. 1, the chipset 21 is connected to the ROM 22, the storage 23, the display 24, the WLAN module 25, the input / output I / F 26, and the EC 31.

[0022] The ROM 22 mainly stores firmware. The firmware stored in the ROM 22 includes firmware such as BIOS (Unified Extensible Firmware Interface Basic Input / Output System) and firmware for controlling individual devices. The ROM 22 may be any of EEPROM (Electrically Erasable Programmable Read Only Memory), flash ROM, etc.

[0023] The storage 23 is an auxiliary storage device that stores various data used in the processing of the host system 10, various data obtained by those processes, or various programs, etc. The storage 23 may be any of, for example, SSD (Solid State Drive), HDD (Hard-disk Drive), etc.

[0024] The display 24 displays a display screen based on the display data input from the CPU 11. The display 24 may be, for example, any of a liquid crystal display (LCD), an OLED (Organic Light Emitting Diode) display, and the like.

[0025] The WLAN module 25 connects to the WLAN so as to be able to transmit and receive various data. The WLAN module 25 enables transmission and reception of various data between the WLAN or other devices connected to other networks via the WLAN. The other network may be, for example, any of the Internet, a public wireless network, a virtual private network, and the like.

[0026] The input / output I / F 26 is connected so as to be able to input and output data to and from various devices, either wired or wirelessly. The input / output I / F 26 includes, for example, a USB connector. The USB connector is a connector for inputting and outputting data wired in accordance with the USB standard.

[0027] The EC 31 is a controller that monitors and controls the operations of various devices connected thereto regardless of the operating state of the host system 10. The EC 31 includes a CPU, a ROM, a RAM, a timer, and an input / output I / F separately from the host system 10. Devices with a data transfer speed lower than that of the chipset 21 may be connected to the EC 31. In the example of FIG. 1, an input device 32, a power supply circuit 34, temperature sensors 35-1 and 35-2, and a heat dissipation mechanism 36 are connected to the EC 31.

[0028] The input device 32 detects a user operation, generates an operation signal according to the detected operation, and outputs the generated operation signal to the EC 31. The keyboard 32k and the track point 32t described above each correspond to an example of the input device 32. The battery 33 charges the power supplied from the power supply circuit 34. Or, the battery 33 discharges the power stored in itself to the power supply circuit 34. The battery may be, for example, any of a lithium-ion battery, a sodium-ion battery, etc.

[0029] The power supply circuit 34 executes power supply to each device according to the control of the EC 31. The power supply circuit 34 includes a charger and a transformer (DC / DC, Direct Current / Direct Current). The charger charges the battery 33 with the surplus power remaining without being consumed in each device among the power supplied from an external power source. When no power is supplied from the external power source, or when the power supplied from the power source does not satisfy the demand of each device, the charger supplies the power discharged from the battery 33 to each device via the transformer. The transformer converts the voltage of the DC power supplied from the external power source or the battery 33 via the charger into the voltage required for the operation of each device. The transformer supplies the DC power having the converted voltage to the destination device.

[0030] The temperature sensors 35-1 and 35-2 are arranged at different positions and detect the temperature at each position. The temperature sensors 35-1 and 35-2 notify the EC 31 of the measured temperature which is the measured value of the temperature detected respectively.

[0031] The heat dissipation mechanism 36 includes a drive circuit 362 and a fan 364. The drive circuit 362 operates the fan 364 so as to obtain the output instructed by the control signal input from the EC 31. The drive circuit 362 supplies the fan 364 with the power corresponding to the instructed output. The fan 364 includes a motor that rotates by consuming the power supplied from the drive circuit 362, and the motor rotates the blades. The rotation of the blades generates an air flow inside the first housing 102, and new air flows in from the outside of the first housing 102. The inflowing air absorbs the heat released from the members inside the first housing 102 and its temperature rises. The air with the increased temperature is discharged to the outside of the first housing 102.

[0032] Next, an example of the device arrangement inside the first housing 102 according to this embodiment will be described. FIG. 3 is a plan view showing an example of the device arrangement inside the first housing 102 according to this embodiment. A substrate 103 is laid inside the first housing 102. On the surface of the substrate 103, a CPU 11, a main memory 12, a chipset 21, a ROM 22, a storage 23, a WLAN module 25, an EC 31, a power circuit 34, temperature sensors 35-1 and 35-2, and a heat pipe 366 are arranged. In the first housing 102, an input / output I / F 26, a battery 33, a drive circuit 362, and a fan 364 are further arranged. The drive circuit 362 is integrally configured with the fan 364 and does not appear in FIG. 3.

[0033] An exhaust port 102r is installed in a region within a predetermined distance from the other end of the back surface of the first housing 102. The periphery of the exhaust port 102r is surrounded by a rear bezel (not shown). One end of the heat pipe 366 is sandwiched by the exhaust port 102r and faces the fan 364. On the surface of the first housing 102, a keyboard bezel (not shown) and a keyboard 32k (FIG. 1) are arranged overlapping each other in that order. The keyboard bezel has a plurality of openings, and air can flow into the first housing 102 from the surface of the keyboard 32k through these openings. When the fan 364 operates, the inflowing air passes through the internal space of the first housing 102, passes through the fan 364 and one end of the heat pipe 366, and is discharged from the exhaust port 102r. The air flowing into the first housing 102 has its temperature increased by each device and the heat radiation from the heat pipe 366. By discharging the air with the increased temperature, the temperature rise inside the first housing 102 is suppressed.

[0034] In the example of FIG. 3, starting from one end of the heat pipe 366 towards the other end, the chipset 21, the CPU 11, the main memory 12, and the WLAN module 25 are connected in that order. The heat generated by each of the chipset 21, the CPU 11, the main memory 12, and the WLAN module 25 conducts towards one end of the heat pipe 366 and dissipates heat to the air around that end.

[0035] Also, the temperature sensors 35-1 and 35-2 are respectively arranged in the vicinity within a predetermined distance from the CPU 11 and the WLAN module 25. This enables control that emphasizes the temperatures of the CPU 11 and the WLAN module 25, which generate relatively large amounts of heat. Note that the battery 33 is arranged on the front surface of the first housing 102 in parallel with its longitudinal direction. The input / output I / F 26 is arranged on the side end surface of the first housing 102.

[0036] Next, a functional configuration example of the electronic device 1 according to the present embodiment will be described. FIG. 4 is a schematic block diagram showing a functional configuration example of the electronic device 1 according to the present embodiment. The EC 31 monitors the actually measured temperatures notified from the temperature sensors 35-1 and 35-2. The EC 31 uses a preset mathematical model to calculate an estimated value of the surface temperature at a predetermined reference point on the surface of the first housing 102 based on the actually measured temperatures of the temperature sensors 35-1 and 35-2 respectively. The EC 31, for example, uses the two-variable regression model shown in Equation (1) to calculate the estimated value Y of the surface temperature 1 、X 2 from the actually measured temperatures X apu (in the present application, sometimes referred to as "estimated surface temperature Y apu "). In Equation (1), M 1 、M 2 respectively represent the coefficients multiplied by the actually measured temperatures X 1 、X 2 . The coefficients M 1 、M 2 are weight coefficients indicating the contribution degrees of the actually measured temperatures X 1 、X 2 to the estimated surface temperature Y apu . Capu indicates a constant. The actually measured temperature X 1 , X 2 The order of may be set in descending order of the coefficient M 1 , M 2 . The learning method of the mathematical model will be described later.

[0037]

Number

[0038] EC31 determines the output value of the fan 364 corresponding to the estimated surface temperature with reference to the control table. The control table is preset in the register of EC31. The control table is a data table showing the association between the estimated surface temperature and the output value of the fan 364. The control table is set such that the output value increases as the estimated surface temperature increases. The output value may be indicated by the rotation speed of the motor or the noise level generated by the rotation. EC31 outputs a control signal indicating the determined output amount to the drive circuit 362. The lower limit of the operating temperature of the fan 364 may be preset in the control table. When the estimated surface temperature is equal to or lower than the lower limit of the operating temperature, EC31 sets the output value of the fan 364 to zero. In that case, the operation of the fan 364 stops. Note that EC31 notifies the host system 10 of the estimated surface temperature.

[0039] The host system 10 executes the OS and performs management of the execution of other programs, management of arithmetic resources such as memory and processes, and management of input / output with each device. The host system 10 includes a power management unit 110. The power management unit 110 controls the power consumption based on the estimated surface temperature notified from EC31. For example, the power management unit 110 controls the power consumption of the host system 10 by determining the operation mode based on the estimated surface temperature notified from EC31.

[0040] The operation modes that the host system 10 can take include, for example, the standard mode and the thermal protection mode. Different power control parameters are set for each operation mode. The power control parameters include, for example, PL1 (Power Limit 1) and PL2 (Power Limit 2). PL1 corresponds to the rated power of the CPU 11. The rated power is a threshold value for allowing the moving average value of the power consumption to temporarily exceed this value, but restricting it from constantly (e.g., continuously for several seconds to dozens of seconds or more) exceeding it. The window length used for the moving average (the observation period of the instantaneous values for calculating the moving average value at a certain time) is typically about 1 to 10 s, for example. PL2 is a threshold value for restricting the CPU 11 from exceeding it even if the power consumption is temporary. Generally, the higher the clock frequency of the CPU 11, the more arithmetic processing it executes, and accordingly, the power consumption increases. The CPU 11 has a control mechanism for adjusting the clock frequency so that the instantaneous value of the power consumption does not exceed PL2 and the moving average value of the power consumption does not exceed PL1.

[0041] The standard mode is an operation mode that provides the standard functions expected as the specifications of the electronic device 1. The standard mode is provided when the estimated surface temperature at that time is within a predetermined standard operation temperature range (sometimes referred to as the "standard operation temperature" in this application). The thermal protection mode is provided when the estimated surface temperature is within a predetermined separate operation temperature range (sometimes referred to as the "thermal protection operation temperature" in this application). The thermal protection operation temperature is a temperature range including a temperature higher than the standard operation temperature. The thermal protection mode is an operation mode with less power consumption than the standard mode. The power control parameters related to the thermal protection mode are set to be smaller than the power control parameters related to the standard mode. Under the power consumption of a certain common CPU 11, the output value of the fan 364 in the thermal protection mode may be larger than the output value of the fan 364 in the standard mode.

[0042] The power management unit 110 monitors the estimated surface temperature notified from the EC 31. When the operation mode at that time is the standard mode and the estimated surface temperature exceeds the upper limit of the standard operating temperature, the power management unit 110 changes the operation mode to the thermal protection mode. Further, the power management unit 110 notifies the EC 31 of the thermal protection mode which is the changed operation mode. When the operation mode at that time is the thermal protection mode and the estimated surface temperature becomes equal to or lower than the lower limit of the thermal protection operating temperature, the power management unit 110 changes the operation mode to the standard mode. The power management unit 110 notifies the EC 31 of the thermal protection mode as the changed operation mode.

[0043] In addition, when the operation mode at that time is the thermal protection mode and the estimated surface temperature exceeds the upper limit of the thermal protection operating temperature, the power management unit 110 may change the operation mode to hibernation. Hibernation corresponds to a suspended state in which the operations of the CPU 11 and the main memory 12 are stopped. Hibernation corresponds to the S4 state among the system states defined in the ACPI (Advanced Configuration and Power Interface). In contrast, the standard mode and the thermal protection mode correspond to the S0 state among the system states defined in the ACPI. When the power management unit 110 changes the operation mode from the thermal protection mode to hibernation, it stops the execution of the program being executed. The power management unit 110 generates an image file including various intermediate data, parameters, etc. generated by the processing being executed by the CPU 11, and stores the generated image file in the storage 23 (backup). Further, the power management unit 110 notifies the EC 31 of hibernation as the operation mode. Thereafter, the CPU 11 ends its operation. Then, the EC 31 stops the power supply to the CPU 11, the main memory 12, and the storage 23 for the drive circuit 362. Further, the EC 31 may stop the power supply to the fan 364 for the drive circuit 362.

[0044] The transition from hibernation to the standard mode or the thermal protection mode is conditional upon the detection of a startup instruction. The EC31 electrically or mechanically detects the contact of the contacts of the power switch 38 and starts energization from the power supply circuit 34 to the CPU 11, the main memory 12, and the storage 23. The CPU 11 reads an image file from the storage 23 and stores the read image file in the main memory 12. Thereafter, the CPU 11 resumes the execution of the program immediately before the change of the operation mode to hibernation using the read image file. Thereby, the operation of the host system 10 resumes.

[0045] When transitioning from hibernation to the standard mode or the thermal protection mode, the EC31 resumes the notification of the calculated estimated surface temperature to the host system 10. At this time, the EC31 resumes the control of the operation of the fan 364 using the drive circuit 362. The host system 10 resumes operation in the standard mode when the estimated surface temperature notified from the EC31 is equal to or lower than the upper limit of the standard operating temperature. When the estimated surface temperature notified from the EC31 exceeds the upper limit of the standard operating temperature and is equal to or lower than the lower limit of the standard operating temperature, the host system 10 resumes operation in the thermal protection mode. Note that when the estimated surface temperature exceeds the upper limit of the thermal protection operating temperature, the EC31 does not start the host system 10 and maintains the operation mode in hibernation. At this time, the EC31 maintains the stopped state without starting the energization from the power supply circuit 34 to the CPU 11, the main memory 12, and the storage 23.

[0046] Next, an example of the control method of the electronic device 1 according to the present embodiment will be described. FIG. 5 is a flowchart showing an example of the control method of the electronic device 1 according to the present embodiment. (Step S102) The temperature sensors 35-1 and 35-2 disposed on the surface of the substrate 103 each detect the temperature and notify the EC31 of the measured temperatures X 1 , X 2 as such. (Step S104) The EC31 receives the measured temperatures X notified from the temperature sensors 35-1 and 35-21 and X 2 to calculate an estimated surface temperature Y using a predetermined mathematical model apu EC31 notifies the calculated estimated surface temperature Y apu to the host system 10.

[0047] (Step S106) EC31 controls the operation of the fan 364 based on the estimated surface temperature Y apu . Here, EC31 refers to a preset control table, determines the output value of the fan 364 based on the estimated surface temperature Y apu , and outputs a control signal indicating the determined output value to the drive circuit 362. The drive circuit 362 supplies power corresponding to the output value indicated by the control signal to the fan 364. Thereby, the output of the fan 364 is controlled. (Step S108) The power management unit 110 of the host system 10 determines an operation mode based on the estimated surface temperature Y notified from the EC31 apu , and sets power control parameters according to the determined operation mode. Thereby, the power consumption of the host system 10 is controlled. Then, the process of FIG. 5 ends.

[0048] Next, an example of a regression model used to calculate the estimated surface temperature from the measured temperature will be described. The parameters of the regression model are obtained in advance and regression analysis (learning) is performed on the training data. One set of training data is composed of a plurality of data sets. Each data set is composed of the measured value (input value) of the explanatory variable and the measured value (output value) of the target variable. According to the regression analysis, the parameter of the regression model is determined so that the index value of the difference between the estimated value and the measured value of the target variable calculated using the mathematical model with respect to the measured value of the explanatory variable decreases (is minimized) as a whole for the training data. In the regression model exemplified by Equation (1), the coefficients M 1 , M 2 and the constant C apucorresponds to the parameters of the regression model. When determining the parameters of the regression equation, known regression analysis methods can be used. For example, the least squares method is used as the regression analysis method. In that case, as an index value of the magnitude of the difference, for example, the sum of squared differences between the estimated value and the measured value is used.

[0049] Figure 6 is a diagram illustrating training data and a regression model. In Figure 6, the vertical axis represents the surface temperature, and the horizontal axis represents the measured temperature X 1 is shown. However, the illustration of the measured temperature X 2 is omitted. Each symbol represents a pair of the measured temperature X 1 for each data set and the measured value of the surface temperature. The measured value of the surface temperature (which may be referred to as the "measured surface temperature" in this application) is detected using a temperature sensor separate from the temperature sensors 35-1 and 35-2. That temperature sensor is installed at a reference point preset on the surface of the first housing 102. Each data set is composed of the measured temperature X 1 , X 2 and the measured surface temperature detected simultaneously. In Figure 6, the straight line represents the relationship between the measured temperature X 1 shown by the regression model and the estimated surface temperature Y apu . Through regression analysis, the coefficients M 1 , M 2 , the constant C apu which are parameters are determined so that a regression model representing the distribution of the data sets as a whole for the training data is obtained.

[0050] By using the regression model, the measured temperatures X 1 , X 2The surface temperature at the reference point is estimated. The reference point may be any of, for example, the bottom surface of the first housing 102 (e.g., the central part), the rear bezel at the periphery of the exhaust port 102r, or any of those on the keyboard 32k covering the surface of the first housing 102 (e.g., the track point 32t). These positions are likely to be continuously or frequently contacted by the user during the use of the electronic device 1. By avoiding abnormal temperature rise near the reference point during use, the user can use the electronic device 1 with confidence. Also, the reference point may be the position on the surface of the first housing 102 where the temperature becomes the highest during the operation of the electronic device 1 (e.g., directly above the CPU 11). Therefore, with the estimated surface temperature at the reference point as the upper limit, the possibility that the surface temperature of the first housing 102 becomes higher can be reduced.

[0051] Next, a control example of the fan 364 according to the present embodiment will be described. FIG. 7 is a diagram showing a control example of the fan 364. FIG. 7 illustrates the time changes of the measured temperature X 1 , the measured value of the measured surface temperature, the estimated surface temperature, and the rotational speed of the fan 364. However, the illustration of the measured temperature X 2 is omitted. Scenario A is an operating situation in which the CPU 11 is made to execute a process instructed by a separate processing request intermittently issued while continuing image processing. Scenario B is an operating situation in which the CPU 11 is made to execute a process instructed by a processing request intermittently issued without executing image processing. In scenarios A and B, heat is mainly generated by the CPU 11 and the main memory 12. Scenario C is an operating situation in which the CPU 11 is made to sequentially read a large amount of data pre-stored in the storage 23 and transmit the read data using the WLAN module 25. Scenario D is an operating situation in which the CPU 11 is made to sequentially receive data using the WLAN module 25 and write the received data to the storage 23. In scenarios C and D, in addition to the CPU 11 and the main memory 12, heat is also generated by the WLAN module 25.

[0052] In FIG. 7, the rotational speeds obtained according to the present embodiment and the comparative example are indicated by a solid line and a broken line, respectively. In the comparative example, for EC31, the rotational speed of the fan 364 is determined using the measured temperature X apu without using the estimated surface temperature Y 1 . In scenarios A and B, there is no significant difference in the rotational speed of the fan 364 between the present embodiment and the comparative example. Also, the measured temperature X 1 on the substrate is approximately the same as the estimated surface temperature or the measured surface temperature, and the difference between them is relatively small. On the other hand, in scenarios C and D, there is a significant difference in the rotational speed of the fan 364 between the present embodiment and the comparative example. Thus, in scenarios C and D, the correlation between the measured temperature and the surface temperature obtained in scenarios A and B is not maintained. In the comparative example, even when the surface temperature is relatively low, the fan 364 operates at a higher output than necessary.

[0053] In contrast, in the present embodiment, the output of the fan 364 is suppressed. In scenario C, the rotational speed of the present embodiment is 5 dB lower than that of the comparative example. In scenario D, the rotational speed of the present embodiment is 8 dB lower than that of the comparative example. That is, even when the measured temperature X 1 on the substrate and the surface temperature deviate from each other depending on the operating state, the operation of the fan 364 is suppressed using the estimated surface temperature. Also, even in scenarios C and D, the difference between the measured surface temperature and the estimated surface temperature is relatively small, at most about 1°C. This indicates that the present embodiment can economically reduce the output of the fan 364 without separately providing a temperature sensor for detecting the surface temperature by estimating the surface temperature using a regression model. Also, it is shown that the surface temperature is accurately estimated regardless of the difference in the operating state according to the scenario by using a plurality of temperature sensors arranged at different positions on the substrate 103.

[0054] In the above example, the case where the number of temperature sensors on the substrate is two is mainly described, but it is not limited to this. The number N of temperature sensors may be one or three or more. EC31 calculates the estimated surface temperature from the measured temperatures respectively detected by the N temperature sensors using a regression model. The regression model used for calculating the estimated surface temperature may be pre-trained using training data configured to include a data set with the N measured temperatures by the N temperature sensors as explanatory variables and the measured surface temperature by the temperature sensor installed at the reference point as the target variable. Some or all of the N temperature sensors may be installed closer to a specific device than to other devices.

[0055] Also, the training data used for learning the regression model may be configured to include at least one set of a data set consisting of explanatory variables and a target variable for each scenario where the operating states of the peripheral devices are different. The regression model is not limited to a linear regression model and may be a non-linear regression model. The electronic device 1 is not necessarily limited to a notebook PC and may be an electronic device realized in other forms such as a tablet terminal device.

[0056] As described above, the electronic device 1 according to the present embodiment houses a controller (for example, EC31), a temperature sensor 35 for detecting temperature, and a fan 364 inside a housing (for example, the first housing 102). The controller and the temperature sensor 35 are arranged on the substrate 103. A model (for example, a regression model) showing the correlation between the measured temperature (for example, measured temperatures X 1 , X 2 ) detected by the temperature sensor and the surface temperature at the reference point on the surface of the housing is set in the controller in advance. The controller calculates an estimated value of the surface temperature (for example, estimated surface temperature Y apu ) based on the measured temperature using the set model, and controls the operation of the fan 364 based on the calculated estimated value. According to this configuration, the operation of the fan 364 is controlled based on the estimated value of the surface temperature calculated from the measured temperature. Therefore, even when the correlation between the surface temperature and the measured temperature varies depending on the operating conditions, an unintended operation or an increase in output of the fan 364 is avoided, and an operation according to the surface temperature is realized. In addition, an increase in production cost due to the installation of a new temperature sensor for detecting the surface temperature can be avoided.

[0057] Further, the electronic device 1 includes a host system 10, and the host system is disposed on the substrate 103 and may control the power consumption of its own system based on the estimated value of the surface temperature. According to this configuration, even when the correlation between the surface temperature and the measured temperature varies depending on the operating conditions, the operation of the host system 10 is controlled according to the surface temperature.

[0058] Further, the electronic device 1 includes two or more temperature sensors (for example, temperature sensors 35-1 and 35-2), and the model for calculating the surface temperature is a set of measured temperatures detected for each temperature sensor (for example, measured temperature X 1 , X 2 ), and the correlation with the surface temperature (for example, measured surface temperature), and the controller may use the model to calculate an estimated value of the surface temperature (for example, estimated surface temperature Y apu ) based on the set of measured temperatures. The reference point of the surface temperature may be the position on the surface of the housing where the temperature is the highest. Further, the reference point of the surface temperature may be any of the bottom surface of the housing, the periphery of the exhaust port of the housing (for example, the rear bezel), and the surface of the input device covering the housing (for example, the keyboard 32k, the track point 32t). According to this configuration, by using the measured temperatures detected at different positions on the substrate 103, even when the correlation between the measured temperature and the surface temperature varies based on the temperature distribution in the housing due to the operating state, the surface temperature can be estimated more accurately than when only one temperature sensor is used.

[0059] Further, the electronic device 1 houses a peripheral device (e.g., the WLAN module 25) on a substrate inside the housing, and a model for calculating the surface temperature may be set using training data consisting of one or more pairs of the measured temperature and the surface temperature detected for each operating state of the peripheral device. According to this configuration, a model for calculating the surface temperature from the measured temperature can be obtained in consideration of different temperature distributions for different scenarios in which the operating state of the peripheral device is different. Therefore, the estimation accuracy of the measured temperature calculated from the measured temperature is further improved.

[0060] As described above, the embodiments of the present application have been described in detail with reference to the drawings. However, the specific configuration is not limited to the above-described embodiments, and designs and the like within the scope not departing from the gist of the present invention are also included. Each configuration described in the above embodiments can be arbitrarily combined.

Description of Reference Numerals

[0061] 1... Electronic device, 10... Host system, 11... CPU, 12... Main memory, 21... Chipset, 22... ROM, 23... Storage, 24... Display, 25... WLAN module, 26... Input / output I / F, 31... EC, 32... Input device, 32k... Keyboard, 32t... Track point, 33... Battery, 34... Power supply circuit, 35(35-1, 35-2)... Temperature sensor, 36... Heat dissipation mechanism, 38... Power switch, 102... First housing, 102r... Exhaust port, 103... Substrate, 104... Second housing, 108(108a, 108b)... Hinge, 110... Power management unit, 362... Drive circuit, 364... Fan, 366... Heat pipe

Claims

1. The controller, the temperature sensor for detecting the temperature, the peripheral devices and the fan are housed inside the housing, the controller, the peripheral device and the temperature sensor are disposed on a substrate; a model indicating a correlation between an actual temperature detected by the temperature sensor and a surface temperature at a reference point on the surface of the housing is preset in the controller; The controller: calculating an estimate of the surface temperature based on the measured temperature using the model; controlling operation of the fan based on the estimated value; The model is The peripheral device is set with reference to one or more pairs of the actual temperature and the surface temperature detected for each operating state of the peripheral device. electronic equipment.

2. A host system is provided. The host system is disposed on the board and controls the power consumption of the host system based on the estimated value.

2. The electronic device according to claim 1.

3. Two or more of the temperature sensors are provided, the model indicates a correlation between the set of actual temperatures detected by each of the temperature sensors and the surface temperature; The controller: Using the model to calculate an estimate of the surface temperature based on the set of measured temperatures.

2. The electronic device according to claim 1.

4. The reference point is the location on the surface of the housing where the temperature is the highest.

2. The electronic device according to claim 1.

5. The reference point is any one of the bottom surface of the housing, the periphery of the exhaust port of the housing, and the surface of the input device that covers the housing.

2. The electronic device according to claim 1.

6. The controller, the temperature sensor for detecting the temperature, the peripheral devices and the fan are housed inside the housing, the controller, the peripheral device and the temperature sensor are disposed on a substrate; A method for controlling an electronic device in which a model indicating a correlation between an actual temperature detected by the temperature sensor and a surface temperature at a reference point on a surface of the housing is preset, comprising: The electronic device includes: calculating an estimate of the surface temperature based on the measured temperature using the model; controlling operation of the fan based on the estimated value; The model is The peripheral device is set with reference to one or more pairs of the actual temperature and the surface temperature detected for each operating state of the peripheral device. Control methods.

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