Self-healing wiring, electrically conductive particle-dispersed non-volatile gel, and method for self-healing self-healing wiring

Abstract

To solve a problem with conventional self-repairing wiring that has a structure in which an electric wiring is covered with an aqueous solution, specifically, a problem in which evaporation of aqueous solution when considering long-term use, "sealing" of aqueous solution is necessary, conductive particles are not uniformly dispersed and tend to settle.SOLUTION: A self-repairing wiring provided with an electric wiring has a structure in which a conductive particle-dispersed nonvolatile gel containing a nonvolatile solvent and conductive particles is in contact with the electric wiring.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a self-healing wiring, a conductive particle-dispersed non-volatile gel, and a self-healing method for the self-healing wiring.

Background Art

[0002] When a crack (disconnection) occurs in an electrical wiring, studies have been made on technologies that enable self-healing.

[0003] For example, Patent Document 1 describes a self-healing wiring having a structure in which an electrical wiring is covered with a fluid in which conductive particles are dispersed. In this self-healing wiring, even if a crack occurs in a part of the electrical wiring, the crack is repaired by dielectrophoresis of the conductive particles by applying a voltage. (Dielectrophoresis is a phenomenon in which a force acts on particles due to the interaction between an applied electric field and an electric dipole induced thereby, and is a phenomenon in which a substance receives a force (dielectrophoretic force) and moves due to the interaction between the electric force line field generated when a non-uniform alternating electric field is applied and the polarization of the substance.) In Patent Document 1, specifically, an aqueous solution in which gold nanoparticles are dispersed is used as the fluid in which conductive particles are dispersed. The particle size of the gold nanoparticles is about 20 to 200 nm, and the larger the particle size, the more likely it is to self-heal at a lower applied voltage.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The self-healing wiring described in Patent Document 1 has a structure in which an electrical wiring is covered with an "aqueous solution". Therefore, there is room for improvement in terms of evaporation of the aqueous solution, "sealing" of the aqueous solution, and easy sedimentation of conductive particles without uniform dispersion when considering long-term use.

[0006] The inventors of the present invention have made various studies to improve the above matters.

Means for Solving the Problems

[0007] The inventors of the present invention have completed the invention provided below.

[0008] According to the present invention, a self-healing wiring in which an electrical wiring is disposed, the self-healing wiring having a structure in which a conductive particle-dispersed non-volatile gel containing a non-volatile solvent and conductive particles is in contact with the electrical wiring is provided.

[0009] Also, according to the present invention, a conductive particle-dispersed non-volatile gel containing a non-volatile solvent and conductive particles, the conductive particle-dispersed non-volatile gel being used for a self-healing wiring is provided.

[0010] Also, according to the present invention, a self-healing method for a self-healing wiring in which an electrical wiring is disposed, wherein a crack generated in the electrical wiring is in contact with a conductive particle-dispersed non-volatile gel containing a non-volatile solvent and conductive particles, and by applying a voltage to the electrical wiring, the crack is crosslinked and repaired by the conductive particles in the conductive particle-dispersed non-volatile gel, the self-healing method for a self-healing wiring is provided.

Effects of the Invention

[0011] According to the present invention, problems that may arise in a self-healing wiring having a conventional structure in which an electric wiring is covered with an aqueous solution, such as evaporation of the aqueous solution in consideration of long-term use, the need for "sealing" of the aqueous solution, and easy sedimentation of conductive particles without uniform dispersion, are improved.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Modes for Carrying Out the Invention

[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and the description thereof will be omitted as appropriate. To avoid complexity, when there are a plurality of the same components in the same drawing, only one of them may be denoted by a reference numeral, and not all of them may be denoted by a reference numeral. All the drawings are for illustrative purposes only. The shapes and dimensional ratios of the respective members in the drawings do not necessarily correspond to actual articles.

[0014] In this specification, the notation "X to Y" in the description of a numerical range represents X or more and Y or less, unless otherwise specified. For example, "1 to 5 mass%" means "1 mass% or more and 5 mass% or less".

[0015] <Self-healing wiring> FIG. 1 is a diagram schematically showing a self-healing wiring (self-healing wiring 1) of the present embodiment. The self-healing wiring 1 can have, for example, a structure in which an electric wiring 3 is disposed on a substrate 2, and a conductive particle-dispersed non-volatile gel 5 (hereinafter, also simply referred to as "gel 5") containing a non-volatile solvent and conductive particles 4 is disposed so as to be in contact with (preferably cover) the electric wiring 3. At both ends of, for example, the electrical wiring 3, terminal portions 8 are provided for applying a voltage from a power source 15 provided outside the self-healing wiring 1 to the electrical wiring 3.

[0016] The substrate 2 is usually composed of an insulating material. The substrate 2 can be a glass substrate, a resin substrate, etc. Depending on the use of the self-healing wiring 1, etc., the substrate 2 may have flexibility / stretchability. The electrical wiring 3 is typically a metal wiring such as gold, copper, or a copper alloy. The terminal portion 8 is preferably one that enables voltage application to the electrical wiring 3 and generates an electric field only at the portion of the crack 7.

[0017] Although not shown in FIG. 1, the self-healing wiring 1 may be provided with a protective material for protecting the gel 5.

[0018] In the self-healing wiring 1, due to the presence of the gel 5, it becomes possible to repair the crack 7 generated in the electrical wiring 3. Even if a crack 7 occurs in the electrical wiring 3, if an appropriate voltage is applied to the electrical wiring 3 using the terminal portion 8, the conductive particles 4 aggregated by dielectrophoresis bridge the crack 7, making it possible to repair the electrical wiring 3. At this time, basically no external heating or the like is required. The magnitude of the force acting on the conductive particles 4 when a voltage is applied can be theoretically estimated based on the descriptions in paragraphs 0041 to 0052 of Patent Document 1.

[0019] One of the features of the self-healing wiring 1 is that it includes a gel 5 containing a non-volatile solvent and conductive particles 4. As a result, compared with a self-healing wiring having a structure in which an "aqueous solution" covers the electrical wiring, the self-healing wiring 1 has the following merits: (i) there is substantially no evaporation problem when considering long-term use, (ii) "sealing" of the aqueous solution is not required, and (iii) the conductive particles are easily uniformly dispersed and difficult to sediment. In addition, since the gel 5 is flexible, there is also the merit that a flexible self-healing wiring 1 can be configured by using the gel 5.

[0020] Hereinafter, the conductive particle-dispersed non-volatile gel 5, that is, a non-volatile solvent and conductive particles, which is preferably used for self-healing wiring, will be specifically described.

[0021] · The polymer forming the network of gel 5 Gel 5 is not particularly limited as long as it can absorb a non-volatile solvent and swell, and can disperse conductive particles 4. Gel 5 usually has a three-dimensional network structure insoluble in the solvent. From the viewpoints of ease of preparation and ease of movement of conductive particles 4 when a voltage is applied, the polymer constituting the network structure of gel 5 preferably contains hydroxypropyl cellulose. Hydroxypropyl cellulose is a water-soluble cellulose derivative, and is usually obtained by treating cellulose with a base such as sodium hydroxide and then reacting it with an etherifying agent such as propylene oxide. Hydroxypropyl cellulose can be purchased, for example, from FUJIFILM Wako Pure Chemical Corporation. The raw material hydroxypropyl cellulose gels at room temperature, but the time until gelation can be shortened by heating. The heating time can be, for example, 50 to 75°C.

[0022] The concentration of the polymer constituting gel 5 is preferably 0.1% by mass or more and 5.0% by mass or less, more preferably 0.5% by mass or more and 1.0% by mass or less. When the concentration of the polymer is somewhat large, the dispersibility of the conductive particles 4 is considered to be further enhanced. Also, when the concentration of the polymer is not too large, the mobility of the conductive particles 4 when a voltage is applied is considered to be further enhanced.

[0023] · Non-volatile solvent From the viewpoint of further suppressing "the problem of evaporation in consideration of long-term use", the vapor pressure of the non-volatile solvent at 20°C is preferably 7 Pa or less. The solvent preferably used as the non-volatile solvent is ethylene glycol.

[0024] · Conductive particles 4 The conductive particles 4 are typically metal particles, specifically, one or more metal particles selected from the group consisting of copper, gold, silver, and aluminum. The conductive particles 4 can be purchased, for example, from Furukawa Chemicals. Incidentally, in Patent Document 1, gold nanoparticles are specifically used as the conductive particles. On the other hand, in the present embodiment, even when using conductive particles that are "cheaper" than gold, such as copper particles, good self-healing performance can be obtained.

[0025] The median diameter of the conductive particles 4 determined by the laser diffraction / scattering method can be, for example, 0.5 to 1.0 μm from the viewpoints of dispersibility in the gel and mobility when a voltage is applied.

[0026] Incidentally, by using the gel 5, even when using conductive particles 4 with a relatively large diameter, sedimentation of the conductive particles 4 can be suppressed. As the finding of the present inventor, the larger the diameter of the conductive particles 4, the more possible it is to repair cracks at a low voltage. That is, by using the gel 5 instead of using an aqueous solution as in the prior art, it is easier to achieve both crack repair at a low voltage and suppression of particle sedimentation at a high level.

[0027] The amount (concentration) of the conductive particles 4 in the gel 5 is preferably 0.05% by mass or more and 1.0% by mass or less, more preferably 0.3% by mass or more and 0.5% by mass or less. It is considered that the crack repair property is further enhanced by containing a certain amount of the conductive particles 4 in the gel 5. Also, it is considered that problems such as short circuits are reduced by not having too much amount of the conductive particles 4.

[0028] ·Regarding the network structure of the gel 5 In the present embodiment, it is preferable that the network structure of the gel 5, specifically, the "size" and "degree of coarseness" of the network of the gel 5 are appropriately designed. Thereby, the mobility of the conductive particles 4 when a voltage is applied and the uniform dispersibility of the conductive particles 4 in the gel 5 are achieved at a high level.

[0029] As an example, the mode diameter of the network structure of gel 5 measured by the photon correlation method conforming to JIS Z 8826 is preferably 700 nm or more and 800 nm or less. Also, the median diameter of the network structure of gel 5 measured by the photon correlation method conforming to JIS Z 8826 is preferably 750 nm or more and 850 nm or less. These values are obtained by measuring gel 5 in which conductive particles 4 are dispersed.

[0030] The "size" and "degree of coarseness" of the network of gel 5 can be controlled by adjusting the amount (concentration) of the gelling agent, the viscosity of the mixture of the gelling agent and the solvent, etc. in the "method for producing gel 5" described later.

[0031] · Method for producing gel 5 / Method for producing self-healing wiring Gel 5 can be produced, for example, by the following procedure. (1) First, mix a gelling agent and a solvent. Preferably, the aforementioned hydroxypropyl cellulose can be mentioned as the gelling agent. Preferably, the aforementioned ethylene glycol can be mentioned as the solvent. (2) Put conductive particles into the mixed solution obtained in (1) and stir. (3) Heat the mixture obtained in (2) to about 50 to 75 °C while stirring. The heating time is not particularly limited as long as the mixture obtained in (2) gels appropriately, and is, for example, about 5 to 15 minutes. Note that even without heating (room temperature), the mixture will gel if sufficient time is taken. (4) Stop heating and stirring and let it stand. (5) If necessary, pass the gel obtained in (4) through a roll mill for the purpose of crushing and / or kneading the conductive particles.

[0032] For example, a self-healing wiring can be obtained by placing the gel obtained as described above on at least the location where the electrical wiring exists on the substrate on which the electrical wiring is disposed.

[0033] <Self-healing method of self-healing wiring> In an electrical wiring provided with a gel 5 in contact with an electrical wiring 3 having a crack 7 as shown in FIG. 1, a voltage is applied to the electrical wiring 3. By applying this voltage, the crack 7 is crosslinked and repaired by the conductive particles 4 in the gel 5. That is, the crack 7 is "repaired".

[0034] The magnitude of the applied voltage is not particularly limited as long as the conductive particles 4 move by dielectrophoresis. Typically, it is an alternating voltage, and in an alternating voltage represented by a trigonometric function of voltage V = V amp sinωt (ω: each speed, t: time), the voltage amplitude V amp is appropriately adjusted between 5 and 150 V. Based on the theory of dielectrophoresis, the applied voltage may be a direct current voltage or an alternating current voltage.

[0035] Incidentally, when the applied voltage is an alternating voltage, by appropriately adjusting the applied frequency, the mobility of the conductive particles 4 may be further increased, which may be more preferable for repairing the crack 7. Specifically, when the applied frequency is relatively small, the influence of alternating current electroosmosis and the like is small, and the mobility of the conductive particles 4 tends to be better, or the conductive particles 4 tend to gather near the crack. As the finding of the present inventors, the applied frequency f is preferably 5 to 50 kHz, more preferably 10 to 20 kHz.

[0036] As described above, the embodiments of the present invention have been described, but these are examples of the present invention, and various configurations other than the above can be adopted. Further, the present invention is not limited to the above-described embodiments, and modifications, improvements, etc. within the scope that can achieve the object of the present invention are included in the present invention. Examples of reference configurations are given below. 1. A self-healing wiring in which electrical wiring is provided, A self-healing wiring comprising a structure in which a conductive particle-dispersed non-volatile gel containing a non-volatile solvent and conductive particles is in contact with the electrical wiring. 2. The self-healing wiring according to 1., A self-healing wiring in which the vapor pressure of the non-volatile solvent at 20 °C is 7 Pa or less. 3. The self-healing wiring according to 1. or 2., A self-healing wiring in which the non-volatile solvent contains ethylene glycol. 4. The self-healing wiring according to any one of 1. to 3., A self-healing wiring in which the gel contains hydroxypropyl cellulose. 5. The self-healing wiring according to any one of 1. to 4., A self-healing wiring in which the mode diameter of the network structure of the conductive particle-dispersed non-volatile gel measured by the photon correlation method in accordance with JIS Z 8826 is 700 nm or more and 800 nm or less. 6. The self-healing wiring according to any one of 1. to 5., A self-healing wiring in which the median diameter of the network structure of the conductive particle-dispersed non-volatile gel measured by the photon correlation method in accordance with JIS Z 8826 is 750 nm or more and 850 nm or less. 7. The self-healing wiring according to any one of 1. to 6., A self-healing wiring in which the conductive particles are metal particles. 8. The self-healing wiring according to 7., A self-healing wiring in which the metal particles are one or more metal particles selected from the group consisting of copper, gold, silver, and aluminum. 9. The self-healing wiring according to any one of 1. to 8., A self-healing wiring in which the concentration of the polymer constituting the conductive particle-dispersed non-volatile gel is 0.1 mass% or more and 5.0 mass% or less. 10. A conductive particle-dispersed non-volatile gel containing a non-volatile solvent and conductive particles, A conductive particle-dispersed non-volatile gel used for self-healing wiring. 11. The conductive particle-dispersed non-volatile gel according to 10., A conductive particle-dispersed non-volatile gel in which the non-volatile solvent contains ethylene glycol. 12. The conductive particle-dispersed non-volatile gel according to 10. or 11., A conductive particle-dispersed non-volatile gel in which the non-volatile gel contains hydroxypropyl cellulose. 13. The conductive particle-dispersed non-volatile gel according to any one of 10. to 12., A conductive particle-dispersed non-volatile gel in which the mode diameter of the network structure measured by the photon correlation method in accordance with JIS Z 8826 is 700 nm or more and 800 nm or less. 14. The conductive particle-dispersed non-volatile gel according to any one of 10. to 13., A conductive particle-dispersed non-volatile gel in which the median diameter of the network structure measured by the photon correlation method in accordance with JIS Z 8826 is 750 nm or more and 850 nm or less. 15. The conductive particle-dispersed non-volatile gel according to any one of 10. to 14., A conductive particle-dispersed non-volatile gel in which the conductive particles are metal particles. 16. The conductive particle-dispersed non-volatile gel according to 15., A conductive particle-dispersed non-volatile gel in which the metal particles are one or more metal particles selected from the group consisting of copper, gold, silver, and aluminum. 17. The conductive particle-dispersed non-volatile gel according to any one of 10. to 16., A conductive particle-dispersed non-volatile gel in which the concentration of the polymer constituting the metal-dispersed non-volatile gel is 0.1 mass% or more and 5.0 mass% or less. 18. A self-healing method for a self-healing type wiring in which electrical wiring is disposed, The crack generated in the electrical wiring is in contact with a conductive particle-dispersed non-volatile gel containing a non-volatile solvent and conductive particles, A self-healing method for a self-healing type wiring, wherein by applying a voltage to the electrical wiring, the crack is crosslinked and repaired by the conductive particles in the conductive particle-dispersed non-volatile gel.

Example

[0037] Embodiments of the present invention will be described in detail based on examples and comparative examples. For the sake of clarity, it should be noted that the present invention is not limited only to the examples.

[0038] <Preparation of Gel> First, the following materials were prepared. ·Gelling agent: Hydroxypropyl cellulose (manufactured by Fujifilm Wako Pure Chemical Corporation) ·Solvent: Ethylene glycol (manufactured by Fujifilm Wako Pure Chemical Corporation) ·Conductive particles: Metal copper powder manufactured by Furukawa Chemicals Co., Ltd. (product number: FMC-SB, median diameter D measured by laser diffraction / scattering method 50 : 0.7 μm)

[0039] First, the gelling agent and the solvent were thoroughly mixed to obtain a mixed solution. The amounts of the gelling agent and the solvent were as described in Table 1. Next, 20 mg of conductive particles were added to the obtained mixed solution and stirred to obtain a mixture. The obtained mixture was heated at 50 - 75 °C for 5 - 15 minutes while stirring. As a result, the mixture became a gel. After stopping the heating, the obtained gel was allowed to stand until it reached room temperature. Then, the gel at room temperature was passed through a roll mill (BR-150V manufactured by Imex) 4 times. Thus, a conductive particle-dispersed non-volatile gel was obtained.

[0040]

Table 1

[0041] The obtained conductive particle-dispersed non-volatile gel was observed at a magnified scale. It was confirmed that the conductive particles (metallic copper powder) were sufficiently uniformly dispersed in the gel.

[0042] <Evaluation of Gel> (Size of Gel Mesh) Regarding the gels obtained in Examples 2 and 5, the mode diameter and median diameter of the network structure, measured by the photon correlation method conforming to JIS Z 8826, were determined. As the measuring device, SZ-100V2 manufactured by HORIBA was used. When bubbles were mixed in when the sample was put into the measuring cell, a defoaming treatment was performed. The results are shown in Table 2.

[0043]

Table 2

[0044] (Presence or Absence of Gel Deterioration due to Solvent Evaporation, etc.) The gels obtained in Examples 1 to 7 were left at room temperature for one month. The viscosity of the gel before and after leaving was measured using a rheometer at room temperature and a rotation speed of 5 rpm. The results are shown in Table 3. The unit of the numerical values in Table 3 is Pa·s.

[0045]

Table 3

[0046] From the results shown in Table 3, it can be said that the deterioration of the gels obtained in Examples 1 to 7 due to solvent evaporation, etc. is sufficiently suppressed. Also, the viscosity of the gels obtained in Examples 1 to 7 was a sufficiently large value compared to water, and the fluidity was suppressed. This means that when constructing a self-healing wiring using the gels obtained in Examples 1 to 7, it is not always necessary to perform the "sealing treatment" of the gel.

[0047] <Evaluation of Self-Healing Property> (Evaluation Method) First, an experimental circuit schematically shown in FIG. 2 was assembled. As the electrical wiring, a gold wiring with a wiring width of 20 μm, a wiring thickness of 500 nm, and a disconnection portion with a width of 10 μm was prepared. The magnitude of the external resistance was 18 kΩ.

[0048] The gel obtained above was placed on the electrical wiring so as to cover at least the disconnection portion of the gold wiring. Then, an alternating voltage was applied under the conditions of an applied voltage of 80 V (peak-to-peak value) and an applied frequency of 100 kHz.

[0049] (Results) In any case where the gels of Examples 1 to 7 were used, it was confirmed through a microscope that conductive particles moved to the disconnection portion. That is, it was shown that the cracks generated in the electrical wiring can be repaired by using a conductive particle-dispersed non-volatile gel containing a non-volatile solvent and conductive particles.

[0050] (Additional evaluation: Migration rate of conductive particles) In some examples, the movement of conductive particles was video-recorded using the microscope shown in FIG. 2, and the migration rate of the conductive particles (average value of the maximum rates measured for n conductive particles) was determined. The results are shown in Table 4. Table 4 also shows the standard deviation of the migration rate.

[0051] [Table 4]

[0052] As shown in Table 3, in terms of the mobility of the conductive particles, preferable results were obtained when the concentration of the polymer constituting the gel was lower.

[0053] Also, in the example of Example 1 (gelator concentration: 0.5%), the applied voltage was changed to 60 V (peak-to-peak value), and the applied frequency was set to 10 kHz, 32 kHz, 100 kHz, or 320 kHz, and the moving speed of the conductive particles (average value of the maximum speeds measured for n conductive particles) was determined. The results are shown in Table 5. Table 5 also shows the standard deviation of the moving speed.

[0054]

Table 5

[0055] <Examination of the diameter of conductive particles> Based on Example 2 (gelator concentration: 1%, median diameter D of conductive particles 50 : 0.7 μm), gels were prepared in which the median diameter D 50 of the conductive particles (metal copper powder) was changed to 1 μm, 3 μm, or 4 μm. Using these gels, the mobility of the conductive particles during voltage application was observed with a microscope as described in the above <Evaluation of self-healing property>. However, the applied frequency was set to 10 kHz instead of 100 kHz.

[0056] As a result of the observation, it was found that the smaller the median diameter D 50 , the more conductive particles tended to gather near the disconnection part (trapped by the electric field). This result is interpreted as indicating that the smaller the median diameter D 50 , the easier it was for the conductive particles to move through the "mesh" of the gel.

[0057] <Examination of the concentration of conductive particles> Based on Example 2 (gelator concentration: 1%, amount of conductive particles used: 20 mg), gels were prepared in which the amount of conductive particles (metal copper powder) used was changed to 200 mg or 5 mg. Using these gels, the mobility of the conductive particles during voltage application was observed with a microscope as described in the above <Evaluation of self-healing property>.

[0058] As a result of the observation, it was found that the larger the amount of conductive particles used, the more conductive particles tended to gather near the disconnection part (trapped by the electric field).

[0059] Also, in the example where the amount of the conductive particles (copper metal powder) used was 200 mg, evaluation was conducted by changing the applied frequency from 100 kHz to 32 kHz. As a result, a tendency was observed that more conductive particles adhered to the disconnection part than in the case of an applied frequency of 100 kHz. From this result, it can be said that the self-repair property is enhanced when the applied frequency is somewhat lower.

Explanation of Signs

[0060] 1 Self-repairing wiring 2 Substrate 3 Electrical wiring 4 Conductive particles 5 Conductive particle-dispersed non-volatile gel (gel) 7 Crack 8 Terminal part 15 Power supply

Claims

1. A self-healing wiring in which electrical wiring is disposed, having a structure in which a conductive particle-dispersed non-volatile gel containing a non-volatile solvent and conductive particles is in contact with the electrical wiring, wherein the non-volatile solvent contains ethylene glycol, a self-healing wiring.

2. The self-healing wiring according to claim 1, wherein the vapor pressure of the non-volatile solvent at 20 ° C is 7 Pa or less, a self-healing wiring.

3. The self-healing wiring according to claim 1 or 2, wherein the conductive particle-dispersed non-volatile gel contains hydroxypropyl cellulose, a self-healing wiring.

4. The self-healing wiring according to any one of claims 1 to 3, wherein the mode diameter of the network structure of the conductive particle-dispersed non-volatile gel measured by the photon correlation method conforming to JIS Z 8826 is 700 nm or more and 800 nm or less, a self-healing wiring.

5. The self-healing wiring according to any one of claims 1 to 4, wherein the median diameter of the network structure of the conductive particle-dispersed non-volatile gel measured by the photon correlation method conforming to JIS Z 8826 is 750 nm or more and 850 nm or less, a self-healing wiring.

6. The self-healing wiring according to any one of claims 1 to 5, wherein the conductive particles are metal particles, a self-healing wiring.

7. The self-healing wiring according to claim 6, wherein the metal particles are one or more metal particles selected from the group consisting of copper, gold, silver, and aluminum, a self-healing wiring.

8. The self-healing wiring according to any one of claims 1 to 7, wherein the concentration of the polymer constituting the conductive particle-dispersed non-volatile gel is 0.1% by mass or more and 5.0% by mass or less, a self-healing wiring.

9. A conductive particle-dispersed non-volatile gel containing a non-volatile solvent and conductive particles, wherein the non-volatile solvent contains ethylene glycol, a conductive particle-dispersed non-volatile gel used for a self-healing wiring.

10. The conductive particle-dispersed non-volatile gel according to claim 9, wherein the conductive particle-dispersed non-volatile gel contains hydroxypropyl cellulose, a conductive particle-dispersed non-volatile gel.

11. The conductive particle-dispersed non-volatile gel according to claim 9 or 10, wherein the mode diameter of the network structure measured by the photon correlation method conforming to JIS Z 8826 is 700 nm or more and 800 nm or less, a conductive particle-dispersed non-volatile gel.

12. ​ ​ A conductive particle-dispersed non-volatile gel according to any one of claims 9 to 11, wherein the median diameter of the network structure measured by the photon correlation method conforming to JIS Z 8826 is 750 nm or more and 850 nm or less, the conductive particle-dispersed non-volatile gel.

13. A conductive particle-dispersed non-volatile gel according to any one of claims 9 to 12, wherein the conductive particles are metal particles, the conductive particle-dispersed non-volatile gel.

14. A conductive particle-dispersed non-volatile gel according to claim 13, wherein the metal particles are one or more metal particles selected from the group consisting of copper, gold, silver, and aluminum, the conductive particle-dispersed non-volatile gel.

15. A conductive particle-dispersed non-volatile gel according to any one of claims 9 to 14, wherein the concentration of the polymer constituting the conductive particle-dispersed non-volatile gel is 0.1 mass% or more and 5.0 mass% or less, the conductive particle-dispersed non-volatile gel.

16. A self-healing method of a self-healing type wiring provided with electrical wiring, wherein a crack generated in the electrical wiring is in contact with a conductive particle-dispersed non-volatile gel containing a non-volatile solvent and conductive particles, the non-volatile solvent contains ethylene glycol, by applying a voltage to the electrical wiring, the crack is crosslinked and repaired by the conductive particles in the conductive particle-dispersed non-volatile gel, the self-healing method of the self-healing type wiring.

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