Housing for an electronic circuit

Abstract

The housing (1) for at least one electronic circuit (3, 4) comprises a housing part (2) having an interior surface (9) and a heat spreader component (5) connected to the interior surface (9) of the housing part (2). The heat spreader component (5) includes contact areas to be connected to electronic components (4) of the at least one electronic circuit (3, 4), the heat spreader component (5) comprising a material having a thermal conductivity greater than that of the housing part (2).

Description

Technical Field

[0001] The present invention relates to a housing for at least one electronic circuit, the housing comprising a housing part having an inner surface. The present invention further relates to an electronic device having the housing, a motor vehicle having the electronic device, and a method for manufacturing the electronic device.

Background Art

[0002] Electronic devices comprise electronic circuits and components that can generate a significant amount of heat. Heat may be transported away from the heat-generating electronic components to ensure the proper functioning of the components and circuits and to extend the life of the components or circuits.

[0003] In particular, in an in-vehicle situation for an electronic device designed to be used in a motor vehicle, the heat dissipation rate is an important factor. If the heat dissipation rate achieved by passive cooling is not sufficient, an active cooling device may have to be installed, which is undesirable from the perspective of cost and overall complexity.

[0004] For example, it is known to connect the heat-generating electronic components of an electronic device to the housing of the device by means of a thermal paste. One drawback of this approach is that the rate of heat dissipation from the electronic component through the thermal paste and the housing to the environment of the housing is somewhat limited by the size of the housing part located directly above the heat-generating component.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The object of the present invention is to provide a housing for at least one electronic circuit that enables an increase in the heat dissipation rate of the heat generated by the electronic components of at least one electronic circuit.

Means for Solving the Problems

[0006] This object is achieved by the respective subject matters of the independent claims. Further implementations and preferred embodiments are the subject matters of the dependent claims.

[0007] The present invention is based on the idea of placing a heat spreader component that can be connected to an electronic component on the inner surface of a housing. By selecting the material of the heat spreader component such that its thermal conductivity is greater than that of the housing part, a lateral spread of the dissipated heat is achieved, which results in transporting the heat faster away from the location where it is generated by the electronic component.

[0008] According to one aspect of the present invention, a housing for at least one electronic circuit is provided. The housing comprises a housing part having an inner surface, and the housing comprises a heat spreader component connected to the inner surface of the housing part. The heat spreader component includes a contact area to be connected to an electronic component of at least one electronic circuit. The heat spreader component comprises, in particular consists of, a material having a thermal conductivity greater than that of the housing part, in particular the material of the housing part.

[0009] The housing and the at least one electronic circuit can be regarded as respective parts of, for example, an electronic device, in particular an electronic device for a motor vehicle or an electronic device for use in a motor vehicle.

[0010] When the electronic device is being assembled, the housing can form an enclosure in which the at least one electronic circuit is arranged. The at least one electronic circuit can comprise a circuit board, and the electronic components can be mounted on the circuit board so as to face the inner surface of the housing part. The electronic components are then connected to the heat spreader component in the assembled state. In other words, the heat spreader component is arranged between the housing part and the electronic components and is thermally and physically connected to both of them.

[0011] The heat spreader component can be connected to the housing part, for example, by means of an adhesive and / or a mechanical fastener. In particular, the connection is such that heat transfer from the heat spreader component to the housing part can occur.

[0012] As a result, the heat generated by the electronic component is at least partially transferred to the heat spreader component. A portion of the heat may be directly transferred from the heat spreader component to the housing portion above the contact area. However, another portion of the heat can spread laterally within the heat spreader component. Here, the lateral direction can be understood as the direction parallel to the inner surface or the surface of the electronic component connected to the heat spreader component. The normal direction is perpendicular to the inner surface or the surface of the electronic component or the lateral direction, respectively.

[0013] The heat spreader component has, in particular, apart from the contact area, a further area, for example, a heat transfer area that laterally, in particular completely or partially, surrounds the contact area. Thus, the heat flow is not essentially pushed in the normal direction and can spread laterally to a significant extent. This is achieved in particular by selecting a heat spreader component material with a higher thermal conductivity than the material of the housing portion. If the thermal conductivity of the heat spreader component were smaller than the thermal conductivity of the housing portion, the heat would essentially flow in the normal direction but would not spread laterally to a significant extent. Thus, the materials of the housing portion directly above the electronic component and the heat spreader component would limit the rate of heat transfer. However, according to the present invention, the significant lateral spread of the heat by the heat spreader component is achieved by selecting the thermal conductivity of its material as described.

[0014] In this way, the heat generated by the electronic component is dispersed or transferred to other areas of the housing portion. Thus, by adapting the geometry of the heat spreader component to the electronic circuit, it can be achieved that the heat is transferred from the heat-generating electronic component towards the area above at least one electronic circuit, and less heat is generated. In other words, the potentially cooler areas inside the housing can be utilized as an effective heat sink by dispersing the heat from the hotter areas via the heat spreader component.

[0015] In this way, an increase in the overall heat dissipation rate can be achieved, and more expensive or more complex solutions for active cooling can be avoided or may be required to a lesser extent. This is particularly beneficial in the context of in-vehicle electronic devices where even a slight improvement in the heat dissipation rate of the electronic device can make it possible to omit the active cooling system.

[0016] According to some implementations, the heat spreader component is formed as an essentially two-dimensional layer.

[0017] The layer may be solid or may include a grid structure that is essentially a periodic lattice or an irregular mesh. In some implementations, both the solid region and the grid region can be combined. For example, in some implementations, the contact region may be solid and the heat transfer region may be formed as a grid structure. However, other combinations may also be possible. In other implementations, the entire heat spreader component may be formed as a solid layer or a grid layer.

[0018] The fact that the heat spreader component is an essentially two-dimensional layer can be understood as meaning that the uniform thickness of the heat spreader component in the normal direction is much smaller than the lateral extension, particularly the maximum lateral extension. For example, the thickness of the heat spreader component can be 2 mm or less, preferably 1 mm or less. The lateral extension of the heat spreader component, in other words the width and / or length dimensions, can be, for example, at least 10 times the thickness, particularly at least 20 times the thickness, for example at least 50 times the thickness.

[0019] According to some implementations, the heat spreader component includes at least partially, particularly a heat transfer region that laterally surrounds the contact region.

[0020] The heat transfer region is not in contact with the electronic component. For example, the electronic component can be connected to the heat spreader component only within the contact region.

[0021] In this way, the heat generated by the electronic component is transmitted to the contact area of the heat spreader component, from which it is transported laterally via the heat transfer area and directly to the housing part. Subsequently, the heat may also be transmitted from the heat transfer area to the housing part.

[0022] According to some implementation forms, the heat spreader component, in particular an essentially two-dimensional layer, comprises a grid structure made of a material.

[0023] In particular, the heat spreader component is formed as an essentially two-dimensional layer comprising or consisting of a grid structure. The grid structure can be regarded as a plurality of spaced and / or intersecting bands of material. The bands can form a periodic or essentially periodic lattice, or an irregular mesh.

[0024] By designing the heat spreader component to include a grid structure, the lateral heat transfer rate can be further increased. The total heat capacity of the heat spreader component may be reduced by the grid structure. However, what is most relevant to these implementation forms of the housing is the heat transfer rate. On the other hand, the reduced total heat capacity can be increased, if desired, by increasing the lateral extension of the heat spreader component.

[0025] According to some implementation forms, the thermal conductivity of the material of the heat spreader component is 270 W / (m·K) or more. Preferably, the thermal conductivity of the material is 290 W / (m·K) or more.

[0026] Unless otherwise specified, the values of thermal conductivity described here and below can be understood as values under normal conditions of a normal temperature of 20 °C and a normal air pressure of 1000 hPa.

[0027] For example, the material comprises and / or consists of copper and / or gold and / or silver. Preferably, the material comprises or consists of any one of copper or gold or silver.

[0028] Copper has a thermal conductivity of about 386 W / (m·K), gold has a thermal conductivity of about 310 W / (m·K), and silver has a thermal conductivity of about 419 W / (m·K).

[0029] On the other hand, the thermal conductivity of the housing part or the material of the housing part is 250 W / (m·K) or less. It is preferably 220 W / (m·K) or less.

[0030] For example, the housing part includes, or consists of, aluminum, particularly cast aluminum and / or magnesium and / or steel and / or plastic material. The housing part preferably includes, or consists of, any one of aluminum or magnesium or steel or plastic.

[0031] Aluminum has a thermal conductivity of about 239 W / (m·K), magnesium has a thermal conductivity of about 151 W / (m·K), and steel can have a thermal conductivity of 50 W / (m·K) or less depending on, for example, a specific alloy. Plastic materials usually have a thermal conductivity of less than 1 W / (m·K).

[0032] In particular, the thermal conductivity of the material can be 270 W / (m·K) or more and less than 600 W / (m·K). On the other hand, in some mounting forms, the thermal conductivity of the housing part may be greater than 0.05 W / (m·K) and 250 W / (m·K) or less.

[0033] However, in any case, it should be noted that the materials used for the heat spreader part and the housing part respectively have different thermal conductivities such that the thermal conductivity of the material of the heat spreader part is greater than the thermal conductivity of the material of the housing part.

[0034] According to some mounting forms, the housing includes an adhesive material disposed between the heat spreader part and the inner surface of the housing part, and the adhesive material connects the heat spreader part to the inner surface of the housing part.

[0035] In other words, the heat spreader component is connected to the inner surface by an adhesive material.

[0036] Alternatively or in addition, the housing comprises at least one mechanical fastener for connecting the heat spreader component to the inner surface of the housing portion.

[0037] According to a further aspect of the invention, an electronic device comprising at least one electronic circuit is provided. The at least one electronic circuit includes electronic components, and the electronic device comprises a housing according to the invention for the at least one electronic circuit. The heat spreader component is connected to the electronic component in, within, or via the contact area.

[0038] According to some implementations of the electronic device, the electronic device comprises a thermal paste for connecting the heat spreader component to the electronic component in the contact area.

[0039] In this way, the heat dissipation rate can be further improved, and accordingly, the heat flow from the electronic device to the heat spreader component can be guided.

[0040] According to some implementations, the electronic device is designed for use in or on a motor vehicle. For example, the electronic device can be an electronic control unit (ECU) of a motor vehicle or part of a sensor system of a motor vehicle, such as an in-vehicle camera.

[0041] According to a further aspect of the invention, a motor vehicle comprising an electronic device according to the invention is provided.

[0042] According to a further aspect of the present invention, a method for manufacturing an electronic device is provided. The method includes providing at least one electronic circuit for the electronic device and providing a housing having a housing portion with an inner surface. Further, a heat spreader component including a material having a higher thermal conductivity than the thermal conductivity of the housing portion is provided. The heat spreader component is connected to the inner surface of the housing portion, and the contact area of the heat spreader component is connected to the electronic components of the at least one electronic circuit.

[0043] According to some implementations of the method, the heat spreader component is connected to the inner surface of the housing portion by an adhesive material and / or by at least one mechanical fastener.

[0044] According to some implementations, the contact area is connected to the electronic components by a thermal paste.

[0045] Further implementations of the method for manufacturing an electronic device according to the present invention are directly obtained from various implementations of the housing according to the present invention and the electronic device according to the present invention, and vice versa. In particular, the electronic device according to the present invention can be manufactured by the method according to the present invention.

[0046] Further features of the present invention are apparent from the claims, the drawings, and the description of the drawings. The features and combinations of features described above in the description, as well as the features and combinations of features described and / or shown in the description of the drawings below, can be included in the present invention not only in the respective combinations described, but also in other combinations. In particular, embodiments and combinations of features that do not have all the features of the claims explicitly stated at first are also included in the present invention. Further, embodiments and combinations of features that exceed or deviate from the combinations of features recited in the enumeration of the claims are included in the present invention.

Brief Description of the Drawings

[0047]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Mode for Carrying Out the Invention

[0048] FIG. 1 shows a schematic cross-sectional view of an exemplary implementation form of electronic devices 11, 12 which can be designed, for example, as an ECU 11 or an in-vehicle camera 12 as shown in FIG. 6 or as another component of the automobile 10.

[0049] The electronic devices 11, 12 include a housing 1 and an electronic circuit including a circuit board 3 and electronic components 4 mounted on the upper part of the circuit board 3. The circuit board 3 can extend, for example, in the x-y plane which may be shown as a horizontal plane or a horizontal direction. The normal direction perpendicular to the surface of the circuit board 3 may be shown as the z direction.

[0050] The housing 1 includes a housing part 2 having an inner surface 9 which is at least substantially parallel to the x-y plane. Further, the housing 1 includes a heat spreader component 5 which is designed essentially as a two-dimensional layer and is connected to the inner surface 9 of the housing part 2. The heat spreader component 5 is thermally connected to the electronic component 4 in the contact area, for example, by a thermal paste 6.

[0051] The heat spreader component 5 is made of a material with a higher thermal conductivity than the thermal conductivity of the housing portion 2. For example, the housing portion 2 may be made of cast aluminum, while the heat spreader component may be made of gold or copper.

[0052] Figure 2 shows a part of the electronic devices 11, 12 of FIG. 1, namely, the housing portion 2, the heat spreader component 5, the circuit board 3, and the electronic component 4. Further, the plurality of arrows in FIG. 2 schematically indicate the heat flow of the heat generated by the electronic component 4.

[0053] If the heat spreader component 5 did not exist, the thermal paste 6 would directly connect the electronic component 4 to the housing portion 2. As a result, heat transfer would be limited to the size of the thermal paste 6 itself. Therefore, heat would essentially move in the z - direction or only in the z - direction. If the housing portion 2 directly above the high - temperature electronic component 4 cannot dissipate heat fast enough, the generated heat would accumulate and could only move outward very slowly in the lateral direction.

[0054] By providing the heat spreader component 5 between the thermal paste 6 and the housing portion 2, heat can be dispersed laterally over the original size of the heat spreader component 5. The heat spreader component 5 is in contact with the housing portion 2 over its entire surface area so that heat can be more effectively transferred to the housing portion 2. In particular, the heat generated by the electronic component 4 is transferred to the heat spreader component 5 via the thermal paste 6 and then moves along the z - direction and along the lateral direction in the x - y plane. In this case, even if the housing portion 2 directly above the electronic component 4 cannot dissipate heat fast enough, the heat can be transported laterally away from the electronic component 4 via the heat spreader component 5.

[0055] Figure 3 shows a schematic view of the housing portion 2 and the heat spreader component 5 on the internal surface 9 for a further exemplary implementation according to the present invention.

[0056] Here, the heat spreader component 5 has a star-shaped geometry having, for example, an internal contact area for connecting the electronic component 4 and a plurality of arms extending from the internal contact area, in order to enable heat transfer at an increased heat transfer rate.

[0057] In some implementations, the heat spreader component 5 may consist of the regular lattice structure 7 shown in the inset of FIG. 3. In other implementations, the heat spreader component 5 may consist of the irregular mesh structure 8 schematically shown in FIG. 4 and the corresponding inset.

[0058] By choosing such a regular lattice structure or irregular mesh structure, a particularly large heat dissipation rate can be achieved, while at the same time resulting in a minimal thermal resistance, reducing the total amount of material of the heat spreader component 5, thereby reducing costs.

[0059] FIG. 5 schematically shows an exemplary implementation of the devices 11, 12 shown with respect to FIG. 3 or FIG. 4 in an assembled state. The housing part 2 is shown essentially transparent in order to make the electronic circuit and the heat spreader component 5 visible.

[0060] As described, particularly with reference to the drawings, the present invention achieves an increase in the heat dissipation rate in an electronic device by providing a heat spreader component fixed inside the housing part. In some implementations, a thermal pedestal mechanism may be used in combination with the heat spreader component.

[0061] The heat spreader component improves the heat distribution of the electronic components on the circuit board that generate a large amount of heat without adversely affecting the functions of the surrounding components.

Claims

1. A housing (1) for at least one electronic circuit (3, 4), the housing (1) comprising a housing part (2) having an inner surface (9), comprising a heat spreader component (5) connected to the inner surface (9) of the housing part (2), the heat spreader component (5) including a contact area to be connected to an electronic component (4) of the at least one electronic circuit (3, 4), the heat spreader component (5) including a material having a higher thermal conductivity than the thermal conductivity of the housing part (2), the heat spreader component (5) having a star-shaped geometry with an inner contact area for connecting the electronic component (4) and a plurality of arms extending from the inner contact area to enable heat transfer at an increased heat transfer rate, the heat spreader component (5) including a grid structure (7, 8) made of the material characterized in that housing (1).

2. the heat spreader component (5) being formed essentially as a two-dimensional layer characterized in that the housing (1) according to claim 1.

3. the heat spreader component (5) including a heat transfer area at least partially surrounding the contact area characterized in that the housing (1) according to claim 1.

4. the thermal conductivity of the material being 270 W / (m*K) or more, and / or the thermal conductivity of the housing part (2) being 250 W / (m*K) or less characterized in that the housing (1) according to claim 1.

5. the material including copper and / or gold and / or silver, and / or The housing part (2) includes aluminum and / or magnesium and / or steel and / or plastic material characterized in that The housing (1) according to claim 1.

6. An adhesive material is provided between the heat spreader part (5) and the inner surface (9) of the housing part (2), and the adhesive material connects the heat spreader part (5) to the inner surface (9) of the housing part (2), and / or At least one mechanical fastener for connecting the heat spreader part (5) to the inner surface (9) of the housing part (2) is provided characterized in that The housing (1) according to claim 1.

7. In an electronic device (11, 12) comprising at least one electronic circuit (3, 4) including an electronic component (4) and a housing (1) for the at least one electronic circuit (3, 4), The housing (1) is designed according to claim 1, and the heat spreader part (5) is connected to the electronic component (4) in the contact area characterized in that Electronic device (11, 12).

8. A thermal paste (6) for connecting the heat spreader part (5) to the electronic component (4) is provided in the contact area characterized in that The electronic device (11, 12) according to claim 7.

9. Designed for use in or on an automobile (10) characterized in that The electronic device (11, 12) according to claim 7.

10. It is an electronic control unit of the automobile (10) characterized in that The electronic device (11, 12) according to claim 9.

11. It is part of the sensor system of the motor vehicle (10), in particular an in-vehicle camera characterized in that the electronic device (11, 12) according to claim 9.

12. A motor vehicle (10) comprising the electronic device (11, 12) according to claim 7.

13. A method for manufacturing an electronic device (11, 12), the method comprising providing at least one electronic circuit (3, 4) for the electronic device (11, 12) and providing a housing (1) having a housing part (2) with an inner surface (9), a heat spreader component (5) is provided and is connected to the inner surface (9) of the housing part (2), the heat spreader component (5) comprising a material having a higher thermal conductivity than the thermal conductivity of the housing part (2), a contact area of the heat spreader component (5) is connected to an electronic component (4) of the at least one electronic circuit (3, 4), the heat spreader component (5) comprises a grid structure (7, 8) made of the material characterized in that method.

14. the heat spreader component (5) is connected to the inner surface (9) of the housing part (2) by an adhesive material and / or by at least one mechanical fastener, and / or the contact area is connected to the electronic component (4) by a thermal paste (6) characterized in that the method according to claim 13.

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