Coil component and filter circuit including the same

Abstract

The present disclosure relates to a coil component (100) comprising an insulator (3) that has a pair of main surfaces facing mutually opposite directions, two or more first conductors (10a-10c) that form a first coil, and three or more second conductors (20a-20c) that form a second coil. The first and second conductors are layered parallel to the pair of main surfaces of the insulator. A first coil (L1) and a second coil (L2) are arranged such that winding axes thereof face a direction normal to the pair of main surfaces. Openings in each of the first coil (L1) and the second coil (L2) at least partially overlap one another. The insulator (3) is provided with a first layered part (11) and a second layered part (21), the first layered part (11) including a portion in which two or more of the second conductors (20a, 20b) are adjacently layered in a layering direction with respect to a first conductor (10a), and the second layered part (21) including a portion in which a first conductor (10c) and a second conductor (20c) are adjacently layered in the layering direction. The distance (d1) between a conductor (20b) that is included in the first layered part (11) and is positioned at a layer on a second-layered-part (21) side among the first conductors (10) and the second conductors (20), and a conductor (10b) that is included in the second layered part (21) and is positioned at a layer on a first-layered-part (11) side among the first conductors (10) and the second conductors (20) is greater than both the distance (d2) between adjacent conductors within the first layered part (11) and the distance (d2) between adjacent conductors within the second layered part (21).

Description

Technical Field

[0001] The present disclosure relates to a coil component and a filter circuit including the same.

Background Art

[0002] In electronic devices, noise countermeasures are taken using a filter circuit including a coil component. Generally, since a capacitor, which is a capacitance element, is used in a filter circuit, the noise suppression effect is reduced by the equivalent series inductance (ESL) which is the parasitic inductance of the capacitor. A coil component having a function of canceling the equivalent series inductance ESL of such a capacitor is known.

[0003] Japanese Unexamined Patent Application Publication No. 2020-31118 (Patent Document 1) discloses a common-mode noise filter including a first coil including a first spiral conductor and a second spiral conductor, and a second coil including a third spiral conductor and a fourth spiral conductor.

[0004] In the common-mode noise filter described in Patent Document 1, the second coil is sandwiched between the first spiral conductor and the second spiral conductor constituting the first coil, and the distance between the third spiral conductor and the fourth spiral conductor constituting the second coil is smaller than the distance between the first spiral conductor and the third spiral conductor and the distance between the second spiral conductor and the fourth spiral conductor.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In the common mode noise filter described in Patent Document 1, a wide gap is provided between the first spiral conductor constituting the first coil and the third spiral conductor constituting the second coil, and between the second spiral conductor constituting the first coil and the fourth spiral conductor constituting the second coil.

[0007] Therefore, according to the common mode noise filter described in Patent Document 1, although the parasitic capacitance can be reduced, there is a possibility that the magnetic coupling force between the first coil and the second coil may be weakened.

[0008] An object of the present disclosure is to provide a coil component capable of improving the magnetic coupling force between a first coil and a second coil while reducing the parasitic capacitance, and a filter circuit including the same.

Means for Solving the Problems

[0009] A coil component according to an aspect of the present disclosure includes an insulator having a pair of main surfaces facing each other, two or more first conductors forming a first coil, and three or more second conductors forming a second coil. The first conductors and the second conductors are laminated in parallel with the pair of main surfaces of the insulator. The first coil and the second coil are arranged such that the winding axes face in the normal direction with respect to the pair of main surfaces. At least a part of the openings of the first coil and the second coil overlap. The insulator includes a first laminated portion and a second laminated portion. The first laminated portion includes a portion where two or more second conductors are laminated adjacent to the first conductor in the lamination direction. The second laminated portion includes a portion where the first conductor and the second conductor are laminated adjacent to each other in the lamination direction. The distance between the conductor disposed in the layer on the second laminated portion side among the first conductors and the second conductors included in the first laminated portion and the conductor disposed in the layer on the first laminated portion side among the first conductors and the second conductors included in the second laminated portion is farther than the distance between adjacent conductors in the first laminated portion and the distance between adjacent conductors in the second laminated portion.

[0010] A filter circuit according to an aspect of the present disclosure includes the above-described coil component and a capacitor connected to the coil component.

Advantages of the Invention

[0011] According to one aspect of the present disclosure, it is possible to provide a coil component capable of improving the magnetic coupling force between a first coil and a second coil while reducing parasitic capacitance, and a filter circuit including the same.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Embodiments for Carrying Out the Invention

[0013] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and their description will not be repeated.

[0014] FIG. 1 is a perspective view of the coil component 100 according to the present embodiment. FIG. 2 is a plan view of the coil component 100 according to the present embodiment. FIG. 3 is a perspective view for explaining the wiring pattern of the coil component 100 according to the present embodiment. FIG. 4 is a plan view of the coils L1 and L2 included in the coil component 100 according to the present embodiment.

[0015] In FIGS. 1 to 4, the long side direction of the coil component 100 is defined as the X direction, the short side direction is defined as the Y direction, and the height direction is defined as the Z direction.

[0016] The coil component 100 includes a coil L1 and a coil L2. The coil component 100 is composed of a laminate (insulator) 3 of ceramic layers. A substrate (ceramic green sheet) on which wiring patterns of the coil L1 (first coil) and the coil L2 (second coil) are formed is laminated on the laminate 3. The lamination direction of the ceramic layers is the Z direction, and the direction of the arrow indicates the upper layer direction.

[0017] The laminate 3 has a pair of main surfaces facing each other and a plurality of side surfaces connecting the pair of main surfaces. Hereinafter, among the pair of main surfaces facing each other, the upper surface of the laminate 3 may be referred to as the "first main surface", the bottom surface may be referred to as the "second main surface", and the pair of main surfaces facing each other may be simply referred to as the "main surfaces".

[0018] Of the two side surfaces on the long side of the laminate 3, an electrode 4a (first electrode) is provided on one side surface (first side surface), and an electrode 4b (second electrode) is provided on the other side surface (second side surface). Of the two side surfaces on the short side, an electrode 4c (third electrode) is provided on one side surface (third side surface), and an electrode 4d (fourth electrode) is provided on the other side surface (fourth side surface). As shown in FIGS. 1 and 2, the electrodes 4a to 4d are provided so as to extend from the side surface of the laminate 3 to the first main surface and the second main surface.

[0019] As shown in FIGS. 1 to 3, the coils L1 and L2 are arranged such that the winding axes face in the direction normal to the main surface of the laminate 3, and the openings of the coils L1 and L2 overlap each other and are magnetically coupled. The coil L1 is composed of conductors 10a to 10c laminated in the Z-axis direction in the laminate 3. The coil L2 is composed of conductors 20a to 20c laminated in the Z-axis direction in the laminate 3. Thus, the coils L1 and L2 are composed of a plurality of conductors 10a to 10c and 20a to 20c laminated in parallel to the main surface of the laminate 3.

[0020] Hereinafter, the conductors 10a, 10b, and 10c constituting the coil L1 may be referred to as the conductor 10, and the conductors 20a, 20b, and 20c constituting the coil L2 may be referred to as the conductor 20. Further, the conductors 10 and 20 may be collectively referred to as the conductor (10, 20).

[0021] As shown in FIG. 1, between the conductor 10a and the conductor 10b constituting the coil L1, the conductors 20a and 20b among the conductors 20a to 20c constituting the coil L2 are laminated. The conductor 20c constituting the coil L2 is laminated at a position adjacent to the conductor 10c.

[0022] Referring to FIG. 3, the wiring patterns of the coils L1 and L2 will be described. The coils L1 and L2 are formed by the conductors 10 and 20 formed on six ceramic green sheets in the laminate 3. FIG. 3 shows the wiring patterns of the conductors 10 and 20 included in each of the six layers. Each wiring pattern is formed, for example, by screen-printing a conductive paste (Ni paste) on a ceramic green sheet that is a substrate.

[0023] The laminate 3 is thus formed by laminating a plurality of layers of a ceramic green sheet as the substrate. Each layer constituting the laminate 3 is made of the same material. Thus, since each layer of the laminate 3 is made of the same material, after the lamination process of the laminate 3 is completed, in the batch firing process, it is possible to prevent the laminate 3 from peeling or cracking due to differences in the coefficient of thermal expansion.

[0024] The coil L1 is composed of a conductor 10a disposed in the first layer, a conductor 10b disposed in the fourth layer, and a conductor 10c disposed in the fifth layer. The coil L2 is composed of a conductor 20a disposed in the second layer, a conductor 20b disposed in the third layer, and a conductor 20c disposed in the sixth layer.

[0025] The connection portion 63a of the conductor 10b and the connection portion 63b of the conductor 10c are connected by a via conductor 53. The connection portion 64a of the conductor 10b and the connection portion 64b of the conductor 10c are connected by a via conductor 54.

[0026] The connection portion 61a of the conductor 20a and the connection portion 61b of the conductor 20b are connected by a via conductor 51. The connection portion 62a of the conductor 20a and the connection portion 62b of the conductor 20b are connected by a via conductor 52.

[0027] Between the conductor 10a and the conductor 10b that form part of the coil L1, the conductors 20a and 20b that form part of the coil L2 are sandwiched. Further, between the conductors 20b and 20c that form part of the coil L2, the conductors 10b and 10c that form part of the coil L1 are sandwiched. Thus, in the laminate 3, the conductors 20 that form part of the coil L2 are sandwiched between a plurality of conductors 10 that form part of the coil L1, and the conductors 10 that form part of the coil L1 are sandwiched between a plurality of conductors 20 that form part of the coil L2.

[0028] The wiring patterns of conductor 10a and conductor 10b are common. The wiring patterns of conductor 20b and conductor 20c are common. The wiring patterns of conductor 20b and conductor 20c are the patterns obtained by turning over the wiring patterns of conductor 10a and conductor 10b. The wiring pattern of conductor 20a is the pattern obtained by turning over conductor 10c.

[0029] Conductors 10a - 10c and conductors 20a - 20c are laminated on the laminate 3 such that the virtual lines V1, V1 shown in FIG. 3 pass through the center of the openings of the coils L1, L2. Therefore, the coils L1 and L2 are arranged such that the openings face in the normal direction to the main surface of the laminate 3. Also, as shown in FIG. 2, when the laminate 3 is viewed from the normal direction to the main surface, the opening pattern of coil L1 and the opening pattern of coil L2 are common.

[0030] As shown in FIG. 4, when the laminate 3 is viewed from the normal direction to the main surface, each of the coils L1 and L2 has a single - loop coil shape. Further, as shown in FIG. 3, when the laminate 3 is viewed from the normal direction to the main surface, each of conductors 10a - 10c has the single - loop coil shape of coil L1, and each of conductors 20a - 20c has the single - loop coil shape of coil L2.

[0031] As shown in FIG. 1, the end 91a of conductor 10a and the end 91b of conductor 10b are connected to the electrode 4a. The end 93a of conductor 10a and the end 93c of conductor 10b are connected to the electrode 4c. The end 92a of conductor 20b and the end 92b of conductor 20c are connected to the electrode 4b. The end 93b of conductor 20b and the end 93d of conductor 20c are connected to the electrode 4c.

[0032] Coil L1 includes a conductor 10b formed by a first wiring pattern and a conductor 10c formed by a second wiring pattern. Coil L2 includes a conductor 20b formed by a third wiring pattern and a conductor 20a formed by a fourth wiring pattern. The conductor 10b formed by the first wiring pattern is connected to the electrode 4a at the end 91b and is connected to the electrode 4c at the end 93b. The conductor 10c formed by the second wiring pattern is connected to the conductor 10b formed by the first wiring pattern by via conductors 53 and 54. The conductor 20b formed by the third wiring pattern is connected to the electrode 4b at the end 92a and is connected to the electrode 4c at the end 93b. The conductor 20a formed by the fourth wiring pattern is connected to the conductor 20b formed by the third wiring pattern by via conductors 51 and 52.

[0033] The first end of coil L1 is formed by the end 91a of conductor 10a and the end 91b of conductor 10b. The second end of coil L1 is formed by the end 93a of conductor 10a and the end 93c of conductor 10b. The first end of coil L2 is formed by the end 92a of conductor 20b and the end 92b of conductor 20c. The second end of coil L2 is formed by the end 93b of conductor 20b and the end 93d of conductor 20c.

[0034] In the present embodiment, the connection point between coil L1 and coil L2 exists at the electrode 4c. In other words, in the present embodiment, the distance from the connection point between coil L1 and coil L2 to the electrode 4c is zero. Hereinafter, the connection point between coil L1 and coil L2 is also referred to as the "intermediate connection point".

[0035] As shown in FIGS. 1 and 2, when the laminate 3 is viewed from the normal direction to the main surface, the ends 93a and 93c of coil L1 and the ends 93b and 93d of coil L2 are arranged at positions overlapping each other.

[0036] The electrode 4c includes the intermediate connection point between the coil L1 and the coil L2. As shown in FIG. 4, when a voltage is applied to the electrode 4a, the current flowing in from the electrode 4a (In) flows from the ends 91a and 91b of the coil L1 to the ends 93a and 93c and reaches the electrode 4c, and then flows into the ends 93b and 93d of the coil L1 via the electrode 4c. The current flowing into the ends 93b and 93d of the coil L2 flows to the ends 92a and 92b of the coil L2 and reaches the electrode 4b (Out). In this case, the electrode 4a functions as an In terminal, the electrode 4b functions as an Out terminal, and the electrode 4c functions as an intermediate connection terminal.

[0037] As shown in FIG. 3, in the present embodiment, the vicinity of both ends of the conductors 10b and 10c are connected by via conductors 53 and 54, and the vicinity of both ends of the conductors 20a and 20b are connected by via conductors 51 and 52. Thereby, a parallel circuit of the conductors 10b and 10c and a parallel circuit of the conductors 20a and 20b are configured.

[0038] In the coil component 100, in the conductors 10a to 10c and the conductors 20a to 20c laminated in a plurality of layers, current flows through the parallel circuit. Therefore, the coil component 100 can handle a large current.

[0039] In the present embodiment, by connecting the conductor 10b and the conductor 10c by the via conductors 53 and 54, the conductor 10c is electrically connected to the electrodes 4a and 4c via the via conductors 53 and 54 and the conductor 10b (see FIGS. 1 and 3). Thereby, in order to electrically connect the conductor 10c to the electrodes 4a and 4c, it is not necessary to draw out both ends of the conductor 10c like the conductor 10b and connect them to the electrodes 4a and 4c.

[0040] Similarly, in the present embodiment, by connecting the conductor 20a and the conductor 20b by the via conductors 51 and 52, the conductor 20a is electrically connected to the electrodes 4b and 4c via the via conductors 51 and 52 and the conductor 20b (see FIGS. 1 and 3). Thereby, in order to electrically connect the conductor 20a to the electrodes 4b and 4c, it is not necessary to draw out both ends of the conductor 20a like the conductor 20b and connect them to the electrodes 4a and 4c.

[0041] Both ends of the conductor 10c may be drawn out and connected to the electrodes 4a and 4c. Similarly, both ends of the conductor 20a may be drawn out and connected to the electrodes 4a and 4c. In this case, the via conductors 51 to 54 become unnecessary. In this case, the number of ends of the conductors (10, 20) that need to be provided with respect to the electrodes 4a to 4c increases. Thus, when the conductors (10, 20) are stacked and pressed in the laminate 3, the ends may be close to each other and the laminate 3 may be easily peeled off.

[0042] Therefore, in the present embodiment, the conductor 10b and the conductor 10c are connected by the via conductors 53 and 54, and the conductor 20a and the conductor 20b are connected by the via conductors 51 and 52. Thereby, the number of ends of the conductors (10, 20) that need to be provided with respect to the electrodes 4a to 4c can be reduced. As a result, it is possible to prevent the laminate 3 from being peeled off in the manufacturing process of the laminate 3. Of course, if peeling is unlikely to occur during manufacturing, both ends of the conductor 10c may be connected to the electrodes 4a and 4c, and both ends of the conductor 20a may be connected to the electrodes 4a and 4c.

[0043] FIG. 5 is a perspective side view of the coil component 100 according to the present embodiment. FIG. 6 is a conceptual diagram for explaining the stacking order of the conductors 10 and 20 in the laminate 3.

[0044] FIG. 6 is a simplified drawing of the side view shown in FIG. 5 from the viewpoint of conceptually explaining the stacking order of the conductors 10 and 20 in the laminate 3. Therefore, in FIG. 5, the connection locations of the conductors 10 and 20 to the electrodes 4c and 4d and the illustration of the via conductors 51 to 54 are omitted.

[0045] In the laminate 3, there are a laminated portion 11 and a laminated portion 21 formed by a combination of conductors 10 and 20. The laminated portion 11 includes a conductor 10a that forms part of the coil L1 and conductors 20a and 20b that form part of the coil L2. The laminated portion 21 includes conductors 10b and 10c that form part of the coil L1 and a conductor 20c that forms part of the coil L2. Thus, the laminate 3 includes a laminated portion 11 (first laminated portion) and a laminated portion 21 (second laminated portion) in which two or more conductors (10, 20) are laminated.

[0046] As shown in FIG. 5, in the laminated portion 11, the conductor 20a and the conductor 20b are connected by via conductors 51 and 52. In the laminated portion 21, the conductor 10b and the conductor 10c are connected by via conductors 53 and 54.

[0047] As shown in FIGS. 5 and 6, both the laminated portion 11 and the laminated portion 21 include conductors (10, 20) laminated over three layers. The conductors 10 and 20 are arranged such that each of the laminated portion 11 and the laminated portion 21 includes a conductor 10 that forms part of the coil L1 and a conductor 20 that forms part of the coil L2. Thereby, in both the laminated portion 11 and the laminated portion 21, the coupling force of the mutual inductance between the coil L1 and the coil L2 can be enhanced.

[0048] In particular, in the present embodiment, a conductor 10a that forms part of the coil L1 is disposed in the uppermost layer of the laminated portion 11, and a conductor 20c that forms part of the coil L2 is disposed in the lowermost layer of the laminated portion 21.

[0049] The laminated portion 11 includes a portion where two or more conductors 20 (20a, 20b) are laminated adjacent to the conductor 10 (10a) in the lamination direction, and the laminated portion 21 includes a portion where the conductor 10 (10c) and the conductor 20 (20c) are laminated adjacent to each other in the lamination direction. The laminated portion 21 includes a portion where three conductors (10b, 10c, 20c) including the conductor 10 and the conductor 20 are laminated adjacent to each other in the lamination direction.

[0050] The distance d1 between the conductor 20b disposed in the layer on the laminated portion 21 side among the conductors 10 and 20 included in the laminated portion 11 and the conductor 10b disposed in the layer on the laminated portion 11 side among the conductors 10 and 20 included in the laminated portion 21 is farther than the distance d2 between the adjacent conductors (10, 20) within the laminated portion 11 and the distance d2 between the adjacent conductors (10, 20) within the laminated portion 21.

[0051] In the present embodiment, the distance between the laminated portion 11 and the laminated portion 21 is widened so that d1 becomes wider than d2. More specifically, while making the distance (d2) between the conductors (10, 20) as narrow as possible, with respect to the space between the laminated portion 11 and the laminated portion 21, the distance (d1) is made as far apart as possible while taking into account the magnetic coupling force.

[0052] Thereby, it is possible to provide a coil component 100 capable of improving the magnetic coupling force between the coil L1 and the coil L2 while reducing the parasitic capacitance that may occur between the laminated portion 11 and the laminated portion 21.

[0053] Here, the laminated body 3 in which the distance between the adjacent conductors (10, 20) within the laminated portion 11 and the distance between the adjacent conductors (10, 20) within the laminated portion 21 are both adjusted to d2 is exemplified.

[0054] However, if the distance between the adjacent conductors (10, 20) within the laminated portion 11 and the distance between the adjacent conductors (10, 20) within the laminated portion 21 are shorter than d1, the distance between the adjacent conductors (10, 20) within the laminated portion 11 and the distance between the adjacent conductors (10, 20) within the laminated portion 21 may be different.

[0055] The distances between the adjacent conductors (10, 20) within the layer portion 11 do not have to be the same. For example, the distance between the conductor 10a and the conductor 20a and the distance between the conductor 20a and the conductor 20b may be made different. Similarly, the distance between the conductor 10b and the conductor 10c and the distance between the conductor 10c and the conductor 20c may be made different.

[0056] In this way, by designing the intervals between the conductors 10 and 20 in various ways, the magnetic coupling force between the coils L1 and 2 can be finely adjusted. For example, when the interval between the two conductors 10b and 10c is shortened, the magnetic coupling force between the conductors 10b and 10c increases. As a result, the self-inductance of the coil L1 can be enhanced.

[0057] Here, for example, when the coils L1 and L2 are grouped one by one layer, and three groups are created and the intervals at two locations are widened, compared with this, as in this embodiment, by laminating a part of the coil L1 or the coil L2 in two layers to form two groups, the parasitic capacitance generated to obtain the same M can be reduced.

[0058] Here, referring to FIG. 7, as an example of a circuit to which the coil component 100 according to this embodiment is applied, the filter circuit 1 will be described. FIG. 7 is a circuit diagram of the filter circuit 1 including the coil component 100 according to this embodiment.

[0059] The filter circuit 1 is, for example, an EMI removal filter and is a third-order T-type LC filter circuit. The coil component 100 is used in this filter circuit 1. In the following embodiments, although the third-order T-type LC filter circuit is used for the description of the configuration of the filter circuit 1, the coil component 100 having the same configuration can also be applied to a fifth-order T-type LC filter circuit or a higher-order T-type LC filter circuit.

[0060] As shown in FIG. 7, the filter circuit 1 to which the coil component 100 is applied includes a capacitor C1. The coil component 100 includes a capacitor C due to the parasitic capacitance generated in the coils L1 and L2 that are connected in parallel to the coil L1 and the coil L2. When there is a capacitor C in parallel with such coils L1 and L2, the high-frequency band noise that is originally supposed to be removed through the capacitor C1 described later will pass through the capacitor C, resulting in insufficient noise removal. Therefore, it is desirable to suppress such a capacitor C as much as possible.

[0061] Capacitor C1 is connected to the coil component 100. One end of capacitor C1 is connected to the electrode 4c formed at the intermediate connection point of coil L1 and coil L2, and the other end is connected to the GND wiring. Capacitor C1 is composed of, for example, a multilayer ceramic capacitor with BaTiO3 (barium titanate) as the main component. As capacitor C1, a multilayer ceramic capacitor with other materials as the main component may be adopted. For example, as capacitor C1, other types of capacitors such as aluminum electrolytic capacitors may be adopted.

[0062] Capacitor C1 has an inductor L3 as parasitic inductance (equivalent series inductance (ESL)). As shown in FIG. 7, capacitor C1 is represented by a circuit configuration in which inductor L3 is connected in series with capacitor C1a. Note that capacitor C1 may be configured such that the parasitic resistance (equivalent series resistance (ESR)) is equivalent to a circuit configuration in which it is connected in series with inductor L3 and capacitor C1a.

[0063] Coil L1 and coil L2 are magnetically coupled, and a negative inductance component (-M) is generated in series with capacitor C1. This negative inductance component is shown as an inductor of -M in FIG. 7. This negative inductance component can cancel out the parasitic inductance (inductor L3) of capacitor C1. Thereby, the parasitic inductance component of capacitor C1 can be seemingly reduced. The filter circuit 1 composed of capacitor C1, coil L1, and coil L2 can improve the noise attenuation effect in the high-frequency band by canceling out the parasitic inductance of capacitor C1 with the negative inductance component due to the mutual inductance between coil L1 and coil L2.

[0064] In the present embodiment, the intermediate connection point between coil L1 and coil L2 exists at electrode 4c. In other words, in the present embodiment, no wiring pattern extending from the intermediate connection point between coil L1 and coil L2 to electrode 4c is provided on either coil L1 or coil L2. Therefore, compared with the conventional configuration in which a wiring pattern extending from the intermediate connection point between coil L1 and coil L2 to electrode 4c is provided, the distance of the wiring pattern does not vary in length due to manufacturing variations, thus preventing variations in the magnitude of the parasitic inductance component. Since the coil component 100 according to the present embodiment is not provided with an unnecessary wiring pattern that causes variations in the magnitude of the parasitic inductance component, there is no parasitic inductance component that depends on the wiring pattern.

[0065] Therefore, in the manufacture of the coil component 100, the labor and cost required to increase the accuracy to the limit in order to suppress such variations can be reduced. Thus, according to the present embodiment, it is possible to provide a coil component and a filter circuit including the same that can prevent variations in the magnitude of the parasitic inductance component.

[0066] Furthermore, when the coil component 100 is used as a component for removing noise from the power line and a current is passed from electrode 4a to electrode 4b, the current flowing inside the laminate 3 passes through the electrode 4c outside the laminate 3. At this time, compared with the conventional pattern in which the current continues to flow inside the laminate 3, the electrode 4c exhibits a heat dissipation function, and the heat generated by the current is dissipated at the electrode 4c. Therefore, according to the coil component 100, the heat dissipation effect can be enhanced.

[0067] Furthermore, in the coil component 100 according to the present embodiment, there is an effect that the procedure for inspecting the continuity of the electrodes 4a to 4c and the coils L1 and L2 can be simplified. In the case of a conventional coil component in which a wiring pattern extending from the intermediate connection point between the coils L1 and L2 to the electrode 4c is provided, simply testing the continuity between the electrodes 4a and 4b cannot confirm that there is no problem with the continuity between the intermediate connection point between the coils L1 and L2 and the electrode 4c. Since another wiring is provided between the intermediate connection point between the coils L1 and L2 and the electrode 4c, it is necessary to inspect the disconnection state of this other wiring and the connection state between this other wiring and the electrode 4c. For this reason, in the conventional structure, in order to confirm that there is no problem with the other wiring or the electrode 4c, in addition to the inspection between the electrodes 4a and 4b, it is necessary to perform a continuity inspection between the electrode 4a or 4b and the electrode 4c.

[0068] On the other hand, in the coil component 100 according to the present embodiment, the electrode 4c corresponding to the intermediate connection terminal functions as a conduction line that conducts the coils L1 and L2. For this reason, in the coil component 100, by inspecting the continuity between the electrodes 4a and 4b, it is possible to complete the continuity inspection of the electrodes 4a to 4c and the coils L1 and L2.

[0069] Furthermore, when the coil component 100 according to the present embodiment is used for applications such as removing noise from a power line, the electrodes 4a and 4b function as mounting terminals connected in series to the power line. That is, the electrodes 4a and 4b are constituted by the mounting terminals. In the coil component 100, since the electrodes 4a and 4b are provided on the long side of the laminate 3, the size of the mounting terminals can be increased as compared with the case where the electrodes 4a and 4b are provided on the short side of the laminate 3. As a result, when a current is passed through the power line, the heat generated at the mounting portion can be sufficiently dissipated by the electrode width.

[0070] In the coil component 100 according to the present embodiment, by arranging the end portions 91a and 91b of the coil L1 on the wide electrode 4a on the long side of the laminate 3 and arranging the end portions 92a and 92b of the coil L2 on the wide electrode 4b on the long side of the laminate 3, there is also an effect that a coil with a large opening can be formed by taking advantage of the distance from one end to the other end of the long side.

[0071] Moreover, the coil component 100 according to the present embodiment is not limited to this. For example, it may be square without long sides and short sides, or the coil may not be a substantially rectangular parallelepiped but may be circular or elliptical. By making it circular, there is no locally high current density in the conductor forming the coil, so a failure due to heat generation is less likely to occur even in applications where a large current flows.

[0072] <Modification Example 1> Next, Modification Example 1 applicable to the present embodiment will be described. FIG. 8 is a conceptual diagram showing Modification Example 1 regarding the lamination order of the conductors 10 and 20 in the laminate 301.

[0073] The laminate 301 according to Modification Example 1 corresponds to an example in which one conductor 10 is added to the uppermost layer of the lamination portion 11 of the laminate 3 and one conductor 10 is deleted from the lamination portion 21 of the laminate 3. In the laminate 301 according to Modification Example 1, the lamination portion 11 is composed of four layers of conductors 10 and 20, and the lamination portion 21 is composed of two layers of conductors 10 and 20.

[0074] In the laminate 301, similar to the laminate 3, the conductors 10 and 20 are arranged such that each of the lamination portion 11 and the lamination portion 21 includes the conductor 10 constituting a part of the coil L1 and the conductor 20 constituting a part of the coil L2. In the laminate 301, similar to the laminate 3, the conductor 10a constituting a part of the coil L1 is arranged on the uppermost layer of the lamination portion 11, and the conductor 20c constituting a part of the coil L2 is arranged on the lowermost layer of the lamination portion 21.

[0075] Also in the laminate 301 according to Modification 1, similar to the laminate 3, the distance between the laminated portion 11 and the laminated portion 21 is widened so that d1 is wider than d2. As a result, also in Modification 1, it is possible to improve the magnetic coupling force between the coil L1 and the coil L2 while reducing the parasitic capacitance that may occur between the laminated portion 11 and the laminated portion 21.

[0076] In the laminate 301 according to Modification 1, unlike the laminate 3, the number of layers of the laminated portion 11 and the number of layers of the laminated portion 21 are different. By thus making the number of layers of the laminated portion 11 and the number of layers of the laminated portion 21 different, it becomes possible to finely adjust the self-inductance values of the coils L1 and L2. As a result, it also becomes possible to finely adjust the mutual inductance of the coils L1 and L2.

[0077] <Modification 2> Next, Modification 2 applicable to the present embodiment will be described. FIG. 9 is a conceptual diagram showing Modification 2 regarding the lamination order of the conductors 10 and 20 in the laminate 302.

[0078] The laminate 302 according to Modification 2 corresponds to an example in which one conductor 10 is deleted from the laminated portion 21 of the laminate 3. The configuration of the laminated portion 11 of the laminate 302 is the same as the configuration of the laminated portion 11 of the laminate 3. In the laminate 302 according to Modification 2, the laminated portion 11 is composed of three layers of conductors 10 and 20, and the laminated portion 21 is composed of two layers of conductors 10 and 20.

[0079] In the laminate 302, similar to the laminate 3, the conductors 10 and 20 are arranged such that each of the laminated portion 11 and the laminated portion 21 includes the conductor 10 that constitutes a part of the coil L1 and the conductor 20 that constitutes a part of the coil L2. In the laminate 302, similar to the laminate 3, the conductor 10a that constitutes a part of the coil L1 is arranged in the uppermost layer of the laminated portion 11, and the conductor 20c that constitutes a part of the coil L2 is arranged in the lowermost layer of the laminated portion 21.

[0080] Also in the laminate 302 according to Modification 2, similar to the laminate 3, the distance between the stacked portion 11 and the stacked portion 21 is widened so that d1 is wider than d2. Thereby, also in Modification 2, it is possible to improve the magnetic coupling force between the coil L1 and the coil L2 while reducing the parasitic capacitance that can occur between the stacked portion 11 and the stacked portion 21.

[0081] Also in the laminate 303 according to Modification 2, similar to the laminate 302 related to Modification 1, the number of layers of the stacked portion 11 and the number of layers of the stacked portion 21 are different. By thus making the number of layers of the stacked portion 11 and the number of layers of the stacked portion 21 different, it becomes possible to finely adjust the value of the self-inductance of each of the coils L1 and L2. As a result, it also becomes possible to finely adjust the mutual inductance of the coils L1 and L2.

[0082] <Modification 3> Next, Modification 3 applicable to the present embodiment will be described. FIG. 10 is a conceptual diagram showing Modification 3 regarding the stacking order of the conductors 10 and 20 in the laminate 303.

[0083] The laminate 303 according to Modification 3 includes a stacked portion 11, a stacked portion 21, and a stacked portion 31 that include combinations of the conductors 10 and 20. The distance between the stacked portion 11 and the stacked portion 21 and the distance between the stacked portion 21 and the stacked portion 31 are each d1.

[0084] The distance between adjacent conductors (10, 20) in the stacked portion 11 according to Modification 3, the distance between adjacent conductors (10, 20) in the stacked portion 21, and the distance between adjacent conductors (10, 20) in the stacked portion 31 are all d2. Also in Modification 3, the relationship d1 > d2 holds.

[0085] The stacking structure of the laminate 303 according to Modification 3 corresponds to a structure in which a stacked portion is added between the stacked portion 11 and the stacked portion 21 in the laminate 3 of FIG. 6 described as the present embodiment.

[0086] In the laminate 303 according to Modification 3, in the lamination part 11, two conductors 20 (20a, 20b) are laminated adjacent to the conductor 10 (10a), and in the lamination part 21, there is a part where the conductor 10 (10c) and the conductor 20 (20c) are laminated adjacent to each other. The distance d1 between the lamination part 11 and the lamination part 21 is farther than the distance d2 between adjacent conductors (10, 20) in the lamination part 11 and the distance d2 between adjacent conductors (10, 20) in the lamination part 21.

[0087] In the laminate 303 according to Modification 3, in the lamination part 21, two conductors 20 (20c, 20d) are laminated adjacent to the conductor 10 (10c), and in the lamination part 31, there is a part where the conductor 10 (10e) and the conductor 20 (20e) are laminated adjacent to each other. The distance d1 between the lamination part 21 and the lamination part 31 is farther than the distance d2 between adjacent conductors (10, 20) in the lamination part 11 and the distance d2 between adjacent conductors (10, 20) in the lamination part 21.

[0088] It may be configured by conductors (10, 20) in which four or more lamination parts are laminated like the lamination part 21 according to Modification 3. Also, if the distance between adjacent conductors (10, 20) in the lamination part 11, the distance between adjacent conductors (10, 20) in the lamination part 21, and the distance between adjacent conductors (10, 20) in the lamination part 31 are shorter than d1, they may be designed to have any distance. Also, the distance between adjacent conductors of the lamination part 11 and the lamination part 21 and the distance between adjacent conductors of the lamination part 21 and the lamination part 31 do not have to be the same d1, and any distance longer than the distance between conductors in each lamination part is acceptable.

[0089] Also in the laminate 302 according to Modification 3, similar to the laminate 3, the distances between the lamination part 11 and the lamination part 21 and between the lamination part 21 and the lamination part 31 are widened so that d1 is wider than d2. Thereby, while reducing the parasitic capacitance that may occur between the lamination part 11 and the lamination part 21 and the parasitic capacitance that may occur between the lamination part 21 and the lamination part 31, it is possible to improve the magnetic coupling force between the coil L1 and the coil L2.

[0090] <Modification 4> Next, a fourth modification applicable to the present embodiment will be described. FIG. 11 is a conceptual diagram showing a fourth modification regarding the stacking order of the conductors 10 and 20 in the laminate 304.

[0091] The laminate 304 according to the fourth modification corresponds to an example in which one conductor 10 is added to the uppermost layer of the stacking portion 11 of the laminate 3, and one conductor 20 is added to the lowermost layer of the stacking portion 21 of the laminate 3. In the laminate 304 according to the fourth modification, both the stacking portion 11 and the stacking portion 21 are composed of four layers of conductors 10 and 20. In the laminate 304, the conductors 10a and 10b and the conductors 20a and 20b are stacked in the stacking portion 11, and the conductors 10c and 10d and the conductors 20c and 20d are stacked in the stacking portion 21.

[0092] In the laminate 304 according to the fourth modification, the stacking pattern of the conductors 10 and 20 in the stacking portion 11 and the stacking pattern of the conductors 10 and 20 in the stacking portion 21 are common. That is, in the laminate 304 according to the fourth modification, the conductor 10 is stacked in the upper two layers and the conductor 20 is stacked in the lower two layers in both the stacking portion 11 and the stacking portion 21.

[0093] As described above, in the fourth modification, the stacking order of the conductors 10 and 20 in the stacking portion 11 and the stacking order of the conductors 10 and 20 in the stacking portion 21 are the same. In this way, by making the stacking order of the conductors 10 and 20 in the plurality of stacking portions 11 and 21 common, the occurrence rate of manufacturing defects can be reduced.

[0094] The first to fourth modifications have been described in order above. The case where the maximum number of consecutive stacks of the conductor 10 or the conductor 20 is 2 has been described as the stacking portions 11 and 21 of the first to fourth modifications. However, the conductor 10 or the conductor 20 may be stacked so that the maximum number of consecutive stacks of the conductor 10 or the conductor 20 is 3 or more. For example, in the first modification shown in FIG. 8, a conductor 20 may be additionally arranged under the lowermost layer conductor 20 (20b) in the stacking portion 11. In the third modification shown in FIG. 10, a conductor 20 may be additionally arranged under the lowermost layer conductor 20 in each of the stacking portions 11, 21, and 31.

[0095] In the present disclosure, an example in which the conductor (10, 20) of the lowermost layer of the stacked portion 11 is different from the conductor (10, 20) of the uppermost layer of the stacked portion 21 has been described. For example, the conductor 20 is arranged in the lowermost layer of the stacked portion 11 shown in FIG. 6, and the conductor 10 is arranged in the uppermost layer of the stacked portion 21 shown in FIG. 6. However, the conductor 10 (or the conductor 20) may be arranged in either the lowermost layer of the stacked portion 11 or the uppermost layer of the stacked portion 21.

[0096] In the present disclosure, an example in which each of the coils L1 and L2 forms a single loop, each of the conductors 10a to 10c forms a single loop of the coil L1, and each of the conductors 20a to 20c forms a single loop of the coil L2 has been described. However, at least one of the coils L1 and L2 may be formed in a spiral loop pattern. Also, a single loop of the coil L1 may be formed by connecting the conductors 10a to 10c in series, and a single loop of the coil L2 may be formed by connecting the conductors 20a to 20c in series.

[0097] [Aspect] Hereinafter, aspects of the present disclosure will be listed.

[0098] (1) The coil component according to claim 1 includes an insulator having a pair of main surfaces facing each other, two or more first conductors forming a first coil, and three or more second conductors forming a second coil. The first conductors and the second conductors are laminated in parallel with the pair of main surfaces of the insulator. The first coil and the second coil are formed by three or more of the second conductors among the first coil and the plurality of conductors. The first coil and the second coil are arranged such that the winding axis faces in the normal direction with respect to the pair of main surfaces. At least a part of the openings of the first coil and the second coil overlap. The insulator includes a first laminated portion and a second laminated portion. The first laminated portion includes a portion where two or more second conductors are laminated adjacent to the first conductor in the lamination direction. The second laminated portion includes a portion where the first conductor and the second conductor are laminated adjacent to each other in the lamination direction. The distance between the conductor disposed in the layer on the second laminated portion side among the first conductors and the second conductors included in the first laminated portion and the conductor disposed in the layer on the first laminated portion side among the first conductors and the second conductors included in the second laminated portion is greater than the distance between adjacent conductors in the first laminated portion and the distance between adjacent conductors in the second laminated portion.

[0099] (2) In the coil component according to claim 1, the second laminated portion includes a portion where three conductors including the first conductor and the second conductor are laminated adjacent to each other in the lamination direction.

[0100] (3) In the coil component according to claim 1 or 2, when the insulator is viewed from the normal direction, each of the first coil and the second coil has a single-loop coil shape.

[0101] (4) In the coil component according to claim 3, when the insulator is viewed from the normal direction, each of the two or more first conductors has the single-loop coil shape of the first coil, and when the insulator is viewed from the normal direction, each of the three or more second conductors has the single-loop coil shape of the second coil.

[0102] (Item 5) In the coil component according to any one of Items 1 to 4, the lamination order of the first conductor and the second conductor in the first lamination part is the same as the lamination order of the first conductor and the second conductor in the second lamination part.

[0103] (Item 6) In the coil component according to any one of Items 1 to 5, the coil component further includes a plurality of electrodes provided on the insulator. The insulator has a plurality of side surfaces connecting between a pair of main surfaces. The plurality of side surfaces include a first side surface, a second side surface, and a third side surface. The plurality of electrodes include a first electrode provided on the first side surface, a second electrode provided on the second side surface, and a third electrode provided on the third side surface. The first coil includes a first conductor formed by a first wiring pattern and a first conductor formed by a second wiring pattern. The second coil includes a second conductor formed by a third wiring pattern and a second conductor formed by a fourth wiring pattern. The first conductor formed by the first wiring pattern is connected to the first electrode and the third electrode. The first conductor formed by the second wiring pattern is connected to the first conductor formed by the first wiring pattern by a first via conductor. The second conductor formed by the third wiring pattern is connected to the second electrode and the third electrode. The second conductor formed by the fourth wiring pattern is connected to the second conductor formed by the third wiring pattern by a second via conductor.

[0104] (Item 7) The filter circuit according to Item 7 includes the coil component according to any one of Items 1 to 6 and a capacitor connected to the coil component.

[0105] The embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. The scope of the present invention is shown not by the above description but by the scope of claims, and it is intended that all modifications within the meaning and scope equivalent to the scope of claims are included.

Explanation of Reference Numerals

[0106] 1 Filter circuit, 3,301 - 304 Insulators, 4a, 4b, 4c, 4d Electrodes, 10a - 10e, 20a - 20d Conductors, 11 First stacked portion, 21 Second stacked portion, 31 Second stacked portion, 51 - 54 Via conductors, 61a, 61b, 62a, 62b, 63a, 63b, 64a, 64b Connection parts, 91a, 91b, 92a, 92b, 93a, 93b Ends, 100 Coil component, C1 Capacitor, L1, L2 Coils.

Claims

1. An insulator having a pair of main surfaces facing each other, Two or more first conductors forming a first coil, Three or more second conductors forming a second coil, and The first conductor and the second conductor are laminated in parallel to the pair of main surfaces of the insulator, The first coil and the second coil are arranged such that the winding axes face in the normal direction to the pair of main surfaces, and at least a part of the openings of the first coil and the second coil overlap each other, The insulator includes a first laminated portion and a second laminated portion, The first laminated portion includes a portion where two or more of the second conductors are laminated adjacent to the first conductor in the lamination direction, The second laminated portion includes a portion where the first conductor and the second conductor are laminated adjacent to each other in the lamination direction, The distance between the conductor arranged in the layer on the second laminated portion side among the first conductor and the second conductor included in the first laminated portion and the conductor arranged in the layer on the first laminated portion side among the first conductor and the second conductor included in the second laminated portion is farther than the distance between adjacent conductors in the first laminated portion and the distance between adjacent conductors in the second laminated portion. A coil component.

2. The coil component according to claim 1, wherein the second laminated portion includes a portion where three conductors including the first conductor and the second conductor are laminated adjacent to each other in the lamination direction.

3. When the insulator is viewed from the normal direction, each of the first coil and the second coil has a single-loop coil shape. The coil component according to claim 1 or claim 2.

4. When the insulator is viewed from the normal direction, each of the two or more first conductors has the single-loop coil shape of the first coil, The coil component according to claim 3, wherein when the insulator is viewed from the normal direction, each of the three or more second conductors has the coil shape of the single loop of the second coil.

5. The coil component according to claim 1 or claim 2, wherein the lamination order of the first conductor and the second conductor in the first lamination part is the same as the lamination order of the first conductor and the second conductor in the second lamination part.

6. Further comprising a plurality of electrodes provided on the insulator, The insulator has a plurality of side surfaces connecting between the pair of main surfaces, The plurality of side surfaces include a first side surface, a second side surface, and a third side surface, The plurality of electrodes include a first electrode provided on the first side surface, a second electrode provided on the second side surface, and a third electrode provided on the third side surface, The first coil includes the first conductor formed by the first wiring pattern and the first conductor formed by the second wiring pattern, The second coil includes the second conductor formed by the third wiring pattern and the second conductor formed by the fourth wiring pattern, The first conductor formed by the first wiring pattern is connected to the first electrode and the third electrode, The first conductor formed by the second wiring pattern is connected to the first conductor formed by the first wiring pattern by a first via conductor, The second conductor formed by the third wiring pattern is connected to the second electrode and the third electrode, The coil component according to claim 1 or claim 2, wherein the second conductor formed by the fourth wiring pattern is connected to the second conductor formed by the third wiring pattern by a second via conductor.

7. The coil component according to claim 1 or claim 2, and A filter circuit comprising a capacitor connected to the coil component.

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