Circuit Board Fixing Device for Camera Module and Camera Module

Abstract

To provide a device for fixing a camera module circuit board.SOLUTION: A device for fixing a camera module circuit board is provided, comprising: a base portion; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side opposite the one side of each of the plurality of boards. A plurality of first fixing parts extend in a first direction from the base portion, and include a plurality of protrusions protruding in a direction perpendicular to the first direction in order to support one side of each of the plurality of boards. A plurality of second fixing parts extend in the first direction from the base portion, and include a plurality of protrusions for supporting the other side of each of the plurality of boards.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] This embodiment relates to a circuit board fixing device for a camera module and a camera module including the same.

[0002] This embodiment relates to a camera module having a structure capable of preventing image quality degradation and electromagnetic stability (Electro Magnetic Compatibility, EMC) degradation due to static electricity.

Background Art

[0003] The content described below only provides background information for this embodiment and does not describe the prior art.

[0004] Recently, not only small IT devices such as smartphones, tablet PCs, and game consoles, but also vehicles are equipped with camera modules for driving records and parking convenience.

[0005] In recent years, camera modules mounted on vehicles perform various additional functions in addition to the function of displaying images. As a result, various elements are mounted on the camera module together with the image sensor, and the size of the circuit board used in the camera module is gradually increasing.

[0006] However, since the size of the camera module is limited, in order to satisfy both the limited size of the camera module and the required area of the circuit board in recent years, a technology for laminating a plurality of circuit boards with small sizes inside the camera module has been developed.

[0007] Korean Patent Publication No. 10-2010-0048101, "Automobile Camera Module" (published on May 11, 2010), discloses a technology in which a plurality of circuit boards are laminated inside the camera module, and each circuit board is coupled to the housing by fastening screws.

[0008] However, in the automotive camera module, since the circuit board is coupled to the housing by fastening screws, problems such as an increase in the number of assembly steps due to the fastening screws, an increase in production cost due to the fastening screws, a decrease in the component mounting area of the circuit board due to the fastening screws, resulting in the use of more circuit boards, and warping of the circuit board due to screw fastening may occur.

[0009] On the other hand, camera modules for various applications can be mounted on automobiles. For example, when parking an automobile, a camera module capable of securing a rear view can be mounted on the rear side of the automobile.

[0010] Furthermore, in the case of an automotive black box that is very useful for tracking the course of an accident and the cause of the accident when an accident occurs in recent years, a camera module can also be used. Furthermore, the use of a camera module as a recognition device for clearly and easily grasping the situation of blind spots that are difficult for the driver or passengers of an automobile to visually confirm is also gradually increasing.

[0011] In recent years, the production of automobiles equipped with so-called smart cars, that is, collision warning systems that can detect the possibility of collisions on the front and rear sides during the running of the automobile in advance and prepare for them, and collision avoidance systems that can directly avoid inter-vehicle collisions during the running of the automobile by a control device mounted on the automobile without depending on the driver's driving, has been increasing, and the development of related technologies has been increasing.

[0012] As the use of camera modules as external situation recognition means for such smart cars is increasing, the production and technological development of automotive camera modules also tend to increase.

Summary of the Invention

Problems to be Solved by the Invention

[0013] This embodiment provides a circuit board fixing device for a camera module and a camera module including the same, which firmly fix the circuit board inside the housing without using fastening screws when fixing the circuit board in the housing, thereby preventing an increase in the number of assembly steps, reducing production costs, preventing a reduction in the component mounting area of the circuit board, and preventing warping of the circuit board.

[0014] Furthermore, this embodiment relates to a camera module having a structure capable of preventing image quality degradation and a decrease in electromagnetic stability (Electro Magnetic Compatibility, EMC) due to static electricity.

[0015] The technical problems to be solved by this embodiment are not limited to the technical problems mentioned above. Other technical problems not mentioned should be clearly understood by those skilled in the art in the technical field to which the embodiment belongs from the following description.

Means for Solving the Problems

[0016] The circuit board fixing device for a camera module of this embodiment includes a base portion and a fixing unit including a first fixing portion that supports one side of each of a plurality of circuit boards and a second fixing portion that supports the other side facing the one side of each of the plurality of circuit boards. The first fixing portion includes a plurality of protrusions that extend from the base portion in a first direction and protrude in a direction perpendicular to the first direction to support one side of each of the plurality of circuit boards. The second fixing portion can include a plurality of protrusions that extend from the base in the first direction to support the other side of each of the plurality of circuit boards.

[0017] The first fixing portion is arranged to extend from opposite corner portions of the base portion, and the protrusions of the first fixing portion can be formed by bending a portion protruding from the side surface of the first fixing portion.

[0018] A pair of the first fixing portions are arranged on the base portion to face each other, and the protrusions of the first fixing portion can be formed to protrude into the internal space where the circuit board is mounted.

[0019] The protruding length of the protruding portion of the first fixing portion can decrease as it moves away from the base portion.

[0020] The second fixing portion is formed to extend in a first direction from mutually parallel sides of the base portion, and the protruding portion of the second fixing portion can protrude toward an internal space in which the substrate is mounted to support the other side of the substrate.

[0021] The second fixing portion can have a step formed between the protruding portions of the second fixing portion.

[0022] The first fixing portion is formed with a first width, and the second fixing portion can be formed with a second width narrower than the first width.

[0023] The plurality of substrates can include a rigid circuit board in which a plurality are stacked so as to face each other vertically, and a flexible circuit board that electrically connects the rigid circuit boards to each other.

[0024] Escape grooves having different sizes can be respectively formed in the substrate to prevent interference with at least some of the protruding portions of the protruding portions of the first fixing portion.

[0025] The camera module of this embodiment includes a fixing unit including a first fixing part that supports one side of each of a base part and a plurality of substrates and a second fixing part that supports the other side of each of the plurality of substrates, an image sensor mounted on the substrate disposed at the uppermost part among the substrates, a lens disposed on a path of light flowing into the image sensor, a lens barrel that fixes the lens, the fixing unit, and a housing that houses the image sensor and the lens. The first fixing part includes a plurality of protrusions that extend from the base part in a first direction and protrude in a direction perpendicular to the first direction to support one side of the plurality of circuit boards respectively. The second fixing part may include a plurality of protrusions that extend from the base in the first direction and contact the other side of the circuit board that faces the one side.

[0026] The camera module of this embodiment may include a lens unit, a hollow front body that houses the lens unit in an internal space, a substrate part disposed at a rear side of the front body and provided with a plurality of printed circuit boards, a first fence that is coupled to the substrate part and separates the plurality of printed circuit boards from each other in an optical axis direction, a second fence that is coupled to the first fence at a rear side of the first fence, and a finger that electrically connects the substrate part and the second fence.

[0027] The plurality of printed circuit boards may include a first substrate disposed to face the lens unit, a third substrate disposed spaced apart from the first substrate in the optical axis direction, and a second substrate disposed between the first substrate and the third substrate and spaced apart from each of the first substrate and the third substrate.

[0028] The finger may electrically connect the second fence and the third substrate.

[0029] The finger includes a substrate coupling portion that couples to the third substrate, and an elastic deformation portion that extends from the substrate coupling portion and is elastically deformed. By pressing the elastic deformation portion with the second fence, the second fence and the third substrate can be electrically connected to each other.

[0030] The second fence may include a pressing portion that protrudes in the direction of the substrate portion and presses the finger.

[0031] The first fence includes a body coupling portion that couples to the front body on one side, and the front body, the body coupling portion, and the first substrate can be coupled by a fastening mechanism.

[0032] The first fence may include a first protruding portion that supports one surface of the printed circuit board, and a second protruding portion that supports the other surface of the printed circuit board.

[0033] The second substrate and the third substrate can be coupled to the first fence by the first protruding portion and the second protruding portion, and can be arranged to be spaced apart in the optical axis direction.

[0034] The second fence is formed with a hook that is detachably coupled to the first fence, and the first fence can be formed with a through portion to which the hook is coupled.

[0035] The second fence can be electrically connected to the substrate portion to ground the substrate portion.

[0036] The finger can be made of beryllium copper material.

[0037] The camera module of this embodiment may further include a cable connection portion that connects the substrate portion and an external cable.

[0038] The cable connection part may include a first connection part that couples with the substrate part and a second connection part that couples with the first connection part and the external cable.

[0039] The camera module of this embodiment includes a lens part, a front body to which the lens part is coupled, a first substrate arranged to face the lens part, a third substrate arranged at a distance from the first substrate in the optical axis direction, a second substrate arranged between the first substrate and the third substrate so as to be separated from the first substrate and the third substrate respectively, a first fence that couples with the first substrate, the second substrate, and the third substrate and separates the first substrate, the second substrate, and the third substrate from each other in the optical axis direction, a second fence that couples with the first fence, and fingers that electrically connect the second fence and the third substrate. The fingers include a substrate coupling part that couples with the third substrate and an elastically deformable elastic deformation part formed by extending from the substrate coupling part. By the second fence pressing the elastic deformation part, the second fence and the third substrate can be electrically connected to each other.

Advantages of the Invention

[0040] The circuit board fixing device for a camera module of this embodiment and the camera module including the same can prevent an increase in the number of assembly steps, reduce production costs, prevent a reduction in the component mounting area of the circuit board, and prevent warping of the circuit board by firmly fixing the circuit board inside the housing without using fastening screws when fixing the circuit board in the housing.

[0041] By using the first fence including a body coupling part, a first protrusion, and a second protrusion, the camera module of this embodiment has the effect of being able to align a plurality of printed circuit boards provided on the substrate part of the camera module in the optical axis direction regularly and easily.

[0042] In addition, the substrate portion and the second fence are electrically connected, so that the static electricity generated in the substrate portion flows to the second fence, and the second fence functions as a grounding portion. As a result, the static electricity generated in the substrate portion can be eliminated or significantly reduced.

[0043] In addition, by eliminating or significantly reducing the static electricity generated in the substrate portion, it is possible to prevent deterioration of the image quality of the camera module and deterioration of electromagnetic stability (Electro Magnetic Compatibility, EMC) caused by static electricity.

Brief Description of the Drawings

[0044]

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Embodiments for Carrying Out the Invention

[0045] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Although the embodiments can be subjected to various changes and can have various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the embodiments to a specific disclosed form, and it should be understood to include all changes, equivalents, and alternatives included in the spirit and technical scope of the embodiments.

[0046] Terms such as "first", "second", etc. can be used to describe various components, but the components should not be limited by these terms. These terms are used for the purpose of distinguishing one component from another. Furthermore, terms specially defined in consideration of the configuration and operation of the embodiments are only for explaining the embodiments and do not limit the scope of the embodiments.

[0047] In the description of the embodiments, when formed "on or under" each element, "on or under" includes both cases where two elements are in direct contact with each other and cases where one or more other elements are disposed between the two elements (indirectly). Also, when expressed as "on or under", it can include not only the upward but also the downward meaning with respect to one element.

[0048] Furthermore, relative terms such as "upper / upper part / above" and "lower / lower part / below" used hereinafter can be used to distinguish one entity or element from another without necessarily requiring or encompassing any physical or logical relationship or order between such entities or elements.

[0049] Furthermore, a rectangular coordinate system (x, y, z) can be used in the drawings. In the drawings, the x-axis and the y-axis mean a plane perpendicular to the optical axis. For convenience, the optical axis direction (z-axis direction) can be referred to as the first direction, the x-axis direction as the second direction, and the y-axis direction as the third direction.

[0050] The camera module of this embodiment can have a first embodiment, a second embodiment, and a third embodiment. The camera modules of this first embodiment and this second embodiment relate to a camera module including a circuit board fixing device for firmly fixing a circuit board. The camera module of this third embodiment relates to a camera module including a first fence and a second fence for electromagnetic stability (Electro Magnetic Compatibility, EMC).

[0051] First, the camera modules of this first embodiment and the second embodiment will be described.

[0052] FIG. 1 is an external perspective view of a camera module according to this first embodiment. FIG. 2 is a cross-sectional view taken along the line I-I' of FIG. 1.

[0053] Referring to FIGS. 1 and 2, the camera module 700 of this first embodiment can include a circuit board fixing device 100, an image sensor 200, a lens 300, a lens barrel 400, and a housing 500.

[0054] FIG. 3 is a perspective view illustrating the circuit board fixing device illustrated in FIG. 2.

[0055] Referring to FIG. 3, the circuit board fixing device 100 can include a fixing unit 180 for fixing a number of circuit boards 110.

[0056] The circuit board 110 according to this first embodiment can be firmly fixed by the fixing unit 180.

[0057] In this first embodiment, for example, four circuit boards 110 can be fixed to the fixing unit 180.

[0058] For the convenience of the following description, the circuit board 110 is divided into a first circuit board 112, a second circuit board 114, a third circuit board 116, and a fourth circuit board 118.

[0059] The first to fourth circuit boards 112, 114, 116, 118 can each include a rigid circuit board.

[0060] In the first embodiment of the present invention, the first circuit board 112, the second circuit board 114, the third circuit board 116, and the fourth circuit board 118 are connected in a row by flexible circuit boards 113, 115, 117.

[0061] The first and second circuit boards 112, 114, the second and third circuit boards 114, 116, and the third and fourth circuit boards 116, 118 can be electrically connected to each other by flexible circuit boards 113, 115, 117, respectively.

[0062] In the first to fourth circuit boards 112, 114, 116, 118, concave grooves can be formed to prevent the bending of each flexible circuit board 113, 115, 117.

[0063] The first to fourth circuit boards 112, 114, 116, 118 can be stacked and arranged in a zigzag form. For example, the second circuit board 114 can be arranged on the upper part of the first circuit board 112, the third circuit board 116 can be arranged on the upper part of the second circuit board 114, and the fourth circuit board 118 can be arranged on the upper part of the third circuit board 116.

[0064] The stacked first to fourth circuit boards 112, 114, 116, 118 are separated from each other by a predetermined interval, and the intervals between the first to fourth circuit boards 112, 114, 116, 118 may be the same or different from each other.

[0065] On the other hand, the planar area of the third circuit board 116 may be larger than that of the second circuit board 114, and the planar area of the fourth circuit board 118 may be larger than that of the third circuit board 116.

[0066] In this first embodiment, an image sensor 200 can be mounted on the first circuit board 112, and connectors and the like can be mounted on the fourth circuit board 118.

[0067] FIG. 4 is a perspective view showing a fixing unit of the circuit board fixing device illustrated in FIG. 3.

[0068] Referring to FIGS. 3 and 4, the fixing unit 180 serves to fix the circuit board 110 including the aforementioned first to fourth circuit boards 112, 114, 116, and 118 without screwing.

[0069] The fixing unit 180 can include a base portion 120, a first fixing portion 130, and a second fixing portion 140.

[0070] In one embodiment of the present invention, the base portion 120, the first fixing portion 130, and the second fixing portion 140 of the fixing unit 180 can be integrally formed, for example.

[0071] Although in one embodiment of the present invention, the base portion 120, the first fixing portion 130, and the second fixing portion 140 are shown and described as being integrally formed, the base portion 120, the first fixing portion 130, and the second fixing portion 140 can be assembled or welded in a mutually separated state.

[0072] The base portion 120 is formed in a plate shape, for example, and the base portion 120 can be coupled and fixed to a housing 500 described later.

[0073] The shape of the base portion 120 is determined by the shape of the housing 500. When the housing 500 is in a hexahedron shape, the base portion 120 can be formed in a rectangular plate shape suitable for being housed in the housing 500, for example.

[0074] An opening 122 can be formed in the central portion of the base portion 120 so that connectors and the like can pass through.

[0075] At least one of the first fixing portions 130 can extend from the frame of the base portion 120 to one side of the base portion 120.

[0076] In one embodiment of the present invention, the first fixing portions 130 can extend in a first direction so as to face each other from opposite side frames of the base portion 120. The first direction can be, for example, the height direction with respect to the base portion 120. The first direction is a direction perpendicular to the base portion 120 and can be formed to extend in a direction perpendicular to the corner or frame of the base portion 120.

[0077] The first fixing portion 130 can be formed, for example, in the shape of a rectangular plate. Although in this first embodiment, it is illustrated and described that the first fixing portion 130 is in the shape of a rectangular plate, the first fixing portion 130 can be formed in various plate shapes.

[0078] The first fixing portion 130 can include support portions 132, 133, 134 that protrude in a direction perpendicular to the first direction, which is the height direction with respect to the base portion 120.

[0079] The support portions 132, 133, 134 serve to prevent the second to fourth circuit boards 114, 116, 118 from detaching. The support portions 132, 133, 14 of the first fixing portion 130 can be referred to as protrusions of the first fixing portion 130. That is, the first fixing portion 130 can include a plurality of protrusions that extend in the first direction from the base portion 120 and protrude in a direction perpendicular to the first direction to support one side of each of the plurality of substrates 110.

[0080] The number of the supporting parts 132, 133, 134 is determined by the number of the circuit boards 110. In the present first embodiment, for example, three supporting parts 132, 133, 134 can be formed on the first fixing part 130 to support one side of the second to fourth circuit boards 114, 116, 118 excluding the first circuit board 112 disposed on the base part 120. One side of the circuit board in this specification may be the upper surface (or the lower surface) of the circuit board, and the other side of the circuit board may be the lower surface (or the upper surface) of the circuit board.

[0081] The supporting part 132 for supporting the second circuit board 114 can be formed, for example, by bending a portion protruding from both side surfaces of the first fixing part 130 toward the lower surface of the second circuit board 114.

[0082] The supporting part 133 for supporting the third circuit board 116 can be formed, for example, by bending a portion protruding from both side surfaces of the first fixing part 130 toward the lower surface of the third circuit board 116.

[0083] The supporting part 134 for supporting the fourth circuit board 118 can be formed, for example, by cutting a part of the first fixing part 130 and protruding the cut part from the outside to the inside of the first fixing part 130.

[0084] In the present first embodiment, in order to arrange the second to fourth circuit boards 114, 116, 118 in a zigzag shape, the protruding lengths of the supporting parts 132, 133, 134 that support the lower surfaces of the second to fourth circuit boards 114, 116, 118 can be intermittently shortened as they are farther from the base part 120. The size of the substrate supported by the supporting part 134 can be determined corresponding to the protruding length of the supporting parts 132, 133, 134. The protruding lengths of the supporting parts 132, 133, 134 become smaller as they are farther from the base part 120, and correspondingly, the size of the substrate in the direction perpendicular to the first direction can also become smaller as it is farther from the base part 120.

[0085] Furthermore, escape grooves can be formed in the second to fourth circuit boards 114, 116, 118 so that the second to fourth circuit boards 114, 116, 118 can be coupled without interfering with the support portions 132, 133, 134. The area of the escape grooves can be formed such that the second circuit board 114 is the largest and the fourth circuit board 118 is the smallest.

[0086] Referring again to FIGS. 3 and 4, the second fixing portion 140 prevents the second to fourth circuit boards 114, 116, 118, which are respectively supported by the support portions 132, 133, 134 of the first fixing portion 130, from coming off upward.

[0087] The second fixing portion 140 can be arranged, for example, in the first direction such that a pair thereof faces each other with respect to the base portion 120.

[0088] Therefore, the second fixing portion 140 can be arranged so as to be parallel to the first fixing portion 130 and perpendicular to the first fixing portion 130 in a plan view.

[0089] When a pair of the second fixing portions 140 are arranged on the base portion 120 with respect to the first fixing portion 130, the first and second fixing portions 130, 140 can stably fix four locations of the second to fourth circuit boards 114, 116, 118, and prevent the second to fourth circuit boards 114, 116, 118 from coming off and moving up and down.

[0090] The second fixing portion 140 can be formed from the frame of the base portion 120 in the first direction.

[0091] The second fixing portion 140 can be formed, for example, in a rectangular plate shape in a side view. Although in the present first embodiment, it is illustrated and described that the second fixing portion 140 is formed in a rectangular plate shape, alternatively, the second fixing portion 140 can have various plate shapes.

[0092] The width of the second fixing part 140 is formed to be narrower than the width of the first fixing part 10. This is to prevent the part where the second fixing part 140 is formed from interfering with the flexible circuit boards 113, 115, 117 that connect the first to fourth circuit boards 112, 114, 116, 118.

[0093] Protrusions 143, 143, 144 are formed on the second fixing part 140 along the height direction with respect to the base part 120. The second fixing part 140 can include a plurality of protrusions that extend from the base part 120 in a first direction and support or contact the other side of each of the plurality of substrates 110. The first direction can be a direction perpendicular to the base part 120. The protrusions 142, 143, 144 are formed at positions corresponding to the second to fourth circuit boards 114, 116, 118 excluding the first circuit board 112 disposed on the upper surface of the base part 120.

[0094] In the present first embodiment, the protrusion 142 formed on the second fixing part 140 contacts or presses the upper surface of the second circuit board 114, so that the second circuit board 114 is not moved up and down by the support part 132 of the first fixing part 130 and the protrusion 142 of the second fixing part 140.

[0095] The protrusion 142 for fixing the second circuit board 114 can be formed by cutting a part of the second fixing part 140 and then bending the cut part toward the upper surface of the second circuit board 114.

[0096] In the present first embodiment, the protrusion 143 formed on the second fixing part 140 contacts or presses the upper surface of the third circuit board 116, so that the third circuit board 116 is not moved up and down by the support part 133 of the first fixing part 130 and the protrusion 143 of the second fixing part 140.

[0097] The protrusion 143 for fixing the third circuit board 116 can be formed by cutting a part of the second fixing part 140 and then bending the cut part toward the upper surface of the third circuit board 116.

[0098] In this second embodiment, the protrusion 144 formed on the second fixing part 140 contacts or presses the upper surface of the fourth circuit board 118, so that the fourth circuit board 118 is not moved up and down by the support part 134 of the first fixing part 130 and the protrusion 144 of the second fixing part 140.

[0099] The protrusion 144 for fixing the fourth circuit board 118 can be formed by cutting a part of the second fixing part 140 and then bending the cut part toward the upper surface of the fourth circuit board 118.

[0100] In this first embodiment, since the second to fourth circuit boards 114, 116, 118 fixed by the protrusions 142, 143, 144 gradually increase in planar area as described above, a step portion can be formed between the protrusions 142, 143, 144 in the second fixing part 140 in consideration of the planar areas of the second to fourth circuit boards 114, 116, 118.

[0101] FIG. 5 is a perspective view showing a fixing unit according to the second embodiment of the camera module. The fixing unit shown in FIG. 5 has substantially the same configuration as the fixing unit shown in FIGS. 2 to 4 except for the shapes of the support part and the protrusion. Therefore, redundant descriptions for the same configuration are omitted, and the same name and the same reference numerals are given to the same configuration.

[0102] Referring to FIG. 5, the fixing unit 180 can include a base part 120, a first fixing part 130, and a second fixing part 140.

[0103] The first fixing part 130 can include support parts 132a, 133a, 134a formed along the height direction with respect to the base part 120.

[0104] The support portions 132a, 133a, and 134a can be formed by cutting a part of the first fixing portion 130 and protruding the cut portion from the outer surface of the first fixing portion 130 in the direction of the inner surface facing the outer surface, and the support portions 132a, 133a, and 134a support the lower surfaces of the second to fourth circuit boards 114, 116, and 118.

[0105] The second fixing portion 140 can include protruding portions 142a, 143a, and 144a formed along the height direction with respect to the base portion 120.

[0106] The protruding portions 142a, 143a, and 144a can be formed by cutting a part of the second fixing portion 140 and protruding the cut portion from the outer surface of the second fixing portion 140 in the direction of the inner surface facing the outer surface, and the protruding portions 142a, 143a, and 144a can contact the upper surfaces of the second to fourth circuit boards 114, 116, and 118.

[0107] FIG. 6 is an exploded perspective view showing a fixing cap coupled to the fixing unit according to the first embodiment of the present invention. FIG. 7 is a perspective view of the coupling shown in FIG. 6.

[0108] Referring to FIGS. 6 and 7, when the first and second fixing portions 130 and 140 of the fixing unit 180 open with the first to fourth circuit boards 112, 114, 116, and 118 coupled to the first and second fixing portions 130 and 140, the first to fourth circuit boards 112, 114, 116, and 118 can be detached from the first and second fixing portions 130 and 140.

[0109] To prevent this, the fixing unit 180 can include a fixing cap 150. The fixing cap 150 is coupled to the first and second fixing portions 130 and 140 of the fixing unit 180 and can prevent the opening of the first and second fixing portions 130 and 140.

[0110] The fixed cap 150 can be made of various materials such as a metal material with high rigidity and easy processing or a synthetic resin material with easy processability and capable of forming a complex shape.

[0111] The fixed cap 150 is formed in a lid shape and can include a side wall 155 and an upper plate 159.

[0112] The upper plate 159 can be formed in a shape corresponding to, for example, the base portion 120 of the fixing unit 180.

[0113] For example, when the base portion 120 is formed in a square plate shape, the upper plate 159 is also formed in a shape corresponding to the base portion 120, and in one embodiment of the present invention, the upper plate 159 can be formed in a square plate shape.

[0114] An opening 158 can be formed in the upper plate 159 to expose a connector connected to the fourth circuit board 118 fixed to the fixing unit 180.

[0115] On the other hand, around the opening 158 formed in the upper plate 159, a detachment prevention portion 157 can be formed which is bent inward of the upper plate 159 to contact the upper surface of the fourth circuit board 118 or press the upper surface to further prevent or suppress the detachment of the fourth circuit board 118.

[0116] The side wall 155 can be integrally formed on the frame of the upper plate 159, and the side wall 155 contacts the outer surfaces of the first and second fixing portions 130, 140 respectively to prevent the first and second fixing portions 130, 140 from opening.

[0117] On the other hand, on the side wall 155, for example, a locking portion 151 coupled to the first and second fixing portions 130, 140 can be formed.

[0118] The engaging portion 151 is formed by cutting and bending a part of the side wall 155. In the first fixing portion 130 corresponding to the engaging portion 151, a through hole 137 for being coupled to the engaging portion 151 in a hook manner can be formed.

[0119] At least one anti-warping rib 152 for preventing warping of the side wall 155 or the like can be formed on the side wall 155.

[0120] FIGS. 8 to 10 are drawings illustrating the order of assembling the first to fourth circuit boards to the first and second fixing portions of the fixing unit according to the present first embodiment.

[0121] Referring to FIG. 8, the first circuit board 112 can be fixed and coupled to the base portion 120 of the fixing unit 180.

[0122] Thereafter, as shown in FIG. 9, the second circuit board 114 is coupled to the first and second fixing portions 130 and 140 respectively so as to face the first circuit board 112. As shown in FIG. 10, the third circuit board 116 is coupled to the first and second fixing portions 130 and 140 so as to face the second circuit board 114.

[0123] Thereafter, as shown in FIG. 3, the fourth circuit board 118 is coupled to the first and second fixing portions 130 and 140 so as to face the third circuit board 116.

[0124] Referring back to FIG. 2, the circuit board fixing device 100 including the fixing unit 180 described with reference to FIGS. 3 to 8 is coupled inside the housing 500, and a lens assembly 400 to which the lens 300 is coupled is coupled to the housing 500.

[0125] As described in detail above, the circuit board fixing device for a camera module according to the first embodiment and the second embodiment of the present invention, and the camera module having the same, can prevent an increase in the number of assembly steps, reduce production costs, prevent a reduction in the component mounting area of the circuit board, and prevent warping of the circuit board by firmly fixing the circuit board inside the housing without using fastening screws when fixing the circuit board in the housing.

[0126] Hereinafter, the camera module of the third embodiment of the present invention will be described.

[0127] FIG. 11 is a perspective view showing the camera module of the third embodiment of the present invention. FIG. 12 is an exploded perspective view showing the camera module of the third embodiment of the present invention. FIG. 13 is a front view showing the camera module of one embodiment.

[0128] The camera module of the third embodiment of the present invention may include a lens unit 1100, a front body 1200, a substrate unit 1300, a first fence 1400, a second fence 1500, an image sensor 1700, a fastening mechanism 1810, a sealing member 1820, and a cable connection unit 1830.

[0129] The lens unit 1100 is a part where external light is incident, and may include a lens barrel on which at least one lens is mounted. At this time, the lens barrel may be composed of a single lens, or a plurality of lenses may be provided in a form aligned in the optical axis direction, that is, the first direction. In other embodiments, one lens or a plurality of lenses may be directly coupled to the front body 1200 without a lens barrel.

[0130] Furthermore, since the lens unit 1100 may be coupled to the front body 1200 by means such as screw coupling, shape fitting, and interference fitting, a sealing member 1820 may be provided to block the inflow of moisture, dust, and other foreign substances into the camera module from the gap between the coupling parts of the lens unit 1100 and the front body 1200.

[0131] As shown in FIG. 12, the sealing member 1820 is disposed at the joint between the lens unit 1100 and the front body 1200, and can be provided, for example, in the form of an O-ring.

[0132] The front body 1200 can be provided in a hollow type that houses the lens unit 1100 in an internal space. The lens unit 1100 can be mounted on the front portion of the front body 1200. For this purpose, a hollow for mounting the lens unit 1100 can be formed in the front body 1200.

[0133] The front body 1200 can be coupled to a housing (not shown). The coupling between the front body 1200 and the housing is performed, for example, by a coupling mechanism (not shown). For this purpose, as shown in FIGS. 11 and 12, through holes into which the coupling mechanism is inserted can be formed at the corner portions of the front body 1200.

[0134] However, this is only one embodiment, and in other embodiments, the coupling mechanism may not be used, and the front body 1200 and the housing may be coupled by adhesion, shape fitting, or interference fitting.

[0135] The cable connection part 1830 can serve to connect the board part 1300 and an external cable. Through an external cable (not shown) electrically connected to the cable connection part 1830, the camera module can receive power supply from the outside and transmit and receive electrical signals to and from an external device.

[0136] The cable connection part 1830 can include a first connection part 1831 and a second connection part 1832. The first connection part 1831 is coupled to the board part 1300, and the second connection part 1832 can be coupled to the first connection part 1831 and the external cable.

[0137] As shown in FIG. 13, the first connecting portion 1831 is coupled to, for example, the third substrate 1313 disposed at the rearmost side in the substrate portion 1300. The second connecting portion 1832 is coupled to the first connecting portion 1831, and the external cable can be coupled to the second connecting portion 1832. With such a structure, the substrate portion 1300 and the external cable can be electrically connected to each other.

[0138] The substrate portion 1300 is disposed at the rear side of the front body 1200 and can be provided in a plurality of printed circuit boards 1310. The substrate portion 1300 can include a printed circuit board 1310 and a connector 1320.

[0139] As shown in FIG. 12, a plurality of printed circuit boards 1310 can be arranged at intervals in the optical axis direction. A plurality of the printed circuit boards 1310 can be arranged opposite to the lens portion 1100. In FIG. 12, as an example, four printed circuit boards 310 are provided, but the number can be less than four or more than four.

[0140] Hereinafter, the substrate portion 1300 including the printed circuit board 1310 according to the third embodiment illustrated in FIGS. 11 to 13 will be described. The printed circuit board 1310 can include a first substrate 1311, a second substrate 1312, and a third substrate 1313.

[0141] The first substrate 1311 can be disposed to face the lens portion 1100. The third substrate 1313 can be disposed at a distance from the first substrate 1311 in the optical axis direction. The second substrate 1312 can be disposed between the first substrate 1311 and the third substrate 1313 so as to be separated from each of the first substrate 1311 and the third substrate 1313.

[0142] At this time, the second substrate 1312 can include, for example, a second - 1 substrate 1312 - 1 disposed adjacent to the first substrate 1311 and a second - 2 substrate 1312 - 2 disposed adjacent to the third substrate 1313, but is not limited thereto. The second substrate 1312 may be provided in a form in which one substrate or three or more substrates are arranged in the optical axis direction.

[0143] The first substrate 1311 faces the lens unit 1100, but can be disposed adjacent to the lens unit 1100. An image sensor 1700 can be mounted on the surface facing the lens unit 1100, that is, the front surface, and an electromagnetic circuit including various other circuit elements can be formed.

[0144] The light incident through the lens unit 1100 is sensed by the image sensor 1700, and the first substrate 1311 can play a role of converting the sensed image into an electrical signal and transmitting it to an external image storage device or image playback device. However, converting the sensed image into an electrical signal can also be performed on another substrate.

[0145] The second substrate 1312 including the second - 1 substrate 1312 - 1 and the second - 2 substrate 1312 - 2 is disposed between the first substrate 1311 and the third substrate 1313 and can be electrically connected to the first substrate 1311 and the third substrate 1313 to form an electromagnetic circuit.

[0146] The second - 1 substrate 1312 - 1 and the second - 2 substrate 1312 - 2 can serve as an electrical path for supplying the necessary power to the first substrate 1311 and can play a role of transmitting the electrical signal for the sensed image transmitted from the first substrate 1311 to an external image storage device or image playback device.

[0147] For example, the second - 1 substrate 1312 - 1 and / or the second - 2 substrate 1312 - 2 can change the sensed image transmitted from the first substrate 1311 into an electrical signal and transmit it to an external image storage device or an image playback device, or rectify the power input from the third substrate 1313 and transmit it to the first substrate 1311.

[0148] That is, the second - 1 substrate 1312 - 1 and / or the second - 2 substrate 1312 - 2 may be disposed between the first substrate 1311 and the third substrate 1313 to partially divide the roles performed by the first substrate 1311 and the third substrate 1313.

[0149] The third substrate 1313 is disposed behind the second substrate 1312 and can be electrically connected to the second substrate 1312 to form an electromagnetic circuit. As described above, the third substrate 1313 can be electrically connected to the cable connection portion 1830 and an external cable.

[0150] The third substrate 1313 mainly receives power required for the operation of the camera module from the outside and sends it to the first substrate 1311 and the second substrate 1312, and can play a role of transmitting an electrical signal for the sensed image transmitted from the first substrate 1311 and the second substrate 1312 to an external image storage device or an image playback device.

[0151] Therefore, elements such as capacitors, rectifiers, and transformers for supplying power having an appropriate voltage and current required for the operation of the camera module can also be mounted on the third substrate 1313. Further, the cable connection portion 1830 may be coupled to the third substrate 1313 for electrical connection to an external image storage device, an image playback device, a camera module control device, and the like as described above.

[0152] The connector 1320 can be made of a flexible material and electrically connect the plurality of printed circuit boards 1310 to each other. The connector 1320 can serve to electrically connect each of the printed circuit boards 1310, that is, the first substrate 1311, the second -1 substrate 1312-1, the second -2 substrate 1312-2, and the third substrate 1313. Since the connector 1320 electrically connects each substrate to each other, it can be provided in a number one less than the number of printed circuit boards 1310.

[0153] In this third embodiment, referring to FIG. 17, since the printed circuit board 1310 includes a total of four boards: the first substrate 1311, the second -1 substrate 1312-1, the second -2 substrate 1312-2, and the third substrate 1313, the connector 1320 can be provided in three, which is one less than these.

[0154] Referring to FIGS. 12 and 17, in the embodiment, one connector 1320 for connecting each substrate to each other is provided on each side surface of each substrate, but it is not limited thereto. Considering the circuit structure of each substrate and the overall structure of the camera module, the number and arrangement position of the connectors 1320 can be selected.

[0155] Considering that the connector 1320 is easy to cooperate with each substrate and needs to absorb such impacts and vibrations so as not to be damaged by the impacts and vibrations applied to the outside of the camera module, it is appropriate to be formed of a flexible material. In this way, the connector 1320 can be formed of a flexible circuit board.

[0156] However, it is not limited thereto. As long as it is strong against impacts and vibrations, a rigid material may be used, or the connector 1320 may be formed using a wire bundle.

[0157] Furthermore, for the connection between the connector 1320 and each substrate, soldering, adhesion using an electrically conductive adhesive, or the like can be used. Such a connector 1320 can serve as a B2B (board to board) connector 1320 that electrically connects each substrate.

[0158] The first fence 400 can be coupled to the substrate portion 300 and serve to separate the plurality of printed circuit boards 310 from each other in the optical axis direction. The first fence 400 will be specifically described below with reference to the drawings.

[0159] FIG. 14 is a perspective view showing a part of the camera module of the third embodiment. FIG. 15 is a front view of FIG. 14. The second fence 1500 can be coupled to the first fence 1400 behind the first fence 1400 and be electrically connected to the substrate portion 1300 to ground the substrate portion 1300.

[0160] When power is supplied to the camera module from an external power source, static electricity may be generated in the camera module. In particular, the static electricity generated in the substrate portion 1300 may adversely affect the performance of the camera module.

[0161] For example, the static electricity generated in the substrate portion 1300 can generate electromagnetic noise, and such noise may cause the captured image to blur or the image quality to deteriorate, thus degrading the electromagnetic stability (Electro Magnetic Compatibility, EMC) of the camera module.

[0162] To solve the above problems, it is necessary to ground the substrate portion 1300 to eliminate or reduce the static electricity generated in the substrate portion 1300. In this third embodiment, the second fence 1500 can serve as a grounding portion.

[0163] For the second fence 1500 to serve as a grounding part, the substrate part 1300 and the second fence 500 should be electrically connected to each other. Such an electrical connection structure will be specifically described later with reference to the drawings below.

[0164] As shown in FIG. 14, the second fence 1500 can surround the first fence 1400 at the rear side of the first fence 1400 and be coupled to the first fence 1400. At this time, the second fence 1500 can be detachably coupled to the first fence 1400.

[0165] The second fence 1500 can be formed with a hook 1520 that is detachably coupled to the first fence 1400. Further, the first fence 1400 can be formed with a through-hole 1440 to which the hook 1520 is coupled at a portion corresponding to the hook 1520.

[0166] Since the hook 1520 can be elastically deformed, the second fence 1500 can be detachably coupled to the first fence 1400 by the hook 1520 elastically deforming and being coupled to or detached from the through-hole 1440.

[0167] As shown in FIG. 15, the camera module of the embodiment can further include a finger 1600. The finger 1600 can serve to electrically connect the substrate part 300 and the second fence 1500.

[0168] For example, the finger 1600 can electrically connect the second fence 1500 and the third substrate 1313. The finger 1600 is coupled to the third substrate 1313, and the second fence 1500 can be formed with a pressing part 1510 that presses the finger 1600 at a portion corresponding to the finger 1600.

[0169] With such a structure, when the pressing portion 1510 presses the finger 1600, the pressing portion 1510 and the finger 1600 come into contact with each other, whereby the substrate portion 1300 including the second fence 1500 and the third substrate 1313 can be in electrical contact with each other. The specific structures of the finger 1600 and the pressing portion 1510 will be specifically described below with reference to the drawings.

[0170] On the other hand, the second fence 1500 is preferably formed of a conductive material, for example, a conductive metal material, so as to be electrically connected to the third substrate 1313 and allow static electricity generated in the substrate portion 1300 to flow to the second fence 1500.

[0171] FIG. 16 is a drawing in which the second fence 1500 of an embodiment in FIG. 15 is removed. FIG. 17 is a drawing obtained by rotating FIG. 16 about the z-axis. FIG. 18 is a perspective view showing the first fence 1400 of an embodiment.

[0172] The first fence 1400 can be coupled to the substrate portion 1300 and serve to separate the plurality of printed circuit boards 1310 from each other in the optical axis direction, and can include a body coupling portion 1430, a first protruding portion 1410, and a second protruding portion 1420.

[0173] The body coupling portion 1430 can be provided to be coupled to the front body 1200 on one side, i.e., the front portion, of the first fence. At this time, the body coupling portion 1430 is disposed between the front body 1200 and the first substrate 1311 and can be coupled to the front body 1200 and the first substrate 1311.

[0174] At this time, the front body 1200, the body coupling portion 1430, and the first substrate 1311 can be coupled to each other by a fastening mechanism 1810 (see FIGS. 12 and 13). With such a structure, the substrate portion 1300 including the first substrate 1311 can be coupled to the front body 1200 by the first fence 1400.

[0175] At this time, as shown in FIG. 18, a through hole can be formed in the body coupling portion 1430 so that the image sensor 1700 mounted on the entire surface of the first substrate 1311 faces the lens unit 1100.

[0176] The first protrusion 1410 can support one surface of the printed circuit board 1310, for example, the front surface. The second protrusion 1420 can support the other surface of the printed circuit board 1310, for example, the rear surface.

[0177] Therefore, the first protrusion 1410 and the second protrusion 1420 can be formed to be spaced apart in the optical axis direction, and such a separation distance can correspond to the thicknesses of the respective printed circuit boards 1310, that is, the second substrate 1312 and the third substrate 1313.

[0178] The second substrate 1312 and the third substrate 1313 can be coupled to the first fence 1400 by the first protrusion 1410 and the second protrusion 1420 and arranged to be spaced apart in the optical axis direction.

[0179] That is, the second substrate 1312 and the third substrate 1313 can be sandwiched between the first protrusion 1410 and the second protrusion 1420 and coupled to the first fence 1400. On the other hand, the first substrate 1311 can be coupled to the body coupling portion 1430 by the fastening mechanism 1810 as described above and may not be sandwiched between the first protrusion 1410 and the second protrusion 1420.

[0180] With such a structure, in the first fence 1400 of the embodiment, the first protrusion 1410 and the second protrusion 1420 can be arranged at three positions spaced apart from each other in the optical axis direction. This is because in the third embodiment, the second -1 substrate 1312-1, the second -2 substrate 1312-2, and the third substrate 1313 can be sandwiched between the first protrusion and the second protrusion 1420.

[0181] The positions of the first substrate 1311, the second -1 substrate 1312-1, the second -2 substrate 1312-2, and the third substrate 1313 spaced apart from each other in the optical axis direction can be determined by the positions of the first protrusion 1410 and the second protrusion 1420 spaced apart from each other in the optical axis direction.

[0182] In the third embodiment, by using the first fence 1400 including the body coupling portion 1430, the first protrusion 1410, and the second protrusion 1420, there is an effect that a plurality of printed circuit boards 1310 provided in the substrate portion 1300 of the camera module can be easily aligned at intervals set in the optical axis direction.

[0183] Furthermore, since the first fence 1400 is provided so as to surround the substrate portion 1300, it can also serve to partially shield electromagnetic waves generated in the substrate portion 300.

[0184] FIG. 19 is a partial perspective view showing a portion A of FIG. 13. The finger 1600 can include a substrate coupling portion 1610 and an elastic deformation portion 1620. The substrate coupling portion 1610 can be coupled to the third substrate 1313. At this time, the substrate coupling portion 1610 and the third substrate 1313 can be coupled to each other by soldering, a conductive adhesive, or the like. The elastic deformation portion 1620 is formed to extend from the substrate coupling portion 1610 and can be elastically deformed.

[0185] When the second fence 1500 presses the elastic deformation part 1620, the second fence 1500 and the third substrate 1313 can be electrically connected to each other. At this time, the second fence 1500 can be provided with a pressing part 1510 that protrudes in the direction of the substrate part 1300 to press the finger 1600.

[0186] When the pressing part 1510 presses the elastic deformation part 1620 while being in contact with the elastic deformation part 1620, the elastic deformation part 1620 starts to undergo elastic deformation. With such a structure, the pressing part 1510 and the elastic deformation part 1620 can be more reliably electrically connected, and electrical disconnection between the pressing part 1510 and the elastic deformation part 1620 can be prevented.

[0187] That is, when the second fence 1500 is coupled to the first fence 1400, the end of the pressing part 1510 is positioned further below the upper surface of the elastic deformation part 1620. As a result, the elastic deformation part 1620 deforms, and at the same time, reliable contact occurs between the pressing part 1510 and the elastic deformation part 1620. Therefore, the pressing part 1510 and the elastic part can be reliably electrically connected without the occurrence of electrical disconnection.

[0188] When the pressing part 1510 and the elastic deformation part 1620 are electrically connected, the second fence 1500 including the pressing part 1510, the finger 1600 including the elastic deformation part 1620, and the substrate part 1300 including the finger 1600 can be electrically connected.

[0189] Therefore, the static electricity generated in the substrate part 1300 can flow to the second fence 1500 that is electrically connected. By serving as a grounding part, the second fence 1500 can eliminate or significantly reduce the static electricity generated in the substrate part 1300.

[0190] In this third embodiment, the substrate portion 1300 and the second fence 1500 are electrically connected, and the static electricity generated in the substrate portion 1300 flows to the second fence 1500, and the second fence 1500 functions as a grounding portion. Therefore, there is an effect that the static electricity generated in the substrate portion 1300 can be eliminated or significantly reduced.

[0191] In addition, by eliminating or significantly reducing the static electricity generated in the substrate portion 1300, there is an effect that it is possible to prevent a decrease in the image quality of the camera module and a decrease in electromagnetic stability (Electro Magnetic Compatibility, EMC) due to static electricity.

[0192] FIG. 20 is a perspective view showing the third substrate 1313 and the fingers 1600 of this third embodiment. FIG. 21 is a side view showing the fingers 1600 of an embodiment.

[0193] As shown in FIG. 20, the finger 1600 can be coupled to the rear surface of the third substrate 1313 disposed at the rearmost side in the printed circuit board 1310, for example. Further, the finger 1600 can be provided at a position facing the pressing portion 1510 formed in the second fence 1500 in the optical axis direction.

[0194] Further, the fingers 1600 can be provided in the same number as the pressing portion 1510. In FIG. 20, two fingers 1600 are provided, but the present invention is not limited to this, and one or three or more fingers 1600 may be provided.

[0195] In addition, there is no special limitation on the position of the finger 1600, and the position, number, etc. of the finger 1600 can be appropriately selected in consideration of the detailed structure or the overall structure of the camera module. At this time, the pressing portion 1510 can be provided so as to correspond to the position, number, etc. of the finger 1600.

[0196] As shown in FIG. 21, the elastic deformation portion 1620 of the finger 1600 can be provided in an overall S shape in a side view. However, this is only an example, and as long as the elastic deformation portion 1620 can be elastically deformed by the pressing portion 1510 and can surely maintain mechanical and electrical contact between the elastic deformation portion 1620 and the pressing portion 1510, the elastic deformation portion 1620 can be adopted in any shape.

[0197] On the other hand, the finger 1600 is preferably formed of a material excellent in abrasion resistance, fatigue strength, elastic limit, electrical conductivity, etc. Therefore, the finger 1600 can be provided with, for example, a beryllium copper material.

[0198] Although several have been described above in relation to the embodiments, other various forms of implementation are possible. The technical contents of the embodiments described above can be combined in various forms as long as they are not technologies that are mutually incompatible, and thus can also be embodied in new embodiments.

Claims

1. A lens unit, a hollow front body that houses the lens unit in an internal space, a substrate unit disposed on the rear side of the front body and including a plurality of printed circuit boards, a first fence that is coupled to the substrate unit and separates the plurality of printed circuit boards from each other in the optical axis direction, a second fence that is coupled to the first fence on the rear side of the first fence, and fingers that electrically connect the substrate unit and the second fence, wherein the first fence includes a base portion, and a fixing unit including a first fixing portion that supports one surface of each of the plurality of printed circuit boards and a second fixing portion that supports the other surface facing the one surface of each of the plurality of printed circuit boards, the first fixing portion includes a plurality of fixing portions extending in the optical axis direction from the base portion and a plurality of protruding portions protruding in a direction perpendicular to the optical axis direction to support one surface of each of the plurality of printed circuit boards, the second fixing portion includes a plurality of fixing portions extending in the optical axis from the base portion and a plurality of protruding portions that support the other surface of each of the plurality of printed circuit boards, the plurality of printed circuit boards include a first substrate disposed to face the lens unit, a third substrate disposed spaced apart from the first substrate in the optical axis direction, and a second substrate disposed between the first substrate and the third substrate and spaced apart from each of the first substrate and the third substrate, the fingers include a substrate coupling portion coupled to the third substrate, and an elastically deformable portion that extends from the substrate coupling portion and is elastically deformed, wherein the second fence and the third substrate are electrically connected to each other when the second fence presses the elastically deformable portion. A camera module.

2. The camera module according to claim 1, wherein the second fence includes a pressing portion that protrudes in the direction of the substrate unit and presses the fingers.

3. The first fence includes a body coupling portion coupled to the front body on one side, and the front body, the body coupling portion, and the first substrate are coupled by a fastening mechanism. The camera module according to claim 1 or 2.

4. The second fence is formed with a hook detachably coupled to the first fence, and the first fence is formed with a through portion to which the hook is coupled. The camera module according to any one of claims 1 to 3.

5. The camera module according to any one of claims 1 to 4, wherein the second fence is electrically connected to the substrate portion to ground the substrate portion.

6. The camera module according to any one of claims 1 to 5, wherein the finger is made of beryllium copper.

7. The camera module according to any one of claims 1 to 6, further comprising a cable connection portion that connects the substrate portion to an external cable.

8. The cable connection portion includes a first connection portion that couples to the substrate portion, and a second connection portion that couples to the first connection portion and the external cable. The camera module according to claim 7.

Images