Card with 3D pattern formed thereon and method for manufacturing the same

Abstract

A method for manufacturing a card using a card manufacturing apparatus according to an embodiment of the present invention includes the steps of forming an adhesive layer on a body plate made of a metal material having a predetermined first surface roughness, performing a vacuum deposition process on the adhesive layer using a first metal base, and printing a 3D pattern layer using UV on the surface of the adhesive layer on which the vacuum deposition process has been performed.

Description

Technical Field

[0001] The present invention relates to a metal card and a method for manufacturing the same. More specifically, the present invention relates to a card having a 3D pattern formed thereon and a method for manufacturing the same.

Background Art

[0002] Generally, credit cards can be used not only as a substitute for cash, but in recent years, they have been developed as smart cards with an IC chip capable of recording a large amount of information, and are actively used for various membership cards and payments (settlements). In this smart card market, special cards using various materials have been developed. In particular, for VIP customers, metal credit cards made of differentiated metal materials have been developed using various methods.

[0003] However, a metal card (metal card) using metal may cause abnormal operation of the antenna when performing non-contact communication with a reader due to the characteristics of the metal, which may cause restrictions on the use of RF functions and ATMs. Also, when manufacturing a metal card using a thin metal sheet or thinly coating metal powder, it is difficult to form patterns and characters on the surface of the metal card. When the metal card is formed from an overly light material, there is a problem that the sense of weight of the metal cannot be felt. Therefore, it is desired to develop a metal card that overcomes the limitations of metal cards and expresses the unique weight and aesthetic sense of metal.

[0004] In particular, when a 3D pattern such as a three-dimensional effect or a pattern such as a hologram is imparted to a metal card, various problems in products and processes are derived, so it is necessary to solve this urgently.

[0005] In particular, when processing a 3D pattern by means of a UV pattern printing method, there is a problem that it is difficult to easily attach or adhesively bond to a metal body. The UV pattern is formed by irradiating a predetermined amount of UV light after paint application and printing, and three-dimensional effects and printing of 3D pattern patterns are possible due to minute differences. However, due to the smooth surface peculiar to metal materials, there is a drawback that peeling easily occurs between the metal body and the 3D pattern printing layer.

[0006] Furthermore, when performing UV pattern printing on such a metal body, a large amount of metal chips may be generated in the process, so there is difficulty in processing them. There is also a problem that the metallic feeling (metallic sense) of the entire metal card due to bending caused by UV 3D pattern printing and the inaccuracy of sheet alignment due to UV pattern printing must be solved.

Summary of the Invention

Problems to be Solved by the Invention

[0007] The present invention has been devised to solve the above problems. On the legs of a metal card with a 3D pattern such as a three-dimensional effect or a hologram pattern, various problems such as peeling, metal chips, reduction of metallic feeling (metallic sense), and sheet alignment in terms of products and processes are solved. As a result, adhesiveness is maximized, and while minimizing the reduction of metallic feeling and product errors, it is possible to manufacture an efficient and highly finished 3D pattern metal card at low cost. The object is to provide a card manufacturing method and the card.

Means for Solving the Problems

[0008] The method according to an embodiment of the present invention for solving the above problems is a method for manufacturing a metal card using a metal card manufacturing apparatus, including the steps of forming an adhesive layer on a body plate formed from a metal material having a predetermined first surface roughness (surface roughness), performing a vacuum deposition process using a first metal base on the adhesive layer, and printing a 3D pattern layer using UV on the surface of the adhesive layer on which the vacuum deposition process has been performed.

[0009] Further, a metal card according to an embodiment of the present invention for solving the above problems includes an adhesive layer formed on a body plate formed from a metal material having a predetermined first surface roughness, a vacuum deposition layer formed by a vacuum deposition process using a first metal base on the adhesive layer, and a 3D pattern layer formed by printing a 3D pattern layer using UV on the surface of the adhesive layer on which the vacuum deposition process has been performed.

Advantages of the Invention

[0010] According to an embodiment of the present invention, an adhesive layer is formed on a body plate formed from a metal material having a predetermined first surface roughness, a vacuum deposition process using a first metal base is performed on the adhesive layer, and a 3D pattern layer using UV is printed on the surface of the adhesive layer on which the vacuum deposition process has been performed, thereby optimizing the efficiency of the adhesive layer formation process and the deposition process suitable for the surface roughness of the metal body. This can provide a metal card with a 3D pattern formed thereon and a manufacturing method thereof, which can maximize the metallic feeling and appearance of the 3D pattern while minimizing the peeling problem in terms of products and processes.

[0011] Further, according to an embodiment of the present invention, by performing the first UV pattern printing and the second UV pattern printing on the metal deposition layer formed in the deposition process, double 3D pattern printing is possible, and by processing a digital printing layer for preventing metal debris that may occur therebetween, foreign matters and process defects that may occur in the manufacturing process can be minimized.

[0012] Furthermore, according to an embodiment of the present invention, by providing an alignment hole capable of adjusting alignment deviation that may occur due to such metal and metal vapor deposition and UV pattern printing, errors in the manufacturing process can be minimized, and a metal card with a 3D pattern formed at low cost and high efficiency can be manufactured.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0014] The following content is merely illustrative of the principles of the present invention. Therefore, even if not explicitly described or illustrated in this specification, those skilled in the art can implement the principles of the present invention and invent various devices included in the concept and scope of the present invention. Also, in principle, all conditional terms and embodiments listed in this specification are clearly intended only for the purpose of understanding the concept of the present invention and should not be construed as being limited to the specifically listed embodiments and states.

[0015] For example, throughout the specification, when a part is said to be "connected (coupled)" to another part, this includes not only the case where it is "directly connected (coupled)", but also the case where it is "indirectly connected (coupled)" with other elements interposed therebetween. Also, when a part is said to "include" a certain component, this means that, unless otherwise specified, it does not exclude other components and may further include other components.

[0016] Also, not only the principles, aspects, and embodiments of the present invention, but also any detailed descriptions listing specific embodiments are to be understood as being intended to include structural and functional equivalents of such matters. It should be noted that such equivalents include not only currently known equivalents but also equivalents developed in the future, that is, any elements invented to perform the same function regardless of structure.

[0017] The above-mentioned objects, features, and advantages will become even more apparent from the following detailed description with reference to the accompanying drawings, whereby those having ordinary knowledge in the technical field to which the present invention pertains should be able to easily implement the technical idea of the present invention. Also, when explaining the present invention, if it is determined that a specific description of the known technology related to the present invention may obscure the gist of the present invention, the detailed description thereof will be omitted.

[0018] FIG. 1 is a perspective view of a metal card 100 according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the metal card 100 according to an embodiment of the present invention.

[0019] First, the metal card 100 may include one or more sheets or layers.

[0020] Also, in one embodiment, the metal card 100 includes a contact-type IC chip module and a wireless communication chip module capable of performing wireless communication, and depending on the card issuing and operating system of the card company, it can process contact-type IC chip-based credit settlement, debit card settlement, or wireless communication chip-based credit settlement, debit card settlement, post-payment settlement, etc. respectively. It may be a card.

[0021] Also, in the embodiments of the present invention described later, the case where the metal card 100 is a card with a single metal material body as a core sheet is exemplified. However, the metal compositions of special material metal materials having various surface roughnesses may be different. The metal core sheet forming the metal body may be formed by mixing different metal materials, formed by mixing metal powder with other core materials such as PVC, formed by laminating different metal material layers, or formed of a clad metal material formed by bonding two or more metal material layers in a layer structure.

[0022] Referring to FIG. 1, the metal card 100 according to the embodiment of the present invention may include a metal layer 110, an adhesive layer 120, a metal vapor deposition layer 130, a first UV pattern layer 140, a digital printing layer 150, a second UV pattern layer 145, an insulating layer 160, an antenna inlay layer 170, an epoxy layer 180, a lower printing layer 190, and a magnetic stripe overlay layer (MS O / L: Magnetic stripe Overlay) 195. A contact-type IC chip 155 in the form of a chip on board (COB: Chip on Board) that provides contact-type communication and transaction functions may be attached to the upper part.

[0023] Although only the above-described components are shown in this figure, the present disclosure is not limited thereto, and other components for realizing the metal card may be further added, and a display unit, a biosensor unit, etc. may be further included for additional functions.

[0024] In addition, the metal card 100 of the present invention may be manufactured in a standard size and thickness according to a predetermined standard, and the size and thickness of each sheet may be determined and combined to an optimal thickness suitable for the operation of the metal card and the sensitivity of wireless communication.

[0025] First, the metal layer 110 according to an embodiment of the present invention is a sheet that forms a layer expressing the material and weight feeling peculiar to metal, and may be formed of a stainless steel (SUS: steel use stainless) material. Alternatively, it may be formed of a solid metal such as copper, copper alloy, and silver having antibacterial properties.

[0026] The metal material constituting the metal layer 110 can be selected in consideration of the material and weight for expressing the characteristics of the metal, as well as the durability, wear degree, degree of deformation, etc. for withstanding the processing steps. In one embodiment, the metal layer 110 made of SUS can be a material that is resistant to corrosion and can be heat-treated. Heat treatment refers to an operation process of heating a metal to a specific temperature and improving it to have specific target properties and metal structures according to the cooling rate. The metal layer 110 may have unevenness on a part or all of the surface in order to increase the adhesive force. Also, the metal layer 110 may be processed by a heat treatment step in order to improve the strength and resilience during the manufacture of the card 100.

[0027] In one embodiment, the metal layer 110 of the present invention can be configured as a large sheet including a plurality of cards, and after a lamination process of combining a plurality of sheets and applying heat and pressure to make one sheet, it can be manufactured as a plurality of cards by cutting. For the cutting operation of the metal sheet including such a plurality of cards, special processing materials, coolants, and cutting tools according to the characteristics of the metal material can be used.

[0028] The insulating layer 160 serves to block the interference between the antenna of the antenna inlay layer 170 and the metal layer 110 so that the antenna can operate. For the NFC antenna to operate, communication with the antenna reader on the opposite side is required. In this case, a magnetic field is generated from the antenna coil provided in the antenna inlay layer 170. At this time, since the antenna coil and the metal material of the metal layer 110 are close to each other, the metal material changes the self-resonant frequency (SRF: self-resonant frequency) of the antenna coil, deteriorates the loss, lowers the inductance of the antenna coil, and ultimately causes a communication failure. This phenomenon is due to eddy currents (eddy currents) generated in the metal by the magnetic field. To eliminate the eddy currents, a high-permeability and high-resistance material must be positioned between the metal and the antenna so that the magnetic field lines can be adjusted in both directions. What is used for this purpose is the insulating layer 160, which is also called a ferrite sheet. Ferrite can be used by grinding iron into powder, oxidizing the outer surface to insulate it, and applying pressure to form the shape. The metal layer 110 and the insulating layer 160 can be joined using hot melt. Hot melt has the characteristics of melting when heated and solidifying when cooled, and can be used as a film-like hot melt adhesive.

[0029] The antenna inlay layer 170 may be a sheet including a radio frequency (RF) antenna coil 121, and the number of turns of the antenna coil may be determined to represent an optimized sensitivity through an RF communication (e.g., NFC, RFID) sensitivity test. Also, the antenna coil of the present invention may be realized to be directly connected to a COB contact area provided on the lower end surface of an IC chip 155 of a chip-on-board (COB) attached through a separate accommodation groove. For this purpose, the metal layer and the insulating layer 160 may be provided with an accommodation groove that opens corresponding to the lower end surface of the IC chip 155.

[0030] Furthermore, an epoxy layer 180, a lower printing layer 190, and a magnetic strip overlay layer 195 may be sequentially provided below the antenna inlay layer 170. The epoxy layer 180 provides body support and buffering effects of epoxy materials. The lower printing layer 190 may print and display information of the card printed on the back surface (rear surface), or an image such as a separate pattern or design may be printed. The magnetic strip overlay layer 195 may be composed of a sheet including a strip with magnetic information.

[0031] On the other hand, in order to efficiently realize the 3D pattern effect according to the embodiment of the present invention based on UV printing on the upper part of the metal layer 110, an adhesive layer 120, a metal vapor deposition layer 130, a first UV pattern layer 140, a digital printing layer 150, and a second UV pattern layer 145 may be sequentially formed.

[0032] In particular, according to the embodiment of the present invention, physical processing variables and chemical processing variables can be considered in advance to form the adhesive layer 120 on the metal layer 110. Such physical processing variables and chemical processing variables can be determined according to a table stored in advance in the memory of the manufacturing apparatus.

[0033] More specifically, examples of the physical processing variables may include physical pretreatment processing variables set corresponding to the surface roughness of the metal layer 110. For example, the card manufacturing apparatus can perform various physical pretreatment processing processes such as sanding intensity, sanding times, brushing intensity, and brushing times based on predetermined physical processing variables corresponding to the first surface roughness of the metal layer 110.

[0034] In addition, examples of chemical processing variables may include chemical pretreatment processing variables set corresponding to the surface roughness of the metal layer 110. For example, the card manufacturing apparatus can set the composition ratio of the adhesive corresponding to the adhesive layer 120, the type of adhesive, the application method of the adhesive, the application strength of the adhesive, the number of times of applying the adhesive, the drying time, etc. to values optimized according to the surface roughness. Further, the chemical processing variables may further include chemical etching pretreatment processing variables corresponding to the metal layer 110.

[0035] Here, examples of the type of the adhesive include various adhesives that provide adhesive strength in combination with a primer, and various adhesives such as acrylic adhesives, polyamides, polyamide amine-based curing agents, epoxy adhesives, acrylic rubber-metal composites, and metal staple adhesives can be configured. As its composition, preferably, it may contain 50 to 60 parts by weight of water, 1.5 parts by weight of 1-ethylpyrrolidin-2-one, 0.9 to 1 part by weight of triethylamine, and 38 to 42 parts by weight of a polyurethane resin. Within the range of the parts by weight, the composition, application method, application variables, etc. by chemical processing variables can be determined.

[0036] Here, the physical processing variables and chemical processing variables can be optimized to minimize the tensile force, peeling problems due to appearance defect rates, and process defect problems that can vary depending on the physical properties and types of the metal materials of each metal layer 110. For this reason, in the card manufacturing apparatus according to the embodiment of the present invention, the surface roughness value corresponding to the type of the metal material of each metal layer 110 and the physical processing variables and chemical processing variables mapped to the surface roughness value can be set to optimal values.

[0037] Such physical and chemical processing variables can be determined to be optimal values that can minimize the appearance defect rate while maximizing the tensile strength according to the bonding structure of the adhesive layer 120, the metal vapor deposition layer 130, the first UV pattern layer 140, the digital printing layer 150, and the second UV pattern layer 145. A pretest regarding this can be conducted and stored in advance in the memory of the card manufacturing apparatus in the form of a data table. Also, the values of the physical and chemical processing variables predetermined by such a table may be transmitted and set from an external device to the card manufacturing apparatus.

[0038] Based on the physically and chemically optimized processing variables in this way, the metal layer 110 may be formed as a body plate composed of an optimized metal material that has undergone physical and chemical pretreatment corresponding to the first surface roughness.

[0039] Furthermore, the adhesive layer 120 can be formed in an optimized structure by determining its composition and coating method based on the chemical processing variables corresponding to the first surface roughness of the metal layer 110.

[0040] On the other hand, the metal vapor deposition layer 130 can be formed on the adhesive layer 120 by a vacuum vapor deposition process using a first metal base. Such a metal vapor deposition layer 130 can enhance the tensile strength with the first UV pattern layer 140, and thereby play a role in preventing peelability in advance.

[0041] Also, since the metal vapor deposition layer 130 is formed by a separate first metal base, it can impart a different metallic feeling from the metal layer and perform a function of expressing a more beautiful aesthetic sense.

[0042] Furthermore, the first UV pattern layer 140 includes a 3D pattern layer formed on the metal vapor deposition layer 130 using a UV printing method. Here, as the UV pattern printing method, a UV coating method formed by applying a well-known UV paint and irradiating and curing it with a UV light source of a certain light amount can be used. In the mode of being formed on the metal vapor deposition layer 130 formed on the adhesive layer 120, by optimizing the above-described physical processing variables and chemical processing variables, the peelability can be minimized.

[0043] Furthermore, the metal card 100 according to an embodiment of the present invention may further include a second UV pattern layer 145, whereby the effect of the 3D pattern can be maximized doubly. However, when the UV pattern layer is doubly formed on the metal vapor deposition layer 130, the manufacturing defect rate of the product due to the above-described metal chips may increase.

[0044] Therefore, the metal card 100 according to an embodiment of the present invention may include a digital printing layer 150 between the first UV pattern layer 140 and the second UV pattern layer 145. In this case, the digital printing layer 150 is a method of directly printing a predetermined digital image with digital printing equipment, and is composed of a printing layer of a predetermined image, and can also play a role of suppressing metal dust that may be generated during the processing of the second UV pattern layer 145 after the processing of the first UV pattern layer 140.

[0045] Also, the digital printing layer 150 can be formed only in a specific side edge region of the first UV pattern layer 140 in order to maximize only the effect of preventing metal chips and reduce its manufacturing cost.

[0046] On the other hand, the second UV pattern layer 145 may be formed of a pattern that can further emphasize the three-dimensional 3D effect provided by the first UV pattern layer 140 or provide a new three-dimensional 3D effect. Since it is printed on the digital printing layer 150, it may be manufactured in a state where the generation of metal chips is minimized.

[0047] In addition, since the aforementioned metal vapor deposition layer 130, first UV pattern layer 140, digital printing layer 150, and second UV pattern layer 145 each have their own unique three-dimensional sense, metallic sense, image printing effect, etc., the metal card 100 according to the embodiment of the present invention is rich and diverse in the combination of the patterns, patterns, forms, and images of the metal vapor deposition layer 130, first UV pattern layer 140, digital printing layer 150, and second UV pattern layer 145, and can maximize the three-dimensional sense and metallic sense.

[0048] Furthermore, the metal card 100 as described above can be formed by driving one or more automated card manufacturing apparatuses that process printing, computerized numerical control (CNC) machining, laminating, etc. according to each process, centering around the metal layer 110 that functions as a core body, to combine the remaining components.

[0049] Therefore, although not shown separately, the card manufacturing apparatus according to the embodiment of the present invention may include a parameter setting unit that sets processes and parameters for each process, a control unit that controls the processes according to the set parameters, and one or more hardware modules that physically process each of printing, bonding, CNC machining, alignment machining, laminating, etc. by driving the control unit.

[0050] By driving such a card manufacturing apparatus, the metal layer 110, adhesive layer 120, metal vapor deposition layer 130, first UV pattern layer 140, digital printing layer 150, second UV pattern layer 145, insulating layer 160, antenna inlay layer 170, epoxy layer 180, lower printing layer 190, and magnetic stripe overlay (MS O / L) 195 according to the embodiment of the present invention can be sequentially formed according to a predetermined process.

[0051] In addition, all of the above-described components may be aligned and pasted together at once, or a primary assembly may be formed by primary processing of a 3D pattern structure including a metal layer 110, an adhesive layer 120, a metal vapor deposition layer 130, a first UV pattern layer 140, a digital printing layer 150, and a second UV pattern layer 145, and then the remaining entire sheet may be aligned and laminated and pasted together, and then processed by secondary lamination to form one card body.

[0052] In particular, in aligning the sheets, one or more alignment holes 115 may be processed in the metal layer 110 according to an embodiment of the present invention, and semi-circular openings 165 corresponding to the alignment holes 115 may be provided in the insulating layer 160. The alignment holes 115 and the semi-circular openings 165 can indicate a predetermined alignment reference position.

[0053] Thereby, the card manufacturing apparatus can grasp the position information of each alignment hole 115 and semi-circular opening 165 with a visual sensor and align the remaining sheets quickly and accurately. This is quicker and more accurate than the existing simple alignment method in which the entire edge range of the card for separate overall sheet alignment is adjusted by light transmission recognition. In particular, alignment errors and errors caused by the fact that the metal layer 110 and the insulating layer 160 do not transmit light can be prevented in advance.

[0054] That is, in the metal layer 110, a light source for visual recognition and alignment can pass through the alignment holes 115, and the insulating layer 160 also passes through the opening region, so that alignment of the antenna inlay layer 170, the epoxy layer 180, the lower printing layer 190, etc. located at the lower end can be processed quickly and easily.

[0055] The metal card 100 formed in this way has an overall 3D pattern layer combining the upper adhesive layer 120, metal vapor deposition layer 130, first UV pattern layer 140, digital printing layer 150 and second UV pattern layer 145 formed to be around 0.01 mm, the metal layer 110 formed to be around 0.35 mm, the insulating layer 160 formed to be around 0.06 mm, the antenna inlay layer 170 formed to be around 0.13 mm, the epoxy layer 180 formed to be around 0.1 mm, the lower printing layer 190 formed to be around 0.1 mm, and the magnetic layer preferably formed to be around 0.04 mm.

[0056] Figure 4 is a flowchart showing a card manufacturing method of a card manufacturing apparatus according to an embodiment of the present invention.

[0057] First, the card manufacturing apparatus detects the first surface roughness of the card body of the metal material to be adhered (S101).

[0058] After that, using the preconfigured optimization mapping table, physical processing variables and chemical processing variables corresponding to the detected first surface roughness are determined (S103).

[0059] Then, pretreatment processing of the metal material card body plate is performed based on the physical processing variables (S105). Here, the pretreated metal material card body plate can constitute the metal layer 110 of the metal card 100.

[0060] After that, an adhesive layer is formed on the metal layer 110 by the composition ratio and application method of the adhesive based on the chemical processing variables (S107).

[0061] Then, a vacuum evaporation process of the first metal base substrate is performed on the adhesive layer 120 to form a metal vapor deposition layer (S109).

[0062] Thereafter, a first UV pattern layer 140 is printed on the metal vapor deposition layer 130 (S111), a digital printing layer 150 is formed on the first UV pattern layer 140 (S113), and a second UV pattern layer 145 is formed on the digital printing layer 150 (S115).

[0063] Here, the metal vapor deposition layer may be formed differently according to the metal base. In particular, it may be formed of a material that can impart a mirror effect to the metal layer 110, and a mirror vapor deposition effect may be further imparted. In this case, the metal vapor deposition layer 130 can be formed as a mirror vapor deposition layer to further enhance the metallic feeling.

[0064] Also, even if the surface of the first UV pattern layer 140 formed on such a mirror vapor deposition layer becomes rough, a smooth metallic feeling can be reapplied by forming the digital printing layer 150 and the second UV pattern layer 145. Depending on the combination of various metal vapor deposition layers 130, first UV pattern layers 140, digital printing layers 150, and second UV pattern layers 145, a beautiful effect can be imparted while the external surface is smooth and the appearance deformation can be minimized.

[0065] Then, by performing sheet alignment and lamination processing through the alignment holes 115 and the semi-circular openings 165, the production of the metal card can be completed (S117).

[0066] FIG. 4 and FIG. 5 are table exemplary diagrams for explaining the configuration of the optimization table according to an embodiment of the present invention.

[0067] Referring to FIGS. 4 and 5, the optimization table of the physical processing variables and the chemical processing variables according to an embodiment of the present invention may be configured according to the results of the optimization tests for each variable.

[0068] As described above, the physical processing variable may be a variable used to perform physical pretreatment of the body plate based on the physical processing variable determined corresponding to the first surface roughness of the metal body plate constituting the metal layer 110 before the formation of the adhesive layer 120.

[0069] Further, the chemical processing variables can be variables used to determine the composition or application method of the adhesive layer based on the chemical processing variables determined corresponding to the first surface roughness before the formation of the adhesive layer 120.

[0070] In determining such variables, in order to optimize the tensile strength, the card manufacturing apparatus can use a tensile test result table for each metal material stored in advance in the memory with respect to the surface roughness, and determine the physical processing variables or chemical processing variables that maximize the tensile strength corresponding to the first surface roughness of the metal material.

[0071] Also, in order to minimize appearance defects, the card manufacturing apparatus can use an appearance test result table for each metal material stored in advance in the memory with respect to the surface roughness, and determine the physical processing variables or chemical processing variables that minimize the appearance defects corresponding to the first surface roughness of the metal material.

[0072] That is, FIGS. 4 and 5 show a tensile test result table for each metal material with respect to the surface roughness, and an appearance test result table for each metal material with respect to the surface roughness. By using the tables constituted by such respective test results, the physical processing variables and chemical processing variables optimized for each surface roughness can be determined.

[0073] For example, according to the roughness of the metal material, as values that minimize appearance defects while maximizing the tensile strength as physical processing variables, the number of sanding times, sanding strength, number of brushing times, brushing strength, etc. can be determined, and as values that minimize appearance defects while maximizing the tensile strength as chemical processing variables, the application method, the working mesh number (mesh density) of the silk screen, the number of application times, the drying time, etc. can be determined.

[0074] FIGS. 6 and 7 are exemplary diagrams for explaining the digital printing structure according to an embodiment of the present invention and its effects.

[0075] First, referring to FIG. 6, FIG. 6 is a photo of the test results implemented by the applicant through its own process tests. FIG. 6(A) shows that when the digital printing layer 150 is not provided, a large number of metal scraps are generated by UV printing on the metal vapor deposition layer.

[0076] However, as shown in FIG. 6(B), when the digital printing layer 150 is printed on the first UV pattern layer 140 according to the embodiment of the present invention, and then the second UV pattern layer 145 is printed, a smooth-shaped sheet can be manufactured without metal scraps or a feeling of foreign matter, indicating that manufacturing defects can be minimized.

[0077] Also, as shown in FIG. 7, the digital printing layer 150 can be used only as a means for minimizing metal scraps that mainly occur at the edges of the card body. In this case, in order to reduce the printing cost, the digital printing layer 150 may be formed such that only a predetermined side edge region is covered on the first UV pattern.

[0078] Such a side edge region may be configured as a region formed in a rectangular frame shape that has a certain width and length and surrounds only the edge region corresponding to the body plate of the metal layer 110, as shown in FIG. 7(A).

[0079] Furthermore, as shown in FIGS. 7(B) and 7(C), when manufacturing a plurality of metal cards 100 in a state where large sheets 400 for forming each layer are laminated, since metal scraps mainly occur only at the peripheral edges of the large sheets 400, it may be configured as a region formed in a rectangular frame shape that surrounds only the peripheral edge region of the large sheets 400.

[0080] FIG. 8 is an exemplary diagram showing UV pattern printing of a metal vapor deposition process base according to an embodiment of the present invention and various metal-like effects by its combination.

[0081] Referring to FIG. 8, the combination of the metal vapor deposition layer 130, the first UV pattern layer 140, the digital printing layer 150, and the second UV pattern layer 145 according to the embodiment of the present invention can provide a beautiful effect, and various combination configurations are possible in which the outer surface is smooth and the appearance deformation is minimized.

[0082] More specifically, for example, FIG. 8(A) can be used as a pattern shape for emphasizing the metallic feeling, and the three-dimensional pattern of FIG. 8(B) can be used as a hologram object pattern shape for enhancing the three-dimensional effect.

[0083] Thereby, as shown in FIG. 8(C), the metallic feeling with the pattern of FIG. 8(A) applied to the metal layer 110, the metal vapor deposition layer 130, and the first UV pattern layer 140, and the digital printing layer 150 in which the map portion as the map shape image is made transparent and the second UV pattern layer (145) are combined with the pattern image in which the hologram object pattern of FIG. 8(B) is three-dimensionally applied, a metal card in a form that emphasizes the metallic feeling of the map shape portion while being three-dimensional can be manufactured.

[0084] Also, as shown in FIG. 8(D), a three-dimensional feeling is given by using the pattern of FIG. 8(B) formed on the metal layer 110, the metal vapor deposition layer 130, and the first UV pattern layer 140, and a metallic feeling pattern of FIG. 8(A) is formed on the second UV pattern layer 145 formed on the digital printing layer 150, whereby a metal card having a shape in which the metallic feeling of the three-dimensional pattern itself is maximized can be manufactured.

[0085] Furthermore, as described above, when a UV pattern printing layer is usually formed on a metal surface, there is a problem that the metallic feeling is reduced due to the three-dimensional structure and roughness occurs. Therefore, a mirror metallic feeling and the like can be realized by the combination of the metal vapor deposition layer 130, the first UV pattern layer 140, the digital printing layer 150, and the second UV pattern layer 145 according to the embodiment of the present invention, and a high-class and smooth-touch metal card 100 can be manufactured.

[0086] FIG. 9 is an exemplary diagram for explaining the alignment hole arrangement according to an embodiment of the present invention and a sheet alignment method using the same.

[0087] Referring to FIG. 9, for aligning a sheet, one or more alignment holes 115 can be processed in the metal layer 110 according to an embodiment of the present invention by a hole punching method, and a semi-circular opening 165 corresponding to the alignment hole 115 can be provided in the insulating layer 160. The alignment hole 115 and the semi-circular opening 165 can indicate a predetermined alignment reference position. Here, the shape of the semi-circular opening 165 is only an example, and any shape or form that opens with the alignment hole 115 as a reference position is possible as long as the alignment hole 115 can be identified, not only a semi-circle.

[0088] Furthermore, the card manufacturing apparatus can grasp the position information of each alignment hole 115 and semi-circular opening 165 with a visual sensor and align the remaining sheets quickly and accurately. As described above, this is quicker and more accurate than the existing simple alignment method in which the entire edge range of the card for separate overall sheet alignment is adjusted by light transmission recognition. In particular, alignment errors and errors caused by the fact that the metal layer 110 and the insulating layer 160 do not transmit light can be prevented in advance.

[0089] For example, the card manufacturing apparatus can sequentially stack the insulating layer 160 and the antenna inlay sheet 170 under the body plate on which the 3D pattern layer is printed on the upper part, and use the position information of the alignment hole 115 that transmits through the sensor light to align and correct the positions of the metal layer 110 of the body plate on which the 3D pattern layers 120, 130, 140, 150, 145 are printed, the insulating layer 160, and the antenna inlay sheet 170.

[0090] Thereby, an opening of the insulating layer 160 may be processed such that a certain area opens around the alignment hole 115 of the body plate of the metal layer 110 and the alignment hole of the body plate is exposed below the insulating layer.

[0091] In addition, for the alignment correction, the card manufacturing apparatus can perform alignment in such a manner that the alignment hole is positioned at the center of a certain region where the insulating layer is open, by adjusting the stacking position of each sheet.

[0092] As described above, the optimal embodiments are disclosed in the drawings and the specification. Here, specific terms are used, but these terms are used only for explaining the present invention and are not used for limiting the meaning or the scope of the present invention described in the claims. Therefore, those having ordinary knowledge in the relevant technical field will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical idea of the appended claims.

Explanation of Reference Numerals

[0093] 100 Metal card 155 IC chip 110 Metal layer 120 Adhesive layer 130 Metal evaporation layer / Metal layer 140 First UV pattern layer 150 Digital printing layer 145 Second UV pattern layer 160 Insulating layer 170 Antenna inlay layer 180 Epoxy layer 190 Lower printing layer 195 Magnetic stripe overlay layer

Claims

1. A method for manufacturing a card using a card manufacturing apparatus, comprising: forming an adhesive layer on the surface of a body plate made of a metal material; forming a metal vapor deposition layer on the surface of the adhesive layer; printing a first UV pattern using UV on the surface of the metal vapor deposition layer to form a first UV pattern layer; printing a predetermined image on the surface of the first UV pattern layer to form a printed layer; printing a second UV pattern using UV on the surface of the printed layer to form a second UV pattern layer, wherein the pattern shape of the first UV pattern is different from the pattern shape of the second UV pattern.

2. The method for manufacturing a card according to claim 1, further comprising performing physical pretreatment of the body plate based on physical processing variables determined corresponding to the surface roughness of the body plate before the step of forming the adhesive layer.

3. The method for manufacturing a card according to claim 1, further comprising determining the composition or application method of the adhesive layer based on chemical processing variables determined corresponding to the surface roughness of the body plate before the step of forming the adhesive layer.

4. The method for manufacturing a card according to claim 1, further comprising determining physical processing variables or chemical processing variables for minimizing appearance defects corresponding to the surface roughness of the metal material using an appearance test result table for each metal material stored in advance in a memory before the step of forming the adhesive layer.

5. The method for manufacturing a card according to claim 1, wherein the pattern shape of the first UV pattern includes a hologram object shape.

6. The method for manufacturing a card according to claim 1, further comprising processing an alignment hole of a predetermined size for inducing alignment when laminating a sheet while transmitting sensor light on one side of the body plate.

7. sequentially laminating an insulating layer and an antenna inlay sheet under the body plate on which the 3D pattern layer is printed on the upper part; correcting the alignment of the positions of the body plate, the insulating layer, and the antenna inlay sheet on which the 3D pattern layer is printed using the position information of the alignment hole; The method for manufacturing a card according to claim 6, further comprising.

8. The manufacturing method of the card according to claim 7, wherein the insulating layer is processed such that a certain area is opened around the alignment hole of the body plate, and the alignment hole of the body plate is exposed below the insulating layer.

9. The step of alignment correction includes The manufacturing method of the card according to claim 8, including the step of adjusting the stacking position of each sheet so that the alignment hole is located at the center of the opened certain area of the insulating layer.

10. In a card, an adhesive layer formed on the surface of a body plate composed of a metal material, A metal vapor deposition layer formed on the surface of the adhesive layer, A first UV pattern layer printed with a first UV pattern on the surface of the metal vapor deposition layer, A printing layer printed with a predetermined image on the surface of the first UV pattern layer, And a second UV pattern layer printed with a second UV pattern on the surface of the printing layer, A card, wherein the pattern shape of the first UV pattern is different from the pattern shape of the second UV pattern.

11. The card according to claim 10, wherein the pattern shape of the first UV pattern includes a hologram object shape.

12. The card according to claim 10, wherein an alignment hole of a predetermined size for guiding alignment is formed on one side of the body plate when laminating sheets.

Images