Vapor deposition mask

Abstract

To provide a vapor deposition mask that makes a mask body and a frame body to less likely to deform using a frame, inhibits the mask body from deviating from a correct position, and improves accuracy relating to vapor deposition.SOLUTION: A vapor deposition mask includes: a mask body with which a number of independent vapor deposition through-holes can be provided at a predetermined pattern; and a frame body disposed integrally with the mask body. An isolating processing part is provided in the frame body. The isolating processing part includes a plurality of through-holes arrayed in a plurality of lines. The through-holes are provided with cut-out parts in ends in a direction in which the through-holes are arrayed in the plurality of lines. The isolating processing part has a shape in which removal parts are adjusted while being increased and decreased in accordance with deformable property of each part of the frame body.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a deposition mask, and can be applied to, for example, a deposition mask for an organic EL element used when forming a light-emitting layer of the organic EL element by a deposition mask method. [Background technology]

[0002] The method for forming the light-emitting layer of an organic EL (Electroluminescence) element is to use a deposition mask. In this deposition mask method, a thin film is deposited on a substrate made of a transparent material such as glass. In order to deposit organic light-emitting materials at desired locations, the areas of the substrate that correspond to the deposition locations are removed. A perforated deposition mask is used.

[0003] In the deposition equipment, the deposition mask is correctly aligned with the substrate on which deposition is to be performed. However, during deposition, the inside of the deposition device must be kept in an environment suitable for deposition. Since heating is generally performed to create a boundary between the deposition mask and the glass substrate, the thermal deformation of the deposition mask and the glass substrate occurs. If they are different, the relative positional relationship between the deposition mask and the substrate changes, and the required light-emitting layer to be formed may be different. There is a problem that the required accuracy cannot be satisfied.

[0004] In recent years, the outer periphery of the thin mask body has been coated with a material having a thermal expansion coefficient equivalent to that of the deposition substrate such as glass. A mask structure is adopted in which a reinforcing frame made of a material having a low thermal expansion coefficient or a material having a low thermal expansion coefficient is attached. Therefore, even if the mask body is made of a material with a different thermal expansion coefficient from the substrate, the mask body The shape changes in accordance with the expansion of the frame, which has the same thermal expansion coefficient as the substrate on which the deposition is performed, or the ... The shape is restricted by the frame having a thermal expansion coefficient and does not change. The mask body can be aligned accurately with respect to the substrate to be deposited, and the light-emitting layer can be deposited on the substrate to be deposited. There has been proposed an evaporation mask that can be formed with high precision.

[0005] As an example of such a conventional evaporation mask, there is one disclosed in Japanese Patent Application Laid-Open No. 2005-15908. There is such a thing.

Prior Art Document

Patent Document

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] Conventional evaporation masks have the configuration shown in the above patent document, and can suppress the relative deformation of the mask and the substrate due to differences in the coefficient of thermal expansion, and prevent a significant deterioration in the positional accuracy of the evaporated film. However, in the market, there is a demand for further higher precision, and it is required to further suppress the occurrence of displacement due to mask displacement. However, in the case of the conventional combination structure of the mask body and the frame, since it is necessary to make the reinforcing frame thin as well, there is a limit to increasing the strength by such a thin frame, and it is not possible to ensure the rigidity to avoid even slight deformation due to the influence of the stress on the mask body side only with the frame. For this reason, in the conventional mask structure, it is difficult to accommodate the displacement of the mask body within the allowable range that becomes stricter with increasing precision, and there is a problem that deterioration of the yield due to positional deviation of the evaporated film cannot be avoided. It can be done.

[0008] However, in the market, there is a demand for further higher precision, and it is required to further suppress the occurrence of displacement due to mask displacement. However, in the case of the conventional combination structure of the mask body and the frame, since it is necessary to make the reinforcing frame thin as well, there is a limit to increasing the strength by such a thin frame, and it is not possible to ensure the rigidity to avoid even slight deformation due to the influence of the stress on the mask body side only with the frame. For this reason, in the conventional mask structure, it is difficult to accommodate the displacement of the mask body within the allowable range that becomes stricter with increasing precision, and there is a problem that deterioration of the yield due to positional deviation of the evaporated film cannot be avoided. However, in the case of the conventional combination structure of the mask body and the frame, since it is necessary to make the reinforcing frame thin as well, there is a limit to increasing the strength by such a thin frame, and it is not possible to ensure the rigidity to avoid even slight deformation due to the influence of the stress on the mask body side only with the frame. For this reason, in the conventional mask structure, it is difficult to accommodate the displacement of the mask body within the allowable range that becomes stricter with increasing precision, and there is a problem that deterioration of the yield due to positional deviation of the evaporated film cannot be avoided. However, in the case of the conventional combination structure of the mask body and the frame, since it is necessary to make the reinforcing frame thin as well, there is a limit to increasing the strength by such a thin frame, and it is not possible to ensure the rigidity to avoid even slight deformation due to the influence of the stress on the mask body side only with the frame. For this reason, in the conventional mask structure, it is difficult to accommodate the displacement of the mask body within the allowable range that becomes stricter with increasing precision, and there is a problem that deterioration of the yield due to positional deviation of the evaporated film cannot be avoided. However, in the case of the conventional combination structure of the mask body and the frame, since it is necessary to make the reinforcing frame thin as well, there is a limit to increasing the strength by such a thin frame, and it is not possible to ensure the rigidity to avoid even slight deformation due to the influence of the stress on the mask body side only with the frame. For this reason, in the conventional mask structure, it is difficult to accommodate the displacement of the mask body within the allowable range that becomes stricter with increasing precision, and there is a problem that deterioration of the yield due to positional deviation of the evaporated film cannot be avoided. However, in the case of the conventional combination structure of the mask body and the frame, since it is necessary to make the reinforcing frame thin as well, there is a limit to increasing the strength by such a thin frame, and it is not possible to ensure the rigidity to avoid even slight deformation due to the influence of the stress on the mask body side only with the frame. For this reason, in the conventional mask structure, it is difficult to accommodate the displacement of the mask body within the allowable range that becomes stricter with increasing precision, and there is a problem that deterioration of the yield due to positional deviation of the evaporated film cannot be avoided. However, in the case of the conventional combination structure of the mask body and the frame, since it is necessary to make the reinforcing frame thin as well, there is a limit to increasing the strength by such a thin frame, and it is not possible to ensure the rigidity to avoid even slight deformation due to the influence of the stress on the mask body side only with the frame. For this reason, in the conventional mask structure, it is difficult to accommodate the displacement of the mask body within the allowable range that becomes stricter with increasing precision, and there is a problem that deterioration of the yield due to positional deviation of the evaporated film cannot be avoided. However, in the case of the conventional combination structure of the mask body and the frame, since it is necessary to make the reinforcing frame thin as well, there is a limit to increasing the strength by such a thin frame, and it is not possible to ensure the rigidity to avoid even slight deformation due to the influence of the stress on the mask body side only with the frame. For this reason, in the conventional mask structure, it is difficult to accommodate the displacement of the mask body within the allowable range that becomes stricter with increasing precision, and there is a problem that deterioration of the yield due to positional deviation of the evaporated film cannot be avoided.

[0009] The present invention has been made to solve the above-mentioned problems, and has an object to provide a deposition mask that makes it difficult for the mask body and frame body to deform, thereby suppressing deviation of the mask body from the correct position, and improving the accuracy of deposition. [Means for solving the problem]

[0010] The deposition mask according to the present disclosure has a large number of independent deposition through-holes arranged in a predetermined pattern. In a deposition mask having a mask body and a frame body integrally disposed with the mask body, The frame body includes a holding frame portion that is connected and integrated with the mask body, and a mask holder that is disposed integrally with the holding frame portion. and a reinforcing frame portion.

[0011] Thus, according to the disclosure of the present invention, the holding frame portion that holds the mask body in the frame body A reinforcing frame is provided to reinforce the mask, thereby increasing the rigidity of the frame against the stress of the mask body. This allows the mask body to be fixed to the deposition device while preventing each part from shifting from its original position. By installing the mask, the alignment between the mask and the substrate can be ensured, and the deposition can be accurately performed at the appropriate position on the substrate. Vapor deposition can be performed easily.

[0012] In addition, the deposition mask according to the present disclosure may further include a holding frame portion in the frame body, if necessary. At least one of through holes and recesses is formed regularly or irregularly at the boundary with the reinforcing frame. The grooves are arranged in a regular line, or the grooves are arranged in a continuous line. A processing portion for use is provided.

[0013] Thus, according to the disclosure of the present invention, the separation is performed at the boundary portion between the holding frame portion and the reinforcing frame portion of the frame body. By providing a processing portion for separating the reinforcing frame from the holding frame, , after positioning and fixing the frame holding frame portion and the mask body on the vapor deposition apparatus side, etc., when it becomes unnecessary to ensure the rigidity of the frame by the reinforcing frame portion, the separation process of the reinforcing frame portion from the holding frame portion can be easily performed without difficulty, and it can smoothly transition to the vapor deposition process by the vapor deposition apparatus. At the same time, the reinforcing frame portion can be separated without affecting the shape of the remaining holding frame portion as the frame and the reinforcement state of the mask body by the holding frame portion, and the subsequent vapor deposition process can proceed without problems. When it becomes impossible to ensure the rigidity of the frame by the reinforcing frame portion, the separation process of the reinforcing frame portion from the holding frame portion can be easily performed without difficulty, and it can smoothly transition to the vapor deposition process by the vapor deposition apparatus. At the same time, the reinforcing frame portion can be separated without affecting the shape of the remaining holding frame portion as the frame and the reinforcement state of the mask body by the holding frame portion, and the subsequent vapor deposition process can proceed without problems. When it becomes impossible to ensure the rigidity of the frame by the reinforcing frame portion, the separation process of the reinforcing frame portion from the holding frame portion can be easily performed without difficulty, and it can smoothly transition to the vapor deposition process by the vapor deposition apparatus. At the same time, the reinforcing frame portion can be separated without affecting the shape of the remaining holding frame portion as the frame and the reinforcement state of the mask body by the holding frame portion, and the subsequent vapor deposition process can proceed without problems. When it becomes impossible to ensure the rigidity of the frame by the reinforcing frame portion, the separation process of the reinforcing frame portion from the holding frame portion can be easily performed without difficulty, and it can smoothly transition to the vapor deposition process by the vapor deposition apparatus. At the same time, the reinforcing frame portion can be separated without affecting the shape of the remaining holding frame portion as the frame and the reinforcement state of the mask body by the holding frame portion, and the subsequent vapor deposition process can proceed without problems. When it becomes impossible to ensure the rigidity of the frame by the reinforcing frame portion, the separation process of the reinforcing frame portion from the holding frame portion can be easily performed without difficulty, and it can smoothly transition to the vapor deposition process by the vapor deposition apparatus. At the same time, the reinforcing frame portion can be separated without affecting the shape of the remaining holding frame portion as the frame and the reinforcement state of the mask body by the holding frame portion, and the subsequent vapor deposition process can proceed without problems.

[0014] In addition, the vapor deposition mask according to the disclosure of the present invention, if necessary, the mask body is integrated with the holding frame portion of the frame in a state where stress that tends to contract inward with respect to the frame remains, the frame is calculated in advance for the predicted deformation amount of each part of the frame assuming a state where a force based on the stress is applied to the frame, the separation processing portion is provided with the separation processing portion of the frame, and the larger the predicted deformation amount at the location where the separation processing portion of the frame is provided, the smaller the ratio of the size of the portion removed as the through hole, recess, or groove to the remaining portion that is not removed at that location. is set to a shape that makes it smaller, In this way, according to the disclosure of the present invention, the predicted deformation amount of each part of the frame due to the force based on the stress of the mask body is estimated in advance, and in the separation processing portion of this frame, the removed portion is made smaller in the ratio of the removed portion to the remaining portion that is not removed at the location where the predicted deformation amount of the frame due to the stress of the mask body is large, while in the location where the predicted deformation amount of the frame due to the stress of the mask body is small, the ratio of the removed portion to the remaining portion that is not removed is made larger,

[0015] and the removed portion of the separation processing portion is adjusted to increase or decrease according to the deformability of each part of the frame, so that the separation processing portion can be adjusted according to the deformability of each part of the frame. In the removed portion of the separation processing portion of the frame, in the location where the predicted deformation amount of the frame due to the stress of the mask body is large, the ratio of the removed portion to the remaining portion that is not removed is made smaller, while in the location where the predicted deformation amount of the frame due to the stress of the mask body is small, the ratio of the removed portion to the remaining portion that is not removed is made larger, so that the separation processing portion can be adjusted according to the deformability of each part of the frame. In the removed portion of the separation processing portion of the frame, in the location where the predicted deformation amount of the frame due to the stress of the mask body is large, the ratio of the removed portion to the remaining portion that is not removed is made smaller, while in the location where the predicted deformation amount of the frame due to the stress of the mask body is small, By forming it into a [specific shape], in a portion where significant deformation of the frame body is expected due to the stress of the mask body, the ratio of the removed portion such as the concave portion in the separation processing portion is reduced to sufficiently ensure the strength of the frame body. On the other hand, in a portion where the stress of the mask body is less likely to be applied to the frame body, the removed portion of the separation processing portion has a large ratio, and while ensuring appropriate strength, the processing efficiency during the separation processing of the reinforcing frame portion is increased so that the reinforcing frame portion can be quickly separated and smoothly transferred to the vapor deposition process.

[0016] Further, the vapor deposition mask according to the disclosure of the present invention, if necessary, the separation processing portion is a groove linearly and continuously arranged at the boundary portion between the holding frame portion and the reinforcing frame portion, and a plurality of through holes drilled at predetermined intervals in the groove in the groove continuous direction. The through holes are provided with acute-angle notches at the ends in the continuous direction of the groove in the through holes. That is, according to the disclosure of the present invention, the separation processing portion of the frame body has a combined structure of a groove and a through hole, and the through hole is partially extended in the continuous direction of the groove to generate an acute-angle notch.

[0017] In this way, according to the disclosure of the present invention, when the separation processing portion of the frame body has a combined structure of a groove and a through hole, and the through hole is partially extended in the continuous direction of the groove to generate an acute-angle notch, when cutting the separation processing portion to separate the reinforcing frame portion of the frame body, a cutting surface is smoothly generated along the separation processing portion starting from the notch portion, and it is difficult for burrs or the like to remain on the holding frame portion side, and it does not have an adverse effect on various operations accompanying the vapor deposition process. That is, when cutting the separation processing portion to separate the reinforcing frame portion of the frame body, a cutting surface is smoothly generated along the separation processing portion starting from the notch portion, and it is difficult for burrs or the like to remain on the holding frame portion side, and it does not have an adverse effect on various operations accompanying the vapor deposition process.

[0018] Further, the installation method of the vapor deposition mask according to the disclosure of the present invention is an installation method of the vapor deposition mask for installing the vapor deposition mask at a preset position in the vapor deposition apparatus, wherein the vapor deposition mask is for a plurality of mask bodies provided with a plurality of independent vapor deposition through holes in a predetermined pattern, the mask body is provided with a plurality of independent vapor deposition through holes in a predetermined pattern, and for the mask body A holding frame part that can be integrally connected to the outer periphery of the body, and a wiring that continuously surrounds the outside of the holding frame part. The frame body has a reinforcing frame portion that is integrally disposed with the holding frame portion at the position, and the frame body is attached to the outside of the mask body. The deposition mask supporting device is manufactured so as to surround the deposition mask. The frame of the deposition mask is fixed integrally to the frame of the deposition mask. The reinforcing frame portion is separated and removed from the retaining frame portion of the frame body in the assembled state.

[0019] Thus, according to the disclosure of the present invention, the strength is increased by the reinforcing frame portion disposed on the outside of the holding frame portion. The deposition mask, which is made by connecting multiple mask bodies to a frame that is less likely to deform, is placed on the frame of the deposition equipment. By fixing the holding frame part of the frame to the deposition apparatus, a state in which the deposition apparatus is supported can be obtained, The deposition mask can be installed in the deposition device while the frame keeps the mask body from deforming, Prevents the mask from displacing, ensures the alignment of the mask with the substrate, and improves deposition accuracy. This improves the yield of deposition products. In addition, the reinforcing frame can be held in place after the frame is fixed to the deposition device. By separating it from the support frame, the reinforcing frame does not become an obstacle to the process after fixing and supporting the deposition mask. Deposition can be carried out without any problems using the deposition device.

[0020] In addition, in the deposition mask installation method according to the present disclosure, the frame has a rectangular outer shape. In the completed state of the deposition mask, the rectangular frame at each position of the frame body and the mask body is The first step measures the displacement in two directions parallel to each side of the body circumference, and the second step measures the inward displacement of a given location. If the displacement does not fall within the preset tolerance range, the displacement is set outside the maximum displacement area. A predetermined tensile force is applied to the outer periphery of the frame in a direction parallel to the maximum displacement. A second step of applying a force having a magnitude that falls within the allowable range, and a third step of measuring the displacements in the two directions at each position of the frame body and the mask body again in the state where the tensile force is applied. When, after the measurement, a location where the newly inward displacement does not fall within the allowable range occurs, while maintaining the state where the tensile force is applied, a fourth step of further applying an outward predetermined tensile force parallel to the direction of the new maximum displacement to the outer peripheral portion of the frame body outside the location where the new maximum displacement occurs, as a force having a magnitude such that the displacement of the location falls within the allowable range. When, at any location corresponding to the inside of the outer peripheral portion of the frame body where the tensile force has already been applied, it is measured that the outward displacement does not fall within the preset allowable range due to the subsequent application of another tensile force, a fifth step of adjusting to reduce the tensile force applied to the outer peripheral portion of the frame body outside the location so that the displacement of the location falls within the allowable range. Including the above, the third to fifth steps are repeatedly performed until the measured displacements at each position of the frame body and the mask body fall within the allowable range. The holding frame portion of the frame body of the vapor deposition mask in which the displacement has fallen within the allowable range is fixed to the frame while the tensile force is applied to the frame body, and after the fixing, the application of the tensile force to the frame body is released. According to the disclosure of the present invention in this way, for a predetermined location of the frame body where large deformation can occur due to the stress of the mask body, a step of applying a tensile force from the outside to keep the displacement within the allowable range is repeated until the displacement at any position of the frame body and the mask body falls within the allowable range. The state of the frame body and the mask body in which the displacement has fallen within the allowable range is left as it is, the holding frame portion of the frame body is fixed to the frame, and after the vapor deposition mask is installed in the vapor deposition apparatus, the tensile force applied to the frame body is released. When, after the measurement, a location where the newly inward displacement does not fall within the allowable range occurs, while maintaining the state where the tensile force is applied, a fourth step of further applying an outward predetermined tensile force parallel to the direction of the new maximum displacement to the outer peripheral portion of the frame body outside the location where the new maximum displacement occurs, as a force having a magnitude such that the displacement of the location falls within the allowable range. When, at any location corresponding to the inside of the outer peripheral portion of the frame body where the tensile force has already been applied, it is measured that the outward displacement does not fall within the preset allowable range due to the subsequent application of another tensile force, a fifth step of adjusting to reduce the tensile force applied to the outer peripheral portion of the frame body outside the location so that the displacement of the location falls within the allowable range. Including the above, the third to fifth steps are repeatedly performed until the measured displacements at each position of the frame body and the mask body fall within the allowable range. The holding frame portion of the frame body of the vapor deposition mask in which the displacement has fallen within the allowable range is fixed to the frame while the tensile force is applied to the frame body, and after the fixing, the application of the tensile force to the frame body is released. According to the disclosure of the present invention in this way, for a predetermined location of the frame body where large deformation can occur due to the stress of the mask body, a step of applying a tensile force from the outside to keep the displacement within the allowable range is repeated until the displacement at any position of the frame body and the mask body falls within the allowable range. The state of the frame body and the mask body in which the displacement has fallen within the allowable range is left as it is, the holding frame portion of the frame body is fixed to the frame, and after the vapor deposition mask is installed in the vapor deposition apparatus, the tensile force applied to the frame body is released. is.

[0021] Thus, according to the disclosure of the present invention, for a predetermined location of the frame body where large deformation can occur due to the stress of the mask body, a step of applying a tensile force from the outside to keep the displacement within the allowable range is repeated until the displacement at any position of the frame body and the mask body falls within the allowable range. The state of the frame body and the mask body in which the displacement has fallen within the allowable range is left as it is, the holding frame portion of the frame body is fixed to the frame, and after the vapor deposition mask is installed in the vapor deposition apparatus, the tensile force applied to the frame body is released. When, after the measurement, a location where the newly inward displacement does not fall within the allowable range occurs, while maintaining the state where the tensile force is applied, a fourth step of further applying an outward predetermined tensile force parallel to the direction of the new maximum displacement to the outer peripheral portion of the frame body outside the location where the new maximum displacement occurs, as a force having a magnitude such that the displacement of the location falls within the allowable range. When, at any location corresponding to the inside of the outer peripheral portion of the frame body where the tensile force has already been applied, it is measured that the outward displacement does not fall within the preset allowable range due to the subsequent application of another tensile force, a fifth step of adjusting to reduce the tensile force applied to the outer peripheral portion of the frame body outside the location so that the displacement of the location falls within the allowable range. Including the above, the third to fifth steps are repeatedly performed until the measured displacements at each position of the frame body and the mask body fall within the allowable range. By releasing the force, while surely preventing the displacement of the mask body accompanied by the deformation of the frame body in the evaporation mask from the correct position by a method of suppressing the deformation of the entire frame body by applying an external force, the frame body is fixed to the flange, and an appropriate installation state of the evaporation mask in the evaporation apparatus can be ensured, and the accuracy related to evaporation can be further improved. Also, the method for manufacturing an evaporation mask according to the disclosure of the present invention is a method for manufacturing an evaporation mask including a plurality of mask bodies made of metal provided with a large number of evaporation through holes and a frame body made of metal disposed so as to surround the outside of the mask body. In the method, a first electroforming step of forming a primary electroplated layer corresponding to the mask body by electroforming metal at a plurality of predetermined positions on a master mold, and aligning the primary electroplated layer so as to be positioned within a plurality of openings provided in advance in the frame body, while disposing the frame body on the master mold. A frame body disposing step, a frame body processing step of performing a predetermined removal process on the frame body to provide a separation processing portion in which at least one of through holes or recesses is arranged in a plurality of lines regularly or irregularly, or in which grooves are continuously arranged linearly, and a second electroforming step of forming a metal layer by electroforming in a predetermined range extending from a part or all of the surface of the frame body to the outer peripheral surface of the primary electroplated layer, and integrally connecting the frame body and the primary electroplated layer through the metal layer so as not to separate, and a peeling step of peeling the integral primary electroplated layer, frame body, and metal layer from the master mold. Thus, according to the disclosure of the present invention, a primary electroplated layer serving as a mask body is formed on a master mold, the frame body is disposed so as to be positioned around the primary electroplated layer, and a metal layer for connecting the frame body and the primary electroplated layer is formed in a predetermined range extending from the surface of the frame body to the outer peripheral surface of the primary electroplated layer.

[0022]

[0023] During the process, a section for separation is provided on the frame by a predetermined removal process. The primary electrodeposition layer, the frame and the metal layer are peeled off from the matrix as a single unit to obtain a deposition mask, and then the frame is The area that holds the inner mask body together and the entire outer frame are separated by the cut-off part. The area where the frame is reinforced can be set, and the area outside the cut-off processing part of the frame can be made large enough. For example, the rigidity of the frame body against the force applied to the frame body from the mask body based on the stress of the mask body can be increased. This allows the mask to be steamed while preventing each part of the mask from shifting out of its original position. The deposition mask is fixed to the deposition apparatus to ensure that the mask and the substrate are aligned. The deposition mask can be fixed to the deposition device. After installation, if it becomes unnecessary to secure the rigidity of the frame body by the area outside the separation processing part of the frame body, By performing the separation process at the separation processing section, the outer area of ​​the frame body can be easily separated without any difficulty. This allows for a smooth transition to the deposition process using a deposition device, while the inner area remains as a frame. To separate the outer region without affecting the shape of the part and the state of holding the mask body by this This allows the subsequent deposition process to proceed without any problems. [Brief description of the drawings]

[0024]

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Embodiments for Carrying Out the Invention

[0025] (The First Embodiment of the Present Invention) Hereinafter, the vapor deposition mask according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 12. In this embodiment, an example applied to the vapor deposition mask for an organic EL element will be described.

[0026] In each of the above figures, the vapor deposition mask 1 according to this embodiment includes a plurality of mask bodies 2 provided with a plurality of vapor deposition through holes 8 in a predetermined pattern and a frame body 3 arranged to surround the outside of the mask body 2. It is a configuration including these.

[0027] The mask body 2 is formed into a sheet shape by electroforming using a nickel alloy such as nickel or nickel cobalt, or other electroplated metal as a material, and has a large number of independent vapor deposition through holes through which the vapor deposition material passes. The holes 8 are provided in a predetermined pattern.

[0028] The mask body 2 includes an internal pattern formation region 2a provided with a large number of vapor deposition through-holes 8, and an outer peripheral edge 2b that is integrally joined to the frame body 3 via a metal layer 7 formed by electroforming. In the pattern formation region 2a, a large number of vapor deposition through-holes 8 form a vapor deposition pattern 9 for forming a light-emitting layer.

[0029] The thickness of the mask body 2 is preferably in the range of 10 to 100 μm, and is set to 20 μm in this embodiment. Each vapor deposition through-hole 8 has, for example, a rectangular shape with a front-rear length dimension of 70 μm and a left-right width dimension of 170 to 200 μm in plan view. These vapor deposition through-holes 8 form a matrix-like vapor deposition pattern 9 in which a plurality of through-hole groups arranged linearly in the front-rear direction are used as columns, and a plurality of columns are arranged in parallel in the left-right direction.

[0030] The frame body 3 is a rectangular thin plate having a thickness greater than that of the mask body 2 and having a frame shape. It is disposed on the outer periphery of the mask body 2 for reinforcement and is configured to be integrally connected to the mask body 2 via the metal layer 7. Specifically, the frame body 3 includes a holding frame portion 4 that is integrally connected to the outer peripheral edge of the mask body 2, and a reinforcing frame portion 5 that is disposed integrally with the holding frame portion 4 in a continuous surrounding arrangement outside the holding frame portion 4.

[0031] The frame body 3 is formed of a material having a low coefficient of thermal expansion, such as an Invar material which is a nickel-iron alloy, or a Super Invar material which is a nickel-iron-cobalt alloy. Then, the frame body 3 is integrally connected to the outer peripheral edge 2b of the pattern formation region 2a of the mask body 2 by the metal layer 7 formed by electroforming so as not to be separated from each other. ​​​​​​​​​​​​​

[0032] When an Invar material or a super Invar material is adopted as the material of the frame body 3, its coefficient of thermal expansion is extremely small, so that dimensional changes of the mask body 2 due to the thermal influence in the vapor deposition process can be favorably suppressed. That is, when the mask body 2 has a coefficient of thermal expansion larger than that of a general glass which is a vapor deposition substrate (not shown), such as nickel, unlike the case where the coefficient of thermal expansion of the mask body 2 is larger than that of the general glass which is a vapor deposition substrate (not shown), such as nickel, due to the difference in the coefficient of thermal expansion at the high temperature during vapor deposition, when the vapor deposition mask 1 is aligned with the vapor deposition substrate at room temperature, there is no deviation between the through-hole position with respect to the substrate and the vapor deposition position of the vapor deposition material during actual vapor deposition. Due to the feature that the coefficient of thermal expansion of the frame body 3 holding the mask body 2 is small, dimensional changes and shape changes caused by the expansion of the mask body 2 during temperature rise can be well suppressed, and the alignment accuracy at room temperature can be favorably maintained even during temperature rise during vapor deposition. Furthermore, the material of the frame body 3 can be a material with a low coefficient of thermal expansion close to that of the glass or the like which is the vapor deposition substrate, for example, glass or ceramic. In this case, conductivity is imparted to at least the surface of these materials.

[0033] As shown in FIG. 4, the frame body 3 is formed in a rectangular frame shape made of a thin plate having six openings 3a corresponding to the mask body 2, and holds six mask bodies 2 with one frame body 3. That is, six openings 3a are arranged in alignment on the plate surface of the frame body 3, and one mask body 2 is mounted in each opening 3a. Among the frame body 3, the width of the wide outer peripheral portion having the reinforcing frame portion 5 is set to about 60 mm, for example, the width of the holding frame portion 4 is about 10 mm, and the width of the reinforcing frame portion 5 is about

[0034] 50 mm. Also, the thickness dimension of the frame body 3 is set to about 0.1 to 5.0 mm, for example. That is, six openings 3a are arranged in alignment on the plate surface of the frame body 3, and one mask body 2 is mounted in each opening 3a. The width of the wide outer peripheral portion having the reinforcing frame portion 5 of the frame body 3 is set to about 60 mm, for example, the width of the holding frame portion 4 is about 10 mm, and the width of the reinforcing frame portion 5 is about 50 mm. Also, the thickness dimension of the frame body 3 is set to about 0.1 to 5.0 mm, for example. For example, it is set to about 60 mm, among which the width of the holding frame portion 4 is about 10 mm, and the width of the reinforcing frame portion 5 is about 50 mm. Also, the thickness dimension of the frame body 3 is, for example, about 0.1 to 5.0 mm In this embodiment, it is set to 1.0 mm.

[0035] At the boundary between the holding frame portion 4 and the reinforcing frame portion 5 in this frame body 3, a separating processing portion 3b having a shape combining a linearly continuous groove 3c and a plurality of through holes 3d is provided. For separation The width of the processing portion 3b is set to, for example, about 2 mm.

[0036] This separating processing portion 3b is linearly continuously arranged at the boundary between the holding frame portion 4 and the reinforcing frame portion 5 and has a combined shape with a groove 3c and a plurality of through holes 3d drilled at predetermined intervals in the direction of groove continuity within this groove 3c. Among these, the through hole 3d is provided with an acute notch portion 3e at the end in the continuous direction of the groove 3c in this through hole.

[0037] Note that the position of the tip (acute corner portion) of the notch portion 3e is preferably set to be shifted toward the holding frame portion 4 or the reinforcing frame portion 5 from the center position in the width direction of the separating processing portion 3b, and it is more preferable to shift it toward the holding frame portion 4 on the mask body 2 side.

[0038] The separating processing portion 3b can be provided not only by etching the frame body 3 but also by removing unnecessary portions by machining or laser processing. Note that the separating processing portion 3b is not limited to having a through hole 3d with a cross-sectional shape having a notch portion 3e, and it may be a through hole with a simple rectangular or circular cross-section. Also, the separating processing portion 3b may have a configuration in which, in addition to a shape combining a groove 3c and a through hole 3d, a groove in which through holes are not provided side by side at a predetermined interval is provided in a linearly continuous arrangement. In addition, the separating processing portion 3b may be such that at least one of the through holes or recesses is regular or irregular. ​​​​​​Alternatively, the electrodes may be arranged in a plurality of lines.

[0039] The frame 3 with the cut-off processed portion 3b provided in advance is used for manufacturing the deposition mask 1. After the formation of the primary electrodeposition layer 15 which will become the mask body, the primary electrodeposition layer 15 is In addition, the unprocessed frame body 3 is placed on the matrix 10. Then, in the intermediate stage of the subsequent manufacturing process, the frame body 3 is provided with a separation processing portion 3b. It can also be.

[0040] The deposition mask 1 is provided on the surface of the matrix 10 in a manner corresponding to a non-positioned portion of the primary electrodeposition layer 15. After the next pattern resist 14 is provided, a primary electrodeposition layer is formed on the matrix 10 by electroforming a metal. A frame 3 is disposed so as to surround the primary electrodeposition layer 15. After forming a secondary pattern resist 18 covering the portion of the layer 15 corresponding to the pattern forming region 2a, A metal layer 7 is formed by electroforming so as to cover the surface of the frame 3 and the surface of the outer periphery 2b of the primary electrodeposition layer 15. The primary electrodeposition layer 15 and the frame 3 are integrally connected via the metal layer 7 so as not to be separated. In this state, the primary electrodeposition layer 15, the frame 3, and the metal layer 7 are separated from the matrix 10. It is manufactured by

[0041] The matrix 10 used in the manufacturing process of the deposition mask 1 according to this embodiment is made of stainless steel. They are made of conductive materials such as brass and steel, and are separated during the deposition mask manufacturing process. The mask body 2 is made up of the primary electrodeposition layer 15 and other components. At each stage, a primary pattern resist 14, a primary electrodeposition layer 15, and a secondary pattern resist are formed on the front side. The anode 18 and the metal layer 7 are formed. When forming the primary electrodeposited layer 15 or the metal layer 7, by energizing through the master mold 10, the primary electrodeposited layer 15 or the metal layer 7 is formed by electroforming on the energizable part not covered by the resist on the surface of the master mold 10. This will be the case.

[0042] The master mold 10 can be made of a material with a low coefficient of thermal expansion such as 42 alloy (42% nickel - iron alloy), invar (36% nickel - iron alloy), SUS430, etc. In addition, the master mold may also be formed by depositing a metal film made of a conductive metal such as chromium or titanium on the surface of an insulating substrate such as a glass plate or a resin plate. This will do.

[0043] In the manufacturing process of the evaporation mask 1, after the metal layer 7 is formed by electroforming on the master mold 10 (see Fig. 9 (B)), the master mold 10 is separated and removed from these (see Fig. 9(C)). When the master mold 10 is made of a stainless material, it is preferable to use a method of physically peeling it off from the evaporation mask side by applying force, and when the master mold 10 is made of other metal materials, it is preferable to use an etching method of dissolving and removing it using a chemical solution. In the case of etching, the master mold 10 dissolves, but a selective etching solution having a property such that the materials forming the primary electrodeposited layer 15, the frame 3, and the metal layer 7 are not affected will be used. will be used. will be used. This will be the case.

[0044] The primary electrodeposited layer 15 is made of nickel or a nickel alloy such as nickel - cobalt suitable for electroforming, and is formed by electroforming on the part of the master mold 10 where there is no primary pattern resist 14. In the evaporation mask 1, the primary electrodeposited layer 15 forms the mask body 2 that covers the surface of the substrate to be evaporated, excluding the evaporation through - holes 8 corresponding to the evaporation target locations such as the light - emitting layer on the substrate to be evaporated. This will be the case. This will be the case. This will be the case.

[0045] The primary pattern resist 14 is made of an insulating material having resistance to the electrolytic solution used for electroforming the primary electrodeposited layer 15, and is disposed corresponding to the non-disposed portion of the primary electrodeposited layer 15 preset on the master mold 10, and is removed after the formation of the primary electrodeposited layer 15 (see FIGS. 6 and 7). This primary pattern resist 14 is disposed on the master mold 10 prior to the formation of the primary electrodeposited layer 15. A photosensitive resist, for example, a negative photosensitive dry film resist, is disposed on the master mold 10 to have a predetermined thickness, for example, a thickness of about 20 μm. With the mask film 12 of a predetermined pattern corresponding to the position of the mask body 2 of the vapor deposition mask 1, that is, the position where the primary electrodeposited layer 15 is disposed, being placed thereon, it is cured by exposure to ultraviolet rays and subjected to processes such as development to remove the resist in the non-irradiated portion, and is formed in a shape corresponding to the non-disposed portion of the primary electrodeposited layer 15. (see FIGS. 6 and 7). (See FIGS. 6 and 7).

[0046] This primary pattern resist 14 is disposed on the master mold 10 prior to the formation of the primary electrodeposited layer 15. A photosensitive resist, for example, a negative photosensitive dry film resist, is disposed on the master mold 10 to have a predetermined thickness, for example, a thickness of about 20 μm. With the mask film 12 of a predetermined pattern corresponding to the position of the mask body 2 of the vapor deposition mask 1, that is, the position where the primary electrodeposited layer 15 is disposed, being placed thereon, it is cured by exposure to ultraviolet rays and subjected to processes such as development to remove the resist in the non-irradiated portion, and is formed in a shape corresponding to the non-disposed portion of the primary electrodeposited layer 15. (see FIGS. 6 and 7). (See FIGS. 6 and 7). After being subjected to processes such as development to remove the resist in the non-irradiated portion, it is formed in a shape corresponding to the non-disposed portion of the primary electrodeposited layer 15. .

[0047] The secondary pattern resist 18 is made of an insulating material having resistance to the electrolytic solution used for electroforming the metal layer 7, and is disposed corresponding to the non-disposed portion of the metal layer 7 preset in advance, and is removed after the formation of the metal layer 7 (see FIGS. 8 and 9). This secondary pattern resist 18 is disposed prior to the formation of the metal layer 7. A photosensitive resist, for example, a negative photosensitive dry film resist, is disposed on the master mold 10 and the already disposed primary electrodeposited layer 15 to have a predetermined thickness, for example, a thickness of about 15 μm. With the mask film 17 of a predetermined pattern corresponding to the positions of the metal layer 7 and the frame body 3 of the vapor deposition mask 1 being placed thereon,

[0048] This secondary pattern resist 18 is disposed prior to the formation of the metal layer 7. A photosensitive resist, for example, a negative photosensitive dry film resist, is disposed on the master mold 10 and the already disposed primary electrodeposited layer 15 to have a predetermined thickness, for example, a thickness of about 15 μm. With the mask film 17 of a predetermined pattern corresponding to the positions of the metal layer 7 and the frame body 3 of the vapor deposition mask 1 being placed thereon, it is cured by exposure to ultraviolet rays and subjected to processes such as development to remove the resist in the non-irradiated portion, and is formed in a shape corresponding to the non-disposed portion of the metal layer 7. In the formed state, through processes such as curing by exposure to ultraviolet light and development to remove the photosensitive material in the non-irradiated part it is formed in a shape corresponding to the non-arrangement part of the metal layer 7 (pattern formation region 2a of the mask body 2).

[0049] The metal layer 7 is formed by electroforming and is made of nickel, nickel-cobalt alloy, etc., and is formed by electroforming on the exposed part of the master mold 10, the already arranged primary electrodeposited layer 15, and the secondary pattern resist 18 on the frame body 3 where there is no secondary pattern resist 18 arranged.

[0050] This metal layer 7 connects the mask body 2 and the frame body 3. The metal layer 7 is laminated by electroforming on the upper surface of the mask body 2 corresponding to the outer peripheral edge 2b of the pattern formation region. Specifically, the metal layer 7 is formed on the upper surface of the outer peripheral edge 2b of the pattern formation region 2a in the mask body 2, the upper surface of the frame body 3, the side surface on the pattern formation region 2a side, and the gap part between the mask body 2 and the frame body 3, and in this way, it integrally connects the outer peripheral edge 2b of the pattern formation region 2a and the opening peripheral edge of the frame body 3 without separating them.

[0051] Note that the metal layer 7 can be formed on the entire surface (upper surface) including both the holding frame part 4 and the reinforcing frame part 5 of the frame body 3, but since the reinforcing frame part 5 of the frame body 3 is separated and removed by cutting at the later separation processing part 3b, the metal layer 7 may also be formed only on the surface of the holding frame part 4.

[0052] Next, the manufacturing process of the vapor deposition mask and the installation process on the vapor deposition apparatus according to this embodiment will be described. Regarding the manufacturing process of the vapor deposition mask, first, on the master mold 10, a mask that is preset ​​​​​​​​​​​Corresponding to the vapor deposition through holes 8 in the main body 2, that is, the non-disposed portions of the primary electrodeposited layer 15, a resist layer 11 is disposed on the master mold 10 (see Fig. 6). Specifically, on the surface side of the master mold 10, for example, one or several sheets of a negative-type photosensitive dry film resist are laminated in accordance with a predetermined thickness (for example, about 20 μm) corresponding to the height of the primary electrodeposited layer 15 to be formed, and the resist layer 11 is formed by thermocompression bonding (see Fig. 6(A)). And, on the surface of the resist layer 11, a mask film (glass mask ) 12 having a light-transmitting hole 12a corresponding to the vapor deposition through hole 8 and having a predetermined pattern corresponding to the arrangement position of the primary electrodeposited layer 15 is adhered, and then, hardening by exposure using ultraviolet irradiation (see Figs. 6(B) and (C)), development for removing the resist of the non-irradiated portion that has been masked, drying, and other processes are performed. In this way, a primary pattern resist 14 corresponding to the non-disposed portion of the primary electrodeposited layer 15 is formed on the master mold 10 (see Fig. 7(A)). Note that such a primary pattern resist 14 can be formed by a lithography method using a photoresist or the like or any other arbitrary method, and the formation method is not limited to the above. The master mold 10 having this primary pattern resist 14 is placed in an electroforming bath set under predetermined conditions, and within the range of the thickness of the primary pattern resist 14, on the surface (exposed region) of the master mold 10 that is not covered by the primary pattern resist 14, an electroformed layer of an electroplated metal such as a nickel alloy, for example, a 20-μm-thick primary electrodeposited layer 15 serving as the mask main body 2 is formed (see Fig. 7(B)).

[0053] That is, corresponding to the vapor deposition through holes 8 in the main body 2, i.e., the non-disposed portions of the primary electrodeposited layer 15, a resist layer 11 is disposed on the master mold 10 (see Fig. 6). Specifically, on the surface side of the master mold 10, for example, one or several sheets of a negative-type photosensitive dry film resist are laminated in accordance with a predetermined thickness (for example, about 20 μm) corresponding to the height of the primary electrodeposited layer 15 to be formed, and the resist layer 11 is formed by thermocompression bonding (see Fig. 6(A)). And then, on the surface of the resist layer 11, a mask film (glass mask ) 12 having a light-transmitting hole 12a corresponding to the vapor deposition through hole 8 and having a predetermined pattern corresponding to the arrangement position of the primary electrodeposited layer 15 is adhered, and then, hardening by exposure using ultraviolet irradiation (see Figs. 6(B) and (C)), development for removing the resist of the non-irradiated portion that has been masked, drying, and other processes are performed. In this way, a primary pattern resist 14 corresponding to the non-disposed portion of the primary electrodeposited layer 15 is formed on the master mold 10 (see Fig. 7(A)). Note that such a primary pattern resist 14 can be formed by a lithography method using a photoresist or the like or any other arbitrary method, and the formation method is not limited to the above. The master mold 10 having this primary pattern resist 14 is placed in an electroforming bath set under predetermined conditions, and within the range of the thickness of the primary pattern resist 14, on the surface (exposed region) of the master mold 10 that is not covered by the primary pattern resist 14, an electroformed layer of an electroplated metal such as a nickel alloy, for example, a 20-μm-thick primary electrodeposited layer 15 serving as the mask main body 2 is formed (see Fig. 7(B)). Note that such a primary pattern resist 14 can be formed by a lithography method using a photoresist or the like or any other arbitrary method, and the formation method is not limited to the above.

[0054] That is, corresponding to the vapor deposition through holes 8 in the main body 2, i.e., the non-disposed portions of the primary electrodeposited layer 15, a resist layer 11 is disposed on the master mold 10 (see Fig. 6). Specifically, on the surface side of the master mold 10, for example, one or several sheets of a negative-type photosensitive dry film resist are laminated in accordance with a predetermined thickness (for example, about 20 μm) corresponding to the height of the primary electrodeposited layer 15 to be formed, and the resist layer 11 is formed by thermocompression bonding (see Fig. 6(A)). And then, on the surface of the resist layer 11, a mask film (glass mask Note that such a primary pattern resist 14 can be formed by a lithography method using a photoresist or the like or any other arbitrary method, and the formation method is not limited to the above.

[0055] The master mold 10 having this primary pattern resist 14 is placed in an electroforming bath set under predetermined conditions, and within the range of the thickness of the primary pattern resist 14, on the surface (exposed region) of the master mold 10 that is not covered by the primary pattern resist 14, an electroformed layer of an electroplated metal such as a nickel alloy, for example, a 20-μm-thick primary electrodeposited layer 15 serving as the mask main body 2 is formed (see Fig. 7(B)). Note that such a primary pattern resist 14 can be formed by a lithography method using a photoresist or the like or any other arbitrary method, and the formation method is not limited to the above. That is, corresponding to the vapor deposition through holes 8 in the main body 2, i.e., the non-disposed portions of the primary electrodeposited layer 15, a resist layer 11 is disposed on the master mold 10 (see Fig. 6). Specifically, on the surface side of the master mold 10, for example, one or several sheets of a negative-type photosensitive dry film resist are laminated in accordance with a predetermined thickness (for example, about 20 μm) corresponding to the height of the primary electrodeposited layer 15 to be formed, and the resist layer 11 is formed by thermocompression bonding (see Fig. 6(A)). And then, on the surface of the resist layer 11, a mask film (glass mask

[0056] Thereafter, by dissolving and removing the primary pattern resist 14, a primary electrodeposited layer 15 is obtained which serves as a mask body 2 provided with a large number of independent vapor deposition through holes 8 forming a predetermined vapor deposition pattern 9 (see Fig. 7(C)).

[0057] After the primary electrodeposited layer 15 is obtained, a resist layer 16 is disposed on the entire surface of the master mold 10 including the formed portion of the primary electrodeposited layer 15. Specifically, on the surface side of the master mold 10, for example, a negative photosensitive dry film resist is laminated one or several sheets in accordance with a predetermined thickness (for example, about 15 μm) set in advance, and the resist layer 16 is formed by thermocompression bonding (see Fig. 8(A)).

[0058] Then, as shown in Fig. 8(B), after a mask film 17 having a light-transmitting hole 17a corresponding to the pattern forming region 2a of the mask body 2 is adhered to the surface of the resist layer 16, an exposure treatment by ultraviolet irradiation is performed to cure it (see Figs. 8(B) and (C)). As a result, a resist layer 16a in which the portion corresponding to the pattern forming region 2a is exposed and a resist layer 16b in which the other portions are unexposed are obtained.

[0059] Here, a frame body 3 in which a separation processing portion 3b is provided in advance is aligned so as to surround the primary electrodeposited layer 15 and disposed on the master mold 10 (see Fig. 8(C)). The frame body 3 here can be temporarily fixed so as not to move easily on the master mold 10 due to the adhesiveness of the unexposed resist layer 16b.

[0060] After the frame body 3 is disposed, a process of dissolving and removing the unexposed resist layer 16b exposed on the surface is performed to form a secondary pattern resist 18 covering the pattern forming region (see Fig. 9(A)). ​​​​​​​​​​​​​Note that the unexposed resist layer 16b existing on the lower side of the frame 3 does not appear on the surface. It is not removed and remains on the master mold 10 to continue to play a role in fixing the frame 3.

[0061] After that, on the upper surface of the primary electrodeposited layer 15 exposed on the surface related to the outer peripheral edge 2b of the pattern formation region 2a, which is not covered by the secondary pattern resist 18, and on the surface of the master mold 10 exposed between the frame 3 and the primary electrodeposited layer 15 and on the surface of the frame 3, a metal layer 7 is formed by electroforming of an electrodeposited metal (see Fig. 9(B)). The metal layer 7 can integrally connect the primary electrodeposited layer 15 and the frame 3 so as not to separate them. (See Fig. 9(B)). The metal layer 7 can integrally connect the primary electrodeposited layer 15 and the frame 3 so as not to separate them.

[0062] In this case, the metal layer 7 is formed such that the thickness on the upper surface of the primary electrodeposited layer 15 exposed on the surface related to the outer peripheral edge 2b of the pattern formation region 2a and on the surface of the master mold 10 exposed between the primary electrodeposited layer 15 and the frame 3 is 30 μm. On the other hand, the thickness of the metal layer 7 on the surface of the frame 3 is 15 μm. This difference in thickness is because the metal layer 7 is sequentially laminated from the surface of the master mold 10 and reaches the frame 3 only after exceeding the height dimension of the unexposed resist layer 16b, and then the frame 3 becomes conductive with the master mold 10, and the formation of the metal layer 7 on the surface of the frame 3 starts.

[0063] When the formation of the metal layer 7 is completed, as the final step, the integral primary electrodeposited layer 15, frame 3 and metal layer 7 are peeled off from the master mold 10 (see Fig. 9(C)). Further, by removing the secondary pattern resist 18 and the unexposed resist layer 16b existing on the lower side of the frame 3, the manufacture of the vapor deposition mask 1 is completed.

[0064] The vapor deposition mask 1 obtained through the above manufacturing processes has its mask body 2 facing the outer frame 3. ​​​​​It is configured to generate a stress F in the direction of contracting inward. Specifically, a primary electrodeposited layer 15 is formed on the master mold 10 by electroforming using a material with a large coefficient of thermal expansion. By doing so, in an environment where the temperature is higher than the normal temperature at which electroforming is performed, the primary electrodeposited layer 15 expands linearly more than the master mold and is formed on the surface of the master mold. Since the deformation is restricted on the master mold 10, although it tries to contract more than the master mold 10 at normal temperature, no contraction occurs, and a stress in the direction of contracting inward is generated in the primary electrodeposited layer 15. A stress in the direction of contracting inward is generated.

[0065] On the other hand, the frame body 3 is disposed with respect to the master mold 10 in a normal temperature environment, and since the frame body itself is also formed of a material with a low coefficient of thermal expansion, even in a state where the primary electrodeposited layer 15 and the frame body 3 are connected by the formation of the metal layer 7, the primary electrodeposited layer 15 still has a stress in the direction of contracting inward. Therefore, when the integral primary electrodeposited layer 15 and the frame body 3 are separated from the master mold 10, the primary electrodeposited layer 15, that is, the mask body 2 tries to contract inward with respect to the frame body 3 and applies an inward tensile force to the frame body 3. This will happen.

[0066] Subsequently, the installation process of the vapor deposition mask according to the present embodiment on the vapor deposition apparatus will be described. As described above, since the mask body 2 is formed in a state where it generates a stress in the direction of contracting inward with respect to the frame body 3, a force that tries to deform the frame body 3 is applied from the mask body 2. Here, the frame body 3 has a configuration in which a reinforcing frame portion 5 is integrally disposed outside the holding frame portion 4, and the reinforcing frame portion 5 reinforces the holding frame portion 4 that holds the mask body 2 inside the frame body 3 from the outside. As a result, the rigidity of the frame body 3 against the force that tries to deform the frame body 3 due to the stress of the mask body 2 is increased, and the frame body 3 that receives the force does not deform significantly. In addition, since the frame 3 is less likely to deform, the mask body 2 is also less likely to deform. do.

[0067] The deposition mask 1 formed by the combination of the mask body 2 and the frame 3 is placed in a deposition vessel or the like. The deposition mask 1 is first placed in the deposition apparatus so that deposition can be performed. After being properly positioned on a frame 50 provided in the deposition apparatus for supporting a deposition mask, The frame 50 is made of a material with low thermal expansion coefficient such as Invar. It is a frame-shaped member made of multiple materials and is formed with a thickness of 10 to 25 mm. This fixing is performed by spot welding the holding frame portion 4 of the frame body 3 of the deposition mask 1 to the frame 50. This is achieved by bonding or welding the parts together in a manner that is strong enough to withstand the heat of deposition.

[0068] The fixing of the holding frame 4 to the frame 50 by welding is performed by using a frame provided in the deposition apparatus. In addition to performing this on the frame 50, if the frame 50 can be removed from the deposition apparatus, Alternatively, this may be done with the frame 50 removed for easier handling.

[0069] The frame 50 has a significantly higher rigidity than the frame 3 of the deposition mask 1, and supports the holding frame 4. When fixed to the frame 50, the holding frame portion 4 is completely fixed without being displaced or deformed relative to the frame 50. The mask body 2, which is integrated with the mask and connected to the inside of the holding frame 4, is also deformed by the stress. This does not cause any problem, and the positional relationship with respect to the frame 50 can be maintained. A bar 51 may be provided across the middle of the frame (see Figs. 13 and 14). In this case, the deposition mask 1 is fixed to the frame 50, and the deposition mask 1 is moved by its own weight. The deflection of the central part can be suppressed. The bar 51 can be arranged in any direction, vertical, horizontal, or diagonal, with respect to the frame 50, and can be provided in any way, such as being combined in a grid pattern. However, since it will interfere with vapor deposition if it overlaps the mask body 2, it is provided so as to overlap the frame body 3. This bar 51 can be formed simultaneously with the frame 50 in a state where it is initially integrated with the frame 50, but it can also be formed independently of the frame 50 and later attached to the frame 50 and combined integrally. Also, the bar 51 is formed of a material with a low coefficient of thermal expansion, such as an invar material or a ceramic, and has a thickness of 5 to 8 mm. Regarding the material of this bar 51, either the same as that of the frame 50 or different from that of the frame 50 can be adopted. It can be in any direction, and can be provided in any way, such as being combined in a grid pattern. However, since it will interfere with vapor deposition if it overlaps the mask body 2, it is provided so as to overlap the frame body 3. This bar 51 can be formed simultaneously with the frame 50 in a state where it is initially integrated with the frame 50, but it can also be formed independently of the frame 50 and later attached to the frame 50 and combined integrally. Also, the bar 51 is formed of a material with a low coefficient of thermal expansion, such as an invar material or a ceramic, and has a thickness of 5 to 8 mm. Regarding the material of this bar 51, either the same as that of the frame 50 or different from that of the frame 50 can be adopted. After fixing the holding frame portion to the frame 50, it is not necessary to ensure the rigidity of the holding frame portion 4 of the frame body 3 with the structure of the frame body 3 itself, that is, it is not necessary to maintain the configuration of reinforcing the holding frame portion 4 with the outer reinforcing frame portion 5. In the vapor deposition process, it is more convenient if the vapor deposition mask 1 is smaller. Since it is not necessary to leave it for reinforcement purposes, for the reinforcing frame portion 5 that has become an unnecessary part, it is cut at the separation processing portion 3b provided at the boundary with the holding frame portion 4 and separated and removed from the holding frame portion 4 (see Fig. 12). In removing this holding frame portion 4, by previously providing the separation processing portion 3b in the frame body 3 and using it as the processing target position when separating the reinforcing frame portion 5 from the holding frame portion 4, the separation processing can be easily performed without difficulty, and the reinforcing frame portion 5 can be separated without affecting the shape of the remaining holding frame portion 4 as the frame body and the holding state of the mask body 2 by the holding frame portion 4, and vapor deposition by the vapor deposition apparatus can be carried out. Also, the bar 51 is formed of a material with a low coefficient of thermal expansion, such as an invar material or a ceramic, and has a thickness of 5 to 8 mm. Regarding the material of this bar 51, either the same as that of the frame 50 or different from that of the frame 50 can be adopted. This bar 51 can be formed simultaneously with the frame 50 in a state where it is initially integrated with the frame 50, but it can also be formed independently of the frame 50 and later attached to the frame 50 and combined integrally. Also, the bar 51 is formed of a material with a low coefficient of thermal expansion, such as an invar material or a ceramic, and has a thickness of 5 to 8 mm. Regarding the material of this bar 51, either the same as that of the frame 50 or different from that of the frame 50 can be adopted.

[0070] After fixing the holding frame portion to the frame 50, it is not necessary to ensure the rigidity of the holding frame portion 4 of the frame body 3 with the structure of the frame body 3 itself, that is, it is not necessary to maintain the configuration of reinforcing the holding frame portion 4 with the outer reinforcing frame portion 5. In the vapor deposition process, it is more convenient if the vapor deposition mask 1 is smaller. Since it is not necessary to leave it for reinforcement purposes, for the reinforcing frame portion 5 that has become an unnecessary part, it is cut at the separation processing portion 3b provided at the boundary with the holding frame portion 4 and separated and removed from the holding frame portion 4 (see Fig. 12). In removing this holding frame portion 4, by previously providing the separation processing portion 3b in the frame body 3 and using it as the processing target position when separating the reinforcing frame portion 5 from the holding frame portion 4, the separation processing can be easily performed without difficulty, and the reinforcing frame portion 5 can be separated without affecting the shape of the remaining holding frame portion 4 as the frame body and the holding state of the mask body 2 by the holding frame portion 4, and vapor deposition by the vapor deposition apparatus can be carried out. In the vapor deposition process, it is more convenient if the vapor deposition mask 1 is smaller. Since it is not necessary to leave it for reinforcement purposes, for the reinforcing frame portion 5 that has become an unnecessary part, it is cut at the separation processing portion 3b provided at the boundary with the holding frame portion 4 and separated and removed from the holding frame portion 4 (see Fig. 12). In removing this holding frame portion 4, by previously providing the separation processing portion 3b in the frame body 3 and using it as the processing target position when separating the reinforcing frame portion 5 from the holding frame portion 4, the separation processing can be easily performed without difficulty, and the reinforcing frame portion 5 can be separated without affecting the shape of the remaining holding frame portion 4 as the frame body and the holding state of the mask body 2 by the holding frame portion 4, and vapor deposition by the vapor deposition apparatus can be carried out. In removing this holding frame portion 4, by previously providing the separation processing portion 3b in the frame body 3 and using it as the processing target position when separating the reinforcing frame portion 5 from the holding frame portion 4, the separation processing can be easily performed without difficulty, and the reinforcing frame portion 5 can be separated without affecting the shape of the remaining holding frame portion 4 as the frame body and the holding state of the mask body 2 by the holding frame portion 4, and vapor deposition by the vapor deposition apparatus can be carried out.

[0071] In removing this holding frame portion 4, by previously providing the separation processing portion 3b in the frame body 3 and using it as the processing target position when separating the reinforcing frame portion 5 from the holding frame portion 4, the separation processing can be easily performed without difficulty, and the reinforcing frame portion 5 can be separated without affecting the shape of the remaining holding frame portion 4 as the frame body and the holding state of the mask body 2 by the holding frame portion 4, and vapor deposition by the vapor deposition apparatus can be carried out. In removing this holding frame portion 4, by previously providing the separation processing portion 3b in the frame body 3 and using it as the processing target position when separating the reinforcing frame portion 5 from the holding frame portion 4, the separation processing can be easily performed without difficulty, and the reinforcing frame portion 5 can be separated without affecting the shape of the remaining holding frame portion 4 as the frame body and the holding state of the mask body 2 by the holding frame portion 4, and vapor deposition by the vapor deposition apparatus can be carried out. In removing this holding frame portion 4, by previously providing the separation processing portion 3b in the frame body 3 and using it as the processing target position when separating the reinforcing frame portion 5 from the holding frame portion 4, the separation processing can be easily performed without difficulty, and the reinforcing frame portion 5 can be separated without affecting the shape of the remaining holding frame portion 4 as the frame body and the holding state of the mask body 2 by the holding frame portion 4, and vapor deposition by the vapor deposition apparatus can be carried out. In removing this holding frame portion 4, by previously providing the separation processing portion 3b in the frame body 3 and using it as the processing target position when separating the reinforcing frame portion 5 from the holding frame portion 4, the separation processing can be easily performed without difficulty, and the reinforcing frame portion 5 can be separated without affecting the shape of the remaining holding frame portion 4 as the frame body and the holding state of the mask body 2 by the holding frame portion 4, and vapor deposition by the vapor deposition apparatus can be carried out. The project can be smoothly transferred to.

[0072] In addition, the separation processing part 3b to be processed is formed into a combined shape of a groove 3c continuously arranged linearly and a plurality of through holes 3d drilled at predetermined intervals in the continuous direction of the groove 3 c, and the through hole 3d has a structure provided with an acute-angle notch part 3e. Therefore, when cutting the separation processing part 3b to cut off the reinforcing frame part 5, a cutting surface is smoothly generated along the separation processing part 3b starting from the notch part 3e, and it is difficult for burrs or the like to remain on the holding frame part 4 side, and it can be prevented from having an adverse effect on various operations accompanying the vapor deposition process. When cutting the separation processing part 3b to cut off the reinforcing frame part 5, a cutting surface is smoothly generated along the separation processing part 3b starting from the notch part 3e, and it is difficult for burrs or the like to remain on the holding frame part 4 side, and it can be prevented from having an adverse effect on various operations accompanying the vapor deposition process.

[0073] As described above, the vapor deposition mask according to the present embodiment arranges a reinforcing frame part 5 for reinforcing the mask body 2 inside the frame body 3 from the outside with respect to the holding frame part 4 that holds the mask body 2 inside the frame body 3, and increases the rigidity of the frame body 3 against the force applied from the mask body 2 to the frame body 3 based on the stress of the mask body 2. Therefore, while suppressing the displacement of each part of the mask body 2 from its original position, it is fixedly installed in the vapor deposition apparatus, and the alignment state between the mask and the substrate to be vapor deposited can be ensured, and vapor deposition can be accurately performed at an appropriate position on the substrate to be vapor deposited.

[0074] When installing the vapor deposition mask 1, the holding frame part 4 of the frame body 3 in the vapor deposition mask 1 is fixed to the frame 50 of the vapor deposition apparatus by welding or the like to obtain an installation state in the vapor deposition apparatus. Therefore, the vapor deposition mask 1 can be installed in the vapor deposition apparatus while maintaining the state of suppressing the deformation of the mask body 2 by the frame body 3, preventing the displacement of the mask body 2, ensuring the alignment state between the mask and the substrate to be vapor deposited, improving the accuracy of vapor deposition, and improving the yield of the vapor deposition formation. Also, by separating the reinforcing frame part 5 from the holding frame part 4 after fixing the frame body 3 to the vapor deposition apparatus, the reinforcing frame part 5 does not affect the vapor deposition mask 1 ​​​​​​​​​​​​​ After fixation, the vapor deposition process by the vapor deposition apparatus can proceed without any problems and without causing any hindrance to subsequent processes.

[0075] In the vapor deposition mask according to the above-described embodiment, the separation processing portion 3b of the frame body 3 has a shape that combines a linearly continuous groove 3c and a plurality of through holes 3d drilled at predetermined intervals in the groove continuous direction, and is provided with a uniform shape at any location of the boundary portion between the holding frame portion 4 and the reinforcing frame portion 5. However, the present invention is not limited to this, and the shape of the separation processing portion 3b may be changed for each position on the frame body 3. For example, in a form corresponding to the mask body 2 that is integrated in a state where stress that tends to contract inward with respect to the frame body 3 remains, the frame body 3 is assumed to be in a state where a force based on the stress is applied to the frame body, and the predicted deformation amount of each part of the frame body is calculated in advance. The separation processing portion 3b is configured such that the ratio of the size of the portion to be removed, which is formed as a through hole, recess, or groove of the separation processing portion 3b at a predetermined location of the frame body 3 where the predicted deformation amount is larger, to the remaining portion that is not removed is set to be smaller.

[0076] In this case, the separation processing portion 3b of the frame body 3 has a shape in which the removed portion is adjusted in accordance with the deformability of each part of the frame body to increase or decrease, that is, the removed portion in the separation processing portion 3b is reduced in the ratio of the removed portion to the remaining portion that is not removed at a location where the deformation amount of the frame body 3 due to the force applied to the frame body 3 based on the stress of the mask body 2 is large, while at a location where the deformation amount of the frame body is small the ratio of the removed portion to the remaining portion that is not removed is increased. By setting in this way, at a location where a large deformation of the frame body 3 is expected, the ratio of the removed portion such as the recess in the separation processing portion 3b is reduced to sufficiently ensure the strength of the frame body 3, while at a location where it is difficult to predict the deformation of the frame body 3 the ratio of the removed portion of the separation processing portion 3b is increased to ensure an appropriate strength while cutting the frame body 3. In a location where a large deformation of the frame body 3 is expected, the ratio of the removed portion such as the recess in the separation processing portion 3b is reduced to sufficiently ensure the strength of the frame body 3. On the other hand, at a location where it is difficult to predict the deformation of the frame body 3 the ratio of the removed portion of the separation processing portion 3b is increased to ensure an appropriate strength while The processing efficiency during the separation process can be increased, enabling the rapid separation of the reinforcing frame portion 5 and allowing for a smooth transition to the vapor deposition process. It will be possible to smoothly transition to the process.

[0077] As a specific example, as shown in FIG. 15, in the frame body 3, in the separation processing portion 3b near the intermediate position of the edge along each side of the rectangular mask body 2 among the respective sides of the frame body, which is relatively low in rigidity and easily affected by the force based on the stress of the mask body 2, the portion to be removed as a through hole, a recess, or a groove is minimized, the ratio of the non-removed portion is increased, the reduction in rigidity due to the removed portion is minimized, and actual deformation can be made less likely to occur. On the other hand, in the separation processing portion 3b near the corner portion where each frame side of the frame body 3 intersects, which is high in rigidity and not easily affected by the force based on the stress of the mask body 2, the ratio of the size of the portion removed as a through hole, a recess, or a groove to the remaining non-removed portion is increased to reduce the labor during the separation process. Among the respective sides of the frame body, the portion near the intermediate position of the edge along each side of the rectangular mask body 2 that is relatively low in rigidity and easily affected by the force based on the stress of the mask body 2 In the separation processing portion 3b near the intermediate position of the edge along each side of the rectangular mask body 2, the portion to be removed as a through hole, a recess, or a groove is minimized to increase the ratio of the non-removed portion, minimize the reduction in rigidity due to the removed portion, and make actual deformation less likely to occur. On the other hand, in the separation processing portion 3b near the corner portion where each frame side of the frame body 3 intersects, which is high in rigidity and not easily affected by the force based on the stress of the mask body 2 the ratio of the size of the portion removed as a through hole, a recess, or a groove to the remaining non-removed portion is increased to reduce the labor during the separation process. In the separation processing portion 3b near the corner portion where each frame side of the frame body 3 intersects, the size of the portion removed as a through hole, a recess, or a groove is increased with respect to the remaining non-removed portion to reduce the labor during the separation process. This can be achieved.

[0078] Also, in the production of the vapor deposition mask according to the above embodiment, the metal layer 7 is formed so as to be in contact with the primary electroplated layer 15 and the frame body 3, and the metal layer 7 is used to integrate the primary electroplated layer 15 and the frame body 3. However, it is not limited to this. Before arranging the frame body, the primary electroplated layer 15 is formed so as to extend to the frame body arrangement position, and the frame body 3 is placed while interposing an adhesive between the primary electroplated layer 15 on the lower side. It is also possible to adopt a configuration in which the primary electroplated layer 15 and the frame body 3 are integrated by adhesion, which can simplify the integration of the primary electroplated layer, that is, the mask body 2, and the frame body 3, and improve the production efficiency of the mask. In addition, by forming the metal layer 7 so as to cover the surface of the mask body 2 and the surface of the frame body 3, the bonding state between the mask body 2 and the frame body 3 can be made more preferable. In particular, regarding the adhesive A configuration is adopted in which the metal layer 7 is formed to be in contact with the primary electroplated layer 15 and the frame body 3 to integrate the primary electroplated layer 15 and the frame body 3 with the metal layer 7. However, it is not limited to this. Before arranging the frame body, the primary electroplated layer 15 is formed to extend to the frame body arrangement position and the frame body 3 is placed while interposing an adhesive between the primary electroplated layer 15 on the lower side. This can also be configured to integrate the primary electroplated layer 15 and the frame body 3 by adhesion, that is, the integration of the mask body 2 and the frame body 3 can be simply executed, and the production efficiency of the mask can be improved. Note that by forming the metal layer 7 so as to cover the surface of the mask body 2 and the surface of the frame body 3 the bonding state between the mask body 2 and the frame body 3 can be made more preferable. In particular, regarding the adhesive By covering the surface (side part) with the metal layer 7, it is possible to effectively prevent the deterioration of the adhesive caused by the cleaning process and the temperature rise, and the joining state between the mask body 2 and the frame body 3 can be maintained over a long period of time.

[0079] Also, in the production of the vapor deposition mask according to the above embodiment, after arranging the frame body 3 on the master mold 10, although the metal layer 7 is formed on the surface of the frame body 3, it is not limited to this. Before forming the metal layer 7 by electroforming, a resist is disposed on a part or all of the upper surface of the frame body, and the metal layer 7 is not formed on the entire upper surface of the frame body, but only on a part of the upper surface of the frame body except for the necessary parts, or omitted, so that a stress relaxation portion can be provided on the surface of the frame body 3.

[0080] In this case, since the metal layer 7 is not uniformly continuous on the upper surface of the frame body 3 and is partial and fragmented, even if internal stress is generated in the metal layer, it acts partially and fragmentarily instead of on the entire frame body 3, so that the frame body 3 is less likely to be affected by adverse effects such as deformation and can maintain its planar shape.

[0081] Also, in the production of the vapor deposition mask according to the above embodiment, after the primary electroplated layer 15 is formed, the metal layer 7 is formed without particularly performing a surface treatment on the primary electroplated layer. However, it is not limited to this. After the primary electroplated layer 15 is formed, at the stage before forming the resist layer 16, activation treatment such as acid dipping or electrolytic treatment can be performed on a predetermined range where the metal layer 7 of the primary electroplated layer 15 is to be disposed in an overlapping manner.

[0082] In this case, compared with the case without treatment, a significant improvement in the bonding strength between the activated portion of the primary electroplated layer 15 and the metal layer 7 thereon can be achieved. Also, instead of the activation treatment, A thin layer such as strike nickel or matte nickel may be formed on a predetermined range of the secondary electrodeposited layer 15. Even in this case, the bonding strength between the thin layer forming portion of the primary electrodeposited layer 15 and the metal layer 7 thereon can be improved.

[0083] In addition, in the production of the vapor deposition mask according to the above embodiment, the portions where the primary electrodeposited layer 15 and the frame 3 overlap with the metal layer 7 are configured to simply contact each other on a plane. However, in addition to this, over the entire circumference of the outer peripheral edge 2b of the pattern formation region 2a in the primary electrodeposited layer 15 (mask body 2), a large number of through holes or recesses are provided, and for the metal layer 7 formed on the outer peripheral edge 2b of the primary electrodeposited layer 15, the metal layer 7 may be formed in a state where the through holes or recesses are filled and the metal layer 7 partially bites into the outer peripheral edge 2b.

[0084] In this case, the metal layer 7 exists not only on the upper surface of the outer peripheral edge 2b of the pattern formation region 2a with respect to the primary electrodeposited layer 15, but also in each through hole or recess of the outer peripheral edge 2b, and the bonding strength with the outer peripheral edge 2b of the primary electrodeposited layer 15 is made larger. Thereby, the mask body 2 and the frame 3 can be more firmly connected and integrated via the metal layer 7, and unnecessary detachment or displacement of the mask body 2 with respect to the frame 3 can be reliably suppressed, and the vapor deposition accuracy and the reproduction accuracy of the vapor deposition formed product can be improved.

[0085] (Second Embodiment of the Present Invention) In the production of the vapor deposition mask in the first embodiment, in the step of disposing the frame 3 on the master mold 10, the frame 3 provided with the separation processing portion 3b in advance is used. However, as another second embodiment, as shown in FIG. 16, the frame 3 is disposed on the master mold 10. ​​​​​​​​​​​Then, as a step in the mask manufacturing process, a cut-off processing portion 3b is provided on the frame 3. It is also possible.

[0086] In this case, the separation processing portion 3b is provided by a removal process. A method of dissolving the frame 3 by immersing it in an etching solution can be used. In this case, the frame 3 will dissolve, but the material of the parts other than the frame, such as the matrix 10, will not be damaged. An etching solution having etching properties is used, and the area to be removed is removed by removing only a predetermined area of ​​the frame. A masking material 19 is placed on the portion (see FIG. 16(B)).

[0087] Specifically, a photosensitive film resist, for example, is applied to cover the areas that are not to be etched. The resist is then placed in the desired area by thermocompression or the like, and a mask is placed over the removed area, and ultraviolet light is applied to the resist. The masking material 19 is hardened and formed by exposure to radiation and development. As a masking material, a protective film that is resistant to the etching solution is used. The electrodes may be arranged to cover non-target areas.

[0088] After the masking material 19 is formed, the frame body 3 is immersed together with the matrix 10 in an etching solution to remove the masking material 19. The exposed part of the surface side of the frame 3 that is not covered with the encapsulant 19 is etched to a predetermined depth. (See FIG. 16(C)). A part of the frame 3 was removed by this etching. This portion becomes the cut-off processed portion 3b which is thinner than the other portion of the frame body 3 and easier to cut.

[0089] After etching, the cutting portion 3b having the desired depth and shape is obtained. Then, When the adhesive material 19 is dissolved and removed with a specific remover, the frame 3 and the primary electrodeposition layer 15 are exposed. Take it out to make the metal layer in a state where electroforming is possible, and thereafter, as in the first embodiment, electroforming The process of forming the metal layer by electroforming will proceed.

[0090] In addition to providing the separation processing portion 3b in the frame body 3 by etching, it is arranged on the master mold 10 For the frame body 3 thus arranged, unnecessary portions are removed by machining or laser processing to provide the separation processing portion 3b.

[0091] Thus, in the method for manufacturing a vapor deposition mask according to this embodiment, a primary electroplated layer 15 that becomes a mask body is formed on the master mold 10, and the frame body 3 is arranged so as to be positioned around the primary electroplated layer 15 Furthermore, in the process of forming the metal layer 7 for connecting the frame body 3 and the primary electroplated layer 15 in a predetermined range that extends from the surface of the frame body 3 to the surface of the outer peripheral edge 2b of the primary electroplated layer 15, a separation processing portion 3b is provided on the frame body 3 by performing predetermined removal processing. Therefore, in the state where the primary electroplated layer 15, the frame body 3, and the metal layer 7 peeled off integrally from the master mold 10 form the vapor deposition mask 1, with the separation processing portion 3b of the frame body 3 as a boundary, an inner region (holding frame portion 4 ) that integrally holds the mask body 2 and an outer region (reinforcing frame portion 5) that reinforces the entire frame body and can be separated when not needed are generated The reinforcing frame portion 5 outside the separation processing portion 3b of the frame body 3 is made sufficiently large to increase the rigidity of the frame body 3 against the stress of the mask body 2, and the vapor deposition mask 1 is fixedly installed in the vapor deposition apparatus in a state where the displacement of each part of the mask body 2 from its original position is suppressed, so that the alignment state between the mask and the substrate to be vapor-deposited can be ensured, and vapor deposition can be accurately performed at an appropriate position on the substrate to be vapor-deposited. Furthermore, after the vapor deposition mask 1 is fixedly installed on the vapor deposition apparatus side, outside the separation processing portion 3b of the frame body 3

[0092] ​​​​​​​​When it becomes unnecessary to ensure the rigidity of the frame body 3 by the reinforcing frame portion 5 on the side, the reinforcing frame portion 5 can be easily separated without force by performing a separating process at the separating process portion 3b, and the vapor deposition process by the vapor deposition apparatus can be smoothly shifted. At the same time, the reinforcing frame portion 5 can be separated without affecting the shape of the holding frame portion 5 remaining as the frame body 3 and the holding state of the mask body 2 thereby, and the subsequent vapor deposition process can be advanced without problems. By performing a separating process, the reinforcing frame portion 5 can be easily separated without force, and it can be smoothly shifted to the vapor deposition process by the vapor deposition apparatus. At the same time, the reinforcing frame portion 5 can be separated without affecting the shape of the holding frame portion 5 remaining as the frame body 3 and the holding state of the mask body 2 thereby, and the subsequent vapor deposition process can be advanced without problems. By performing a separating process, the reinforcing frame portion 5 can be easily separated without force, and it can be smoothly shifted to the vapor deposition process by the vapor deposition apparatus. At the same time, the reinforcing frame portion 5 can be separated without affecting the shape of the holding frame portion 5 remaining as the frame body 3 and the holding state of the mask body 2 thereby, and the subsequent vapor deposition process can be advanced without problems.

[0093] (The third embodiment of the present invention) In the installation of the vapor deposition mask 1 in the vapor deposition apparatus in the first embodiment, after the completion of the manufacture of the vapor deposition mask, the vapor deposition mask 1 is directly fixed to the frame 50 of the vapor deposition apparatus, and the vapor deposition mask is installed in the vapor deposition apparatus. However, as another third embodiment, as shown in FIGS. 17 to 24, a tensile force is applied to each outer peripheral portion of the frame body 3 in the vapor deposition mask 1, and after allowing the displacement of the frame body 3 and the mask body 2 within the allowable range, it can also be installed in the vapor deposition apparatus. After the completion of the manufacture of the vapor deposition mask, the vapor deposition mask 1 is directly fixed to the frame 50 of the vapor deposition apparatus, and the vapor deposition mask is installed in the vapor deposition apparatus. However, as another third embodiment, as shown in FIGS. 17 to 24, a tensile force is applied to each outer peripheral portion of the frame body 3 in the vapor deposition mask 1, and after allowing the displacement of the frame body 3 and the mask body 2 within the allowable range, it can also be installed in the vapor deposition apparatus. After the completion of the manufacture of the vapor deposition mask, the vapor deposition mask 1 is directly fixed to the frame 50 of the vapor deposition apparatus, and the vapor deposition mask is installed in the vapor deposition apparatus. However, as another third embodiment, as shown in FIGS. 17 to 24, a tensile force is applied to each outer peripheral portion of the frame body 3 in the vapor deposition mask 1, and after allowing the displacement of the frame body 3 and the mask body 2 within the allowable range, it can also be installed in the vapor deposition apparatus. After the completion of the manufacture of the vapor deposition mask, the vapor deposition mask 1 is directly fixed to the frame 50 of the vapor deposition apparatus, and the vapor deposition mask is installed in the vapor deposition apparatus.

[0094] In the vapor deposition mask 1 in the manufactured state before being installed in the vapor deposition apparatus, similar to the first embodiment, the mask body 2 is formed in a state where a stress in the direction of contracting inward with respect to the frame body 3 is generated, so that a force to deform the frame body 3 is applied from the mask body 2. Here, the frame body 3 has a configuration in which the reinforcing frame portion 5 is integrally arranged outside the holding frame portion 4, and the reinforcing frame portion 5 reinforces the holding frame portion 4 that holds the mask body 2 inside the frame body 3 from the outside. In the vapor deposition mask 1 in the manufactured state before being installed in the vapor deposition apparatus, similar to the first embodiment, the mask body 2 is formed in a state where a stress in the direction of contracting inward with respect to the frame body 3 is generated, so that a force to deform the frame body 3 is applied from the mask body 2. Here, the frame body 3 has a configuration in which the reinforcing frame portion 5 is integrally arranged outside the holding frame portion 4, and the reinforcing frame portion 5 reinforces the holding frame portion 4 that holds the mask body 2 inside the frame body 3 from the outside. In the vapor deposition mask 1 in the manufactured state before being installed in the vapor deposition apparatus, similar to the first embodiment, the mask body 2 is formed in a state where a stress in the direction of contracting inward with respect to the frame body 3 is generated, so that a force to deform the frame body 3 is applied from the mask body 2. Here, the frame body 3 has a configuration in which the reinforcing frame portion 5 is integrally arranged outside the holding frame portion 4, and the reinforcing frame portion 5 reinforces the holding frame portion 4 that holds the mask body 2 inside the frame body 3 from the outside. In the vapor deposition mask 1 in the manufactured state before being installed in the vapor deposition apparatus, similar to the first embodiment, the mask body 2 is formed in a state where a stress in the direction of contracting inward with respect to the frame body 3 is generated, so that a force to deform the frame body 3 is applied from the mask body 2. Here, the frame body 3 has a configuration in which the reinforcing frame portion 5 is integrally arranged outside the holding frame portion 4, and the reinforcing frame portion 5 reinforces the holding frame portion 4 that holds the mask body 2 inside the frame body 3 from the outside. Thus, since the frame body 3 is difficult to deform, the mask body 2 is also in a state where it is difficult to deform.

[0095] However, due to the necessity of forming the frame body 3 thinly as part of the vapor deposition mask 1, it cannot be made too thick. Moreover, due to the handling relationship during fixation to the frame 50 and certain limitations on the size of the reinforcing frame portion 5, there is a limit to strengthening the rigidity of the frame body 3, and it is impossible to completely suppress the deformation of the frame body 3. Therefore, when the force applied from the mask body 2 is large, a part of the frame body 3 is slightly deformed inward, allowing the shrinking deformation of the mask body 2 integrated with the frame body 3, and as a result, slight deformation of the mask body 2 may not be suppressed. At this time, when the dimensional accuracy conditions of the vapor deposition formation are strict and the allowable range related to the displacement of the mask body 2 is small, displacement exceeding the allowable range occurs at a predetermined position of the mask body 2, which may lead to deterioration of the yield of the vapor deposition formation.

[0096]

[0097] On the other hand, when installing the vapor deposition mask 1 in the vapor deposition apparatus, a force is applied to the frame body 3 to counteract the force attempting to deform the frame body 3 based on the stress of the mask body 2, so that the displacement of the frame body 3 is kept within the allowable range, and while maintaining the state where the displacement of the frame body 3 is within the allowable range, a step of fixing the holding frame portion 4 of the frame body 3 to the frame 50 is adopted. Thereby, the deformation of the frame body 3 can be suppressed, and at the same time, the deviation of the mask body 2 from the correct position accompanied by the deformation of the frame body 3 can also be suppressed.

[0098] The specific installation process is as follows: First, measure the displacement of the frame body 3 and the mask body 2 that make up the vapor deposition mask 1 from their original states, and for a predetermined outer peripheral portion of the frame body 3 outside the position where a large displacement occurs. ​ Apply a tensile force from the outside and repeat a series of steps to keep the displacement within the allowable range until the displacement at any position of the frame 3 and the mask body 2 is within the allowable range. Then while maintaining the state of the frame 3 and the mask body 2 in which the displacement is within the allowable range with the application of the tensile force, fix the holding frame portion 4 of the frame 3 to the frame 50. After that, release the tensile force applied to the frame 3. This is the procedure. Note that the positions where the tensile force is applied on the outer periphery of the frame are targeted at positions other than the outer peripheral positions of the frame that are outside (on the extension line) of the lattice-like portion inside the frame. This is because the portion of the outer periphery of the frame that corresponds to the outside of the lattice-like portion inside the frame has high rigidity due to the connection with the lattice portion, and it is difficult for deformation based on the stress of the mask body to occur in the first place, and even if deformation occurs, it is difficult to apply a reverse deformation that cancels out the deformation by applying a tensile force from the outside. Specifically, as the first step, measure the displacements in two directions parallel to each side of the outer periphery of the rectangular frame at each position of the frame 3 and the mask body 2 of the evaporation mask 1. Then, as the second step, if the inward displacement at a predetermined location does not fall within the preset allowable range, apply an outward predetermined tensile force parallel to the direction of the maximum displacement to the outer peripheral portion of the frame 3 corresponding to the outside of the location where the maximum displacement occurred, with a magnitude such that the displacement at the said location falls within the allowable range.

[0099] Subsequently, as the third step, measure the displacements in the two directions at each position of the frame and the mask body again with the tensile force applied. After this measurement, as the fourth step, if a new location where the inward displacement does not fall within the allowable range occurs, keep the state in which the tensile force is applied as it is

[0100] While maintaining the above, on the outer peripheral portion of the frame body corresponding to the outside of the location where the new maximum displacement has occurred, a new maximum outward predetermined tensile force parallel to the direction of the displacement is further applied as a force of such a magnitude that the displacement of the said location falls within the allowable range.

[0101] Also, as a fifth step, if at any location inside the outer peripheral portion of the frame body where a tensile force has already been applied, it is measured that the outward displacement does not fall within the preset allowable range due to the subsequent additional application of other tensile forces, an adjustment is made to reduce the tensile force applied to the outer peripheral portion of the frame body outside the said location so that the displacement of the said location falls within the allowable range.

[0102] Then, the third to fifth steps are repeatedly performed until the measured displacements at each position of the frame body 3 and the mask body 2 fall within the allowable range.

[0103] Explaining with a specific example, in the vapor deposition mask after manufacturing is completed, at position A of the mask body 2, the maximum displacement is -6.1 μm in the vertical direction (y-axis direction) of the frame body 3, that is, 6. 1 μm of displacement inward of the frame body has been confirmed by measurement (see Fig. 17). Since this displacement does not fall within the allowable range (within ±1 μm), on the outer peripheral portion of the frame body 3 corresponding to the outside in the y-axis direction of the position A where the maximum displacement has occurred (the center of the upper side and the center of the lower side), a tensile force of 40 N is applied in the y-axis direction parallel to the direction of the maximum displacement and in the outward direction of the frame body in each direction (see Fig. 18).

[0104] However, when the displacements at each position of the frame body and the mask body are measured at the stage when this 40 N tensile force is applied, still, at position A of the mask body 2, a displacement of - 3.0 μm in the y-axis direction of the frame body 3 is confirmed as the maximum displacement (see Fig. 18). Since this displacement does not fall within the allowable range, ​​​​​​​​​​Therefore, in the same manner as above, the outer periphery of the frame 3 (the center of the upper side and the center of the lower side) which is outside the position A in the y-axis direction is The displacement of position A is within the allowable range in each direction toward the outside of the frame in the y-axis direction. Apply a tensile force of 80 N to the specimen (see Figure 19).

[0105] After applying a tensile force of 80N in the y-axis direction, the displacement of each position on the frame was measured. At position B of the mask body 2, the maximum displacement is −2.4 μm in the horizontal direction (x-axis direction) of the frame body 3. m, that is, a displacement of 2.4 μm inside the frame was confirmed (see Figure 19). Since it is not within the range, the tensile force (80N) in the y-axis direction is still applied. While maintaining the above, the outer periphery of the frame 3 ( Two points near the center of the left side and two points near the center of the right side were placed in four places in total, parallel to the direction of the maximum displacement. In each direction toward the outside of the frame in the x-axis direction, the displacement of position B is within the allowable range. A tensile force of 40 N is applied to each of them (see Figure 20).

[0106] After applying a tensile force of 40N in the x-axis direction, the displacement of each position of the frame and mask body was measured. When this is done, the maximum displacement at position C of the mask body 2 is -1. 5 μm, that is, a displacement of 1.5 μm inside the frame was confirmed (see FIG. 20). Since this is not within the allowable range, the tensile force in the y-axis direction (80N) and the tensile force in the x-axis direction The force (40N) is also maintained as it is, and the y-axis at position C where the maximum displacement occurs The outer periphery of the frame 3 (two points slightly away from the center of the upper side and one point slightly away from the center of the lower side) The y-axis direction is parallel to the maximum displacement direction and is on the outside of the frame. As a force of such magnitude that the displacement at position C falls within the allowable range, apply a tensile force of 20 N thereto respectively (see Fig. 21).

[0107] After applying a tensile force of 20 N in this y-axis direction, measure the displacements at each position of the frame body and the mask body to find that a displacement of +1.1 μm in the y-axis direction of the frame body 3, i.e., a displacement of 1.1 μm outward from the frame body, is newly confirmed as the maximum displacement at position D of the mask body 2 (see Fig. 21). Since this displacement does not fall within the allowable range, while maintaining the previous tensile force in the x-axis direction (40 N) as it is, at two locations on the outer periphery (the center of the upper side and the center of the lower side) of the frame body 3 corresponding to the outside in the y-axis direction at the position D where the maximum displacement occurred, reduce the previously applied tensile force (80 N) in each direction outward from the frame body in the y-axis direction to 60 N, and at a total of four locations on the outer periphery of the frame body 3 (two locations slightly away from the center of the upper side and two locations slightly away from the center of the lower side), increase the previously applied tensile force (20 N) in each direction outward from the frame body in the y-axis direction to 30 N (see Fig. 22) so that the displacement at position D falls within the allowable range. Since this displacement does not fall within the allowable range, while maintaining the previous tensile forces in the y-axis direction (60 N, 30 N ) and the tensile force in the x-axis direction (40 N) as they are, at the outer periphery of the frame body 3 corresponding to the outside in the x-axis direction at the position E where the maximum displacement occurred (the center of the left side and the center of the right side), reduce the previously applied tensile force (80 N) in each direction outward from the frame body in the x-axis direction to 60 N, and at a total of four locations on the outer periphery of the frame body 3 (two locations slightly away from the center of the left side and two locations slightly away from the center of the right side), increase the previously applied tensile force (20 N) in each direction outward from the frame body in the x-axis direction to 30 N (see Fig. 22) so that the displacement at position E falls within the allowable range. After adjusting the tensile force applied in the y-axis direction in this way, measure the displacements at each position of the frame body and the mask body. A displacement of -1.1 μm in the x-axis direction of the frame body 3, i.e., a displacement of 1.1 μm inward from the frame body, is newly confirmed as the maximum displacement at position E of the mask body 2 (see Fig. 22). Since this displacement does not fall within the allowable range, while maintaining the previous tensile forces in the y-axis direction (60 N, 30 N ) and the tensile force in the x-axis direction (40 N) as they are, at two locations on the outer periphery (the center of the left side and the center of the right side) of the frame body 3 corresponding to the outside in the x-axis direction at the position E where the maximum displacement occurred, reduce the previously applied tensile force (80 N) in each direction outward from the frame body in the x-axis direction to 60 N, and at a total of four locations on the outer periphery of the frame body 3 (two locations slightly away from the center of the left side and two locations slightly away from the center of the right side), increase the previously applied tensile force (20 N) in each direction outward from the frame body in the x-axis direction to 30 N (see

[0108] After increasing and decreasing the tensile force applied in the y-axis direction in this way, measure the displacements at each position of the frame body and the mask body. A displacement of -1.1 μm in the x-axis direction of the frame body 3, i.e., a displacement of 1.1 μm inward from the frame body, is newly confirmed as the maximum displacement at position E of the mask body 2 (see Fig. 22). Since this displacement does not fall within the allowable range, while maintaining the previous tensile forces in the y-axis direction (60 N, 30 N ) and the tensile force in the x-axis direction (40 N) as they are, at the outer periphery of the frame body 3 corresponding to the outside in the x-axis direction at the position E where the maximum displacement occurred . Since this displacement does not fall within the allowable range, while maintaining the previous tensile forces in the y-axis direction (60 N, 30 N ) and the tensile force in the x-axis direction (40 N) as they are, at the outer periphery of the frame body 3 corresponding to the outside in the x-axis direction at the position E where the maximum displacement occurred (two locations slightly away from the center of the left side), reduce the previously applied tensile force (80 N) in each direction outward from the frame body in the x-axis direction to 60 N, and at a total of four locations on the outer periphery of the frame body 3 (two locations slightly away from the center of the left side and two locations slightly away from the center of the right side), increase the previously applied tensile force (20 N) in each direction outward from the frame body in the x-axis direction to 30 N (see The four points were aligned parallel to the x-axis, which was the maximum displacement direction. A tensile force of 20 N is applied in each direction outward to the frame (see Figure 23).

[0109] After applying a tensile force of 20N in the x-axis direction, the displacement of each position of the frame and mask body was measured. When this is done, the maximum displacement at position F of the mask body 2 is -1. 2 μm, that is, a displacement of 1.2 μm inside the frame was confirmed (see FIG. 23). Since this is not within the allowable range, the tensile force in the y-axis direction (80N) and the tensile force in the x-axis direction The position where the maximum displacement occurred while maintaining the applied force (40N, 20N) The outer periphery of the frame 3 that is outside the y-axis direction of F (two points a little away from the center of the upper side and the center of the lower side In total, four points are added to each direction that is the outside of the frame in the y-axis direction. The tension force (30N) is reduced to 20N (see Figure 24), and the displacement at position F is within the allowable range. Make it fit within.

[0110] After adjusting the tension applied in the y-axis direction in this way, the frame and mask body at each position are When the displacement was measured, the maximum displacement of the frame 3 and the mask body 2 was in the x-axis direction at position G. A displacement of -0.8 μm in the direction toward the center of the frame, i.e., a displacement of 0.8 μm toward the inside of the frame, was confirmed (see FIG. 24). Since this displacement is within the allowable range, the process of measuring, applying tension, and adjusting is repeated. will end.

[0111] By repeating these steps, when the displacement falls within the allowable range, the frame of the deposition mask 1 is The holding frame 4 in the vapor deposition apparatus is placed in the vapor deposition apparatus while applying a tensile force to the frame 3. Fix it to the frame 50 located outside. Fix the holding frame portion 4 to the frame 50 so that the mask body 2 is held without displacement in the proper position together with the frame body 3 After obtaining a state in which the mask body 2 is held without displacement in the proper position together with the frame body 3, release the application of the tensile force to the frame body 3. Similar to the first embodiment, cut the reinforcing frame portion 5 of the frame body 3 with the separating process portion 3b provided at the boundary with the holding frame portion 4 and separate and remove it from the holding frame portion 4 to. When the frame 50 is inside the vapor deposition apparatus, in this state, and when the frame 50 is outside the vapor deposition apparatus, install the frame 50 and the vapor deposition mask 1 in the vapor deposition apparatus, and the installation process of the vapor deposition mask 1 is completed

[0112] As described above, the method for installing the vapor deposition mask according to the present embodiment applies a tensile force from the outside to a predetermined portion of the frame body 3 where large deformation can occur due to the stress of the mask body 2 in the vapor deposition mask 1, and allows the displacement to be within the allowable range. The process is repeated until the displacement is within the allowable range at any position of the frame body 3. Keeping the state of the frame body 3 in which the displacement is within the allowable range as it is, fixing the holding frame portion 4 of the frame body 3 to the frame 50, and installing the evaporation mask 1 in the evaporation apparatus. After that, by releasing the tensile force applied to the frame body 3, the deviation of the mask body 2 from the correct position accompanied by the deformation of the frame body 3 in the evaporation mask 1 is surely prevented by a method of suppressing the deformation of the entire frame body 3 by the application of an external force, while fixing the frame body 3 to the frame 50, an appropriate installation state of the vapor deposition mask 1 in the vapor deposition apparatus can be ensured, and the accuracy related to vapor deposition can be further improved

Description of symbols

[0113] 1 Vapor deposition mask 2 Mask body 2a Pattern formation region 2b Outer peripheral edge 3 Frame body ​​​​​​​​​​​​3a Opening 3b Machining part for separation 3c Groove 3d Through-hole 3e Notch 4 Holding frame part 5 Reinforcing frame part 7 Metal layer 8 Evaporation through-hole 9 Evaporation pattern 10 Master mold 11 Resist layer 12 Mask film 13 Thin part 14 Primary pattern resist 15 Primary electroplated layer 16 Resist layer 17 Mask film 18 Secondary pattern resist 19 Masking material 50 Frame 51 Bar

Claims

1. In a vapor deposition mask comprising a mask body provided with a plurality of independent vapor deposition through-holes in a predetermined pattern and a frame body disposed integrally with the mask body, a separating process portion is provided in the frame body, the separating process portion has through-holes arranged in a plurality of linear arrays, notches are provided at the ends of the through-holes in the direction in which the through-holes are arranged in a plurality of linear arrays, the mask body is integrated with the frame body in a state where stress tending to contract inward with respect to the frame body remains, the frame body is assumed to have a predicted deformation amount for each part of the frame body calculated in advance assuming a state where a force based on the stress is applied to the frame body, the separating process portion has a shape in which the removed portion is adjusted to increase or decrease according to the deformability of each part of the frame body, in the removed portion of the separating process portion, at a location where the deformation amount of the frame body due to the force applied to the frame body based on the stress of the mask body increases, the ratio of the removed portion to the remaining portion that is not removed is decreased, while at a location where the deformation amount of the frame body decreases, the ratio of the removed portion to the remaining portion that is not removed is increased. A vapor deposition mask characterized by this.

2. The frame body has a holding frame portion that is connected and integrated with the mask body and a reinforcing frame portion disposed integrally with the holding frame portion, and is formed in a frame shape having a greater wall thickness than the mask body. The vapor deposition mask according to Claim 1, characterized by this.

3. A separating process portion is provided at the boundary portion between the holding frame portion and the reinforcing frame portion. The vapor deposition mask according to Claim 2, characterized by this.

4. The reinforcing frame portion is separable and removable from the holding frame portion. The vapor deposition mask according to Claim 2 or 3, characterized by this.

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