Liquid ejection head and liquid ejection device

Abstract

To provide a liquid jet head and a liquid jet device, which can suppress deformation of a fixing plate fixed with a head chip thereon.SOLUTION: A first adhesive surface 41 is provided in an upper section of a head chip 10. A holder 70 stores the head chip 10 between the holder and a fixing plate 80 and has a second adhesive surface 42 formed with an opening of a second supply flow passage 102 communicated with the head chip 10. The first adhesive surface 41 and the second adhesive surface 42 are adhered with a first adhesive agent 45 so as to demarcate a connection flow passage 44 for connecting between a first supply flow passage 101 and the second supply flow passage 102. The upper section of the head chip 10 has a first contact section 51. The holder 70 has a first contacted section 71 facing the first contact section 51. A first dimension H1 between the first contact section 51 and the first contacted section 71 is smaller than a second dimension H2 between the first adhesive surface 41 and the second adhesive surface 42.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a liquid injection head for injecting a liquid from a nozzle and a liquid injection device, and more particularly to an inkjet recording head for injecting ink as a liquid and an inkjet recording device.

Background Art

[0002] As an example of an inkjet recording head (hereinafter also simply referred to as a recording head), which is a representative example of a liquid injection head for injecting droplets, there is, for example, one including a plurality of head chips for injecting ink, a holder for holding the plurality of head chips, and a fixing plate to which the holder and the plurality of head chips are fixed (see, for example, Patent Document 1).

[0003] In the recording head exemplified in Patent Document 1, an adhesive is filled around a communication portion between the liquid introduction passage of the holder and the case passage of the head chip among the gaps between the holder and the head chip, and the upper surface of the head chip and the head mounting surface of the holder are adhered by the adhesive.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the recording head having the above-described configuration, an opening through which the nozzles of the head chips are exposed is formed in the fixing plate. However, when sealing this opening with a cap, an external force acts on the fixing plate by the cap. In addition, an external force also acts on the fixing plate when the medium to be injected contacts the fixing plate. When an external force acts on the fixing plate in this way, there is a problem that the adhesive filled between the head chip and the holder may be crushed, the head chip may be pushed in so as to approach the holder, and the fixing plate may be deformed.

[0006] Note that the above problems can occur in inkjet recording heads of any configuration, and not only in inkjet recording heads that eject ink, but also in liquid ejection heads that eject liquids other than ink.

Means for Solving the Problems

[0007] One aspect of the present invention for solving the above problems includes a first head chip having a plurality of first nozzles that eject liquid in an ejection direction, a holder that holds the first head chip, and a fixing plate having a first opening for exposing the plurality of first nozzles to the outside, and the holder and the first head chip are fixed thereto. An upper portion of the first head chip is provided with a first bonding surface in which an opening of a flow path is formed. The holder houses the first head chip between the fixing plate and has a second bonding surface in which an opening of a flow path communicating with the first head chip is formed. The first bonding surface and the second bonding surface are bonded by a first adhesive so as to define a connection flow path that connects between the flow path communicating with the first head chip of the holder and the flow path of the first head chip. The upper portion of the first head chip has a first contact portion, and the holder has a first contacted portion facing the first contact portion. A first dimension between the first contact portion and the first contacted portion is smaller than a second dimension between the first bonding surface and the second bonding surface. The liquid ejection head is characterized by this.

[0008] Another aspect of the present invention is a liquid ejection device characterized by including the liquid ejection head of the above aspect and a conveyance unit that conveys a medium.

Brief Description of the Drawings

[0009]

Figure 1

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Figure 10

Figure 11

Best Mode for Carrying Out the Invention

[0010] The present invention will be described in detail below based on embodiments. However, the following description shows one aspect of the present invention and can be arbitrarily changed within the scope of the present invention. In each figure, the same members are denoted by the same reference numerals, and redundant descriptions are omitted. In each figure, X, Y, and Z represent three mutually orthogonal spatial axes. In this specification, the directions along these axes are referred to as the X direction, the Y direction, and the Z direction, and the direction in which the arrow in each figure points is defined as the positive (+) direction, and the opposite direction of the arrow is defined as the negative (-) direction. The Z direction indicates the vertical direction, the +Z direction indicates vertically downward, and the -Z direction indicates vertically upward. Further, with respect to the three X, Y, and Z spatial axes without limiting the positive and negative directions, they will be described as the X axis, the Y axis, and the Z axis.

[0011] (Embodiment 1) FIG. 1 is a schematic diagram of an inkjet recording apparatus. FIG. 2 is an enlarged cross-sectional view of a main part of the inkjet recording apparatus, which is a plane perpendicular to the Y-axis and passes through the inkjet recording head 1, the transport mechanism 4, and the moving mechanism 6, which will be described later. The inkjet recording apparatus I according to the present invention (hereinafter, also simply referred to as "recording apparatus I") is a printing apparatus that ejects ink, which is a kind of liquid, as ink droplets onto a medium S such as printing paper and causes them to land, and performs printing such as an image by an arrangement of dots formed on the medium S. Note that as the medium S, any material such as a resin film or cloth can be used in addition to the recording paper.

[0012] The recording apparatus I includes an inkjet recording head 1 (hereinafter, also simply referred to as "recording head 1"), which is an example of a liquid ejection head, a liquid container 3, a transport mechanism 4 that feeds out the medium S, a control unit 5, and a moving mechanism 6. The transport mechanism 4 is an example of a "transport unit".

[0013] The liquid container 3 stores the ink ejected from the recording head 1. Examples of the liquid container 3 include a cartridge that is detachable from the recording apparatus I, a bag-shaped ink pack formed of a flexible film, and an ink tank that can be refilled with ink. In the present embodiment, a cartridge detachably provided on the recording head 1 is used as the liquid container 3. Further, a plurality of types of inks different in color and type are individually stored in the liquid container 3.

[0014] Although not particularly shown, the control unit 5 includes, for example, a control device such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage device such as a semiconductor memory. The control unit 5 comprehensively controls each element of the inkjet recording apparatus I, that is, the transport mechanism 4, the moving mechanism 6, the recording head 1, etc., by the control device executing a program stored in the storage device.

[0015] The conveying mechanism 4 is controlled by the control unit 5 to convey the medium S in the +X direction. Specifically, the conveying mechanism 4 includes a platen 400, a paper feeding means 410, and a conveying means 420 provided on the apparatus main body 2.

[0016] The platen 400 extends in the ±Y direction and is a member that supports the surface on the side opposite to the surface where the ink of the medium S is ejected, that is, the surface on the +Z direction side. The platen 400 is disposed on the +Z direction side of the recording head 1 at least within the movement range of the recording head 1 in the ±Y direction, and has a surface that supports the medium S facing the recording head 1 side. The platen 400 is disposed on the +X direction side of the paper feeding means 410 described later and on the -X direction side of the conveying means 420 described later.

[0017] Note that the platen 400 may be provided with an adsorption means for adsorbing the medium S to the surface facing the recording head 1 of the platen 400. Examples of the adsorption means include those that adsorb by sucking the medium S and those that electrostatically adsorb the medium S by electrostatic force.

[0018] The paper feeding means 410 conveys the medium S in the +X direction and feeds the medium S to the recording head 1 disposed on the apparatus main body 2. Specifically, the paper feeding means 410 includes a paper feeding roller 411, a paper feeding driven roller 412, and driving means such as a driving motor (not shown), and is disposed on the -X direction side of the recording head 1. The paper feeding roller 411 is a member that extends in the ±Y direction, is rotatably attached to the apparatus main body 2 around the Y axis, and is rotated by the driving means. The paper feeding driven roller 412 is a member that extends in the ±Y direction, is rotatably attached to the apparatus main body 2 around the Y axis, and is driven by the paper feeding roller 411. The paper feeding roller 411 is disposed on the +Z direction side of the medium S, and the paper feeding driven roller 412 is disposed on the -Z direction side of the medium S. When the control unit 5 drives the driving means, the paper feeding roller 411 rotates. The medium S is conveyed to the +X direction side through between the rotating paper feeding roller 411 and the paper feeding driven roller 412. Note that the paper feeding roller 411 may be disposed on the -Z direction side of the medium S and the paper feeding driven roller 412 may be disposed on the +Z direction side of the medium S.

[0019] The conveying means 420 conveys the medium S in the +X direction and discharges it to the outside of the apparatus main body 2. Specifically, the conveying means 420 includes driving means such as a conveying roller 421, a conveying driven roller 422, and a driving motor (not shown), and is arranged on the +X direction side of the recording head 1. The conveying roller 421 is a member extending in the ±Y direction, is rotatably attached to the apparatus main body 2 around the Y axis, and is rotated by the driving means. The conveying driven roller 422 is a member extending in the ±Y direction, is rotatably attached to the apparatus main body 2 around the Y axis, and is driven by the conveying roller 421. The conveying roller 421 is arranged on the +Z direction side of the medium S, and the conveying driven roller 422 is arranged on the -Z direction side of the medium S. When the control unit 5 drives the driving means, the conveying roller 421 rotates. The medium S is conveyed to the +X direction side through between the rotating conveying roller 421 and the conveying driven roller 422. Note that the conveying roller 421 may be arranged on the -Z direction side of the medium S, and the conveying driven roller 422 may be arranged on the +Z direction side of the medium S.

[0020] The medium S is conveyed in the +X direction by the paper feeding means 410 and fed to the recording head 1. The medium S is supported from the +Z direction side by the platen 400, and the ink droplets ejected from the recording head 1 land on it. The medium S on which the ink droplets have landed is discharged to the outside of the apparatus main body 2 by the conveying means 420.

[0021] Note that the conveying mechanism 4 for conveying the medium S is not limited to a structure using rollers such as a paper feeding roller 411 and a conveying roller 421, and may convey the medium S by a belt or a drum.

[0022] The moving mechanism 6 is controlled by the control unit 5 to reciprocate the recording head 1 in the ±Y direction. The ±Y direction in which the recording head 1 reciprocates by the moving mechanism 6 is a direction intersecting the +X direction in which the medium S is conveyed.

[0023] Specifically, the moving mechanism 6 of this embodiment includes a holding member 7 that holds the recording head 1, a conveyance belt 8, and a guide rail 8b. The holding member 7 is a substantially box-shaped structure that houses the recording head 1, namely, a so-called carriage, and is fixed to the conveyance belt 8. The conveyance belt 8 is an endless belt laid along the ±Y direction. Under the control of the control unit 5, the driving force of the drive motor 8a is transmitted to the conveyance belt 8, and as the conveyance belt 8 rotates, the recording head 1 reciprocates along the guide rail 8b extending along the ±Y direction together with the holding member 7. Then, in the recording apparatus I, while the medium S is conveyed and the recording head 1 repeatedly reciprocates, the recording head 1 injects ink onto the medium S, and thus a desired image is formed on the surface of the medium S. Note that the liquid container 3 is mounted on the holding member 7 together with the recording head 1, but is not limited to such a configuration. It is also possible to place the liquid container 3 in the apparatus main body 2 separately from the recording head 1.

[0024] Further, a cap 9 is provided on the -Y direction side of the recording apparatus I. Although the detailed configuration will be described later, the cap 9 is a member that seals the nozzles 11 (see FIG. 5) of the recording head 1, and is provided in the recording apparatus I so as to be movable in the ±Z direction. By the control unit 5, the recording head 1 is moved to a position overlapping the cap 9 when viewed in the +Z direction, the cap 9 moves toward the recording head 1 side, and the nozzles 11 are sealed in a closed space 9a (see FIG. 7) formed by the cap 9 and the recording head 1.

[0025] Note that the above-described recording apparatus I is exemplified as one in which the recording head 1 reciprocates in the ±Y direction, but is not limited thereto. For example, the present invention can also be applied to a so-called line type recording apparatus in which the recording head 1 is longer than the width of the medium S, and the medium S is moved only in the ±X direction without the recording head 1 moving while injecting liquid onto the medium S for printing.

[0026] FIG. 3 is an exploded perspective view of the recording head 1. The recording head 1 includes a head chip 10, a holder 70, and a fixing plate 80. In the present embodiment, one recording head 1 includes four head chips 10, and the first head chip 10A, the second head chip 10B, the third head chip 10C, and the fourth head chip 10D are arranged from the +Y direction side to the -Y direction side. Note that the number of head chips 10 held by the holder 70 is not limited to four, and may be two or more, or may be one. Also, the arrangement of the plurality of head chips 10 is not limited to the example shown in the figure.

[0027] Hereinafter, the description of "head chips 10A - 10D" refers to the first head chip 10A, the second head chip 10B, the third head chip 10C, and the fourth head chip 10D. The components common to the head chips 10A - 10D will be described with reference to the head chip 10. The components unique to each of the head chips 10A - 10D will be described with reference to the first head chip 10A, the second head chip 10B, the third head chip 10C, or the fourth head chip 10D.

[0028] An example of the head chip 10 will be described with reference to FIGS. 4 and 5. FIG. 4 is a plan view of the head chip 10 viewed in the +Z direction, and FIG. 5 is a cross-sectional view taken along the line A - A' of FIG. 4. Note that in FIG. 5, the cross-section of the fixing plate 80 is also shown. Also, in the present embodiment, each direction of the head chip 10 will be described based on the direction when mounted on the recording head 1.

[0029] The head chip 10 includes a plurality of nozzles 11, a case 13, and a flexible substrate 23. Further, the head chip 10 of the present embodiment further includes a communication plate 14, a pressure chamber forming substrate 15, a diaphragm 16, a compliance substrate 17, a piezoelectric actuator 18, etc. The plurality of components constituting these head chips 10 are laminated and joined by an adhesive or the like to form a unit.

[0030] The plurality of nozzles 11 are formed on the nozzle plate 12 and eject ink in the +Z direction. The nozzles 11 of the first head chip 10A are an example of the "first nozzle", and the nozzles 11 of the second head chip 10B are an example of the "second nozzle". The surface of the nozzle plate 12 where the nozzles 11 are provided is referred to as the nozzle surface.

[0031] The pressure chamber forming substrate 15 has a plurality of pressure chambers 19 communicating with each of the plurality of nozzles 11 formed on the nozzle plate 12. A plurality of piezoelectric actuators 18 are provided corresponding to each pressure chamber 19. The piezoelectric actuator 18 is an energy generating element that generates pressure fluctuations in the ink in the corresponding pressure chamber 19, that is, the energy required for the ejection of the ink from the nozzle 11 communicating with the pressure chamber 19, and is also a pressure generating element. A diaphragm 16 is provided between the pressure chamber 19 and the piezoelectric actuator 18, and the diaphragm 16 seals the opening on the -Z direction side of the pressure chamber 19 to partition a part of the pressure chamber 19. Note that the pressure chamber forming substrate 15 and the diaphragm 16 may be integrally formed. Then, the piezoelectric actuators 18 are respectively laminated on the regions corresponding to the respective pressure chambers 19 on the diaphragm 16. The piezoelectric actuator 18 of the present embodiment is formed by sequentially laminating a first electrode 20, a piezoelectric layer 21, and a second electrode 22 on the diaphragm 16. The piezoelectric actuator 18 configured in this way deflects and deforms when an electric field corresponding to the potential difference between the first electrode 20 and the second electrode 22 is applied therebetween.

[0032] Further, a flexible substrate 23 having flexibility is connected to the piezoelectric actuator 18. In the present embodiment, each electrode of the piezoelectric actuator 18 and the flexible substrate 23 are connected via a lead wiring 24 drawn from the piezoelectric actuator 18 to the diaphragm 16. A drive circuit 25 such as a circuit board having a switching element such as a transmission gate for driving the piezoelectric actuator 18 or a semiconductor integrated circuit (IC) is mounted on the flexible substrate 23. Such a flexible substrate 23 is drawn in the -Z direction of the pressure chamber forming substrate 15. Note that the flexible substrate 23 is not limited to a COF substrate provided with the drive circuit 25 as described above. For example, instead of the flexible substrate 23, a flexible wiring such as an FFC or an FPC on which the drive circuit 25 is not mounted may be used.

[0033] A communication plate 14 having an area wider than that of the pressure chamber forming substrate 15 in a plan view seen in the +Z direction is joined to the surface of the pressure chamber forming substrate 15 on the +Z direction side. The communication plate 14 is formed with a nozzle communication port 26 that communicates the pressure chamber 19 and the nozzle 11, a common liquid chamber 27 provided in common to each pressure chamber 19, and an individual communication port 28 that communicates the common liquid chamber 27 and the pressure chamber 19. The common liquid chamber 27 is a space extending along the ±X direction which is the direction in which the nozzles 11 are arranged in parallel. In the present embodiment, two common liquid chambers 27 are formed corresponding to the two rows of nozzles 11 provided on the nozzle plate 12, respectively. A plurality of individual communication ports 28 are formed along the ±X direction which is the nozzle row direction corresponding to each pressure chamber 19. The individual communication port 28 communicates with an end portion on the side opposite to the portion communicating with the nozzle communication port 26 of the pressure chamber 19.

[0034] A nozzle plate 12 formed with a plurality of nozzles 11 is joined to a substantially central portion of the surface on the +Z direction side of the communication plate 14. The nozzle plate 12 in the present embodiment is a plate material having an outer shape smaller than that of the communication plate 14 in a plan view seen in the -Z direction. This nozzle plate 12 is positioned on the surface of the communication plate 14 on the +Z direction side, at a position deviated from the opening of the common liquid chamber 27, in a region where the nozzle communication ports 26 are opened, and is joined by an adhesive or the like in a state where these nozzle communication ports 26 and the plurality of nozzles 11 communicate with each other. In the nozzle plate 12 in the present embodiment, a total of two nozzle rows (not shown) in which a plurality of nozzles 11 are arranged in parallel in the ±X direction, which is the aforementioned nozzle row direction, are formed. The two nozzle rows are arranged in parallel in the ±Y direction.

[0035] Also, on the surface of the communication plate 14 on the +Z direction side, a compliance substrate 17 is joined at a position deviated from the nozzle plate 12. This compliance substrate 17 seals the opening of the common liquid chamber 27 on the surface of the communication plate 14 on the +Z direction side in a state of being positioned and joined to the surface of the communication plate 14 on the +Z direction side.

[0036] In the present embodiment, the compliance substrate 17 includes a sealing film 17a made of a flexible thin film such as resin, and a frame member 17b made of a hard material such as metal such as stainless steel. Since the region of the frame member 17b facing the common liquid chamber 27 has a compliance opening 17c that is completely removed in the thickness direction, one surface of the common liquid chamber 27 is a compliance portion 17d that is a flexible portion sealed only by the flexible sealing film 17a. The compliance portion 17d has a function of relaxing pressure fluctuations in the ink flow path, particularly in the common liquid chamber 27, by flexibly deforming.

[0037] Also, a protective substrate 29 having substantially the same size as the pressure chamber forming substrate 15 is joined to the -Z direction of the pressure chamber forming substrate 15. The protective substrate 29 has a holding portion 30 that is a space for protecting the piezoelectric actuator 18.

[0038] The pressure chamber forming substrate 15, the protective substrate 29, and the communication plate 14 are fixed to the case 13. Inside this case 13, introduction liquid chambers 31 that communicate with the common liquid chamber 27 of the communication plate 14 are formed on both sides with the pressure chamber forming substrate 15 interposed therebetween. Further, the protective substrate 29 and the case 13 are provided with wiring insertion holes 33 through which the flexible substrate 23 is inserted. The flexible substrate 23 drawn out from the pressure chamber forming substrate 15 in the -Z direction is inserted through the wiring insertion holes 33 of the protective substrate 29 and the case 13 and is drawn out to the -Z direction side of the case 13.

[0039] An adhesive portion 40 is provided on the upper part of the head chip 10, that is, a part on the -Z direction side of the case 13. The adhesive portion 40 has a shape protruding from the upper part of the case 13 toward the -Z direction side. Further, the adhesive portions 40 are provided at both ends of the case 13 in the ±X directions, respectively. A first supply flow path 101 that communicates with the introduction liquid chamber 31 is formed in the adhesive portion 40 on the +X direction side. A first discharge flow path 111 that communicates with the introduction liquid chamber 31 is formed in the adhesive portion 40 on the -X direction side. Further, in the present embodiment, two common liquid chambers 27 are formed in one head chip 10, and one first supply flow path 101 and one first discharge flow path 111 are provided in each common liquid chamber 27.

[0040] The adhesion surface 41 is the surface on the -Z direction side of the adhesive portion 40. The first supply flow path 101 opens in the adhesion surface 41 of the adhesive portion 40 on the +X direction side, and an opening of the first discharge flow path 111 is formed in the adhesion surface 41 of the adhesive portion 40 on the -X direction side. Although details will be described later, a first adhesive 45 (see FIG. 6) is applied to the periphery of the openings of the first supply flow path 101 and the first discharge flow path 111 on the adhesion surface 41. The adhesion surface 41 is provided in each of the head chips 10A - 10D. The adhesion surface 41 of the first head chip 10A is an example of the "first adhesion surface", and the adhesion surface 41 of the second head chip 10B is an example of the "third adhesion surface".

[0041] As shown in FIG. 6, a contact portion 51 and a contact portion 52 are provided on the upper portion of the head chip 10. The contact portion 51 faces the contacted portion 71 of the holder 70 described later, and the contact portion 52 faces the contacted portion 72 of the holder 70 described later. Specifically, the contact portion 51 and the contact portion 52 have a columnar shape protruding from the upper portion of the case 13 toward the -Z direction side. Note that the shapes of the contact portion 51 and the contact portion 52 are not limited to columnar shapes. The contact portion 51 is provided on each of the head chips 10A - 10D. The contact portion 51 provided on the first head chip 10A is an example of the "first contact portion", and the contact portion 51 provided on the second head chip 10B is an example of the "third contact portion". Also, the contact portion 52 provided on the first head chip 10A is an example of the "second contact portion".

[0042] Further, in the longitudinal direction of the head chip 10, in this embodiment, with respect to the center of the head chip 10 in the ±X direction, the contact portion 51 is arranged on the -X direction side, and the contact portion 52 is arranged on the +X direction side. Two sets of such a combination of the contact portion 51 and the contact portion 52 are arranged in the ±Y direction with the wiring insertion hole 33 interposed therebetween.

[0043] The upper portion of the head chip 10 has a non-contact portion 43 that does not contact the holder 70. In this embodiment, the non-contact portion 43 is a portion of the upper portion of the head chip 10 where the bonding portion 40, the contact portion 51, and the contact portion 52 are not provided. The non-contact portion 43 is a surface facing the holder 70 and is formed substantially flat.

[0044] The bonding surface 41 on the -X direction side and the contact portion 51 are arranged so as to sandwich the non-contact portion 43 when viewed in the +Z direction. Similarly, the bonding surface 41 on the +X direction side and the contact portion 52 are arranged so as to sandwich the non-contact portion 43 when viewed in the +Z direction.

[0045] Also, when viewed in the +Z direction, the area of the non-contact portion 43 is larger than the area of the contact portion 51. Similarly, when viewed in the +Z direction, the area of the non-contact portion 43 is larger than the area of the contact portion 52. Further, the non-contact portion 43 is larger than the contact portion 51 and larger than the contact portion 52 in the ±X direction, which is the longitudinal direction of the head chip 10, and in the ±Y direction, which is the short-side direction.

[0046] Also, the contact portion 51 is located in the -Z direction, which is the direction opposite to the +Z direction, which is the ink ejection direction, with respect to the adhesion surface 41. Similarly, the contact portion 52 is located in the -Z direction, which is the direction opposite to the +Z direction, which is the ink ejection direction, with respect to the adhesion surface 41.

[0047] With reference to FIGS. 3, 6, 7, and 8, the configurations of the holder 70, the fixing plate 80, the circuit board 95, and the flow path member 90 that hold the head chip 10 will be described. FIG. 6 is a cross-sectional view of the recording head 1 in which the cross-sectional line is appropriately bent to include the adhesion surface 41, the introduction liquid chamber 31, the first supply flow path 101, the contact portion 51, and the contact portion 52. FIG. 7 is an enlarged cross-sectional view of the main part of the recording head 1 with a cross-section taken along a plane perpendicular to the ±X direction and passing through the center of the head chip 10 in the ±X direction. FIG. 8 is a plan view of the recording head 1 viewed in the -Z direction. In FIG. 8, the broken line indicates the outer shape of each of the head chips 10A - 10D, the dashed-dotted line indicates the contact position 83 to be described later, and the hatched area indicates the fixing position 82 to be described later.

[0048] The holder 70 holds four head chips 10 and is a member that accommodates the four head chips 10 between the fixed plate 80. Specifically, the holder 70 includes a flat base portion 75 and an outer peripheral wall 76 protruding from the base portion 75 toward the +Z direction side. A plurality of head chips 10 are accommodated in a plurality of accommodating portions 77 formed by the surface of the base portion 75 on the +Z direction side and the inner surface of the outer peripheral wall 76. As can be understood from FIGS. 6 to 8, the outer peripheral wall 76 includes a frame-shaped outermost wall 76a and a plurality of partition portions 76b when viewed in the -Z direction. Specifically, when viewed in the -Z direction, the outermost wall 76a is provided so as to surround the four head chips 10, and the plurality of partition portions 76b divide the accommodating portion 77 surrounded by the outermost wall 76a into a plurality of parts. That is, each head chip 10 is disposed one by one in an accommodating portion 77, which is a space surrounded by a part of the outermost wall 76a and one or a plurality of partition portions 76b when viewed in the -Z direction. In the present embodiment, since three partition portions 76b are provided, four accommodating portions 77 are provided corresponding to each of the four head chips. Note that the outer peripheral wall 76 may be configured only by the outermost wall 76a without including the partition portion 76b, and a plurality of head chips 10 may be accommodated in one accommodating portion 77. Further, the number of the partition portions 76b may be any number including 0.

[0049] As an example of a flow path communicating with the head chip 10, the holder 70 has a second supply flow path 102 and a second discharge flow path 112 that penetrate the base portion 75 in the ±Z direction. In the present embodiment, two second supply flow paths 102 are provided corresponding to the two first supply flow paths 101 provided in the head chip 10. Similarly, two second discharge flow paths 112 are provided corresponding to the two first discharge flow paths 111 provided in the head chip 10.

[0050] Next, the bonding surface 42 is the surface on the +Z direction side of the holder 70 and is the surface to which the first adhesive 45 described later is applied. Openings of the second supply channel 102 and the second discharge channel 112 described above are formed in the bonding surface 42. Note that the bonding surface 42 is provided on the holder 70 corresponding to each of the head chips 10A - 10D. The bonding surface 42 provided on the holder 70 corresponding to the first head chip 10A is an example of the "second bonding surface", and the bonding surface 42 provided on the holder 70 corresponding to the second head chip 10B is an example of the "fourth bonding surface".

[0051] Further, the holder 70 has a contacted portion 71 facing the contact portion 51 and a contacted portion 72 facing the contact portion 52. In the present embodiment, the bottom surface 78 on the +Z direction side of the holder 70 inside the outer peripheral wall 76 is formed flat, and the contacted portion 71 is the portion of the bottom surface 78 facing the contact portion 51. Also, the contacted portion 72 is the portion of the bottom surface 78 facing the contact portion 52. There are two contacted portions 71 corresponding to each of the two contact portions 51, and there are two contacted portions 72 corresponding to each of the two contact portions 52. Note that the contacted portion 71 is provided on the holder 70 corresponding to each of the head chips 10A - 10D. The contacted portion 71 provided on the holder 70 corresponding to the first head chip 10A is an example of the "first contacted portion", and the contacted portion 71 provided on the holder 70 corresponding to the second head chip 10B is an example of the "third contacted portion". The contacted portion 72 is provided on the holder 70 corresponding to each of the head chips 10A - 10D. The contacted portion 72 provided on the holder 70 corresponding to the first head chip 10A is an example of the "second contacted portion".

[0052] A flow path member 90 is provided on the -Z direction side of the holder 70. The flow path member 90 has a third supply channel 103 which is a flow path for supplying ink from the liquid container 3 to the -Z direction side surface. Also, the flow path member 90 has a third discharge channel 113 which is a flow path for discharging ink from the head chip 10 to the -Z direction side surface.

[0053] Although not particularly shown, the third supply channel 103 branches such that it has one opening connected to the liquid container 3 and two openings connected to the second supply channel 102 of the holder 70. As described above, two first supply channels 101 are provided for one head chip 10, and correspondingly, two second supply channels 102 are provided for the holder 70. The third supply channel 103 branches to supply ink from one liquid container 3 to the two second supply channels 102. Four such third supply channels 103 are provided according to the number of liquid containers 3, which is four in this embodiment.

[0054] Although not particularly shown, the third discharge channel 113 branches such that it has one opening connected to the liquid container 3 and two openings connected to the second discharge channel 112 of the holder 70. As described above, two first discharge channels 111 are provided for one head chip 10, and correspondingly, two second discharge channels 112 are provided for the holder 70. The third discharge channel 113 branches to supply ink from one liquid container 3 to the two second discharge channels 112. Four such third discharge channels 113 are provided according to the number of liquid containers 3, which is four in this embodiment.

[0055] The holder 70 holds the circuit board 95 between itself and the flow path member 90. Specifically, a recess 91 is formed on the surface of the flow path member on the +Z direction side. The +Z direction side of the flow path member 90 and the -Z side of the holder 70 are fixed, and the circuit board 95 is accommodated in the space formed by the recess 91 and the holder 70 in a state of being laminated above the holder 70, that is, above the holder 70.

[0056] The circuit board 95 is a rigid board common to the plurality of flexible boards 23 each of the plurality of head chips 10 has. A first board insertion hole 98 penetrating in the ±Z directions is formed in the base portion 75 of the holder 70 and the flexible board 23 can be inserted therethrough. Also, a second board insertion hole 97 penetrating in the ±Z directions is formed in the circuit board 95 and the flexible board 23 can be inserted therethrough. The flexible board 23 of each head chip 10 is inserted through the first board insertion hole 98 and the second board insertion hole 97 and bent, and is electrically connected to the surface on the -Z direction side of the circuit board 95. Further, the circuit board 95 is provided with a first insertion hole 96 through which the third supply channel 103 and the third discharge channel 113 are inserted. The third supply channel 103 is inserted through the first insertion hole 96 and connected to the second supply channel 102. The third discharge channel 113 is inserted through the first insertion hole 96 and connected to the second discharge channel 112.

[0057] Also, a fixing plate 80 is fixed to each head chip 10. The fixing plate 80 is a plate-like member made of a metal material such as stainless steel, and includes an opening 81 for exposing the plurality of nozzles 11 of the head chip 10 to the outside. In the present embodiment, the opening 81 is formed to have a size at which the nozzle plate 12 of the head chip 10 is exposed, and a plurality of openings 81 are provided independently for each head chip 10. Here, the opening 81 for exposing the plurality of nozzles 11 of the first head chip 10A is an example of the "first opening", and the opening 81 for exposing the plurality of nozzles 11 of the second head chip 10B is an example of the "second opening".

[0058] The head chip 10 is fixed to the fixing plate 80. That the head chip 10 is fixed to the fixing plate 80 means that the fixing plate 80 is fixed to the +Z direction side of the head chip 10. There is no limitation on the portion of the head chip 10 to which the fixing plate 80 is fixed. In the present embodiment, the fixing plate 80 is fixed to the compliance board 17. Of course, the present invention is not limited to such a configuration. For example, the fixing plate 80 may be fixed to the nozzle plate 12.

[0059] Further, the fixing plate 80 fixes the holder 70. In the present embodiment, the fixing plate 80 is fixed to the outer peripheral wall 76 of the holder 70. That is, the tip of the outer peripheral wall 76 on the +Z direction side is fixed to the fixing plate 80. The portion of the fixing plate 80 fixed to the outer peripheral wall 76 is referred to as a fixing position 82. Also, when viewed in the -Z direction, the outer peripheral wall 76, in other words, the outermost wall 76a and the partition portion 76b, surround the head chip 10 with a gap from the head chip 10.

[0060] The head chip 10 fixed to the fixing plate 80 on the +Z direction side in this way is adhered to the holder 70 by the first adhesive 45 on the -Z direction side. Specifically, the adhesive surface 41 of the head chip 10 and the adhesive surface 42 of the holder 70 are adhered by the first adhesive 45.

[0061] The first adhesive 45 adheres the head chip 10 and the holder 70 and defines a connection channel 44 that connects between the first supply channel 101 and the second supply channel 102. Similarly, the first adhesive 45 defines a connection channel 44 that connects between the first discharge channel 111 and the second discharge channel 112. Note that the first adhesive 45 does not need to be provided on the entire surface of the adhesive surface 41 or the adhesive surface 42, and it may be provided near the openings of the first supply channel 101, the second supply channel 102, the first discharge channel 111, and the second discharge channel 112. Also, as the first adhesive 45, for example, a silicone-based adhesive can be used, but it is not limited thereto.

[0062] Note that although it was described above that the holder 70 accommodates the head chip 10 between itself and the fixing plate 80, this means that the head chip 10 is disposed between the holder 70 and the fixing plate 80 in the ±Z directions, the +Z direction side of the head chip 10 is fixed to the fixing plate 80, and the -Z direction side of the head chip 10 is adhered to the holder 70.

[0063] In the recording head 1 equipped with the head chip 10 having the above-described configuration, the ink in the liquid container 3 is supplied to the first supply channel 101 of the head chip 10 via the third supply channel 103 and the second supply channel 102 provided in the channel member 90 and the holder 70, and the connection channel 44 formed by the first adhesive 45. Then, with the channels from the first supply channel 101 to the introduction liquid chamber 31, the common liquid chamber 27, and the pressure chamber 19 to the nozzle 11 filled with ink, the piezoelectric actuator 18 is driven, causing pressure fluctuations in the ink in the pressure chamber 19, and the ink is ejected from a predetermined nozzle 11 due to this pressure fluctuation. Also, in the recording head 1, the ink that has not been ejected from the nozzle 11 is discharged from the introduction liquid chamber 31 to the first discharge channel 111, the connection channel 44, the second discharge channel 112, and the third discharge channel 113. The ink discharged from the third discharge channel 113 is supplied again from the third supply channel 103 to the head chip 10, making it a circulation-type recording head 1.

[0064] As shown in FIGS. 1 and 7, the recording apparatus I is provided with caps 9 corresponding to the respective head chips 10 housed between the holder 70 and the fixing plate 80.

[0065] That is, the caps 9 are provided individually for the head chips 10A - 10D, and are also referred to as caps 9A, 9B, 9C, 9D (cap 9D is not shown in FIG. 7). Hereinafter, the description of "caps 9A - 9D" refers to caps 9A, 9B, 9C, and 9D. Regarding the configuration common to caps 9A - 9D, it will be described as cap 9.

[0066] Each of the caps 9A - 9D has a shape capable of closing each of the openings 81 provided corresponding to the respective head chips 10A - 10D. Note that the "first cap" corresponds to cap 9A provided for the first head chip 10A, and the "second cap" corresponds to cap 9B provided for the second head chip 10B.

[0067] The cap 9 is provided in the apparatus main body 2 as a component of a maintenance unit (not shown). The maintenance unit includes the cap 9, a cap moving mechanism (not shown) for operating the cap 9, and a suction pump (not shown).

[0068] The cap 9 has a flat bottom portion 901 facing the nozzle plate 12 and wall portions 902 extending from each side of the bottom portion 901 toward the -Z direction side, and is a bottomed box-shaped member that opens toward the -Z direction side. The opening shape of the cap 9 is larger than at least the opening 81 of the fixing plate 80.

[0069] The recording head 1 can move along the guide rail 8b toward the -Y direction side and stop at a predetermined position on the -Y direction side of the range where the medium S is conveyed. This predetermined position is referred to as the cap position. When the recording head 1 stops at the cap position, the cap 9 faces the nozzle plate 12 as viewed in the +Z direction and is arranged to cover the opening 81.

[0070] The cap moving mechanism of the maintenance unit moves the cap 9 in the ±Z direction. In a state where the recording head 1 has stopped at the cap position, the control unit 5 causes the cap moving mechanism to move the cap 9 toward the -Z direction side. By such an operation of the cap moving mechanism, the cap 9 moves from the +Z direction side to the -Z direction side and contacts the fixing plate 80 at a position that is inside the fixed position 82 and overlaps the head chip 10 as viewed in the +Z direction. As shown in FIGS. 7 and 8, a part of the fixing plate 80 that abuts against the -Z direction side surface of the wall portion 902 of the cap 9 is defined as the abutting position 83. The abutting position 83 is outside the opening 81 of the fixing plate 80 and inside the fixed position 82.

[0071] When the wall portion 902 of the cap 9 contacts the contact position 83 of the fixing plate 80, the opening 81 is blocked, and a closed space 9a is formed by the portion of the recording head 1 exposed to the opening 81 such as the nozzle plate 12, the inner peripheral surface of the opening 81, and the cap 9. That is, the cap 9 functions as a seal that blocks the nozzles 11 from the outside air. Therefore, by stopping the recording head 1 at the cap position and forming the closed space 9a so that the cap 9 covers the nozzle plate 12, the nozzles 11 of the nozzle plate 12 can be blocked from the outside air. As a result, the nozzles 11 can be kept moist, and for example, it is possible to suppress the thickening of the ink in the vicinity of the nozzles 11.

[0072] The suction pump of the maintenance unit applies a negative pressure to the closed space 9a formed by the cap 9. For example, the cap 9 is provided with a communication path (not shown) that communicates the closed space 9a to the outside, and the suction pump can apply a negative pressure to the closed space 9a through the communication path.

[0073] By operating the suction pump with the closed space 9a formed by the cap 9 to apply a negative pressure to the closed space 9a, it is possible to perform cleaning that forcibly discharges the thickened ink or the bubbles staying in the flow path in the ink flow path of the recording head 1 from the nozzles 11. Further, the cap 9 can also be used to receive the ink jetted by flushing from the nozzles 11 without operating the suction pump.

[0074] Here, let the dimension between the contact portion 51 and the contacted portion 71 be the first dimension H1. Let the dimension between the bonding surfaces 41 and 42 be the second dimension H2. Let the dimension between the contact portion 52 and the contacted portion 72 be the third dimension H3. And the first dimension H1 is smaller than the second dimension H2, and the third dimension H3 is also smaller than the second dimension H2. The magnitude relationship between the first dimension H1 and the third dimension H3 may be such that one is larger than the other, or the two may be equal. Also, the contact portion 51 and the contacted portion 71 may be in contact. That is, the first dimension H1 may be zero. The contact portion 52 and the contacted portion 72 may be in contact. That is, the third dimension H3 may be zero. Also, for the second head chip 10B, the "fourth dimension" between the aforementioned "third contact portion" and "third contacted portion" corresponds to the first dimension H1 in the first head chip 10A, but the "fourth dimension" is also smaller than the second dimension H2.

[0075] For example, let the second dimension H2 be 0.14 ± 0.11 mm (tolerance during manufacturing). That is, the second dimension H2 is in the range of 0.03 - 0.25 mm. It is preferable that the first dimension H1 is narrower than 0.03 mm, which is the minimum gap of the second dimension H2 considering the tolerance. Specifically, it is preferable that the first dimension H1 is 0.020 ± 0.009 mm, that is, about 0.00 mm - 0.029 mm. By setting the first dimension H1, the second dimension H2, and the third dimension H3 in this way, the deformation of the fixing plate 80 can be suppressed as follows.

[0076] Also, let the dimension between the non-contact portion 43 and the portion of the holder 70 facing the non-contact portion 43 be the dimension H. The dimension H is larger than the second dimension H2. That is, the upper part of the head chip 10 is configured such that the contact portions 51 and 52 are in contact with the holder 70, and the other non-contact portion 43 is not in contact with the holder 70.

[0077] As described above, the fixing plate 80 is fixed to the tip of the outer peripheral wall 76 of the holder 70 and is also fixed to the head chip 10 spaced apart from the outer peripheral wall 76. When the cap 9 contacts at the contact position 83 which is inside the fixing position 82 and overlaps with the head chip 10 when viewed in the +Z direction with respect to such a fixing plate 80, an external force in the -Z direction acts near the head chip 10 of the fixing plate 80.

[0078] When an external force by the cap 9 acts on the fixing plate 80, the head chip 10 is pressed in the -Z direction and the first adhesive 45 is crushed. However, since the first dimension H1 is smaller than the second dimension H2, the contact portion 51 and the contacted portion 71 come into contact. Due to this contact, the movement of the head chip 10 in the -Z direction due to the external force of the cap 9 is restricted. And since the movement of the head chip 10 in the -Z direction is restricted, it is possible to suppress the deformation of the fixing plate 80 to the -Z direction side.

[0079] Also, there is a possibility that an external force by the medium S acts on the fixing plate 80. For example, when the medium S having a bent portion or a wrinkled portion is conveyed, or when a bent portion or a wrinkled portion occurs in the medium S during conveyance, the bent portion or the wrinkled portion reaches between the recording head 1 and the platen 400 (see FIG. 2), and there is a possibility of acting an external force that presses the fixing plate 80 to the -Z direction side. In particular, when the medium S is a cloth, the thickness in the ±Z direction of the bent portion or the wrinkled portion tends to be thick, and the external force acting on the fixing plate 80 tends to be large. However, as described above, since the recording head 1 of the present embodiment can restrict the movement of the head chip 10 in the -Z direction due to the external force of the medium S by the contact between the contact portion 51 and the contacted portion 71, it is possible to suppress the deformation of the fixing plate 80 against the external force by the medium S.

[0080] The Young's modulus of the contact portions 51 and 52 is higher than that of the first adhesive 45. Specifically, the contact portions 51 and 52 are rigid bodies that do not deform under the external force acting from the cap 9 or the medium S via the fixed plate 80. In the present embodiment, the contact portions 51 and 52 are formed as part of the case 13. Examples of the material constituting such a case 13 include resin, metal, and ceramics. Note that the contact portions 51 and 52 may be separate from the case 13.

[0081] The Young's modulus of the contacted portions 71 and 72 is higher than that of the first adhesive 45. Specifically, the contacted portions 71 and 72 are rigid bodies that do not deform under the external force acting from the cap 9 or the medium S via the fixed plate 80. In the present embodiment, the contacted portions 71 and 72 are part of the holder 70. Examples of the material constituting such a holder 70 include resin, metal, and ceramics. Note that the contacted portions 71 and 72 may be separate from the holder 70.

[0082] Examples of the resin constituting the case 13 or the holder 70 may be, for example, a thermoplastic resin or a thermosetting resin. Examples of the thermoplastic resin include polyphenylene ether resin (PPE), modified polyphenylene ether resin (m-PPE), polyethylene resin (PE), polystyrene resin (PS), polyamide resin (PA), PPS, PP, LCP, ABS resin, vinyl chloride-vinyl acetate copolymer resin, polyvinyl chloride resin, and mixtures thereof. Examples of the thermosetting resin include phenolic resins such as bakelite, epoxy resins such as epoxy glass, urethane resins, melamine resins, and ester resins. Note that it is preferable to form the case 13 and the holder 70 using a thermosetting resin having excellent temperature stability, chemical resistance, and high rigidity.

[0083] As described above, the recording head 1 according to the present embodiment includes a head chip 10, a holder 70, and a fixing plate 80, and houses the head chip 10 between the holder 70 and the fixing plate 80. An adhesive surface 41, a contact portion 51, and a contact portion 52 are provided on the head chip 10, and an adhesive surface 42, a contacted portion 71, and a contacted portion 72 are provided on the holder 70. The head chip 10 is adhered to the adhesive surface 42 by a first adhesive 45 at the adhesive surface 41 and is fixed to the fixing plate 80. And the first dimension H1 is smaller than the second dimension H2, and the third dimension H3 is smaller than the second dimension H2.

[0084] Even when an external force in the -Z direction acts on the head chip 10 via the fixing plate 80 in such a recording head 1, since the first dimension H1 is smaller than the second dimension H2, the contact portion 51 and the contacted portion 71 can be brought into contact, and the movement of the head chip 10 in the -Z direction due to the external force of the cap 9 can be restricted. And since the movement of the head chip 10 in the -Z direction is restricted, deformation of the fixing plate 80 can be suppressed.

[0085] Also, the head chip 10 and the holder 70 are fixed by the first adhesive 45. For this reason, the inclination of the nozzle surface due to the dimensional error of each head chip 10 can be adjusted by changing the thickness of the first adhesive 45 in the ±Z direction when attaching the head chip 10 to the holder 70. In particular, by adopting a silicone-based adhesive with a relatively small Young's modulus as the first adhesive 45, it is easy to change the thickness of the first adhesive 45 in the ±Z direction.

[0086] The contact portion 51 and the contacted portion 71 exemplified in the above embodiment are not in contact in a state where no external force acts on the fixing plate 80, but are not limited to such a configuration and may be in direct contact. In the recording head 1 in which the contact portion 51 and the contacted portion 71 are in direct contact, deformation of the fixing plate 80 can be more reliably suppressed as compared with the case where the contact portion 51 and the contacted portion 71 are not in contact.

[0087] In addition, when a contact portion 52 and a contacted portion 72 are provided in addition to the contact portion 51 and the contacted portion 71, that is, when a plurality of sets of a contact portion and a contacted portion are provided, the contact portion and the contacted portion may be in contact in all sets, or the contact portion and the contacted portion may be in contact only in an arbitrary set.

[0088] Further, in the recording head 1 of the present embodiment, when viewed in the +Z direction which is the ink ejection direction, the area of the non-contact portion 43 is larger than the areas of the contact portion 51 and the contact portion 52. That is, the configuration in which the contact portions 51 and 52 are provided at a part of the upper portion of the case 13 can improve the surface accuracy of the contact portions 51 and 52 and the accuracy of the first dimension H1 as compared with the configuration in which the contact portions are provided on the entire surface of the case 13 other than the adhesion surface 41 at the upper portion.

[0089] Further, the head chip 10 has a case 13 having the contact portion 51 and the contact portion 52, and the contact portion 51 and the contact portion 52 are formed as a part of the upper portion of the case 13. Since the rigid case 13 abuts against the holder 70, deformation of the fixing plate 80 can be more reliably suppressed.

[0090] Further, the head chip 10 is connected to the circuit board 95 and includes a flexible substrate 23 standing along the ±Z direction which is the ink ejection direction. Thereby, the flexible substrate 23 capable of absorbing the tolerance in the ±Z direction can connect the drive circuit 25 of the head chip 10 and the circuit board 95 held by the holder 70 so that the inclination of the head chip 10 in the ±Z direction with respect to the holder 70 can be adjusted. Note that the flexible substrate 23 may stand obliquely with respect to the ±Z direction.

[0091] In addition, in this embodiment, the recording head 1 has a contact portion 52 and a contacted portion 72. When the third dimension H3 between the contact portion 52 and the contacted portion 72 is equal to the first dimension H1, each of the contact portion 51 and the contact portion 52 contacts each of the contacted portion 71 and the contacted portion 72 due to the external force on the fixed plate 80. Since a plurality of contact portions contact the contacted portions in this way and receive the external force acting from the fixed plate 80, it is possible to more reliably suppress the deformation of the fixed plate 80. When the third dimension H3 is not equal to the first dimension H1, either one of the contact portion 51 or the contact portion 52 contacts the contacted portion 71 or the contacted portion 72. That is, even if a plurality of sets of the contact portion and the contacted portion are provided and the dimensions in the ±Z direction of each set are different, since any one set will contact, the deformation of the fixed plate 80 as described above can be suppressed.

[0092] In addition, in this embodiment, with respect to the longitudinal direction of the head chip 10, that is, with respect to the center of the head chip 10 in the ±X direction in this embodiment, the contact portion 51 is arranged on the -X direction side, and the contact portion 52 is arranged on the +X direction side. By arranging the contact portion 51 and the contact portion 52 in this way, the external force acting from the fixed plate 80 is dispersed in the +X direction and the -X direction, so that the deformation of the fixed plate 80 can be further suppressed.

[0093] In addition, in this embodiment, each of the plurality of caps 9 is provided individually for each of the head chips 10. For this reason, compared with a configuration in which one cap 9 is provided in common for a plurality of head chips 10, a large load is likely to act on the head chip 10 via the fixed plate 80. However, the recording head 1 of this embodiment can withstand such a large load and suppress the deformation of the fixed plate 80 even when individual caps 9 are provided for a plurality of head chips 10. In addition, since each of the plurality of caps 9 is provided individually for each of the head chips 10, the moisture retention of the nozzles 11 can be improved, and clogging and the like can be suppressed. Also, the sealing property of the closed space 9a can be improved.

[0094] (Embodiment 2) FIG. 9 is a cross-sectional view of the recording head 1A according to Embodiment 2 of the present invention. Specifically, FIG. 9 is a cross-sectional view of the recording head 1 in which the cross-sectional line is appropriately bent to include the adhesion surface 41, the introduction liquid chamber 31, the first supply flow path 101, the contact portion 51A, and the contact portion 52A. Note that the same members as those in Embodiment 1 described above are denoted by the same reference numerals, and redundant descriptions are omitted.

[0095] In the holder 70A of the present embodiment, the second supply flow path 102 and the second discharge flow path 112 described in Embodiment 1 are not provided. The holder 70A is provided with a second insertion hole 79 penetrating in the ±Z direction.

[0096] The third supply flow path 103 provided in the flow path member 90A extends in the +Z direction and passes through the second insertion hole 79. The surface on the +Z direction side of the third supply flow path 103 is adhered to the first adhesive 45, and the third supply flow path 103 communicates with the connection flow path 44 and the first supply flow path 101. The opening edge portion on the +Z direction side of the third supply flow path 103 serves as the adhesion surface 42.

[0097] The third discharge flow path 113 provided in the flow path member 90A extends in the +Z direction and passes through the second insertion hole 79. The surface on the +Z direction side of the third discharge flow path 113 is adhered to the first adhesive 45, and the third discharge flow path 113 communicates with the connection flow path 44 and the first discharge flow path 111. The opening edge portion on the +Z direction side of the third discharge flow path 113 serves as the adhesion surface 42.

[0098] The contact portion 51A is located in the +Z direction, which is the ejection direction, from the adhesion surface 41. Similarly, the contact portion 52A is located in the +Z direction, which is the ejection direction, from the adhesion surface 41. Further, the contacted portion 71A protrudes from the surface facing the head chip 10 of the holder 70. Similarly, the contacted portion 72A protrudes from the surface facing the head chip 10 of the holder 70.

[0099] The first dimension H1 between the contact portion 51A and the contacted portion 71A is smaller than the second dimension H2. Further, the third dimension H3 between the contact portion 52A and the contacted portion 72A is smaller than the second dimension H2.

[0100] Further, the contact portion 51A and the contacted portion 71A are adhered via the second adhesive 46, and the contact portion 52A and the contacted portion 72A are adhered via the second adhesive 46. The second adhesive 46 may have the same composition as the first adhesive 45 or may have a different composition. When using the second adhesive 46 having a composition different from that of the first adhesive 45, it is preferable that the second adhesive 46 has a higher Young's modulus than the first adhesive 45. When using a silicone-based adhesive as the first adhesive 45, an epoxy-based adhesive can be used as the second adhesive 46 having a higher Young's modulus than that.

[0101] The Young's modulus of the contact portion 51A and the contact portion 52A is higher than that of the second adhesive 46. Also, the Young's modulus of the contacted portion 71A and the contacted portion 72A is higher than that of the second adhesive 46.

[0102] In the recording head 1A having such a configuration, the bonding surface 41 and the bonding surface 42 are bonded by the first adhesive 45, and the head chip 10 is fixed to the fixing plate 80. And the first dimension H1 is smaller than the second dimension H2, and the third dimension H3 is smaller than the second dimension H2. Therefore, the recording head 1A exhibits the same operational effects as the recording head 1 of the first embodiment.

[0103] Also, the contact portion 51A and the contacted portion 71A are adhered to each other via the second adhesive 46. In such a recording head 1A, the deformation of the fixing plate 80 can be more reliably suppressed as compared with the case where the contact portion 51A and the contacted portion 71A are not in contact with each other.

[0104] Also, the first adhesive 45 and the second adhesive 46 may be of the same type, but it is preferable that the second adhesive 46 has a higher Young's modulus than the first adhesive 45. The recording head 1A in which the contact portion 51A and the contacted portion 71A are adhered via the second adhesive 46 having a higher Young's modulus than the first adhesive 45 can more reliably suppress the deformation of the fixing plate 80 as compared with the case where the contact portion 51A and the contacted portion 71A are not in contact with each other, and also as compared with the case where the first adhesive 45 and the second adhesive 46 are adhesives having the same Young's modulus.

[0105] (Embodiment 3) FIG. 10 is a cross-sectional view of a recording head 1B according to Embodiment 3 of the present invention. Specifically, FIG. 10 is a cross-sectional view of the recording head 1 in which the cross-sectional line is appropriately bent to include the bonding surface 41, the introduction liquid chamber 31, the first supply flow path 101, the contact portion 51, and the contact portion 52. Note that the same members as those in the above-described Embodiment 1 and Embodiment 2 are denoted by the same reference numerals, and redundant descriptions are omitted.

[0106] In the recording head 1B of the present embodiment, a circuit board 95 is disposed above the holder 70B, that is, on the -Z direction side of the holder 70B.

[0107] The second supply flow path 102 provided in the holder 70B protrudes from the bottom surface 78 in the +Z direction. The surface on the +Z direction side of the second supply flow path 102 is adhered to the first adhesive 45, and the second supply flow path 102 communicates with the connection flow path 44 and the first supply flow path 101. The opening edge portion on the +Z direction side of the second supply flow path 102 serves as the bonding surface 42.

[0108] The second discharge flow path 112 provided in the holder 70B protrudes from the bottom surface 78 in the +Z direction. The surface on the +Z direction side of the second discharge flow path 112 is adhered to the first adhesive 45, and the second discharge flow path 112 communicates with the connection flow path 44 and the first discharge flow path 111. The opening edge portion on the +Z direction side of the second discharge flow path 112 serves as the bonding surface 42.

[0109] In the recording head 1B having such a configuration, the bonding surface 41 and the bonding surface 42 are bonded by the first adhesive 45, and the head chip 10 is fixed to the fixing plate 80. The first dimension H1 is smaller than the second dimension H2, and the third dimension H3 is smaller than the second dimension H2. Therefore, the recording head 1B exhibits the same operational effects as the recording head 1 of Embodiment 1.

[0110] (Embodiment 4) FIG. 11 is a plan view of the head chip 10 as viewed in the +Z direction. Note that the same members as those in the above-described Embodiments 1-3 are denoted by the same reference numerals, and redundant descriptions are omitted.

[0111] In Embodiments 1-3, the head chip 10 had a configuration in which connection channels 44 defined by a first adhesive 45 were disposed at each of the longitudinal direction +X-direction side end portion and the -X-direction side end portion. That is, in the ±X directions, the connection channels 44 were on the outside, and the contact portions 51 and 52 were disposed inside thereof. Such a configuration is suitable when ink is circulated in the head chip 10.

[0112] On the other hand, as shown in FIG. 11, the head chip 10 according to the present embodiment is not provided with the first discharge channel 111, and the first supply channels 101 are connected to each of the two common liquid chambers 27 (see FIG. 5), and the connection channels 44 (see FIG. 6) are connected to the first supply channels 101. That is, it is not configured such that ink circulates.

[0113] In the head chip 10 according to the present embodiment, in the ±X directions, the contact portions 51 and 52 are disposed on the outside, and the first supply channel 101 is disposed inside thereof. When ink does not circulate in the head chip 10, it is preferable in terms of the strength of the head chip 10 to provide the contact portions 51 and 52 on the outside in the ±X directions.

[0114] (Other Embodiments) As described above, each embodiment of the present invention has been described, but the basic configuration of the present invention is not limited to those described above.

[0115] In the above embodiment, the contact portions 51 and 52 were provided on the head chip 10, but the present invention is not limited to a configuration in which a plurality of such contact portions are provided. The number of contact portions may be one.

[0116] When there is one contact portion, it is preferably provided at the center in the ±X direction, which is the longitudinal direction of the head chip 10. When there are two contact portions, as exemplified in Embodiment 4, it is desirable to provide the contact portions at both ends of the head chip 10 in the ±X direction, respectively. When there are four contact portions, as exemplified in Embodiment 1, it is preferably provided at the four corners at the center in the ±X direction of the head chip 10. Note that both ends in the ±X direction, which is the longitudinal direction of the head chip, refer to the regions of the portions located on the outermost ends when the head chip 10 is virtually divided into three to five portions in the ±X direction. The center in the ±X direction, which is the longitudinal direction of the head chip, refers to the region of the portion inside the portions located on the outermost ends described above.

[0117] In the above embodiment, only the portion of the head chip 10 that forms the connection flow path 44 is adhered to the holder 70 with the first adhesive 45. By adhering in this way with the first adhesive 45, it becomes easier to adjust the inclination of the head chip 10 in the ±Z direction, and the amount of the adhesive used can be reduced. Note that the first adhesive 45 may be applied not only to the portion of the head chip 10 that forms the connection flow path 44 but also to other portions outside the portion. That is, the first adhesive 45 may be provided between the non-contact portion 43 and the holder 70. Thereby, the head chip 10 can be firmly fixed by the holder 70.

[0118] In Embodiments 2 - 3, the contacted portions 71A, 71B, 72A, and 72B were provided so as to protrude from the bottom surface 78 of the holder 70 toward the +Z direction side, but the configuration is not limited to this. For example, the contacted portion may be provided so as to protrude from the outer peripheral wall 76 of the holder 70 in the ±X direction or the ±Y direction.

[0119] In the above embodiment, the fixing plate 80 was directly fixed to the head chip 10, but the configuration is not limited to this. For example, a reinforcing plate may be provided between the fixing plate 80 and the head chip 10, and the fixing plate 80 may be indirectly fixed to the head chip 10 via the reinforcing plate.

[0120] If the first dimension H1, the second dimension H2, and the third dimension H3 satisfy the above-described relationship, the bonding surface 41, the contact portions 51, 51A, the contact portions 52, and 52A may protrude in the -Z direction from the non-contact portion 43, or may be flush with the non-contact portion 43 or recessed in the +Z direction side from the non-contact portion 43.

[0121] If the first dimension H1, the second dimension H2, and the third dimension H3 satisfy the above-described relationship, the bonding surface 42, the contacted portions 71, 71A, the contacted portions 72, and 72A may protrude in the +Z direction from the bottom surface 78 facing the head chip 10 of the holder 70, or may be flush with the bottom surface 78 or recessed in the -Z direction from the bottom surface 78.

[0122] Furthermore, the present invention is directed to liquid ejection heads in general, and can be applied to, for example, recording heads such as various inkjet recording heads used in image recording apparatuses such as printers, color material ejection heads used in the manufacture of color filters such as liquid crystal displays, electrode material ejection heads used in the formation of electrodes such as organic EL displays and FED (field emission displays), and biological organic matter ejection heads used in the manufacture of biochips. Also, although an inkjet recording apparatus has been described as an example of the liquid ejection apparatus, it can also be used in liquid ejection apparatuses using the other liquid ejection heads described above.

Explanation of Reference Numerals

[0123] H1…First dimension, H2…Second dimension, H3…Third dimension, I…Inkjet recording apparatus (recording apparatus), 1, 1A, 1B…Inkjet recording head (recording head), 4…Conveying mechanism (conveying unit), 9, 9A, 9B, 9C, 9D…Cap, 10…Head chip, 10A…First head chip, 10B…Second head chip, 10C…Third head chip, 10D…Fourth head chip, 11…Nozzle, 12…Nozzle plate, 13…Case, 23…Flexible substrate, 41, 42…Adhesive surface, 43…Non-contact portion, 44…Connection flow path, 45…First adhesive, 46…Second adhesive, 51, 51A, 52, 52A…Contact portion, 70, 70A, 70B…Holder, 71, 71A, 71B, 72, 72A, 72B…Contacted portion, 76…Outer peripheral wall, 80…Fixing plate, 81…Opening, 82…Fixing position, 95…Circuit board

Claims

1. A first head chip having a plurality of first nozzles for injecting liquid in an injection direction; A holder for holding the first head chip; A fixing plate having a first opening for exposing the plurality of first nozzles to the outside, and to which the holder and the first head chip are fixed; Comprising: On the upper part of the first head chip, a first bonding surface with an opening of a flow path formed thereon is provided; The holder has a second bonding surface that accommodates the first head chip between the holder and the fixing plate and has an opening of a flow path communicating with the first head chip; The first bonding surface and the second bonding surface are bonded by a first adhesive so as to define a connection flow path connecting between the flow path communicating with the first head chip of the holder and the flow path of the first head chip; The upper part of the first head chip has a first contact portion; The holder has a first contacted portion facing the first contact portion; A first dimension between the first contact portion and the first contacted portion is smaller than a second dimension between the first bonding surface and the second bonding surface; A liquid injection head, characterized in that.

2. The first contact portion and the first contacted portion are in direct contact; The liquid injection head according to Claim 1, characterized in that.

3. The first contact portion and the first contacted portion are adhered to each other via a second adhesive; The liquid injection head according to Claim 1, characterized in that.

4. The second adhesive has a higher Young's modulus than the first adhesive; The liquid injection head according to Claim 3, characterized in that.

5. Each of the first contact portion and the first contacted portion has a higher Young's modulus than the first adhesive; The liquid injection head according to any one of Claims 1 to 4, characterized in that.

6. The upper part of the first head chip has a non-contact portion that does not contact the holder; A dimension between the non-contact portion and a portion of the holder facing the non-contact portion is larger than the second dimension; The liquid injection head according to any one of Claims 1 to 5, characterized in that.

7. The first bonding surface and the first contact portion are arranged so as to sandwich the non-contact portion when viewed in the injection direction; The liquid injection head according to Claim 6, characterized in that.

8. When viewed in the injection direction, an area of the non-contact portion is larger than an area of the first contact portion; The liquid injection head according to Claim 6 or 7, characterized in that.

9. The first head chip has a case having the first contact portion, The first contact portion is a part of the upper portion of the case, The liquid ejection head according to any one of claims 1 to 8, characterized in that.

10. A circuit board disposed above the holder and electrically connected to the first head chip is provided, The liquid ejection head according to any one of claims 1 to 9, characterized in that.

11. The first head chip includes a flexible substrate that is connected to the circuit board and stands up along the ejection direction, The liquid ejection head according to claim 10, characterized in that.

12. The first contact portion is located in a direction opposite to the ejection direction with respect to the first adhesive surface, The liquid ejection head according to any one of claims 1 to 11, characterized in that.

13. The first contact portion is located in the ejection direction with respect to the first adhesive surface, The first contacted portion protrudes from the surface of the holder facing the first head chip, The liquid ejection head according to any one of claims 1 to 11, characterized in that.

14. The upper portion of the first head chip has a second contact portion, The holder has a second contacted portion facing the second contact portion, A third dimension between the second contact portion and the second contacted portion is smaller than the second dimension, The liquid ejection head according to any one of claims 1 to 13, characterized in that.

15. The first contact portion is disposed on one side with respect to the center of the first head chip in the longitudinal direction of the first head chip, The second contact portion is disposed on the other side with respect to the center of the first head chip in the longitudinal direction of the first head chip, The liquid ejection head according to claim 14, characterized in that.

16. A second head chip having a plurality of second nozzles for ejecting liquid is provided, The fixing plate has a second opening for exposing the plurality of second nozzles to the outside, and the second head chip is fixed, The second head chip is accommodated between the holder and the fixing plate at a distance from the first head chip, A third adhesive surface having an opening of a flow path is provided on the upper portion of the second head chip, The holder has a fourth adhesive surface having an opening of a flow path communicating with the second head chip, The third adhesive surface and the fourth adhesive surface are adhered by the first adhesive so as to define a connection flow path connecting between the flow path communicating with the second head chip of the holder and the flow path of the second head chip. The upper part of the second head chip has a third contact part. The holder has a third contacted part facing the third contact part. A fourth dimension between the third contact part and the third contacted part is smaller than the second dimension. The liquid ejection head according to any one of claims 1 to 15, characterized in that.

17. The holder has an outer peripheral wall surrounding the first head chip so as to be spaced apart from the first head chip. A tip of the outer peripheral wall in the ejection direction is fixed at a fixed position of the fixing plate. The liquid ejection head according to any one of claims 1 to 16, characterized in that.

18. A liquid ejection head according to any one of claims 1 to 17, A transport unit for transporting a medium, A liquid ejection device characterized by comprising.

19. A cap that contacts the fixing plate by relatively moving in a direction opposite to the ejection direction with respect to the fixing plate is provided, The cap forms a closed space in which the plurality of first nozzles open by contacting the fixing plate inside the fixed position. The liquid ejection device according to claim 18, which cites claim 17, characterized in that.

20. A liquid ejection head according to claim 17, which cites claim 16, A first cap and a second cap that contact the fixing plate by relatively moving in a direction opposite to the ejection direction with respect to the fixing plate, Comprising, The first cap forms a closed space in which the plurality of first nozzles open by contacting the fixing plate at a position inside the fixed position and overlapping the first head chip when viewed in the ejection direction. The second cap forms a closed space in which the plurality of second nozzles open by contacting the fixing plate at a position inside the fixed position and overlapping the second head chip when viewed in the ejection direction. A liquid ejection device characterized by that.

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