Thermal printing head thermistor resistance value preparation device

Abstract

The utility model provides a thermistor resistance value preparation device for a thermal printing head, and relates to the technical field of thermal printing head equipment. Comprising an industrial control system, and a to-be-detected material shuttle storage position system, a detected material shuttle storage position system, a material shuttle taking and placing manipulator, a substrate taking and placing manipulator, a resistance adjusting probe station and an identifier identification visual system which are connected with the industrial control system, according to the scheme, the uniformity of the resistance value of the thermal printing head can be improved, and the production efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of thermal printing head devices, and more particularly, to a device for preparing the resistance value of a thermistor of a thermal printing head. Background Art

[0002] When preparing the resistance value of the existing thermal printing head, a probe is needed for resistance adjustment to ensure that the resistance values between each printing point meet the requirements. However, the existing devices have problems such as poor uniformity, slow resistance adjustment, and poor reliability during resistance adjustment. Poor uniformity will lead to quality defects such as uneven ink dots for printing. In addition, there are also problems with the existing devices for realizing resistance value preparation, such as low automation and a high possibility of differences in resistance values between multiple devices, resulting in different qualities and lower stability of the thermal printing heads modulated by different devices. Summary of the Utility Model

[0003] The utility model discloses a device for preparing the resistance value of a thermistor of a thermal printing head, aiming to improve the problems of poor resistance adjustment uniformity, poor stability, and low efficiency of the existing resistance adjustment devices.

[0004] The utility model adopts the following solutions:

[0005] A device for preparing the resistance value of a thermistor of a thermal printing head, comprising: an industrial control system and a to-be-tested shuttle storage system, a tested shuttle storage system, a pick-and-place shuttle manipulator, a pick-and-place substrate manipulator, and a resistance adjustment probe table connected to the industrial control system; wherein,

[0006] The to-be-tested shuttle storage system is provided with an upper plate position, and the to-be-tested shuttle storage system is configured to be able to convey the substrate with the printing head to be resistance-adjusted to the upper plate position and cooperate with the pick-and-place substrate manipulator to take out and transport the substrate into the resistance adjustment probe table; the tested shuttle storage system is provided with a board storage position, and the tested shuttle storage system is configured to be able to convey the substrate with the resistance-adjusted printing head to the lower plate position; a pick-and-place shuttle manipulator is arranged between the upper plate position and the board storage position, and the pick-and-place shuttle manipulator is configured to be able to, after the substrate in the shuttle at the upper plate position is taken out, transport the shuttle at the upper plate position to the board storage position for storing the resistance-adjusted substrate;

[0007] A plurality of the resistance trimming probe tables are arranged side by side. Each resistance trimming probe table includes a vacuum adsorption platform, an XY-axis displacement mechanism, a Z-axis lifting mechanism, a rotation angle compensation mechanism, a vision positioning system, a needle washing device, a probe card, and a resistance trimming chassis. Among them, there are a plurality of resistance trimming probes on the probe card. A positioning mechanism is arranged on the vacuum adsorption platform for positioning and clamping the thermal printing head substrate. A large number of heating points are densely arranged on the thermal printing head substrate to be trimmed at a preset interval in the XY direction. By moving the XY coordinates, the heating points to be measured form a one-to-one correspondence with the resistance trimming probes of the probe card to meet the requirements of positioning and alignment, and the heating points on the thermal printing head substrate are grouped and tested according to the number of probes on the probe card until all resistance trimming is completed. The vision positioning system is arranged above the vacuum adsorption platform for identifying and positioning all the heating points and the conductive lines of the heating points on the substrate to be measured, forming an XY coordinate system, and calculating the deviation angle of the heating points from this XY coordinate system to calculate the angle required to rotate the probe card, so that the resistance trimming probes of the probe card are aligned with the conductive lines of the heating points to be measured in the XY extension direction. The Z-axis lifting mechanism is provided with a mounting table suitable for mounting the probe card and is suitable for driving the probe card to lift above the substrate so that each resistance trimming probe on the probe card contacts the heating point electrode. A rotation angle compensation mechanism is arranged on the mounting table for driving the probe card to rotate by the calculated deviation angle of the heating point in the XY direction. The XY-axis displacement mechanism is suitable for driving the substrate to move under the probe card so that the heating point electrode is aligned with the resistance trimming probes on the probe card, ensuring that each heating point completes resistance trimming one by one. A needle washing device is arranged on the XY-axis displacement mechanism, and the needle washing device is suitable for cleaning the needle tips of the probes on the probe card to remove oxides, pollutants or perform horizontal calibration after passivation. The probe card is connected to the resistance trimming chassis, and the resistance trimming chassis provides corresponding pulse voltages one by one according to the number of probes on the probe card for trimming the resistance values of the corresponding heating points.

[0008] The substrate picking and placing robot is suitable for moving between the to-be-tested shuttle storage system, the tested shuttle storage system, and the resistance trimming probe table, and includes a group B arm and a group A arm for simultaneously transporting the to-be-tested substrate and the tested substrate in the same movement stroke.

[0009] Further, clamping mechanisms are arranged at the bottoms of the upper board position and the board storage position. The clamping mechanisms include clamping blocks and telescopic mechanisms, and the telescopic mechanisms are suitable for driving the clamping blocks to clamp inside the shuttles.

[0010] Further, a transfer track is further included. The transfer track is arranged between the to-be-tested shuttle storage system, the tested shuttle storage system, and the resistance trimming probe table. The substrate picking and placing robot is arranged on the transfer track and is suitable for moving on the transfer track.

[0011] Furthermore, a fine-tuning mechanism is provided on the Z-axis lifting mechanism, and the fine-tuning mechanism is adapted to adjust the initial height of the probe card; the industrial control system is configured to, when performing test resistance adjustment, according to the probe image information obtained by the vision lens and the potential change generated during the substrate test by the industrial control system, when the height of the probe bottom end is different and the potential fluctuation during the test exceeds the preset range, drive the needle washing device to be under the probe card for needle washing, so as to reduce the resistance error caused by poor contact between the probe and the conductive circuit, and help to obtain a more valuable actual resistance value.

[0012] Furthermore, a turntable for installing the probe card is rotatably provided on the installation table, and gear teeth are provided on the turntable. The rotation angle compensation mechanism includes a rotation motor provided on the installation table, and an output shaft of the rotation motor is connected with a gear assembly adapted to match the gear teeth, so as to drive the turntable to rotate through the rotation motor, and then perform fine rotation adjustment on the probe card on the horizontal plane.

[0013] Furthermore, an elastic fixing component is provided on one side of the installation table. The elastic fixing component includes two pressing blocks installed on the cylinder, and an elastic member is provided on each pressing block to press the substrate tightly on the vacuum adsorption platform from above the substrate when the substrate is placed on the vacuum adsorption platform, so as to maintain effective flatness.

[0014] Furthermore, a spare conductive probe is provided on one side of the vacuum adsorption platform of each resistance adjustment probe table. The spare conductive probe is connected to a flipping mechanism, and the spare conductive probe is adapted to be flipped through the flipping mechanism to connect with the common electrode on the substrate when the substrate to be resistance-adjusted placed on the vacuum adsorption platform needs to be externally connected to the common electrode.

[0015] Furthermore, a marking point mechanism is provided on the installation table, and the marking point mechanism is provided on the side of the probe card to make a marking point when the final resistance value of the heating point does not meet the preset target resistance value range.

[0016] Beneficial effects:

[0017] By the above method, the loaded shuttle can be transported to the measured shuttle storage system by the pick-and-place shuttle manipulator for storing the substrate with completed resistance adjustment, realizing the recycling of the to-be-tested shuttle and the measured shuttle, and reducing the shuttle supply pressure; by setting the B-group arm and the A-group arm on the substrate pick-and-place manipulator, the efficient conversion and supply make the beat coherent, making full use of the capacity of the resistance adjustment device, and improving the efficiency and production capacity; by setting the resistance adjustment probe table, it is possible to solve the quality defects of the existing thermal printer head, such as uneven printing ink dots due to poor uniformity in resistance preparation, and the technical problems of slow resistance adjustment, low stability, and poor reliability during resistance preparation. Description of the Drawings

[0018] Figure 1 is a schematic diagram of the overall structure of a device for preparing the resistance value of a thermistor of a thermal print head according to an embodiment of the present utility model;

[0019] Figure 2 is a schematic diagram of the structure of a substrate picking and placing manipulator of a device for preparing the resistance value of a thermistor of a thermal print head according to an embodiment of the present utility model;

[0020] Figure 3 is a schematic diagram of the connection structure of a to-be-tested shuttle storage system, a tested shuttle storage system, and a shuttle picking and placing manipulator of a device for preparing the resistance value of a thermistor of a thermal print head according to an embodiment of the present utility model;

[0021] Figure 4 is a schematic diagram of the structure of an impedance tuning probe station of a device for preparing the resistance value of a thermistor of a thermal print head according to an embodiment of the present utility model;

[0022] Figure 5 is a schematic diagram of the XY-axis displacement mechanism structure of an impedance tuning probe station of a device for preparing the resistance value of a thermistor of a thermal print head according to an embodiment of the present utility model;

[0023] Figure 6 is a schematic diagram of the impedance tuning mechanism part of an impedance tuning probe station of a device for preparing the resistance value of a thermistor of a thermal print head according to an embodiment of the present utility model;

[0024] Figure 7 is a schematic diagram of the structure of an impedance tuning probe station of a device for preparing the resistance value of a thermistor of a thermal print head after hiding the mounting table according to an embodiment of the present utility model;

[0025] Figure 8 is a schematic diagram of the mark point mechanism of an impedance tuning probe station of a device for preparing the resistance value of a thermistor of a thermal print head according to an embodiment of the present utility model;

[0026] Icons: Impedance tuning probe station 100, Vacuum adsorption platform 110, XY-axis displacement mechanism 120, Z-axis lifting mechanism 130, Lifting component 131, Guide rod 132, Fine tuning mechanism 140, Vision positioning system 150, Probe card 160, Needle washing device 170, Flipping mechanism 181, Spare conductive probe 182, Mounting table 191, Mark point mechanism 192, Turntable 193, Fixing mechanism 194, Locking rod 1941, Fine tuning rod 1942, Elastic fixing component 195, Rotation angle compensation mechanism 196, To-be-tested shuttle storage system 200, Upper plate position 210, Clamping mechanism 220, Tested shuttle storage system 300, Board storage position 310, Shuttle picking and placing manipulator 400, Substrate picking and placing manipulator 500, Group B arm 510, Group A arm 520, Conveyor track 600. Detailed Description of the Invention

[0027] Example 1

[0028] Combined Figures 1 to 8 As shown, this embodiment provides a device for preparing the resistance value of the thermistor of a thermal print head, including: an industrial control system and a to-be-tested bobbin storage system 200, a tested bobbin storage system 300, a bobbin picking and placing manipulator 400, a substrate picking and placing manipulator 500, and a resistance adjusting probe station 100 that are connected to the industrial control system; among them,

[0029] The to-be-tested bobbin storage system 200 is provided with an upper plate position 210. The to-be-tested bobbin storage system 200 is configured to be able to transfer the substrate storing the to-be-resistance-adjusted print head to the upper plate position 210 and cooperate with the substrate picking and placing manipulator 500 to take out the substrate and transport it into the resistance adjusting probe station 100; the tested bobbin storage system 300 is provided with a substrate storage position 310. The tested bobbin storage system 300 is configured to be able to transfer the substrate storing the thermally adjusted print head to the lower plate position; a bobbin picking and placing manipulator 400 is arranged between the upper plate position 210 and the substrate storage position 310. The bobbin picking and placing manipulator 400 is configured to be able to, after the substrate in the bobbin at the upper plate position 210 is taken out, transport the bobbin at the upper plate position 210 to the substrate storage position 310 for storing the substrate after resistance adjustment;

[0030] The identification recognition vision system (not shown) is adapted to, after the substrate picking and placing manipulator 500 takes out the substrate from the to-be-tested bobbin at the upper plate position 210, perform visual recognition on the identification of the taken-out substrate, and match the result of the visual recognition with the resistance adjusting probe station 100 where the picking and placing manipulator 500 is about to go, so as to associate the data of the substrate with the resistance adjusting probe station 100 through the industrial control system;

[0031] A plurality of the resistance adjusting probe tables 100 are arranged side by side. Each resistance adjusting probe table 100 includes a vacuum adsorption platform 110, an XY-axis displacement mechanism 120, a Z-axis lifting mechanism 130, a rotation angle compensation mechanism 196, a vision positioning system 150, a needle washing device 170, a probe card 160, a flipping electrode, and a resistance adjusting chassis. Among them, there are a plurality of resistance adjusting probes on the probe card 160. The vacuum adsorption platform 110 is arranged on the XY-axis displacement mechanism 120 and is used for adsorbing a thermal printing head substrate to be adjusted in resistance value. A large number of heating points are densely arranged on the thermal printing head substrate to be adjusted in resistance value at a preset interval in the XY direction. By moving the XY coordinates, the heating points to be measured form a one-to-one correspondence with the resistance adjusting probes of the probe card 160 to meet the requirements of positioning and alignment, and the heating points on the thermal printing head substrate are grouped and tested according to the number of probes on the probe card 160 until all the resistance adjustments are completed. The vision positioning system 150 is arranged above the vacuum adsorption platform 110 and is used for identifying all the heating points and the conductive lines of the heating points on the substrate to be measured, forming an XY coordinate system, and calculating the deviation angle of the heating points from this XY coordinate system to calculate the angle required to rotate the probe card 160, so that the resistance adjusting probes of the probe card 160 are aligned with the conductive lines of the heating points to be measured in the XY extension direction, ensuring that the resistance adjusting probes can be accurately docked with the heating points. The Z-axis lifting mechanism 130 is provided with a mounting table 191 suitable for mounting the probe card 160 and is suitable for driving the probe card 160 to lift above the substrate so that each resistance adjusting probe on the probe card 160 contacts the heating point electrode. The mounting table 191 is provided with a rotation angle compensation mechanism 196 for driving the probe card 160 to rotate a predetermined angle. The XY-axis displacement mechanism 120 is suitable for driving the substrate to move under the probe card 160 so that the heating point electrode contacts the resistance adjusting probes on the probe card 160, ensuring that each heating point is adjusted in resistance one by one. A needle washing device 170 is arranged on the XY-axis displacement mechanism 120. The needle washing device 170 is suitable for cleaning the tips of the probes on the probe card 160 to remove oxides, contaminants, or perform horizontal calibration on the probes after passivation. The probe card 160 is connected to the resistance adjusting chassis. The resistance adjusting chassis provides corresponding pulse voltages one by one according to the number of probes on the probe card to adjust the resistance value of the corresponding heating points.

[0032] The substrate picking and placing robot 500 is suitable for moving between the to-be-tested shuttle storage system 200, the tested shuttle storage system 300, and the resistance adjusting probe table 100. It includes a group B arm 510 and a group A arm 520 for simultaneously transporting the to-be-tested substrate and the tested substrate during the same movement stroke.

[0033] Combined with Figures 1 to 3As shown in the figure, in this embodiment, the to-be-tested shuttle storage system 200 and the tested shuttle storage system 300 are both provided with a conveying mechanism. The conveying mechanism is used to drive the shuttle to move, so as to carry the shuttle loaded with the to-be-tested substrate to the upper plate position 210 in the to-be-tested shuttle storage system 200, and convey the shuttle loaded with the tested substrate away from the storage plate position 310 in the tested shuttle storage system 300. A clamping mechanism 220 is provided at the bottom of the upper plate position 210 and the storage plate position 310. The clamping mechanism 220 includes a clamping block and a telescopic mechanism. The telescopic mechanism is adapted to drive the clamping block to clamp inside the shuttle. The clamping mechanism 220 further includes a lifting device for driving the clamping block to rise to clamp inside the shuttle when clamping. Positioning can be achieved through the clamping mechanism 220. The pick-and-place shuttle manipulator 400 is arranged above the upper plate position 210 and the storage plate position 310. It includes a clamping jaw, a lifting mechanism and a transverse movement mechanism. The clamping jaw is arranged on the lifting mechanism, and the lifting mechanism is arranged on the transverse movement mechanism, so that the shuttle can be carried from the upper plate position 210 to the storage plate position 310.

[0034] Combined with Figures 1 to 3 As shown in the figure, a conveying track 600 is provided between the to-be-tested shuttle storage system 200, the tested shuttle storage system 300 and the resistance adjustment probe table 100. The pick-and-place substrate manipulator 500 is arranged on the conveying track 600 and is adapted to move on the conveying track 600. The pick-and-place substrate manipulator 500 includes a group B arm 510 and a group A arm 520. The group B arm 510 and the group A arm 520 are arranged on a lifting assembly, and the lifting assembly is used to drive the group B arm 510 and the group A arm 520 to lift simultaneously; The group B arm 510 and the group A arm 520 are provided with an extending cylinder assembly for driving the rod for picking up the board to extend and retract, so as to pick up or place the board. When picking up and placing the board, the extending cylinder assembly and the lifting assembly work together, with efficient conversion and supply of one pick and one place, making the beat coherent, making full use of the capacity of the resistance adjustment device, and improving efficiency and production capacity; In this embodiment, one pick-and-place substrate manipulator 500 can meet the requirements of multiple resistance adjustment probe tables 100 for testing substrates. From taking out the to-be-tested substrate and storing the tested substrate, to loading and unloading the substrate at the resistance adjustment probe table 100, one cycle can be achieved, meeting the one-to-many capacity and optimizing the preparation process.

[0035] In this embodiment, after the pick-and-place substrate manipulator 500 takes out the substrate from the shuttle to be tested, the identification recognition vision system can perform visual recognition on the identification on this substrate. Such identification can be inkjet printing, laser marking, Mark mark, printed pattern, etc., and the identification content can be simple numbers, barcodes, two-dimensional codes, and patterns, etc. The result of the visual recognition is matched with the trimming probe station 100 that the pick-and-place substrate manipulator 500 is about to go to, so as to associate data. The identification recognition vision system can be a vision device or a scanning device. For example, the identification recognition vision system includes an OCR recognition device arranged in the direction of the transfer track and connected to the industrial control system. The OCR recognition device is used to read the identification code on the substrate and distribute the identification code to the corresponding trimming probe station 100 through the industrial control computer system. Through the identification recognition vision system, the data of the substrate and the trimming probe station 100 can be associated through the industrial control system, so that the industrial control system can obtain in real time the data of the substrate currently being processed and the substrate that has been processed by each trimming probe station 100.

[0036] In this embodiment, a large number of heating points are densely arranged on the thermal printing head substrate to be trimmed at a preset interval in the XY direction. By moving the XY coordinates, the heating points to be tested are made to correspond one by one with the trimming probes of the probe card 160 to meet the requirements of positioning and alignment. And the heating points on the thermal printing head substrate are grouped and tested according to the number of probes of the probe card 160 until all trimming is completed. The visual positioning system 150 can be used to identify all the heating points and the conductive circuits of the heating points on the substrate to be tested, so as to form an XY coordinate system, and the deviation angle of the heating points is calculated from this XY coordinate system. The coordinate data of the heating points obtained by the visual positioning system 150 is used through the industrial control system to control the XY-axis displacement mechanism 120 and the rotation angle compensation mechanism 196 to adjust the position, so that the heating points are accurately docked with the trimming probes.

[0037] In this embodiment, three trimming probe stations 100 can be provided and arranged side by side, and trimming can be performed simultaneously. Combined with Figures 4 to 5 As shown, in this embodiment, the XY-axis displacement mechanism 120 and the Z-axis lifting mechanism 130 are arranged on the base, the vacuum adsorption platform 110 is detachably arranged on the XY-axis displacement mechanism 120, and clamping devices are also arranged on the four peripheral sides of the vacuum adsorption platform 110. On the one hand, it can be used to correct the position of the substrate placed on the vacuum adsorption platform 110, and on the other hand, it is also used for auxiliary clamping to prevent deviation during the displacement of the machine table or during trimming.

[0038] The needle washing device 170 is arranged on the XY-axis displacement mechanism 120. When needle washing is required, it moves to the lower part of the probe card 160 and grinds the probes on the probe card 160 on the needle washing device 170 by moving. In one embodiment, the needle washing device 170 can be sandpaper for grinding the ends of the probes. Preferably, a blowing device is arranged on one side of the sandpaper to blow air while washing the needles to prevent debris of the probes from adhering to the ends of the probes and affecting the subsequent test and resistance adjustment effects. In addition, after the resistance adjustment probes are passivated, the overall correction can be carried out through the needle washing device 170 to improve the accuracy of resistance adjustment.

[0039] Combined with Figures 4 to 8 As shown, the Z-axis lifting mechanism 130 includes a lifting component 131 arranged on the base and two guide rods 132 parallel to the lifting direction of the lifting component 131. The mounting table 191 is connected to the guide rods 132 through sliders. The fine adjustment mechanism 140 is fixed on the slider and one end of it is in contact connection with the top end of the lifting component 131, so as to act on the fine adjustment mechanism 140 through the lifting component 131, and then drive the mounting table 191 to move up and down. Here, the fine adjustment mechanism 140 can be adjusted by a micrometer component controlled by a gear set with higher precision in cooperation with a motor. The lifting component 131 includes a linear motor. The linear motor is arranged on one side of the two guide rods 132 and is used to drive the slider to rise. When the extending shaft of the linear motor contracts, the slider and the mounting table 191 descend under the action of their own gravity. The end of the micrometer component on the fine adjustment mechanism 140 is in contact with the end of the extending shaft of the linear motor and is used to support the slider. Thus, when adjusting the micrometer component, the mounting table 191 and the probe card 160 on the mounting table 191 can be finely adjusted up and down. This is because the precision of the linear motor or other lifting mechanisms is difficult to meet the adjustment of tiny distances. When there is a tiny distance between the probes on the probe card 160 and the heating points on the substrate, large potential fluctuations will occur during resistance measurement, and the measured resistance value will also fluctuate, and the fluctuation is relatively large. The reasons for the fluctuation may be that the contact points between the probes and the heating points are small, or the tip of the probe descends a large height, resulting in the bending of the tip (the tip is flexible). At this time, if the linear motor is directly started for lifting, it may cause the probes to completely separate from the substrate, or the amount of downward movement of the probes is too large, resulting in probe damage. Therefore, by setting the fine adjustment mechanism 140 for adjustment, the precision can reach 1um, which can effectively prevent the occurrence of the above situations.

[0040] Combined with Figures 4 to 8As shown, the visual positioning system 150 includes a lifting device and a visual lens disposed on the lifting device. The visual lens is adapted to photograph and identify the positions of the heating point electrodes on the substrate, and can move to the probe position under the drive of the lifting device to obtain the image information of the probe, and transmit the image information to the industrial control system. The visual lens is provided with a fine adjustment component for adjusting the position and height of the visual lens. After being used for a period of time and after the rotation angle compensation mechanism 196 is adjusted, when the industrial control system can still detect that the measured resistance value or potential fluctuation of some of the heating points exceeds the preset range, it may be that the probe card 160 has not moved in place. At this time, the visual lens can be driven to descend to the probe position for photographing and identification. According to the probe image information obtained by the visual lens, when it is found that the probe is not in full contact with the heating point of the substrate, the probe card 160 can be driven to descend a certain scale distance through the fine adjustment mechanism 140 until the resistance value or potential fluctuation detected by the industrial control system becomes smaller, or the fluctuation range is within the preset range; if the visual lens identifies that the tip of the probe is bent, it means that the probe card 160 has descended a large height. At this time, the probe card 160 can be controlled to rise a certain scale distance through the fine adjustment mechanism 140 until the resistance value or potential fluctuation detected by the industrial control system becomes smaller, or the fluctuation range is within the preset range; if the resistance value or potential fluctuation detected by the industrial control system cannot be made smaller through the fine adjustment mechanism 140, or the fluctuation range cannot be made within the preset range, it means that there is a problem of uneven lengths of the probes on the probe card 160. At this time, the needle washing device 170 is driven under the probe card 160 for grinding and cleaning to ensure that the tip heights of each probe are consistent, so as to improve the uniformity of the resistance value during resistance adjustment.

[0041] Combined with Figures 4 to 8As shown, a turntable 193 for mounting the probe card 160 is rotatably provided on the mounting table 191. The turntable 193 is provided with gear teeth. The rotation angle compensation mechanism 196 includes a rotation motor provided on the mounting table 191. The output shaft of the rotation motor is connected with a gear assembly adapted to match the gear teeth, so as to drive the turntable 193 to rotate through the rotation motor, and then finely adjust the probe card 160 left and right. A probe card fixing mechanism 194 is provided on the turntable 193. The fixing mechanism 194 includes a plurality of locking rods 1941 and a fine adjustment rod 1942. The locking rods 1941 are adapted to be locked on opposite sides of the probe card 160, and the fine adjustment rod is adapted to press the rear end position of the probe card 160. The probe card 160 is kept horizontal by the plurality of locking rods 1941 and the fine adjustment rod 1942. In this embodiment, the probe card 160 is installed in the fixing mechanism 194, the locking rods 1941 are adjusted and locked, and then fine adjustment is performed through the fine adjustment rod 1942, so that the probe card 160 is kept horizontal in the fixing mechanism 194. An elastic fixing assembly 195 is provided on one side of the mounting table 191. The elastic fixing assembly 195 includes two pressing blocks installed on a cylinder. Each pressing block is provided with an elastic member to press the substrate tightly on the vacuum adsorption platform 110 from above the substrate when the substrate is placed on the vacuum adsorption platform 110. A marking point mechanism 192 is provided on the mounting table 191. The marking point mechanism 192 is provided on the side of the probe card 160 to make a dot mark when the resistance value of the heat generating point at the corresponding position of the substrate is detected to be abnormal.

[0042] In this solution, by providing the rotation angle compensation mechanism 196, it can cooperate with the fine adjustment mechanism 140. When the difference between the actually measured resistance value and the set target resistance value exceeds the preset target value or the measured resistance value reading is abnormal, the probe card 160 is lifted by the lifting mechanism, and then the rotation angle compensation mechanism 196 is used to control the probe card 160 to move left and right respectively for fine adjustment. The fine adjustment range is about 1 - 10 um at intervals. The left and right fine adjustment needle insertion is repeated. If the resistance value reading is normal and the difference between the actually measured resistance value and the set target resistance value is within the allowable range of the preset target value, then resistance adjustment can be performed. If the normal reading still cannot be obtained after repeated fine adjustment for many times or the difference between the actually measured resistance value and the set target resistance value still exceeds the preset target value, it is determined that there are relatively large problems with the heat generating points in this area, and a dot mark is made through the marking point mechanism 192, and no resistance adjustment action is performed. Here, the rotation angle compensation mechanism 196 can adjust the problem that the probe is not accurately aligned with the heat generating point caused by the position error between the probe and the heat generating point, and the left and right fine adjustment is repeated to make the probe accurately aligned with the heat generating point. During the test process, the resistance adjustment chassis collects the resistance value in real time.

[0043] Combined with Figure 4 and Figure 5As shown, in another embodiment, a spare conductive probe 182 is provided on one side of the vacuum adsorption platform 110. The spare conductive probe 182 is connected to a flipping mechanism 181. The spare conductive probe 182 is adapted to be flipped by the flipping mechanism 181 when the substrate to be adjusted for resistance placed on the vacuum adsorption platform 110 has no common electrode or the common electrode fails, so that the spare conductive probe 182 is connected to the electrode on the substrate. By providing the spare conductive probe 182, this mechanism can be adapted to test different types of substrates, especially substrates with and without common electrodes. Here, when adjusting the resistance of a substrate with a common electrode, the common electrode on the substrate is electrically connected to the resistance adjustment chassis, and the probe serves as another electrode to form a circuit with the common electrode, so that the resistance of the heating point can be measured. Then, a pulsed voltage is output by the resistance adjustment chassis for resistance adjustment. When adjusting the resistance, each heating point is independently adjusted from one end to the other end. For the heating points with the resistance value meeting the requirements, no adjustment is needed. For those with a relatively large resistance value, pulsed voltage is required for resistance adjustment. The method of adjusting the resistance by pulsed voltage is a prior art and will not be elaborated here. When the substrate has no common electrode, the flipping mechanism 181 flips the spare conductive probe 182 to a position close to the substrate, so that the substrate is connected to the spare conductive probe 182, and the spare conductive probe 182 acts as one of the electrodes of the substrate.

[0044] By providing the fine adjustment mechanism 140 and the rotation angle compensation mechanism 196, the position of the probe card 160 can be finely adjusted in cooperation with the industrial control system before resistance adjustment, thus effectively solving the problem of poor reliability of resistance adjustment. At the same time, in cooperation with the needle cleaning device 170, the uniformity of resistance adjustment can be improved, and the quality defect that the printed ink dots are of different shades due to poor uniformity in the resistance preparation of the existing thermal print heads can be solved.

[0045] Embodiment 2

[0046] The present invention also provides a method for adjusting the resistance of a device for preparing the resistance value of a thermal resistor of a thermal print head, including the following steps:

[0047] S1. Load the substrate through a shuttle, and reserve a certain amount of shuttles on the to-be-tested shuttle storage system 200 for standby.

[0048] S2. The B-group arms of the substrate pick-and-place manipulator 500 pick up a substrate from the resistive trimming shuttle to be adjusted, and then the A-group arms deposit the resistively trimmed substrate into the shuttle at the board storage position. After that, the substrate pick-and-place manipulator 500 moves to the position of the identification recognition vision system, reads the identification code on the substrate to be measured, and is allocated to the corresponding resistive trimming station through the industrial control system, so that the identification number of each thermal printing head substrate on the substrate is associated with the resistive trimming data of the corresponding station. When all the substrates in the shuttle at the loading position are taken out, the shuttle at the board storage position is transferred to the next station, and then through the pick-and-place shuttle manipulator, the empty shuttle at the loading position is transported to the board storage position for storing the resistively trimmed substrates, thus realizing the recycling of the shuttles to be measured and the measured shuttles, and reducing the shuttle supply pressure.

[0049] S3. In the order of calling materials, the substrate pick-and-place manipulator moves to the resistive trimming probe station where the trimming is completed to use the B-group arms to take out the resistively trimmed substrate in the resistive trimming probe station, and then use the A-group arms to place the substrate to be measured into the resistive trimming probe station. If the corresponding resistive trimming station shows that there is no need to pick up the board, the board placement operation is directly carried out.

[0050] S4. The substrate pick-and-place manipulator returns to the initial position and executes the next cycle of the substrate pick-and-place process; the stations that have received the substrates start the resistive trimming operation. The resistive trimming operation includes the following steps:

[0051] S41. Positioning, the visual positioning system scans the heating points of the entire substrate comprehensively, and then performs high-precision positioning and rotation angle compensation to ensure that each probe can accurately contact the electrodes of the heating points for reading the resistance and energizing for resistive trimming. Specifically: after the substrate moves into place, the probe card moves down to measure the resistance at the heating point. The industrial control system judges the actual measured resistance value compared with the set upper and lower limit resistance values. When it exceeds the preset upper and lower limit resistance value range or the measured resistance value reading is abnormal, the probe card lifts up and the substrate moves left or right by a preset small displacement amount and then re-punches the needle to make the probe accurately contact the resistive trimming electrode of the heating point. If the resistance value read after the number of repeated needle punching exceeds the predetermined value still does not conform to the preset upper and lower limit resistance values, a dot marking is made at this place.

[0052] S42. Resistive trimming, the number of heating points trimmed each time depends on the number of probes on the probe card. Each probe corresponds to a conductive line, and the conductive line is connected to the heating point or the common electrode.

[0053] S421. Before resistive trimming, measure the standard resistance value of each probe of the probe card for calibration to ensure the accuracy of each resistance reading by the probe.

[0054] S422. When the actually measured resistance value is within the preset upper limit and lower limit values, adjust the resistance at each heating point. The resistance adjustment is achieved by connecting a probe to a resistance adjustment chassis to output a pulsed voltage to adjust the resistance of each heating point to be close to the preset target resistance value;

[0055] S423. Repeat the steps of S422 until the difference between the actually measured resistance value and the preset target resistance value is within the allowable difference range; in each cycle of step S422, when the difference between the actually measured resistance value and the preset target resistance value of the corresponding heating point meets the standard, it is judged as qualified, and the qualified heating points will not be powered on for resistance adjustment in the next cycle; for unqualified resistance values, after multiple cycles of powered-on resistance adjustment, the resistance value of the last resistance adjustment is used for judgment. Those that do not meet the target resistance value are judged as defective and marked with dots;

[0056] S43. Wash the needles. After repeating the above resistance adjustment process a predetermined number of times, clean the tips of the probes to remove oxides and smooth them so that the tips of the probes are on a horizontal plane to ensure the accuracy of the resistance measurement of the probes each time;

[0057] S44. Cross-testing. Within a preset time, directly transfer the substrate with the resistance adjustment completed on one of the resistance adjustment probe stations to one of the other two resistance adjustment probe stations for resistance measurement, and compare the measured resistance value with the resistance value measured during actual resistance adjustment to determine whether the resistance measurement result of the probe card at the actual resistance adjustment station meets the consistency requirements with the measurement results of other resistance adjustment probe stations, so as to judge whether the standard resistance inside the resistance adjustment probe station for measuring the resistance value during resistance adjustment is in a normal working state by means of cross-validation.

[0058] In this embodiment, within step S423, when multiple cycles of resistance adjustment are used to judge with the resistance value of the last resistance adjustment, this is the first judgment; if the first judgment is a defective product, the second resistance measurement and adjustment are performed by lifting the probe card to move left by a certain small displacement amount, this is the second judgment; if the second judgment is still unqualified, the probe card is lifted to return the unqualified heating point to the initial position, and then the third resistance measurement and adjustment are performed by moving right by a small displacement amount; any one of the three judgments being qualified is regarded as qualified. If the resistance value is still unqualified in the third judgment, it is marked with dots. Through this solution, the probability of mismeasurement can be reduced, and the waste of substrates caused by mismeasurement can be reduced.

[0059] In this embodiment, during the testing phase, when an abnormal resistance value is detected, fine-tuning can be first performed in the up, down, left, and right directions through the rotation angle compensation mechanism 196 and the fine-tuning mechanism 140 to prevent the problem of abnormal resistance value testing caused by position errors. When, after adjustment by the fine-tuning mechanism 140 and the rotation angle compensation mechanism 196, the resistance value of a certain heating point still shows abnormality or large fluctuations, the probe tips on the probe card 160 are ground flat by the needle washing device 170 to solve the problem that some heating points cannot be accurately detected due to different probe heights.

[0060] During the resistance adjustment phase, the resistance is adjusted by multiple cycles of needle insertion and resistance adjustment, and the resistance value of the last resistance adjustment is used to determine whether it meets the target resistance value. If it does not meet the requirement, a dot is marked.

[0061] It should be noted that in this embodiment, each of the substrates includes multiple thermal print heads, and each thermal print head is provided with multiple heating points. The probe card 160 acts on one of the thermal print heads each time for resistance adjustment. When a non-conforming thermal print head is detected, a dot is marked, and then the other thermal print heads are tested for resistance adjustment. After a certain number of times of testing and resistance adjustment, the probe tips are cleaned to remove oxides and ground flat so that the probe tips are on a horizontal plane.

[0062] Through the solution of this embodiment, better resistance value uniformity can be achieved, ensuring the ink dot color saturation of the printing effect and the refinement of printing characters, and enabling high-speed resistance adjustment, continuous rhythm, and high utilization rate.

[0063] It should be understood that the above is only the preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions falling within the concept of the present invention belong to the protection scope of the present invention.

[0064] The above introduction to the drawings used in the embodiments only shows some embodiments of the present invention and should not be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

Claims

1. A device for preparing the resistance value of a thermistor of a thermal print head, characterized in that Including: An industrial control system and a to-be-tested shuttle storage system, a tested shuttle storage system, a pick-and-place shuttle manipulator, a pick-and-place substrate manipulator, a trimming probe station, and an identification recognition vision system connected to the industrial control system; wherein, the to-be-tested shuttle storage system is provided with an upper plate position, and the to-be-tested shuttle storage system is configured to be able to convey a substrate storing a to-be-trimmed print head to the upper plate position and cooperate with the pick-and-place substrate manipulator to take out and transport the substrate into the trimming probe station; the tested shuttle storage system is provided with a board storage position, and the tested shuttle storage system is configured to be able to convey a substrate storing a trimmed print head to the unloading position; a pick-and-place shuttle manipulator is arranged between the upper plate position and the board storage position, and the pick-and-place shuttle manipulator is configured to be able to, after the substrate in the shuttle at the upper plate position is taken out, transport the shuttle at the upper plate position to the board storage position for storing the trimmed substrate. The identification recognition vision system is adapted to, after the pick-and-place substrate manipulator takes out a substrate from the to-be-tested shuttle at the upper plate position, perform visual recognition on the identification of the taken-out substrate, match the result of the visual recognition with the trimming probe station where the pick-and-place manipulator is about to go, so as to associate the data of the substrate with the trimming probe station through the industrial control system. A plurality of resistance adjustment probe tables are arranged side by side. Each resistance adjustment probe table includes a vacuum adsorption platform, an XY-axis displacement mechanism, a Z-axis lifting mechanism, a rotation angle compensation mechanism, a vision positioning system, a needle cleaning device, a probe card, and a resistance adjustment chassis. Among them, there are a plurality of resistance adjustment probes on the probe card. The vacuum adsorption platform is arranged on the XY-axis displacement mechanism, and a positioning mechanism is arranged on the vacuum adsorption platform to position and clamp the thermal printing head substrate. On the thermal printing head substrate to be resistance-adjusted, a large number of heating points are densely arranged at a preset interval in the XY direction. By moving the XY coordinates, the heating points to be measured are made to correspond one by one with the resistance adjustment probes of the probe card to meet the requirements of positioning and alignment. And according to the number of probes on the probe card, the heating points on the thermal printing head substrate are grouped for testing until all resistance adjustments are completed. The vision positioning system is arranged above the vacuum adsorption platform to identify and position all the heating points and the conductive lines of the heating points on the substrate to be measured, so as to form an XY coordinate system, and the deviation angle of the heating points is calculated from this XY coordinate system to calculate the angle required to rotate the probe card, so that the resistance adjustment probes of the probe card are kept consistent with the conductive lines of the heating points to be measured in the XY extension direction. The Z-axis lifting mechanism is provided with a mounting table suitable for mounting the probe card, and is suitable for driving the probe card to lift above the substrate so that each resistance adjustment probe on the probe card contacts the heating point electrode. A rotation angle compensation mechanism is arranged on the mounting table to drive the probe card to rotate the calculated deviation angle of the heating point in the XY direction. The XY-axis displacement mechanism is suitable for driving the substrate to move under the probe card so that the heating point electrode is aligned with the resistance adjustment probe on the probe card to ensure that each heating point completes the resistance adjustment one by one. A needle cleaning device is arranged on the XY-axis displacement mechanism, and the needle cleaning device is suitable for cleaning the needle tips of the probes on the probe card to remove oxides, pollutants, and perform horizontal calibration after passivation. The probe card is connected to the resistance adjustment chassis, and the resistance adjustment chassis provides corresponding pulse voltages one by one according to the number of probes on the probe card to adjust the resistance value of the corresponding heating point. The substrate picking and placing manipulator is suitable for moving between the to-be-tested shuttle storage system, the tested shuttle storage system, and the resistance adjustment probe table, and includes a group B arm and a group A arm for carrying the to-be-tested substrate and the tested substrate simultaneously during the same movement stroke.

2. The apparatus for preparing the resistance value of the thermistor of the thermal print head according to claim 1, wherein Clamping mechanisms are arranged at the bottoms of the upper board position and the board storage position. The clamping mechanisms include clamping blocks and telescopic mechanisms, and the telescopic mechanisms are suitable for driving the clamping blocks to clamp inside the shuttles.

3. The thermistor resistance value preparation device for a thermal printing head according to claim 1, wherein It further includes a transfer track. The transfer track is arranged between the to-be-tested shuttle storage system, the tested shuttle storage system, and the resistance adjustment probe table. The substrate picking and placing manipulator is arranged on the transfer track and is suitable for moving on the transfer track.

4. The apparatus for preparing the resistance value of the thermistor of the thermal print head according to claim 1, wherein, A fine-tuning mechanism is provided on the Z-axis lifting mechanism, and the fine-tuning mechanism is adapted to adjust the initial height of the probe card; the industrial control system is configured to, when testing and adjusting resistance, drive the needle washing device under the probe card to wash the needles according to the probe image information obtained by the vision lens and the potential change generated during the substrate test by the industrial control system when the height of the probe bottom end is different and the potential fluctuation during the test exceeds the preset range, so as to reduce the resistance error caused by poor contact between the probe and the conductive circuit, which helps to obtain a more valuable actual resistance value.

5. The apparatus for preparing the resistance value of the thermistor of the thermal print head according to claim 1, characterized in that, A turntable for installing the probe card is rotatably provided on the installation table, and gear teeth are provided on the turntable. The rotation angle compensation mechanism includes a rotation motor provided on the installation table, and an output shaft of the rotation motor is connected with a gear assembly adapted to match the gear teeth, so as to drive the turntable to rotate through the rotation motor, and then perform fine rotation adjustment on the probe card on the horizontal plane.

6. The device for preparing the resistance value of the thermistor of the thermal print head according to claim 1, characterized in that, An elastic fixing assembly is provided on one side of the installation table. The elastic fixing assembly includes two pressing blocks installed on the cylinder, and an elastic member is provided on each pressing block to press the substrate against the vacuum adsorption platform from above the substrate when the substrate is placed on the vacuum adsorption platform, so as to maintain effective flatness.

7. The apparatus for preparing the resistance value of the thermistor of the thermal print head according to claim 1, characterized in that, A spare conductive probe is provided on one side of the vacuum adsorption platform of each resistance adjustment probe table. The spare conductive probe is connected to a flipping mechanism, and the spare conductive probe is adapted to be flipped by the flipping mechanism to connect with the common electrode on the substrate when the substrate to be resistance-adjusted placed on the vacuum adsorption platform needs to be externally connected to the common electrode.

8. The apparatus for preparing the resistance value of the thermistor of the thermal print head according to claim 1, characterized in that, A marking point mechanism is provided on the installation table, and the marking point mechanism is provided on the side of the probe card to mark a marking point when the final resistance value of the heating point does not meet the preset target resistance value range.

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