Photocurable resin composition, optical component, method for manufacturing an optical component, light-emitting device, and method for manufacturing a light-emitting device

Abstract

To provide a photocurable resin composition which contains an ultraviolet absorber and hardly causes bleeding out in a cured product.SOLUTION: A photocurable resin composition includes a photopolymerizable compound (A), a photopolymerization initiator (B), an ultraviolet absorber (C), and a sensitizer (D). The sensitizer (D) contains an anthracene-based sensitizer (D1) having an anthracene skeleton and a group represented by "-O-R10" bonded to the anthracene skeleton. R10 is an organic group having no reactive group, and the number of atoms forming the longest linear chain attached to O in R10 is 2 to 10.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a photocurable resin composition, an optical component, a method for manufacturing an optical component, a light-emitting device, and a method for manufacturing a light-emitting device. Specifically, the present invention relates to a photocurable resin composition containing a photopolymerizable compound and a photoinitiator, an optical component produced from the photocurable resin composition, a method for manufacturing an optical component using the photocurable resin composition, a light-emitting device including the optical component, and a method for manufacturing a light-emitting device using the photocurable resin composition.

Background Art

[0002] In a light-emitting device including a light-emitting element such as an organic EL element as a light source, for example, an organic EL element is disposed on a support substrate, a transparent substrate is disposed so as to face the support substrate, and a transparent sealing material is filled between the support substrate and the transparent substrate. The sealing material is produced, for example, by an inkjet method.

[0003] For example, Patent Document 1 discloses a sealing agent for an organic EL display element containing a polymerizable compound, wherein the polymerizable compound contains 30 parts by weight or more of a polymerizable compound having a surface tension of 35 mN / m or more at 25°C in 100 parts by weight of the polymerizable compound, the viscosity of the entire sealing agent for an organic EL display element at 25°C is 5 mPa·s or more and 50 mPa·s or less, and the surface tension of the entire sealing agent for an organic EL display element at 25°C is 35 mN / m or less.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] According to the inventor's investigation, when the light-emitting device is used outdoors, the deterioration of the light source such as the light-emitting element tends to progress more easily than when it is used indoors.

[0006] Therefore, in order to suppress the deterioration of the light source, the inventor conducted independent research and tried to prevent ultraviolet rays from reaching the light source through the optical components by incorporating an ultraviolet absorber into the optical components in the light-emitting device.

[0007] However, the inventor found that when using an ultraviolet absorber, it becomes difficult to cure the photocurable material because the ultraviolet absorber absorbs light when trying to fabricate the optical component from the photocurable material. The inventor also considered using a sensitizer to enhance the curability, but a problem also occurred in that the sensitizer bled out from the optical component.

[0008] An object of the present invention is to provide a photocurable resin composition containing an ultraviolet absorber and having little tendency for bleed-out in the cured product, an optical component made from the photocurable resin composition, a method for manufacturing an optical component using the photocurable resin composition, a light-emitting device including the optical component, and a method for manufacturing a light-emitting device using the photocurable resin composition.

Means for Solving the Problems

[0009] The photocurable resin composition according to one aspect of the present invention contains a photopolymerizable compound (A), a photoinitiator (B), an ultraviolet absorber (C), and a sensitizer (D), and the sensitizer (D) contains an anthracene-based sensitizer (D1) having an anthracene skeleton and a group represented by "-O-R 10 " bonded to the anthracene skeleton. R 10 is an organic group having no reactive group, and the number of atoms constituting the longest linear chain bonded to O in R 10 is 2 to 10.

[0010] The optical component according to one aspect of the present invention includes a cured product of the photocurable resin composition.

[0011] A method for manufacturing an optical component according to one aspect of the present invention includes molding the photocurable resin composition by an inkjet method and then irradiating the photocurable resin composition with light to cure it.

[0012] A light-emitting device according to one aspect of the present invention includes a light source and an optical component that transmits light emitted from the light source, and the optical component includes a cured product of the photocurable resin composition.

[0013] A method for manufacturing a light-emitting device according to one aspect of the present invention is a method for manufacturing a light-emitting device including a light source and an optical component that transmits light emitted from the light source, and includes manufacturing the optical component by the method for manufacturing the optical component.

Advantages of the Invention

[0014] According to one aspect of the present invention, it is possible to provide a photocurable resin composition containing an ultraviolet absorber and having little bleed-out in the cured product, an optical component produced from the photocurable resin composition, a method for manufacturing an optical component using the photocurable resin composition, a light-emitting device including the optical component, and a method for manufacturing a light-emitting device using the photocurable resin composition.

Brief Description of the Drawings

[0015]

Figure 1

Embodiments for Carrying Out the Invention

[0016] Hereinafter, one embodiment of the present invention will be described.

[0017] The photocurable resin composition (hereinafter, also referred to as composition (X)) according to the present embodiment contains a photopolymerizable compound (A), a photopolymerization initiator (B), an ultraviolet absorber (C), and a sensitizer (D). The sensitizer (D) contains an anthracene-based sensitizer (D1) having an anthracene skeleton and a group represented by "-O-R 10 " bonded to the anthracene skeleton. R 10is an organic group having no reactive group, and R 10 In, the number of atoms constituting the longest straight-chain connected to O is 2 to 10.

[0018] According to this embodiment, a cured product can be produced by irradiating the composition (X) with light. Although the composition (X) contains an ultraviolet absorber (C), since it further contains a sensitizer (D), good reactivity when the composition (X) is irradiated with light is likely to be maintained. Further, since the ultraviolet absorber (C) absorbs ultraviolet rays, the cured product is less likely to transmit ultraviolet rays. Furthermore, the anthracene-based sensitizer (D1) is less likely to bleed out from the cured product. This is presumably because the anthracene-based sensitizer (D1) can have good affinity for the photopolymerizable compound (A) by having a group represented by "-O-R 10 ".

[0019] Therefore, in this embodiment, a photocurable resin composition that contains the ultraviolet absorber (C) and is less likely to have reduced curability and less likely to cause bleeding out in the cured product can be obtained.

[0020] Further, when the composition (X) is used to produce an optical component in a light-emitting device, the optical component becomes less likely to transmit ultraviolet rays, and thus a light source such as a light-emitting element in the light-emitting device is less likely to be deteriorated by ultraviolet rays. As a result, even when the light-emitting device is used outdoors, the deterioration of the light source is less likely to progress.

[0021] In this embodiment, it is preferable that the transmittance of light with a wavelength of 400 nm of a cured product having a thickness of 10 μm obtained by curing the composition (X) is 30% or less. In this case, the cured product becomes particularly less likely to transmit ultraviolet rays. It is more preferable that this transmittance is 20% or less, and even more preferable that it is 10% or less. The lower this transmittance, the more preferable it is, and ideally it is 0%. This low transmittance can be achieved by the selection of the ultraviolet absorber (C) and the sensitizer (D).

[0022] In this embodiment, it is preferable that the transmittance of the cured product with a thickness of 10 μm obtained by curing the composition (X) for light with a wavelength of 430 nm is 70% or more. In this case, the cured product is less likely to inhibit the transmission of visible light. Therefore, when the composition (X) is used to produce an optical component in a light-emitting device, the light-emitting performance of the light-emitting device is less likely to be impaired by the optical component. This transmittance is preferably 80% or more, and more preferably 90% or more. This transmittance can be achieved by the selection of the ultraviolet absorber (C) and the photosensitizer (D).

[0023] In this embodiment, it is preferable that the composition (X) can be cured when irradiated with light having a peak wavelength of 395 nm. In particular, in this embodiment, a coating film with a thickness of 10 μm is produced from the composition (X), and light with a peak wavelength of 395 nm is irradiated onto the coating film at an irradiation intensity of 3 W / cm 2 and an integrated light quantity of 0.9 J / cm 2 When irradiated under the conditions, the reaction rate of the photopolymerizable compound (A) in the composition (X) is preferably 80% or more. In this case, although the composition (X) contains the ultraviolet absorber (C), the composition (X) can be cured by utilizing ultraviolet light near a wavelength of 395 nm. Such characteristics can be achieved by the selection of the photosensitizer (D). This reaction rate is more preferably 90% or more.

[0024] These characteristics of the composition (X) and the cured product can be achieved by the composition of the composition (X) detailed below.

[0025] An optical component can be manufactured from the composition (X), and a light-emitting device including the optical component can also be manufactured. Note that the use of the composition (X) is not limited to only the manufacture of optical components, and it can be applied to various uses that utilize the characteristics of the composition (X).

[0026] The composition (X) is preferably formed by an inkjet method. In this case, it is easy to produce a cured product of the composition (X) and an optical component with high positional accuracy. Further, when the composition (X) is formed by an inkjet method as compared with the case of forming by a printing method involving contact such as a screen printing method, foreign matters are less likely to be mixed into the composition (X) and its cured product, and thus the yield in producing an optical component is less likely to deteriorate.

[0027] In the present embodiment, it is preferable that the viscosity of the composition (X) at 25°C is 30 mPa·s or less. In this case, the composition (X) is easy to form, and particularly easy to form by an inkjet method. It is more preferable that this viscosity is 25 mPa·s or less, still more preferable that it is 20 mPa·s or less, and particularly preferable that it is 15 mPa·s or less. It is also preferable that this viscosity is 1 mPa·s or more, and more preferable that it is 5 mPa·s or more.

[0028] It is also preferable that the viscosity of the composition (X) at 40°C is 30 mPa·s or less. In this case, regardless of the value of the viscosity of the composition (X) at normal temperature, the composition (X) can be made to have a lower viscosity by slightly heating it. For this reason, by heating, the composition (X) can be easily formed, and particularly easily formed by an inkjet method. Further, since the composition (X) can be made to have a lower viscosity without heating it greatly, it is possible to less likely cause a change in the composition of the composition (X) due to the volatilization of the components in the composition (X). It is more preferable that this viscosity is 25 mPa·s or less, still more preferable that it is 20 mPa·s or less, and particularly preferable that it is 15 mPa·s or less. It is also preferable that this viscosity is 1 mPa·s or more, and more preferable that it is 5 mPa·s or more.

[0029] Such a low viscosity of the composition (X) at 25°C or 40°C can be realized by the composition of the composition (X) described in detail below. The methods and conditions for measuring the viscosity in each of the cases of 25°C and 40°C of the composition (X) will be described in detail in the column of Examples shown later.

[0030] It is preferable that the outgas ratio generated when the cured product of the composition (X) is heated at 100 °C for 30 minutes is 300 ppm or less. In this case, it is difficult for outgas to be generated from the cured product. Therefore, for example, it is possible to make it difficult to generate voids caused by outgas in a light-emitting device including an optical component made of the cured product. Therefore, it is possible to make it difficult for water and oxygen to reach the light-emitting element through the voids, and it is possible to make the light-emitting element less likely to deteriorate due to water and oxygen. If the outgas ratio is 100 ppm or less, it is more preferable. The method for measuring the outgas ratio will be described in detail in the examples described later.

[0031] The composition (X) preferably does not contain a solvent or has a solvent content of 1 mass% or less. In this case, it is difficult for outgas derived from the solvent to be generated from the composition (X) and the cured product of the composition (X). Also, a drying step for removing the solvent from the composition (X) and the cured product can be made unnecessary during the manufacture of the optical component and the light-emitting device. There may be a drying step for removing the solvent from at least one of the composition (X) and the cured product, but in this case, at least one of reducing the heating temperature and shortening the heating time in the drying step can be achieved. Therefore, it is possible to make it difficult for outgas to be generated from the optical component without reducing the manufacturing efficiency of the optical component and the light-emitting device. Furthermore, when the composition (X) is particularly molded by an inkjet method, a decrease in thickness due to volatilization of the solvent from the molded composition (X) is less likely to occur, and therefore a decrease in the thickness of the optical component is less likely to occur. Therefore, while molding by the inkjet method, the thickness of the optical component can be ensured to be as large as possible. If the solvent content is 0.5 mass% or less, it is more preferable, if it is 0.3 mass% or less, it is further preferable, and if it is 0.1 mass% or less, it is particularly preferable. It is particularly preferable that the composition (X) does not contain a solvent or contains only an unavoidably mixed solvent.

[0032] The glass transition temperature of the cured product of the composition (X) is preferably 75°C or higher. That is, the composition (X) preferably has the property of becoming a cured product with a glass transition temperature of 75°C or higher upon curing. In this case, the cured product can have good heat resistance. Therefore, for example, when the cured product is subjected to a treatment accompanied by a temperature rise, the cured product is less likely to deteriorate. For this reason, for example, when a layer of an inorganic material (for example, the passivation layer 6) overlapping an optical component is formed by a vapor deposition method such as plasma CVD, even if the optical component is heated, the optical component is less likely to deteriorate. Further, by enhancing the heat resistance, the optical component can also be adapted to in-vehicle applications where strict requirements are imposed on heat resistance. The glass transition temperature of the cured product is more preferably 80°C or higher, still more preferably 90°C or higher, and particularly preferably 100°C or higher. The glass transition temperature of this cured product can be realized by the composition of the composition (X) described in detail below.

[0033] When 20 mg of the composition (X) is heated under the conditions of 100°C for 30 minutes using a thermogravimetric analyzer, the volatility is preferably 40% or less. The volatility of the composition (X) is defined as the percentage of the weight reduction amount (the difference between the weight before treatment and the weight after treatment of the composition (X)) of the composition (X) after treatment with respect to the weight of the composition (X) before treatment. In this case, by the low volatility of the composition (X), the storage stability of the composition (X) can be enhanced. Further, outgassing is less likely to occur from the cured product of the composition (X) and the optical component. Therefore, voids caused by outgassing are less likely to occur further in the light-emitting device. The volatility of the composition (X) can be determined by heating 20 mg of the composition (X) under the conditions of 100°C for 30 minutes using a thermogravimetric analyzer and calculating the weight reduction amount of the weight after treatment with respect to the weight before treatment. When 20 mg of the composition (X) is heated under the conditions of 100°C for 30 minutes using a thermogravimetric analyzer, the volatility is more preferably 30% or less, and still more preferably 20% or less. The lower limit of the volatility of the composition (X) is not particularly limited, but may be, for example, 0.1% or more.

[0034] The components contained in the composition (X) will be described in more detail.

[0035] The sensitizer (D) will be described. Since the composition (X) contains the sensitizer (D), as described above, even though the composition (X) contains the ultraviolet absorber (C), good reactivity when the composition (X) is irradiated with light is likely to be maintained.

[0036] The sensitizer (D) contains an anthracene-based sensitizer (D1). Therefore, even when the composition (X) is irradiated with light near a wavelength of 395 nm, good reactivity is likely to be maintained. Further, since the anthracene-based sensitizer (D1) has a group represented by "-O-R 10 ", bleeding out of the sensitizer (D) from the cured product is less likely to occur.

[0037] R 10 is, as described above, an organic group having no reactive group. R 10 is, for example, a saturated hydrocarbon group which may contain a non-reactive group. The non-reactive group is, for example, at least one selected from the group consisting of a carbonyl group, an ether bond, an ester bond, and the like. The number of atoms constituting the longest straight-chain chain bonded to O in R 10 is preferably 2 to 10.

[0038] R 10 The number of atoms constituting the longest straight-chain chain bonded to O in is more preferably 4 or more, and even more preferably 5 or more. In this case, bleeding out of the sensitizer (D) is even less likely to occur. Also, the number of these atoms is preferably 8 or less, and even more preferably 6 or less. In this case, good reactivity of the composition (X) is particularly likely to be maintained.

[0039] The anthracene-based sensitizer (D1) contains, for example, a compound having a structure represented by the following formula (70).

[0040]

Chemical formula

[0041] In the above formula (70), at least one of the plurality of Rs is a group represented by "-O-R 10 ". It is preferable that each of two or more of the plurality of Rs is a group represented by "-O-R 10 ".

[0042] Among the plurality of Rs other than the alkyloxy group having 2 to 10 carbon atoms, each is independently an organic group having a reactive functional group or a group other than an organic group having a reactive functional group (non-reactive group).

[0043] When the plurality of Rs contain an organic group having a reactive functional group, and the photopolymerizable compound (A) contains a radical polymerizable compound and the reactive functional group is a radical polymerizable functional group, the organic group having a reactive functional group is, for example, the organic group shown in the above formula (72), the organic group shown in formula (73) or the organic group shown in formula (74). In the above formula (72), R 2 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and R 3 is a single bond, an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms. In the above formula (73), R 4 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 5 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms, X 1 is O, S, NH or NR 6 and R 6 is an alkyl group having 1 to 5 carbon atoms. In the above formula (74), R 7 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 8 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms, R 9 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms, X 2 is O, S, NH or NR 13 and R 13 is an alkyl group having 1 to 5 carbon atoms, and m is a number from 1 to 6.

[0044] When the photopolymerizable compound (A) contains a cationic polymerizable compound and the reactive functional group is a cationic polymerizable functional group, the cationic polymerizable functional group is, for example, at least one group selected from the group consisting of a cyclic ether group and a vinyl ether group. The cyclic ether group is, for example, at least one of an epoxy group and an oxetane group. The organic group having a reactive functional group is, for example, a vinyl ether group.

[0045] The non-reactive group is, for example, a hydrogen atom, a halogen atom, an amino group, a cyano group, a nitro group, or an organic group having no reactive functional group. The organic group having no reactive functional group is, for example, an alkyl group having 1 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms and having a hydroxyl group, an aryl group having 6 to 10 carbon atoms, or the group represented by the above formula (71). In the above formula (71), R 11 is an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 20 carbon atoms, or an alkyleneoxy group having 1 to 10 carbon atoms, and R 12 is an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an alkyloxy group having 1 to 10 carbon atoms. Each of the non-reactive groups is preferably particularly a hydrogen atom, an OH group, a methyl group, or an ethyl group. In this case, the sensitizing action of the anthracene-based photosensitizer is more likely to be exhibited, so that the good reactivity of the composition (X) is more likely to be maintained, and the necessity of using a large amount of the photosensitizer is reduced.

[0046] The anthracene-based photosensitizer (D1) preferably has no reactive functional group. That is, the anthracene-based photosensitizer (D1) is preferably a non-reactive anthracene-based photosensitizer. In this case, even when the addition amount of the photosensitizer (D) is small, the sensitizing action of the photosensitizer (D) is likely to be exhibited, so that the sealing performance by the composition (X) is likely to be high, and the increase in the viscosity of the composition (X) due to the photosensitizer (D) is less likely to occur, so that the composition (X) is more easily ejected by the inkjet method. Further, when the composition (X) is irradiated with light, a high sensitizing action is easily obtained by the anthracene-based photosensitizer (D1). This is presumably because the anthracene-based photosensitizer (D1) can efficiently promote the reaction of the reactive functional group in a molecule other than itself because it has no reactive functional group.

[0047] When the anthracene-based sensitizer (D1) is a non-reactive anthracene-based sensitizer, the anthracene-based sensitizer (D1) is represented by, for example, the above formula (70), where each of the plurality of Rs in the formula is a non-reactive group, and the plurality of Rs contain at least one group represented by "-O-R 10 ".

[0048] The anthracene-based sensitizer (D1) preferably contains a compound represented by the following formula (701). In formula (701), "-O-R 10 " is as described above. In this case, the sensitizing action by the sensitizer (D) is more likely to be exhibited, and thus the good reactivity of the composition (X) is more likely to be maintained. Also, the affinity between the sensitizer (D) and the photopolymerizable compound (A) is likely to be high. Therefore, even if the sensitizer (D) does not have a reactive functional group, it is less likely for the sensitizer (D) to bleed out from the cured product.

[0049]

Chemical formula

[0050] The compound represented by formula (701) contains at least one selected from the group consisting of, for example, the compound represented by the following formula (702), the compound represented by the following formula (703), the compound represented by the following formula (704), and the compound represented by the following formula (705).

[0051]

Chemical formula

[0052]

Chemical formula

[0053]

Chemical formula

[0054] [Chemical]

[0055] The sensitizer (D) may contain a compound other than the anthracene-based sensitizer (D1). In that case, the sensitizer (D) is, for example, an anthracene-based photosensitizer having no group represented by "-O-R 10 ", thioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, anthraquinone, 1,2-dihydroxyanthraquinone, 2-ethylanthraquinone, 1,4-diethoxynaphthalene, p-dimethylaminoacetophenone, p-diethylaminoacetophenone, p-dimethylaminobenzophenone, p-diethylaminobenzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, p-dimethylaminobenzaldehyde, and p-diethylaminobenzaldehyde, etc., and can contain at least one compound selected from the group consisting of these.

[0056] The percentage of the anthracene-based sensitizer (D1) with respect to the total sensitizer (D) is preferably 50% by mass or more, more preferably 70% by mass or more, and still more preferably 90% by mass or more.

[0057] The percentage of the sensitizer (D) with respect to the solid content of the composition (X) is preferably 1.0% by mass or more and 4.5% by mass or less. The solid content means the components excluding volatile components such as solvents in the composition (X). If the percentage is 1.0% by mass or more, the good reactivity of the composition (X) is more easily maintained. Also, if the percentage is 4.5% by mass or less, the transparency (visible light transmittance) of the cured product is hardly inhibited, and outgassing generated from the sensitizer after curing can be reduced. This percentage is more preferably 1.2% by mass or more, and still more preferably 1.5% by mass or more. Also, this percentage is more preferably 4.0 or less, and still more preferably 3.0% by mass or less.

[0058] Also, the percentage of the sensitizer (D) with respect to the total of the ultraviolet absorber (C) and the sensitizer (D) is preferably 3% by mass or more and 70% by mass or less. When this percentage is 3% by mass or more, the good reactivity of the composition (X) is particularly likely to be maintained. Also, when this percentage is 70% by mass or less, the cured product is particularly less likely to transmit ultraviolet rays, and the storage stability of the composition (X) is particularly likely to be enhanced. This percentage is more preferably 4% by mass or more, and even more preferably 5% by mass or more. Also, this percentage is more preferably 50% by mass or less, and even more preferably 40% by mass or less.

[0059] Next, the ultraviolet absorber (C) will be described. As described above, the ultraviolet absorber (C) can reduce the ultraviolet ray transmittance of the cured product. Also, the ultraviolet absorber (C) is less likely to inhibit the transmission of visible light compared to light reflectors such as titanium dioxide particles and zinc oxide particles.

[0060] The ultraviolet absorber (C) contains at least one selected from the group consisting of benzotriazole-based ultraviolet absorbers, benzophenone-based ultraviolet absorbers, azomethine-based ultraviolet absorbers, indole-based ultraviolet absorbers, diazine-based ultraviolet absorbers, triazine-based ultraviolet absorbers, pyrazolidinedione-based ultraviolet absorbers, and ethylene-based ultraviolet absorbers. In this case, the bleed-out of the ultraviolet absorber (C) is less likely to occur, and furthermore, the ultraviolet ray transmittance of the cured product is more likely to be reduced.

[0061] The ultraviolet absorber (C) contains at least one of a reactive ultraviolet absorber (C1) and a non-reactive ultraviolet absorber (C2). The reactive ultraviolet absorber (C1) is an ultraviolet absorber that can undergo a polymerization reaction with at least one compound contained in the photopolymerizable compound (A). The non-reactive ultraviolet absorber (C2) is an ultraviolet absorber that does not undergo a polymerization reaction with the photopolymerizable compound (A).

[0062] When the ultraviolet absorber (C) contains a reactive ultraviolet absorber (C1), bleeding out of the ultraviolet absorber (C) from the cured product is less likely to occur. This is presumably because the reactive ultraviolet absorber (C1) reacts with the compounds in the photopolymerizable compound (A) and is thus easily incorporated into the polymer skeleton in the cured product.

[0063] The reactive ultraviolet absorber (C1) preferably has a functional group (reactive functional group) having reactivity with the compounds contained in the photopolymerizable compound (A). For example, when the photopolymerizable compound (A) contains a radical polymerizable compound, the reactive ultraviolet absorber (C1) preferably has a radical polymerizable functional group as the reactive functional group. Examples of the radical polymerizable functional group include ethylenically unsaturated groups. When the photopolymerizable compound (A) contains a cationic polymerizable compound, the reactive ultraviolet absorber (C1) preferably has a cationic polymerizable functional group as the reactive functional group. The cationic polymerizable functional group includes, for example, at least one selected from the group consisting of an epoxy group, an oxetane group, and a vinyl ether group.

[0064] The reactive ultraviolet absorber (C1) contains, for example, at least one selected from the group consisting of benzotriazole-based reactive ultraviolet absorbers, benzophenone-based reactive ultraviolet absorbers, azomethine-based reactive ultraviolet absorbers, indole-based reactive ultraviolet absorbers, diazine-based reactive ultraviolet absorbers, triazine-based reactive ultraviolet absorbers, pyrazolidinedione-based reactive ultraviolet absorbers, and ethylene-based reactive ultraviolet absorbers.

[0065] In particular, it is preferable that the reactive ultraviolet absorber (C1) contains at least one of a benzotriazole-based reactive ultraviolet absorber and a benzophenone-based reactive ultraviolet absorber. In this case, the benzotriazole-based reactive ultraviolet absorber and the benzophenone-based reactive ultraviolet absorber are likely to absorb ultraviolet rays with relatively short wavelengths. Therefore, it becomes more difficult for the cured product to transmit ultraviolet rays, and it becomes less likely for the transmission of visible light to be inhibited by the reactive ultraviolet absorber (C1). It is particularly preferable that the reactive ultraviolet absorber (C1) contains a benzotriazole-based reactive ultraviolet absorber. Since the benzotriazole-based reactive ultraviolet absorber can absorb ultraviolet rays in a relatively wide wavelength range, it becomes particularly difficult for the cured product to transmit ultraviolet rays.

[0066] The benzotriazole-based reactive ultraviolet absorber has, for example, a structure represented by the following formula (80).

[0067] [Chemical formula]

[0068] In the above formula (80), a plurality of Rs include at least one organic group having a reactive functional group. For example, among a plurality of Rs, it is preferable that each of one R or two Rs is an organic group having a reactive functional group.

[0069] When the photopolymerizable compound (A) contains a radical polymerizable compound and the reactive functional group is a radical polymerizable functional group, the organic group having a reactive functional group is, for example, an organic group represented by the above formula (81), an organic group represented by formula (82), or an organic group represented by formula (83). In the above formula (81), R 2 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and R 3 is a single bond, an alkylene group having 1 to 10 carbon atoms, or an arylene group having 6 to 20 carbon atoms. In the above formula (82), R 4 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 5 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms, and X 1 is O, S, NH, or NR 6and R 6 is an alkyl group having 1 to 5 carbon atoms. In the above formula (83), R 7 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 8 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms, R 9 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms, X 2 is O, S, NH or NR 13 and R 13 is an alkyl group having 1 to 5 carbon atoms, and m is a number from 1 to 6.

[0070] When the photopolymerizable compound (A) contains a cationic polymerizable compound and the reactive functional group is a cationic polymerizable functional group, the cationic polymerizable functional group is, for example, at least one group selected from the group consisting of a cyclic ether group and a vinyl ether group. The cyclic ether group is, for example, at least one of an epoxy group and an oxetane group. The organic group having a reactive functional group is, for example, a vinyl ether group.

[0071] Among the plurality of Rs in the formula (80), each of the groups other than the organic group having a reactive functional group (non-reactive group) is, for example, a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a cyano group, a nitro group, or an organic group having no reactive functional group. The organic group having no reactive functional group is, for example, an alkyl group having 1 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms having a hydroxyl group, an aryl group having 6 to 10 carbon atoms, or an alkyloxy group having 1 to 10 carbon atoms. The non-reactive group preferably contains one or more hydroxyl groups in particular. In this case, the photostability of the ultraviolet absorber (C) itself is likely to be improved by intramolecular hydrogen bonding.

[0072] The benzophenone-based reactive ultraviolet absorber has, for example, a structure represented by the following formula (90).

[0073]

Chemical formula

[0074] In the above formula (90), a plurality of Rs each contain at least one organic group having a reactive functional group. For example, among the plurality of Rs, it is preferable that each of one R or two Rs is an organic group having a reactive functional group.

[0075] When the photopolymerizable compound (A) contains a radical polymerizable compound and the reactive functional group is a radical polymerizable functional group, the organic group having a reactive functional group is, for example, the organic group represented by the above formula (91), the organic group represented by formula (92) or the organic group represented by formula (93). In the above formula (91), R 2 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and R 3 is a single bond, an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms. In the above formula (92), R 4 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 5 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms, X 1 is O, S, NH or NR 6 and R 6 is an alkyl group having 1 to 5 carbon atoms. In the above formula (93), R 7 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 8 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms, R 9 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms, X 2 is O, S, NH or NR 13 and R 13 is an alkyl group having 1 to 5 carbon atoms, and m is a number from 1 to 6.

[0076] When the photopolymerizable compound (A) contains a cationic polymerizable compound and the reactive functional group is a cationic polymerizable functional group, the cationic polymerizable functional group is, for example, at least one kind of group selected from the group consisting of a cyclic ether group and a vinyl ether group. The cyclic ether group is, for example, at least one of an epoxy group and an oxetane group. The organic group having a reactive functional group is, for example, a vinyl ether group.

[0077] Among the plurality of Rs in formula (90), each of the groups other than the organic group having a reactive functional group (non-reactive group) is, for example, a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a cyano group, a nitro group, or an organic group having no reactive functional group. The organic group having no reactive functional group is, for example, an alkyl group having 1 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms and having a hydroxyl group, an aryl group having 6 to 10 carbon atoms, or an alkyloxy group having 1 to 10 carbon atoms. It is preferable that the non-reactive group in formula (90) contains a hydroxyl group, and particularly preferably, at least two of the non-reactive groups are hydroxyl groups. That is, the benzophenone-based reactive ultraviolet absorber preferably has two or more hydroxyl groups. In this case, the transparency (visible light transmittance) of the cured product is less likely to be inhibited, and the transmittance of light with a wavelength of 400 nm of the cured product is effectively reduced.

[0078] On the other hand, the non-reactive ultraviolet absorber (C2) contains at least one selected from the group consisting of, for example, a benzotriazole-based ultraviolet absorber having no reactive functional group, a benzophenone-based ultraviolet absorber having no reactive functional group, an azomethine-based ultraviolet absorber having no reactive functional group, an indole-based ultraviolet absorber having no reactive functional group, a diazine-based ultraviolet absorber having no reactive functional group, a triazine-based ultraviolet absorber having no reactive functional group, a pyrazolidinedione-based ultraviolet absorber having no reactive functional group, and an ethylene-based ultraviolet absorber having no reactive functional group. The non-reactive ultraviolet absorber (C2) preferably contains at least one selected from the group consisting of a triazine-based ultraviolet absorber, a benzotriazole-based ultraviolet absorber, and a benzophenone-based ultraviolet absorber.

[0079] The benzotriazole-based ultraviolet absorber having no reactive functional group has, for example, a structure in which each of the plurality of Rs in the above formula (80) is a non-reactive group. In this case, each of the plurality of Rs is, for example, a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a cyano group, a nitro group, or an organic group having no reactive functional group. The organic group having no reactive functional group is, for example, an alkyl group having 1 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms and having a hydroxyl group, an aryl group having 6 to 10 carbon atoms, or an alkyloxy group having 1 to 10 carbon atoms.

[0080] Benzophenone-based UV absorbers having no reactive functional groups have, for example, in the above formula (90), a structure in which each of a plurality of Rs is a non-reactive group. In this case, each of the plurality of Rs is, for example, a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a cyano group, a nitro group, or an organic group having no reactive functional group. The organic group having no reactive functional group is, for example, an alkyl group having 1 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms and having a hydroxyl group, an aryl group having 6 to 10 carbon atoms, or an alkyloxy group having 1 to 10 carbon atoms.

[0081] The non-reactive UV absorber (C2) may contain a compound that exhibits UV absorbency when heated, so-called latent UV absorber. In this case, since the latent UV absorber does not exhibit UV absorbency in the composition (X), the composition (X) is easily cured by UV light. Further, when the cured product is heated, the latent UV absorber in the cured product exhibits UV absorbency, making the cured product less likely to transmit UV light.

[0082] When the UV absorber (C) contains a reactive UV absorber (C1) and a non-reactive UV absorber (C2), the percentage of the reactive UV absorber (C1) with respect to the entire UV absorber (C) is preferably 30% by mass or more, more preferably 40% by mass or more, and still more preferably 50% by mass or more. In this case, bleed-out of the UV absorber (C) from the cured product is less likely to occur.

[0083] The ultraviolet absorber (C) preferably contains a compound having a molecular weight of 400 or more. In this case, outgas is less likely to be generated from the cured product. The percentage of the compound having a molecular weight of 400 or more with respect to the whole ultraviolet absorber (C) is preferably 3% by mass or more. In this case, there is an advantage that ultraviolet rays can be sufficiently absorbed even in a thin film of 10 μm. This percentage is more preferably 5% by mass or more, and even more preferably 8% by mass or more. Also, this percentage is preferably 30% by mass or less. In this case, there is an advantage that the inkjet property of the composition (X) is good and the outgas is also reduced. This percentage is more preferably 25% by mass or less, and even more preferably 15% by mass or less.

[0084] The percentage of the ultraviolet absorber (C) is, for example, 1% by mass or more and 25% by mass or less with respect to the whole composition (X). If this percentage is 1% by mass or more, there is an advantage that the cured product is particularly unlikely to transmit ultraviolet rays. This percentage is more preferably 3% by mass or more. If this percentage is 25% by mass or less, there is an advantage that the coating property of the composition (X) is good. This percentage is more preferably 20% by mass or less, and even more preferably 15% by mass or less.

[0085] The photopolymerizable compound (A) and the photoinitiator (B) will also be described.

[0086] The photopolymerizable compound (A) is a compound that can cause a polymerization reaction upon irradiation with light. The photopolymerizable compound (A) contains, for example, at least one component selected from the group consisting of monomers, oligomers, and prepolymers.

[0087] The photopolymerizable compound (A) contains at least one of a monofunctional photopolymerizable compound (A011) having only one polymerizable functional group and a polyfunctional photopolymerizable compound (A012) having two or more polymerizable functional groups.

[0088] The photopolymerizable compound (A) preferably contains a monofunctional photopolymerizable compound (A011). In this case, even if the polymerization reaction of the monofunctional photopolymerizable compound (A011) proceeds to some extent, the viscosity of the composition (X) hardly fluctuates significantly. Therefore, an increase in the viscosity of the composition (X) during storage of the composition (X) can be suppressed, that is, it is easy to enhance the storage stability of the composition (X). Particularly in this embodiment, since the composition (X) contains a sensitizer (D), the reaction of the photopolymerizable compound (A) may be promoted by the sensitizer (D) during storage of the composition (X). However, even in such a case, the increase in the viscosity of the composition (X) is less likely to occur due to the monofunctional photopolymerizable compound (A011).

[0089] The photopolymerizable compound (A) preferably further contains a polyfunctional photopolymerizable compound (A012). In this case, the reactivity of the composition (X) when the composition (X) is irradiated with light is enhanced. Therefore, good reactivity when the composition (X) is irradiated with light near a wavelength of 395 nm can be achieved, and the generation of outgas from the cured product is suppressed.

[0090] The percentage of the monofunctional photopolymerizable compound (A011) with respect to the solid content in the composition (X) is preferably 10% by mass or more and 40% by mass or less. If this percentage is 10% by mass or more, the storage stability of the composition (X) is more likely to be enhanced. Also, if this percentage is 40% by mass or less, the reactivity of the composition (X) is more likely to be ensured. It is more preferably 12% by mass or more, and even more preferably 15% by mass or more. Also, it is more preferably 35% by mass or less, and even more preferably 30% by mass or less.

[0091] The percentage of the polyfunctional photopolymerizable compound (A012) with respect to the solid content in the composition (X) is preferably 50% by mass or more. In this case, the reactivity of the composition (X) is more easily ensured, and outgas is less likely to be generated. If this percentage is 55% by mass or more, it is more preferable, and if it is 60% by mass or more, it is even more preferable. Also, this percentage is preferably 90% by mass or less. In that case, there is an advantage that the increase in the viscosity of the composition (X) during storage of the composition (X) can be suppressed, that is, the storage stability of the composition (X) can be easily enhanced. There is also an advantage that the curing shrinkage can be sufficiently suppressed. If this percentage is 85% by mass or less, it is more preferable, and if it is 80% by mass or less, it is even more preferable.

[0092] The photopolymerizable compound (A) preferably contains a compound (A02) having at least one of a -R-O- skeleton and a -R-N- skeleton. In this case, the bleed-out of the ultraviolet absorber (C) and the sensitizer (D) from the cured product is less likely to occur. This is presumably because the affinity between the photopolymerizable compound (A) and the ultraviolet absorber (C) and the sensitizer (D) increases. R in each of the -R-O- skeleton and the -R-N- skeleton is a divalent hydrocarbon group such as an alkylene group having 2 or more carbon atoms. If the carbon number of R is 3 or more, a higher effect is more easily obtained. Also, the carbon number of R is, for example, 10 or less. However, from each of the -R-O- skeleton and the -R-N- skeleton described above, the -R-O- skeleton and the -R-N- skeleton present in the three-membered ring and the -R-O- skeleton and the -R-N- skeleton present in the four-membered ring are excluded.

[0093] The percentage of the compound (A02) with respect to the solid content in the composition (X) is preferably 10% by mass or more and 90% by mass or less. If this percentage is 10% by mass or more, bleed-out is less likely to occur. If this percentage is 80% by mass or less, the storage stability of the composition (X) is more easily enhanced. If this percentage is 30% by mass or more, it is more preferable, and if it is 50% by mass or more, it is even more preferable. Also, if this percentage is 80% by mass or less, it is even more preferable.

[0094] The compound (A02) can contain at least one compound selected from the group consisting of compounds having at least one of an -R-O- skeleton and an -R-N- skeleton among the specific examples of the compounds described as being included in the photopolymerizable compound (A) described later.

[0095] The photopolymerizable compound (A) contains at least one of, for example, a radical polymerizable compound (A1) and a cationic polymerizable compound (A2). When the photopolymerizable compound (A) contains the radical polymerizable compound (A1), the photopolymerization initiator (B) preferably contains a photo radical polymerization initiator (B1). When the photopolymerizable compound (A) contains the cationic polymerizable compound (A2), the photopolymerization initiator (B) preferably contains a photo cationic polymerization initiator (B2) (cationic curing catalyst).

[0096] The case where the photopolymerizable compound (A) contains the radical polymerizable compound (A1) will be described.

[0097] The radical polymerizable compound (A1) contains at least one of an acrylic compound (Y) and a radical polymerizable compound (Z) other than the acrylic compound (Y). The radical polymerizable compound (A1) preferably contains the acrylic compound (Y). The acrylic compound (Y) is a compound having one or more (meth)acryloyl groups in one molecule.

[0098] The viscosity of the entire acrylic compound (Y) at 25°C is preferably 50 mPa·s or less. In this case, the acrylic compound (Y) can particularly reduce the viscosity of the composition (X). More preferably, the viscosity of the entire acrylic compound (Y) is 30 mPa·s or less, and particularly preferably 20 mPa·s or less. Also, the viscosity of the entire acrylic compound (Y) is, for example, 3 mPa·s or more.

[0099] It is also preferable that the viscosity of the entire acrylic compound (Y) at 40 °C is 50 mPa·s or less. In this case, the acrylic compound (Y) can particularly reduce the viscosity of the composition (X) when heated. If the viscosity of the entire acrylic compound (Y) is 30 mPa·s or less, it is more preferable, and if it is 20 mPa·s or less, it is particularly preferable. Also, the viscosity of the entire acrylic compound (Y) is, for example, 3 mPa·s or more.

[0100] The percentage of components in the acrylic compound (Y) having a boiling point of 270 °C or higher is preferably 80% by mass or more. In this case, the storage stability of the composition (X) is particularly unlikely to be impaired, and outgas is particularly unlikely to occur from the cured product. If the percentage of components in the acrylic compound (Y) having a boiling point of 280 °C or higher is 80% by mass or more, it is more preferable.

[0101] The acrylic compound (Y) preferably contains a component having a viscosity at 25 °C of 20 mPa·s or less. In this case, the viscosity of the composition (X) can be reduced.

[0102] The ratio of the component having a viscosity at 25 °C of 20 mPa·s or less to the total amount of the acrylic compound (Y) is preferably 50% by mass or more and 100% by mass or less. In this case, the viscosity of the composition (X) can be particularly reduced, and the composition (X) can be particularly easily applied by the inkjet method. This ratio is more preferably 60% by mass or more, and even more preferably 70% by mass or more. Also, this ratio is more preferably 95% by mass or less, and even more preferably 90% by mass or less.

[0103] The component having a viscosity at 25 °C of 20 mPa·s or less preferably contains a compound having a glass transition temperature of 80 °C or higher. In this case, while reducing the viscosity of the composition (X), the glass transition temperature of the cured product can be increased. It is more preferable if this component contains a compound having a glass transition temperature of 90 °C or higher, and even more preferable if it contains a compound having a glass transition temperature of 100 °C or higher. There is no upper limit to the glass transition temperature of the compound contained in this component, but it is, for example, 150 °C or less.

[0104] The compounds that the acrylic compound (Y) may contain will be described.

[0105] The acrylic compound (Y) contains at least one of a monofunctional acrylic compound (Y2) having only one (meth)acryloyl group as a radically polymerizable functional group in one molecule and a polyfunctional acrylic compound (Y1) having two or more radically polymerizable functional groups containing a (meth)acryloyl group in one molecule. The monofunctional acrylic compound (Y2) is included in the above-mentioned monofunctional photopolymerizable compound (A011), and the polyfunctional acrylic compound (Y1) is included in the above-mentioned polyfunctional photopolymerizable compound (A012).

[0106] The polyfunctional acrylic compound (Y1) can increase the glass transition temperature of the cured product, and thus can improve the heat resistance of the cured product. The proportion of the polyfunctional acrylic compound (Y1) is preferably 50% by mass or more and 100% by mass or less based on the whole acrylic compound (Y).

[0107] The polyfunctional acrylic compound (Y1) is, for example, 1,3-butylene glycol di(meth)acrylate, 1,4-butanediol oligoacrylate, diethylene glycol diacrylate, 1,6-hexanediol oligoacrylate, neopentyl glycol diacrylate, triethylene glycol diacrylate, tripropylene glycol diacrylate, dipropylene glycol diacrylate, cyclohexanedimethanol diacrylate, tricyclodecane dimethanol diacrylate, bisphenol A polyethoxydiacrylate, bisphenol F polyethoxydiacrylate, pentaerythritol tetraacrylate, propoxylated (2) neopentyl glycol diacrylate, trimethylolpropane triacrylate, tris(2-hydroxyethyl) isocyanurate triacrylate, pentaerythritol triacrylate, ethoxylated (3) trimethylolpropane triacrylate, propoxylated (3) glyceryl triacrylate, pentaerythritol tetraacrylate, ditrimethylolpropane tetraacrylate, ethoxylated (4) pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, 2-(2-ethoxyethoxy)ethyl acrylate, hexanediol diacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, tripropylene glycol triacrylate, bispentaerythritol hexaacrylate, ethylene glycol diacrylate, 1,6-hexanediol diacrylate, ethoxylated 1,6-hexanediol diacrylate, polypropylene glycol diacrylate, 1,4-butanediol diacrylate, 1,9-nonanediol diacrylate, tetraethylene glycol diacrylate, 2-n-butyl-2-ethyl-1,It contains at least one compound selected from the group consisting of 3-propanediol diacrylate, neopentyl glycol diacrylate hydroxy pivalate, trimethylolpropane triacrylate hydroxy pivalate, ethoxylated triacrylate phosphate, ethoxylated tripropylene glycol diacrylate, neopentyl glycol-modified trimethylolpropane diacrylate, stearic acid-modified pentaerythritol diacrylate, trimethylolpropane triacrylate, tetramethylolmethane triacrylate, caprolactone-modified trimethylolpropane triacrylate, propoxylated glyceryl triacrylate, tetramethylolmethane tetraacrylate, ethoxylated pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, caprolactone-modified dipentaerythritol hexaacrylate, dipentaerythritol hydroxy pentaacrylate, neopentyl glycol oligoacrylate, trimethylolpropane oligoacrylate, pentaerythritol oligoacrylate, ethoxylated neopentyl glycol di(meth)acrylate, propoxylated neopentyl glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, and 2-(2-vinyloxyethoxy)ethyl acrylate.,

[0108] The acrylic equivalent of the polyfunctional acrylic compound (Y1) is preferably 150 g / eq or less, more preferably 90 g / eq or more and 150 g / eq or less. The weight average molecular weight of the polyfunctional acrylic compound (Y1) is, for example, 100 or more and 1000 or less, more preferably 200 or more and 800 or less.,

[0109] The polyfunctional acrylic compound (Y1) preferably contains a compound (Y11) having a structure represented by the following formula (200).

[0110] CH2=CR 1 -COO-(R 3 -O)n-CO-CR2 =CH2…(200) In formula (200), R 1 and R 2 Each of the groups is a hydrogen atom or a methyl group, n is an integer of 1 or more, R 3 is an alkylene group having 1 or more carbon atoms, and when n is 2 or more, multiple R 3 may be the same or different from each other.

[0111] R 3 When the number of carbon atoms in R is 2 or more, the compound (Y11) is included in the above-mentioned compound (A02). 3 is preferably an alkylene group having 3 to 6 carbon atoms.

[0112] Compound (Y11) has the structure shown in formula (200), in particular R 3 Since the carbon number of R is 3 or more, it is difficult to increase the affinity of the cured product with water. 3 The number of carbon atoms in is, for example, 1 or more and 15 or less, preferably 3 or more and 15 or less. In addition, the compound (Y11) can increase the glass transition temperature of the cured product by having the structure shown in formula (200), particularly by having two (meth)acryloyl groups in one molecule, and therefore can increase the heat resistance of the cured product. In addition, n in formula (200) is, for example, an integer of 1 or more and 12 or less.

[0113] The compound (Y11) preferably contains a component having a boiling point of 270°C or higher. That is, the acrylic compound (Y) preferably has the structure represented by the formula (200) and contains a component having a boiling point of 270°C or higher. In this case, when the composition (X) is stored and when the composition (X) is heated, the acrylic compound (Y) is less likely to volatilize from the composition (X). Therefore, the storage stability of the composition (X) is less likely to be impaired. Further, even if the compound (Y11) remains unreacted in the cured product of the composition (X), outgas caused by the compound (Y11) is less likely to be generated from the cured product. Therefore, in the light-emitting device 1, voids due to outgas are less likely to occur. If there are voids in the light-emitting device 1, there is a risk that moisture may enter the light-emitting element 4 through the voids. However, if voids are less likely to occur, moisture is less likely to enter the light-emitting element 4. The boiling point is the boiling point under normal pressure obtained by converting the boiling point under reduced pressure, and is determined by, for example, the method shown in Science of Petroleum, Vol.II. P.1281 (1938). It is more preferable that the compound (Y11) contains a component having a boiling point of 280°C or higher.

[0114] The percentage of the compound (Y11) with respect to the acrylic compound (Y) is preferably 50% by mass or more. In this case, the storage stability of the composition (X) is effectively enhanced, the generation of outgas from the cured product is effectively reduced, and further, the affinity of the cured product for water is not particularly enhanced. The percentage of the compound (Y11) with respect to the acrylic compound (Y) is, for example, 100% by mass or less, or 95% by mass or less, and preferably 80% by mass or less.

[0115] The viscosity of the compound (Y11) at 25°C is preferably 25 mPa·s or less. In this case, the compound (Y11) can lower the viscosity of the composition (X). The viscosity of the compound (Y11) at 25°C is more preferably 20 mPa·s or less, and particularly preferably 15 mPa·s or less. Also, the viscosity of the compound (Y11) at 25°C is, for example, 1 mPa·s or more, preferably 3 mPa·s or more, and more preferably 5 mPa·s or more.

[0116] The compound (Y11) contains at least one compound selected from the group consisting of, for example, alkylene glycol di(meth)acrylate, polyalkylene glycol di(meth)acrylate, and alkylene oxide-modified alkylene glycol di(meth)acrylate.

[0117] Alkylene glycol di(meth)acrylate is a compound in which n is 1 in the formula (200). In this case, the carbon number of R 3 in the formula (200) is preferably 4 to 12. R 3It may be linear or may have a branch. In particular, alkylene glycol di(meth)acrylate preferably contains at least one compound selected from the group consisting of 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, neopentyl glycol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate, 1,10-decanediol diacrylate, 1,4-butanediol dimethacrylate, 1,3-butylene glycol dimethacrylate, neopentyl glycol dimethacrylate, 1,6-hexanediol dimethacrylate, 1,9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, and 1,12-dodecanediol dimethacrylate. Further, alkylene glycol di(meth)acrylate preferably contains at least one compound selected from the group consisting of product number SR213 manufactured by Sartomer, product number V195 manufactured by Osaka Organic Chemical Industry Co., Ltd., product number SR212 manufactured by Sartomer, product number SR247 manufactured by Sartomer, product name Light Acrylate NP-A manufactured by Kyoeisha Chemical Co., Ltd., product number SR238NS manufactured by Sartomer, product number V230 manufactured by Osaka Organic Chemical Industry Co., Ltd., product number HDDA manufactured by Daicel Corporation, product number 1,6HX-A manufactured by Kyoei Chemical Industry Co., Ltd., product number V260 manufactured by Osaka Organic Chemical Industry Co., Ltd., product number 1,9-ND-A manufactured by Kyoei Chemical Industry Co., Ltd., product number A-NOD-A manufactured by Shin-Nakamura Chemical Co., Ltd., product number CD595 manufactured by Sartomer, product number SR214NS manufactured by Sartomer, product number BD manufactured by Shin-Nakamura Chemical Co., Ltd., product number SR297 manufactured by Sartomer, product number SR248 manufactured by Sartomer, product name Light Ester NP manufactured by Kyoeisha Chemical Co., Ltd., product number SR239NS manufactured by Sartomer, product name Light Ester 1,6HX manufactured by Kyoeisha Chemical Co., Ltd., product number HD-N manufactured by Shin-Nakamura Chemical Co., Ltd., product name Light Ester 1,9ND manufactured by Kyoeisha Chemical Co., Ltd., product number NOD-N manufactured by Shin-Nakamura Chemical Co., Ltd., product name Light Ester 1,10DC manufactured by Kyoeisha Chemical Co., Ltd., product number DOD-N manufactured by Shin-Nakamura Chemical Co., Ltd., and product number SR262 manufactured by Sartomer.

[0118] Polyalkylene glycol di(meth)acrylate is, for example, a compound in which n is 2 or more in formula (200). n is, for example, 2 to 10, preferably 2 to 7, also preferably 2 to 6, and also preferably 2 to 3. The number of carbon atoms of R 3 is, for example, 2 to 7, preferably 2 to 5. The larger the number of carbon atoms, the higher the hydrophobicity of the cured product, and the more difficult it is for the cured product to permeate moisture. Polyalkylene glycol di(meth)acrylate preferably contains at least one compound selected from the group consisting of diethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, hexaethylene glycol dimethacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, tripropylene glycol dimethacrylate, tritetramethylene glycol diacrylate, polyethylene glycol 200 dimethacrylate, and polyethylene glycol 200 diacrylate. Further, polyalkylene glycol di(meth)acrylate preferably contains at least one compound selected from the group consisting of Sartomer product number SR230, Sartomer product number SR508NS, Daicel product number DPGDA, Sartomer product number SR306NS, Daicel product number TPGDA, Osaka Organic Chemical Industry product number V310HP, Shin-Nakamura Chemical product number APG200, Kyoeisha Chemical product name Light Acrylate PTMGA-250, Sartomer product number SR231NS, Kyoeisha Chemical product name Light Ester 2EG, Sartomer product number SR205NS, Kyoeisha Chemical product name Light Ester 3EG, Sartomer product number SR210NS, Kyoeisha Chemical product name Light Ester 4EG, Mitsubishi Chemical product name Acrylate HX, and Shin-Nakamura Chemical product number 3PG.

[0119] The alkylene oxide-modified alkylene glycol di(meth)acrylate contains, for example, propylene oxide-modified neopentyl glycol. Further, the alkylene oxide-modified alkylene glycol di(meth)acrylate contains, for example, product number EBECRYL145 manufactured by Daicel Corporation.

[0120] When the acrylic compound (Y) contains the compound (Y11) having the structure represented by the formula (200), it is preferable that the compound (Y11) does not contain a compound in which the value of n in the formula (200) is 5 or more. (R 3 When -O)n is a polyethylene glycol skeleton, it is particularly preferable that the compound in which the value of n in the formula (200) is greater than 5 is not contained. Even when the compound (Y11) contains a compound in which the value of n in the formula (200) is greater than 5, the percentage of the compound in which the value of n in the formula (200) is greater than 5 with respect to the acrylic compound (Y) is preferably 20% by mass or less. Further, even when the compound (Y11) contains a compound in which the value of n in the formula (200) is greater than 5, it is preferable that the compound (Y11) does not contain a compound in which the value of n is greater than 9, and more preferably does not contain a compound in which the value of n is greater than 7. In these cases, an increase in the viscosity of the composition (X) is particularly unlikely to occur.

[0121] It is particularly preferable that the polyfunctional acrylic compound (Y1) contains polyalkylene glycol di(meth)acrylate. Since polyalkylene glycol di(meth)acrylate has a low viscosity and is difficult to volatilize, it can contribute to reducing the viscosity of the composition (X), and can contribute to improving the storage stability of the composition (X) and reducing outgas from the cured product.

[0122] When the polyfunctional acrylic compound (Y1) contains a polyalkylene glycol di(meth)acrylate, the proportion of the polyalkylene glycol di(meth)acrylate in the acrylic compound (Y) is preferably 40% by mass or more and 80% by mass or less. When the proportion of the polyalkylene glycol di(meth)acrylate is 40% by mass or more, the viscosity of the composition (X) can be effectively reduced. It is more preferably 42% by mass or more and 75% by mass or less, and still more preferably 45% by mass or more and 70% by mass or less.

[0123] The polyfunctional acrylic compound (Y1) may contain a compound having three or more radically polymerizable functional groups containing a (meth)acryloyl group in one molecule. In this case, the polyfunctional acrylic compound (Y1) can contain at least one selected from the group consisting of trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, and pentaerythritol tetra(meth)acrylate. In this case, the glass transition temperature of the cured product can be particularly increased, and thus the heat resistance of the cured product can be particularly increased.

[0124] The polyfunctional acrylic compound (Y1) preferably contains pentaerythritol tetra(meth)acrylate. In this case, the glass transition temperature of the cured product can be particularly increased, and the reactivity of the composition (X) can be improved. When the reactivity of the composition (X) is improved, the composition (X) can be easily cured even in an environment containing oxygen such as an air atmosphere.

[0125] When the polyfunctional acrylic compound (Y1) contains pentaerythritol tetra(meth)acrylate, the proportion of pentaerythritol tetra(meth)acrylate in the acrylic compound (Y) is preferably 0.5% by mass or more and 10% by mass or less. In this case, it is possible to achieve both high reactivity and low viscosity of the composition (X). It is more preferably 1% by mass or more and 9% by mass or less, and still more preferably 2% by mass or more and 8% by mass or less.

[0126] The polyfunctional acrylic compound (Y1) may have at least one of a benzene ring, an alicyclic ring, and a polar group. The polar group is, for example, at least one of an OH group and an NHCO group. In this case, the shrinkage during the curing of the composition (X) can be particularly reduced. Furthermore, the adhesion between the cured product and an inorganic compound such as silicon nitride or silicon oxide can also be enhanced. The polyfunctional acrylic compound (Y1) preferably contains at least one compound selected from the group consisting of tricyclodecane dimethanol diacrylate, bisphenol A polyethoxydiacrylate, bisphenol F polyethoxydiacrylate, trimethylolpropane triacrylate, and pentaerythritol triacrylate. These compounds can particularly reduce the shrinkage during the curing of the composition (X). Furthermore, these compounds can also enhance the adhesion between the cured product and an inorganic compound such as silicon nitride or silicon oxide.

[0127] When the adhesion between the cured product and the inorganic material is enhanced, when the optical component is stacked with a film made of an inorganic material such as a SiN film (inorganic film), high adhesion between the optical component and the inorganic film is easily obtained.

[0128] It is particularly preferable that the polyfunctional acrylic compound (Y1) contains polyalkylene glycol di(meth)acrylate and pentaerythritol tetra(meth)acrylate. In this case, the composition (X) has a low viscosity and excellent reactivity. Therefore, even in an environment containing oxygen such as an air atmosphere, the composition (X) can be easily cured.

[0129] The acrylic compound (Y) preferably contains a monofunctional acrylic compound (Y2) in which the radically polymerizable functional group in one molecule is only one (meth)acryloyl group. The monofunctional acrylic compound (Y2) can suppress the shrinkage during the curing of the composition (X).

[0130] When the acrylic compound (Y) contains a monofunctional acrylic compound (Y2), the amount of the monofunctional acrylic compound (Y2) relative to the total amount of the acrylic compound (Y) is preferably more than 0% by mass and 50% by mass or less. If the amount of the monofunctional acrylic compound (Y2) is more than 0% by mass, the shrinkage during curing of the composition (X) can be suppressed. Further, if the amount of the monofunctional acrylic compound (Y2) is 50% by mass or less, the amount of the polyfunctional acrylic compound (Y1) can be 50% by mass or more, thereby particularly improving the heat resistance of the cured product. It is more preferable that the amount of the monofunctional acrylic compound (Y2) is 5% by mass or more, more preferably 30% by mass or less, and particularly preferably 20% by mass or less.

[0131] The monofunctional acrylic compound (Y2) is, for example, tetrahydrofurfuryl acrylate, isobornyl acrylate, 2-hydroxyethyl acrylate, 4-hydroxybutyl acrylate, isobutyl acrylate, t-butyl acrylate, isooctyl acrylate, 2-methoxyethyl acrylate, methoxytriethylene glycol acrylate, 2-ethoxyethyl acrylate, 3-methoxybutyl acrylate, ethoxyethyl acrylate, butoxyethyl acrylate, ethoxydiethylene glycol acrylate, methoxydiglycol ethyl acrylate, ethyldiglycol acrylate, cyclic trimethylolpropane formal monoacrylate, imide acrylate, isoamyl acrylate, ethoxylated succinic acid acrylate, trifluoroethyl acrylate, ω-carboxypolycaprolactone monoacrylate, cyclohexyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, stearyl acrylate, diethylene glycol monobutyl ether acrylate, lauryl acrylate, isodecyl acrylate, 3,3,It contains at least one compound selected from the group consisting of 5-trimethylcyclohexanol acrylate, isooctyl acrylate, octyl / decyl acrylate, tridecyl acrylate, caprolactone acrylate, ethoxylated(4) nonylphenol acrylate, methoxypolyethylene glycol(350) monoacrylate, methoxypolyethylene glycol(550) monoacrylate, phenoxyethyl acrylate, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, benzyl acrylate, methylphenoxyethyl acrylate, 4-t-butylcyclohexyl acrylate, caprolactone-modified tetrahydrofurfuryl acrylate, tribromophenyl acrylate, ethoxylated tribromophenyl acrylate, 2-phenoxyethyl acrylate, ethylene oxide adduct of 2-phenoxyethyl acrylate, propylene oxide adduct of 2-phenoxyethyl acrylate, acryloylmorpholine, morpholin-4-yl acrylate, dicyclopentanyl acrylate, phenoxydiethylene glycol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 1,4-cyclohexanedimethanol monoacrylate, 3-methacryloyloxymethyl cyclohexene oxide and 3-acryloyloxymethyl cyclohexene oxide.,

[0132] The monofunctional acrylic compound (Y2) may contain at least one compound selected from the group consisting of a compound having an alicyclic structure and a compound having a cyclic ether structure.,

[0133] The compound having an alicyclic structure contains at least one compound selected from the group consisting of, for example, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 4-t-butylcyclohexyl acrylate, caprolactone-modified tetrahydrofurfuryl acrylate, acryloylmorpholine, 4-morpholinyl acrylate, isobornyl acrylate, dicyclopentanyl acrylate, phenoxydiethylene glycol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, and 1,4-cyclohexanedimethanol monoacrylate.

[0134] In the compound having a cyclic ether structure, the number of ring members of the cyclic ether structure is preferably 3 or more, more preferably 3 or more and 4 or less. The number of carbon atoms contained in the cyclic ether structure is preferably 2 or more and 9 or less, more preferably 2 or more and 6 or less. The compound having a cyclic ether structure contains at least one compound selected from the group consisting of, for example, 3-methacryloyloxymethyl cyclohexene oxide and 3-acryloyloxymethyl cyclohexene oxide.

[0135] The acrylic compound (Y) may contain a compound having silicon in its molecular skeleton. In this case, the adhesion between the cured product and the inorganic material is improved. The compound having silicon in its molecular skeleton contains at least one compound selected from the group consisting of, for example, 3-(trimethoxysilyl)propyl acrylate (for example, product number KBM5103 manufactured by Shin-Etsu Chemical Co., Ltd.) and (meth)acryl group-containing alkoxysilane oligomer (for example, product number KR-513 manufactured by Shin-Etsu Chemical Co., Ltd.).

[0136] The acrylic compound (Y) may contain a compound having phosphorus in its molecular skeleton. In this case, the adhesion between the cured product and the inorganic material is improved. The compound having phosphorus in its molecular skeleton includes acid phosphoxy (meth)acrylate such as acid phosphoxypolyoxypropylene glycol monomethacrylate.

[0137] The acrylic compound (Y) may contain a compound having nitrogen in its molecular skeleton. In this case, the adhesion between the cured product and the inorganic material is improved. Also, the reactivity of the acrylic compound (Y) is likely to be improved, and thus outgas is less likely to be generated from the cured product. In particular, as the compound contained in the above-described compound (A02), it is preferable that the acrylic compound (Y) contains a compound having a -R-N- skeleton. The compound having nitrogen in its molecular skeleton includes, for example, at least one compound selected from the group consisting of compounds having a morpholine skeleton such as acryloylmorpholine and 4-yl morpholine acrylate, diethylacrylamide, dimethylaminopropylacrylamide, and pentamethylpiperidyl methacrylate.

[0138] It is particularly preferable that the acrylic compound (Y) contains a compound having a morpholine skeleton. In this case, the reactivity of the composition (X) can be further improved, and the curability of the composition (X) can be further enhanced even in an air atmosphere. Further, since the morpholine skeleton includes a -R-O- skeleton and a -R-N- skeleton, the compound having a morpholine skeleton is included in the above-described compound (A02). It is particularly preferable that the acrylic compound (Y) contains at least one of acryloylmorpholine and 4-yl morpholine acrylate. In this case, shrinkage during curing of the composition (X) can be suppressed. Also, the viscosities of acryloylmorpholine and 4-yl morpholine acrylate are low, and thus these compounds are less likely to increase the viscosity of the composition (X). Further, since these compounds are less volatile, it is easy to improve the storage stability of the composition (X).

[0139] The ratio of the compound having a morpholine skeleton to the acrylic compound (Y) is preferably 5% by mass or more and 50% by mass or less. In this case, there is an advantage that outgas is less likely to be generated from the cured product of the composition (X). This ratio is more preferably 7% by mass or more and 45% by mass or less, and even more preferably 10% by mass or more and 40% by mass or less.

[0140] The acrylic compound (Y) may contain a compound having an isobornyl skeleton. The compound having an isobornyl skeleton can contain, for example, one or more compounds selected from the group consisting of isobornyl acrylate and isobornyl methacrylate.

[0141] The acrylic compound (Y) may contain a component composed of a compound having at least one skeleton selected from the group consisting of a dicyclopentadiene skeleton, a dicyclopentanyl skeleton, a dicyclopentenyl skeleton, and a bisphenol skeleton. Specifically, the acrylic compound (Y) may contain, for example, at least one compound selected from the group consisting of tricyclodecane dimethanol diacrylate, bisphenol A polyethoxydiacrylate, and bisphenol F polyethoxydiacrylate. In this case, the adhesion between the cured product and the inorganic material can be enhanced.

[0142] The acrylic compound (Y) may contain the compound represented by the following formula (100). In this case, the reactivity of the composition (X) can be enhanced, and the adhesion between the cured product and the inorganic material can be improved.

[0143]

Chemical formula

[0144] In formula (100), R 0 is H or a methyl group. X is a single bond or a divalent hydrocarbon group. Each of R 1 to R 11 is H, an alkyl group, or -R 12 -OH, R 12 is an alkylene group and at least one of R 1 to R 11 is an alkyl group or -R 12 -OH. R 1 to R 11 are not chemically bonded to each other. When X is a divalent hydrocarbon group, since this compound has a -R-O- skeleton, it is included in the above-mentioned compound (A02).

[0145] Specifically, for example, the acrylic compound (Y) may contain at least one compound selected from the group consisting of the compound represented by the following formula (110), the compound represented by the formula (120), and the compound represented by the formula (130).

[0146]

Chemical formula

[0147] The radically polymerizable compound (A1) may contain a radically polymerizable compound (Z) other than the acrylic compound (Y). The amount of the radically polymerizable compound (Z) relative to the total amount of the acrylic compound (Y) and the radically polymerizable compound (Z) is, for example, 10% by mass or less. The radically polymerizable compound (Z) can contain at least one of a polyfunctional radically polymerizable compound (Z1) having two or more radically polymerizable functional groups in one molecule and a monofunctional radically polymerizable compound (Z2) having only one radically polymerizable functional group in one molecule. The monofunctional radically polymerizable compound (Z2) is included in the above-mentioned monofunctional photopolymerizable compound (A011), and the polyfunctional radically polymerizable compound (Z1) is included in the above-mentioned polyfunctional photopolymerizable compound (A012).

[0148] The polyfunctional radically polymerizable compound (Z1) may contain, for example, at least one compound selected from the group consisting of aromatic urethane oligomers, aliphatic urethane oligomers, epoxy acrylate oligomers, polyester acrylate oligomers, and other special oligomers having two or more ethylenic double bonds in one molecule. Note that the components that the polyfunctional radically polymerizable compound (Z1) may contain are not limited to the above. The monofunctional radically polymerizable compound (Z2) contains, for example, at least one compound selected from the group consisting of N-vinylformamide, vinylcaprolactam, vinylpyrrolidone, phenyl glycidyl ether, p-tert-butylphenyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, allyl glycidyl ether, 1,2-butylene oxide, 1,3-butadiene monooxide, 1,2-epoxydodecane, epichlorohydrin, 1,2-epoxydecane, styrene oxide, cyclohexene oxide, 3-vinylcyclohexene oxide, 4-vinylcyclohexene oxide, N-vinylpyrrolidone, and N-vinylcaprolactam. Note that the components that the monofunctional radically polymerizable compound (Z2) may contain are not limited to the above.

[0149] When the radically polymerizable compound (A1) contains the radically polymerizable compound (Z), the radically polymerizable compound (Z) may contain a compound having nitrogen in its molecular skeleton. The compound having nitrogen in its molecular skeleton includes, for example, at least one compound selected from the group consisting of N-vinylformamide, N-vinylpyrrolidone, and N-vinylcaprolactam. In this case, similar to the case where the acrylic compound (Y) contains a compound having nitrogen in its molecular skeleton, the adhesion between the cured product and the inorganic material is improved.

[0150] In other words, the radically polymerizable compound (A1) preferably contains a compound having nitrogen in its molecular skeleton. The compound having nitrogen in its molecular skeleton may contain a compound contained in the acrylic compound (Y), or may contain a compound contained in the radically polymerizable compound (Z). In this case, the adhesion between the cured product and the inorganic material is improved. The proportion of the compound having nitrogen in its molecular skeleton with respect to the whole radically polymerizable compound (A1) is preferably 5% by mass or more and 80% by mass or less. When this proportion is 5% by mass or more, the adhesion between the cured product and the inorganic material is particularly likely to be improved. When this proportion is 80% by mass or less, the compound having nitrogen in its molecular skeleton is less likely to inhibit the storage stability of the composition (X), and it is less likely to cause satellites when the composition (X) is ejected by an inkjet method. Therefore, the inkjet property of the composition (X) is less likely to be inhibited. Furthermore, it is possible to hardly generate outgas caused by the compound having nitrogen in its molecular skeleton. This proportion is more preferably 10% by mass or more and 70% by mass or less, still more preferably 20% by mass or more and 60% by mass or less, and particularly desirably 25% by mass or more and 50% by mass or less.

[0151] The proportion of the total of the monofunctional radically polymerizable compounds in the radically polymerizable compound (A1) (that is, the total of the monofunctional acrylic compound (Y2) and the monofunctional radically polymerizable compound (Z2)) with respect to the radically polymerizable compound (A1) is preferably 70% by mass or less. In this case, the generation of outgas caused by the monofunctional compound is less likely to occur. This proportion is more preferably 60% by mass or less, and still more preferably 50% by mass or less.

[0152] The photo radical polymerization initiator (B1) is not particularly limited as long as it is a compound that generates radical species when irradiated with light. The photo radical polymerization initiator (B1) preferably contains a compound that generates radical species when irradiated with light having a peak wavelength of 395 nm.

[0153] The photo radical polymerization initiator (B1) contains at least one compound selected from the group consisting of, for example, aromatic ketones, acylphosphine oxide compounds, aromatic onium salt compounds, organic peroxides, thio compounds (such as thioxanthone compounds and thiophenyl group-containing compounds), hexaarylbiimidazole compounds, oxime ester compounds, borate compounds, azinium compounds, metallocene compounds, active ester compounds, compounds having a carbon-halogen bond, and alkylamine compounds.

[0154] The ratio of the photo radical polymerization initiator (B1) to the radical polymerizable compound (A1) is preferably 6% by mass or more. In this case, the composition (X) can have good photocurability and can also have good photocurability under a good atmosphere. If this ratio is 7% by mass or more, it is more preferable, and if it is 8% by mass or more, it is even more preferable. Also, this ratio is, for example, 30% by mass or less, preferably 20% by mass or less, and even more preferably 18% by mass or less.

[0155] The photo radical polymerization initiator (B1) preferably contains a photo radical polymerization initiator (B1) having photobleaching properties. In this case, the cured product of the composition (X) is likely to have good light transmittance. The ratio of the photo radical polymerization initiator (B1) to the radical polymerizable compound (A1) is preferably 3% by mass or more. If this ratio is 7% by mass or more, it is more preferable, and if it is 8% by mass or more, it is even more preferable. Also, this ratio is, for example, 30% by mass or less, preferably 25% by mass or less, and even more preferably 20% by mass or less.

[0156] The photo radical polymerization initiator (B1) contains at least one of, for example, an acylphosphine oxide-based photoinitiator and a compound having photobleaching properties among oxime ester-based photoinitiators.

[0157] It is also preferable that the photo radical polymerization initiator (B1) contains a component having a sensitizer skeleton in the molecule. The sensitizer skeleton includes, for example, at least one of a 9H-thioxanthen-9-one skeleton and an anthracene skeleton. That is, it is preferable that the photo radical polymerization initiator (B1) contains a component having at least one of a 9H-thioxanthen-9-one skeleton and an anthracene skeleton.

[0158] Regardless of the presence or absence of photobleaching property, it is also preferable that the photo radical polymerization initiator (B1) contains an oxime ester-based photoinitiator. The oxime ester-based photoinitiator can improve the curability of the composition (X). Therefore, the composition (X) can be easily cured even in an environment containing oxygen such as an air atmosphere, and the generation of outgas from the cured product can be made less likely.

[0159] In order to make it less likely to cause contamination of the composition (X) and the manufacturing apparatus due to the generation of decomposition products from the composition (X), and to further make it less likely to generate outgas from the cured product, the oxime ester-based photoinitiator preferably contains a compound having an aromatic ring, more preferably contains a compound having a condensed ring containing an aromatic ring, and even more preferably contains a compound having a condensed ring containing a benzene ring and a hetero ring.

[0160] The oxime ester-based photoinitiator can contain at least one compound selected from the group consisting of oxime ester-based photoinitiators such as 1,2-octadione-1-[4-(phenylthio)-,2-(o-benzoyloxime)], and ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-, 1-(o-acetoxime), and those described in JP-A-2000-80068, JP-A-2001-233842, JP-T-2010-527339, JP-T-2010-527338, JP-A-2013-041153, and JP-A-2015-93842. The oxime ester-based photoinitiator may contain at least one compound selected from the group consisting of commercially available Irgacure OXE-02 (manufactured by BASF), Adeka Arcles NCI-831, N-1919 (manufactured by ADEKA), and TR-PBG-304 (manufactured by Changzhou Qiangli Electronic New Materials Co., Ltd.) having a carbazole skeleton, Irgacure OXE-01 having a diphenyl sulfide skeleton, Adeka Arcles NCI-930 (manufactured by ADEKA), TR-PBG-345, and TR-PBG-3057 (manufactured by Changzhou Qiangli Electronic New Materials Co., Ltd. above), and TR-PBG-365 (manufactured by Changzhou Qiangli Electronic New Materials Co., Ltd.) and SPI-04 (manufactured by Sanso) having a fluorene skeleton. In particular, when the oxime ester-based photoinitiator contains a compound having a diphenyl sulfide skeleton or a fluorene skeleton, it is preferable in that the cured product is less likely to be colored by photobleaching. It is also preferable that the oxime ester-based photoinitiator contains a compound having a carbazole skeleton in that the exposure sensitivity is likely to increase.

[0161] It is also preferable that the oxime ester-based photoinitiator contains two or more kinds of compounds. In this case, for example, since the oxime ester-based photoinitiator contains two or more kinds of compounds having different exposure sensitivities, it is possible to reduce the amount of the photo radical polymerization initiator (B1) while maintaining good exposure sensitivity, so that outgas is less likely to be generated from the cured product.

[0162] The oxime ester compound having photo-bleaching property contains at least one of, for example, the compound represented by the following formula (401) and the compound represented by the following formula (402). Among these, since the compound represented by formula (402) is particularly highly sensitive, it is particularly easy to enhance the photocurability of the composition (X), and therefore it is easy to realize the photocurability of the composition (X) in an air atmosphere.

[0163]

Chemical formula

[0164]

Chemical formula

[0165] When the photo-radical polymerization initiator (B1) contains an acylphosphine oxide compound, even if the ultraviolet absorber (C) is contained, the reactivity of the composition (X) when irradiated with light is more likely to be higher, and particularly when irradiated with light having a wavelength of 395 nm, the reactivity of the composition (X) is likely to be high. The percentage of the acylphosphine oxide compound with respect to the whole photo-radical polymerization initiator (B1) is preferably 50% by mass or more, more preferably 60% by mass or more, and still more preferably 70% by mass or more. The acylphosphine oxide compound contains, for example, at least one selected from the group consisting of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0166] In addition to the photo-radical polymerization initiator (B1), the composition (X) may contain a polymerization accelerator. The polymerization accelerator contains, for example, amine compounds such as ethyl p-dimethylaminobenzoate, 2-ethylhexyl p-dimethylaminobenzoate, methyl p-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, and butoxyethyl p-dimethylaminobenzoate. Note that the components that the polymerization accelerator can contain are not limited to the above.

[0167] The cationic polymerizable compound (A2) will be described. When the photopolymerizable compound (A) contains the cationic polymerizable compound (A2), the cationic polymerizable compound (A2) contains, for example, at least one of a polyfunctional cationic polymerizable compound (W1) and a monofunctional cationic polymerizable compound (W2).

[0168] The polyfunctional cationic polymerizable compound (W1) can contain either one or both of a polyfunctional cationic polymerizable compound (W11) having no siloxane skeleton and a polyfunctional cationic polymerizable compound (W12) having a siloxane skeleton.

[0169] The polyfunctional cationic polymerizable compound (W11) has no siloxane skeleton and has two or more cationic polymerizable functional groups per molecule. The number of cationic polymerizable functional groups per molecule of the polyfunctional cationic polymerizable compound (W11) is preferably 2 to 4, and more preferably 2 to 3.

[0170] The cationic polymerizable functional group is, for example, at least one kind of group selected from the group consisting of a cyclic ether group and a vinyl ether group. The cyclic ether group is, for example, at least one of an epoxy group and an oxetane group.

[0171] The polyfunctional cationic polymerizable compound (W11) contains, for example, at least one compound selected from the group consisting of a polyfunctional alicyclic epoxy compound, a polyfunctional heterocyclic epoxy compound, a polyfunctional oxetane compound, alkylene glycol diglycidyl ether, and alkylene glycol monovinyl monoglycidyl ether.

[0172] The polyfunctional alicyclic epoxy compound contains, for example, either one or both of the compound represented by the following formula (1) and the compound represented by the following formula (20).

[0173]

Chemical formula

[0174] In formula (1), R 1 ~R 18 each is independently a hydrogen atom, a halogen atom, or a hydrocarbon group. The hydrocarbon group preferably has 1 to 20 carbon atoms. The hydrocarbon group is, for example, an alkyl group having 1 to 20 carbon atoms such as a methyl group, an ethyl group, or a propyl group; an alkenyl group having 2 to 20 carbon atoms such as a vinyl group or an allyl group; or an alkylidene group having 2 to 20 carbon atoms such as an ethylidene group or a propylidene group. The hydrocarbon group may contain an oxygen atom or a halogen atom. R 1 ~R 18 each is preferably independently a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, more preferably a hydrogen atom or a methyl group, and most preferably a hydrogen atom.

[0175] In formula (1), X is a single bond or a divalent organic group. The organic group is, for example, -CO-O-CH2-, and in this case, the compound represented by formula (1) is included in the above-mentioned compound (A02).

[0176] Examples of the compound represented by formula (1) include the compound represented by the following formula (1a) and the compound represented by the following formula (1b).

[0177]

Chemical formula

[0178]

Chemical formula

[0179]

Chemical formula

[0180] In formula (20), R 1 ~R 12 each is independently a hydrogen atom, a halogen atom, or a carbon number of 1 to It is a hydrocarbon group having 20 carbon atoms. The halogen atom is, for example, a fluorine atom, a chlorine atom, a bromine atom or an iodine atom. The hydrocarbon group having 1 to 20 carbon atoms is, for example, an alkyl group having 1 to 20 carbon atoms such as a methyl group, an ethyl group, a propyl group; an alkenyl group having 2 to 20 carbon atoms such as a vinyl group, an allyl group; or an alkylidene group having 2 to 20 carbon atoms such as an ethylidene group, a propylidene group. The hydrocarbon group having 1 to 20 carbon atoms may contain an oxygen atom or a halogen atom.

[0181] R 1 ~R 12 Each of them is preferably independently a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, more preferably a hydrogen atom or a methyl group, and most preferably a hydrogen atom.

[0182] Examples of the compound represented by the formula (20) include the tetrahydroindene diepoxide represented by the following formula (20a).

[0183]

Chemical formula

[0184] The polyfunctional heterocyclic epoxy compound contains, for example, a trifunctional epoxy compound as represented by the following formula (2).

[0185]

Chemical formula

[0186] The polyfunctional oxetane compound contains, for example, a bifunctional oxetane compound as represented by the following formula (3).

[0187]

Chemical formula

[0188] Alkylene glycol diglycidyl ether contains at least one compound selected from the group consisting of compounds represented by the following formulas (4) to (7).

[0189]

Chemical formula

[0190]

Chemical formula

[0191]

Chemical formula

[0192]

Chemical formula

[0193] Alkylene glycol monovinyl monoglycidyl ether contains a compound represented by the following formula (8), for example.

[0194]

Chemical formula

[0195] The compounds represented by each of the above formulas (2) to (8) are included in the above-mentioned compound (A02).

[0196] More specifically, the polyfunctional cationic polymerizable compound (W11) can contain at least one component selected from the group consisting of, for example, Celloxide 2021P and Celloxide 8010 manufactured by Daicel, TEPIC-VL manufactured by Nissan Chemical Industries, Ltd., OXT-221 manufactured by Toagosei Co., Ltd., and 1,3-PD-DEP, 1,4-BG-DEP, 1,6-HD-DEP, NPG-DEP, and butylene glycol monovinyl monoglycidyl ether manufactured by Yokkaichi Gosei Co., Ltd.

[0197] The polyfunctional cationically polymerizable compound (W11) preferably contains a polyfunctional alicyclic epoxy compound. In this case, the composition (X) can have particularly high cationic polymerization reactivity.

[0198] The polyfunctional alicyclic epoxy compound preferably contains either one or both of the compounds represented by formula (1) and the compounds represented by formula (20). In this case, the composition (X) can have higher cationic polymerization reactivity.

[0199] When the polyfunctional alicyclic epoxy compound contains the compound represented by formula (1), the compound represented by formula (1) preferably contains the compound represented by formula (1a). In this case, the composition (X) can have higher cationic polymerization reactivity and particularly low viscosity.

[0200] In addition, since the compound represented by formula (20) has low viscosity, when the composition (X) contains the compound represented by formula (20), the composition (X) can have good photocurability and particularly low viscosity. Furthermore, the compound represented by formula (20) has the property of being less volatile despite having low viscosity. Therefore, even when the composition (X) contains the compound represented by formula (20), the composition (X) is less likely to have a compositional change due to the volatilization of the compound represented by formula (20). For this reason, the composition (X) can be made to have a lower viscosity without impairing its storage stability by containing the compound represented by formula (20).

[0201] The compound represented by formula (20) can be synthesized, for example, by oxidizing a cyclic olefin compound having a tetrahydroindene skeleton using an oxidizing agent.

[0202] The compound represented by formula (20) may contain four stereoisomers based on the configuration of the two epoxy rings. The compound represented by formula (20) may contain any of the four stereoisomers. That is, the compound represented by formula (20) can contain at least one component selected from the group consisting of the four stereoisomers. The percentage of the total amount of the exo - endo form and the endo - endo form among the four stereoisomers in the compound represented by formula (20) is preferably 10% by mass or less, more preferably 5% by mass or less, based on the whole epoxy compound (A1). In this case, the heat resistance of the cured product can be improved. The percentage of a specific stereoisomer in the compound represented by formula (20) can be determined based on the peak area ratio appearing in the chromatogram obtained by gas chromatography.

[0203] In order to reduce the amounts of the exo - endo form and the endo - endo form in the compound represented by formula (20), appropriate methods such as a method of precision distillation of the compound represented by formula (20) and a method of applying column chromatography using silica gel or the like as a filler can be applied.

[0204] When the composition (X) contains a polyfunctional cationically polymerizable compound (W11), the percentage of the polyfunctional cationically polymerizable compound (W11) relative to the total amount of the resin component is preferably 5% by mass or more and 95% by mass or less. Here, the resin component refers to a compound having cationic polymerizability in the composition (X), and includes a polyfunctional cationically polymerizable compound (W1) and a monofunctional cationically polymerizable compound (W2). If the percentage of the polyfunctional cationically polymerizable compound (W11) is 5% by mass or more, the composition (X) can have particularly excellent reactivity during the photocationic polymerization reaction, and thereby the cured product can have high strength (hardness). Further, if the percentage of the polyfunctional cationically polymerizable compound (W11) is 95% by mass or less, when the composition (X) contains a moisture absorbent (E), the moisture absorbent (E) can be particularly uniformly dispersed in the composition (X). The percentage of this polyfunctional cationically polymerizable compound (W11) is more preferably 12% by mass or more, still more preferably 15% by mass or more, still more preferably 20% by mass or more, and particularly preferably 25% by mass or more. Also, the percentage of this polyfunctional cationically polymerizable compound (W11) is more preferably 85% by mass or less, and still more preferably 60% by mass or less. For example, it is preferable that the percentage of the polyfunctional cationically polymerizable compound (W11) is in the range of 20 to 60% by mass.

[0205] When the polyfunctional cationically polymerizable compound (W11) contains a polyfunctional alicyclic epoxy compound, the polyfunctional alicyclic epoxy compound may be part or all of the polyfunctional cationically polymerizable compound (W11). The percentage of the polyfunctional alicyclic epoxy compound relative to the polyfunctional cationically polymerizable compound (W11) is preferably 15% by mass or more and 100% by mass or less. When this percentage is 15% by mass or more, the polyfunctional alicyclic epoxy compound can particularly contribute to the improvement of the photocurability of the composition (X).

[0206] The polyfunctional cationically polymerizable compound (W12) has a siloxane skeleton and two or more cationically polymerizable functional groups per molecule. The number of cationically polymerizable functional groups per molecule of the polyfunctional cationically polymerizable compound (W12) is preferably 2 to 6, and more preferably 2 to 4. The polyfunctional cationically polymerizable compound (W12) can contribute to the improvement of the cationic polymerization reactivity of the composition (X), and can also contribute to the improvement of the heat discoloration resistance of the cured product and the optical component. The polyfunctional cationically polymerizable compound (W12) can also contribute to the reduction of the elastic modulus of the cured product and the optical component. When the composition (X) contains a moisture absorbent, the polyfunctional cationically polymerizable compound (W12) can also contribute to the improvement of the dispersibility of the moisture absorbent in the composition (X) and the cured product.

[0207] The polyfunctional cationically polymerizable compound (W12) is preferably a liquid at 25°C. In particular, the viscosity of the polyfunctional cationically polymerizable compound (W12) at 25°C is preferably in the range of 10 to 300 mPa·s. In this case, an increase in the viscosity of the composition (X) can be suppressed.

[0208] The cationically polymerizable functional group that the polyfunctional cationically polymerizable compound (W12) has is at least one group selected from the group consisting of, for example, an epoxy group, an oxetane group, and a vinyl ether group.

[0209] The siloxane skeleton that the polyfunctional cationically polymerizable compound (W12) has may be linear, branched, or cyclic. The number of Si atoms in the siloxane skeleton is preferably in the range of 2 to 14. In this case, the composition (X) can have a particularly low viscosity. The number of these Si atoms is more preferably in the range of 2 to 10, still more preferably in the range of 2 to 7, and particularly preferably in the range of 3 to 6.

[0210] The polyfunctional cationically polymerizable compound (W12) contains at least one of, for example, the compound represented by formula (10) and the compound represented by formula (11).

[0211]

Chemical formula

[0212]

Chem.

[0213] In each of Formula (10) and Formula (11), R is a single bond or a divalent organic group, preferably an alkylene group. Y is a siloxane skeleton, which may be linear, branched or cyclic, and the number of its Si atoms is preferably in the range of 2 to 14, more preferably in the range of 2 to 10, still more preferably in the range of 2 to 7, and particularly preferably in the range of 3 to 6. n is an integer of 2 or more, and preferably in the range of 2 to 4.

[0214] More specifically, for example, the polyfunctional cationic polymerizable compound (W12) contains a compound represented by the following formula (10a).

[0215]

Chem.

[0216] In formula (10a), R is a single bond or a divalent organic group, preferably an alkylene group having 1 to 4 carbon atoms. n in formula (10a) is an integer of 0 or more. n is preferably in the range of 0 to 12, more preferably in the range of 0 to 8, still more preferably in the range of 0 to 5, and particularly preferably in the range of 1 to 4.

[0217] The compound represented by formula (10a) preferably contains a compound represented by formula (30) described below. That is, the polyfunctional cationic polymerizable compound (W12) preferably contains a compound represented by the following formula (30).

[0218] More specifically, the polyfunctional cationically polymerizable compound (W12) preferably contains at least one component selected from the group consisting of product numbers X-40-2669, X-40-2670, X-40-2715, X-40-2732, X-22-169AS, X-22-169B, X-22-2046, X-22-343, X-22-163, and X-22-163B manufactured by Shin-Etsu Chemical Co., Ltd.

[0219] The polyfunctional cationically polymerizable compound (W12) preferably has an alicyclic epoxy structure, and it is particularly preferable if the polyfunctional cationically polymerizable compound (W12) contains the compound represented by formula (10a). The compound represented by formula (10a) can particularly contribute to improving the cationic polymerization reactivity and reducing the viscosity of the composition (X), and can also particularly contribute to improving the heat discoloration resistance and reducing the elastic modulus of the cured product and optical components. When the composition (X) contains the moisture absorbent (E), it can also particularly contribute to improving the dispersibility of the moisture absorbent (E) in the composition (X).

[0220] When the composition (X) contains the polyfunctional cationically polymerizable compound (W12), the percentage of the polyfunctional cationically polymerizable compound (W12) with respect to the total amount of the resin components is preferably 5% by mass or more and 95% by mass or less. In this case, particularly when the composition (X) contains the moisture absorbent (E), the dispersibility of the moisture absorbent (E) in the composition (X) and the cured product is particularly improved, and the composition (X) can have particularly high photocationic polymerization reactivity.

[0221] The monofunctional cationically polymerizable compound (W2) has only one cationically polymerizable functional group per molecule. The cationically polymerizable functional group is at least one group selected from the group consisting of, for example, an epoxy group, an oxetane group, and a vinyl ether group.

[0222] The viscosity of the monofunctional cationic polymerizable compound (W2) at 25°C is preferably 8 mPa·s or less. In this case, even if the composition (X) does not contain a solvent, the monofunctional cationic polymerizable compound (W2) can reduce the viscosity of the composition (X). In particular, the viscosity of the monofunctional cationic polymerizable compound (W2) at 25°C is preferably in the range of 0.1 to 8 mPa·s.

[0223] The monofunctional cationic polymerizable compound (W2) can contain, for example, at least one compound selected from the group consisting of the compounds represented by the following formulas (12) to (17) and limonene oxide.

[0224]

Chemical formula

[0225]

Chemical formula

[0226]

Chemical formula

[0227]

Chemical formula

[0228]

Chemical formula

[0229]

Chemical formula

[0230] The compounds represented by each of the above formulas (12) to (14), (16) and (17) are included in the above-mentioned compound (A02).

[0231] The percentage of the monofunctional cationic polymerizable compound (W2) with respect to the total amount of the resin component is preferably 5% by mass or more and 50% by mass or less. If the percentage of the monofunctional cationic polymerizable compound (W2) is 5% by mass or more, the viscosity of the composition (X) can be particularly reduced. Also, if the percentage of the monofunctional cationic polymerizable compound (W2) is 50% by mass or less, the composition (X) can have particularly excellent reactivity during the photocationic polymerization reaction, and thereby the cured product can have high strength (hardness). This percentage of the monofunctional cationic polymerizable compound (W2) is more preferably 10% by mass or more, and even more preferably 15% by mass or more. Also, this percentage of the monofunctional cationic polymerizable compound (W2) is more preferably 40% by mass or less, even more preferably 35% by mass or less, and particularly preferably 30% by mass or less. If the percentage of the monofunctional cationic polymerizable compound (W2) is particularly 35% by mass or less, the volatilization amount of the components in the composition (X) during storage of the composition (X) can be effectively reduced, so that the properties of the composition (X) are less likely to be impaired even when the composition (X) is stored for a long time. Furthermore, the occurrence of tack in the cured product can be particularly suppressed. For example, it is preferable that the percentage of the monofunctional cationic polymerizable compound (W2) is in the range of 10 to 35% by mass.

[0232] Also, particularly when the composition (X) contains a polyfunctional cationic polymerizable compound (W11) and a polyfunctional cationic polymerizable compound (W12), with respect to the total amount of the resin component, the percentage of the polyfunctional cationic polymerizable compound (W11) is preferably 30% by mass or more and 60% by mass or less, the percentage of the polyfunctional cationic polymerizable compound (W12) is preferably 15% by mass or more and 30% by mass or less, and the percentage of the monofunctional cationic polymerizable compound (W2) is preferably 15% by mass or more and 40% by mass or less. In this case, good storage stability, low viscosity, and good cationic polymerization reactivity of the composition (X) can be achieved in a well-balanced manner, and furthermore, excellent transparency (visible light transmittance), excellent hygroscopicity, and high refractive index of the cured product can be achieved in a well-balanced manner.

[0233] If the cationic polymerizable compound (A2) contains the compound represented by the formula (3) and the compound represented by the formula (16), by adjusting the ratio of the two, while appropriately adjusting the ease of progress of the curing reaction when producing a photocured product from the composition (X), it is possible to achieve a reduction in the viscosity of the composition (X) and an improvement in storage stability.

[0234] The amount of the compound represented by the formula (16) is appropriately adjusted so that the composition (X) has the above characteristics. For example, the amount of the compound represented by the formula (16) is preferably 10% by mass or more and 40% by mass or less based on the total amount of the resin components.

[0235] The cationic polymerizable compound (A2) preferably contains a compound (f1) represented by the following formula (30) (hereinafter also referred to as an aromatic epoxy compound (f1)).

[0236]

Chemical formula

[0237] In the formula (30), X is at least one selected from the group consisting of a halogen, H, a hydrocarbon group, and an alkylene glycol group, and when there are a plurality of Xs in one molecule, they may be the same or different from each other. The hydrocarbon group is, for example, an alkyl group or an aryl group. When X is a hydrocarbon group, the number of carbon atoms of X is, for example, in the range of 1 to 10. R is a single bond or a divalent organic group. When R is a divalent organic group, the divalent organic group is, for example, an alkylene group, an oxyalkylene group, a carbonyloxyalkylene group (for example, -CO-O-CH2-), or a -C(Ph)2-O-CH2- group. Y is H or a monovalent organic group. When R is an oxyalkylene group or a carbonyloxyalkylene group, the compound represented by the formula (30) is included in the above-mentioned compound (A02). When Y is a monovalent organic group, the monovalent organic group is, for example, an alkyl group or an aryl group.

[0238] When the cationically polymerizable compound (A2) contains the aromatic epoxy compound (f1), since the aromatic epoxy compound (f1) has a low viscosity, the aromatic epoxy compound (f1) easily reduces the viscosity of the composition (X). Further, the aromatic epoxy compound (f1) is difficult to volatilize. Therefore, even when the composition (X) is stored, the composition (X) is less likely to change in composition due to the volatilization of the aromatic epoxy compound (f1). Therefore, the aromatic epoxy compound (f1) easily enhances the storage stability of the composition (X). Further, since the aromatic epoxy compound (f1) has high reactivity, unreacted components are less likely to remain in the cured product, and therefore it is difficult to generate outgas from the cured product. Furthermore, the aromatic epoxy compound (f1) easily increases the glass transition temperature of the cured product, and therefore it is easy to enhance the heat resistance of the cured product.

[0239] Further, when the aromatic epoxy compound (f1) is discharged from the composition (X) by an inkjet method, it is difficult to generate defective droplets called satellites.

[0240] It is preferable that R in the formula (30) is a single bond or an alkylene group. When n in the formula (30) is 2 or 3, it is preferable that at least one of the plurality of Rs in the formula (30) is a single bond or an alkylene group. In these cases, the reactivity of the aromatic epoxy compound (f1) is likely to increase, and therefore the curability of the composition (X) when the composition (X) is irradiated with ultraviolet rays is likely to increase.

[0241] The aromatic epoxy compound (f1) preferably contains at least one compound selected from the group consisting of the compounds represented by the following formulas (301) to (318), for example.

[0242]

Chemical formula

[0243] The compounds represented by each of the above formulas (306) to (311), (313), and (315) to (318) are included in the above-mentioned compound (A02).

[0244] In particular, it is preferable that the aromatic epoxy compound (f1) contains at least one component selected from the group consisting of the compounds represented by the formulas (301) to (305), (312), (314), and (318). Since at least one epoxy group (oxirane) in these compounds is bonded to the benzene ring by a single bond or an alkylene group, they tend to have high reactivity, and thus it is easy to enhance the curability of the composition (X).

[0245] The percentage of the aromatic epoxy compound (f1) with respect to the entire cationically polymerizable compound (A2) is preferably 5% by mass or more. In this case, the above-described action of the aromatic epoxy compound (f1) is particularly likely to be obtained. This percentage is also preferably 95% by mass or less. In this case, the storage stability of the composition (X) tends to be good. More preferably, this percentage is 10% by mass or more and 90% by mass or less, and even more preferably 20% by mass or more and 85% by mass or less.

[0246] The cationically polymerizable compound (A2) may contain a compound (f2) having an oxyalkylene skeleton. The oxyalkylene skeleton is a linear skeleton composed of one or more linear oxyalkylene units. The compound (f2) having an oxyalkylene skeleton is included in the above-described compound (A02).

[0247] When the cationically polymerizable compound (A2) contains the compound (f2), since the compound (f2) has a low viscosity, the compound (f2) easily reduces the viscosity of the composition (X). In addition, the compound (f2) is hardly volatile, and thus even when the composition (X) is stored, the composition of the composition (X) hardly changes due to the volatilization of the aromatic epoxy compound (f1). Therefore, the compound (f2) easily enhances the storage stability of the composition (X).

[0248] In addition, when the composition (X) is ejected by an inkjet method, the compound (f2) is less likely to generate defective droplets called satellites. Furthermore, even if the ejection speed of the droplets ejected by the inkjet method is increased, the compound (f2) can be made less likely to generate satellites. Therefore, depending on the inkjet conditions, for example, it is possible to set the ejection speed of the droplets by the inkjet method to 4 m / s or more without generating satellites. If the droplet speed can be increased, the trajectory of the droplets is less likely to be affected by disturbances, so the dimensional accuracy of the cured product produced from the composition (X) can be improved. Furthermore, since the compound (f2) can improve the storage stability of the composition (X) as described above, even when the composition (X) is stored for a long time, the characteristics of the composition (X) of being less likely to generate satellites are likely to be maintained.

[0249] The oxyalkylene skeleton preferably contains a structure of "-C-C-O-", that is, an oxyethylene unit in particular. In this case, satellites are particularly unlikely to occur, and for example, even when the driving frequency when ejecting the composition (X) by an inkjet method is varied, satellites are less likely to occur. Also, the compound (f2) is less likely to volatilize, is more likely to have a lower viscosity, and is more likely to enhance the affinity (wettability) for the inorganic material of the composition (X).

[0250] The number of oxyalkylene units in the oxyalkylene skeleton in the compound (f2) is preferably 1 or more and 8 or less. In this case, since the compound (f2) is more likely to have a lower viscosity, satellites are particularly unlikely to occur, and since the crosslink density of the cured product is likely to be high, the glass transition temperature of the cured product is particularly likely to be high. It is more preferable that the number of these oxyalkylene units is 1 or more and 6 or less, and even more preferable that it is 1 or more and 4 or less.

[0251] Note that a substituent other than hydrogen may be bonded to the oxyalkylene unit in the oxyalkylene skeleton in the compound (f2). For example, the oxyethylene unit contained in the oxyalkylene skeleton may have a structure of "-CH(CH3)-CH2-O-".

[0252] The percentage of the compound (f2) is preferably 10% by mass or more with respect to the cationically polymerizable compound (A2). In this case, the inkjet property becomes good and the wettability to the substrate improves. It is also preferable that this percentage is 70% by weight or less. In this case, the glass transition temperature can be sufficiently increased. More preferably, this percentage is 15% by mass or more and 60% by mass or less, and still more preferably 20% by mass or more and 50% by mass or less.

[0253] The compound (f2) contains at least one compound selected from, for example, a compound (f21) having an oxyalkylene skeleton and an epoxy group, and a compound (f22) having an oxyalkylene group and an oxetane group.

[0254] The compound (f21) contains at least one compound selected from the group consisting of, for example, the compounds represented by the above formula (1b), the compounds represented by the formula (4), the compounds represented by the formula (5), the compounds represented by the formula (6), the compounds represented by the formula (7), the compounds represented by the formula (8), the compounds represented by the formula (13), the compounds represented by the formula (14), and the like. Note that the components that the compound (f21) can contain are not limited to the above.

[0255] The compound (f22) contains at least one compound selected from the group consisting of, for example, the compounds represented by the above formula (3), the compounds represented by the formula (12), the compounds represented by the formula (16), and the compounds represented by the formula (17). Note that the components that the compound (f22) can contain are not limited to the above.

[0256] When the composition (X) contains the cationically polymerizable compound (A2), the composition (X) preferably further contains a sensitizer. In this case, the composition (X) can have particularly high cationic polymerization reactivity. The sensitizer contains, for example, either one or both of 9,10-dibutoxyanthracene and 9,10-diethoxyanthracene. The percentage of the sensitizer with respect to the cationically polymerizable compound (A2) is preferably more than 0% by mass and within the range of 1% by mass or less. In this case, the sensitizer is less likely to inhibit the transparency (visible light transmittance) of the cured product, and thus the cured product can have good transparency (visible light transmittance).

[0257] When the composition (X) contains the cationically polymerizable compound (A2), the photopolymerization initiator (B) preferably contains a photo cationic polymerization initiator (B2). The photo cationic polymerization initiator (B2) is not particularly limited as long as it is a catalyst that generates a protonic acid or a Lewis acid upon light irradiation. The photo cationic polymerization initiator (B2) preferably contains a catalyst that generates a protonic acid or a Lewis acid upon light irradiation with a peak wavelength of 395 nm. The photo cationic polymerization initiator (B2) can contain at least one of an ionic photoacid-generating type cationic curing catalyst and a non-ionic photoacid-generating type cationic curing catalyst.

[0258] The ionic photoacid-generating type cationic curing catalyst can contain at least one of onium salts and organometallic complexes. Examples of onium salts include aromatic diazonium salts, aromatic halonium salts, and aromatic sulfonium salts. Examples of organometallic complexes include iron-allyl complexes, titanocene complexes, and arylsilanol-aluminum complexes. The ionic photoacid-generating type cationic curing catalyst can contain at least one of these components.

[0259] The nonionic photoacid-generating cationic curing catalyst can contain at least one component selected from the group consisting of, for example, nitrobenzyl esters, sulfonic acid derivatives, phosphate esters, phenolsulfonic acid esters, diazonaphthoquinones, and N-hydroxyimide phosphonates. Note that the components that the nonionic photoacid-generating cationic curing catalyst can contain are not limited to those described above.

[0260] More specific examples of the compounds that the photo cationic polymerization initiator (B2) can contain are the DPI series (105, 106, 109, 201, etc.), BI-105, MPI series (103, 105, 106, 109, etc.), BBI series (101, 102, 103, 105, 106, 109, 110, 200, 210, 300, 301, etc.), TSP series (102, 103, 105, 106, 109, 200, 300, 1000, etc.), HDS-109, MDS series (103, 105, 109, 203, 205, 209, etc.), BDS-109, MNPS-109, DTS series (102, 103, 105, 200, etc.), NDS series (103, 105, 155, 165, etc.), DAM series (101, 102, 103, 105, 201, etc.), SI series (105, 106 such as), PI-106, NDI series (105, 106, 109, 1001, 1004, etc.), PAI series (01, 101, 106, 1001, 1002, 1003, 1004, etc.), MBZ-101, PYR-100, NB series (101, 201, etc.), NAI series (100, 1002, 1003, 1004, 101, 105, 106, 109, etc.), TAZ series (100, 101, 102, 103, 104, 107, 108, 109, 110, 113, 114, 118, 122, 123, 203, 204, etc.), NBC-101, ANC-101, TPS-Acetate, DTS-Acetate, Di-Boc Bisphinol A, tert-Butyl lithocholate, tert-Butyl deoxycholate, tert-Butyl cholate, BX, BC-2, MPI-103, BDS-105, TPS-103, NAT-103, BMS-105, and TMS-105; Silicyure UVI-6970, Silicyure UVI-6974, Silicyure UVI-6990, and Silicyure UVI-950 manufactured by Union Carbide Corporation of the United States; Irgacure 250, Irgacure 261, and Irgacure 264 manufactured by BASF; CG-24-61 manufactured by Ciba-Geigy; Adeka Optomer SP-150, Adeka Optomer SP-151, Adeka Optomer SP-170, and Adeka Optomer SP-171 manufactured by ADEKA Corporation; DAICAT II manufactured by Daicel Corporation; UVAC1590 and UVAC1591 manufactured by Daicel Cytec Corporation; CI-2064, CI-2639, CI-2624, CI-2481, CI-2734, CI-2855, CI-2823, CI-2758, and CIT-1682 manufactured by Nippon Soda Co., Ltd.; PI-2074, which is tetrakis(pentafluorophenyl)borate toluylcumyliodonium salt manufactured by Rhodia; FFC509 manufactured by 3M; CD-1010, CD-1011, and CD-1012 manufactured by Sartomer Company, USA; CPI-100P, CPI-101A, CPI-110P, CPI-110A, and CPI-210S manufactured by San-Apro Limited; and UVI-6992 and UVI-6976 manufactured by Dow Chemical Company. The photo cationic polymerization initiator (B2) can contain at least one compound selected from the group consisting of these compounds.

[0261] The photo cationic polymerization initiator (B2) preferably has a triaryl sulfonate type cation. In particular, it is preferable that the photo cationic polymerization initiator (B2) contains a salt having at least one cation selected from the group consisting of the cations represented by the following formula (61), the cation represented by formula (62), the cation represented by formula (63), and the cation represented by the following formula (64). In this case, the photo cationic polymerization initiator (B2) can effectively promote the reaction of the cation polymerizable compound (A2) by receiving light irradiation with a peak wavelength of 395 nm.

[0262]

Chemical formula

[0263]

Chemical formula

[0264]

Chemical formula

[0265]

Chemical formula

[0266] It is also preferable that the photo cationic polymerization initiator (B2) contains a salt having a (perfluoroalkyl) fluorophosphate anion. In this case, the transparency (visible light transmittance) of the cured product is likely to increase. The percentage of the salt having a (perfluoroalkyl) fluorophosphate anion with respect to the total photo cationic polymerization initiator (B2) is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and still more preferably 0.8% by mass or more.

[0267] (Perfluoroalkyl) fluorophosphate anion is (Rf) n PF 6-n - represented by. Rf is a perfluoroalkyl group, and n is any number from 1 to 5. The number of carbon atoms in Rf is, for example, 1 or more and 3 or less. When there are a plurality of Rfs (when n is 2 or more), Rfs may be the same or different from each other.

[0268] It is also preferable that the salt having a (perfluoroalkyl) fluorophosphate anion has a triarylsulfonate type cation, that is, it is a salt of a triarylsulfonate type cation and a (perfluoroalkyl) fluorophosphate anion.

[0269] The percentage of the photo cationic polymerization initiator (B2) with respect to the cationically polymerizable compound (A2) is preferably 1% by mass or more and 4% by mass or less. When this percentage is 1% by mass or more, the composition (X) can have particularly good cationic polymerization reactivity. Further, when this percentage is 4% by mass or less, the composition (X) can have good storage stability, and the production cost can be reduced by not containing an excessive photo cationic polymerization initiator (B2).

[0270] The composition (X) may further contain a moisture absorbent (E). When the composition (X) contains the moisture absorbent (E), the cured product of the composition (X) can have moisture absorption properties. Therefore, the encapsulant 5 containing the cured product can further prevent moisture from entering the light-emitting element 4 in the light-emitting device 1. The average particle size of the moisture absorbent (E) is preferably 200 nm or less. In this case, the cured product can have high transparency (visible light transmittance).

[0271] The moisture absorbent (E) is preferably inorganic particles having moisture absorption properties, and preferably contains at least one component selected from the group consisting of zeolite particles, silica gel particles, calcium chloride particles, and titanium oxide nanotube particles. It is particularly preferable that the moisture absorbent (E) contains zeolite particles.

[0272] Zeolite particles with an average particle size of 200 nm or less can be produced, for example, by pulverizing common industrial zeolite. When producing zeolite particles, the zeolite may be pulverized and then crystallized by hydrothermal synthesis or the like. In this case, the zeolite particles can have particularly high moisture absorption properties. Examples of such methods for producing zeolite particles are disclosed in JP-A-2016-69266 and JP-A-2013-049602.

[0273] The zeolite particles preferably contain sodium ions. Therefore, the zeolite particles are preferably produced from at least one selected from the group consisting of type A zeolite, type X zeolite, and type Y zeolite. It is particularly preferable that the zeolite particles are produced from 4A zeolite among type A zeolites. In these cases, the zeolite particles have a crystal structure suitable for adsorbing moisture.

[0274] The pH of the zeolite particles is preferably 7 or more and 10 or less. When the pH of the zeolite particles is 7 or more, the crystals of the zeolite particles are less likely to be destroyed, and therefore the cured product of the composition (X) containing the zeolite particles can have particularly high hygroscopicity. Further, when the pH of the zeolite particles is 10 or less, the zeolite particles are less likely to inhibit the curing when the composition (X) is cured. The pH of the zeolite particles is a value obtained by measuring the pH of the supernatant of the dispersion liquid with a pH meter after heating a dispersion liquid obtained by adding 0.05 g of zeolite particles to 99.95 g of ion-exchanged water at 90 °C for 24 hours. As the pH meter, for example, a compact pH meter manufactured by Horiba, Ltd. <laquatwin>B-711 can be used.

[0275] The average particle diameter of the moisture absorbent (E) is preferably 10 nm or more and 200 nm or less. If this average particle diameter is 200 nm or less, the cured product can have particularly high transparency (visible light transmittance). Further, if this average particle diameter is 10 nm or more, good moisture absorbency of the moisture absorbent (E) can be maintained. Note that this average particle diameter is the median diameter, that is, the cumulative 50% diameter (D50), calculated from the measurement result by the dynamic light scattering method. Note that as the measuring device, the Nanotrac Wave series of Microtrac Bell Co., Ltd. can be used.

[0276] The average particle diameter of the moisture absorbent (E) is more preferably 150 nm or less, still more preferably 100 nm or less, and particularly preferably 70 nm or less. Further, the average particle diameter of the moisture absorbent (E) is preferably 20 nm or more, and more preferably 50 nm or more. In this case, the cured product can have particularly good transparency (visible light transmittance) and moisture absorbency.

[0277] It is also preferable that the cumulative 90% diameter (D90) of the moisture absorbent (E) is 100 nm or less. In this case, the cured product can have particularly high transparency (visible light transmittance).

[0278] When the composition (X) contains the moisture absorbent (E), the percentage of the moisture absorbent (E) with respect to the total amount of the composition (X) is preferably 1% by mass or more and 20% by mass or less. If the percentage of the moisture absorbent (E) is 1% by mass or more, the cured product can have particularly high moisture absorbency. Further, if the percentage of the moisture absorbent (E) is 20% by mass or less, the viscosity of the composition (X) can be particularly reduced, and the composition (X) can also have a sufficiently low viscosity to be applicable by the inkjet method. The percentage of the moisture absorbent (E) is more preferably 3% by mass or more, and particularly preferably 5% by mass or more. Further, the percentage of the moisture absorbent (E) is more preferably 15% by mass or less, and particularly preferably 13% by mass or less.

[0279] The composition (X) may further contain an inorganic filler other than the moisture absorbent (E). For example, the composition (X) may contain nano-sized high refractive index particles. Examples of the high refractive index particles include zirconia particles. When the composition (X) contains high refractive index particles, the refractive index of the cured product can be increased while maintaining good transparency (visible light transmittance) of the cured product. Therefore, when the cured product is applied to an optical component, the light extraction efficiency of the light transmitted through the optical component and emitted to the outside can be improved. The average particle size of the high refractive index particles is preferably in the range of 5 to 30 nm, and more preferably in the range of 10 to 20 nm.

[0280] The percentage of the high refractive index particles in the composition (X) is appropriately designed so that the cured product has a desired refractive index. In particular, the high refractive index particles are preferably contained in the composition (X) so that the refractive index of the cured product is in the range of 1.45 or more and less than 1.55. In this case, the light extraction efficiency of the light emitting device 1 is particularly improved.

[0281] When the composition (X) contains the moisture absorbent (E), the composition (X) preferably further contains a dispersant (F). In this case, the dispersant (F) can improve the dispersibility of the moisture absorbent (E) in the composition (X). Therefore, in the composition (X), an increase in viscosity and a decrease in storage stability due to the moisture absorbent (E) are less likely to occur.

[0282] The dispersant (F) is a surfactant that can adsorb onto the particles. The dispersant (F) has an adsorption group (generally also referred to as an anchor) that can be adsorbed onto the particles and a molecular backbone (generally also referred to as a tail) that adheres to the particles when the adsorption group is adsorbed onto the particles. The dispersant (F) contains at least one component selected from the group consisting of, for example, an acrylic dispersant in which the tail is an acrylic molecular chain, a urethane dispersant in which the tail is a urethane molecular chain, and a polyester dispersant in which the tail is a polyester molecular chain. The adsorption group contains at least one of, for example, a basic polar functional group and an acidic polar functional group. The basic polar functional group contains at least one group selected from the group consisting of, for example, an amino group, an imino group, an amide group, an imide group, and a nitrogen-containing heterocyclic group. The acidic polar functional group contains at least one group selected from the group consisting of, for example, a carboxyl group and a phosphate group. The dispersant (F) can contain at least one compound selected from the group consisting of, for example, the Solsperse series manufactured by Nippon Lubrizol Corporation, the DISPERBYK series manufactured by BYK-Chemie Japan Co., Ltd., and the AJISPER series manufactured by Ajinomoto Fine-Techno Co., Ltd.

[0283] When the composition (X) contains the moisture absorbent (E), the amount of the dispersant (F) relative to 100 parts by mass of the moisture absorbent (E) is preferably 5 parts by mass or more and 60 parts by mass or less. When the amount of the dispersant (F) is 5 parts by mass or more, the function of the dispersant (F) can be effectively exhibited, and when it is 60 parts by mass or less, it is possible to suppress the inhibition of the adhesion between the free molecules of the dispersant (F) in the cured product and the member made of the inorganic material by the cured product. Further, the amount of the dispersant (F) is more preferably 15 parts by mass or more, more preferably 50 parts by mass or less, still more preferably 40 parts by mass or less, and particularly preferably 30 parts by mass or less.

[0284] The structure of the light-emitting device 1 will be described. The light-emitting device 1 includes a light source and an optical component that transmits the light emitted by the light source. For example, the light-emitting device 1 includes a light-emitting element 4, a sealing material 5 that covers the light-emitting element 4, and a passivation layer 6. In this case, the light-emitting element 4 is the light source, the sealing material 5 is the optical component, and the passivation layer 6 is an inorganic layer. The sealing material 5 and the passivation layer 6 overlap each other.

[0285] The light-emitting element 4 includes, for example, a light-emitting diode. The light-emitting diode includes, for example, at least one of an organic EL element (organic light-emitting diode) and a micro light-emitting diode. When the light-emitting element 4 includes an organic light-emitting diode, the light-emitting device 1 including the light-emitting element 4 is, for example, an organic EL display. When the light-emitting element 4 includes a micro light-emitting diode, the light-emitting device 1 including the light-emitting element 4 is, for example, a micro LED display. Note that EL is an abbreviation for electroluminescence.

[0286] An example of the structure of the light-emitting device 1 will be described with reference to FIG. 1. This light-emitting device 1 is a top emission type. The light-emitting device 1 includes a support substrate 2, a transparent substrate 3 facing the support substrate 2 with a gap therebetween, a light-emitting element 4 on a surface of the support substrate 2 facing the transparent substrate 3, and a passivation layer 6 and a sealing material 5 that cover the light-emitting element 4.

[0287] The support substrate 2 is made of, for example, a resin material, but is not limited thereto. The transparent substrate 3 is made of a material having translucency. The transparent substrate 3 is, for example, a glass substrate or a transparent resin substrate. The light-emitting element 4 includes, for example, a pair of electrodes 41 and 43 and an organic light-emitting layer 42 between the electrodes 41 and 43. The organic light-emitting layer 42 includes, for example, a hole injection layer 421, a hole transport layer 422, an organic light-emitting layer 423, and an electron transport layer 424, and these layers are laminated in the above order.

[0288] The light-emitting device 1 includes a plurality of light-emitting elements 4, and the plurality of light-emitting elements 4 form an array 9 (hereinafter referred to as the element array 9) on the support substrate 2. The element array 9 also includes partition walls 7. The partition walls 7 are on the support substrate 2 and partition between two adjacent light-emitting elements 4. The partition walls 7 are produced, for example, by molding a photosensitive resin material by photolithography. The element array 9 also includes connection wirings 8 that electrically connect the electrodes 43 and the electron transport layers 424 of adjacent light-emitting elements 4. The connection wirings 8 are provided on the partition walls 7.

[0289] The passivation layer 6 is preferably made of silicon nitride or silicon oxide, and particularly preferably made of silicon nitride. In the example shown in FIG. 1, the passivation layer 6 includes a first passivation layer 61 and a second passivation layer 62. The first passivation layer 61 covers the element array 9 in a state of being in direct contact with the element array 9, thereby covering the light-emitting element 4. The second passivation layer 62 is disposed at a position opposite to the element array 9 with respect to the first passivation layer 61, and there is a gap between the second passivation layer 62 and the first passivation layer 61. A sealing material 5 is filled between the first passivation layer 61 and the second passivation layer 62. That is, the first passivation layer 61 is interposed between the light-emitting element 4 and the sealing material 5 that covers the light-emitting element 4.

[0290] Furthermore, a second sealing material 52 is filled between the second passivation layer 62 and the transparent substrate 3. The second sealing material 52 is made of, for example, a transparent resin material. The material of the second sealing material 52 is not particularly limited. The material of the second sealing material 52 may be the same as or different from that of the sealing material 5.

[0291] A method for producing the sealing material 5 using the composition (X) and a method for manufacturing the light-emitting device 1 will be described.

[0292] In this embodiment, it is preferable to produce the sealing material 5 by forming the composition (X) by an inkjet method and then irradiating the composition (X) with ultraviolet rays for curing. In this embodiment, it is possible to apply and form the composition (X) by an inkjet method.

[0293] When applying the composition (X) by an inkjet method, if the composition (X) has a sufficiently low viscosity at room temperature, for example, if the viscosity at 25°C is 30 mPa·s or less, particularly 15 mPa·s or less, it can be formed by applying the composition (X) by an inkjet method without heating.

[0294] When the composition (X) has the property of decreasing in viscosity when heated, the composition (X) may be heated and then applied and formed by an inkjet method. When the viscosity of the composition (X) at 40°C is 30 mPa·s or less, particularly 15 mPa·s or less, the composition (X) can be decreased in viscosity by merely heating it slightly, and this decreased-viscosity composition (X) can be ejected by an inkjet method. The heating temperature of the composition (X) is, for example, 20°C or higher and 50°C or lower.

[0295] More specifically, for example, first, the support substrate 2 is prepared. On one surface of this support substrate 2, the partition wall 7 is produced by a photolithography method using, for example, a photosensitive resin material. Subsequently, a plurality of light-emitting elements 4 are provided on one surface of the support substrate 2. The light-emitting element 4 can be produced by an appropriate method such as a vapor deposition method or a coating method. In particular, it is preferable to produce the light-emitting element 4 by a coating method such as an inkjet method. Thereby, the element array 9 is produced on the support substrate 2.

[0296] Next, a first passivation layer 61 is provided on the element array 9. The first passivation layer 61 can be produced by a vapor deposition method such as a plasma CVD method.

[0297] Next, the composition (X) is formed on the first passivation layer 61, for example, by an inkjet method to produce a coating film. If the inkjet method is applied to both the formation of the light-emitting element 4 and the application of the composition (X), the manufacturing efficiency of the light-emitting device 1 can be particularly improved. Subsequently, the composition (X) is cured by irradiating the coating film of the composition (X) with light to produce the encapsulant 5.

[0298] The peak wavelength of the light irradiated on the composition (X) is preferably around 395 nm. In the present embodiment, good curability of the composition (X) is easily obtained when irradiated with light having a wavelength of around 395 nm. The peak wavelength of the light irradiated on the composition (X) is, for example, 365 nm or more and 405 nm or less.

[0299] When irradiating the composition (X) with light, the composition (X) may be irradiated with light in an atmosphere containing oxygen such as an air atmosphere, or the composition (X) may be irradiated with light in an inert atmosphere such as a nitrogen atmosphere. In the present embodiment, as described above, since the oxygen ratio of the composition (X) is 75% by mass or less, even when the photopolymerizable compound (A) particularly contains the radical polymerizable compound (A1), oxygen inhibition hardly occurs. Therefore, even when the composition (X) is irradiated with ultraviolet rays in an atmosphere containing oxygen, the composition (X) is easily cured.

[0300] Next, a second passivation layer 62 is provided on the encapsulant 5. The second passivation layer 62 can be formed by a vapor deposition method such as a plasma CVD method.

[0301] Next, a photocurable resin material is provided on one surface of the support substrate 2 so as to cover the second passivation layer 62, and then the transparent substrate 3 is overlaid on this resin material. The transparent substrate 3 is, for example, a glass substrate or a transparent resin substrate.

[0302] Next, ultraviolet rays are irradiated from the outside toward the transparent substrate 3. The ultraviolet rays pass through the transparent substrate 3 and reach the photocurable resin material. Thereby, the photocurable resin material is cured to produce the second encapsulant 52.

[0303] In this embodiment, as described above, it is possible to less likely cause a decrease in luminous efficiency due to the passivation layer 6 and the encapsulant 5 in the light-emitting device 1.

[0304] The thickness of the encapsulant 5 is, for example, 1 μm or more and 50 μm or less. The thickness of the encapsulant 5 is more preferably 20 μm or less, and even more preferably 15 μm or less. In this case, by thinning the encapsulant 5, the light-emitting device 1 can be thinned, and it is also possible to obtain a flexible light-emitting device 1. Further, in order to effectively suppress moisture from reaching the light-emitting element 4 by the encapsulant 5, the thickness of the encapsulant 5 is preferably 3 μm or more, more preferably 5 μm or more, and even more preferably 8 μm or more.

[0305] The thickness of the passivation layer 6 overlapping the encapsulant 5 is, for example, 0.1 μm or more and 2 μm or less. When the passivation layer 6 includes the first passivation layer 61 and the second passivation layer 62 as described above, the thicknesses of the first passivation layer 61 and the second passivation layer 62 are each preferably 0.1 μm or more and 2 μm or less.

[0306] Note that the use of the composition (X) according to this embodiment is not limited to the production of the encapsulant 5 for the light-emitting element 4. The composition (X) can be used to produce various optical components that transmit light emitted by a light source. For example, the optical component may be a color resist. That is, for example, a phosphor may be contained in the composition (X), and a color resist in a color filter may be produced from this composition (X). This color filter can be provided in a display device such as an organic EL display or a micro LED display, which is a light-emitting device.

Examples

[0307] 1. Preparation of composition Compositions of Examples and Comparative Examples were prepared by mixing the components shown in the following table.

[0308] The details of the components shown in the table are as follows. Also, the viscosity of each of the following components was measured using a rheometer (manufactured by Anton Paar Japan, model number DHR-2) under the conditions of a temperature of 25°C and a shear rate of 1000 s -1 and is the value measured under these conditions. - Dicyclopentanyl acrylate: viscosity 10 mPa·s, with -R-O- skeleton. - N,N-Dimethylacrylamide: manufactured by KJ Chemicals, product number DMAA, viscosity 1 mPa·s, with -R-N- skeleton. - Urethane acrylate: manufactured by Daicel Ornex, product number KRM9276, viscosity 30 mPa·s, with -R-N- skeleton. - Acryloylmorpholine: viscosity 10 mPa·s, with -R-O- and -R-N- skeletons. - Tripropylene glycol diacrylate: viscosity 10 mPa·s, with -R-O- skeleton. - Polyethylene glycol diacrylate: viscosity 10 mPa·s, with -R-O- skeleton. - 1,9-Nonanediol diacrylate: viscosity 10 mPa·s, without -R-O- and -R-N- skeletons. - VEEA: 2-(2-Vinyloxyethoxy)ethyl acrylate, viscosity 4 mPa·s, glass transition temperature 40°C, boiling point 260°C, with -R-O-. - Ditrimethylolpropane tetraacrylate: viscosity 600 mPa·s, without -R-O- and -R-N- skeletons. - Celloxide 8010: manufactured by Daicel, product name Celloxide 8010, the compound shown in formula (1a), viscosity 60 mPa·s, without -R-O- and -R-N- skeletons. - OXT-221: 3-Ethyl-3-{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane (the compound shown in formula (3)), manufactured by Toagosei, product number OXT-221, viscosity 12 mP·s, with -R-O- skeleton. - Celloxide 2021P: 3’,4’-Epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, the compound shown in formula (1b), viscosity 250 mP·s, with -R-O- skeleton. -1,2,7,8-Octane diepoxide: Viscosity 3 mPa·s, without -R-O- and -R-N- skeletons. -X-40-2669: Manufactured by Shin-Etsu Chemical Co., Ltd., product number X-40-2669, the compound shown in formula (10a-1), viscosity 45 mPa·s, without -R-O- and -R-N- skeletons. -NBB-ME: Manufactured by ENEOS Corporation, product name NBB-ME, viscosity 13 mPa·s, without -R-O- and -R-N- skeletons. -AL-EOX: Manufactured by Yokkaichi Gosei Co., Ltd., product name AL-EOX, the compound shown in formula (16) (3-allyloxymethyl-3-ethyloxetane), viscosity 2 mPa·s, with -R-O- skeleton. -Ultraviolet absorber 1: A benzotriazole-based ultraviolet reactive absorber having a cationic polymerizable functional group, shown by the following formula.

[0309]

Chemical formula

[0310] -Ultraviolet absorber 2: A benzophenone-based reactive ultraviolet absorber having two hydroxyl groups and a cationic polymerizable functional group, shown by the following formula.

[0311]

Chemical formula

[0312] -Ultraviolet absorber 3: A benzophenone-based ultraviolet reactive absorber having one hydroxyl group and a cationic polymerizable functional group, shown by the following formula.

[0313]

Chemical formula

[0314] -Ultraviolet absorber 4: A benzotriazole-based reactive ultraviolet absorber having a radical polymerizable functional group, shown by the following formula.

[0315]

Chemical formula

[0316] - UV Absorbent 5: A benzophenone-based reactive UV absorbent having two hydroxyl groups and a radical polymerizable functional group, represented by the following formula.

[0317]

Chemical formula

[0318] - UV Absorbent 6: A benzophenone-based reactive UV absorbent having one hydroxyl group and a radical polymerizable functional group, represented by the following formula.

[0319]

Chemical formula

[0320] - UV Absorbent 7: A triazine-based UV absorbent without a reactive functional group, manufactured by BASF Japan Ltd., product name Tinuvin 970. The compound name is as follows 6-butyl-2-[2-hydroxy-3-(1-methyl-1-phenylethyl)-5-(1,1,3,3-tetramethylbutyl)phenyl]pyrrolo[3,4-f]benzotriazole-5,7(2H,6H)-dione - UV Absorbent 8: An indole-based UV absorbent without a reactive functional group, manufactured by Orient Chemical Industries Co., Ltd., product name BONASORB 3912. - UV Absorbent 9: An azomethine-based UV absorbent without a reactive functional group, manufactured by Orient Chemical Industries Co., Ltd., product name BONASORB 3701. - Omnirad TPO H: Manufactured by IGM Resins B.V., product name Omnirad TPO H, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, with photo-bleaching property. - CPI-210S: Manufactured by San-Apro Ltd., product name CPI-210S, a salt of the triarylsulfonate-type cation shown in formula (64) and (perfluoroalkyl)fluorophosphate anion. -CPI-410S: Manufactured by Sun-Apro Co., Ltd., product name CPI-410S, a salt of a triarylsulfonate-type cation and a (perfluoroalkyl)fluorophosphate anion. -UVS-1331: Manufactured by Kawasaki Kasei Chemicals Ltd., product name Antracure UVS-1331, an anthracene-based sensitizer shown in formula (702). -UVS-107: Manufactured by Kawasaki Kasei Chemicals Ltd., product name Antracure UVS-107, an anthracene-based sensitizer shown in formula (705). -Reactive anthracene-based sensitizer: An anthracene-based sensitizer having a structure shown in the following formula.

[0321]

Chemical formula

[0322] 2. Evaluation tests The following evaluation tests were carried out on the examples and comparative examples. The results are shown in the table.

[0323] (1) Viscosity The viscosity of the composition was measured using a rheometer (manufactured by Anton Paar Japan, model number DHR-2) at a temperature of 25°C and a shear rate of 1000 s -1 under the given conditions.

[0324] (2) Curing property (395 nm) An IR spectrum was obtained by measuring the composition with an infrared spectroscopic analyzer (manufactured by Agilent Technologies, model number Agilent Cary 610 FTIR microscope system).

[0325] The composition was applied to form a coating film with a thickness of 10 μm, and the coating film was irradiated with light having a peak wavelength of 395 nm using a UV irradiator (manufactured by USHIO Inc., model number E075IIHD) at an irradiation intensity of 3 W / cm 2 and an integrated light amount of 0.9 J / cm 2 under the given conditions. Subsequently, an IR spectrum was obtained by measuring the composition (cured product) after UV irradiation with the above infrared spectroscopic analyzer.

[0326] In each of the two IR spectra, the peak intensity of the absorption of the reactive functional group was measured. From the peak intensity I0 for the coating film and the peak intensity I1 for the cured product, using the formula {1 - (I0 - I1) / I0} × 100 (%), the reduction rate of the reactive functional group in the composition before and after ultraviolet irradiation was calculated. The result was taken as the reaction rate.

[0327] Note that the absorption of the reactive functional group is the absorption of the alicyclic epoxy group appearing at 885 cm -1 in Examples 1 to 14, and is the absorption of the acryloyl group appearing at 810 cm -1 in Examples 15 to 33 and Comparative Examples 1 and 2.

[0328] This result was evaluated as follows. A: 90% or more. B: 80 or more and less than 90% C: Less than 80%.

[0329] (3) Inkjet property The composition was put into the cartridge of an inkjet printer (manufactured by Fujifilm, model DMP2831), and droplets of the composition were ejected from the nozzles of the inkjet printer under the conditions of a temperature of 30 °C and a frequency of 1 kHz. These droplets were observed with a high-speed camera and evaluated as follows. As a result, the case where the droplets did not separate was rated as "A", the case where the satellite separated from the original droplet and then the satellite integrated with the original droplet to become one droplet again was rated as "B", and the case where the satellite separated from the original droplet and did not integrate was rated as "C".

[0330] (4) Glass transition temperature The composition was applied to form a coating film, and this coating film was irradiated with light having a peak wavelength of 395 nm using a UV irradiator (manufactured by USHIO INC., model number E075IIHD) in an air atmosphere, with an irradiation intensity of 3 W / cm 2 and an integrated light amount of 1.5 J / cm 2 By irradiating under the following conditions, the coating film was photocured to produce a film with a thickness of 500 μm. The glass transition temperature of a sample cut out from this film was measured using a viscoelasticity measuring device (manufactured by Hitachi High-Tech Sciences Corporation, model number DMA7100).

[0331] (5) Transmittance The composition was applied to form a coating film, and light with a peak wavelength of 395 nm was irradiated onto this coating film using a UV irradiator (manufactured by Ushio Inc., model number E075IIHD) at an irradiation intensity of 3 W / cm 2 and an integrated light amount of 1.5 J / cm 2 By irradiating under the conditions, the coating film was photocured to produce a film with a thickness of 15 μm.

[0332] The transmittances of light at wavelengths of 430 nm and 400 nm of this film were measured using a spectrophotometer (manufactured by Nippon Denshoku Industries Co., Ltd., model number SD7000).

[0333] (6) Bleed-out evaluation The composition was applied to form a coating film, and light with a peak wavelength of 395 nm was irradiated onto this coating film using a UV irradiator (manufactured by Ushio Inc., model number E075IIHD) at an irradiation intensity of 3 W / cm 2 and an integrated light amount of 1.5 J / cm 2 By irradiating under the conditions, the coating film was photocured to produce a film with a thickness of 15 μm. The obtained film was exposed for 500 hours under the conditions of 85 °C and 85 mass% relative humidity, and then the film was visually observed. When there was no spot-like pattern on the surface, it was evaluated as A. When spots were confirmed in part such as the film edge, it was evaluated as B. When spots were confirmed throughout, it was evaluated as C.

[0334] (7) Outgas evaluation The outgas when the cured product of the composition was heated was sampled by the headspace method and measured by gas chromatography. Specifically, first, 100 mg of the composition was placed in a headspace vial with a volume of 22 mL. Subsequently, light with a peak wavelength of 395 nm was irradiated onto the composition using a UV irradiator (manufactured by Ushio Inc., model number E075IIHD) in an air atmosphere at an irradiation intensity of 3 W / cm 2 And irradiate under the condition of an integrated light quantity of 1.5 J / cm 2 After the composition was cured by irradiation under the above conditions, the vial was sealed. Subsequently, the composition was heated at 100 °C for 30 minutes, and then the gas phase portion in the vial was introduced into a gas chromatograph for analysis. As a result, based on the peak area of the obtained gas chromatogram, the concentration of the outgas generated from the composition was specified. The concentration of the outgas is the volume fraction of the outgas in the gas phase of the vial with respect to the volume of the vial (22 mL).

[0335] Note that the concentration of the outgas was specified using toluene as a reference substance. Specifically, by volatilizing toluene in the vial, two reference samples with toluene concentrations of 1000 ppm and 100 ppm were prepared. Each reference sample was introduced into a gas chromatograph for analysis. From the peak areas of the two chromatograms thus obtained, the relationship between the peak area and the concentration was defined, and based on this result, the concentration of the above-mentioned outgas was specified.

[0336] The results were evaluated as follows. A: Concentration 200 ppm or less B: Concentration exceeds 200 ppm and is 300 ppm or less. C: Concentration exceeds 300 ppm.

[0337] (8) Storage stability The composition was stored at 60 °C for 336 hours. As a result, when there was no change in the color and viscosity of the composition, it was evaluated as "A", when at least one of yellowing and gelation was confirmed in the composition, it was evaluated as "B", and when the composition had hardened after storage, it was evaluated as "C".

[0338] (9) Device evaluation A glass substrate (thickness 700 μm) with a 30 mm square ITO electrode was cleaned using acetone and isopropanol respectively. Then, the following compounds were sequentially vapor-deposited by vacuum vapor deposition to form a thin film, and a substrate having a 2 mm square organic EL element composed of an anode / hole injection layer / hole transport layer / light-emitting layer / electron injection layer / cathode was obtained. The configuration of each layer is as follows. · Anode: ITO, film thickness of the anode 150 nm · Hole injection layer: 4,4’,4”-tris{2-naphthyl(phenyl)amino}triphenylamine (2-TNATA) · Hole transport layer: N,N’-diphenyl-N,N’-dinaphthylbenzidine (α-NPD) · Light-emitting layer: Tris(8-hydroxyquinolinato)aluminum (metal complex material), the film thickness of the light-emitting layer is 1000 Å, and the light-emitting layer also functions as an electron transport layer. · Electron injection layer: Lithium fluoride · Cathode: Aluminum, film thickness 150 nm Then, a mask (cover) with an opening of 10 mm × 10 mm was placed to cover the 2 mm × 2 mm organic EL element, and a SiN film was formed by plasma CVD method.

[0339] Next, the composition was applied with a thickness of 10 μm using an inkjet device in a nitrogen atmosphere to cover the 2 mm × 2 mm organic EL element, and the composition was cured under the conditions of a peak wavelength of 395 nm, an irradiation intensity of 3 W / cm 2 and an integrated light quantity of 1.5 J / cm 2 Thereby, a sealing material was prepared.

[0340] Subsequently, a mask (cover) with an opening of 10 mm × 10 mm was placed to cover the entire sealing material, and a SiN film was formed by plasma CVD method.

[0341] The thickness of the formed SiN film (inorganic film) was about 1 μm. Then, the SiN film was bonded to a 30 mm × 30 mm × 0.7 mmt non-alkali glass (Eagle XG manufactured by Corning) using a 30 mm × 30 mm × 25 μmt transparent base material double-sided tape to fabricate an organic EL light-emitting device.

[0342] The fabricated organic EL light-emitting device was exposed for 70 hours under the conditions of 85 °C and 85 mass% relative humidity, then a voltage of 6 V was applied, and the light-emitting state of the organic EL element was observed visually and with a microscope, and the diameter of the dark spot was measured.

[0343] The diameter of the dark spot can be regarded as an index for evaluating the degree of penetration of the encapsulant into the pinholes of the passivation layer and the degree of moisture in the encapsulant being discharged as outgas. The diameter of the dark spot was evaluated as "C" when it was more than 50 μm and 300 μm or less, "C" when it was 50 μm or less, and "A" when no dark spot was present.

[0344] (10) Device evaluation (Sunshine weather meter) The light resistance evaluation test of the device fabricated in (9) above was carried out using a sunshine weather meter (manufactured by Suga Test Instruments Co., Ltd., model number S80HB) under the conditions of an integrated light quantity of 236 W / m2, a black panel temperature of 63°C, and a test time of 400 hours. As a result, it was evaluated as "A" when the emission luminance of the device was 90% or more compared to the initial value, "B" when it was 80% or more and less than 90%, and "C" when it was less than 80%.

[0345]

Table 1

[0346]

Table 2

[0347]

Table 3

Claims

1. A photocurable resin composition containing a photopolymerizable compound (A) containing a radically polymerizable compound, a photoinitiator (B) containing a photoinitiating agent (B1) having photobleaching properties, an ultraviolet absorber (C), and a sensitizer (D), wherein the sensitizer (D) contains an anthracene-based sensitizer (D1) having an anthracene skeleton and a group represented by "-O-R10" bonded to the anthracene skeleton, wherein R10 is an organic group having no reactive group, and the number of atoms constituting the longest linear chain bonded to O in R10 is 2 to 10, wherein the ultraviolet absorber (C) contains at least one selected from the group consisting of benzotriazole-based ultraviolet absorbers, benzophenone-based ultraviolet absorbers, azomethine-based ultraviolet absorbers, indole-based ultraviolet absorbers, diazine-based ultraviolet absorbers, triazine-based ultraviolet absorbers, pyrazolidinedione-based ultraviolet absorbers, and ethylene-based ultraviolet absorbers, a photocurable resin composition.

2. A photocurable resin composition containing a photopolymerizable compound (A) containing a radically polymerizable compound, a photoinitiator (B) containing a photoinitiating agent (B1) having photobleaching properties, an ultraviolet absorber (C), and a sensitizer (D), wherein the sensitizer (D) contains an anthracene-based sensitizer (D1) having an anthracene skeleton and a group represented by "-O-R10" bonded to the anthracene skeleton, wherein R10 is an organic group having no reactive group, and the number of atoms constituting the longest linear chain bonded to O in R10 is 2 to 10, when a coating film with a thickness of 10 μm is prepared from the photocurable resin composition and the coating film is irradiated with light having a peak wavelength of 395 nm under the conditions of an irradiation intensity of 3 W / cm2 and an integrated light amount of 0.9 J / cm2, the reaction rate of the photopolymerizable compound (A) is 80% or more, a photocurable resin composition.

3. A photocurable resin composition containing a photopolymerizable compound (A) containing a radically polymerizable compound, a photoinitiator (B) containing a photoinitiating agent (B1) having photobleaching properties, an ultraviolet absorber (C), and a sensitizer (D), wherein the sensitizer (D) contains an anthracene-based sensitizer (D1) having an anthracene skeleton and a group represented by "-O-R10" bonded to the anthracene skeleton, The R10 is an organic group having no reactive group, and the number of atoms constituting the longest linear chain bonded to O in the R10 is 2 to 10. The light transmittance of the cured product with a thickness of 10 μm obtained by curing the photocurable resin composition with respect to light having a wavelength of 400 nm is 30% or less. Photocurable resin composition.

4. The light transmittance of the cured product with a thickness of 10 μm obtained by curing the photocurable resin composition with respect to light having a wavelength of 430 nm is 70% or more. The photocurable resin composition according to Claim 3.

5. A photopolymerizable compound (A) containing a radical polymerizable compound, a photopolymerization initiator (B) containing a photobleaching photopolymerization initiator (B1), an ultraviolet absorber (C), and a sensitizer (D), The sensitizer (D) contains an anthracene-based sensitizer (D1) having an anthracene skeleton and a group represented by “—O—R10” bonded to the anthracene skeleton. The R10 is an organic group having no reactive group, and the number of atoms constituting the longest linear chain bonded to O in the R10 is 2 to 10. It is formed by being ejected by an inkjet method. Photocurable resin composition.

6. A photopolymerizable compound (A) containing a radical polymerizable compound, a photopolymerization initiator (B) containing a photobleaching photopolymerization initiator (B1), an ultraviolet absorber (C), and a sensitizer (D), The sensitizer (D) contains an anthracene-based sensitizer (D1) having an anthracene skeleton and a group represented by “—O—R10” bonded to the anthracene skeleton. The R10 is an organic group having no reactive group, and the number of atoms constituting the longest linear chain bonded to O in the R10 is 2 to 10. For producing an optical component that transmits light emitted from a light source. Photocurable resin composition.

7. The anthracene-based sensitizer (D1) contains a compound represented by the following formula (701). 【Chemical Formula 1】 The two R10s are organic groups having no reactive group, and the number of atoms constituting the longest linear chain bonded to O in the R10 is 2 to 10. The photocurable resin composition according to any one of Claims 1 to 6.

8. The ratio of outgas generated when the cured product of the photocurable resin composition is heated at 100° C. for 30 minutes is 300 ppm or less. The photocurable resin composition according to any one of Claims 1 to 7. **Claim 9**: The photocurable resin composition according to any one of claims 1 to 8, wherein the photoinitiator (B1) contains an acylphosphine oxide-based photoinitiator. **Claim 10**: The photocurable resin composition according to any one of claims 1 to 9, wherein the photopolymerizable compound (A) contains a compound (A02) having at least one of a -R-O- skeleton and a -R-N- skeleton, wherein each of the Rs is an alkylene group having 2 or more carbon atoms. The photocurable resin composition according to any one of claims 1 to 9. **Claim 11**: The photocurable resin composition according to any one of claims 1 to 10, wherein the glass transition temperature of the cured product is 75°C or higher. The photocurable resin composition according to any one of claims 1 to 10. **Claim 12**: The photocurable resin composition according to any one of claims 1 to 11, wherein at least one of the viscosity at 25°C and the viscosity at 40°C is 30 mPa·s or less. The photocurable resin composition according to any one of claims 1 to 11. **Claim 13**: An optical component comprising a cured product of the photocurable resin composition according to any one of claims 1 to 12. Optical component. **Claim 14**: A method for manufacturing an optical component, comprising molding a photocurable resin composition by an inkjet method and then irradiating the photocurable resin composition with light to cure it, wherein the photocurable resin composition contains a photopolymerizable compound (A) containing a radical polymerizable compound, a photoinitiator (B) containing a photoinitiator (B1) having photobleaching properties, an ultraviolet absorber (C), and a sensitizer (D). The sensitizer (D) contains an anthracene-based sensitizer (D1) having an anthracene skeleton and a group represented by "-O-R10" bonded to the anthracene skeleton. R10 is an organic group having no reactive group, and the number of atoms constituting the longest straight-chain chain bonded to O in R10 is 2 to 10. Method for manufacturing an optical component. **Claim 15**: An optical component comprising a light source and an optical component that transmits light emitted by the light source, wherein the optical component includes a cured product of a photocurable resin composition, wherein the photocurable resin composition contains a photopolymerizable compound (A) containing a radical polymerizable compound, a photoinitiator (B) containing a photoinitiator (B1) having photobleaching properties, an ultraviolet absorber (C), and a sensitizer (D). The sensitizer (D) contains an anthracene-based sensitizer (D1) having an anthracene skeleton and a group represented by "-O-R10" bonded to the anthracene skeleton. The R10 is an organic group having no reactive group, and the number of atoms constituting the longest linear chain bonded to O in the R10 is 2 to 10. Light-emitting device. A method for manufacturing a light-emitting device including a light source and an optical component that transmits light emitted from the light source, The method includes manufacturing the optical component by the method according to claim 14. Method for manufacturing a light-emitting device.

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