Rotating device and thermal spraying device

Abstract

To provide a rotation device capable of preventing a peeling of a coating from a base material and a crack in the coating by reducing a thermal stress of the base material, and a flame spray apparatus.SOLUTION: A rotation device includes: an inflow port and an outflow port of a liquid at a predetermined temperature; a rotation stage that detachably supports a base material having a flow line blocking the inflow port and the outflow port; a rotation pillar for supporting the rotation table; a rotation mechanism for rotating the rotation pillar, and a liquid supply part for supplying the liquid to the base material. The rotation stage has a liquid supply port for supplying the liquid to the base material and a liquid discharge port for discharging the liquid from the base material. The rotation pillar has a first pipe connected to the liquid supply port and a second pipe connected to the liquid discharge port therein. A flame spray apparatus includes the rotation device and a flame spray gun.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] One embodiment of the present disclosure relates to a rotating device and a thermal spraying device.

Background Art

[0002] There is known a thermal spraying device that forms a film of a film-forming material on a substrate by heating and melting a film-forming material such as metal or ceramic, or bringing it into a state close to melting (semi-molten), and spraying the melted or semi-molten film-forming material onto the substrate. For example, Patent Documents 1 and 2 disclose a thermal spraying device that rotates a workpiece and deposits molten metal on its surface to form a metal coating layer.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] The properties of the film formed by thermal spraying are greatly affected by the conditions during film formation. One of these conditions is the temperature of the substrate on which the film is formed. In the thermal spraying process, since the molten or semi-molten film-forming material is sprayed, the substrate becomes hot. When the thermal spraying is completed, the temperature of the substrate drops, but at this time, thermal stress is generated in the substrate, and there are problems such as the film peeling off from the substrate surface or cracks occurring in the film.

[0005] One of the problems of the embodiments of the present disclosure is to provide a rotating device and a thermal spraying device that can reduce the thermal stress of the substrate and prevent the film from peeling off from the substrate and cracking of the film.

Means for Solving the Problems

[0006] A rotating device according to an embodiment of the present disclosure includes a rotating stage that removably supports a base material having an inlet for a liquid at a predetermined temperature, an outlet, and a flow path connecting the inlet and the outlet, a rotating column that supports the rotating table, a rotation mechanism that rotates the rotating column, and a liquid supply unit that supplies the liquid to the base material. The rotating stage has a liquid supply port for supplying the liquid to the base material and a liquid discharge port for discharging the liquid from the base material. The rotating column has, inside thereof, a first pipe connected to the liquid supply port and a second pipe connected to the liquid discharge port.

[0007] A thermal spraying device according to an embodiment of the present disclosure includes the above-described rotating device and a thermal spraying gun.

Advantages of the Invention

[0008] According to an embodiment of the present disclosure, it is possible to provide a rotating device and a thermal spraying device that can reduce the thermal stress of a base material and prevent peeling of a coating film from the base material and cracking of the coating film.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Modes for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings and the like. However, the present invention can be implemented in many different modes and is not construed as being limited to the description of the embodiments illustrated below. The drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual mode for clearer explanation, but this is merely an example and does not limit the interpretation of the present disclosure.

[0011] The drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual mode for clearer explanation, but this is merely an example and does not limit the interpretation of the present invention. Also, in this specification and the drawings, elements having the same functions as those described with respect to the previously shown drawings may be denoted by the same reference numerals, and duplicate explanations may be omitted. Further, in this specification and the drawings, the same part or parts having similar functions may be denoted by the same reference numerals or similar reference numerals (reference numerals with A, B, etc. appended after the numbers), and repeated explanations thereof may be omitted.

[0012] In this specification, when it is stated that a certain member or region is "above (or below)" another member or region, unless otherwise specifically limited, this includes not only the case where it is directly above (or directly below) the other member or region but also the case where it is above (or below) the other member or region, that is, it also includes the case where another component is included in between above (or below) the other member or region.

[0013] Also, in this specification, expressions such as "α includes A, B, or C", "α includes any one of A, B, and C", "α includes one selected from the group consisting of A, B, and C", etc., do not exclude the case where α includes a plurality of combinations of A to C unless otherwise specifically stated. Furthermore, these expressions do not exclude the case where α includes other elements.

[0014] Hereinafter, the thermal spraying device 10 according to an embodiment of the present disclosure will be described with reference to the drawings.

[0015] FIG. 1 is a diagram for explaining the configuration of a thermal spraying apparatus 10 according to an embodiment of the present disclosure. The thermal spraying apparatus 10 includes a rotating device 100 that supports a base material 300 and a thermal spraying gun 200 that sprays a thermal spraying material onto the surface of the base material 300.

[0016] The rotating device 100 includes a gantry 101, a rotating support column 103, a rotating stage 105, a liquid supply device (liquid supply unit) 111, an air chuck device 113, and a rotation mechanism 117.

[0017] The liquid supply device 111, the air chuck device 113, and the rotation mechanism 117 are installed on the gantry 101. The gantry 101 may be a housing.

[0018] The liquid supply device 111 supplies a liquid adjusted to a predetermined temperature range to the base material 300. Further, the liquid supply device 111 recovers the liquid that has circulated through the base material 300 and adjusts the recovered liquid to the predetermined temperature range again. The liquid supply device 111 supplies the liquid to the base material 300 and recovers the liquid from the base material 300 through pipes (not shown) provided in the rotating stage 105 and the rotating support column 103. The pipes may be hollow passages provided in the rotating stage 105 and the rotating support column 103. Details of the configuration of the liquid supply device 111 will be described later.

[0019] The rotation mechanism 117 is connected to the rotating support column 103 described later. The rotation mechanism 117 includes a driving device such as a motor. The rotation mechanism 117 rotates the rotating stage 105 fixed to the rotating support column 103 about the rotating support column 103.

[0020] The air chuck device 113 vacuum-chucks the base material 300, at least a part of which is formed of a porous material, through pipes (suction pipes, not shown) provided in the rotating stage 105 and the rotating support column 103, and fixes the base material 300 on the rotating stage 105. The pipes may be hollow passages provided in the rotating stage 105 and the rotating support column 103. The air chuck device 113 may include a vacuum connected to the pipes provided in the rotating support column 103.

[0021] The rotating support column 103 supports a rotating stage 105 described later. Although not shown, inside the rotating support column 103, there are provided a pipe (first pipe) for supplying liquid from a liquid supply device 111 to the base material 300, a pipe (second pipe) for collecting the liquid that has circulated through the base material 300 back to the liquid supply device 111, and a pipe (suction pipe) connected to an air chuck device 113. These pipes may be hollow paths provided inside the rotating support column 103. The pipes provided inside the rotating support column 103 for supplying liquid from the liquid supply device 111 to the base material 300, for collecting the liquid that has circulated through the base material 300 back to the liquid supply device 111, and for connecting to the air chuck device 113 are respectively connected to the liquid supply device 111 and the air chuck device 113 via a rotary joint 115.

[0022] The rotating support column 103 is connected to a rotation mechanism 117. The rotating support column 103 functions as a shaft and can rotate the rotating stage 105 and the base material 300 placed on the rotating stage 105 about the longitudinal axis direction of the rotating support column 103.

[0023] The rotating support column 103 may have a connecting portion 107 that connects to the rotating stage 105. The connecting portion 107 may be connected to a position control mechanism such as an actuator. In this case, the connecting portion 107 can tilt the rotating stage 105 and the base material 300 placed on the rotating stage 105 at a predetermined angle with respect to the spraying gun 200.

[0024] The rotary stage 105 is fixed to the rotary support column 103. The rotary stage 105 may be fixed to the rotary support column 103 so as to be tiltable. The rotary stage 105 detachably supports the base material 300. In the spraying process, the rotary stage 105 rotates together with the base material 300 by the rotary support column 103 connected to the rotation mechanism. At this time, the rotary stage 105 may be inclined at a predetermined angle with respect to the spraying gun 200 that sprays the spraying material onto the base material 300. Although not shown, the rotary stage 105 is connected to a pipe (first pipe) of the rotary support column 103, and is provided with a liquid supply port for supplying the liquid supplied through the pipe to the base material 300, and discharges the liquid circulated through the base material 300, and is connected to a pipe (second pipe) of the rotary support column 103. A liquid discharge port is provided. The liquid supply port is provided so as to be aligned with a pipe (first pipe) of the rotary support column 103 and an inlet (303) provided in the base material 300 described later. Similarly, the liquid discharge port is provided so as to be aligned with a pipe (second pipe) of the rotary support column 103 and an outlet (305) provided in the base material 300 described later.

[0025] FIG. 2 is a diagram for explaining the configuration of the base material 300. The base material 300 is placed on the rotary stage 105 of the rotating device 100. The base material 300 contains, for example, a metal such as aluminum (Al). A sprayed film 201 is formed on the base material 300 by the sprayed material sprayed from the spraying gun 20. As shown in FIG. 2, inside the base material 300, a flow path (flow path) 301 for circulating the liquid supplied from the liquid supply device 111 is provided.

[0026] FIG. 3 is a diagram showing an example of a liquid flow path 301 provided in a substrate 300. FIG. 3 is a view seen from the back side of the substrate 300 where the spraying film 201 is not formed. The flow path 301 has an inlet 303 that receives the supply of liquid from the liquid supply device 111, and an outlet 305 that returns the liquid circulated in the substrate 300 along the flow path 301 to the liquid supply device 111. The inlet 303 is provided on the rotary stage 105 and is connected to a liquid supply port 119 (see FIG. 2) that is connected to a pipe (first pipe) of the rotary support column 103. The outlet 305 is connected to a liquid discharge port 121 (see FIG. 2) that is connected to a pipe (second pipe) of the rotary support column 103. When the substrate 300 is circular, as shown in FIG. 3, the flow path 301 is preferably provided throughout the substrate 300 along the circumferential direction of the substrate 300. In FIG. 3, the case where the substrate 300 is circular is shown, but the shape of the substrate 300 is not limited to circular.

[0027] At least a part of the substrate 300 is formed of a porous material 302. The porous material 302 may be, for example, a porous ceramic having a pore diameter of 10 to 200 μm. Inside the substrate 300, a through hole 307 connected to a pipe provided on the rotary support column 103 and connected to the air chuck device 113 may be provided. The through hole 307 is connected to the porous material 302 portion. Note that the substrate 300 of the present embodiment is not limited to this, and the substrate 300 may not include a porous material. In this case, the substrate 300 can be fixed to the rotary stage 105 by a fixture such as a screw.

[0028] The liquid supply device 111 supplies a liquid at a predetermined temperature to the substrate 300 placed on the rotary stage 105. Hereinafter, the configuration of the liquid supply device 111 will be described with reference to FIG. 4.

[0029] FIG. 4 is a diagram for explaining the configuration of the liquid supply device 111. The liquid supply device 111 includes a hot water tank 401, a cold water tank 403, a heat exchanger 405, a pure water device 407, and a supply unit 409. In the present embodiment, an example of using water as the liquid used for temperature adjustment of the substrate 300 will be described. In FIG. 4, the illustration of the rotary support column 103 and the rotary stage 105 is omitted.

[0030] The hot water tank 401 temporarily stores hot water for supplying the base material 300. The hot water stored in the hot water tank 401 is maintained at a temperature of about 20°C to 120°C. The hot water tank 401 has a heater 411 for maintaining the temperature of the stored hot water. The hot water tank 401 supplies the hot water to the supply unit 409. Further, the hot water tank 401 recovers the liquid that has circulated through the base material 300 and supplies a part of it to the cold water tank 403. The liquid that has circulated through the base material 300 is recovered into the hot water tank 401 via a liquid discharge port provided on the rotary stage 105 and a pipe provided on the rotary support column 103. The hot water tank 401 is connected to the pipe provided on the rotary support column 103 via the rotary joint 115, and recovers the liquid that has circulated through the base material 300 via the rotary joint 115.

[0031] The cold water tank 403 temporarily stores cold water for supplying the base material 300. The cold water stored in the cold water tank 403 is maintained at a normal temperature (about 20°C to about 35°C). The cold water tank 403 supplies the cold water to the supply unit 409. Further, the cold water tank 403 receives the supply of hot water from the hot water tank 401. The cold water tank 403 supplies the water containing the supplied hot water to the heat exchanger 405. Cold water is supplied to the cold water tank 403 from the heat exchanger 405. Further, the cold water tank 403 may supply the stored cold water to the pure water device 407.

[0032] Water is supplied to the heat exchanger 405 from the cold water tank 403. The heat exchanger 405 cools the supplied water and returns the cooled water to the cold water tank 403. The heat exchanger 405 may be a radiator.

[0033] The pure water device 407 purifies the water supplied from the cooling tank 403. The pure water device 407 includes an ion exchange resin. The pure water device 407 returns the water purified by the ion exchange resin to the cooling tank 403. According to one embodiment, the pure water device 407 may be omitted from the configuration of the liquid supply device 111.

[0034] Hot water is supplied to the supply unit 409 from the hot water tank 401, and cold water is supplied from the cold water tank 403. The supply unit 409 mixes the supplied hot water and cold water and adjusts it to hot water at a predetermined temperature, and supplies the hot water to the base material 300 through the pipe provided on the rotating column 103 and the liquid water supply port provided on the rotary stage 105. The temperature of the hot water adjusted in the supply unit 409 is preferably in the range of 85°C or higher and 120°C or lower. The supply unit 409 is connected to the pipe provided on the rotating column 103 via the rotary joint 115, and supplies the hot water whose temperature has been adjusted through the rotary joint 115 to the base material 300.

[0035] The supply unit 409 may include a pressurizing device. When adjusting the temperature of the hot water supplied to the base material 109 to exceed 100°C, the hot water can be pressurized by the pressurizing device to adjust the temperature of the hot water to exceed 100°C.

[0036] During the spraying process, if there is a large temperature difference in the base material 300 between when the sprayed material in a molten state or semi-molten state is sprayed from the spray gun 20 and after the spraying is completed, thermal stress will occur in the base material 300, and there is a risk of problems such as the sprayed film (201) peeling off from the surface of the base material 300 or cracks occurring in the sprayed film (201).

[0037] In this embodiment, warm water adjusted to a predetermined temperature is supplied from the liquid supply device 111 to the substrate 300. The warm water supplied to the substrate 300 circulates throughout the substrate 300 along the flow path 301 formed in the substrate 300. The warm water flowing through the flow path 301 receives heat from the substrate 300 that becomes hot during the spraying process, suppressing the temperature rise of the substrate 300. That is, the warm water supplied to the substrate 300 functions as a heat medium. As a result, the temperature difference of the substrate 300 during and after the spraying process is reduced, and the thermal stress generated in the substrate 300 can be reduced. As a result, peeling of the sprayed film and generation of cracks can be prevented. Also, the temperature fluctuation range of the substrate 300 during the spraying process is reduced, and the residual stress of the formed sprayed film is also reduced. As a result, the peeling resistance of the sprayed film is improved, the variation in quality for each product is reduced, and the reliability of the product is improved.

[0038] In the above embodiment, an example in which water is used as the liquid supplied from the liquid supply device 111 to the substrate 300 has been described. However, the liquid used for temperature adjustment of the substrate 300 is not limited to water. For example, a high-boiling material such as Galden or other liquid media can also be used for temperature adjustment of the substrate 300. In this case, the temperature of the liquid medium supplied from the liquid supply device 111 to the substrate 300 is preferably in the range of 25°C or higher and 270°C or lower. The configuration of the liquid supply device 111 can be appropriately changed according to the type of heat medium used for temperature adjustment of the substrate 300.

Example

[0039] [Example 1] The temperature of the substrate when using the rotating device according to an embodiment of the present disclosure was verified. The configuration of the rotating device used is the same as the configuration of the rotating device 10 described with reference to FIG. 1. Also, the configuration of the liquid supply device included in the rotating device used is the same as the configuration of the liquid supply device 111 described with reference to FIG. 4. The configuration of the substrate used is the same as the configuration of the substrate 300 described with reference to FIGS. 2 and 3. A substrate in which the main body is aluminum and the porous portion (302) is made of aluminum oxide was used.

[0040] In Example 1, the temperature of the warm water introduced from the liquid supply device to the substrate was set to 85°C, the water supply pressure from the liquid supply device to the substrate was set to 3 atmospheres, and the temperature of the back side of the substrate (the surface on which the sprayed film is not formed) during the spraying process and the temperatures of the water inlet and outlet of the flow path provided in the substrate were measured. The sprayed material sprayed from the spraying gun (200) onto the substrate surface during the spraying process is aluminum oxide, and its temperature is 1800°C to 2500°C. Fig. 5 shows the changes in the temperature of the back side of the substrate and the temperatures of the water inlet and outlet of the flow path provided in the substrate in Example 1.

[0041] Referring to Fig. 5, in Example 1 using the rotating device according to the embodiment of the present disclosure, it can be seen that when the warm water set at 85°C is supplied from the liquid supply device to the substrate, the back surface temperature of the substrate is maintained at about 105°C. Also, while the temperature of the water inlet of the flow path is about 85°C, the temperature of the outlet is about 110°C. This means that the warm water circulating in the flow path receives heat from the surface side of the substrate on which the sprayed film is being formed during the spraying process, suppressing the temperature rise of the substrate. From this result, it is suggested that in Example 1, the temperature difference of the substrate during and after the spraying process is reduced. Therefore, it can be understood that by using a liquid as the heat medium, the temperature of the substrate during the spraying process can be effectively adjusted.

[0042] As described above, in the rotating device according to the embodiment of the present disclosure, the temperature rise of the substrate during the spraying process can be suppressed, and the temperature difference of the substrate during and after the spraying process can be reduced. Thereby, the thermal stress generated in the substrate can be reduced. As a result, peeling of the sprayed film from the substrate and generation of cracks in the sprayed film after the spraying process can be prevented, the quality of the sprayed film can be improved, and the reliability of the product can be improved. Also, since the thermal stress generated during the spraying process is small, the quality of the substrate including the sprayed film is improved, and the reliability of the substrate is improved when the substrate is actually used.

[0043] (Modification example) In the embodiment of the present disclosure described above, the case where the base material 300 installed in the rotating device 100 is supplied with liquid from the liquid supply device 111 has been described. However, the present disclosure is not limited to this. For example, the base material 300 may be supplied with pressurized gas from a gas supply device (gas supply unit).

[0044] In the thermal spraying device according to a modification of the present disclosure, the rotating device 100 may include a gas supply device in addition to the liquid supply device 111. The gas supply device may supply, for example, water vapor as the pressurized gas to the base material 300. In this case, the gas supply device may omit the hot water tank (hot water tank 401 in FIG. 4), and instead heat the cold water supplied from the cold water tank (cold water tank 403 in FIG. 4) by a boiler to generate steam, and supply it to the base material 300. Except for this, it can be configured substantially the same as the configuration of the liquid supply device 111 shown in FIG. 4. Incidentally, the steam generated by the boiler can be mixed with hot air to adjust the temperature before being supplied to the base material 300. Incidentally, the gas supplied from the gas supply device is not necessarily limited to water vapor. The gas supply device supplies, for example, a gas at about 85°C to about 145°C.

[0045] The gas supply device may supply pressurized gas to the base material 300 before the thermal spraying process. Before the start of thermal spraying, the gas supply device can efficiently adjust the temperature of the base material 300 by supplying pressurized gas to the base material 300.

[0046] Before the start of thermal spraying, by adjusting the temperature of the base material 300 to a desired temperature by the gas supplied from the gas supply device, it is possible to prevent the temperature of the base material 300 from rising rapidly after the start of thermal spraying, and reduce the thermal stress generated in the base material 300 before and after the start of thermal spraying. Incidentally, in order to adjust the temperature of the base material 300 during the thermal spraying process, after the start of thermal spraying, that is, during the thermal spraying process, it is preferable that the rotating device 100 receives the supply of hot water as a heat medium from the liquid supply device 111 according to the above embodiment.

[0047] As described above, before the start of thermal spraying, the rotating device 100 adjusts the temperature of the base material 300 to a desired temperature by receiving gas supply from the gas supply device, and after the start of thermal spraying (during the thermal spraying process), the rotating device 100 may adjust the temperature of the base material 300 on which the thermal spray film is formed to a desired temperature by receiving supply of warm water from the liquid supply device 111. In this case, in the rotating device 100, the connection between the gas supply device and the liquid supply device 111 and the rotary joint 115 may be switched before and after the start of thermal spraying.

[0048] Based on the embodiments and modifications of the present disclosure described above, those obtained by those skilled in the art by appropriately adding, deleting, or changing the design of components are also included in the scope of the present invention as long as they have the gist of the present invention.

[0049] In the embodiment of the present disclosure described above, the case where the rotating device includes a liquid supply device has been described, but the present disclosure is not limited thereto. For example, in addition to the rotating device used for thermal spraying, in a device that performs a process of heating up to about 200°C, the liquid supply device of the present embodiment may be applied for temperature control of the base material.

[0050] Even for other operational effects different from those brought about by the above-described embodiments, those that are obvious from the description of this specification or can be easily predicted by those skilled in the art are naturally understood to be brought about by the present invention.

Description of Reference Numerals

[0051] 10: Thermal spraying device, 100: Rotating device, 101: Rotating table, 103: Rotating support column, 105: Rotating stage, 300: Base material (workpiece), 111: Liquid supply device, 113: Air chuck device, 115: Rotary joint, 117: Rotating mechanism, 200: Thermal spray gun, 301: Flow path, 303: Inlet, 305: Outlet, 401: Tank for warm water, 403: Tank for cold water, 405: Heat exchanger, 407: Pure water device, 409: Supply unit

Claims

1. A rotating stage on which a base material is placed, the base material having an inlet and an outlet for a liquid at a predetermined temperature provided on the bottom surface thereof and a flow path connecting the inlet and the outlet provided therein, and the rotating stage detachably supporting the base material; A rotating column that is connected to one end of the rotating stage and supports the rotating stage from a surface opposite to the surface of the rotating stage on which the base material is placed; A rotation mechanism that rotates the rotating stage about the rotating column; A liquid supply unit that supplies the liquid to the base material; Comprising: The rotating stage has a liquid supply port for supplying the liquid to the base material and a liquid discharge port for discharging the liquid from the base material; When the base material is placed on the rotating stage, the liquid supply port is connected to the inlet, and the liquid discharge port is connected to the outlet; The rotating column has, inside thereof, a first pipe connected to the liquid supply port and a second pipe connected to the liquid discharge port; When the base material is placed on the rotating stage, the rotating stage and the base material A rotating device that rotates together with the rotating column.

2. The rotating stage has a flat plate shape. The rotating device according to claim 1.

3. The liquid supply unit A hot water tank that supplies hot water at a relatively high temperature; A cold water tank that supplies cold water at a relatively low temperature; A supply unit that mixes the hot water supplied from the hot water tank and the cold water supplied from the cold water tank, adjusts the temperature to the predetermined temperature, and supplies the mixture to the base material; Comprising: The rotating device according to claim 1 or 2.

4. The liquid supply unit further includes a pressurizing device that pressurizes the water adjusted to the predetermined temperature. The rotating device according to claim 3.

5. The liquid supply unit further includes a heat exchanger that provides water at room temperature to the cold water tank. The rotating device according to any one of claims 3 or 4.

6. The predetermined temperature ranges from 85°C to 120°C. The rotating device according to any one of claims 1 to 5.

7. The predetermined temperature ranges from 25°C to 270°C. The rotating device according to claim 1.

8. The liquid supply unit supplies the liquid to the base material through the first pipe and recovers the liquid from the base material through the second pipe while the rotating stage is rotating. The rotating device according to any one of claims 1 to 7.

9. The rotary device according to claim 8, wherein the first pipe and the liquid supply unit are connected via a rotary joint.

10. The rotary device according to any one of claims 1 to 9, wherein the liquid supply port is provided so as to be aligned with the inflow port, and the liquid discharge port is provided so as to be aligned with the outflow port.

11. The rotary device according to any one of claims 1 to 10, further comprising a chuck mechanism for holding the substrate on the rotary stage.

12. The chuck mechanism is a vacuum chuck mechanism, The vacuum chuck mechanism, a through hole provided in the rotary stage, a suction pipe provided in the rotary column and connected to the through hole, and a vacuum connected to the suction pipe. The rotary device according to claim 11.

13. The rotary device according to claim 12, wherein at least a part of the substrate contains a porous material.

14. The rotary device according to claim 12, wherein the suction pipe and the vacuum are connected via a rotary joint.

15. The rotary device according to any one of claims 1 to 14, wherein the flow path provided in the substrate is provided along the circumferential direction of the substrate.

16. A spraying device comprising the rotary device according to claims 1 to 15, and a spraying gun.

17. The spraying gun sprays a spraying material onto the surface of the substrate supported by the rotary stage, While the spraying material is being sprayed from the spraying gun, the liquid supply unit supplies the liquid to the substrate. The spraying device according to claim 16.

18. The rotary device further comprises a gas supply unit for supplying pressurized gas to the substrate, Before the spraying material is sprayed from the spraying gun, the gas supply unit supplies the gas to the substrate. The spraying device according to claim 17.

Images