Method for controlled deposition of donor material onto a target surface and a plate therefor

Abstract

A method, plate and deposition apparatus for depositing donor material on a target surface are provided. The first major surface (11) of a substrate (10) is coated with a stretchable layer (4), which is attached by a sealing (43) applied around an enclosed area (13) of the first major surface to define an enclosure (6). The stretchable layer (4) faces the opposite side of the substrate and has an outer surface (41) patterned with one or more recesses (42a, ..., 42e) into which a donor material to be deposited is filled. A relatively high pressure is applied to the interior (61) of the enclosure (6), causing the volume (V 61 ) and pressing the patterned surface (41) of the elastic layer (4) against the target surface (51). With the elastic layer (4) in this state, the second major surface (12) of the substrate opposite the first major surface (11) is irradiated with photon radiation at an intensity and duration that causes transfer of the donor material (2) from one or more of the recesses (42a, ..., 42e) to the target surface (51).

Description

Technical Field

[0001] The present invention relates to a method for controlled deposition of a donor material onto a target surface. The present invention also relates to a plate for accommodating a donor material to be deposited on a target surface. The present invention further relates to a deposition apparatus including such a plate.

Background Art

[0002] A method for controlled deposition of a donor material onto a target surface is known from Patent Document 1 (U.S. Patent Application Publication No. 2017 / 268107). According to the method disclosed in Patent Document 1, an optically transparent plate having a first surface provided with one or more wells and a second surface opposite to the first surface is prepared, the first surface is thinly coated with a light-absorbing material, and then the wells are filled with a donor material. Next, the plate is irradiated with pulsed light from the second surface to heat the inside of the wells, generate gas, and transfer the donor material from the wells onto a receiving substrate adjacent to the plate. In this process, the heat flux around the wells determines how the donor material is released.

[0003] This known method is very suitable for depositing a donor material onto a flat surface, but a method suitable for use on a surface with irregularities is also needed. For example, the need may arise when depositing a donor material onto an object composed of multiple layers and providing an electrical connection between a certain product layer and a part of another product layer extending thereunder. Another example is when forming an electrical connection between a component carrier and an electrical terminal of a component disposed on the component carrier.

[0004] Also, the following prior art is known.

[0005] Non-patent document 1 (Hongyu Luo et al., "Laser-driven programmable non-contact transfer printing of objects onto arbitrary receivers via an active elastomeric microstructured stamp", National science review, August 6, 2019 (2019-08-06), pp. 296-304, XP055728788, Doi: 10.1093 / nsr / nwz109, Internet <URL:https: / / academic.oup.com / nsr / article-pdf / 7 / 2 / 296 / 32921935 / nwz109.pdf> [searched on September 8, 2020]) discloses a laser-driven programmable non-contact transfer printing technique using an active elastomeric microstructured stamp characterized by a cavity filled with air located under the contact surface, a micro-patterned surface film enclosing the air cavity, and a metal layer on the internal cavity surface functioning as a laser absorption layer. The micro-patterned surface film can be dynamically expanded to control the interfacial adhesion, and by locally laser-heating the air in the cavity with a temperature rise of less than 100°C, it is possible to switch the interfacial adhesion from a "strong" state to a "weak" state by more than three orders of magnitude.

[0006] Patent document 2 (International Publication No. WO 2010 / 081137) discloses an imaging array manufacturing process method including a step of fabricating an array of semiconductor imaging elements, interconnecting the elements in a stretchable manner, and transfer-printing the array onto a non-planar secondary surface using a pre-strained elastomeric stamp.

[0007] Patent Document 3 (U.S. Patent Application Publication No. 2017 / 306495) describes an apparatus for depositing a material on an acceptor surface, which includes a transparent donor substrate having first and second surfaces on opposite sides of each other. The transparent donor substrate is configured such that at least a portion of the second surface is not parallel to the acceptor surface, and a donor film is provided on the second surface. The optical assembly irradiates a radiation beam so as to strike the donor film at a portion of the second surface that is not parallel to the acceptor surface through the first surface of the donor substrate, and induces the release of droplets of molten material from the donor film onto the acceptor surface.

Prior Art Documents

Patent Documents

[0008]

Patent Document 1

Patent Document 2

Patent Document 3

Non-Patent Documents

[0009]

Non-Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0010] An object of the present invention is to provide an improved vapor deposition method suitable for vapor deposition of a donor material onto a non-flat target surface. Accordingly, the method according to claim 1 is provided.

[0011] Another object of the present invention is to provide an improved plate for use with the improved method. Accordingly, the plate according to claim 9 is provided.

[0012] Yet another object of the invention is to provide an improved vapor deposition apparatus suitable for vapor deposition of a donor material onto a non-flat target surface. Accordingly, the improved apparatus is described in claim 13.

Means for Solving the Problems

[0013] The improved method according to claim 1 includes the following steps. Coat the first major surface of the substrate with a stretchable layer. The stretchable layer is made of a stretchable polymer such as, for example, PDMS (polydimethylsiloxane) or PU (polyurethane), and is attached to the first major surface by a seal applied around the surrounding area of the first major surface. Thereby, an enclosure is defined. The stretchable layer faces the opposite side of the substrate and has an outer surface on which one or more recesses such as grooves, trenches, wells, etc. are patterned. One or more of the recesses are filled with a donor material to be vapor deposited onto the target surface. Subsequently, apply a relatively high pressure inside the enclosure compared to the pressure outside the enclosure. For example, supply pressurized gas or pressurized air inside and / or evacuate the environment where the plate is disposed. Also, the internal substance may be evaporated to increase the vapor pressure. By applying a relatively high pressure, the internal volume increases and the patterned surface of the stretchable layer is pressed against the target surface. With the patterned surface of the stretchable layer pressed against the target surface, photon radiation is irradiated onto the second main surface of the substrate, which is opposite to the first main surface. The photon radiation shall have an intensity and duration that cause the transfer of the donor material from one or more recesses to the target surface. The photon radiation passes through the substrate and the stretchable layer and reaches within one or more recesses, generating a vapor pressure at the interface of the donor material with respect to the stretchable layer, so that the donor material is released from one or more recesses toward the target surface. Due to the relatively high pressure within the enclosure, the stretchable layer necessarily conforms to the uneven shape of the target surface. As a result, the patterned surface having one or more recesses containing the donor material is in close contact with the target surface, and good transfer accuracy is obtained.

[0014] In certain embodiments, a vapor pressure is generated by the evaporation of the donor material. In other embodiments, an auxiliary material that is more volatile than the donor material is introduced at the interface. Additionally / alternatively, an auxiliary material having a relatively high absorbency with respect to the photon radiation used may be introduced at the interface.

[0015] Also, according to certain embodiments, the donor material is a viscous substance and can be easily deformed in response to the strain occurring in the stretchable layer. In these embodiments, the intensity and duration of the photon radiation are selected such that the donor material is at least partially cured. By at least partially curing the donor material at least at the interface with the stretchable layer surface, it is possible to avoid a part of the donor material remaining on the stretchable layer surface. In a preferred embodiment, the donor material may be completely cured while being released toward the target surface.

[0016] When the donor material is deposited on the target surface, the stretchable layer can be removed from the target surface. To do so, the plate may be pulled away from the target surface. In certain embodiments, for example, internal evacuation and / or external pressurization is performed to make the internal pressure relatively lower than the external pressure, thereby shrinking the enclosure. After the plate with the stretchable layer is removed from the target surface, the recesses of the stretchable layer can be refilled to make it reusable. Optionally, a step of cleaning the surface of the stretchable layer may be performed before refilling.

[0017] The improved plate according to claim 9 comprises a substrate having first and second major surfaces on opposite sides of each other. The first major surface of the substrate is coated with a pattern layer, and the pattern layer has a pattern surface facing the target surface. One or more recesses filled with a donor material to be deposited on the target surface are patterned on the pattern surface.

[0018] The second major surface of the substrate is a surface that receives irradiation of photon radiation, and the irradiated photon radiation passes through the substrate and travels towards the recesses filled with the donor material. In use, the photon radiation has an intensity and duration that causes transfer of the donor material from one or more recesses to the target surface.

[0019] The improved plate is characterized in that the pattern layer is made of a stretchable material and is attached to the first major surface by a sealing applied around the surrounding area of the first major surface of the substrate, thereby defining the inside and outside of the enclosure. The internal volume depends on the relative difference between the internal pressure and the external pressure.

[0020] According to certain embodiments, to facilitate pressure control inside the enclosure, the plate has an opening extending towards the inside of the enclosure. For example, the opening may extend through the substrate, or alternatively, through the sealing or the stretchable layer.

[0021] In some embodiments of the improved plate, the stretchable layer is reinforced by a relatively rigid member. Thereby, deformation can be controlled to improve alignment accuracy and the stretchable layer can be adapted to the target surface. The relatively rigid member may, for example, limit the deformation of the stretchable layer near the recess. As another example, the relatively rigid member may be relatively rigid in only one direction and more flexible in the direction intersecting it.

[0022] In these embodiments, for example, one or more relatively rigid members prevent local stretching while maintaining flexibility. This one or more relatively rigid members may be provided with a dielectric coating on the side facing away from the substrate that provides at least a substantially uniform heat flux within the recess. In this case, the dielectric coating shall have a higher reflectivity for the monochromatic photon radiation of a predetermined wavelength incident on the bottom wall of the recess than for the monochromatic radiation incident on the side walls of the recess. In this example, by using a relatively rigid member, damage to the dielectric coating when pressure is applied internally relative to the outside of the enclosure is reduced. An exemplification and more detailed description of such a dielectric coating are described in the specification of European Patent Application No. 20167549.3 filed by the applicant of the present application.

[0023] According to an embodiment of the plate, the stretchable layer is further attached to the first major surface of the substrate at locations within the enclosed area as an alternative or additional means for controlling deformation.

[0024] Also, according to an embodiment, the stretchable layer is further attached to the first major surface of the substrate at locations within the enclosed area to locally limit deformation.

[0025] In some embodiments of the improved plate, a plurality of enclosures are formed on the substrate. Each of the plurality of enclosures either has an individual stretchable layer or has a portion of a stretchable layer, and each portion is attached to the substrate with an individual surrounding seal. According to these embodiments, the expansion of the formed enclosures can be independently controlled. When there is one stretchable layer used, its deformation is more precisely controlled compared to when it is attached to the substrate with a single seal. In variations of these embodiments, the stretchable layer or a portion of the stretchable layer of each enclosure is further attached to the first major surface of the substrate at locations within each surrounding area.

[0026] The vapor deposition apparatus provided in the present disclosure includes, in addition to the improved plate according to the above embodiments, a holding unit, a photon radiation source, a pressure adjustment mechanism, and a control unit.

[0027] The photon radiation source is provided to irradiate photon radiation toward the second surface of the plate.

[0028] The pressure adjustment mechanism is provided to controllably generate a relative pressure difference between the inside and the outside of the enclosure. Thus, in one embodiment, the pressure adjustment mechanism is configured to control the pressure inside the enclosure by evacuating the inside of the enclosure and / or by supplying a gas or a gas mixture (e.g., air) into the inside of the enclosure. Also, in other embodiments, the pressure adjustment mechanism is configured to control the pressure outside the enclosure by evacuating the outside of the enclosure and / or by supplying a gas or a gas mixture (e.g., air) to the outside of the enclosure. Further, in other embodiments, the pressure adjustment mechanism is configured to adjust the pressure inside and outside.

[0029] The holding part is provided to hold the object in a state where the target surface faces the first surface of the plate. In certain embodiments, the holding part is configured to hold the object at a fixed position relative to the plate. In other embodiments, the holding part is configured to move the object. The vapor deposition apparatus may be configured to place a new plate or a new portion of the plate in front of the radiation source and place the subsequent portion of the target surface in front of the first surface of the new plate or the new portion of the plate after the vapor deposition process.

[0030] The control unit is provided to control the pressure adjustment mechanism and the photon radiation source. The control unit has a first operation mode in which it controls the pressure adjustment mechanism to keep the pressure inside the enclosure lower than the external pressure and maintains the photon radiation source in a stopped state. Also, the control unit has a second operation mode in which it controls the pressure adjustment mechanism to keep the internal pressure higher than the external pressure. Thereby, the control unit presses the pattern layer against the target surface, and with the pattern layer pressed against the target surface, irradiates the radiation source with photon radiation having an intensity and duration that cause the transfer of the donor material from one or more recesses to the target surface. The duration of the thermal irradiation is generally short, for example in microseconds, but is often even shorter, in nanoseconds. In practice, a pulse duration of several nanoseconds to several tens of nanoseconds can obtain good results with reasonable technical requirements. However, in some cases, an even shorter pulse duration, for example in the range of 10 - 500 ps, may be applied. At the test stage, the intensity is changed from a relatively low value (for example, corresponding to an exposure (fluence) of about 0.1 J / cm 2 to a relatively high value (for example, corresponding to an exposure (fluence) of about 1 J / cm 2 to determine the value or range of values at which the transfer of the donor material is optimal from the perspective of vapor deposition accuracy. As described above, in some embodiments, the intensity and duration of the photon radiation are selected such that the donor material at least partially cures at the interface with the wall of the recess from which the donor material is released.

Brief Description of the Drawings

[0031]

FIG. 1A

FIG. 1B

FIG. 2A

FIG. 2B

FIG. 2C

FIG. 2D

FIG. 2E

FIG. 3

FIG. 4

FIG. 5

DETAILED DESCRIPTION OF THE INVENTION

[0032] FIGS. 1A and 1B schematically show a plate 1 that houses a donor material 2 to be vapor-deposited on a target surface 51 (see FIG. 2B) of an object 5 (see FIG. 2B), and FIG. 1B is a cross-sectional view showing the IB IB cross-section of FIG. 1A. The plate 1 includes a substrate 10 having a first main surface 11 and a second main surface on the opposite side thereof. The first main surface 11 of the substrate 10 is covered with a pattern layer 4 having a pattern surface 41 facing the target surface. One or more recesses are patterned on the pattern surface 41. In the examples of FIGS. 1A and 1B, the recesses include first and second trenches 42a and 42e that are respectively filled with appropriate portions 2a and 2b of the donor material 2. In this example, one or more recesses further include wells 42c, 42d, and 42e that are filled with appropriate portions 2c, 2d, and 2e of the donor material 2.

[0033] In use, the second major surface 12 of the plate 1 is irradiated with photon radiation, and the irradiated photon radiation passes through the substrate 10 and travels towards the donor material. The photon radiation used here has an intensity and duration that cause the transfer of the donor materials 2a, …, 2e from one or more of the recesses 42a, …, 42e to the target surface 51 of the object (also referred to as the “acceptor”) 5. The pattern layer 4 is made of an elastic material and is attached to the first major surface 11 by a sealing 43 applied around the surrounding region 13 of the first major surface 11. Thereby, the substrate 10, the sealing 43, and the layer 4 of the elastic material define the interior 61 and the exterior 62 of the enclosure 6 (see FIG. 5). The internal volume V 61 is dependent on the difference between the pressure P int inside the interior 61 and the pressure P ext outside the exterior 62.

[0034] Referring to FIGS. 2A - 2E, an embodiment of the method using the plate 1 will be described.

[0035] In a manufacturing process (not shown), the first major surface 11 of the substrate 10 is coated with the elastic layer 4. The elastic layer 4 is attached to the first major surface 11 by a sealing 43 applied around the surrounding region 13 of the first major surface 11. In certain embodiments, the sealing consists of an epoxy - based adhesive. In other embodiments, the sealing is formed by the material of the elastic layer 4 itself. This can be achieved by locally roughening the surface of the first major surface 11 of the substrate 10 where the sealing is to be formed and mechanically attaching the elastic layer to the locally roughened surface. The substrate 10, the elastic layer 4, and the sealing 43 formed by the material of the elastic layer itself or a separate material form the enclosure 6 and its interior 61 and exterior 62. The elastic layer 4 has an outer surface 41 facing away from the substrate 10, and one or more recesses are patterned on the outer surface 41. FIG. 2A shows, as an example, the recesses 42a, 42b.

[0036] In the next step, one or more recesses are filled with a donor material 2 to be vapor-deposited. In the illustrated example, a part 2a of the donor material has already been filled in the recess 42a, and another part 2b of the donor material is being filled in the recess 42b here using a doctor blade 20. Examples of the donor material for vapor deposition include copper, aluminum, tungsten, chromium, and polysilicon, which are supplied as particles in a suspension medium. The suspension medium may further contain a solvent and a binder. Also, materials other than metals can be suitably used as the donor material. For example, ink in which conductive particles are suspended may be used as the donor material. The rheological properties of the donor material may be changed by additives or solvents in order to obtain shear thickening, shear thinning, thixotropic, rheopectic, Bingham plastic behavior, etc. As an example, the donor material may be a viscous silver nanoparticle ink having a high metal loading. In some embodiments, the donor material has a viscosity in the range of 100 to 1000 Pa·s.

[0037] When filling the recess with the donor material, the interior 61 of the enclosure is typically maintained at a relatively low pressure P int , that is, lower than the external main pressure P ext . This can be achieved by evacuating the interior 61 and / or pressurizing it to the outside.

[0038] FIG. 2B shows a plate 1 with the recesses filled with the donor materials 2a, 2b and the interior 61 of the enclosure maintained at a relatively low pressure. FIG. 2B further shows an object (acceptor) 5, and as can be seen from the figure, the object 5 has a non-flat surface 51.

[0039] FIG. 2C shows the next step, in which a pressure P ext higher than the pressure P int outside the enclosure is applied to the interior 61 of the enclosure 6. As a result, the volume V 61 of the interior 61 increases, and the pattern surface 41 of the stretchable layer 4 is pressed against the target surface 51, and its shape conforms to the shape of the target surface.

[0040] Also, in the process shown in FIG. 2C, in this state, the second main surface 12 of the substrate 10 is irradiated with photon radiation having an intensity and a duration that cause the transfer of the donor materials 2a, 2b from the recesses 42a, 42b to the target surface 51. The transferred donor materials 2a, 2b form the members 2aa, 2bb on the target surface. At this time, since the stretchable layer 4 conforms to the target surface 51, the donor material can be accurately deposited on the target surface.

[0041] FIG. 2D shows the state in which the stretchable layer 4 detaches from the target surface 51 by applying a pressure P ext lower than the external pressure P int inside the enclosure 6. Here, the members 2aa, 2bb formed by the deposited donor material remain on the target surface 51. In the illustrated example, since the object 5 includes a plurality of layers 55, 56, the target surface is not flat. The members 2aa, 2bb serve as, for example, electrical connection portions between these layers 55, 56.

[0042] FIG. 2E shows another example, in which the component 52 is mounted on the component carrier 5. In this example, this method is used to apply the electrical connection portions 2aa, 2bb between the component carrier 5 and the contact points on the surface 53 of the component that protrudes from the carrier 5.

[0043] FIG. 3 is a diagram showing another embodiment of the improved plate 1, and shows the first surface 11 of the substrate 10. In the figure, the same reference numerals are given to the components common to the previous figures. In the embodiment shown in FIG. 3, the stretchable layer 4 is reinforced by relatively rigid members 45a, 45b, 45c, 45d, and the recesses 42a, …, 43d are provided in the reinforced portions of the stretchable layer. Thereby, while the stretchable layer 4 can be deformed to conform to the target surface, local deformation in the vicinity of the recesses is reduced. In an exemplary embodiment, reinforcement prevents local stretching while maintaining flexibility. In one embodiment in this case, the reinforced portion provided with the recess is made of a relatively thin glass layer, for example, a SiO2 layer having a thickness in the range of 5 to 10 microns. As described in more detail in European Patent Application No. 20167549.3 filed by the applicant, this locally flexible but non-stretchable reinforcing portion may be provided with a dielectric coating on the side facing the opposite side of the substrate to provide a uniform heat flux in the recess. Alternatively or additionally, the stretchable layer 4 may be reinforced in the region outside the recess. Or, or further, the stretchable layer 4 may be attached to the first main surface 11 of the substrate 10 at locations within the enclosure region to control deformation due to pressure differences.

[0044] As shown in FIG. 4, a plurality of enclosures are formed on the substrate 10, and each enclosure has stretchable layer portions 4_1, 4_2, …, 4_9 of the stretchable layer 4 attached to the substrate by corresponding enclosure sealings 43_1, 43_2, …, 43_9. The internal pressures of these enclosures can be independently controlled via their respective channels 14_1, 14_2, …, 14_9. In the illustrated example, the stretchable layer portion is locally reinforced as shown in FIG. 3, but reinforcement may not be necessary in other embodiments. In the example of FIG. 4, a single stretchable layer 4 is used, but there are also embodiments in which one or more enclosures each have an individual stretchable layer. In that case, different stretchable materials may be used for each enclosure depending on the position on the plate 1.

[0045] FIG. 5 is a diagram schematically showing the vapor deposition apparatus 100, which includes, for example, the improved plate 1 shown in one of the previous figures and described with reference to that figure.

[0046] The vapor deposition apparatus 100 also includes a holding unit 9 that holds the object 5 in a state where the target surface 51 faces the first surface 11 of the plate 1. As shown in FIG. 2C, the vapor deposition apparatus 100 further includes a photon radiation source 3 that irradiates photon radiation toward the second surface 12 of the plate 1.

[0047] The vapor deposition apparatus 100 also includes a pressure adjustment mechanism 7 that controllably generates a relative pressure difference between the inside 61 and the outside 62 of the enclosure 6. In the illustrated embodiment, the pressure adjustment mechanism 7 is connected to the inside 61 of the enclosure 6 via the first conduit 71 and the opening 14 of the plate 1. The components of the vapor deposition apparatus 100 are arranged within a sealed housing 110 that surrounds the outside 62 of the enclosure 6. The pressure adjustment mechanism 7 also has a second conduit 72 that has an opening to the outside 62. Thereby, the pressure adjustment mechanism 7 can control both the internal pressure and the pressure of the outside 62. In other embodiments, the pressure adjustment mechanism 7 controls one of the internal pressure and the external pressure. For example, in an embodiment where the apparatus 100 does not include a sealed housing, the pressure adjustment mechanism 7 is used to control only the pressure inside the enclosure 61 of the enclosure 6.

[0048] The vapor deposition apparatus 100 further includes a control unit 8 that controls the pressure adjustment mechanism 7 and the photon radiation source 3. In the example of FIG. 5, the control unit 8 controls the photon radiation source 3 with the control signal C3 and the pressure adjustment mechanism 7 with the control signal C7, respectively.

[0049] The control unit 8 has a first operation mode in which it controls the pressure adjustment mechanism 7 to keep the pressure inside 61 lower than the pressure outside 62 and maintains the photon radiation source 3 in a stopped state. The control unit 8 also has a second operation mode in which it controls the pressure adjustment mechanism 7 to keep the pressure inside 61 higher than the pressure outside 62. As a result, the stretchable pattern layer 4 is pressed toward the target surface 51. As shown in FIG. 2C, with the stretchable pattern layer 4 pressed against the target surface 51, the control unit 8 irradiates the radiation source 3 with photon radiation R3 at an appropriate intensity and duration that causes the transfer of the donor materials 2a, 2b from one or more of the recesses 42a, …, 42e to the target surface 51. There are various forms of irradiation. For example, a wide area of the second surface 12 of the plate may be irradiated at an appropriate intensity and duration that causes the simultaneous transfer of the donor material in a plurality of recesses of the plate. In this case, an excimer laser, for example, may be used as the photon radiation source 3. Alternatively, as schematically shown in FIG. 2C, a scanning laser that generates and scans a laser beam over an area having the donor material to be transferred may be used. The laser may be a pulsed laser, but is not limited thereto. In this case, the duration for which the area is locally irradiated with radiation can alternatively (or additionally) be controlled by the speed at which the laser beam is scanned. Therefore, the exposure time is inversely proportional to the scanning speed.

[0050] The control unit 8 may have a transitional operation mode in which it maintains the photon radiation source 3 in a stopped state until the stretchable pattern layer 4 is in a state of conforming to the target surface 51. The control unit 8 may also have a release operation mode in which it releases the stretchable pattern layer 4 from the target surface 51 by reducing the main relative pressure (relative pressure with respect to the external pressure) inside 61, as shown in FIGS. 2 and 2E.

[0051] In a further embodiment, the vapor deposition apparatus includes a transport mechanism that automatically replaces the plate 1 with a new plate and the object 5 with a new object when the donor material has been received. In this case, the control unit 8 can control the transport mechanism. (Supplementary Note) (Supplementary Note 1) A method of depositing a donor material (2) on a target surface (51), comprising: covering a first main surface (11) of a substrate (10) with a stretchable layer (4) having a pattern surface (41) which faces the opposite side of the substrate and has one or more recesses (42a,..., 42e) formed thereon in a pattern, and attaching the stretchable layer (4) to the first main surface (11) by a sealing (43) applied around a surrounding region (13) of the first main surface to define an enclosure (6) (step S1); filling the one or more recesses (42a,..., 42e) with the donor material (2) to be deposited; supplying a gas into the interior (61) of the enclosure (6) through an opening (14) of the substrate (10) to apply a relatively high pressure to the interior (61) compared to the pressure outside the enclosure, thereby increasing the volume (V 61 ) of the interior (61) and pressing the pattern surface (41) of the stretchable layer (4) against the target surface (51); irradiating a second main surface (12) of the substrate, which is opposite to the first main surface (11), with photon radiation having an intensity and duration that cause transfer of the donor material (2) from the one or more recesses (42a,..., 42e) to the target surface (51). (Supplementary Note 2) The method according to Supplementary Note 1, characterized in that the one or more recesses (42a,..., 42e) are filled with the donor material (2) using a doctor blade (20). (Supplementary Note 3) The method according to Supplementary Note 1 or 2, characterized in that the interior (61) of the enclosure (6) is evacuated prior to the step of filling the one or more recesses (42a,..., 42e). (Supplementary Note 4) The method according to Supplementary Note 1, 2 or 3, characterized in that a relatively high pressure is applied to the interior (61) by supplying a gas into the interior (61) or by reducing the pressure outside. (Supplementary Note 5) The method according to any one of Supplementary Notes 1 to 4, characterized in that the intensity and duration of the photon radiation are selected such that a part of the donor material evaporates at an interface between the outer surface of the stretchable layer (4) and the donor material. (Supplementary Note 6) The method according to any one of appendices 1 to 5, characterized in that the intensity and duration of the photon radiation are selected such that the donor material is at least partially cured. (Appendix 7) The method according to any one of appendices 1 to 6, characterized by including a step of detaching the stretchable layer (4) from the target surface (51) by applying a relatively low pressure to the inside compared to the external pressure. (Appendix 8) The method according to any one of appendices 1 to 7, characterized by including a step of cleaning the pattern surface (41) after the transfer. (Appendix 9) A plate (1) for accommodating a donor material (2) suitable for vapor deposition on a target surface (51), comprising a substrate (10) having a first main surface (11) and a second main surface (12) on the opposite side thereof, and an opening (14) extending through the substrate (10), the first main surface (11) of the substrate (10) is coated with a pattern layer (4) having a pattern surface (41) facing the target surface (51), and one or more recesses (42a,..., 42e) filled with the donor material are patterned on the pattern surface (41), the second main surface (12) is configured to receive irradiation of photon radiation (R3) that preferably penetrates the substrate (10), and the photon radiation has an intensity and duration suitable for causing transfer of the donor material (2) from the one or more recesses (42a,..., 42e) to the target surface (51), the pattern layer (4) is made of a stretchable material and is attached to the first main surface (11) by a sealing (43) applied around the surrounding region (13) of the first main surface, defining the inside (61) and the outside of the enclosure (6), the volume (V 61 ) of the inside (61) depends on the relative difference (P int -P ext ) between the internal pressure and the external pressure, the opening (14) extends through the substrate (10) toward the inside (61) of the enclosure, characterized plate. (Appendix 10) The plate according to appendix 9, characterized in that the stretchable pattern layer (4) is reinforced by one or more relatively rigid members (45a, 45b, 45c, 45d). (Appendix 11) The one or more relatively rigid members are provided with a dielectric coating that locally prevents stretching while maintaining flexibility and provides at least a substantially uniform heat flux into the recess on the side facing the opposite side of the substrate. The dielectric coating is characterized by having a reflectance higher than that of the monochromatic radiation incident on the side wall of the recess with respect to the monochromatic photon radiation of a predetermined wavelength incident on the bottom wall of the recess, the plate according to appended claim 9 or 10. (Appended claim 12) The stretchable pattern layer (4) is further attached to the first main surface (11) of the substrate (10) also at a location within the surrounding region, the plate according to any one of appended claims 9 to 11. (Appended claim 13) A plurality of enclosures are formed on the substrate (10), each of the plurality of enclosures having an individual stretchable layer or a stretchable layer portion (4_1, 4_2, …, 4_9) attached to the substrate by an individual surrounding seal (43_1, 43_2, …, 43_9), the plate according to any one of appended claims 9 to 12. (Appended claim 14) A plate (1) according to any one of appended claims 9 to 13, a holding part (9) for holding an object (5) in a state where the target surface (51) faces the first surface (11) of the plate, a photon radiation source (3) for irradiating photon radiation (R3) toward the second surface (12) of the plate, a pressure adjustment mechanism (7) for controllably generating a relative pressure difference between the interior (61) and the exterior, and a control part (8) for controlling the pressure adjustment mechanism (7) and the photon radiation source (3), the control part having a first operation mode in which the pressure adjustment mechanism (7) is controlled to keep the pressure inside lower than the pressure outside and the photon radiation source (3) is maintained in a stopped state, and a second operation mode in which the pressure adjustment mechanism (7) is controlled to keep the pressure inside higher than the pressure outside and the pattern layer (4) is pressed against the target surface (51), the control part irradiating the photon radiation source (3) with photon radiation (R3) at an intensity and for a duration that causes transfer of a donor material (2) from one or more recesses (42a, …, 42e) to the target surface (51), a vapor deposition apparatus.

Claims

1. A method of depositing a donor material (2) on a target surface (51), comprising: covering a first major surface (11) of a substrate (10) with a stretchable layer (4) having a pattern surface (41) that faces away from the substrate and has one or more recesses (42a,..., 42e) patterned thereon, and attaching the stretchable layer (4) to the first major surface (11) by a seal (43) applied around a surrounding region (13) of the first major surface to define an enclosure (6) (step S1); filling the one or more recesses (42a,..., 42e) with the donor material (2) to be deposited; By supplying gas into the interior (61) of the enclosure (6) through the opening (14) of the substrate (10), a relatively high pressure is applied to the interior (61) compared to the pressure outside the enclosure, and the volume (V ６１ ) is increased, and pressing the patterned surface (41) of the stretchable layer (4) against the target surface (51); irradiating a second major surface (12) of the substrate, opposite to the first major surface (11), with photon radiation having an intensity and duration that causes transfer of the donor material (2) from the one or more recesses (42a,..., 42e) to the target surface (51).

2. The method according to claim 1, wherein a doctor blade (20) is used to fill the one or more recesses (42a,..., 42e) with the donor material (2).

3. The method according to claim 1 or 2, wherein prior to the step of filling the one or more recesses (42a,..., 42e), the interior (61) of the enclosure (6) is evacuated.

4. The method according to claim 1, 2, or 3, wherein a relatively high pressure is applied to the interior (61) by supplying a gas to the interior (61) or by reducing the external pressure.

5. The method according to any one of claims 1 to 4, wherein the intensity and duration of the photon radiation are selected such that a portion of the donor material evaporates at an interface with the outer surface of the stretchable layer (4).

6. The method according to any one of claims 1 to 5, wherein the intensity and duration of the photon radiation are selected such that the donor material is at least partially cured.

7. The method according to any one of claims 1 to 6, further comprising detaching the stretchable layer (4) from the target surface (51) by applying a relatively low pressure to the interior compared to the external pressure.

8. The method according to any one of claims 1 to 7, characterized by including a step of cleaning the pattern surface (41) after the transfer.

9. A plate (1) containing a donor material (2) suitable for vapor deposition on a target surface (51), comprising a substrate (10) having a first main surface (11) and a second main surface (12) on the opposite side thereof, and an opening (14) extending through the substrate (10), wherein the first main surface (11) of the substrate (10) is coated with a pattern layer (4) having a pattern surface (41) facing the target surface (51), and one or more recesses (42a,..., 42e) filled with the donor material are patterned on the pattern surface (41), the second main surface (12) is configured to receive irradiation of photon radiation (R3) that preferably penetrates the substrate (10), and the photon radiation has an intensity and duration suitable for causing transfer of the donor material (2) from the one or more recesses (42a,..., 42e) to the target surface (51), the pattern layer (4) is made of an elastic material and is attached to the first main surface (11) by a sealing (43) applied around the surrounding area (13) of the first main surface, defining the inside (61) and outside of an enclosure (6), The volume (V ６１ ) of the interior (61) depends on the relative difference (P ｉｎｔ - P ｅｘｔ ) between the pressure inside and the pressure outside, the plate, characterized in that the opening (14) extends through the substrate (10) towards the inside (61) of the enclosure.

10. The plate according to claim 9, characterized in that the elastic pattern layer (4) is reinforced by one or more relatively rigid members (45a, 45b, 45c, 45d).

11. The one or more relatively rigid members are provided with a dielectric coating that locally prevents stretching while retaining flexibility and provides at least a substantially uniform heat flux into the recess on the side facing the opposite side of the substrate, the plate according to claim 10, characterized in that the dielectric coating has a higher reflectivity for monochromatic photon radiation of a predetermined wavelength incident on the bottom wall of the recess than for the monochromatic photon radiation incident on the side walls of the recess.

12. The plate according to any one of claims 9 to 11, characterized in that the elastic pattern layer (4) is further attached to the first main surface (11) of the substrate (10) at locations within the surrounding area.

13. A plurality of enclosures are formed on the substrate (10), The plurality of enclosures each having an individual stretchable layer, or a stretchable layer portion (4_1, 4_2, …, 4_9) attached to the substrate by an individual surrounding seal (43_1, 43_2, …, 43_9), the plate according to any one of claims 9 to 12.

14. A plate (1) according to any one of claims 9 to 13, A holding portion (9) for holding an object (5) with a target surface (51) facing the first surface (11) of the plate, A photon radiation source (3) for irradiating photon radiation (R3) toward the second surface (12) of the plate, A pressure adjustment mechanism (7) capable of controllably generating a relative pressure difference between the interior (61) and the exterior, A control unit (8) for controlling the pressure adjustment mechanism (7) and the photon radiation source (3), comprising: The control unit has a first operation mode in which the pressure adjustment mechanism (7) is controlled to keep the internal pressure lower than the external pressure and the photon radiation source (3) is maintained in a stopped state, and a second operation mode in which the pressure adjustment mechanism (7) is controlled to keep the internal pressure higher than the external pressure and the pattern layer (4) is pressed against the target surface (51). The control unit irradiates the photon radiation source (3) with photon radiation (R3) at an intensity and duration that causes transfer of a donor material (2) from one or more recesses (42a, …, 42e) to the target surface (51), a vapor deposition apparatus.

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