Formed body and method for producing the same

Abstract

To provide a component excellent in drive stability without lifting between layers or breakage of wiring when a molded body is used as the component of a circuit device even under severe use conditions such as shock and vibration.SOLUTION: A molded body comprises an insulating layer, a conductive layer, and a base film laminated in this order on a substrate, wherein the conductive layer is a patterned conductive layer, volume resistivity of the insulating layer is 1*10 12 Ω*cm or more to less than 1×1017 Ω*cm, the insulating layer contains a thermoplastic resin (A2) having an aromatic skeleton, and the substrate comprises a thermoplastic resin (A1) containing 50-100% polycarbonate.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a molded body and a method for manufacturing the same.

Background Art

[0002] Patent Document 1 discloses a specific integrated conductive circuit molded article having a resin molded body, a base film embedded flush with one surface of the resin molded body, and a conductive circuit disposed between the resin molded body and the base film. Patent Document 1 describes, as a method for manufacturing the integrated conductive circuit molded article, a method in which a base film having a specific conductive circuit formed thereon is placed on the cavity surface of an injection mold, and then molten resin is injected to injection-mold the resin molded body. In Patent Document 1, the conductive circuit is formed by etching a specific transparent metal thin film.

[0003] As a method for forming a conductive circuit in place of the etching method, a printing method using conductive ink has been studied. According to the method of printing conductive ink, compared with the etching method, there are no complicated processes, a conductive circuit can be easily formed, productivity can be improved, and cost reduction can be achieved. For example, Patent Document 2 discloses a conductive ink containing specific conductive fine particles and a specific epoxy resin as a low-temperature treatment type conductive ink capable of forming a high-definition conductive pattern by screen printing. According to screen printing, thickening of the conductive pattern is possible, and reduction of the resistance of the conductive pattern is said to be achievable.

[0004] Further, Patent Document 3 discloses a method for manufacturing a decorative sheet capable of expressing a three-dimensional sense of solidity, in which a laminate having a printed layer printed in a pattern on a transparent resin layer and a laminated sheet having a decorative layer on a base film are thermocompression bonded to make the decorative layer have an uneven shape along the pattern of the printed layer.

[0005] In addition, Patent Document 4 discloses a method for obtaining a molded article with an integrated conductive circuit, which has a conductive circuit between a resin molded body and the base film by performing thermoforming of a molded film having a conductive pattern formed by printing conductive ink on the base film and integrating it with the resin molded body.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0007] According to the method of Patent Document 1, a conductor can be easily provided on the surface of the molded body. On the other hand, there is an increasing demand to form conductive circuits on the surfaces of base materials with various shapes, such as base materials having uneven or curved surfaces. When forming a conductive circuit by laminating a film having a conductive layer on such a base material surface, the film needs to be deformed according to the surface shape of the base material. When the film is deformed, a large tensile force may be partially generated in the conductive layer. Due to the tensile force, breakage of the conductive layer may occur, resulting in a problem of reduced conductivity. Furthermore, when forming a conductive circuit on a base material having such an uneven or curved surface, after deforming the film having the conductive layer or simultaneously with deforming the film, it is necessary to integrate the film and the base material. In this integration process, stress caused by friction with the plastic base material at high temperature is applied to the conductive circuit. Also due to the high-temperature stress, breakage of the conductive layer may occur, resulting in a problem of reduced conductivity. On the other hand, in the method of Patent Document 4, since resistance to the thermoforming process is imparted to the conductive ink material, the decrease in conductivity due to the above-mentioned high-temperature stress is solved. However, on the other hand, in the conductive circuit formed on the surface of the three-dimensional substrate by this method, the resin molded body and the conductive layer are in direct contact, and the adhesion at this boundary portion is not always sufficient, and in fact, extremely fine voids may occur. For this reason, when this integrated conductive circuit molded product is used as a practical device under severe conditions for a long period of time, the occurrence of short circuits between circuits due to ion migration becomes a problem over time.

[0008] The present invention has been made in view of such circumstances, and suppresses a decrease in conductivity due to tensile stress and stress at high temperature in the molding process, and also has excellent resistance to ion migration between conductive patterns even after molding. An object of the present invention is to provide a molded body in which a molded film is incorporated, and a molded body excellent in impact resistance and conductivity and capable of maintaining circuit characteristics even when used under severe conditions for a long period of time, and a method for manufacturing the same.

Means for Solving the Problems

[0009] The molded body of the present embodiment is a molded body in which a molding film for forming a printed conductive circuit coated with an insulating layer is laminated on the surface of a substrate having an uneven surface or a three-dimensional curved surface, and the conductive layer is a patterned conductive layer. The volume resistivity of the insulating layer is 1×10 12 Ω·cm or more and less than 1×10 17 Ω·cm, the insulating layer contains a thermoplastic resin (A2) having an aromatic skeleton, the substrate contains a thermoplastic resin (A1) containing 50% or more and 100% or less of polycarbonate.

[0010] One embodiment of the present molded body is that the conductive layer is a cured product of a conductive composition containing a thermoplastic resin (A3) and conductive fine particles.

[0011] In one embodiment of the molded article, the difference (Tg1 - Tg2) between the glass transition temperature (Tg1) of the base material and the glass transition temperature (Tg2) of the insulating layer is 30°C or more and 130°C or less.

[0012] In one embodiment of the molded article, the ratio (G‘1 / G‘2) of the storage elastic modulus (G‘1) of the base material at 25°C to the storage elastic modulus (G‘2) of the insulating layer at 25°C is 0.3 or more and 100 or less.

[0013] In one embodiment of the molded article, the melt flow rate of the base material is 5 g / 10 min or more and 40 g / 10 min or less, and the storage elastic modulus of the insulating layer at 200°C is 0 or more and less than 1×10 6 Pa.

[0014] In one embodiment of the molded article, the thermoplastic resin (A1) contained in the base material is a bisphenol A type polycarbonate resin or a polymer alloy of a bisphenol A type polycarbonate resin and an ABS resin, the thermoplastic resin (A2) has a polyester skeleton, and the content of aromatic carboxylic acid units in all constituent carboxylic acid units in the polyester skeleton is 50 mol% or more and 100 mol% or less.

[0015] In one embodiment of the molded article, the insulating layer further contains a wax having a melting point of 70°C or more and 200°C or less.

[0016] In one embodiment of the method for manufacturing a molded article, a step of forming a laminated body in which a conductive layer and an insulating layer are laminated in this order on a base film into a predetermined shape to obtain a formed film, a step of disposing the formed film in a mold for injection molding, a step of molding the base material by injection molding and integrating the formed film and the base material to obtain a molded body, wherein the conductive layer is a patterned conductive layer, the volume resistivity of the insulating layer is 1×10 12 Ω·cm or more and less than 1×10 17 Ω·cm, The insulating layer contains a thermoplastic resin (A2) having an aromatic skeleton, The base material contains a thermoplastic resin (A1) containing 50% or more and 100% or less of polycarbonate.

Advantages of the Invention

[0017] According to the present invention, it is possible to provide a molded body that suppresses a decrease in conductivity due to tensile force in the molding process and stress stress at high temperature, has an excellent molded film with resistance to ion migration between conductive patterns even after molding, is excellent in impact resistance such as dropping, and can maintain excellent circuit characteristics under severe conditions for a long period of time, and a method for manufacturing the same.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0019] Hereinafter, the molded body according to the present embodiment and the manufacturing method thereof will be described in detail in order. In the present embodiment, the cured product includes not only those cured by a chemical reaction but also those cured without a chemical reaction, such as those hardened by the evaporation of a solvent.

[0020] [Molded Body] The molded body of the present embodiment is a molded body provided with an insulating layer, a conductive layer, and a base film on a base material, wherein the base material is a thermoplastic resin, the insulating layer is a cured product of an insulating composition, and the conductive layer is a cured product of a conductive composition. The molded body of the present embodiment is characterized in that a conductive circuit is formed on an arbitrary base material surface such as a concavo-convex surface or a three-dimensional curved surface, and it has excellent impact resistance against dropping and collision.

[0021] In order to manufacture a molded body having a molding film applicable to a non-flat base material surface and having a process suitability for an integration process with a plastic base material and a base material formed from a specific thermoplastic resin, the inventors examined a screen-printable insulating resin composition, a conductive resin composition, and a base material. In order to apply it to the production of a molded body, the ratio of polycarbonate contained in the base material and the volume resistivity of the insulating composition were variously adjusted and examined. As a result, by using an insulating composition having an aromatic skeleton, a molded film obtained, and a base material having a specific structure, it was found that the impact resistance and the ion migration characteristics over time when energized under severe conditions for a long period were different. As a result of investigations based on such findings, the inventors confirmed that in a conductive circuit integrated product in which an insulating layer having a low volume resistivity is laminated on a conductive layer, significantly larger ion migration occurs compared to a flat film circuit substrate or the like. In addition, when the insulating layer formed on the conductive layer does not have an aromatic structure, or when the thermoplastic resin forming the base material does not contain a polycarbonate structure, it was found that more cracks occur in the molded body by a falling ball impact test, and the conductivity of the conductive layer deteriorates significantly due to cracks caused by impact. Furthermore, it became clear that the occurrence of cracks increases the generation of silver black oxide due to ion migration when continuously conducting in the vicinity of the conductive layer under high temperature and high humidity, decreases the insulation resistance value between conductive patterns, and increases the probability of leak touch (dielectric breakdown).

[0022] When such an insulating layer with a slightly low volume resistivity is laminated on a conductive layer, or when a molded film having a conductive layer and an insulating layer that causes more cracks, local deformation, and accompanying ion migration in the conductive layer when deformed by tensile force at high temperature is used as a flat circuit board or the like, or when used in a bent state on a two-dimensional curved surface, there is no problem. However, when used as a molded body that follows and integrates with the shape of a non-flat substrate surface, for example, an uneven shape or a three-dimensional curved surface shape, the molded film will be deformed. Therefore, the deformation stress generated in the conductive layer and the insulating layer due to the deformation of the molded film is concentrated on the conductive layer and the conductive layer / insulating layer interface, and peeling or disconnection occurs, so it is predicted that the conductivity of the conductive layer is reduced. In addition, the uneven surface and the three-dimensional curved surface in the present invention refer not only to a surface having a gentle curved cross section but also to all three-dimensional surfaces having acute angles or rectangular shapes. That is, it refers to a three-dimensional shape that cannot be formed only by deforming a plane without stretching or shrinking it, for example, three-dimensional shapes such as hemispherical, conical, cylindrical, and quadrangular prism shapes. When a certain three-dimensional shape has both elements of the above-mentioned plane or two-dimensional curved surface and a three-dimensional curved surface in a continuous three-dimensional surface, for example, a three-dimensional shape in which one or more partial hemispherical shapes are combined with a planar shape, since it is a three-dimensional shape that cannot be formed by deforming the plane as a whole without stretching or shrinking it, this is also regarded as a three-dimensional curved surface. That is, the uneven surface and the three-dimensional curved surface in the present invention cannot be realized by bending a flexible substrate or the like, and can be realized, for example, by shaping by three-dimensional molding of a molded film under heating.

[0023] Based on these findings, the inventors of the present invention conducted intensive studies. As a result, the volume resistivity of the insulating layer is 1 × 10 12 Ω·cm or more and 1 × 10 17In a conductive circuit integrated product provided with a formed film having a resistance of less than

[0024] Ω·cm, it has been found that the occurrence of ion migration is suppressed. Further, when a formed film in which the thermoplastic resin forming the base material has a polycarbonate structure and the insulating resin composition forming the insulating layer has an aromatic structure is used, in the conductive circuit integrated product, the impact resistance such as dropping becomes good, and it has been found that the deterioration of the wiring during dropping is suppressed. Further, by using the film, a molded body in which a conductive circuit insulated on an arbitrary surface such as an uneven surface or a curved surface of a base material made of a three-dimensional shaped plastic having practical strength can be obtained.

[0024] The molded body of the present embodiment is a molded body in which at least a conductive layer is laminated on a base material, and the conductive layer is a cured product of the conductive composition for the formed film described above. Since the molded body of the present embodiment is formed by the formed film using the conductive composition for the formed film of the present embodiment, it becomes a molded body in which a conductive circuit is formed on an arbitrary surface such as an uneven surface or a curved surface. Hereinafter, two embodiments of the manufacturing method of the molded body of the present embodiment will be described. The molded body of the present embodiment may be manufactured using the conductive composition of the present embodiment, and is not limited to these methods.

[0025] <First manufacturing method> The first manufacturing method of the molded body according to the present embodiment includes a step of manufacturing a formed film by printing a conductive composition for a formed film on a base film and drying it, a step of disposing the formed film on a base material, and a step of integrating the formed film and the base material by an overlay molding method. Hereinafter, it will be described with reference to FIG. 3. Since the manufacturing method of the formed film is as described later, the description here is omitted.

[0026] FIG. 1 is a schematic process diagram showing an example of a first manufacturing method of a molded body. FIGS. 1(A) to (C) illustrate a molding film 10 and a base material 20 disposed in a chamber box of a TOM (Three dimension Overlay Method) molding machine, respectively, and the chamber box is omitted in FIGS. 1(B) and (C). In the first manufacturing method, first, the base material 20 is placed on the table of the lower chamber box 22. Next, the present molding film 10 is passed between the upper chamber box 21 and the lower chamber box 22 and disposed on the base material 20. At this time, the conductive layer of the molding film 10 may be disposed so as to face either the base material 20 side or the side opposite to the base material 20, and is selected according to the application of the final molded body. Next, after the upper and lower chamber boxes are evacuated, the molding film is heated. Next, the table is raised to raise the base material 20 by 15. Next, only the inside of the upper chamber box 21 is opened to the atmosphere (FIG. 1(B)). At this time, the molding film is pressed against the base material side, and the molding film 10 and the base material 20 are bonded and integrated (FIG. 1(C)). In this way, the molded body 30 can be obtained.

[0027] In the first manufacturing method, the base material 20 can be prepared in any method in advance. In the first manufacturing method, a base material resin described later can be used as the material of the base material 20.

[0028] Note that the frictional stress between the base material plastic at high temperature in the integration step with the base material in the first manufacturing method is caused by the frictional stress between the conductive circuit of the molding film and the base material at high temperature when the molding film in FIG. 1(C) is pressed against the base material side and the molding film 10 and the base material 20 are bonded and integrated. That is, in the first manufacturing method, the conductive layer simultaneously receives the load due to the tensile stress during molding and the frictional stress between the base material plastic at high temperature.

[0029] <The Second Manufacturing Method> The second manufacturing method of the molded body according to the present embodiment includes a step of manufacturing a molding film by printing a conductive composition for a molding film, which will be described later, on a base film and drying it, a step of molding the molding film into a predetermined shape, a step of disposing the molded molding film in a mold for injection molding, a step of molding a base material by injection molding and integrating the molding film and the base material. Hereinafter, it will be described with reference to FIG. 2. Note that the second manufacturing method may be referred to as a film insert method.

[0030] FIG. 2 is a schematic process diagram showing an example of the second manufacturing method of the molded body. In the second manufacturing method, the molding film 10 is pre-molded into a predetermined shape by a mold 11 (FIG. 2(A)). After heating and softening the molding film 10, or while softening it, it is molded by suction to the mold by vacuum or pressing to the mold by compressed air, or both are used in combination, and molded by the mold 11 (FIG. 2(B)). At this time, the molding film 10 may be molded so that the conductive layer faces either the base material 20 side, which will be described later, or the side opposite to the base material 20, and is selected according to the use of the final molded body. Next, the molded molding film 10 is disposed in a mold 12 for injection molding (FIGS. 2(C) to 2(D)). Next, resin is injected 14 from the opening 13 to form the base material 20, and the molding film 10 and the base material 20 are integrated to obtain a molded body 30 (FIG. 2(E)).

[0031] In the second manufacturing method, it is not necessary to prepare the base material 20 in advance, and the molding of the base material and the integration with the molding film can be performed simultaneously. As the material of the base material 20, a resin for the base material, which will be described later, can be used.

[0032] In the second manufacturing method, the frictional stress between the base material and the plastic at high temperature in the integration process with the base material described above refers to the injection of resin 14 from the opening 13 in Fig. 2(E) to form the base material 20, and when integrating the molding film 10 and the base material 20, it is caused by the frictional stress received by the conductive layer on the molding film due to the injection of the high-temperature molten resin into the mold. That is, in the second manufacturing method, after the conductive layer receives the load due to the tensile stress during molding, it will receive the frictional stress between the base material plastic at high temperature in a separate process.

[0033] The molded body obtained in this way enables the mounting of circuits, touch sensors, and various electronic components on plastic casings such as those for home appliances, automotive parts, robots, and drones. It is also extremely useful for making electronic devices thinner, lighter, more compact, with improved design freedom, and more multifunctional.

[0034] [Base material] In this embodiment, the base material can be formed using the resin (G) for the base material, and is characterized by containing at least the thermoplastic resin (A1). The thermoplastic resin is not particularly limited as long as it contains 50 to 100% of polycarbonate. Examples of the thermoplastic resin (A1) used for the base material include bisphenol A type polycarbonate resin, an alloy of bisphenol A type polycarbonate resin and ABS resin, and an alloy of bisphenol A type resin and polyester resin. Among these, bisphenol A type resin is preferable because it has high impact resistance against dropping and collision of the molded body.

[0035] The content ratio of polycarbonate in the thermoplastic resin is 50 to 100%, preferably contains 70 to 100% of polycarbonate, and particularly preferably contains 90% or more of polycarbonate. By including polycarbonate within the above range, it is possible to provide a molded body with high impact resistance against dropping and collision of the molded body. Furthermore, due to the high transparency of polycarbonate, it is possible to visually confirm the presence or absence of cracks in the conductive wiring after the impact test of the molded body.

[0036] [Forming film] The layer structure of the forming film used for the formed body of the present embodiment will be described with reference to FIGS. 3 and 4. FIGS. 3 and 4 are schematic cross-sectional views showing an example of the forming film of the present embodiment. The forming film 10 shown in the example of FIG. 3 has a conductive layer 2 on a base film 1, and an insulating layer 3 is provided on the conductive layer 2. The conductive layer 2 may be formed on the entire surface of the base film 1, or may be formed in a desired pattern as in the example of FIG. 3. Further, the insulating layer 3 may be formed on the entire surfaces of the base film 1 and the conductive layer 2, or may be formed in a desired pattern so as to cover a part of the conductive layer 2 as in the example of FIG. 3. The forming film 10 shown in the example of FIG. 4 has a decorative layer 6 on a base film 1, has a conductive layer 2 on the decorative layer 6, and further has an insulating layer 3 on the conductive layer 2. Also, as shown in the example of FIG. 4, the forming film 10 may include electronic components 4 and pins 5 for connecting to an extraction circuit on the conductive layer 2. The forming film 10 shown in the example of FIG. 5 has a conductive layer 2 on a base film 1, and an insulating layer 3 is provided on the conductive layer 2. Also, a second conductive layer 7 is provided on the surface of the base film 1 on the opposite side, and a second insulating layer 8 is provided on the second conductive layer 7. The second conductive layer 7 may also be formed on the entire surface of the base film 1, or may be formed in a desired pattern as in the example of FIG. 5. Further, the second insulating layer 8 may also be formed on the entire surfaces of the base film 1 and the second conductive layer 7, or may be formed in a desired pattern so as to cover a part of the second conductive layer 7 as in the example of FIG. 5. The formed film 10 shown in the example of FIG. 6 has a conductive layer 2 on a base film 1, an insulating layer 3 on the conductive layer 2, a second conductive layer 7 on the insulating layer 3, and a second insulating layer 8 on the second conductive layer 7. In this case, the second conductive layer 7 may be formed on the entire surface of the base film 1 and the insulating layer 3. When there is an exposed portion of the conductive layer 2 that is not covered by the insulating layer 3 as in the example of FIG. 6, it may be provided in a desired pattern so as to be in partial contact with this conductive layer 2. Also, it may not be in contact with any part of the conductive layer 2. The second insulating layer 8 may also be formed on the entire surface of the base film 1, the conductive layer 2, the insulating layer 3, and the second conductive layer 7, or may be formed in a desired pattern so as to cover a part of the second conductive layer 7 as in the example of FIG. 6. Also, although not shown, when the formed film 10 of the present embodiment includes a decorative layer 3, in addition to the example of FIG. 6, a layer configuration in which the decorative layer 3 is provided on one surface of the base film 1 and the conductive layer 2 is provided on the other surface may also be possible. The formed body of the present embodiment includes at least a base material, a base film, an insulating layer, and a conductive layer, and may have other layers as necessary. Hereinafter, each layer of such a formed body will be described.

[0037] [Insulating layer] In the formed film used for the formed body of the present embodiment, the insulating layer is a cured product of an insulating resin composition described later, and the volume resistivity is 1×10 12 Ω·cm or more and less than 1×10 17 Ω·cm. By covering the conductive layer with an insulating layer, it is possible to prevent frictional damage to the conductive layer during the manufacturing process. It also serves as a heat-resistant stress protection layer to prevent the frictional stress between the base plastic at high temperatures from being directly applied to the conductive layer. Furthermore, it becomes possible to ensure insulation during long-term continuous energization between conductive layer patterns. This is because the insulating composition can reliably penetrate and seal the conductive layer with fine irregularities to every corner, and the insulating layer also acts as an adhesive layer with the resin molded body, making it possible to more reliably block moisture, sulfur compounds, and other corrosive gases from the outside. Also, it becomes possible to suppress the physical peeling of the molding film from the resin molded body base material against external impacts and the like. The method for forming the insulating layer is not particularly limited, but in this embodiment, it is preferably formed by screen printing, pad printing, stencil printing, screen offset printing, dispenser printing, gravure offset printing, reverse offset printing, or microcontact printing, and more preferably formed by screen printing. In the screen printing method, it is preferable to use a screen with a mesh in a specific range, particularly preferably a mesh of about 120 to 400 meshes, so as to reliably insulate the conductive circuit pattern from the outside and ensure a certain degree of patterning accuracy. At this time, the open area of the screen is preferably about 20 to 50%. The screen wire diameter is preferably about 10 to 70 μm. Examples of the types of screen plates include polyester screens, combination screens, metal screens, nylon screens, etc. Also, when printing a high-viscosity paste-like material, a high-tension stainless steel screen can be used. The squeegee for screen printing can be any shape, such as round, rectangular, or square, and a polished squeegee can also be used to reduce the attack angle (the angle between the plate and the squeegee during printing). Other printing conditions and the like can be appropriately designed according to conventionally known conditions.

[0038] In the molding film used for the molded body of the present embodiment, the insulating layer is formed by screen printing an insulating resin composition, followed by heating to perform drying and crosslinking reactions for curing. For sufficient volatilization of the solvent and crosslinking reaction, the heating temperature is preferably 80 to 230 °C, and the heating time is preferably 10 to 120 minutes. Thereby, a patterned insulating layer can be obtained. The patterned insulating layer may cover the entire surface of the conductive pattern, but an insulating layer may be provided so as to cover a part of the conductive pattern while leaving the exposed conductive pattern surface that can be connected to an external device when the conductive pattern is used as a circuit.

[0039] The film thickness of the insulating layer may be appropriately adjusted according to the required insulation properties and the like, and is not particularly limited. For example, it can be 5 μm or more and 50 μm or less, and preferably 8 μm or more and 30 μm or less.

[0040] [Insulating resin composition (H)] The insulating resin composition (H) used for the molded body of the present embodiment contains a thermoplastic resin (A2), and may contain a solvent (B1), a crosslinking agent (C1), and other components (F) as required. The following describes each component of such an insulating resin composition.

[0041] [Thermoplastic resin (A2)] The insulating resin composition of the present embodiment contains a binder-type thermoplastic resin (A2) in order to ensure film-forming properties and insulation properties, and to impart adhesion to the conductive layer and the base film or the decorative layer. In addition, in the present embodiment, by containing the thermoplastic resin (A2), when the insulating layer covers the conductive layer, mechanical cushioning performance based on flexibility and toughness can be imparted to the insulating layer. Therefore, by containing the thermoplastic resin (A2), not only the breakage of the insulating layer due to stretching but also the disconnection of the conductive layer are suppressed.

[0042] The thermoplastic resin (A2) only needs to have an aromatic skeleton, and it can be appropriately selected and used from among the resins used for the insulating composition applications. Examples of the thermoplastic resin (A2) include 、 polyether resins, polyester resins, polyurethane resins, epoxy resins, phenoxy resins, polycarbonate resins, polyamide resins, polyimide resins, etc., and they can be used alone or in combination of two or more.

[0043] In this embodiment, the thermoplastic resin (A2) has an aromatic structure, so that the affinity with the base material is improved, the impact resistance is improved, the generation of cracks in the molded body is suppressed, and even when subjected to impact, the wiring does not break and the conductivity of the wiring can be maintained.

[0044] Furthermore, in this embodiment, the thermoplastic resin (A2) preferably has a polyester skeleton. Also, the content of aromatic carboxylic acid units in all constituent carboxylic acid units in the skeleton is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and even more preferably 70 to 100 mol%. By setting it within the above range, the affinity with the base material is improved, and excellent impact resistance and the conductivity of the wiring based on the strong adhesion between the base material and the insulating layer can be maintained.

[0045] In this embodiment, it is preferable that the thermoplastic resin (A2) either has no halogen element in its structure or has an extremely low content thereof. By having no halogen element in its structure, it is suitable in that when laminated and used with the conductive layer, it has even better resistance to ion migration under harsh conditions. Further, in this embodiment, the thermoplastic resin (A2) is particularly preferably a resin having an ester bond in its repeating structure and a weight average molecular weight of 5,000 to 200,000. By being a resin having an ester bond in its repeating structure and a weight average molecular weight of 5,000 to 200,000, the insulating layer efficiently wets and spreads over both the formed film and the surface of the conductive fine particles of the conductive layer and adheres strongly, and by exhibiting appropriate elasticity under high temperature conditions, it is possible to achieve both high-level protection characteristics of the conductive layer from elongation during thermoforming and resistance to ion migration between the conductive patterns after forming the molded body.

[0046] In this embodiment, the thermoplastic resin (A2) may have two or more functional groups selected from arbitrary crosslinkable functional groups, particularly hydroxy groups, amino groups, carboxyl groups, and acid anhydride groups, in one molecule. Among these, from the perspective of reactivity with the crosslinking agent (C1), by using the crosslinkable functional group, it is possible to sufficiently volatilize the solvent, suppress the generation of voids due to the leaving group, and crosslink at a low temperature. Further, by combining with the crosslinking agent (C1), the thermoplastic resin (A2) can be three-dimensionally crosslinked and can be suitably used for applications where hardness is required. Furthermore, when the insulating layer covers the conductive layer by crosslinking, it strengthens the mechanical cushioning performance based on flexibility and toughness in the insulating layer, and it is possible to balance the stretchability during thermoforming of the insulating layer itself at a high level, so it can be more suitably used.

[0047] In this embodiment, the thermoplastic resin (A2) may be synthesized and used by the following-described examples or other known methods, or commercially available products having desired physical properties may be used. In this embodiment, the thermoplastic resin (A2) can be used alone or in combination of two or more.

[0048] The content ratio of the thermoplastic resin (A2) in the insulating resin composition of this embodiment may be appropriately adjusted according to applications and the like and is not particularly limited, but it is preferably 50% by mass or more and 100% by mass or less, more preferably 70% by mass or more and 100% by mass or less, based on the total amount of solid components contained in the conductive resin composition. If the content ratio of the thermoplastic resin (A2) is at least the above lower limit value, the film-forming property and the adhesion to a base film or the like are improved, and flexibility can be imparted to the conductive layer.

[0049] <Solvent (B1)> The solvent (B1) is not particularly limited, but from the viewpoint of continuous screen printability, it preferably has a boiling point of 180°C or higher and 270°C or lower. Examples of the solvent include, but are not limited to, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether acetate, butyl acetate, gamma-butyrolactone, isophorone, tetralin, etc., and these can be used. In this embodiment, the solvent (B2) can be used alone or in combination of two or more.

[0050] <Crosslinking agent (C1)> In this embodiment, a crosslinking agent (C1) may be additionally used as an optional component to crosslink the thermoplastic resin (A2). As the crosslinking agent (C1), it can be appropriately selected from those having two or more reactive functional groups capable of forming a crosslink with the reactive functional group possessed by the thermoplastic resin (A2) in one molecule. Examples of such reactive functional groups include, for example, epoxy group, isocyanate group, blocked isocyanate group, alkyloxyamino group, aziridinyl group, oxetanyl group, carbodiimide group, β-hydroxyalkylamide group, etc. Among these, it is preferable to use an isocyanate-based compound having an isocyanate group or a blocked isocyanate group, and a blocked isocyanate having a blocked isocyanate group can be particularly preferably used.

[0051] Examples of the blocked isocyanate include isocyanate compounds in which the isocyanate groups of bifunctional isocyanates such as hexamethylene diisocyanate, tolylene diisocyanate, xylylene diisocyanate, tetramethylxylylene diisocyanate, and isophorone diisocyanate, or their allophanate, biuret, adduct, prepolymer, and isocyanurate forms, are protected (blocked) with ε-caprolactam, MEK oxime, or the like, and are not particularly limited. Specifically, examples include those in which the isocyanate groups of the above isocyanate compounds are blocked with ε-caprolactam, MEK oxime, cyclohexanone oxime, pyrazole, 3,5-dimethylpyrazole, diisopropylamine, diethyl malonate, ethyl acetoacetate, phenol, or the like. Further, alcohol-blocked aromatic isocyanates such as N-alkoxycarbonylmelamine, which are obtained by treating aromatic nitrogen elements such as melamine and benzoguanamine with an alcohol such as methanol or butanol and a carbonic ester compound, can also be used.

[0052] By using the crosslinking agent (C1) in combination with the thermoplastic resin (A2), not only is the insulating layer three-dimensionally crosslinked, but also crosslinking is formed with the thermoplastic resin (A3) contained in the conductive layer described later, thereby improving the affinity between the conductive layer and the insulating layer, relaxing the stress at the interface, and suppressing cracks in the wiring.

[0053] <Other Component (F)> The insulating resin composition of the present invention may further contain other components as necessary. Examples of such other components include, in addition to the crosslinking agent (C1), modifiers, dispersants, anti-friction improvers, infrared absorbers, ultraviolet absorbers, fragrances, antioxidants, organic pigments, inorganic pigments, defoaming agents, silane coupling agents, plasticizers, flame retardants, moisturizing agents, and the like.

[0054] <Wax (J)> The insulating resin composition of the present invention preferably contains wax (J). By containing wax (J), when injection molding, wax (J) melts to form fine irregularities on the surface of the insulating layer, and an anchor effect works between the injection resin, which has the effect of increasing impact resistance.

[0055] Such wax (J) is not particularly limited. For example, polyethylene wax, amide wax, modified amide wax, etc. can be used. It may be used alone or in combination.

[0056] Specific examples of wax include polyethylene wax A-73 manufactured by Tokyo Fine Chemical Co., Ltd., polyethylene wax CERAFLOUR998R, 999 manufactured by BYK Chemie Co., Ltd., amide wax CERAFLOUR964 manufactured by BYK Chemie Co., Ltd., modified amide wax CERAFLOUR960 manufactured by BYK Chemie Co., Ltd., etc. These may be used alone or in combination.

[0057] The content ratio of wax (J) in the insulating resin composition of the present embodiment may be appropriately adjusted according to the application, etc., and is not particularly limited. However, it is preferably 0.01% by mass or more and 25% by mass or less, and more preferably 0.1% by mass or more and 15% by mass or less with respect to the total solid content contained in the insulating resin composition. If the content ratio of wax (J) is within the above range, blocking of the mold during injection molding can be suppressed, and at the same time, an anchor effect works between the injection resin, and the impact resistance can be increased.

[0058] The melting point of wax (J) in the insulating resin composition of the present embodiment is preferably 70°C or higher and 200°C or lower. By setting it within this range, the wax melts during injection molding, and fine irregularities are formed on the surface of the insulating layer, so that an anchor effect works between the injection resin, and the base material and the insulating layer can be firmly adhered.

[0059] <Manufacturing method of insulating resin composition> The manufacturing method of the insulating composition of the present embodiment may be any method of dissolving or dispersing the thermoplastic resin (A2), the solvent (B1), the crosslinking agent (C1), the other components (F), and the wax (J), and it can be manufactured by mixing them with known mixing means.

[0060] 〔Conductive layer〕 In the molded film of the present embodiment, the conductive layer is a cured product of the conductive resin composition described later. The method for forming the conductive layer is not particularly limited. In the present embodiment, it is preferably formed by screen printing method, pad printing method, stencil printing method, screen offset printing method, dispenser printing method, gravure offset printing method, reverse offset printing method, or microcontact printing method, and more preferably formed by screen printing method. In the screen printing method, in order to cope with the high definition of the conductive circuit pattern, it is preferable to use a fine mesh screen, particularly preferably a fine mesh screen of about 300 to 650 meshes. At this time, the open area of the screen is preferably about 20 to 50%. The screen wire diameter is preferably about 10 to 70 μm. Examples of the types of screen plates include polyester screen, combination screen, metal screen, nylon screen, etc. Also, when printing a high-viscosity paste-like material, a high-tension stainless steel screen can be used. The squeegee for screen printing may be any shape of round, rectangular, or square, and a polished squeegee can also be used to reduce the attack angle (the angle between the plate and the squeegee during printing). Other printing conditions and the like may be appropriately designed according to conventionally known conditions.

[0061] After printing the conductive resin composition by screen printing, it is heated to perform drying and crosslinking reaction for curing. For sufficient volatilization of the solvent and crosslinking reaction, the heating temperature is preferably 80 to 230 °C, and the heating time is preferably 10 to 120 minutes. Thereby, a patterned conductive layer can be obtained.

[0062] The film thickness of the conductive layer may be appropriately adjusted according to the required conductivity and the like, and is not particularly limited. For example, it can be 0.5 μm or more and 20 μm or less, and preferably 1 μm or more and 15 μm or less.

[0063] [Conductive resin composition (I)] In the molding film used for the molded body of the present embodiment, the conductive resin composition (I) contains a thermoplastic resin (A3) and conductive fine particles (D), and may contain a solvent (B2), a crosslinking agent (C2) and other components as necessary. Hereinafter, each component of such a conductive resin composition will be described.

[0064] [Thermoplastic resin (A3)] The conductive composition of the present embodiment contains a binder-type thermoplastic resin (A3) in order to impart film-forming properties and adhesion to the base film or the decorative layer. Further, in the present embodiment, by containing the thermoplastic resin (A3), flexibility can be imparted to the conductive layer. Therefore, by containing the thermoplastic resin (A3), disconnection of the conductive layer due to stretching is suppressed.

[0065] The thermoplastic resin (A3) can be appropriately selected from resins used for conductive resin composition applications. Examples of the thermoplastic resin (A3) include acrylic resins, vinyl ether resins, polyether resins, polyester resins, polyurethane resins, epoxy resins, phenoxy resins, polycarbonate resins, polyvinyl chloride resins, polyolefin resins, styrene block copolymers, polyamide resins, polyimide resins, etc. It can be used alone or in combination of two or more.

[0066] In this embodiment, the thermoplastic resin (A3) may have an aromatic structure in the main chain. By having an aromatic structure, not only can excessive solvent infiltration from the insulating composition be suppressed, but also the affinity at the interface with the insulating layer containing the modifier is improved, thereby suppressing the occurrence of cracks during thermo-stretching formation under higher temperature conditions and suppressing a decrease in conductivity.

[0067] Furthermore, in this embodiment, the thermoplastic resin (A3) may have a bond selected from the group consisting of an ester bond and an amide bond in the main chain. In this case, in addition to preventing solvent infiltration into the above-mentioned conductive layer, since the affinity with the insulating layer containing the modifier is more excellent, the occurrence of cracks during thermo-stretching formation under high temperature conditions can be suppressed, the decrease in conductivity can be further suppressed, and the manufactured molded body has excellent resistance to ion migration.

[0068] In this embodiment, the thermoplastic resin (A3) may have a crosslinkable functional group. The crosslinkable functional group is a substituent selected from a hydroxy group, an amino group, a carboxyl group, and an acid anhydride group, and one or two or more thereof may be contained in one molecule. These crosslinkable functional groups can crosslink the thermoplastic resin (A3) three-dimensionally by combining with a crosslinking agent (C2) described later as necessary, and can be suitably used in applications where hardness is required for the conductive layer. Furthermore, by three-dimensionally crosslinking the interface between the conductive layer containing the thermoplastic resin (A3) and the insulating layer, the interfacial stress of the conductive layer can be reduced, and stress relaxation during thermo-stretching and the occurrence of cracks and voids can be suppressed.

[0069] In this embodiment, the thermoplastic resin (A3) may be synthesized and used by the following examples or other known methods, or commercially available products having desired physical properties may be used. In this embodiment, the thermoplastic resin (A3) can be used alone or in combination of two or more.

[0070] The content ratio of the thermoplastic resin (A3) in the conductive resin composition of the present embodiment may be appropriately adjusted according to the use and the like and is not particularly limited, but it is preferably 5% by mass or more and 50% by mass or less, and more preferably 10% by mass or more and 40% by mass or less with respect to the total amount of the solid content contained in the conductive composition. If the content ratio of the thermoplastic resin (A3) is at least the above lower limit value, the film-forming property and the adhesion to a base film or the like can be improved, and flexibility can be imparted to the conductive layer. Further, if the content ratio of the thermoplastic resin (A3) is at most the above upper limit value, the content ratio of the conductive fine particles (D) can be relatively increased, and a conductive layer excellent in conductivity can be formed.

[0071] <Solvent (B2)> The solvent (B2) is not particularly limited, but from the viewpoint of continuous screen printability, it preferably has a boiling point of 180°C or higher and 270°C or lower. Examples of the solvent include diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether acetate, butyl acetate, gamma-butyrolactone, isophorone, tetralin, etc., but it is not limited thereto and can be used. In the present embodiment, the solvent (B2) can be used alone or in combination of two or more.

[0072] <Conductive fine particles (D)> The conductive fine particles (D) are those in which a plurality of conductive fine particles come into contact with each other in the conductive layer to exhibit conductivity, and in the present embodiment, they are appropriately selected and used from those that can obtain conductivity without heating at a high temperature. Examples of the conductive fine particles used in the present embodiment include metal fine particles, carbon fine particles, conductive oxide fine particles, and the like. Examples of the metal fine particles include, in addition to single metal powders such as gold, silver, copper, nickel, chromium, palladium, rhodium, ruthenium, indium, aluminum, tungsten, molybdenum, and platinum, alloy powders such as copper-nickel alloy, silver-palladium alloy, copper-tin alloy, silver-copper alloy, and copper-manganese alloy, and metal-coated powders in which the surfaces of the single metal powders or alloy powders are coated with silver or the like. Examples of the carbon fine particles include carbon black, graphite, and carbon nanotubes. Examples of the conductive oxide fine particles include silver oxide, indium oxide, tin oxide, zinc oxide, and ruthenium oxide.

[0073] In this embodiment, among others, it is preferable to contain one or more kinds of conductive fine particles selected from silver powder, copper powder, silver-coated powder, copper alloy powder, conductive oxide powder, and carbon fine particles. By using these conductive fine particles (D), a conductive layer excellent in conductivity can be formed without sintering, and further, a conductive layer excellent in stretchability and conductivity retention performance when formed into a three-dimensional shape as a molded body described later can be formed.

[0074] The shape of the conductive fine particles (D) is not particularly limited, but is preferably flake-like or chain-aggregated. In the case of flake-like, it is not particularly limited as long as it has a two-dimensional planar flat shape. The "flake-like" in the present invention refers to all two-dimensional planar flat shapes called scaly, flaky, plate-like, flat, sheet-like, etc. Among them, from the viewpoints of maintaining printability, maintaining conductivity during molding and stretching, and friction stress resistance against the base plastic at high temperature in the integration process with the plastic base material, those having an aspect ratio of 3 or more and 500 or less are particularly preferable. In the case of chain-aggregated, it is not particularly limited as long as it has an irregular shape in which fine spherical particles are bound to each other. The "chain-aggregated" in the present invention refers to all irregular shapes formed by the binding of spherical particles called bound spherical, chain spherical, aggregated, etc. Being chain-aggregated is also particularly preferable from the viewpoints of maintaining printability, maintaining conductivity during molding and stretching, and friction stress resistance against the base plastic at high temperature in the integration process with the plastic base material.

[0075] The average particle diameter of the conductive fine particles is not particularly limited, but from the viewpoints of dispersibility in the conductive composition, retention of printability, maintenance of conductivity during molding, resistance to the injection molding process by the molten resin, or high-temperature tensile resistance to the molded resin, it is preferably 0.5 μm or more and 30 μm or less, more preferably 1 μm or more and 15 μm or less. In this implementation, the average particle diameter of the conductive fine particles (D) is calculated as follows. In accordance with the laser diffraction / scattering method described in JIS M8511 (2014), using a laser diffraction / scattering type particle size distribution measuring device (manufactured by Nikkiso Co., Ltd.: Microtrac 9220FRA), an appropriate amount of the conductive fine particles (D) was added to an aqueous solution containing 0.5% by volume of a commercially available surfactant polyoxyethylene octylphenyl ether (manufactured by Roche Diagnostics K.K.: Triton X-100) as a dispersant, irradiated with 40 W of ultrasonic waves for 180 seconds while stirring, and then measured. The value of the obtained median diameter (D50) was taken as the average particle diameter of the conductive fine particles (D).

[0076] In this implementation, the conductive fine particles (D) can be used alone or in combination of two or more. The content ratio of the conductive fine particles (D) in the conductive composition of this implementation may be appropriately adjusted according to the use and the like and is not particularly limited, but is preferably 50% by mass or more and 85% by mass or less, more preferably 55% by mass or more and 80% by mass or less, based on the total amount of the solid content contained in the conductive composition. If the content ratio of the conductive fine particles (D) is equal to or higher than the above lower limit value, a conductive layer excellent in conductivity can be formed. Further, if the content ratio of the conductive fine particles (D) is equal to or lower than the above upper limit value, the content ratio of the thermoplastic resin (A3) can be increased, the film-forming property and the adhesion to a base film or the like are improved, and flexibility can be imparted to the conductive layer.

[0077] <Optional component> In the molding film used for the molded body of the present invention, the conductive resin composition may further contain other components as necessary. Such other components include, in addition to the crosslinking agent (C2), a dispersant, an anti-friction improver, an infrared absorber, an ultraviolet absorber, a fragrance, an antioxidant, an organic pigment, an inorganic pigment, an antifoaming agent, a silane coupling agent, a plasticizer, a flame retardant, a moisturizing agent, and the like.

[0078] <Crosslinking agent (C2)> In this embodiment, the crosslinking agent (C2) may be additionally used as an optional component to crosslink the thermoplastic resin (A3). As the crosslinking agent (C2), it can be appropriately selected from those having two or more reactive functional groups capable of forming a crosslink with the reactive functional group of the thermoplastic resin (A3) in one molecule and used. Examples of such reactive functional groups include an epoxy group, an isocyanate group, a blocked isocyanate group, an alkyloxyamino group, an aziridinyl group, an oxetanyl group, a carbodiimide group, a β-hydroxyalkylamide group, and the like.

[0079] <Method for producing the conductive resin composition> The method for producing the conductive resin composition of this embodiment may be any method of dissolving or dispersing the thermoplastic resin (A3), the conductive fine particles (D), the solvent (B2), the crosslinking agent (C2) and other components used as necessary, and it can be produced by mixing them by known mixing means.

[0080] <Base film> In this embodiment, the base film can be appropriately selected from those having flexibility and stretchability to the extent that they can follow the shape of the base material surface under the molding temperature conditions during base material formation, and it is preferably selected according to the use of the molded body, the manufacturing method of the molded body, and the like. For example, when adopting the overlay molding method or the film insert method described later as the manufacturing method of the molded body, since the base film remains in the molded body, the base film can be selected in consideration of functions such as having a function as a protective layer for the conductive layer.

[0081] The base film can be appropriately selected from the above viewpoints. For example, it can be a film such as polycarbonate, polymethyl methacrylate, polyethylene terephthalate, polystyrene, polyimide, polyamide, polyethersulfone, polyethylene naphthalate, polybutylene terephthalate, polyvinyl chloride, polyethylene, polypropylene, cycloolefin polymer, ABS (acrylonitrile-butadiene-styrene copolymer resin), AES (acrylonitrile-ethylene-styrene copolymer resin), Kydax (acrylic-modified vinyl chloride resin), modified polyphenylene ether, and a polymer alloy composed of two or more of these resins, or a laminated film of these may also be used. Among them, a film selected from polycarbonate, polymethyl methacrylate, polypropylene, and polyethylene terephthalate, or a laminated film of these is preferably used. As the laminated film, among others, a laminated film of polycarbonate and polymethyl methacrylate is preferred. The method for manufacturing a laminated film of polycarbonate and polymethyl methacrylate is not particularly limited. A polycarbonate film and a polymethyl methacrylate film may be laminated by bonding them together, or polycarbonate and polymethyl methacrylate may be laminated as a laminated film by coextrusion. It is also preferable that the surface of these base films is subjected to a surface modification treatment such as corona treatment.

[0082] Further, if necessary, for the purpose of improving the printability of the conductive resin composition, an anchor coat layer may be provided on the base film, and the conductive resin composition may be printed on the anchor coat layer. The anchor coat layer is not particularly limited as long as it has good adhesion to the base film and further good adhesion to the conductive resin composition and follows the film during molding. Organic fillers such as resin beads and inorganic fillers such as metal oxides may also be added as necessary. The method for providing the anchor coat layer is not particularly limited, and it can be obtained by coating, drying, and curing by a conventionally known coating method. Furthermore, if necessary, a hard coat layer may be provided on the base film to prevent damage to the surface of the molded body, and a conductive composition and, if necessary, a decorative layer may be printed on the opposite surface. The hard coat layer is not particularly limited as long as it has good adhesion to the base film and, furthermore, good surface hardness and follows the film during molding. Organic fillers such as resin beads and inorganic fillers such as metal oxides may also be added as necessary. The method of providing the hard coat layer is not particularly limited, and it can be obtained by applying, drying, and curing by a conventionally known coating method.

[0083] Also, in the molding film of the molded body of the present embodiment, when the molding film has a decorative layer, it is preferable to select a base film having transparency.

[0084] The thickness of the base film is not particularly limited, but for example, it can be 10 μm or more and 500 μm or less, and preferably 20 μm or more and 450 μm or less.

[0085] [Decorative layer] From the viewpoint of design, the molded body of the present embodiment may have a decorative layer. The decorative layer may be a layer having a single color tone or may have an arbitrary pattern. As an example, the decorative layer can be formed by preparing a decorative ink containing a coloring material, a resin, and a solvent, and then applying the decorative ink to the base film by a known printing means. As the coloring material, it can be appropriately selected and used from known pigments and dyes. As the resin, it is preferably appropriately selected and used from those similar to the thermoplastic resin (A2) in the insulating resin composition of the present embodiment. The thickness of the decorative layer is not particularly limited, but for example, it can be 0.5 μm or more and 10 μm or less, and preferably 1 μm or more and 5 μm or less.

[0086] <Difference (Tg1 - Tg2) between the glass transition point (Tg1) of the base material and the glass transition point (Tg2) of the insulating layer> In the present invention, the difference (Tg1 - Tg2) between the glass transition temperature (Tg1) of the base material and the glass transition temperature (Tg2) of the insulating layer is preferably 30°C or more and 130°C or less, more preferably 50°C or more and 130°C or less, and still more preferably 60°C or more and 130°C or less. By being within the above range, the impact resistance of the wiring of the molded body can be enhanced, wiring deterioration can be suppressed, and there is an effect of resistance to ion migration.

[0087] <Ratio (G‘1 / G‘2) of the storage elastic modulus (G‘1) of the base material at 25°C and the storage elastic modulus (G‘2) of the insulating layer at 25°C> In the present invention, the ratio (G‘1 / G‘2) of the storage elastic modulus (G‘1) of the base material at 25°C and the storage elastic modulus (G‘2) of the insulating layer at 25°C is preferably 0.3 or more and less than 100, more preferably 1.0 or more and less than 100, and still more preferably 1.5 or more and less than 100. By setting it within the above range, when the base material is injection-molded, there is an excellent impact resistance effect based on the high adhesion between the insulating layer of the molded body. The storage elastic modulus was determined by a dynamic viscoelasticity measuring device DVA-225 manufactured by IT Measurement & Control Co., Ltd., and the ratio was calculated from the storage elastic moduli of the base material and the insulating layer at 25°C.

[0088] <Melt flow rate of the base material and storage elastic modulus (G‘3) of the insulating layer at 200°C> In the present invention, the melt flow rate of the base material is 5 g / 10 min or more and less than 40 g / 10 min, and the storage elastic modulus (G‘3) of the insulating layer at 200°C is 0 or more and less than 1×10 6 Pa, more preferably, the melt flow rate of the base material is 10 g / 10 min or more and less than 40 g / 10 min, and the storage elastic modulus (G‘3) of the insulating layer at 200°C is 1×10 3 or more and less than 1×10 6 Pa, still more preferably, the melt flow rate of the base material is 10 g / 10 min or more and less than 30 g / 10 min, and the storage elastic modulus (G‘3) of the insulating layer at 200°C is 1×10 4 or more and less than 1×106 It is preferably less than Pa. By setting it within the above range, when the base material is injection-molded, there is an impact resistance effect based on the high adhesion to the insulating layer of the molded body. In addition, the melt flow rate in the present invention is a value calculated by the mass measurement method at 300 °C using a No120 melt flow rate tester manufactured by Yasuda Seiki Seisakusho Co., Ltd. Further, the storage elastic modulus (G‘3) at 200 °C was determined by a dynamic viscoelasticity measuring device DVA-225 manufactured by IT Measurement & Control Co., Ltd., and the storage elastic modulus of the insulating layer at 200 °C was calculated.

Examples

[0089] The present invention will be described in more detail below with reference to examples. However, the following examples do not limit the present invention in any way. In the examples, "parts" represents "parts by mass" and "%" represents "% by mass". In addition, the weight average molecular weight and number average molecular weight in the examples are the polystyrene-converted molecular weights in the measurement using GPC (gel permeation chromatography) "HLC-8320" manufactured by Tosoh Corporation. In addition, the storage elastic modulus of the base material was measured by a dynamic viscoelasticity measuring device DVA-225 manufactured by IT Measurement & Control Co., Ltd. after putting the base material into a metal pan with a length of 15 cm, a width of 30 cm, and a depth of 1 cm, heating and melting it in an oven at 300 °C, molding it with a press, and cutting it into a size of 0.5 cm in length and 2 cm in width. The storage elastic modulus of the insulating layer was measured in the same manner as the base material using a sample obtained by coating a thermoplastic resin (A2) on a release film with a bar coater and drying it in an oven at 120 °C for 30 minutes, and then peeling it off and cutting it into a size of 0.5 cm × 5.0 cm. In addition, the melt flow rate of the base material was determined by a method based on JIS standard K7210-1:2014 (ISO1133-1:2011).

[0090] <Resin (G) for base material (G―1)~(G-8)> The following base materials were used as the base material resins (G-1) to (G-5). · Resin for substrate (G-1): Polycarbonate resin manufactured by Mitsubishi Engineering-Plastics Corporation, containing bisphenol A type polycarbonate resin as thermoplastic resin (A1), with a polycarbonate content of 100%, a glass transition point of 240 °C, and a melt flow rate of the substrate of 63 g / 10 min. · Resin for substrate (G-2): Polycarbonate resin manufactured by Mitsubishi Engineering-Plastics Corporation, containing bisphenol A type polycarbonate resin as thermoplastic resin (A1), with a polycarbonate content of 100%, a glass transition point of 153 °C, and a melt flow rate of the substrate of 15 g / 10 min. · Resin for substrate (G-3): Polycarbonate resin manufactured by Mitsubishi Engineering-Plastics Corporation, containing bisphenol A type polycarbonate resin as thermoplastic resin (A1), with a polycarbonate content of 100%, a glass transition point of 153 °C, and a melt flow rate of the substrate of 5.3 g / 10 min. · Resin for substrate (G-4): Polycarbonate resin manufactured by Toray Industries, Inc., an alloy containing bisphenol A type polycarbonate resin and ABS resin as thermoplastic resin (A1), with a polycarbonate content of 85%, a glass transition point of 153 °C, and a melt flow rate of the substrate of 14 g / 10 min. · Resin for substrate (G-5): Polycarbonate resin manufactured by Mitsubishi Engineering-Plastics Corporation, an alloy containing bisphenol A type polycarbonate resin and ABS resin as thermoplastic resin (A1), with a polycarbonate content of 60%, a glass transition point of 153 °C, and a melt flow rate of the substrate of 37 g / 10 min. · Resin for substrate (G-6): Polycarbonate resin manufactured by Mitsubishi Engineering-Plastics Corporation, an alloy containing bisphenol A type polycarbonate resin and polyester resin as thermoplastic resin (A1), with a polycarbonate content of 70%, a glass transition point of 153 °C, and a melt flow rate of the substrate of 20 g / 10 min. · Resin for substrate (G-7): Polycarbonate resin manufactured by Mitsubishi Engineering-Plastics Corporation, an alloy containing bisphenol A type polycarbonate resin and polyester resin as thermoplastic resin (A1), with a polycarbonate content of 95%, a glass transition point of 153 °C, and a melt flow rate of the substrate of 7 g / 10 min. · Resin for substrate (G-8): ABS resin manufactured by Toray Industries, Inc., containing ABS resin as thermoplastic resin (A1), with a polycarbonate content of 0%, a glass transition point of 85°C, and a melt flow rate of the substrate of 48 g / 10 min. · Resin for substrate (G―9): Polycarbonate resin manufactured by Mitsubishi Engineering-Plastics Corporation, an alloy containing bisphenol A type polycarbonate resin and polyethylene terephthalate resin as thermoplastic resin (A1), with a polycarbonate content of 25%, a glass transition point of 153°C, and a melt flow rate of the substrate of 5 g / 10 min.

[0091] <Thermoplastic resin (A2): (A-1)~(A-5)> The following resins were used as thermoplastic resins (A-1)~(A-5).

[0092] <Synthesis Example 1: Synthesis of thermoplastic resin (A-1)> Into a reactor equipped with a stirrer, thermometer, rectification column, nitrogen gas inlet tube, and decompression device, 6.5 parts (0.03 mol) of dimethyl isophthalate, 2.0 parts (0.01 mol) of dimethyl terephthalate, 2.5 parts (0.02 mol) of adipic acid, 5.0 parts (0.08 mol) of ethylene glycol, 5.0 parts (0.05 mol) of neopentyl glycol, and 0.03 part of tetrabutyl titanate were charged. While stirring under a nitrogen stream, the mixture was gradually heated to 180°C, and an ester exchange reaction was carried out at 180°C for 3 hours. After measuring the acid value and when it reached 15 or less, the inside of the reactor was gradually decompressed to 1 - 2 Torr. When the predetermined viscosity was reached, the reaction was stopped and taken out, and then transferred to a fluorine-treated pallet for cooling to obtain a solid of polyester resin (A-1) having a weight average molecular weight of 16,000, a glass transition point of 47°C, having an aromatic ring skeleton and a polyester skeleton in the main chain, and the content of aromatic carboxylic acid units in all constituent carboxylic acid units in the polyester skeleton being 71.9%.

[0093] <Synthesis Example 2: Synthesis of thermoplastic resin (A-2)> Into a reactor equipped with a stirrer, a thermometer, a rectification tube, a nitrogen gas introduction tube, and a decompression device, 6.5 parts (0.03 mol) of dimethyl isophthalate, 6.5 parts (0.03 mol) of dimethyl terephthalate, 9.5 parts (0.06 mol) of 1,4-cyclohexanedicarboxylic acid, 2.5 parts (0.04 mol) of ethylene glycol, 6.5 parts (0.06 mol) of neopentyl glycol, and 0.03 part of tetrabutyl titanate were charged. While stirring under a nitrogen stream, the mixture was gradually heated to 180 °C, and transesterification reaction was carried out at 180 °C for 3 hours. The acid value was measured. When it became 15 or less, the inside of the reactor was gradually depressurized to 1 to 2 Torr. When a predetermined viscosity was reached, the reaction was stopped and taken out, and then transferred to a fluorine-treated pallet and cooled to obtain a solid of a polyester resin (A-2) having a weight average molecular weight of 23,000, a glass transition point of 7 °C, an aromatic ring skeleton and a polyester skeleton in the main chain, and the content of aromatic carboxylic acid units in all constituent carboxylic acid units in the polyester skeleton being 54.8%.

[0094] <Synthesis Example 3: Synthesis of Thermoplastic Resin (A-3)> Into a reactor equipped with a stirrer, a thermometer, a rectification tube, a nitrogen gas inlet tube, and a decompression device, 10.0 parts (0.05 mol) of dimethyl isophthalate, 5.5 parts (0.03 mol) of dimethyl terephthalate, 4.5 parts (0.03 mol) of adipic acid, 2.5 parts (0.01 mol) of sebacic acid, 5.0 parts (0.08 mol) of ethylene glycol, 5.0 parts (0.05 mol) of neopentyl glycol, and 0.03 part of tetrabutyl titanate were charged. While stirring under a nitrogen stream, the mixture was gradually heated to 180 °C, and transesterification reaction was carried out at 180 °C for 3 hours. The acid value was measured. When it reached 15 or less, the pressure inside the reactor was gradually reduced to 1 to 2 Torr. When a predetermined viscosity was reached, the reaction was stopped and the product was taken out, then transferred to a fluorine-treated pallet and cooled to obtain a solid of a polyester resin (A-3-1) having a weight average molecular weight of 17,000, a glass transition temperature of 45 °C, an aromatic ring skeleton and a polyester skeleton in the main chain, and the content of aromatic carboxylic acid units in all constituent carboxylic acid units in the polyester skeleton being 64.1%. Subsequently, into a separable flask equipped with a stirrer, a thermometer, a distillate trap, a nitrogen gas inlet tube, and a pressure reduction regulator, 225.0 parts of the above polyester resin, 32.3 parts of isophorone diisocyanate, and 63.6 parts of toluene were charged. The mixture was stirred at 90 °C for 4 hours under a nitrogen stream. Then, 3.6 parts of isophoronediamine was added, and the reaction was further carried out at 90 °C for 2 hours. After that, the mixture was cooled to stop the reaction. Then, after taking it out, it was transferred to a fluorine-treated pallet and dried in a hot air drying oven at 120 °C for 4 hours, and further vacuum dried for 24 hours to obtain a solid of a urethane resin (A-3) having a weight average molecular weight of 23,000, a glass transition temperature of 20 °C, an aromatic ring skeleton and a polyester skeleton in the main chain, and the content of aromatic carboxylic acid units in all constituent carboxylic acid units in the polyester skeleton being 64.9%.

[0095] · Thermoplastic resin (A-4): Phenoxy resin manufactured by Mitsubishi Chemical Corporation, jER-4250, having a weight average molecular weight of 59,000, a glass transition temperature of 70 °C, and an aromatic ring skeleton in the main chain. · Thermoplastic resin (A-5): Acrylic resin Dianal BR-77 manufactured by Mitsubishi Chemical Corporation, weight average molecular weight 65,000, glass transition point 80°C, having no aromatic ring skeleton and polyester skeleton in the main chain. · Thermoplastic resin (A-6): A solution obtained by diluting chloropropylene rubber "CS4503F" manufactured by Semedine Co., Ltd. with a butyl acetate solution to a solid content of 40% was used.

[0096] <Thermoplastic resin (A3): (A-7) to (A-9)> The following resins were used as thermoplastic resins (A-7) to (A-9). · Thermoplastic resin (A-7): Acrylic resin Dianal BR-83 manufactured by Mitsubishi Chemical Corporation, weight average molecular weight 40,000, glass transition point 80°C was used. · Thermoplastic resin (A-8): Polyester resin "Eryther UE3400" manufactured by Unitika Ltd., weight average molecular weight 25,000 was used.

[0097] <Synthesis Example 4: Synthesis of Thermoplastic Resin (A-9)> Into a separable flask equipped with a stirrer, thermometer, distillate trap, nitrogen gas inlet tube, and pressure regulator, 223.0 parts of thermoplastic resin (A-8) ("Eryther UE3400"), 72.0 parts of isophorone diisocyanate, and 90.6 parts of toluene were charged, and stirred at 90°C for 4 hours under a nitrogen stream. Then, 5.5 parts of isophoronediamine was added and reacted at 90°C for another 2 hours, and then cooled to stop the reaction. After that, after taking it out, it was transferred to a fluorine-treated pallet and dried in a hot air drying oven at 120°C for 4 hours, and further dried under vacuum for 24 hours to obtain a solid of urethane resin (A-9) with a weight average molecular weight of 31,000 and a glass transition point of 5°C.

[0098] The following were used as the solvent, crosslinking agent, conductive fine particles, and other components. <Solvents (B-1) to (B-4)> · Solvent (B-1): 1,2,3,4-Tetrahydronaphthalene, boiling point 209°C · Solvent (B-2): Butyl acetate, boiling point 126°C · Solvent (B-3): 2-methoxypropanol, boiling point 121 °C · Solvent (B-4): Diethylene glycol monoethyl ether acetate, boiling point 217 °C

[0099] <Crosslinking agent (C-1)> · Crosslinking agent (C-1) Block isocyanate solution manufactured by Baxeneden Chemicals, Trixene BI7963, containing 3 isocyanate groups blocked with ethyl methyl ketoxime in one molecule (functional group value 168 mg KOH / g), non-volatile content 70% (solvent (E3): 2-methoxypropanol)

[0100] <Conductive fine particles (D-1) to (D-4)> · Conductive fine particles (D-1): Flaky silver powder manufactured by Fukuda Metal Foil Powder Co., Ltd., average particle diameter 5.2 μm · Conductive fine particles (D-2): Chain-aggregated silver powder manufactured by Fukuda Metal Foil Powder Co., Ltd., average particle diameter 1.5 μm · Conductive fine particles (D-3): Flaky silver-coated copper powder manufactured by DOWA Electronics Co., Ltd., silver coating amount 10%, average particle diameter 4.0 μm · Conductive fine particles (D-4): Scaly graphite manufactured by Ito Graphite Co., Ltd., average particle diameter 15 μm

[0101] <Other components (E-1), (E-2)> · Other component (E-1): Antifoaming agent manufactured by BYK-Chemie, BYK-1790, solid content 100% · Other component (E-2): Anionic lubricant manufactured by Daiichi Kogyo Seiyaku Co., Ltd., Karisekken HY, solid content 100%

[0102] <Wax (J) (J-1)> · Amide wax manufactured by BYK-Chemie, CERAFLOUR-960, solid content 100%, melting point 145 °C

[0103] <Production Example 1: Preparation of insulating resin composition (H-1)> 22.0 parts of thermoplastic resin (A-1) was dissolved in 30.0 parts of solvent (B-1), 0.2 parts by weight of antifoaming agent (E-1) was added, and the mixture was stirred and mixed uniformly using a planetary mixer to obtain insulating resin composition (H-1).

[0104] <Production Examples 2 to 12: Preparation of Insulating Resin Compositions (H-2) to (H-12)> Insulating compositions for molded films (H-2) to (H-12) were obtained in the same manner as in Production Example 1, except that the thermoplastic resin, solvent, crosslinking agent, other components, and their amounts were changed as shown in Table 2.

[0105] <Production Example 13: Preparation of conductive resin composition (I-1)> 22.0 parts of thermoplastic resin (A-7) was dissolved in 31.0 parts of solvent (B-1), and 78.0 parts of conductive fine particles (D-1) were stirred and mixed. The mixture was kneaded in a three-roll mill (manufactured by Kodaira Seisakusho Co., Ltd.), and then stirred and mixed uniformly in a planetary mixer to obtain a conductive resin composition (I-1).

[0106] <Production Examples 14 to 20: Preparation of Conductive Resin Compositions (I-2) to (I-8)> Conductive compositions for molded films (I-2) to (I-8) were obtained in the same manner as in Production Example 13, except that the types and amounts of thermoplastic resin, solvent, conductive fine particles, and crosslinking agent (when a crosslinking agent was used, it was added immediately before uniform stirring and mixing with a planetary mixer) were changed as shown in Table 3. The numerical values ​​for each material in Tables 2 and 3 are all parts by mass.

[0107] <Example 1: Creation of molded body by film insert molding> On a polycarbonate (PC)-based film (manufactured by Teijin Limited, Panlite 2151, thickness: 300 μm), a conductive resin composition (I-1) was printed using a screen printing machine (manufactured by Minoscreen Co., Ltd., Minomat SR5575 semi-automatic screen printing machine). Subsequently, by heating in a hot air drying oven at 120°C for 30 minutes, a molded film was obtained that had each of the following conductive layers: (1) a square solid pattern with a width of 70 mm, a length of 120 mm, and a thickness of 10 μm; (2) a linear pattern with a line width of 2 mm, a length of 80 mm, and a thickness of 10 μm; and (3) a comb-shaped wiring pattern with an L / S of 100 μm / 100 μm, 10 positive and 10 negative opposing line lengths of 50 mm each. For the square solid pattern at this stage, the volume resistivity of the conductive layer was measured using a resistivity meter (manufactured by Mitsubishi Chemical Analytic, Loresta GX MCP-T700). Furthermore, an insulating resin composition (H-1) was screen-printed onto the surface of the formed film provided with this conductive layer on which the conductive pattern was formed. (1) For the square solid conductive pattern, the width was 90 mm, the length was 140 mm, and the thickness was 15 μm so as to cover the entire conductive pattern. (2) For the linear pattern, both ends in the Nagakute direction were exposed by 10 mm, the width was 5 mm, the length was 60 mm, and the thickness was 15 μm so as to cover a part of the wiring pattern. (3) For the comb-shaped wiring pattern, both ends were exposed by 10 mm, the width was 6 mm, the length was 80 mm, and the thickness was 15 μm so as to cover a part of the wiring pattern. Then, the formed film provided with an insulating layer laminated so as to cover the patterned conductive layer and a part or all thereof was obtained by heating at 120 °C for 30 minutes in a hot air drying oven. At this time, formed films were created so that the combination of the conductive composition and the insulating composition would be as shown in Tables 4 to 7. Regarding the insulating layer portion at the end of the square solid pattern in this stage that did not overlap with the conductive layer, the volume resistivity of the insulating layer was measured using a resistivity meter (manufactured by Mitsubishi Chemical Analytic, High Resista UX MCP-HT800). Also, a vertical line 2 cm long was drawn with an oil-based magic pen as a mark from the opposite side of the formed film at a position 6 mm from both ends where the conductive layer of the linear pattern of the obtained formed film was exposed. Subsequently, a block-shaped metal mold having a hemispherical shape with a radius of 4 cm at the center was aligned so as to face the surfaces on the conductive layer and insulating layer sides so as to overlap the positions of the linear pattern and the comb-shaped wiring patterns with a line width of 6 mm, a length of 80 mm, and an L / S = 100 μm / 100 μm, ten each of positive and negative. Overlay molding was performed at a set temperature of 160 °C using a TOM molding machine (manufactured by Busch Vacuum Co., Ltd.) to obtain formed films each having a patterned conductor inside the hemispherical shape. Next, the formed film shaped into the hemispherical shape was set in an injection molding machine (IS170(i5), manufactured by Toshiba Machine Co., Ltd.) equipped with an in-mold molding test die of the valve gate type, and the resin for the base material (G-1) was injection molded to obtain a molded body integrated with the formed film with the patterned conductor (injection conditions: screw diameter 40 mm, cylinder temperature 290 °C, mold temperature (fixed side, movable side) 80 °C, injection pressure 180 MPa, holding pressure 120 MPa, injection speed 60 mm / second (28%), injection time 4 seconds, cooling time 20 seconds or more for injection).

[0108] <Examples 2 to 23, 42 to 44, Comparative Examples 2 to 4> In Example 1 above, a molded body was obtained in the same manner as in Example 1, except that the base material, the insulating resin composition, and the conductive resin composition were changed as shown in Tables 4 to 7.

[0109] <Examples 24 to 41, Comparative Example 10> In Example 1 above, a molded body was obtained in the same manner as in Example 1, except that the base material, the insulating resin composition, and the conductive resin composition were changed as shown in Tables 5 and 6, and the cylinder temperature during injection molding was changed to 245 °C.

[0110] <Comparative Example 5> In Example 1 above, a molded body was obtained in the same manner as in Example 1, except that the base material, the insulating resin composition, and the conductive resin composition were changed as shown in Table 7, and the cylinder temperature was changed to 220 °C during injection molding.

[0111] <Example 45 and Comparative Example 6> In Example 16 above, an acrylic resin-based film (Technoloy S001G, thickness 250 μm) (300 mm × 210 mm) manufactured by Sumitomo Chemical Co., Ltd. was used instead of the polycarbonate-based film, and a molded body was obtained in the same manner as in Example 16, except that the drying conditions in the hot air drying oven were 80 °C for 30 minutes.

[0112] <Example 46 and Comparative Example 7> In Example 16, a two-layer coextruded base film of polycarbonate resin / acrylic resin (Technoloy C001, manufactured by Sumitomo Chemical Co., Ltd., thickness 125 μm) was used instead of the polycarbonate-based film, and a conductive resin composition and an insulating resin composition for a molded film were printed on the polycarbonate resin side. Otherwise, a molded article was obtained in the same manner as in Example 16.

[0113] <Example 47 and Comparative Example 8> In Example 16, a polypropylene resin-based film (Purethermo AG-306, manufactured by Idemitsu Unitech Co., Ltd., thickness 200 μm) was used instead of the polycarbonate-based film, and the drying conditions in a hot air drying oven were set to 80 °C for 30 minutes. Otherwise, a molded article was obtained in the same manner as in Example 16.

[0114] <Example 48 and Comparative Example 9> In Example 16, a polyethylene terephthalate resin-based film (A-PET film, NOACRYSTAL-V, manufactured by RP-Toray Co., Ltd., thickness 300 μm) was used instead of the polycarbonate-based film, and the drying conditions in a hot air drying oven were set to 80 °C for 30 minutes. Otherwise, a molded article was obtained in the same manner as in Example 16.

[0115] <Comparative Example 1> In Example 16, a molded article was obtained in the same manner as in Example 16, except that an insulating layer was not formed.

[0116] [(1) Wiring Resistance Evaluation of Molded Article] According to the marks entered on the back side of the obtained molded article, both measurement parts of the tester were brought into contact with the conductive layer of the linear pattern, and the resistance value of the conductive layer was measured, which was taken as the wiring resistance (Ω). The results are shown in Tables 4 to 7.

[0117] [(2) Drop Ball Impact Test 1 of Molded Article] The drop ball impact test of the obtained molded article was carried out to measure the impact resistance. Using the "JIS Falling Ball Impact Tester IM-4100" manufactured by Shimadzu Corporation, the obtained molded body was attached to a predetermined position, and an iron ball weighing 500 g was dropped from a height of 80 cm onto the center of the molded body. The presence or absence of cracks in the wiring and the resistance change rate were observed visually from the film side. For the resistance change rate, both measuring parts of the tester were brought into contact with the conductive layer of the linear pattern, the resistance value of the conductive layer was measured, and the wiring resistance before the falling ball impact test / the wiring resistance after the falling ball impact test was taken as the resistance change rate (times), and the evaluation was made according to the following criteria respectively. The results are shown in Tables 4 to 7. (Presence or absence of cracks) A: No cracks were found in the wiring. B: One or two minor cracks were confirmed in the wiring. C: The wiring was exposed and disconnected. (Resistance change rate) A: 1 times to less than 1.3 times B: 1.3 times or more and less than 1.5 times C: 1.5 times or more and less than 2.0 times D: Disconnected and measurement impossible

[0118] [(3) Falling ball impact test 2 of molded body] A falling ball impact test was conducted in the same manner as in falling ball impact test 1 except that the weight of the iron ball was changed to 1 kg, and the presence or absence of cracks and the resistance change rate were observed. The results are shown in Tables 4 to 7.

[0119] [(4) Evaluation of ion migration resistance of molded body] For each of the comb-shaped wirings of the molded bodies of Examples 1 to 48 and Comparative Examples 1 to 9 above, the exposed parts of the positive and negative electrodes of the comb-shaped wiring were connected to the wiring by alligator clips, and using the "MIG-8600B", an insulation degradation evaluation tester for migration tester manufactured by IMV, the insulation resistance value between the comb-shaped wiring terminals after 1000 hours under the conditions of 5 V application, 85 °C and 85% RH was confirmed, and the evaluation was made according to the following criteria respectively. The results are shown in Tables 4 to 7. (Presence or absence of short circuit due to ion migration and insulation resistivity) A: The insulation resistance change rate is less than ±25% of the initial value. B: The insulation resistance change rate is ±25% or more and less than ±100% of the initial value. C: Insulation resistance variation rate is ±100% or more of the initial value or there is leak touch (electrode short - circuit history)

[0120]

Table 1

[0121]

Table 2

[0122]

Table 3

[0123]

Table 4

[0124]

Table 5

[0125]

Table 6

[0126]

Table 7

[0127] [Summary of Results] In Comparative Example 1 where the insulating layer is not formed on the conductive layer, the ion migration resistance between the comb - shaped electrodes is poor, and short - circuits are likely to occur over time, indicating that it is not suitable for using the molded body as a three - dimensional wiring circuit. This is presumably because the adhesion between the base film and the injection - molded resin of the molded body is not sufficient, resulting in significant promotion of ionization due to the intrusion of moisture from this interface and mechanical degradation of the conductive pattern due to thermal expansion and contraction. In Comparative Example 2, although an insulating layer was formed, since the insulating layer did not have an aromatic structure, it was inferior in impact resistance, and the ion migration resistance between the comb-shaped electrodes was at a level that could not withstand practical use. Further, in Comparative Examples 3 and 4, although an insulating layer was formed, they were inferior in impact resistance, and the volume resistivity was as low as less than 10 12 Ω·cm, so the ion migration resistance between the comb-shaped electrodes of the molded body was also at a level that could not withstand practical use. Further, as shown in Comparative Examples 5 to 9, when the base material did not have a polycarbonate resin, the impact resistance was insufficient and it could not be compatible with ion migration. Further, as shown in Comparative Example 10, when the polycarbonate content of the resin for the base material was less than 50%, it was impossible to achieve both sufficient impact resistance and ion migration resistance at a practically sufficient level.

[0128] On the other hand, from the results of Examples 1 to 48, it was found that the molded body of the present embodiment sufficiently satisfied impact resistance and ion migration resistance when the glass transition points of the base material and the insulating layer, the storage elastic ratio at 25°C, the melt flow rate of the base material, and the storage elastic modulus of the insulating layer at 200°C satisfied a specific range. In particular, as shown in Examples 16, 23, 36, 43, and 44, by adding wax, excellent ion migration resistance based on the high adhesion at the interface between the insulating layer and the injection resin was achieved.

[0129] Thus, the molded film and the wiring integrated molded body using the conductive composition of the present embodiment can directly form a lightweight and space-saving circuit, a touch sensor, an antenna, a heating element, an electromagnetic wave shield, an inductor (coil), a resistor, and mount various electronic components into plastic housings and three-dimensional shaped parts such as home appliances, automotive parts, robots, and drones without sacrificing the design freedom. It is extremely useful for making electronic devices thinner, lighter, more compact, improving the design freedom, and adding multiple functions.

Explanation of Symbols

[0130] 1 Base film 2 Conductive layer 3 Insulating layer 4 Electronic component 5 Pin 6 Decorative layer 7 Second conductive layer 8 Second insulating layer 10 Forming film 11 Mold 12 Injection mold 13 Opening 14 Injection 15 Ascent 16 Pressurization 17 Resin 20 Substrate 21 Upper chamber box 22 Lower chamber box 30 Molded body

Claims

1. A molded body in which an insulating layer, a conductive layer, and a base film are laminated in this order on a substrate, wherein the conductive layer is a patterned conductive layer, The volume resistivity of the insulating layer is 1×10 １２ Ω·cm or more and less than 1×10 １７ Ω·cm, and the insulating layer contains a thermoplastic resin (A2) having an aromatic skeleton in the main chain, the substrate contains a thermoplastic resin (A1) containing 50 to 100% of polycarbonate, and the conductive layer is a cured product of a conductive composition containing a thermoplastic resin (A3) and conductive fine particles.

2. The molded body according to Claim 1, wherein the difference (Tg1 - Tg2) between the glass transition point (Tg1) of the substrate and the glass transition point (Tg2) of the insulating layer is 30°C to 130°C.

3. The thermoplastic resin (A1) contained in the substrate is a bisphenol A type polycarbonate resin or a polymer alloy of a bisphenol A type polycarbonate resin and an ABS resin, and the thermoplastic resin (A2) has a polyester skeleton, and the content of aromatic carboxylic acid units in all constituent carboxylic acid units in the polyester skeleton is 50 to 100 mol%. The molded body according to Claim 1 or 2.

4. The molded body according to any one of Claims 1 to 3, wherein the insulating layer further contains a wax having a melting point of 70°C to 200°C.

5. A step of forming a laminated body in which a conductive layer and an insulating layer are laminated in this order on a base film into a predetermined shape to obtain a formed film, a step of disposing the formed film in a mold for injection molding, and a step of forming a substrate by injection molding and integrating the formed film and the substrate to obtain a molded body. A method for manufacturing a molded body, wherein the conductive layer is a patterned conductive layer, The volume resistivity of the insulating layer is 1 × 10 １０ Ω·cm or more and less than 1 × 10 １７ Ω·cm, and the insulating layer contains a thermoplastic resin (A2) having an aromatic skeleton in the main chain, the substrate contains a thermoplastic resin (A1) containing 50 to 100% of polycarbonate, and the conductive layer is a cured product of a conductive composition containing a thermoplastic resin (A3) and conductive fine particles. A method for manufacturing a molded body.

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