Mask set and method for manufacturing a mask

Abstract

To provide a mask that is improved in mask accuracy and mechanical strength, and to provide a method for manufacturing the same and a method for manufacturing an organic light-emitting display device that can uniformly form a pattern of an organic light-emitting layer of high resolution or ultra-high resolution without causing any poor vapor deposition.SOLUTION: In a mask set including at least one mask, the at least one mask includes: a mask frame 110 in which an opening region is defined; a mask sheet 120 corresponding to the opening region, provided with a pattern part 121, and in which a support part 123 is defined along an edge part of the pattern part; and a first adhesive plating film 150 positioned so as to cover a rear face of the support part and a lateral face of the mask frame, where the pattern part includes: a plurality of cell parts 125 provided with a plurality of opening parts 130; and a bezel part 127 defined between the cell parts and provided with a plurality of dummy holes.SELECTED DRAWING: Figure 6A

Description

Technical Field

[0001] The present invention relates to a mask set including at least one mask used when manufacturing an organic light emitting display device and a method for manufacturing the mask.

Background Art

[0002] In recent years, with the advent of the full-fledged information age, interest in information displays for processing and displaying large amounts of information has increased, and demands for the use of portable information media have also intensified. In response, various lightweight and thin flat panel display devices have been developed and are in the spotlight.

[0003] Among various flat panel display devices, an organic light emitting display device (Organic Light Emitting Diodes: OLED) is a self-emitting element, so it does not require a backlight used in a liquid crystal display device (Liquid Crystal Display Device: LCD), which is a non-emitting element. Therefore, it can be lightweight and thin.

[0004] And it has excellent viewing angles and contrast ratios compared to liquid crystal display devices, and is also advantageous in terms of power consumption. In addition, it can be driven by a DC low voltage, has a fast response speed, and because its internal components are solid, it is strong against external impacts and has a wide operating temperature range.

[0005] On the other hand, among the components of such an organic light emitting display device, except for the anode electrode and the cathode electrode, an organic light emitting layer such as a hole injection film, a hole transport film, a light emitting material film, an electron transport film, and an electron injection film is usually formed by a vacuum thermal evaporation method. The vacuum thermal evaporation method is a method of heating and sublimating an organic substance by applying heat to a crucible containing a powdery organic substance inside a vacuum chamber and then depositing it.

[0006] When there are multiple organic light-emitting layers having a desired pattern, a thermal evaporation method using a fine metal mask (hereinafter referred to as a mask) having a plurality of openings is known.

[0007] After positioning a mask having a plurality of openings close to the evaporation substrate, an organic light-emitting layer having a plurality of spaced patterns in a predetermined pattern is formed by evaporating an organic light-emitting substance onto the evaporation substrate through the mask.

[0008] Here, in order to form a desired evaporation pattern on the evaporation substrate, it is important to closely adhere the mask so as not to be separated from the evaporation substrate. Therefore, the positional accuracy of the plurality of openings through which the evaporation substance passes on the mask must be strictly reproduced and fixed.

[0009] Therefore, when manufacturing the mask, it is important to design it so as to satisfy the target pixel position accuracy (PPA).

[0010] Here, the positional accuracy of the openings of the mask with respect to the target design position of the openings at the time of manufacturing the mask can be defined as the manufacturing PPA. Also, in the process of evaporating the organic light-emitting substance in the vacuum chamber, the positional accuracy of the pattern deposited on the evaporation substrate generated by the change in the position of the openings of the mask can be defined as the evaporation PPA.

[0011] In recent years, in the case of an organic light-emitting display device, the substrate has been increasing in size up to the 6th generation half size for mass production, but in the actual situation where large areaization such as the 7th generation and the 8th generation is inevitable, in order to form a pattern of ultra-high resolution, a finer size of the openings and a dense interval between the openings are required.

[0012] In order to form a high-resolution pattern, it is necessary to reduce the thickness of the mask in order to prevent the shadow effect along with the miniaturization of the pixels, but there is a difficult problem in realizing a thickness below a predetermined thickness with the current technology.

[0013] When the mask is thinned for the precision machining of the high-resolution opening, wrinkles tend to occur on the mask itself, and it is difficult to match the manufacturing PPA and the deposition PPA due to sagging in the direction of gravity.

Summary of the Invention

Problems to be Solved by the Invention

[0014] The present invention has been made to solve such problems, and overcomes the manufacturing limitations of existing masks and the technical limitations in increasing the area of masks, and provides a mask with improved mask accuracy and mechanical strength as a first object.

[0015] Thereby, a second object of the present invention is to provide a method for manufacturing an organic light-emitting display device capable of uniformly forming a pattern of a high-resolution or ultra-high-resolution organic light-emitting layer without causing deposition defects.

Means for Solving the Problems

[0016] To achieve the above-described object, the present invention provides a mask set including at least one mask, wherein the at least one mask includes a mask frame in which an opening region is defined, a mask sheet in which a pattern portion is provided corresponding to the opening region, and a support portion is defined along an edge of the pattern portion, and a first adhesive plating film covering a back surface of the support portion and a side surface of the mask frame. The pattern portion includes a plurality of cell portions provided with a plurality of openings, and a bezel portion defined between the plurality of cell portions and provided with a plurality of dummy holes.

[0017] Here, an adhesive pad is interposed between the back surface of the support portion and the upper surface of the mask frame. The first adhesive plating film covers the back surface of the support portion exposed outside the adhesive pad, the inner side surface of the adhesive pad, and the side surface of the mask frame. The at least one mask includes a red mask provided with an R opening corresponding to an R sub-pixel in the cell portion, a green mask provided with a G opening corresponding to a G sub-pixel in the cell portion, and a blue mask provided with a B opening corresponding to a B sub-pixel in the cell portion in the cell portion. The R, G, and B openings are arranged at different positions from each other in the cell portion, and the plurality of dummy holes in the red, green, and blue masks are located at the same position as each other in the bezel portion.

[0018] Also, an approximation level value (Approximation Level: AL) based on the RD (Rib Density) value of the cell portion and the RD (Rib Density) value of the bezel portion is defined as AL = |(BRD - CRD) × BRD| ≦ 0.1, and the plurality of openings and the plurality of dummy holes are tapered.

[0019] Also, the adhesive pad includes a protruding portion protruding from the mask frame toward the opening region, and the adhesive pad contains a conductive substance.

[0020] Also, the first adhesive plating film has a thickness of 50 μm to 250 μm, and the first adhesive plating film is made of the same material as the mask sheet and the mask frame. Here, the solution for forming the first adhesive plating film contains Ni, and / or Fe, and further includes a second adhesive plating film that covers a part of the upper surface end portion and the side surface of the support portion, the outer side surface of the adhesive pad, and a part of the upper surface of the mask frame.

[0021] Also, the second adhesive plating film is made of the same material as the first adhesive plating film, corresponds to the dummy hole on the back surface of the mask sheet, and further includes a cover portion of the bezel portion.

[0022] Further, the cover portion of the bezel portion is made of a polymer film or has a two-layer structure in which an adhesive layer is further interposed between the polymer film and the back surface of the mask sheet, and the cover portion of the bezel portion is cured by ultraviolet rays or heat.

[0023] Also, on the back surface of the mask sheet, a cover sheet corresponding to the support portion and the bezel portion is further included. The cover sheet is located between the adhesive pad and the mask frame, and the first adhesive plating film is located to cover the side surface of the cover sheet.

[0024] Here, the mask frame corresponds to the bezel portion and further includes a rib that connects the end frames of the mask frame facing each other. A conductive adhesive is located on the back surface of the support portion and the side surface of the mask frame. The first adhesive plating film is located to cover the back surface of the support portion and the side surface of the mask frame above the conductive adhesive. Further, the present invention includes: a) providing a first insulating pattern and a second insulating pattern on the upper portion of a cathode mother board on which a conductive film is deposited; b) performing primary electroforming to form a plating film on the upper portion of the conductive film; c) adhering a mask frame along the edge of the plating film on the upper portion of the plating film; d) forming an insulating film on the entire surface of the cathode mother board so as to expose a part of the surface of the plating film adjacent to the mask frame and a part of the mask frame; e) performing secondary electroforming on a part of the surface of the plating film exposed outside the insulating film and a part of the mask frame to form a first adhesive plating film; and f) removing the cathode mother board including the conductive film, the insulating film, and the insulating pattern to form a mask sheet. The mask sheet provides a method for manufacturing a mask including openings and dummy holes corresponding to the insulating pattern in the cell portion and the bezel portion.

[0025] Here, before the step of a), further comprising the steps of providing a conductive pattern on a glass substrate and performing primary electroforming to form the plating film on top of the conductive pattern, and after the step of b), further comprising the step of bonding the mask frame on top of the plating film along the edge of the plating film via an adhesive pad.

[0026] The adhesive pad contains a conductive substance, and in the step of forming the first adhesive plating film, the adhesive pad serves as a passage for transmitting the voltage applied from the mask frame to the conductive film and as an electrode for electroforming where metal is deposited when electrons are emitted from the pad itself.

Advantages of the Invention

[0027] As described above, according to the present invention, by providing dummy holes on the bezel portion within the pattern portion of the mask sheet of the mask, the rigidity difference between the cell portion provided with a plurality of openings and the bezel portion can be reduced, and the effects of minimizing the production PPA (Pixel Position Accuracy) and the deposition PPA are achieved.

[0028] Thereby, it has the effect of being able to uniformly form a pattern of a high-resolution or ultra-high-resolution organic light-emitting layer without causing deposition defects.

[0029] Also, by forming the mask sheet according to an embodiment of the present invention on an Invar thin plate by electroforming, the formation process of the mask sheet can be simplified, the equipment cost for manufacturing can be reduced, and the effect of being able to form a large-area mask sheet with a thin thickness can be achieved.

[0030] In addition, since the mask sheet is integrally formed with the mask frame via the adhesive pad and the first adhesive plating film, it is possible to further prevent the mask sheet from sagging. As a result, using the mask, a predetermined pattern can be deposited at an accurate position, and the deposition PPA is improved.

[0031] In addition, since the adhesive pads of the mask and the first adhesive plating film are positioned along the edge of the mask sheet, the mask sheet can be stably placed on and adhered to the mask frame in a state where a natural force is applied to the mask sheet in the direction of the mask frame. Therefore, it is possible to form the mask sheet that is taut against the mask frame integrally with the mask frame without performing the process of separately pulling and aligning the mask sheet.

Brief Description of the Drawings

[0032]

Figure 1

Figure 2A

Figure 2B

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Figure 6A

Figure 6B

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Figure 7B

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Figure 8B

Figure 8C

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Figure 10

Figure 11A

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Figure 11C

Figure 11D

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Figure 11G

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Figure 16A

Figure 16B

Figure 17

Mode for Carrying Out the Invention

[0033] Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

[0034] First Embodiment FIG. 1 is a perspective view schematically showing a mask according to a first embodiment of the present invention, FIG. 2A is a plan view schematically showing an opening, and FIG. 2B is a perspective view schematically showing the opening.

[0035] As shown in FIG. 1, a mask 100 according to a first embodiment of the present invention is roughly composed of a rectangular mask frame 110 and a mask sheet 120 stably placed on the mask frame 110.

[0036] The mask frame 110 is a square frame shape having a substantially rectangular opening region G at its center, and includes first to fourth end frames 110a, 110b, 110c, and 110d having a certain thickness.

[0037] Although the mask sheet 120 is located within the opening region G of the mask frame 110, the mask frame 110 is preferably made of the same material as the mask sheet 120 in consideration of thermal deformation and the like.

[0038] The mask sheet 120 is defined by a pattern portion 121 provided with a plurality of openings 130 and a support portion 123 arranged along the edge of the pattern portion 121. Here, although the pattern portion 121 and the support portion 123 of the mask sheet 120 are described with different names and reference numerals according to their formation positions, the pattern portion 121 and the support portion 123 are not separate regions from each other, but are made of the same material and are integrally connected.

[0039] In other words, the pattern portion 121 and the support portion 123 are electroplated in the electroforming process for forming the mask 100, and are plating films formed simultaneously, or are portions of the mask sheet 120. The manufacturing process of the mask 100 will be described in detail later.

[0040] Such a mask sheet 120 has a shape corresponding to the mask frame 110. However, the support portions 123 defined at the four end portions of the mask sheet 120 are respectively supported and fixed on the first to fourth end frames 110a, 110b, 110c, and 110d of the mask frame 110.

[0041] In this way, the mask frame 110 surrounds and supports the end portion of the mask sheet 120, so that the mask sheet 120 is supported in a taut state without sagging or twisting.

[0042] Here, in the mask 100 according to the first embodiment of the present invention, the support portion 123 of the mask frame 110 and the mask sheet 120 are not fixed by welding, but are adhered and fixed via the adhesive pads 140 (see FIG. 6A).

[0043] The adhesive pads 140 (see FIG. 6A) are made of a material in which a conductive material is dispersed in an organic polymer material. However, it is preferable to use an epoxy-based organic material with strong chemical resistance so as not to react in the mask cleaning process.

[0044] In addition, the conductive material can include metal powders such as carbon, Ag, Cu, Ni, or nanowires. Thus, the mask 100 according to the first embodiment of the present invention can further include a first adhesive plating film 150 (see FIG. 6B).

[0045] A plurality of cell portions 125 having a certain size corresponding to the display region AA (see FIG. 10) of the organic light-emitting display device 300 (see FIG. 10) are formed in the pattern portion 121 of the mask sheet 120, and a bezel portion 127 is formed between the plurality of cell portions 125.

[0046] Here, in the case of a small display device such as a smartphone, among the plurality of deposition regions included in the mask 100, any one cell portion 125 may be for forming one display device. Since one mask 100 can include a plurality of cell portions 125, a plurality of display devices can be formed simultaneously. Therefore, the mask 100 according to the first embodiment of the present invention can improve process efficiency.

[0047] On the other hand, in the case of a large display device such as a television, a plurality of cell portions 125 included in one mask 100 may be a part for forming one display device.

[0048] That is, the cell portion 125 and the bezel portion 127 are defined in the pattern portion 121 of the mask sheet 120. When depositing an organic light-emitting substance on the deposition substrate, each cell portion 125 of the mask sheet 120 is arranged to correspond to the display area AA (see FIG. 10) of the display device, and the bezel portion 127 of the mask sheet 120 is arranged to correspond to the peripheral area of the display device, that is, the non-display area BA (see FIG. 10).

[0049] Each cell portion 125 is separated at a predetermined interval and includes a plurality of openings 130 having a certain size corresponding to sub-pixels R-SP, G-SP, B-SP (see FIG. 10) defined on the deposition substrate so that heated and sublimated organic substances (not shown) can pass through, and a shielding portion 135 between the plurality of openings.

[0050] The deposition material passes through each of the plurality of openings 130 and is deposited on the deposition substrate.

[0051] Referring to FIGS. 2A and 2B, when the cell portion 125 is enlarged, a plurality of openings 130 corresponding to the R·G·B sub-pixels R-SP, G-SP, B-SP (see FIG. 10) can be confirmed. The opening 130 may have a shape in which its side surface 131 is inclined, a tapered shape, or a shape in which the pattern width becomes wider from the top to the bottom.

[0052] Therefore, in the mask 100, the size of the opening 130 on the surface facing the vapor deposition substrate and the size of the opening 130 on the surface facing the vapor deposition source are formed to be different from each other, thereby minimizing the shadow effect during the vapor deposition process using the organic light-emitting material.

[0053] Here, the mask 100 according to the first embodiment of the present invention is characterized in that dummy holes 200 are provided in the bezel portion 127 defined between the plurality of cell portions 125.

[0054] Due to the dummy holes 200, the bezel portion 127 of the mask sheet 120 will have an RD (Rib Density) value similar to that of the cell portion 125 including the opening 130. Here, the RD value of the bezel portion 127 is the value obtained by dividing the volume of the bezel portion 127 excluding the dummy holes 200 by the volume in the ideal state without the dummy holes 200. That is, it means the density of the bezel portion 127.

[0055] In addition, the RD value of the cell portion 125 is defined as the value obtained by dividing the volume of the cell portion 125 excluding the opening 130 by the volume of the ideal cell portion 125 without the opening 130.

[0056] Here, the value of the approximation level (AL) of the RD value can satisfy the following formula (1).

[0057] Formula (1) AL = |(BRD - CRD)×BRD| ≦ 0.1

[0058] Here, BRD means the RD value of the bezel portion 127 of the mask 100, and CRD means the RD value of the cell portion 125 of the mask 100.

[0059] That is, the value of the approximation level of the RD value of the bezel portion 127 and the RD value of the cell portion 125 is made to satisfy 0.1 or less.

[0060] As a result, the bezel portion 127 including a plurality of dummy holes 200 has an RD value similar to that of the cell portion 125 including the opening 130.

[0061] In this way, by designing the bezel portion 127 and the cell portion 125 of the mask sheet 120 to have similar RD values so that the value of the approximation level is 0.1 or less, the mask 100 according to the first embodiment of the present invention can reduce the rigidity difference between the cell portion 125 and the bezel portion 127.

[0062] In other words, since many openings 130 are located in the cell portion 125, the rigidity can be relatively lower than that of the bezel portion 127. However, by forming the dummy holes 200 in the bezel portion 127 so that the bezel portion 127 has an RD value similar to that of the cell portion 125, the rigidity difference between the bezel portion 127 and the cell portion 125 can be reduced.

[0063] When the rigidity difference between the bezel portion 127 and the cell portion 125 of the mask sheet 120 is reduced, the manufacturing PPA (Pixel Position Accuracy) is minimized, and the deposition PPA is improved.

[0064] Therefore, a pattern of an organic light-emitting layer with high resolution or ultra-high resolution can be formed uniformly without causing deposition defects.

[0065] The following Table 1 shows the results of an experiment in which the manufacturing PPA was simulated while adjusting the width of the dummy holes 200 in the bezel portion 127 (BRD = 0.58 to 1.00).

[0066]

Table 1

[0067] From Table 1, it can be confirmed that the manufacturing PPA decreases as the value of the approximation level (AL) of the RD value decreases. The RD value of the bezel portion 127 and the RD value of the cell portion 125 can be designed to have a minimized manufacturing PPA by making the value of the approximation level (AL) satisfy 0.1 or less.

[0068] FIG. 3 is a graph simulating the CRD values of the red, green, and blue masks. The horizontal axis represents the value of the approximation level (AL), and the vertical axis represents the manufacturing PPA. BRD was fixed at 1.0 without the dummy hole 200.

[0069] Sample A, Sample B, and Sample C represent a red mask, a green mask, and a blue mask of the 8th generation size, respectively, and Sample D represents a green mask used for mobile. Sample E, Sample F, and Sample G represent a red mask, a green mask, and a blue mask used for a QXGA (Quad eXtended Graphics Array) display device, respectively.

[0070] Referring to FIG. 3, when trying to design all the manufacturing PPAs of Sample A, Sample B, Sample C, Sample D, Sample E, Sample F, and Sample G to be as low as the level of 5 μm to 6 μm (in the case of mobile, the level of 3 μm to 4 μm), it can be confirmed that it is preferable to make the value of the approximation level (AL) satisfy 0.1 or less.

[0071] FIG. 4A, FIG. 4B, and Table 2 are experimental results simulating the manufacturing PPA by the design of the CRD and BRD of the mask 100, and show the displacement distribution of the mask 100.

[0072] For the experiment, an edge bezel portion (Edge Bezel: EBZ) was embodied at both ends in the length direction. However, the mask sheet 120 in FIGS. 4A and 4B is made of an Invar thin plate containing Ni metal, has a size of 2200 mm × 500 mm, and a thickness of 10 μm.

[0073] The samples of FIGS. 4A and 4B were adhered and fixed to the mask frame 110 through the adhesive pads 140 at the four ends of the mask sheet 120 as in the first embodiment of the present invention in order to confirm only the design differences at the approximate level value (AL).

[0074] FIG. 4A (Sample 6) was designed such that the CRD is 0.58, the BRD is 1.0, and the approximate level value (AL) satisfies 0.42. FIG. 4B (Sample 1) was designed such that the CRD and the BRD are 0.58 and the approximate level value (AL) satisfies 0, similar to the mask 100 according to the first embodiment of the present invention.

[0075]

Table 2

[0076] In FIGS. 4A and 4B, the white portions are the locations where stress is concentrated and displacement occurs, and the black portions are the locations where stress is weakest and no displacement occurs. From FIG. 4A (Sample 6), it can be confirmed that displacement occurred adjacent to the edge bezel portion (EBZ). Here, looking at the in-plane distribution of the displacement amount in FIG. 4A, it can be confirmed that equal displacement occurs uniformly from the edge bezel portion (EBZ) toward the center direction. This is because the approximate level values (AL) of the bezel portion and the cell portion are different, and a rigidity difference occurred between the bezel portion 127 and the cell portion 125 of the mask sheet 120.

[0077] The maximum value of the manufacturing PPA of Sample 6 of FIG. 4A is 14.6 μm.

[0078] On the other hand, in Sample 1 of FIG. 4B, it can be confirmed that no displacement occurred. Sample 1 according to the first embodiment of the present invention can be interpreted as not having displacement by reducing the rigidity difference between the bezel portion 127 and the cell portion 125 of the mask sheet 120.

[0079] In Sample 1 according to the first embodiment of the present invention, considering that the maximum value of the manufacturing PPA is 1.6 μm and the manufacturing PPA of the mask 100 required in recent years is 3 μm, it can be confirmed that there is a very significant improvement.

[0080] On the other hand, the relationship between the manufacturing PPA and the approximate level value (AL) in Table 1 can be approximated as a quadratic equation as shown in the following formula (2). Defining the manufacturing PPA as y and the approximate level value (AL) as a, formula (2) can be defined as follows.

[0081] Formula (2) y = 24.14a2 + 20.52a + 1.62

[0082] When calculating the approximate level value (AL) that satisfies the manufacturing PPA of 3 μm according to formula (2), it becomes 0.024.

[0083] To explain more clearly, when a product that requires a CRD = 0.58 is arranged in an 8-generation size to form a mask and the edge bezel part (EBZ) that has a great influence on the manufacturing PPA is configured to be 200 mm, if the BRD, which is the RD value of the bezel part 127, is not designed to be 0.594 (AL = 0.024) or less, the manufacturing PPA cannot be manufactured to be 3 μm or less.

[0084] Here, it is expected that the acceptable target manufacturing PPA will be set in the range of 3 μm to 5 μm depending on the size of the substrate, the size of the product, the resolution, etc. However, in order to maximize the yield, it is preferable to converge the manufacturing PPA to 0 by designing with AL = 0.

[0085] When the target manufacturing PPA of the mask 100, which is a typical future product shown in FIG. 3, is set to 4 μm, when the maximum (Max) CRD is 0.58 and the minimum (Min) CRD is 0.80, AL must satisfy 0.1 or less and 0.03 or less, respectively.

[0086] Figures 5A and 5B, and Table 3 show the experimental results of measuring the deposition PPA according to the CRD and BRD designs of the mask 100, and show the displacement distribution of the mask 100.

[0087] For the experiment, edge bezel portions (EBZ) were embodied at both ends in the longitudinal direction. However, the mask sheets 120 in FIGS. 5A and 5 are made of an Invar thin plate containing Ni metal, have a size of 2200 mm × 500 mm, and a thickness of 10 μm.

[0088] The samples in FIGS. 5A and 5B were adhered and fixed to the mask frame 110 via the adhesive pads 140 at the four ends of the mask sheet 120 as in the first embodiment of the present invention in order to confirm only the design difference at the approximate level value (AL).

[0089] FIG. 5A (Sample 6) was designed so that the CRD is 0.58, the BRD is 1.0, and the approximate level value (AL) satisfies 0.42. FIG. 5B (Sample 1) was designed so that the CRD and BRD are 0.58 and the approximate level value (AL) satisfies 0, similar to the mask 100 according to the first embodiment of the present invention.

[0090] Also, assuming that the temperature of the mask frame during the deposition process is fixed at 25°C and the temperature of the mask sheet 120 rises by 10°C up to 35°C, the deposition PPA was simulated. Here, in order to see only the influence of the deposition PPA, the fabrication PPA of both samples was set to 0 and simulated.

[0091] [Table 3]

[0092] From FIG. 5A (Sample 6), it can be confirmed that displacement occurred adjacent to the edge bezel portion (EBZ). In such FIG. 5A (Sample 6), the maximum value of the deposition PPA is 8.74 μm. On the other hand, in Sample 1 of FIG. 5B, no displacement occurred, but the maximum value of the deposition PPA is 0.92 μm, and it can be confirmed that the deposition PPA has improved compared to Sample 6.

[0093] That is, the mask 100 according to the first embodiment of the present invention can uniformly form the vapor-deposited PPA even when the temperature of the vapor-deposition process rises by 10°C in a continuous process.

[0094] FIG. 6A is a cross-sectional view schematically showing the mask according to the first embodiment of the present invention, and FIG. 6B is an enlarged view showing an enlargement of A in FIG. 6A.

[0095] FIGS. 7A and 7B are modified examples of the first embodiment of the present invention, and are enlarged views showing an enlargement of A in FIG. 6A.

[0096] As shown in FIG. 6A, the mask 100 according to the first embodiment of the present invention corresponds to the opening region G of the mask frame 110, and a support portion 123 defined along the edge of the mask sheet 120 is stably placed and supported on the mask frame 110 so that the pattern portion 121 of the mask sheet 120 is located.

[0097] A plurality of openings 130 are respectively formed in a plurality of cell portions 125 provided in the pattern portion 121 of the mask sheet 120. Each opening 130 may have a shape in which its side surface (131 in FIG. 2B) is inclined, a tapered shape, or a shape in which the pattern width becomes wider from the upper portion (the surface facing the vapor-deposition substrate) to the lower portion (the surface facing the vapor-deposition source).

[0098] That is, the opening 130 is formed such that the width on the first surface side a is larger than the width on the second surface side b, which is the opposite side of the first surface side a, and the side surface (131 in FIG. 2B) constituting the opening 130 is tapered so as to gradually become narrower along the vapor-deposition direction.

[0099] Also, the plurality of dummy holes 200 provided in the bezel portion 127 defined between the plurality of cell portions 125 may also be tapered so as to gradually become narrower along the vapor-deposition direction, similar to the opening 130.

[0100] Such a mask sheet 120 is stably placed and supported on the mask frame 110 via an adhesive pad 140 provided at the lower part of a support part 123 defined along the edge part. The adhesive pad 140 can be composed of an epoxy resin-based adhesive or the like. For example, it is in the form of an adhesive foam, and by buffering the impact received by the mask sheet 120 or the mask frame 110, it can also play a role in reducing the impact force transmitted between them.

[0101] The adhesive pad 140 can have a thin thickness of about 10 μm to 100 μm. Since the processing flatness of the mask frame 110 can be at most 100 μm, even if the adhesive pad 140 is interposed between the mask sheet 120 and the mask frame 110, it hardly affects the step caused by the adhesive pad 140.

[0102] In addition, the mask 100 according to the first embodiment of the present invention is characterized in that a first adhesive plating film 150 is further applied between a part of the back surface of the support part 123 of the mask sheet 120 that is not adhered to the adhesive pad 140 and the mask frame 110.

[0103] The first adhesive plating film 150 can be applied to cover the inner side surface of the adhesive pad 140 from a part of the back surface of the support part 123 of the mask sheet 120 and extend to the side surface of the mask frame 110.

[0104] Such a first adhesive plating film 150 plays a role in preventing the displacement of the manufacturing PPA due to the shear stress applied to the adhesive pad 140 by the residual stress and gravity of the mask 100.

[0105] Such a first adhesive plating film 150 can be applied with a thickness of 50 μm to 250 μm. However, when it is applied to less than 50 μm, in order to maintain the adhesive force between the mask sheet 120 and the mask frame 110, the adhesive force of the first adhesive plating film 150 is very weak and it is substantially difficult to have adhesiveness. Also, it may not be able to fill the gap between the support part 123 of the mask sheet 120 and the mask frame 110.

[0106] As a result, voids are formed, and in subsequent cleaning processes or the like, a cleaning liquid or the like may penetrate into the voids.

[0107] If the cleaning liquid or the like remains in the vapor deposition apparatus as it is during the drying process, it evaporates during the process of vapor-depositing the organic light-emitting substance, reacts as foreign matter in the organic light-emitting substance, and may affect the lifetime of the organic light-emitting layer.

[0108] In addition, when the thickness of the first adhesive plating film 150 is applied to 250 μm or more, a problem may occur in that the film floats due to the stress of the plating film itself.

[0109] That is, it is difficult to form the first adhesive plating film 150 having a thickness of 250 μm or more itself.

[0110] In particular, in the process of recycling the mask frame 110, if the applied first adhesive plating film 150 is too thick, it becomes very difficult to remove the first adhesive plating film 150. Therefore, the first adhesive plating film 150 is preferably applied to a thickness of 200 μm.

[0111] The first adhesive plating film 150 is preferably made of the same material as the mask frame 110 and the mask sheet 120 in consideration of thermal deformation and the like. In particular, it is preferably made of Ni or a Ni alloy so that the mask frame 110 and the mask sheet 120 can be metallically bonded.

[0112] That is, in the mask 100 according to the first embodiment of the present invention, the mask frame 110 and the mask sheet 120 are integrally connected via the adhesive pads 140 and the first adhesive plating film 150.

[0113] At this time, the adhesive pads 140 and the first adhesive plating film 150 are positioned along the edge of the mask sheet 120, so that a tensile force acts on the mask sheet 120 in the direction of the mask frame 110 due to the residual stress of the mask sheet 120, and the mask sheet 120 can be stably placed on and adhered to the mask frame 110.

[0114] Therefore, the mask 100 according to the first embodiment of the present invention can form the mask sheet 120 that is taut on the mask frame 110 side integrally with the mask frame 110 without separately pulling and aligning the mask sheet 120.

[0115] On the other hand, as shown in FIG. 7A, the adhesive pad 140 may further protrude from the mask frame 110 into the opening region G and be attached to the back surface of the support portion 123 of the mask sheet 120.

[0116] A first adhesive plating film 150 can be applied to a part of the back surface of the support portion 123 of the mask sheet 120 and the side surface of the mask frame 110, including the protruding adhesive pad 140.

[0117] In this way, by attaching the adhesive pad 140 to the back surface of the support portion 123 of the mask sheet 120 so as to protrude from the mask frame 110, it is possible to prevent the formation of a separate gap between the mask sheet 120, the mask frame 110, and the first adhesive plating film 150.

[0118] When a gap is formed in the joining structure between the mask sheet 120 and the mask frame 110 in the mask 100, displacement may occur in the PPA of manufacturing the mask 100. Further, when a cleaning liquid or the like penetrates into the gap during the cleaning process of the mask 100 and is carried into the vapor deposition apparatus while remaining after the drying process, it evaporates during the process of vapor-depositing the organic light-emitting substance, reacts as a foreign substance of the organic light-emitting substance, and may affect the lifetime of the organic light-emitting layer.

[0119] Next, the adhesive pad 140 can be formed to protrude from the mask frame 110 by about 50 μm to 500 μm. However, if the width of the protruding portion 140a of the adhesive pad 140 is 50 μm or less, in the process of adhering the adhesive pad 140 attached to the back surface of the support portion 123 of the mask sheet 120 onto the mask frame 110, due to process variations, voids may be formed in the joining structure between the mask sheet 120 and the mask frame 110.

[0120] Also, when the adhesive pad 140 has a protruding portion 140a with a width of 500 μm or more, a short circuit may occur in the first electroless plating film 150 applied to a thickness of 200 μm.

[0121] Furthermore, as shown in FIG. 7B, the mask 100 according to the first embodiment of the present invention can further form a second electroless plating film 160 so as to cover a part of the upper surface end portion and the side surface of the support portion 123 of the mask sheet 120, the outer side surface of the adhesive pad 140, and a part of the upper surface of the mask frame 110.

[0122] Thereby, the rigidity at the end portion of the mask 100 can be further improved.

[0123] Here, the second electroless plating film 160 is preferably made of the same material as the first electroless plating film 150 and is applied to a thickness of 20 μm or less. When the second electroless plating film 160 is formed to be 20 μm or more, the corners of the vapor deposition substrate and the mask 100 may not be in close contact with each other, which can cause displacement in the vapor deposition PPA.

[0124] To summarize the above, the mask 100 according to the first embodiment of the present invention can reduce the rigidity difference between the cell portion 125 provided with a plurality of openings 130 and the bezel portion 127 by further providing dummy holes 200 in the bezel portion 127 within the pattern portion 121 in the mask sheet 120.

[0125] Therefore, the manufacturing PPA is minimized and the deposition PPA is improved. As a result, a high-resolution or ultra-high-resolution pattern of the organic light-emitting layer can be uniformly formed without causing deposition defects.

[0126] In addition, in the mask 100 according to the first embodiment of the present invention, the mask sheet 120 and the mask frame 110 are integrally connected to each other via the adhesive pads 140 and the first electroless plating film 150, so that a plurality of bar-shaped mask sheets 120 can be formed integrally with the mask frame 110 without separately pulling and aligning them.

[0127] On the other hand, such a mask 100 can be classified into red, green, and blue masks according to the position and size of the openings 130. The mask 100 according to the first embodiment of the present invention is further characterized in that the positions of the dummy holes 200 in each of the red, green, and blue masks are all the same.

[0128] This will be described in more detail with reference to FIGS. 8A to 8C.

[0129] FIGS. 8A to 8C are plan views schematically showing a cell portion and a bezel portion. FIG. 8A shows a red mask, FIG. 8B shows a green mask, and FIG. 8C shows a blue mask.

[0130] As shown in FIG. 8A, a plurality of R openings 130a corresponding to the R sub-pixels R-SP (see FIG. 10) are provided in the cell portion 125 of the red mask. The R openings 130a are spaced apart in units of adjacent sub-pixels R-SP, G-SP, B-SP (see FIG. 10) defined on the substrate 301 and are formed in a zigzag pattern.

[0131] This will be described in more detail. When the cell unit 125 is defined by dividing it into the first to ninth rows (1row, 2row, 3row, 4row, 5row, 6row, 7row, 8row, 9row) in the first direction which is the horizontal direction, and into the first to ninth columns (1column, 2column, 3column, 4column, 5column, 6column, 7column, 8column, 9column) in the second direction which is the vertical direction, the R opening 130a is located at the first column (1column), fifth column (5column), and ninth column (9column) of the second row (2row), the third column (3column) and seventh column (7column) of the fourth row (4row), the first column (1column) and fifth column (5column) of the sixth row (6row), and the third column (3column) of the eighth row (8row).

[0132] When the bezel unit 127 is defined by dividing it into the first to thirteenth rows (1row, 2row, 3row, 4row, 5row, 6row, 7row, 8row, 9row, 10row, 11row, 12row, 13row) in the first direction which is the horizontal direction, and into the first to thirteenth columns (1column, 2column, 3column, 4column, 5column, 6column, 7column, 8column, 9column, 10column, 11column, 12column, 13column) in the second direction which is the vertical direction, the dummy hole 200 is located at the fifth column (5column) and ninth column (9column) of the first row (1row), the second column (2column), sixth column (6column), and tenth column (10column) of the third row (3row). Further, the dummy hole 200 is located at the third column (3column), seventh column (7column), and eleventh column (11column) of the fifth row (5row), the fourth column (4column) of the seventh row (7row), the first column (1column) and fifth column (5column) of the ninth row (9row), the second column (2column) of the eleventh row (11row), and the third column (3column) of the thirteenth row (13row).

[0133] Also, looking at the green mask in FIG. 8B, the G openings 130b are located in the second column (2column), fourth column (4column), sixth column (6column), eighth column (8column) of each of the first row (1row), third row (3row), fifth row (5row), seventh row (7row), and ninth row (9row) of the cell portion 125.

[0134] The dummy holes 200 located in the bezel portion 127 of the green mask are located in the fifth column (5column) and ninth column (9column) of the first row (1row), the second column (2column), sixth column (6column), and tenth column (10column) of the third row (3row). Also, the dummy holes 200 are located in the third column (3column), seventh column (7column), and eleventh column (11column) of the fifth row (5row), the fourth column (4column) of the seventh row (7row), the first column (1column) and fifth column (5column) of the ninth row (9row), the second column (2column) of the eleventh row (11row), and the third column (3column) of the thirteenth row (13row).

[0135] Also, looking at the blue mask in FIG. 8C, the B openings 130c are located at the 3rd column and 7th column in the 2nd row and 6th row respectively in the cell portion 125, and at the 1st column, 5th column, and 9th column in the 4th row and 8th row respectively. The dummy holes 200 located in the bezel portion 127 of the blue mask are located at the 5th column and 9th column in the 1st row, the 2nd column, 6th column, and 10th column in the 3rd row. Also, the dummy holes 200 are located at the 3rd column, 7th column, and 11th column in the 5th row, the 4th column in the 7th row, the 1st column and 5th column in the 9th row, the 2nd column in the 11th row, and the 3rd column in the 13th row.

[0136] That is, for the mask 100 according to the first embodiment of the present invention, for each of the red, green, and blue masks, a plurality of R, G, B openings 130a, 130b, 130c are provided corresponding to the R, G, B sub-pixels R-SP, G-SP, B-SP (see FIG. 10) in the respective cell portions 125. However, the dummy holes 200 located in the bezel portions 127 of the red, green, and blue masks are all arranged at the same positions.

[0137] Thus, by forming the dummy holes 200 in the bezel portion 127, the mask 100 according to the first embodiment of the present invention can reduce the rigidity difference between the cell portion 125 provided with the plurality of R, G, B openings 130a, 130b, 130c and the bezel portion 127, minimizing the manufacturing PPA, and thus improving the deposition PPA. As a result, a high-resolution or ultra-high-resolution organic light-emitting layer pattern can be uniformly formed without causing deposition defects.

[0138] In particular, by ensuring that the dummy holes 200 in the bezel portion 127 are all in the same positions in the red, green, and blue masks, it is possible to prevent moisture, oxygen, etc. from the outside from penetrating into the organic light-emitting display device 300 (see FIG. 10) through the non-display region BA (see FIG. 10).

[0139] Regarding this, with reference to the figure schematically showing the organic light-emitting display device 300 (see FIG. 10) manufactured using the mask 100 according to the first embodiment of the present invention, a more detailed description will be given.

[0140] FIG. 9 is a plan view schematically showing an organic light-emitting layer formed on a substrate using the mask according to the first embodiment of the present invention, and FIG. 10 is a cross-sectional view taken along the line X-X' of FIG. 9.

[0141] As shown in FIG. 9, on the substrate 301 constituting the organic light-emitting display device 300, a display region AA and a non-display region BA are defined along the edge of the display region AA. In the display region AA, a plurality of sub-pixels B-SP, R-SP, and G-SP are arranged, and an image is displayed on the organic light-emitting display device 300. The non-display region BA is the region excluding the display region AA, and various circuits and wirings for driving the sub-pixels B-SP, R-SP, and G-SP are arranged therein.

[0142] Here, the display region AA of the organic light-emitting display device 300 corresponds to the cell portion (125 in FIG. 8C) of the mask (100 in FIG. 6A) according to the first embodiment of the present invention, and the non-display region BA corresponds to the bezel portion (127 in FIG. 8C).

[0143] Regarding the arrangement of the sub-pixels B-SP, R-SP, and G-SP arranged in the display region AA in more detail, in the first row (1row) in the horizontal direction, the G sub-pixel G-SP can be arranged at a predetermined interval in the first direction, and in the second row (2row) adjacent to the first row (1row), the R sub-pixel R-SP and the B sub-pixel B-SP can be arranged alternately in the first direction.

[0144] Also, in the third row (3row), the G sub-pixels G-SP can be spaced apart and arranged at a predetermined interval, and in the fourth row (4row), the R sub-pixels R-SP and the B sub-pixels B-SP can be arranged alternately. Such an arrangement of the sub-pixels B-SP, R-SP, and G-SP can be repeated up to a predetermined row that has already been set.

[0145] The G sub-pixels G-SP arranged in the second column (2column) may be arranged offset from the R sub-pixels R-SP and the B sub-pixels B-SP arranged in the first column (1column) and the third column (3column). Therefore, in the first column (1column), the R sub-pixels R-SP and the B sub-pixels B-SP can be arranged alternately in the second direction, and in the second column (2column), the G sub-pixels G-SP can be spaced apart and arranged at a predetermined interval in the second direction. Such an arrangement of the sub-pixels B-SP, R-SP, and G-SP can be repeated up to a predetermined column that has already been set.

[0146] The areas of the G sub-pixels G-SP and the B sub-pixels B-SP can be formed larger than that of the R sub-pixels R-SP, but can be designed in consideration of the element efficiency, element life, etc. of the organic light-emitting display device 300 that each sub-pixel B-SP, R-SP, G-SP is intended to embody.

[0147] Such an arrangement structure of the sub-pixels B-SP, R-SP, G-SP is called a pentile matrix. By applying a rendering drive that represents a hue by sharing adjacent sub-pixels B-SP, R-SP, G-SP, a high resolution can be achieved with a small number of sub-pixels B-SP, R-SP, G-SP.

[0148] On the one hand, the arrangement structures of the sub-pixels B-SP, R-SP, and G-SP according to the embodiments of the present invention can be variously changed. For example, it can also be designed to have a stripe arrangement, a mosaic arrangement, or a delta arrangement. Further, in the organic light-emitting display device 300 according to the embodiments of the present invention, a dummy pattern 400 is provided in the non-display area BA, and the dummy pattern 400 has a structure in which an R organic light-emitting material 401a, a G organic light-emitting material 401b, and a B light-emitting organic material 401c are stacked.

[0149] That is, in the non-display area BA, in the process of depositing the R organic light-emitting layer 313a on the R sub-pixel R-SP, the R organic light-emitting material 401a is deposited, and on top of the R organic light-emitting material 401a, the G organic light-emitting material 401b that constitutes the G organic light-emitting layer 313b deposited on the G sub-pixel G-SP, and the B organic light-emitting material 401c that constitutes the B organic light-emitting layer 313c deposited on the B sub-pixel B-SP are sequentially stacked to form the dummy pattern 400.

[0150] Regarding this, it will be described in more detail with reference to FIG. 10. On the substrate 301 of the organic light-emitting display device 300, a pixel compensation circuit Tr including a plurality of switching thin-film transistors, driving thin-film transistors, etc., and an organic light-emitting diode E are formed. On the substrate 301, a display area AA where an image is embodied and a non-display area BA are defined along the edge of the display area AA.

[0151] In the display area AA, a plurality of sub-pixels B-SP, R-SP, G-SP are provided, which are defined by an area partitioned by a gate wiring (not shown) and a data wiring (not shown), and a power supply wiring (not shown) is provided along with the data wiring (not shown).

[0152] In each of such a plurality of sub-pixels B-SP, R-SP, G-SP, a pixel compensation circuit Tr is formed, and in a light-emitting area EA that substantially displays an image, a first electrode 311 that constitutes the organic light-emitting diode E is formed.

[0153] Here, the driving thin film transistor (not shown) and the switching thin film transistor (not shown) of the pixel compensation circuit Tr each include a semiconductor layer (not shown), a gate electrode (not shown), a source electrode (not shown), a drain electrode (not shown), and a gate insulating film (not shown).

[0154] A transistor protection insulating film 306 is provided above the pixel compensation circuit Tr, and a first electrode 311 is located above it.

[0155] The first electrode 311 is connected to the drain electrode (not shown) of the driving thin film transistor (not shown) of the pixel compensation circuit Tr. The first electrode 311 is formed for each of the sub-pixels B-SP, R-SP, and G-SP. However, a bank 305 is located in the non-light-emitting region between the first electrodes 311 formed in each of the sub-pixels B-SP, R-SP, and G-SP.

[0156] In such a case, the first electrode 311 is preferably formed of indium tin oxide (ITO) having a relatively high work function so as to act as an anode electrode.

[0157] Further, R, G, and B organic light-emitting layers 313a, 313b, and 313c that emit red, green, and blue are formed on the first electrode 311, and a second electrode 315 is formed over the entire surface of the organic light-emitting layers 313a, 313b, and 313c.

[0158] The second electrode 315 is made of a conductive material having a lower work function than the first electrode 311 so as to serve as a cathode electrode.

[0159] Here, the second electrode 315 includes one selected from metals having a relatively low work function compared to the first electrode 311, such as aluminum (Al), aluminum alloy (AlNd), silver (Ag), magnesium (Mg), and silver-magnesium alloy (Ag:Mg).

[0160] The R·G·B organic light-emitting layers 313a, 313b, 313c are composed of a hole injection layer, a hole transporting layer, an emitting material layer, an electron transporting layer, and an electron injection layer.

[0161] Here, in the organic light-emitting display device 300, organic light-emitting layers 313a, 313b, 313c that emit different colors are formed for each of the sub-pixels B-SP, R-SP, and G-SP. That is, an R organic light-emitting material that emits red light is deposited on the R sub-pixel R-SP, and the R organic light-emitting layer 313a is located over the entire light-emitting region EA of the R sub-pixel R-SP.

[0162] A G organic light-emitting material that emits green light is deposited on the G sub-pixel G-SP, and the G organic light-emitting layer 313b is located over the entire light-emitting region EA of the G sub-pixel G-SP. Also, a B organic light-emitting material that emits blue light is deposited on the B sub-pixel B-SP, and the B organic light-emitting layer 313c is located over the entire light-emitting region EA of the B sub-pixel B-SP.

[0163] Therefore, in the organic light-emitting display device 300, when a predetermined voltage is applied to the first electrode 311 and the second electrode 315 in response to a signal of the selected color, holes from the first electrode 311 and electrons from the second electrode 315 are transported to the R·G·B organic light-emitting layers 313a, 313b, 313c, forming excitons. When the excitons transition from the excited state to the ground state, light is generated and emitted as visible light.

[0164] Here, the organic light-emitting display device 300 according to an embodiment of the present invention is a top emission type. For each of the sub-pixels B-SP, R-SP, and G-SP, the red light, green light, and blue light emitted from the R·G·B organic light-emitting layers 313a, 313b, 313c pass through the second electrode 315 and are emitted to the outside.

[0165] At this time, in the non-display area BA outside the display area AA, a dummy pattern 400 in which an R organic light-emitting substance 401a, a G organic light-emitting substance 401b, and a B organic light-emitting substance 401c are laminated is located on the transistor protection insulating film 306.

[0166] In this way, in the mask (100 in FIG. 6A) according to the first embodiment of the present invention, by providing the dummy hole (200 in FIG. 6A) in the bezel portion (127 in FIG. 6A) of the mask sheet (120 in FIG. 6A), the rigidity difference between the bezel portion (127 in FIG. 6A) and the cell portion (125 in FIG. 6A) of the mask sheet (120 in FIG. 6A) can be reduced.

[0167] Therefore, the manufacturing PPA is minimized and the deposition PPA is improved. As a result, high-resolution or ultra-high-resolution R·G·B organic light-emitting layers 313a, 313b, and 313c can be uniformly formed without causing deposition defects.

[0168] Also, including such a dummy pattern 400, an inorganic film, an organic film, and an inorganic film are sequentially laminated on the upper part of the pixel compensation circuit Tr and the organic light-emitting diode E, and a thin film protective film 302 is positioned together with an encapsulation structure 304 in which an adhesive made of either one of an organic insulating substance and a polymer substance is located on the upper part thereof.

[0169] At this time, without providing an air layer, the encapsulation structure 304 is completely adhered to and interposed between the substrate 301 and the protective film 302, whereby the organic light-emitting display device 300 is sealed.

[0170] At this time, since the dummy pattern 400 provided in the non-display area BA of the organic light-emitting display device 300 of the present invention is formed by laminating the R organic light-emitting substance 401a, the G organic light-emitting substance 401b, and the B organic light-emitting substance 401c at the same positions, the area where the dummy pattern 400 is formed in the non-display area BA can be minimized.

[0171] The dummy pattern 400 composed of the organic light-emitting substances 401a, 401b, and 401c arranged and connected at the same position can prevent moisture, oxygen, etc. from the outside from penetrating into the organic light-emitting display device 300 through the non-display area BA.

[0172] Hereinafter, with reference to the drawings, the manufacturing method of the mask according to the first embodiment of the present invention will be described in detail.

[0173] FIGS. 11A to 11G are schematic process diagrams showing the manufacturing process of the mask according to the first embodiment of the present invention in the order of processes, and FIG. 12 is a plan view schematically showing the back surface of the mask according to the first embodiment of the present invention.

[0174] As shown in FIG. 11A, a cathode mother board 501 on which a conductive film 503 is formed is prepared. The conductive film 503 provided on the cathode mother board 501 is used as a cathode in electroforming so that electroforming can be performed.

[0175] The conductive film 503 preferably has a good bonding force with the glass mother substrate constituting the cathode mother board 501, low resistance, does not react with the plating solution (not shown), and can be easily separated from the plating film 507 (see FIG. 11C) in subsequent processes. For this purpose, it can also be formed in multiple layers.

[0176] Here, for the first film, any one of Mo and Ti having a good bonding force with the glass mother substrate can be selected, for the second film, any one of low-resistance wirings such as Cu and Al can be selected, and for the third film, any one of Ti and ITO that do not react with the plating solution can be selected.

[0177] Next, as shown in FIG. 11B, an insulating pattern 505 is formed on the conductive film 503. The insulating pattern 505 can be composed of a photosensitive resin and can be formed by patterning in a photolithography process.

[0178] The insulating pattern 505 is formed corresponding to the cell portion 125 and the bezel portion 127 of the pattern portion 121 (see FIG. 11G). The insulating pattern 505 formed within the cell portion 125 is in an inverted taper shape and is formed in the same arrangement as the openings 130 (see FIG. 11G) corresponding to the R·G·B sub-pixels (B-SP, R-SP, G-SP in FIG. 10) to be vapor-deposited.

[0179] Also, the insulating pattern 505 formed within the bezel portion 127 is formed in an inverted taper shape, similar to the insulating pattern 505 formed within the cell portion 125.

[0180] Next, as shown in FIG. 11C, a plating film 507 is plated on the cathode mother board 501 including the insulating pattern 505.

[0181] The plating film 507 is selectively formed on the conductive film 503 exposed by the insulating pattern 505 by electroforming. In other words, the plating film 507 is not formed on the portion where the insulating pattern 505 exists, and the plating film 507 is formed on the portion where the insulating pattern 505 does not exist.

[0182] That is, because the insulating pattern 505 has insulating properties, no electric field is formed between the insulating pattern 505 and the conductive film 503, or a very weak electric field that is difficult to plate is formed. Therefore, the portion corresponding to the insulating pattern 505 where the plating film 507 is not formed on the cathode mother board 501 will constitute the pattern, holes, etc. of the plating film 507.

[0183] Here, the plating film 507 is electrodeposited from the surface of the conductive film 503 and thickens, but it is preferable to form the plating film 507 so as not to exceed the upper end of the insulating pattern 505. That is, the thickness of the plating film 507 is formed smaller than the thickness of the insulating pattern 505.

[0184] Since such a plating film 507 fills the pattern space of the insulating pattern 505 and is electrodeposited, the plating film 507 corresponds to the cell portion 125 and has a tapered shape in which the width gradually increases from the upper part to the lower part due to the reverse-tapered insulating pattern 505, and also has a tapered shape corresponding to the bezel portion 127.

[0185] In this way, the mask sheet 120 (see FIG. 11G) in which a plurality of openings 130 (see FIG. 11G) are provided in the cell portion 125 and the bezel portion 127 in the pattern portion 121 (see FIG. 11G) is completed.

[0186] The thickness of the plating film 507 can be formed to be several μm to several tens of μm, for example, 7 μm to 20 μm, but it is preferably formed to be 10 μm.

[0187] The solution for forming the plating film 507 may be a mixture of a solution containing Ni ions and a solution containing Fe ions, or may be a mixture of a solution containing Ni ions, a solution containing Fe ions, and a solution containing Co ions.

[0188] Here, when the solution for forming the plating film 507 is a mixture of a solution containing Ni ions and a solution containing Fe ions, the mask sheet 120 (see FIG. 11G) made of an Invar thin plate can be formed. When the solution for forming the plating film 507 is a mixture of a solution containing Ni ions, a solution containing Fe ions, and a solution containing Co ions, the mask sheet 120 (see FIG. 11G) made of a super Invar thin plate can be formed.

[0189] Since the thermal expansion coefficient of the mask sheet 120 (see FIG. 11G) made of an Invar thin plate is about 2.0 to 4.0×10−6 / °C, and the thermal expansion coefficient of the mask sheet 120 (see FIG. 11G) made of a super Invar thin plate is very low at about 1.0×10−6 / °C or less, the possibility of the pattern shape of the mask 100 (see FIG. 11G) being deformed by thermal energy is low.

[0190] In addition to this, the target plating film 507 can be formed and used without limitation. However, in the first embodiment of the present invention, the manufacturing of the mask sheet 120 (see FIG. 11G) made of an Invar thin plate will be described mainly as an example.

[0191] Thus, when forming the mask sheet 120 (see FIG. 11G) made of an Invar thin plate by electroforming, the formation process of the mask sheet 120 (see FIG. 11G) can be simplified, the equipment cost for manufacturing can be reduced, and a large-area mask sheet 120 (see FIG. 11G) with a thin thickness (for example, 10 μm to 20 μm) can be formed.

[0192] On the other hand, after forming the plating film 507, heat treatment can be performed on the plating film 507, and it can be performed at a temperature of 300°C to 800°C.

[0193] Generally, the coefficient of thermal expansion of an Invar thin plate produced by electroforming is higher than that of an Invar thin plate produced by rolling. The coefficient of thermal expansion can be reduced by performing heat treatment on the Invar thin plate, but in this process, some deformation may occur in the Invar thin plate.

[0194] Therefore, when heat treatment is performed in a state where the cathode mother plate 501 and the conductive film 503 are bonded together, the shapes of the openings 130 (see FIG. 11G) and the dummy holes 200 (see FIG. 11G) provided in the space portion occupied by the insulating pattern 505 in the cathode mother plate 501 are kept constant, and there is an advantage that fine deformation due to heat treatment can be prevented. Also, after separating the cathode mother plate 501 from the plating film 507, performing heat treatment on the mask sheet 120 (see FIG. 11G) having the openings 130 (see FIG. 11G) also has the effect of reducing the coefficient of thermal expansion of the Invar thin plate.

[0195] Therefore, by further reducing the coefficient of thermal expansion of the mask sheet 120 (see FIG. 11G), deformation of the opening 130 (see FIG. 11G) on the μm scale can be prevented, and a mask 100 (see FIG. 11G) capable of depositing organic light-emitting layers 313a, 313b, 313c (see FIG. 10) with high resolution or ultra-high resolution can be manufactured.

[0196] Next, as shown in FIG. 11D, the mask frame 110 is attached via the adhesive pad 140 to the edge of the plating film 507 corresponding to the support portion 123 (see FIG. 11G) defined along the edge of the pattern portion 121 (see FIG. 11G) of the mask sheet 120 (see FIG. 11G).

[0197] The adhesive pad 140 is made of a material in which a conductive material is dispersed in an organic polymer material, and it is preferable to use a highly chemical-resistant epoxy-based organic material so as not to react in the cleaning process of the mask 100.

[0198] Also, the conductive material can include carbon, metal powders such as Ag, Cu, Ni, or nanowires.

[0199] At this time, the plating film 507 is adhered in a state where a force is naturally applied in the direction toward the mask frame 110 or in the outward direction, so that a tensile force acts in the outward direction and the mask frame 110 side is kept in a taut state.

[0200] The mask frame 110 has a rectangular frame shape with an opening region G, and the plating film 507 is exposed from the opening region G of the mask frame 110.

[0201] Such a mask frame 110 is preferably made of the same material as the plating film 507.

[0202] Next, as shown in FIG. 11E, an insulating film 509 is formed on the plating film 507 including the mask frame 110.

[0203] The insulating film 509 can be made of the same material as the insulating pattern 505. At this time, the insulating film 509 is formed in a region excluding a part of the side surface 110a of the mask frame 110 adjacent to the plating film 507, the inner side surface 140b of the adhesive pad 140, and a part of the surface 507a of the plating film 507 adjacent to the mask frame 110.

[0204] Next, as shown in FIG. 11F, a first adhesive plating film 150 is applied so as to cover a part of the side surface 110a of the mask frame 110, the inner side surface 140b of the adhesive pad 140, and a part of the edge surface 507a of the plating film 507, which are regions where the insulating film 509 is not formed.

[0205] The first adhesive plating film 150 can be made of the same material as the plating film 507. Alternatively, even when the plating film 507 is invar, it can be formed of Ni, which has relatively less residual stress than invar and is not an alloy, so that plating can be easily performed.

[0206] Such a first adhesive plating film 150 is also electrodeposited by electroforming. By applying a voltage to the mask frame 110, the adhesive pad 140, and the conductive film 503, the first adhesive plating film 150 is electrodeposited so as to cover a part of the side surface of the mask frame 110, the inner side surface of the adhesive pad 140, and a part of the edge surface of the plating film 507.

[0207] As shown in FIG. 12, the first adhesive plating film 150 is applied so as to cover a part of the side surface of the mask frame 110, the inner side surface of the adhesive pad 140, and a part of the edge surface of the plating film 507 along the edge of the mask sheet 120.

[0208] Therefore, the mask sheet 120 can minimize the displacement of the manufacturing PPA due to the shear stress applied to the adhesive pad 140 by the residual stress and gravity.

[0209] At this time, by forming the adhesive pad 140 with a conductive material, when a voltage is applied to the mask frame 110, the voltage can also be applied to the mask frame 110, the adhesive pad 140, and the conductive film 503. Further, since electroplating is simultaneously performed on the surface of the adhesive pad 140, the first electroless plating film 150 having a uniform thickness can be formed.

[0210] Subsequently, as shown in FIG. 11G, the cathode mother board 501 including the conductive film 503, the insulating film 509, and the insulating pattern 505 are removed. The cathode mother board 501, the insulating film 509, and the insulating pattern 505 can be removed by a chemical method.

[0211] For example, a stripping solution for selectively etching the insulating pattern 505 and the insulating film 509 is used, and in the process of removing the insulating pattern 505 and the insulating film 509 from the plating film 507, the plating film 507 can be separated from the cathode mother board 501.

[0212] In this way, by removing the cathode mother board 501, the insulating film 509, and the insulating pattern 505, only the plating film 507 and the mask frame 110 attached via the adhesive pad 140 along the edge of the plating film 507 will remain.

[0213] At this time, the support portion 123 is defined along the edge of the plating film 507, and the pattern portion 121 is defined inside the support portion 123, forming the mask sheet 120, and constituting the mask 100 according to the first embodiment of the present invention.

[0214] In the pattern portion 121, a plurality of openings 130 are provided in the plurality of cell portions 125, and a plurality of dummy holes 200 are provided in the bezel portion 127 between the plurality of cell portions 125.

[0215] The mask 100 according to the first embodiment of the present invention can reduce the rigidity difference between the cell portion 125 provided with a plurality of openings 130 and the bezel portion 127 by further providing dummy holes 200 on the bezel portion 127 within the pattern portion 121 of the mask sheet 120.

[0216] Therefore, since the manufacturing PPA is minimized, the deposition PPA is improved, and as a result, a high-resolution or ultra-high-resolution organic light-emitting layer pattern can be uniformly formed without causing deposition defects.

[0217] In particular, the mask 100 according to the first embodiment of the present invention can simplify the formation process of the mask sheet 120 by forming the mask sheet 120 made of an electroformed thin plate, reduce the equipment cost for manufacturing, and form a large-area mask sheet 120 having a thin thickness.

[0218] Further, since the mask sheet 120 is integrally formed with the mask frame 110 via the adhesive pads 140 and the first electroless plating film 150, it is possible to further prevent the mask sheet 120 from sagging. As a result, using the mask 100, a predetermined pattern can be deposited at an accurate position, and the deposition PPA can be improved.

[0219] Moreover, in the mask 100 according to the first embodiment of the present invention, since the adhesive pads 140 and the first electroless plating film 150 are positioned along the edge of the mask sheet 120, the mask sheet 120 can be stably placed, adhered, and supported on the mask frame 110 in a state where a tensile force acts on the mask sheet 120 in the direction of the mask frame 110.

[0220] Therefore, the mask 100 according to the first embodiment of the present invention can integrally form the mask sheet 120 that is taut on the mask frame 110 side with the mask frame 110 without performing the process of separately pulling and aligning the mask sheet 120.

[0221] Second Embodiment Figures 13 and 14 are cross-sectional views schematically showing a mask according to the second embodiment of the present invention.

[0222] As shown in the figure, a mask 100 according to the second embodiment of the present invention corresponds to the opening region G of the mask frame 110, and a support portion 123 defined along the edge of the mask sheet 120 is stably placed and supported / adhered on the mask frame 110 so that the pattern portion 121 of the mask sheet 120 is located.

[0223] At this time, a plurality of openings 130 are respectively formed in a plurality of cell portions 125 in the pattern portion 121 of the mask sheet 120. Each opening 130 may have a shape in which its side surface (131 in FIG. 2B) is inclined, a tapered shape, or a shape in which the pattern width becomes wider from the top to the bottom.

[0224] In addition, a plurality of dummy holes 200 provided in the bezel portion 127 defined between the plurality of cell portions 125 may also be in a tapered shape inclined so that the width gradually becomes narrower along the deposition direction, similar to the opening 130.

[0225] Such a mask sheet 120 is stably placed and supported / adhered on the mask frame 110 via an adhesive pad 140 provided at the lower part of the support portion 123 defined along the edge. The adhesive pad 140 can be composed of an epoxy resin-based adhesive or the like. For example, it is in the form of an adhesive foam and can also play a role in reducing the impact force transmitted between each other by buffering the impact received by the mask sheet 120 or the mask frame 110.

[0226] Since the adhesive pad 140 has a thin thickness of about 10 μm to 100 μm, even if it is interposed between the mask sheet 120 and the mask frame 110, it hardly affects the step.

[0227] Further, in the mask 100 according to the second embodiment of the present invention, a first adhesive plating film 150 is further applied between a part of the back surface of the support portion 123 of the mask sheet 120 that is not adhered to the adhesive pad 140 and the mask frame 110.

[0228] The first adhesive plating film 150 can be applied to cover the inner side surface of the adhesive pad 140 from a part of the back surface of the support portion 123 of the mask sheet 120 and extend to the side surface of the mask frame 110.

[0229] Such a first adhesive plating film 150 serves to prevent displacement of the manufacturing PPA due to the shear stress applied to the adhesive pad 140 by the residual stress and gravity of the mask 100.

[0230] Such a first adhesive plating film 150 can be applied to a thickness of 50 μm to 250 μm. However, when applied to a thickness of 50 μm or less, the adhesive force of the first adhesive plating film 150 is very weak to maintain the adhesive force between the mask sheet 120 and the mask frame 110, and it is substantially difficult to have adhesiveness. Also, it may not be able to fill the gap between the support portion 123 of the mask sheet 120 and the mask frame 110.

[0231] As a result, voids are formed, and in subsequent cleaning processes, etc., cleaning liquid, etc. may penetrate into the voids. If this remains as it is and is carried into the evaporator during the drying process, it evaporates during the process of depositing the organic light-emitting substance, reacts as a foreign substance of the organic light-emitting substance, and may affect the life of the organic light-emitting layer, etc.

[0232] Also, when the thickness of the first adhesive plating film 150 is applied to 250 μm or more, a problem may occur that the film floats due to the stress of the plating film itself.

[0233] That is, it is difficult to form the first adhesive plating film 150 having a thickness of 250 μm or more itself.

[0234] In particular, in the process of recycling the mask frame 110, if the applied first adhesive plating film 150 is too thick, it becomes very difficult to remove the first adhesive plating film 150. Therefore, the first adhesive plating film 150 is preferably applied to a thickness of 200 μm.

[0235] Considering thermal deformation and the like, the first adhesive plating film 150 is preferably made of the same material as the mask frame 110 and the mask sheet 120. In particular, it is preferably made of a metal material so that the mask frame 110 and the mask sheet 120 can be metallically bonded.

[0236] Here, as shown in FIG. 13, the mask 100 according to the second embodiment of the present invention can further include a cover portion 600 of the bezel portion corresponding to the bezel portion 127 provided with a plurality of dummy holes 200.

[0237] The cover portion 600 of the bezel portion can be made of a thin polymer film that can adhere to the mask sheet 120. However, by curing with ultraviolet rays or heat, it is preferable to prevent the cover portion 600 of the bezel portion from separating or deteriorating in the cleaning process of the mask 100.

[0238] Also, as shown in FIG. 14, by forming the cover portion 600 of the bezel portion located corresponding to the bezel portion 127 provided with a plurality of dummy holes 200 into a two-layer structure of an adhesive layer 610 and a polymer film 620, it is possible to prevent the polymer film 620 from shifting.

[0239] Such a cover portion 600 of the bezel portion may be formed corresponding to the entire bezel portion 127 of the mask 100, or may be formed corresponding to only a part of the region such as a pad portion formed in the non-display region (BA in FIG. 10) of the organic light-emitting display device (300 in FIG. 10).

[0240] Also, it may be formed corresponding to a part of the region around the pattern such as an alignment key, thickness management, evaporation PPA management, etc.

[0241] The mask 100 according to the second embodiment of the present invention can reduce the rigidity difference between the cell portion 125 provided with a plurality of openings 130 and the bezel portion 127 by further providing dummy holes 200 on the bezel portion 127 within the pattern portion 121 of the mask sheet 120.

[0242] Therefore, since the vapor deposition PPA due to the manufacturing PPA is minimized, a high-resolution or ultra-high-resolution organic light-emitting layer pattern can be uniformly formed without causing vapor deposition defects.

[0243] In particular, by further providing a cover portion 600 corresponding to the bezel portion 127, the organic light-emitting substance can be prevented from being vapor-deposited or selectively vapor-deposited on the vapor deposition substrate through the dummy holes 200 provided in the bezel portion 127, and problems such as moisture penetration caused by the organic light-emitting substance vapor-deposited in the non-display area (BA in FIG. 10) of the organic light-emitting display device (300 in FIG. 10) can be prevented from occurring.

[0244] Third Embodiment FIG. 15 is a cross-sectional view schematically showing a mask according to the third embodiment of the present invention.

[0245] As shown in FIG. 15, the mask 100 according to the third embodiment of the present invention corresponds to the opening region G of the mask frame 110, and a support portion 123 defined along the edge of the mask sheet 120 is stably placed and supported on the mask frame 110 so that the pattern portion 121 of the mask sheet 120 is located.

[0246] At this time, a plurality of openings 130 are respectively formed in the plurality of cell portions 125 in the pattern portion 121 of the mask sheet 120, and a plurality of dummy holes 200 are provided in the bezel portion 127 defined between the plurality of cell portions 125.

[0247] Such a mask sheet 120 is integrally connected to the mask frame 110 by adhering a support portion 123 defined along its edge portion to the mask frame 110. At this time, a cover sheet 700 is positioned between the support portion 123 of the mask sheet 120 and the mask frame 110, and the cover sheet 700 and the support portion 123 of the mask sheet 120 are adhered via an adhesive pad 140.

[0248] The cover sheet 700 is formed corresponding to the bezel portion 127 of the mask sheet 120. The mask frame 110, the cover sheet 700, the adhesive pad 140, and the support portion 123 of the mask sheet 120 are adhered to each other via a first adhesive plating film 150.

[0249] Such a cover sheet 700 is preferably adhered and fixed only at the contact portion with the mask frame 110 in order to prevent displacement of the vapor-deposited PPA due to temperature change during the vapor deposition process.

[0250] With such a cover sheet 700, it is possible to prevent the organic light-emitting substance from being vapor-deposited or selectively vapor-deposited through the dummy hole 200 provided in the bezel portion 127 onto the vapor-deposited substrate, and to prevent problems such as moisture penetration that may be caused by the organic light-emitting substance vapor-deposited in the non-display area (BA in FIG. 10) of the organic light-emitting display device (300 in FIG. 10).

[0251] Fourth Embodiment FIG. 16A is a cross-sectional view schematically showing a mask according to the fourth embodiment of the present invention, and FIG. 16B is a back plan view of FIG. 16A.

[0252] As shown in the figure, a support portion 123 defined along the edge portion of the mask sheet 120 corresponding to the opening region G of the mask frame 110 and where the pattern portion 121 of the mask sheet 120 is located is stably placed on and supported and adhered to the mask frame 110.

[0253] At this time, a plurality of openings 130 are respectively formed in a plurality of cell portions 125 in the pattern portion 121 of the mask sheet 120, and a plurality of dummy holes 200 are provided in a bezel portion 127 defined between the plurality of cell portions 125.

[0254] Such a mask sheet 120 is stably placed and supported on the mask frame 110 through an adhesive pad 140 provided at the lower part of a support portion 123 defined along the edge portion.

[0255] Further, in the mask 100 according to the fourth embodiment of the present invention, a first adhesive plating film 150 is further applied between a part of the back surface of the support portion 123 of the mask sheet 120 that is not adhered to the adhesive pad 140 and the mask frame 110.

[0256] The first adhesive plating film 150 can be applied to cover the inner side surface of the adhesive pad 140 from a part of the back surface of the support portion 123 of the mask sheet 120 and extend to the side surface of the mask frame 110.

[0257] Such a first adhesive plating film 150 serves to prevent displacement of the manufacturing PPA due to the residual stress of the mask 100 and the shear stress applied to the adhesive pad 140 by gravity.

[0258] The first adhesive plating film 150 is preferably made of the same material as the mask frame 110 and the mask sheet 120 in consideration of thermal deformation and the like. In particular, it is preferably made of a metal material so that the mask frame 110 and the mask sheet 120 can be metallically bonded.

[0259] Here, the mask 100 according to the fourth embodiment of the present invention is characterized in that the mask frame 110 is further provided with ribs 800.

[0260] The rib 800 corresponds to the bezel portion 127 of the pattern portion 121 in the mask sheet 120 and can be formed. By this rib 800, the rigidity of the mask frame 110 can be improved, and it is also possible to prevent the mask sheet 120 from sagging.

[0261] Such a rib 800 can be provided with one or two at the center of the mask 100 so as to connect the first end frame 110a of the mask frame 110 and the third end frame 110c facing the first end frame 110a.

[0262] Fifth Embodiment FIG. 17 is a cross-sectional view schematically showing a mask according to the fifth embodiment of the present invention.

[0263] As shown in FIG. 17, in the mask 100 according to the fifth embodiment of the present invention, a support portion 123 defined along the edge of the mask sheet 120 corresponding to the opening region G of the mask frame 110 and where the pattern portion 121 of the mask sheet 120 is located is stably placed and supported and adhered on the mask frame 110.

[0264] At this time, a plurality of openings 130 are respectively formed in a plurality of cell portions 125 in the pattern portion 121 of the mask sheet 120, and a plurality of dummy holes 200 are provided in the bezel portion 127 defined between the plurality of cell portions 125.

[0265] Here, in the mask 100 according to the fifth embodiment of the present invention, the support portion 123 defined along the edge of the mask sheet 120 is stably placed and supported on the mask frame 110. At this time, a conductive adhesive 900 is applied between the back surface of the support portion 123 and the mask frame 110, and the mask sheet 120 is adhered to the mask frame 110.

[0266] Since the conductive adhesive 900 is in a liquid state, due to capillary action, it enters through the gap between the back surface of the support portion 123 of the mask sheet 120 and the mask frame 110, and adheres to and bonds a part of the back surface of the support portion 123 in the mask sheet 120 and the mask frame 110.

[0267] The conductive adhesive 900 can also be composed of a material in which a conductive material is dispersed in an organic polymer material, but it is preferable to use an epoxy-based organic material with strong chemical resistance so as not to react in the cleaning process of the mask 100.

[0268] The conductive material can include carbon, metal powders such as Ag, Cu, Ni, or nanowires.

[0269] In addition, a first adhesive plating film 150 is further applied between a part of the back surface of the support portion 123 in the mask sheet 120, which includes the conductive adhesive 900, and the mask frame 110.

[0270] The first adhesive plating film 150 can cover the inner side surface of the adhesive pad 140 from a part of the back surface of the support portion 123 of the mask sheet 120 and extend to the side surface of the mask frame 110 for application.

[0271] Such a first adhesive plating film 150 serves to prevent displacement of the manufacturing PPA due to the shear stress applied to the adhesive pad 140 by the residual stress and gravity of the mask 100.

[0272] The first adhesive plating film 150 is preferably made of the same material as the mask frame 110 and the mask sheet 120 in consideration of thermal deformation and the like. In particular, it is preferable to make it of a metal material so that the mask frame 110 and the mask sheet 120 can be metallically bonded.

[0273] As in the fifth embodiment of the present invention, by adhering the mask sheet 120 to the mask frame 110 via the conductive adhesive 900 and the first adhesive plating film 150, the mask sheet 120 can be easily adhered to the mask frame 110.

[0274] The present invention is not limited to the above-described embodiments, and various modifications and implementations can be made without departing from the spirit of the present invention.

Explanation of Reference Numerals

[0275] 100... mask, 110... mask frame, 120... mask sheet, 121... pattern portion, 123... support portion, 125... cell portion, 127... bezel portion, 130... opening, 140... adhesive pad, 150... first adhesive plating film, 200... dummy hole

Claims

1. In a mask set including at least one mask, the at least one mask includes a mask frame in which an opening region is defined, a mask sheet corresponding to the opening region, provided with a pattern portion, and having a support portion defined along an edge of the pattern portion, and a first adhesive plating film covering a back surface of the support portion and a side surface of the mask frame, the pattern portion includes a plurality of cell portions each provided with a plurality of openings, and a bezel portion defined between the plurality of cell portions and provided with a plurality of dummy holes, an approximation level value (Approximation Level: AL) based on an RD (Rib Density) value of the cell portion and an RD (Rib Density) value of the bezel portion is defined as AL = |(BRD - CRD) × BRD| ≦ 0.1, an adhesive pad is interposed between a back surface of the support portion and an upper surface of the mask frame, the adhesive pad includes a protruding portion protruding from the mask frame toward the opening region, a mask set.

2. The mask set according to claim 1, wherein the first adhesive plating film covers a back surface of the support portion exposed outside the adhesive pad, an inner side surface of the adhesive pad, and a side surface of the mask frame.

3. the at least one mask includes a red mask provided with an R opening corresponding to an R sub-pixel in the cell portion, a green mask provided with a G opening corresponding to a G sub-pixel in the cell portion, and a blue mask provided with a B opening corresponding to a B sub-pixel in the cell portion, the R, G, and B openings are respectively arranged at different positions in the cell portion, the plurality of dummy holes in the red, green, and blue masks are located at the same position in the bezel portion, the mask set according to claim 1.

4. The mask set according to claim 1, wherein the plurality of openings and the plurality of dummy holes are tapered.

5. In a mask set including at least one mask, the at least one mask includes a mask frame in which an opening region is defined, a mask sheet corresponding to the opening region, provided with a pattern portion, and having a support portion defined along an edge of the pattern portion, and a first adhesive plating film covering a back surface of the support portion and a side surface of the mask frame, The pattern portion includes a plurality of cell portions provided with a plurality of openings, and a bezel portion defined between the plurality of cell portions and provided with a plurality of dummy holes. The approximation level value (Approximation Level: AL) based on the RD (Rib Density) value of the cell portion and the RD (Rib Density) value of the bezel portion is defined as AL = |(BRD - CRD) × BRD| ≦ 0.

1. An adhesive pad is interposed between the back surface of the support portion and the upper surface of the mask frame. The adhesive pad is a mask set containing a conductive material. **Claim 6** The mask set according to any one of claims 1 to 5, wherein the first electroless plating film has a thickness of 50 μm to 250 μm. **Claim 7** The mask set according to any one of claims 1 to 5, wherein the first electroless plating film is made of the same material as the mask sheet and the mask frame. **Claim 8** The mask set according to claim 7, wherein the solution for forming the first electroless plating film contains Ni, or / and Fe. **Claim 9** In a mask set including at least one mask, the at least one mask includes a mask frame in which an opening region is defined, a mask sheet corresponding to the opening region, provided with a pattern portion, and having a support portion defined along the edge of the pattern portion, and a first electroless plating film covering the back surface of the support portion and the side surface of the mask frame. The pattern portion includes a plurality of cell portions provided with a plurality of openings, and a bezel portion defined between the plurality of cell portions and provided with a plurality of dummy holes. The approximation level value (Approximation Level: AL) based on the RD (Rib Density) value of the cell portion and the RD (Rib Density) value of the bezel portion is defined as AL = |(BRD - CRD) × BRD| ≦ 0.

1. An adhesive pad is interposed between the back surface of the support portion and the upper surface of the mask frame. The mask set further includes a second electroless plating film covering a part of the upper surface end portion and the side surface of the support portion, the outer side surface of the adhesive pad, and a part of the upper surface of the mask frame. **Claim 10** The mask set according to claim 9, wherein the second electroless plating film is made of the same material as the first electroless plating film. **Claim 11** In a mask set including at least one mask, the at least one mask includes A mask frame having an opening area, A mask sheet corresponding to the opening area, provided with a pattern portion, and having a support portion defined along an edge of the pattern portion, Including a first adhesive plating film covering a back surface of the support portion and a side surface of the mask frame, The pattern portion includes a plurality of cell portions provided with a plurality of openings, and a bezel portion defined between the plurality of cell portions and provided with a plurality of dummy holes, An approximation level value (Approximation Level: AL) based on an RD (Rib Density) value of the cell portion and an RD (Rib Density) value of the bezel portion is defined as AL = |(BRD - CRD) × BRD| ≦ 0.1, The mask set according to claim 1, further including a cover portion of the bezel portion corresponding to the dummy holes on a back surface of the mask sheet.

12. The mask set according to claim 11, wherein the cover portion of the bezel portion is made of a polymer film or has a two-layer structure in which an adhesive layer is further interposed between the polymer film and a back surface of the mask sheet.

13. The mask set according to claim 11, wherein the cover portion of the bezel portion is cured by ultraviolet rays or heat.

14. In a mask set including at least one mask, The at least one mask includes A mask frame having an opening area, A mask sheet corresponding to the opening area, provided with a pattern portion, and having a support portion defined along an edge of the pattern portion, Including a first adhesive plating film covering a back surface of the support portion and a side surface of the mask frame, The pattern portion includes a plurality of cell portions provided with a plurality of openings, and a bezel portion defined between the plurality of cell portions and provided with a plurality of dummy holes, An approximation level value (Approximation Level: AL) based on an RD (Rib Density) value of the cell portion and an RD (Rib Density) value of the bezel portion is defined as AL = |(BRD - CRD) × BRD| ≦ 0.1, An adhesive pad is interposed between a back surface of the support portion and an upper surface of the mask frame, The mask set further includes a cover sheet corresponding to the support portion and the bezel portion on a back surface of the mask sheet.

15. The cover sheet is located between the adhesive pad and the mask frame, The first adhesive plating film is located to cover a side surface of the cover sheet, and the mask set according to claim 14.

16. The mask frame corresponds to the bezel portion, and further includes a rib for connecting opposing end frames of the mask frame, and the mask set according to any one of claims 1 to 5.

17. In a mask set including at least one mask, the at least one mask includes a mask frame in which an opening region is defined, a mask sheet corresponding to the opening region, provided with a pattern portion, and having a support portion defined along an edge of the pattern portion, and a first adhesive plating film located to cover a back surface of the support portion and a side surface of the mask frame, the pattern portion includes a plurality of cell portions provided with a plurality of openings, and a bezel portion defined between the plurality of cell portions and provided with a plurality of dummy holes, an approximation level value (Approximation Level: AL) based on an RD (Rib Density) value of the cell portion and an RD (Rib Density) value of the bezel portion is defined as AL = |(BRD - CRD) × BRD| ≦ 0.1, a conductive adhesive is located on a back surface of the support portion and a side surface of the mask frame, the first adhesive plating film is located to cover the back surface of the support portion and the side surface of the mask frame above the conductive adhesive, and the mask set.

18. a) providing a first insulating pattern and a second insulating pattern on an upper portion of a cathode mother board on which a conductive film is deposited; b) performing primary electroforming to form a plating film on an upper portion of the conductive film; c) adhering a mask frame along an edge of the plating film above the plating film; d) forming an insulating film on an entire surface of the cathode mother board so as to expose a partial surface of the plating film adjacent to the mask frame and a partial surface of the mask frame; e) performing secondary electroforming on a partial surface of the plating film exposed outside the insulating film and a partial surface of the mask frame to form a first adhesive plating film; f) removing the cathode mother board including the conductive film, the insulating film, and the insulating pattern to form a mask sheet, the mask sheet includes openings and dummy holes corresponding to the insulating pattern in a cell portion and a bezel portion. The approximation level value (Approximation Level: AL) based on the RD (Rib Density) value of the cell part and the RD (Rib Density) value of the bezel part is defined as AL = |(BRD - CRD) × BRD| ≦ 0.

1. Method for manufacturing a mask.

19. Before the step of a), The step of providing a conductive pattern on a glass substrate, The method for manufacturing a mask according to claim 18, further comprising performing primary electroforming to form the plating film on top of the conductive pattern.

20. After the step of b), the method for manufacturing a mask according to claim 18, further comprising the step of adhering the mask frame via an adhesive pad along the edge of the plating film on top of the plating film.

21. The adhesive pad contains a conductive substance. In the step of forming the first adhesive plating film, the adhesive pad serves as a passage for transmitting the voltage applied from the mask frame to the conductive film, and also serves as an electrode where metal is deposited when electrons are emitted from the pad itself and electroforming is performed. The method for manufacturing a mask according to claim 20.

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