Heat transfer plate and method for manufacturing the heat transfer plate

The heat transfer plate design with complementary longitudinal webs and grooves in the plate elements allows for efficient and cost-effective assembly of connecting pipes, improving thermal management and durability in automobile batteries.

JP7705441B2Active Publication Date: 2025-07-09BENTELER AUTOMOBILTECHNIK GMBH
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Patent Information

Application Number
JP2023216946
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2023-02-27
Filing Date
2023-12-22
Publication Date
2025-07-09
Estimated Expiration
2043-12-22

AI Technical Summary

Technical Problem

Existing heat transfer plates for automobile batteries face challenges in assembly, manufacturing process reliability, and cost-effective joining of connecting pipes, which affect the thermal management and durability of the battery system.

Method used

A heat transfer plate design featuring a plate body composed of two plate elements with integrated connecting pipes, where the connecting portion is oriented parallel to the plate element plane, and a complementary longitudinal web and groove configuration ensures a tight, high-strength joint through a molding and soldering process, using ductile solder material to form channels and seals.

Benefits of technology

The solution enables rapid, reliable, and cost-effective assembly of connecting pipes, reducing flow resistance and improving durability while maintaining airtightness, thus enhancing the thermal management of automobile batteries.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a heat exchanger plate enabling low-cost bonding assurance and a method for producing the same.SOLUTION: A cooling plate for a vehicle battery of a motor vehicle is provided, comprising: a plate body 2 comprising two plate elements 3, 4; and a connecting pipe 6 for a cooling fluid. The connecting pipe 6 has a connection section which is joined in a receiving section 8 of the plate body 2 formed between the plate elements 3, 4. The connection section has two arcuate wall sections 16, 17 in cross section and two opposing, outwardly directed longitudinal webs 9. The receiving section 8 has longitudinal grooves 10 extending between the plate elements 3, 4 in the area of the joining plane FE. The longitudinal webs 9 extend in the longitudinal grooves 10. A solder material 20 is melted into between the plate elements 3, 4 and between the connection section and the receiving section 8, and they are joined by soldering.SELECTED DRAWING: Figure 6
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Description

Technical Field

[0001] The present invention relates to a heat transfer plate and a method for manufacturing the heat transfer plate.

Background Art

[0002] Heat transfer plates are used for different applications. The type of heat transfer plate in question here is, in particular, a cooling plate for cooling an automobile battery.

[0003] Increasing demands on electric vehicles with regard to travel distance, driving performance, and charging time mean that the thermal load on the battery increases due to overheating or aging. To reduce these harmful effects, the operating temperature of the battery is limited by a temperature control element through which a medium flows. The temperature control element is a heat transfer plate in the form of a cooling plate arranged above, beside, and / or below the battery module.

[0004] Conventional types of heat transfer plates usually consist of joined aluminum sheets or extruded aluminum profiles that allow the heat transfer plate to be traversed by a temperature control medium or a cooling fluid through connecting pipes. Usually, the connecting pipes are manufactured by shaping or machining and are joined to the plate body of the cooling plate. The connecting pipes are considered to enable rapid assembly of the cooling fluid lines.

[0005] According to European Patent No. 2372761, a cooling plate having a plate body composed of two plate elements is part of the prior art. In the case of this cooling plate, a fluid connection member or a connecting pipe for the cooling fluid is arranged on a flat surface of the plate element parallel to the surface of the plate element.

[0006] In the case of the cooling plate known from European Patent Application Publication No. 2607832, the supply and discharge of the cooling fluid are carried out through a connecting member that can be inserted into the accommodating portion of the plate element through a connecting portion.

[0007] In the case of the battery cooling plate described in European Patent Application Publication No. 3741876, the plate body is composed of two plate elements, is provided with a connecting pipe for the cooling fluid, and the connecting pipe is oriented parallel to the plane of the plate element and joined to the connecting portion within the accommodating portion of the plate body.

[0008] German Patent No. 102010051106 discloses a cooling plate having at least one cooling channel for guiding a coolant, the cooling channel having at least one inlet and at least one outlet. The cooling plate includes plate elements that abut against each other on at least two surfaces, and bulges that form the cooling channels with respect to each other are formed within these plate elements. The inlet and the outlet each include a connecting pipe for connecting the cooling channel to a coolant connection unit.

Prior Art Documents

Patent Documents

[0009]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0010] Based on the prior art, the problem underlying the present invention is to provide a heat transfer plate that is improved functionally and in manufacturing technology, is easy to assemble the connecting pipe to the plate body of the heat transfer plate, has process reliability, and shows a method for manufacturing a heat transfer plate that ensures inexpensive joining.

Means for Solving the Problems

[0011] The solution to the object-related part of the problem lies in the heat transfer plate according to the features of claim 1.

[0012] The method-related part of the problem is solved by the method according to claim 11.

[0013] Advantageous formations and developments of the present invention are the subject matter of the dependent claims.

[0014] The heat transfer plate comprises a plate body composed of two plate elements and connecting pipes for the supply and discharge of a cooling fluid. The plate elements are, in particular, channel plates and base plates that are integrated into a plate laminate and joined to each other to form the plate body. A connecting pipe is joined to the plate body. At least one connecting pipe has a connecting portion, and this connecting portion is joined within a receiving portion of the plate body formed between the plate elements. The orientation of the connecting portion of the connecting pipe is parallel to the plane of the plate element. On the outside of the plate body, the connecting pipe can comprise an arch and / or a curved portion. The portion of the connecting pipe extending outside the plate body is configured as a connecting portion for connecting a connecting line for the cooling fluid.

[0015] The plate element is made of a light metal or a light metal alloy, in particular an aluminum alloy.

[0016] At least one plate element of the plate body of the cooling plate comprises a channel structure for guiding a cooling fluid.

[0017] According to the present invention, the connecting portion comprises two outwardly directed longitudinal webs, the receiving portion comprises a longitudinal groove extending within the region of the joining plane between the plate elements, and the longitudinal webs extend within the longitudinal groove.

[0018] The plate element is in a state in which the connecting portion of the connecting pipe is incorporated into the receiving portion of the plate body. solderThey are joined by attachment. The longitudinal webs and longitudinal grooves complement each other. The contour or configuration of the longitudinal webs and longitudinal grooves ensures the technically required joining gap. The joining surface is optimized. The joining gap, especially the width of the joining gap, is equalized without a sudden change in thickness across the periphery or path between the connecting part and the receiving part. The gap width is small. A high-strength and tight material joining is achieved by the connecting part of the connecting pipe within the receiving part of the plate body.

[0019] The connecting part comprises two convexly curved wall parts, and these wall parts extend between the longitudinal webs. In particular, the wall parts are curved in an oval or oval-shaped manner.

[0020] The two curved wall parts extend mirror-symmetrically with respect to the transverse axis of the connecting part, especially the central longitudinal axis, and each has a terminal side and transitions to the longitudinal web. The wall parts are curved convexly towards the center point or the central longitudinal axis of the connecting part. Within the web part, the side surfaces are curved concavely.

[0021] The formation of the connecting part contemplates that the connecting part of the connecting pipe has an oval or oval-shaped outer contour with outward longitudinal webs facing each other on the transverse axis in cross-section.

[0022] It is possible for the connecting part to have flat upper and lower wall parts, especially a central wall part, in cross-section, and these wall parts each have a terminal side and transition to the longitudinal web via the convexly curved wall part.

[0023] The receiving part of the plate body constitutes an insertion or joining area for the connecting part of the connecting pipe.

[0024] The connecting pipe comprises longitudinal webs extending on both sides in the longitudinal direction of the connecting pipe within the connecting part. These longitudinal webs have a cross-section configured as a triangle with a concave web wall and rounded tips. The contour of the longitudinal webs ensures a smooth transition from the oval outer contour to the longitudinal webs with a rounded surface without steps or sharp curvatures or corners.

[0025] The longitudinal groove in the receiving part is configured in a funnel shape in cross section, having a groove side wall concave with respect to the center point or central longitudinal axis of the connecting pipe and the receiving part and a wedge-shaped groove bottom. The inner contour within the region of the inner corner of the receiving part formed by the groove side wall is rounded along the groove side wall. The groove bottom at the transition of the receiving part to the plate elements in contact with each other is an acute angle.

[0026] The configurations of the longitudinal web and the longitudinal groove are formed complementarily to each other. The contours of the longitudinal web and the longitudinal groove complement each other such that the longitudinal web entering the longitudinal groove cooperates in the form of a positive engagement and a joining gap is formed between the contours.

[0027] The connecting part comprises two wall parts that extend in a convexly curved manner. These wall parts each extend between the longitudinal webs facing each other and transition to a concave web wall.

[0028] The receiving part comprises inner wall parts that extend in a convexly curved manner, to which concave groove side walls are connected.

[0029] The descriptions of "convex" and "concave" are each related to the center point or longitudinal axis of the connecting pipe. A convex surface, convex wall or convex wall part is a surface or part that bulges outward from the center point or central longitudinal axis of the connecting pipe.

[0030] A concave surface, concave wall part or concave groove side wall is a surface, part or side surface that bulges inward or extends in a curved manner with respect to the center point or central longitudinal axis of the connecting part.

[0031] The connecting part of the connecting pipe, in cross section, is formed mirror-symmetrically with respect to a horizontal central transverse axis and a vertical central transverse axis, similar to the receiving part.

[0032] The cross-sectional contour of the connection part can be described as being lemon-shaped or lemon-like, and the description of the cross-section relates to the longitudinal section passing through the lemon. This means that the connection part is configured in an elliptical shape and has a major axis and a minor axis in the cross-section. The major axis and the minor axis are perpendicular to each other and intersect at a central point along the central axis of the connecting pipe. The major axis represents the maximum dimension of the connecting pipe within the connection part, while the minor axis represents the minimum dimension of the connection part in the outward radial direction. With respect to the joining plane of the plate elements of the plate body, the major axis extends within the joining plane and coincides with the horizontal central transverse axis. The minor axis coincides with the vertical central transverse axis.

[0033] The cross-section of the connecting pipe within the connection part is symmetric with respect to the major axis and the minor axis.

[0034] The longitudinal webs face each other on the major axis and are formed outward from the wall of the connecting pipe.

[0035] As described, the longitudinal webs form the cross-section, in particular, into a triangle with rounded concave web walls and rounded tips. The rounded tips constitute the overlap of the lateral webs.

[0036] A joining gap is formed between the connection part of the connecting pipe and the receiving part of the plate body. Through the formation up to the vicinity of the tubular contours of the connecting pipe and the receiving part and their mutual adjustment, a technically necessary and advantageous joining gap is ensured. Particularly advantageous is that the joining gap has a slight or small width in the cross-section within its circumferential path, and this width is uniformly small over most of the circumferential length of the joining gap. Also within the region between the tip of the longitudinal web and the wedge-shaped groove bottom of the longitudinal groove, solder the attachment gap is small.

[0037] Between the connection part and the receiving part, solder material is applied. The upper and lower plate elements, and the plate elements and the connecting pipe are solder joined by attachment. This can be achieved in a manufacturing-technological, process-reliable, and inexpensive manner. The parts solderJoining by attachment is carried out during molding solder in an attachment mold, and during this molding solder in the attachment mold, the plate elements are pressed against each other at the joining surface, the receiving portion of the plate body composed of both plate elements is finally molded, channels are formed in the plate body, and the parts are solder heated to the attachment temperature, solder and joined to each other by attachment.

[0038] In the mold, a combination of molding and solder attachment is carried out. During molding solder in the attachment mold, channels and channel structures are formed in the plate body, the connecting portion of the plate body is finally molded, and the joining portions of the upper and lower plate elements, the plate element or the receiving portion and the connecting pipe are joined to each other solder by attachment. solder During the attachment process, the parts are solder clamped in the attachment mold and pressed against each other.

[0039] Aspects of the present invention utilize the ductile of solder material molding characteristics to seal the connecting pipe within the receiving portion. The connecting portion of the connecting pipe is preformed at least near the final contour. Here, the connecting portion has a cross-sectional configuration having two longitudinal webs that are outwardly directed on the horizontal axis and a wall portion that extends in an arched shape between the longitudinal webs. The molding of the connecting pipe is carried out technically using an inner mandrel.

[0040] is applied to the connecting portion of the connecting pipe. solder material can be pre-applied to both molded portions of the plate element and the connecting contour within the region between the connecting portion and the receiving portion. Advantageous formations and methods solder material are contemplated where solder material is applied within the connecting contour or on the connecting portion, for example solder material in the form of a layer or solder material a sleeve. As already mentioned, for this purpose, it can be pre-applied in an appropriate amount to the molded portions of the plate element and the connecting contour. solder material is, for example, a low melting point solder material, especially those of aluminum-based solder material consisting of solder strips or solder are applied to the connection part in the form of sleeves.

[0041] The plate elements are transferred to a heatable forming solder attachment mold equipped with an upper mold and a lower mold. For this reason, outside the forming solder attachment mold, a plate laminate composed of both plate elements can be formed, and the connecting pipe can be positioned within the cell cluster contour between the forming parts of the plate elements at its connecting part. Then, this plate laminate is transferred into the forming solder attachment mold.

[0042] The plate laminate with the connecting pipe incorporated can also be formed within the forming solder attachment mold. For this reason, the plate elements are positioned within the forming solder attachment mold with the connecting pipe incorporated. Within the forming solder attachment mold, the connecting part is positioned between the forming part of the plate element and the connecting contour provided therein. The forming part can be formed on the board part of the plate element protruding from the base body of the plate element.

[0043] During the closing of the forming solder attachment mold, the plate laminate composed of both plate elements is clamped within the forming solder attachment mold together with the connecting part of the incorporated connecting pipe. Here, the connecting contour is finally formed within the forming part of the plate element around the connecting part of the connecting pipe. The forming part of the plate element is finally formed and constitutes a receiving part. The outer contour of the connecting part sets the inner contour of the receiving part. The formed forming parts complement each other to form the receiving part. The receiving part has an inner wall part that extends convexly curved. In the region of the joining plane between the plate elements, a longitudinal groove extending in the longitudinal direction of the receiving part is formed. The longitudinal groove is configured with a funnel-shaped cross-section and has a concave groove side wall and a wedge-shaped groove bottom. The groove side wall connects to the inner wall part of the receiving part that extends curvedly.

[0044] Forming process and forming solder When forming the contour of the accommodation part in the attachment mold, it is applied around the connecting pipe solder material is compressed in the radial direction and ductile solder material is pressed so as to flow into the joining gap generated between the connecting part and the accommodation part.

[0045] Forming solder The intermediate space between the plate elements of the plate laminate in the attachment mold is subjected to the action of internal pressure. This is done by introducing the working medium through the connecting pipe. By forming with internal pressure, at least one channel is formed in at least one of the plate elements.

[0046] Plate element or forming solder For the plate laminate clamped in the attachment mold solder material is melted between the plate elements and between the connecting part and the accommodation part to join the parts materially.

[0047] An advantageous formation contemplates that the connecting pipe is provided with a stopper. In particular, the stopper is formed in the form of an annular bead. The stopper or the annular bead abuts against the connecting pipe at the end face. The position of the connecting pipe in the axial introduction direction relative to the plate body is determined by the stopper abutting against the connecting pipe at the end face. Further, at the opening of the connecting pipe, axial sealing is performed by the stopper or the annular bead.

[0048] Another advantageous embodiment of the heat transfer plate according to the present invention is solder When forming the attachment joint solder Flow restricting solder It is contemplated that stop means are provided. solder The stop means are arranged between the connecting pipe and the accommodation part, and in particular solder The stop means are arranged between the connecting part of the connecting pipe and the accommodation part.

[0049] One embodiment contemplates that stop means are arranged on the opening side of the accommodation part. solder The opening side meanssolder The stop means means that it is applied inside the housing part within the area of the opening of the housing part, or is applied outside on the end face around the opening of the housing part.

[0050] A particularly advantageous formation in practice contemplates that solder the stop means is formed by a cross-sectional change at the connection part of the connecting pipe and the housing part. solder The stop means is formed by a cross-sectional change in the joining region between the housing part formed in the forming part of the plate element and the connecting pipe. Both the connecting part and the housing part comprise two length parts with different cross-sections from each other. The length part of the connecting part and the length part of the housing part transition into each other via a tapered part.

[0051] The cross-sectional changes at the connecting part and the housing part complement each other, resulting in a reduction in the cross-section of the annular space between the connecting part and the housing part. solder during the attaching process, the melted solder material is retained at the cross-sectional change part between the connecting part and the housing part. Thereby, solder during the formation of the attachment joint solder the flow is restricted.

[0052] An additional or alternative embodiment contemplates that solder the stop means is composed of a sealing metal. The sealing metal softens and becomes viscous under the action of temperature in the forming solder attachment mold. As a result, under the pressure in the forming solder attachment mold, a homogeneous sealant with fluidity is obtained that prevents the melted solder attachment material from flowing into undesirable or technically disadvantageous areas. The sealing metal has a melting temperature higher than that of the solder used in the attachment process solder material .

[0053] solder The stop means solder is equipped and set to restrict the flow solder during the formation of the attachment joint. Also, solderThe stop means is equipped, set, and positioned to prevent the solder material blowout of the still molten

[0054] solder during the internal pressure reforming of the plate element forming the channel. solder material It can also be composed of solder material . As a result, two solder material with different material properties are applied. The first type of solder material is applied to or around the connection part of the connecting pipe. solder material The second type of solder material has a melting temperature higher than that of the first type of solder and constitutes the stop means. The second type of solder material melts later when heating the connecting pipe and the accommodating part in the hot forming die, and is harder than the first type of solder material under the temperature action of the hot forming die, thus having a high viscosity or being highly viscous. In this way, the second type of solder material constitutes the solder material stop means for the first type of solder .

[0055] solder The stop means can be realized differently, for example, in the form of a mechanical solder stop barrier, especially solder in the form of a stop ring. The outer annular bead abutting against the accommodating part at the end face can also be closed to seal the opening solder material .

[0056] Two different solder stop means or two different types of solder stop means can also be used in combination. In this way, solder the stop means can be provided in the form of a cross-sectional change at the connection part of the connecting pipe and a cross-sectional change in the accommodating part formed complementarily thereto. Furthermore, solder the stop means is a mechanical solder stop barrier, especially solderA separate ring body made of a stop material, or integrally formed of the same material on a connecting pipe solder can be provided in the form of a stop ring.

[0057] The connecting pipe has a connecting portion, and through this connecting portion, joining is performed within the accommodating portion of the plate body. On the inlet side, the connecting pipe has a connecting portion. The connecting portion is used for connecting a cooling fluid line. Within the connecting portion, the connecting pipe has a circular cross-section. From the circular cross-section of the connecting portion, the connecting pipe transitions to the connecting portion through a transition portion.

[0058] An embodiment for further improving the practical formation contemplates that the connecting pipe has a connecting portion with an abutment. The abutment functions for connecting a connecting line for the cooling fluid. The abutment body is preferably formed in the form of an annular bead within the rear connecting portion. The annular bead is an integral component of the same material as the connecting portion.

[0059] Upstream and / or downstream of the connecting portion, a pipe portion having a cross-section different from that of the connecting portion, for example, a circular or elliptical cross-section without a longitudinal web, can be provided.

[0060] An embodiment advantageous in practice contemplates that the connecting portion of the connecting pipe has two length portions, and both length portions have cross-sections different from each other. The first or front length portion of the connecting portion has a larger cross-sectional area than the second or rear length portion. The front or first length portion has a cross-sectional configuration with a transverse longitudinal web. The first length portion and the second length portion are joined to each other through a transition portion or a joining portion.

[0061] Complementary to the formation of the length portion of the connection portion, an accommodation portion is formed. The accommodation portion also has a length portion on the front plate body side. This length portion has a cross-sectional configuration different from that of the second rear length portion of the main portion connected via the transition portion. The cross-sectional area of the first length portion in front of the accommodation portion is larger than the cross-sectional area of the second length portion behind the accommodation portion.

[0062] The present invention provides an advantageous, rapid, easily assembled and highly process-reliable joint between one or more connecting pipes and a plate body of a heat transfer plate, particularly a cooling plate. High process stability is ensured. The joint is efficient and has the airtightness required for the components.

[0063] The connection portion of the connecting pipe is oriented parallel to the plate element within the joint plane of the plate element. This contributes to reducing the flow resistance by means of parallel cooling fluid inlets or outlets. By adjusting the position of the connecting pipe parallel to the surface plane of the plate element and the plate body, a laminar flow of the cooling fluid without sudden deflection, vortices or turbulence is generated.

[0064] Furthermore, it is advantageous that the formation of the connecting pipe and the accommodation portion according to the present invention realizes a larger joint area of the connecting pipe to the heat transfer plate. Thereby, an improvement in durability as a whole is achieved and voltage peaks are reduced.

[0065] Finally, the heat transfer plate according to the present invention and its manufacture contribute to reducing the scrap rate, because the downstream joining operation is abolished or at least reduced.

[0066] A method for manufacturing a heat transfer plate having a connecting pipe is · providing a connecting pipe having a connection portion with two outward longitudinal webs; · providing a first plate element and a second plate element, the first plate element and the second plate element having an accommodation contour for the connection portion; · lower die and upper a heated forming die provided with a diesolder transferring a first plate element and a second plate element to the attachment mold, wherein a connection portion of the connecting pipe is positioned between the molding portions of the plate elements, and between the connection portion and the plate element solder material is arranged; ·molding solder closing the attachment mold, lower the mold and upper clamping the plate laminate between the molds, wherein a receiving contour within the molding portion of the plate element is finally formed around the connection portion of the connecting pipe, and a receiving portion having a longitudinal groove extending within a region of the joining plane between the plate elements is configured; ·heating the plate laminate; ·applying an internal pressure to an intermediate space between the plate elements of the plate laminate by introducing a working medium into the intermediate space through the connecting pipe, and forming channels in at least one of the plate elements; ·between the plate elements and between the connection portion and the receiving portion solder material is melted, solder and joined by attachment; ·molding solder opening the attachment mold, and removing the cooling plate from the molding solder attachment mold; and comprising.

[0067] The method according to the present invention enables the production of high-quality heat transfer plates with optimized connection of the connecting pipes in a process-technologically improved and efficient manner.

[0068] The heat transfer plate comprises a plurality of connecting pipes, and in particular the plate body comprises a connecting pipe for supplying a cooling fluid and a connecting pipe for discharging the cooling fluid. Preferably, the fixing of all the connecting pipes of the plate body on or within the plate body between the plate elements is carried out according to the present invention.

[0069] formed solder The attachment mold is heatable and is heated to the mold temperature required for attachment to manufacture the heat transfer plate. solder is heated.

[0070] The plate laminate is composed of at least two plate elements made of a metallic material, in particular a light metal material. Between the plate elements, solder material is applied.

[0071] The connection contour is dish-shaped or channel-shaped and is configured such that a connecting pipe can be positioned or can be positioned between the receiving contours at its connection part.

[0072] Within the scope of the method according to the invention, preferably and effectively, solder material plate elements provided with solder material are used, solder is applied to at least one of the plate elements in the form of a plated solder material layer. As a result, at least one plate element is

[0073] Both plate elements constitute the plate laminate. When the plate laminate is constructed, the connecting pipe is positioned between the plate elements at its connection part. For this purpose, the connection part is arranged between the forming part of the plate element and the connection contour preformed there.

[0074] The plate laminate is inserted into a hot forming die, and the hot forming die is closed. The plate laminate can be constructed outside the hot forming die and introduced into the hot forming die. The plate laminate can also be constructed for the first time within the hot forming die.

[0075] Forming solder attachment dies comprise a lower die and an upper die. These dies are moved relative to each other during the closing movement of the forming solder attachment die, and in particular, the upper die is lowered onto the lower die. During the closing movement, the plate laminate is received and clamped between the lower die and the upper die. In this case, the plate laminate is in surface contact between the lower die and the upper die and is heated within the forming solder attachment die. The forming solder attachment die is for the forming process and solderIt is heated to a mold temperature at which both joining processes by brazing are carried out. In particular, the mold temperature is 540°C to 670°C. Particularly preferably, the mold temperature is, particularly preferably, 550°C to 640°C.

[0076] Forming solder When the brazing mold is closed, the forming part of the plate element is finally formed around the connecting part of the connecting pipe, and a receiving part having a longitudinal groove extending in the joining plane between the plate elements is formed. The longitudinal web of the connecting part extends in the longitudinal direction of the connecting pipe. In the longitudinal groove, along the longitudinal sides of the connecting pipe respectively, the longitudinal web of the connecting part extends into the longitudinal groove of the receiving part.

[0077] The intermediate space between the plate elements of the plate stack is subjected to the action of internal pressure. The intermediate space is the region between adjacent plate elements, and it is not necessary that there is a gap between the plate elements in the region of the intermediate space. The action of the internal pressure on the intermediate space is carried out by introducing an acting medium, particularly nitrogen, into the intermediate space. Here, the channel is for forming solder It is formed by forming at least one plate element region in the channel cavity in one or both contact surfaces of the brazing mold by internal pressure. The supply of the acting medium is carried out through one of the connecting pipes of the plate stack.

[0078] The acting medium for forming channels or a channel structure in the plate body is introduced through one of the connecting parts or connecting pipes.

[0079] Between the plate elements and between the plate elements and the connecting pipe solder material Is for forming solder It is melted for the mold temperature of the brazing mold. The plate elements and the plate elements and the connecting pipe in the region of the receiving part solder Are joined by brazing.

[0080] Forming solder The brazing mold is for forming solderAfter the end of the attaching process, the lower mold and the upper mold are moved relative to each other and separated. The joined high-temperature plate body or heat transfer plate is formed solder After the release of the attaching mold, this formed solder can be taken out from the attaching mold. Before taking out, the heat transfer plate can be held and cooled in the attaching mold. The cooling is preferably solder performed until it is below the melting temperature of solder material .

[0081] The plate element, especially its joint surface, solder material is provided with. Before the configuration of the plate laminate and the positioning of the connecting pipe, the connecting part of the connecting pipe is of the first type solder material is provided with. Further, the connecting pipe solder can be provided with stop means. solder The stop means can also be, for example, of the second type with a melting temperature higher than that of the first type solder material and is positioned on the connecting pipe in the form of solder material .

[0082] To position the connecting pipe, a stopper in the form of an annular bead can be provided on this connecting pipe. In that case, the connecting pipe, together with the annular bead, is positioned on the end face of the plate laminate composed of plate elements and the formed part provided thereon.

[0083] The plate laminate is clamped between a lower mold and an upper mold during the manufacture of the heat transfer plate. During molding and forming by the internal pressure of the channel, the plate laminate is sealed annularly along the adjacent peripheral regions and / or adjacent to the channel cavity. The sealing can be induced or assisted by a pressurizing element provided on the lower mold and / or the upper mold. Such a pressurizing element is optional and can also be provided in the region of the connecting pipe. The pressurizing element can be formed, for example, by a sealing bead by corresponding contour formation within the molding part of the lower mold and / or the upper mold. The sealing element can be provided annularly along the adjacent peripheral regions of the upper mold and / or the lower mold. The sealing element further has a receiving part with the connecting part of the connecting pipe arranged therein, which is clamped and sealed, or is arranged to be clamped and sealed during the expansion process and solder the attachment process. The sealing element can also be provided adjacent to the channel cavity. The sealing element ensures a particularly advantageous molding process, especially when the molding process takes place within the region of the channel cavity and within the connecting contour region of the connecting pipe. In this way, high dimensional accuracy and molding accuracy are ensured.

[0084] The cooling device for a vehicle battery comprises a heat transfer plate according to the invention, which is manufactured according to the method according to the invention. The cooling device includes peripheral components and device components necessary for cooling the vehicle battery, such as a cooling fluid line, a storage and compensation container for the cooling fluid, a supply unit and / or a pump unit and / or a recooler for the cooling fluid.

[0085] The present invention will be explained in more detail below with reference to the drawings.

Brief Description of the Drawings

[0086]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Mode for Carrying Out the Invention

[0087] With reference to FIGS. 1 to 14, the heat transfer plate 1 according to the present invention, its manufacture, and variations of the connection portion of the cooling fluid line to the heat transfer plate 1 are described. In the figures, the same reference numerals are used for the same and functionally identical parts or components, even when repeated descriptions are omitted for simplicity.

[0088] FIGS. 1 to 6 are used to explain the first embodiment of the heat transfer plate 1.

[0089] With reference to FIGS. 6 to 10, the second embodiment of the cooling plate 1 is described. The cross-sectional view in FIG. 6 is applicable to both embodiments of the cooling plate 1. The same applies to the plate body 2 of the cooling plate 1 and the plate elements 3, 4 that make up the plate body 2.

[0090] Figures 11 to 13 show variations of the connection part of the cooling fluid line.

[0091] Figure 14 is used to explain another embodiment of the cooling plate 1 and the configuration of the connection part of the cooling fluid line.

[0092] The heat transfer plate 1 is, in particular, a cooling plate for battery cooling, especially for a vehicle battery of an automobile.

[0093] The heat transfer plate 1 includes a plate body 2 composed of two plate elements 3 and 4. The plate element 3 is a channel plate having a channel structure composed of at least one channel 5 (see, in particular, FIGS. 1, 5, and 11). The plate element 4 is a completely or substantially flat base plate (see FIG. 2).

[0094] Both plate elements 3 and 4 are positioned so as to overlap flatly to form a plate laminate. The adjacent surfaces of the plate elements 3 and 4 are completely or partially solder material provided with. In particular, a solder in the form of a plated solder material layer is pre-applied to one of the plate elements 3 and 4.

[0095] The adjacent surfaces of the plate elements 3 and 4 are joined to each other completely or regionally. A connecting pipe 6 for the cooling fluid is connected to the plate body 2. The connecting pipe 6 is used to supply or discharge the cooling fluid. Usually, the connecting pipe 6 is provided to supply the cooling fluid, while the discharge of the cooling fluid is performed through another connecting pipe 6.

[0096] The connecting pipe 6 includes a connecting portion 7 joined within a receiving portion 8 of the plate body 2 formed between the plate elements 3 and 4.

[0097] The connecting portion 7 has an outer contour that is elliptical in cross-section.

[0098] The connection portion 7 of the connecting pipe 6 has, in cross-section, a main axis H and a secondary axis N perpendicular thereto. The main axis H coincides with the central transverse axis and represents the maximum dimension of the connection portion 7. The main axis H extends within the joining plane FE of the plate elements 3, 4. The secondary axis N is the minimum dimension in the radially outward direction of the connection portion 7.

[0099] The connection portion 7 has two outwardly directed longitudinal webs 9. The longitudinal webs 9 are opposed to each other on the main axis H of the connecting pipe 6. The longitudinal webs 9 are integral components of the same material of the connection portion 7 and are oriented from the inside of the connecting pipe 6 outward.

[0100] The connection portion 7 of the connecting pipe 6 is located within the receiving portion 8 of the plate body 2 and is joined to the receiving body. The receiving portion 8 has a longitudinal groove 10 extending within the region of the joining plane FE between the plate elements 3, 4. The longitudinal webs 9 of the connection portion 7 extend in the longitudinal direction L of the receiving portion 8 within the longitudinal groove 10.

[0101] The longitudinal web 9 and the longitudinal groove 10 are formed complementary to each other. This means that the contour of the longitudinal groove 10 and the contour of the longitudinal web 9 complement each other while forming a joining gap 11. The longitudinal web and the longitudinal groove cooperate in a dovetail manner.

[0102] The longitudinal web 9 has a web wall 12 configured with a triangular cross-section, extending in a concave curve and ending with a rounded tip 13 (see particularly FIG. 6).

[0103] The longitudinal groove 10 is configured in a funnel shape in cross-section having a concave groove side wall 14 and a wedge-shaped groove bottom 15. Also in this regard, reference should be made particularly to the figure of FIG. 6.

[0104] The information on convex and concave relates to the center point M of the connecting pipe 6 respectively.

[0105] The connecting portion 7 includes an upper wall portion 16 that extends in a convexly curved manner and a lower wall portion 17 that extends in a convexly curved manner. On both sides respectively, longitudinal webs 9 are connected to the wall portions 16, 17. The wall portions 16, 17 transition to the web walls 12 of the longitudinal webs 9.

[0106] The accommodating portion 8 includes accommodating wall portions 18, 19 that extend in a convexly curved manner, and these accommodating wall portions transition to the groove side walls 14 respectively.

[0107] The connecting portion 7 is, within the accommodating portion 8, materially joined by solder material 20. For this reason, solder material is disposed around the connecting portion 7 of the connecting pipe 6. FIG. 3 shows solder material the connecting pipe 6 to which 20 is not applied, and FIG. 4 shows solder material the connecting pipe 6 to which 20 is applied. When the plate elements 3, 4 and the connecting portion 7 are joined by solder molding, solder material 20 is melted, and the joining gap 11 is wetted and filled entirely with solder material 20, and the components are materially joined.

[0108] The cross-sectional contour of the connecting portion 7 can be described as lemon-shaped, and the cross-sectional information is related to the longitudinal section passing through the lemon.

[0109] The outer contour of the connecting portion 7 and the inner contour of the accommodating portion 8 are formed complementarily to each other while forming the joining gap 11.

[0110] The embodiment of the cooling plate 1 as illustrated by FIGS. 6 to 10 differs in terms of the formation of the connecting pipe 6. In the case of the connecting pipe 6 as recognized in FIGS. 7 to 10, a stopper is provided. The stopper is formed in the form of an annular bead 21. The annular bead 21 is formed from the wall of the connecting pipe 6 by upsetting and bulging processes. For this reason, the connecting pipe 6 is narrowed in a constricted region 22 where the annular bead 21 is folded back outward. In the direction of the opening 23 on the plate body side of the connecting pipe 6, a connecting portion 7 is connected to the tubular bead 21. The connecting portion 7 is configured as described above and is particularly illustrated in FIG. 6.

[0111] The free end portion of the connecting pipe 6 protruding with respect to the plate body 2 is formed as a connecting portion 24 and is used to connect a cooling fluid line that can be fixed to the connecting portion 24.

[0112] In the case of the embodiment of the connecting pipe 6 as recognized in FIG. 11, an abutment body formed in the form of an annular bead 25 is provided on the connecting portion 24. The annular bead 25 is formed from the wall of the connecting portion 24. A cooling fluid line, particularly a cooling fluid hose, can be mounted on the connecting section 24 and the abutment body in the form of the annular bead 25 integrated therewith, and can be fixed by appropriate fixing means, such as a spring clamp.

[0113] The connecting portion 24 of the connecting pipe 6 has a circular cross-section. In the case of the embodiment of the connecting pipe 6 as shown in FIGS. 3 and 4, the circular cross-section of the connecting portion 24 continuously transitions to the connecting portion 7 and its cross-sectional configuration via a transition portion 26.

[0114] For the material joining of the connecting portion 7 within the receiving portion 8, solder a sleeve or solder a strip in the form of solder material 20 is applied to the connecting portion 7. The connecting pipe 6 is positioned within the receiving portion 7 of the plate body 2 by the connecting portion 7 and is joined to the receiving portion by molding solder attachment.

[0115] To manufacture a cooling plate 1 having at least one connecting pipe 6, a connecting pipe 6 is provided, and a connecting portion 7 having two outward longitudinal webs 9 and wall portions 16, 17 that are arched and extend is formed on this connecting pipe. Further, first and second plate elements 3, 4 are provided. Both plate elements 3, 4 are flat. At least one of the plate elements 3, 4 solder material is provided with. Each plate element 3, 4 is provided with a protruding molding portion 27. On these molding portions 27, one receiving contour for the connecting portion 7 of the connecting pipe 6 is formed respectively. From both plate elements 3, 4, a plate laminate is formed, and the connecting portion 7 of the connecting pipe 6 is arranged between the molding portion 27 and the receiving contour provided therein. On the connecting portion 7, solder material 20 is applied.

[0116] The plate elements 3, 4 are transferred to a heated molding solder attaching mold. For this reason, outside the molding solder attaching mold, a plate laminate composed of both plate elements with the connecting pipe 6 incorporated therebetween can be formed. The plate laminate can also be formed within the molding solder attaching mold.

[0117] The plate laminate or the plate elements 3, 4 and the connecting pipe 6 with the connecting portion 7 positioned are inserted into a heated molding solder attaching mold. The connecting portion 7 of the connecting pipe 6 is arranged within the receiving contour that complements to form a receiving portion 8 between the plate elements 3, 4. The molding solder attaching mold includes a lower mold and an upper mold. By closing the molding solder attaching mold, the plate laminate is clamped and heated between the upper mold and the lower mold. The plate laminate is in surface contact with the lower mold at its lower side and in surface contact with the upper mold at its upper side.

[0118] When the molding solder attaching mold is closed, the molding portion 27 is finally formed in the region of the receiving contour of the plate elements 3, 4 and is formed toward the outer contour of the connecting portion 7. Here, a joining gap 11 is formed, and into this joining gap,solder material 20 is pushed in. The formed molded part 27 complements to form a receiving part 8 having a longitudinal groove 10 extending in the region of the joining plane FE between the plate elements 3, 4.

[0119] Molding solder When the attachment mold is closed, the plate laminate clamped between the lower mold and the upper mold is heated. The intermediate space between the plate elements 3, 4 is subjected to the action of internal pressure. This is done by introducing a working medium, usually nitrogen, into the intermediate space between the plate elements 3, 4. Thereby, the channel 5 is formed by molding with internal pressure. During channel forming, the plate element region of the upper plate element 3 constituting the channel plate is molded to enter the channel cavity in the upper mold. The channel portions of the channel 5 loop into each other and communicate between the connecting pipe 6 shown here and another connecting pipe not shown.

[0120] Molding solder During molding by internal pressure in the attachment mold, the plate laminate can be sealed by one or more pressurizing elements along the adjacent peripheral regions and / or adjacent to the channel cavity, particularly in the region of the receiving parts of the plate elements 3, 4. The pressurizing elements can be provided in the upper mold and / or the lower mold as sealing strips, and are intended for this purpose, and it is determined to seal the plate laminate or both plate elements 3, 4 annularly along the outer edge region and adjacent to the receiving part 8 accommodating the channel cavity and the connecting part 7 of the connecting pipe 6. The pressurizing elements can be realized, for example, in the form of beaded objects.

[0121] Applied between the plate elements 3, 4 solder material and applied between the receiving part 8 and the connecting part 7 solder material 20 melts or is molten when the plate elements 3, 4 are heated. Material joining is performed between the joining partners. A channel structure having the channel 5 is formed, solder After the attachment process is completed, molding solder The attachment mold is opened, and the cooling plate 1 is molded solderIt is taken out from the attaching mold.

[0122] The cooling plate 1 is for molding solder After the attaching mold is opened and before taking out, it can be held and cooled in the attaching mold. For this reason, the channel plate 1 can be removed from the lower mold by the manipulator element when or after the attaching mold is opened, so the contact between the lower mold and the still hot channel plate is released. The upper mold is opened and similarly no longer in contact with the cooling plate. After the holding time or cooling time, the cooling plate 1 is then solder held and cooled in the attaching mold. For this reason, the channel plate 1 can be removed from the lower mold by the manipulator element when or after the attaching mold is opened, so the contact between the lower mold and the still hot channel plate is released. The upper mold is opened and similarly no longer in contact with the cooling plate. After the holding time or cooling time, the cooling plate 1 is then solder taken out from the attaching mold. solder It is taken out from the attaching mold.

[0123] solder To improve the attaching process, especially solder material for wetting or solder material outflow of solder stop means 28 can be integrated into the arrangement parts of the connecting pipe 6 and the accommodating part 8. solder The stop means 28 can be constituted by an annular bead 21 that abuts against the opening 29 of the accommodating part 8 at the end face.

[0124] Especially, solder the stop means 28 is constituted by a layer, ring or sleeve made of a sealing metal material 30. Such a formation is shown in the diagrams of FIGS. 12 and 13. solder The stop means 28 is solder material formed from a sealing metal 30 having a melting temperature higher than that of the first type of solder 20. solder material The stop means 28 is

[0125] In the case of the embodiment illustrated in FIG. 13, solder the stop means 28 is solder material arranged in the region of the opening 29 between the annular bead 21 and

[0126] The sealing metal 30 is of the first typesolder material a second type having a melting temperature higher than 20 solder material may also be. Based on the high melting temperature of the first type solder material of, this first type solder material is viscous under the action of temperature in the molding solder die and becomes plastically deformable, so that the molding between the connecting pipe 6, the connecting portion 7 and the accommodating portion 8 solder By attachment, a complete sealing action is achieved within a predetermined region of the joint.

[0127] FIG. 14 shows a view of a part of the plate body 2, the plate element 3, and the accommodating portion 8 formed in the molding portion 27. The connecting portion 7 of the connecting pipe 8 is positioned within the accommodating portion.

[0128] The connecting portion 7 has a cross-section configured as described with reference to FIG. 6.

[0129] The connecting portion 7 tapers to the length portion 32 via the transition portion 31. Within the length portion 32, the connecting piece 6 is circular.

[0130] The accommodating portion also comprises two length portions 33, 34 having different cross-sections. The length portion 33 on the plate body side is configured as described with reference to FIG. 6. Via the transition portion 35, the length portion 33 located inside on the plate body side transitions to the length portion 34 on the opening side that conforms to the circular contour of the length portion 32.

[0131] To the connecting portion 7, solder material 20 is applied. The cross-sectional changes at the connecting portion 7 and the accommodating portion solder constitute the stop means 28. The transition from the connecting portion 7 to the length portion 32 and accommodation The cross-sectional change at the transition from the length portion 33 to the length portion 34 of the portion 8 forms solder The stop means 28 restricts the soldering flow during the generation of the joint between the connecting pipe 6 or the connecting portion 7 and the accommodating portion 8 solder at the time. Note that this application relates to the invention described in the claims, but may also include the following as other aspects. 1. A heat transfer plate comprising a plate body (2) composed of at least two plate elements (3, 4) and a connecting pipe (6) for a cooling fluid, the connecting pipe (6) having a connecting portion (7), and the connecting portion being joined within a receiving portion (8) of the plate body (2) formed between the plate elements (3, 4). The heat transfer plate is characterized in that the connecting portion (7) has two outwardly directed longitudinal webs (9), the receiving portion (8) has a longitudinal groove (10) extending within the region of the joining plane (FE) between the plate elements (3, 4), and the longitudinal webs (9) extend within the longitudinal groove (10). 2. The heat transfer plate according to 1 above, characterized in that the longitudinal web (9) has a cross-section configured as a triangle having a concave web wall (12) and a rounded tip (13). 3. The heat transfer plate according to 1 or 2 above, characterized in that the longitudinal groove (10) has a cross-section configured as a funnel shape having a concave groove side surface (14) and a wedge-shaped groove bottom (15). 4. The heat transfer plate according to any one of 1 to 3 above, characterized in that the longitudinal web (9) and the longitudinal groove (10) are formed complementarily to each other. 5. The heat transfer plate according to any one of 1 to 4 above, characterized in that the connecting portion (7) has two convexly curved wall portions (16, 17), and these wall portions extend between the longitudinal webs (9). 6. The heat transfer plate according to any one of 1 to 5 above, characterized in that the receiving portion (8) has convexly curved receiving wall portions (18, 19), and the groove side surface (14) is connected to these receiving wall portions. 7. The connecting portion (7) comprises wall portions extending parallel to the joining plane (FE), and these wall portions each terminate with a wall portion that curves and extends and transitions to a longitudinal web via the curved wall portion. The heat transfer plate according to any one of the above 1 to 6, characterized in that. 8. The connecting pipe (6) is provided with a stopper, particularly in the form of an annular bead (21), that abuts against the receiving portion (8) at the end face. The heat transfer plate according to any one of the above 1 to 7, characterized in that. 9. Between the connecting pipe (6), particularly the connecting portion (7) of the connecting pipe (6), and the receiving portion (8), solder Stop means (28) are provided. The heat transfer plate according to any one of the above 1 to 8, characterized in that. 10. The connecting pipe (6) is provided with a connecting portion (24) having an abutment body, particularly in the form of an annular bead (25). The heat transfer plate according to any one of the above 1 to 9, characterized in that. 11. In a method for manufacturing a heat transfer plate having a connecting pipe (6), · Providing a connecting pipe (6) with a connecting portion (7) having two outward longitudinal webs (9); · Providing a first plate element (3) and a second plate element (4), the first plate element (3) and the second plate element (4) having a receiving contour for the connecting portion (7); · lower Die and upper A heated forming solder Transferring the first plate element (3) and the second plate element (4) to a clamping die having a die, the connecting portion (7) of the connecting pipe (6) being positioned between the forming portions (27) of the plate elements (3, 4), and between the connecting portion (7) and the plate elements (3, 4) solder material (20) is arranged; · Closing the forming solder Clamping die, lower Die and upperA step of clamping the plate laminate between molds, wherein the receiving contour within the forming portion (27) of the plate elements (3, 4) is finally formed around the connecting portion (7) of the connecting pipe (6), and a receiving portion (8) is configured which has a longitudinal groove (10) extending within the region of the joining plane (FE) between the plate elements (3, 4); · A step of heating the plate laminate; · A step of applying an internal pressure to the intermediate space between the plate elements (3, 4) of the plate laminate by introducing a working medium into the intermediate space through the connecting pipe (6), and forming channels in at least one of the plate elements (3, 4); · Between the plate elements (3, 4) and between the connecting portion (7) and the receiving portion (8) solder material (20) is melted, solder · And joining by brazing; · Forming solder · The brazing mold is opened, and the cooling plate (1) is taken out from the brazing mold solder · And having, a method characterized by. 12. The cooling plate (1) is held and cooled in the brazing mold after the brazing mold is opened and before taking out, the method according to item 11 above, characterized in that. solder solder

Explanation of Signs

[0132] 1 Heat transfer plate 2 Plate body 3 Plate element 4 Plate element 5 Channel 6 Connecting pipe 7 Connecting portion 8 Receiving portion 9 Longitudinal web 10 Longitudinal groove 11 Joining gap 12 Web wall 13 Tip 14 Groove side wall 15 Groove bottom 16 Wall portion 17 Wall part 18 Receiving wall part 19 Receiving wall part 20 First type of solder material 21 Annular bead 22 Narrow region 23 Opening 24 Connecting part 25 Annular bead 26 Transition region 27 Forming part 28 solder Stop means 29 Opening 30 Second type of solder material 31 Transition part 32 Length part 33 Length part 34 Length part 35 Transition part H Main axis N Sub - axis FE Joint plane M Center point L Vertical direction

Claims

1. A heat transfer plate comprising a plate body (2) composed of at least two plate elements (3, 4) and a connecting pipe (6) for a cooling fluid, the connecting pipe (6) having a connecting portion (7), and the connecting portion being joined within a receiving portion (8) of the plate body (2) formed between the plate elements (3, 4). The heat transfer plate is characterized in that the connecting portion (7) has two outwardly directed longitudinal webs (9), the receiving portion (8) has a longitudinal groove (10) extending within the region of the joining plane (FE) between the plate elements (3, 4), and the longitudinal webs (9) extend within the longitudinal groove (10).

2. The heat transfer plate according to claim 1, characterized in that the longitudinal webs (9) and the longitudinal groove (10) are formed complementary to each other.

3. The heat transfer plate according to claim 2, characterized in that the longitudinal web (9) has a cross-section configured as a triangle having a concave web wall (12) and a rounded tip (13).

4. The heat transfer plate according to claim 2, characterized in that the longitudinal groove (10) has a cross-section configured as a funnel shape having a concave groove side surface (14) and a wedge-shaped groove bottom (15).

5. The heat transfer plate according to claim 3, characterized in that the connecting portion (7) has two convexly curved wall portions (16, 17) extending between the longitudinal webs (9).

6. The heat transfer plate according to claim 4, characterized in that the receiving portion (8) has convexly curved receiving wall portions (18, 19), and the groove side surface (14) is connected to these receiving wall portions.

7. The heat transfer plate according to claim 5, characterized in that the connecting portion (7) has wall portions extending parallel to the joining plane (FE), and these wall portions each terminate at a terminal side and transition to the longitudinal webs via convexly curved wall portions.

8. The heat transfer plate according to claim 1, characterized in that the connecting pipe (6) has a stopper (21) abutting against the receiving portion (8) at an end face.

9. The heat transfer plate according to claim 1, characterized in that brazing stop means (28) are provided between the connecting pipe (6) and the receiving portion (8).

10. The heat transfer plate according to claim 1, characterized in that the connecting pipe (6) has a connecting portion (24) having an abutment body (25).

11. In a method for manufacturing a heat transfer plate having a connecting pipe (6), - providing a connecting pipe (6) comprising a connecting portion (7) having two outwardly directed longitudinal webs (9); - providing a first plate element (3) and a second plate element (4), the first plate element (3) and the second plate element (4) having a receiving contour for the connecting portion (7); - transferring the first plate element (3) and the second plate element (4) to a heated forming brazing die having a lower die and an upper die, the connecting portion (7) of the connecting pipe (6) being positioned between the forming portions (27) of the plate elements (3, 4) and a brazing material (20) being disposed between the connecting portion (7) and the plate elements (3, 4); - closing the forming brazing die and clamping the plate laminate between the lower die and the upper die, the receiving contour within the forming portions (27) of the plate elements (3, 4) being finally formed around the connecting portion (7) of the connecting pipe (6) and a receiving portion (8) being formed having longitudinal grooves (10) extending in the region of the joining plane (FE) between the plate elements (3, 4); - heating the plate laminate; - applying an internal pressure to the intermediate space between the plate elements (3, 4) of the plate laminate by introducing a working medium into the intermediate space via the connecting pipe (6) to form channels in at least one of the plate elements (3, 4); - melting the brazing material (20) between the plate elements (3, 4) and between the connecting portion (7) and the receiving portion (8) and joining by brazing; - opening the forming brazing die and removing the cooling plate (1) from the forming brazing die characterized by comprising the above steps.

12. The method according to claim 11, characterized in that the cooling plate (1) is held and cooled in the forming brazing die after the forming brazing die is opened and before removal.

Citation Information

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