Evaporation device

Abstract

To provide a vapor deposition apparatus for fixing the incident angle of a vapor deposition material to a substrate without enlarging the apparatus.SOLUTION: A vapor deposition apparatus includes: an evaporation source for evaporating a vapor deposition material; a substrate holder separated from the evaporation source and holding at least one substrate; at least one collimator positioned between the evaporation source and the substrate holder; and a film thickness control body holder positioned between the substrate holder and the collimator holder and holding at least one film thickness control body. One collimator is arranged corresponding to one substrate held on the substrate holder, and one film thickness control body corresponds to the one substrate and the one collimator.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a vapor deposition apparatus having a collimator for making the incident angle of a vapor deposition material on a substrate constant.

Background Art

[0002] Conventionally, a vapor deposition apparatus for depositing a vapor deposition material on a substrate to form a film has been known. In the vapor deposition apparatus, a film can be formed uniformly on the substrate by keeping the incident angle of the vapor deposition material on the substrate constant. In order to keep this incident angle constant, the distance between the substrate and the vapor deposition source that houses the vapor deposition material has been set to a predetermined distance.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the size of the substrate has gradually been increasing. For this reason, there has been a problem that the vapor deposition apparatus has been growing larger and larger. If the vapor deposition apparatus becomes larger, the area of the apparatus increases, and there arises a problem that it can be installed only in a limited space. In addition, when the apparatus becomes larger, there is also a problem that it is more difficult to adjust the film formation conditions than in a small-sized apparatus. Furthermore, when the apparatus becomes larger, there is also a problem that the price of the apparatus increases.

[0005] The present invention has been made in view of the above points. Its object is to provide a vapor deposition apparatus for making the incident angle of a vapor deposition material on a substrate constant without increasing the size of the apparatus.

Means for Solving the Problems

[0006] The characteristics of the vapor deposition apparatus according to the present invention are An evaporation source for evaporating a vapor deposition material, a substrate on which the vapor deposition material evaporated by the evaporation source is deposited, a substrate holder that holds a plurality of substrates at a distance from the evaporation source, a collimator that selectively passes the vapor deposition material so as to give directivity to the vapor deposition material evaporated by the evaporation source, a collimator holder that holds a plurality of collimators at a position between the evaporation source and the substrate holder, a drive motor that rotationally drives the substrate holder, and the collimator holder has a plurality of collimator openings to which a plurality of the collimators are attached, the substrate has a disc shape, and the collimator openings have a circular shape, each of the plurality of collimators corresponds to each of the plurality of substrates such that the vapor deposition material evaporated by the evaporation source reaches the substrate with a constant incident angle to the substrate, and each of the substrates is positioned concentrically with each of the collimator openings, the collimator holder and the substrate holder are integrally formed by a fixing member, the substrate holder and the collimator holder are rotatable, by the drive motor, the collimator holder, Among the vapor deposition materials directed toward the substrate, only the vapor deposition materials whose traveling direction is within a predetermined degree with respect to the longitudinal direction of the collimator are allowed to pass through is rotated integrally with the substrate holder.

Advantages of the Invention

[0007] According to the present invention, the incident angle of the vapor deposition material on the substrate can be made constant without increasing the size of the apparatus. As a result, a uniform film can be formed on the substrate.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Mode for Carrying Out the Invention

[0009] <<<<Outline of the Present Embodiment>>>>

[0010] <<First Aspect>> According to the first aspect, an evaporation source for evaporating a vapor deposition material, a substrate holder that is separated from the evaporation source and holds at least one substrate, body and at least one collimator located between the evaporation source and the substrate holder, body wherein one collimator is arranged corresponding to one substrate held by the substrate holder, and at least one collimator is provided. body A vapor deposition apparatus is provided.

[0011] <<Second Aspect>> The second aspect is, in the first aspect, further comprising a collimator holder having a collimator opening in which the at least one collimator is arranged, the substrate has a disk shape, the collimator opening has a disk shape, and the one substrate is positioned concentrically with the one collimator opening.

[0012] <<Third Aspect>> The third aspect is, in the first aspect or the second aspect, a straight line connecting the center of the one substrate and the center of the one collimator reaches the evaporation source.

[0013] <<Fourth Aspect>> The fourth aspect is, in the second aspect or the third aspect, the substrate holder is rotatable, the collimator holder is integrated with the substrate holder and is rotatable.

[0014] <<Fifth Aspect>> The fifth aspect is, in the first aspect to the fourth aspect, the maximum incident angle at which the evaporated material released from the evaporation source spreads at the collimator opening is larger than the maximum incident angle at which the evaporated material passing through the collimator spreads on the substrate.

[0015] <<Sixth Aspect>> The sixth aspect is, in the second aspect to the fifth aspect, a thickness adjustment body holder that is located between the substrate holder body and the collimator holder and holds at least one thickness adjustment body, body wherein one thickness adjustment body holder is further provided that is associated with the one substrate and the one collimator. body is further provided.

[0016] <<Seventh Aspect>> The seventh aspect is, in the sixth aspect, the thickness adjustment body is formed integrally with the collimator.

[0017] <<Eighth Aspect>> The eighth aspect is, in the first aspect to the seventh aspect, the substrate holder is capable of simultaneous rotation and revolution.

[0018] <<Ninth Aspect>> The ninth aspect is, in the second aspect to the eighth aspect, the collimator holder is integrated with the substrate holder and is capable of self-rotation and revolution.

[0019] <<<<<Details of This Embodiment>>>>> Hereinafter, embodiments will be described with reference to the drawings. FIG. 1 is an overall view of a vapor deposition apparatus according to one embodiment of the present invention. FIG. 2 is a view of the opening of the substrate holder and the opening of the collimator of the vapor deposition apparatus of FIG. 1. FIG. 3 is a view for explaining the operation of the collimator of FIG. 1. FIG. 4 is a view of the solid angle of the substrate holder and the solid angle of the collimator of the vapor deposition apparatus of FIG. 1. FIG. 5 is a schematic view showing the relationship between the distance between adjacent collimators and the size of the substrate.

[0020] <<<<Vapor Deposition Apparatus 10>>>> The vapor deposition apparatus 10 includes an evaporation source 100, a substrate holder 200, a collimator holder 300, and a film thickness adjustment unit holder 400. The evaporation source 100, the substrate holder 200, the collimator holder 300, and the film thickness adjustment unit holder 400 are accommodated in a vacuum chamber 20.

[0021] <<<Vacuum Chamber 20>>> In the vacuum chamber 20, the evaporation source 100, the substrate holder 200, the collimator holder 300, and the film thickness adjustment unit holder 400 are arranged in order from bottom to top along the height direction. The vacuum chamber 20 has a height longer than the distance between the evaporation source 100 and the substrate holder 200.

[0022] The vacuum chamber 20 has an exhaust hole. A vacuum pump (not shown) is connected to the vacuum chamber 20. The inside of the vacuum chamber 20 can be set to a desired degree of vacuum.

[0023] The vacuum chamber 20 has a heater. The substrate SB installed on the substrate holder 200 can be heated. The vacuum chamber 20 has various sensors. The degree of vacuum and temperature can be controlled by the sensors.

[0024] <<<Evaporation Source 100>>> The evaporation source 100 is arranged at the lower part of the vacuum chamber 20.

[0025] The evaporation source 100 includes a crucible (not shown), a filament (not shown), and a bias power supply (not shown). The filament and the bias power supply are disposed near the crucible. The crucible stores a deposition material.

[0026] The electron beam is emitted by the filament and the bias power supply. The emitted electron beam irradiates and heats the deposition material in the crucible. The heated deposition material is emitted as an evaporating substance. The evaporating substance spreads from the evaporation source 100 into the vacuum chamber 20. The evaporating substance directed toward the substrate SB adheres to the substrate SB.

[0027] <<Deposition Material>> Examples of the deposition material include Si, Ti, Ni, Al, Cu, Au, Ag, Pt, Mo, Ru, Sn, and their compounds. The deposition material is not limited to these and can be any desired material. The evaporation conditions of the evaporation source 100 can be determined according to the type of the deposition material.

[0028] <<<Substrate Holder 200>>> The substrate holder 200 holds a plurality of substrates SB. The substrate holder 200 can perform a deposition process on a plurality of substrates SB simultaneously. The substrate holder 200 is disposed at the upper part of the chamber. The substrate holder 200 is disposed at a distance of about 1200 mm from the evaporation source 100. The distance from the evaporation source 100 can be appropriately determined according to the size of the substrate.

[0029] The substrate holder 200 has a curved shape. The substrate holder 200 generally has a shape like a bowl, a pot, or a spherical shell. The substrate holder 200 has a shape that is a part of a spherical surface (spherical shell). The substrate holder 200 has a circular shape in plan view. The substrate holder 200 has a shape with a substantially constant radius of curvature centered on the evaporation source 100.

[0030] The size of the substrate holder 200 can be appropriately determined according to the size and number of the substrates SB to be deposited simultaneously.

[0031] The material and characteristics of the substrate holder 200 may be any as long as they are difficult to emit constituent substances in a vacuum state or a heated state and have heat resistance. For example, there are Ti, stainless steel, Al, etc.

[0032] <Substrate SB> The substrate SB is an object to be subjected to a vapor deposition process to which a vapor deposition substance is attached. For example, the substrate SB has a thin disc shape. The vapor deposition substance is attached to the circular surface of the substrate SB. The substrate SB is not limited to a thin disc shape and may have other shapes.

[0033] The substrate SB has a desired size. For example, the diameter can be 2 inches, 4 inches, 8 inches, etc.

[0034] The substrate SB is made of a material corresponding to the type of evaporation substance. For example, the substrate SB is composed of LT, LN, Si, SiO2, etc.

[0035] <<Opening 210 for substrate>> The substrate holder 200 has an opening 210 for substrate. The substrate holder 200 has a plurality of openings 210 for substrate. The number of openings 210 for substrate can be a desired number. The plurality of openings 210 for substrate are formed concentrically and along the circumference (see FIG. 2).

[0036] The opening 210 for substrate opens toward the evaporation source 100. The opening 210 for substrate has a shape corresponding to the substrate SB. The opening 210 for substrate has, for example, a circular shape. The opening 210 for substrate has a size corresponding to the substrate SB. For example, it has a size slightly smaller than the substrate SB.

[0037] <Holding step portion (not shown)> The opening 210 for substrate has a holding step portion. The holding step portion supports the end portion (peripheral portion) of the substrate SB. By the support by the holding step portion, the substrate SB can be disposed in the opening 210 for substrate. The substrate SB is disposed so as to cover the opening 210 for substrate. The substrate SB faces the evaporation source 100 through the opening 210 for substrate.

[0038] <<Drive motor 220>> The substrate holder 200 has a drive motor 220. A rotating shaft (not shown) is attached to the central portion of the substrate holder 200, and the driving force of the drive motor 220 is transmitted to the rotating shaft. The drive motor 220 rotates the substrate holder 200 together with the collimator holder 300. The rotation direction, rotation speed, etc. of the drive motor 220 are controlled by a control unit (not shown).

[0039] Furthermore, the substrate holder 200 has a drive mechanism that transmits the driving force of the drive motor 220 to the substrate SB to rotate and revolve the substrate SB.

[0040] <<Fixing member 230>> The substrate holder 200 has a fixing member 230. The fixing member 230 fixes the collimator holder 300 at a certain position with respect to the substrate holder 200. The collimator holder 300 can rotate together with the substrate holder 200.

[0041] <<<Collimator holder 300>>> The collimator holder 300 holds a plurality of collimators 320. The collimator holder 300 is disposed between the evaporation source 100 and the substrate holder 200. The distance between the collimator holder 300 and the substrate holder 200, and the distance between the collimator holder 300 and the evaporation source 100 can be appropriately determined.

[0042] The collimator holder 300 has a curved shape. The collimator holder 300 has a shape approximately like a bowl, a pot, or a spherical shell. The collimator holder 300 has a shape that is a part of a spherical surface (spherical shell). The collimator holder 300 has a circular shape in plan view. The collimator holder 300 has a shape with a substantially constant radius of curvature centered on the evaporation source 100.

[0043] The collimator holder 300 is smaller than the substrate holder 200. The diameter of the collimator holder 300 is shorter than the diameter of the substrate holder 200.

[0044] The material and characteristics of the collimator holder 300 may be any as long as they are heat-resistant and less likely to emit constituent substances in a vacuum or heated state. For example, there are Ti, SUS, AL, etc.

[0045] The collimator holder 300 may be integrally formed with the substrate holder 200 or separately formed. When the collimator holder 300 is separately formed, the collimator holder 300 may operate in conjunction with the operation of the substrate holder 200 or independently of the substrate holder 200.

[0046] <<Collimator opening 310>> The collimator holder 300 has a collimator opening 310. The collimator opening 310 fixes the collimator 320 in a certain position. The collimator opening 310 has a shape corresponding to the contour of the collimator 320.

[0047] The attachment of the collimator 320 to the collimator opening 310 may be such that it does not loosen or come off in a vacuum or heated state, such as screwing. It is preferable that the collimator 320 is detachable with respect to the collimator opening 310. By making it detachable, maintenance such as replacement of the collimator 320 can be facilitated.

[0048] The collimator holder 300 is arranged such that one collimator opening 310 corresponds to one substrate opening 210 of the substrate holder 200. The one substrate opening 210 of the substrate holder 200 and the one collimator opening 310 share a common radius centered on the evaporation source 100.

[0049] <<Collimator 320>> The collimator 320 is attached to the collimator opening 310. The collimator 320 adjusts the traveling direction of the vapor deposition material. The collimator 320 functions as a filter for direction adjustment. Specifically, the moving direction of the vapor deposition material passing through one collimator 320 is adjusted so as to be directed toward one substrate SB (one substrate opening 210) corresponding to one collimator 320.

[0050] The collimator 320 has, for example, a plurality of cylindrical portions 322. The plurality of cylindrical portions 322 have the same shape. The cylindrical portion 322 has an elongated shape. The plurality of cylindrical portions 322 are arranged parallel to each other in the longitudinal direction (axial direction). Adjacent cylindrical portions 322 are arranged in close contact with each other. The entire plurality of cylindrical portions 322 cause the collimator 320 to have a thin disk-like shape.

[0051] The cylindrical portion 322 has a first opening and a second opening spaced apart from the first opening along the longitudinal direction. The first opening opens toward the evaporation source 100. The second opening opens toward one substrate opening 210 of the substrate holder 200.

[0052] As shown in FIG. 3, the collimator 320 allows only the deposition material whose traveling direction is within plus or minus several degrees with respect to the longitudinal direction of the cylindrical portion 322 among the deposition materials heading toward the substrate SB to pass through. The deposition material whose traveling direction is greater than plus or minus several degrees is made to adhere to the collimator 320. By doing so, directivity can be imparted to the deposition material heading toward the substrate SB. In other words, the collimator 320 selectively allows the deposition material to pass through.

[0053] By using the collimator 320, even when the substrate SB has a shape having small holes, grooves, etc., the deposition material can reach the bottom of the small holes and grooves, and a sufficient deposition film thickness can be obtained.

[0054] The material and material quality of the collimator 320 may be any as long as they are difficult to emit constituent substances in a vacuum state or a heated state and have heat resistance. Also, the material and material quality of the collimator 320 may be any as long as they can selectively allow the deposition material to pass through. For example, there are Al, SUS, Ti, etc.

[0055] FIG. 4 is a diagram regarding the maximum incident angle of the substrate holder of the vapor deposition apparatus and the maximum incident angle of the collimator.

[0056] The maximum incident angle at which the evaporated material released from the evaporation source 100 spreads at the collimator opening 310 is larger than the maximum incident angle at which the evaporated material passing through the collimator 320 spreads on the substrate SB.

[0057] The vapor deposition material passing through the collimator 320 can be sufficiently spread and adhered to the substrate SB, and the vapor deposition material can be adhered with the film thickness approaching uniformity.

[0058] <<Relationship between the interval of the collimator 320 and the size of the substrate SB>> FIG. 5 is a schematic diagram showing the relationship between the interval of adjacent collimators 320 and the size of the substrate SB. The shortest interval CL between adjacent collimators 320 is preferably the same length as the size SL of the substrate SB (for example, the diameter of the substrate SB) or longer than the size SL of the substrate SB.

[0059] It is possible to prevent the vapor deposition material from adhering to the substrate SB unnecessarily, and the vapor deposition material can be adhered with the film thickness approaching uniformity.

[0060] <<<Film thickness adjusting body holder 400>>> FIG. 6 is an overall view of a vapor deposition apparatus according to another embodiment of the present invention. The film thickness adjusting body holder 400 can be provided. The film thickness adjusting body holder 400 is disposed between the collimator holder 300 and the substrate holder 200.

[0061] <<Film thickness adjusting body 410>> The film thickness adjusting body holder 400 has a film thickness adjusting body 410. The film thickness adjusting body holder 400 may be movable or fixed.

[0062] The collimator 320 and the film thickness adjusting body 410 are fixed. The collimator 320 and the film thickness adjusting body 410 may be integrated with the planet.

[0063] The collimator 320 can control the film thickness distribution, while the film thickness adjusting body 410 can control the film formation rate distribution.

[0064] <<<<Scope of Embodiment>>>> As described above, this embodiment has been described. However, the description and drawings forming a part of this disclosure should not be understood as limiting. Various embodiments and the like not described herein are included.

Description of Reference Numerals

[0065] 10 Evaporation apparatus 100 Evaporation source 200 Substrate holder 210 Substrate opening 300 Collimator holder 310 Collimator opening 320 Collimator 400 Film thickness adjusting body holder 410 Film thickness adjusting body SB Substrate

Claims

1. An evaporation source for evaporating a deposition material, a substrate on which the deposition material evaporated by the evaporation source is deposited, a substrate holder that holds a plurality of the substrates at a distance from the evaporation source, a collimator that selectively passes the deposition material so as to give directivity to the deposition material evaporated by the evaporation source, a collimator holder that holds a plurality of the collimators at a position between the evaporation source and the substrate holder, a drive motor that rotationally drives the substrate holder, and the collimator holder has a plurality of collimator openings to which a plurality of the collimators are attached, the substrate has a disc shape, and the collimator openings have a circular shape, each of the plurality of collimators corresponds to each of the plurality of substrates such that the deposition material evaporated by the evaporation source reaches the substrate with a constant incident angle to the substrate, and each of the substrates is positioned concentrically with each of the collimator openings, the collimator holder and the substrate holder are integrally configured by a fixing member, the substrate holder and the collimator holder are rotatable, a vapor deposition apparatus in which the drive motor rotates the collimator holder integrally with the substrate holder so that only the deposition material whose traveling direction is within a predetermined degree with respect to the longitudinal direction of the collimator among the deposition materials heading for the substrate passes through.

2. An evaporation source for evaporating a deposition material, a substrate on which the deposition material evaporated by the evaporation source is deposited, a substrate holder that holds a plurality of the substrates at a distance from the evaporation source, a collimator that selectively passes the deposition material so as to give directivity to the deposition material evaporated by the evaporation source, a collimator holder that holds a plurality of the collimators at a position between the evaporation source and the substrate holder, a drive motor that rotationally drives the substrate holder, and the collimator holder has a plurality of collimator openings to which a plurality of the collimators are attached, the substrate has a disc shape, and the collimator openings have a circular shape, Each of the plurality of collimators corresponds to each of the plurality of substrates such that the deposition material evaporated by the evaporation source reaches the substrate with a constant incident angle to the substrate, and a straight line connecting the center of each substrate and the center of each collimator reaches the evaporation source, and each substrate is positioned concentrically with the collimator opening. The collimator holder and the substrate holder are integrally formed by a fixing member. The substrate holder and the collimator holder are rotatable. A vapor deposition apparatus in which the collimator holder is rotated integrally with the substrate holder by the drive motor so that only the deposition material whose traveling direction is within a predetermined degree with respect to the longitudinal direction of the collimator among the deposition materials directed from the evaporation source toward the substrate passes through.

3. The vapor deposition apparatus according to claim 1 or 2, wherein a maximum incident angle at which the evaporation substance released from the evaporation source spreads at the collimator opening is larger than a maximum incident angle at which the evaporation substance that has passed through the collimator spreads at the substrate.

4. The vapor deposition apparatus according to claim 1 or 2, wherein the predetermined degree is ± several degrees.

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