Cutting blade and method for manufacturing the cutting blade

Abstract

To provide a cutting blade and a cutting blade manufacturing method capable of reducing a width dimensional difference in a vertical direction of a cut groove in cutting of a workpiece.SOLUTION: A cutting blade 100 to rotate around an axis O includes: a blade body 10 having a metal bond phase 20 formed in a disk shape centered at the axis O and diamond super-abrasive grains 30 dispersed in the metal bond phase 20; and a cutting edge 11A formed on an outer peripheral surface 11 of the blade body 10. On the side surfaces on both sides in the axial O direction, an abrasive grain flat surface 30S formed on the diamond super-abrasive grains 30 is exposed flush with the metal bond phase 20.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a cutting blade and a method for manufacturing the cutting blade, which are used for cutting a substrate such as a semiconductor material into individual chips.

Background Art

[0002] As is well known, when cutting a substrate such as a semiconductor material into individual chips, for example, a cutting blade (metal blade) in which abrasive grains are dispersed and arranged in a metal bond phase mainly composed of Cu-Sn is widely used (see, for example, Patent Document 1).

[0003] In addition to the cutting blade provided with a metal bond phase, a cutting blade (resin blade) in which abrasive grains are dispersed and arranged in a bond phase made of a resin material (resin) is also widely used (see, for example, Patent Document 2).

[0004] Such a cutting blade for cutting a substrate such as a semiconductor material into individual chips is configured to cut a workpiece with high precision by forming the thickness (axial dimension) of the blade body to be thin.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, when cutting a workpiece with the cutting blades described in Patent Documents 1 and 2, the width dimension of the cutting groove formed in the workpiece is likely to vary depending on the vertical position (depth from the workpiece surface).

[0007] In particular, for example, in the case of an electronic material component that is singulated by mounting a large number of elements on a lead frame all at once, molding them together, and then cutting them, or in the case of an electronic material component having a substrate in which the inner peripheral surface of a through hole formed in a glass epoxy resin substrate is plated with Ni, Au, Cu, etc., like an optical transmission module conforming to the IrDA (Infrared Data Association) standard (hereinafter referred to as IrDA), the difference in width dimensions becomes even larger depending on the vertical position of the cutting groove.

[0008] On the other hand, in the future, in order to cut the workpiece with higher precision, it is essential not only to reduce the thickness of the cutting blade but also to perform cutting so that the dimensional difference due to the vertical position of the cutting groove is reduced. Therefore, there is a demand for a cutting technique capable of reducing the difference in width dimensions due to the vertical position of the cutting groove when cutting a workpiece.

[0009] This invention has been made in consideration of such circumstances, and an object thereof is to provide a cutting blade and a method for manufacturing a cutting blade capable of reducing the difference in width dimensions due to the vertical position of the cutting groove when cutting a workpiece.

Means for Solving the Problems

[0010] In order to solve the above problems, this invention proposes the following means. (1) A first aspect of this invention is a cutting blade that rotates around an axis to cut a workpiece, comprising a blade body formed in a disc shape centered on the axis, in which abrasive grains are dispersed and arranged in a bond phase, and a cutting edge formed on an outer peripheral portion of the blade body, wherein on at least one side surface of the blade body in the axial direction, an abrasive grain flat surface formed on the abrasive grains is flush with the bond phase and exposed.

[0011] According to the cutting blade of the present invention, on at least one side surface in the axial direction, the abrasive grain flat surface formed on the abrasive grains is flush with the bond phase and does not protrude from the surface of the bond phase, so that the chips when cutting the workpiece flow smoothly along the side surface of the cutting groove. Therefore, the cutting resistance when cutting the workpiece can be reduced, and the wear of the side surface of the blade body and the cutting edge can be suppressed. In addition, the shape of the cutting edge when viewed in the direction perpendicular to the axis is likely to be maintained. In other words, when the abrasive grains are flush with the bond phase on both side surfaces, the rectangularity maintaining property is improved. As a result, the change in the width dimension due to the vertical position of the cutting groove of the workpiece can be reduced.

[0012] Here, the abrasive grain flat surface is a flat surface formed by polishing (lapping) the abrasive grains, and the surface roughness (ISO 25178) is less than 1 μm. Note that a part of the abrasive grain flat surface may be recessed inward from the surface of the bond phase.

[0013] Also, here, the fact that the abrasive grain flat surface is flush with the surface of the bond phase means that the abrasive grains do not protrude from the surface of the bond phase. When the side surface of the blade body is measured by a shape measuring instrument, the protrusion of the abrasive grain flat surface with respect to the surface of the bond phase is less than 1 μm, that is, the surface roughness (ISO 25178) is less than 1 μm.

[0014] Also, the material constituting the bond phase can be arbitrarily set. For example, a powder molded product formed by compacting and sintering metal or metal compound powder, a plated molded product formed by plating metal or metal compound, a resin molded product made of resin material, and a porous vitrified molded product made of glassy material can be used. Also, the type, average grain size, and content of the abrasive grains dispersed and arranged in the bond phase can be arbitrarily set.

[0015] (2) The cutting blade according to (1) above may have the abrasive grain flat surface exposed flush with the bond phase on both side surfaces in the axial direction of the blade body.

[0016] According to the cutting blade of the present invention, since the abrasive grain flat surface is exposed flush with the bond phase on both side surfaces in the axial direction, compared with the case where the abrasive grain flat surface is exposed flush with the bond phase on one side surface, the change in the width dimension due to the vertical position of the cutting groove can be reduced.

[0017] (3) The cutting blade according to (1) or (2) above may be set such that the content ratio of the abrasive grains is higher on the outer side than on the inner side in the axial direction of the blade body.

[0018] According to the cutting blade of the present invention, since the content ratio of the abrasive grains is set higher on the outer side than on the inner side in the axial direction of the blade body, the abrasion resistance on the side surface of the cutting blade can be improved. As a result, abrasion in the vicinity of the side surface (outer side in the width direction) in the axial direction of the cutting edge can be suppressed, and change in the shape of the corner portion of the cutting edge can be suppressed (rectangular shape maintainability can be improved).

[0019] (4) The cutting blade according to any one of (1) to (3) above may have the abrasive grains formed of diamond super abrasive grains.

[0020] According to the cutting blade of the present invention, since the abrasive grains are formed of diamond super abrasive grains, the abrasion resistance is improved. As a result, the rectangular shape maintainability of the cutting edge can be improved.

[0021] (5) A second aspect of this invention is a cutting blade manufacturing method for manufacturing the cutting blade according to any one of the above (1) to (4), comprising a blade blank forming step of forming a cutting blade blank, and a step of lapping the surface of the cutting blade blank on which the abrasive grain flat surface is to be formed, to form the abrasive grain flat surface on the abrasive grains and expose the abrasive grain flat surface flush with the bond phase, characterized by comprising these steps.

[0022] According to the cutting blade manufacturing method of this invention, with respect to the side surface where the abrasive grain flat surface is to be formed and exposed on the formed cutting blade blank, lapping is performed in the abrasive grain flat surface forming step to polish the abrasive grains protruding from the bond phase to form the abrasive grain flat surface, and the abrasive grains are lapped until the abrasive grain flat surface becomes flush with the surface of the bond phase. As a result, the abrasive grain flat surface can be efficiently formed on the abrasive grains, and the abrasive grain flat surface can be exposed flush with the surface of the bond phase.

[0023] (6) In the cutting blade manufacturing method for manufacturing the cutting blade according to the above (5), it is preferable that the abrasive grains used for lapping in the abrasive grain flat surface forming step contain boron carbide.

[0024] According to the cutting blade manufacturing method of this invention, since the abrasive grains used for lapping in the abrasive grain flat surface forming step contain boron carbide, for abrasive grains made of diamond superabrasive grains as well, the abrasive grains can be lapped to efficiently form the abrasive grain flat surface until the abrasive grain flat surface is exposed flush with the bond phase.

[0025] Here, boron carbide is so-called boron carbide (B4C). As the composition of boron carbide (B4C), for example, it includes combinations of carbon-boron bonds and regular icosahedral boron B 12 combinations, for example, combinations of B 12 C2 and B 12 C3, and may also include octahedral boron B6. In addition, the fact that the abrasive grains used for lapping contain boron carbide means that other abrasive grains than boron carbide may be contained, and it means that cBN (cubic boron nitride) or SiC (silicon carbide) may be contained together with boron carbide.

[0026] According to the cutting blade according to the present invention, it is possible to reduce the dimensional difference in width due to the vertical position of the cutting groove when cutting a workpiece. According to the method for manufacturing a cutting blade according to the present invention, it is possible to efficiently manufacture a cutting blade capable of reducing the dimensional difference in width due to the vertical position of the cutting groove when cutting a workpiece.

Brief Description of the Drawings

[0027]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0028] <First Embodiment> Hereinafter, with reference to FIGS. 1 to 3, a cutting blade according to the first embodiment of the present invention will be described. FIG. 1 is a view seen along the axis for explaining the schematic configuration of a cutting blade according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG. 1 for explaining the schematic configuration of the cutting blade. Further, FIG. 3 is a view for explaining the schematic configuration of the cutting blade, and is a conceptual diagram obtained by enlarging the portion indicated by III in FIG. 2.

[0029] In FIGS. 1 to 3, reference numeral 100 denotes a cutting blade, reference numeral 10 denotes a blade body, reference numeral 11 denotes an outer peripheral surface (outer peripheral portion), reference numeral 11A denotes a cutting edge, reference numeral 20 denotes a metal bond phase, reference numeral 30 denotes diamond super abrasive grains (abrasive grains), reference numeral 30S denotes an abrasive grain flat surface, reference numeral 40 denotes a filler, and reference numeral 40S denotes a filler flat surface.

[0030] As shown in FIGS. 1 and 2, the cutting blade 100 according to the first embodiment includes, for example, a blade body 10 rotated around an axis O, and a cutting edge 11A formed on an outer peripheral surface (outer peripheral portion) 11 of the blade body 10. Then, a material to be cut (not shown) is cut by the cutting edge 11A.

[0031] The configuration of the cutting blade 100 can be arbitrarily set. In this embodiment, the cutting blade 100 is, for example, a metal blade including a metal bond phase (bond phase) 20. As shown in FIGS. 1 to 3, the blade body 10 is, for example, a sintered molded product obtained by compacting a powder of a metal or a metal compound formed in a disc shape, and includes a metal bond phase 20, diamond super abrasive grains (abrasive grains) 30 dispersed and arranged in the metal bond phase 20, and a filler 40 dispersed and arranged in the metal bond phase 20.

[0032] Further, the cutting blade 100 is used, for example, for precision cutting (cutting) of a work material such as a brittle material (hard and brittle material) such as glass, ceramics, or quartz used for a semiconductor device (electronic material component).

[0033] Further, although not particularly shown, the cutting blade 100 has its blade body 10 attached to the main shaft of the cutting device via a flange, and while rotating around the axis (central axis) O of the blade body 10, by moving it in a direction perpendicular to the axis O (for example, the vertical direction), the cutting blade 11A on the outer peripheral surface 11 that protrudes radially outward from the flange in the blade body 10 cuts the material to be cut (not shown).

[0034] Here, in this specification, the direction along the axis O direction of the blade body 10 is referred to as the width direction, the direction perpendicular to the axis O is referred to as the radial direction, and the direction of orbiting around the axis O may be referred to as the circumferential direction. Also, in FIGS. 1 to 3, for the sake of explanation, the thickness of the blade body 10 is shown thicker than the actual.

[0035] Also, at the central portion (axis O) in the radial direction of the blade body 10, a circular mounting hole 13 that penetrates the blade body 10 in the width direction with the axis O as the center is formed. That is, the blade body 10 is specifically in the shape of an annular plate. Here, the “blade body 10 having a circular plate shape” as used in this specification also includes the meaning of being in the shape of an annular plate. Also, the numerical range indicated by “~” in the specification includes the lower limit value and the upper limit value (that is, it indicates “above” and “below”).

[0036] Regarding the dimensions of the cutting blade 100, they can be arbitrarily set. However, in this embodiment, the cutting blade 100 is set to an outer diameter of φ56 mm, an inner diameter (diameter of the mounting hole) of φ40 mm, and a thickness t of 50 to 100 μm, for example.

[0037] The metal or metal compound forming the metal bond phase 20 can be arbitrarily set. However, in this embodiment, for example, it is a metal bond phase made of a powder molded product formed by compacting and sintering metal powders of copper (Cu) and tin (Sn). Note that instead of copper (Cu) and tin (Sn), for example, well-known metal material powders such as nickel powder, cobalt powder, and iron powder may be used. In addition, as shown in FIGS. 1 and 2, the metal bond phase 20 has a circular mounting hole 13 centered on the axis O formed on the inner peripheral side (central portion), and is formed in an annular plate shape (disk shape).

[0038] The mounting hole 13 is formed centered on the axis O of the metal bond phase 20. In addition, the mounting hole 13 penetrates the metal bond phase 20 in the thickness direction. That is, the mounting hole 13 opens to the side surfaces 12A, 12B (12) on both sides in the direction of the axis O of the metal bond phase 20.

[0039] The dimension in the thickness direction of the metal bond phase 20 (hereinafter referred to as thickness) can be arbitrarily set, but for example, it is set to 0.15 mm or more and 0.6 mm or less. The cutting edge 11A is disposed on the outer peripheral surface (outer peripheral portion) 11 of the metal bond phase 20 and is formed in an annular shape. Further, the cutting edge 11A is formed, for example, with a blade width having the same dimension as the thickness of the metal bond phase 20.

[0040] In this embodiment, for example, diamond super abrasive grains (abrasive grains) 30 are used as the abrasive grains. The abrasive grains can be arbitrarily set, but for example, it is preferably formed of either diamond or cBN. Note that, as the abrasive grains, a hard material other than diamond and cBN (however, a material harder than the metal bond phase 20) may be used.

[0041] The diamond super abrasive grains 30 are set, for example, to an average particle size of 3 to 10 μm (for example, 5 μm) and a content rate of 12.5 to 31.25 vol% (concentration 50 to 125). In addition, the diamond super abrasive grains 30 protrude from the outer peripheral surface 11 of the metal bond phase 20 by about 2 μm, for example. Although not particularly shown, the outer surface (surface) of the diamond super abrasive grains (abrasive grains) 30 may be coated with a metal material such as Ti, for example.

[0042] Further, in this embodiment, among the diamond super abrasive grains 30, in the blade body 10, on the portion exposed from the metal bond phase 20, an abrasive grain flat surface 30S flattened by polishing is formed. In this embodiment, as shown in FIG. 3, the abrasive grain flat surface 30S is formed on both side surfaces 12A and 12B (12) on both sides in the axial direction O of the blade body 10. Further, the abrasive grain flat surface 30S is formed flush with the surface 20S of the metal bond phase 20.

[0043] Here, the abrasive grain flat surface 30S is a flat surface formed by polishing (lapping) the diamond super abrasive grains 30. Further, the abrasive grain flat surface 30S means that the surface roughness (ISO 25178) is less than 1 μm. Note that a part of the abrasive grain flat surface 30S may be recessed inward from the surface 20S of the metal bond phase 20.

[0044] Further, the fact that the abrasive grain flat surface 30S is flush with the surface 20S of the metal bond phase 20 means that the abrasive grains do not protrude from the surface of the bond phase. When the side surface of the blade body is measured with a shape measuring instrument, the protrusion of the abrasive grain flat surface 30S with respect to the surface 20S of the metal bond phase 20 is, for example, less than 1 μm in surface roughness (ISO 25178).

[0045] Here, the above-mentioned "average particle size" represents the average value of a large number of diamond super abrasive grains (abrasive grains) 30. For example, diamond super abrasive grains (abrasive grains) 30 having a certain particle size range are measured by a model MT3300EXII-SDC manufactured by Microtrac Co., Ltd. (registered trademark), and the average particle size is calculated by particle size indication based on the mesh size (see JIS B 4130:1998), etc.

[0046] Further, the "concentration" is an index representing the amount of abrasive grains in the tool. In the case of a cutting blade, when the volume of the abrasive grains occupies 25 vol% with respect to the volume of the entire blade body, the concentration is defined as 100. (Therefore, when the entire blade body is composed of abrasive grains, the concentration is 400.)

[0047] The filler 40 may disperse fillers (not shown) such as molybdenum disulfide (MoS2), hollow fine particles such as silica balloons and glass balloons, and silicon carbide (SiC) and tungsten carbide (WC) for the purpose of improving various functions such as the workability and rigidity of the blade body 10, for example. Whether to disperse and arrange the filler 40 in the metal bond phase 20, and the type, content rate, etc. of the filler in the case of dispersing and arranging can be arbitrarily set.

[0048] For example, a flat filler flat surface 40S is formed on the portion of the filler 40 exposed from the metal bond phase 20. This filler flat surface 40S is formed on the side surfaces 12A and 12B (12) on both sides in the direction of the axis O of the blade body 10, for example, and the filler flat surface 40S is formed flush with the surface 20S of the metal bond phase 20.

[0049] Next, with reference to FIGS. 4 and 5, the outline of the method for manufacturing a cutting blade according to the first embodiment will be described. FIG. 4 is a flowchart showing the outline of the method for manufacturing a cutting blade according to the first embodiment, and FIG. 5 is a conceptual diagram for explaining the outline of the abrasive grain flat surface forming step in the method for manufacturing a cutting blade.

[0050] The manufacturing process of the cutting blade according to the first embodiment includes, as shown in FIG. 4, for example, a metal blade base plate forming process (blade base plate forming process) (S101) and an abrasive grain flat surface forming process (S102). And through the metal blade base plate forming process (S101) and the abrasive grain flat surface forming process (S102), the cutting blade 100 is completed.

[0051] [1] Metal blade base plate forming process (S101) In the metal blade base plate forming process, a metal blade base plate (cutting blade base plate) is formed. (1) First, the metal blade blank (cutting blade blank) is formed by, for example, cold pressing a mixed powder of materials to form the metal blade blank. The mixed powder of materials is prepared by mixing powders of copper (Cu) and tin (Sn), which are raw materials of the metal bond phase 20, diamond super abrasive grains (abrasive grains) 30, and a filler 40 in a predetermined ratio and mixing them until they become uniform. For example, a ball mill is used for mixing the material powders. Instead of the ball mill, a known applicable mixing device may be used. (2) Next, this mixed powder is filled into a mold (not shown) to form a compacted powder product. (3) Next, the formed compacted powder product is put into a sintering furnace and held at 800 °C for about 1 hour in an inert gas atmosphere such as nitrogen or argon to form a metal blade blank. (4) Next, by grinding the inner peripheral portion and the outer peripheral portion of the metal blade blank to predetermined diameter dimensions respectively, the metal blade blank (cutting blade blank) is formed (manufactured). Note that the grinding of the inner peripheral portion and the outer peripheral portion may be performed, for example, after the abrasive grain flat surface forming step (S102).

[0052] 〔2〕Abrasive Grain Flat Surface Forming Step (S102) In the abrasive grain flat surface forming step, the side surfaces 12A, 12B (12) of the object to make the abrasive grain flat surface 30S of the metal blade blank (cutting blade blank) flush with the surface 20S of the metal bond phase 20 are lapped. It is possible to use a known lapping machine for lapping.

[0053] When performing lapping, as shown in FIG. 5, the metal blade blank (cutting blade blank) 100A is placed on a lapping machine 500, and the metal blade blank 100A is clamped from above and below by lapping platens 510, 520. Note that when clamping the metal blade blank (cutting blade blank) 100A by the lapping platens 510, 520, the metal blade blank 100 is accommodated in a holder (not shown) in which a hole for accommodating the metal blade blank 100 is formed.

[0054] Then, as shown in FIG. 5, while supplying the abrasive 500S and the lapping liquid 500L, the lapping plates 510 and 520 are rotated in opposite directions around the axis O1 to lap the metal blade blank 100A. Note that whether the lapping plates 510 and 520 are rotated in opposite directions can be arbitrarily set. For example, they may be rotated in the same direction for lapping.

[0055] The abrasive grains used for lapping can be arbitrarily set as long as they can polish the metal bond phase 20, the diamond superabrasive grains 30, and the filler 40. For example, it is preferable that they contain boron carbide.

[0056] Here, boron carbide is so-called boron carbide (B4C). As for the composition of boron carbide (B4C), for example, it is a combination of carbon-boron bonds and icosahedral boron B 12 C, for example, B 12 C2 and B 12 C3 combinations are included.

[0057] Also, the average particle size of boron carbide is preferably, for example, #1000 to #3000. Note that the abrasive grains 500S may contain abrasive grains other than boron carbide, or may contain cBN (cubic boron nitride) or SiC (silicon carbide) instead of or together with boron carbide.

[0058] By performing lapping, the diamond superabrasive grains (abrasive grains) 30 and the filler 40 protruding from the metal bond phase 20 of the cutting blade blank 100A are polished. Then, as the lapping progresses, abrasive grain flat surfaces 30S and filler flat surfaces 40S are formed on the diamond superabrasive grains (abrasive grains) 30 and the filler 40.

[0059] Also, when the formation of the abrasive grain flat surface 30S and the filler flat surface 40S progresses, on the side surface 12 of the metal blade base plate (cutting blade base plate) 100A, the diamond super abrasive grains (abrasive grains) 30, the filler 40, and the metal bond phase 20 are co-processed. As a result, as shown in FIG. 3, the abrasive grain flat surface 30S and the filler flat surface 40S are flush with the surface 20S of the metal bond phase 20. It is preferable to perform polishing using a buff or the like after lapping the cutting blade base plate 100A. As a result, the cutting blade 100 is completed.

[0060] According to the cutting blade 100 according to the first embodiment, on both side surfaces 12A and 12B (12) on both sides in the axial direction O of the blade body 10, the abrasive grain flat surface 30S of the diamond super abrasive grains 30 is flush with the surface 20S of the metal bond phase 20 and does not protrude from the surface 20S of the metal bond phase 20. Therefore, the chips when cutting the workpiece smoothly flow along the side surface of the cutting groove (not shown). Therefore, the cutting resistance when cutting the workpiece is reduced, and the wear of the side surfaces 12A and 12B (12) of the blade body 10 and the cutting edge 11A can be suppressed. Also, the shape of the cutting edge 11A when viewed in the direction orthogonal to the axis O is easily maintained. In other words, the rectangular maintainability of the cutting edge 11A is improved. As a result, the change in the width dimension due to the vertical position of the cutting groove of the workpiece can be reduced.

[0061] Also, according to the cutting blade manufacturing method according to the first embodiment, by lapping the metal blade base plate (cutting blade base plate) 100A, the diamond super abrasive grains 30 and the filler 40 protruding from the metal bond phase 20 are polished to form the abrasive grain flat surface 30S and the filler flat surface 40S respectively, and the diamond super abrasive grains 30 and the filler 40 are lapped until the abrasive grain flat surface 30S and the filler flat surface 40S are flush with the surface 20S of the metal bond phase 20, so that the abrasive grain flat surface 30S and the filler flat surface 40S can be efficiently formed. In addition, the abrasive grain flat surface 30S and the filler flat surface 40S can be exposed flush with the surface 20S of the metal bond phase 20 phase.

[0062] According to the method for manufacturing a cutting blade according to the first embodiment, when lapping in the abrasive grain flat surface forming step, since abrasive grains containing boron carbide are used, the diamond super abrasive grains 30 and the filler 40 are efficiently polished, and the abrasive grain flat surface 30S and the filler flat surface 40S can be efficiently formed.

[0063] <Second Embodiment> Hereinafter, with reference to FIG. 6, the cutting blade according to the second embodiment of the present invention will be described. FIG. 6 is an enlarged conceptual diagram for explaining the schematic configuration of a cutting blade according to an embodiment of the present invention. In FIG. 6, reference numeral 200 indicates a cutting blade, and reference numeral 10A indicates a blade body.

[0064] The cutting blade 200 according to the second embodiment includes, as shown in FIG. 6, for example, a blade body 10A rotated around an axis O, and a cutting edge 11A formed on an outer peripheral surface (outer peripheral portion) 11 of the blade body 10A. And the cutting blade 11A cuts a material to be cut (not shown).

[0065] In addition, as shown in FIG. 6, the blade body 10A is, for example, a sintered product obtained by compacting a powder of a metal or a metal compound formed in a disk shape, and includes a metal bond phase 20, diamond super abrasive grains (abrasive grains) 30 dispersed and arranged in the metal bond phase 20, and a filler 40 dispersed and arranged in the metal bond phase 20.

[0066] The inner side (inner side in the width direction) of the diamond super abrasive grains (abrasive grains) 30 in the axial direction O of the blade body 10A is set to, for example, an average particle size of 3 to 10 μm (for example, 5 μm) and a content rate of 12.5 to 31.25 vol% (concentration 50 to 125). Further, for the diamond super abrasive grains (abrasive grains) 30, the outer side (the surface side in the width direction) in the axial direction O of the blade body 10A is set, for example, to an average particle size of 3 to 10 μm (for example, 5 μm) and a content rate of 17.5 to 35 vol% (the concentration is 75 to 150), and is set higher than the inner side in the axial direction O.

[0067] The cutting blade 200 is different from the cutting blade 100 according to the first embodiment in that, as described above, the content rate of the diamond super abrasive grains 30 on the outer side (the outer side (surface side) in the width direction) in the axial direction O of the blade body 10A is set higher than the inner side (the inner side in the width direction) in the axial direction O. Other aspects are the same as those of the first embodiment, so the same reference numerals are used and the description is omitted.

[0068] When manufacturing the cutting blade 200, in the metal blade blank forming step (S101), when filling the mixed powder of the material powder into a die (not shown) for cold pressing, the distribution of the content rate of the diamond super abrasive grains (abrasive grains) 30 is adjusted.

[0069] Specifically, a first mixed powder with a relatively high content rate of the diamond super abrasive grains (abrasive grains) 30 and a second mixed powder with a relatively low content rate of the diamond super abrasive grains (abrasive grains) 30 compared to the first mixed powder are created. Then, after filling the first mixed powder into a die (not shown) for cold pressing, the second mixed powder is filled, and then, after filling the first mixed powder, cold pressing is performed. Other aspects are the same as those of the cutting blade manufacturing method according to the first embodiment, so the description is omitted.

[0070] According to the cutting blade 200 according to the second embodiment, since the content rate of the diamond super abrasive grains 30 in the blade body 10A is set such that the outer side in the axial direction O is higher than the inner side, the wear resistance of the side surfaces 12A, 12B (12) of the cutting blade 200 can be improved. As a result, wear in the vicinity of the side surfaces 12A and 12B (12) in the axial direction O of the cutting edge 11A (near the surface in the width direction) is suppressed, and change in the shape of the corner portion of the cutting edge 11A can be suppressed (rectangular maintainability is improved).

[0071] Regarding the technical matters described in the above embodiments, various modifications can be made without departing from the gist of the invention.

[0072] For example, in the above embodiment, the case where the abrasive grain flat surface 30S and the filler flat surface 40S are flush with the surface 20S of the metal bond phase 20 on both side surfaces 12A and 12B (12) in the axial direction O of the cutting blade 100 has been described. However, a configuration may be adopted in which the abrasive grain flat surface 30S and the filler flat surface 40S are flush with the surface 20S of the metal bond phase 20 on one side surface 12 in the axial direction O.

[0073] Further, in the above embodiment, the case where the cutting blades 100 and 200 include the metal bond phase 20 formed by compacting and sintering material powders of copper (Cu) and tin (Sn) has been described. However, instead of copper (Cu) and tin (Sn), for example, a metal bond phase formed by compacting and sintering material powders of well-known metals or metal compounds such as nickel powder, cobalt powder, and iron powder may be used.

[0074] Further, in the above embodiment, the case where the cutting blades 100 and 200 include the metal bond phase 20 has been described. However, instead of the metal bond phase 20, for example, it may be applied to a cutting blade provided with an electroformed blade. In this case, in the blade master forming step, for example, masking is applied to a mirror-finished SUS alloy (stainless steel alloy) in accordance with the shapes of the blade bodies 10 and 10A. Then, a nickel plating solution in which diamond super abrasive grains 30 are dispersed is stored in a dispersion plating apparatus (not shown), and the SUS alloy is immersed therein. Then, using nickel as the anode, while stirring the nickel plating solution, nickel plating is grown on the SUS base metal by electrolytic plating to form an electroformed blade blank (cutting blade blank) composed of a dispersed nickel plating layer. Note that instead of electrolytic plating, an electroless plating method may be applied to form the dispersed plating layer constituting the electroformed blade. Thereafter, in the abrasive grain flat surface forming step (S102), the electroformed blade blank (cutting blade blank) is lapped.

[0075] Further, instead of the metal bond phase 20, for example, it may be applied to a cutting blade provided with a resin bond phase. The resin material for forming the resin bond phase can be arbitrarily set, but for example, it is preferably formed of a thermosetting resin such as a phenolic resin. Note that instead of the phenolic resin, for example, polyimide or the like may be used. In this case, it is prepared by blending the material powder constituting the resin bond phase, the abrasive grains, and the filler in a predetermined ratio and mixing them until they become uniform. For example, a ball mill is used for mixing the material powder. Note that instead of the ball mill, a well-known applicable mixing device may be used. Next, the prepared mixed powder is filled into a mold (not shown) and cold-pressed in the mold to form a disk-shaped resin blade blank. Next, the resin blade blank is hot-pressed and sintered. The hot pressing of the resin blade blank is preferably performed, for example, at a hot plate temperature of 200 °C, a heating time of 30 minutes, and a pressure of 10 MPa. Here, hot pressing means, for example, applying pressure at a temperature at which the resin material powder can flow. By grinding the inner peripheral portion and the outer peripheral portion of the resin blade blank after hot pressing formed by sintering to predetermined diameter dimensions, a resin blade blank (cutting blade blank) is formed (manufactured). Thereafter, in the above-mentioned abrasive grain flat surface forming step (S102), the resin blade blank (cutting blade blank) is lapped. Incidentally, the inner diameter processing and outer diameter processing of the resin blade blank may be performed after the abrasive grain flat surface forming step.

[0076] Further, instead of the metal bond phase 20, for example, it may be applied to a cutting blade provided with a vitrified bond phase. In this case, a material powder is formed by mixing a material powder forming the vitrified bond phase and abrasive grains, and this material powder is set in a mold to form a vitrified blade blank. Then, this vitrified blade blank is sintered (for example, placed in a sintering furnace and heated) to form a vitrified blade blank (cutting blade blank) of a porous body having a three-dimensional crosslinked structure. Incidentally, when dispersing super abrasive grains and a filler in the vitrified bond phase, the filler is mixed during the above-described material mixing. Thereafter, in the abrasive grain flat surface forming step (S102), the vitrified blade blank (cutting blade blank) is lapped.

[0077] Further, in the above embodiment, for example, the case where the cutting blade 100 has a constant abrasive grain content rate and the cutting blade 200 has a higher content rate on the outer side in the axial direction O of the blade body 10A than on the inner side has been described. However, it may also be applied to a cutting blade in which the abrasive grain content rate on the inner side in the axial direction O of the blade body is set higher than on the outer side.

[0078] Further, in the above embodiment, for example, the case where the average particle diameter of the abrasive grains used for the cutting blades 100 and 200 is constant has been described. However, the average particle diameter of the abrasive grains used for the cutting blades 100 and 200 can be arbitrarily set, and abrasive grains having a plurality of average particle diameters may be used according to the position of the blade body.

[0079] In the above embodiment, the case where the diamond superabrasive grains 30 are lapped together with the bond phase 20 to form the grain flat surface 30S of the diamond superabrasive grains 30 has been described. However, the method for forming the grain flat surface 30S on the diamond superabrasive grains 30 is not limited to lapping and can be arbitrarily set. In the above embodiment, the case of wet lapping while supplying the abrasive 500S and the lapping liquid 500L has been described. However, lapping may be performed without using the lapping liquid.

[0080] In the above embodiment, the case where boron carbide (B4C) is used as the abrasive 500S has been described. However, the abrasive 500S may contain abrasive grains other than boron carbide, or may contain cBN (cubic boron nitride) or SiC (silicon carbide) instead of or together with boron carbide.

[0081] In the above embodiment, the case where the cutting blades 100 and 200 have the filler 40 dispersed and arranged in the metal bond phase 20 has been described. However, whether to disperse the filler 40 can be arbitrarily set. Also, when dispersing the filler 40, the composition such as the material and average particle size of the filler 40 can be arbitrarily set.

[0082] Also, the flowchart shown in FIG. 4 is an example and may be appropriately changed (omitted, added), or other arbitrary manufacturing methods may be applied for manufacturing.

Industrial Applicability

[0083] According to the cutting blade and the cutting blade manufacturing method according to the present invention, since the dimensional difference in the vertical direction of the cutting groove when cutting the workpiece can be reduced, it is industrially applicable.

Explanation of Signs

[0084] O axis 10, 10A blade body 11 outer peripheral surface 11A Cutting Edge 12, 12A, 12B Sides 20 Metal Bond Phase (Bond Phase) 30 Diamond Superabrasive Grains (Abrasive Grains) 30S Abrasive Grain Flat Surface 40 Filler 40S Filler Flat Surface 100, 200 Cutting Blades

Claims

1. A cutting blade that rotates around an axis to cut a workpiece, A blade body formed in a disc shape centered on the axis, with abrasive grains dispersed and arranged in a bond phase; A cutting edge formed on the outer peripheral portion of the blade body; Comprising: On at least one side surface of the blade body in the axial direction, an abrasive grain flat surface formed on the abrasive grains is flush with the bond phase and exposed; The cutting blade does not include those in the middle of manufacturing; A cutting blade characterized by the above.

2. The cutting blade according to Claim 1, On both side surfaces of the blade body in the axial direction, the abrasive grain flat surfaces are flush with the bond phase and exposed. A cutting blade characterized by the above.

3. The cutting blade according to Claim 1 or 2, The content rate of the abrasive grains is set such that the outer side, which is the surface side of the blade body in the axial direction of the blade body, is higher than the inner side, which is the inner part of the blade body. A cutting blade characterized by the above.

4. The cutting blade according to any one of Claims 1 to 3, The abrasive grains are formed of diamond superabrasive grains. A cutting blade characterized by the above.

5. A method for manufacturing a cutting blade for manufacturing the cutting blade according to any one of Claims 1 to 4, A blade blank forming step of forming a cutting blade blank; A step of lapping the surface for forming the abrasive grain flat surface on the cutting blade blank to form the abrasive grain flat surface on the abrasive grains and expose the abrasive grain flat surface flush with the bond phase; A method for manufacturing a cutting blade characterized by comprising the above.

6. The method for manufacturing a cutting blade according to Claim 5, The abrasive grains used for lapping in the abrasive grain flat surface forming step contain boron carbide. A method for manufacturing a cutting blade characterized by the above.

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