Method for manufacturing a support member and method for manufacturing a semiconductor device

Abstract

To provide a method for manufacturing a support member that can improve the pick-up performance of the support member.SOLUTION: A method for manufacturing support members includes the processes of preparing a laminated film to which an adhesive film is attached via an adhesive layer to a base film, individualizing the adhesive film into a plurality of support members, and picking up each of the plurality of support members from the base film. In the process of picking up, each of the plurality of support members is picked up while the base film is expanded by an expansion amount of 3 mm to 9 mm.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a support member and a method for manufacturing a semiconductor device.

Background Art

[0002] As one aspect of semiconductor devices, a structure in which another semiconductor chip is stacked on a semiconductor chip disposed on a substrate has attracted attention. For example, Patent Document 1 discloses a configuration in which another semiconductor chip is stacked on a semiconductor chip via a spacer. Further, Patent Document 2 discloses a semiconductor die assembly including a controller die and a memory die supported by a support member on the controller die. Such a structure is also called, for example, a Dolmen structure.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] For example, in the structure of the semiconductor device shown in Patent Document 2, a support member including an expensive silicon chip is used. Further, in order to manufacture this support member, a step of polishing silicon or the like is required before singulating each support member by dicing. Therefore, it has been considered to manufacture an inexpensive support member that does not include a silicon chip from a resin film, for example, an adhesive film such as DAF (Die attach film). However, when the resin film is diced when manufacturing the support member from the resin film without including silicon, the sticky burrs generated by dicing may adhere between the singulated support members, which may inhibit the pickup of the support members.

[0005] Therefore, the present disclosure provides a method for manufacturing a support member capable of improving the pick-up property of the support member, and a method for manufacturing a semiconductor device using the support member manufactured by the manufacturing method.

Means for Solving the Problems

[0006] The present disclosure relates to a method for manufacturing a support member. This manufacturing method includes a step of preparing a laminated film in which an adhesive film is attached to a base film via an adhesive layer, a step of cutting the adhesive film into a plurality of support members, and a step of picking up each of the plurality of support members from the base film. In the picking-up step, each of the plurality of support members is picked up in a state where the base film is expanded with an expansion amount of 3 mm or more and 9 mm or less.

[0007] In the above manufacturing method, when picking up the separated support members, each support member is picked up in a state where the base film is expanded with an expansion amount of 3 mm or more and 9 mm or less. In this case, since the expansion amount is larger than normal, the burrs adhering to the side surfaces of the separated support members are peeled off by the expansion, and the state where adjacent support members are adhered by the burrs can be eliminated. Therefore, according to this manufacturing method, when picking up each of the separated support members, adjacent support members are not connected by burrs, so that the pick-up property of the separated support members can be improved. Here, the "expansion amount" refers to the amount (distance) by which the base film is lifted when the base film is lifted with respect to the fixed end (for example, the attachment end to the ring) to widen the distance between the support members.

[0008] The manufacturing method of the above support member may further include a step of attaching a base film to a ring via an adhesive layer so that the adhesive film is disposed inside a ring for singulation. In this attaching step, the laminated film may be attached to the ring while applying tension to the laminated film so that the elongation rate of the laminated film becomes greater than 100%. In this case, before dicing, a tension is applied such that the laminated film is stretched outward, and the tension is released by dicing. Therefore, even if burrs are formed by dicing between adjacent support members, the burrs are scraped out from the dicing grooves or the like between the support members due to the sudden contraction caused by the release of this tension, so that adjacent support members are not connected by burrs, and the pick-up property of the singulated support members can be further improved. Here, the "elongation rate of the laminated film" refers to a value indicating the elongation rate of the laminated film when attached to the ring with the laminated film before being attached to the ring as a reference (100%).

[0009] In the manufacturing method of the above support member, in the attaching step, the laminated film may be attached to the ring while applying tension to the laminated film so that the elongation rate of the laminated film becomes 101% or less. In this case, since the tension applied to the laminated film is not so high, the elongation force applied to the adhesive film constituting the laminated film is also suppressed low, and when the laminated film is attached to the ring, peeling of the adhesive film from the base film is reduced. In particular, peeling is likely to occur near the outer periphery of the base film (adhesive layer) and the adhesive film, but the above manufacturing method reduces the peeling of the adhesive film from the base film. As a result, voids are less likely to occur between the laminate composed of the base film and the adhesive layer and the adhesive film. By reducing such voids, according to this manufacturing method, it is possible to suppress chip jumping or the like during singulation and manufacture inexpensive support members with a high yield.

[0010] In the method for manufacturing the above-described support member, in the step of picking up, each of the plurality of support members may be picked up in a state where the base film is expanded with an expansion amount of 5 mm or more and 9 mm or less. In this case, since the expansion amount is in a range larger than normal, the burrs adhering to the side surfaces and the like of each of the separated support members are peeled off more strongly, and the state where adjacent support members are adhered by the burrs can be eliminated. Therefore, according to this manufacturing method, when picking up each of the separated support members, the pick-up property of the separated support members can be further improved.

[0011] In the method for manufacturing the above-described support member, in the step of picking up, the base film may be pushed up with a pushing-up amount of 300 μm or more in a pushing-up direction intersecting the expanding direction, and each of the plurality of support members may be picked up. In this case, since a larger distance of the support member from the base film can be taken when picking up, the pick-up property of the separated support members can be further improved.

[0012] In the method for manufacturing the above-described support member, the tensile elastic modulus of the adhesive film may be 8.0 MPa or more. Further, the adhesive film may contain polyimide. In this case, it becomes possible to obtain an inexpensive and highly strong support member.

[0013] In the method for manufacturing the above-described support member, the adhesive film may include a pair of surface layers made of a cured product of a thermosetting resin composition and an intermediate layer disposed between the pair of surface layers. In this case, since the adhesive film has a multilayer structure, even if the adhesive film is formed to be relatively thick, warping of the adhesive film can be suppressed. By suppressing warping, according to this manufacturing method, it is possible to make the thickness of the adhesive film spreading in the planar direction more uniform and to make the thickness of the manufactured support member more uniform. In this embodiment, the intermediate layer may be a polyimide layer or a metal layer. Thereby, a support member excellent in strength and heat resistance can be obtained. Note that the thickness of the intermediate layer may be 50 μm or less. Thereby, even if it has a multilayer structure, the support member can be made thin without making it too thick.

[0014] The present disclosure relates to a method for manufacturing a semiconductor device. This manufacturing method is a method for manufacturing a semiconductor device using a support member manufactured by any of the above-described methods for manufacturing a support member. In this case, it is possible to inexpensively form a semiconductor device using a support member with improved pick-up property and manufactured at low cost.

Advantages of the Invention

[0015] According to the present disclosure, it is possible to provide a method for manufacturing a support member capable of improving the pick-up property of the support member, and a method for manufacturing a semiconductor device using the support member manufactured by the manufacturing method.

Brief Description of the Drawings

[0016]

Figure 1

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Figure 13

Embodiments for Carrying Out the Invention

[0017] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and redundant descriptions are omitted. Also, the positional relationships such as up, down, left, and right are based on the positional relationships shown in the drawings unless otherwise specified. Furthermore, the dimensional ratios in the drawings are not limited to the ratios shown. In this specification, “(meth)acrylic acid” means acrylic acid or methacrylic acid, and “(meth)acrylate” means acrylate or the corresponding methacrylate. “A or B” means that either A or B may be included, or both may be included.

[0018] In this specification, the term “layer” includes not only a structure formed over the entire surface when observed in a plan view but also a structure formed in part. Also, in this specification, the term “step” includes not only an independent step but also a step in which the intended action of the step is achieved even if it cannot be clearly distinguished from other steps. Also, the numerical range indicated using “~” indicates a range including the numerical values described before and after “~” as the minimum value and the maximum value, respectively.

[0019] In this specification, the content of each component in the composition means the total amount of the plurality of substances corresponding to each component present in the composition when there are a plurality of substances corresponding to each component in the composition, unless otherwise specified. Also, the exemplified materials may be used alone or in combination of two or more, unless otherwise specified. Also, in the numerical ranges described stepwise in this specification, the upper limit value or the lower limit value of a numerical range at a certain step may be replaced with the upper limit value or the lower limit value of a numerical range at another step. Also, in the numerical ranges described in this specification, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.

[0020] (Semiconductor device) FIG. 1 is a cross-sectional view showing an embodiment of a semiconductor device using a support piece manufactured by the manufacturing method according to the present embodiment. As shown in FIG. 1, the semiconductor device 1 includes a substrate 10, semiconductor chips 20, 21, 22, 23, a plurality of support pieces 30 (a plurality of support members), adhesive pieces 40 to 43, wires 45 to 48, and a sealing material 50. Note that the support piece manufactured by the manufacturing method according to the present embodiment may be used for manufacturing other semiconductor devices.

[0021] The substrate 10 may be an organic substrate or a metal substrate such as a lead frame. From the viewpoint of suppressing warping of the semiconductor device 1, the thickness of the substrate 10 is, for example, 90 to 300 μm, and may be 90 to 210 μm.

[0022] The semiconductor chip 20 is, for example, a controller chip (hereinafter also referred to as "CTL") and is disposed on the surface of the substrate 10. The semiconductor chip 20 is adhered to the substrate 10 by the adhesive piece 40 and electrically connected to the substrate 10 by the wire 45. The shape of the semiconductor chip 20 in plan view is, for example, rectangular (square or rectangular). The length of one side of the semiconductor chip 20 is, for example, 5 mm or less, and may be 2 to 5 mm or 1 to 5 mm. The thickness of the semiconductor chip 20 is, for example, 10 to 150 μm, and may be 20 to 100 μm.

[0023] The semiconductor chip 21 is, for example, a memory chip and is adhered onto the support piece 30 via the adhesive piece 41. Thereby, the semiconductor chip 21 is disposed on the semiconductor chip 20. Also, the adhesive piece 41 is sandwiched between the semiconductor chip 21 and the plurality of support pieces 30. The semiconductor chip 21 has a size larger than that of the semiconductor chip 20 in plan view. The shape of the semiconductor chip 21 in plan view is, for example, rectangular (square or rectangle). The length of one side of the semiconductor chip 21 is, for example, 20 mm or less, and may be 4 to 20 mm or 4 to 12 mm. The thickness of the semiconductor chip 21 is, for example, 10 to 170 μm, and may be 20 to 120 μm. Note that the semiconductor chips 22 and 23 are, like the semiconductor chip 21, for example, memory chips and are sequentially adhered onto the semiconductor chip 21 via the adhesive pieces 42 and 43. The length of one side of the semiconductor chips 22 and 23 may be the same as that of the semiconductor chip 21, and the thickness of the semiconductor chips 22 and 23 may also be the same as that of the semiconductor chip 21.

[0024] The support piece 30 is disposed on the surface of the substrate 10 around the semiconductor chip 20 and serves as a spacer that forms a space around the semiconductor chip 20. The support piece 30 is made of, for example, a cured product of a thermosetting resin composition. As shown in FIG. 2(a), two support pieces 30 (shape: rectangle) may be disposed at positions separated from both sides of the semiconductor chip 20, or as shown in FIG. 2(b), one support piece 30 (shape: square, a total of 4) may be disposed at each position corresponding to the corners of the semiconductor chip 20. The length of one side of the support piece 30 in plan view is, for example, 20 mm or less, and may be 1 to 20 mm or 1 to 12 mm. The thickness (height) of the support piece 30 is, for example, 10 to 180 μm, and may be 20 to 120 μm.

[0025] In this embodiment, a dolmen structure is formed on the substrate 10 by the semiconductor chip 21, a plurality of support pieces 30, and the adhesive piece 41 located between the support piece 30 and the semiconductor chip 21. In the semiconductor device 1 shown in FIG. 1, the semiconductor chip 20 is separated from the adhesive piece 41. By appropriately setting the thickness of the support piece 30, a space for the wire 45 for connecting the upper surface of the semiconductor chip 20 and the substrate 10 can be secured. When the semiconductor chip 20 is flip-chip connected to the electrode on the substrate 10, the adhesive piece 41 may be in contact with the upper surface of the semiconductor chip 20.

[0026] The wires 45 to 48 electrically connect the electrodes (not shown) on the surface of the substrate 10 and the semiconductor chips 20 to 23, respectively. The sealing material 50 fills the gap between the semiconductor chip 20 and the semiconductor chip 21 and seals the upper surface of the substrate 10 so as to cover the entire semiconductor chips 21 to 23 and the wires 46 to 48. The sealing material 50 is, for example, an epoxy resin.

[0027] (Method for manufacturing the support piece) Next, an example of a method for manufacturing the support piece used in the above-described semiconductor device or the like will be described. The support piece 30 shown in FIG. 1 is a cured product after the thermosetting resin composition has been cured. On the other hand, the support piece manufactured by this manufacturing method is in a state before the thermosetting resin composition is completely cured.

[0028] First, a laminated film 60 for forming the support piece shown in FIGS. 3(a) and 3(b) is prepared. The laminated film 60 includes a base film 61, an adhesive layer 62, and an adhesive film 63 for forming the support piece. The base film 61 and the adhesive layer 62 are formed, for example, in a circular shape by punching or the like (see FIG. 3(a)). The adhesive film 63 is a film that becomes a material for forming the support piece 30. The adhesive film 63 is formed in a circular shape by punching or the like and has a diameter smaller than that of the base film 61 and the adhesive layer 62 (see FIG. 3(a)).

[0029] The base film 61 is, for example, a polypropylene film (PP film) or a polyethylene film (PE film). The adhesive layer 62 is made of, for example, an ultraviolet curable adhesive. That is, the adhesive layer 62 has the property that its adhesiveness decreases when irradiated with ultraviolet rays. The base film 61 and the adhesive layer 62 constitute the first laminate 65 (see FIG. 4). The first laminate 65 is, for example, a dicing tape (DCT), and has at least one of a tensile strength of 15 MPa or more and 40 MPa or less and an elongation rate of 300% or more and 700% or less. Depending on the application, the first laminate 65 can use a base film that is easy to stretch or a base film that is difficult to stretch. When using a base film that is easy to stretch, the first laminate 65 can have a tensile strength of 15 MPa or more and less than 30 MPa and an elongation rate of 600% or more and 700% or less. When using a base film that is difficult to stretch, the first laminate 65 can have a tensile strength of 30 MPa or more and 40 MPa or less and an elongation rate of 300% or more and less than 600%.

[0030] The above-mentioned "tensile strength" and "elongation rate" can be calculated by the following method. First, as the size of the test piece, prepare a test piece by cutting it so that the width is 10 mm and the length is such that the chuck distance is 50 mm. As the test apparatus, use a tensile tester specified in JIS B7721 or a tensile tester equivalent thereto. Then, set the test piece in this test apparatus, pull it at a speed of 300 ± 30 mm / min, and measure the load and elongation until the test piece breaks. From these measured values, calculate the "tensile strength" and "elongation rate" based on the following formulas. Tensile strength (MPa) = Strength at tape break (N) ÷ Tape cross-sectional area (mm 2 ) Elongation rate (%) = (Length at break (mm) - Initial length (50 mm)) ÷ Initial length (50 mm)

[0031] Next, the adhesive film 63 is made of, for example, a thermosetting resin composition. The thermosetting resin composition constituting the adhesive film 63 can be in a fully cured state (C-stage) through a semi-cured (B-stage) state by subsequent curing treatment. The thermosetting resin composition includes an epoxy resin, a curing agent, and an elastomer (for example, an acrylic resin), and further includes an inorganic filler, a curing accelerator, etc. as necessary. Details of the thermosetting resin composition constituting the adhesive film 63 will be described later.

[0032] The laminated film 60 can be produced, for example, by laminating a first laminate 65 having a base film 61 and an adhesive layer 62 on its surface and a second laminate 66 having a cover film 64 and an adhesive film 63 on its surface (see FIG. 4). The first laminate 65 is obtained through a process of forming the adhesive layer 62 on the surface of the base film 61 by coating and a process of processing the base film 61 and the adhesive layer 62 into a predetermined shape (for example, circular) by punching or the like. The second laminate 66 is obtained through a process of forming the adhesive film 63 on the surface of the cover film 64 (for example, a PET film or a polyethylene film) by coating and a process of processing the adhesive film 63 into a predetermined shape (for example, circular) by punching or the like. When using the laminated film 60, the cover film 64 is peeled off at an appropriate timing.

[0033] Next, as shown in Fig. 5(a), a dicing ring frame 100 (ring) is attached to the above-described laminated film 60. That is, the base film 61 is attached to the ring frame 100 via the adhesive layer 62 so that the adhesive film 63 is disposed inside the ring frame 100. As shown in Fig. 6, the ring frame 100 is, for example, a substantially annular ring, and the outer peripheral portion of the laminate 65 including the base film 61 is attached to the ring frame 100 via the adhesive layer 62. This attachment is performed while pressing with a pressing member such as a roller from one end 100a to the other end 100b of the ring frame 100. Note that the roller may be fixed so as not to move in the horizontal direction (rotational movement is possible), and the ring frame 100 and the laminated film 60 may be configured to move relative to the roller.

[0034] Also, at the time of this attachment, the laminated film 60 composed of the base film 61, the adhesive layer 62, and the adhesive film 63 is attached to the ring frame 100 with a certain amount of tension applied. Specifically, tension is applied to the laminated film 60 so that the elongation rate of the laminated film 60 at the time of attachment is greater than 100%, and the laminated film 60 is attached to the ring frame 100. Preferably, tension may be applied to the laminated film 60 so that the elongation rate of the laminated film 60 at the time of attachment is 100.40% or more, and more preferably, tension may be applied to the laminated film 60 so that the elongation rate of the laminated film 60 at the time of attachment is 101% or more, and the laminated film 60 is attached to the ring frame 100. By attaching the laminated film 60 to the ring frame 100 in a state where a predetermined tension is applied to the laminated film 60 in this way, burrs due to dicing are scraped out from the dicing groove (see Fig. 9(a)) by the release of tension during dicing described later, and the pick-up property of the support piece can be improved (see Fig. 9(b)). Here, the "elongation rate of the laminated film" is a value indicating the ratio of the length (diameter) of the laminated film after attachment to the length (diameter) of the laminated film before attachment when the length (diameter) of the laminated film before attachment is set to 100%.

[0035] Alternatively, when attaching the laminated film 60, a tension may be applied to the laminated film 60 so that the elongation rate at the time of attachment is 101% or less, and then the laminated film 60 may be attached to the ring frame 100. In this case, since the tension applied to the laminated film 60 is not so high, the elongation force applied to the adhesive film 63 constituting the laminated film 60 can also be kept low, and when the laminated film 60 is attached to the ring frame 100, the peeling of the adhesive film 63 from the base film 61 is reduced. In particular, peeling is likely to occur near the outer periphery of the base film 61 (adhesive layer 62) and the adhesive film 63, but by suppressing the elongation rate of the laminated film 60 within the above range, the peeling of the adhesive film 63 from the base film 61 is reduced. Therefore, by applying a tension to the laminated film 60 so that the elongation rate at the time of attachment of the laminated film 60 is greater than 100% and 101% or less and attaching it to the ring frame 100, it is possible to achieve both an improvement in the pick-up property of the support piece and a reduction in the peeling of the laminated film 60.

[0036] Subsequently, when the attachment of the laminated film 60 to the ring frame 100 is completed, as shown in FIG. 5(b), the adhesive film 63 is diced into individual pieces. Thereby, a number of support pieces 63a are obtained from the adhesive film 63. Thereafter, the adhesive force between the adhesive layer 62 and the support pieces 63a is reduced by irradiating the adhesive layer 62 with ultraviolet rays. After the irradiation with ultraviolet rays is completed, the base film 61 may be expanded outward in the horizontal direction to separate the support pieces 63a from each other.

[0037] Subsequently, as shown in Fig. 5(c), while expanding the base film 61, the support pieces 63a are peeled off from the adhesive layer 62 by pushing up with the push-up jig 111, and the support pieces 63a are picked up by suction with the suction collet 112. The amount of expansion (expansion amount E) by this expansion performed during this pick-up is 3 mm or more and 9 mm or less. More preferably, the expansion amount E may be 5 mm or more and 9 mm or less, or may be 5 mm or more and 7 mm or less. By picking up the support pieces 63a while expanding with such an expansion amount E larger than normal, the burrs adhering between the support pieces 63a are peeled off, and the pick-up by the suction collet 112 can be performed easily and surely. Here, the "expansion amount E" means the amount (distance) by which the central portion of the base film 61 is lifted by the expansion jig with respect to the end portion of the base film 61 attached to the ring frame 100. Also, the amount of pushing up by the push-up jig 111 may be 300 μm or more, and more preferably, may be 400 μm or more. Also, the pushing-up speed by the push-up jig 111 may be 0.1 mm / s or more, 1 mm / s or more, or 10 mm / s or more. Note that the curing reaction of the thermosetting resin may be advanced by heating the adhesive film 63 before dicing or the support piece 63a before pick-up. By appropriately curing the support piece 63a at the time of pick-up, excellent pick-up performance can be achieved. As described above, the support pieces 63a are obtained.

[0038] Here, with reference to Fig. 7, the operational effects of picking up the support pieces 63a while expanding the base film 61 with an expansion amount E within a predetermined range in the method for manufacturing the support pieces 30 described above will be described. Fig. 7(a) is a cross-sectional view schematically showing the state of the burr G remaining adhered between the support pieces 63a when the expansion amount E at the time of pick-up is small, and Fig. 7(b) is a cross-sectional view schematically showing the state of the burr G peeled off from the support pieces 63a when the expansion amount E at the time of pick-up is large.

[0039] As shown in FIG. 7(a), when the adhesive film 63 of the laminated film 60 is diced into individual pieces, sticky burrs G adhere between the support pieces 63a after dicing. The burr G is, for example, a part of the adhesive film 63 scraped off by dicing. In this case, if the expansion amount E during pickup is small, the sticky burr G remaining in the dicing groove H between the support pieces 63a remains attached to the support pieces 63a, which will inhibit the pickup of each support piece 63a. On the other hand, as shown in FIG. 7(b), in the manufacturing method according to this embodiment, the base film 61 is in an expanded state during pickup, and the burr G in the dicing groove H is peeled off from the support piece 63a or the area where it adheres is reduced. Therefore, by expanding the laminated film 60 during the pickup of the support piece 63a, the inhibition of the pickup of the support piece 63a by the burr G is significantly reduced, and the pick-up property is improved. Incidentally, if the expansion amount E is too large (for example, when the expansion amount is larger than 9 mm), the base film 61 and the like become hard, and as a result, the followability to the lifting jig 111 (pin) when lifting the support piece 63a decreases, and the pickup rate decreases.

[0040] Also, with reference to FIGS. 8 and 9, in the manufacturing method of the support piece 30 described above, the effect of attaching the laminated film to the ring frame 100 with a predetermined attachment tension will be described. FIG. 8(a) is a cross-sectional view schematically showing the state of burrs remaining attached between the support pieces after dicing when the attachment tension in the lamination process is weak, and FIG. 8(b) is a cross-sectional view schematically showing the state of the burrs during pickup following FIG. 8(a). FIG. 9(a) is a cross-sectional view schematically showing the state in which the burrs adhering between the support pieces are scraped out of the dicing groove due to the release of the tension during dicing when the attachment tension in the lamination process is strong, and FIG. 9(b) is a cross-sectional view schematically showing the state of the burrs during pickup following FIG. 9(a).

[0041] When the base film 61 is attached to the ring frame 100 with the sticking tension of the laminated film 60 being low, as shown in Fig. 8(a), when the adhesive film 63 is diced, the sticky burr G remains in the dicing groove as it is. In this state, as shown in Fig. 8(b), when the pickup of the support piece 63a is performed, the pickup is inhibited by the burr G. On the other hand, when the base film 61 is attached to the ring frame 100 with the sticking tension of the laminated film 60 being high (for example, when the elongation rate of the laminated film is greater than 100%), as shown in Fig. 9(a), when the adhesive film 63 is diced, the burr G is scraped out from the dicing groove H due to the release of the tension during attachment. Therefore, in this state, as shown in Fig. 9(b), even when the pickup of the support piece 63a is performed, the pickup is not inhibited by the burr G, and the pickup of the support piece 63a can be performed without problems. That is, the pick-up property can be improved.

[0042] (Thermosetting resin composition constituting the adhesive film 63) Next, the thermosetting resin composition constituting the adhesive film 63 for forming the support piece 30 will be described in detail. As described above, this thermosetting resin composition contains an epoxy resin, a curing agent, and an elastomer, and further contains an inorganic filler, a curing accelerator, etc. as required. According to the study by the present inventors, it is preferable that the support piece 63a and the support piece 30 after curing have the following characteristics. ·Characteristic 1: It is difficult for positional deviation to occur when the support piece 30 is thermocompression-bonded to a predetermined position on the substrate 10 (the melt viscosity of the support piece 30 at 120°C is, for example, 4300 to 50000 Pa·s or 5000 to 40000 Pa·s). ·Characteristic 2: The support piece 30 exhibits stress relaxation properties within the semiconductor device 1 (the thermosetting resin composition contains an elastomer (rubber component)). ·Characteristic 3: The adhesion strength with the adhesive piece 41 of the chip with an adhesive piece is sufficiently high (the die shear strength of the support piece 30 with respect to the adhesive piece 41 is, for example, 2.0 to 7.0 Mpa or 3.0 to 6.0 Mpa). ·Characteristic 4: The shrinkage rate accompanying curing is sufficiently small. ·Characteristic 5: Good visibility of the support piece 63a by the camera in the pickup process (the thermosetting resin composition contains, for example, a coloring agent). ·Characteristic 6: The support piece 30 has sufficient mechanical strength.

[0043] [Epoxy resin] The epoxy resin is not particularly limited as long as it cures and has an adhesive action. Bifunctional epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, novolac type epoxy resins such as phenol novolac type epoxy resin and cresol novolac type epoxy resin can be used. In addition, generally known ones such as polyfunctional epoxy resins, glycidylamine type epoxy resins, heterocyclic ring-containing epoxy resins or alicyclic epoxy resins can be applied. These may be used alone or in combination of two or more.

[0044] [Hardener] Examples of the hardener include phenol resins, ester compounds, aromatic amines, aliphatic amines and acid anhydrides. Among these, from the viewpoint of achieving high die shear strength, phenol resins are preferred. Examples of commercially available phenol resins include LF-4871 (trade name, BPA novolac type phenol resin) manufactured by DIC Corporation, HE-100C-30 (trade name, phenylalkyl type phenol resin) manufactured by Air Water Inc., Phenolite KA and TD series manufactured by DIC Corporation, Mirex XLC-series and XL-series (for example, Mirex XLC-LL) manufactured by Mitsui Chemicals, Inc., HE series (for example, HE100C-30) manufactured by Air Water Inc., MEHC-7800 series (for example, MEHC-7800-4S) manufactured by Meiwa Kasei Co., Ltd., and JDPP series of JEF Chemical Corporation. These may be used alone or in combination of two or more.

[0045] From the viewpoint of achieving high die shear strength, the compounding amounts of the epoxy resin and the phenol resin preferably have an equivalent ratio of epoxy equivalent to hydroxyl equivalent of 0.6 to 1.5, more preferably 0.7 to 1.4, and even more preferably 0.8 to 1.3, respectively. By having the compounding ratio within the above range, it is easy to sufficiently achieve both curability and fluidity at a high level.

[0046] [Elastomer] Examples of the elastomer include acrylic resin, polyester resin, polyamide resin, polyimide resin, silicone resin, polybutadiene, acrylonitrile, epoxy-modified polybutadiene, maleic anhydride-modified polybutadiene, phenol-modified polybutadiene, and carboxy-modified acrylonitrile.

[0047] From the viewpoint of achieving high die shear strength, an acrylic resin is preferred as the elastomer. Further, an acrylic resin such as an epoxy group-containing (meth)acrylic copolymer obtained by polymerizing a functional monomer having an epoxy group or a glycidyl group such as glycidyl acrylate or glycidyl methacrylate as a crosslinkable functional group is more preferred. Among acrylic resins, an epoxy group-containing (meth)acrylate copolymer and an epoxy group-containing acrylic rubber are preferred, and an epoxy group-containing acrylic rubber is more preferred. The epoxy group-containing acrylic rubber is a rubber having an epoxy group, mainly composed of acrylate esters, and mainly composed of copolymers such as butyl acrylate and acrylonitrile, and copolymers such as ethyl acrylate and acrylonitrile. In addition, the acrylic resin may have crosslinkable functional groups such as alcoholic or phenolic hydroxyl groups and carboxyl groups in addition to the epoxy group.

[0048] Commercially available products of acrylic resin include SG-70L, SG-708-6, WS-023 EK30, SG-280 EK23, SG-P3 solvent-changed product (trade name, acrylic rubber, weight average molecular weight: 800,000, Tg: 12 °C, solvent is cyclohexanone) manufactured by Nagase ChemteX Corporation, etc.

[0049] The glass transition temperature (Tg) of the acrylic resin is preferably -50 to 50°C, more preferably -30 to 30°C, from the viewpoint of achieving high die shear strength. The weight average molecular weight (Mw) of the acrylic resin is preferably 100,000 to 3,000,000, more preferably 500,000 to 2,000,000, from the viewpoint of achieving high die shear strength. Here, Mw means a value measured by gel permeation chromatography (GPC) and converted using a calibration curve with standard polystyrene. Note that using an acrylic resin with a narrow molecular weight distribution tends to form a highly elastic adhesive sheet.

[0050] The amount of the acrylic resin contained in the thermosetting resin composition is preferably 10 to 200 parts by mass, more preferably 20 to 100 parts by mass, based on 100 parts by mass in total of the epoxy resin and the epoxy resin curing agent, from the viewpoint of achieving high die shear strength.

[0051] [Inorganic filler] Examples of the inorganic filler include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, boron nitride, crystalline silica, and amorphous silica. These may be used alone or in combination of two or more.

[0052] The average particle size of the inorganic filler is preferably 0.005 μm to 1.0 μm, more preferably 0.05 to 0.5 μm, from the viewpoint of achieving high die shear strength. The surface of the inorganic filler is preferably chemically modified from the viewpoint of achieving high die shear strength. Examples of suitable materials for chemically modifying the surface include silane coupling agents. Examples of the types of functional groups of the silane coupling agent include vinyl group, acryloyl group, epoxy group, mercapto group, amino group, diamino group, alkoxy group, and ethoxy group.

[0053] From the viewpoint of achieving high die shear strength, the content of the inorganic filler is preferably 20 to 200 parts by mass, more preferably 30 to 100 parts by mass, based on 100 parts by mass of the resin component of the thermosetting resin composition.

[0054] [Curing accelerator] Examples of the curing accelerator include imidazoles and their derivatives, organic phosphorus compounds, secondary amines, tertiary amines, and quaternary ammonium salts. From the viewpoint of achieving high die shear strength, imidazole-based compounds are preferred. Examples of imidazoles include 2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, and the like. These may be used alone or in combination of two or more.

[0055] From the viewpoint of achieving high die shear strength, the content of the curing accelerator in the thermosetting resin composition is preferably 0.04 to 3 parts by mass, more preferably 0.04 to 0.2 parts by mass, based on 100 parts by mass of the total of the epoxy resin and the epoxy resin curing agent.

[0056] In addition, the adhesive film serving as the support piece 30 may be formed of multiple layers. FIG. 10 is a cross-sectional view showing a laminated film 60A according to a modified example. As shown in FIG. 10, the laminated film 60A has a base film 61, an adhesive layer 62, and an adhesive film 63A. The adhesive film 63A includes a pair of surface layers 66a and 66b made of any of the above-described thermosetting resin compositions, and an intermediate layer 67 disposed between the pair of surface layers 66a and 66b. The thickness of the surface layers 66a and 66b is, for example, 5 to 60 μm, and may be 5 to 25 μm or 5 to 20 μm. The thickness of the intermediate layer 67 is, for example, 5 to 75 μm, and may be 10 to 75 μm or 10 to 50 μm. The tensile elastic modulus of the intermediate layer 67 is, for example, 8.0 MPa or more, and may be 9.0 MPa or more or 10.0 MPa or more. By the tensile elastic modulus of the intermediate layer 67 being 8.0 MPa or more, in the step of picking up the support piece 63a (see FIG. 5(c)), the intermediate layer 67 serves like a spring plate, and excellent pick-up property can be achieved. Note that the upper limit value of the tensile elastic modulus of the intermediate layer 67 is about 15 MPa from the viewpoint of ease of obtaining materials. The intermediate layer 67 is composed of, for example, a resin layer such as polyimide or polyethylene terephthalate (PET), or a metal layer. The intermediate layer 67 may be a layer made of a thermosetting resin composition or a photocurable resin composition that has been subjected to a curing treatment so that the tensile elastic modulus is within the above range.

[0057] (Method of manufacturing a semiconductor device) Here, with reference to FIGS. 11 to 13, a method of manufacturing a semiconductor device 1 having a three-dimensional mounting structure using the support piece 30 manufactured by the above-described manufacturing method will be described. FIG. 11 is a view showing one step of the manufacturing method of the semiconductor device 1, and is a cross-sectional view showing a state in which a plurality of support pieces 30 are arranged around a semiconductor chip 20 on a substrate 10. FIG. 12 is a cross-sectional view showing an example of an adhesive-attached chip used in the manufacturing method of the semiconductor device 1. FIG. 13 is a view showing one step of the manufacturing method of the semiconductor device 1 following FIG. 11, and is a cross-sectional view schematically showing a dorman structure formed on the substrate 10.

[0058] The manufacturing method of the semiconductor device according to this embodiment includes the following steps (A) to (G). (A) Step of preparing a plurality of support pieces 30 (see (a) to (c) of FIG. 5) (B) Step of disposing the semiconductor chip 20 on the substrate 10 (C) Step of disposing a plurality of support pieces 30 around the semiconductor chip 20 on the substrate 10 (see FIG. 11) (D) Step of preparing an adhesive chip 21a including a semiconductor chip 21 and an adhesive piece 41 provided on one surface of the semiconductor chip 21 (see FIG. 12) (E) Step of constructing a dorman structure by disposing the adhesive chip 21a on the surfaces of the plurality of support pieces 30 (see FIG. 13) (F) Step of laminating further semiconductor chips 22 and 23 on the semiconductor chip 21 (see FIG. 1) (G) Step of sealing the upper surface of the substrate 10 with a sealing material 50 so as to fill the gap between the semiconductor chip 20 and the semiconductor chip 21 and cover the semiconductor chips 21 to 23 and the wires 46 to 48 (see FIG. 1)

[0059] (A) to (G) steps are a process of constructing a dorman structure on the substrate 10 using a plurality of support pieces 30. In step (A), a predetermined number of support pieces 30 manufactured by the manufacturing method shown in FIG. 5 and the like are prepared. In step (A), the support pieces 30 may be manufactured by the manufacturing method shown in FIG. 5 and the like, or the manufactured support pieces 30 may be acquired.

[0060] [Step (B)] (B) step is a step of disposing the semiconductor chip 20 on the substrate 10. For example, first, the semiconductor chip 20 is mounted on a predetermined position on the substrate 10 via an adhesive piece 40. Then, the semiconductor chip 20 is electrically connected to the substrate 10 with a wire 45.

[0061] [Step (C)] (C) process is a process of arranging a plurality of support pieces 30 on the substrate 10 around the semiconductor chip 20. Through this process, the structure T shown in FIG. 11 is fabricated. The structure T includes the substrate 10, the semiconductor chip 20 disposed on its surface, and a plurality of support pieces 30. The arrangement of the support pieces 30 may be performed by a crimping process. The crimping process is preferably carried out, for example, under the conditions of 80 to 180 °C and 0.01 to 0.50 MPa for 0.5 to 3.0 seconds. Note that the support pieces 30 may be fully cured support pieces at the time of the (C) process, or may not be fully cured at this time. It is preferable that the support pieces 30 are fully cured support pieces before the start of the (C) process.

[0062] [(D) process] (D) process is a process of preparing the adhesive-attached chip 21a shown in FIG. 12. The adhesive-attached chip 21a includes the semiconductor chip 21 and an adhesive piece 41 provided on one of its surfaces. The adhesive-attached chip 21a can be obtained, for example, by using a semiconductor wafer and a dicing / die bonding integrated film through a dicing process and a pick-up process.

[0063] [(E) process] (E) process is a process of arranging the adhesive-attached chip 21a above the semiconductor chip 20 such that the adhesive piece 41 contacts the upper surfaces of the plurality of support pieces 30. Specifically, the semiconductor chip 21 is crimped to the upper surfaces of the support pieces 30 via the adhesive piece 41. This crimping process is preferably carried out, for example, under the conditions of 80 to 180 °C and 0.01 to 0.50 MPa for 0.5 to 3.0 seconds. Next, the adhesive piece 41 is cured by heating. This curing process is preferably carried out, for example, under the conditions of 60 to 175 °C and 0.01 to 1.0 MPa for 5 minutes or more. Thereby, the adhesive piece 41 is cured. Through this process, a dolmen structure is constructed on the substrate 10 (see FIG. 13).

[0064] [(F) process] (F) In the process, the semiconductor chip 22 is placed on the semiconductor chip 21 via the adhesive piece 42, and further, the semiconductor chip 23 is placed on the semiconductor chip 22 via the adhesive piece 43. The adhesive pieces 42 and 43 may be the same thermosetting resin composition as the above-described adhesive pieces 40 and 41, and become adhesive pieces by heat curing (see Fig. 1). On the other hand, the semiconductor chips 21, 22, 23 and the substrate 10 are electrically connected to each other by wires 46 to 48. Note that the number of chips laminated above the semiconductor chip 20 is not limited to three in this embodiment and can be set as appropriate.

[0065] [(G) Process] (G) In the process, the gap between the semiconductor chip 20 and the semiconductor chip 21 is filled, and the substrate 10 is sealed with the sealing material 50 so as to cover the semiconductor chips 21 to 23 and the wires 46 to 48 (see Fig. 1). The sealing material 50 contains, for example, an epoxy resin. Through this process, the semiconductor device 1 shown in Fig. 1 is completed.

[0066] As described above, in the manufacturing method of the support piece according to this embodiment, when picking up the individualized support pieces 63a, each support piece 63a is picked up in a state where the base film 61 is expanded with an expansion amount of 3 mm or more and 9 mm or less. In this case, since the expansion amount is made larger than normal, the burr G adhering to the side surface or the like of each individualized support piece 63a is peeled off by the expansion, and the state where the adjacent support pieces 63a are adhered by the burr G can be eliminated. Therefore, according to this manufacturing method, when picking up each individualized support piece 63a, since the adjacent support pieces 63a are not connected by the burr G, the pick-up property of the individualized support piece 63a can be improved.

[0067] Further, the method for manufacturing the support piece according to the present embodiment may further include a step of attaching the base film 61 to the ring frame 100 via the adhesive layer 62 so that the adhesive film 63 is disposed inside the ring frame 100 for individualization. In this attaching step, the laminated film 60 is attached to the ring frame 100 while applying tension to the laminated film 60 so that the elongation rate of the laminated film 60 becomes greater than 100%. In this case, before dicing, a tension is applied to stretch the laminated film 60 outward, and the tension will be released by dicing. Therefore, even if burrs G are formed by dicing between adjacent support pieces 63a, the burrs G are scraped out from the dicing grooves H or the like between the support pieces 63a due to the sudden contraction caused by the release of this tension. As a result, adjacent support pieces 63a are not connected by the burrs G, and the pick-up property of the individualized support pieces 63a can be further improved.

[0068] Also, in the method for manufacturing the support piece according to the present embodiment, in the attaching step, the laminated film 60 may be attached to the ring frame 100 while applying tension to the laminated film 60 so that the elongation rate of the laminated film 60 becomes 101% or less. In this case, since the tension applied to the laminated film 60 is not so high, the stretching force applied to the adhesive film 63 constituting the laminated film 60 can also be kept low, and when the laminated film 60 is attached to the ring frame 100, the peeling of the adhesive film 63 from the base film 61 is reduced. Particularly, peeling is likely to occur in the vicinity of the outer periphery of the base film 61 (adhesive layer 62) and the adhesive film 63, but with the above manufacturing method, the peeling of the adhesive film 63 from the base film 61 is reduced. As a result, voids are less likely to occur between the laminate composed of the base film 61 and the adhesive layer 62 and the adhesive film 63. By reducing such voids, according to this manufacturing method, it is possible to suppress chip jumping or the like during individualization and manufacture inexpensive support members with a high yield.

[0069] Also, in the method for manufacturing the support piece according to the present embodiment, in the step of picking up, each of the plurality of support pieces 63a may be picked up in a state where the base film 61 is expanded with an expansion amount of 5 mm or more and 9 mm or less. In this case, since the expansion amount is in a range larger than normal, the burr G adhered to the side surface or the like of each of the individualized support pieces 63a is peeled off more strongly, and the state where the adjacent support pieces 63a are adhered by the burr can be eliminated. Therefore, according to this manufacturing method, when picking up each of the individualized support pieces 63a, the pick-up property of the individualized support pieces 63a can be further improved.

[0070] Also, in the method for manufacturing the support piece according to the present embodiment, in the step of picking up, the base film 61 may be pushed up with a push-up amount of 300 μm or more in the push-up direction orthogonal to the expansion direction, and each of the plurality of support pieces 63a may be picked up. In this case, since a larger distance of the support piece 63a from the base film 61 can be taken when picking up, the pick-up property of the individualized support piece can be further improved.

[0071] Also, in the method for manufacturing the support piece according to the present embodiment, the tensile elastic modulus of the adhesive film 63 may be 8.0 MPa or more. Further, the adhesive film 63 may contain polyimide. In this case, it becomes possible to obtain an inexpensive and highly strong support member.

[0072] Further, in the method for manufacturing the support piece according to the present embodiment, the adhesive film 63 may include a pair of surface layers 66a and 66b made of a cured product of a thermosetting resin composition, and an intermediate layer 67 disposed between the pair of surface layers 66a and 66b. In this case, the adhesive film 63A has a multilayer structure, and even if the adhesive film 63A is formed to be relatively thick, warping of the adhesive film 63A can be suppressed. By suppressing warping, according to this manufacturing method, the thickness of the adhesive film 63A spreading in the planar direction can be made more uniform, and the thickness of the manufactured support piece can be made more uniform. In this modification, the intermediate layer 67 may be a polyimide layer or a metal layer. Thereby, a support piece excellent in strength and heat resistance can be obtained. Note that the thickness of the intermediate layer 67 may be 50 μm or less. Thereby, even if it has a multilayer structure, the support piece can be made thin without making it too thick.

[0073] As described above, the embodiments of the present disclosure have been described in detail, but the present invention is not limited to the above embodiments. For example, in the above embodiments, the method for manufacturing the support piece 30 used in the semiconductor device having the dorman structure has been described, but the support piece 30 may be used as a member of other semiconductor devices and is not particularly limited. Further, although the laminated film 60 having the ultraviolet curable adhesive layer 62 has been exemplified, the adhesive layer 62 may be a pressure sensitive type.

Example

[0074] Hereinafter, the present invention will be described more specifically by way of examples, but the present invention is not limited to the examples.

[0075] In the following examples, the pick-up property of the support piece when the support piece was produced using the laminated film 60A having the configuration shown in FIG. 10 was confirmed. Specifically, the laminated film 60A was attached to the ring frame 100, the adhesive film 63A was diced into individual pieces, and then the diced support pieces were picked up. The apparatuses used for these were a 12-inch dual dicing machine (DFD-6362) manufactured by DISCO Corporation and a die bonder (DB-830P) manufactured by Fast Forward Technology Co., Ltd.

[0076] Also, the compounds used in each example are as follows.

[0077] (Laminate) As the laminate 65, the following laminate was prepared.

[0078] (Production of laminate) Using 78 parts by mass of 2-ethylhexyl acrylate, 20 parts by mass of 2-hydroxyethyl acrylate, and 2 parts by mass of methacrylic acid as raw materials, and using ethyl acetate as a solvent, a copolymer was obtained by solution radical polymerization. Next, 8 parts by weight of 2-methacryloyloxyethyl isocyanate was reacted with this acrylic copolymer to synthesize a radiation-reactive acrylic copolymer having a carbon-carbon double bond. In the above reaction, 0.05 part of hydroquinone monomethyl ether was used as a polymerization inhibitor. When the weight average molecular weight of the synthesized acrylic copolymer was measured by GPC, it was 800,000.

[0079] The acrylic copolymer thus obtained was mixed with 8.0 parts in terms of solid content of a polyisocyanate compound (Tosoh Corporation, trade name: Coronate L) as a curing agent and 0.5 part of 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator to prepare a radiation-curable pressure-sensitive adhesive solution. Next, the radiation-curable pressure-sensitive adhesive solution obtained as described above was applied and dried on a polyethylene terephthalate release film (thickness: 38 μm) so that the thickness after drying was 10 μm. Thereafter, a polyolefin film (thickness: 90 μm) having one-sided corona discharge treatment was laminated on the adhesive layer. The laminated sample was aged in a constant temperature bath at 40°C for 72 hours to produce a laminate. The tensile strength of the laminate was 32 MPa and the elongation rate was 340%.

[0080] (Adhesive film) As the adhesive film, as described above, the three-layered adhesive film 63A shown in FIG. 10 was used. The thermosetting resin composition constituting the surface layers 66a and 66b of the adhesive film 63A contained the following (a) to (h).

[0081] (Preparation of Varnish A) Varnish A for the film for forming the support piece was prepared using the following materials. (a) Epoxy resin: YDCN-700-10: (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., cresol novolak type epoxy resin, solid at 25°C) 13.2 parts by mass (b) Phenolic resin (hardening agent): HE-100C-30: (trade name, manufactured by Air Water Inc., phenylalkyl type phenolic resin) 11.0 parts by mass (c) Inorganic filler: Aerosil R972: (trade name, manufactured by Nippon Aerosil Co., Ltd., silica, average particle diameter 0.016 μm) 7.8 parts by mass (d) Elastomer: SG-P3 solvent-modified product (trade name, manufactured by Nagase ChemteX Corporation, acrylic rubber, weight average molecular weight: 800,000, Tg: 12°C, solvent is cyclohexanone) 66.4 parts by mass (e) Coupling agent 1: A-189: (trade name, manufactured by GE Toshiba Corporation, γ-mercaptopropyltrimethoxysilane) 0.4 parts by mass (f) Coupling agent 2: A-1160: (trade name, manufactured by GE Toshiba Corporation, γ-ureidopropyltriethoxysilane) 1.15 parts by mass (g) Curing accelerator: Curezol 2PZ-CN: (trade name, manufactured by Shikoku Kasei Kogyo Co., Ltd., 1-cyanoethyl-2-phenylimidazole) 0.03 parts by mass (h) Solvent: Cyclohexane

[0082] As described above, cyclohexanone was used as the solvent, and the solid content ratio of Varnish A was adjusted to 16% by mass. Varnish A was filtered through a 100-mesh filter and degassed under vacuum. As the film to which Varnish A was applied, a polyethylene terephthalate (PET) film (thickness 38 μm) subjected to a release treatment was prepared. The degassed Varnish A under vacuum was applied onto the surface of the PET film subjected to the release treatment. The applied Varnish A was dried by heating in two steps at 90°C for 5 minutes and then at 140°C for 5 minutes. Thus, a thermosetting resin layer A in a B-stage state (semi-cured state) was formed on the surface of the PET film.

[0083] Further, the intermediate layer 67 of the adhesive film 63A was composed of polyimide (manufactured by Ube Industries, Ltd., trade name: Upilex 50SGA, thickness 50 μm).

[0084] Next, thermosetting resin layers 66a and 66b were prepared and laminated on both sides of the intermediate layer 67 on a hot plate at 70°C using a rubber roll to form the adhesive film 63A, and then laminated on the laminate 65 at room temperature using a rubber roll to obtain the laminated film 60A.

[0085] Subsequently, the obtained laminated film 60A was attached to the ring frame 100 with a predetermined attachment tension (see Fig. 5(a)), and then the adhesive film 63A was diced by a dicing device into individual pieces (see Fig. 5(b)). Then, while expanding the base film 61 by a predetermined expansion amount, each support piece was pushed up with a push-up jig 111 and picked up by suction with a suction collet 112. The number of pick-ups in each test was 20.

[0086] The following Tables 1 to 3 show the evaluation results (Examples 1 to 16) in which the expansion amount, attachment tension, push-up amount, and push-up speed were changed respectively. In Table 1, the attachment tension was 100.19% and the kerf width during dicing was 24 μm. In Table 2, the attachment tension was 100.47% and the kerf width during dicing was 31 μm. In Table 3, the attachment tension was 101.00% and the kerf width during dicing was 33 μm.

Table 1

Table 2

Table 3

[0087] As shown in the above Examples 1 to 16, by setting the expansion amount during pickup in the range of 3 mm to 9 mm, it was confirmed that the pickup rate of the support piece was almost 100% and the pick-up property was improved. In addition, as shown in Examples 1 and 2, when the expansion amount during pickup was 3 mm, if the pushing-up amount was 275 mm and 300 mm, the pickup rate tended to decrease. However, for example, by increasing the pushing-up amount in Example 2 to 325 μm, the pickup rate could be made 20 / 20.

[0088] In addition, Table 4 below shows Examples 17 to 19 in which the expansion amount was 7 mm and the pasting tension of the laminate 65A to the ring frame 100 was changed.

Table 4

[0089] As shown in the above Examples 17 to 19, it was confirmed that the number of pickups could be improved as the pasting tension of the laminate 65A to the ring frame 100 was increased above 100%. The pushing-up amounts in Examples 17 to 19 were set low to confirm the tendency due to the change in pasting tension. By increasing the pushing-up amount to 225 μm in the tests corresponding to Examples 18 and 19 (with other conditions remaining the same), the pickup rate could be made 20 / 20.

[0090] As is clear from the above test results, it was confirmed that the pickup rate could be increased by picking up each support piece in a state where the base film was expanded with an expansion amount of 3 mm or more and 9 mm or less (more preferably, an expansion amount of 5 mm or more and 9 mm or less). In addition, it was confirmed that the pick-up property could be improved by increasing the pasting tension of the laminate to the ring frame.

Explanation of Signs

[0091] 1…Semiconductor device, 10…Substrate, 20…Semiconductor chip, 21…Semiconductor chip, 30…Support piece (support member), 60, 60A…Laminated film, 61…Base film, 62…Adhesive layer, 63…Adhesive film, 63a…Support piece, 65…Laminated body, 66a, 66b…Surface layer, 67…Intermediate layer, 100…Ring frame (ring), 111…Lifting jig, 112…Suction collet, E…Expansion amount, G…Burr, H…Dicing groove.

Claims

1. A step of preparing a laminated film in which an adhesive film is attached to a base film via an adhesive layer; A step of attaching the base film to the ring via the adhesive layer so that the adhesive film is disposed inside a ring for individualization; A step of individualizing the adhesive film into a plurality of support members; A step of picking up each of the plurality of support members from the base film, comprising: In the attaching step, the laminated film is attached to the ring while applying tension to the laminated film so that the elongation rate of the laminated film is greater than 100%; In the picking-up step, each of the plurality of support members is picked up in a state where the base film is expanded with an expansion amount of 3 mm or more and 9 mm or less; A method for manufacturing a support member.

2. In the attaching step, the laminated film is attached to the ring while applying tension to the laminated film so that the elongation rate of the laminated film is 101% or less; The method for manufacturing a support member according to Claim 1.

3. In the attaching step, the laminated film is attached to the ring while applying tension to the laminated film so that the elongation rate of the laminated film is 101% or more; The method for manufacturing a support member according to Claim 1.

4. In the picking-up step, each of the plurality of support members is picked up in a state where the base film is expanded with an expansion amount of 5 mm or more and 9 mm or less; The method for manufacturing a support member according to any one of Claims 1 to 3.

5. In the picking-up step, the base film is pushed up with a pushing-up amount of 300 μm or more in a pushing-up direction intersecting the expansion direction, and each of the plurality of support members is picked up; The method for manufacturing a support member according to any one of Claims 1 to 4.

6. The tensile elastic modulus of the adhesive film is 8.0 MPa or more; The method for manufacturing a support member according to any one of Claims 1 to 5.

7. The adhesive film contains polyimide; The method for manufacturing a support member according to any one of Claims 1 to 6.

8. The adhesive film includes a pair of surface layers made of a cured product of a thermosetting resin composition, and an intermediate layer disposed between the pair of surface layers; The method for manufacturing a support member according to any one of Claims 1 to 7.

9. wherein the intermediate layer is a polyimide layer or a metal layer The method for manufacturing a support member according to claim 8

10. A method for manufacturing a semiconductor device, comprising manufacturing a semiconductor device using a support member manufactured by the method for manufacturing a support member according to any one of claims 1 to 9

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