Electronic component, method for manufacturing electronic component, and traceability system

Abstract

An electronic component 1 comprising an element body 10 and external electrodes 21, 22 that are provided on the element body 10, wherein metal particles 31 having a particle radius of 10-1000 nm are disposed on the element body 10 so as to form a code 30.

Description

Technical Field

[0001] The present invention relates to an electronic component, a method for manufacturing an electronic component, and a traceability system.

Background Art

[0002] In recent years, circular economy has been socially demanded. Also, the amount of electronic waste (E-Waste) has been increasing year by year. However, mounted electronic components are often pulverized and discarded. In order to recycle this, it is important to know what kind of components the electronic components removed from the waste electronic substrate are, where they were made, and what materials (components) they contain.

[0003] Patent Document 1 describes a traceability system for electronic components that are produced in batches for each lot and stored in a plurality of reels in each lot, the system including a lot number input device, an identification mark reader that reads a unique identification mark attached to each reel body, a host computer that associates reel unit traceability information and lot unit traceability information with the identification mark for each reel, and a user terminal that acquires the lot unit traceability information and the reel unit traceability information for each reel based on the identification mark.

[0004] Patent Document 2 describes an electronic component having an authentication pattern formed on an exposed surface, the authentication pattern including a base portion containing resin and colored grains having distinguishable color tones within the base portion, and the colored grains forming a dot pattern dispersed within the base portion.

[0005] Patent Document 3 describes a small electronic component in which a lot number consisting of the manufacturing date and serial number of the component is represented by a painted pattern distinguished by a symbol that can be identified even when overlaid, and the lot code is represented by a grid display in which the numbers are represented by the positions of the grid.

[0006] Patent Document 4 describes a laminated chip component including a body having a laminated structure including a plurality of ceramic layers, provided with a code including a plurality of dot-shaped depressions arranged on a main surface orthogonal to the lamination direction, and the dot-shaped depressions having a semi-circular cross-sectional shape.

[0007] Patent Document 5 describes a method for manufacturing a laminated chip component, including a step of forming a code indicating information for identifying at least an intermediate product in a previous stage and information for identifying a final product after singulation on each of a plurality of singulation regions on a main surface of a laminated substrate in which a plurality of green sheets are laminated, a step of singulating the laminated substrate for each of the singulation regions to form a plurality of green chips, and a step of forming the green chips into a laminated chip component as a final product.

Prior Art Documents

Patent Documents

[0008]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Patent Document 5

Summary of the Invention

Problems to be Solved by the Invention

[0009] However, in the case of lot description in units of reels, after each component is mounted on a substrate, its history cannot be confirmed when recovered from the market. Also, since the seal attached to the reel can be replaced, forgery is easy.

[0010] For large units such as semiconductor chips and their modules, markings such as printing are possible, but it is difficult for small components. With a coating method such as inkjet, the area of the printed part is on the order of mm.

[0011] When the base body is cut by laser processing or the like, there is a risk of a decrease in mechanical strength, characteristic abnormalities and appearance defects due to adsorption of contaminants in the process of cutting the base body. Also, when processing an unfired green sheet, since deformation occurs after firing, it may lead to a decrease in the identification accuracy of the code. Furthermore, there are subsequent barrel processes for chamfering the product and coating and plating processes for forming external electrodes, etc., and there is also a risk of a decrease in the yield in those processes.

[0012] The present invention has been made to solve the above problems, and an object thereof is to provide an electronic component capable of suppressing a decrease in mechanical strength, a method for manufacturing an electronic component, and a traceability system.

Means for Solving the Problems

[0013] In a first aspect, the present invention is an electronic component including a base body and an external electrode provided on the base body, wherein metal particles having a particle radius of 10 nm or more and 1000 nm or less are arranged on the base body so as to form a code.

[0014] In a second aspect, the present invention is an electronic component including a base body and an external electrode provided on the base body, wherein depressions having a radius of 10 nm or more and 1000 nm or less in plan view are arranged on the base body so as to form a code.

[0015] In a third aspect, the present invention relates to a method for manufacturing an electronic component according to the first aspect, including the steps of preparing a solution containing metal ions, filling the solution into a cylindrical probe having an electrode disposed therein, controlling the X point, Y point, and Z point of the probe, bringing the tip of the probe close to the element of the electronic component, bringing the solution discharged from the tip of the probe into contact with the element to form a meniscus between the element and the probe, and applying a voltage between the external electrode of the electronic component and the electrode in a state where the meniscus is formed to deposit metal particles on the element.

[0016] In a fourth aspect, the present invention relates to a method for manufacturing an electronic component according to the second aspect, including the steps of preparing a solution containing a strong acid, filling the solution into a cylindrical probe, controlling the X point, Y point, and Z point of the probe, bringing the tip of the probe close to the element of the electronic component, bringing the solution discharged from the tip of the probe into contact with the element to form a meniscus between the element and the probe, and dissolving a part of the element in a state where the meniscus is formed to form a depression on the element.

[0017] In a fifth aspect, the code indicates information including the type of the electronic component. The present invention provides a traceability system including a code reader that reads the code of the electronic component according to the first or second aspect, a database that stores component processing information specifying a processing method after use of the electronic component for each type of the electronic component, and an information processing device that collates the type of the electronic component read by the code reader with the component processing information in the database to determine a processing method after use of the electronic component.

Advantages of the Invention

[0018] According to the present invention, it is possible to provide an electronic component, a method for manufacturing an electronic component, and a traceability system capable of suppressing a decrease in mechanical strength.

Brief Description of the Drawings

[0019]

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Embodiments for Carrying Out the Invention

[0020] Hereinafter, the electronic component, the method for manufacturing an electronic component, and the traceability system of the present invention will be described. However, the present invention is not limited to the following configurations, and can be appropriately modified and applied without changing the gist of the present invention. In addition, a combination of two or more of the individual desirable configurations described below is also the present invention.

[0021] (Electronic Component) First, an electronic component according to an embodiment of the present invention will be described. FIG. 1 is a perspective view schematically showing an example of an electronic component according to an embodiment of the present invention.

[0022] The electronic component 1 shown in FIG. 1 is a small chip-type electronic component (surface-mount type electronic component), and includes a body 10 and external electrodes 21 and 22 provided on the body 10.

[0023] The size of the electronic component 1 is not particularly limited, and for example, it may be of 1005 size, 0603 size, 0402 size, 0201 size, etc.

[0024] The specific type of the electronic component 1 is not particularly limited. Specifically, for example, laminated ceramic electronic components such as laminated ceramic capacitors, laminated coils, laminated thermistors, laminated varistors, laminated LC filters, and laminated piezoelectric filters can be mentioned.

[0025] In this case, the body 10 preferably comprises a laminate in which at least one of a dielectric ceramic layer, a magnetic ceramic layer, a piezoelectric ceramic layer, and a semiconductor ceramic layer is laminated with an internal electrode layer as an internal conductor.

[0026] Also, the electronic component 1 may not be a laminated component as described above. Specific examples in that case include, for example, silicon capacitors, ferrite type coils, inductors made of a composite material of metal powder and resin, and the like.

[0027] The body 10 includes a dielectric layer 11 and an internal conductor (internal electrode layer, not shown in FIG. 1), and has a top surface 10a and a bottom surface 10b facing each other in the height direction T, a first side surface 10c and a second side surface 10d facing each other in the length direction L orthogonal to the height direction T, and a third side surface 10e and a fourth side surface 10f facing each other in the width direction W orthogonal to the height direction T and the length direction L.

[0028] As described above, the base body 10 has a substantially rectangular parallelepiped outer shape, but the corners and the ridge lines may be rounded. The corner is the part where three surfaces of the base body 10 intersect, and the ridge line is the part where two surfaces of the base body 10 intersect.

[0029] The electronic component 1 is mounted on the mounting substrate such that the bottom surface 10b faces the mounting surface of the mounting substrate. That is, the bottom surface 10b is the mounting surface.

[0030] Note that the areas of the top surface 10a and the bottom surface 10b may be substantially the same as or different from the areas of the third side surface 10e and the fourth side surface 10f. Also, the areas of the first side surface 10c and the second side surface 10d may be substantially the same as or different from the areas of the third side surface 10e and the fourth side surface 10f.

[0031] Excluding the exposed portions of the internal conductors, the surface of the base body 10 is composed of the dielectric layer 11.

[0032] The dielectric layer 11 can be formed of, for example, a dielectric material (oxide). The dielectric material can be appropriately selected according to the type of the electronic component 1, and examples thereof include a dielectric ceramic material, a magnetic ceramic material, a piezoelectric ceramic material, and a semiconductor ceramic material.

[0033] Examples of the dielectric ceramic material include those containing a main component such as barium titanate, calcium titanate, strontium titanate, barium calcium titanate, or calcium zirconate. When containing the above dielectric ceramic material as the main component, the electronic component 1 can function as a multilayer ceramic capacitor. However, depending on the desired characteristics of the multilayer ceramic capacitor, for example, those obtained by adding a sub-component having a smaller content than the main components such as Mg compound, Mn compound, Si compound, Al compound, V compound, Ni compound, and rare earth compound may be used.

[0034] Examples of the magnetic ceramic material include those containing a main component such as a ferrite ceramic material. When the magnetic ceramic material is used, the electronic component 1 can function as a multilayer coil.

[0035] Specific examples of the piezoelectric ceramic material include, for example, PZT (lead zirconate titanate) - based ceramic materials and the like. When the piezoelectric ceramic material is used, the electronic component 1 can function as a multilayer piezoelectric filter.

[0036] Specific examples of the semiconductor ceramic material include, for example, spinel - based ceramic materials and the like. When the semiconductor ceramic material is used, the electronic component 1 can function as a multilayer thermistor.

[0037] The external electrodes 21 and 22 are provided on the surface of the element body 10.

[0038] The external electrode 21 is provided on the first side surface 10c of the element body 10. In FIG. 1, the external electrode 21 extends from the first side surface 10c of the element body 10 to each of the top surface 10a, the bottom surface 10b, the third side surface 10e, and the fourth side surface 10f. The external electrode 21 is electrically connected to the internal conductor exposed from the element body 10 on the first side surface 10c.

[0039] The external electrode 22 is provided on the second side surface 10d of the element body 10. In FIG. 1, the external electrode 22 extends from the second side surface 10d of the element body 10 to each of the top surface 10a, the bottom surface 10b, the third side surface 10e, and the fourth side surface 10f. The external electrode 22 is electrically connected to the internal conductor exposed from the element body 10 on the second side surface 10d.

[0040] FIG. 2 is an example of a cross - sectional view taken along the line A - A of the electronic component shown in FIG. 1. In FIG. 2, the illustration of the internal conductor of the element body 10 is omitted.

[0041] As shown in Fig. 2, the external electrodes 21 and 22 have a resin electrode layer 23 containing a conductive component and a resin component. The conductive component mainly contains a single metal such as silver, copper, nickel, tin, or an alloy containing at least one of these metals. The resin component mainly contains an epoxy resin, a phenolic resin, or the like. The resin electrode layer can be formed, for example, using a conductive paste such as a silver paste.

[0042] Note that the external electrodes 21 and 22 may have a baked electrode layer of copper or silver instead of the resin electrode layer 23. Specifically, the baked electrode layer of copper or silver is an electrode formed by baking a paste material of copper or silver containing a glass component.

[0043] Also, the external electrodes 21 and 22 have a so-called plating layer formed by a plating method on the resin electrode layer 23 (or it may be a baked electrode layer of copper or silver. The same applies hereinafter). Specifically, it has a Ni plating layer 24 provided so as to cover the resin electrode layer 23 and a Sn plating layer 26 as the outermost layer 25 provided so as to cover the Ni plating layer 24.

[0044] Note that as the outermost layer 25 of the external electrodes 21 and 22, an Au plating layer may be provided instead of the Sn plating layer 26.

[0045] Also, in the present invention, the external electrode may be provided on a part of the surface of the body, and its arrangement location is not particularly limited. For example, it may be arranged only on the bottom surface of the body, or it may be arranged so as to cover a part of any side surface of the body and extend from the side surface to cover a part of the bottom surface (L-shaped in cross-section), or it may be arranged so as to cover a part or all of any side surface of the body and extend from the side surface to cover a part of the top surface and a part of the bottom surface (U-shaped (C-shaped) in cross-section).

[0046] Also, in the present invention, the number of external electrodes is not particularly limited, and at least one external electrode may be provided for the body. For example, four external electrodes may be provided for the body (4 terminals), or six external electrodes may be provided for the body (6 terminals).

[0047] Figure 3 is another example of the cross-sectional view taken along line A-A of the electronic component shown in Figure 1, showing the case where the electronic component is a multilayer ceramic capacitor.

[0048] In this case, the body 10 is a laminate in which a dielectric ceramic layer 12 as a dielectric layer and internal electrode layers 13 and 14 as internal conductors are laminated.

[0049] The internal electrode layer 13 is drawn out to the first side surface 10c of the body 10 and connected to the external electrode 21, and the internal electrode layer 14 is drawn out to the second side surface 10d of the body 10 and connected to the external electrode 22.

[0050] The dielectric ceramic layer 12 can be obtained by sheet-forming a dielectric slurry containing a dielectric ceramic material and an organic solvent.

[0051] The internal electrode layers 13 and 14 can be obtained by printing an electrode paste containing a conductive component. The internal electrode layers 13 and 14 are preferably Ni electrode layers using Ni as the conductive component.

[0052] Also, it may be an Ag electrode layer, a Pd electrode layer, or a Cu electrode layer instead of the Ni electrode layer.

[0053] Figure 4 is an enlarged plan view of the code formation portion of the electronic component shown in Figure 1. Figure 5 is an example of the cross-sectional view taken along line B-B of the electronic component shown in Figure 4.

[0054] As shown in FIGS. 1 to 5, metal particles 31 having a particle radius of 10 nm or more and 1000 nm or less are arranged on the base body 10 so as to form the code 30. Thus, since the code 30 is formed of fine metal particles on the base body 10, it is possible to suppress a decrease in the mechanical strength of the electronic component 1, and it is difficult to easily forge the code 30. Further, since the code 30 formed by the metal particles 31 is provided for each electronic component 1, it is possible to check the identification information and history information of each electronic component 1. Further, since the code 30 formed by the metal particles 31 can be formed in a very narrow region, it can also be provided for small electronic components. Further, since it is not necessary to cut the base body 10, it is possible to prevent characteristic abnormalities and appearance defects associated with the adsorption of contaminants. Furthermore, since the code 30 formed by the metal particles 31 can be formed after firing the base body 10 as described later, it is also possible to prevent a decrease in the identification accuracy of the code 30 due to deformation caused by firing.

[0055] Note that the metal particles 31 and metal particles 41 described later can be observed, for example, with a scanning electron microscope (SEM) or a microscope capable of magnifying 5000 times or more, and the particle radius thereof can also be measured based on the observation image. Specifically, the radius measured when the metal particles 31 and 41 are viewed in plan view (observed from a direction orthogonal to the surface of the base body 10) in the above observation image is defined as their particle radius. Note that the metal particles 31 and 41 have a circular, elliptical or other shape in plan view, but when they have different radii, the shortest length is defined as the particle radius.

[0056] The code 30 is a two-dimensional code that follows rules such as a DataMatrix code, a QR Code (registered trademark), a MicroQR code, etc., and is formed in a rectangular area. The code 30 may be matrix type or stack type. In the code 30, the data cell representing the minimum unit of data is dot-shaped (it may also be triangular or square-shaped), and metal particles 31 are provided as dots in some of the data cells. That is, the code 30 is formed by an aggregate of a plurality of arranged metal particles 31. In the case shown in FIG. 1, the number of metal particles 31 constituting each dot is one, and one metal particle 31 is arranged for one data cell.

[0057] FIG. 6 is a plan view schematically showing a modified example of the electronic component shown in FIG. 1, and is an enlarged view of the code formation part.

[0058] As shown in FIG. 6, the number of metal particles 31 constituting each dot may be plural, and a plurality of metal particles 31 may be arranged for one data cell.

[0059] The placement location of the code 30 is not particularly limited, but it is preferably on any one of the top surface 10a, the bottom surface 10b, the third side surface 10e, and the fourth side surface 10f, and more preferably on any one of the top surface 10a, the third side surface 10e, and the fourth side surface 10f.

[0060] As shown in FIG. 4, the code 30 is preferably arranged within a range d1 of 100 μm or less (more preferably 50 μm or less) from the external electrode 22 (or 21). Thereby, it is possible to easily deposit the metal particles 31 by utilizing the leakage current from the external electrode 22 (or 21) by the manufacturing method described later.

[0061] The information indicated by the code 30 includes, for example, the part ID which is information for identifying the electronic component 1, the type information which is information indicating the type of the electronic component 1, and the material information which is information indicating the material contained in the electronic component 1.

[0062] Note that the variety information may be information directly indicating the variety of the electronic component 1, such as the variety name, or may be information indirectly indicating the variety of the electronic component 1, such as the variety number set according to each variety. The same applies to the material information.

[0063] The particle radius of the metal particles 31 is preferably 10 nm or more and 1000 nm or less, and more preferably 100 nm or more and 500 nm or less.

[0064] The shape of the metal particles 31 is usually spherical, oblate, hemispherical, disk-shaped with a concave center on both sides, snowman-shaped, etc. When it is hemispherical, the metal particles 31 are usually arranged on the base body 10 so that its flat part is in contact with the base body 10 on the surface.

[0065] The material of the metal particles 31 is not particularly limited, and examples include Ni, Cu, Au, Ag, etc. Among them, from the viewpoints of having a melting point equal to or higher than the temperature at the time of mounting (for example, 250 °C) and being inexpensive, Ni and Cu are preferable.

[0066] Since the metal particles 31 and the base body 10 are made of different materials in this way, an image with light and dark can be obtained between the metal particles 31 and the base body 10, and the code 30 can be read based on the image.

[0067] FIG. 7 is a plan view schematically showing another modification of the electronic component shown in FIG. 1, and is an enlarged view of the code formation portion. FIG. 8 is an example of a cross-sectional view taken along line C-C of the electronic component shown in FIG. 7.

[0068] As shown in FIGS. 7 and 8, metal particles 41 having a particle radius different from that of the metal particles 31 forming the code 30 may be arranged on the base body 10 so as to form a frame portion 40 surrounding the code 30. Thereby, since the formation range of the code 30 can be more easily specified, the reading of the code 30 becomes easier. The frame portion 40 can be, for example, rectangular.

[0069] The particle radius of the metal particles 41 forming the frame portion 40 is preferably larger than the particle radius of the metal particles 31 forming the cord 30. Specifically, the particle radius of the metal particles 41 is preferably 100 nm or more and 1000 nm or less, more preferably 200 nm or more and 1000 nm or less, and still more preferably 500 nm or more and 1000 nm or less.

[0070] The shape of the metal particles 41 is usually spherical, oblate, hemispherical, disk-shaped with both central surfaces concave, snowman-shaped, or the like. In the case of hemispherical, the metal particles 41 are usually arranged on the base body 10 such that their flat portions are in contact with the base body 10 in a plane. The metal particles 31 and the metal particles 41 may have different shapes from each other or may have substantially the same shape.

[0071] The material of the metal particles 41 is not particularly limited, and examples include Ni, Cu, Au, Ag, etc. Among them, from the viewpoints of having a melting point equal to or higher than the temperature at the time of mounting (for example, 250 ° C) and being inexpensive, Ni and Cu are preferable. The materials of the metal particles 31 and the metal particles 41 may be different from each other or may be substantially the same.

[0072] FIG. 9 is a cross-sectional view schematically showing still another modified example of the electronic component shown in FIG. 1, and is an enlarged view of the cord forming portion.

[0073] As shown in FIG. 9, a glass coat film 50 covering the metal particles 31 forming the cord 30 may be further provided on the base body 10. Thereby, since it is possible to effectively prevent the metal particles 31 from falling off from the surface of the base body 10, it is possible to effectively prevent a decrease in the identification accuracy of the cord 30 caused by the falling off of the metal particles 31. The shape of the glass coat film 50 can be the same as the shape of the formation region of the cord 30, for example, rectangular.

[0074] The type of glass constituting the glass coating film 50 is not particularly limited, and examples thereof include those having a composition containing SiO2, TiO2, Al2O3, etc., mixtures thereof, various additives, fillers, and the like. Among them, glass mainly composed of SiO2 is easy to collect and has a wide composition range including additives.

[0075] The film thickness of the glass coating film 50 is not particularly limited, but it is preferably 50 nm or more and 3000 nm or less, more preferably 300 nm or more and 2000 nm or less, and still more preferably 500 nm or more and 1500 nm or less.

[0076] In addition, when forming the frame portion 40, the glass coating film 50 preferably covers the frame portion 40 together with the cord 30.

[0077] FIG. 10 is a cross-sectional view schematically showing still another modified example of the electronic component shown in FIG. 1, and is an enlarged view of the cord forming portion. FIG. 11 is an example of a cross-sectional view taken along line D-D of the electronic component shown in FIG. 10.

[0078] As shown in FIGS. 10 and 11, depressions 32 having a radius of 10 nm or more and 1000 nm or less in plan view may be arranged on the base body 10 so as to form the code 30. That is, such depressions 32 may be arranged as dots provided in the data cells of the code 30 instead of the metal particles 31, and the code 30 may be formed by an aggregate of a plurality of arranged depressions 32. Although the depression 32 is provided by partially removing the surface of the base body 10, since it is very fine, even in this case, a decrease in the mechanical strength of the electronic component 1 can be suppressed, and it is difficult to easily forge the code 30. In addition, since the code 30 formed by the depression 32 is provided for each electronic component 1, it is possible to check the identification information and history information of the component for each electronic component 1. In addition, since the code 30 formed by the depression 32 can be formed in a very narrow area, it can also be provided in a small electronic component. Further, since the depression 32 can be formed by local dissolution of the base body 10 as described later, it is possible to prevent characteristic abnormalities and appearance defects associated with the adsorption of contaminants. Furthermore, since the code 30 formed by the depression 32 can be formed after firing of the base body 10 as described later, it is also possible to prevent a decrease in the identification accuracy of the code 30 due to deformation caused by firing.

[0079] Note that the depression 32 and the depression 42 described later can be observed, for example, with a scanning electron microscope (SEM) or a microscope capable of magnifying 5000 times or more, and their radii can also be measured based on the observation image. Specifically, the radii are the radii measured when the depressions 32 and 42 are viewed in plan view (observed from a direction orthogonal to the surface of the base body 10) in the above observation image. Note that although the depressions 32 and 42 are circular or elliptical in plan view, when they have different radii, the shortest length is defined as the radius.

[0080] In the case shown in FIG. 10, there is one depression 32 constituting each dot, and one depression 32 is arranged for one data cell.

[0081] However, similar to the case of the metal particles 31 shown in FIG. 6, there may be a plurality of depressions 32 that constitute each dot, and a plurality of depressions 32 may be arranged for one data cell.

[0082] As shown in FIG. 10, similar to the case of the metal particles 31, the code 30 is preferably arranged within a range d1 of 100 μm or less (more preferably 50 μm or less) from the external electrode 22 (or 21). Thereby, it is possible to easily deposit the depression 32 by utilizing the leakage current from the external electrode 22 (or 21) by the manufacturing method described later.

[0083] The radius of the depression 32 in plan view is preferably 10 nm or more and 1000 nm or less, and more preferably 100 nm or more and 500 nm or less.

[0084] The shape of the depression 32 in plan view is usually circular, but may be elliptical.

[0085] The depth of the depression 32 is not particularly limited, but is preferably 10 nm or more and 1000 nm or less, more preferably 50 nm or more and 500 nm or less, and still more preferably 100 nm or more and 300 nm or less.

[0086] Since the depression 32 is formed on the surface of the base body 10 in this way, an image with light and dark areas can be obtained between the depression 32 and the area other than the depression 32 of the base body 10, and the code 30 can be read based on the image.

[0087] FIG. 12 is a plan view schematically showing another modification of the electronic component shown in FIG. 1, and is an enlarged view of the code formation portion. FIG. 13 is an example of a cross-sectional view taken along line E-E of the electronic component shown in FIG. 12.

[0088] As shown in FIGS. 12 and 13, on the base body 10, a recess 42 having a radius different from that of the recess 32 in plan view may be arranged so as to form a frame portion 40 surrounding the code 30. Thereby, since the formation range of the code 30 can be specified more easily, the reading of the code 30 becomes easier. The frame portion 40 can be, for example, rectangular.

[0089] The radius of the recess 42 forming the frame portion 40 in plan view is preferably larger than the radius of the recess 32 forming the code 30 in plan view. Specifically, the radius of the recess 42 in plan view is preferably 100 nm or more and 1000 nm or less, more preferably 200 nm or more and 1000 nm or less, and still more preferably 500 nm or more and 1000 nm or less.

[0090] The shape of the recess 42 in plan view is usually circular, but may be elliptical. The shapes of the recess 32 and the recess 42 in plan view may be different from each other or may be substantially the same.

[0091] The depth of the recess 42 forming the frame portion 40 is not particularly limited, but is preferably 100 nm or more and 1000 nm or less, more preferably 200 nm or more and 500 nm or less, and still more preferably 30 nm or more and 500 nm or less.

[0092] (Method for manufacturing an electronic component) Next, a method for manufacturing an electronic component according to an embodiment of the present invention will be described.

[0093] The method for manufacturing an electronic component according to an embodiment of the present invention is the method for manufacturing the electronic component 1 according to the above embodiment.

[0094] First, a solution containing metal ions is prepared.

[0095] Examples of the metal ions include Ni ions, Cu ions, Au ions, Ag ions, etc. Among them, from the viewpoints that the metal has a melting point equal to or higher than the temperature during mounting (e.g., 250 °C) and is inexpensive, Ni ions and Cu ions are preferred.

[0096] As the solution containing metal ions, for example, a nickel sulfate bath, a nickel sulfamate bath, a copper sulfate bath, a copper pyrophosphate bath, a gold cyanide bath, a sodium gold sulfite bath, a silver cyanide bath, a silver methanesulfonate bath, etc. can be used.

[0097] The concentration of the metal ions in the solution is not particularly limited, but it is preferably 0.1 mol / L or more and 2 mol / L or less, and more preferably 0.5 mol / L or more and 1.5 mol / L or less.

[0098] FIG. 14 is a cross-sectional view schematically showing an example of a mode of filling a solution into a probe in the method for manufacturing an electronic component according to an embodiment of the present invention. FIG. 15 is a cross-sectional view schematically showing an example of an apparatus used in the method for manufacturing an electronic component according to an embodiment of the present invention. In FIG. 15 and FIG. 16 described later, illustration of the internal conductor of the element body 10 is omitted.

[0099] Next, as shown in FIG. 14, the above-described solution 61 is filled into a cylindrical probe 63 in which an electrode 62 is disposed inside. The probe 63 has a tapered cylindrical shape toward the tip, and a rod-shaped electrode 62 is fixed in a state of being inserted into the internal space thereof.

[0100] An opening having a circular shape in plan view is provided at the tip of the probe 63. The tip diameter (radius of the opening) of the probe 63 is preferably 10 nm or more and 1000 nm or less, and more preferably 100 nm or more and 500 nm or less.

[0101] As shown in FIG. 14, one end of the electrode 62 is inserted near the tip of the probe 63, and as shown in FIG. 15, the other end is electrically connected to the power supply means 64. The material of the electrode 62 is not particularly limited, and for example, a general reference electrode such as a hydrogen electrode or a silver-silver chloride electrode can be used. The distance d2 between one end of the electrode 62 and the tip of the probe 63 is preferably 1 μm or more and 100 μm or less, and more preferably 10 μm or more and 50 μm or less.

[0102] The electronic component 1A shown in FIG. 15 corresponds to the electronic component 1 at the stage before forming the cord 30 (the same as the electronic component 1 except that the cord 30 is not formed), and is arranged such that the external electrodes 21 and 22 are in contact with the power supply plate 65 for electrical supply. That is, the electronic component 1A is an electronic component after firing and being singulated. The power supply plate 65 for electrical supply is electrically connected to the power supply means 64.

[0103] A position control device (not shown) for controlling the position of the probe 63 in the three-dimensional space is connected to the probe 63. The position control device includes, for example, a Z-axis stage that holds the probe 63 so as to be movable in the Z direction (vertical direction, for example, the height direction T), an XY-axis stage that holds the placed power supply plate 65 so as to be movable in the XY direction (horizontal direction, for example, the directions parallel to the length direction L and the width direction W), and a controller that controls the Z-axis stage and the XY-axis stage.

[0104] FIG. 16 is a cross-sectional view schematically showing an example of a mode in which the tip of the probe approaches the element body of the electronic component in the method for manufacturing an electronic component according to an embodiment of the present invention. FIG. 17 is a cross-sectional view schematically showing an example of a mode in which a meniscus is formed between the element body and the probe in the method for manufacturing an electronic component according to an embodiment of the present invention.

[0105] Next, as shown in FIG. 16, control the X, Y, and Z points of the probe 63 to bring the tip of the probe 63 closer to the body 10 of the electronic component 1A (probe position control step). That is, move the probe 63 by the position control device and place its tip above the region where the metal particles of the body 10 are to be formed.

[0106] Thereafter, as shown in FIG. 17, bring the solution 61 emitted from the tip of the probe 63 into contact with the body 10. That is, move the probe 63 downward by the position control device until the solution 61 contacts the body 10. Then, form a meniscus 66 between the body 10 and the probe 63 (meniscus formation step). As a result, the solution 61 does not spread infinitely wet on the body 10 but stays on the body 10 due to its surface tension and becomes hemispherical. The amount of the solution 61 in contact with the body 10 is extremely small.

[0107] At this time, the shortest distance d3 between the tip of the probe 63 and the body 10 is preferably 15 nm or more and 1500 nm or less, more preferably 150 nm or more and 750 nm or less, and even more preferably 300 nm or more and 750 nm or less.

[0108] The radius of the meniscus 66 is not particularly limited, but is preferably 20 nm or more and 2000 nm or less, more preferably 50 nm or more and 1000 nm or less, and even more preferably 100 nm or more and 500 nm or less.

[0109] FIG. 18 is a cross-sectional view schematically showing an example of a mode of depositing metal particles on a body in a method for manufacturing an electronic component according to an embodiment of the present invention.

[0110] Next, as shown in FIG. 18, with the meniscus 66 formed, a voltage is applied between the external electrodes 21 and 22 of the electronic component 1A and the electrode 62 to deposit metal particles 31 on the base body 10 (metal particle deposition step). That is, when power is supplied to the external electrodes 21 and 22 and the electrode 62 by the power supply means 64, a leakage current is generated, and metal ions are reduced on the base body 10 to deposit the metal particles 31. Thereafter, the tip of the probe 63 is separated from the meniscus 66.

[0111] A pulsed voltage is applied to the external electrodes 21 and 22 and the electrode 62 in the cathode direction, and by controlling this voltage, the particle radius of the metal particles 31 can be controlled. Specifically, the larger the voltage value of the pulsed voltage and the longer the application time of the pulsed voltage, the larger the particle radius of the deposited metal particles 31 can be made respectively. Thereby, the metal particles 31 for forming the cord 30 and the metal particles 41 for forming the frame portion 40 can be separated.

[0112] The voltage of the pulsed voltage is preferably 1 V or more and 100 V or less, and more preferably 10 V or more and 50 V or less.

[0113] Also, the application time of the pulsed voltage is preferably 100 μs or more and 10 s or less, and more preferably 500 μs or more and 1 s or less.

[0114] Note that a predetermined voltage may be constantly applied to the external electrodes 21 and 22 and the electrode 62 from the stage before the solution 61 emitted from the tip of the probe 63 contacts the base body 10. Thereby, the leakage current generated at the moment when the solution 61 contacts the base body 10 can be detected, and the pulsed voltage may be applied in accordance with the detected timing to deposit the metal particles 31.

[0115] Also, this leakage current can be generated from conduction parts such as the external electrodes 21 and 22 and the internal electrode layers 13 and 14, but it is more effective to deposit the metal particles 31 by using the leakage current from the external electrode 22 (or 21). Therefore, as described above, it is preferable to arrange the cord 30 in the vicinity of the external electrode 22 (or 21).

[0116] FIG. 19 is a cross-sectional view schematically showing an example of a mode of scanning a probe on a substrate in a method for manufacturing an electronic component according to an embodiment of the present invention.

[0117] Thereafter, as shown in FIG. 19, by repeating the above-described position control step of the probe 63, the meniscus formation step, and the metal particle deposition step, the metal particles 31 can be deposited while controlling the particle radius and the arrangement. That is, it is possible to form the code 30 with the metal particles 31. Further, according to this method, even when there is a step on the substrate 10, the probe 63 can be scanned along the step to form the code 30.

[0118] FIG. 20 is a cross-sectional view schematically showing an example of a mode of forming a depression on a substrate in a method for manufacturing an electronic component according to an embodiment of the present invention.

[0119] In the above example, the metal particles 31 were deposited using the solution 61 containing metal ions. However, as shown in FIG. 20, a solution 67 containing a strong acid may be used instead of the solution 61. Then, a voltage may be applied between the external electrodes 21 and 22 of the electronic component 1A and the electrode 62 in a state where the meniscus 66 is formed, and a part of the substrate 10 may be dissolved to form a depression 32 on the substrate 10 (depression forming step).

[0120] The strong acid is an electrolyte that almost completely ionizes protons when it reaches equilibrium in the solution 67. Specifically, for example, hydrochloric acid, nitric acid, sulfuric acid, and a mixture thereof can be used. The solution 67 is usually an aqueous solution of a strong acid containing a strong acid and water.

[0121] The concentration of the strong acid in the solution 67 is not particularly limited, but is preferably 1 mol / L or more and 10 mol / L or less, and more preferably 2 mol / L or more and 5 mol / L or less.

[0122] The conditions are the same as those in the case of using the solution 61 containing metal ions.

[0123] In addition, even when using the solution 67, the larger the voltage value of the pulsed voltage (anode direction), and the longer the application time of the pulsed voltage, the larger the radius of the depression 32 can be respectively. Thereby, it is possible to distinguish between the depression 32 for forming the code 30 and the depression 42 for forming the frame portion 40.

[0124] However, when using the solution 67, it is not necessary to apply a voltage between the external electrodes 21, 22 and the electrode 62. That is, just by bringing the solution 67 into contact, a part of the base body 10 can be dissolved to form a depression 32 on the base body 10. In that case, the longer the contact time, the larger the radius of the depression 32 can be. However, from the viewpoint of controlling the shape of the depression 32, it is preferable to apply a voltage between the external electrodes 21, 22 and the electrode 62 even when using the solution 67.

[0125] According to the above method, since the code 30 can be formed after the barrel process for chamfering the corners of the electronic component 1 and the coating and plating processes for forming the external electrodes 21, 22, etc., it is possible to prevent a reduction in the yield in those processes.

[0126] FIG. 21 is a perspective view schematically showing another example of a method for manufacturing an electronic component according to an embodiment of the present invention.

[0127] In the above example, the mode of forming the code 30 for the individual electronic component 1 has been described. However, as shown in FIG. 21, the code 30 may be formed in each electronic component region at a stage before the semi-finished electronic component block 70 is separated into individual electronic components, and then the electronic component block 70 is cut to be separated into individual electronic components. In this case, for example, the dummy electrode 71 for energization is formed only on the top surface, the terminal 72 electrically connected to the power supply means 64 is brought into contact with the dummy electrode 71, after forming the code 30, it is separated into individual pieces, and then normal external electrodes may be formed including the side surface and the bottom surface. Thereby, the structure of the above-described electronic component 1 can be obtained.

[0128] (Traceability System) Next, a traceability system according to an embodiment of the present invention will be described. FIG. 22 is a diagram schematically showing an example of a traceability system according to an embodiment of the present invention.

[0129] The traceability system 100 shown in FIG. 22 includes a code reader 110, an information processing apparatus 120 communicably connected to the code reader 110 via a network, and a database 130 communicably connected to the information processing apparatus 120 via a network.

[0130] The code reader 110 reads the code 30 of the above-described electronic component 1. The code reader 110 includes, for example, an image acquisition unit (not shown) that acquires an image (gray image) of the code 30, a binarization unit that binarizes the acquired image of the code 30 to generate a binarized image, and an image processing unit (not shown) that performs a decoding process on the generated binarized image and restores the information indicated by the code 30.

[0131] The component ID, type information, and material information indicated by the code 30 are read by the code reader 110.

[0132] As the image acquisition unit of the code reader 110, for example, an optical microscope with a camera such as a microscope can be used. In addition, the image acquisition unit of the code reader 110 may include a scanning electron microscope (SEM).

[0133] The image processing unit of the code reader 110 is configured as a computer system including a CPU (Central Processing Unit), a memory, etc., and the above-described processing is realized by executing a predetermined software program in the CPU.

[0134] The database 130 stores (stores) component processing information that specifies a processing method after use of the electronic component for each type of the electronic component. Examples of the processing method after use include recycling, reuse, rebuild, disposal, etc. of the electronic component.

[0135] The information processing device 120 is configured as a computer system including a CPU, a memory, etc., and also includes an input device such as a keyboard and a mouse, and a display device such as a liquid crystal display.

[0136] The information processing device 120 collates the type of the electronic component 1 read by the code reader 110 with the component processing information in the database 130 to determine (search) the processing method after use of the electronic component 1. Then, the information processing device 120 outputs the determination result to the display device, and the user can confirm the processing method after use of the electronic component 1 on the display device.

[0137] The database 130 may store (memorize) component processing information specifying the processing method after use of the electronic component for each type and material of the electronic component. The information processing device 120 may also collate the type and material of the electronic component 1 read by the code reader 110 with the component processing information in the database 130 to determine the processing method after use of the electronic component 1.

[0138] In the above embodiment, the case where a two-dimensional code is provided as the code has been described. However, in the present invention, the code may be a one-dimensional code such as a bar code. In this case, each line of the one-dimensional code can be drawn using a plurality of metal particles or depressions.

[0139] Also, in the above embodiment, the case where the code is formed only from metal particles or depressions has been described. However, in the present invention, one code may be formed using both metal particles and depressions.

[0140] The following content is disclosed in this specification.

[0141] <1> An electronic component including a body and external electrodes provided on the body, wherein metal particles having a particle radius of 10 nm or more and 1000 nm or less are arranged on the body so as to form a code.

[0142] <2> The electronic component according to <1>, wherein metal particles having a particle radius different from that of the metal particles are arranged on the base body so as to form a frame portion surrounding the code.

[0143] <3> The electronic component according to <1> or <2>, further comprising a glass coat film covering the metal particles forming the code on the base body.

[0144] <4> The electronic component according to any one of <1> to <3>, wherein the code is arranged within a range of 100 μm or less from the external electrode.

[0145] <5> An electronic component comprising a base body and an external electrode provided on the base body, wherein depressions having a radius of 10 nm or more and 1000 nm or less in a plan view are arranged on the base body so as to form a code.

[0146] <6> The electronic component according to <5>, wherein depressions having a radius different from that of the depressions in a plan view are arranged on the base body so as to form a frame portion surrounding the code.

[0147] <7> The electronic component according to <5> or <6>, wherein the code is arranged within a range of 100 μm or less from the external electrode.

[0148] <8> The electronic component according to any one of <1> to <7>, wherein the code is a two-dimensional code.

[0149] <9> The electronic component according to any one of <1> to <8>, wherein the information indicated by the code includes information indicating the type of the electronic component.

[0150] <10> The electronic component according to <9>, wherein the information indicated by the code further includes information indicating the material of the electronic component.

[0151] <11> A method for manufacturing an electronic component according to any one of <1> to <10>, comprising: preparing a solution containing metal ions; filling the solution into a cylindrical probe having an electrode disposed therein; controlling the X point, Y point, and Z point of the probe to bring the tip of the probe close to the body of the electronic component; bringing the solution emerging from the tip of the probe into contact with the body to form a meniscus between the body and the probe; applying a voltage between the external electrode of the electronic component and the electrode in a state where the meniscus is formed to deposit metal particles on the body.

[0152] <12> A method for manufacturing an electronic component according to any one of <1> to <10>, comprising: preparing a solution containing a strong acid; filling the solution into a cylindrical probe; controlling the X point, Y point, and Z point of the probe to bring the tip of the probe close to the body of the electronic component; bringing the solution emerging from the tip of the probe into contact with the body to form a meniscus between the body and the probe; dissolving a part of the body in a state where the meniscus is formed to form a depression on the body.

[0153] <13> The probe has an electrode disposed therein, In the step of forming the depression, a voltage is applied between the external electrode of the electronic component and the electrode in a state where the meniscus is formed. The method for manufacturing an electronic component according to <12>.

[0154] <14> <9> or a code reader that reads the code of the electronic component described in <10>, a database that stores component processing information specifying a processing method after use of the electronic component for each type of the electronic component, and an information processing device that collates the type of the electronic component read by the code reader with the component processing information in the database to determine a processing method after use of the electronic component. A traceability system comprising the same. [Explanation of Signs]

[0155] 1, 1A Electronic component 10 Element body 10a Top surface 10b Bottom surface 10c First side surface 10d Second side surface 10e Third side surface 10f Fourth side surface 11 Dielectric layer 12 Dielectric ceramic layer 13, 14 Internal electrode layer 21, 22 External electrode 23 Resin electrode layer 24 Ni plating layer 25 Outermost layer 26 Sn plating layer 30 Code 31, 41 Metal particles 32, 42 Depressions 40 Frame portion 50 Glass coat film 61, 67 Solutions 62 Electrode 63 Probe 64 Electric supply means 65 Electric supply plate 66 Meniscus 70 Electronic component block 71 Dummy electrode 72 Terminal 100 Traceability system 110 Code reader 120 Information processing device 130 Database

Claims

1. A method for manufacturing an electronic component, comprising a base body and an external electrode provided on the base body, wherein metal particles having a particle radius of 10 nm or more and 1000 nm or less are arranged on the base body so as to form a code, the method comprising: preparing a solution containing metal ions; filling the solution into a cylindrical probe having an electrode disposed therein; controlling the X point, Y point, and Z point of the probe and bringing the tip of the probe close to the base body of the electronic component; bringing the solution emerging from the tip of the probe into contact with the base body to form a meniscus between the base body and the probe; applying a voltage between the external electrode of the electronic component and the electrode in a state where the meniscus is formed to deposit metal particles on the base body.

2. A method for manufacturing an electronic component, comprising a base body and an external electrode provided on the base body, wherein depressions having a radius of 10 nm or more and 1000 nm or less in plan view are arranged on the base body so as to form a code, the method comprising: preparing a solution containing a strong acid; filling the solution into a cylindrical probe; controlling the X point, Y point, and Z point of the probe and bringing the tip of the probe close to the base body of the electronic component; bringing the solution emerging from the tip of the probe into contact with the base body to form a meniscus between the base body and the probe; dissolving a part of the base body in a state where the meniscus is formed to form a depression on the base body.

3. The probe has an electrode disposed therein, and in the step of forming the depression, a voltage is applied between the external electrode of the electronic component and the electrode in a state where the meniscus is formed. The method for manufacturing an electronic component according to claim 2.

4. A code reader for reading a code of an electronic component, a database storing component processing information specifying a processing method after use of the electronic component for each type of the electronic component, and an information processing apparatus for collating the type of the electronic component read by the code reader with the component processing information in the database to determine a processing method after use of the electronic component. The electronic component includes a base body and an external electrode provided on the base body. On the base body, metal particles having a particle radius of 10 nm or more and 1000 nm or less, or depressions having a radius of 10 nm or more and 1000 nm or less in plan view are arranged so as to form a code. A traceability system in which the information indicated by the code includes information indicating the type of the electronic component.

Images