64results about "Encapsulating capacitors apparatus" patented technology

This invention discloses a surface-mount solid aluminum electrolytic capacitor and its manufacturing method, comprising a capacitor core package, which includes N capacitor cores, N+1 conductive metal meshes, a substrate, anode leads, cathode leads, and a silver paste covering tape. The capacitor core package is encapsulated and electroplated to form a solid aluminum electrolytic capacitor. The capacitor core includes an anode portion, a cathode portion, and an insulating barrier tape. In this invention, the conductive metal mesh sandwiched between the metal pads in the anode portion of the capacitor core and the cathode portion of the capacitor core can achieve the flatness of the core package. The silver paste covering tape located on the side of the cathode portion of the core package is embedded in the gap formed between two adjacent capacitor cores due to the conductive metal mesh sandwiched, forming an integrated connection. This prevents the resin encapsulant from being squeezed into the core layers during encapsulation, preventing core deformation damage that could lead to increased leakage current and increased ESR. Furthermore, it can prevent insufficient capacitance or even capacitor failure caused by delamination between cores.

Provided is a multilayer ceramic capacitor that maintains electrical characteristics and ensures sufficient mechanical strength. In a multilayer ceramic capacitor (1), in a surface layer region (400), a side edge portion (16) includes a first segregation substance (133) having silicon as a main component and having a major diameter of 10 nm to 50 nm, and a second segregation substance (135) having silicon as a main component and having a major diameter of 1 [mu] m or more, a plurality of second segregation substances (135) are present in a cross section, and in the surface layer region (400), an additive component is included. The additive component includes at least one of zirconium, aluminum, titanium, and calcium, and the concentration of the additive component in the surface layer region (400) is higher than the concentration of the additive component in the inner region (402).

The invention relates to a glue pouring positioning tool for a capacitor, which comprises a positioning frame, more than one positioning block and at least two locking strips, and is characterized in that the positioning frame is sleeved outside a shell of the capacitor and is positioned at the upper part of the shell; the locking bar is used for fixing the positioning frame on the upper part of the shell; the two end parts of the positioning block are connected with the upper end of the positioning frame, and the middle part of the positioning block is locked with a connecting terminal of a core group of the capacitor. According to the invention, the glue filling positioning tool is applied to the preparation process of the capacitor, so that the upper cover of the capacitor can be welded after glue filling is completed, the glue filling liquid level height and the glue curing effect can be confirmed in the glue filling process of the capacitor, and the glue filling liquid level height and the glue curing effect can meet the requirements; therefore, the yield of the capacitor is improved.

The invention relates to the technical field of capacitor generation, in particular to an automobile capacitor glue pouring packaging device. An automobile capacitor glue pouring packaging device comprises a conveying line used for conveying a capacitor body, a lifting mechanism used for lifting a capacitor to be processed is arranged at the front end of the conveying line, and the lifting mechanism lifts the capacitor to be processed to be equal to the conveying line in height and then transfers the capacitor to be processed into a glue pouring mechanism for glue pouring operation of the capacitor to be processed. And the capacitor after glue filling is transferred to the terminal bending mechanism for terminal bending, the capacitor after terminal bending is transferred to the terminal welding mechanism, the welded capacitor is transferred to the visual detection mechanism, and the capacitor after detection is guided out by the conveying line. A to-be-processed capacitor is lifted by the lifting mechanism to be flush with the conveying line and then is transferred, the to-be-processed capacitor is subjected to glue filling by the glue filling mechanism, shaping by the terminal bending mechanism and connection by the terminal welding mechanism, then the quality is screened by the visual inspection mechanism, qualified products are finally guided out by the conveying line, and packaging is completed.

The invention discloses a rubber coating device and a rubber coating method. The rubber coating device comprises a feeding mechanism, a bearing mechanism, a rubber taking mechanism and a rubber coating mechanism. The receiving mechanism is configured to receive and fix the to-be-encapsulated part from the feeding mechanism. The rubber taking mechanism comprises a feeding assembly and a material taking assembly, the feeding assembly is configured to load rubber coating materials, and the material taking assembly is configured to take out the rubber coating materials from the feeding assembly. The rubber coating mechanism comprises a cutting assembly and a rubber coating assembly, and the cutting assembly is configured to cut off the connection between the rubber coating material taken out by the material taking assembly and the rubber coating material on the material supply assembly, so that the material taking assembly takes the to-be-used rubber coating material with the preset length; the rubber coating assembly is configured to attach a to-be-used rubber coating material to the outer peripheral wall of the to-be-rubber-coated part. The receiving mechanism is further configured to drive the to-be-encapsulated part to rotate relative to the encapsulating mechanism under the condition that the to-be-used encapsulating material is attached to the peripheral wall of the to-be-encapsulated part through the encapsulating assembly, so that the peripheral wall of the to-be-encapsulated part is coated with the encapsulating material.

An electronic component (for example, an electrolytic capacitor) includes an internal element (for example, a capacitor element) and a packaging (for example, a case). The production lot for the internal element includes a plurality of subunits. The packaging is provided with an identifier for identifying the plurality of subunits. By this configuration, it is possible to provide an electronic component capable of specifying production information, a production method for the electronic component, a management method for the electronic component, and a program. The identifier may be provided on the packaging as a display. Further, the identifier may be a one-dimensional code or a two-dimensional code.

The invention discloses equipment and a method for synchronously attaching electrodes to two sides of a thin film capacitor core, and belongs to the field of thin film capacitors. A device for synchronously attaching electrodes to the two faces of a film capacitor core comprises a conveying table and a spraying table which are fixedly connected and a sliding way fixedly connected to the conveying table, a containing frame is slidably connected into the sliding way, the film capacitor core is placed in the containing frame, and a handle is arranged on the containing frame; the threaded rod is rotationally arranged on the baffle, the arc-shaped plate is fixedly arranged on the baffle, and the threaded rod rotates to enable the hook assembly to be connected with the lifting handle in a clamped mode; the spraying piece is arranged on the spraying table in a reciprocating motion mode, and a spraying gun is arranged on the spraying piece; according to the invention, a plurality of thin-film capacitor cores can be conveyed in a centralized manner through the placing frame, and the continuous feeding operation of the plurality of thin-film capacitor cores can be realized through the shifting plate and the threaded rod, so that the conditions of overlapping, vacancy, non-uniform thickness, spraying leakage or excessive spraying on an electrode attachment surface are avoided, and the electrode attachment effect and the qualification rate are ensured.

To provide a multilayer ceramic electronic component, a circuit board, and a manufacturing method for the multilayer ceramic electronic component that can achieve high reliability.SOLUTION: A multilayer ceramic electronic component 100 includes an element body 10 including a plurality of dielectric layers 11, and a plurality of internal electrode layers 12 that are laminated with the plurality of dielectric layers 11 interposed therebetween, and are provided so as to face each other and have one ends exposed, and an external electrode 20a and an external electrode 20b that are provided on respective end faces of the element body 10 being the ends in the direction in which the plurality of internal electrode layers 12 extend, are in contact with respective one ends of the plurality of internal electrode layers 12, and include glass 30. The external electrodes 20a and 20b include crystals 40 that contain at least one of the same elements as those contained in the plurality of dielectric layers 11 and are in contact with the element body 10 and the glass 30.SELECTED DRAWING: Figure 6

The invention discloses an aluminum electrolytic capacitor based on a ripple-resistant electrolyte and a preparation method thereof, and relates to the technical field of aluminum electrolytic capacitors. Comprising the following preparation steps: placing electrolytic paper between an anode foil and a cathode foil, winding to obtain a core, immersing the core in a ripple-resistant electrolyte for impregnation treatment, sealing the core after impregnation, putting the core into an aluminum shell, sealing the top with a rubber plug, and aging; the ripple-resistant electrolyte comprises the following raw materials in parts by mass: 40-60 parts of ethylene glycol, 3-5 parts of ammonium adipate, 1-5 parts of ammonium formate, 18-25 parts of an ammonium salt solution, 1.5-3 parts of composite polyester polyol, 3-6 parts of an additive, 1-3 parts of a flash fire improver, 0.5-1 part of a hydrogen elimination agent and 15-20 parts of deionized water.

The invention discloses a compact implanting system for chip capacitors. The compact implanting system comprises a feeding plate storage mechanism, an automatic discharging mechanism, an implanting mechanism, a leveling mechanism, a discharging buffering mechanism, a plate moving mechanism and a transferring mechanism. According to the compact implanting system of the chip capacitor, the operations of spreading, implanting and leveling of the capacitor which need to be manually completed in the traditional process are completely replaced, unmanned operation of the whole process from loading of the material loading plate to implanting completion is achieved, the labor cost can be effectively reduced through long-term operation, and the efficiency is improved. And meanwhile, product consistency fluctuation caused by manual operation difference is avoided. Besides, main procedures of the scheme adopt modular linear layout, material transfer among the main procedures is realized by the aid of a plate moving mechanism, and the whole equipment is small in occupied area, convenient to quickly deploy or transform in an existing production line, particularly applicable to small and medium-sized electronic component manufacturing workshops with limited spaces and high in production efficiency. And collaborative optimization of high efficiency, high yield, low cost and small occupied area is realized.

The invention relates to the technical field of conveying devices, in particular to a conveying device and method for packaging an aluminum electrolytic capacitor. The conveying device comprises a packaging assembly and a feeding disc in the packaging assembly, the outer side of the feeding disc is in transmission connection with an accelerator, the output end of the accelerator is in transmission connection with a rotating plate, and the outer side of the rotating plate is connected with a first bottom plate; connecting rods are fixed to the top of the first bottom plate, damping springs are arranged on the outer sides of the two connecting rods, buffering parts are slidably connected to the outer sides of the connecting rods, and supporting pieces are arranged on the tops of the buffering parts. The buffer part comprises a hollow ring at the bottom of the damping spring, the inner side of the hollow ring is rotatably connected with a side rod, side gears are fixed to the two sides of the side rod, a toothed plate is fixed to the bottom of the supporting piece, the inner side of the side rod is connected with a fixed rod, and the hollow ring is matched with the damping spring to reduce the acceleration of the aluminum electrolytic capacitor in the falling process. Meanwhile, the side gear and the toothed plate are matched to enable the side rod and the fixed rod to move from the bottom of the aluminum electrolytic capacitor to the outer side of the aluminum electrolytic capacitor to be finally separated, and the aluminum electrolytic capacitor is moved into the feeding disc.

The application discloses a kind of supercapacitor beam waist sealing equipment with detection function, belong to supercapacitor manufacturing equipment technical field, including for sealing capacitor beam waist sealing workbench, workbench is rotationally provided with work turntable, workbench is provided with for sealing capacitor loading and unloading beam die reset mechanism, workbench top is provided with for sealing capacitor sealing beam detection mechanism, beam die reset mechanism includes installation in the work turntable bottom station conversion seat.The application integrates mechanical structure and electrical control, clamping, beam waist sealing, performance detection, unloading and die reset and other multiple links in supercapacitor production are highly integrated and realized automation, break the traditional serial, separate process mode, and through integrated synchronous operation and turntable multi-station parallel design, under the premise of guaranteeing processing quality and detection accuracy, the leap-forward improvement of production efficiency is realized.

A multilayer ceramic capacitor includes a multilayer body including laminated ceramic layers and laminated inner electrode layers, a barrier film on the multilayer body; and outer electrodes on the barrier film at both end surfaces of the multilayer body. The ceramic layers include a perovskite compound represented by the general formula ABO3, where the A-site is Ba. The barrier film includes Ba and at least one of S or C. The barrier film covers main surfaces and side surfaces, and also covers the end surfaces except for exposed surfaces at which the inner electrode layers are exposed. The outer electrodes are in contact with the inner electrode layers at the exposed surfaces.

A film capacitor comprising a capacitor element that includes first metallized films electrically connected to a first termination and second metallized films electrically connected to a second termination, and a case within which the capacitor element is disposed, is provided. The case contains a polymer composition that includes 100 parts by weight of a polymer matrix that contains a polyarylene sulfide, from about 30 to about 90 parts by weight of inorganic fibers, and a zinc (II) compound.

To provide a manufacturing method of an electronic component and an electronic component holding jig capable of reducing the possibility of collision of the electronic component.SOLUTION: A manufacturing method of an electronic component 1 according to the present invention includes an electronic component preparation step of preparing an electronic component 1 including a laminate chip 1A having a dielectric layer 14 and an internal electrode 15 stacked thereon, an electronic component holding step of holding the electronic components 1 in an electronic component holding jig 200 in an aligned state spaced a predetermined distance apart from each other, a position information acquisition step of acquiring position information of the laminate chip 1A in the electronic component holding jig 200, a processing step of processing the electronic component 1 while the electronic component 1 is held in the electronic component holding jig 200, and an information linking step of linking the processing results of the electronic component 1 to the position information.SELECTED DRAWING: Figure 3

This application provides a sealing device and method for a chip-type three-terminal capacitive filter. The sealing device includes a slurry-coating plate, a slurry-coating mechanism, and a driving mechanism. The slurry-coating plate has a through hole for exposing the exposed portion of the inner electrode at the waist. The slurry-coating mechanism includes a slurry-coating roller, a slurry-bearing structure, and a slurry tray. The slurry-bearing structure has a slurry groove for carrying the end slurry, and the slurry tray has a strip-shaped groove on the side of the slurry tray near the slurry-coating plate. The slurry-coating roller is used to transfer the end slurry. The driving mechanism is connected to the slurry-coating plate and the slurry-coating mechanism. The driving mechanism is used to drive the slurry-coating roller to pick up the end slurry from the slurry groove and drive the slurry tray to move above the slurry-coating roller so that the end slurry is placed in the strip-shaped groove. The driving mechanism is used to drive the slurry tray with the end slurry to move directly above the slurry-coating plate so that the end slurry in the strip-shaped groove is squeezed onto the corresponding exposed portion of the inner electrode at the waist, thereby achieving the sealing effect of the grounding electrode.

The invention discloses an enhanced heat dissipation type box-type capacitor and a manufacturing method thereof, and relates to the technical field of capacitors, the enhanced heat dissipation type box-type capacitor comprises a hollow metal tube, a plurality of heat dissipation ribs are annularly arranged on the outer side wall of the hollow metal tube in the circumferential direction, the lower ends of the heat dissipation ribs penetrate into the hollow metal tube and are provided with limiting plates, and connecting rods are arranged in the hollow metal tube; the connecting rods abut against the limiting plates so as to support the heat dissipation ribs. The core cladding is formed by winding aluminum foil and a polypropylene raw film on the heat dissipation ribs in an overlapping manner, the two ends of the core cladding are sprayed with metal spraying materials and welded with leads, and the inner surface, the outer surface and the metal spraying surfaces at the two ends of the core cladding are sprayed with insulating ceramic layers; the box body is covered with a sealing cover, the core package is installed in the box body, the two ends of the hollow metal tube penetrate to the outer sides of the box body and the sealing cover respectively, the two ends of the heat dissipation ribs abut against the box body and the sealing cover respectively, and the lead penetrates to the outer side of the sealing cover. According to the invention, the heat dissipation efficiency is improved, and the problems of performance degradation and shortened service life are avoided.

This invention provides a packaging device that feeds material along the slicing path of a rotating powder tray. It comprises a material belt pulled by a traction mechanism, a heating mechanism, and an annular powder trough driven by a motor. Several evenly arranged components to be packaged adhere to the material belt. Turning mechanisms are located on both sides of the annular powder trough to direct the material belt into and out of the trough. After passing through the heating mechanism, the material belt enters the annular powder trough and forms a wrapping angle against the inner ring of the trough as it moves. This invention operates continuously using a strip-shaped material movement method. The powder adheres to the components to be packaged in a relatively static manner through the annular powder trough and the material belt, resulting in dust-free operation, energy saving, environmental friendliness, better packaging effect, higher efficiency, and reduced production costs.

The application provides a capacitor assembly and a preparation method thereof. The capacitor assembly has a simple structure and a simple preparation process. The capacitor structure comprises a first film layer, a second film layer and a capacitor core. The first film layer comprises a first metal layer and a first film layer. The first film layer is stacked on one side of the first metal layer and connected to the first metal layer. The second film layer comprises a second metal layer and a second film layer. The second film layer is stacked on one side of the second metal layer and connected to the second metal layer. The first film layer and the second film layer are stacked and co-wound on the capacitor core.

A film capacitor comprising a capacitor element that includes first metallized films electrically connected to a first termination and second metallized films electrically connected to a second termination, and a case within which the capacitor element is disposed, is provided. The case contains a polymer composition that includes 100 parts by weight of a polymer matrix that contains a polyarylene sulfide, from about 30 to about 90 parts by weight of inorganic fibers, and a zinc (II) compound.

The invention relates to the technical field of capacitors, and particularly discloses an anti-high-frequency large-current metallized film resonant capacitor, which comprises a capacitor roll core, the capacitor roll core comprises a first electrode layer and a second electrode layer, the first electrode layer comprises a first base film, a first metal layer and a second metal layer, and the second electrode layer comprises a second base film. A first gap is formed between the first metal layer and the second metal layer, the second electrode layer comprises a second base film, a third metal layer and a fourth metal layer, the third metal layer and the fourth metal layer are arranged on the second base film, a second gap is formed between the third metal layer and the fourth metal layer, and the first gap and the second gap are arranged in a staggered mode in the width direction of the first electrode layer. And the metal layers are matched to form a plurality of groups of capacitor unit structures connected in series. Through a plurality of groups of capacitor unit structures which are connected in series, the voltage and current impact borne by a single group of capacitors is effectively reduced, and the overall high-frequency-resistant and large-current-resistant performance is improved; dislocation gap arrangement can avoid local breakdown risks caused by alignment of adjacent layers of electrodes, and the insulation reliability is enhanced.

The invention relates to a thin film capacitor and a preparation process thereof, the thin film capacitor comprises an insulation assembly, and the insulation assembly comprises a first plastic part, a second plastic part and interelectrode insulation paper; the first plastic part is matched with the side wall of the metal shell, and the direct current terminals of the first busbar and the second busbar are fixed on the first plastic part, so that the first plastic part forms insulation barrier between the direct current terminals and the metal shell; the second plastic part is matched with the side wall of the metal shell, and the alternating current terminals of the first busbar and the second busbar are fixed on the second plastic part, so that the second plastic part forms insulation barrier between the alternating current terminals and the metal shell. Effective insulation barrier is established among the direct-current terminal, the alternating-current terminal and the metal shell, and it is ensured that a safe electrical gap and a creepage distance required by the design are always kept between a live part and the metal shell.

The invention provides a capacitor aluminum shell clamping device, and relates to the technical field of capacitor aluminum shell clamping, the capacitor aluminum shell clamping device comprises a collecting pipe installed on a fixing frame, the collecting pipe is in threaded connection with two flow slowing pipes, the flow slowing pipes are in threaded connection with threaded rings, the threaded rings are in sliding connection with follow-up sleeves, and the follow-up sleeves are in sliding connection with the follow-up sleeves. The capacitor aluminum shell clamping device comprises a follow-up sleeve, a flow slowing pipe is arranged in the follow-up sleeve, a control disc is fixedly arranged in the flow slowing pipe, a flow blocking disc is arranged on the follow-up sleeve, the flow blocking disc is attached to the control disc, a conical groove is formed in the flow blocking disc, and a threaded pipe is connected into the follow-up sleeve in a threaded mode. Through a liquid flow control and pressure distribution mechanism, uniform clamping and pressure self-adaptive adjustment of the soft aluminum shell are achieved, and the common problem of local stress concentration in a traditional clamping device in the innovative design is solved.

The application discloses a combined medium high-voltage multilayer porcelain dielectric capacitor and a preparation process thereof. The multilayer porcelain dielectric capacitor is prepared by stacking and firing a plurality of combined dielectric layers. The combined dielectric layers are stacked in the order of dielectric layer B, medium layer A and dielectric layer B to form a BAB structure. The dielectric layer B comprises a medium layer B and an electrode printed on the medium layer B. The medium layer A comprises the following raw materials: a barium titanate matrix A and a liquid modified dopant A. The liquid modified dopant A comprises the following raw materials: magnesium oxide, trimanganese tetroxide, rare earth oxide a, rare earth oxide b, barium carbonate, zirconium dioxide and SLV material. The porcelain dielectric capacitor prepared by the ceramic material defined in the application has excellent performances such as high dielectric constant (>=4500), smooth dielectric temperature characteristic curve (X7R requirement is met), low loss (<=3.0%), high insulation resistance (RC@25 DEG C >=5000 M omega*mu F), high voltage resistance (>150 V / um) and the like.

To provide a multilayer ceramic capacitor package for reducing a surface crack of a multilayer ceramic capacitor during packaging.SOLUTION: A multilayer ceramic capacitor package 100 in which a plurality of multilayer ceramic capacitors 10 are stored, comprises: a long-length-shaped carrier tape 200 provided with a plurality of recessed pockets 210 that are arranged in a longitudinal direction at equal intervals; a long-length-shaped cover tape 300 that is attached to the carrier tape 200 so as to cover openings of the plurality of pockets 210; and the plurality of multilayer ceramic capacitors 10 stored in the plurality of pockets 210, respectively. According to multilayer ceramic capacitors 10 adjacent to each other among the plurality of multilayer ceramic capacitors 10, a density difference between surfaces on opening sides of the pockets 210 is 0% or more and 4% or less.SELECTED DRAWING: Figure 1

Provided is a multilayer ceramic capacitor capable of ensuring moisture resistance reliability by suppressing infiltration of moisture from the outside to the inside of the multilayer ceramic capacitor, and capable of achieving a low resistance of ESR. A laminated ceramic capacitor (10) is provided with: a laminated body (12) in which a ceramic layer (14) and an internal electrode layer (16) are laminated; a barrier film (28) disposed on the laminated body (12); and external electrodes (24) disposed on the barrier film (28) on both end surfaces (12e, 12f) of the laminated body (12). The ceramic layer (14) contains a perovskite compound represented by the general formula ABO3, wherein the A site is Ba. The barrier film (28) contains Ba and at least one of S and C. The barrier film (28) covers both main surfaces (12a, 12b) and both side surfaces (12c, 12d), and covers both end surfaces (12e, 12f) excluding an exposed surface (29) from which the internal electrode layer (16) is exposed, and the external electrode (24) is in contact with the internal electrode layer (16) at the exposed surface (29).

The present disclosure provides a multilayer ceramic capacitor and a manufacturing method thereof. The multilayer ceramic capacitor includes a capacitor body having first and second surfaces opposite in a first direction, third and fourth surfaces opposite and connecting the first and second surfaces in a second direction, and fifth and sixth surfaces opposite and connecting the first to fourth surfaces in a third direction, and including a plurality of dielectric layers and a plurality of internal electrodes stacked in the third direction, an external electrode on an outer side of the capacitor body, and an edge coating on the third and fourth surfaces and including a barium titanate-based compound and Nb, wherein, based on 100 mol parts of Ti included in the edge coating, the content of Nb included in the edge coating is 0.5 to 1 mol parts.

The invention discloses a potting module capacitor and a preparation method thereof. The potting module capacitor comprises a shell, a potting layer and a capacitor body, the shell is provided with a fixing cavity for fixing the capacitor body; the encapsulation layer is filled in the fixing cavity to fix the capacitor body; the capacitor body is arranged in the fixed cavity and comprises two leading-out end frames which are oppositely arranged, a plurality of capacitor chip modules which are arranged between the two leading-out end frames at intervals and a plurality of connecting frames which are respectively arranged on two adjacent capacitor chip modules; the connecting frame comprises a connecting frame body, a plurality of first welding pins arranged on one side of the connecting frame body at intervals and a plurality of second welding pins arranged on the other side of the connecting frame body at intervals, and the first welding pins and the second welding pins are sequentially and alternately arranged; through the arrangement of the connecting frame and the leading-out end frame, the endurance capability of the prepared capacitor under high-voltage and complex working conditions can be improved, and the capacitor has higher reliability in a special working environment.

The invention relates to the technical field of capacitors, and discloses a thin-film capacitor and a preparation method thereof, and the thin-film capacitor comprises a capacitor housing which is sequentially provided with a dielectric layer, a transition buffer layer, a dispersion adjustment channel, a functional composite layer, a support column, a sealing electricity pasting layer, a metal foil electrode layer and an insulating medium. During preparation, the inner wall of the capacitor shell is coated with polycaprolactone-organic montmorillonite composite dielectric layer slurry, and the slurry is cured to form the dielectric layer; preparing a transition buffer layer on the inner wall of the dielectric layer; preparing a dispersion adjusting channel on the inner side of the transition buffer layer, and filling polyetherimide microspheres; coating functional composite layer slurry on the inner side of the dispersion adjusting channel, and arranging supporting columns; and finally, preparing a metal foil electrode layer on the inner wall of the electricity sealing paste layer, and filling and curing an insulating medium. According to the method, the bonding strength and dielectric property of the dielectric layer can be enhanced, electric field distribution and heat dissipation are optimized, the structure supporting uniformity is ensured, and the attaching tightness of the electrode layer is improved.

To provide a laminated ceramic electronic component capable of improving adhesion of an external electrode.SOLUTION: A multilayer ceramic electronic device includes an element body in which a plurality of internal electrodes 12a and 12b and a plurality of dielectric layers 14 including a ceramic as a main component are alternately laminated in a first direction, the plurality of laminated internal electrodes have a pair of end surfaces alternately exposed and facing each other in a second direction, and a copper region 40 is exposed from surfaces of the element body, and a pair of external electrodes 20a and 20b respectively in contact with the plurality of internal electrodes exposed from the pair of end surfaces and in contact with the copper region.SELECTED DRAWING: Figure 2