214results about "Encapsulating capacitors apparatus" patented technology

The invention relates to the technical field of capacitors, and discloses a solar cell panel electrode glue brushing device which comprises a base, a supporting column is fixedly installed on the upper surface of the base, a top plate is fixedly installed at the top end of the supporting column, a hydraulic cylinder is fixedly installed on the upper surface of the top plate, and the output end of the hydraulic cylinder is fixedly connected with a transmission frame. And a glue supply barrel is fixedly mounted on the bottom surface of the transmission frame, and a gluing assembly is arranged at the bottom of the transmission frame. Through the arrangement of the gluing assembly, along with continuous downward movement of the transmission frame, two electrodes at the top of the capacitor body enter two groups of gluing cylinders in sequence, and through a gluing arc plate and a contact wheel, the contact wheel can continuously supply glue to the surfaces of the electrodes while correcting the postures of the electrodes in the gluing cylinders; therefore, the more uniform gluing effect on the surface of the electrode is ensured, and the packaging operation of the electrode on the capacitor body is completed.

The invention discloses a chip tantalum capacitor and a packaging method thereof, the capacitor comprises a lead frame and a tantalum core, and the lead frame is connected with the tantalum core through a connecting part. The packaging method comprises the following steps: correspondingly connecting a lead frame, a connecting part and a tantalum core, and then coating a water-soluble polymer material on the connecting part; putting into a mold for mold pressing; soaking in water after mould pressing, taking out, washing and drying; and carrying out electroplating treatment to finish packaging of the tantalum capacitor. According to the invention, a layer of water-soluble polymeric membrane material is coated on the positive and negative electrode lead wire areas of the lead wire frame; the water-soluble polymer material has good adhesion and peelability, so that the epoxy mould pressing flash material can be effectively prevented from being tightly attached to the lead frame in the mould pressing process, the epoxy mould pressing flash material is effectively removed, particularly the flash material is prevented from being tightly attached to the lead frame, the production quality and the product performance are improved, and the production cost is reduced. And the step of treating the flash is omitted.

The present invention discloses a negative pressure packaging method for aluminum electrolytic capacitors, comprising: inserting a core into a sealing body. Placing the core, the sealing body and the outer shell in the inner cavity of a receiving mechanism, and sealing the receiving mechanism. Evacuating the inner cavity of the receiving mechanism so that the inner cavity of the receiving mechanism is in a negative pressure state. The sealing body and the outer shell are packaged so that the sealing body is located at a first depth of the outer shell. The sealing body and the outer shell are pressed together so that the sealing body is located at a second depth of the outer shell, and the second depth is closer to the bottom of the outer shell relative to the first depth. The method solves the problem of the sealing body sliding too long on the inner wall of the outer shell in the prior art, avoids overheating of the friction surface of the sealing body and slight melting, and can ensure that the outer diameter of the sealing body will not shrink, thereby ensuring the airtightness of the outer shell and the sealing body, realizing the negative pressure packaging of the aluminum electrolytic capacitor, improving the stability of the product and increasing the service life of the product.

The invention relates to an automobile capacitor and a manufacturing method thereof, and relates to the technical field of capacitors, and the automobile capacitor comprises a housing, capacitor bodies arranged in the housing at intervals, and a pouring sealant which is poured into the inner cavity of the housing to wrap the capacitor bodies. A first contact piece and a second contact piece which extend out of the shell are respectively arranged at two ends of the capacitor body, a heat dissipation hole is formed in the bottom of the shell, and a metal heat dissipation piece for dissipating heat of the first contact piece and the second contact piece is arranged in the heat dissipation hole; stepped grooves are formed in the metal radiating fins in the circumferential direction, and embedded convex rings matched with the stepped grooves are arranged at the radiating holes of the shell. With the adoption of the structure, heat of the capacitor body can be radiated through the metal radiating fins by arranging the metal radiating fins, so that the radiating effect of the capacitor is improved, and the capacitor is not easy to damage.

The invention relates to the field of processing of capacitor packaging coatings, and particularly discloses a quick-drying packaging coating for a thin-film capacitor, a preparation method and application. The quick-drying packaging coating for the thin film capacitor consists of a component A and a component B in a mass ratio of 100: (90-100), the component A comprises 30-50 parts of organic silicon modified epoxy resin, 20-30 parts of polyether polyol, 10-25 parts of toughening filler, 1-3 parts of a coating tackifier, 1-3 parts of a flow promoter and 0.5-1 part of a defoaming agent; the component B comprises the following components in parts by weight: 45-75 parts of a curing agent, 1-2 parts of an accelerant, 1-1.5 parts of an antioxidant and 1-2 parts of a weather-resistant agent; the preparation method comprises the following steps: respectively preparing the component A and the component B, respectively packaging, and mixing while using to obtain the packaging coating. The method is applied to a thin-film capacitor. The quick-drying water-based paint has the advantages of quick drying, good moisture resistance, good flexibility and high adhesion stability.

The invention discloses a chip capacitor end sealing production line based on a thick rubber plate. The chip capacitor end sealing production line comprises an assembling mechanism, an implanting mechanism, a pressing-in mechanism, a leveling mechanism, a slurry soaking mechanism, a drying mechanism, a cooling and storing mechanism, a plate replacing mechanism, a discharging mechanism and a transferring clamping jaw. The number of the dipping mechanisms, the number of the drying mechanisms and the number of the cooling storage mechanisms are all two, and the assembling mechanism, the implanting mechanism, the pressing-in mechanism, the leveling mechanism, one dipping mechanism, one drying mechanism, one cooling storage mechanism, the plate changing mechanism, the other dipping mechanism, the other drying mechanism, the other cooling storage mechanism and the discharging mechanism are sequentially arranged. The assembling mechanism is used for placing the guide-in plate to the top of the thick rubber plate and forming an assembly. According to the chip capacitor end sealing production line based on the thick rubber plate, full-automatic operation in the end sealing process of the chip capacitor is achieved, the end sealing efficiency of the chip capacitor can be effectively improved, the end sealing precision of the chip capacitor can be improved, and meanwhile the labor cost in the end sealing process can be reduced.

The invention discloses a sealing structure for an electrolytic capacitor, and relates to the technical field of electrolytic capacitors, the sealing structure comprises a capacitor fixing mechanism and a lifting support rod installed at the bottom of the capacitor fixing mechanism, the top of the capacitor fixing mechanism is provided with a sealing mechanism, and the bottom of the sealing mechanism is provided with a moving disc. The capacitor fixing mechanism comprises a workbench, a fixing ring is fixedly installed on the top of the workbench, a first rotating motor is installed on one side of the interior of the fixing ring, the output end of the first rotating motor is fixedly connected with a rotating main bevel gear, and the top of the rotating main bevel gear is connected with a meshing gear ring in a meshing mode. An adjusting knob is rotated to drive an inclined threaded rod to rotate, so that an inclined threaded sleeve drives a second support and an inclined rotating rod to rotate, the inclination angle of an inclined guide plate can be adjusted, and when the electrolytic capacitor is sealed, a capacitor end cover can be secondarily extruded and fixed through a clamping sliding rod.

The invention discloses a special aluminum fixing capacitor for an electronic detonator with ultralow electric leakage characteristic and a preparation method thereof, the capacitor comprises a positive foil electrode, a negative foil electrode, an aluminum foil or an aluminum alloy foil coated with an oxide film on the surface, electrolytic paper and an electrolyte, and the electrolyte can be a phosphate-based electrolyte, a borate-based electrolyte or an organic electrolyte containing high-conductivity salt, and an additive, the preparation method comprises the following steps: slitting positive and negative foils and electrolytic paper, winding the positive and negative foils and the electrolytic paper to form a concentric circle, forming a repair oxide film, dipping a conductive polymer material, baking and polymerizing to form a conductive film, injecting a pouring sealant into an aluminum shell, and carrying out heat treatment to obtain the conductive aluminum shell. The formation liquid is ammonium dihydrogen phosphate, ammonium adipate or boric acid aqueous solution, and the pouring sealant is epoxy resin or polyurethane; the capacitor has an ultra-low electric leakage characteristic, is suitable for being used as a power supply energy storage element in an electronic detonator system, stabilizes power supply output and inhibits an electric leakage phenomenon.

The invention provides a clamp for packaging a capacitor shell, and relates to the field of tantalum capacitor processing, the clamp comprises a clamping mechanism, the clamping mechanism comprises a clamping base, a telescopic rod, a clamping plate and a fixing groove, the clamping mechanism is internally provided with an auxiliary assembly, the auxiliary assembly comprises an extension frame, a sliding groove and a sliding opening, and the extension frame is provided with a clamping groove; an auxiliary clamping assembly is arranged in the auxiliary assembly and comprises a moving block, a sliding block, an extending plate, a spring groove, a limiting rod, a reset spring, a limiting sliding block, an auxiliary clamping block, a hollow groove, a micro vibration motor and a buffering rubber pad. According to the invention, the capacitor is placed between the auxiliary clamping blocks and then is pushed between the clamping plates, so that the capacitor can be conveniently placed, the influence of a small placing space on placement is reduced, bubbles generated by potting can rapidly disappear due to the vibrating capacitor, the bubbles can be conveniently eliminated, and the packaging effect is further improved.

The invention belongs to the technical field of capacitor materials, and particularly relates to a capacitor packaging material, a preparation method and application thereof and a capacitor packaging method. The capacitor packaging material comprises a resin component A, a curing component B and a bonding component C, the resin component A contains bisphenol A epoxy resin I, polyether polyol I and optional rubber toughening agent I and modified silicon dioxide I; the curing component B contains anhydride and optional rubber toughening agent II and modified silicon dioxide II; the bonding component C contains epoxy modified acrylic resin and bisphenol A epoxy resin II. The key point of the capacitor packaging material is that the specific coupling agent modified silicon dioxide, the rubber flexibilizer, the modified anhydride and the epoxy modified acrylic resin are introduced into the capacitor packaging material, and all the components cooperate with one another to play a synergistic role, so that the capacitor packaging material has a relatively low linear expansion coefficient and relatively high toughness; the cured packaging material is free of cracking, and the contact surface between the packaging material and the ceramic is well combined without gaps.

The ultrasonic vacuum filling and sealing machine comprises a machine body, a filling and sealing box is arranged on one side of the upper surface of the machine body, a guide seat is arranged on the other side of the upper surface of the machine body, and a box opening for a power container to pass through is formed in the side, close to the guide seat, of the filling and sealing box. A filling and sealing gun vertically extending downwards is arranged in the center of the inner top wall of the filling and sealing box, and an ultrasonic generator and an electric heater are installed at the positions, located on the periphery of the filling and sealing gun, of the inner top wall of the filling and sealing box. Ultrasonic energy generated by working of the ultrasonic generator can change the fluidity and viscosity of a pouring material, promote permeation and filling of the pouring material, reduce bubbles and improve the uniformity of the pouring material, heat is generated by electrifying the electric heater, the pouring material is heated and subjected to heat preservation, premature cooling of the pouring material is avoided, pouring material forming is facilitated, and the production efficiency is improved. The automatic feeding and discharging device can replace traditional manpower for automatic feeding and discharging of capacitors, time and labor are saved, the feeding and discharging speed is high, and the capacitor pouring machining efficiency is improved.

The present invention discloses a chip capacitor termination production line based on a thick rubber plate, comprising an assembly mechanism, an implantation mechanism, a pressing mechanism, a leveling mechanism, a slurry dipping mechanism, a drying mechanism, a cooling storage mechanism, a plate changing mechanism, a discharge mechanism and a transfer clamp; the slurry dipping mechanism, the drying mechanism and the cooling storage mechanism are each provided with two, and the assembly mechanism, the implantation mechanism, the pressing mechanism, the leveling mechanism, a slurry dipping mechanism, a drying mechanism, a cooling storage mechanism, a plate changing mechanism, another slurry dipping mechanism, another drying mechanism, another cooling storage mechanism and a discharge mechanism are provided in sequence; the assembly mechanism is used to place the lead-in plate on top of the thick rubber plate and form an assembly. The chip capacitor termination production line based on a thick rubber plate proposed in this scheme realizes the fully automatic operation of the chip capacitor termination process, can effectively improve the termination efficiency and the termination accuracy of the chip capacitor, and is conducive to reducing the labor cost in the termination process.

The invention discloses a low-howling multilayer ceramic dielectric capacitor and a preparation method thereof, and an end sealing tool, and relates to the technical field of cleaning capacitor structures and preparation methods and end sealing, the capacitor comprises a positive end electrode, a negative end electrode and an inner electrode, and the inner electrode comprises a plurality of inner electrode layers stacked in the Z-axis direction; when current passes through the capacitor, the direction of the current is the horizontal X-axis direction; when the vertical direction is the Y-axis direction, the Z-axis direction is perpendicular to the X-axis direction and the Y-axis direction; the inter-plate electrostriction stress transfer direction of the inner electrode layer is an XZ plane, and the electrostriction stress transfer direction between the positive end electrode and the negative end electrode is an XY plane. According to the invention, the direction of the terminal electrode is changed, so that the purpose of dispersing and guiding the electrostrictive stress of each component in the MLCC under the conditions that hardware is not changed, the space height is not influenced and the ceramic material is not changed is achieved.

The invention provides a stacked capacitor assembly, a manufacturing method thereof and a stacked capacitor packaging structure. The stacked capacitor assembly comprises a plurality of conductive substrates, a plurality of internal conductive structures, a plurality of connecting layers and an outermost coating structure. The plurality of internal conductive structures are configured to cover the plurality of first portions of the plurality of conductive substrates, respectively. Each connecting layer is configured to be connected between any two adjacent internal conductive structures. The outermost cladding structure is configured for cladding the plurality of internal conductive structures and the plurality of connection layers. Therefore, the stacked capacitor assembly provided by the invention not only can simplify the overall structure, but also can meet the characteristic requirements of the capacitor. When the stacked capacitor assembly is applied to the stacked capacitor packaging structure, the stacked capacitor packaging structure can still achieve the electrical characteristics and functions provided by the capacitor under the condition that the overall structure is simplified.

This invention discloses a surface-mount solid aluminum electrolytic capacitor and its manufacturing method, comprising a capacitor core package, which includes N capacitor cores, N+1 conductive metal meshes, a substrate, anode leads, cathode leads, and a silver paste covering tape. The capacitor core package is encapsulated and electroplated to form a solid aluminum electrolytic capacitor. The capacitor core includes an anode portion, a cathode portion, and an insulating barrier tape. In this invention, the conductive metal mesh sandwiched between the metal pads in the anode portion of the capacitor core and the cathode portion of the capacitor core can achieve the flatness of the core package. The silver paste covering tape located on the side of the cathode portion of the core package is embedded in the gap formed between two adjacent capacitor cores due to the conductive metal mesh sandwiched, forming an integrated connection. This prevents the resin encapsulant from being squeezed into the core layers during encapsulation, preventing core deformation damage that could lead to increased leakage current and increased ESR. Furthermore, it can prevent insufficient capacitance or even capacitor failure caused by delamination between cores.

The invention provides a motor controller thin-film capacitor, and the capacitor comprises a housing which is provided with an opening and a cooling structure. The capacitor core is arranged in the shell; the capacitor core is provided with a metal terminal, the metal terminal extends out of the shell through the opening, and one end, far away from the capacitor core, of the metal terminal is provided with a bent wiring end; the positioning adjusting assembly is located in the shell; the capacitor core is detachably connected with one of two inner side walls which are oppositely arranged in the shell through the positioning adjusting assembly, and is configured to adjust the application direction of one end, far away from the capacitor core, of the metal terminal; the pouring sealant is filled in the shell; the pouring sealant covers the capacitor core, the positioning adjusting assembly and the part, located in the shell, of the metal terminal. According to the thin-film capacitor, the mounting position of the capacitor core in the shell can be changed by applying the positioning adjusting assembly, and then the application direction of the end part of the metal terminal is changed, so that the adaptability and compatibility of the thin-film capacitor are improved, and the application range of the thin-film capacitor is widened.

The invention provides a stacked capacitor assembly, a manufacturing method thereof and a stacked capacitor packaging structure. The stacked capacitor assembly includes a plurality of conductive substrates, an internal conductive structure, and an outermost cladding structure. Each conductive substrate is provided with a first part and a second part opposite to the first part; the internal conductive structure is configured to wrap the first portion of each conductive substrate and fill between any two adjacent conductive substrates. The outermost cladding structure is configured for cladding the inner conductive structure. Therefore, the stacked capacitor assembly provided by the invention not only can simplify the overall structure, but also can meet the characteristic requirements of the capacitor. When the stacked capacitor assembly is applied to the stacked capacitor packaging structure, the stacked capacitor packaging structure can still achieve the electrical characteristics and functions provided by the capacitor under the condition that the overall structure is simplified.

The invention relates to an all-inorganic flexible capacitor and a preparation method thereof, the all-inorganic flexible capacitor comprises at least one all-inorganic flexible capacitor unit, and the all-inorganic flexible capacitor unit comprises a metal electrode, a flexible electrode and a dielectric layer between the two electrodes; the dielectric layer is a metal oxide, the dielectric layer is generated by electrolysis on the surface of the metal foil through an electrochemical oxidation method, the metal foil is not completely electrolyzed, the remaining part of the metal foil after electrolysis serves as a flexible electrode, the dielectric layer is tightly attached to the flexible electrode, and a metal film is deposited on the surface of the dielectric layer to serve as a metal electrode. Compared with the prior art, the full-inorganic flexible capacitor can bear high voltage and is high in energy density, simple in structure and excellent in breakdown resistance, and the preparation method is simple, high in operability, low in cost, suitable for large-scale preparation and high in industrial production feasibility.

Provided is a multilayer ceramic capacitor that maintains electrical characteristics and ensures sufficient mechanical strength. In a multilayer ceramic capacitor (1), in a surface layer region (400), a side edge portion (16) includes a first segregation substance (133) having silicon as a main component and having a major diameter of 10 nm to 50 nm, and a second segregation substance (135) having silicon as a main component and having a major diameter of 1 [mu] m or more, a plurality of second segregation substances (135) are present in a cross section, and in the surface layer region (400), an additive component is included. The additive component includes at least one of zirconium, aluminum, titanium, and calcium, and the concentration of the additive component in the surface layer region (400) is higher than the concentration of the additive component in the inner region (402).

A method for manufacturing a sealed container lid includes arranging an insulating flange 42 so as to overlap with a terminal flange 32, heating the insulating flange 42 overlapping with the terminal flange 32, pressing the insulating flange 42 on the terminal flange 32 in a state where a pair of pressure portions 55, 56 sandwich the terminal flange 32 and the heated insulating flange 42, and joining the insulating flange 42 to the terminal flange 32, arranging the insulating flange 42 so as to overlap with a lid body 15, heating the insulating flange 42 overlapping with the lid body 15, and a pressing the insulating flange 42 on the lid body 15 in a state where the pair of pressure portions 55, 56 sandwich the lid body 15 and the heated insulating flange 42, and joining the insulating flange 42 to the lid body 15.

The invention relates to a glue pouring positioning tool for a capacitor, which comprises a positioning frame, more than one positioning block and at least two locking strips, and is characterized in that the positioning frame is sleeved outside a shell of the capacitor and is positioned at the upper part of the shell; the locking bar is used for fixing the positioning frame on the upper part of the shell; the two end parts of the positioning block are connected with the upper end of the positioning frame, and the middle part of the positioning block is locked with a connecting terminal of a core group of the capacitor. According to the invention, the glue filling positioning tool is applied to the preparation process of the capacitor, so that the upper cover of the capacitor can be welded after glue filling is completed, the glue filling liquid level height and the glue curing effect can be confirmed in the glue filling process of the capacitor, and the glue filling liquid level height and the glue curing effect can meet the requirements; therefore, the yield of the capacitor is improved.

The present invention relates to a method for manufacturing an automobile capacitor, and relates to the technical field of capacitors, which includes a shell, a capacitor body arranged in the shell at intervals, and a potting glue poured into the inner cavity of the shell to wrap the capacitor body, the two ends of the capacitor body are respectively provided with a first contact piece and a second contact piece extending from the shell, a heat dissipation hole is provided at the bottom of the shell, and a metal heat sink for dissipating heat for the first contact piece and the second contact piece is arranged in the heat dissipation hole; the metal heat sink is provided with a stepped groove in the circumference, and the shell has an embedded convex ring matched with the stepped groove at the heat dissipation hole. With the above structure, by providing a metal heat sink, the heat of the capacitor body can be dissipated through the metal heat sink, thereby improving the heat dissipation effect of the capacitor and making the capacitor less prone to damage.

The special-shaped capacitor electrode terminal positioning device comprises two limiting longitudinal arms and a positioning transverse arm, each limiting longitudinal arm is provided with two special-shaped capacitor width size limiting arms and two special-shaped capacitor height size limiting arms, and the positioning transverse arm is provided with two positioning transverse arms. The two special-shaped capacitor width size limiting arms and the two special-shaped capacitor height size limiting arms are arranged and distributed on the same limiting longitudinal arm at intervals, and the height of the bottom end faces of the two special-shaped capacitor height size limiting arms is larger than that of the bottom end faces of the two special-shaped capacitor width size limiting arms. The two limiting longitudinal arms are connected with a positioning cross arm at a position between the two special-shaped capacitor height size limiting arms, and positioning hole sites matched with special-shaped capacitor electrode leading-out terminals for positioning are distributed on the positioning cross arm. The cross section of the side surface of the special-shaped capacitor is provided with a capacitor structure with step-shaped high and low top end surfaces with different heights. The occupied space is smaller and more reasonable, and the circuit wiring is more reasonable.

The invention relates to the technical field of electronic components, in particular to a chip precision positioning system and method.The chip precision positioning system comprises a shooting module, a positioning module, a transmission module and an import module, the positioning module comprises an analysis unit, a calibration unit, a calculation unit and a positioning unit, and the analysis unit analyzes and recognizes shooting data based on the image recognition technology; an end sealing plate layout is obtained; the calibration unit divides the layout of the end sealing plates and calibrates the plate hole positions of the end sealing plates to obtain calibration coordinates; the calculation unit calculates a transverse difference value between the calibration coordinate and the position of the import module to obtain a coordinate difference; the positioning unit adjusts the position of the end sealing plate based on the coordinate difference and completes feeding positioning of the end sealing plate, the positioning system obtains the layout of the end sealing plate through photographing analysis, the coordinate position of a plate hole of the end sealing plate is calibrated, the difference between the coordinate position and the position of the guiding-in module is obtained, displacement needing to be adjusted by the end sealing plate each time is obtained, and the position of the end sealing plate is automatically adjusted through the positioning module. And automatic positioning of end sealing plate feeding is achieved.

The invention relates to the technical field of capacitor generation, in particular to an automobile capacitor glue pouring packaging device. An automobile capacitor glue pouring packaging device comprises a conveying line used for conveying a capacitor body, a lifting mechanism used for lifting a capacitor to be processed is arranged at the front end of the conveying line, and the lifting mechanism lifts the capacitor to be processed to be equal to the conveying line in height and then transfers the capacitor to be processed into a glue pouring mechanism for glue pouring operation of the capacitor to be processed. And the capacitor after glue filling is transferred to the terminal bending mechanism for terminal bending, the capacitor after terminal bending is transferred to the terminal welding mechanism, the welded capacitor is transferred to the visual detection mechanism, and the capacitor after detection is guided out by the conveying line. A to-be-processed capacitor is lifted by the lifting mechanism to be flush with the conveying line and then is transferred, the to-be-processed capacitor is subjected to glue filling by the glue filling mechanism, shaping by the terminal bending mechanism and connection by the terminal welding mechanism, then the quality is screened by the visual inspection mechanism, qualified products are finally guided out by the conveying line, and packaging is completed.

The invention discloses a capacitor producing, manufacturing and processing method, and relates to the technical field of capacitor production, and the method comprises the steps: S1, manufacturing a capacitor core, meeting a preset electrical parameter requirement, of an AC tuning capacitor; and assembling the capacitor core into the cylindrical shell of the alternating current tuning capacitor, and sealing and welding a shell body and a shell cover of the cylindrical shell according to a uniformly-formulated welding process standard. The capacitor manufacturing device is suitable for manufacturing a large-size capacitor, the first pneumatic cylinder slides on the top end of the top supporting rib plate in a reciprocating mode, and the first servo motor and the threaded lead screw are used for precisely pushing the sliding rack to slide to the corresponding position on the surface of the top supporting rib plate in a reciprocating mode; and the sliding rack and a plurality of capacitors which are fixed at equal intervals according to specifications on the top surface of the bottom supporting seat below the sliding rack move accurately, and oil is injected downwards automatically through an oil storage tank which is connected and fixed in the middle of the oil tank rack in parallel.

The present invention discloses a conveying device for a capacitor housing, comprising: a storage rack on which a plurality of boxes for holding capacitor housings are placed; a robotic arm for grasping and moving the boxes; a flipping mechanism for receiving the boxes filled with capacitor housings grasped by the robotic arm and driving the boxes to flip so that the capacitor housings are ejected from the boxes; and a conveying device disposed below the flipping mechanism to receive the capacitor housings ejected from the boxes, and the conveying device is used to convey the capacitor housings to a capacitor assembly device. With such a setting, the conveying process of the capacitor housings is completed by the conveying device, replacing the traditional manual conveying, reducing the labor consumption and improving the conveying efficiency; moreover, the conveying device can continuously convey the capacitor housings to the capacitor assembly device without storing them on the machine table plate, and can avoid the mess on the machine table plate.

The invention relates to the technical field of audio collectors, in particular to capacitor automatic punching, cover riveting and casing integrated equipment which comprises a base, and a punching assembly used for punching a capacitor, a cover riveting assembly used for riveting a cover of the capacitor and a casing assembly used for casing the capacitor are sequentially placed on one side of the base. The base is provided with a conveying belt assembly used for conveying a capacitor to be processed. Through the arrangement of the limiting assembly, the clamping assembly and the reset assembly, a worker puts a capacitor to be machined into the limiting assembly to press the capacitor, the clamping assembly can automatically clamp the capacitor, the time for fixing the capacitor is saved, after a casing process is carried out, the reset assembly enables the limiting assembly to reset, the capacitor can complete casing, and the work efficiency is improved. And moreover, the limiting assembly is recovered to a state in which the capacitor is not clamped, so that a worker only needs to simply take down the capacitor, and then the next capacitor can be fixedly installed.

The invention discloses a rubber coating device and a rubber coating method. The rubber coating device comprises a feeding mechanism, a bearing mechanism, a rubber taking mechanism and a rubber coating mechanism. The receiving mechanism is configured to receive and fix the to-be-encapsulated part from the feeding mechanism. The rubber taking mechanism comprises a feeding assembly and a material taking assembly, the feeding assembly is configured to load rubber coating materials, and the material taking assembly is configured to take out the rubber coating materials from the feeding assembly. The rubber coating mechanism comprises a cutting assembly and a rubber coating assembly, and the cutting assembly is configured to cut off the connection between the rubber coating material taken out by the material taking assembly and the rubber coating material on the material supply assembly, so that the material taking assembly takes the to-be-used rubber coating material with the preset length; the rubber coating assembly is configured to attach a to-be-used rubber coating material to the outer peripheral wall of the to-be-rubber-coated part. The receiving mechanism is further configured to drive the to-be-encapsulated part to rotate relative to the encapsulating mechanism under the condition that the to-be-used encapsulating material is attached to the peripheral wall of the to-be-encapsulated part through the encapsulating assembly, so that the peripheral wall of the to-be-encapsulated part is coated with the encapsulating material.

An electronic component (for example, an electrolytic capacitor) includes an internal element (for example, a capacitor element) and a packaging (for example, a case). The production lot for the internal element includes a plurality of subunits. The packaging is provided with an identifier for identifying the plurality of subunits. By this configuration, it is possible to provide an electronic component capable of specifying production information, a production method for the electronic component, a management method for the electronic component, and a program. The identifier may be provided on the packaging as a display. Further, the identifier may be a one-dimensional code or a two-dimensional code.