107results about "Encapsulating capacitors apparatus" patented technology

The invention discloses a chip capacitor end sealing production line based on a thick rubber plate. The chip capacitor end sealing production line comprises an assembling mechanism, an implanting mechanism, a pressing-in mechanism, a leveling mechanism, a slurry soaking mechanism, a drying mechanism, a cooling and storing mechanism, a plate replacing mechanism, a discharging mechanism and a transferring clamping jaw. The number of the dipping mechanisms, the number of the drying mechanisms and the number of the cooling storage mechanisms are all two, and the assembling mechanism, the implanting mechanism, the pressing-in mechanism, the leveling mechanism, one dipping mechanism, one drying mechanism, one cooling storage mechanism, the plate changing mechanism, the other dipping mechanism, the other drying mechanism, the other cooling storage mechanism and the discharging mechanism are sequentially arranged. The assembling mechanism is used for placing the guide-in plate to the top of the thick rubber plate and forming an assembly. According to the chip capacitor end sealing production line based on the thick rubber plate, full-automatic operation in the end sealing process of the chip capacitor is achieved, the end sealing efficiency of the chip capacitor can be effectively improved, the end sealing precision of the chip capacitor can be improved, and meanwhile the labor cost in the end sealing process can be reduced.

The invention discloses a special aluminum fixing capacitor for an electronic detonator with ultralow electric leakage characteristic and a preparation method thereof, the capacitor comprises a positive foil electrode, a negative foil electrode, an aluminum foil or an aluminum alloy foil coated with an oxide film on the surface, electrolytic paper and an electrolyte, and the electrolyte can be a phosphate-based electrolyte, a borate-based electrolyte or an organic electrolyte containing high-conductivity salt, and an additive, the preparation method comprises the following steps: slitting positive and negative foils and electrolytic paper, winding the positive and negative foils and the electrolytic paper to form a concentric circle, forming a repair oxide film, dipping a conductive polymer material, baking and polymerizing to form a conductive film, injecting a pouring sealant into an aluminum shell, and carrying out heat treatment to obtain the conductive aluminum shell. The formation liquid is ammonium dihydrogen phosphate, ammonium adipate or boric acid aqueous solution, and the pouring sealant is epoxy resin or polyurethane; the capacitor has an ultra-low electric leakage characteristic, is suitable for being used as a power supply energy storage element in an electronic detonator system, stabilizes power supply output and inhibits an electric leakage phenomenon.

The invention provides a clamp for packaging a capacitor shell, and relates to the field of tantalum capacitor processing, the clamp comprises a clamping mechanism, the clamping mechanism comprises a clamping base, a telescopic rod, a clamping plate and a fixing groove, the clamping mechanism is internally provided with an auxiliary assembly, the auxiliary assembly comprises an extension frame, a sliding groove and a sliding opening, and the extension frame is provided with a clamping groove; an auxiliary clamping assembly is arranged in the auxiliary assembly and comprises a moving block, a sliding block, an extending plate, a spring groove, a limiting rod, a reset spring, a limiting sliding block, an auxiliary clamping block, a hollow groove, a micro vibration motor and a buffering rubber pad. According to the invention, the capacitor is placed between the auxiliary clamping blocks and then is pushed between the clamping plates, so that the capacitor can be conveniently placed, the influence of a small placing space on placement is reduced, bubbles generated by potting can rapidly disappear due to the vibrating capacitor, the bubbles can be conveniently eliminated, and the packaging effect is further improved.

The present invention discloses a chip capacitor termination production line based on a thick rubber plate, comprising an assembly mechanism, an implantation mechanism, a pressing mechanism, a leveling mechanism, a slurry dipping mechanism, a drying mechanism, a cooling storage mechanism, a plate changing mechanism, a discharge mechanism and a transfer clamp; the slurry dipping mechanism, the drying mechanism and the cooling storage mechanism are each provided with two, and the assembly mechanism, the implantation mechanism, the pressing mechanism, the leveling mechanism, a slurry dipping mechanism, a drying mechanism, a cooling storage mechanism, a plate changing mechanism, another slurry dipping mechanism, another drying mechanism, another cooling storage mechanism and a discharge mechanism are provided in sequence; the assembly mechanism is used to place the lead-in plate on top of the thick rubber plate and form an assembly. The chip capacitor termination production line based on a thick rubber plate proposed in this scheme realizes the fully automatic operation of the chip capacitor termination process, can effectively improve the termination efficiency and the termination accuracy of the chip capacitor, and is conducive to reducing the labor cost in the termination process.

This invention discloses a surface-mount solid aluminum electrolytic capacitor and its manufacturing method, comprising a capacitor core package, which includes N capacitor cores, N+1 conductive metal meshes, a substrate, anode leads, cathode leads, and a silver paste covering tape. The capacitor core package is encapsulated and electroplated to form a solid aluminum electrolytic capacitor. The capacitor core includes an anode portion, a cathode portion, and an insulating barrier tape. In this invention, the conductive metal mesh sandwiched between the metal pads in the anode portion of the capacitor core and the cathode portion of the capacitor core can achieve the flatness of the core package. The silver paste covering tape located on the side of the cathode portion of the core package is embedded in the gap formed between two adjacent capacitor cores due to the conductive metal mesh sandwiched, forming an integrated connection. This prevents the resin encapsulant from being squeezed into the core layers during encapsulation, preventing core deformation damage that could lead to increased leakage current and increased ESR. Furthermore, it can prevent insufficient capacitance or even capacitor failure caused by delamination between cores.

Provided is a multilayer ceramic capacitor that maintains electrical characteristics and ensures sufficient mechanical strength. In a multilayer ceramic capacitor (1), in a surface layer region (400), a side edge portion (16) includes a first segregation substance (133) having silicon as a main component and having a major diameter of 10 nm to 50 nm, and a second segregation substance (135) having silicon as a main component and having a major diameter of 1 [mu] m or more, a plurality of second segregation substances (135) are present in a cross section, and in the surface layer region (400), an additive component is included. The additive component includes at least one of zirconium, aluminum, titanium, and calcium, and the concentration of the additive component in the surface layer region (400) is higher than the concentration of the additive component in the inner region (402).

The invention relates to a glue pouring positioning tool for a capacitor, which comprises a positioning frame, more than one positioning block and at least two locking strips, and is characterized in that the positioning frame is sleeved outside a shell of the capacitor and is positioned at the upper part of the shell; the locking bar is used for fixing the positioning frame on the upper part of the shell; the two end parts of the positioning block are connected with the upper end of the positioning frame, and the middle part of the positioning block is locked with a connecting terminal of a core group of the capacitor. According to the invention, the glue filling positioning tool is applied to the preparation process of the capacitor, so that the upper cover of the capacitor can be welded after glue filling is completed, the glue filling liquid level height and the glue curing effect can be confirmed in the glue filling process of the capacitor, and the glue filling liquid level height and the glue curing effect can meet the requirements; therefore, the yield of the capacitor is improved.

The invention relates to the technical field of capacitor generation, in particular to an automobile capacitor glue pouring packaging device. An automobile capacitor glue pouring packaging device comprises a conveying line used for conveying a capacitor body, a lifting mechanism used for lifting a capacitor to be processed is arranged at the front end of the conveying line, and the lifting mechanism lifts the capacitor to be processed to be equal to the conveying line in height and then transfers the capacitor to be processed into a glue pouring mechanism for glue pouring operation of the capacitor to be processed. And the capacitor after glue filling is transferred to the terminal bending mechanism for terminal bending, the capacitor after terminal bending is transferred to the terminal welding mechanism, the welded capacitor is transferred to the visual detection mechanism, and the capacitor after detection is guided out by the conveying line. A to-be-processed capacitor is lifted by the lifting mechanism to be flush with the conveying line and then is transferred, the to-be-processed capacitor is subjected to glue filling by the glue filling mechanism, shaping by the terminal bending mechanism and connection by the terminal welding mechanism, then the quality is screened by the visual inspection mechanism, qualified products are finally guided out by the conveying line, and packaging is completed.

The present invention discloses a conveying device for a capacitor housing, comprising: a storage rack on which a plurality of boxes for holding capacitor housings are placed; a robotic arm for grasping and moving the boxes; a flipping mechanism for receiving the boxes filled with capacitor housings grasped by the robotic arm and driving the boxes to flip so that the capacitor housings are ejected from the boxes; and a conveying device disposed below the flipping mechanism to receive the capacitor housings ejected from the boxes, and the conveying device is used to convey the capacitor housings to a capacitor assembly device. With such a setting, the conveying process of the capacitor housings is completed by the conveying device, replacing the traditional manual conveying, reducing the labor consumption and improving the conveying efficiency; moreover, the conveying device can continuously convey the capacitor housings to the capacitor assembly device without storing them on the machine table plate, and can avoid the mess on the machine table plate.

The invention discloses a rubber coating device and a rubber coating method. The rubber coating device comprises a feeding mechanism, a bearing mechanism, a rubber taking mechanism and a rubber coating mechanism. The receiving mechanism is configured to receive and fix the to-be-encapsulated part from the feeding mechanism. The rubber taking mechanism comprises a feeding assembly and a material taking assembly, the feeding assembly is configured to load rubber coating materials, and the material taking assembly is configured to take out the rubber coating materials from the feeding assembly. The rubber coating mechanism comprises a cutting assembly and a rubber coating assembly, and the cutting assembly is configured to cut off the connection between the rubber coating material taken out by the material taking assembly and the rubber coating material on the material supply assembly, so that the material taking assembly takes the to-be-used rubber coating material with the preset length; the rubber coating assembly is configured to attach a to-be-used rubber coating material to the outer peripheral wall of the to-be-rubber-coated part. The receiving mechanism is further configured to drive the to-be-encapsulated part to rotate relative to the encapsulating mechanism under the condition that the to-be-used encapsulating material is attached to the peripheral wall of the to-be-encapsulated part through the encapsulating assembly, so that the peripheral wall of the to-be-encapsulated part is coated with the encapsulating material.

An electronic component (for example, an electrolytic capacitor) includes an internal element (for example, a capacitor element) and a packaging (for example, a case). The production lot for the internal element includes a plurality of subunits. The packaging is provided with an identifier for identifying the plurality of subunits. By this configuration, it is possible to provide an electronic component capable of specifying production information, a production method for the electronic component, a management method for the electronic component, and a program. The identifier may be provided on the packaging as a display. Further, the identifier may be a one-dimensional code or a two-dimensional code.

The invention discloses equipment and a method for synchronously attaching electrodes to two sides of a thin film capacitor core, and belongs to the field of thin film capacitors. A device for synchronously attaching electrodes to the two faces of a film capacitor core comprises a conveying table and a spraying table which are fixedly connected and a sliding way fixedly connected to the conveying table, a containing frame is slidably connected into the sliding way, the film capacitor core is placed in the containing frame, and a handle is arranged on the containing frame; the threaded rod is rotationally arranged on the baffle, the arc-shaped plate is fixedly arranged on the baffle, and the threaded rod rotates to enable the hook assembly to be connected with the lifting handle in a clamped mode; the spraying piece is arranged on the spraying table in a reciprocating motion mode, and a spraying gun is arranged on the spraying piece; according to the invention, a plurality of thin-film capacitor cores can be conveyed in a centralized manner through the placing frame, and the continuous feeding operation of the plurality of thin-film capacitor cores can be realized through the shifting plate and the threaded rod, so that the conditions of overlapping, vacancy, non-uniform thickness, spraying leakage or excessive spraying on an electrode attachment surface are avoided, and the electrode attachment effect and the qualification rate are ensured.

To provide a multilayer ceramic electronic component, a circuit board, and a manufacturing method for the multilayer ceramic electronic component that can achieve high reliability.SOLUTION: A multilayer ceramic electronic component 100 includes an element body 10 including a plurality of dielectric layers 11, and a plurality of internal electrode layers 12 that are laminated with the plurality of dielectric layers 11 interposed therebetween, and are provided so as to face each other and have one ends exposed, and an external electrode 20a and an external electrode 20b that are provided on respective end faces of the element body 10 being the ends in the direction in which the plurality of internal electrode layers 12 extend, are in contact with respective one ends of the plurality of internal electrode layers 12, and include glass 30. The external electrodes 20a and 20b include crystals 40 that contain at least one of the same elements as those contained in the plurality of dielectric layers 11 and are in contact with the element body 10 and the glass 30.SELECTED DRAWING: Figure 6

The present invention discloses a negative pressure encapsulation device for aluminum electrolytic capacitors, which includes a feeding device, an encapsulation device, a first pressing device and a conveying device. The feeding device is used to output the outer shell, the element core and the sealing body one by one. The encapsulation device is used to encapsulate and combine the outer shell, the element core and the sealing body output by the feeding device under negative pressure, so that the sealing body is at a first depth in the outer shell. The first pressing device is used to press the outer shell, the element core and the sealing body processed by the encapsulation device under negative pressure, so that the sealing body is at a second depth. The second depth is closer to the bottom end of the outer shell relative to the first depth. The conveying device is used to convey the element core, the sealing body and the outer shell between the feeding device, the encapsulation device and the first pressing device. This negative pressure encapsulation device can avoid overheating of the friction surface of the sealing body and generate fine melting, and can ensure that the outer diameter of the sealing body will not shrink, thereby ensuring the airtightness between the outer shell and the sealing body.

The invention discloses an aluminum electrolytic capacitor based on a ripple-resistant electrolyte and a preparation method thereof, and relates to the technical field of aluminum electrolytic capacitors. Comprising the following preparation steps: placing electrolytic paper between an anode foil and a cathode foil, winding to obtain a core, immersing the core in a ripple-resistant electrolyte for impregnation treatment, sealing the core after impregnation, putting the core into an aluminum shell, sealing the top with a rubber plug, and aging; the ripple-resistant electrolyte comprises the following raw materials in parts by mass: 40-60 parts of ethylene glycol, 3-5 parts of ammonium adipate, 1-5 parts of ammonium formate, 18-25 parts of an ammonium salt solution, 1.5-3 parts of composite polyester polyol, 3-6 parts of an additive, 1-3 parts of a flash fire improver, 0.5-1 part of a hydrogen elimination agent and 15-20 parts of deionized water.

In the present invention, a mother laminate is cut by arranging the mother laminate on a pedestal and moving a cutting blade having a linear cutting edge through the mother laminate in a parallel direction along the arrangement surface of the pedestal, where the cutting edge is tilted relative to the travel direction thereof.

The invention discloses a compact implanting system for chip capacitors. The compact implanting system comprises a feeding plate storage mechanism, an automatic discharging mechanism, an implanting mechanism, a leveling mechanism, a discharging buffering mechanism, a plate moving mechanism and a transferring mechanism. According to the compact implanting system of the chip capacitor, the operations of spreading, implanting and leveling of the capacitor which need to be manually completed in the traditional process are completely replaced, unmanned operation of the whole process from loading of the material loading plate to implanting completion is achieved, the labor cost can be effectively reduced through long-term operation, and the efficiency is improved. And meanwhile, product consistency fluctuation caused by manual operation difference is avoided. Besides, main procedures of the scheme adopt modular linear layout, material transfer among the main procedures is realized by the aid of a plate moving mechanism, and the whole equipment is small in occupied area, convenient to quickly deploy or transform in an existing production line, particularly applicable to small and medium-sized electronic component manufacturing workshops with limited spaces and high in production efficiency. And collaborative optimization of high efficiency, high yield, low cost and small occupied area is realized.

The present invention discloses a high-temperature polypropylene film capacitor and a preparation method thereof, specifically relating to the technical field of capacitor production. The capacitor includes a capacitor body, and the capacitor body includes a capacitor inner core. Metal conductive layers are formed at both ends of the capacitor inner core through gold spraying by a gold spraying machine. The capacitor inner core is wound from an inner core base material, and the inner core base material includes a film dielectric. A metal electrode layer is formed on the film dielectric through evaporation coating. The film dielectric is prepared by adding an antioxidant and a high-temperature heat stabilizer to polypropylene plastic particles. When the high-temperature polypropylene film capacitor produced by the present invention is subjected to gold spraying, the wrapping strip can closely adhere to the outer wall of the capacitor inner core, and can generate adaptive deformation according to the specific shape differences of the outer wall of the capacitor inner core, thereby ensuring that the side wall of the capacitor inner core can be fully protected during gold spraying, without causing forced extrusion on the capacitor inner core, and improving the product quality.

A bushing assembly for mounting in openings of a panel of a housing for electrical equipment, such as a capacitor housing. The bushing assembly includes a plurality of first bushing members releasably attachable through a respective one of said openings of the panel to a single second bushing member positioned on an inside of the panel inside the housing.

The invention relates to the technical field of conveying devices, in particular to a conveying device and method for packaging an aluminum electrolytic capacitor. The conveying device comprises a packaging assembly and a feeding disc in the packaging assembly, the outer side of the feeding disc is in transmission connection with an accelerator, the output end of the accelerator is in transmission connection with a rotating plate, and the outer side of the rotating plate is connected with a first bottom plate; connecting rods are fixed to the top of the first bottom plate, damping springs are arranged on the outer sides of the two connecting rods, buffering parts are slidably connected to the outer sides of the connecting rods, and supporting pieces are arranged on the tops of the buffering parts. The buffer part comprises a hollow ring at the bottom of the damping spring, the inner side of the hollow ring is rotatably connected with a side rod, side gears are fixed to the two sides of the side rod, a toothed plate is fixed to the bottom of the supporting piece, the inner side of the side rod is connected with a fixed rod, and the hollow ring is matched with the damping spring to reduce the acceleration of the aluminum electrolytic capacitor in the falling process. Meanwhile, the side gear and the toothed plate are matched to enable the side rod and the fixed rod to move from the bottom of the aluminum electrolytic capacitor to the outer side of the aluminum electrolytic capacitor to be finally separated, and the aluminum electrolytic capacitor is moved into the feeding disc.

The application discloses a kind of supercapacitor beam waist sealing equipment with detection function, belong to supercapacitor manufacturing equipment technical field, including for sealing capacitor beam waist sealing workbench, workbench is rotationally provided with work turntable, workbench is provided with for sealing capacitor loading and unloading beam die reset mechanism, workbench top is provided with for sealing capacitor sealing beam detection mechanism, beam die reset mechanism includes installation in the work turntable bottom station conversion seat.The application integrates mechanical structure and electrical control, clamping, beam waist sealing, performance detection, unloading and die reset and other multiple links in supercapacitor production are highly integrated and realized automation, break the traditional serial, separate process mode, and through integrated synchronous operation and turntable multi-station parallel design, under the premise of guaranteeing processing quality and detection accuracy, the leap-forward improvement of production efficiency is realized.

A multilayer ceramic capacitor includes a multilayer body including laminated ceramic layers and laminated inner electrode layers, a barrier film on the multilayer body; and outer electrodes on the barrier film at both end surfaces of the multilayer body. The ceramic layers include a perovskite compound represented by the general formula ABO3, where the A-site is Ba. The barrier film includes Ba and at least one of S or C. The barrier film covers main surfaces and side surfaces, and also covers the end surfaces except for exposed surfaces at which the inner electrode layers are exposed. The outer electrodes are in contact with the inner electrode layers at the exposed surfaces.

To provide a capacitor of which a weight is lightened and a performance for protecting a capacitor element from water is improved, and a manufacturing method of the capacitor.SOLUTION: A capacitor 1 comprises a capacitor element 2, outer shell members 10 and 20, and a film 30. The capacitor element 2 includes: a first end surface 4 having a first electrode 5; a second end surface 6 having a second electrode 7; and a side surface 3 that is extended between the first end surface and the second end surface. The outer shell members 10 and 20 are provided at the first and second end surfaces, and suppress permeation of water. The film 30 covers the side surface while being overlapped with the outer shell member, and has a weight per unit area lighter than that of the outer shell member, and suppresses permeation of water to the outer shell member and the capacitor element. Thus, the capacitor that can realize a right with and a performance of protection from water can be provided.SELECTED DRAWING: Figure 2

A film capacitor comprising a capacitor element that includes first metallized films electrically connected to a first termination and second metallized films electrically connected to a second termination, and a case within which the capacitor element is disposed, is provided. The case contains a polymer composition that includes 100 parts by weight of a polymer matrix that contains a polyarylene sulfide, from about 30 to about 90 parts by weight of inorganic fibers, and a zinc (II) compound.

The invention relates to the technical field of preparation of electrolytic capacitors, in particular to a preparation method of a chip polymer laminated aluminum electrolytic capacitor, which comprises the following steps of: S1, removing an oxidation film on the surface of a core anode to obtain a first core; s2, the anode surface and the cathode surface of the first core are bonded through ACF adhesive tape, and a second core is obtained; s3, a plurality of second cores are stacked and then subjected to hot-pressing curing treatment, and a capacitor core package is obtained; s4, packaging, aging and forming treatment are conducted on the capacitor core package, and the solid aluminum electrolytic capacitor is obtained.According to the solid aluminum electrolytic capacitor, the anodic oxide film removing technology and the ACF adhesive tape bonding technology are adopted, and the hot pressing mode is combined; the problems of insufficient welding strength, welding slag phenomenon, silver paste bonding operation, uneven stress caused by a fan-shaped structure and the like in the prior art can be effectively solved, and the electrical performance and the reliability of the product are improved. And meanwhile, by using the ACF adhesive tape, the operation process is more stable and controllable, and industrial production can be realized.

The present invention relates to a capacitor element righting and assembling device, comprising: an assembling mold, a bundling mold, a conveying assembly, a first assembling rod, and a second assembling rod; characterized in that: the assembling mold is used for integrally encapsulating and combining an element and a housing under negative pressure to obtain an encapsulated body; the bundling mold is used for fixing the housing and can be attached to the bottom of the assembling mold; the first assembling rod is used for transferring the element into the assembling mold; the second assembling rod is used for extruding and combining the element and the housing into one body; the first assembly and the second assembly are combined to form the assembling mold; a hollow mold cavity is arranged in the axial direction of the assembling mold, a flared opening is arranged at one end of the mold cavity, and a tapered groove is arranged at one end of the assembling mold; the tapered groove communicates with the mold cavity; through the arrangement of elastic pieces and elastic members in the assembling mold, the mold cavity forms a sealed negative pressure state, and the opening and closing of the mold cavity are used for integrally assembling the element under negative pressure to obtain a negative pressure capacitor, realizing negative pressure dust-free assembling and encapsulation, achieving the effects of improving product performance and production efficiency.

To provide a manufacturing method of an electronic component and an electronic component holding jig capable of reducing the possibility of collision of the electronic component.SOLUTION: A manufacturing method of an electronic component 1 according to the present invention includes an electronic component preparation step of preparing an electronic component 1 including a laminate chip 1A having a dielectric layer 14 and an internal electrode 15 stacked thereon, an electronic component holding step of holding the electronic components 1 in an electronic component holding jig 200 in an aligned state spaced a predetermined distance apart from each other, a position information acquisition step of acquiring position information of the laminate chip 1A in the electronic component holding jig 200, a processing step of processing the electronic component 1 while the electronic component 1 is held in the electronic component holding jig 200, and an information linking step of linking the processing results of the electronic component 1 to the position information.SELECTED DRAWING: Figure 3

This application provides a sealing device and method for a chip-type three-terminal capacitive filter. The sealing device includes a slurry-coating plate, a slurry-coating mechanism, and a driving mechanism. The slurry-coating plate has a through hole for exposing the exposed portion of the inner electrode at the waist. The slurry-coating mechanism includes a slurry-coating roller, a slurry-bearing structure, and a slurry tray. The slurry-bearing structure has a slurry groove for carrying the end slurry, and the slurry tray has a strip-shaped groove on the side of the slurry tray near the slurry-coating plate. The slurry-coating roller is used to transfer the end slurry. The driving mechanism is connected to the slurry-coating plate and the slurry-coating mechanism. The driving mechanism is used to drive the slurry-coating roller to pick up the end slurry from the slurry groove and drive the slurry tray to move above the slurry-coating roller so that the end slurry is placed in the strip-shaped groove. The driving mechanism is used to drive the slurry tray with the end slurry to move directly above the slurry-coating plate so that the end slurry in the strip-shaped groove is squeezed onto the corresponding exposed portion of the inner electrode at the waist, thereby achieving the sealing effect of the grounding electrode.

The invention discloses an enhanced heat dissipation type box-type capacitor and a manufacturing method thereof, and relates to the technical field of capacitors, the enhanced heat dissipation type box-type capacitor comprises a hollow metal tube, a plurality of heat dissipation ribs are annularly arranged on the outer side wall of the hollow metal tube in the circumferential direction, the lower ends of the heat dissipation ribs penetrate into the hollow metal tube and are provided with limiting plates, and connecting rods are arranged in the hollow metal tube; the connecting rods abut against the limiting plates so as to support the heat dissipation ribs. The core cladding is formed by winding aluminum foil and a polypropylene raw film on the heat dissipation ribs in an overlapping manner, the two ends of the core cladding are sprayed with metal spraying materials and welded with leads, and the inner surface, the outer surface and the metal spraying surfaces at the two ends of the core cladding are sprayed with insulating ceramic layers; the box body is covered with a sealing cover, the core package is installed in the box body, the two ends of the hollow metal tube penetrate to the outer sides of the box body and the sealing cover respectively, the two ends of the heat dissipation ribs abut against the box body and the sealing cover respectively, and the lead penetrates to the outer side of the sealing cover. According to the invention, the heat dissipation efficiency is improved, and the problems of performance degradation and shortened service life are avoided.

This invention provides a packaging device that feeds material along the slicing path of a rotating powder tray. It comprises a material belt pulled by a traction mechanism, a heating mechanism, and an annular powder trough driven by a motor. Several evenly arranged components to be packaged adhere to the material belt. Turning mechanisms are located on both sides of the annular powder trough to direct the material belt into and out of the trough. After passing through the heating mechanism, the material belt enters the annular powder trough and forms a wrapping angle against the inner ring of the trough as it moves. This invention operates continuously using a strip-shaped material movement method. The powder adheres to the components to be packaged in a relatively static manner through the annular powder trough and the material belt, resulting in dust-free operation, energy saving, environmental friendliness, better packaging effect, higher efficiency, and reduced production costs.