Heating device and temperature adjustment device equipped with the same

Abstract

Provided is a heating device that can efficiently heat a circulating fluid with high precision, and that can shorten the time required for temperature adjustment to enhance productivity in semiconductor manufacturing and the like; and a temperature adjusting device using the heating device.　A heating device (26) heats a circulating fluid for adjusting the temperature of a control target, the heating device including: an electroconductive pipe (55) through which the circulating fluid flows; a primary coil (50) wound on the periphery of the pipe (55) and through which alternating current flows; and an electroconductive heating element (51) provided in a region of the pipe (55) where the primary coil (50) is wound. The heating element (51) generates heat by induction heating resulting from the alternating current of the primary coil (50), and the circulating fluid is heated by the heating element (51). Due to this configuration, the heat of the heating element (51) that generates heat by electromagnetic induction can be transferred directly to the circulating fluid, and the circulating fluid can be efficiently heated to a correct temperature. Thus, the time required for temperature adjustment can be shortened in semiconductor manufacturing and the like.

Description

Technical Field

[0001] The present invention relates to a heating device and a temperature adjustment device including the same, and more particularly to a heating device used for adjusting the temperature of various manufacturing devices such as semiconductor manufacturing devices and various measuring devices to a predetermined temperature, and a temperature adjustment device including the same.

Background Art

[0002] Generally, in semiconductor manufacturing and the like, it is necessary to control the temperature of the manufacturing device so that the temperature of the processing location, measurement location, etc. of the workpiece by the manufacturing device reaches a predetermined temperature corresponding to each manufacturing process. Conventionally, as a device for performing such temperature control, a temperature adjustment device having a circulation path through which a heat medium circulates and cooling or heating a control object that requires temperature adjustment by the heat medium circulating through the circulation path is known. This type of temperature adjustment device includes a chiller of a vapor compression refrigeration cycle that cools the circulating heat medium, a heating device that heats the cooled heat medium, and the like.

[0003] For example, Patent Document 1 discloses an area-specific parameter control method hybrid chiller used for controlling the temperature of various devices such as semiconductor manufacturing devices, processes, and the like. The area-specific parameter control method hybrid chiller disclosed in the same document includes a circulating liquid circulation circuit that supplies a circulating liquid cooled to a predetermined temperature by a refrigeration cycle to a control object, and a second circulating liquid circulation circuit that supplies a circulating liquid cooled to a predetermined temperature by cooling water cooled by a cooling tower to a control object. A heater for heating the circulating liquid is provided in the circulating liquid supply path that sends the circulating liquid to the control object.

[0004] With such a configuration, the method of cooling the circulating liquid using the refrigeration cycle and the method of cooling the circulating liquid using the cooling water of the cooling tower are properly used to cool the circulating liquid supplied to the control object. The circulating liquid cooled by the refrigeration cycle or the cooling tower is heated to a predetermined temperature by a heating device such as a heater and supplied to the control object.

[0005] For example, Patent Document 2 discloses a cooling device including a first circulation system that circulates a first refrigerant in a condenser back to the condenser via a pump, a heater, a throttle valve, and an evaporator, and a second circulation system that circulates a second refrigerant that includes a heat exchanger disposed in the condenser and cools the first refrigerant.

[0006] The first circulation system cools an object to be cooled by the latent heat of vaporization of the first refrigerant boiling in the evaporator. The heater of the first circulation system is, for example, an electric heater, and heats the first refrigerant so that the first refrigerant reaches a predetermined temperature. The second circulation system has a compressor, a second condenser, an expansion valve, and a heat exchanger, and cools and condenses the first refrigerant by utilizing the latent heat of vaporization of the second refrigerant in the heat exchanger provided inside the condenser of the first circulation system.

[0007] Also, the same document discloses that a second heat exchanger that heats the first refrigerant by condensation of the second refrigerant is provided as the heater of the first circulation system. The second refrigerant of the second circulation system is pressurized by a compressor and sent to the second heat exchanger to heat the first refrigerant of the first circulation system.

[0008] For example, Patent Document 3 discloses a circulation cooling and heating device that cools and heats a circulation fluid supplied to a chamber of a plasma etching device, and includes a tank that stores the circulation fluid, a pump that circulates the circulation fluid between the tank and the chamber, a heat exchanger that exchanges heat between the circulation fluid and cooling water, and heating means that heats the circulation fluid in the tank. The heating means disclosed in the same document is composed of a sheathed heater. The circulation fluid is heated by the heat generation of this sheathed heater.

Prior Art Documents

Patent Documents

[0009]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0010] However, in the above-described conventional heating device and temperature adjustment device, there are points to be improved in order to shorten the time required for temperature adjustment, improve the efficiency of the production process in a semiconductor manufacturing device or the like, and reduce the energy consumption for temperature adjustment to achieve energy saving.

[0011] Specifically, in semiconductor manufacturing or the like, the temperature of a control target such as a manufacturing device may be changed in response to a processing process, a measurement process, or the like. For example, there may be a case where the set temperature of the control target has to be changed from -40°C to 130°C in a process where temperature control is being performed. In such a case, in the temperature adjustment device of the prior art, it takes a long time to change the temperature of the control target to a predetermined set temperature. The time required to change the temperature of the control target in this way becomes a time loss in the manufacturing process.

[0012] That is, in the temperature adjustment device of the prior art, in order to change the set temperature of the control target and raise the temperature, it is necessary to heat the circulating liquid with a heating device composed of an electric heater such as a sheathed heater for a long time. The process of heating the circulating liquid with a heating device or the like to raise the temperature of the control target is performed until the temperature of the control target reaches a stable set temperature. The time required to heat the circulating liquid with a heating device or the like to raise the temperature of the control target has been a waiting time during which a processing process, a measurement process, or the like cannot be performed in a semiconductor manufacturing device or the like.

[0013] In addition, a heating device composed of a prior art sheathed heater or the like has a problem that it takes time to change the heating temperature and it is not easy to perform precise temperature adjustment. That is, a sheathed heater has a configuration in which a heating element made of a nichrome wire or the like is covered with an insulator and a metal pipe, and the heat of the heating element is not directly transmitted to the circulating liquid of the object to be heated. Therefore, it takes time until the metal pipe that transfers heat to the circulating liquid after adjusting the calorific value of the heating element is heated to a predetermined temperature, resulting in a time loss until the temperature of the control object is adjusted to the accurate set temperature.

[0014] In addition, a temperature adjustment device of the prior art has a configuration in which the circulating liquid is cooled by an evaporator of a refrigeration cycle circuit and then the cooled circulating liquid is heated to a predetermined temperature by a heating device such as a sheathed heater. Therefore, there is a problem that the energy consumed to heat the circulating liquid, that is, the amount of electric power consumed by the heating device or the like, becomes large.

[0015] On the other hand, Patent Document 2 discloses that a second refrigerant in a second circulation system that cools a first refrigerant in a first circulation system using the latent heat of vaporization heats the first refrigerant using the latent heat of condensation in a second heat exchanger. In this way, by heating the first refrigerant corresponding to the circulating liquid supplied to the control object using the latent heat of condensation of the second refrigerant that is the refrigerant of the refrigeration cycle, the energy consumption of a sheathed heater or the like required for heating the circulating liquid can be reduced.

[0016] However, in a method of heating a circulating liquid using the latent heat of condensation of a refrigerant that condenses in a condenser of a refrigeration cycle circuit, like the cooling device disclosed in Patent Document 2, it is difficult to heat the circulating liquid to a high temperature. Therefore, even when the circulating liquid is heated using the latent heat of condensation of the refrigerant, when the set temperature of the control object is high and it is necessary to heat the circulating liquid to a high temperature, a lot of heating by a heating device such as a sheathed heater is required, and the heating amount of the heating device cannot be significantly reduced.

[0017] Further, even in a configuration where the condenser of the refrigeration cycle circuit is used for heating the circulating liquid, when the set temperature of the control target is changed to significantly increase the temperature of the circulating liquid, it takes time to change the temperature, and there is a time loss until the processing step, measurement step, etc. are started.

[0018] The present invention has been made to solve the above problems. An object of the present invention is to provide a heating device that can efficiently and highly accurately heat a circulating liquid, shorten the time required for temperature adjustment when changing the set temperature, etc., and improve productivity in semiconductor manufacturing and the like, and a temperature adjustment device using the same. Another object of the present invention is to provide a temperature adjustment device that can reduce the energy consumption in semiconductor manufacturing and the like and achieve energy saving.

Means for Solving the Problems

[0019] The heating device of the present invention is a heating device that heats a circulating liquid for adjusting the temperature of a control target, and the circulating liquid flows tube and a primary coil wound around the outer periphery of the tube through which an alternating current flows, a conductive heating element provided inside the region of the tube around which the primary coil is wound; and is configured to heat the circulating liquid by the induced heating by the alternating current of the primary coil, causing the heating element to generate heat and using the heating element to heat the circulating liquid. and the heating element is formed of a wire having a relative permeability of 1 or more covered with an insulating member, and both ends of the wire are connected to form a conductive closed loop This is the gist of the present invention.

[0020] Further, the heating device of the present invention is a heating device that heats a circulating liquid for adjusting the temperature of a control target, and includes a tube through which the circulating liquid flows, a primary coil wound around the outer periphery of the tube through which an alternating current flows, and a conductive heating element provided inside the region of the tube around which the primary coil is wound. The heating element generates heat by the induced heating by the alternating current of the primary coil, and the heating element heats the circulating liquid. and the heating element is a secondary coil wound in a coil shape, and both ends of the coil path wound in a coil shape of the secondary coil are connected to form a conductive closed circuit This is the gist of the present invention.

[0021] In addition, the temperature adjustment device of the present invention includes a refrigeration cycle circuit in which a compression means, a radiator, a throttling means, and an evaporator are sequentially connected and a refrigerant circulates, and a circulation liquid circuit in which a circulation pump and a heating device are provided and a circulation liquid for adjusting the temperature of a control object circulates. In the circulation liquid circuit, an openable and closable low-temperature path is formed upstream of the heating device through which the circulation liquid flows through the evaporator in a heat-exchangeable manner with the refrigerant. The heating device is where the circulation liquid flows tube and a primary coil wound around the outer periphery of the pipe through which an alternating current flows a conductive heating element provided inside the region of the tube around which the primary coil is wound; and is provided with, by induction heating by the alternating current of the primary coil, the heating element generates heat and the heating element heats the circulation liquid with the and the heating element is formed of a wire having a relative permeability of 1 or more covered with an insulating member , both ends of the wire are connected to form a conductive closed loop which is characterized in that.

[0022] In addition, the temperature adjustment device of the present invention includes a refrigeration cycle circuit in which a compression means, a radiator, a throttling means, and an evaporator are sequentially connected and a refrigerant circulates, and a circulation liquid circuit in which a circulation pump and a heating device are provided and a circulation liquid for adjusting the temperature of a control object circulates. In the circulation liquid circuit, an openable and closable low-temperature path is formed upstream of the heating device through which the circulation liquid flows through the evaporator in a heat-exchangeable manner with the refrigerant. The heating device includes a pipe through which the circulation liquid flows, a primary coil wound around the outer periphery of the pipe through which an alternating current flows, and a conductive heating element provided inside the region of the pipe around which the primary coil is wound. The heating element generates heat by induction heating by the alternating current of the primary coil, and the heating element heats the circulation liquid and the heating element is a secondary coil wound in a coil shape, and both ends of the coil path wound in a coil shape of the secondary coil are connected to form a conductive closed circuit which is characterized in that.

Advantages of the Invention

[0023] The heating device of the present invention includes a conductive tube through which a circulating liquid flows, and a primary coil wound around the outer periphery of the tube through which an alternating current flows. The tube generates heat by induction heating caused by the alternating current of the primary coil, and heats the circulating liquid with the tube. Thereby, the heat of the tube that generates heat by electromagnetic induction can be directly transmitted to the circulating liquid, and the circulating liquid can be efficiently heated to an accurate temperature. Therefore, in a semiconductor manufacturing apparatus or the like, it is possible to shorten the time required for heating the circulating liquid for temperature control and execute a highly efficient processing process with less time loss.

[0024] Further, the heating device of the present invention includes a tube through which a circulating liquid flows, a primary coil wound around the outer periphery of the tube through which an alternating current flows, and a conductive heating element provided inside the region of the tube around which the primary coil is wound. The heating element may generate heat by induction heating caused by the alternating current of the primary coil, and heat the circulating liquid with the heating element. With such a configuration, the heat of the heating element can be directly transmitted to the circulating liquid, and the circulating liquid can be efficiently heated to an accurate temperature. Therefore, it is possible to reduce the time loss in the manufacturing process and improve the productivity of semiconductor devices and the like. In addition, direct heat dissipation from the heating element to the outside of the tube can be reduced, and highly efficient heating with less heat dissipation loss can be performed.

[0025] Further, in the heating device of the present invention, the heating element is formed of a wire having a relative permeability of 1 or more covered with an insulating member, and both ends of the wire may be connected so as to form a conductive closed loop. Thereby, a large amount of induced current can flow through the wire by highly efficient electromagnetic induction to heat the wire, and the circulating liquid can be efficiently heated to an accurate temperature. In addition, the flow resistance of the circulating liquid in the vicinity of the heating element can be reduced, and the circulating liquid can be efficiently circulated.

[0026] Further, in the heating device of the present invention, the heating element is a secondary coil wound in a coil shape, and both ends of the coil path wound in a coil shape of the secondary coil may be connected to form a conductive closed circuit. Thereby, high-efficiency induction heating in which an induced current preferably flows through the secondary coil becomes possible. In addition, the flow resistance of the circulating fluid in the vicinity of the heating element is reduced, and highly efficient circulation of the circulating fluid is realized.

[0027] Further, in the heating device of the present invention, the secondary coil may have a portion wound such that the winding diameter of the coil path is different between the upstream side and the downstream side of the pipe. Thereby, a suitable turbulent flow of the circulating fluid is generated around the secondary coil, and heat exchange between the heating element and the circulating fluid can be promoted. Therefore, by highly efficient heating by the secondary coil, the circulating fluid can be efficiently adjusted to an accurate temperature in a short time.

[0028] Further, in the heating device of the present invention, the secondary coil may be formed of at least one of an iron-based material, a nickel alloy-based material, and a ferritic stainless material. Thereby, a secondary coil excellent in durability and safety can be obtained, and the alternating magnetic field by the primary coil can be concentrated on the secondary coil made of a highly magnetic material to improve the efficiency of induction heating of the secondary coil. Therefore, the circulating fluid can be efficiently heated.

[0029] Further, in the heating device of the present invention, the pipe may be formed of an austenitic stainless material. Thereby, a pipe excellent in corrosion resistance, durability, and safety can be obtained, and the alternating magnetic field of the primary coil can be concentrated on the secondary coil to improve the efficiency of induction heating of the secondary coil.

[0030] Further, in the heating device of the present invention, the pipe may have a bent pipe portion in a region where the primary coil is wound, and the region where the primary coil is wound may be formed in a circular shape, an elliptical shape, or a track shape. Thereby, the magnetic flux generated by the alternating current of the primary coil can be concentrated inside the pipe to increase the magnetic flux density inside the pipe, and the efficiency of induction heating of the secondary coil can be improved.

[0031] Further, the temperature adjustment device of the present invention includes a refrigeration cycle circuit in which a compression means, a radiator, a throttling means, and an evaporator are sequentially connected and a refrigerant circulates, and a circulation liquid circuit in which a circulation pump and a heating device are provided and a circulation liquid for adjusting the temperature of a control target circulates. In the circulation liquid circuit, an openable and closable low-temperature path is formed upstream of the heating device, through which the circulation liquid can flow through the evaporator and exchange heat with the refrigerant. The heating device includes a conductive pipe through which the circulation liquid flows, and a primary coil wound around the outer periphery of the pipe through which an alternating current flows. The pipe generates heat by induction heating caused by the alternating current of the primary coil, and the circulation liquid is heated by the pipe. With such a configuration, the circulation liquid flowing through the circulation liquid circuit can be cooled by the refrigeration cycle circuit, and the cooled circulation liquid can be efficiently heated to an accurate temperature by the heating device, enabling high-precision temperature adjustment.

[0032] Further, the temperature adjustment device of the present invention includes a refrigeration cycle circuit in which a compression means, a radiator, a throttling means, and an evaporator are sequentially connected and a refrigerant circulates, and a circulation liquid circuit in which a circulation pump and a heating device are provided and a circulation liquid for adjusting the temperature of a control target circulates. In the circulation liquid circuit, an openable and closable low-temperature path is formed upstream of the heating device, through which the circulation liquid can flow through the evaporator and exchange heat with the refrigerant. The heating device includes a pipe through which the circulation liquid flows, a primary coil wound around the outer periphery of the pipe through which an alternating current flows, and a conductive heating element provided inside the region of the pipe around which the primary coil is wound. The heating element may generate heat by induction heating caused by the alternating current of the primary coil, and the circulation liquid may be heated by the heating element. With such a configuration, the circulation liquid cooled by the refrigeration cycle circuit can be efficiently heated to an accurate temperature by the heating device, and a circulation at a suitable temperature liquid can be supplied to the control target.

[0033] In addition, in the temperature adjustment device of the present invention, the heating element is formed of a wire having a relative permeability of 1 or more covered with an insulating member, and both ends of the wire may be connected so as to form a conductive closed loop. Thereby, an induced current can be efficiently passed through the wire to efficiently heat the circulating liquid to an accurate temperature. In addition, the flow resistance of the circulating liquid in the vicinity of the heating element can be reduced, and the circulating liquid can be efficiently circulated.

[0034] In addition, in the temperature adjustment device of the present invention, the heating element is a secondary coil wound in a coil shape, and both ends of the coil path wound in a coil shape of the secondary coil are connected to form a conductive closed circuit. Thereby, the heating device enables highly efficient induction heating in which an induced current flows suitably. In addition, the flow resistance of the circulating liquid in the vicinity of the heating element in the pipe can be reduced, and the circulating liquid can be efficiently circulated.

[0035] In addition, in the temperature adjustment device of the present invention, the secondary coil may have a portion wound such that the winding diameter of the coil path is different between the upstream side and the downstream side of the pipe. Thereby, a suitable turbulent flow of the circulating liquid can be generated around the secondary coil, and heat exchange between the heating element and the circulating liquid can be promoted. Therefore, by highly efficient heating by the secondary coil, the circulating liquid can be efficiently and precisely adjusted to an accurate temperature in a short time.

[0036] In addition, in the temperature adjustment device of the present invention, the pipe may have a bent pipe portion in a region where the primary coil is wound, and the region where the primary coil is wound may be formed in a circular shape, an elliptical shape, or a track shape. Thereby, the magnetic flux generated by the alternating current of the primary coil can be concentrated inside the pipe to increase the magnetic flux density inside the pipe, and the efficiency of induction heating of the secondary coil can be increased.

[0037] In addition, in the temperature adjustment device of the present invention, in the circulating liquid circuit, an openable and closable high-temperature path is formed upstream of the heating device, through which the circulating liquid flows through the radiator so as to be heat-exchangeable with the refrigerant. The refrigerant is carbon dioxide, and the radiator heats the circulating liquid at a supercritical pressure. The high-temperature path may be provided with a high-temperature tank for storing the circulating liquid heated by the refrigerant in the radiator. With such a configuration, the temperature adjustment device can perform highly efficient temperature adjustment with less waste heat loss by utilizing both the cold heat and the warm heat generated in the refrigeration cycle circuit.

[0038] Specifically, when the temperature of the circulating liquid returning from the control target is low and it is necessary to significantly increase the temperature of the circulating liquid, the high-temperature path of the circulating liquid circuit is opened so that the circulating liquid flows through the high-temperature path. Thereby, the temperature adjustment device can heat the circulating liquid by utilizing the heat dissipation of the refrigerant flowing through the radiator of the refrigeration cycle circuit. Then, the circulating liquid heated by the radiator of the refrigeration cycle circuit is heated to a predetermined temperature by the heating device of the circulating liquid circuit and supplied to the control target at a suitable temperature so that the control target reaches the accurate set temperature. In this way, since the circulating liquid can be heated by utilizing the heat dissipation of the radiator of the refrigeration cycle circuit, the energy consumed by the heating device of the circulating liquid circuit can be reduced, and highly efficient temperature adjustment can be performed.

[0039] Moreover, the refrigerant in the refrigeration cycle circuit is carbon dioxide, and since the radiator heats the circulating liquid at a supercritical pressure, the circulating liquid can be efficiently heated to a high temperature. Specifically, it is possible to heat the circulating liquid in the radiator of the refrigeration cycle circuit up to a high temperature range that was impossible with condensers of conventional chillers etc. that use HFC (hydrofluorocarbon)-based refrigerants, HFO (hydrofluoroolefin)-based refrigerants, or mixed refrigerants of these. Therefore, even when the set temperature is changed to a high temperature of, for example, 130°C due to changes in the processing process etc., the temperature of the circulating liquid can be raised to a high temperature in a short time. Thus, the time loss caused by temperature adjustment can be reduced, and the productivity of semiconductor devices etc. can be improved. Also, since the heating amount by the heating device of the circulating liquid circuit can be reduced, the energy consumption by the heating device can be reduced, and energy saving can be achieved.

[0040] Also, in the high-temperature path, a high-temperature tank for storing the circulating liquid heated by the refrigerant in the radiator is provided. Thereby, for example, when the set temperature of the control target is changed due to changes in the processing process etc. and the temperature of the circulating liquid is significantly increased, the high-temperature circulating liquid stored in the high-temperature tank is supplied to the circulating liquid circuit, and the temperature of the circulating liquid circulating in the circulating liquid circuit can be rapidly increased to a predetermined temperature in a short time. Thus, the time required for changing the set temperature can be significantly shortened, and the time loss associated with the temperature change until starting the processing process, measurement process, etc. can be reduced.

Brief Description of the Drawings

[0041]

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DETAILED DESCRIPTION OF THE INVENTION

[0042] Hereinafter, the temperature adjustment device 1 according to the embodiment of the present invention will be described in detail with reference to the drawings as appropriate. Note that the illustrated embodiments do not limit the present invention, and are merely examples of the embodiments of the present invention.

[0043] FIG. 1 is a diagram showing the schematic configuration of the temperature adjustment device 1 according to the embodiment of the present invention. Referring to FIG. 1, the temperature adjustment device 1 is a device used to adjust the temperature of a control target 46, such as various manufacturing devices such as semiconductor manufacturing devices, or various measuring devices used in semiconductor manufacturing processes, etc., to a predetermined temperature according to the process.

[0044] The temperature adjustment device 1 includes a refrigeration cycle circuit 10 that constitutes a vapor compression refrigeration cycle and cools or heats a circulating liquid with a refrigerant, and a circulating liquid circuit 20 that circulates the circulating liquid cooled or heated by the refrigeration cycle circuit 10 to the control target 46 to adjust the temperature of the control target 46.

[0045] The circulating fluid that circulates through the circulation fluid circuit 20 contains, for example, water. The circulating fluid is cooled or heated by the refrigerant in the refrigeration cycle circuit 10, and is heated to a suitable temperature by the heating device 26 in the circulation fluid circuit 20 and supplied to the control target 46 such as a semiconductor manufacturing apparatus. Thereby, the control target 46 is cooled or heated by the circulating fluid adjusted to a suitable temperature, and is controlled to have a suitable temperature suitable for each manufacturing process, measurement process, etc.

[0046] First, the configuration of the refrigeration cycle circuit 10 will be described in detail. The refrigeration cycle circuit 10 is formed by sequentially connecting a compressor 11 as a compression means, a radiator 12, a second radiator 13, an expansion valve 14 as a throttling means, and an evaporator 15 via a refrigerant pipe 17. The refrigeration cycle circuit 10 constitutes a closed circuit in which the refrigerant circulates and the operation of the vapor compression refrigeration cycle is performed.

[0047] The compressor 11 is a compression means that compresses the refrigerant and sends it to the radiator 12. As the compressor 11, various types of compression devices such as rotary type, scroll type, reciprocating type, and screw type can be adopted.

[0048] In particular, the rotary compressor 11 is suitable when configuring a compact temperature adjustment device 1 with a small cooling capacity. Also, the compressor 11 may be a two-stage compression type. Adopting a two-stage compression type as the compressor 11 is suitable for compressing the carbon dioxide refrigerant that becomes high pressure.

[0049] The radiator 12 is a heat exchanger in which heat exchange occurs between the refrigerant compressed by the compressor 11 and becoming high pressure and high temperature, and the circulating fluid in the circulation fluid circuit 20. The radiator 12 is, for example, a gas cooler. Note that the radiator 12 may be a condenser in which the refrigerant condenses. The radiator 12 is provided, for example, inside a high-temperature tank 39 in which the circulating fluid is stored, and although not shown, has a plurality of tubes through which the refrigerant flows. The tubes are, for example, steel pipes or the like.

[0050] Specifically, the tubes of the radiator 12 have an inlet at the upper part and an outlet at the lower part so that the refrigerant flows from top to bottom, and are wound in a substantially spiral form, for example, and are provided inside the high-temperature tank 39. With such a configuration, the refrigerant flowing through the radiator 12 can efficiently heat the circulating liquid in the high-temperature tank 39.

[0051] For example, even when the circulating liquid in the high-temperature tank 39 is not supplied to the control target 46, that is, even when the circulating liquid does not flow through the high-temperature path 38 of the circulating liquid circuit 20 provided with the high-temperature tank 39, the refrigerant flowing through the radiator 12 can heat the circulating liquid in the high-temperature tank 39.

[0052] That is, according to such a configuration, in order to heat the circulating liquid with the radiator 12, it is possible to heat the circulating liquid stored in the high-temperature tank 39 to a high temperature with the radiator 12 without providing a circulation pump or the like for flowing the circulating liquid through the high-temperature path 38 of the circulating liquid circuit 20.

[0053] Therefore, when the refrigeration cycle circuit 10 is operating to cool the circulating liquid by utilizing the latent heat of vaporization of the evaporator 15, it is possible to effectively utilize the waste heat from the radiator 12 to heat the circulating liquid in the high-temperature tank 39 to a high temperature without circulating the circulating liquid through the high-temperature path 38.

[0054] Note that the radiator 12 may be provided outside the high-temperature tank 39 as long as the refrigerant can exchange heat with the circulating liquid. For example, as the radiator 12, various types of heat exchangers such as plate type, shell and tube type, and double tube type may be adopted.

[0055] The second radiator 13 is a heat exchanger that releases the heat of the refrigerant to the outside, and is provided downstream of the radiator 12. The second radiator 13 is, for example, an air-cooled heat exchanger in which air that exchanges heat with the refrigerant is sent by a blower fan 16. For example, although not shown, the second radiator 13 may be a fin-and-tube type heat exchanger. That is, the second radiator 13 has a plurality of tubes such as copper tubes through which the refrigerant flows, and a plurality of aluminum fins provided in parallel therewith, and the tubes are inserted into holes formed in the fins.

[0056] Note that the second radiator 13 may be a water-cooled heat exchanger. Further, as the second radiator 13, heat exchangers of various types such as plate type, shell-and-tube type, and double-tube type can be adopted. In particular, a plate type heat exchanger is preferable because it has high heat exchange efficiency and can make the second radiator 13 compact.

[0057] Since the second radiator 13 is provided downstream of the radiator 12, the refrigerant whose temperature has decreased by heating the circulating liquid in the radiator 12 can be further cooled to a lower temperature. Further, even when the circulating liquid in the high-temperature tank 39 becomes high temperature and it is not necessary to heat the circulating liquid with the refrigerant flowing through the radiator 12, the high-temperature refrigerant that has passed through the radiator 12 can be cooled to a low temperature by heat radiation in the second radiator 13. Thereby, even when the inside of the high-temperature tank 39 is filled with the high-temperature circulating liquid, the cooling capacity of the refrigeration cycle circuit 10, that is, the ability to cool the circulating liquid by utilizing the latent heat of vaporization of the refrigerant in the evaporator 15, is exhibited.

[0058] The expansion valve 14 is a throttling means for reducing the pressure of the high-pressure refrigerant that has passed through the radiator 12 and the second radiator 13 and has become low temperature. Further, the expansion valve 14 has a function of adjusting the flow of the refrigerant. As the expansion valve 14, various types of throttling means such as an electronic expansion valve, a temperature automatic expansion valve, and a capillary tube can be adopted. By adopting an electronic expansion valve as the expansion valve 14, the cooling and heating of the circulating liquid by the refrigeration cycle circuit 10 can be controlled with high performance.

[0059] The evaporator 15 is a heat exchanger in which low-pressure liquid refrigerant evaporates, and the circulating liquid is cooled by the latent heat of evaporation. As the evaporator 15, various types of heat exchangers such as plate type, double pipe type, tube contact type, shell and tube type can be adopted.

[0060] In particular, the plate type heat exchanger is preferable because it has high heat exchange efficiency and can make the evaporator 15 compact. Also, the double pipe type and the tube contact type are excellent in that they are easy to manufacture and process and suitable pressure resistance strength can be easily obtained.

[0061] The refrigerant pipe 17 downstream of the evaporator 15 is connected to the compressor 11 via an accumulator (not shown). With the above configuration, a closed circuit of the refrigeration cycle circuit 10 in which the compressor 11, the radiator 12, the second radiator 13, the expansion valve 14, and the evaporator 15 are sequentially connected is formed.

[0062] The refrigerant used in the refrigeration cycle circuit 10 is, for example, carbon dioxide. And the carbon dioxide refrigerant heats the circulating liquid at a supercritical pressure in the radiator 12 as a gas cooler. Thereby, the circulating liquid can be efficiently heated to a high temperature.

[0063] Specifically, the circulating liquid can be heated by the radiator 12 of the refrigeration cycle circuit 10 up to a high temperature range that was impossible in condensers of conventional chillers using HFC-based refrigerants, HFO-based refrigerants, or mixed refrigerants thereof.

[0064] For example, even when the temperature adjustment device 1 changes the set temperature to a high temperature of 130 ° C. due to changes in the processing process or the like, the temperature of the circulating liquid can be raised to a high temperature in a short time. Therefore, the temperature adjustment device 1 can reduce the time loss caused by temperature adjustment and improve the productivity of semiconductor devices and the like. Also, since the heating amount by the heating device 26 in the circulating liquid circuit 20 can be reduced, the energy consumption by the heating device 26 can be reduced, and energy saving in semiconductor manufacturing and the like can be achieved. Note that, as the refrigerant of the refrigeration cycle circuit 10, an HFC-based refrigerant, an HFO-based refrigerant, a mixed refrigerant, or the like may be used in the temperature adjustment device 1.

[0065] In addition, the refrigeration cycle circuit 10 is provided with a refrigerant temperature sensor 18 for measuring the temperature of the refrigerant, a pressure sensor 19 for measuring the pressure of the refrigerant, and the like. The control device 43 (see FIG. 7) controls the rotation speed of the compressor 11 and the opening degree of the expansion valve 14 based on the set temperature of the control target 46, the measured temperature information, the temperature of the refrigerant measured by the refrigerant temperature sensor 18, the pressure of the refrigerant measured by the pressure sensor 19, and the like.

[0066] Next, the circulating liquid circuit 20 will be described in detail. The circulating liquid circuit 20 constitutes a closed circuit in which the circulating liquid for cooling and heating the control target 46 circulates. Specifically, the circulating liquid circuit 20 includes a plurality of circuit modules 21 connected to the control target 46 for circulating the circulating liquid, a low-temperature path 31 to which the circuit modules 21 are connected and through which the circulating liquid flows through the evaporator 15 so as to be heat-exchangeable with the refrigerant, and a high-temperature path 38 to which the circuit modules 21 are connected and through which the circulating liquid flows through the radiator 12 so as to be heat-exchangeable with the refrigerant.

[0067] The circuit module 21 is a device that supplies the circulating liquid to the control target 46 to adjust the temperature of the control target 46. A basic circulation path 22 serving as a basic closed circuit for circulating the circulating liquid is formed in each circuit module 21. Specifically, in the circuit module 21, a basic circulation path 22 is formed, which is a closed circuit connected to a feed path 23 for supplying the circulating liquid to the control target 46 such as a semiconductor manufacturing apparatus and a return path 24 to which the circulating liquid that has cooled and heated the control target 46 is returned.

[0068] In the feed path 23 of each circuit module 21, a circulation pump 25 for sending the circulating liquid to the control target 46, a heating device 26 for heating the circulating liquid supplied to the control target 46 to adjust the temperature, and a temperature sensor 27 for measuring the temperature of the circulating liquid heated by the heating device 26 are provided.

[0069] The heating device 26 is an induction heating type heating means for heating the circulating liquid. Details of the heating device 26 will be described later. An induction heating power source 48 is connected to the heating device 26. The induction heating power source 48 is a power supply device that supplies power to the heating device 26. An alternating current flows through the heating device 26 by the power from the induction heating power source 48, and the circulating liquid is heated by the induction heating caused by the alternating current.

[0070] The temperature sensor 27 is provided in the feed path 23 downstream of the heating device 26, and measures the temperature of the circulating liquid heated by the heating device 26. The circulation pump 25, the heating device 26, and the temperature sensor 27 are connected to the control device 43. The control device 43 controls the circulation pump 25 and the heating device 26 so that the temperature of the circulating liquid measured by the temperature sensor 27 becomes a predetermined temperature. Thereby, the temperature of the control target 46 is controlled to become the set temperature. Specifically, the output of the induction heating power source 48, that is, the power supplied to the heating device 26, is controlled by the control device 43, and the heating of the circulating liquid by the heating device 26 is controlled.

[0071] Also, a solenoid valve 28 for opening and closing the feed path 23 is provided in the basic circulation path 22 of each circuit module 21. Thereby, when temperature control is not required for the control target 46 connected to the circuit module 21, the solenoid valve 28 can be closed to stop the flow of the circulating liquid.

[0072] The low-temperature path 31 is a path for cooling the circulating liquid by the refrigeration cycle circuit 10. The low-temperature path 31 is connected to the return path 24 side of the circuit module 21 at the inlet side and to the feed path 23 side of the circuit module 21 at the outlet side so as to form a bypass path for the circulating liquid in the basic circulation path 22.

[0073] That is, the circulating liquid circulating in the basic circulation path 22 of the circuit module 21 can flow into the low-temperature path 31 at the branch point that becomes the inlet of the low-temperature path 31. Also, the circulating liquid can flow to the feed path 23 side without flowing into the low-temperature path 31.

[0074] A mixing valve 30 is provided at the confluence point of the outlet of the low-temperature path 31 and the basic circulation path 22. The mixing valve 30 is a valve that mixes the circulating liquid that has passed through the low-temperature path 31 with the circulating liquid supplied to the control target 46 via the feed path 23 of the circuit module 21. That is, the low-temperature path 31 can be opened and closed and its flow rate can be adjusted by the mixing valve 30.

[0075] By adjusting the mixing valve 30, an operation can be performed in which the circulating liquid that has returned from the control target 46 is mixed with the circulating liquid cooled by the evaporation of the refrigerant in the evaporator 15 of the refrigeration cycle circuit 10 to obtain a suitable temperature.

[0076] Also, by adjusting the mixing valve 30, it is also possible to perform an operation in which the circulating liquid cooled by the evaporator 15 is not supplied to the control target 46. That is, a temperature adjustment operation can also be performed in which only the circulating liquid that has returned from the control target 46 or only the circulating liquid heated by the radiator 12 is sent to the feed path 23, heated by the heating device 26, and supplied to the control target 46 for circulation.

[0077] In addition, the low-temperature path 31 is provided with a low-temperature tank 32 for storing the circulating liquid, a low-temperature pump 33 for sending the circulating liquid, and a low-temperature circulation path 34 for returning the circulating liquid to the inlet side of the low-temperature path 31 without sending it to the control target 46.

[0078] Specifically, for example, a low-temperature tank 32 is provided on the inlet side of the low-temperature path 31, a low-temperature pump 33 is provided downstream of the low-temperature tank 32, and an evaporator 15 is provided downstream of the low-temperature pump 33. And the low-temperature circulation path 34 may be provided so as to connect the system branch pipe 36 provided downstream of the evaporator 15 of the low-temperature path 31 and the low-temperature tank 32 provided on the inlet side of the low-temperature path 31.

[0079] The cryogenic tank 32 is provided with a cryogenic sensor 37 for measuring the temperature of the circulating fluid within the cryogenic tank 32. The cryogenic pump 33 and the cryogenic sensor 37 are connected to the control device 43. The control device 43 may utilize the temperature information of the circulating fluid measured by the cryogenic sensor 37 in calculations to control the operation of the circulation pump 25 and the cryogenic pump 33, as well as the adjustment of the opening degree of the mixing valve 30, etc.

[0080] As described above, the cryogenic path 31 is provided with the cryogenic tank 32, the cryogenic pump 33 for sending the circulating fluid, and the cryogenic circulation path 34 for returning the circulating fluid from the outlet side to the inlet side of the cryogenic path 31. Therefore, even when the circulating fluid in the cryogenic path 31 is not used as the circulating fluid supplied to the control target 46, the circulating fluid in the cryogenic path 31 can be circulated and cooled by the refrigerant flowing through the evaporator 15.

[0081] Then, the circulating fluid cooled by the refrigerant can be stored in the cryogenic tank 32, and the stored low-temperature circulating fluid can be supplied to the circulating fluid circuit 20 as needed. For example, when the set temperature of the control target 46 is changed due to a change in the processing step or the like, and the temperature of the circulating fluid is significantly reduced, low warm tank 32 the low-temperature circulating fluid stored therein can be supplied to the circulating fluid circuit 20.

[0082] Thereby, the temperature of the circulating fluid circulating in the circulating fluid circuit 20 can be rapidly reduced to a predetermined temperature in a short time. Therefore, the time required for changing the set temperature can be significantly shortened, and the time loss associated with the temperature change until the start of the processing step, the measurement step, etc. can be reduced.

[0083] Also, as described above, the cryogenic path 31 is provided with the cryogenic tank 32, the cryogenic pump 33, and the cryogenic circulation path 34. Therefore, even when the circulating fluid in the cryogenic path 31 is not supplied to the control target 46, the refrigeration cycle circuit 10 can be operated to heat the circulating fluid in the high-temperature path 38 with the refrigerant in the radiator 12.

[0084] The high-temperature path 38 is a path for heating the circulating fluid by the refrigeration cycle circuit 10. The high-temperature path 38 is connected on the inlet side to the return path 24 side of the circuit module 21 and on the outlet side to the feed path 23 side of the circuit module 21 so as to form a bypass path for the circulating fluid in the basic circulation path 22.

[0085] Specifically, a three-way valve 29 is provided in the basic circulation path 22 of the circulating fluid circuit 20 upstream of the branch point to the low-temperature path 31. The three-way valve 29 is a valve that switches whether to send the circulating fluid returning from the controlled object 46 to the high-temperature path 38. That is, the high-temperature path 38 can be opened, closed, and its flow rate adjusted by the three-way valve 29.

[0086] Specifically, the inlet of the high-temperature path 38 is connected to the three-way valve 29. The outlet of the high-temperature path 38 is connected downstream of the three-way valve 29 in the basic circulation path 22 and upstream of the branch point to the low-temperature path 31.

[0087] With such a configuration, by switching the three-way valve 29, it is possible to switch between and execute an operation of supplying the circulating fluid heated by the radiator 12 of the refrigeration cycle circuit 10 to the controlled object 46 and an operation of not supplying it.

[0088] The high-temperature path 38 is provided with a high-temperature tank 39 for storing the circulating fluid heated to a high temperature and a high-temperature sensor 42 for measuring the temperature of the circulating fluid in the high-temperature tank 39. And inside the high-temperature tank 39, the radiator 12 of the refrigeration cycle circuit 10 is provided so that the circulating fluid can be heated by the refrigerant.

[0089] The high-temperature tank 39 has an inlet for the circulating fluid formed at the lower part and an outlet for the circulating fluid formed at the upper part. Thereby, the high-temperature circulating fluid stored in the high-temperature tank 39 can be efficiently supplied to the controlled object 46.

[0090] That is, the low-temperature circulating fluid returning from the control target 46 flows into the high-temperature path 38 through the three-way valve 29 and flows into the inside of the high-temperature tank 39 from the inlet formed at the lower part of the high-temperature tank 39. Then, the high-temperature circulating fluid stored in the high-temperature tank 39 is sent from the outlet formed at the upper part of the high-temperature tank 39 to the basic circulation path 22 and supplied to the control target 46.

[0091] In this way, the temperature adjustment device 1 includes the high-temperature tank 39 and can send the high-temperature circulating fluid stored in the high-temperature tank 39 to the basic circulation path 22. Therefore, for example, when the set temperature of the control target 46 is changed due to a change in a processing step or the like and the temperature of the circulating fluid is significantly increased, a highly efficient temperature change becomes possible.

[0092] That is, the high-temperature circulating fluid stored in the high-temperature tank 39 can be supplied to the circulating fluid circuit 20, and the temperature of the circulating fluid circulating in the circulating fluid circuit 20 can be rapidly increased to a predetermined temperature in a short time. Therefore, the temperature adjustment device 1 can significantly shorten the time required for changing the set temperature and reduce the time loss associated with the temperature change until the start of a processing step, a measurement step, or the like.

[0093] Note that the control device 43 may use the temperature information of the circulating fluid in the high-temperature tank 39 measured by the high-temperature sensor 42 in the operation for controlling the opening and closing of the three-way valve 29. Thereby, the flow of the high-temperature path 38 can be controlled according to the amount of the high-temperature circulating fluid stored in the high-temperature tank 39. Therefore, when the high-temperature circulating fluid stored in the high-temperature tank 39 is insufficient, it is possible to suppress the low-temperature circulating fluid from being sent to the basic circulation path 22 and causing a time loss in the temperature change.

[0094] Also, system confluence pipes 35 and 40 and system branch pipes 36 and 41 for connecting a plurality of circuit modules 21 are provided in the low-temperature path 31 and the high-temperature path 38. Specifically, in the low-temperature path 31, a system confluence pipe 35 is provided on the inlet side and a system branch pipe 36 is provided on the outlet side. In the high-temperature path 38, a system confluence pipe 40 is provided on the inlet side and a system branch pipe 41 is provided on the outlet side.

[0095] As a result, a plurality of circuit modules 21, for example, two to eight or more circuit modules 21, can be connected to the low-temperature path 31 and the high-temperature path 38 via the system confluence pipes 35, 40 and the system branch pipes 36, 41.

[0096] Each of the plurality of circuit modules 21 has a circulation pump 25 and a heating device 26, and can circulate the circulating liquid to a different control target 46 respectively. As a result, by using one refrigeration cycle circuit 10, control targets 46 such as a plurality of processing locations and measurement locations can be cooled and heated with high efficiency, and each control target 46 can be adjusted to a suitable temperature.

[0097] FIG. 2 is a diagram showing a schematic configuration of the heating device 26, and shows a cross section of the pipe 55. In FIG. 2, the arrow indicates the flow direction of the circulating liquid. Referring to FIG. 2, the heating device 26 has a pipe 55 through which the circulating liquid flows and a primary coil 50 wound around the outer periphery of the pipe 55. The pipe 55 is provided in the feed path 23 (see FIG. 1) of the basic circulation path 22 (see FIG. 1) and serves as a flow path through which the circulating liquid flows.

[0098] The primary coil 50 generates an alternating magnetic field by an alternating current, is formed of a conductor covered with an insulating material, etc., and is wound around the outer periphery of the pipe 55 in a substantially spiral shape. That is, the primary coil 50 constitutes a coil-shaped conductive path around the outer periphery of the pipe 55, and both ends are connected to an induction heating power source 48 (see FIG. 1).

[0099] Here, the pipe 55 is formed of, for example, a conductive material. As a result, the pipe 55 can generate heat by induction heating by the alternating current of the primary coil 50 and heat the circulating liquid flowing through the pipe 55.

[0100] That is, a magnetic field is generated by the alternating current flowing through the primary coil 50, and eddy currents flow through the pipe 55 so as to cancel this magnetic field. And since the pipe 55 has an electrical resistance, Joule heat is generated by the eddy currents flowing through the pipe 55, and the circulating liquid flowing through the pipe 55 can be heated.

[0101] In this way, the heat of the pipe 55 that generates heat by electromagnetic induction can be directly transferred to the circulating liquid, and the circulating liquid can be efficiently heated to an accurate temperature. Therefore, in a semiconductor manufacturing apparatus or the like, it is possible to shorten the time required for heating the circulating liquid for temperature control and execute a highly efficient processing process with less time loss.

[0102] FIG. 3 is a diagram showing another example of the heating device 26, and shows a cross section of the pipe 55. In FIG. 3, the arrow indicates the flow direction of the circulating liquid. As shown in FIG. 3, inside the pipe 55, a heating pipe 52 as a heating element 51 made of a conductive material may be provided inside the region where the primary coil 50 is wound.

[0103] For example, the heating pipe 52 is a substantially cylindrical member provided substantially coaxially with the pipe 55. That is, a substantially double-tubular shape is formed by the pipe 55 and the substantially cylindrical heating pipe 52 provided inside it. By providing such a heating pipe 52, the heating pipe 52 generates heat by induction heating with the alternating current of the primary coil 50, and the circulating liquid can be directly heated by the high-temperature heating pipe 52.

[0104] Note that the heating pipe 52 provided inside the pipe 55 may be a member formed of a conductive material such as copper, iron, stainless steel, or other metals. Preferably, the material forming the heating pipe 52 is an iron-based material, a nickel alloy-based material, a ferritic stainless steel material, etc. with a relative permeability of 1 or more. Thereby, highly efficient induction heating is performed. Also, the shape of the heating pipe 52 is not limited to a cylindrical shape.

[0105] Also, as the material constituting the heating pipe 52, for example, a metal plate or the like having through holes formed therein, such as punching metal, may be used. Thereby, the holes formed in the heating pipe 52 can be used as flow paths through which the circulating liquid passes. With the heating pipe 52 in such a form, a heating element 51 with a small flow resistance of the circulating liquid and capable of efficiently heating the circulating liquid can be obtained.

[0106] FIG. 4 is a diagram showing still another example of the heating device 26, and shows a cross section of the pipe 55. In FIG. 4, the arrow indicates the flow direction of the circulating liquid. As shown in FIG. 4, the heating element 51 provided inside the pipe 55 may be a heating loop 53 formed in a closed loop shape from a conducting wire.

[0107] Specifically, the conducting wire forming the heating loop 53 has both ends connected so as to form a conductive closed circuit. With such a configuration, an induced current can flow efficiently through the heating element 51, and the efficiency of induction heating of the heating element 51 can be enhanced. Also, the flow resistance of the circulating liquid in the vicinity of the heating element 51 can be reduced, and the circulating liquid can be circulated efficiently.

[0108] Also, the heating loop 53 may be formed from a conducting wire such as an iron wire, a nickel alloy wire, or a ferrite stainless steel wire having a relative permeability of 1 or more. By using such a conducting wire made of a ferromagnetic material, it becomes possible to collect magnetic flux in the heating element 51 and perform highly efficient induction heating. Also, since the iron wire can keep the manufacturing cost of the heating loop 53 low, it is also suitable from the viewpoint of the productivity of the heating loop 53.

[0109] Also, the conducting wire forming the heating loop 53 is covered with, for example, enamel, a glass tube, a resin material, etc. That is, the conducting wire is coated or covered with a resin material or the like. Thereby, leakage of the induced current to the outside of the conducting wire is suppressed, and safe and highly efficient induction heating is performed.

[0110] FIG. 5 is a diagram showing still another example of the heating device 26, and shows a cross section of the pipe 55. In FIG. 5, the arrow indicates the flow direction of the circulating liquid. As shown in FIG. 5, inside the pipe 55, a secondary coil 54 made of a conductive material may be provided as the heating element 51. Specifically, the secondary coil 54 is a member in which a conductive wire or the like is wound in a coil shape.

[0111] With such a configuration, the secondary coil 54, which is the heating element 51, generates heat by induction heating due to the alternating current in the primary coil 50, and directly transfers the heat of the heated secondary coil 54 to the circulating fluid, enabling efficient and accurate heating of the circulating fluid to a specific temperature. Therefore, time loss in the manufacturing process can be reduced, and the productivity of semiconductor devices and the like can be improved.

[0112] Note that heating elements 51 such as the heating pipe 52 (see Fig. 3), the heating loop 53 (see Fig. 4), and the secondary coil 54 are fixed to the inner periphery of the pipe 55 by, for example, an insulating support member (not shown). That is, the heating element 51 such as the secondary coil 54 is non-contact with respect to the primary coil 50 through which an alternating current flows, and is provided inside the pipe 55 through which the circulating fluid flows. Therefore, direct heat dissipation from the heating element 51 such as the secondary coil 54 to the outside of the pipe 55 can be reduced, and highly efficient heating with less heat dissipation loss can be performed.

[0113] In addition, the heating device 26 is configured such that the heating element 51 such as the secondary coil 54 is provided non-contact with respect to the primary coil 50 to which the induction heating power supply 48 (see Fig. 1) is connected and alternating current power is supplied. Therefore, it is also excellent from the viewpoints of safety and reliability against electric leakage, electrical wiring damage, etc. In addition, by adopting the heating element 51 wound in a coil shape in this way, the flow resistance of the circulating fluid in the heating element 51 is reduced, enabling highly efficient circulation of the circulating fluid.

[0114] Also, the secondary coil 54 as the heating element 51 has both ends of the coiled coil path connected to form a conductive closed circuit. This enables highly efficient induction heating in which an induced current flows preferably.

[0115] In addition, the secondary coil 54 may have a portion wound such that the coil diameter of the coil path is different between the upstream side and the downstream side of the pipe 55. Specifically, the secondary coil 54 may be formed with a large-diameter winding portion having a large coil diameter of the coil path and a small-diameter winding portion having a small coil diameter of the coil path.

[0116] By forming a large-diameter winding portion, a small-diameter winding portion, etc. with different winding diameters in this way, a suitable turbulent flow of the circulating liquid can be generated around the secondary coil 54, and heat exchange between the heating element 51 and the circulating liquid can be promoted. Therefore, by highly efficient heating by the secondary coil 54, the circulating liquid can be efficiently adjusted to an accurate temperature in a short time.

[0117] Specifically, the secondary coil 54 may be wound in a substantially conical shape or a substantially cup shape such that the winding diameter of the coil gradually decreases. With such a configuration, it is possible to suppress the circulating liquid flowing in the pipe 55 from passing through a position away from the secondary coil 54 as the heating element 51, and the circulating liquid will approach the heating portion of the secondary coil 54 and pass through the secondary coil 54.

[0118] That is, the circulation liquid is suppressed from passing through the secondary coil 54 at a low temperature without being heated by the secondary coil 54, and the circulating liquid passing through the secondary coil 54 will approach the secondary coil 54 and be preferably heated. Therefore, the secondary coil 54 enables the circulating liquid to be efficiently heated to an accurate temperature.

[0119] In addition, the secondary coil 54 wound in a substantially conical spiral shape may be provided such that a small-diameter winding portion with a small winding diameter is on the upstream side of the flow of the circulating liquid and a large-diameter winding portion with a large winding diameter is on the downstream side, as shown in FIG. 5. Conversely, although not shown, the secondary coil 54 may be provided such that a large-diameter winding portion with a large winding diameter is on the upstream side of the pipe 55 and a small-diameter winding portion with a small winding diameter is on the downstream side.

[0120] Also, the secondary coil 54 may be formed of a ferromagnetic material having a relative magnetic permeability of 1 or more, preferably much larger than 1, in the same manner as the aforementioned heating loop 53. For example, the secondary coil 54 may be formed of at least one of a ferrite-based stainless steel material, an iron-based material, a nickel alloy-based material, etc.

[0121] The ferrite stainless steel material can obtain a secondary coil 54 with excellent corrosion resistance, durability, and safety. At the same time, the alternating magnetic field generated by the primary coil 50 can be concentrated on the secondary coil 54 made of a high-magnetic material, thereby enhancing the efficiency of induction heating of the secondary coil 54. Therefore, the circulating fluid can be efficiently heated. In addition to being able to achieve high efficiency of induction heating, the iron-based material also has the advantage of reducing the production cost of the secondary coil 54. Also, similar to the aforementioned heating loop 53, the secondary coil 54 may be covered with an insulating member.

[0122] Also, the pipe 55 may be formed of a non-magnetic material, for example, an austenitic stainless steel material. Thereby, a pipe 55 with excellent corrosion resistance, durability, and safety can be obtained, and the alternating magnetic field of the primary coil 50 can be concentrated on the secondary coil 54 to enhance the efficiency of induction heating of the secondary coil 54.

[0123] FIG. 6 is a diagram showing a schematic configuration of the heating device 26, and shows an example of a schematic form of the pipe 55 and the primary coil 50. As shown in FIG. 6, the pipe 55 constituting the heating device 26 has a bent pipe portion 56 in the region where the primary coil 50 is wound, and the region where the primary coil 50 is wound may be formed in a substantially circular shape, a substantially elliptical shape, or a substantially track shape. Thereby, the magnetic flux generated by the alternating current of the primary coil 50 can be concentrated inside the pipe 55 to increase the magnetic flux density inside the pipe 55.

[0124] That is, when the bent pipe portion 56 is formed in the pipe 55, one end and the other end of the region of the pipe 55 where the primary coil 50 is wound are in a state of approaching each other. Thereby, the magnetic flux generated outside the pipe 55 is generated at a short distance so as to connect the vicinity of one end and the vicinity of the other end that are approaching each other. Therefore, the magnetic flux along the outer periphery of the pipe 55 can be reduced and the alternating magnetic flux can be concentrated inside the pipe 55. And the eddy current generated in the heating elements 51 such as the heating pipe 52 (see FIG. 3), the heating loop 53 (see FIG. 4), and the secondary coil 54 (see FIG. 5) can be increased to enhance the efficiency of induction heating.

[0125] FIG. 7 is a block diagram showing the control system of the temperature adjustment device 1. As shown in FIG. 7, the temperature adjustment device 1 includes a control device 43 that controls each component device. The control device 43 is a control means including a microprocessor, and executes a predetermined calculation to control the temperature of the control target 46 (see FIG. 1).

[0126] Connected to the input of the control device 43 are sensors such as a refrigerant temperature sensor 18 that detects the temperature of the refrigerant, a pressure sensor 19 that detects the pressure of the refrigerant, a temperature sensor 27 that detects the temperature of the circulating liquid supplied to the control target 46, a low-temperature sensor 37 that detects the temperature of the circulating liquid in the low-temperature path 31, a high-temperature sensor 42 that detects the temperature of the circulating liquid in the high-temperature path 38, and a temperature sensor 47 that detects the temperature of the control target 46.

[0127] Connected to the output of the control device 43 are a compressor 11, an expansion valve 14, and a blower fan 16 of the refrigeration cycle circuit 10, as well as a circulation pump 25, a heating device 26, a solenoid valve 28, a three-way valve 29, a mixing valve 30, and a low-temperature pump 33 of the circulating liquid circuit 20.

[0128] In addition, the control device 43 is provided with an input device 44 for inputting the set temperature of the control target 46 and other operation information, and a display device 45 for displaying the temperature information of each part and other control information. Note that other sensors (not shown), information input devices, display devices, control target devices, recording devices, etc. may be connected to the control device 43.

[0129] Based on inputs such as the refrigerant temperature sensor 18, the pressure sensor 19, the temperature sensor 27, the low-temperature sensor 37, the high-temperature sensor 42, the temperature sensor 47, and the input device 44, the control device 43 executes a predetermined calculation and controls the compressor 11, the expansion valve 14, the blower fan 16, the circulation pump 25, the heating device 26, the solenoid valve 28, the three-way valve 29, the mixing valve 30, and the low-temperature pump 33.

[0130] Next, with reference to FIGS. 8 to 11, the temperature adjustment method by the temperature adjustment device 1 will be described in detail. FIG. 8 is a diagram showing the flow path of the circulating fluid, and shows an example in which the circulating fluid cooled or heated by the refrigeration cycle circuit 10 is not used. In FIGS. 8 to 11, the path through which the circulating fluid flows is indicated by a thick line, and the flow direction of the circulating fluid is indicated by an arrow.

[0131] As shown in FIG. 8, by closing the high-temperature path 38 with the three-way valve 29 and closing the low-temperature path 31 with the mixing valve 30, it is also possible not to supply the circulating fluid cooled by the evaporator 15 and the circulating fluid heated by the radiator 12 to the control target 46. That is, the circulating fluid circulates through the basic circulation path 22 without passing through the low-temperature path 31 and the high-temperature path 38. In this way, it is also possible to perform a temperature adjustment operation in which the circulating fluid flowing through the low-temperature path 31 or the high-temperature path 38 is not sent to the feed path 23, and only the circulating fluid returned from the control target 46 is directly sent to the feed path 23, heated by the heating device 26, and sent to the control target 46 for circulation.

[0132] FIG. 9 is a diagram showing the flow path of the circulating fluid when performing a temperature adjustment operation using the circulating fluid cooled by the refrigeration cycle circuit 10. As shown in FIG. 9, when cooling of the control target 46 is required, the mixing valve 30 is controlled by the control device 43 (see FIG. 7), and the low-temperature path 31 of the circulating fluid circuit 20 is opened so that the circulating fluid flows through the low-temperature path 31.

[0133] Then, a part of the circulating fluid returned from the control target 46 flows through the low-temperature path 31 and is cooled by utilizing the latent heat of the refrigerant evaporating in the evaporator 15 of the refrigeration cycle circuit 10. Then, the circulating fluid cooled by the refrigeration cycle circuit 10 merges with the circulating fluid in the basic circulation path 22 that has not flowed through the low-temperature path 31, is heated to a predetermined temperature by the heating device 26, and is supplied to the control target 46 at a suitable temperature so that the control target 46 reaches the set temperature.

[0134] FIG. 10 is a diagram showing another example of using the circulating fluid cooled by the refrigeration cycle circuit 10. As shown in FIG. 10, the mixing valve 30 may be controlled to open the low-temperature path 31 by 100%. That is, the circulating fluid returning from the control object 46 does not directly pass through the mixing valve 30, and all of it passes through the low-temperature path 31. Then, only the circulating fluid cooled by the refrigerant in the refrigeration cycle circuit 10 passes through the mixing valve 30 and is sent to the feed path 23.

[0135] With such a flow path, a large amount of circulating fluid cooled to a low temperature in the refrigeration cycle circuit 10 and stored in the low-temperature tank 32 can be sent to the circulating fluid circuit 20, and the temperature of the circulating fluid supplied to the control object 46 can be rapidly decreased. Therefore, the time loss in the process of changing the set temperature and the like can be reduced, and the productivity of semiconductor devices and the like can be improved.

[0136] FIG. 11 is a diagram showing the flow path of the circulating fluid when performing a temperature adjustment operation using the circulating fluid heated by the refrigeration cycle circuit 10. Referring to FIG. 11, when the temperature of the circulating fluid returning from the control object 46 is low and it is necessary to significantly increase the temperature of the circulating fluid, the three-way valve 29 is controlled by the control device 43 (see FIG. 7) and the high-temperature path 38 of the circulating fluid circuit 20 is opened. As a result, the circulating fluid returning from the control object 46 flows through the high-temperature path 38. Then, the circulating fluid in the high-temperature tank 39 that has become high temperature by using the heat dissipation of the refrigerant flowing through the radiator 12 of the refrigeration cycle circuit 10 is sent to the basic circulation path 22.

[0137] Then, the circulating fluid heated by the refrigeration cycle circuit 10 is sent to the feed path 23 through the mixing valve 30, heated to a predetermined temperature by the heating device 26, and supplied to the control object 46 at a suitable temperature so that the control object 46 reaches the accurate set temperature.

[0138] In this way, the radiator 12 of the refrigeration cycle circuit 10 is used to heat the circulating liquid, which is then stored in the high-temperature tank 39. The high-temperature circulating liquid stored in the high-temperature tank 39 is supplied to the basic circulation path 22, enabling the circulating liquid flowing through the basic circulation path 22 to be changed to a high temperature in a short time. Therefore, the energy consumed by the heating device 26 in the circulating liquid circuit 20 can be reduced, and highly efficient temperature adjustment can be achieved.

[0139] When the control device 43 opens the three-way valve 29, the high-temperature circulating liquid stored in the high-temperature tank 39 is sent to the basic circulation path 22. After the temperature of the circulating liquid circulating through the basic circulation path 22 rises to a predetermined temperature in a short time, as shown in FIGS. 8, 9, and 10, the three-way valve 29 is closed by the control device 43, and normal temperature adjustment operation can be performed where the circulating liquid does not flow through the high-temperature path 38.

[0140] That is, as shown in FIG. 8, an operation may be performed to adjust the temperature by heating the circulating liquid circulating through the basic circulation path 22 only with the heating device 26 without using the refrigeration cycle circuit 10. Also, as shown in FIG. 9, an operation may be performed to adjust the temperature by mixing the low-temperature circulating liquid flowing through the low-temperature path 31 with the circulating liquid circulating through the basic circulation path 22. Further, as shown in FIG. 10, a temperature adjustment operation may be performed where the low-temperature path 31 is fully opened by the mixing valve 30, and all the circulating liquid circulating through the basic circulation path 22 is sent to the feed path 23 via the low-temperature path 31.

[0141] That is, as shown in FIG. 11, after a temperature change with a large temperature difference is made due to a change in the processing process or the like, as shown in FIGS. 8, 9, and 10, temperature adjustment can be performed using a cooling capacity and a heating capacity that are small to the extent corresponding to the heat dissipation amount and the heat absorption amount in the control object 46.

[0142] In this way, the temperature adjustment device 1 can circulate the circulating liquid through a suitable path according to the situation of the control object 46, change the set temperature efficiently in a short time, and adjust the temperature of the control object 46 efficiently with a small amount of energy consumption.

[0143] As described above, the temperature adjustment device 1 according to the present embodiment can perform highly efficient temperature adjustment with less exhaust heat loss by using both the cold heat and the warm heat generated in the refrigeration cycle circuit 10 for the control target 46 such as a semiconductor manufacturing apparatus.

[0144] Note that the present invention is not limited to the above-described embodiment. The present invention can be variously modified without departing from the gist thereof.

Explanation of Reference Numerals

[0145] 1 Temperature adjustment device 10 Refrigeration cycle circuit 11 Compressor 12 Radiator 13 Second radiator 14 Expansion valve 15 Evaporator 16 Blower fan 17 Refrigerant pipe 18 Refrigerant temperature sensor 19 Pressure sensor 20 Circulating liquid circuit 21 Circuit module 22 Basic circulation path 23 Feed path 24 Return path 25 Circulation pump 26 Heating device 27 Temperature sensor 28 Solenoid valve 29 Three-way valve 30 Mixing valve 31 Low-temperature path 32 Low-temperature tank 33 Low-temperature pump 34 Low-temperature circulation path 35 System confluence pipe 36 System branch pipe 37 Low-temperature sensor 38 High-temperature path 39 High-temperature tank 40 System confluence pipe 41 System branch pipe 42 High-temperature sensor 43 Control device 44 Input device 45 Display device 46 Controlled object 47 Temperature sensor 48 Induction heating power supply 50 Primary coil 51 Heating element 52 Heating tube 53 Heating loop 54 Secondary coil 55 Pipe 56 Bent pipe section

Claims

1. A heating device for heating a circulating fluid that adjusts the temperature of a controlled object, comprising: a pipe through which the circulating fluid flows; a primary coil wound around the outer periphery of the pipe through which an alternating current flows; a conductive heating element provided inside the region of the pipe around which the primary coil is wound; and the heating element generates heat by induction heating with the alternating current of the primary coil, and the circulating fluid is heated by the heating element; the heating element is formed of a wire having a relative permeability of 1 or more covered with an insulating member; the wire is characterized in that both ends are connected to form a conductive closed loop. A heating device.

2. A heating device for heating a circulating fluid that adjusts the temperature of a controlled object, comprising: a pipe through which the circulating fluid flows; a primary coil wound around the outer periphery of the pipe through which an alternating current flows; a conductive heating element provided inside the region of the pipe around which the primary coil is wound; and the heating element generates heat by induction heating with the alternating current of the primary coil, and the circulating fluid is heated by the heating element; the heating element is a secondary coil wound in a coil shape; the secondary coil is characterized in that both ends of a coil path wound in a coil shape are connected to form a conductive closed circuit. A heating device.

3. The heating device according to claim 2, wherein the secondary coil has a portion wound such that the winding diameter of the coil path is different on the upstream side and the downstream side of the pipe.

4. The heating device according to claim 2, wherein the secondary coil is formed of at least one of an iron-based material, a nickel alloy-based material, and a ferritic stainless steel material.

5. The heating device according to claim 4, wherein the pipe is formed of an austenitic stainless steel material.

6. The pipe according to any one of claims 1 to 5, wherein the pipe has a bent pipe portion in the region where the primary coil is wound, and the region where the primary coil is wound is formed in a circular shape, an elliptical shape, or a track shape. Heating device.

7. A refrigeration cycle circuit in which a compression means, a radiator, a throttling means, and an evaporator are sequentially connected and a refrigerant circulates; a circulation pump and a heating device are provided, and a circulating fluid circuit in which a circulating fluid that adjusts the temperature of a controlled object circulates; In the circulating fluid circuit, an openable and closable low-temperature path is formed upstream of the heating device, through which the circulating fluid flows through the evaporator so as to be heat-exchangeable with the refrigerant. The heating device includes a pipe through which the circulating liquid flows, a primary coil wound around the outer periphery of the pipe through which an alternating current flows, and a conductive heating element provided inside the region of the pipe around which the primary coil is wound. The heating element generates heat by induction heating due to the alternating current of the primary coil, and the circulating liquid is heated by the heating element. The heating element is formed of a wire having a relative permeability of 1 or more covered with an insulating member. The wire is characterized in that both ends are connected to form a conductive closed loop, and it is a temperature adjustment device.

8. A refrigeration cycle circuit in which a compression means, a radiator, a throttling means, and an evaporator are sequentially connected and a refrigerant circulates, A circulating liquid circuit provided with a circulation pump and a heating device and in which a circulating liquid for adjusting the temperature of a control object circulates. In the circulating liquid circuit, an openable and closable low-temperature path is formed upstream of the heating device, through which the circulating liquid flows through the evaporator so as to be heat-exchangeable with the refrigerant. The heating device includes a pipe through which the circulating liquid flows, a primary coil wound around the outer periphery of the pipe through which an alternating current flows, and a conductive heating element provided inside the region of the pipe around which the primary coil is wound. The heating element generates heat by induction heating due to the alternating current of the primary coil, and the circulating liquid is heated by the heating element. The heating element is a secondary coil wound in a coil shape. The secondary coil is characterized in that both ends of a coil path wound in a coil shape are connected to form a conductive closed circuit, and it is a temperature adjustment device.

9. The temperature adjustment device according to claim 8, wherein the secondary coil has a portion wound such that the winding diameter of the coil path is different between the upstream side and the downstream side of the pipe.

10. The temperature adjustment device according to any one of claims 7 to 9, wherein the pipe has a bent pipe portion in the region around which the primary coil is wound, and the region around which the primary coil is wound is formed in a circular shape, an elliptical shape, or a track shape.

11. In the circulating liquid circuit, an openable and closable high-temperature path is formed upstream of the heating device, through which the circulating liquid flows through the radiator so as to be heat-exchangeable with the refrigerant. The refrigerant is carbon dioxide, and the circulating liquid is heated at a supercritical pressure in the radiator. The temperature adjustment device according to any one of claims 7 to 9, wherein the high-temperature path is provided with a high-temperature tank for storing the circulating liquid heated by the refrigerant in the radiator.

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