Light-emitting device

Abstract

To provide a light-emitting device with high reliability.SOLUTION: A light-emitting device comprises: a substrate that has a side wall part having a top face and a first surface surrounded by the side wall part; a light-emitting element that is arranged on the first surface; a joint member that is arranged on the top face of the side wall part; and a translucent member that is arranged above the side wall part and the first surface, and is joined to the top face of the side wall part with the joint member. In a top view, the substrate has a rectangular shape. The top face of the side wall part has a first top face located at a center part of one side of the substrate, second top faces each located between the first top face and corner parts of the substrate, and third top faces each located at the corner parts of the substrate. The joint member is continuously arranged on the first top face, the second top faces, and the third top faces, and on at least one side, a first joint part located on the first top face has a wider width than a second joint part located on the second top face in a direction orthogonal to one side of the substrate. The first joint part extends in a direction separating from the first surface beyond an outer edge of the second joint part.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device.

Background Art

[0002] In a light-emitting device, a configuration is known in which a light-emitting element is disposed in a recess provided in a substrate, and a translucent member is joined to the substrate using a joining material such as AuSn so as to cover the upper side of the recess (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In such a light-emitting device, further improvement in reliability is required. The present disclosure provides a highly reliable light-emitting device.

Means for Solving the Problems

[0005] The light-emitting device according to one aspect of the present disclosure includes a substrate having a sidewall portion with an upper surface, a first surface surrounded by the sidewall portion, a light-emitting element disposed on the first surface, a joining member disposed on the upper surface of the sidewall portion, and a light-transmitting member disposed above the sidewall portion and the first surface and joined to the upper surface of the sidewall portion by the joining member. In a top view, the substrate is rectangular, and the upper surface of the sidewall portion has a first upper surface located at the center of one side of the substrate, a second upper surface located between the first upper surface and a corner of the substrate, and a third upper surface located at the corner of the substrate. The joining member is continuously disposed on the first upper surface, the second upper surface, and the third upper surface. On at least one side, a width of a first joining portion located on the first upper surface is wider than a width in a direction orthogonal to one side of the substrate of a second joining portion located on the second upper surface, and the first joining portion extends in a direction away from the first surface beyond an outer edge of the second joining portion.

Advantages of the Invention

[0006] According to the present disclosure, a highly reliable light-emitting device can be provided.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the embodiments described below are for embodying the technical idea of the present invention, and the present invention is not limited to the following unless there are specific descriptions. Also, the sizes, positional relationships, etc. of the members shown in the drawings may be exaggerated for clarity of explanation. Hereinafter, the present invention will be described in detail with reference to the drawings. In the following description, terms indicating specific directions and positions (for example, "up", "down", and other terms including these terms) are used as necessary, but the use of these terms is for facilitating the understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meanings of these terms. Also, parts denoted by the same reference numerals in a plurality of drawings indicate the same or equivalent parts or members. Furthermore, the embodiments shown below exemplify a light-emitting device for embodying the technical idea of the present invention, and the present invention is not limited to the following. Also, the dimensions, materials, shapes, relative arrangements, etc. of the components described below are not intended to limit the scope of the present invention only to those, but are intended to be illustrative unless there are specific descriptions. Also, the content described in one embodiment or example is applicable to other embodiments or examples. Also, the sizes, positional relationships, etc. of the members shown in the drawings may be exaggerated for clarity of explanation.

[0009] [Embodiment 1] FIG. 1 is a schematic top view of the light-emitting device according to the present embodiment. FIG. 2 is a schematic bottom view of the light-emitting device according to the present embodiment. FIG. 3 is a schematic cross-sectional view taken along line III-III of FIG. 1.

[0010] The light-emitting device 100 shown in FIG. 3 includes a substrate 10, a light-emitting element 20, a light-transmitting member 40, and a bonding member 30.

[0011] In the example shown in FIG. 3, the substrate 10 has a flat base portion 11 and a side wall portion 12 disposed on the base portion 11. The base portion 11 and the side wall portion 12 may be integrated or separate. The substrate 10 has a side wall portion 12 having an upper surface 12a and a first surface 11a surrounded by the side wall portion 12. The first surface 11a is located on the upper surface of the base portion 11. A recess is defined by the inner wall surface 12c of the side wall portion 12 and the first surface 11a of the base portion 11. The first surface 11a of the base portion 11 is the bottom of the recess. The light-emitting element 20 is disposed on the first surface 11a. The light-emitting element 20 is located in a space 13 defined by the inner wall surface 12c of the side wall portion 12 of the substrate 10, the first surface 11a of the base portion 11, and the lower surface 40b of the light-transmissive member 40.

[0012] As shown in FIG. 4, in a top view, the shape of the substrate 10 is rectangular. In this specification, a rectangle is a shape including four sides and four corners, and the corners can be right angles, rounded shapes, or chamfered shapes (spoon surfaces) in an arc shape as shown in FIG. 4. The shape of the first surface 11a of the base portion 11 is, for example, rectangular in a top view. The upper surface 12a of the side wall portion 12 is located outside the first surface 11a of the base portion 11. The shape of the upper surface 12a of the side wall portion 12 is a frame shape having a rectangular outer shape and a rectangular opening inside in a top view.

[0013] The upper surface 12a of the side wall portion 12 has a first upper surface 121a located at the center of one side of the base body 10, a second upper surface 122a located between the first surface 121a and the corner portion of the base body 10, and a third upper surface 123a located at the corner portion of the base body 10. In the example shown in FIG. 4, the upper surface 12a of the side wall portion 12 has the first upper surface 121a and the second upper surface 122a on each side constituting the rectangular outer shape. Further, the third upper surface 123a is provided at the four corners constituting the outer shape. That is, the upper surface 12a of the side wall portion 12 has four first upper surfaces 121a, eight second upper surfaces 122a, and four third upper surfaces. In a top view, the four sides of the inner edge (rectangular opening) of the frame-shaped side wall portion 12 are constituted by the inner edges of the first upper surface 121a and the second upper surface 122a. Further, the four corner portions of the rectangular opening in the side wall portion 12 are constituted by the inner edges of the third upper surface 123a. In a top view, the boundary between the first upper surface 121a and the second upper surface 122a can be set at an arbitrary position between the light-emitting element 20 and the side constituting the outer shape of the base body 10, that is, in the region where the side surface of the light-emitting element 20 is projected onto the side wall portion 12 of the base body 10. As shown in FIG. 4, the boundary between the first upper surface 121a and the second upper surface 122a coincides with the boundary between the first joining portion 31 and the second joining portion 32 described later. Further, in a top view, the boundary between the second upper surface 122a and the third upper surface 123a is located at the boundary between the side in the rectangular opening of the side wall portion 12 and the curve of the rounded corner portion.

[0014] Positive and negative upper surface wirings 14 are arranged on the first surface 11a of the base body 10. The light-emitting element 20 is flip-chip mounted on the first surface 11a of the base body 10. Specifically, a light-emitting element 20 having positive and negative electrodes on the same surface side is used, and the positive and negative electrodes of the light-emitting element 20 are electrically connected to the positive and negative upper surface wirings 14 of the base body 10 via a conductive member, respectively. As the conductive member, for example, eutectic solder mainly composed of gold and tin, tin and silver and copper, etc., conductive paste containing silver, gold, palladium, etc., bumps containing silver or gold, etc. can be used. Note that the light-emitting element 20 may be connected (face-up mounted) to the upper surface wiring 14 of the base body 10 by a wire. Further, a light-emitting element having either a positive or negative electrode on the upper surface and the other electrode on the lower surface may be used.

[0015] On the second surface 10b of the base body 10, which is located on the side opposite to the first surface 11a, a bottom surface wiring 15 is disposed. The base portion 11 of the base body 10 has a through hole, and an internal wiring (not shown) is disposed in the through hole. The top surface wiring 14 and the bottom surface wiring 15 are connected to each other by the internal wiring. The second surface 10b side of the base body 10 may or may not have a second recess 16. The second recess 16 is disposed from the second surface 10b of the base body 10 to the outer surface 10c. When having the second recess 16, the bottom surface wiring 15 is also disposed on the outer surface 16c of the base body 10 that defines the second recess 16. When joining the bottom surface wiring 15 of the light emitting device 100 to another mounting substrate or the like using solder or the like, the solder can enter the second recess 16. Thereby, the bottom surface wiring 15 can be more stably and electrically connected.

[0016] The light transmissive member 40 is a member having light transmissivity that transmits at least the light from the light emitting element 20, transmits 60% or more of the light emitted from the light emitting element 20, and preferably transmits 90% or more. The shape of the light transmissive member 40 is, for example, rectangular in a top view. The light transmissive member 40 may be in a flat plate shape as shown in FIGS. 1 and 3, or may have a lens shape such as a spherical surface or an aspherical surface on the top surface and / or the bottom surface.

[0017] The joining member 30 joins the upper surface 12a of the side wall portion 12 of the base body 10 and the light transmissive member 40. The joining member 30 has a first joining portion 31 that is a portion joined to the first upper surface 121a, a second joining portion 32 that is a portion joined to the second upper surface 122a, and a third joining portion 33 that is a portion joined to the third upper surface 123a. In the example shown in FIG. 4, in a top view, the joining member 30 is continuously disposed on the first upper surface 121a, the second upper surface 122a, and the third upper surface 123a. The first joining portion 31, the second joining portion 32, and the third joining portion 33 may be integral or separate.

[0018] The joining member 30 has, on at least one side of the base body 10, the width of the first joining portion 31 in the direction orthogonal to the side of the base body 10 on which the joining member 30 is disposed being wider than that of the second joining portion 32. Thereby, the contact areas of the first joining portion 31 of the joining member 30 with the first upper surface 121a of the base body 10 and of the first joining portion 31 of the joining member 30 with the light-transmissive member 40 can be increased. Also, by widening only the width of the first joining portion 31, the amount of the joining member 30 used can be suppressed as much as possible, and while suppressing an increase in the cost of the light-emitting device, the inside of the recess of the light-emitting device can be hermetically sealed. Further, it is possible to reduce the absorption of the light from the light-emitting element 20 by the joining member 30. In the light-emitting device using the base body 10 having the base portion 11 and the side wall portion 12, warping due to thermal contraction may occur, and the height of the side wall portion 12 at the central portion of one side of the base body 10 may become lower than the height of the side wall portion 12 in its periphery. Therefore, by increasing the contact areas of the first joining portion 31 of the joining member 30 with the first upper surface 121a of the base body 10 and of the first joining portion 31 of the joining member 30 with the light-transmissive member 40, the joining forces between the joining member 30 and the base body 10 and between the joining member 30 and the light-transmissive member 40 at this portion can be strengthened. Thereby, peeling between the joining member 30 and the base body 10 and between the joining member 30 and the light-transmissive member 40 at the central portion of one side of the base body 10 can be prevented. The joining member 30 is preferably disposed such that, on two opposing sides of the base body 10, the width of the first joining portion 31 in the direction orthogonal to the side of the base body 10 is wider than that of the second joining portion 32. When the outer shape and the opening shape in a top view of the side wall portion 12 are rectangular, it is preferable to dispose the joining member 30 such that, on two opposing long sides, the width of the first joining portion 31 in the direction orthogonal to the side of the base body 10 is wider than that of the second joining portion 32. Also, it is preferable to dispose the joining member 30 such that, on each of the four sides of the base body 10, the width of the first joining portion 31 in the direction orthogonal to the side of the base body 10 is wider than that of the second joining portion 32.

[0019] In a top view, the length of one side of the substrate 10 can be, for example, 2 mm or more and 8 mm or less. The widths of the first upper surface 121a and the second upper surface 122a of the substrate 10 in a direction orthogonal to the side of the substrate 10 can be, for example, 0.3 mm or more and 0.7 mm or less. In the example shown in FIG. 1, the first upper surface 121a and the second upper surface 122a have the same width in a direction orthogonal to the side of the substrate 10. The first upper surface 121a and the second upper surface 122a may have different widths in a direction orthogonal to the side of the substrate 10. The length of the first upper surface 121a of the substrate 10 in a direction parallel to the side of the substrate 10 is preferably longer than the width (32W in FIG. 4) of the second joint portion 32 described later. The length of the first upper surface 121a of the substrate 10 in a direction parallel to the side of the substrate 10 can be, for example, 300 μm or more and 1000 μm or less.

[0020] The ratio of the width (31W in FIG. 4) of the first joint portion 31 of the joint member 30 to the width (12W in FIG. 4) of the upper surface 12a of the substrate 10 in a direction orthogonal to the side of the substrate 10 is preferably, for example, 50% or more. The width of the first joint portion 31 of the joint member 30 in a direction orthogonal to the side of the substrate 10 can be, for example, 0.15 mm or more and 0.65 mm or less. The ratio of the width (32W in FIG. 4) of the second joint portion 32 of the joint member 30 to the width (12W in FIG. 4) of the upper surface 12a of the substrate 10 in a direction orthogonal to the side of the substrate 10 is preferably, for example, 30% or more. The width of the second joint portion 32 of the joint member 30 in a direction orthogonal to the side of the substrate 10 can be, for example, 0.09 mm or more and 0.6 mm or less.

[0021] It is preferable that the first metal film 51 is disposed on the upper surface 12a of the substrate 10. In the example shown in FIG. 6, the first metal film 51 is located between the joint member 30 and the upper surface 12a of the side wall portion 12 of the substrate 10. The first metal film 51 has a rectangular frame shape in a top view, and the four corner portions are rounded. When the first metal film 51 is provided, the joint member 30 is disposed on the first metal film 51. When the first metal film 51 is not provided, the joint member 30 is disposed on the upper surface 12a of the side wall portion 12 of the substrate 10.

[0022] As shown in FIG. 5, it is preferable that the second metal film 52 is disposed on the outer peripheral portion of the lower surface 40b of the light-transmissive member 40. The second metal film 52 is located between the joining member 30 and the lower surface 40b of the light-transmissive member 40. The second metal film 52 is disposed so as to face the upper surface 12a of the side wall portion 12 of the base 10. The second metal film 52 has a rectangular frame shape in plan view when looking at the lower surface 40b of the light-transmissive member 40, and the four corner portions are rounded. When the second metal film 52 is provided, the joining member 30 is joined to the light-transmissive member 40 via the second metal film 52. Note that when the second metal film 52 is not provided, the joining member 30 is directly joined to the lower surface 40b of the light-transmissive member 40. In the example shown in FIG. 5, the second metal film 52 is formed with the same width over the entire circumference.

[0023] For the first metal film 51 and the second metal film 52, it is preferable to use a metal material such as tungsten, molybdenum, nickel, gold, silver, platinum, titanium, copper, aluminum, ruthenium. The first metal film 51 and the second metal film 52 preferably have high wettability with respect to the joining member 30.

[0024] The light-emitting device 100 may or may not have a protection element such as a Zener diode. In the example shown in FIG. 4, the protection element 90 is disposed on the first surface 11a of the base 10. Hereinafter, each element constituting the light-emitting device 100 will be described.

[0025] (Base 10) The base 10 is for disposing the light-emitting element 20. In the example shown in FIG. 3, the base 10 has a flat base portion 11 and a side wall portion 12 disposed on the base portion 11. The light-emitting element 20 is disposed on the first surface 11a of the base portion 11, and the joining member 30 is disposed on the upper surface 12a of the side wall portion 12. The shape of the first surface 11a of the base portion 11 defined by the side wall portion 12 is, for example, rectangular in plan view.

[0026] The substrate 10 includes an insulating base material, an upper surface wiring 14, and a lower surface wiring 15. Examples of the material of the insulating base material include ceramics, glass epoxy, and resin. As the ceramics, those having high heat resistance and weather resistance are preferably used, and examples of such ceramics include alumina, aluminum nitride, and mullite.

[0027] The first surface 11a of the substrate 10 has the upper surface wiring 14. The second surface 10b of the substrate 10 has the lower surface wiring 15. The materials of the upper surface wiring 14 and the lower surface wiring 15 can be formed of materials known in the art. For the upper surface wiring 14 and the lower surface wiring 15, for example, metals such as copper, aluminum, gold, silver, and tungsten can be used.

[0028] (Light-emitting element 20) The light-emitting element 20 is disposed on the first surface 11a of the substrate 10. As the light-emitting element 20, a light-emitting diode, a laser diode, etc. can be used.

[0029] The emission peak wavelength of the light-emitting element 20 is not particularly limited, and those having a desired emission peak wavelength can be appropriately selected. For example, those having a wavelength of 250 nm or more and 600 nm or less can be used. For example, by using a light-emitting diode that emits ultraviolet light, it can be used as a light source for sterilization or disinfection. The emission peak wavelength of the light-emitting element 20 that emits ultraviolet light is, for example, 400 nm or less.

[0030] The light-emitting element 20 is, for example, In X Al Y Ga 1-X-Y It is preferably one using a nitride semiconductor layer containing N (0≦X, 0≦Y, X+Y≦1). When using a light-emitting element that emits light in the wavelength range from deep ultraviolet to ultraviolet, it is preferably one having a nitride semiconductor layer containing at least Al. The light-emitting element 20 has at least a semiconductor layer including a light-emitting layer, and positive and negative electrodes.

[0031] In the example shown in FIG. 4, the light-emitting element 20 is disposed at the center of the first surface 11a of the substrate 10. Also, in the example shown in FIG. 4, the light-emitting device 100 has one light-emitting element 20 disposed therein. The light-emitting device 100 may have a plurality of light-emitting elements 20 disposed therein. The light-emitting element 20 can be, for example, rectangular in a top view. In this case, the length of one side of the light-emitting element 20 in the top view is preferably, for example, 50 μm or more and 3000 μm or less, and more preferably 300 μm or more and 2000 μm or less. Also, the shape of the light-emitting element 20 in the top view may be, for example, a polygon such as a triangle or a hexagon.

[0032] (Bonding member 30) The bonding member 30 is disposed between the substrate 10 and the light-transmissive member 40 and bonds the substrate 10 and the light-transmissive member 40. When the light-emitting device 100 has the first metal film 51 and the second metal film 52, the bonding member 30 is disposed between the first metal film 51 and the second metal film 52. Examples of the bonding member 30 include solder, low-melting glass, resin, etc. Examples of the solder material include Au-Sn, Au-In, etc. Examples of the resin include silicone resin, epoxy resin, etc.

[0033] The bonding member 30 that bonds the substrate 10 and the light-transmissive member 40 is continuously disposed on the first upper surface 121a, the second upper surface 122a, and the third upper surface 123a as shown in FIG. 4. That is, by disposing the bonding member 30 over the entire circumference of the upper surface 12a of the frame-shaped side wall portion 12, the inside of the recess of the light-emitting device can be hermetically sealed.

[0034] In the example shown in FIG. 4, in a top view, the inner edge of the bonding member 30 is disposed spaced apart from the opening of the side wall portion 12. Thereby, compared with the case where the bonding member 30 is disposed adjacent to the first surface 11a in a top view, absorption of the light from the light-emitting element 20 by the bonding member 30 can be reduced. As shown in FIG. 4, in a top view, the second bonding portion 32 may be disposed spaced apart from the first surface 11a, and the first bonding portion 31 may extend closer to the first surface 11a side than the inner edge of the second bonding portion 32.

[0035] (Light-transmitting member 40) The light-transmitting member 40 has a function of transmitting the light from the light-emitting element 20 disposed on the base 10 and emitting the light to the outside of the light-emitting device 100. Examples of the material of the light-transmitting member 40 include at least one inorganic material selected from the group consisting of sapphire, borosilicate glass, quartz glass, calcium fluoride glass, aluminoborosilicate glass, oxynitride glass, and chalcogenide glass. The thickness of the light-transmitting member 40 may be 0.1 mm or more and 7 mm or less.

[0036] As shown in FIG. 3, the lower surface 40b of the light-transmitting member 40 includes a first region 41b located above the first surface 11a of the base 10 and a second region 42b located above the side wall portion 12 of the base 10. The first region 41b faces the upper surface of the light-emitting element 20 with the space 13 therebetween. The second region 42b of the lower surface 40b of the light-transmitting member 40 is joined to the upper surface 12a of the side wall portion 12 of the base 10 by the joining member 30.

[0037] Hereinafter, a method of joining the base 10 and the light-transmitting member 40 by the joining member 30 will be described. As shown in FIG. 6, the joining member 30a is disposed on the upper surface 12a of the base 10 (when having the first metal film 51, the upper surface of the first metal film 51) by a printing method, a dispensing method, or the like. In the example shown in FIG. 5, a plurality of joining members 30a are arranged annularly at intervals. The joining member 30a is preferably formed, for example, with a diameter in the range of 80 μm to 400 μm, and more preferably with a diameter in the range of 90 to 200 μm. Also, the distance between the center points of adjacent joining members 30a is preferably set in the range of 80 μm to 1000 μm, and more preferably set in the range of 100 μm to 400 μm. By arranging a plurality of joining members 30a at intervals in this way, the amount of the joining member 30a can be reduced. On the first upper surface 121a, two joining members 30a are arranged in a direction perpendicular to the side of the base 10. On the first upper surface 121a, three or more joining members 30a may be arranged in a direction perpendicular to the side of the base 10. In the example shown in FIG. 6, the plurality of joining members 30a are each formed with the same diameter.

[0038] After arranging the joining member 30a, the light-transmissive member 40 is arranged on the base 10 via the joining member 30a, and the joining member 30a is heated and melted to join the base 10 and the light-transmissive member 40. By connecting the melted joining members 30a to each other, the joining member 30 continuously arranged on the first upper surface 121a, the second upper surface 122a, and the third upper surface 123a can be formed as shown in FIG. 4. Thereby, the space where the light-emitting element 20 is located can be hermetically sealed. A plurality of joining members 30a arranged on the first upper surface 121a in FIG. 5 can form the first joining portion 31 having a wide width in the direction orthogonal to one side of the base 10. In the step of arranging the joining member 30a, the joining member 30a may be continuously formed on the first upper surface 121a, the second upper surface 122a, and the third upper surface 123a by, for example, a printing method or a dispensing method.

[0039] FIG. 7 shows another arrangement example of the joining member 30a in the step of arranging the joining member 30a. In the example shown in FIG. 7, among the joining members 30a arranged annularly at intervals, the diameter of the joining member 30A arranged on the first upper surface 121a of the base 10 is larger than the diameter of the joining members 30a arranged in other portions. The joining member 30A arranged on the first upper surface 121a is preferably formed with a diameter in the range of, for example, 100 μm to 300 μm. By arranging such a joining member 30A, the first joining portion 31 having a wide width in the direction orthogonal to one side of the base 10 can be formed.

[0040] [Embodiment 2] FIG. 8 is a schematic top view showing an arrangement example of the first metal film 51 in the light-emitting device according to Embodiment 2.

[0041] In the example shown in FIG. 8, the first metal film 51 has a first metal portion 511 located on the first upper surface 121a of the base 10, a second metal portion 512 located on the second upper surface 122a of the base 10, and a third metal portion 513 located on the third upper surface 123a of the base 10. The width of the first metal portion 511 in the direction orthogonal to one side of the base 10 is wider than the width of the second metal portion 512 in the direction orthogonal to one side of the base.

[0042] In the step of arranging the joining member 30a, it is preferable to make the amount of the joining member 30a formed on the first upper surface 121a larger than that of other portions in the same manner as in the first embodiment. In the step of heating the above-described joining member 30a, the wettability of the molten joining member 30a with respect to the first metal film 51 is higher than that of the base material. For this reason, the molten joining member 30a is likely to spread on the first metal film 51 rather than on the base material. The range in which the molten joining member 30a wets and spreads on the base body 10 side can be substantially the same as the shape of the first metal film 51. Thereby, the contact area between the joining member 30a and the first metal portion 511 can be increased.

[0043] In the example shown in FIG. 8, the first metal portion 511 has an extending portion 511e that extends outside the outer edge of the second metal portion 512 (in a direction away from the first surface 11a). In the step of heating the above-described joining member 30a, by causing the excess joining member 30a to flow toward the extending portion 511e, it is possible to suppress the joining member 30a from flowing toward the first surface 11a side.

[0044] FIG. 9 is a schematic bottom view showing an example of the arrangement of the second metal film 52 in the light-emitting device according to the second embodiment.

[0045] In the example shown in FIG. 9, the second metal film 52 includes a first metal portion 521 located above the first upper surface 121a of the base body 10, a second metal portion 522 located above the second upper surface 122a of the base body 10, and a third metal portion 523 located above the third upper surface 123a of the base body 10. The width of the first metal portion 521 in the direction orthogonal to one side of the base body 10 is wider than the width of the second metal portion 522 in the direction orthogonal to one side of the base body 10. In the step of heating the above-described joining member 30a, the molten joining member 30a is likely to spread on the second metal film 52 on the light-transmissive member 40 side. Thereby, the contact area between the joining member 30a and the first metal portion 521 can be increased.

[0046] In the example shown in FIG. 9, the first metal part 521 has an extending part 521e that extends inward (toward the first region 41b) from the inner edge of the second metal part 522, and the second metal part 522 and the third metal part 523 are arranged at a distance from the first region 41b of the light-transmissive member 40. Thereby, it is possible to reduce the light from the light-emitting element 20 being blocked by the second metal part 522 and the third metal part 523. Note that the first metal part 521 may have an extending part that extends outward (in a direction away from the first region 41b) from the outer edge of the second metal part 522.

Explanation of Signs

[0047] 10 Substrate 20 Light-emitting element 30 Joining member 40 Light-transmissive member 51 First metal film 52 Second metal film 90 Protection element 100 Light-emitting device

Claims

1. A substrate having a side wall portion with an upper surface, and a first surface surrounded by the side wall portion; A light emitting element disposed on the first surface; A joining member disposed on the upper surface of the side wall portion; A light transmissive member disposed above the side wall portion and the first surface, and joined to the upper surface of the side wall portion by the joining member; Comprising: In a top view, the substrate is rectangular; The upper surface of the side wall portion has a first upper surface located at the center of one side of the substrate, a second upper surface located between the first upper surface and a corner of the substrate, and a third upper surface located at the corner of the substrate; The joining member is disposed on the first upper surface, the second upper surface, and the third upper surface, and at least on one side of the substrate, a width of a first joining portion located on the first upper surface is wider than a width of a second joining portion located on the second upper surface in a direction orthogonal to one side of the substrate; The light emitting device, wherein the first joining portion extends in a direction away from the first surface with respect to an outer edge of the second joining portion.

2. In a top view, the second joining portion is disposed at a distance from the first surface; The light emitting device according to claim 1, wherein the first joining portion extends on the first surface side with respect to an inner edge of the second joining portion.

3. A lower surface of the light transmissive member has a first region disposed above the first surface and a second region disposed above the side wall portion; A metal film disposed in the second region of the lower surface of the light transmissive member and surrounding the first region; The joining member is joined to the light transmissive member via the metal film; The metal film has a first metal portion located above the first upper surface and a second metal portion located above the second upper surface; The light emitting device according to claim 1 or 2, wherein a width of the first metal portion in a direction orthogonal to one side of the substrate is wider than a width of the second metal portion in a direction orthogonal to one side of the substrate.

4. The second metal portion is disposed at a distance from the first region; The light emitting device according to claim 3, wherein the first metal portion extends on the first region side with respect to an inner edge of the second metal portion.

5. The light emitting device according to claim 3 or 4, wherein the first metal portion extends in a direction away from the first region with respect to an outer edge of the second metal portion.

6. The light emitting device according to any one of claims 1 to 5, wherein the substrate is made of ceramic.

7. The light emitting device according to any one of claims 1 to 6, wherein the light transmissive member is made of an inorganic material.

8. The light-emitting device according to any one of claims 1 to 7, wherein the light-emitting element is a light-emitting element that emits ultraviolet light.

Images