Vapor Chamber, Electronic Device, and Method of Manufacturing Vapor Chamber

Abstract

To provide a vapor chamber which enables improvement of performance when bent, and to provide an electronic device and a manufacturing method of the vapor chamber.SOLUTION: A body sheet of a vapor chamber includes multiple first land parts. A first sheet outer surface 10a of a first sheet includes first joint areas 13 each overlapping with the first land part and first space areas 14 each overlapping with a space part. The vapor chamber includes a bending area 7 bent along a bending line extending in a direction intersecting with a first direction in a plan view of the vapor chamber. A maximum dimension defined between the first joint area and the first space area and seen in a thickness direction of the first sheet is defined as a first maximum dimension. When viewed along a direction parallel to the bending line, the first maximum dimension in the bending area is larger than the first maximum dimension in other areas other than the bending area.SELECTED DRAWING: Figure 13

Description

Technical Field

[0001] The present disclosure relates to a vapor chamber, an electronic device, and a method for manufacturing a vapor chamber.

Background Art

[0002] In electronic devices such as mobile terminals, electronic devices that generate heat are used. Examples of such electronic devices include a central processing unit (CPU), a light-emitting diode (LED), and a power semiconductor. Examples of mobile terminals include mobile phones and tablet terminals.

[0003] Such electronic devices are cooled by a heat dissipation device such as a heat pipe (see, for example, Patent Documents 1 and 2). In recent years, in order to reduce the thickness of electronic devices, a reduction in the thickness of the heat dissipation device has been demanded. As a heat dissipation device, the development of a vapor chamber that can be made thinner than a heat pipe has been promoted. A vapor chamber efficiently cools an electronic device by an enclosed working fluid absorbing the heat of the electronic device and diffusing inside.

[0004] More specifically, the working fluid in the vapor chamber receives heat from the electronic device at a portion (evaporation portion) close to the electronic device. The heated working fluid evaporates and becomes working vapor. The working vapor diffuses in the vapor flow path portion formed in the vapor chamber in a direction away from the evaporation portion. The diffused working vapor is cooled and condensed to become a working fluid. In the vapor chamber, a liquid flow path portion as a capillary structure (wick) is provided. The working fluid flows through the liquid flow path portion and is transported toward the evaporation portion. Then, the working fluid transported to the evaporation portion receives heat again at the evaporation portion and evaporates. In this way, the working fluid refluxes in the vapor chamber while repeating a phase change, that is, evaporation and condensation, and diffuses the heat of the electronic device. As a result, the heat dissipation efficiency of the vapor chamber is enhanced.

[0005] By the way, the vapor chamber may be bent depending on the internal structure of the electronic device to be mounted. In this case, since the vapor flow path is bent, the working fluid may stay in the bent portion of the vapor flow path portion. Therefore, the flow of the working vapor in the vapor flow path portion may be inhibited.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0007] An object of the present disclosure is to provide a vapor chamber, an electronic device, and a method for manufacturing a vapor chamber that can improve performance even when bent.

Means for Solving the Problems

[0008] A first aspect of the present disclosure is a vapor chamber in which a working fluid is enclosed, a main body sheet including a first main body surface and a second main body surface located on the side opposite to the first main body surface, a first sheet located on the first main body surface of the main body sheet, a space portion provided in the main body sheet, the space portion being covered by the first sheet, the main body sheet includes a plurality of first land portions extending in a first direction located in the space portion, the plurality of first land portions being spaced apart in a second direction orthogonal to the first direction, the first sheet includes a first sheet outer surface located on the side opposite to the main body sheet, the first sheet outer surface includes a first bonding region overlapping the first land portion and a first space region overlapping the space portion, The vapor chamber includes a bent region bent along a bent line extending in a direction intersecting the first direction in a plan view of the vapor chamber, When a maximum dimension defined between the first bonding region and the first space region and being the maximum dimension in the thickness direction of the first sheet is defined as a first maximum dimension, The vapor chamber is such that when viewed along a direction parallel to the bent line, the first maximum dimension in the bent region is larger than the first maximum dimension in other regions other than the bent region.

[0009] A second aspect of the present disclosure is in the vapor chamber according to the first aspect described above, The first space region may be formed in a concave shape.

[0010] A third aspect of the present disclosure is in the vapor chamber according to the first aspect described above, The first space region in the bent region is formed in a concave shape, and the first space region in other regions other than the bent region may be formed flat in a direction along the bent line.

[0011] A fourth aspect of the present disclosure is in the vapor chamber according to the first aspect described above, A part of the first space region in the bent region may be formed in a concave shape and another part thereof may be formed flat in a direction along the bent line.

[0012] A fifth aspect of the present disclosure is in the vapor chamber according to the first aspect described above, The first sheet may include a plurality of first sheet recesses overlapping the first space region in a plan view and entering the space portion.

[0013] A sixth aspect of the present disclosure is in the vapor chamber according to each of the first aspect to the fifth aspect described above, In the bending region, the vapor chamber may be bent along a bending line extending in the second direction.

[0014] A seventh aspect of the present disclosure is a vapor chamber according to each of the first aspect to the fifth aspect described above, In the bending region, the vapor chamber may be bent along a bending line inclined in the first direction.

[0015] An eighth aspect of the present disclosure is a vapor chamber according to each of the first aspect to the seventh aspect described above, In the bending region, the first sheet may be located outside the main body sheet.

[0016] A ninth aspect of the present disclosure is a vapor chamber according to each of the first aspect to the seventh aspect described above, In the bending region, the first sheet may be located inside the main body sheet.

[0017] A tenth aspect of the present disclosure is a vapor chamber according to each of the first aspect to the ninth aspect described above, comprising a second sheet located on the second main surface of the main body sheet, The space portion extends from the first main surface to the second main surface and is covered by the second sheet on the second main surface, The second sheet includes a second sheet outer surface located on the side opposite to the main body sheet, The second sheet includes a second bonding region overlapping the first land portion and a second space region overlapping the space portion, When defining the maximum dimension defined between the second bonding region and the second space region and being the maximum dimension in the thickness direction of the second sheet as the second maximum dimension, When viewed along the direction parallel to the bending line, the second maximum dimension in the bending region may be larger than the second maximum dimension in other regions other than the bending region.

[0018] In the vapor chamber according to each of the first to tenth aspects described above, in the eleventh aspect of the present disclosure, the main body sheet includes a plurality of second land portions extending in the second direction, the second land portions are located in regions other than the bending region, the first land portion is located in the bending region, the first land portion may be connected to the second land portion.

[0019] The twelfth aspect of the present disclosure is a housing, an electronic device housed in the housing, and a vapor chamber according to any one of the first to eleventh aspects described above, which is in thermal contact with the electronic device, and is an electronic apparatus.

[0020] The thirteenth aspect of the present disclosure is a method for manufacturing a vapor chamber in which a working fluid is enclosed, a preparation step of preparing a main body sheet including a first main body surface and a second main body surface located on the side opposite to the first main body surface, and a first sheet; a joining step of disposing the first sheet on the first main body surface of the main body sheet and joining the first sheet and the main body sheet, wherein a space portion covered by the first sheet is formed in the main body sheet; and a bending step of bending the main body sheet and the first sheet to form a bending region in which the main body sheet and the first sheet are bent. The main body sheet includes a plurality of first land portions extending in a first direction and located in the space portion, the plurality of first land portions being spaced apart from each other in a second direction orthogonal to the first direction, the first sheet includes a first sheet outer surface located on the side opposite to the main body sheet, the first sheet outer surface includes a first joining region overlapping the first land portion and a first space region overlapping the space portion, In the bending region, the vapor chamber is bent along a bending line extending in a direction intersecting the first direction in a plan view. When defining the maximum dimension defined between the first bonding region and the first space region and being the maximum dimension in the thickness direction of the first sheet as a first maximum dimension, A method for manufacturing a vapor chamber, wherein when viewed along a direction parallel to the bending line, the first maximum dimension in the bending region is larger than the first maximum dimension in other regions outside the bending region.

[0021] A fourteenth aspect of the present disclosure is A vapor chamber filled with a working fluid, A plurality of vapor passages through which the gas of the working fluid passes and extending along a first direction, A liquid flow path portion communicating with the vapor passage through which the liquid of the working fluid passes, and comprising: A vapor chamber bent along a direction parallel to the first direction.

[0022] A fifteenth aspect of the present disclosure is, in the vapor chamber according to the fourteenth aspect described above, It may be bent at a position where the vapor passage is arranged.

[0023] A sixteenth aspect of the present disclosure is, in the vapor chamber according to the fourteenth aspect described above, The liquid flow path portion is arranged between the vapor passages and extends along the first direction, It may be bent at a position where the liquid flow path portion is arranged.

[0024] A seventeenth aspect of the present disclosure is, in the vapor chamber according to the fourteenth aspect described above, A reinforcing portion where the vapor passage and the liquid flow path portion are not arranged is provided, It may be bent at a position where the reinforcing portion is arranged.

[0025] An eighteenth aspect of the present disclosure is, in the vapor chamber according to the fourteenth aspect described above, comprising a space portion where the steam passage and the liquid flow path portion are not disposed, It may be bent at a position where the space portion is disposed.

[0026] A 19th aspect of the present disclosure is a vapor chamber filled with a working fluid, a main body sheet including a first main body surface and a second main body surface located on the side opposite to the first main body surface, a first sheet located on the first main body surface of the main body sheet, a second sheet located on the second main body surface of the main body sheet, a plurality of steam passages through which the gas of the working fluid passes and extends along a first direction, and a liquid flow path portion communicating with the steam passage and through which the liquid of the working fluid passes. The vapor chamber includes a bent region bent along a bending line parallel to the first direction, and a first region and a second region separated via the bent region. The vapor chamber is such that a main body surface recess is formed in the first main body surface or the second main body surface in the bent region.

[0027] A 20th aspect of the present disclosure is, in the vapor chamber according to the 19th aspect described above, the vapor chamber in which a plurality of the main body surface recesses are arranged along the bending line.

[0028] A 21st aspect of the present disclosure is, in the vapor chamber according to each of the 19th aspect and the 20th aspect described above, the main body sheet includes a reinforcing portion where the steam passage and the liquid flow path portion are not disposed, the main body surface recess may be formed in the first main body surface or the second main body surface of the reinforcing portion.

[0029] A 22nd aspect of the present disclosure is, in the vapor chamber according to each of the 19th aspect and the 20th aspect described above, The main body sheet is a land portion located between two adjacent vapor passages and extending along the first direction, and includes a land portion provided with the liquid flow path portion. The main body surface recess may be formed at a position where the liquid flow path portion of the land portion is not provided.

[0030] The 23rd aspect of the present disclosure is a housing, a device housed in the housing, a vapor chamber according to any one of the 14th aspect to the 22nd aspect described above, which is in thermal contact with the device, and an electronic device including the same.

[0031] The 24th aspect of the present disclosure is an electronic device according to the 23rd aspect described above, including a plurality of the devices, the plurality of devices include a first device and a second device, the vapor chamber is divided into a first region and a second region via a bent portion, the first device is in thermal contact with the first region of the vapor chamber, the second device may be in thermal contact with the second region of the vapor chamber.

[0032] The 25th aspect of the present disclosure is an electronic device according to the 23rd aspect described above, the vapor chamber is divided into a first region and a second region via a bent portion, the device may be in thermal contact with the first region of the vapor chamber.

[0033] The 26th aspect of the present disclosure is a first sheet preparation step of preparing a first sheet, a main body sheet preparation step of preparing a main body sheet including a plurality of vapor passages through which a gas of a working fluid passes and extending along a first direction, and a liquid flow path portion communicating with the vapor passages through which a liquid of the working fluid passes. A bonding step of laminating and bonding the first sheet and the main body sheet; After the bonding step, a bending step of bending the first sheet and the main body sheet along a direction parallel to the first direction, and a method for manufacturing a vapor chamber.

Effect of the Invention

[0034] According to the present disclosure, the performance can be improved even when bent.

Brief Description of the Drawings

[0035]

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Embodiments for Carrying Out the Invention

[0036] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings attached to this specification, for the convenience of illustration and easy understanding, the scale, the aspect ratio of the vertical and horizontal dimensions, etc. are appropriately changed and exaggerated from those of the actual object. Also, the configurations shown in some of the drawings may be omitted in other drawings.

[0037] In this specification, the geometric conditions, physical properties, terms specifying the degree of geometric conditions or physical properties, numerical values indicating geometric conditions or physical properties, etc. may be interpreted without being restricted to a strict meaning. And these geometric conditions, physical properties, terms, numerical values, etc. may be interpreted to include a range in which similar functions can be expected. Examples of terms specifying geometric conditions include "length", "angle", "shape", "arrangement", etc. Examples of terms specifying geometric conditions include "parallel", "orthogonal", "identical", etc. Furthermore, for the sake of clarity of the drawings, the shapes of a plurality of parts that can be expected to have similar functions are regularly described. However, without being restricted to a strict meaning, within the range where the function can be expected, the shapes of the parts may be different from each other. In the drawings, the boundary lines indicating the joint surfaces between members, etc. are shown as simple straight lines for convenience, but are not restricted to being strict straight lines, and within the range where the desired joint performance can be expected, the shape of the boundary line is arbitrary.

[0038] (First Embodiment) With reference to FIGS. 1 to 29, a vapor chamber, an electronic device, and a method for manufacturing a vapor chamber according to the first embodiment of the present disclosure will be described. The vapor chamber 1 according to the present embodiment is housed in the housing H of the electronic device E together with the electronic device D that generates heat, and is a device for cooling the electronic device D. Examples of the electronic device E include mobile terminals such as mobile phones and tablet terminals. Examples of the electronic device D include a central processing unit (CPU), a light-emitting diode (LED), and a power semiconductor. The electronic device D may also be referred to as a device to be cooled.

[0039] Here, first, an electronic device E equipped with the vapor chamber 1 according to the present embodiment will be described by taking a tablet terminal as an example. As shown in FIG. 1, the electronic device E may include a housing H, an electronic device D housed in the housing H, and a vapor chamber 1. In the electronic device E shown in FIG. 1, a touch panel display TD is provided on the front surface of the housing H. The vapor chamber 1 is housed in the housing H and is arranged to be in thermal contact with the electronic device D. The vapor chamber 1 receives the heat generated by the electronic device D during the use of the electronic device E. The heat received by the vapor chamber 1 is released to the outside of the vapor chamber 1 via the working fluids 2a and 2b described later, and the electronic device D is effectively cooled. When the electronic device E is a tablet terminal, the electronic device D corresponds to a central processing unit or the like.

[0040] Next, the vapor chamber 1 according to the present embodiment will be described. As shown in FIGS. 2 and 3, the vapor chamber 1 according to the present embodiment is bent. The vapor chamber 1 is bent according to the internal structure of the electronic device E. The vapor chamber 1 may be bent depending on the positional relationship between the electronic device E that generates heat and the housing member Ha that releases heat. The housing member Ha is a member that constitutes the housing H.

[0041] As an example, there is a case where the electronic device D and the housing member Ha are arranged as shown in FIG. 2. In this case, the vapor chamber 1 is bent at a right angle so as to be in contact with the electronic device D and the housing member Ha. The electronic device D is mounted on the substrate S. As another example, there is a case where the electronic device D and the housing member Ha are arranged as shown in FIG. 3. In this case, the vapor chamber 1 is bent by 180° so as to be in contact with the electronic device D and the housing member Ha. FIGS. 2 and 3 show an example of the vapor chamber 1 bent by one bending line 8 (see FIGS. 4 and 5), but the present invention is not limited to this. The vapor chamber 1 may be bent at different positions by two or more bending lines 8.

[0042] In this embodiment, as shown in FIG. 4, the vapor chamber 1 bent at a right angle by one bending line 8 will be described as an example. The vapor chamber 1 shown in FIG. 4 is divided into a first region 5, a second region 6, and a bending region 7 located between the first region 5 and the second region 6. In the bending region 7, the vapor chamber 1 is bent at a right angle. The first region 5 and the second region 6 are formed substantially flat. The electronic device D may contact the first region 5, and the housing member Ha (see FIG. 2) may contact the second region 6.

[0043] Here, first, the configuration of the vapor chamber 1 will be described using FIGS. 5 to 11 showing the vapor chamber 1 before being bent. By bending the flat plate-shaped vapor chamber 1 shown in FIG. 5, the vapor chamber 1 shown in FIG. 4 is obtained.

[0044] As shown in FIGS. 5 and 6, the vapor chamber 1 has a sealed space 3 in which the working fluids 2a and 2b are enclosed. By repeatedly undergoing a phase change of the working fluids 2a and 2b in the sealed space 3, the above-described electronic device D is cooled. Examples of the working fluids 2a and 2b include pure water, ethanol, methanol, acetone, etc., and mixtures thereof.

[0045] As shown in FIGS. 5 and 6, the vapor chamber 1 includes a first sheet 10, a second sheet 20, a wick sheet 30, a vapor flow path portion 50, and a first liquid flow path portion 60. The second sheet 20 is provided on the side opposite to the first sheet 10 with respect to the wick sheet 30. The wick sheet 30 is an example of a main body sheet and is interposed between the first sheet 10 and the second sheet 20. In the vapor chamber 1 according to this embodiment, the first sheet 10, the wick sheet 30, and the second sheet 20 are stacked in this order. Here, an example in which one wick sheet 30 is stacked will be described, but two or more wick sheets 30 may be stacked.

[0046] The vapor chamber 1 shown in Fig. 5 is generally formed in a thin flat plate shape. The planar shape of the vapor chamber 1 before bending is arbitrary, but it may be a rectangular shape as shown in Fig. 5. The planar shape of the vapor chamber 1 may be, for example, a rectangle with one side being 1 cm and the other side being 3 cm, or a square with one side being 15 cm. The planar dimensions of the vapor chamber 1 before bending are arbitrary. In this embodiment, an example will be described in which the planar shape of the vapor chamber 1 before bending is a rectangular shape with the X direction, which will be described later, as the longitudinal direction. In this case, as shown in Figs. 7 to 10, the first sheet 10, the second sheet 20, and the wick sheet 30 may have the same planar shape as the vapor chamber 1. The planar shape of the vapor chamber 1 before bending is not limited to a rectangular shape, and may be any shape such as a circular shape, an elliptical shape, an L-shaped, or a T-shaped.

[0047] As shown in Figs. 4 and 5, the vapor chamber 1 has an evaporation region SR where the working fluid 2b evaporates and a condensation region CR where the working vapor 2a condenses. The working vapor 2a is a gaseous working fluid, and the working fluid 2b is a liquid working fluid.

[0048] The evaporation region SR is a region that overlaps the electronic device D in plan view and is a region that contacts the electronic device D. The evaporation region SR is located within the first region 5, but the position of the evaporation region SR is arbitrary. In this embodiment, the evaporation region SR is formed on one side (the left side in Fig. 5) in the X direction of the vapor chamber 1. Heat from the electronic device D is transmitted to the evaporation region SR, and the working fluid 2b evaporates due to this heat, generating the working vapor 2a. The heat from the electronic device D can be transmitted not only to the region that overlaps the electronic device D in plan view but also to the periphery of the region where the electronic device D overlaps. For this reason, the evaporation region SR may include, in plan view, the region that overlaps the electronic device D and the peripheral region thereof.

[0049] The condensation region CR is a region that does not overlap with the electronic device D in a plan view, and is mainly a region where the working vapor 2a releases heat and condenses. The condensation region CR may be located within the second region 6. The condensation region CR may be a region surrounding the evaporation region SR including the second region 6. Heat is released from the working vapor 2a in the condensation region CR. The working vapor 2a is cooled and condensed to generate the working liquid 2b.

[0050] Here, the plan view refers to the state seen from a direction orthogonal to the surface of the vapor chamber 1 that receives heat from the electronic device D and the surface that releases the received heat. The surface that receives heat corresponds to the outer surface 20b of the second sheet 20 described later. The surface that releases heat corresponds to the outer surface 10a of the first sheet 10 described later. For example, as shown in FIG. 4, in the first region 5 of the bent vapor chamber 1, the state seen in the direction indicated by the arrow V1 corresponds to the plan view. In the second region 6, the state seen in the direction indicated by the arrow V2 corresponds to the plan view. As shown in FIG. 5, in the vapor chamber 1 before bending, the state of viewing the vapor chamber 1 from above or from below corresponds to the plan view.

[0051] As shown in FIG. 6, the first sheet 10 includes a first sheet outer surface 10a located on the side opposite to the wick sheet 30 and a first sheet inner surface 10b facing the wick sheet 30. In the above-described second region 6, the above-described housing member Ha contacts the first sheet outer surface 10a. The first main body surface 30a of the wick sheet 30 described later contacts the first sheet inner surface 10b. As shown in FIGS. 6 and 7, the first sheet 10 may be formed in a substantially flat shape. The first sheet 10 may have a substantially constant thickness.

[0052] As shown in FIG. 7, alignment holes 12 may be formed at the four corners of the first sheet 10. FIG. 7 shows an example in which the planar shape of the alignment holes 12 is circular, but it is not limited thereto. The alignment holes 12 may penetrate the first sheet 10.

[0053] As shown in FIG. 6, the second sheet 20 includes a second sheet inner surface 20a facing the wick sheet 30 and a second sheet outer surface 20b located on the side opposite to the wick sheet 30. In the first region 5 described above, the above-described electronic device D contacts the second sheet outer surface 20b. The second body surface 30b of the wick sheet 30 described below contacts the second sheet inner surface 20a. As shown in FIGS. 6 and 8, the second sheet 20 may be formed substantially flat. The second sheet 20 may have a substantially constant thickness.

[0054] As shown in FIG. 8, alignment holes 22 may be formed at the four corners of the second sheet 20. FIG. 8 shows an example in which the planar shape of the alignment hole 22 is circular, but the present invention is not limited to this. The alignment hole 22 may penetrate the second sheet 20.

[0055] As shown in FIG. 5, the wick sheet 30 has a first body surface 30a and a second body surface 30b located on the side opposite to the first body surface 30a. The first sheet inner surface 10b of the first sheet 10 contacts the first body surface 30a of the wick sheet 30. The second sheet inner surface 20a of the second sheet 20 contacts the second body surface 30b of the wick sheet 30.

[0056] The first sheet inner surface 10b of the first sheet 10 and the first body surface 30a of the wick sheet 30 may be diffusion bonded. The first sheet inner surface 10b and the first body surface 30a may be permanently joined to each other.

[0057] Similarly, the second sheet inner surface 20a of the second sheet 20 and the second body surface 30b of the wick sheet 30 may be diffusion bonded. The second sheet inner surface 20a and the second body surface 30b may be permanently joined to each other.

[0058] Note that the term "permanently joined" is not bound by a strict meaning, and is used as a term meaning that the joined state is such that the sealing performance of the sealed space 3 can be maintained during the operation of the vapor chamber 1.

[0059] As shown in FIGS. 5, 9, and 10, the wick sheet 30 according to the present embodiment includes a frame portion 32 and a plurality of first land portions 33. The frame portion 32 defines a vapor flow path portion 50 and is formed in a rectangular frame shape along the X direction and the Y direction in plan view. The first land portion 33 is located within the vapor flow path portion 50 and is located inside the frame portion 32 in plan view. The frame portion 32 and the first land portion 33 are portions where the material of the wick sheet 30 remains without being etched in the etching process described later. A first vapor passage 51, through which the working vapor 2a flows and will be described later, is formed between the frame portion 32 and the adjacent first land portion 33. A second vapor passage 52, through which the working vapor 2a flows and will be described later, is formed between the adjacent first land portions 33.

[0060] In plan view, the first land portion 33 may extend in an elongated shape with the X direction as the longitudinal direction. The planar shape of the first land portion 33 may be an elongated rectangular shape. The X direction is an example of the first direction and corresponds to the left - right direction in FIGS. 9 and 10. Also, the first land portions 33 may be arranged at equal intervals in the Y direction. The Y direction is an example of the second direction and is a direction orthogonal to the X direction in plan view. The Y direction corresponds to the up - down direction in FIGS. 9 and 10. The first land portions 33 may be positioned parallel to each other. A direction orthogonal to each of the X direction and the Y direction is defined as the Z direction. The Z direction corresponds to the up - down direction in FIGS. 6 and 11 and corresponds to the thickness direction.

[0061] As shown in FIG. 11, the width w1 of the first land portion 33 may be, for example, 100 μm to 1500 μm. Here, the width w1 of the first land portion 33 is the dimension of the first land portion 33 in the Y direction. The width w1 means the dimension at the position where a through - portion 34, which will be described later, exists in the Z direction of the wick sheet 30.

[0062] Here, the X direction in the first region 5 and the second region 6 of the vapor chamber 1 shown in FIG. 4 corresponds to the direction along the longitudinal direction of the first land portion 33. The X direction in the first region 5 corresponds to the vertical direction in FIG. 4. The Y direction in the first region 5 and the second region 6 of the vapor chamber 1 shown in FIG. 4 corresponds to the direction in which the first land portions 33 are arranged. The Z direction corresponds to the direction orthogonal to the vapor chamber 1 in the first region 5 and the second region 6 of the vapor chamber 1 shown in FIG. 4. The Z direction in the second region 6 corresponds to the vertical direction in FIG. 4.

[0063] The frame body portion 32 and each first land portion 33 are diffusion-bonded to the first sheet 10 and are also diffusion-bonded to the second sheet 20. This improves the mechanical strength of the vapor chamber 1. The wall surface 53a of the first vapor flow path recess 53 and the wall surface 54a of the second vapor flow path recess 54, which will be described later, constitute the side walls of the first land portion 33. The first main body surface 30a and the second main body surface 30b of the wick sheet 30 may be formed flatly over the frame body portion 32 and each first land portion 33.

[0064] As shown in FIGS. 9 and 10, alignment holes 35 may be formed at the four corners of the wick sheet 30. FIGS. 9 and 10 show an example in which the planar shape of the alignment holes 35 is circular, but the present invention is not limited to this. Further, the alignment holes 35 may penetrate the wick sheet 30.

[0065] As shown in FIG. 6, the vapor flow path portion 50 may be provided on the first main body surface 30a of the wick sheet 30. The vapor flow path portion 50 is an example of a space portion. The vapor flow path portion 50 may mainly be a flow path through which the working vapor 2a passes. The working liquid 2b may also pass through the vapor flow path portion 50. In the present embodiment, the vapor flow path portion 50 may extend from the first main body surface 30a to the second main body surface 30b and may penetrate the wick sheet 30. The vapor flow path portion 50 may be covered with the first sheet 10 on the first main body surface 30a and may be covered with the second sheet 20 on the second main body surface 30b.

[0066] As shown in FIGS. 9 and 10, the vapor flow path portion 50 according to the present embodiment may include a first vapor passage 51 and a plurality of second vapor passages 52. The first vapor passage 51 is formed between the frame portion 32 and the first land portion 33. The first vapor passage 51 is an example of the space peripheral portion. The first vapor passage 51 is continuously formed inside the frame portion 32 and outside the first land portion 33. The planar shape of the first vapor passage 51 may be a rectangular frame shape along the X direction and the Y direction. The second vapor passages 52 are formed between adjacent first land portions 33. The planar shape of the second vapor passage 52 may be an elongated rectangular shape. By the plurality of first land portions 33, the vapor flow path portion 50 is partitioned into the first vapor passage 51 and the plurality of second vapor passages 52.

[0067] As shown in FIG. 6, the first vapor passage 51 and the second vapor passages 52 may extend from the first main body surface 30a to the second main body surface 30b of the wick sheet 30. The first vapor passage 51 and the second vapor passages 52 include a first vapor flow path recess 53 provided on the first main body surface 30a and a second vapor flow path recess 54 provided on the second main body surface 30b. The first vapor flow path recess 53 and the second vapor flow path recess 54 communicate with each other.

[0068] The first vapor flow path recess 53 may be formed by being etched from the first main body surface 30a of the wick sheet 30 in an etching process described later. The first vapor flow path recess 53 is formed in a concave shape on the first main body surface 30a. The first vapor flow path recess 53 may have a curved wall surface 53a as shown in FIG. 11. FIG. 11 shows a cross section orthogonal to the X direction. This wall surface 53a defines the first vapor flow path recess 53 and may be curved so as to approach the opposing wall surface 53a as it approaches the second main body surface 30b. The first vapor flow path recess 53 constitutes a portion of the first vapor passage 51 that is relatively close to the first sheet 10 and a portion of the second vapor passages 52 that is relatively close to the first sheet 10.

[0069] The width w2 of the first vapor flow path recess 53 may be, for example, 100 μm to 5000 μm. The width w2 of the first vapor flow path recess 53 is a dimension in the Y direction and is the dimension of the first vapor flow path recess 53 on the first main body surface 30a. The width w2 corresponds to the dimension in the Y direction of the portion of the first vapor passage 51 extending in the X direction and the dimension in the Y direction of the second vapor passage 52. The width w2 also corresponds to the dimension in the X direction of the portion of the first vapor passage 51 extending in the Y direction.

[0070] The second vapor flow path recess 54 may be formed by being etched from the second main body surface 30b of the wick sheet 30 in an etching process described later. The second vapor flow path recess 54 is formed in a concave shape on the second main body surface 30b. The second vapor flow path recess 54 may have a curved wall surface 54a as shown in FIG. 11. This wall surface 54a defines the second vapor flow path recess 54 and may be curved so as to approach the opposing wall surface 54a as it approaches the first main body surface 30a. The second vapor flow path recess 54 constitutes a portion of the first vapor passage 51 that is relatively close to the second sheet 20 and a portion of the second vapor passage 52 that is relatively close to the second sheet 20.

[0071] Similar to the width w2 of the first vapor flow path recess 53 described above, the width w3 of the second vapor flow path recess 54 may be, for example, 100 μm to 5000 μm. The width w3 of the second vapor flow path recess 54 is a dimension in the Y direction and is the dimension of the second vapor flow path recess 54 on the second main body surface 30b. The width w3 corresponds to the dimension in the Y direction of the portion of the first vapor passage 51 extending in the X direction and the dimension in the Y direction of the second vapor passage 52. The width w3 also corresponds to the dimension in the X direction of the portion of the first vapor passage 51 extending in the Y direction. The width w3 of the second vapor flow path recess 54 may be equal to or different from the width w2 of the first vapor flow path recess 53.

[0072] As shown in FIG. 11, the wall surface 53a of the first vapor flow path recess 53 and the wall surface 54a of the second vapor flow path recess 54 may be connected to form the through portion 34. In the present embodiment, the planar shape of the through portion 34 in the first vapor passage 51 may be a rectangular frame shape. The planar shape of the through portion 34 in the second vapor passage 52 may be an elongated rectangular shape. The through portion 34 may be defined by a ridge line where the wall surface 53a of the first vapor flow path recess 53 and the wall surface 54a of the second vapor flow path recess 54 merge. As shown in FIG. 11, the ridge line may be formed so as to protrude inside the vapor passages 51 and 52. The planar area of the first vapor passage 51 in the through portion 34 may be minimized, and the planar area of the second vapor passage 52 in the through portion 34 may be minimized. The width w4 of the through portion 34 in each of the vapor passages 51 and 52 may be, for example, 400 μm to 5000 μm. Here, the width w4 of the through portion 34 corresponds to the gap between the first land portions 33 adjacent to each other in the Y direction.

[0073] The position of the through portion 34 in the Z direction may be at an intermediate position between the first main body surface 30a and the second main body surface 30b. Alternatively, the position of the through portion 34 may be closer to the first sheet 10 than the intermediate position, or closer to the second sheet 20 than the intermediate position. The position of the through portion 34 in the Z direction is arbitrary.

[0074] In the present embodiment, as described above, the cross-sectional shapes of the first vapor passage 51 and the second vapor passage 52 are formed to include the through portion 34 defined by the ridge line formed so as to protrude inside, but it is not limited thereto. For example, the cross-sectional shape of the first vapor passage 51 and the cross-sectional shape of the second vapor passage 52 may be trapezoidal or parallelogram-shaped, or may be barrel-shaped.

[0075] The vapor flow path portion 50 including the first vapor passage 51 and the second vapor passage 52 configured as described above constitutes a part of the sealed space 3 described above. Each of the vapor passages 51 and 52 has a relatively large flow path cross-sectional area through which the working vapor 2a passes.

[0076] Here, FIG. 11 shows an enlarged view of the first steam passage 51 and the second steam passage 52 for clarity of the drawing. The number and position of the steam passages 51, 52, etc. are different from those in FIGS. 5, 9, and 10.

[0077] Although not shown, a plurality of support portions for supporting the first land portion 33 on the frame body portion 32 may be provided in each of the steam passages 51 and 52. Further, a support portion for supporting the first land portions 33 adjacent to each other may be provided. These support portions may be provided on both sides of the first land portion 33 in the X direction, or may be provided on both sides of the first land portion 33 in the Y direction. The support portion is preferably formed so as not to obstruct the flow of the working steam 2a that diffuses the steam flow path portion 50. For example, the support portion may be located at a position close to one of the first main body surface 30a and the second main body surface 30b of the wick sheet 30, and a space forming the steam flow path portion 50 may be formed at a position close to the other. By this, the thickness of the support portion can be made thinner than the thickness of the wick sheet 30, and the first steam passage 51 and the second steam passage 52 can be prevented from being divided in the X direction and the Y direction.

[0078] As shown in FIG. 5, the vapor chamber 1 may include an injection portion 4 for injecting the working liquid 2b into the sealed space 3. The injection portion 4 includes an injection flow path 36 communicating with the first steam passage 51. The position of the injection portion 4 is arbitrary. As shown in FIGS. 9 and 10, the injection flow path 36 may be formed in a concave shape on the second main body surface 30b. Alternatively, the injection flow path 36 may be formed in a concave shape on the first main body surface 30a. Note that depending on the configuration of the first liquid flow path portion 60, the injection flow path 36 may communicate with the first liquid flow path portion 60.

[0079] As shown in FIGS. 6, 10, and 11, the first liquid flow path portion 60 may be formed between the first sheet 10 and the wick sheet 30. In the present embodiment, the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33. The first liquid flow path portion 60 may be a flow path mainly through which the working liquid 2b passes. The above-described working vapor 2a may pass through the first liquid flow path portion 60. The first liquid flow path portion 60 constitutes a part of the above-described sealed space 3 and communicates with the vapor flow path portion 50. The first liquid flow path portion 60 is configured as a capillary structure for transporting the working liquid 2b to the evaporation region SR. The first liquid flow path portion 60 may also be referred to as a wick. The first liquid flow path portion 60 may be formed over the entire first main body surface 30a of each first land portion 33. Although not shown in FIG. 9 and the like, the first liquid flow path portion 60 may be formed in the inner portion of the first main body surface 30a of the frame portion 32. In the present embodiment, the first liquid flow path portion 60 is not formed on the second main body surface 30b of the first land portion 33 and the second main body surface 30b of the frame portion 32.

[0080] As shown in FIG. 12, the first liquid flow path portion 60 is an example of a first groove aggregate including a plurality of grooves. More specifically, the first liquid flow path portion 60 includes a plurality of main flow grooves 61 and a plurality of connection grooves 65. The main flow grooves 61 and the connection grooves 65 are grooves through which the working liquid 2b passes. The connection grooves 65 communicate with the main flow grooves 61.

[0081] As shown in FIG. 12, each main flow groove 61 extends in the X direction. The main flow groove 61 mainly has a small flow path cross-sectional area so that the working liquid 2b flows by capillary action. The flow path cross-sectional area of the main flow groove 61 is smaller than the flow path cross-sectional areas of the vapor passages 51 and 52. The main flow groove 61 is configured to transport the working liquid 2b condensed from the working vapor 2a to the evaporation region SR. Each main flow groove 61 may be spaced apart at equal intervals along the Y direction orthogonal to the X direction. Each main flow groove 61 may be positioned parallel to each other.

[0082] The main flow channel 61 is formed by being etched from the first main body surface 30a of the wick sheet 30 in the etching process described later. As a result, the main flow channel 61 may have a curved wall surface 62 as shown in FIG. 11. This wall surface 62 defines the main flow channel 61 and may be curved in a shape that bulges toward the second main body surface 30b.

[0083] As shown in FIGS. 11 and 12, the width w5 of the main flow channel 61 may be smaller than the width w2 of the first vapor flow path recess 53. The width w5 of the main flow channel 61 may be smaller than the width w1 of the first land portion 33. The width w5 of the main flow channel 61 may be, for example, 5 μm to 400 μm. The width w5 means the dimension of the main flow channel 61 on the first main body surface 30a. In FIGS. 11 and 12, the width w5 corresponds to the dimension of the main flow channel 61 in the Y direction. The depth h1 of the main flow channel 61 may be, for example, 3 μm to 300 μm. The depth h1 corresponds to the dimension of the main flow channel 61 in the Z direction.

[0084] As shown in FIG. 12, each communication channel 65 extends in a direction different from the X direction. In the present embodiment, each communication channel 65 extends in the Y direction and is formed perpendicular to the main flow channel 61. Some of the communication channels 65 communicate with adjacent main flow channels 61. Other communication channels 65 communicate the first vapor passage 51 or the second vapor passage 52 with the main flow channel 61. That is, the communication channel 65 extends from the side edge 33a of the first land portion 33 in the Y direction to the main flow channel 61 adjacent to the side edge 33a. In this way, the first vapor passage 51 communicates with the main flow channel 61, and the second vapor passage 52 communicates with the main flow channel 61.

[0085] The communication channel 65 mainly has a small flow channel cross-sectional area so that the working fluid 2b flows by capillary action. The flow channel cross-sectional area of the communication channel 65 is smaller than the flow channel cross-sectional areas of the vapor passages 51 and 52. The communication channels 65 are spaced apart at equal intervals along the X direction. Each communication channel 65 may be positioned parallel to each other.

[0086] The communication groove 65 is also formed by etching described later, similar to the main flow groove 61. Thus, the communication groove 65 may have a wall surface (not shown) formed in a curved shape similar to that of the main flow groove 61. The width w6 of the communication groove 65 may be smaller than the width w2 of the first vapor flow path recess 53. The width w6 of the communication groove 65 may be smaller than the width w1 of the first land portion 33. As shown in FIG. 12, the width w6 of the communication groove 65 may be equal to the width w5 of the main flow groove 61. However, the width w6 may be larger than or smaller than the width w5. The width w6 means the dimension of the communication groove 65 on the first main body surface 30a. In FIG. 12, the width w6 corresponds to the dimension of the communication groove 65 in the X direction. The depth of the communication groove 65 may be equal to the depth h1 of the main flow groove 61. However, the depth of the communication groove 65 may be deeper or shallower than the depth h1.

[0087] As shown in FIG. 12, the first liquid flow path portion 60 has a convex portion row 63. The convex portion row 63 is provided on the first main body surface 30a of the wick sheet 30. The convex portion row 63 is provided between adjacent main flow grooves 61. Each convex portion row 63 includes a plurality of convex portions 64 arranged in the X direction. The convex portion 64 is in contact with the first sheet 10. As shown in FIG. 12, each convex portion 64 is formed in a rectangular shape such that the X direction is the longitudinal direction in plan view. A main flow groove 61 is interposed between adjacent convex portions 64 in the Y direction. A communication groove 65 is interposed between adjacent convex portions 64 in the X direction.

[0088] The convex portion 64 is a portion where the material of the wick sheet 30 remains without being etched in the etching process described later. In the present embodiment, as shown in FIG. 12, the planar shape of the convex portion 64 is rectangular. More specifically, the planar shape of the convex portion 64 corresponds to the planar shape at the position of the first main body surface 30a.

[0089] In the present embodiment, the convex portions 64 are arranged in a staggered pattern. More specifically, the convex portions 64 of the convex portion rows 63 adjacent to each other in the Y direction are located at positions shifted from each other in the X direction. This shift amount may be half of the arrangement pitch of the convex portions 64 in the X direction. The width w7 of the convex portion 64 may be, for example, 5 μm to 500 μm. The width w7 means the dimension of the convex portion 64 on the first main body surface 30a. In FIG. 12, the width w7 corresponds to the dimension of the convex portion 64 in the Y direction. Note that the positions of the convex portions 64 are not limited to being in a staggered pattern and may be arranged in parallel. In this case, the convex portions 64 of the convex portion rows 63 adjacent to each other in the Y direction are located at the same positions in the X direction.

[0090] Incidentally, the materials constituting the first sheet 10, the second sheet 20, and the wick sheet 30 are not particularly limited as long as they have good thermal conductivity to ensure the heat dissipation efficiency as the vapor chamber 1. For example, each of the sheets 10, 20, 30 may be made of a metal material. For example, each of the sheets 10, 20, 30 may contain copper or a copper alloy. Copper and copper alloys have good thermal conductivity and corrosion resistance when pure water is used as the working fluid. Examples of copper include pure copper and oxygen-free copper (C1020). Examples of copper alloys include copper alloys containing tin, copper alloys containing titanium (such as C1990), and Corson-based copper alloys (such as C7025) that are copper alloys containing nickel, silicon, and magnesium. The copper alloy containing tin is, for example, phosphor bronze (such as C5210).

[0091] The materials constituting the first sheet 10, the second sheet 20, and the wick sheet 30 are not particularly limited as long as they have good thermal conductivity. Each sheet 10, 20, 30 may contain, for example, copper or a copper alloy. In this case, the thermal conductivity of each sheet 10, 20, 30 can be increased, and the heat dissipation efficiency of the vapor chamber 1 can be increased. Further, when pure water is used as the working fluids 2a, 2b, corrosion can be prevented. Note that as long as a desired heat dissipation efficiency can be obtained and corrosion can be prevented, other metal materials such as aluminum or titanium, or other metal alloy materials such as stainless steel may be used for these sheets 10, 20, 30.

[0092] The thickness t1 of the vapor chamber 1 shown in FIG. 5 may be, for example, 100 μm to 500 μm. By setting the thickness t1 of the vapor chamber 1 to 100 μm or more, the vapor flow path portion 50 can be appropriately secured. Therefore, the vapor chamber 1 can function properly. On the other hand, by setting the thickness t1 to 500 μm or less, an increase in the thickness t1 of the vapor chamber 1 can be suppressed. Therefore, the vapor chamber 1 can be made thinner.

[0093] The thickness of the wick sheet 30 may be greater than the thickness of the first sheet 10. Similarly, the thickness of the wick sheet 30 may be greater than the thickness of the second sheet 20. In the present embodiment, an example in which the thicknesses of the first sheet 10 and the second sheet 20 are equal is shown. However, the present invention is not limited to this, and the thicknesses of the first sheet 10 and the second sheet 20 may be different.

[0094] The thickness t2 of the first sheet 10 may be, for example, 6 μm to 100 μm. By setting the thickness t2 of the first sheet 10 to 6 μm or more, the mechanical strength and long-term reliability of the first sheet 10 can be ensured. On the other hand, by setting the thickness t2 of the first sheet 10 to 100 μm or less, an increase in the thickness t1 of the vapor chamber 1 can be suppressed. The thickness t3 of the second sheet 20 may be set in the same manner as the thickness t2 of the first sheet 10.

[0095] The thickness t4 of the wick sheet 30 may be, for example, 50 μm to 400 μm. By setting the thickness t4 of the wick sheet 30 to 50 μm or more, the vapor flow path portion 50 can be appropriately secured. Therefore, the vapor chamber 1 can function properly. On the other hand, by setting it to 400 μm or less, an increase in the thickness t1 of the vapor chamber 1 can be suppressed. Therefore, the vapor chamber 1 can be made thinner. Note that the thickness t4 of the wick sheet 30 may be the distance between the first main body surface 30a and the second main body surface 30b.

[0096] As described above, the vapor chamber 1 according to the present embodiment is divided into a first region 5, a second region 6, and a bent region 7. In the bent region 7, the vapor chamber 1 is bent along a bent line 8 extending in a direction intersecting the X direction in a plan view. As shown in FIGS. 4 and 5, the bent line 8 according to the present embodiment extends in the Y direction in a plan view. The Y direction is a direction orthogonal to the X direction in a plan view. The bent line 8 crosses the frame body portion 32, the first land portion 33, the first vapor passage 51, and the second vapor passage 52. Thereby, deformation such that the first sheet 10 enters each of the vapor passages 51 and 52 can be suppressed, and deformation such that the second sheet 20 enters each of the vapor passages 51 and 52 can be suppressed. The flow path cross-sectional areas of the first vapor passage 51 and the second vapor passage 52 can be secured.

[0097] The first region 5, the second region 6, and the bent region 7 may be separated by a boundary line along the bent line 8. As shown in FIGS. 4 and 5, each of the regions 5, 6, and 7 may be separated by a boundary line extending in the Y direction in a plan view. The bent region 7 is a region having a certain width including the bent line 8. The bent region 7 is composed of a portion where the vapor chamber 1 is deformed by bending. The first region 5 and the second region 6 correspond to other regions other than the bent region 7. That is, the first region 5 and the second region 6 are non-bent regions. As shown in FIGS. 4 and 5, the first region 5 and the second region 6 may be regions that extend on the XY plane without being bent. The first region 5 and the second region 6 may be composed of portions where no deformation of the bent vapor chamber 1 occurs.

[0098] The first region 5 and the second region 6 may be two regions separated by the bending region 7. The first region 5 may be a region located on one side (the left side in FIG. 5) of the bending region 7 in the direction orthogonal to the bending line 8 (the X direction in the illustrated example). The first region 5 may be a region adjacent to the bending region 7 on one side of the bending region 7. The second region 6 may be a region located on the other side (the right side in FIG. 5) of the bending region 7 in the direction orthogonal to the bending line 8. The second region 6 may be a region adjacent to the bending region 7 on the other side of the bending region 7.

[0099] In the illustrated example, the first region 5 extends from the boundary line with the bending region 7 to the end on one side (the left side in FIG. 5) of the vapor chamber 1 in the X direction, and the second region 6 extends from the boundary line with the bending region 7 to the end on the other side (the right side in FIG. 5) of the vapor chamber 1 in the X direction, but it is not limited thereto. For example, the first region 5 may not extend to the end on one side of the vapor chamber 1 in the X direction, and the second region 6 may not extend to the end on the other side of the vapor chamber 1 in the X direction either.

[0100] As shown in FIG. 13, the vapor chamber 1 is bent. In the bending region 7, the first sheet 10 is located outside the wick sheet 30 with respect to the center O of the bending. The second sheet 20 is located inside the wick sheet 30 with respect to the center O of the bending.

[0101] As shown in FIG. 13, each of the vapor passages 51, 52 may include a passage bending portion 57 located in the bending region 7. FIG. 13 shows an example of the passage bending portion 57. In FIG. 13, the shape of the passage bending portion 57 when viewed along the Y direction forms a quarter arc, but it is not limited thereto. The passage bending portion 57 may include the first vapor flow path recess 53 and the second vapor flow path recess 54 described above.

[0102] As shown in FIGS. 11, 13, and 14, the first sheet outer surface 10a of the above-described first sheet 10 may include a plurality of first joining regions 13 and a first vapor flow path region 14. Each of the first joining regions 13 is a region that overlaps the corresponding first land portion 33 in plan view. The first joining region 13 is a portion joined to the first land portion 33 of the wick sheet 30. The first vapor flow path region 14 is an example of the first space region. The first vapor flow path region 14 is a region that overlaps the vapor flow path portion 50 in plan view. The first vapor flow path region 14 is a portion not joined to the wick sheet 30. The flow path cross section of the first vapor flow path region 14 may be formed in a concave shape so as to be concave inward toward the vapor flow path portion 50. The first vapor flow path region 14 may be formed in a curved shape.

[0103] The first vapor flow path region 14 of the first sheet outer surface 10a may be formed in a concave shape in each of the first region 5, the second region 6, and the bending region 7. More specifically, in each of the first region 5 and the second region 6, as shown in FIG. 11, the first vapor flow path region 14 may be formed in a concave shape. FIG. 11 is a cross-sectional view taken along line B-B of FIG. 13. In the bending region 7, as shown in FIG. 14, the first vapor flow path region 14 may be formed in a concave shape. FIG. 14 is a cross-sectional view taken along line C-C of FIG. 13. Over the entire area of the first sheet outer surface 10a, the first vapor flow path region 14 may be formed in a concave shape.

[0104] As shown in FIGS. 11 and 14, the first sheet 10 may include a first sheet recess 15 that overlaps the first vapor flow path region 14 in plan view. The first sheet recess 15 enters the first vapor flow path recess 53.

[0105] When bent, since the portion of the first sheet 10 in the first joint region 13 is joined to the first land portion 33, this portion deforms along the first land portion 33. On the other hand, since the portion of the first sheet 10 in the first steam flow path region 14 covers each steam passage 51, 52 of the steam flow path portion 50, it is less likely to stretch than the portion of the first joint region 13. For this reason, the elongation of the portion of the first steam flow path region 14 is small. As shown in FIG. 14, the first sheet recess 15 is displaced inward and enters the first steam flow path recess 53.

[0106] The recess dimension of the first steam flow path region 14 in the bending region 7 is larger than the recess dimension of the first steam flow path region 14 in the first region 5 and the second region 6. As shown in FIG. 13, when viewed along the direction parallel to the bending line 8, the maximum dimension d2 in the bending region 7 is larger than the maximum dimension d1 in the first region 5 and the second region 6. The maximum dimension d1 is the dimension defined between the first joint region 13 and the first steam flow path region 14 in the first region 5 and the second region 6, and is the dimension in the thickness direction of the first sheet 10. The thickness direction of the first sheet 10 corresponds to the Z direction. The maximum dimension d2 is the dimension defined between the first joint region 13 and the first steam flow path region 14 in the bending region 7, and is the dimension in the thickness direction of the first sheet 10. FIG. 13 is a view seen along the direction parallel to the bending line 8, in other words, along the Y direction. The maximum dimensions d1, d2 defined between the first joint region 13 and the first steam flow path region 14, which are the maximum dimensions d1, d2 in the thickness direction of the first sheet 10, are also referred to as the first maximum dimensions d3, d4. Note that the fact that the maximum dimension d2 in the bending region 7 is larger than the maximum dimension d1 in the first region 5 and the second region 6 means that it is sufficient if the maximum dimension d2 at a certain position in the bending region 7 is larger than the maximum dimension d1 at a certain position in the first region 5 and the second region 6, and it is not necessary that the maximum dimension d2 at all positions in the bending region 7 is larger than the maximum dimension d1 at all positions in the first region 5 and the second region 6.

[0107] FIG. 11 shows a cross-section of the vapor chamber 1 orthogonal to the X direction in the first region 5 and the second region 6. In the present embodiment, in each of the first region 5 and the second region 6, the first vapor flow path region 14 is recessed. The first bonding region 13 is formed flat in each of the X direction and the Y direction. The above-described dimension d1 may be the depth dimension of the recess. The dimension d1 may be the distance between the most recessed position in the first vapor flow path region 14 and a straight line on the first bonding region 13 that overlaps with and extends in the Y direction when viewed in the normal direction of the position. That is, the dimension d1 may be the distance in the Z direction between the most recessed position in the first vapor flow path region 14 and the position of the flat portion of the first bonding region 13. The dimension d1 may be obtained from each of the first region 5 and the second region 6. The dimension d1 in the first region 5 and the dimension d1 in the second region 6 may be equal, but may also be different.

[0108] FIG. 14 shows a cross-section of the vapor chamber 1 orthogonal to the X direction in the bending region 7. In the present embodiment, the first vapor flow path region 14 in the bending region 7 is recessed. The first bonding region 13 in the bending region 7 is formed flat in the Y direction. The above-described dimension d2 may be the depth dimension of the recess. The dimension d2 may be the distance between the most recessed position in the first vapor flow path region 14 and a straight line on the first bonding region 13 that overlaps with and extends in the Y direction when viewed in the normal direction of the position. That is, the dimension d2 may be the distance in the Z direction between the most recessed position in the first vapor flow path region 14 and the position of the flat portion of the first bonding region 13. FIG. 14 is a cross-sectional view taken along the line C-C of FIG. 13 and is a cross-sectional view at the position where the first vapor flow path region 14 is most recessed. FIG. 14 shows a cross-section at a position rotated 45° with respect to the center O of bending from the boundary between the first region 5 and the bending region 7. However, the position where the first vapor flow path region 14 is most recessed is not limited to this.

[0109] The first vapor flow path region 14 shown in FIG. 14 is recessed more deeply than the first vapor flow path region 14 shown in FIG. 11. For this reason, the dimension d2 is larger than the dimension d1. The first sheet recess 15 in the bending region 7 extends deeper into the first vapor flow path recess 53 than the first sheet recess 15 in the first region 5 and the second region 6.

[0110] As shown in FIGS. 11 and 14, a flow path corner 55 that constitutes a part of the vapor flow path cross section is defined by the first sheet inner surface 10b in the first sheet recess 15 and the wall surface 53a of the first vapor flow path recess 53. The flow path corner 55 may be formed in a wedge shape.

[0111] As shown in FIG. 11, in each of the first region 5 and the second region 6, the angle formed by the first sheet inner surface 10b and the wall surface 53a may be α1. α1 may be an acute angle. The angle α1 may be defined by the tangent of the first sheet inner surface 10b and the tangent of the wall surface 53a at the intersection of the first sheet inner surface 10b and the wall surface 53a.

[0112] As shown in FIG. 14, in the bending region 7, the angle formed by the first sheet inner surface 10b and the wall surface 53a may be α2. α2 may be defined in the same manner as α1.

[0113] The angle α2 shown in FIG. 14 may be smaller than the angle α1 shown in FIG. 11. This is because the first vapor flow path region 14 shown in FIG. 14 is recessed more deeply than the first vapor flow path region 14 shown in FIG. 11. In this case, the capillary action of the flow path corner 55 shown in FIG. 14 may be stronger than the capillary action of the flow path corner 55 shown in FIG. 11.

[0114] The first vapor flow path region 14 may extend in the X direction in the same manner as the first land portion 33 in each of the first region 5, the second region 6, and the bending region 7. The first sheet recess 15 and the flow path corner 55 may also extend in the X direction in the same manner.

[0115] As shown in FIGS. 11, 13, and 14, the second sheet outer surface 20b of the above-described second sheet 20 may include a plurality of second joining regions 23 and a second vapor flow path region 24. Each of the second joining regions 23 is a region that overlaps with the corresponding first land portion 33 in plan view. The second joining region 23 is a portion joined to the first land portion 33 of the wick sheet 30. The second vapor flow path region 24 is an example of a second space region. The second vapor flow path region 24 is a region that overlaps with the vapor flow path portion 50 in plan view. The second vapor flow path region 24 is a portion not joined to the wick sheet 30. The flow path cross-section of the second vapor flow path region 24 may be formed in a concave shape so as to be concave inward toward the vapor flow path portion 50. The second vapor flow path region 24 may be formed in a curved shape.

[0116] The second vapor flow path region 24 of the second sheet outer surface 20b may be formed in a concave shape in each of the first region 5, the second region 6, and the bent region 7. More specifically, in each of the first region 5 and the second region 6, as shown in FIG. 11, the second vapor flow path region 24 may be formed in a concave shape. In the bent region 7, as shown in FIG. 14, the second vapor flow path region 24 may be formed in a concave shape. Over the entire area of the second sheet outer surface 20b, the second vapor flow path region 24 may be formed in a concave shape.

[0117] As shown in FIGS. 11 and 14, the second sheet 20 may include a second sheet recess 25 that overlaps with the second vapor flow path region 24 in plan view. The second sheet recess 25 enters the second vapor flow path recess 54.

[0118] When bent, since the portion of the second joint region 23 in the second sheet 20 is joined to the first land portion 33, this portion deforms along the first land portion 33. On the other hand, since the portion of the second vapor flow path region 24 covers each of the vapor passages 51 and 52 of the vapor flow path portion 50, it is likely to shrink. Since the second sheet 20 is located inside, a jig (not shown) abuts against the outer surface 20b of the second sheet 20. For this reason, the displacement of the second vapor flow path region 24 inward is restricted. As shown in FIG. 13, the second sheet recess 25 is displaced outward and enters the second vapor flow path recess 54.

[0119] The recess dimension of the second vapor flow path region 24 in the bent region 7 is larger than the recess dimension of the second vapor flow path region 24 in the first region 5 and the second region 6. As shown in FIG. 13, when viewed along the direction parallel to the bending line 8, the maximum dimension d4 in the bent region 7 is larger than the maximum dimension d3 in the first region 5 and the second region 6. The maximum dimension d3 is the dimension defined between the second joint region 23 and the second vapor flow path region 24 in the first region 5 and the second region 6, and is the dimension in the thickness direction of the second sheet 20. The thickness direction of the second sheet 20 corresponds to the Z direction. The maximum dimension d4 is the dimension defined between the second joint region 23 and the second vapor flow path region 24 in the bent region 7, and is the dimension in the thickness direction of the second sheet 20. The maximum dimensions d3 and d4 defined between the second joint region 23 and the second vapor flow path region 24, which are the maximum dimensions d3 and d4 in the thickness direction of the second sheet 20, are also referred to as the second maximum dimensions d3 and d4. Note that the fact that the maximum dimension d4 in the bent region 7 is larger than the maximum dimension d3 in the first region 5 and the second region 6 means that it is sufficient if the maximum dimension d4 at a certain position in the bent region 7 is larger than the maximum dimension d3 at a certain position in the first region 5 and the second region 6, and it is not necessary that the maximum dimension d4 at all positions in the bent region 7 is larger than the maximum dimension d3 at all positions in the first region 5 and the second region 6.

[0120] In the present embodiment, in each of the first region 5 and the second region 6, the second vapor flow path region 24 is recessed. The second joint region 23 is formed flat in each of the X direction and the Y direction. The dimension d3 described above may be the depth dimension of the recess. The dimension d3 may be the distance between the most recessed position in the second vapor flow path region 24 and a straight line extending in the Y direction overlapping the position when viewed in the normal direction of the position on the second joint region 23. That is, the dimension d3 may be the distance in the Z direction between the most recessed position in the second vapor flow path region 24 and the position of the flat portion of the second joint region 23. The dimension d3 may be obtained from each of the first region 5 and the second region 6. The dimension d3 in the first region 5 and the dimension d3 in the second region 6 may be equal, but may also be different.

[0121] In the present embodiment, the second vapor flow path region 24 in the bent region 7 is recessed. The second joint region 23 in the bent region 7 is formed flat in the Y direction. The dimension d4 described above may be the depth dimension of the recess. The dimension d4 may be the distance between the most recessed position in the second vapor flow path region 24 and a straight line extending in the Y direction overlapping the position when viewed in the normal direction of the position on the second joint region 23. That is, the dimension d4 may be the distance in the Z direction between the most recessed position in the second vapor flow path region 24 and the position of the flat portion of the second joint region 23. FIG. 14 is a cross-sectional view at the position where the second vapor flow path region 24 is most recessed, but the position where the second vapor flow path region 24 is most recessed is not limited to this, similar to the first vapor flow path region 14.

[0122] The second vapor flow path region 24 shown in FIG. 14 is recessed more deeply than the second vapor flow path region 24 shown in FIG. 11. Therefore, the dimension d4 is larger than the dimension d3. The second sheet recess 25 in the bent region 7 extends deeper into the second vapor flow path recess 54 than the second sheet recess 25 in the first region 5 and the second region 6.

[0123] As shown in FIGS. 11 and 14, a channel corner 56 that forms part of the cross-section of the vapor flow path is defined by the inner surface 20a of the second sheet and the wall surface 54a of the second vapor flow path recess 25 in the second sheet recess 25. The channel corner 56 may be formed in a wedge shape.

[0124] As shown in FIG. 11, in each of the first region 5 and the second region 6, the angle formed by the inner surface 20a of the second sheet and the wall surface 54a may be β1. β1 may be an acute angle. The angle β1 may be defined by the tangent of the inner surface 20a and the tangent of the wall surface 54a at the intersection of the inner surface 20a of the second sheet and the wall surface 54a.

[0125] As shown in FIG. 14, in the bent region 7, the angle formed by the inner surface 20a of the second sheet and the wall surface 53a may be β2. β2 may be defined in the same manner as β1.

[0126] The angle β2 shown in FIG. 14 may be smaller than the angle β1 shown in FIG. 11. This is because the second vapor flow path region 24 shown in FIG. 14 is more deeply recessed than the second vapor flow path region 24 shown in FIG. 11. In this case, the capillary action of the channel corner 56 shown in FIG. 14 may be stronger than the capillary action of the channel corner 56 shown in FIG. 11.

[0127] The second vapor flow path region 24 may extend in the X direction in the same manner as the first land portion 33 in each of the first region 5, the second region 6, and the bent region 7. The second sheet recess 25 and the channel corner 56 may also extend in the X direction in the same manner.

[0128] As described above, the first sheet 10 and the second sheet 20 may be thinner than the wick sheet 30. In this case, stress can be applied to the portion of the first sheet 10 that overlaps the vapor flow path portion 50 to leave distortion, and stress can be applied to the portion of the second sheet 20 that overlaps the vapor flow path portion 50 to leave distortion. Due to such distortion, even before bending, the first vapor flow path region 14 and the second vapor flow path region 24 can be formed in a concave shape in the first region 5, the second region 6, and the bending region 7. For example, the first sheet 10 and the second sheet 20 are more likely to leave distortion by applying stress while being heated and softened, or are more likely to leave distortion by applying stress after being heated and softened. As a result, the first vapor flow path region 14 and the second vapor flow path region 24 can be formed in a concave shape. However, as will be described later, the first vapor flow path region 14 before bending may be formed flat in the first region 5, the second region 6, and the bending region 7. Similarly, the second vapor flow path region 24 before bending may be formed flat in the first region 5, the second region 6, and the bending region 7.

[0129] Next, a method for manufacturing the vapor chamber 1 of the present embodiment having such a configuration will be described.

[0130] First, as a preparation step, the first sheet 10, the second sheet 20, and the wick sheet 30 are prepared. The preparation step may include an etching step of forming the wick sheet 30 by etching. In the etching step, the wick sheet 30 may be formed by etching using a patterned resist film (not shown) by photolithography technology.

[0131] As a temporary fixing step, the first sheet 10, the wick sheet 30, and the second sheet 20 are temporarily fixed. For example, each sheet 10, 20, 30 may be temporarily fixed by spot welding or laser welding. At this time, each sheet 10, 20, 30 may be aligned using the alignment holes 12, 22, 35 described above.

[0132] Next, as a joining step, the first sheet 10, the wick sheet 30, and the second sheet 20 are permanently joined. Each of the sheets 10, 20, and 30 may be joined by diffusion bonding.

[0133] After the joining step, as an injection step, the sealed space 3 is evacuated, and the working fluid 2b is injected into the sealed space 3 from the injection portion 4 (see FIG. 5).

[0134] After the injection step, as a sealing step, the above-described injection flow path 36 is sealed. As a result, the communication between the sealed space 3 and the outside is blocked, and the sealed space 3 is sealed. A sealed space 3 filled with the working fluid 2b is obtained, and leakage of the working fluid 2b in the sealed space 3 to the outside is prevented.

[0135] After the sealing step, as a bending step, the first sheet 10, the second sheet 20, and the wick sheet 30 may be bent. For example, each of the sheets 10, 20, and 30 is bent along a bending line 8 extending in the Y direction as shown in FIG. 5. At this time, a jig (not shown) is brought into contact with the outer surface 20b of the second sheet 20 on the inner side of the bending. Both end portions of each of the sheets 10, 20, and 30 in the X direction are gripped, and each of the sheets 10, 20, and 30 is bent at a desired angle. As a result, the bent vapor chamber 1 shown in FIG. 4 is obtained, and the vapor chamber 1 is divided into a first region 5, a second region 6, and a bending region 7. Note that the bending step may be performed between the joining step and the injection step.

[0136] As described above, the vapor chamber 1 according to the present embodiment is obtained.

[0137] Next, a method of operating the vapor chamber 1, that is, a method of cooling the electronic device D will be described.

[0138] The vapor chamber 1 obtained as described above is installed in a housing H such as a mobile terminal. In the first region 5, the outer surface 10a of the first sheet 10 of the first sheet contacts the housing member Ha. In the second region 6, the outer surface 20b of the second sheet 20 of the second sheet contacts the electronic device D. The working fluid 2b in the sealed space 3 adheres to the wall surface of the sealed space 3 due to its surface tension. More specifically, the working fluid 2b adheres to the wall surface 53a of the first vapor flow path recess 53, the wall surface 54a of the second vapor flow path recess 54, the wall surface 62 of the main flow groove 61 of the first liquid flow path portion 60, and the wall surface of the communication groove 65. Further, the working fluid 2b may also adhere to the portion of the inner surface 10b of the first sheet 10 that is exposed in the first vapor flow path recess 53. Furthermore, the working fluid 2b may also adhere to the portions of the inner surface 20a of the second sheet 20 that are exposed in the second vapor flow path recess 54, the main flow groove 61, and the communication groove 65.

[0139] When the electronic device D generates heat in this state, the working fluid 2b present in the evaporation region SR receives heat from the electronic device D. The received heat is absorbed as latent heat and the working fluid 2b evaporates, generating working vapor 2a. The generated working vapor 2a diffuses in the first vapor passage 51 and the second vapor passage 52 that constitute the sealed space 3 (see the solid arrows in FIG. 9). More specifically, in the portion of the first vapor passage 51 of the vapor flow path portion 50 that extends in the X direction and the second vapor passage 52, the working vapor 2a mainly diffuses in the X direction. In this case, a part of the working vapor 2a diffuses through the passage bending portion 57. On the other hand, in the portion of the first vapor passage 51 that extends in the Y direction, the working vapor 2a mainly diffuses in the Y direction.

[0140] Then, the working vapor 2a in each of the vapor passages 51 and 52 moves away from the evaporation region SR and is transported to the condensation region CR where the temperature is relatively low. In the condensation region CR, the working vapor 2a is mainly cooled by releasing heat to the first sheet 10. The heat received by the first sheet 10 from the working vapor 2a is transmitted to the outside air through the housing member Ha (see FIG. 6).

[0141] The working vapor 2a loses the latent heat absorbed in the evaporation region SR by dissipating heat to the first sheet 10 in the condensation region CR. As a result, the working vapor 2a condenses and the working fluid 2b is generated. The generated working fluid 2b adheres to the wall surfaces 53a, 54a of the respective vapor flow path recesses 53, 54, the first sheet inner surface 10b of the first sheet 10, and the second sheet inner surface 20a of the second sheet 20. Here, in the evaporation region SR, the working fluid 2b continues to evaporate. For this reason, the working fluid 2b in the condensation region CR in the first fluid flow path portion 60 is transported toward the evaporation region SR by the capillary action of each main flow groove 61 (see the dashed arrow in FIG. 9). As a result, the working fluid 2b adhering to the wall surfaces 53a, 54a, the first sheet inner surface 10b, and the second sheet inner surface 20a moves to the first fluid flow path portion 60 and enters the main flow groove 61 through the communication groove 65. In this way, the main flow grooves 61 and the communication grooves 65 are filled with the working fluid 2b. The filled working fluid 2b obtains a driving force toward the evaporation region SR by the capillary action of each main flow groove 61 and is smoothly transported toward the evaporation region SR. As shown in FIG. 4, even when the evaporation region SR is located above the vapor chamber 1, the working fluid 2b is transported by capillary action.

[0142] In the first fluid flow path portion 60, each main flow groove 61 communicates with another adjacent main flow groove 61 via the corresponding communication groove 65. As a result, the working fluid 2b moves back and forth between the adjacent main flow grooves 61, and the occurrence of dry-out in the main flow groove 61 is suppressed. For this reason, capillary action is imparted to the working fluid 2b in each main flow groove 61, and the working fluid 2b is smoothly transported toward the evaporation region SR.

[0143] The working fluid 2b that has reached the evaporation region SR receives heat from the electronic device D again and evaporates. The working vapor 2a evaporated from the working fluid 2b moves through the communication groove 65 in the evaporation region SR to the first vapor flow path recess 53 and the second vapor flow path recess 54 with a large flow path cross-sectional area. Then, the working vapor 2a diffuses within each of the vapor flow path recesses 53 and 54, and a part of the working vapor 2a can diffuse through the passage bending portion 57. In this way, the working fluids 2a and 2b reflux within the sealed space 3 while repeating the phase change, that is, evaporation and condensation. As a result, the heat of the electronic device D is diffused and released. As a result, the electronic device D is cooled.

[0144] Here, as shown in FIGS. 11 and 14, in the first region 5, the second region 6, and the bending region 7, the first vapor flow path region 14 of the outer surface 10a of the first sheet is formed in a concave shape. The above-described flow path corner portion 55 having a capillary action is defined within the first vapor flow path recess 53. For this reason, due to the presence of the flow path corner portion 55, the working fluid 2b condensed within the vapor flow path portion 50 is transported toward the evaporation region SR.

[0145] More specifically, as shown in FIG. 13, when viewed along the direction parallel to the bending line 8, the maximum dimension d2 (the first maximum dimension d2) in the bending region 7 is larger than the maximum dimension d1 (the first maximum dimension d1) in the first region 5 and the second region 6. As a result, the capillary action of the flow path corner portion 55 in the bending region 7 is stronger than the capillary action of the flow path corner portion 55 in the first region 5 and the second region 6.

[0146] Similarly, in the first region 5, the second region 6, and the bending region 7, the second vapor flow path region 24 of the outer surface 20b of the second sheet is formed in a concave shape. The above-described flow path corner portion 56 having a capillary action is defined within the second vapor flow path recess 54. For this reason, due to the presence of the flow path corner portion 56, the working fluid 2b condensed within the vapor flow path portion 50 is transported toward the evaporation region SR.

[0147] More specifically, when viewed along the direction parallel to the bending line 8, the maximum dimension d4 (second maximum dimension d4) in the bending region 7 is larger than the maximum dimension d3 (second maximum dimension d3) in the first region 5 and the second region 6. As a result, the capillary action of the flow path corner 56 in the bending region 7 is stronger than the capillary action of the flow path corner 55 in the first region 5 and the second region 6.

[0148] Outside the passage bending portion 57, the working steam 2a is likely to collide with the inner surface 10b of the first sheet. The collided working steam 2a is condensed into the working liquid 2b and adheres to the inner surface 10b of the first sheet. A part of the adhered working liquid 2b is transported to the flow path corner 55 toward the evaporation region SR by the capillary action of the flow path corner 55 described above. Another part of the working liquid 2b adhered to the inner surface 10b of the first sheet enters the main flow groove 61 through the communication groove 65 of the first liquid flow path portion 60. Then, the working liquid 2b is transported toward the evaporation region SR by the capillary action of each main flow groove 61. In this way, the retention of the working liquid 2b adhered to the inner surface 10b of the first sheet in the bending region 7 is suppressed.

[0149] Inside the passage bending portion 57, the flow of the working steam 2a can be separated from the inner surface 20a of the second sheet. More specifically, a vortex is formed near the outlet of the passage bending portion 57, and the working steam 2a is condensed and adheres to the inner surface 20a of the second sheet. The vicinity of the outlet of the passage bending portion 57 corresponds to a portion of the passage bending portion 57 that is relatively close to the second region 6. A part of the adhered working liquid 2b is transported to the flow path corner 55 toward the evaporation region SR by the capillary action of the flow path corner 56 described above. In this way, the retention of the working liquid 2b adhered to the inner surface 20a of the second sheet in the bending region 7 is suppressed.

[0150] According to this embodiment, the plurality of first land portions 33 of the wick sheet 30 are spaced apart in the Y direction orthogonal to the X direction, and in the bending region 7, the vapor chamber 1 is bent along a bending line 8 extending in a direction intersecting the X direction in a plan view. When viewed along a direction parallel to the bending line 8, the maximum dimension d2 (first maximum dimension d2) in the bending region 7 is larger than the maximum dimension d1 (first maximum dimension d1) in other regions (first region 5 and second region 6) other than the bending region 7. As a result, in the bending region 7, the first sheet 10 can be inserted into the first vapor passage 51 and the second vapor passage 52, and a flow path corner 55 with enhanced capillary action can be formed in each of the vapor passages 51, 52. Therefore, the working liquid 2b condensed from the working vapor 2a in the bending region 7 can be transported to the evaporation region SR by the capillary action of the flow path corner 55. Further, the condensed working liquid 2b can be efficiently moved to the first liquid flow path portion 60 communicating with each of the vapor passages 51, 52. For this reason, it is possible to suppress the retention of the working liquid 2b in each of the vapor passages 51, 52 in the bending region 7, and to suppress the flow of the working vapor 2a from being inhibited by the working liquid 2b. As a result, even when bent, the heat dissipation efficiency of the vapor chamber 1 can be improved.

[0151] In addition, due to the large maximum dimension d2, the surface area of the first sheet 10 can be increased in the bending region 7. Therefore, the heat dissipation efficiency to the outside through the housing member Ha can be improved, and the cooling capacity of the vapor chamber 1 can be enhanced. Also, an increase in the vapor pressure of the working vapor 2a in the bending region 7 can be suppressed, and the difference in the vapor pressure of the working vapor 2a between the bending region 7 and the first region 5 and the second region 6 can be reduced. For this reason, the working vapor 2a can be transported smoothly. Further, due to the increase in the surface area of the first sheet 10, the adhesion force with the housing member Ha via an adhesive tape or the like can be increased in the bending region 7. Therefore, the reliability of the vapor chamber 1 can be improved.

[0152] Further, according to the present embodiment, the first vapor flow path region 14 on the outer surface 10a of the first sheet is formed in a concave shape. As a result, in each of the first region 5, the second region 6, and the bent region 7, a flow path corner 55 with enhanced capillary action can be formed in the first vapor passage 51 and the second vapor passage 52. Therefore, the working liquid 2b condensed from the working vapor 2a can be transported to the evaporation region SR by the capillary action of the flow path corner 55.

[0153] Also, since the first vapor flow path region 14 is formed in a concave shape, the surface area of the first sheet 10 can be increased. Therefore, the heat dissipation efficiency to the outside through the housing member Ha can be improved, and the cooling capacity of the vapor chamber 1 can be enhanced. Further, an increase in the vapor pressure of the working vapor 2a in the bent region 7 can be suppressed, and the difference in the vapor pressure of the working vapor 2a between the bent region 7 and the first region 5 and the second region 6 can be reduced. Thus, the working vapor 2a can be transported smoothly. In addition, due to the increase in the surface area of the first sheet 10, the adhesion force with the housing member Ha via an adhesive tape or the like can be increased. Therefore, the reliability of the vapor chamber 1 can be improved.

[0154] Also, according to the present embodiment, in the bent region 7, the vapor chamber 1 is bent along a bent line 8 extending in the Y direction. As a result, the vapor chamber 1 can be bent along a direction orthogonal to the X direction in which the first land portion 33 extends. Therefore, in the first region 5, the second region 6, and the bent region 7, it is possible to prevent the maximum dimension between the first joint region 13 and the first vapor flow path region 14 from becoming excessive. As a result, the flow path cross-sectional areas of the first vapor passage 51 and the second vapor passage 52 in the bent region 7 can be ensured, and it is possible to prevent the flow of the working vapor 2a in the bent region 7 from being obstructed.

[0155] Further, according to the present embodiment, a first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33. In the bending region 7, the first sheet 10 is located outside the wick sheet 30. Thus, the working liquid 2b condensed when the working vapor 2a flowing through the passage bending portion 57 collides with the inner surface 10b of the first sheet can be easily guided to the first liquid flow path portion 60. Therefore, the working liquid 2b can be smoothly transported toward the evaporation region SR. As a result, it is possible to suppress the working liquid 2b from staying in each of the vapor passages 51 and 52 in the bending region 7, and to suppress the flow of the working vapor 2a from being inhibited.

[0156] Further, according to the present embodiment, when viewed along the direction parallel to the bending line 8, the maximum dimension d4 (second maximum dimension d4) in the bending region 7 is larger than the maximum dimension d3 (second maximum dimension d3) in other regions (the first region 5 and the second region 6) other than the bending region. Thus, in the bending region 7, the second sheet 20 can be inserted into the first vapor passage 51 and the second vapor passage 52, and a channel corner portion 56 with enhanced capillary action can be formed in each of the vapor passages 51 and 52. Therefore, the working liquid 2b condensed from the working vapor 2a in the bending region 7 can be transported to the evaporation region SR by the capillary action of the channel corner portion 56. Further, the condensed working liquid 2b can be efficiently moved to the first liquid flow path portion 60 communicating with each of the vapor passages 51 and 52. As a result, it is possible to suppress the working liquid 2b from staying in each of the vapor passages 51 and 52 in the bending region 7, and to suppress the flow of the working vapor 2a from being inhibited.

[0157] Also, in the bending region 7, the working liquid 2b tends to accumulate inside the bend where the vapor pressure of the working vapor 2a is low. Therefore, by efficiently moving the working liquid 2b to the first liquid flow path portion 60 inside the bend, it is possible to effectively suppress an increase in the flow resistance of the working vapor 2a in the bending region 7. Further, due to the large maximum dimension d4, the direction of the working vapor 2a flowing along the inner wall of the second sheet 20 can be easily bent along the bending shape. Therefore, the working vapor 2a can be smoothly transported.

[0158] In the above-described embodiment, an example in which the first vapor flow path region 14 of the first sheet outer surface 10a in the first region 5, the second region 6, and the bent region 7 is formed in a concave shape has been described. However, as long as the first vapor flow path region 14 in the bent region 7 is formed in a concave shape and the above-described maximum dimension d2 is larger than the above-described maximum dimension d1, it is not limited to this.

[0159] For example, the first vapor flow path region 14 of the first sheet outer surface 10a in one of the first region 5 and the second region 6 may be formed flat in the Y direction. The first vapor flow path regions 14 of the first sheet outer surface 10a in both the first region 5 and the second region 6 may be formed flat in the Y direction. In this case, the above-described maximum dimension d1 may be zero. For example, when the first vapor flow path region 14 shown in FIG. 11 is formed flat, the difference between the capillary force of the flow path corner 55 shown in FIG. 11 and the capillary force of the flow path corner 55 shown in FIG. 14 can be increased. The capillary action of the flow path corner 55 in the bent region 7 can be relatively strengthened. Also, the surface area of the first sheet 10 in the bent region 7 can be relatively increased. Therefore, the heat dissipation efficiency to the outside through the housing member Ha can be improved, and the cooling capacity of the vapor chamber 1 can be enhanced. Also, an increase in the vapor pressure of the working vapor 2a in the bent region 7 can be suppressed, and the difference in the vapor pressure of the working vapor 2a between the bent region 7 and the first region 5 and the second region 6 can be reduced. Therefore, the working vapor 2a can be transported smoothly. Also, since the first vapor flow path region 14 is formed flat, it is possible to suppress the formation of a gap with the housing member Ha, and it is possible to sufficiently adhere to the housing member Ha. Therefore, the heat dissipation efficiency to the outside through the housing member Ha can be improved.

[0160] Similarly, the second vapor flow path region 24 of the second sheet outer surface 20b in one of the first region 5 and the second region 6 may be formed flat in the Y direction. The second vapor flow path region 24 of the second sheet outer surface 20b in both the first region 5 and the second region 6 may be formed flat in the Y direction. In this case, the above-described maximum dimension d3 may be zero. For example, when the second vapor flow path region 24 shown in FIG. 11 is formed flat, the difference between the capillary force of the flow path corner 56 shown in FIG. 11 and the capillary force of the flow path corner 56 shown in FIG. 14 can be increased. Therefore, the capillary action of the flow path corner 56 in the bent region 7 can be relatively strengthened. Further, the surface area of the second sheet 20 in the bent region 7 can be relatively increased. Therefore, the heat radiation efficiency to the outside through the housing member Ha can be improved, and the cooling capacity of the vapor chamber 1 can be enhanced. Also, an increase in the vapor pressure of the working vapor 2a in the bent region 7 can be suppressed, and the difference in the vapor pressure of the working vapor 2a between the bent region 7 and the first region 5 and the second region 6 can be reduced. Therefore, the working vapor 2a can be transported smoothly. Further, since the second vapor flow path region 24 is formed flat, it is possible to suppress the formation of a gap with the electronic device D, and the electronic device D can be brought into sufficient close contact. Therefore, the electronic device D can be efficiently cooled.

[0161] Also, in the above-described embodiment, in the bent region 7, the amount of depression of the second vapor flow path region 24 of the second sheet 20 located inside the bend may be smaller than the amount of depression of the first vapor flow path region 14 of the first sheet 10 located outside the bend. That is, the above-described maximum dimension d4 may be smaller than the above-described maximum dimension d2. In this case, a decrease in the flow path cross-sectional area of the second vapor flow path recess 54 can be suppressed, and an increase in the flow path resistance of the working vapor 2a can be suppressed. Therefore, the working vapor 2a can be transported smoothly.

[0162] Also, in the above-described embodiment, in the bending region 7, the amount of indentation of the first vapor flow path region 14 of the first sheet 10 located on the outer side of the bend may be smaller than the amount of indentation of the second vapor flow path region 24 of the second sheet 20 located on the inner side of the bend. That is, the above-described maximum dimension d2 may be smaller than the above-described maximum dimension d4. The above-described maximum dimension d2 may be zero. In this case, a decrease in the flow path cross-sectional area of the first vapor flow path recess 53 can be suppressed, and an increase in the flow path resistance of the working vapor 2a can be suppressed. Therefore, the working vapor 2a can be transported smoothly.

[0163] Also, in the above-described embodiment, in the bending region 7, the amount of indentation of the first vapor flow path region 14 of the first sheet 10 on the side where the first liquid flow path portion 60 is located may be larger than the amount of indentation of the second vapor flow path region 24 of the second sheet 20 on the side where the first liquid flow path portion 60 is not located. In this case, a flow path corner portion 55 with enhanced capillary action can be formed between each vapor passage 51, 52 and the first liquid flow path portion 60. Therefore, the working liquid 2b condensed from the working vapor 2a in the bending region 7 can be efficiently moved to the first liquid flow path portion 60.

[0164] Also, in the above-described embodiment, in the bending region 7, the amount of recess of the vapor flow path regions 14 and 24 of the respective sheets 10 and 20 at the widthwise end of the vapor flow path portion 50 may be smaller than the amount of recess of the vapor flow path regions 14 and 24 of the respective sheets 10 and 20 at the widthwise center of the vapor flow path portion 50. For example, in the second vapor passage 52 at the center in the Y direction of the vapor chamber 1 shown in FIG. 5, as shown in FIG. 14, the first sheet 10 may have a maximum dimension d2 in the bending region 7, and the second sheet 20 may have a maximum dimension d4 in the bending region 7. Also, in the first vapor passage 51 at the end in the Y direction of the vapor chamber 1 shown in FIG. 5, as shown in FIG. 15, the first sheet 10 may have a maximum dimension d2' in the bending region 7, and the second sheet 20 may have a maximum dimension d4' in the bending region 7. Here, the maximum dimension d2' may be smaller than the maximum dimension d2. Also, the maximum dimension d4' may be smaller than the maximum dimension d4. In this case, at the widthwise end of the vapor flow path portion 50, an increase in the flow path resistance of the working vapor 2a can be suppressed, and the working vapor 2a can be transported smoothly. Also, in order to facilitate heat transfer at the widthwise end of the vapor flow path portion 50, the temperature difference between the widthwise end and the widthwise center of the vapor flow path portion 50 can be reduced, and the vapor chamber 1 can be made to have uniform heat.

[0165] Also, in the above-described embodiment, in the bending region 7, the amount of recess of the vapor flow path regions 14 and 24 of the respective sheets 10 and 20 at the widthwise end of the vapor flow path portion 50 may be larger than the amount of recess of the vapor flow path regions 14 and 24 of the respective sheets 10 and 20 at the widthwise center of the vapor flow path portion 50. For example, the above-described maximum dimension d2' may be larger than the maximum dimension d2. Also, the above-described maximum dimension d4' may be larger than the maximum dimension d4. In this case, at the widthwise end of the vapor flow path portion 50, the condensed working liquid 2b can be efficiently moved to the first liquid flow path portion 60. Therefore, it is possible to prevent the vapor passages 51 and 52 from being blocked by the condensed working liquid 2b, and the working vapor 2a can be transported smoothly. Also, in order to facilitate heat transfer at the widthwise end of the vapor flow path portion 50, the temperature difference between the widthwise end and the widthwise center of the vapor flow path portion 50 can be reduced, and the vapor chamber 1 can be made to have uniform heat.

[0166] Also, in the above-described embodiment, an example has been described in which the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33 and no liquid flow path portion is formed on the second main body surface 30b of the first land portion 33. However, the present invention is not limited to this. For example, as shown in FIG. 16, no liquid flow path portion may be formed on the first main body surface 30a of the first land portion 33, and the first liquid flow path portion 60 may be formed on the second main body surface 30b of the first land portion 33.

[0167] Also, in the above-described embodiment, an example has been described in which the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33 and no liquid flow path portion is formed on the second main body surface 30b of the first land portion 33. However, the present invention is not limited to this. For example, as shown in FIG. 17, a second liquid flow path portion 70 may be formed on the second main body surface 30b of the first land portion 33. The second liquid flow path portion 70 formed on the second main body surface 30b is an example of a second groove aggregate. The second liquid flow path portion 70 may include a plurality of main flow grooves 61 and a plurality of communication grooves 65 in the same manner as the above-described first liquid flow path portion 60.

[0168] In the bending region 7, the second sheet 20 is located inside the wick sheet 30. Inside the passage bending portion 57, the flow of the working vapor 2a can be separated from the inner surface 20a of the second sheet. More specifically, a vortex is formed near the outlet of the passage bending portion 57, and the working vapor 2a condenses. The condensed working liquid 2b can be guided to the second liquid flow path portion 70. Thereby, the working liquid 2b can be transported toward the evaporation region SR. Therefore, it is possible to suppress the retention of the working liquid 2b in each of the vapor passages 51 and 52 in the bending region 7, and it is possible to suppress the inhibition of the flow of the working vapor 2a.

[0169] In the example shown in FIG. 17, an example in which the second liquid flow path portion 70 is configured in the same manner as the first liquid flow path portion 60 has been described. However, it is not limited to this. For example, as shown in FIG. 18, the flow path cross-sectional area of the main flow groove 61 of the second liquid flow path portion 70 may be larger than the flow path cross-sectional area of the main flow groove 61 of the first liquid flow path portion 60. The flow path cross-sectional area of the communication groove 65 of the second liquid flow path portion 70 may be larger than the flow path cross-sectional area of the communication groove 65 of the first liquid flow path portion 60. The second liquid flow path portion 70 shown in FIG. 18 is also referred to as a liquid storage portion.

[0170] According to the modified example shown in FIG. 18, while the electronic device D has stopped generating heat, the working fluid 2b can be dispersed and stored not only in the first liquid flow path portion 60 but also in the second liquid flow path portion 70. Therefore, even when the working fluid 2b in the first liquid flow path portion 60 freezes and expands in a temperature environment lower than the freezing point of the working fluid 2b, the expansion force acting on the first sheet 10 can be reduced. In this case, deformation of the first sheet 10 can be suppressed. Also, even when the working fluid 2b in the second liquid flow path portion 70 freezes and expands, the expansion force acting on the second sheet 20 can be reduced. In this case, deformation of the second sheet 20 can be suppressed. As a result, deformation of the vapor chamber 1 can be suppressed, and deterioration of the performance of the vapor chamber 1 can be suppressed. Also, while the electronic device D is generating heat, the working fluid 2b in the second liquid flow path portion 70 can evaporate by receiving heat from the electronic device D.

[0171] Also, according to the modified example shown in FIG. 18, the capillary force acting on the working fluid 2b in the main flow groove 61 of the second liquid flow path portion 70 can be made smaller than the capillary force acting on the working fluid 2b in the main flow groove 61 of the first liquid flow path portion 60. During the time when the electronic device D is generating heat, the amount of movement of the working fluid 2b to the second liquid flow path portion 70 can be reduced. Therefore, a decrease in the transport function of the working fluid 2b to the evaporation region SR can be suppressed, and a decrease in the heat transport efficiency can be suppressed. Also, as described above, by making the flow path cross-sectional area of the main flow groove 61 of the second liquid flow path portion 70 larger than the flow path cross-sectional area of the main flow groove 61 of the first liquid flow path portion 60, the total volume of the space formed by the main flow groove 61 of the second liquid flow path portion 70 can be increased. Therefore, while the electronic device D has stopped generating heat, the storage amount of the working fluid 2b by the second liquid flow path portion 70 can be increased.

[0172] Also, in the above-described embodiment, an example in which the second vapor flow path region 24 in the first region 5, the second region 6, and the bent region 7 is formed in a concave shape has been described. However, the present invention is not limited to this. For example, as shown in FIG. 19, the second vapor flow path region 24 in the first region 5, the second region 6, and the bent region 7 may be formed flat in the Y direction. Even in this case, the capillary action of the flow path corner 55 can be enhanced, and the working fluid 2b adhering to the inner surface 10b of the first sheet can be transported. Further, in the bent region 7, the surface area of the first sheet 10 can be increased. Therefore, the heat dissipation efficiency to the outside through the housing member Ha can be improved, and the cooling capacity of the vapor chamber 1 can be enhanced. Also, an increase in the vapor pressure of the working vapor 2a can be suppressed in the bent region 7, and the difference in the vapor pressure of the working vapor 2a between the bent region 7 and the first region 5 and the second region 6 can be reduced. Therefore, the working vapor 2a can be transported smoothly. Further, since the second vapor flow path region 24 is formed flat, it is possible to suppress the formation of a gap between the second vapor flow path region 24 and the electronic device D, and the electronic device D can be brought into sufficient close contact. Therefore, the electronic device D can be efficiently cooled.

[0173] Also, in the above-described embodiment, an example in which the first sheet 10 is located outside the wick sheet 30 in the bent region 7 has been described. However, the present invention is not limited to this. For example, the first sheet 10 may be located inside the wick sheet 30. Even in this case, at the flow path corner 55, the capillary action can be enhanced, and the working fluid 2b adhering to the inner surface 10b of the first sheet can be transported. In this case, the second vapor flow path region 24 of the second sheet 20 located outside the wick sheet 30 may be formed flat in the Y direction in the first region 5, the second region 6, and the bent region 7.

[0174] Further, in the above-described embodiment, an example in which one first sheet recess 15 is formed over the entire width direction of the first vapor flow path region 14 has been described. However, the present invention is not limited to this. For example, as shown in FIG. 20, a part of the first vapor flow path region 14 in the bending region 7 may be formed in a concave shape, and another part may be formed in a flat shape in the Y direction. By doing so, the capillary action of the portion formed in the concave shape can be made stronger than the capillary action of the portion formed in the flat shape. Therefore, the flow of the working fluid 2b can be controlled, and the location where the capillary action is intentionally strengthened can be arbitrarily set. For example, one first sheet recess 15 may be formed in a part of the width direction of the first vapor flow path region 14. In this case, in other regions, the first vapor flow path region 14 may be formed in a flat shape in the Y direction. For example, in the first vapor flow path region 14 in the bending region 7, a part of the region in the vapor flow direction may be formed in a concave shape, and the other region may be formed in a flat shape in the Y direction. Similarly, a part of the second vapor flow path region 24 may be formed in a concave shape, and another part may be formed in a flat shape in the Y direction.

[0175] Further, in the above-described embodiment, an example in which the first sheet 10 includes one first sheet recess 15 overlapping the first vapor flow path region 14 in plan view has been described. However, the present invention is not limited to this. For example, as shown in FIG. 21, the first sheet 10 may include a plurality of first sheet recesses 15 overlapping the first vapor flow path region 14 in plan view. For example, the plurality of first sheet recesses 15 may be formed so as to be formed in the first vapor flow path region 14. The plurality of first sheet recesses 15 may be formed at different positions in the Y direction. The plurality of first sheet recesses 15 may be formed at different positions in the X direction. FIG. 21 shows an example in which two first sheet recesses 15 arranged in the Y direction are formed in the first vapor flow path region 14. Similarly, the second sheet 20 may also include a plurality of second sheet recesses 25.

[0176] Further, in the above-described embodiment, as shown in FIG. 22, when the first liquid flow path portion 60 is formed on the second main body surface 30b of the first land portion 33, the width w5' of the main flow groove 61 of the first liquid flow path portion 60 in the bending region 7 shown in FIG. 22 may be smaller than the width w5 of the main flow groove 61 of the first liquid flow path portion 60 in the first region 5 and the second region 6. The same applies to the width w6 of the communication groove 65. In the example shown in FIG. 22, the second sheet 20 may be located inside the bend. In this case, in the bending region 7, the capillary action of the first liquid flow path portion 60 can be enhanced. Therefore, the condensed working fluid 2b can be efficiently moved from each of the vapor passages 51 and 52 to the first liquid flow path portion 60. Further, when the second sheet 20 is pressed from the outside, it is possible to prevent the main flow groove 61 and the communication groove 65 of the first liquid flow path portion 60 from being crushed.

[0177] Also, as shown in FIG. 22, in the bending region 7, the second sheet 20 may be recessed toward the first liquid flow path portion 60. The amount of recess of the second sheet 20 in this bending region 7 may be larger than the amount of recess of the second sheet 20 in the first region 5 and the second region 6. The amount of recess of the second sheet 20 in the first region 5 and the second region 6 may be zero. That is, in the first region 5 and the second region 6, the second sheet 20 may not be recessed toward the first liquid flow path portion 60. In this case, in the bending region 7, the angle formed by the inner surface 20a of the second sheet and the wall surface 62 of the main flow groove 61 can be made smaller. Also, the angle formed by the inner surface 20a of the second sheet and the wall surface of the communication groove 65 can be made smaller. As a result, the capillary action of the first liquid flow path portion 60 can be enhanced. Therefore, the condensed working fluid 2b can be smoothly transported toward the evaporation region SR.

[0178] Also, in the above-described embodiment, as shown in FIG. 23, when the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33, the width w5'' of the main flow groove 61 of the first liquid flow path portion 60 in the bending region 7 shown in FIG. 23 may be larger than the width w5 of the main flow groove 61 of the first liquid flow path portion 60 in the first region 5 and the second region 6. The same applies to the width w6 of the communication groove 65. Also, the depth h1' of the main flow groove 61 of the first liquid flow path portion 60 in the bending region 7 shown in FIG. 23 may be shallower than the depth h1 of the main flow groove 61 of the first liquid flow path portion 60 in the first region 5 and the second region 6. The same applies to the depth of the communication groove 65. In the example shown in FIG. 23, the second sheet 20 may be located inside the bend. In this case, in the bending region 7, the angle formed by the inner surface 10b of the first sheet and the wall surface 62 of the main flow groove 61 can be reduced. Also, the angle formed by the inner surface 10b of the first sheet and the wall surface of the communication groove 65 can be reduced. Thereby, the capillary action of the first liquid flow path portion 60 can be enhanced. For this reason, the condensed working fluid 2b can be smoothly transported toward the evaporation region SR.

[0179] Also, as shown in FIG. 23, in the bending region 7, the first sheet 10 may be recessed toward the first liquid flow path portion 60. The amount of recess of the first sheet 10 in this bending region 7 may be larger than the amount of recess of the first sheet 10 in the first region 5 and the second region 6. The amount of recess of the first sheet 10 in the first region 5 and the second region 6 may be zero. That is, in the first region 5 and the second region 6, the first sheet 10 may not be recessed toward the first liquid flow path portion 60. In this case, in the bending region 7, the angle formed by the inner surface 10b of the first sheet and the wall surface 62 of the main flow groove 61 can be further reduced. Also, the angle formed by the inner surface 10b of the first sheet and the wall surface of the communication groove 65 can be further reduced. Thereby, the capillary action of the first liquid flow path portion 60 can be enhanced. For this reason, the condensed working fluid 2b can be transported even more smoothly toward the evaporation region SR.

[0180] Also, in the examples shown in FIGS. 22 and 23, the flow path cross-sectional area of the main flow channel 61 in the bent region 7 may be smaller than the flow path cross-sectional areas of the main flow channel 61 in the first region 5 and the second region 6. Further, the flow path cross-sectional area of the connection channel 65 in the bent region 7 may be smaller than the flow path cross-sectional areas of the connection channel 65 in the first region 5 and the second region 6. In this case, in the bent region 7, the capillary action of the first liquid flow path portion 60 can be enhanced. Therefore, the condensed working fluid 2b can be smoothly transported toward the evaporation region SR.

[0181] Also, in the above-described embodiment, as shown in FIGS. 24 to 26, when the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33 and the second liquid flow path portion 70 is formed on the second main body surface 30b of the first land portion 33, a communication path 80 for communicating the first liquid flow path portion 60 and the second liquid flow path portion 70 may be provided. As shown in FIGS. 25 and 26, the communication path 80 may extend straight in the Z direction and penetrate the first land portion 33. The communication path 80 may be provided at any position of the first land portion 33. The communication path 80 may be provided at a position overlapping the main flow channel 61 of the first liquid flow path portion 60 and the main flow channel 61 of the second liquid flow path portion 70 in a plan view. In this case, the communication path 80 may connect the main flow channel 61 of the first liquid flow path portion 60 and the main flow channel 61 of the second liquid flow path portion 70. Also, as shown in FIG. 24, the communication path 80 may be provided at a position overlapping the connection channel 65 of the first liquid flow path portion 60 and the connection channel 65 of the second liquid flow path portion 70 in a plan view. In this case, the communication path 80 may connect the connection channel 65 of the first liquid flow path portion 60 and the connection channel 65 of the second liquid flow path portion 70. By providing the communication path 80 for communicating the first liquid flow path portion 60 and the second liquid flow path portion 70 in this way, for example, even when the flow of the working fluid 2b becomes difficult in one of the first liquid flow path portion 60 and the second liquid flow path portion due to bending, the working fluid 2b can flow through the communication path 80 to the other liquid flow path portion. Therefore, the working fluid 2b can be smoothly transported toward the evaporation region SR, and the cooling capacity of the vapor chamber 1 can be enhanced.

[0182] Further, the length L2 of the communication path 80 in the bending region 7 shown in FIG. 26 may be smaller than the length L1 of the communication path 80 in the first region 5 and the second region 6 shown in FIG. 25. Here, the lengths L1 and L2 of the communication path 80 mean the distance along the communication path 80, and when the communication path 80 extends straight in the Z direction as shown in FIGS. 25 and 26, it is the length in the Z direction. In this case, the liquid flow path resistance of the communication path 80 in the bending region 7 can be reduced. Therefore, the condensed working fluid 2b can be efficiently moved from the liquid flow path portion with high capillary action at the flow path angle to the liquid flow path portion with low capillary action at the flow path angle through the communication path 80, and the cooling capacity of the vapor chamber 1 can be enhanced.

[0183] Also, in the above-described embodiment, a main body surface recess 82 may be formed at a position where the first liquid flow path portion 60 of the first land portion 33 is not provided. For example, when the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33, the main body surface recess 82 may be formed on the second main body surface 30b of the first land portion 33. Further, for example, when the first liquid flow path portion 60 is formed on the second main body surface 30b of the first land portion 33, the main body surface recess 82 may be formed on the first main body surface 30a of the first land portion 33. Further, for example, when the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33 and the second liquid flow path portion 70 is formed on the second main body surface 30b of the first land portion 33, the main body surface recess 82 may be formed at any position where the liquid flow path portions 60 and 70 are not formed on the first main body surface 30a or the second main body surface 30b of the first land portion 33. In the examples shown in FIGS. 27 and 28, the main body surface recess 82 is formed on the second main body surface 30b of the first land portion 33.

[0184] The main body surface recess 82 may be formed in a concave shape on the second main body surface 30b of the first land portion 33. The main body surface recess 82 may have an arbitrary planar shape. For example, as shown in FIG. 27, the main body surface recess 82 may be formed in a pore shape having a circular (true circle, ellipse, etc.) planar shape. Also, for example, as shown in FIG. 28, the main body surface recess 82 may be formed in a groove shape extending in the Y direction. Further, as shown in FIGS. 27 and 28, a plurality of main body surface recesses 82 may be arranged along the Y direction. As shown in FIGS. 27 and 28, the plurality of main body surface recesses 82 overlap the bending line 8 in plan view. That is, the plurality of main body surface recesses 82 are arranged along the bending line BL. In other words, each main body surface recess 82 is formed at a position that overlaps the bending line 8 in plan view.

[0185] The main body surface recess 82 may be formed by etching the wick sheet 30 in the etching step of the manufacturing method of the vapor chamber 1 described above. The main body surface recess 82 is visible from the outside through the first sheet 10 or the second sheet 20 when the vapor chamber 1 is viewed in plan view. For this reason, the main body surface recess 82 functions as a mark at the bending position of the vapor chamber 1 in the bending step of the manufacturing method of the vapor chamber 1 described above. That is, in the bending step, by bending the vapor chamber 1 along the main body surface recess 82, a vapor chamber 1 bent along the bending line 8 can be obtained. By forming the main body surface recess 82 in this way, the bending workability can be improved. Further, since the main body surface recess 82 is formed in a pore shape or a groove shape, the vapor chamber 1 can be easily bent. For this reason, the manufacture of the bent vapor chamber 1 can be facilitated.

[0186] Also, in the above-described embodiment, an example has been described in which the vapor chamber 1 is bent at a right angle so that the first region 5 and the second region 6 are orthogonal to each other. However, the present invention is not limited to this. For example, as shown in FIG. 29, the vapor chamber 1 may be bent in a U shape so that the first region 5 and the second region 6 face each other. In the example shown in FIG. 29, the bent region 7 of the vapor chamber 1 is formed in a semi-circular arc shape. In this case, the degree of freedom in arranging the vapor chamber 1 in the housing H can be improved. Therefore, for example, even when an electronic device E accompanied by heat generation is located away from the housing member Ha that releases heat, the heat of the electronic device E can be transferred to the housing member Ha through the vapor chamber 1.

[0187] Also, in this case, as shown in FIG. 29, when viewed along the direction parallel to the bending line 8, the dimension in the thickness direction of the first sheet 10 defined between the first joint region 13 and the first vapor flow path region 14 in the bent region 7 may change within the bent region 7. Here, the end on the side of the first region 5 of the bent region 7 is referred to as the first bent end 7a, the end on the side of the second region 6 of the bent region 7 is referred to as the second bent end 7c, and the intermediate portion between the first bent end 7a and the second bent end 7c of the bent region 7 is referred to as the bent intermediate portion 7b. In this case, for example, this dimension may increase as it goes from the first bent end 7a toward the bent intermediate portion 7b. This dimension may be the maximum dimension d2 at the bent intermediate portion 7b. Also, this dimension may decrease as it goes from the bent intermediate portion 7b toward the second bent end 7c. Similarly, when viewed along the direction parallel to the bending line 8, the dimension in the thickness direction of the second sheet 20 defined between the second joint region 23 and the second vapor flow path region 24 in the bent region 7 may change within the bent region 7. For example, this dimension may increase as it goes from the first bent end 7a toward the bent intermediate portion 7b. This dimension may be the maximum dimension d4 at the bent intermediate portion 7b. Also, this dimension may decrease as it goes from the bent intermediate portion 7b toward the second bent end 7c.

[0188] According to the modification shown in Fig. 29, particularly in the middle bent portion 7b of the bent region 7 where the bending is large, the capillary action of the flow path corner 55 can be enhanced, and the condensed working fluid 2b can be smoothly transported toward the evaporation region SR. Further, in the bent region 7, the surface areas of the first sheet 10 and the second sheet 20 can be increased, and the heat radiation efficiency of the vapor chamber 1 can be improved. Also, in the bent region 7, an increase in the vapor pressure of the working vapor 2a can be suppressed, and the difference in the vapor pressure of the working vapor 2a between the bent region 7 and the first region 5 and the second region 6 can be reduced. Therefore, the working vapor 2a can be smoothly transported particularly in the middle bent portion 7b where the bending is large.

[0189] Note that, as shown in Fig. 13, even when the vapor chamber 1 is bent at a right angle such that the first region 5 and the second region 6 are orthogonal to each other, when viewed along the direction parallel to the bending line 8, similar to the example shown in Fig. 29, the dimension in the thickness direction of the first sheet 10 defined between the first joint region 13 and the first vapor flow path region 14 in the bent region 7 may vary within the bent region 7. For example, this dimension may increase as it goes from the first bent end 7a toward the middle bent portion 7b. This dimension may be the maximum dimension d2 at the middle bent portion. Also, this dimension may decrease as it goes from the middle bent portion 7b toward the second bent end 7c. Similarly, when viewed along the direction parallel to the bending line 8, the dimension in the thickness direction of the second sheet 20 defined between the second joint region 23 and the second vapor flow path region 24 in the bent region 7 may vary within the bent region 7. For example, this dimension may increase as it goes from the first bent end 7a toward the middle bent portion 7b. This dimension may be the maximum dimension d4 at the middle bent portion 7b. Also, this dimension may decrease as it goes from the middle bent portion 7b toward the second bent end 7c. Even in this case, the same effects as those of the modification shown in Fig. 29 can be obtained.

[0190] (Second Embodiment) Next, with reference to Figs. 30 to 33, a vapor chamber, an electronic device, and a method for manufacturing a vapor chamber according to the second embodiment of the present disclosure will be described.

[0191] In the second embodiment shown in FIGS. 30 to 33, it is mainly different in that the vapor chamber is bent along a bending line inclined in the first direction. Other configurations are substantially the same as those of the first embodiment shown in FIGS. 1 to 29. In FIGS. 30 to 33, the same parts as those of the first embodiment shown in FIGS. 1 to 29 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0192] As shown in FIG. 30, the vapor chamber 1 according to the present embodiment is bent along a bending line 8 inclined in the X direction in a plan view. The bending line 8 shown in FIG. 30 is inclined not only in the X direction but also in the Y direction. The bending line 8 shown in FIG. 30 also extends in a direction intersecting the X direction in a plan view. In the present embodiment, the first region 5, the second region 6, and the bending region 7 may be divided by a boundary line along the bending line 8 inclined in the X direction in a plan view.

[0193] The flow of vapor in one of the vapor passages 51, 52 in the bending region 7 will be described with reference to FIGS. 31 and 32. FIG. 31 is a plan view showing the vapor passages 51, 52 obtained by developing the bending region 7 in a plane. FIG. 32 is a schematic cross-sectional view showing the vapor passages 51, 52 along the D-D line, E-E line, and F-F line of FIG. 31, respectively. The D-D line, the E-E line, and the F-F line are defined at different positions in the Y direction.

[0194] As shown in FIG. 32, at the position P1 on the D-D line, the first vapor flow path region 14 and the second vapor flow path region 24 are most recessed. At the position P2 on the E-E line, the first vapor flow path region 14 and the second vapor flow path region 24 are most recessed. At the position P3 on the F-F line, the first vapor flow path region 14 and the second vapor flow path region 24 are most recessed.

[0195] Positions P1, P2, and P3 overlap the bending line 8 in plan view and are at different positions in the X direction in which the vapor passages 51 and 52 extend, as shown in FIG. 31. As a result, in each cross section, positions P1, P2, and P3 where the flow path cross-sectional area of the vapor passages 51 and 52 is the smallest can be shifted in the X direction. Therefore, the position where the flow resistance of the working vapor 2a becomes high can be dispersed in the flow direction of the working vapor 2a, and it is possible to suppress the flow of the working vapor 2a in the passage bending portion 57 from being inhibited.

[0196] As described above, according to the present embodiment, the vapor chamber 1 is bent along the bending line 8 inclined in the X direction. As a result, it is possible to suppress the flow of the working vapor 2a in the bending region 7 from being inhibited. Therefore, even when bent, the heat dissipation efficiency of the vapor chamber 1 can be improved.

[0197] In the above-described embodiment, an example in which the frame portion 32 is formed in a rectangular frame shape along the X direction and the Y direction has been described. However, the present invention is not limited to this. For example, as shown in FIG. 33, the frame portion 32 may be inclined with respect to the first land portion 33 extending in the X direction. The frame portion 32 is formed in a rectangular frame shape that is inclined in the X direction and also inclined in the Y direction. The bending line 8 is along the frame portion 32. The bending line 8 extends in the vertical direction of FIG. 33. Also in this case, the bending line 8 extends in a direction intersecting the X direction in plan view. Also in the example shown in FIG. 33, in each of the vapor passages 51 and 52, in the same manner as in the examples shown in FIGS. 30 to 32, the position where the flow resistance of the working vapor 2a becomes high can be dispersed in the flow direction of the working vapor 2a. Therefore, it is possible to suppress the flow of the working vapor 2a in the bending region 7 from being inhibited.

[0198] (Third Embodiment) Next, with reference to FIGS. 34 to 37, a vapor chamber, an electronic device, and a method for manufacturing a vapor chamber according to a third embodiment of the present disclosure will be described.

[0199] In the third embodiment shown in FIGS. 34 to 37, the main body sheet includes a plurality of second land portions extending in the second direction, and the main difference is that the second land portions are located in regions other than the bending region. Other configurations are substantially the same as those of the first embodiment shown in FIGS. 1 to 29. In FIGS. 34 to 37, the same reference numerals are given to the same parts as those of the first embodiment shown in FIGS. 1 to 29, and detailed descriptions thereof are omitted.

[0200] In the present embodiment, as shown in FIG. 34, the wick sheet 30 includes a plurality of second land portions 37 extending in the Y direction. The second land portions 37 are located in each of the first region 5 and the second region 6. A plurality of second land portions 37 may be located in each of the first region 5 and the second region 6. The second land portion 37 can be configured in the same manner as the first land portion 33.

[0201] The first land portion 33 is located in the bending region 7. The first land portion 33 may be formed from the first region 5 through the bending region 7 to the second region 6. Each of the first land portions 33 is connected to the second land portion 37 located in the first region 5. In the example shown in FIG. 34, a plurality of first land portions 33 are connected to one second land portion 37 located in the first region 5. Each of the first land portions 33 is connected to the second land portion 37 located in the second region 6. In the example shown in FIG. 34, each of the first land portions 33 is connected to the corresponding second land portion 37. In other words, one second land portion 37 located in the second region 6 is connected to one first land portion 33.

[0202] In the present embodiment, as shown in FIG. 34, the vapor flow path portion 50 may include a third vapor passage 58. The third vapor passage 58 is formed between the second land portions 37 located in the first region 5. The third vapor passage 58 extends in the Y direction. A third vapor passage 58 that extends in the Y direction is also formed between the second land portions 37 located in the second region 6. The third vapor passage 58 located in the second region 6 communicates with the second vapor passage 52 located between the first land portions 33. In the example shown in FIG. 34, a third vapor passage 58 that extends in the Y direction is also formed in the bending region 7. The third vapor passage 58 can be configured in the same manner as the second vapor passage 52.

[0203] The first vapor passage 51 is formed continuously inside the frame portion 32 and outside the first land portion 33 and the second land portion 37.

[0204] In the present embodiment, the first liquid flow path portion 60 includes a first land liquid flow path portion 71 formed on the first main body surface 30a of the first land portion 33 and a second land liquid flow path portion 72 formed on the first main body surface 30a of the second land portion 37. The first land liquid flow path portion 71 and the second land liquid flow path portion 72 each include a plurality of main flow grooves 61 and a plurality of communication grooves 65. The main flow grooves 61 of the first land liquid flow path portion 71 extend in the X direction. The communication grooves 65 of the first land liquid flow path portion 71 may extend in the Y direction. The main flow grooves 61 of the second land liquid flow path portion 72 extend in the Y direction. The communication grooves 65 of the second land liquid flow path portion 72 may extend in the X direction. The first land liquid flow path portion 71 and the second land liquid flow path portion 72 communicate with each other so that the working liquid 2b can flow back and forth. In this way, the working liquid 2b can flow back and forth between the first region 5 and the second region 6.

[0205] In the present embodiment, the evaporation regions SR overlapping the electronic device D are located in the first region 5 and the second region 6, respectively. The condensation region CR is located in the first region 5. A bending region 7 is formed between the first region 5 and the second region 6. The bending line 8 extends in a direction intersecting the X direction in a plan view. In FIG. 34, the bending line 8 extends in the Y direction. In the bending region 7, the working vapor 2a can pass through the first vapor passage 51, the second vapor passage 52, and the third vapor passage 58, and the working vapor 2a can travel between the first region 5 and the second region 6. In the example shown in FIG. 34, the bending line 8 is located in the bending region 7 and also overlaps the third vapor passage 58 extending in the Y direction in a plan view.

[0206] The working vapor 2a is transported from the evaporation region SR located in the first region 5 to the condensation region CR, and is also transported from the evaporation region SR located in the second region 6 through the bending region 7 to the condensation region CR. A part of the working liquid 2b condensed in the condensation region CR is transported toward the evaporation region SR by the capillary action of the second land liquid flow path portion 72 located in the first region 5. Another part of the working liquid 2b is transported from the second land liquid flow path portion 72 located in the first region 5 to the evaporation region SR located in the second region 6 through the first land liquid flow path portion 71 and the second land liquid flow path portion 72 located in the second region 6.

[0207] As shown in FIG. 34, the electronic device D is disposed in the first region 5 and the electronic device D is also disposed in the second region 6. Thereby, heat transfer between the electronic device D in the first region 5 and the electronic device D in the second region 6 can be suppressed. Therefore, heat damage to the other electronic device D due to heat generation of one electronic device D can be suppressed.

[0208] Thus, according to this embodiment, each of the first land portions 33 is connected to the second land portion 37. More specifically, each of the first land portions 33 is connected to the second land portion 37 in the first region 5 and is also connected to the second land portion 37 in the second region 6. As a result, the working fluid 2b can flow back and forth between the first region 5 and the second region 6. Further, an evaporation region SR where the electronic device D overlaps can be positioned in each of the first region 5 and the second region 6. Accordingly, heat generated by the plurality of electronic devices D can be dissipated in one vapor chamber 1.

[0209] In the above-described embodiment, an example has been described in which the bent line 8 overlaps with the third vapor passage 58 that is located in the bent region 7 and extends in the Y direction in a plan view. However, the present invention is not limited to this. For example, as shown in FIG. 35, the bent line 8 may overlap with the second land portion 37 that is located in the bent region 7 in a plan view. Alternatively, as shown in FIG. 36, it may overlap with the frame portion 32. In the example shown in FIG. 36, the frame portion 32 includes an inner protruding portion 32a that extends in the Y direction. The bent line 8 may overlap with the inner protruding portion 32a. Alternatively, as shown in FIG. 37, the bent line 8 may overlap with a slit 73 formed between the first region 5 and the second region 6. The slit 73 is located between the first region 5 and the second region 6 and may be a space where the first sheet 10, the second sheet 20, and the wick sheet 30 do not exist.

[0210] (Fourth Embodiment) Next, a vapor chamber and an electronic device according to a fourth embodiment of the present disclosure will be described with reference to FIGS. 38 to 46.

[0211] In the present embodiment, the electronic device E may include a plurality of devices D. For example, the plurality of devices D may include a first device D1 and a second device D2. The first device D1 may be in thermal contact with a first region RR1 of a vapor chamber 101 described later, and the second device D2 may be in thermal contact with a second region RR2 of the vapor chamber 101 described later (see FIGS. 38 to 40).

[0212] The vapor chamber 101 according to the present embodiment will be described. The vapor chamber 101 has a sealed space 103 in which working fluids 102a and 102b are enclosed, and is configured to effectively cool the device D of the electronic device E described above by repeating phase changes of the working fluids 102a and 102b in the sealed space 103. Examples of the working fluids 102a and 102b include pure water, ethanol, methanol, acetone, etc., and mixtures thereof.

[0213] As shown in FIGS. 38 and 39, the vapor chamber 101 according to the present embodiment is a bent vapor chamber 101. Such a vapor chamber 101 can be manufactured, for example, by bending a thin flat plate-shaped vapor chamber 101 as shown in FIG. 40 along a bending line BL. This bent vapor chamber 101 includes a bent portion BP, a first region RR1, and a second region RR2. In this specification, "bending" has the same meaning as "folding". For example, bending the vapor chamber 101 means folding the vapor chamber 101.

[0214] The bent portion BP is a portion where a first sheet 110, a second sheet 120, and a main body sheet 130, which will be described later and constitute the vapor chamber 101, are bent. The bent portion BP is formed by bending the vapor chamber 101 along a bending line BL. The bent portion BP is a region having a certain width including the bending line BL. The bending angle in the bent portion BP is arbitrary. In the illustrated example, the bending angle is 90° (right angle). Therefore, as shown in FIG. 39, the cross-sectional shape of the vapor chamber 101 is substantially L-shaped. However, it is not limited to this. For example, the vapor chamber 101 may be bent in a curved manner so that the cross-sectional shape of the vapor chamber 101 becomes U-shaped. Further, for example, the vapor chamber 101 may be bent multiple times so that the cross-sectional shape of the vapor chamber 101 becomes a U-shaped or the like.

[0215] The first region RR1 and the second region RR2 are regions separated via the bent portion BP. In the example shown in FIG. 38, the first region RR1 is a region on the vapor chamber 101 located on the positive Y-direction side (the front side in FIG. 38) with respect to the bent portion BP, and the second region RR2 is a region on the vapor chamber 101 located on the positive Z-direction side (the upper side in FIG. 38) with respect to the bent portion BP. In the illustrated example, the first region RR1 extends on the XY plane, and the second region RR2 extends on the XZ plane. The plane formed by the first region RR1 and the plane formed by the second region RR2 are orthogonal to each other.

[0216] Here, the X-direction indicates a direction along the longitudinal direction of the non-bent vapor chamber 101 as shown in FIG. 40, the Y-direction indicates a direction along the short-side direction of the vapor chamber 101, and the Z-direction indicates a direction along the thickness direction of the vapor chamber 101. The X-direction, the Y-direction, and the Z-direction are orthogonal to each other.

[0217] Hereinafter, in the description of the vapor chamber 101 according to the present embodiment, FIGS. 40 to 46, which are diagrams of the vapor chamber 101 in a non-bent state, are used. Also in FIGS. 40 to 46, the region on the vapor chamber 101 that becomes the above-described first region RR1 when bent is similarly referred to as the first region RR1, and the region on the vapor chamber 101 that becomes the above-described second region RR2 when bent is similarly referred to as the second region RR2.

[0218] As shown in FIGS. 39 to 41, the vapor chamber 101 includes a first sheet 110, a second sheet 120, and a main body sheet 130 (wick sheet) interposed between the first sheet 110 and the second sheet 120. In the vapor chamber 101 according to the present embodiment, the first sheet 110, the main body sheet 130, and the second sheet 120 are laminated in this order.

[0219] The vapor chamber 101 shown in FIG. 40 is formed in a thin flat plate shape. The planar shape of the vapor chamber 101 is arbitrary, and may be a rectangular shape as shown in FIG. 40. The planar shape of this vapor chamber 101 may be, for example, a rectangle with one side being 10 mm or more and 200 mm or less and the other side being 50 mm or more and 600 mm or less, or a square with one side being 40 mm or more and 300 mm or less, and its planar dimensions are arbitrary. In the present embodiment, as an example, an example in which the planar shape of this vapor chamber 101 is a rectangular shape having a longitudinal direction and a short-side direction will be described. In this case, as shown in FIGS. 42 to 44, the first sheet 110, the second sheet 120, and the main body sheet 130 in a non-bent state may also have the same planar shape as the vapor chamber 101 shown in FIG. 40. Note that the planar shape of this vapor chamber 101 is not limited to a rectangular shape, and can be any shape such as a circular shape, an elliptical shape, an L-shaped, a T-shaped, a U-shaped, etc.

[0220] As shown in FIGS. 39 and 40, the vapor chamber 101 has evaporation regions SR1 and SR2 where the working fluids 102a and 102b evaporate, and condensation regions CR1 and CR2 where the working fluids 102a and 102b condense. In the present embodiment, a first evaporation region SR1 and a first condensation region CR1 are provided in a first region RR1 of the vapor chamber 101, and a second evaporation region SR2 and a second condensation region CR2 are provided in a second region RR2 of the vapor chamber 101.

[0221] The first evaporation region SR1 is a region that overlaps with the first device D1 when viewed in the thickness direction (Z direction in FIG. 39) of the vapor chamber 101 (in plan view), and is a region where the first device D1 is attached. The first evaporation region SR1 can be provided at any position in the first region RR1 of the vapor chamber 101. In the illustrated example, the first evaporation region SR1 is formed on the positive X side (the right side in FIG. 40) of the first region RR1 of the vapor chamber 101. Heat from the first device D1 is transmitted to the first evaporation region SR1, and the liquid of the working fluid (appropriately referred to as the working liquid 102b) evaporates in the first evaporation region SR1 due to this heat. The heat from the first device D1 can be transmitted not only to the region overlapping with the first device D1 but also to the periphery of the region. Therefore, the first evaporation region SR1 can include the region overlapping with the first device D1 and the peripheral region thereof.

[0222] The first condensation region CR1 is a region that does not overlap with the first device D1 when viewed in the thickness direction of the vapor chamber 101 (the Z direction in FIG. 39) (in plan view), and is a region where mainly the gas of the working fluid (appropriately referred to as the working vapor 102a) releases heat and condenses. The first condensation region CR1 can also be said to be the region around the first evaporation region SR1 in the first region RR1. In the illustrated example, the first condensation region CR1 is formed on the negative X side (the left side in FIG. 40) of the first region RR1 of the vapor chamber 101. In the first condensation region CR1, the heat of the working vapor 102a from the first evaporation region SR1 is released to the first sheet 110, and the working vapor 102a is cooled and condensed in the first condensation region CR1.

[0223] The second evaporation region SR2 is a region that overlaps with the second device D2 when viewed in the thickness direction of the vapor chamber 101 (the Y direction in FIG. 39) (in plan view), and is the region where the second device D2 is attached. The second evaporation region SR2 can be provided at any position in the second region RR2 of the vapor chamber 101. In the illustrated example, the second evaporation region SR2 is formed on the positive X side (the right side in FIG. 40) of the second region RR2 of the vapor chamber 101. Heat from the second device D2 is transferred to the second evaporation region SR2, and due to this heat, the working fluid 102b evaporates in the second evaporation region SR2. The heat from the second device D2 can be transferred not only to the region that overlaps with the second device D2 but also to the periphery of the region. For this reason, the second evaporation region SR2 can include the region that overlaps with the second device D2 and the peripheral region thereof.

[0224] The second condensation region CR2 is a region that does not overlap with the second device D2 when viewed in the thickness direction of the vapor chamber 101 (the Y direction in FIG. 39) (in plan view), and is a region where the working vapor 102a mainly releases heat and condenses. The second condensation region CR2 can also be referred to as the region around the second evaporation region SR2 in the second region RR2. In the illustrated example, the second condensation region CR2 is formed on the negative X side (the left side in FIG. 40) of the second region RR2 of the vapor chamber 101. In the second condensation region CR2, the heat of the working vapor 102a from the second evaporation region SR2 is released to the first sheet 110, and the working vapor 2a is cooled and condensed in the second condensation region CR1.

[0225] Here, the plan view is a state viewed from a direction orthogonal to the surface of the vapor chamber 101 that receives heat from the electronic device D and the surface that releases the received heat. That is, it is a state viewed from a direction orthogonal to the first sheet outer surface 110a (to be described later) of the first sheet 110 of the vapor chamber 101 and the second sheet outer surface 120b (to be described later) of the second sheet 120. For example, as shown in FIGS. 38 and 39, in the first region RR1 of the bent vapor chamber 101, the state viewed from the Z direction corresponds to the plan view. Also, in the second region RR2, the state viewed from the Y direction corresponds to the plan view.

[0226] As shown in FIG. 41, the first sheet 110 has a first sheet outer surface 110a provided on the side opposite to the main body sheet 130, and a first sheet inner surface 110b provided on the side opposite to the first sheet outer surface 110a (that is, the side of the main body sheet 130). The first sheet 110 may be formed in a flat shape as a whole, and the first sheet 110 may have a constant thickness as a whole. A housing member Ha that forms a part of the housing H of a mobile terminal or the like is attached to the first sheet outer surface 110a (see FIGS. 38 and 39). The entire first sheet outer surface 110a may be covered with the housing member Ha. As shown in FIG. 42, alignment holes 112 may be provided at the four corners of the first sheet 110.

[0227] As shown in FIG. 41, the second sheet 120 has a second sheet inner surface 120a provided on the side of the main body sheet 130 and a second sheet outer surface 120b provided on the side opposite to the second sheet inner surface 120a. The second sheet 120 may be formed in a flat shape as a whole, and the second sheet 120 may have a constant thickness as a whole. The above-described devices D1 and D2 are attached to the second sheet outer surface 120b. As shown in FIG. 43, alignment holes 122 may be provided at the four corners of the second sheet 120.

[0228] In the above example, the housing member Ha is attached to the first sheet outer surface 110a of the first sheet 110, and the devices D1 and D2 are attached to the second sheet outer surface 120b of the second sheet 120. However, the present invention is not limited to this. The devices D1 and D2 may be attached to the first sheet outer surface 110a of the first sheet 110, and the housing member Ha may be attached to the second sheet outer surface 120b of the second sheet 120. Further, the housing member Ha and the devices D1 and D2 may be attached to the first sheet outer surface 110a of the first sheet 110, and the housing member Ha and the devices D1 and D2 may be attached to the second sheet outer surface 120b of the second sheet 120.

[0229] As shown in FIG. 41, the main body sheet 130 includes a sheet main body 131 and a steam flow path portion 150 provided in the sheet main body 131. The sheet main body 131 has a first main body surface 131a and a second main body surface 131b provided on the side opposite to the first main body surface 131a. The first main body surface 131a is provided on the side of the first sheet 110, and the second main body surface 131b is provided on the side of the second sheet 120.

[0230] The inner surface 110b of the first sheet 110 of the first sheet 110 and the first main surface 131a of the sheet body 131 may be permanently joined to each other by thermocompression bonding. Similarly, the inner surface 120a of the second sheet 120 of the second sheet 120 and the second main surface 131b of the sheet body 131 may be permanently joined to each other by thermocompression bonding. Examples of joining by thermocompression bonding include, for example, diffusion bonding. However, the first sheet 110, the second sheet 120, and the main body sheet 130 may be joined by other methods such as brazing as long as they can be permanently joined, rather than by diffusion bonding. Note that the term "permanently joined" is not restricted to a strict meaning, and is used as a term meaning that the joining between the first sheet 110 and the main body sheet 130 and the joining between the second sheet 120 and the main body sheet 130 can be maintained to such an extent that the sealing performance of the sealed space 103 can be maintained during the operation of the vapor chamber 101.

[0231] As shown in FIGS. 40 and 44, the sheet body 131 has a frame portion 132 and a plurality of land portions 133 provided inside the frame portion 132. The frame portion 132 and the land portions 133 are portions where the material of the main body sheet 130 remains without being etched in the etching process described later.

[0232] In the illustrated example, the frame portion 132 is formed in a rectangular frame shape when viewed in the thickness direction of the main body sheet 130 (the Z direction in FIG. 44). A vapor flow path portion 150 is provided inside the frame portion 132. The vapor flow path portion 150 houses the working fluids 102a and 102b. Each land portion 133 is provided in the vapor flow path portion 150, and the working vapor 102a flows around each land portion 133. That is, the vapor flow path portion 150 includes the plurality of land portions 133 described above and vapor passages 151 and 152, which are passages through which the working vapor 102a flows and are provided around each land portion 133, described later.

[0233] In the illustrated example, the land portion 133 extends in the X direction (the left - right direction in FIG. 44), and the planar shape of the land portion 133 is an elongated rectangular shape. Also, the respective land portions 133 are spaced apart in the Y direction (the up - down direction in FIG. 44) and are arranged parallel to each other. The width ww1 of the land portion 133 (see FIG. 45) may be, for example, 100 μm to 3000 μm. Here, the width ww1 of the land portion 133 is the dimension of the land portion 133 in the Y direction, and means the dimension at the position where the through - hole portion 134 described later exists in the Z direction.

[0234] The frame portion 132 and each land portion 133 are joined to the first sheet 110 and are also joined to the second sheet 120. The wall surface 153a of the first vapor flow path recess 153 and the wall surface 154a of the second vapor flow path recess 154 described later constitute the side walls of the land portion 133. The first main body surface 131a and the second main body surface 131b of the sheet main body 131 may be formed flat over the frame portion 132 and each land portion 133.

[0235] The vapor flow path portion 150 is mainly a flow path through which the working vapor 102a passes. The working liquid 102b may also pass through the vapor flow path portion 150. As shown in FIGS. 41 and 45, the vapor flow path portion 150 may penetrate from the first main body surface 131a to the second main body surface 131b. That is, it may penetrate the sheet main body 131 of the main body sheet 130. The vapor flow path portion 150 may be covered by the first sheet 110 on the first main body surface 131a and may be covered by the second sheet 120 on the second main body surface 131b.

[0236] As shown in FIG. 44, the steam flow path portion 150 has a first steam passage 151 and a plurality of second steam passages 152. The steam flow path portion 150 is partitioned into the first steam passage 151 and the plurality of second steam passages 152 by a plurality of land portions 133. The first steam passage 151 is formed between the frame portion 132 and the land portion 133. The first steam passage 151 is continuously formed inside the frame portion 132 and outside the land portion 133. The planar shape of the first steam passage 151 is a rectangular frame shape. The second steam passages 152 are provided between adjacent land portions 133. The second steam passages 152 include a plurality of steam passages 152a extending in the first direction. In the illustrated example, the first direction is the X direction. That is, each steam passage 152a extends in the X direction. The planar shape of each steam passage 152a is an elongated rectangular shape. Each steam passage 152a is arranged in parallel.

[0237] In addition, in the present embodiment, although the steam flow path portion 150 has the first steam passage 151, the steam flow path portion 150 may not have the first steam passage 151. That is, the frame portion 132 and the land portion 133 may be arranged adjacent to each other, and a steam passage may not be provided between the frame portion 132 and the land portion 133.

[0238] As shown in FIG. 41, the first steam passage 151 and the second steam passages 152 may penetrate from the first main body surface 131a to the second main body surface 131b of the sheet main body 131. That is, it may penetrate the sheet main body 131 of the main body sheet 130. The first steam passage 151 and the second steam passages 152 are respectively constituted by a first steam flow path recess 153 provided on the first main body surface 131a and a second steam flow path recess 154 provided on the second main body surface 131b. The first steam flow path recess 153 and the second steam flow path recess 154 communicate with each other, and the first steam passage 151 and the second steam passages 152 of the steam flow path portion 150 are formed to extend from the first main body surface 131a to the second main body surface 131b.

[0239] The first steam flow path recess 153 is formed in a concave shape on the first main body surface 131a by being etched from the first main body surface 131a of the main body sheet 130 in an etching process described later. As a result, the first steam flow path recess 153 has a curved wall surface 153a as shown in FIG. 45. This wall surface 153a defines the first steam flow path recess 153 and curves so as to approach the opposing wall surface 153a as it progresses toward the second main body surface 131b in the cross section shown in FIG. 45. Such a first steam flow path recess 153 constitutes a part (lower half) of the first steam passage 151 and a part (lower half) of the second steam passage 152.

[0240] The second steam flow path recess 154 is formed in a concave shape on the second main body surface 131b by being etched from the second main body surface 131b of the main body sheet 130 in an etching process described later. As a result, the second steam flow path recess 154 has a curved wall surface 154a as shown in FIG. 45. This wall surface 154a defines the second steam flow path recess 154 and curves so as to approach the opposing wall surface 154a as it progresses toward the first main body surface 131a in the cross section shown in FIG. 45. Such a second steam flow path recess 154 constitutes a part (upper half) of the first steam passage 151 and a part (upper half) of the second steam passage 152.

[0241] As shown in FIG. 45, the wall surface 153a of the first steam flow path recess 153 and the wall surface 154a of the second steam flow path recess 154 are connected to form a through portion 134. The wall surface 153a and the wall surface 154a are each curved toward the through portion 134. As a result, the first steam flow path recess 153 and the second steam flow path recess 154 communicate with each other. The planar shape of the through portion 134 in the first steam passage 151 may be in a rectangular frame shape similar to the first steam passage 151, and the planar shape of the through portion 134 in the second steam passage 152 may be in an elongated rectangular shape similar to the second steam passage 152. The through portion 134 may be defined by a ridge line formed by the wall surface 153a of the first steam flow path recess 153 and the wall surface 154a of the second steam flow path recess 54 merging and projecting inward. The planar area of the steam flow path portion 150 is minimized in the through portion 134. The width ww2, ww2' (see FIG. 45) of such a through portion 134 may be, for example, 100 μm to 3000 μm. Here, the width ww2 of the through portion 134 corresponds to the gap between the land portions 133 adjacent to each other in the Y direction. Also, the width ww2' of the through portion 134 corresponds to the gap between the frame body portion 132 and the land portion 133 in the Y direction (or X direction).

[0242] The position of the through portion 134 in the Z direction may be at an intermediate position between the first main body surface 131a and the second main body surface 131b, or may be shifted to a lower or upper position from the intermediate position. As long as the first steam flow path recess 153 and the second steam flow path recess 154 communicate, the position of the through portion 134 is arbitrary.

[0243] Also, in the illustrated example, the cross-sectional shapes of the first steam passage 151 and the second steam passage 152 are formed to include the through portion 134 defined by a ridge line formed to project inward, but it is not limited thereto. For example, the cross-sectional shape of the first steam passage 151 and the cross-sectional shape of the second steam passage 152 may be trapezoidal or rectangular, or may be in a barrel shape.

[0244] The steam flow path section 150 including the first steam passage 151 and the second steam passage 152 configured as described above constitutes a part of the sealed space 103 described above. As shown in FIG. 41, the first steam passage 151 and the second steam passage 152 are mainly defined by the first sheet 110, the second sheet 120, and the frame portion 132 and the land portion 133 of the sheet body 131 described above. Each steam passage 151, 152 has a relatively large flow path cross-sectional area through which the working steam 102a passes.

[0245] Here, FIG. 41 shows an enlarged view of the first steam passage 151, the second steam passage 152, etc. for clarity of the drawing, and the number and arrangement of these steam passages 151, 152, etc. are different from those in FIGS. 38 to 40 and FIG. 44.

[0246] Incidentally, although not shown, a plurality of support portions for supporting the land portion 133 on the frame portion 132 may be provided in the steam flow path section 150. Further, a support portion for supporting adjacent land portions 133 may be provided. These support portions may be provided on both sides of the land portion 133 in the X direction, or may be provided on both sides of the land portion 133 in the Y direction. The support portion may be formed so as not to obstruct the flow of the working steam 102a that diffuses the steam flow path section 150. For example, it may be arranged on one side of the first main body surface 131a and the second main body surface 131b of the sheet body 131 of the main body sheet 130, and a space forming a steam flow path recess may be formed on the other side. Thereby, the thickness of the support portion can be made thinner than the thickness of the sheet body 131, and it is possible to prevent the first steam passage 151 and the second steam passage 152 from being divided in the X direction and the Y direction.

[0247] As shown in FIGS. 41, 44, and 45, a liquid flow path portion 160 through which the working liquid 102b mainly passes is provided on the second main body surface 131b of the sheet main body 131 of the main body sheet 130. More specifically, the liquid flow path portion 160 is provided on the second main body surface 131b of each land portion 133 of the main body sheet 130. The working vapor 102a may also pass through the liquid flow path portion 160. This liquid flow path portion 160 constitutes a part of the above-described sealed space 103 and communicates with the vapor flow path portion 150. The liquid flow path portion 160 is configured as a capillary structure (wick) for transporting the working liquid 102b to the evaporation regions SR1 and SR2. The liquid flow path portion 160 may be formed over the entire second main body surface 131b of each land portion 133. The liquid flow path portion 160 is arranged so as to extend in the first direction, that is, the X direction. In the illustrated example, the liquid flow path portion 160 is not provided on the first main body surface 131a of each land portion 133 of the sheet main body 131, but the liquid flow path portion 160 may be provided on the second main body surface 131b of the land portion 133 of the sheet main body 131.

[0248] As shown in FIG. 46, the liquid flow path portion 160 is composed of a plurality of grooves provided on the second main body surface 131b. More specifically, the liquid flow path portion 160 has a plurality of liquid flow path main grooves 161 through which the working liquid 102b passes and a plurality of liquid flow path communication grooves 165 communicating with the liquid flow path main grooves 161.

[0249] As shown in FIG. 46, each liquid flow path main groove 161 is formed so as to extend in the X direction. The liquid flow path main groove 161 mainly has a smaller flow path cross-sectional area than the first vapor passage 151 or the second vapor passage 152 of the vapor flow path portion 150 so that the working liquid 102b flows by capillary action. Thus, the liquid flow path main groove 161 is configured to transport the working liquid 102b condensed from the working vapor 102a to the evaporation regions SR1 and SR2. Each liquid flow path main groove 161 may be arranged at intervals in the Y direction.

[0250] The main flow channel 161 of the liquid flow path is formed by being etched from the second main body surface 131b of the sheet main body 131 of the main body sheet 130 in the etching process described later. As a result, as shown in FIG. 45, the main flow channel 161 of the liquid flow path has a curved wall surface 162. This wall surface 162 defines the main flow channel 161 of the liquid flow path and is curved concave toward the first main body surface 131a.

[0251] The width ww3 (dimension in the Y direction) of the main flow channel 161 of the liquid flow path shown in FIGS. 45 and 46 may be, for example, 5 μm to 150 μm. Note that the width ww3 of the main flow channel 161 of the liquid flow path means the dimension on the second main body surface 131b. Further, the depth hh1 (dimension in the Z direction) of the main flow channel 161 of the liquid flow path shown in FIG. 45 may be, for example, 3 μm to 150 μm.

[0252] As shown in FIG. 46, each liquid flow path connecting groove 165 extends in a direction different from the X direction. In the illustrated example, each liquid flow path connecting groove 165 is formed to extend in the Y direction and is formed perpendicular to the main flow channel 161 of the liquid flow path. Some of the liquid flow path connecting grooves 165 are arranged to communicate the adjacent main flow channels 161 of the liquid flow path with each other. Other liquid flow path connecting grooves 165 are arranged to communicate the vapor flow path portion 150 (the first vapor passage 151 or the second vapor passage 152) and the main flow channel 161 of the liquid flow path. That is, the liquid flow path connecting groove 165 extends from the edge of the land portion 133 in the Y direction to the main flow channel 161 adjacent to the edge. In this way, the first vapor passage 151 or the second vapor passage 152 of the vapor flow path portion 150 and the main flow channel 161 of the liquid flow path communicate with each other.

[0253] The liquid flow path connecting groove 165 mainly has a smaller flow path cross-sectional area than the first vapor passage 151 or the second vapor passage 152 of the vapor flow path portion 150 so that the working liquid 102b flows by capillary action. Each liquid flow path connecting groove 165 may be arranged at intervals in the X direction.

[0254] The liquid flow path connection groove 165 is also formed by etching, similar to the liquid flow path main groove 161, and has a wall surface (not shown) formed in a curved shape similar to that of the liquid flow path main groove 161. The width ww4 (dimension in the X direction) of the liquid flow path connection groove 165 shown in FIG. 46 may be equal to the width ww3 of the liquid flow path main groove 161, but may also be larger or smaller than the width ww3. The depth of the liquid flow path connection groove 165 may be equal to the depth hh1 of the liquid flow path main groove 161, but may also be deeper or shallower than the depth hh1.

[0255] As shown in FIG. 46, the liquid flow path portion 160 has a liquid flow path convex portion row 163 provided on the second main body surface 131b of the sheet main body 131. The liquid flow path convex portion row 163 is provided between adjacent liquid flow path main grooves 161. Each liquid flow path convex portion row 163 includes a plurality of liquid flow path convex portions 164 arranged in the X direction. The liquid flow path convex portions 164 are provided within the liquid flow path portion 160 and are in contact with the second sheet 120. Each liquid flow path convex portion 164 is formed in a rectangular shape in plan view such that the X direction is the longitudinal direction. A liquid flow path main groove 161 is interposed between adjacent liquid flow path convex portions 164 in the Y direction, and a liquid flow path connection groove 165 is interposed between adjacent liquid flow path convex portions 164 in the X direction. The liquid flow path connection groove 165 is formed to extend in the Y direction and communicates the liquid flow path main grooves 161 adjacent to each other in the Y direction. As a result, the working fluid 102b can flow back and forth between these liquid flow path main grooves 161.

[0256] The liquid flow path convex portion 164 is a portion where the material of the main body sheet 130 remains without being etched in the etching process described later. In the example shown in FIG. 46, the planar shape of the liquid flow path convex portion 164 (the shape at the position of the second main body surface 131b of the sheet main body 131 of the main body sheet 130) is rectangular.

[0257] In the example shown in FIG. 46, the liquid flow path convex portions 164 are arranged in a staggered pattern. More specifically, the liquid flow path convex portions 164 of the liquid flow path convex portion rows 163 adjacent to each other in the Y direction are arranged so as to be offset from each other in the X direction. This offset amount may be half of the arrangement pitch of the liquid flow path convex portions 164 in the X direction. The width ww5 (dimension in the Y direction) of the liquid flow path convex portions 164 may be, for example, 5 μm to 500 μm. Note that the width ww5 of the liquid flow path convex portions 164 means the dimension on the second main body surface 131b. Note that the arrangement of the liquid flow path convex portions 164 is not limited to being in a staggered pattern, and they may be arranged in parallel. In this case, the liquid flow path convex portions 164 of the liquid flow path convex portion rows 163 adjacent to each other in the Y direction are also aligned in the X direction.

[0258] The main liquid flow path groove 161 includes a liquid flow path intersection portion 166 that communicates with the liquid flow path connection groove 165. At the liquid flow path intersection portion 166, the main liquid flow path groove 161 and the liquid flow path connection groove 165 communicate with each other in a T shape. As a result, at the liquid flow path intersection portion 166 where one main liquid flow path groove 161 communicates with the liquid flow path connection groove 165 on one side (for example, the upper side in FIG. 46), it is possible to avoid the liquid flow path connection groove 165 on the other side (for example, the lower side in FIG. 46) from communicating with the main liquid flow path groove 161. Thus, at the liquid flow path intersection portion 166, it is possible to prevent the wall surface 162 of the main liquid flow path groove 161 from being notched on both sides (the upper side and the lower side in FIG. 46), and one side of the wall surface 162 can be left intact. For this reason, even at the liquid flow path intersection portion 166, capillary action can be imparted to the working liquid in the main liquid flow path groove 161, and it is possible to suppress a decrease in the propulsion force of the working liquid 102b toward the evaporation region SR at the liquid flow path intersection portion 166.

[0259] As shown in FIG. 44, alignment holes 135 may be provided at the four corners of the sheet body 131 of the main body sheet 130. In the example shown in FIG. 44, the planar shape of the alignment holes 135 is circular, but it is not limited to this. The alignment holes 135 may penetrate the sheet body 131 of the main body sheet 130.

[0260] Also, as shown in FIG. 40, the vapor chamber 101 may include an injection portion 104 provided at the edge on the negative X-direction side (left side in FIG. 40) for injecting the working fluid 102b into the sealed space 103. In the example shown in FIG. 40, the injection portion 104 is disposed on the side of the condensation regions CR1 and CR2. The injection portion 104 may have an injection flow path 137 formed in the main body sheet 130. After the working fluid 102b is injected, the injection flow path 137 may be sealed.

[0261] Incidentally, as described above, the vapor chamber 101 according to the present embodiment is bent along the bending line BL (see FIGS. 38 and 39). This bending line BL extends in a direction parallel to the first direction in which the above-described vapor passage 152a extends. For this reason, the vapor chamber 101 is bent along a direction parallel to the first direction. As described above, in the present embodiment, the first direction is the X direction. As shown in FIG. 39, the vapor chamber 101 may be bent such that the first sheet 110 is located on the outer side of the bend and the second sheet 120 is located on the inner side of the bend.

[0262] Also, the vapor chamber 101 may be bent at the position where the vapor passage 152a is disposed. That is, the vapor chamber 101 may be bent along the vapor passage 152a.

[0263] In the bent portion BP, the flow path cross-sectional area of the vapor passage 152a can be reduced. For example, as shown in FIG. 39, in the bent portion BP, when the first sheet inner surface 110b of the first sheet 110 and the second sheet inner surface 120a of the second sheet 120 come into contact with each other, the flow path cross-sectional area of the vapor passage 152a can be reduced. As a result, the reciprocation of the working vapor 102a between the first region RR1 and the second region RR2 is suppressed.

[0264] When the vapor chamber 101 is bent, the first sheet 110 is deformed so as to be recessed inward (toward the second sheet 120 side) under tensile stress at the bent portion BP. Also, the second sheet 120 is deformed so as to be recessed inward (toward the first sheet 110 side) under compressive stress at the bent portion BP. As a result, when the vapor chamber 1 is bent, as shown in FIG. 39, the first sheet inner surface 110b of the first sheet 110 comes into contact with the second sheet inner surface 120a of the second sheet 120, and the flow path cross-sectional area of the vapor passage 152a may become narrow.

[0265] In the illustrated example, the first sheet inner surface 110b of the first sheet 110 is in contact with the second sheet inner surface 120a of the second sheet 120, but it is not limited to this. At the bent portion BP, the first sheet inner surface 110b of the first sheet 110 and the second sheet inner surface 120a of the second sheet 120 may not be in contact with each other, and a gap may be provided between the first sheet inner surface 110b and the second sheet inner surface 120a. Even in such a case, since the flow path cross-sectional area of the vapor passage 152a becomes narrow at the bent portion BP, the reciprocation of the working vapor 102a between the first region RR1 and the second region RR2 is suppressed.

[0266] The materials constituting the first sheet 110, the second sheet 120, and the main body sheet 130 are not particularly limited as long as they have good thermal conductivity. However, the first sheet 110, the second sheet 120, and the main body sheet 130 may contain, for example, copper or a copper alloy. In this case, the thermal conductivity of each of the sheets 110, 120, 130 can be increased, and the heat dissipation efficiency of the vapor chamber 101 can be increased. Also, when pure water is used as the working fluids 102a, 102b, corrosion can be prevented. Note that as long as a desired heat dissipation efficiency can be obtained and corrosion can be prevented, other metal materials such as aluminum and titanium, or other metal alloy materials such as stainless steel can also be used for these sheets 110, 120, 130.

[0267] The thickness tt1 of the vapor chamber 101 shown in FIG. 41 may be, for example, 100 μm to 1000 μm. By setting the thickness tt1 of the vapor chamber 101 to 100 μm or more, the vapor flow path portion 150 can be appropriately secured, and the vapor chamber 101 can function properly. On the other hand, by setting the thickness tt1 of the vapor chamber 101 to 1000 μm or less, it is possible to suppress the thickening of the vapor chamber 101.

[0268] The thickness tt2 of the first sheet 110 shown in FIG. 41 may be, for example, 6 μm to 100 μm. By setting the thickness tt2 of the first sheet 110 to 6 μm or more, the mechanical strength of the first sheet 110 can be ensured. On the other hand, by setting the thickness tt2 of the first sheet 110 to 100 μm or less, it is possible to suppress the thickening of the thickness tt1 of the vapor chamber 101. Similarly, the thickness tt3 of the second sheet 120 shown in FIG. 41 may be set in the same manner as the thickness tt2 of the first sheet 110. The thickness tt3 of the second sheet 120 and the thickness tt2 of the first sheet 110 may be different.

[0269] The thickness tt4 of the main body sheet 130 shown in FIG. 41 may be, for example, 50 μm to 400 μm. By setting the thickness tt4 of the main body sheet 130 to 50 μm or more, the vapor flow path portion 150 can be appropriately secured, and the vapor chamber 101 can operate properly. On the other hand, by setting the thickness tt4 of the main body sheet 130 to 400 μm or less, it is possible to suppress the thickening of the thickness tt1 of the vapor chamber 101.

[0270] Next, a method for manufacturing the vapor chamber 101 having such a configuration will be described with reference to FIGS. 47 to 50.

[0271] Here, first, a sheet preparation process for preparing each of the sheets 110, 120, and 130 will be described. This sheet preparation process includes a first sheet preparation process for preparing the first sheet 110, a second sheet preparation process for preparing the second sheet 120, and a main body sheet preparation process for preparing the main body sheet 130.

[0272] In the first sheet preparation process, first, a first sheet base material having a desired thickness is prepared. The first sheet base material may be a rolled material. Subsequently, by etching the first sheet base material, a first sheet 110 having a desired planar shape is formed. Alternatively, the first sheet 110 having a desired planar shape may be formed by pressing the first sheet base material. In this way, the first sheet 110 having an outer contour shape as shown in FIG. 42 can be prepared.

[0273] Also in the second sheet preparation process, similar to the first sheet preparation process, first, a second sheet base material having a desired thickness is prepared. The second sheet base material may be a rolled material. Subsequently, by etching the second sheet base material, a second sheet 120 having a desired planar shape is formed. Alternatively, the second sheet 120 having a desired planar shape may be formed by pressing the second sheet base material. In this way, the second sheet 120 having an outer contour shape as shown in FIG. 43 can be prepared.

[0274] The main body sheet preparation process includes a material sheet preparation process for preparing the metal material sheet M and an etching process for etching the metal material sheet M.

[0275] First, in the material sheet preparation process, as shown in FIG. 47, a flat metal material sheet M including a first material surface Ma and a second material surface Mb is prepared. The metal material sheet M may be a rolled material having a desired thickness.

[0276] Next, in the etching process, as shown in FIG. 48, the metal material sheet M is etched from the first material surface Ma and the second material surface Mb to form the vapor flow path portion 150 and the liquid flow path portion 160.

[0277] More specifically, a patterned resist film (not shown) is formed on the first material surface Ma and the second material surface Mb of the metal material sheet M by photolithography technology. The pattern of this resist film includes the patterns of the vapor flow path portion 150 and the liquid flow path portion 160 described above. Subsequently, the first material surface Ma and the second material surface Mb of the metal material sheet M are etched through the openings of the patterned resist film. As a result, the first material surface Ma and the second material surface Mb of the metal material sheet M are etched in a pattern, and the vapor flow path portion 150 and the liquid flow path portion 160 as shown in FIG. 48 are formed. Note that, for example, an iron chloride-based etching solution such as an aqueous solution of ferric chloride or a copper chloride-based etching solution such as an aqueous solution of copper chloride may be used as the etching solution.

[0278] In the etching process, the first material surface Ma and the second material surface Mb of the metal material sheet M may be etched simultaneously. However, this is not limited thereto, and the etching of the first material surface Ma and the second material surface Mb may be performed as separate processes. Also, the vapor flow path portion 150 and the liquid flow path portion 160 may be formed by simultaneous etching or may be formed in separate processes.

[0279] Also, in the etching process, by etching the first material surface Ma and the second material surface Mb of the metal material sheet M, a predetermined outer contour shape as shown in FIG. 44 can be obtained. That is, the main body sheet 130 having an outer peripheral edge as shown in FIG. 44 can be obtained.

[0280] In this way, the main body sheet 130 as shown in FIG. 44 can be prepared.

[0281] After the preparation process, as a bonding process, as shown in FIG. 49, the first sheet 110, the second sheet 120, and the main body sheet 130 are bonded.

[0282] More specifically, first, the first sheet 110, the second sheet 120, and the main body sheet 130 are laminated in this order. In this case, the first main body surface 131a of the main body sheet 130 is overlapped with the inner surface 110b of the first sheet 110, and the inner surface 120a of the second sheet 120 is overlapped with the second main body surface 131b of the main body sheet 130. At this time, the alignment holes 112 of the first sheet 110, the alignment holes 135 of the main body sheet 130, and the alignment holes 122 of the second sheet 120 may be used to align the sheets 110, 120, and 130.

[0283] Subsequently, the first sheet 110, the second sheet 120, and the main body sheet 130 are temporarily fixed. For example, spot resistance welding may be performed to temporarily fix these sheets 110, 120, and 130, or laser welding may be used to temporarily fix these sheets 110, 120, and 130.

[0284] Next, the first sheet 110, the second sheet 120, and the main body sheet 130 are permanently joined by thermocompression bonding. For example, these sheets 110, 120, and 130 may be permanently joined by diffusion bonding. As a result, a sealed space 103 having a vapor flow path portion 150 and a liquid flow path portion 160 is formed between the first sheet 110 and the second sheet 120. At this stage, the injection flow path 137 is not sealed in the sealed space 103 and communicates with the outside through the injection flow path 137.

[0285] After the joining step, as an injection step, the working fluid 102b is injected from the injection flow path 137 of the injection portion 104 into the sealed space 103.

[0286] After the injection step, as a sealing step, the injection flow path 137 is sealed. As a result, the communication between the sealed space 103 and the outside is blocked, and the sealed space 103 is sealed. Therefore, a sealed space 103 filled with the working fluid 102b can be obtained, and leakage of the working fluid 102b in the sealed space 103 to the outside can be prevented.

[0287] In this way, a thin flat vapor chamber 101 filled with the working fluid 102b as shown in FIG. 40 can be obtained.

[0288] After the sealing process, as a bending process, as shown in FIG. 50, the first sheet 110, the second sheet 120, and the main body sheet 130 are bent along the bending line BL, that is, along a direction parallel to the first direction in which the vapor passage 152a extends. As a result, a first region RR1 and a second region RR2 separated by the bent portion BP are formed in the vapor chamber 101. The vapor chamber 101 is bent at the position where the vapor passage 152a is arranged. Thus, when the vapor chamber 101 is bent, the first sheet 110 is deformed so as to be recessed inward under tensile stress at the bent portion BP, and the second sheet 120 is deformed so as to be recessed inward under compressive stress at the bent portion BP. Therefore, at the bent portion BP, the inner surface 110b of the first sheet 110 of the first sheet and the inner surface 120a of the second sheet 120 of the second sheet come into contact with each other, and the flow cross-sectional area of the second vapor passage 152 becomes narrow. As a result, the reciprocation of the working vapor 102a between the first region RR1 and the second region RR2 is suppressed.

[0289] In the above manner, a bent vapor chamber 101 as shown in FIGS. 38 and 39 can be obtained.

[0290] Next, a method of operating the vapor chamber 101, that is, a method of cooling the device D will be described.

[0291] The vapor chamber 101 obtained as described above is installed in a housing H such as a mobile terminal. Here, the outer surface 110a of the first sheet 110 is covered with the housing member Ha, and devices D1, D2 such as a CPU, which is a device to be cooled, are attached to the outer surface 120b of the second sheet 120. The first device D1 is attached to the first region RR1 of the vapor chamber 101, and the second device D2 is attached to the second region RR2 of the vapor chamber 101. The working fluid 102b in the sealed space 103 adheres to the wall surface of the sealed space 103, that is, the wall surface 153a of the first vapor flow path recess 153, the wall surface 154a of the second vapor flow path recess 154, the wall surface 162 of the main flow groove 161 of the liquid flow path in the liquid flow path portion 160, and the wall surface of the liquid flow path connection groove 165 due to its surface tension. Further, the working fluid 102b may also adhere to the portion of the inner surface 110b of the first sheet 110 that is exposed in the first vapor flow path recess 153. Furthermore, the working fluid 102b may also adhere to the portions of the inner surface 120a of the second sheet 120 that are exposed in the second vapor flow path recess 154, the main flow groove 161 of the liquid flow path, and the liquid flow path connection groove 165.

[0292] When the first device D1 generates heat in this state, the working fluid 102b present in the first evaporation region SR1 (see FIG. 44) receives heat from the first device D1. The received heat is absorbed as latent heat and the working fluid 102b evaporates (vaporizes), generating working vapor 102a. Most of the generated working vapor 102a diffuses in the first vapor flow path recess 153 and the second vapor flow path recess 154 that constitute the sealed space 103 (see the solid arrows in FIG. 44). The working vapor 102a in each of the vapor flow path recesses 153, 154 moves away from the first evaporation region SR1, and most of the working vapor 102a is transported to the first condensation region CR1 (the left portion in FIG. 44), which has a relatively low temperature. In the first condensation region CR1, the working vapor 102a is mainly cooled by dissipating heat to the first sheet 110. The heat received by the first sheet 110 from the working vapor 102a is transmitted to the outside air through the housing member Ha (see FIG. 39).

[0293] The working steam 102a dissipates heat to the first sheet 110 in the first condensation region CR1, thereby losing the latent heat absorbed in the first evaporation region SR1 and condensing to generate the working fluid 102b. The generated working fluid 102b adheres to the wall surfaces 153a, 154a of the respective steam flow path recesses 153, 154, the first sheet inner surface 110b of the first sheet 110, and the second sheet inner surface 120a of the second sheet 120. Here, since the working fluid 102b continues to evaporate in the first evaporation region SR1, the working fluid 102b in the first condensation region CR1 is transported toward the first evaporation region SR1 by the capillary action of each liquid flow path main groove 161 (see the dashed arrow in FIG. 44). As a result, the working fluid 102b adhering to the wall surfaces 153a, 154a, the first sheet inner surface 110b, and the second sheet inner surface 120a moves to the liquid flow path portion 160, passes through the liquid flow path connection groove 165, and enters the liquid flow path main groove 161. In this way, the liquid flow path main grooves 161 and the liquid flow path connection grooves 165 are filled with the working fluid 102b. Therefore, the filled working fluid 102b obtains a driving force toward the first evaporation region SR1 by the capillary action of each liquid flow path main groove 161 and is smoothly transported toward the first evaporation region SR1.

[0294] In the liquid flow path portion 160, each liquid flow path main groove 161 communicates with another adjacent liquid flow path main groove 161 via the corresponding liquid flow path connection groove 165. As a result, the working fluid 102b flows back and forth between the adjacent liquid flow path main grooves 161, and the occurrence of dry-out in the liquid flow path main groove 161 is suppressed. Therefore, capillary action is imparted to the working fluid 102b in each liquid flow path main groove 161, and the working fluid 102b is smoothly transported toward the first evaporation region SR1.

[0295] The working fluid 102b that has reached the first evaporation region SR1 receives heat again from the first device D1 and evaporates. The working vapor 102a evaporated from the working fluid 102b passes through the liquid flow path communication groove 165 in the first evaporation region SR1 and moves to the first vapor flow path recess 153 and the second vapor flow path recess 154 with a large flow path cross-sectional area, and diffuses in each vapor flow path recess 153, 154. In this way, the working fluids 102a, 102b reflux in the sealed space 103 while repeating phase changes, that is, evaporation and condensation, to transport and release the heat of the first device D1. As a result, the first device D1 is cooled.

[0296] Similarly, when the second device D2 generates heat, the working fluid 102b present in the second evaporation region SR2 (see FIG. 44) receives heat from the second device D2. The received heat is absorbed as latent heat and the working fluid 102b evaporates (vaporizes) to generate the working vapor 102a. Most of the generated working vapor 102a diffuses in the first vapor flow path recess 153 and the second vapor flow path recess 154 that constitute the sealed space 103 (see the solid arrows in FIG. 44). The working vapor 102a in each vapor flow path recess 153, 154 moves away from the second evaporation region SR2, and most of the working vapor 102a is transported to the second condensation region CR2 (the left portion in FIG. 44) with a relatively low temperature. In the first condensation region CR2, the working vapor 102a is mainly cooled by releasing heat to the first sheet 110. The heat received by the first sheet 110 from the working vapor 102a is transmitted to the outside air through the housing member Ha (see FIG. 39).

[0297] The working vapor 102a dissipates heat to the first sheet 110 in the second condensation region CR2, thereby losing the latent heat absorbed in the second evaporation region SR2 and condensing to generate the working fluid 102b. The generated working fluid 102b adheres to the wall surfaces 153a, 154a of the respective vapor flow path recesses 153, 154, the first sheet inner surface 110b of the first sheet 110, and the second sheet inner surface 120a of the second sheet 120. Here, since the working fluid 102b continues to evaporate in the second evaporation region SR2, the working fluid 102b in the second condensation region CR2 is transported toward the second evaporation region SR2 by the capillary action of each liquid flow path main groove 161 (see the dashed arrows in FIG. 44). As a result, the working fluid 102b adhering to the wall surfaces 153a, 154a, the first sheet inner surface 110b, and the second sheet inner surface 120a moves to the liquid flow path portion 160, passes through the liquid flow path connection groove 165, and enters the liquid flow path main groove 161. In this way, the liquid flow path main grooves 161 and the liquid flow path connection grooves 165 are filled with the working fluid 102b. Therefore, the filled working fluid 102b obtains a propulsive force toward the second evaporation region SR2 by the capillary action of each liquid flow path main groove 161 and is smoothly transported toward the second evaporation region SR2.

[0298] In the liquid flow path portion 160, each liquid flow path main groove 161 communicates with other adjacent liquid flow path main grooves 161 via the corresponding liquid flow path connection groove 165. As a result, the working fluid 102b moves back and forth between the adjacent liquid flow path main grooves 161, and the occurrence of dry-out in the liquid flow path main groove 161 is suppressed. Therefore, capillary action is imparted to the working fluid 102b in each liquid flow path main groove 161, and the working fluid 102b is smoothly transported toward the second evaporation region SR2.

[0299] The working fluid 102b that has reached the second evaporation region SR2 is reheated by the second device D2 and evaporates again. The working vapor 102a evaporated from the working fluid 102b passes through the liquid flow path connection groove 165 in the second evaporation region SR2 and moves to the first vapor flow path recess 153 and the second vapor flow path recess 154 with a large flow path cross-sectional area, and diffuses in each vapor flow path recess 153, 154. In this way, the working fluids 102a and 102b reflux in the sealed space 103 while repeating the phase change, that is, evaporation and condensation, to transport and release the heat of the second device D2. As a result, the second device D2 is cooled.

[0300] Here, in the present embodiment, the vapor chamber 101 is bent along a direction parallel to the first direction in which the vapor passage 152a extends. As described above, in the bent portion BP, the reciprocation of the working vapor 102a between the first region RR1 and the second region RR2 is suppressed. Therefore, in the bent vapor chamber 101, heat transfer through the bent portion BP can be suppressed. As a result, a single vapor chamber 101 can be provided with the functions of a plurality of vapor chambers (two vapor chambers in the present embodiment).

[0301] For example, when the first device D1 is operating and generating heat, and the second device D2 is not operating and not generating heat, the working vapor 102a that has received heat from the first device D1 can be suppressed from moving from the first region RR1 to the second region RR2 and transferring heat to the second device D2. Also, for example, when the amount of heat generated by the first device D1 is large and the amount of heat generated by the second device D2 is small, the working vapor 102a that has received heat from the first device D1 can be suppressed from moving from the first region RR1 to the second region RR2 and transferring heat to the second device D2. The heat-resistant temperature of the device D varies depending on its type. Therefore, for example, when the heat-resistant temperature of the second device D2 is lower than the heat-resistant temperature of the first device D1, it is possible to prevent the heat of the first device D1 from being transferred to the second device D2 and thermally damaging the second device D2.

[0302] Thus, according to this embodiment, the vapor chamber 101 is bent along a direction parallel to the first direction. As a result, in the bent portion BP, the flow of the working vapor 102a between the first region RR1 and the second region RR2 can be suppressed. Therefore, in the bent vapor chamber 101, heat transfer through the bent portion BP can be suppressed.

[0303] Also, according to this embodiment, a single vapor chamber 101 can be provided with the functions of a plurality of vapor chambers 101. Therefore, the manufacturing cost of the vapor chamber 101 can be reduced as compared with the case of manufacturing a plurality of vapor chambers 101.

[0304] Further, according to this embodiment, since the vapor chamber 101 is bent along a direction parallel to the first direction, it is possible to avoid the bent portion BP from intersecting the vapor passage 152a. As a result, in each of the regions RR1 and RR2, an increase in the pressure loss of the working vapor 102a in the vapor passage 152a can be suppressed. Therefore, a decrease in the heat transfer ability of the vapor chamber 101 can be suppressed.

[0305] Moreover, according to this embodiment, the vapor chamber 101 is bent at the position where the vapor passage 152a is disposed. As a result, the pressure loss of the working vapor 102a in the vapor passage 152a at the bent portion BP can be increased. Therefore, in the bent portion BP, the flow of the working vapor 102a between the first region RR1 and the second region RR2 can be further suppressed. As a result, heat transfer through the bent portion BP can be further suppressed.

[0306] In addition, according to this embodiment, since the vapor chamber 101 is bent at the position where the vapor passage 152a is disposed, the vapor chamber 101 can be easily bent in the bending process of the vapor chamber 101. Therefore, the manufacture of the bent vapor chamber 101 can be facilitated.

[0307] In the above-described fourth embodiment, an example has been described in which the liquid flow path portion 160 is provided on the second main body surface 131b of the land portion 133 and not provided on the first main body surface 131a of the land portion 133. However, the present invention is not limited to this. As shown in FIG. 51, the liquid flow path portion 160 may not be provided on the second main body surface 131b of the land portion 133 and may be provided on the first main body surface 131a of the land portion 133.

[0308] Also, as shown in FIG. 52, the liquid flow path portion 160 may be provided on the second main body surface 131b of the land portion 133, and the liquid flow path portion 160 may also be provided on the first main body surface 131a of the land portion 133. In this case, the liquid flow path portion 160 provided on the first main body surface 131a and the liquid flow path portion 160 provided on the second main body surface 131b may be configured in the same manner, or may be configured to be different from each other. For example, as shown in FIG. 52, the flow path cross-sectional area of the liquid flow path portion 160 provided on the first main body surface 131a may be larger than the flow path cross-sectional area of the liquid flow path portion 160 provided on the second main body surface 131b. The liquid flow path portion 160 provided on the first main body surface 131a may function as a liquid storage portion while the electronic device D has stopped generating heat.

[0309] Also, in the fourth embodiment described above, as shown in FIG. 53, in the bent portion BP, the height hh2 of the vapor passage 152a may be smaller than the width ww1 of the land portion 133. Here, the height hh2 of the vapor passage 152a means the minimum dimension of the vapor passage 152a in the Z direction and corresponds to the minimum distance between the inner surface 110b of the first sheet and the inner surface 120a of the second sheet in the Z direction. The width ww1 of the land portion 133 is the dimension of the land portion 133 in the Y direction and means the dimension at the position where the through portion 134 exists in the Z direction. In this case, when the vapor chamber 101 is bent along the bending line BL, in the bent portion BP, the gap between the inner surface 110b of the first sheet and the inner surface 120a of the second sheet can be made smaller, and the flow channel cross-sectional area of the vapor passage 152a can be made narrower. As a result, the pressure loss of the working vapor 102a in the vapor passage 152a at the bent portion BP can be further increased. Therefore, in the bent portion BP, the reciprocation of the working vapor 102a between the first region RR1 and the second region RR2 can be further suppressed, and the heat transfer through the bent portion BP can be further suppressed.

[0310] Also, in the above-described fourth embodiment, as shown in FIG. 54, the width ww2a of the vapor passage 152a where the bending line BL is located may be larger than the width ww2b of the vapor passage 152a where the bending line BL is not located. Here, the widths ww2a and ww2b of the vapor passage 152a are the dimensions of the vapor passage 152a in the Y direction, and mean the dimensions at the position where the through portion 134 exists in the Z direction. The widths ww2a and ww2b of the vapor passage 152a correspond to the gaps between the land portions 133 adjacent to each other in the Y direction. Also in this case, when the vapor chamber 101 is bent along the bending line BL, at the bent portion BP, the gap between the first sheet inner surface 110b and the second sheet inner surface 120a can be made smaller, and the flow cross-sectional area of the vapor passage 152a can be made narrower. As a result, the pressure loss of the working vapor 102a in the vapor passage 152a at the bent portion BP can be further increased. Therefore, at the bent portion BP, the reciprocation of the working vapor 102a between the first region RR1 and the second region RR2 can be further suppressed, and the heat transfer through the bent portion BP can be further suppressed.

[0311] Also, in the above-described fourth embodiment, as shown in FIG. 55, a communication groove 136 may be provided in the land portion 133 adjacent to the vapor passage 152a where the bending line BL is located to communicate the vapor passage 152a where the bending line BL is located and the vapor passage 152a where the bending line BL is not located. In this case, the working vapor 102a can be diffused from the non-bent vapor passage 152a to the bent vapor passage 152a, and the bent vapor passage 152a can be effectively utilized as a vapor passage. Also, while the electronic device D has stopped generating heat, the communication groove 136 can store the working liquid 102b by capillary force. Also, the communication groove 136 may be provided continuously in the X direction, or may be provided discretely and partially in the X direction. In this case, the above effects can be obtained while suppressing a decrease in the mechanical strength of the vapor chamber 101.

[0312] Also, in the above-described fourth embodiment, as shown in FIG. 56, the width ww6a of the opening of the vapor passage 152a where the bending line BL is located may be larger than the width ww6b of the vapor passage 152a where the bending line BL is not located. Here, the widths ww6a and ww6b of the opening of the vapor passage 152a are the dimensions of the opening of the vapor passage 152a in the Y direction, and mean the dimensions on the first main body surface 131a or the second main body surface 131b. As shown in FIG. 56, the width ww6a of the opening of the first vapor flow path recess 153 of the vapor passage 152a where the bending line BL is located may be larger than the width ww6b of the opening of the first vapor flow path recess 153 of the vapor passage 152a where the bending line BL is not located. Although not shown, the width of the opening of the second vapor flow path recess 154 of the vapor passage 152a where the bending line BL is located may be larger than the width of the opening of the second vapor flow path recess 154 of the vapor passage 152a where the bending line BL is not located. In this case, while suppressing heat transfer through the bent portion BP, the flow cross-sectional area of the vapor passage 152a at the bent portion BP can be ensured, and an increase in the pressure loss of the working vapor 102a in the vapor passage 152a can be suppressed. Therefore, a decrease in the heat transport capacity of the vapor chamber 101 can be suppressed.

[0313] Also, in the above-described fourth embodiment, an example in which the vapor chamber 101 is bent at the position where the vapor passage 152a is disposed has been described (see FIG. 44). However, the present invention is not limited to this, and as shown in FIG. 57, the vapor chamber 101 may be bent at the position where the liquid flow path portion 160 is disposed.

[0314] In the example shown in FIG. 57, the bending line BL overlaps one of the plurality of land portions 133. For this reason, the vapor chamber 101 is bent at the position where the liquid flow path portion 160 is disposed.

[0315] In this case, at the bent portion BP, the liquid flow path portion 160 provided in the land portion 133 may be crushed, and the flow cross-sectional area of the liquid flow path portion 160 may become narrow. As a result, the reciprocation of the working liquid 102b between the first region RR1 and the second region RR2 is suppressed.

[0316] The other configurations of the vapor chamber 101 are the same as those of the fourth embodiment described above.

[0317] According to the modification shown in FIG. 57, the vapor chamber 101 is bent at the position where the liquid flow path portion 160 is disposed. By this, at the bent portion BP, the capillary force of the liquid flow path portion 160 can be increased. In particular, in the bent liquid flow path portion 160, due to the deformation of the cross section, there are portions that are thinner and portions with a smaller cross-sectional area than other non-bent portions, and thus the capillary force can be increased in these portions. Therefore, the working fluid 102b condensed at the bent portion BP can be quickly recovered.

[0318] Further, the bent liquid flow path portion 160 is more likely to collect the working fluid 102b than other non-bent portions. Therefore, the working fluid 102b can be distributed to a region where the working fluid 102b is likely to be insufficient through the bent liquid flow path portion 160. By this, uneven distribution of the working fluid 102b in each region RR1, RR2 can be suppressed. Therefore, the vapor chamber 101 can be made isothermal in each region RR1, RR2.

[0319] Further, according to the modification shown in FIG. 57, since the vapor chamber 101 is bent at the position where the liquid flow path portion 160 is disposed, an increase in the pressure loss of the working vapor 102a in the vapor passage 152a can be suppressed. Therefore, while suppressing heat transfer through the bent portion BP, a decrease in the heat transport capacity of the entire vapor chamber 101 can be suppressed. It is important to arrange more flow paths in the limited space for the vapor chamber 101. In particular, since the vapor passage 152a is a passage through which the working vapor 102a flows, that is, a passage for transporting heat, it is desirable to arrange as many as possible. According to the modification shown in FIG. 57, more vapor passages 152a can be secured in the limited space. Also, the region of the vapor chamber 101 can be effectively utilized, and the space saving of the vapor chamber 101 can be achieved.

[0320] Also, in the modification shown in FIG. 57, as shown in FIG. 58, when the liquid flow path portion 160 is provided on the side of the second sheet 120 located inside the bend, that is, when the liquid flow path portion 160 is provided on the second main body surface 131b of the land portion 133, the width ww3a of the main liquid flow path groove 161 provided in the land portion 133 where the bend line BL is located may be smaller than the width ww3b of the main liquid flow path groove 161 provided in the land portion 133 where the bend line BL is not located. That is, the width ww3a of the main liquid flow path groove 161 in the bent portion BP may be smaller than the width ww3b of the main liquid flow path groove 161 in the first region RR1 and the second region RR2. The same applies to the width of the liquid flow path connection groove 165. In this case, in the bent portion BP, the capillary force of the liquid flow path portion 160 can be increased. Therefore, the condensed working fluid 102b can be efficiently moved from the vapor passage 152a to the liquid flow path portion 160. Also, when the second sheet 120 is pressed from the outside, it is possible to suppress the main liquid flow path groove 161 and the liquid flow path connection groove 165 from being crushed.

[0321] Also, as shown in FIG. 58, in the bent portion BP, the second sheet 120 may be recessed toward the liquid flow path portion 160. The amount of recess of the second sheet 120 in this bent portion BP may be larger than the amount of recess of the second sheet 120 in the first region RR1 and the second region RR2. The amount of recess of the second sheet 120 in the first region RR1 and the second region RR2 may be zero. That is, in the first region RR1 and the second region RR2, the second sheet 120 does not have to be recessed toward the liquid flow path portion 160. In this case, in the bent portion BP, the angle formed by the inner surface 120a of the second sheet and the wall surface 162 of the main liquid flow path groove 161 can be made smaller. Also, the angle formed by the inner surface 120a of the second sheet and the wall surface of the liquid flow path connection groove 165 can be made smaller. As a result, the capillary force of the liquid flow path portion 160 can be increased. Therefore, the condensed working fluid 102b can be smoothly transported toward the evaporation region SR.

[0322] Further, in the modification shown in FIG. 57, as shown in FIG. 59, the liquid flow path portion 160 may be provided on the side of the first sheet 110 located on the outer side of the bend. That is, the liquid flow path portion 160 may be provided on the first main body surface 131a of the land portion 133. In this case, as shown in FIG. 59, the width ww3c of the main liquid flow path groove 161 provided in the land portion 133 where the bend line BL is located may be larger than the width ww3d of the main liquid flow path groove 161 provided in the land portion 133 where the bend line BL is not located. That is, the width ww3c of the main liquid flow path groove 161 in the bent portion BP may be larger than the width ww3d of the main liquid flow path groove 161 in the first region RR1 and the second region RR2. The same applies to the width of the liquid flow path connection groove 165. Also, the depth hh3c of the main liquid flow path groove 161 provided in the land portion 133 where the bend line BL is located may be shallower than the depth hh3d of the main liquid flow path groove 161 provided in the land portion 133 where the bend line BL is not located. That is, the depth hh3c of the main liquid flow path groove 161 in the bent portion BP may be larger than the depth hh3d of the main liquid flow path groove 161 in the first region RR1 and the second region RR2. The same applies to the depth of the liquid flow path connection groove 165. In this case, in the bent portion BP, the angle formed by the inner surface 110b of the first sheet and the wall surface 162 of the main liquid flow path groove 161 can be made smaller. Also, the angle formed by the inner surface 110b of the first sheet and the wall surface of the liquid flow path connection groove 165 can be made smaller. As a result, the capillary force of the liquid flow path portion 160 can be increased. Therefore, the condensed working fluid 102b can be smoothly transported toward the evaporation region SR.

[0323] Also, as shown in FIG. 59, in the bent portion BP, the first sheet 110 may be recessed toward the liquid flow path portion 160. The amount of recess of the first sheet 110 in the bent portion BP may be larger than the amount of recess of the first sheet 110 in the first region RR1 and the second region RR2. The amount of recess of the first sheet 110 in the first region RR1 and the second region RR2 may be zero. That is, in the first region RR1 and the second region RR2, the first sheet 110 may not be recessed toward the liquid flow path portion 160. In this case, in the bent portion BP, the angle formed by the inner surface 110b of the first sheet and the wall surface 162 of the main flow groove 161 of the liquid flow path can be reduced. Also, the angle formed by the inner surface 110b of the first sheet and the wall surface of the communication groove 165 of the liquid flow path can be reduced. As a result, the capillary force of the liquid flow path portion 160 can be increased. Therefore, the condensed working fluid 102b can be smoothly transported toward the evaporation region SR.

[0324] Also, in the modification shown in FIG. 57, as shown in FIG. 60, a liquid flow path portion 160 may be provided on the second main body surface 131b of the land portion 133, or a liquid flow path portion 160 may be provided on the first main body surface 131a of the land portion 133. In this case, as shown in FIG. 60, similar to the example shown in FIG. 58, the width ww3a of the main liquid flow path groove 161 may be smaller than the width ww3b of the main liquid flow path groove 161. The same applies to the width of the liquid flow path connection groove 165. Also, in the bent portion BP, the second sheet 120 may be recessed toward the liquid flow path portion 160. Also, similar to the example shown in FIG. 59, the width ww3c of the main liquid flow path groove 161 may be larger than the width ww3d of the main liquid flow path groove 161. The same applies to the width of the liquid flow path connection groove 165. The depth hh3c of the main liquid flow path groove 161 may be shallower than the depth hh3d of the main liquid flow path groove 161. The same applies to the depth of the liquid flow path connection groove 165. Also, in the bent portion BP, the first sheet 110 may be recessed toward the liquid flow path portion 160. In this case, both the effects of the example shown in FIG. 58 and the effects of the example shown in FIG. 59 can be obtained. In the example shown in FIG. 60, the flow path cross-sectional area of the liquid flow path portion 160 provided on the first main body surface 131a may be larger than the flow path cross-sectional area of the liquid flow path portion 160 provided on the second main body surface 131b. The liquid flow path portion 160 provided on the first main body surface 131a may function as a liquid storage portion while the electronic device D has stopped generating heat. In this case, since the capillary force of the liquid flow path portion 160 is increased, the working liquid 102b can be easily drawn into the liquid flow path portion 160 provided on the first main body surface 131a serving as the liquid storage portion.

[0325] Also, as shown in FIGS. 61 and 62, when the liquid flow path portion 160 is provided on the second main body surface 131b of the land portion 133 and the liquid flow path portion 160 is also provided on the first main body surface 131a of the land portion 133, a communication path 180 may be provided to communicate the liquid flow path portion 160 provided on the second main body surface 131b with the liquid flow path portion 160 provided on the second main body surface 131b. As shown in FIG. 62, the communication path 180 may extend straight in the Z direction and penetrate the land portion 133. The communication path 180 may be provided at any position of the land portion 133. As shown in FIG. 61, the communication path 180 may be provided at a position overlapping the main liquid flow path groove 161 in plan view. The communication path 180 may connect the main liquid flow path groove 161 on the second main body surface 131b and the main liquid flow path groove 161 on the second main body surface 131b. Also, although not shown, the communication path 180 may be provided at a position overlapping the liquid flow path connection groove 165 in plan view. The communication path 180 may connect the liquid flow path connection groove 165 on the second main body surface 131b and the liquid flow path connection groove 165 on the second main body surface 131b. By providing the communication path 180, for example, even when the working fluid 102b is difficult to flow at a position other than the bending line BL of one of the liquid flow path portions 160, the working fluid 102b can flow through the communication path 180 to the other liquid flow path portion 160. Therefore, the working fluid 102b can be smoothly transported toward the evaporation region SR. Also, the retention of the working fluid 102b at the bending portion BP can be suppressed, and the temperature rise of the bending portion BP can be suppressed. For this reason, a decrease in the heat transfer suppression effect through the bending portion BP can be suppressed.

[0326] Also, in the above-described fourth embodiment, an example in which the planar shape of the vapor chamber 101 is a rectangular shape has been described (see FIGS. 40 and 44). However, the present invention is not limited to this, and the planar shape of the vapor chamber 101 is arbitrary. For example, as shown in FIG. 63, the planar shape of the vapor chamber 101 may be a shape combining two rectangular shapes.

[0327] In the example shown in FIG. 63, the vapor chamber 101 has a first portion 101a and a second portion 101b having a rectangular shape. The planar area of the second portion 101b is smaller than the planar area of the first portion 101a. The second portion 101b is provided so as to protrude from a part (right half) on the positive X-direction side (right side in FIG. 63) of the first portion 101a toward the positive Y-direction side (upper side in FIG. 63). The frame portion 132 is provided at the periphery of the region composed of the first portion 101a and the second portion 101b. A plurality of land portions 133 are provided within the frame portion 132.

[0328] The plurality of land portions 133 include a plurality of first land portions 133a, a plurality of second land portions 133b, and a plurality of third land portions 133c.

[0329] Each of the first land portions 133a is located in the first portion 101a. Each of the first land portions 133a extends in the X direction, is spaced apart in the Y direction, and is arranged parallel to each other. In the example shown in FIG. 63, five first land portions 133a are provided.

[0330] Each of the second land portions 133b is located in the second portion 101b. Each of the second land portions 133b extends in the X direction, is spaced apart in the Y direction, and is arranged parallel to each other. In the example shown in FIG. 63, three second land portions 133b are provided. The dimension of the second land portion 133b in the X direction is smaller than the dimension of the first land portion 133a in the X direction. Also, as shown in FIG. 63, the dimensions of the second land portions 133b in the X direction may be different from each other.

[0331] Each third land portion 133c connects the first land portion 133a and the second land portion 133b. Each third land portion 133c extends in the Y direction, is spaced apart in the X direction, and is arranged parallel to each other. In the example shown in FIG. 63, three third land portions 133c are provided. As shown in FIG. 63, each third land portion 133c may be connected to the edge on the negative X side (the left side in FIG. 63) of the corresponding second land portion 133b. Also, each third land portion 133c may be connected to the first land portion 133a that is located on the most positive Y side (the upper side in FIG. 63) among the plurality of first land portions 133a.

[0332] The first land portion 133a, the second land portion 133b, and the third land portion 133c are each provided with a liquid flow path portion 160. The liquid flow path portion 160 of the first land portion 133a communicates with the liquid flow path portion 160 of the third land portion 133c, and the liquid flow path portion 160 of the third land portion 133c communicates with the liquid flow path portion 160 of the second land portion 133b.

[0333] The second vapor passage 152 includes a vapor passage 152a extending in the first direction and a vapor passage 152b extending in a second direction orthogonal to the first direction. In the illustrated example, the first direction is the X direction. That is, the vapor passage 152a extends in the X direction, and the vapor passage 152b extends in the Y direction. The vapor passage 152a is provided between each of the first land portions 133a, between each of the second land portions 133b, and between the first land portion 133a and the second land portion 133b. The vapor passage 152b is provided between each of the third land portions 133c.

[0334] In the example shown in FIG. 63, the bending line BL is provided at the boundary between the first portion 101a and the second portion 101b of the vapor chamber 101. For this reason, the first region RR1 is located in the first portion 101a of the vapor chamber 101, and the second region RR2 is located in the second portion 101b of the vapor chamber 101.

[0335] Also, in the example shown in FIG. 63, a first evaporation region SR1 is provided in the first region RR1 of the vapor chamber 101, and a second evaporation region SR2 is provided in the second region RR2 of the vapor chamber 101. More specifically, the first evaporation region SR1 is formed on the positive X-direction side (the right side in FIG. 63) of the first region RR1 of the vapor chamber 101. That is, the first device D1 is attached to the positive X-direction side of the first region RR1. Also, the second evaporation region SR2 is formed on the positive X-direction side of the second region RR2 of the vapor chamber 101. That is, the second device D2 is attached to the positive X-direction side of the second region RR2. Further, a first condensation region CR1 is formed on the negative X-direction side (the left side in FIG. 63) of the first region RR1 of the vapor chamber 101. Also, a second condensation region CR2 is formed on the negative X-direction side of the second region RR2 of the vapor chamber 101.

[0336] Also, in the example shown in FIG. 63, the bending line BL extends in a direction parallel to the first direction in which the vapor passage 152a extends. For this reason, the vapor chamber 101 is bent along a direction parallel to the first direction.

[0337] Also, in the example shown in FIG. 63, the vapor chamber 101 is bent at the position where the vapor passage 152a is disposed. That is, the vapor chamber 101 is bent along the vapor passage 152a.

[0338] Other configurations of the vapor chamber 101 are the same as those in the fourth embodiment described above.

[0339] According to the modification shown in FIG. 63, the vapor chamber 101 is bent at the position where the vapor passage 152a is disposed. Thereby, the pressure loss of the working vapor 102a in the vapor passage 152a at the bent portion BP can be increased. Thereby, the reciprocation of the working vapor 102a between the first region RR1 and the second region RR2 can be suppressed at the bent portion BP. For this reason, heat transfer through the bent portion BP can be further suppressed.

[0340] Also, according to the modification example shown in FIG. 63, while suppressing the reciprocation of the working vapor 102a between the first region RR1 and the second region RR2, the reciprocation of the working vapor 102a between the first region RR1 and the second region RR2 can be enabled. As a result, for example, the heat of the second device D2 can also be transferred to the first region RR1, and the first condensation region CR1 can be utilized as a condensation region for the working vapor 102a from the second evaporation region SR2. Therefore, an efficient heat dissipation design can be enabled, and the vapor chamber 101 can be made more space-saving.

[0341] Also, in the modification example shown in FIG. 63, an example in which the vapor chamber 101 is bent at the position where the vapor passage 152a is arranged has been described. However, it is not limited to this. As shown in FIG. 64, the vapor chamber 101 may be bent at the position where the liquid flow path portion 160 is arranged.

[0342] In the example shown in FIG. 64, one of the plurality of land portions 133 is provided at the boundary between the first portion 101a and the second portion 101b. And this land portion 133 is located on the bending line BL. Therefore, the vapor chamber 101 is bent at the position where the liquid flow path portion 160 is arranged.

[0343] In this case, at the bent portion BP, the liquid flow path portion 160 provided in the land portion 133 may be crushed, and the flow path cross-sectional area of the liquid flow path portion 160 may become narrow. As a result, the reciprocation of the working liquid 102b between the first region RR1 and the second region RR2 is suppressed.

[0344] Other configurations of the vapor chamber 101 are the same as those in the modification example shown in FIG. 63.

[0345] According to the modification shown in FIG. 64, the vapor chamber 101 is bent at the position where the liquid flow path portion 160 is disposed. As a result, the capillary force of the liquid flow path portion 160 can be increased at the bent portion BP. In particular, in the bent liquid flow path portion 160, due to the deformation of the cross section, there are portions that are thinner and portions with a smaller cross-sectional area than other non-bent portions, so the capillary force can be increased at these portions. Therefore, the working liquid 102b condensed at the bent portion BP can be quickly recovered.

[0346] Further, the bent liquid flow path portion 160 is more likely to collect the working liquid 102b than other non-bent portions. Therefore, the working liquid 102b can be distributed to a region where the working liquid 102b is likely to be insufficient through the bent liquid flow path portion 160. As a result, uneven distribution of the working liquid 102b in each region RR1, RR2 can be suppressed. Therefore, the vapor chamber 101 can be made isothermal in each region RR1, RR2.

[0347] Further, according to the modification shown in FIG. 64, since the vapor chamber 101 is bent at the position where the liquid flow path portion 160 is disposed, an increase in the pressure loss of the working vapor 102a in the vapor passage 152a can be suppressed. Therefore, while suppressing heat transfer through the bent portion BP, a decrease in the heat transport capacity of the entire vapor chamber 101 can be suppressed. It is important to arrange more flow paths in the limited space for the vapor chamber 101. In particular, since the vapor passage 152a is a passage through which the working vapor 102a flows, that is, a passage for transporting heat, it is desirable to arrange as many as possible. According to the modification shown in FIG. 64, more vapor passages 152a can be secured in the limited space. In addition, the region of the vapor chamber 101 can be effectively utilized, and the space saving of the vapor chamber 101 can be achieved.

[0348] Also, according to the modified example shown in FIG. 64, while suppressing the reciprocation of the working steam 102a between the first region RR1 and the second region RR2, it is possible to enable the reciprocation of the working steam 102a between the first region RR1 and the second region RR2. As a result, for example, the heat of the second device D2 can also be transmitted to the first region RR1, and the first condensation region CR1 can be used as a condensation region for the working steam 102a from the second evaporation region SR2. Therefore, an efficient heat dissipation design can be enabled, and the space saving of the vapor chamber 101 can be achieved.

[0349] Also, in the modified example shown in FIG. 63, an example in which the vapor chamber 101 is bent at the position where the steam passage 152a is arranged has been described. However, it is not limited to this. As shown in FIG. 65, the vapor chamber 101 may be bent at the position where the reinforcing portion 138 is arranged.

[0350] In the example shown in FIG. 65, the main body sheet 130 has a reinforcing portion 138 extending inward from the frame portion 132. The steam flow path portion 150 and the liquid flow path portion 160 are not arranged in the reinforcing portion 138. The reinforcing portion 138 is a portion where the material of the main body sheet 130 remains without being etched in the etching process. The frame portion 132 and the reinforcing portion 138 may be formed continuously. The first main body surface 131a of the frame portion 132 of the main body sheet 130 and the first main body surface 131a of the reinforcing portion 138 of the main body sheet 130 may be located on the same plane. Also, the second main body surface 131b of the frame portion 132 of the main body sheet 130 and the second main body surface 131b of the reinforcing portion 138 of the main body sheet 130 may be located on the same plane. As shown in FIG. 65, the planar shape of the reinforcing portion 138 may be an elongated rectangular shape extending in the X direction. The reinforcing portion 138 may be provided so as to protrude from the portion located on the positive X direction side (the right side in FIG. 65) of the frame portion 132 toward the negative X direction side (the left side in FIG. 65). Also, the reinforcing portion 138 may be provided between the above-described first land portion 133a and the above-described second land portion 133b.

[0351] Also, in the example shown in FIG. 65, the bending line BL overlaps with the reinforcing portion 138. Therefore, the vapor chamber 101 is bent at the position where the reinforcing portion 138 is disposed.

[0352] Other configurations of the vapor chamber 101 are the same as those in the modification shown in FIG. 63.

[0353] According to the modification shown in FIG. 65, the vapor chamber 101 is bent at the position where the reinforcing portion 138 is disposed. Thus, at the bent portion BP, due to the presence of the reinforcing portion 138, the flow of the working vapor 102a and the working liquid 102b between the first region RR1 and the second region RR2 can be further suppressed. Heat transfer at the reinforcing portion 138 is performed by heat transfer of the material of the main body sheet 130. For example, when the material of the main body sheet 130 is copper, its thermal conductivity is about 400 W / (m·K), and in the vapor chamber 101, an equivalent thermal conductivity more than 10 times that can be expected. Therefore, the thermal conductivity of the reinforcing portion 138 becomes relatively small. For this reason, in the bent vapor chamber 101, heat transfer through the bent portion BP can be further suppressed.

[0354] Also, according to the modification shown in FIG. 65, due to the presence of the reinforcing portion 138, the mechanical strength of the vapor chamber 101 at the bent portion BP can be improved. Also, although the inside of the vapor chamber 101 is hollow, due to the presence of such a reinforcing portion 138, many bulk portions can be left inside the vapor chamber 101, and the mechanical strength of the vapor chamber 101 can be improved.

[0355] Also, according to the modification shown in FIG. 65, since the vapor chamber 101 is bent at the position where the reinforcing portion 138 is disposed, deformation of the vapor passage 152a and the liquid flow path portion 160 can be suppressed. Therefore, while suppressing heat transfer through the bent portion BP, a decrease in the heat transport capacity of the vapor chamber 101 can be suppressed.

[0356] Also, according to the modification example shown in FIG. 65, while suppressing the reciprocation of the working vapor 102a between the first region RR1 and the second region RR2, it is possible to enable the reciprocation of the working vapor 102a between the first region RR1 and the second region RR2. Thus, for example, the heat of the second device D2 can also be transferred to the first region RR1, and the first condensation region CR1 can be used as the condensation region of the working vapor 102a from the second evaporation region SR2. Therefore, an efficient heat dissipation design can be enabled, and the space saving of the vapor chamber 101 can be achieved.

[0357] Also, in the modification example shown in FIG. 65, an example in which the planar shape of the vapor chamber 101 is a shape combining two rectangular shapes has been described. However, it is not limited to this, and the planar shape of the vapor chamber 101 is arbitrary. For example, as shown in FIG. 66, the planar shape of the vapor chamber 101 may be a rectangular shape. Also, in this case, as shown in FIG. 66, the main body sheet 130 may have a reinforcing portion 138, and the bending line BL may overlap the reinforcing portion 138. That is, the vapor chamber 101 may be bent at the position where the reinforcing portion 138 is arranged.

[0358] In the example shown in FIG. 66, the reinforcing portion 138 is located between the first region RR1 and the second region RR2. As shown in FIG. 66, the planar shape of the reinforcing portion 138 may be an elongated rectangular shape extending in the X direction. The reinforcing portion 138 may extend from the portion located on the positive X side (the right side in FIG. 65) of the frame body portion 132 to the portion located on the negative X side (the left side in FIG. 65). In the example shown in FIG. 66, the first region RR1 and the second region RR2 are separated by the reinforcing portion 138. That is, due to the presence of the reinforcing portion 138, the working vapor 102a and the working liquid 102b do not reciprocate between the first region RR1 and the second region RR2. Each region RR1, RR2 can function as if they were independent vapor chambers.

[0359] According to the modified example shown in FIG. 66, since the first region RR1 and the second region RR2 are separated by the reinforcing portion 138, heat transfer through the bending portion BP can be further suppressed. Further, due to the presence of such a bending portion BP, the mechanical strength of the vapor chamber 101 can be further improved. Further, since a single vapor chamber 101 can be provided with the functions of a plurality of vapor chambers 101, the manufacturing cost of the vapor chamber 101 can be reduced as compared with the case of manufacturing a plurality of vapor chambers 101.

[0360] Further, in the modified examples shown in FIGS. 65 and 66, in the bending portion BP, a main body surface recess 182 may be formed in the first main body surface 131a or the second main body surface 131b of the reinforcing portion 138. In the examples shown in FIGS. 67 and 68, the main body surface recess 182 is formed in the second main body surface 131b of the reinforcing portion 138.

[0361] The main body surface recess 182 may be formed in a concave shape in the second main body surface 131b of the reinforcing portion 138. The main body surface recess 182 may have an arbitrary planar shape. For example, as shown in FIG. 67, the main body surface recess 182 may be formed in a pore shape having a circular (true circle, ellipse, etc.) planar shape. Further, for example, as shown in FIG. 68, the main body surface recess 182 may be formed in a groove shape extending in the X direction. Further, as shown in FIGS. 67 and 68, a plurality of main body surface recesses 182 may be arranged along the X direction. As shown in FIGS. 67 and 68, the plurality of main body surface recesses 182 overlap the bending line BL in plan view. That is, the plurality of main body surface recesses 182 are arranged along the bending line BL. In other words, each main body surface recess 182 is formed at a position overlapping the bending line BL in plan view.

[0362] The main body surface recess 182 may be formed by etching the main body sheet 130 in the etching step of the manufacturing method of the vapor chamber 101 described above. The main body surface recess 182 is visible from the outside through the first sheet 110 or the second sheet 120 when the vapor chamber 101 is viewed in plan view. For this reason, the main body surface recess 182 functions as a mark at the bending position of the vapor chamber 101 in the bending step of the manufacturing method of the vapor chamber 101 described above. That is, in the bending step, by bending the vapor chamber 101 along the main body surface recess 182, a vapor chamber 101 bent along the bending line BL can be obtained.

[0363] According to the modified examples shown in FIGS. 67 and 68, by bending the vapor chamber 101 along the main body surface recess 182, a vapor chamber 101 bent along the bending line BL can be obtained. Thereby, the bending workability can be improved. Further, since the main body surface recess 182 is formed in a pore shape or a groove shape, the vapor chamber 1 can be easily bent. For this reason, the manufacture of the bent vapor chamber 101 can be facilitated. In particular, when the main body surface recess 182 is formed in the second main body surface 131b of the reinforcing portion 138, it is facilitated to bend the vapor chamber 101 so that the second sheet 120 is located inside the bend.

[0364] Note that the main body surface recess 182 may be formed in the first main body surface 131a of the reinforcing portion 138. In this case, it is facilitated to bend the vapor chamber 101 so that the first sheet 110 is located inside the bend. Further, the main body surface recess 182 may be formed in both the first main body surface 131a and the second main body surface 131b of the reinforcing portion 138. In this case, it is facilitated to bend the vapor chamber 101 to either side.

[0365] Further, in the modification shown in FIG. 65, in the bent portion BP, a main body surface recess 182 may be formed at a position where the liquid flow path portion 160 of the land portion 133 is not provided. For example, when the liquid flow path portion 160 is provided on the second main body surface 131b of the land portion 133, the main body surface recess 182 may be formed on the first main body surface 131a of the land portion 133. Further, for example, when the liquid flow path portion 160 is provided on the first main body surface 131a of the land portion 133, the main body surface recess 182 may be formed on the second main body surface 131b of the land portion 133. Further, for example, when the liquid flow path portion 160 is provided on both the first main body surface 131a and the second main body surface 131b of the land portion 133, the main body surface recess 182 may be formed at an arbitrary position where the liquid flow path portion 160 is not provided on the first main body surface 131a or the second main body surface 131b of the land portion 133. Further, the main body surface recess 182 may be formed on both the first main body surface 131a and the second main body surface 131b of the land portion 133. As shown in FIG. 69, the main body surface recess 182 may be formed in the reinforcing portion 138, and the main body surface recess 182 may also be formed in the land portion 133. The plurality of main body surface recesses 182 may be arranged along the X direction, and each main body surface recess 182 may overlap the bending line BL in plan view.

[0366] According to the modification shown in FIG. 69, since the main body surface recess 182 is also formed in the land portion 133, the bending workability can be further improved. Further, the vapor chamber 101 can be bent more easily. Therefore, the manufacturing of the bent vapor chamber 101 can be further facilitated.

[0367] Even when the vapor chamber 101 does not have the reinforcing portion 138, the main body surface recess 182 may be formed in the land portion 133. As in the modified example shown in FIG. 57, when the vapor chamber 101 is bent at the position where the liquid flow path portion 160 is arranged, and the liquid flow path portion 160 is provided on the second main body surface 131b of the land portion 133, as shown in FIG. 70, the main body surface recess 182 may be formed in the first main body surface 131a of the land portion 133. As shown in FIG. 70, a plurality of main body surface recesses 182 may be arranged along the X direction, and each main body surface recess 182 may overlap the bending line BL in plan view.

[0368] Also in the modified example shown in FIG. 70, since the main body surface recess 182 is formed in the land portion 133, the bending workability can be improved. Also, the vapor chamber 101 can be easily bent. Therefore, the manufacture of the bent vapor chamber 101 can be facilitated.

[0369] Also, in the modified example shown in FIG. 63, an example in which the vapor chamber 101 is bent at the position where the vapor passage 152a is arranged has been described. However, it is not limited to this. As shown in FIG. 71, the vapor chamber 101 may be bent at the position where the space portion 139 is arranged.

[0370] In the example shown in FIG. 71, the main body sheet 130 has a space portion 139 provided between a first region RR1 and a second region RR2. The vapor flow path portion 150 and the liquid flow path portion 160 are not arranged in the space portion 139. The space portion 139 is continuous with the space outside the vapor chamber 101 and constitutes a part of the space outside the vapor chamber 101. As shown in FIG. 71, the planar shape of the space portion 139 may be an elongated rectangular shape extending in the X direction. The space portion 139 may be provided between the above-described first land portion 133a and the above-described second land portion 133b. In other words, the space portion 139 may be formed by the portion of the frame body portion 132 located on the positive X side (the right side in FIG. 71) being recessed toward the negative X side (the left side in FIG. 71) between the first land portion 133a and the second land portion 133b.

[0371] Further, in the example shown in FIG. 71, a bending line BL (or its extension line) overlaps the space portion 139. For this reason, the vapor chamber 101 is bent at the position where the space portion 139 is arranged.

[0372] Other configurations of the vapor chamber 101 are the same as those in the modified example shown in FIG. 63.

[0373] According to the modified example shown in FIG. 71, the vapor chamber 101 is bent at the position where the space portion 139 is arranged. As a result, in the bent portion BP, due to the presence of the space portion 139, the flow of the working vapor 102a and the working liquid 102b between the first region RR1 and the second region RR2 can be further suppressed. For this reason, in the bent vapor chamber 101, heat transfer through the bent portion BP can be further suppressed.

[0374] Further, according to the modified example shown in FIG. 71, since the vapor chamber 101 is bent at the position where the space portion 139 is arranged, the vapor chamber 101 can be easily bent in the bending process of the vapor chamber 101. For this reason, the manufacture of the bent vapor chamber 101 can be facilitated.

[0375] Also, according to the modification shown in FIG. 71, since the vapor chamber 101 is bent at the position where the space portion 139 is disposed, deformation of the vapor passage 152a and the liquid flow path portion 160 can be suppressed. Therefore, it is possible to suppress a decrease in the heat transport capacity of the vapor chamber 101 while suppressing heat transfer through the bent portion BP.

[0376] Also, according to the modification shown in FIG. 71, another member can be disposed in the space portion 139, and the region inside the housing H can be effectively utilized. For example, a protrusion for positioning the vapor chamber 101 can be disposed in the space portion 139. In this case, positioning when disposing the vapor chamber 101 inside the housing H can be easily performed. Also, for example, wiring such as that of a device can be passed through the space portion 139. In this case, the length of the wiring can be shortened, and signal loss can be reduced.

[0377] Also, according to the modification shown in FIG. 71, it is possible to allow the working vapor 102a to travel between the first region RR1 and the second region RR2 while suppressing the travel of the working vapor 102a between the first region RR1 and the second region RR2. As a result, for example, the heat of the second device D2 can also be transferred to the first region RR1, and the first condensation region CR1 can be used as a condensation region for the working vapor 102a from the second evaporation region SR2. Therefore, an efficient heat dissipation design can be enabled, and the vapor chamber 101 can be made more space-saving.

[0378] Also, in the above-described fourth embodiment, an example in which the first evaporation region SR1 is provided in the first region RR1 of the vapor chamber 101 and the second evaporation region SR2 is provided in the second region RR2 of the vapor chamber 101 has been described (see FIGS. 40 and 44). However, the present invention is not limited to this, and the evaporation region SR may be provided in either the first region RR1 or the second region RR2.

[0379] In the example shown in FIG. 72, an evaporation region SR is provided in the first region RR1, and no evaporation region SR is provided in the second region RR2. More specifically, an evaporation region SR is formed on the positive X side (the right side in FIG. 72) of the first region RR1 of the vapor chamber 101. That is, the device D is attached to the positive X side of the first region RR1. Further, a condensation region CR is formed around the evaporation region SR. More specifically, a condensation region CR is formed on the negative X side (the left side in FIG. 72) of the first region RR1 of the vapor chamber 101. Also, a condensation region CR is formed in the second region RR2 of the vapor chamber 101.

[0380] Other configurations of the vapor chamber 101 are the same as those in the fourth embodiment described above.

[0381] According to the modification shown in FIG. 72, an evaporation region SR is provided in the first region RR1, and no evaporation region SR is provided in the second region RR2. Even in such a case, in the bent portion BP, the flow of the working vapor 2a between the first region RR1 and the second region RR2 can be suppressed. Therefore, in the bent vapor chamber 101, heat transfer through the bent portion BP can be suppressed.

[0382] Also, according to the modification shown in FIG. 72, heat transfer from the first region RR1 to the second region RR2 can be suppressed, and the second region RR2 can be prevented from becoming high temperature. Therefore, for example, when the housing member Ha attached to the second region RR2 is close to the gripping portion of a mobile terminal or the like, heat of the device D can be prevented from being transferred to the housing member Ha and the gripping portion from becoming high temperature.

[0383] In addition, in the modification shown in FIG. 63, an example was described in which a first evaporation region SR1 is provided in the first region RR1 of the vapor chamber 101 and a second evaporation region SR2 is provided in the second region RR2 of the vapor chamber 101. However, the present invention is not limited to this. Similar to the modification shown in FIG. 72, an evaporation region SR may be provided in either the first region RR1 or the second region RR2.

[0384] In the example shown in FIG. 73, an evaporation region SR is provided in the first region RR1, and no evaporation region SR is provided in the second region RR2. More specifically, the evaporation region SR is formed on the negative X-direction side (the left side in FIG. 73) of the first region RR1 of the vapor chamber 101. That is, the device D is attached to the negative X-direction side of the first region RR1. Further, a condensation region CR is formed around the evaporation region SR. More specifically, the condensation region CR is formed on the positive X-direction side (the right side in FIG. 73) of the first region RR1 of the vapor chamber 101. Also, a condensation region CR is formed in the second region RR2 of the vapor chamber 101.

[0385] Other configurations of the vapor chamber 101 are the same as those in the modification shown in FIG. 63.

[0386] According to the modification shown in FIG. 73, an evaporation region SR is provided in the first region RR1, and no evaporation region SR is provided in the second region RR2. Even in such a case, in the bent portion BP, the flow of the working vapor 102a between the first region RR1 and the second region RR2 can be suppressed. Therefore, in the bent vapor chamber 101, heat transfer through the bent portion BP can be suppressed.

[0387] Further, according to the modification example shown in FIG. 73, heat transfer from the first region RR1 to the second region RR2 can be suppressed, and the second region RR2 can be prevented from becoming high in temperature. Therefore, for example, when the housing member Ha attached to the second region RR2 is located close to the gripping portion of a mobile terminal or the like, heat of the device D can be prevented from being transferred to the housing member Ha and the gripping portion from becoming high in temperature.

[0388] Also, in the modification example shown in FIG. 73, an example in which the plurality of land portions 133 include a plurality of first land portions 133a and a plurality of second land portions 133b extending in the X direction and a plurality of third land portions 133c extending in the Y direction has been described. However, the present invention is not limited to this, and the form and arrangement of the plurality of land portions 133 are arbitrary. For example, as shown in FIG. 74, the plurality of land portions 133 may include a plurality of first land portions 133a extending in the X direction and a plurality of second land portions 133b extending in the Y direction.

[0389] In the example shown in FIG. 74, the plurality of land portions 133 include a plurality of first land portions 133a and a plurality of second land portions 133b.

[0390] Each of the first land portions 133a is located in the first portion 101a. Each of the first land portions 133a extends in the X direction. Each of the first land portions 133a extends from the position on the negative X side (left side in FIG. 74) to the positive X side (right side in FIG. 74) of the first portion 101a in the X direction. The first land portions 133a are spaced apart from each other in the Y direction and are arranged parallel to each other. In the example shown in FIG. 74, five first land portions 133a are provided. As shown in FIG. 74, the dimensions of the first land portions 133a in the X direction may be different from each other.

[0391] Each second land portion 133b is mainly located in the second part 101b, but also extends across to the first part 101a. Each second land portion 133b extends in the Y direction. Each second land portion 133b extends from the positive Y-direction side (the upper side in FIG. 74) to the negative Y-direction side (the lower side in FIG. 74) of the second part 101b. The second land portions 133b are spaced apart in the X direction and arranged parallel to each other. In the example shown in FIG. 74, five second land portions 133b are provided. As shown in FIG. 74, the dimensions of each second land portion 133b in the Y direction may be different from each other.

[0392] In the example shown in FIG. 74, each second land portion 133b is connected to the corresponding first land portion 133a. More specifically, the edge on the negative Y-direction side (the lower side in FIG. 74) of each second land portion 133b is connected to the edge on the positive X-direction side (the right side in FIG. 74) of the corresponding first land portion 133a. Thus, the first land portion 133a and the second land portion 133b form a land portion 133 having an L-shaped planar shape.

[0393] Liquid flow path portions 160 are provided in the first land portion 133a and the second land portion 133b, respectively. The liquid flow path portion 160 in the first land portion 133a communicates with the liquid flow path portion 160 in the second land portion 133b.

[0394] The second vapor passage 152 includes a vapor passage 152a extending in the first direction and a vapor passage 152b extending in a second direction orthogonal to the first direction. In the illustrated example, the first direction is the Y direction. That is, the vapor passage 152a extends in the Y direction, and the vapor passage 152b extends in the X direction. The vapor passage 152a is provided between the second land portions 133b. The vapor passage 152b is provided between the first land portions 133a.

[0395] In the example shown in FIG. 74, the bending line BL is provided across the first portion 101a and the second portion 101b. The bending line BL extends in a direction parallel to the first direction which is the direction in which the vapor passage 152a extends. For this reason, the vapor chamber 101 is bent along a direction parallel to the first direction.

[0396] Also, in the example shown in FIG. 74, the bending line BL overlaps the vapor passage 152a provided between adjacent second land portions 133b. For this reason, the vapor chamber 101 is bent at the position where the vapor passage 152a is disposed. That is, the vapor chamber 101 is bent along the vapor passage 152a.

[0397] Other configurations of the vapor chamber 101 are the same as those of the modification shown in FIG. 73.

[0398] Also in the modification shown in FIG. 74, since the vapor chamber 101 is bent at the position where the vapor passage 152a is disposed, the pressure loss of the working vapor 102a in the vapor passage 152a at the bent portion BP can be increased. As a result, the reciprocation of the working vapor 102a between the first region RR1 and the second region RR2 can be further suppressed at the bent portion BP. For this reason, the heat transfer through the bent portion BP can be further suppressed.

[0399] Also, in the above-described fourth embodiment, an example in which the plurality of land portions 133 extend in the X direction has been described (see FIG. 44). However, the present invention is not limited to this, and the form and arrangement of the plurality of land portions 133 are arbitrary. For example, as shown in FIG. 75, the plurality of land portions 133 may include a plurality of first land portions 133a extending in the X direction, a plurality of second land portions 133b extending in the Y direction, and a plurality of third land portions 133c extending radially.

[0400] In the example shown in FIG. 75, the planar shape of the vapor chamber 101 is a rectangular shape. A first region RR1 is provided on the negative X side (the left side in FIG. 75) of the vapor chamber 101, and a second region RR2 is provided on the positive X side (the right side in FIG. 75) of the vapor chamber 101. An evaporation region SR is provided in this first region RR1. More specifically, the evaporation region SR is formed on the positive Y side (the upper side in FIG. 75) of the first region RR1. Also, a condensation region CR is formed around the evaporation region SR. More specifically, the condensation region CR is formed on the negative X side (the lower side in FIG. 75) of the first region RR1 of the vapor chamber 101. Further, the condensation region CR is formed in the second region RR2 of the vapor chamber 101.

[0401] Also, in the example shown in FIG. 75, the plurality of land portions 133 includes a plurality of first land portions 133a, a plurality of second land portions 133b, and a plurality of third land portions 133c.

[0402] Each of the first land portions 133a is located on the positive Y side (the upper side in FIG. 75) of the vapor chamber 101. Each of the first land portions 133a extends in the X direction. Each of the first land portions 133a extends from the position on the negative X side (the left side in FIG. 75) to the positive X side (the right side in FIG. 75) of the vapor chamber 101. The first land portions 133a are spaced apart in the Y direction and arranged parallel to each other. In the example shown in FIG. 75, four first land portions 133a are provided. As shown in FIG. 75, the dimensions of each of the first land portions 133a in the X direction may be different from each other.

[0403] Each second land portion 133b is located on the negative Y side (lower side in FIG. 75) of the vapor chamber 101. Each second land portion 133b extends in the Y direction. Each second land portion 133b extends in the negative Y direction so as to branch from the first land portion 133a located on the most negative Y side. Each second land portion 133b is spaced apart in the Y direction and arranged parallel to each other. In the example shown in FIG. 75, four second land portions 133b are provided.

[0404] Each third land portion 133c is located on the positive X side (right side in FIG. 75) of the vapor chamber 101. Each third land portion 133c extends radially. Each third land portion 133c extends so as to spread from the edge or any position on the positive X side of the corresponding first land portion 133a. Each third land portion 133c is arranged such that the interval between each third land portion 133c widens as it moves away from the evaporation region SR. In the example shown in FIG. 75, five third land portions 133c are provided.

[0405] Liquid flow path portions 160 are provided in the first land portion 133a, the second land portion 133b, and the third land portion 133c, respectively. The liquid flow path portion 160 of the first land portion 133a communicates with the liquid flow path portion 160 of the second land portion 133b and the liquid flow path portion 160 of the third land portion 133c, respectively.

[0406] The second vapor passage 152 includes a vapor passage 152a extending in a first direction, a vapor passage 152b extending in a second direction orthogonal to the first direction, and a vapor passage 152c extending radially. In the illustrated example, the first direction is the Y direction. That is, the vapor passage 152a extends in the Y direction, and the vapor passage 152b extends in the X direction. The vapor passage 152c extends such that its width widens as it moves away from the evaporation region SR. The vapor passage 152a is provided between each second land portion 133b. The vapor passage 152b is provided between each first land portion 133a. The vapor passage 152c is provided between each third land portion 133c.

[0407] In the example shown in FIG. 75, the bending line BL extends in a direction parallel to the first direction in which the vapor passage 152a extends. Therefore, the vapor chamber 101 is bent along the direction parallel to the first direction.

[0408] Also, in the example shown in FIG. 75, the bending line BL overlaps the vapor passage 152a provided between adjacent second land portions 133b. Therefore, the vapor chamber 101 is bent at the position where the vapor passage 152a is arranged. That is, the vapor chamber 101 is bent along the vapor passage 152a.

[0409] Other configurations of the vapor chamber 101 are the same as those in the fourth embodiment described above.

[0410] Also in the modified example shown in FIG. 75, since the vapor chamber 101 is bent at the position where the vapor passage 152a is arranged, the pressure loss of the working vapor 102a in the vapor passage 152a at the bent portion BP can be increased. As a result, the reciprocation of the working vapor 102a between the first region RR1 and the second region RR2 can be further suppressed at the bent portion BP. Therefore, the heat transfer through the bent portion BP can be further suppressed.

[0411] Also, according to the modified example shown in FIG. 75, the second vapor passage 152 includes a vapor passage 152c that extends radially. As a result, the working vapor 102a can be uniformly transported within the XY plane of the vapor chamber 101, and the heat can be uniformly spread. Therefore, the heat dissipation efficiency of the vapor chamber 101 can be improved.

[0412] In addition, in the above-described fourth embodiment, an example in which the vapor chamber 101 is bent in an L shape so that the first region RR1 and the second region RR2 are orthogonal to each other has been described (see FIG. 39). However, the present invention is not limited to this, and for example, as shown in FIG. 76, the vapor chamber 101 may be bent in a U shape so that the first region RR1 and the second region RR2 face each other. In the example shown in FIG. 76, the bent portion BP of the vapor chamber 101 is formed in a semi-circular arc shape. In this case, the degree of freedom in arranging the vapor chamber 101 in the housing H can be improved. Therefore, for example, even when the first device D1 and the second device D2 are located apart from each other, the first device D1 can be brought into thermal contact with the first region RR1 of the vapor chamber 101, and the second device D2 can be brought into thermal contact with the second region RR2 of the vapor chamber 101. As a result, it is possible to eliminate the need to prepare a plurality of vapor chambers 101. Therefore, the manufacturing cost of the vapor chamber 101 can be reduced as compared with the case of manufacturing a plurality of vapor chambers 101.

[0413] Also, in this case, as shown in FIG. 76, in the bent portion BP, the first sheet 110 may be recessed toward the vapor passage 152a. The amount of recess of the first sheet 110 in the bent portion BP may be larger than the amount of recess of the first sheet 110 in the first region RR1 and the second region RR2. The amount of recess of the first sheet 110 in the first region RR1 and the second region RR2 may be zero. That is, in the first region RR1 and the second region RR2, the first sheet 110 may not be recessed toward the vapor passage 152a. In this case, in the bent portion BP, a flow path corner portion with enhanced capillary action can be formed between the inner surface 110b of the first sheet and the wall surface 153a of the first vapor flow path recess 153. As a result, the working fluid 102b condensed in the bent portion BP can be quickly recovered. Therefore, it is possible to suppress a decrease in the heat transport capacity of the vapor chamber 101 while suppressing heat transfer through the bent portion BP.

[0414] Also, as shown in FIG. 76, in the bent portion BP, the second sheet 120 may be recessed toward the vapor passage 152a. The amount of recess of the second sheet 120 in this bent portion BP may be larger than the amount of recess of the second sheet 120 in the first region RR1 and the second region RR2. The amount of recess of the second sheet 120 in the first region RR1 and the second region RR2 may be zero. That is, in the first region RR1 and the second region RR2, the second sheet 120 may not be recessed toward the vapor passage 152a. In this case, in the bent portion BP, a flow path corner portion with enhanced capillary action can be formed between the inner surface 120a of the second sheet and the wall surface 154a of the second vapor flow path recess 154. Thereby, the working fluid 102b condensed in the bent portion BP can be quickly recovered. For this reason, while suppressing heat transfer through the bent portion BP, a decrease in the heat transport capacity of the vapor chamber 101 can be suppressed.

[0415] Also, in this case, as shown in FIGS. 76 and 77, the height hh2a of the vapor passage 152a in the bent portion BP may be smaller than the height hh2b of the main flow groove 161 of the liquid flow path in the first region RR1 and the second region RR2. Here, the heights hh2a and hh2b of the vapor passage 152a mean the minimum dimension of the vapor passage 152a in the Z direction and correspond to the minimum distance between the inner surface 110b of the first sheet and the inner surface 120a of the second sheet in the Z direction. In this case, in the bent portion BP, the flow path cross-sectional area of the vapor passage 152a can be narrowed. For this reason, the flow path resistance of the working vapor 2a in the bent portion BP can be increased, and heat transfer through the bent portion BP can be further suppressed.

[0416] Note that the height hh2a of the vapor passage 152a in the bent portion BP may be zero, but it may also not be zero. That is, a gap may be provided between the inner surface 110b of the first sheet and the inner surface 120a of the second sheet. In this case, the capillary force between the inner surface 110b of the first sheet and the inner surface 120a of the second sheet can be increased. As a result, the condensed working fluid 102b can be retained in the vapor passage 152a by the capillary force. In this case, as shown in FIG. 77, a wall LW of the condensed working fluid 102b can be formed in the vapor passage 152a. As a result, in the bent portion BP, the flow cross-sectional area of the vapor passage 152a becomes narrow, and the flow resistance of the working vapor 2a can increase. Therefore, heat transfer through the bent portion BP can be suppressed.

[0417] Also, as shown in FIG. 76, when a plurality of vapor passages 152a are located within the bent portion BP, the heights hh2a of the respective vapor passages 152a in the bent portion BP may be different from each other. Here, the end on the side of the first region RR1 of the bent portion BP is referred to as the first bent end BE1, the end on the side of the second region RR2 of the bent portion BP is referred to as the second bent end BE2, and the intermediate portion between the first bent end BE1 and the second bent end BE2 of the bent portion BP is referred to as the bent intermediate portion BM. In this case, for example, within the bent portion BP, the height hh2a of the vapor passage 152a located near the bent intermediate portion BM may be smaller than the height hh2a of the vapor passage 152a located near the first bent end BE1 and the height hh2a of the vapor passage 152a located near the second bent end BE2. That is, within the bent portion BP, the height hh2a of each vapor passage 152a may decrease as it goes from the first bent end BE1 toward the bent intermediate portion BM and increase as it goes from the bent intermediate portion BM toward the second bent end BE2. In this case, the flow resistance of the working vapor 2a in the bent intermediate portion BM can be increased, and even when the bent portion BP extends over a wide range, heat transfer through the bent portion BP can be suppressed. Also, in the bent intermediate portion BM, the capillary force between the first sheet inner surface 110b and the second sheet inner surface 120a can be increased. As a result, the condensed working fluid 102b can be retained in the vapor passage 152a by the capillary force. In this case, as shown in FIG. 77, a wall LW of the working fluid 102b condensed in the vapor passage 152a can be formed. As a result, in the bent portion BP, the flow cross-sectional area of the vapor passage 152a becomes narrow, and the flow resistance of the working vapor 2a can increase. Therefore, heat transfer through the bent portion BP can be further suppressed.

[0418] Note that, as shown in FIG. 78, even when the vapor chamber 101 is bent in an L shape such that the first region RR1 and the second region RR2 are orthogonal to each other, the vapor chamber 101 may have the same configuration as the modified example shown in FIG. 76. That is, in the bent portion BP, the first sheet 110 may be recessed toward the vapor passage 152a, and the second sheet 120 may be recessed toward the vapor passage 152a. Further, the height hh2a of the vapor passage 152a in the bent portion BP may be smaller than the height hh2a of the liquid flow path main groove 161 in the first region RR1 and the second region RR2. Also, within the bent portion BP, the height hh2a of each vapor passage 152a may decrease from the first bent end BE1 toward the bent intermediate portion BM and increase from the bent intermediate portion BM toward the second bent end BE2. Even in such a case, the same effects as those of the modified example shown in FIG. 76 can be obtained.

[0419] In the above-described fourth embodiment, an example in which the vapor chamber 101 is composed of the first sheet 110, the second sheet 120, and the main body sheet 130 has been described (see FIG. 41). However, the present invention is not limited to this, and as shown in FIG. 79, the vapor chamber 101 may be composed of the first sheet 110 and the main body sheet 130.

[0420] In the example shown in FIG. 79, the vapor chamber 101 includes the first sheet 110 and the main body sheet 130 but does not include the second sheet 120. In the example shown in FIG. 79, the main body sheet 130 and the first sheet 110 are laminated in this order. The device D may be attached to the outer surface 110a of the first sheet 110 of the first sheet. The housing member Ha may be attached to the second main surface 131b of the main body sheet 130. The heat of the working vapor 102a is transmitted from the main body sheet 130 to the housing member Ha.

[0421] In the example shown in FIG. 79, the vapor flow path portion 150 is provided on the first main body surface 131a, but does not reach the second main body surface 131b and does not penetrate the sheet main body 131 of the main body sheet 130. That is, the first vapor passage 151 and the second vapor passage 152 of the vapor flow path portion 150 are constituted by the first vapor flow path recess 153, and the second vapor flow path recess 154 is not provided in the main body sheet 130.

[0422] The thickness tt5 of the vapor chamber 101 shown in FIG. 79 may be, for example, 100 μm to 1000 μm. The thickness tt6 of the first sheet 110 shown in FIG. 79 may be, for example, 6 μm to 200 μm. The thickness tt7 of the main body sheet 130 shown in FIG. 79 may be, for example, 50 μm to 800 μm.

[0423] Note that the present invention is not limited to the example shown in FIG. 79. As shown in FIG. 80, a vapor flow path portion 150' may be provided on the first sheet inner surface 110b of the first sheet 110. As shown in FIG. 80, the vapor flow path portion 150' of the first sheet 110 may be provided at a position facing the vapor flow path portion 150 of the main body sheet 130. That is, the vapor flow path portion 150' of the first sheet 110 may have a first vapor passage 151' facing the first vapor passage 151 of the main body sheet 130 and a second vapor passage 152' facing the second vapor passage 152 of the main body sheet 130. Each dimension of the vapor flow path portion 150' of the first sheet 110 may be approximately the same as each dimension of the vapor flow path portion 150 of the main body sheet 130. The thickness tt7' of the first sheet 110 shown in FIG. 80 may be approximately the same as the thickness tt7 of the main body sheet 130. Note that, in the example shown in FIG. 80, the liquid flow path portion 160 is not provided in the first sheet 110, but the present invention is not limited to this, and the liquid flow path portion 160 may be provided in the first sheet 110.

[0424] According to the modified examples shown in FIGS. 79 and 80, the vapor chamber 101 is composed of a first sheet 110 and a main body sheet 130. Even in such a case, since the vapor chamber 101 is bent along a direction parallel to the first direction, the flow of the working vapor 102a between the first region RR1 and the second region RR2 can be suppressed at the bent portion BP. Therefore, in the bent vapor chamber 101, heat transfer through the bent portion BP can be suppressed.

[0425] Also, according to the modified examples shown in FIGS. 79 and 80, since the vapor chamber 101 is composed of the first sheet 110 and the main body sheet 130, the vapor chamber 101 can be made even thinner.

[0426] According to the embodiments described above, the performance can be improved even when bent.

[0427] The present invention is not limited to the above-described embodiments and each modified example as they are, and at the implementation stage, the components can be modified and embodied without departing from the gist thereof. Also, various inventions can be formed by appropriately combining a plurality of components disclosed in the above-described embodiments and each modified example. Some components may be deleted from all the components shown in the above-described embodiments and each modified example.

Claims

1. A vapor chamber filled with a working fluid, comprising: a body sheet including a first body surface and a second body surface located on the side opposite to the first body surface; a first sheet located on the first body surface of the body sheet; a plurality of vapor passages through which the gas of the working fluid passes and extending along a first direction; a liquid flow path portion through which the liquid of the working fluid passes in communication with the vapor passage; the body sheet includes a frame portion provided at the periphery of the body sheet and a reinforcing portion extending inward from the frame portion, the reinforcing portion being a portion where the vapor passage and the liquid flow path portion are not arranged; a vapor chamber in which a body surface recess is formed on the first body surface of the reinforcing portion.

2. The body sheet includes a land portion located between two adjacent vapor passages and extending along the first direction, and the land portion is provided with the liquid flow path portion. The vapor chamber according to claim 1, wherein a body surface recess is also formed at a position on the first body surface of the land portion where the liquid flow path portion is not provided.

3. The vapor chamber according to claim 1, which is divided into a first region and a second region by the reinforcing portion.

4. The vapor chamber according to any one of claims 1 to 3, wherein the body surface recess is also formed on the second body surface.

5. The vapor chamber according to any one of claims 1 to 3, wherein a plurality of the body surface recesses are arranged along the first direction.

6. The vapor chamber according to any one of claims 1 to 3, wherein the body surface recess is formed in a pore shape or a groove shape.

7. A vapor chamber filled with a working fluid, comprising: a body sheet including a first body surface and a second body surface located on the side opposite to the first body surface; a first sheet located on the first body surface of the body sheet; a plurality of vapor passages through which the gas of the working fluid passes and extending along a first direction; a liquid flow path portion through which the liquid of the working fluid passes in communication with the vapor passage; the body sheet includes a frame portion provided at the periphery of the body sheet and a reinforcing portion extending inward from the frame portion, the reinforcing portion being a portion where the vapor passage and the liquid flow path portion are not arranged; the vapor chamber includes a bent portion bent at a position where the reinforcing portion is arranged along a direction parallel to the first direction. In the bent portion, a vapor chamber in which a main body surface recess is formed in the first main body surface of the reinforcing portion. **Claim 8**: The main body sheet is a land portion located between two adjacent vapor passages and extending along the first direction, and includes a land portion provided with the liquid flow path portion. The vapor chamber according to claim 7, wherein in the bent portion, a main body surface recess is also formed at a position on the first main body surface of the land portion where the liquid flow path portion is not provided. **Claim 9** A housing, A device housed in the housing, An electronic device comprising the vapor chamber according to claim 1 or 2, which is in thermal contact with the device. **Claim 10** A housing, A device housed in the housing, An electronic device comprising the vapor chamber according to claim 7 or 8, which is in thermal contact with the device. **Claim 11** Comprising a plurality of the devices, The plurality of devices include a first device and a second device, The vapor chamber is divided into a first region and a second region via the bent portion, The first device is in thermal contact with the first region of the vapor chamber, The electronic device according to claim 10, wherein the second device is in thermal contact with the second region of the vapor chamber.

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