Implementation machine

Abstract

The mounting machine according to the present invention comprises: a head that has a suction nozzle and that suctions up a component at the tip of the suction nozzle to mount the component on a board; a light source that emits light, a slit with a slit hole through which light passes; a sensor that has a light receiving element that receives light that has passed through the slit hole, and that irradiates the tip of the suction nozzle with the light, receives, by using the light receiving element, the light that has passed through the slit hole, and outputs the light intensity of the received light; and a control unit that determines whether a component is suctioned at the tip of the suction nozzle through which light passes on the basis of a differentiated value obtained by differentiating the light intensity of the light. The suction nozzle has a taper that tapers toward the tip, and the slit hole is arranged non-parallel to the taper.

Description

Technical Field

[0001] The present disclosure relates to a mounting machine.

Background Art

[0002] Patent Document 1 discloses a component mounting method in which a suction nozzle holding a component at its tip is positioned at a predetermined position of component mounting device information on a worn object, the suction nozzle is lowered from the predetermined position to mount the component at the component mounting position, the holding of the component by the suction nozzle is released, and the suction nozzle is raised. The component mounting method sets a measurement position at a predetermined height position of the lifting path of the suction nozzle, measures the time from the predetermined position to the measurement position of the component or the suction nozzle when the suction nozzle is lowered and / or raised, and determines the quality of the holding state and / or mounting state of the component by the suction nozzle based on the measured time.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] In view of the above-described conventional circumstances, the present disclosure has been devised, and an object thereof is to provide a mounting machine that can acquire the suction state of a component adsorbed to a nozzle with higher accuracy.

[0005] The mounting machine according to the present disclosure has a suction nozzle, a head that sucks a component at the tip of the suction nozzle and mounts the component on a substrate, a light source that irradiates a light beam, a slit having a slit hole through which the light beam passes, and a light receiving element that receives the light beam that has passed through the slit hole, and irradiates the tip of the suction nozzle with the light beam, receives the light beam that has passed through the slit hole with the light receiving element, and outputs the light intensity of the received light beam; a sensor, differentiates the light intensity of the light beam output from the sensor to obtain a differential value, and based on the differential value, determines whether a component is adsorbed to the tip of the suction nozzle through which the light beam passes. The suction nozzle has a taper that narrows toward the tip, and the slit hole is arranged non-parallel to the taper When the control unit determines that the differential value is equal to or greater than a first threshold value and less than a second threshold value that is greater than the first threshold value, it determines that the component is adsorbed to the tip portion through which the light beam passes. is.

[0006] According to the present disclosure, it is possible to more accurately determine the adsorption state of the component adsorbed to the nozzle.

Brief Description of Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Mode for Carrying Out the Invention

[0008] (Background Leading to the Present Disclosure) Conventionally, there is a mounting machine that uses an optical sensor to detect an electronic component (hereinafter referred to as "component") adsorbed to the tip of a suction nozzle and determines whether the adsorption state of the component is good or bad. The component mounting method and apparatus thereof in Patent Document 1 (hereinafter referred to as "mounting machine") uses an optical sensor arranged so as to be able to detect a suction nozzle and a component in a range corresponding to a component mounting position on a circuit board (hereinafter referred to as "board"), and calculates a passing time during descent blocked by the suction nozzle and the component. Further, the mounting machine calculates a theoretical value of the passing time during descent based on each of the previously stored descent speed of the suction nozzle, the thickness of the component, and the offset amount of the suction nozzle, and when it is determined that (passing time during descent) ≒ (theoretical value of passing time during descent), it is determined that the component is normally adsorbed.

[0009] However, in the above-described component mounting method, the theoretical value of the passing time during descent is calculated using the offset amount of the suction nozzle stored in advance. Therefore, in the case where there is deterioration of the suction nozzle such as wear in the mounting machine, the passing time during descent becomes short, and there is a possibility that the determination accuracy of the adsorption posture of the component decreases.

[0010] Further, as another method of determining whether the adsorption state of a component is good or bad using an optical sensor, there is a method of determining the adsorption state of a component being conveyed by a suction nozzle by an optical sensor provided in the conveyance path of the component from the component supply position to the component mounting position. In the mounting machine, the light of the light source is blocked by the suction nozzle and the component passing through the optical sensor, and the thickness of the component based on this blocking amount is calculated to determine the adsorption state of the component.

[0011] In such a method, since the amount of light blocked changes due to disturbances such as vibrations of the suction nozzle during conveyance, the mounter removes the disturbances by differentiating the acquired amount of light blocked, and measures the thickness of the component based on the differentiated light-blocking value. However, since the amount of light blocked includes diffracted light diffracted at the edge of the suction nozzle, it was difficult for the mounter to accurately measure the thickness of the component using the waveform of the amount of light blocked after differentiation processing.

[0012] Here, with reference to FIGS. 9 and 10 respectively, the influence of diffracted light in the adsorption determination of component P0 using an optical sensor will be described. FIG. 9 is a diagram for explaining the IV conversion graph OpA of diffracted light. FIG. 10 is a diagram for explaining the IV conversion graph OpB and the differential graph DfB at the time of diffraction occurrence.

[0013] The optical sensor receives the light irradiated from the light source and converts the received light into an electrical signal. The optical sensor measures the thickness (height), width, posture (angle), etc. of the component P0 adsorbed to the tip of the suction nozzle 15Z based on the time-series change of the differential value obtained by differentiating the conversion value (hereinafter referred to as "IV conversion value") obtained by converting the electrical signal (current) into a voltage, and executes determination processing regarding the adsorption state or adsorption posture of the component P0.

[0014] The suction nozzle 15Z passes through the light (light beam) irradiated from the light source in a state where the component P0 is adsorbed to the tip. The light of the light source blocked by the suction nozzle 15Z and the component P0 is diffracted by the suction nozzle 15Z and the component P0 which are obstacles. The diffracted light DL1 shown in FIG. 9 indicates the diffracted light when diffracted by the suction nozzle 15Z not adsorbing the component P0. The diffracted light DL1 is light that occurs along the edge EG1 and whose emission intensity changes periodically. The diffracted light DL2 indicates the diffracted light when diffracted by the suction nozzle 15Z in a state where the component P0 is adsorbed. The diffracted light DL2 is light that occurs along the edge EG2 and whose emission intensity changes periodically.

[0015] The IV conversion graph OpA is a graph showing the time-series change of the IV conversion value of the diffracted light DL2 in the direction away from the suction nozzle 15A, with the position EG0 of the suction nozzle 15Z as a reference, received by the optical sensor. The emission intensity of the diffracted light DL2 is a decaying wave that attenuates as it moves away from the edges EG2 of the suction nozzle 15Z and the component P0, which are obstacles.

[0016] The IV conversion graph OpB shown in FIG. 10 is a graph showing the time-series change of the IV conversion values of the diffracted light DL2 received by the optical sensor and the light source. Note that the IV conversion graph OpB1 shown by the dashed line is a graph showing the time-series change of the IV conversion value when the component P0 is not adsorbed to the suction nozzle 15Z. The IV conversion graph OpB2 shown by the solid line is a graph showing the time-series change of the IV conversion value when the component P0 is adsorbed to the suction nozzle 15Z in the correct orientation. The IV conversion graph OpB shown by the dotted-dashed line is a graph showing the time-series change of the IV conversion value when the component P0 is not adsorbed to the suction nozzle 15Z in the correct orientation.

[0017] In the case where diffraction occurs, for the IV conversion graph OpB, the IV conversion values corresponding to the diffracted light DL2 of the suction nozzle 15Z appear at the points Pt11 and Pt14, and the IV conversion values corresponding to the thickness of the component P0 adsorbed to the suction nozzle 15Z (i.e., the amount of light blocked by the component P0) appear at the points Pt12 and Pt13.

[0018] The differential graph DfB is a graph showing the time-series change of the differential values of the IV conversion values obtained by differentiating the IV conversion graph OpB. Note that the differential graph DfB1 shown by the dashed line is a graph showing the time-series change of the differential value when the component P0 is not adsorbed to the suction nozzle 15Z. The differential graph DfB2 shown by the solid line is a graph showing the time-series change of the differential value when the component P0 is adsorbed to the suction nozzle 15Z in the correct orientation. The differential graph DfB3 shown by the dotted-dashed line is a graph showing the time-series change of the differential value when the component P0 is not adsorbed to the suction nozzle 15Z in the correct orientation.

[0019] The differential graph DfB has peaks Pk11 and Pk14 caused by the diffracted light DL2 at positions (times) corresponding to the points Pt11 and Pt14 of the IV conversion graph OpA, respectively. Further, the differential graph DfB has peaks Pk12 and Pk13 caused by the component P0 at positions (times) corresponding to the points Pt12 and Pt13 of the IV conversion graph OpA, respectively. As described above, when diffracted light is generated, the peaks Pk11 and Pk14 indicating the intensity of the diffracted light LD2 are larger than the peaks Pk12 and Pk13 indicating the thickness of the component P0 in the differential graph DfB. Therefore, it was difficult for the mounting machine to measure the thickness of the component P0 based on the peaks of the differential values obtained from the differential graph DfB.

[0020] Hereinafter, with appropriate reference to the drawings, embodiments specifically disclosing the configuration and operation of the mounting machine according to the present disclosure will be described in detail. However, a more detailed description than necessary may be omitted. For example, a detailed description of well-known matters or a redundant description of substantially the same configuration may be omitted. This is to avoid making the following description unnecessarily redundant and to facilitate the understanding of those skilled in the art. Note that the attached drawings and the following description are provided for those skilled in the art to fully understand the present disclosure, and it is not intended to limit the subject matter described in the claims thereby.

[0021] Also, hereinafter, in each figure, the X direction and the Y direction are directions orthogonal to each other in the horizontal plane. The Z direction is the height direction (vertical direction) orthogonal to the X direction and the Y direction.

[0022] (Embodiment 1) First, with reference to FIGS. 1 to 3, the internal configuration of the mounting machine 100 according to Embodiment 1 will be described. FIG. 1 is a diagram for explaining an example of the internal configuration of the mounting machine 100 according to Embodiment 1. FIG. 2 is a diagram for explaining an example of a partial configuration of the mounting machine 100 according to Embodiment 1. FIG. 3 is an enlarged view of a main part of the mounting machine 100.

[0023] In the example shown in FIG. 1, the number of mounting machines connected to the management computer 21 is one, but a plurality of mounting machines may be connected simultaneously. Also, in FIG. 1, the illustrations of the X-axis rail 10A, Y-axis rail 10B, component supply unit 12, and substrate rail 16 are each omitted.

[0024] The mounting machine 100 according to Embodiment 1 drives each of a pair of substrate rails 16 to carry in the substrate 13. The mounting machine 100 drives a head 11 provided with each of one or more suction nozzles 15 to suck the component P (see FIG. 3) supplied by the component supply unit 12 by each of the suction nozzles 15. After the mounting machine 100 sucks the component P by the suction nozzle 15, it moves the head 11 onto the substrate 13, transports the component P onto the substrate 13, and then mounts the component P at each component mounting position on the substrate 13. After the mounting machine 100 produces a mounted substrate by mounting (attaching) all the components P to be mounted on the substrate 13, it drives each of the pair of substrate rails 16 to carry out the produced mounted substrate.

[0025] The mounting machine 100 includes a head 11, a component supply unit 12, a measurement system 14, one or more suction nozzles 15, a pair of substrate rails 16, a processor 17, a memory 18, and an output unit 19. Note that the communication unit 20 is not an essential component and may be omitted. Also, when the mounting machine 100 includes the communication unit 20, it may be communicably connected to a management computer 21 (that is, an external device) to execute data transmission and reception.

[0026] Each of the pair of X-axis rails 10A is coupled to the Y-axis rail 10B and supports the Y-axis rail 10B so as to be movable in the X direction and -X direction. The Y-axis rail 10B is coupled to the head 11 and supports the head 11 so as to be movable in the Y direction and -Y direction. Each of the pair of X-axis rails 10A and the Y-axis rail 10B constitute a movement mechanism for moving the head 11.

[0027] The head 11 is controlled by a moving mechanism and is driven (moved) in each of the X-axis direction, Y-axis direction, and Z-axis direction. The head 11 is coupled to the Y-axis rail 10B and conveys the component P between the component supply unit 12 and a predetermined component mounting position on the substrate 13.

[0028] The head 11 includes each of one or more suction nozzles 15. The suction nozzle 15 is moved up and down by the processor 17 in a direction along the Z-axis direction (lifting direction) between the conveyance height of the component P and the mounting height of the component P on the substrate 13. The head 11 executes suction and release of the component P by each of the suction nozzles 15, respectively, by the processor 17. The head 11 sucks the component P supplied by the component supply unit 12 at the tip of the suction nozzle 15, conveys it to a predetermined component mounting position on the substrate 13, and then releases the suction of the component P to mount it on the substrate 13.

[0029] Here, after the head 11 sucks the component P, the component P adsorbed at the tip of the suction nozzle 15 moves so as to pass through the light beam 14B irradiated from the light source 14A and is disposed between the component supply unit 12 and the substrate 13. Thereby, the mounter 100 measures the thickness of the component P adsorbed at the tip of each suction nozzle 15 based on the light shielding amount of the light beam 14B (that is, the variation amount of the received light amount), and determines the adsorption state of the component P.

[0030] The component supply unit 12 is controlled by the processor 17 to supply the component P to be mounted on the substrate 13. Note that the component supply unit 12 may be capable of simultaneously supplying a plurality of different types of components P. Also, the arrangement of the component supply unit 12 shown in FIG. 2 is an example and is not limited thereto.

[0031] The measurement system 14 as an example of a sensor includes a light source 14A, a slit 14C, a photoelectric conversion element 14D, and a current-voltage conversion unit 14E. The slit 14C has a slit hole 141C and is disposed on the surface facing the light source 14A. Note that the arrangement position of the measurement system 14 shown in each of FIGS. 1 to 3 is an example and is not limited thereto.

[0032] As an example of a light-receiving element, the photoelectric conversion element 14D is irradiated by a light source 14A such as an LED (Light Emitting Diode) or an LD (Laser Diode), and converts the light (light beam 14B) that has passed through the slit hole 141C of the slit 14C into an electrical signal and outputs it to the current-voltage conversion unit 14E. The current-voltage conversion unit 14E outputs a conversion value (hereinafter referred to as "IV conversion value") obtained by converting the electrical signal (current) output from the photoelectric conversion element 14D into a voltage to the differential processing unit 17A in the processor 17. Note that the current-voltage conversion unit 14E outputs the IV conversion value to the differential processing unit 17A at a predetermined period (for example, a period on the order of kHz).

[0033] The slit 14C is arranged such that the slit hole 141C formed in a substantially rectangular shape is located at a predetermined position (height) with respect to the suction nozzle 15. Specifically, the slit hole 141C of the slit 14C is based on the thickness A of the component P in the Z direction (see FIGS. 6 and 7) and the tip heights H2 and H5 of the suction nozzle 15 attached to the head 11 (see FIGS. 6 and 7), and the upper limit value of the arrangement height with respect to the suction nozzle 15 (height B described later) is determined. The slit 14C is arranged based on the determined upper limit value of the arrangement height with respect to the suction nozzle 15 (height B described later). Note that the shape of the slit hole 141C is not limited to a substantially rectangular shape. The slit hole 141C only needs to have at least a part thereof parallel to the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C. For example, both ends in the height direction of the slit hole 141C may be formed in an arc shape.

[0034] The processor 17 as an example of the control unit is configured using, for example, a CPU (Central Processing Unit), a DSP (Digital Signal Processor), or an FPGA (Field Programmable Gate Array), and controls the operations of each part of the processor 17. The processor 17 cooperates with the memory 18 to comprehensively perform various processes and controls. Specifically, the processor 17 refers to the programs and data held in the memory 18 and realizes the functions of each part by executing the programs. Here, each part mentioned refers to the differential processing unit 17A and the determination unit 17B.

[0035] The differential processing unit 17A calculates the differential (difference) of each of two consecutive IV conversion values output from the current-voltage conversion unit 14E, and obtains a differential value indicating the change amount of the IV conversion value. The differential processing unit 17A outputs each of the obtained differential values to the determination unit 17B.

[0036] Based on the time-series change of the differential value output from the differential processing unit 17A, the determination unit 17B measures the thickness (height) in the Z direction, the width in the X direction, the posture (angle), etc. of the component P adsorbed to the tip of the adsorption nozzle 15, and executes a determination process regarding the adsorption state or adsorption posture of the component P.

[0037] Based on the differential value output from the differential processing unit 17A and the threshold value 18A stored in the memory 18, the determination unit 17B determines whether the thickness of the component P adsorbed by each adsorption nozzle 15 is the thickness of the component P when the component P is normally adsorbed. Further, based on the differential value output from the differential processing unit 17A and the threshold value 18A stored in the memory 18, the determination unit 17B determines whether the adsorption posture (angle) of the component P adsorbed by each adsorption nozzle 15 is the adsorption posture of the component P when the component P is normally adsorbed.

[0038] Note that the normal posture (angle) mentioned here is data regarding the posture (angle) of component P set corresponding to the orientation of component P mounted on substrate 13, and is included in, for example, production data. Head 11 adsorbs and takes out component P from component supply unit 12 based on the posture (angle) of component P included in the production data, transports it onto substrate 13, and mounts it.

[0039] Determination unit 17B outputs the determination result to output unit 19. Note that determination unit 17B may output the determination result to output unit 19 only when it determines that component P is not normally adsorbed or is not in a normal adsorption posture. Further, determination unit 17B may store the determination result in memory 18. Furthermore, when mounting machine 100 is communicably connected to management computer 21 via communication unit 20, determination unit 17B may output the determination result to management computer 21 via communication unit 20.

[0040] Note that when determination unit 17B determines that component P is normally adsorbed but not in a normal adsorption posture, it may calculate the angular difference between the measured adsorption angle of component P and the normal adsorption angle, and rotate the corresponding adsorption nozzle 15 based on the calculated angular difference. Thereby, mounting machine 100 can correct the adsorption posture (angle) of component P to a normal adsorption posture.

[0041] Memory 18 includes, for example, a RAM (Random Access Memory) as a work memory used when executing each process of processor 17, and a ROM (Read Only Memory) that stores programs and data defining the operation of processor 17. In the RAM, data or information generated or acquired by processor 17 is temporarily stored. In the ROM, a program defining the operation of processor 17 is written. Memory 18 stores threshold value 18A used for various determinations executed by determination unit 17B. Further, memory 18 stores production data for producing the mounting substrate to be produced.

[0042] The production data referred to here is information used by the mounting machine 100 to produce a mounting substrate. The production data includes, for example, the size of the substrate 13, the size and shape of the component P, information regarding the suction nozzle, the number of substrates to be produced, and the like. Note that the production data is not necessarily limited to the data of the items described above. The production data may include information on the threshold value 18A for each component P described later.

[0043] The threshold value 18A is set for each type of component P and is a threshold value for determining whether the component P is normally sucked by the suction nozzle 15. Specifically, the threshold value 18A stored in the memory 18 includes a threshold value ThA for determining whether the component P is normally sucked based on the thickness of the component P, a threshold value ThB for determining whether the suction posture (angle) of the component P is normal based on the thickness of the component P, a threshold value ThC for determining whether the suction posture (angle) and the suction surface of the component P are normal based on the width of the component P, and the like. Note that for each determination, at least one threshold value may be set.

[0044] The output unit 19 is configured using a display such as an LCD (Liquid Crystal Display) or an organic EL (Electroluminescence). The output unit 19 displays or outputs an audio of the determination result regarding the suction state or the suction posture of the component P output from the determination unit 17B.

[0045] The communication unit 20 is connected to be wirelessly or wiredly communicable with the management computer 21 to perform data transmission and reception. The communication unit 20 transmits the determination result regarding the suction state or the suction posture of the component P output from the determination unit 17B to the management computer 21. Further, the communication unit 20 acquires the production data of the substrate 13, the production data for each component P, or the threshold value for each component P transmitted from the management computer 21 and outputs it to the processor 17. Note that the wireless communication referred to here is communication via a wireless LAN (Local Area Network) such as Wi-Fi (registered trademark).

[0046] Note that the determination process regarding the adsorption state or adsorption posture (angle) of the component P may be executed by the management computer 21. In such a case, the processor 17 in the mounter 100 may transmit the IV conversion value output from the current-voltage conversion unit 14E and the identification information capable of identifying the mounter 100 and the adsorption nozzle 15 to the management computer 21 in association with each other, or may transmit the differential value calculated by the differential processing unit 17A and the identification information capable of identifying the mounter 100 and the adsorption nozzle 15 to the management computer 21 in association with each other. Further, in such a case, the mounter 100 may acquire the determination result regarding the adsorption state or adsorption posture of the component P transmitted from the management computer 21, store it in the memory 18, and output it to the output unit 19.

[0047] The management computer 21 is, for example, a PC (Personal Computer), a notebook PC, a tablet terminal, etc., and is operated by an operator. The management computer 21 is communicably connected to one or more mounters, and generates production information regarding the production process of the mounting substrate pre-input or set by the operator and an execution command for executing the production process, and transmits them to each mounter.

[0048] Next, with reference to FIG. 4, the IV (current-voltage) conversion process executed by the current-voltage conversion unit 14E will be described. FIG. 4 is a diagram for explaining an example of the IV conversion process. Note that in FIG. 4, the illustration of the head 11 is omitted for easy understanding of the explanation.

[0049] Each of the plurality of adsorption nozzles 15 provided in the head 11 may have individual differences in the length to the tip portion that adsorbs the component P, the shape of the tip portion, etc. due to manufacturing errors, aging deterioration, etc. Hereinafter, the change in the IV conversion output value due to the individual differences of the adsorption nozzle 15 will be specifically described.

[0050] Here, in the example shown in FIG. 4, an example is shown in which each of the two suction nozzles 15A and 15B that have adsorbed the same component P is arranged side by side along the irradiation direction (Y direction) of the light beam 14B. However, each of the actual plurality of suction nozzles 15 is arranged in a direction different from the irradiation direction (Y direction) of the light beam 14B as shown in FIGS. 2 and 3 so that each of two or more suction nozzles is not detected simultaneously by the measurement system 14. Thereby, the mounter 100 can detect the adsorption state (or adsorption posture) of the component P for each suction nozzle 15.

[0051] In the example shown in FIG. 4, the suction nozzle 15A adsorbs the component P at the height HA. The suction nozzle 15B adsorbs the component P at the height HB. The amount of light shielding of the light beam 14B shielded by the suction nozzle 15A is larger than the amount of light shielding of the light beam 14B shielded by the suction nozzle 15B.

[0052] The IV conversion graph Op1 is a graph showing the time-series change of the IV conversion value obtained when the suction nozzle 15A passes through the light beam 14B. The IV conversion graph Op2 is a graph showing the time-series change of the IV conversion value obtained when the suction nozzle 15B passes through the light beam 14B. The vertical axis of each of the IV conversion graphs Op1 and Op2 indicates the IV conversion value output from the current-voltage conversion unit 14E. The horizontal axis of each of the IV conversion graphs Op1 and Op2 indicates time. The IV conversion values of each of the IV conversion graphs Op1 and Op2 increase in proportion to the amount of light shielding of the light beam 14B. The light shielding level LV0A is the IV conversion value indicating that the light beam 14B is not shielded by the suction nozzle.

[0053] In such a case, for the IV conversion graph Op1 corresponding to the suction nozzle 15A, the light shielding amount becomes maximum and the IV conversion value becomes the maximum value V11 when the suction nozzle 15A and the component P pass through the light beam 14B in the time period T11. Similarly, for the IV conversion graph Op2, the light shielding amount becomes maximum and the IV conversion value becomes the maximum value V12 when the suction nozzle 15A and the component P pass through the light beam 14B in the time period T12. Thus, when the light shielding amount of the light beam 14B differs due to individual differences between the suction nozzles 15A and 15B, since the IV conversion values at the time of adsorbing the component P indicated by the respective IV conversion graphs Op1 and Op2 are different, it becomes difficult for the mounter 100 to more accurately determine the adsorption state of the component P.

[0054] Therefore, the mounter 100 according to the first embodiment differentiates each of two consecutive IV conversion values output from the current-voltage conversion unit 14E by the differential processing unit 17A. Thereby, the mounter 100 can generate time-series data (for example, differential graphs Df41, Df51, etc. shown in FIG. 8) of differential values (differences) indicating the change amount of the IV conversion value excluding the individual differences for each suction nozzle from the IV conversion value.

[0055] Here, with reference to FIG. 5, the change in the received light amount of the diffracted light due to the arrangement of the suction nozzle 15 and the slit 14C will be described. FIG. 5 is a diagram for explaining an example of the change in the received light amount of the diffracted light due to the arrangement of the suction nozzle 15 and the slit 14C. In FIG. 5, an example in which the edge EG of the suction nozzle 15 is not tapered will be described.

[0056] The diffracted light is generated along the edge EG of the suction nozzle 15. Each of the IV conversion graphs Op31, Op32, Op33, and Op34 is a graph showing the time-series change of the IV conversion value obtained by IV-converting the received light amount of the diffracted light when the head 11 is moved in the direction of the arrow in the figure. The vertical axis of each of the IV conversion graphs Op31 to Op34 indicates the IV conversion value. The horizontal axis of each of the IV conversion graphs Op31 to Op34 indicates time.

[0057] The IV conversion graph Op31 shows the amount of received diffracted light when the angle formed by the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C of the slit 14C is 0 (zero) ° (that is, the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C are parallel). In such a case, when the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C of the slit 14C are parallel, the diffracted light passes through the slit hole 141C alternately as diffracted light with high intensity (bright) and diffracted light with low intensity (dark). As a result, since the amount of change in the amount of received light of the diffracted light received by the photoelectric conversion element 14D increases, it appears as a large peak (differential value) in the differential graph obtained by differential processing.

[0058] The IV conversion graph Op32 shows the amount of received diffracted light when the angle formed by the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C of the slit 14C is 5°. In such a case, for the diffracted light passing through the slit hole 141C, the diffracted light with low intensity (dark) increases, and the proportion occupied by the diffracted light with high intensity (bright) decreases. Therefore, the amount of change in the amount of received diffracted light when the angle formed by the suction nozzle 15 and the opening direction of the slit hole 141C is 5° is smaller than when the suction nozzle 15 and the opening direction of the slit hole 141C are parallel.

[0059] Also, the IV conversion graph Op33 shows the amount of received diffracted light when the angle formed by the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C of the slit 14C is 20°. In such a case, for the diffracted light passing through the slit hole 141C, the diffracted light with low intensity (dark) further increases, and the proportion occupied by the diffracted light with high intensity (bright) further decreases. Therefore, the amount of change in the amount of received diffracted light when the angle formed by the suction nozzle 15 and the opening direction of the slit hole 141C is 20° is smaller than when the angle formed by the suction nozzle 15 and the opening direction of the slit hole 141C is 5°.

[0060] Similarly, the IV conversion graph Op34 shows the amount of received diffracted light when the angle formed by the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C of the slit 14C is 30°. In such a case, the diffracted light passing through the slit hole 141C has an even smaller intensity (darker) diffracted light, and the proportion of the diffracted light with a larger intensity (brighter) further decreases. Therefore, the change amount of the received diffracted light amount when the angle formed by the suction nozzle 15 and the opening direction of the slit hole 141C is 30° is even smaller than when the angle formed by the suction nozzle 15 and the opening direction of the slit hole 141C is 20°.

[0061] As described above, in the mounting machine 100, the smaller the angle formed by the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C of the slit 14C, the larger the change amount of the received diffracted light amount, and it becomes difficult to determine the adsorption of the component P using the differential graph. Also, in the mounting machine 100, the more the arrangement of the edge EG of the suction nozzle 15 and the slit hole 141C of the slit 14C overlaps in the height direction, the smaller the change amount of the received diffracted light amount, and the adsorption determination of the component P using the differential graph can be performed with higher accuracy.

[0062] Hereinafter, the arrangement of the suction nozzles 15, 15C and the slit hole 141C of the slit 14C in the present embodiment will be described.

[0063] Next, with reference to FIG. 6, the relative positional relationship between the suction nozzles 15, 15C and the slit hole 141C of the slit 14C will be described. FIG. 6 is a diagram for explaining an example of the first relative positional relationship between the suction nozzle 15 and the slit hole 141C. In FIG. 6, for easier explanation, only the slit hole 141C of the slit 14C is shown.

[0064] In addition, the shape of the suction nozzle 15 shown in FIG. 6 shows an example where the whole is formed in a tapered shape, but it is not limited thereto. For example, the suction nozzle 15 may be formed in a tapered shape only at the tip portion that adsorbs the component P (that is, the taper angle θb = 0 (zero) °). That is, the suction nozzle 15 shown in FIG. 6 has a taper that becomes thinner toward the tip portion.

[0065] The relative positional relationship between the suction nozzles 15, 15C and the slit holes 141C of the slit 14C is determined based on the thickness A of the component P adsorbed by the suction nozzles 15, 15C. Here, the thickness A of the component refers to the height (size) of the component P in the Z direction adsorbed and held by the suction nozzles 15, 15C.

[0066] When the suction nozzle 15 has a tapered shape, the slit 14C is arranged at a height where the height H1 of one end of the slit hole 141C is less than the height B in the +Z direction from the taper formation height H0 of the suction nozzle 15. Also, the slit 14C is arranged such that the opening direction of the slit hole 141C (the Z direction in the example shown in FIG. 6) is substantially parallel to the extending direction of the suction nozzle 15 (substantially parallel to the lifting and lowering direction of the suction nozzle 15).

[0067] Here, the taper formation height H0 refers to the height of the intersection point Pt1 of the surfaces having two different taper angles θa, θb. The taper angle θa > the taper angle θb.

[0068] Note that the value of the height B may be 0 (zero). In such a case, the slit hole 141C is arranged between the taper formation height H0 and the suction height of the component P (the tip height H2 of the suction nozzle 15) at the height H1 of one end of the slit hole 141C.

[0069] As described above, when the slit hole 141C is arranged substantially parallel to the extending direction of the suction nozzle 15, the angles formed by the opening direction of the slit hole 141C and the edges EG11, EG12 of the suction nozzle 15 are substantially equal to the taper angles θa, θb, respectively. That is, the mounting machine 100 can reduce the change amount of the diffracted light received by the photoelectric conversion element 14D by passing through the slit hole 141C by making the overlapping height (that is, the height B) where the edge EG11 having the smaller taper angle θb among the edges of the suction nozzle 15 and the slit hole 141C overlap in the Z direction smaller than the thickness A of the component P to be measured.

[0070] As a result, the mounting machine 100 can more effectively remove the influence of diffracted light in the differential graph obtained by differentiating the IV conversion output value. Therefore, in the differential graph obtained by the differentiation process, the mounting machine 100 can perform the adsorption determination or the adsorption posture determination of the component P based on the peak value of the differential graph by making the differential value (peak) corresponding to the change amount of the diffracted light smaller than the differential value (peak) corresponding to the thickness A of the component P.

[0071] Next, with reference to FIG. 7, the relative positional relationship between the suction nozzles 15, 15C and the slit hole 141C of the slit 14C will be described. FIG. 7 is a diagram for explaining an example of the second relative positional relationship between the suction nozzle 15C and the slit hole 141C.

[0072] The suction nozzle 15C shown in FIG. 7 is a suction nozzle in which the boundary between the first and second tapered surfaces having two different taper angles (that is, the intersection point Pt1 shown in FIG. 6) is formed in an R shape. In such a case, the slit 14C is based on the height H3 of the intersection point Pt2 between the tangent line L2 along the edge EG13 of the first tapered surface and the tangent line L1 along the edge EG14 of the second tapered surface, and one end height H4 of the slit hole 141C is from the height H3 of the intersection point Pt2. It is arranged at a height less than the height B in the +Z direction. Further, as shown in FIG. 7, the slit hole 141C of the slit 14C is arranged non-parallel to either the tangent line L1 or the tangent line L2.

[0073] When the height B is 0 (zero), the slit hole 141C may be arranged between the one end height H4 of the slit hole 141C and the suction height of the component P (that is, the tip height H5 of the suction nozzle 15).

[0074] As described above, when the slit hole 141C is arranged substantially parallel to the extending direction of the suction nozzle 15, the angles formed by the opening direction of the slit hole 141C and the tangents L1 and L2 along the edges EG13 and EG14 of the suction nozzle 15 are close to the taper angles θa and θb, respectively. That is, in the Z direction, the mounting machine 100 makes the overlapping height (i.e., height B) where the edge EG11 having the smaller taper angle θb among the edges of the suction nozzle 15 overlaps with the slit hole 141C smaller than the thickness A of the component P to be measured, so that the change amount of the diffracted light passing through the slit hole 141C and received by the photoelectric conversion element 14D can be reduced.

[0075] Thereby, the mounting machine 100 can more effectively remove the influence of the diffracted light in the differential graph obtained by differentiating the IV conversion output value. Therefore, the mounting machine 100 can execute the adsorption determination or the adsorption posture determination of the component P based on the peak value of the differential graph by making the differential value (peak) corresponding to the change amount of the diffracted light smaller than the differential value (peak) corresponding to the thickness A of the component P in the differential graph obtained by the differentiation process.

[0076] Referring to FIG. 8, a comparative example of the IV conversion graph and the differential graph based on the relative position between the suction nozzle 15 and the slit hole 141C will be described. FIG. 8 is a diagram for explaining a comparative example of the IV conversion graphs Op41 and Op51 and the differential graphs Df41 and Df51 according to the relative positional relationship between the suction nozzle 15 and the slit hole 141C. In the following description, the IV conversion graph and the differential graph based on the relative position between the suction nozzle 15 and the slit hole 141C will be described, but the same applies to the suction nozzle 15C.

[0077] The vertical axis of each of the IV conversion graphs Op41 and Op51 indicates the IV conversion value. The horizontal axis of each of the IV conversion graphs Op41 and Op51 indicates time. The vertical axis of each of the differential graphs Df41 and Df51 indicates the differential value. The horizontal axis of each of the differential graphs Df41 and Df51 indicates time.

[0078] The IV conversion graph Op41 is a graph showing the time-series change of the IV conversion value when the height B (see FIGS. 6 and 7) where the edges EG11 and EG13 and the slit hole 141C overlap in the height direction is equal to or greater than the thickness A of the component P (thickness A ≤ height B). Further, the level LV0D indicates that the light beam 14B is not blocked and the IV conversion value output from the current-voltage conversion unit 14E is 0 (zero).

[0079] The point Pt41A indicates the timing before and after the start of blocking of the light beam 14B by the suction nozzle 15 and the component P. In the IV conversion graph Op41, the IV conversion value varies corresponding to the amount of received light of the diffracted light generated at the edge portion of the suction nozzle 15 at the point Pt41A.

[0080] The point Pt42A indicates the timing before and after the start of blocking of the light beam 14B by the suction nozzle 15 and the component P adsorbed to the tip of the suction nozzle 15. In the IV conversion graph Op41, the IV conversion value corresponding to the tip height H2 of the suction nozzle 15 and the thickness A of the component P adsorbed to the tip of the suction nozzle 15 is output at the point Pt42A. Here, the level LV40 is the IV conversion value output from the current-voltage conversion unit 14E and corresponding to the tip height H2 of the suction nozzle 15 and the thickness A of the component P adsorbed to the tip of the suction nozzle 15.

[0081] The point Pt43A indicates the timing before and after the end of blocking of the light beam 14B by the suction nozzle 15 and the component P adsorbed to the tip of the suction nozzle 15. In the IV conversion graph Op41, the IV conversion value corresponding to the tip height H2 of the suction nozzle 15 and the thickness A of the component P adsorbed to the tip of the suction nozzle 15 is output at the point Pt43A.

[0082] The point Pt44A indicates the timing before and after the end of blocking of the light beam 14B by the suction nozzle 15 and the component P. In the IV conversion graph Op41, the IV conversion value varies corresponding to the amount of received light of the diffracted light generated at the edge portion of the suction nozzle 15 at the point Pt41A.

[0083] The differential graph Df41 is a graph showing the time-series change of differential values obtained by differentiating the IV conversion values of the IV conversion graph Op41. Also, the level LV0E indicates that the change amount of the IV conversion value is 0 (zero) and the differential value output from the differential processing unit 17A is 0 (zero).

[0084] The peak Pk41B is a peak corresponding to the point Pt41A of the IV conversion graph Op41. The peak Pk42B is a peak corresponding to the point Pt42A of the IV conversion graph Op41. The peak Pk43B is a peak corresponding to the point Pt43A of the IV conversion graph Op41. The peak Pk44B is a peak corresponding to the point Pt44A of the IV conversion graph Op41.

[0085] Here, each of the peaks Pk42B and Pk43B corresponding to the thickness A of the component P is smaller than each of the peaks Pk41B and Pk44B corresponding to the diffracted light of the suction nozzle 15. Therefore, when the thickness A of the component P is such that the slit hole 141C with respect to the suction nozzle 15 has a height B or less (thickness A ≤ height B), the determination unit 17B determines that the negative maximum value of the differential value is the peak Pk41B and the positive maximum value of the differential value is the peak Pk44B. Thus, in order to perform the suction determination of the component P based on the respective peaks Pk41B and Pk44B (maximum values) of the negative and positive differential values, another process is required to detect the differential value corresponding to the thickness of the component P.

[0086] The IV conversion graph Op51 is a graph showing the time-series change of the IV conversion values when the height B (see FIGS. 6 and 7) at which the edges EG11 and EG13 and the slit hole 141C overlap in the height direction is less than the thickness A of the component P (thickness A > height B). Note that the height B may be 0 (zero). In such a case, it indicates that one end height H1 of the slit hole 141C is located between the suction height of the component P (the tip height H2 of the suction nozzle 15) and the height H0.

[0087] Point Pt51A indicates the timing before and after the start of the light beam 14B being blocked by the suction nozzle 15 and the component P. The IV conversion graph Op51 shows that the IV conversion value fluctuates corresponding to the received light amount of the diffracted light generated at the edge portion of the suction nozzle 15 at point Pt51A.

[0088] Point Pt52A indicates the timing before and after the start of the light beam 14B being blocked by the suction nozzle 15 and the component P adsorbed at the tip of the suction nozzle 15. The IV conversion graph Op51 outputs the IV conversion value corresponding to the tip height H2 of the suction nozzle 15 and the thickness A of the component P adsorbed at the tip of the suction nozzle 15 at point Pt52A. Here, the level LV40 is the IV conversion value output from the current-voltage conversion unit 14E and corresponding to the tip height H2 of the suction nozzle 15 and the thickness A of the component P adsorbed at the tip of the suction nozzle 15.

[0089] Point Pt53A indicates the timing before and after the end of the light beam 14B being blocked by the suction nozzle 15 and the component P adsorbed at the tip of the suction nozzle 15. The IV conversion graph Op51 outputs the IV conversion value corresponding to the tip height H2 of the suction nozzle 15 and the thickness A of the component P adsorbed at the tip of the suction nozzle 15 at point Pt53A.

[0090] Point Pt54A indicates the timing before and after the end of the light beam 14B being blocked by the suction nozzle 15 and the component P. The IV conversion graph Op51 shows that the IV conversion value fluctuates corresponding to the received light amount of the diffracted light generated at the edge portion of the suction nozzle 15 at point Pt51A.

[0091] The differential graph Df51 is a graph showing the time-series change of the differential value obtained by differentiating the IV conversion value of the IV conversion graph Op51.

[0092] Peak Pk51B is the peak corresponding to point Pt51A on the IV conversion graph Op51. Peak Pk52B is the peak corresponding to point Pt52A on the IV conversion graph Op51. Peak Pk53B is the peak corresponding to point Pt53A on the IV conversion graph Op51. Peak Pk54B is the peak corresponding to point Pt54A on the IV conversion graph Op51.

[0093] Here, each of peaks Pk52B and Pk53B corresponding to the thickness A of component P is larger than each of peaks Pk51B and Pk54B corresponding to the diffracted light of the suction nozzle 15. Thus, in such a case, since the maximum negative value of the differential value is peak Pk52B and the maximum positive value of the differential value is peak Pk53B, by comparing each of the maximum negative and positive values of the differential value with each of the threshold values ThA and ThB, it is possible to more easily determine whether component P is adsorbed to the suction nozzle 15.

[0094] Specifically, when the determination unit 17B determines that the maximum negative value of the differential value is less than or equal to the threshold value ThB and the maximum positive value of the differential value is greater than or equal to the threshold value ThA, it determines that component P is adsorbed to the tip of the suction nozzle 15. Also, when the determination unit 17B determines that the maximum negative value of the differential value is less than or equal to the threshold value ThB and the maximum positive value of the differential value is not greater than or equal to the threshold value ThA, it determines that component P is not normally adsorbed to the tip of the suction nozzle 15.

[0095] Furthermore, the determination unit 17B measures the width of component P based on the time period during which the differential value is less than or equal to the threshold value ThB and greater than or equal to the threshold value ThA in the differential graph. For example, the determination unit 17B calculates the time period T5 between when the moving speed of the head 11, the maximum negative value of the differential value (i.e., peak Pk52B), and the maximum positive value of the differential value (i.e., peak Pk53B) are each detected. The determination unit 17B determines whether the adsorption posture, adsorption surface, etc. of component P adsorbed by the suction nozzle 15 are normal by comparing the time period T5 corresponding to the width of component P with the threshold value ThC for determining the adsorption posture of component P.

[0096] In the example shown in FIG. 8, when the determination unit 17B determines that the time period T5 is less than the threshold value ThC, it determines that the suction posture, suction surface, etc. of the component P are normal, and when it determines that the time period T5 is not less than the threshold value ThC, it determines that the suction posture, suction surface, etc. of the component P are defective.

[0097] In addition, when the threshold value ThC is a threshold value corresponding to the width of the component P when the component P is normally sucked, the determination unit 17B may determine that the suction posture, suction surface, etc. of the component P are normal when it determines that the time period T5 is greater than or equal to the threshold value ThC.

[0098] In the above-described embodiment, the conveyance height between the component supply unit 12 by the head 11 and the component mounting position of the component P is constant, and the arrangement position of the slit 14C with respect to the suction nozzle 15 attached to the head 11 has been described. However, the conveyance height may be variable.

[0099] When the conveyance height between the component supply unit 12 by the head 11 and the component mounting position of the component P is variable, the mounting machine 100 may control the height of the suction nozzle 15 with respect to the slit hole 141C of the slit 14C based on the positions (heights) of the heights H1 and H3 of one end of the slit 14C so that the thickness A of the component P is greater than the height B.

[0100] As described above, the mounter 100 according to the first embodiment adsorbs the component P at the tip of at least one adsorption nozzle 15, 15C and mounts it on the substrate 13. The mounter 100 includes a head 11, a light source 14A, and a photoelectric conversion element 14D (an example of a light receiving element) that receives the light beam 14B irradiated from the light source 14A. The light beam 14B is irradiated onto the tip of the adsorption nozzles 15, 15C, and the light beam 14B that has passed through the slit hole 141C disposed between the light source and the photoelectric conversion element 14D is received by the photoelectric conversion element 14D. A measurement system 14 (an example of a sensor) outputs the light intensity of the received light beam 14B. Based on the light intensity of the light beam 14B output from the measurement system 14, a processor 17 (an example of a control unit) determines whether or not the component P is adsorbed to the tip of the adsorption nozzles 15, 15C through which the light beam 14B passes. The adsorption nozzles 15, 15C are formed with a taper toward the tip. The slit hole 141C is disposed non-parallel to the taper.

[0101] As a result, the mounter 100 according to the first embodiment can reduce the amount of diffracted light received by the photoelectric conversion element 14D after passing through the slit hole 141C. Therefore, in the determination of the adsorption of the component P, the differential value based on the increase and decrease in the amount of diffracted light received can be more effectively removed. Therefore, the mounter 100 can execute the adsorption state of the component P with higher accuracy using the differential value.

[0102] Also, as described above, one end of the slit hole 141C in the mounting machine 100 according to Embodiment 1 is, in the height direction, equal to or higher than the adsorption height of the component P adsorbed to the tip (that is, the tip heights H2 and H5 of the adsorption nozzles 15), and is arranged at a height less than the height B (an example of a predetermined height) from the taper formation height H0 or the height H3 of the intersection Pt2 between the tangent lines (an example of the first tangent line, for example, the edge EG11 and the tangent line L2) of the edges EG11 to EG14 of the adsorption nozzles 15 and 15C and the second tangent line (an example of the second tangent line, for example, the edge EG12 and the tangent line L1). Thereby, the mounting machine 100 according to Embodiment 1 can more easily reduce the amount of diffracted light received by the photoelectric conversion element 14D only by defining the height of the slit hole 141C with respect to each of the edges EG11 and EG12 of the adsorption nozzles 15 and 15C (in the case of the adsorption nozzle 15C, the tangent lines L1 and L2 along each of the edges EG13 and EG14).

[0103] Also, as described above, in the mounting machine 100 according to Embodiment 1, the height B is the height A of the component. Thereby, in the mounting machine 100 according to Embodiment 1, the differential value obtained by differentiating the fluctuation amount of the received amount of diffracted light is smaller than the differential value obtained by differentiating the fluctuation amount of the received amount based on the shielding of the light beam 14B when the component P passes through. Therefore, the adsorption determination of the component P can be executed based on the peak of the differential value.

[0104] Also, as described above, the slit hole 141C of the mounting machine 100 according to Embodiment 1 is arranged substantially parallel to the adsorption nozzles 15 and 15C. Thereby, the mounting machine 100 according to Embodiment 1 can more easily reduce the amount of diffracted light received by the photoelectric conversion element 14D only by defining the height of the slit hole 141C with respect to each of the edges EG11 and EG12 of the adsorption nozzles 15 and 15C (in the case of the adsorption nozzle 15C, the tangent lines L1 and L2 along each of the edges EG13 and EG14).

[0105] Furthermore, as described above, the processor 17 in the mounting machine 100 according to the first embodiment determines that the component P is adsorbed to the tip portion through which the light beam 14B passes when the differential value is equal to or greater than the threshold value ThA (an example of the first threshold value) and less than the threshold value ThB (an example of the second threshold value) greater than the threshold value ThA. Thereby, the mounting machine 100 can determine whether or not the component P is adsorbed and the adsorption posture of the component P based on the thickness A (height) of the component P indicated by the differential value.

[0106] Furthermore, as described above, the processor 17 in the mounting machine 100 according to the first embodiment determines that the component P is not adsorbed to the tip portion through which the light beam 14B passes when the differential value is determined to be less than the threshold value ThA, and generates and outputs a notification indicating that the adsorption state of the component P is defective. Thereby, when the mounting machine 100 determines that the adsorption posture (state) of the component P is defective based on the thickness A (height) of the component P indicated by the differential value, it can generate and output a notification indicating that there is an adsorption defect.

[0107] Furthermore, as described above, the processor 17 in the mounting machine 100 according to the first embodiment generates and outputs a notification indicating that the adsorption state of the component P is defective when the differential value is determined to be equal to or greater than the threshold value ThB. Thereby, when the mounting machine 100 determines that the adsorption posture (state) of the component P is defective based on the thickness A (height) of the component P indicated by the differential value, it can generate and output a notification indicating that there is an adsorption defect.

[0108] Furthermore, as described above, the processor 17 in the mounting machine 100 according to the first embodiment measures the time period T5 during which the differential value is equal to or greater than the threshold value ThA and less than the threshold value ThB, and determines the adsorption posture of the component P based on the measured time period T5. Thereby, the mounting machine 100 can determine the adsorption posture of the component P based on the width of the component P corresponding to the length of the time period T5 during which the differential value indicating that the component P is adsorbed is equal to or greater than the threshold value ThA and less than the threshold value ThB.

[0109] Further, as described above, when the processor 17 in the mounter 100 according to the first embodiment determines that the length of the time period T5 is equal to or greater than the threshold value ThC, it determines that the suction posture of the component P is defective, and generates and outputs a notification indicating that the suction state of the component P is defective. As a result, the mounter 100 can determine whether the suction posture, suction surface, etc. of the component P are normal based on the width of the component P, and if it is determined that they are not normal, generate and output a notification indicating a suction defect.

[0110] As described above, various embodiments have been described with reference to the accompanying drawings, but the present disclosure is not limited to such examples. It is obvious that those skilled in the art can conceive of various modification examples, correction examples, substitution examples, addition examples, deletion examples, equivalent examples within the scope described in the claims, and it is understood that they also belong to the technical scope of the present disclosure. Further, within the scope not departing from the gist of the invention, the components in the above-described various embodiments may be arbitrarily combined.

Industrial Applicability

[0111] The present disclosure is useful as a presentation of a mounter that can more accurately determine the suction state of a component adsorbed to a nozzle.

Explanation of Signs

[0112] 11 Head 12 Component Supply Unit 13 Substrate 14 Measurement System 14A Light Source 14B Light Ray 14C Slit 14D Photoelectric Conversion Element 14E Current-Voltage Conversion Unit 15, 15A, 15B, 15C Suction Nozzle 17 Processor 17A Differentiation Processing Unit 17B Determination Unit 18 Memory 18A Threshold Value 19 Output Unit 21 Management Computer 100 Implementing Machine EG, EG11, EG12, EG13, EG14 Edge P, P0 Component

Claims

1. A head having a suction nozzle, sucking a component at the tip of the suction nozzle, and mounting the component on a substrate, A light source that irradiates light, a slit having a slit hole through which the light passes, and a light receiving element that receives the light that has passed through the slit hole. The tip of the suction nozzle is irradiated with the light, and the light that has passed through the slit hole is received by the light receiving element, and a sensor that outputs the light intensity of the received light, A control unit that differentiates the light intensity of the light output from the sensor to obtain a differential value, and determines whether or not the component is adsorbed to the tip of the suction nozzle through which the light passes based on the differential value, The suction nozzle has a taper that becomes thinner toward the tip, The slit hole is arranged non-parallel to the taper, When the control unit determines that the differential value is equal to or greater than a first threshold value and less than a second threshold value greater than the first threshold value, it determines that the component is adsorbed to the tip through which the light passes, A mounter.

2. The suction nozzle has a first edge and a second edge, One end of the slit hole is arranged in the height direction to be equal to or higher than the suction height of the component adsorbed to the tip and less than a predetermined height from the intersection of the first tangent line of the first edge and the second tangent line of the second edge, The mounter according to claim 1.

3. The predetermined height is the height of the component, The mounter according to claim 2.

4. The slit hole is arranged substantially parallel to the suction nozzle, The mounter according to claim 1.

5. When the control unit determines that the differential value is less than the first threshold value, it determines that the component is not adsorbed to the tip through which the light passes, and generates and outputs a notification indicating that the adsorption state of the component is defective, The mounter according to claim 1.

6. When the control unit determines that the differential value is equal to or greater than the second threshold value, it generates and outputs a notification indicating that the adsorption state of the component is defective, The mounter according to claim 1.

7. The control unit measures a time period during which the differential value is equal to or greater than the first threshold value and less than the second threshold value, and determines the adsorption posture of the component based on the measured time period, The mounter according to claim 1.

8. When the control unit determines that the length of the time period is equal to or greater than a third threshold value, the control unit determines that the adsorption posture of the component is defective, and generates and outputs a notification indicating that the adsorption state of the component is defective. The mounting machine according to claim 7.

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