Mold, imprinting device, and method for manufacturing an article

Abstract

To provide a technique advantageous in detecting a reference mark on a stage when a mold is used in which the periphery of a pattern area is configured to block light.SOLUTION: A mold having a pattern to be transferred to an imprint material on a substrate with the use of an imprint device includes a pattern area in which the pattern is arranged, and a peripheral area that surrounds the pattern area and blocks light. The pattern area has a first part that is arranged with a mark for measuring a relative position to a substrate mark provided on the substrate and passes an image of the substrate mark, and a second part that passes an image of a stage mark provided on a stage that holds the substrate. In plan view, the first part and the second part are arranged within a range of 10 μm or more and 350 μm or less from the boundary between the pattern area and the peripheral area in the pattern area.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a mold, an imprint apparatus, and a method for manufacturing an article.

Background Art

[0002] As one of lithographic apparatuses for manufacturing semiconductor devices, magnetic storage media, etc., an imprint apparatus is known that forms a pattern of an imprint material on a substrate using a mold (die) having a pattern region. In the imprint apparatus, after bringing the imprint material supplied onto the shot region of the substrate into contact with the pattern region of the mold, the imprint material is irradiated with light in that state to cure the imprint material, and then the mold is peeled off from the cured imprint material. Thereby, the pattern formed in the pattern region of the mold can be transferred to the imprint material on the shot region of the substrate.

[0003] In the imprint apparatus, in the contact step of bringing the mold into contact with the imprint material on the shot region, the imprint material may protrude from the shot region. When the imprint material protruding from the shot region in this way is cured, the mold comes into contact with the protruding imprint material in the contact step with an adjacent shot region, and the protruding imprint material can be peeled off from the substrate. The imprint material peeled off from the substrate may contaminate the inside of the apparatus as particles, or may damage the mold and / or the substrate when it adheres to the mold and / or the substrate. Patent Document 1 proposes a technique of providing a light-shielding portion for blocking the curing light for curing the imprint material around the pattern region of the mold to avoid curing of the imprint material protruding from the shot region.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In an imprint apparatus, for example, when a mold is carried into the apparatus, a reference mark (stage mark) on a stage that holds a substrate and a mark provided on the mold can be detected by a scope, and the relative position between the stage and the mold can be measured. In Patent Document 1, a light-shielding portion provided around the pattern region of the mold is configured to block the curing light that cures the imprint material and transmit the detection light for detecting the object to be inspected. However, configuring such a light-shielding portion may reduce the degree of freedom in wavelength selection of the curing light and the detection light, and may increase the noise generated during detection of the reference mark.

[0006] Therefore, an object of the present invention is to provide an advantageous technique for detecting a reference mark on a stage when using a mold configured such that the periphery of the pattern region blocks light.

Means for Solving the Problems

[0007] In order to achieve the above object, a mold according to one aspect of the present invention is a mold having a pattern to be transferred to an imprint material on a substrate using an imprint apparatus, the mold including a pattern region where the pattern is disposed, and a peripheral region that surrounds the pattern region and blocks light, The imprint apparatus includes a scope that detects a substrate mark provided on the substrate and a stage mark provided on a stage that holds the substrate, via the mold. the pattern region has a first portion through which an image of the substrate mark passes and a second portion through which an image of the stage mark passes for measuring the relative position with respect to the Base substrate mark, and the first portion and the second portion are disposed within a range of 10 μm or more and 350 μm or less from the boundary between the pattern region and the peripheral region in the pattern region in a plan view, which is characterized in that. For the scope to detect the substrate mark For the scope to detect the stage mark, the

[0008] ​​A further object or other aspect of the present invention will be clarified by the preferred embodiments described below with reference to the accompanying drawings.

Advantages of the Invention

[0009] According to the present invention, for example, when using a mold configured to block light around a pattern region, it is possible to provide an advantageous technique for detecting a reference mark on a stage.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.

[0012] <First Embodiment> A first embodiment of the present invention will be described. An imprint apparatus is a device that forms a pattern of a cured product in which an uneven pattern of a mold is transferred by bringing an imprint material supplied onto a substrate into contact with the mold and applying energy for curing to the imprint material. For example, the imprint apparatus supplies a liquid imprint material as a plurality of droplets onto a substrate, and irradiates the imprint material with light in a state where a mold (die) having an uneven pattern is brought into contact with the imprint material on the substrate to cure the imprint material. Then, by increasing the distance between the mold and the substrate and peeling (releasing) the mold from the cured imprint material, the pattern of the mold can be transferred to the imprint material on the substrate. Such a series of processes is called "imprint process" and is performed for each of a plurality of shot regions on the substrate.

[0013] As the imprint material, a curable composition (sometimes referred to as an uncured resin) that cures when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat, etc. are used. Examples of the electromagnetic wave include light such as infrared rays, visible rays, and ultraviolet rays whose wavelength is selected from the range of 10 nm or more and 1 mm or less.

[0014] The curable composition is a composition that cures by irradiation with light or by heating. Among these, the photocurable composition that cures by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component, and the like.

[0015] The imprint material is applied in a film form onto the substrate by a spin coater or a slit coater. Alternatively, it may be applied onto the substrate in the form of droplets, or in an island or film form formed by connecting a plurality of droplets, by a liquid ejection head. The viscosity (viscosity at 25°C) of the imprint material is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0016] [Configuration of Imprinting Apparatus] FIG. 1 is a schematic diagram showing a configuration example of an imprinting apparatus 100 according to the present embodiment. The imprinting apparatus 100 may include, for example, an imprint head 1 that holds a mold 10, a substrate stage 3 that holds and is movable with a substrate 2, a light irradiation unit 4, a supply unit 5, a detection unit 6, and a control unit 7. The control unit 7 is configured by, for example, a computer having a CPU (processor) and a memory, and controls each part of the imprinting apparatus 100 to execute (control) an imprinting process. Note that the imprinting apparatus 100 of the present embodiment employs a photocuring method in which light is irradiated onto an imprint material to cure the imprint material. Further, hereinafter, in a plane parallel to the surface of the substrate 2, two directions orthogonal to each other are defined as the X-axis direction and the Y-axis direction, and a direction perpendicular to the X-axis direction and the Y-axis direction is defined as the Z-axis direction. In the following description, when described as the "X-axis direction", it may be defined to include the +X direction and the -X direction. The same applies to the "Y-axis direction" and the "Z-axis direction".

[0017] The mold 10 is usually made of a material capable of transmitting ultraviolet rays such as quartz, and has a concavo-convex pattern to be transferred to the imprint material on the substrate 2 (each shot region) in a partial region (pattern region 11) on the surface on the substrate side. In the case of the present embodiment, the pattern region 11 has a mesa shape protruding toward the substrate side from a peripheral region 12 surrounding the pattern region 11 on the surface on the substrate side of the mold 10. The specific configuration of the mold 10 will be described later. Further, as the substrate 2, glass, ceramics, metal, semiconductor, resin, etc. are used, and if necessary, a member made of a material different from the substrate may be formed on its surface. Specifically, the substrate 2 is a silicon wafer, a compound semiconductor wafer, quartz glass, etc. Further, before applying the imprint material, an adhesion layer may be provided as necessary to improve the adhesion between the imprint material and the substrate.

[0018] The imprint head 1 may include a mold chuck 1a that holds the mold 10 by a vacuum force or the like, and a mold drive mechanism 1b that drives the mold (mold chuck 1a) in the Z-axis direction so as to change the distance between the mold 10 and the substrate 2. By driving the mold 10 in the Z-axis direction with the imprint head 1, a contact step of bringing the mold 10 into contact with the imprint material on the substrate 2 (each shot region), and a mold release step of peeling the mold 10 from the cured imprint material can be performed. The contact step may be understood as an imprinting step of pressing the mold 10 against the imprint material on the substrate 2. Further, the imprint head 1 may be configured to drive the mold 10 not only in the Z-axis direction but also in the X-axis direction, the Y-axis direction, the θ direction (rotation direction around the Z-axis), etc.

[0019] The substrate stage 3 may include a substrate chuck 3a that holds the substrate 2 by a vacuum force or the like, and a moving mechanism 3b that supports the substrate chuck 3a and is movable at least in the XY directions. By moving the substrate stage 3 (moving mechanism 3) in the XY directions, the substrate 2 can be driven in the XY directions to perform alignment between the mold 10 and the substrate 2. Further, the substrate stage 3 may be configured to drive the substrate 2 not only in the XY directions but also in the Z-axis direction and the θ direction.

[0020] In the case of this embodiment, a reference mark 8a (stage mark) is provided on the substrate stage 3. Specifically, a reference plate 8 is mounted on the substrate stage 3, and the reference mark 8a is provided on the upper surface of the reference plate 8. The reference plate 8 may be configured such that its upper surface is disposed at the same position (height) as the upper surface of the substrate 2 held by the substrate stage 3 (substrate chuck 3a) in the Z-axis direction. By detecting the reference mark 8a provided on the substrate stage 3 and the mold mark 13 provided on the mold 10 with a scope 6a described later, the relative position (relative positional relationship) between the substrate stage 3 and the mold 10 can be measured.

[0021] The light irradiation unit 4 (hardening unit) irradiates the imprint material on the substrate through the mold 10 with light (e.g., ultraviolet light) for hardening the imprint material, and hardens the imprint material. The light irradiation unit 4 may include, for example, a light source that emits light (hardening light) for hardening the imprint material, and an optical system for adjusting the light emitted from the light source to optimal light in the imprint process. Further, the supply unit 5 (discharge unit, dispenser) supplies the imprint material onto the substrate 2 (each shot area). In the present embodiment, a resin that is hardened by light irradiation can be used as the imprint material. For example, the supply unit 5 can supply the imprint material onto the substrate by discharging the imprint material as a plurality of droplets onto the substrate while the substrate 2 is moving relative to the supply unit 5 by the substrate stage 3.

[0022] The detection unit 6 (detection optical system) includes a scope 6a that detects, through the mold 10, a substrate mark 2a provided on the substrate 2 and / or a reference mark 8a provided on the substrate stage 3. The scope 6a includes, for example, an imaging element and an imaging optical system, and detects (images) the substrate mark 2a or the reference mark 8a together with the mold mark 13 of the mold 10. In the case of the present embodiment, the detection unit 6 detects (images) the mold mark 13 and the substrate mark 2a in a state where the mold mark 13 of the mold 10 and the substrate mark 2a of the substrate 2 are included in the field of view of the scope 6a. Thereby, the control unit 7 can obtain the relative position between the pattern area 11 (mold mark 13) of the mold 10 and the shot area (substrate mark 2a) of the substrate 2 based on the detection result of the detection unit 6. Further, the detection unit 6 detects (images) the mold mark 13 of the mold 10 and the reference mark 8a of the substrate stage 3 in a state where the mold mark 13 of the mold 10 and the reference mark 8a of the substrate stage 3 are included in the field of view of the scope 6a. Thereby, the control unit 7 can obtain the relative position between the mold 10 (mold mark 13) and the substrate stage 3 (reference mark 8a) based on the detection result of the detection unit 6. Here, the detection unit 6 may include a plurality of scopes 6a so that not only the relative position between the pattern area 11 of the mold 10 and the shot area of the substrate 2 but also the shape difference therebetween can be measured.

[0023] Further, although not shown in FIG. 1, the imprint apparatus 100 may include a deforming portion that deforms the mold 10 (pattern region 11) into a convex shape with its central portion protruding toward the substrate 2. A cavity 14 (core-out portion, recess) is formed on a surface of the mold 10 opposite to the surface provided with the pattern region 11, and the cavity becomes a substantially sealed space while the mold 10 is held by the imprint head 1. The deforming portion can deform the mold 10 (pattern region 11) into a convex shape by controlling the supply of compressed air into the cavity 14 of the mold 10 to adjust the internal pressure of the cavity 14 while the mold 10 is held by the imprint head 1. For example, by deforming the mold 10 into a convex shape in the contact step, the contact area between the mold 10 and the imprint material on the substrate can be gradually increased, and the bubbles remaining between the mold 10 and the imprint material can be reduced. That is, the defect of the pattern of the imprint material formed on the substrate by the imprint process can be reduced.

[0024] [Configuration of Mold] Next, a configuration example of the mold 10 of the present embodiment will be described. Conventionally, when measuring the relative position between the mold and the substrate stage 3, the reference mark 8a of the substrate stage 3 is detected by the scope 6a of the detection unit 6 through the peripheral region (i.e., the region outside the pattern region) surrounding the pattern region of the mold. However, in recent years, in order to avoid curing of the imprint material protruding from the shot region in the contact step, the peripheral region of the mold is configured to block light, such as by providing a light-shielding film. In this case, it may be difficult to accurately measure the relative position between the mold 10 and the substrate stage 3 by simultaneously bringing the mold mark 13 and the reference mark 8a within the field of view of the scope 6a. Therefore, in the mold 10 of the present embodiment, a first portion 11a through which the image of the substrate mark 2a passes and a second portion 11b through which the image of the reference mark 8a passes are provided in the pattern region 11 while the mold mark 13 is arranged.

[0025] FIG. 2 is a schematic diagram showing an overall configuration example of the mold 10 of the present embodiment. FIG. 2(a) is a view of the mold 10 of the present embodiment seen from above (+Z direction side), and FIG. 2(b) is a view of the mold 10 of the present embodiment seen from the side (-Y direction side). The mold 10 has a pattern region 11 in which a concavo-convex pattern to be transferred to the imprint material on the substrate 2 (each shot region) is arranged on the surface on the substrate side, and a peripheral region 12 that blocks light around the pattern region 11. As described above, the pattern region 11 has a mesa shape protruding from the substrate side more than the peripheral region 12. The peripheral region 12 has a light-shielding film on the surface on the substrate side. Further, the mold 10 has a cavity 14 on the surface opposite to the surface provided with the pattern region 11. The cavity 14 can be formed in the mold 10 with dimensions including at least the pattern region 11 in a plan view (that is, when viewed from the +Z direction). Here, in the example of FIG. 2, in the peripheral region 12, the light-shielding film is provided on the surface on the substrate side, but it is not limited thereto, and the light-shielding film may be provided on the surface opposite to the surface on the substrate side (for example, inside the cavity 14).

[0026] FIG. 3 is a schematic diagram showing a configuration example of the pattern region 11 of the mold 10 of the present embodiment. In FIG. 3, a view of only the pattern region 11 seen from above (+Z direction) is shown. As described above, in the pattern region 11 of the mold 10 of the present embodiment, a mold mark 13 is arranged, and a first portion 11a that allows the image of the substrate mark 2a to pass through and a second portion 11b that allows the image of the reference mark 8a to pass through are provided. Concavo-convex patterns to be transferred to the imprint material on the substrate are formed in a portion 11c of the pattern region 11 other than the first portion 11a and the second portion 11b.

[0027] The first part 11a and the second part 11b are arranged within a range of 10 μm or more and 350 μm or less from the boundary B between the pattern region 11 and the surrounding region 12 in a plan view. By such an arrangement, the influence of the first part 11a and the second part 11b on the pattern layout in the pattern region 11 can be reduced. Also, the first part 11a and the second part 11b are preferably arranged in the pattern region 11 so as to be simultaneously within the field of view of the scope 6a of the detection unit 6. Thereby, since the image of the mold mark 13 provided in the first part 11a and the image of the reference mark 8a that has passed through the second part 11b can be simultaneously detected by the scope 6a, the relative position between the mold 10 and the substrate stage 3 can be accurately measured.

[0028] Here, in the pattern region 11, it is preferable that a plurality of sets each consisting of one first part 11a and one second part 11b are arranged. In the example shown in FIG. 3, the pattern region 11 has a rectangular shape, and the sets are arranged at the four corners of the pattern region 11, respectively. Thereby, the relative position between the mold mark 13 and the substrate mark 2a can be detected in each of the plurality of first parts 11a, and the relative position (XY direction, θ direction) and / or shape difference between the pattern region 11 of the mold 10 and the shot region of the substrate 2 can be accurately measured. Also, since the relative position between the mold mark 13 and the reference mark 8a can be detected using each of the plurality of second parts 11b, the relative position (XY direction, θ direction) between the mold 10 and the substrate stage 3 can be accurately measured.

[0029] FIG. 4 is a diagram showing a set consisting of one first part 11a and one second part 11b, and shows an enlarged view of the first part 11a and the second part 11b arranged at the upper left of the drawing sheet of the pattern region 11 in FIG. 3.

[0030] The first part 11a is configured to pass an image of the substrate mark 2a provided on the substrate 2, and a mold mark 13 for measuring the relative position with respect to the substrate mark 2a is arranged. In the example shown in FIG. 4, a fine inspection mark 13a and a rough inspection mark 13b as the mold mark 13 are arranged in the first part 11a. The fine inspection mark 13a is a mark for detecting the relative position between the mold 10 and the substrate 2 with high precision, and can be constituted by a diffraction grating that generates moiré fringes by overlapping with the fine inspection mark of the substrate mark 2. On the other hand, the rough inspection mark 13b is a mark for detecting the relative position between the mold 10 and the substrate 2 with low precision, and specifically, it is a mark for specifying the position of the fine inspection mark. Conceptually explaining the fine inspection mark 13a and the rough inspection mark 13b, for example, when the relative position between the mold 10 and the substrate 2 is represented by a two-digit value, the relative position in the tens place can be detected by the rough inspection mark 13b, and the relative position in the units place can be detected by the fine inspection mark 13a.

[0031] The second part 11b is configured to pass an image of the reference mark 8a provided on the substrate stage 3. In the second part 11b, no pattern to be transferred to the imprint material on the substrate may be arranged, or a pattern configured with dimensions smaller than the spatial resolution of the scope 6a of the detection unit 6 may be arranged. The "pattern configured with dimensions smaller than the spatial resolution" refers to a pattern configured with dimensions that cannot be detected (recognized) by the scope 6a. For example, when the pattern arranged in the second part 11b is constituted by a plurality of line elements (i.e., line and space pattern), the dimensions of the pattern can be defined as the line width and interval of the line elements that cannot be detected by the scope 6a. Also, the dimensions of the pattern arranged in the second part 11b can be equal to or less than (for example, 1 / 5, 1 / 10, or 1 / 50) the dimensions of the pattern arranged in the part 11c other than the first part 11a and the second part 11b. The pattern arranged in the part 11c other than the first part and the second part may be configured with dimensions smaller than the spatial resolution of the scope 6a.

[0032] [Imprinting Process] Next, the imprinting process executed by the imprinting apparatus 100 using the mold 10 described above will be explained. FIG. 5 is a flowchart showing the imprinting process of the present embodiment. Each step of the flowchart shown in FIG. 5 can be controlled by the control unit 7.

[0033] In step S11, the control unit 7 conveys the mold 10 under the imprint head 1 (mold chuck 1a) by a mold conveyance mechanism (not shown), and causes the mold chuck 1a to hold the mold 10. At this time, the position of the scope 6a may be adjusted by a drive mechanism (not shown) so that the first portion 11a and the second portion 11b of the pattern region 11 of the mold 10 are arranged within the visual field of the scope 6a of the detection unit 6.

[0034] In step S12, the control unit 7 moves the substrate stage 3 to place the reference mark 8a below the second portion 11b of the mold 10, and as shown in FIG. 6, causes the mold mark 13 and the reference mark 8a to be simultaneously detected by the scope 6a (detection unit 6). FIG. 6 shows a state where the scope 6a is simultaneously detecting the mold mark 13 and the reference mark 8a. The mold mark 13 is the fine inspection mark 13a and / or the rough inspection mark 13b arranged in the first portion 11a. Also, the reference mark 8a is detected by the scope 6a through the second portion 11b of the mold 10. Through this step, the control unit 7 can obtain the relative position between the mold 10 and the substrate stage 3 based on the detection result of the scope 6a, and thus can accurately drive the substrate stage 3 with respect to the mold 10 based on the information of the relative position. Note that in this step S12, the mold mark 13 and the reference mark 8a may be simultaneously detected by the scope 6a in a state where the mold 10 (pattern region) is deformed into a convex shape in the same manner as in the actual imprinting process. Thereby, the relative position between the mold 10 and the substrate stage 3 at the time of actual imprinting can be obtained.

[0035] In step S13, the control unit 7 conveys the substrate 2 onto the substrate stage 3 (substrate chuck 3a) by a substrate conveyance mechanism (not shown) and causes the substrate chuck 3a to hold the substrate. Next, in step S14, the control unit 7 determines whether an imprint material has already been supplied onto the target shot area for performing the imprint process. For example, the control unit 7 can acquire information indicating that the imprint material has been supplied onto the substrate 2 by an external device and make the determination based on that information. If the imprint material has not yet been supplied onto the target shot area, the process proceeds to step S15, where the control unit 7 positions the target shot area below the supply unit 5 and causes the supply unit 5 to supply the imprint material onto the target shot area (supply step). On the other hand, if the imprint material has already been supplied onto the target shot area, the process proceeds to step S16.

[0036] In step S16, the control unit 7 positions the target shot area below the pattern area 11 of the mold 10 by moving the substrate stage 3. Then, the control unit 7 drives the mold 10 in the -Z direction with respect to the imprint head 1 to narrow the gap between the mold 10 and the substrate 2, thereby bringing the mold 10 into contact with the imprint material on the target shot area (contact step). At this time, as described above, the control unit 7 may deform the mold 10 (pattern area 11) into a convex shape by the deformation unit. Next, in step S17, the control unit 7 waits until a predetermined time has elapsed so that the pattern recesses of the mold 10 are filled with the imprint material (filling step).

[0037] In step S18, the control unit 7 causes the scope 6a (detection unit 6) to simultaneously detect the mold mark 13 and the substrate mark 2a. Then, based on the relative positions of the mold mark 13 and the substrate mark 2a detected by the scope 6a, alignment is performed between the pattern region 11 of the mold 10 and the target shot region of the substrate 2 (alignment step). The substrate mark 2a is disposed at a position corresponding to the mold mark 13 within the target shot region, and like the mold mark 13, may include a fine inspection mark and a rough inspection mark. And the substrate mark 2a can be detected simultaneously (e.g., superimposed) with the mold mark 13 by the scope 6a through the first portion 11a of the mold 10. Here, in this step S18, the control unit 7 may correct the shape difference between the pattern region 11 and the target shot region by applying a force to the side surface of the mold 10 or heating the substrate 2 based on the detection result by the scope 6a.

[0038] In step S19, with the pattern region 11 of the mold 10 in contact with the imprint material on the target shot region, the control unit 7 cures the imprint material by irradiating the imprint material with light using the light irradiation unit 4 (curing step). Next, in step S20, the control unit 7 drives the mold 10 in the +Z direction with respect to the imprint head 1 to widen the gap between the mold 10 and the substrate 2, thereby peeling the mold 10 from the cured imprint material on the target shot region (demolding step). Thereby, a pattern made of a cured product of the imprint material is formed on the target shot region.

[0039] In step S21, the control unit 7 determines whether the shot area (next shot area) for which imprint processing is to be performed next is on the substrate 2. If there is a next shot area, the process proceeds to step S14, and imprint processing is executed with the next shot area as the target shot area. On the other hand, if there is no next shot area, the process proceeds to step S22, and the control unit 7 unloads the substrate 2 from above the substrate stage 3 by a substrate transfer mechanism (not shown). Next, in step S23, the control unit 7 determines whether there is a substrate (next substrate) for which imprint processing is to be performed next. If there is a next substrate, the process proceeds to step S13, and imprint processing is executed on the next substrate. On the other hand, if there is no next substrate, the process proceeds to step S24, and the control unit 7 unloads the mold 10 from the imprint head 1 by a mold transfer mechanism (not shown).

[0040] As described above, in the mold 10 of the present embodiment, the first portion 11a through which the mold mark 13 is disposed and the image of the substrate mark 2a passes, and the second portion 11b through which the image of the reference mark 8a passes are provided in the pattern area 11. Thereby, even if the surrounding area 12 that blocks light is provided around the pattern area 11, it is possible to simultaneously and accurately detect the reference mark 8a provided on the substrate stage 3 and the mold mark 13 with the scope 6a. That is, it is possible to accurately measure the relative position between the mold 10 and the substrate stage 3.

[0041] <Second Embodiment> The second embodiment according to the present invention will be described. In the first embodiment, in step S12, an example in which the mold mark 13 and the reference mark 8a are detected with one scope 6a using only one set consisting of the first portion 11a and the second portion 11b was described. However, the present invention is not limited thereto, and in step S12, an example in which the mold mark 13 and the reference mark 8a are detected in each of a plurality of scopes 6a will be described. Note that this embodiment basically inherits the first embodiment, and the configuration and processing of the imprint apparatus 100 are the same as those of the first embodiment unless otherwise specified below.

[0042] In the above-described step S12, FIG. 7 shows a state in which each of a plurality of scopes 6a simultaneously detects a mold mark 13 and a reference mark 8a. Specifically, each of the plurality of scopes 6a, with the first part 11a and the second part 11b within the field of view, detects the reference mark 8a via the second part 11b together with the mold mark 13 disposed on the first part 11a. As described above, a set consisting of the first part 11a and the second part 11b is arranged in plurality in the pattern region 11, and a plurality of scopes 6a are provided so as to respectively correspond to the plurality of sets. Thus, in the present embodiment, each of the plurality of scopes 6a is made to detect the mold mark 13 and the reference mark 8a. Thereby, not only the position (XY direction) of the substrate stage 3 with respect to the mold 10, but also the rotational component (θ direction) of the substrate stage with respect to the mold 10, the magnification component and the trapezoidal component of the pattern region 11 of the mold 10 can be measured.

[0043] <Third Embodiment> The third embodiment according to the present invention will be described. This embodiment basically inherits the first to second embodiments, and the configuration and processing of the imprint apparatus 100 are the same as those of the first to second embodiments unless otherwise specifically mentioned below.

[0044] In this embodiment, an example of a method for detecting the mold mark 13 and the reference mark 8a in the scope 6a will be described. The control unit 7 drives the substrate stage 3 in the XY directions so that the mold mark 13 and the reference mark 8a are within the field of view of the scope 6a, and arranges the reference mark 8a under the second portion 11b of the pattern region 11 of the mold 10. Then, the imprint head 1 drives the mold 10 in the Z-axis direction, and arranges the first portion 11a (mold mark 13) and the second portion 11b on the focus plane of the scope 6a. In this state, the scope 6a detects the mold mark 13 provided on the first portion 11a, and stores the XY-direction position of the obtained mold mark 13. Next, the control unit 7 drives the mold 10 by the imprint head 1 in the Z-axis direction so that the detection signal of the reference mark 8a by the scope 6a becomes equal to or less than the threshold value (for example, so that the line width of the reference mark 8a becomes minimum). Then, with the detection signal being equal to or less than the threshold value, the scope 6a detects the reference mark 8a through the second portion 11b, and stores the XY-direction position of the obtained reference mark 8a. Thereby, the relative position between the mold mark 13 and the reference mark 8a, that is, the relative position between the mold 10 and the substrate stage 3 can be accurately measured.

[0045] <Embodiment of method for manufacturing article> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The method for manufacturing an article of this embodiment includes a step of forming a pattern on an imprint material supplied (coated) to a substrate using the above-described imprint apparatus (imprint method), and a step of processing the substrate on which the pattern has been formed in such a step. Further, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

[0046] The pattern of the cured product formed using the imprint apparatus is permanently used for at least a part of various articles, or temporarily used when manufacturing various articles. The article is an electric circuit element, an optical element, MEMS, a recording element, a sensor, or a mold or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold or the like.

[0047] The pattern of the cured product is used as it is as a constituent member of at least a part of the above article, or temporarily used as a resist mask. After etching, ion implantation, or the like is performed in the substrate processing step, the resist mask is removed.

[0048] Next, a specific manufacturing method of the article will be described. As shown in Fig. 8(a), a substrate 1z such as a silicon wafer having a workpiece 2z such as an insulator formed on its surface is prepared, and then an imprint material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state where a plurality of droplet-shaped imprint materials 3z are applied on the substrate is shown.

[0049] As shown in Fig. 8(b), an imprint mold 4z is opposed with the side on which the concavo-convex pattern is formed facing the imprint material 3z on the substrate. As shown in Fig. 8(c), the substrate 1z to which the imprint material 3z is applied and the mold 4z are brought into contact with each other and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z as energy for curing in this state, the imprint material 3z cures.

[0050] As shown in Fig. 8(d), after curing the imprint material 3z and then separating the mold 4z from the substrate 1z, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. The pattern of this cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the convex portion of the mold corresponds to the concave portion of the cured product. That is, the uneven pattern of the mold 4z has been transferred to the imprint material 3z.

[0051] As shown in Fig. 8(e), when etching is performed using the pattern of the cured product as an etching mask, the portion of the surface of the workpiece 2z where the cured product is absent or remains thinly is removed, forming a groove 5z. As shown in Fig. 8(f), when the pattern of the cured product is removed, an article with a groove 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured product has been removed, but it may also be used as a component of the article, for example, as a film for interlayer insulation included in a semiconductor element or the like, without being removed after processing.

[0052] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, claims are appended to disclose the scope of the invention.

Explanation of Reference Numerals

[0053] 1: Imprint head, 2: Substrate, 2a: Substrate mark, 3: Substrate stage, 7: Control unit, 8a: Reference mark, 10: Mold, 11: Pattern region, 11a: First part, 11b: Second part, 12: Peripheral region, 13: Mold mark, 100: Imprint apparatus

Claims

1. A mold having a pattern to be transferred onto an imprint material on a substrate using an imprint apparatus, a pattern region where the pattern is disposed, a peripheral region surrounding the pattern region and blocking light, and comprising, the imprint apparatus includes a scope for detecting a substrate mark provided on the substrate and a stage mark provided on a stage for holding the substrate through the mold, the pattern region has a first portion where a mark for measuring a relative position with respect to the substrate mark is disposed and through which an image of the substrate mark passes for the scope to detect the substrate mark, and a second portion through which an image of the stage mark passes for the scope to detect the stage mark, the first portion and the second portion are disposed within a range of 10 μm or more and 350 μm or less from a boundary between the pattern region and the peripheral region in the pattern region in a plan view, A mold characterized by that.

2. The mold according to claim 1, wherein the pattern disposed in the second portion is configured with a dimension smaller than a spatial resolution of the scope.

3. The mold according to claim 2, wherein the pattern disposed in the second portion is configured with a dimension equal to or smaller than a dimension of the pattern disposed in a portion other than the first portion and the second portion.

4. A mold having a pattern to be transferred onto an imprint material on a substrate using an imprint apparatus, a pattern region where the pattern is disposed, a peripheral region surrounding the pattern region and blocking light, and comprising, the pattern region has a first portion where a mark for measuring a relative position with respect to a substrate mark provided on the substrate is disposed and through which an image of the substrate mark passes, and a second portion through which an image of a stage mark provided on a stage for holding the substrate passes, the first portion and the second portion are disposed within a range of 10 μm or more and 350 μm or less from a boundary between the pattern region and the peripheral region in the pattern region in a plan view, the imprint apparatus includes a scope for detecting the stage mark through the second portion, The pattern disposed in the second portion is configured with dimensions smaller than the spatial resolution of the scope and smaller than the dimensions of the pattern disposed in portions other than the first portion and the second portion. A mold characterized by this.

5. The mold according to claim 1, wherein no pattern is disposed in the second portion.

6. The mold according to any one of claims 1 to 5, wherein the pattern region is configured in a mesa shape protruding from the peripheral region.

7. The mold according to any one of claims 1 to 6, wherein a light-shielding film for blocking light is provided in the peripheral region.

8. The mold according to any one of claims 1 to 7, wherein the first portion and the second portion are disposed in the pattern region so as to be simultaneously accommodated within the field of view of the scope.

9. The mold according to any one of claims 1 to 8, wherein a plurality of sets each consisting of the first portion and the second portion are disposed in the pattern region.

10. The pattern region has a rectangular shape, The mold according to claim 9, wherein the set is disposed at each of the four corners of the pattern region.

11. An imprint apparatus for forming a pattern of an imprint material on a substrate using the mold according to any one of claims 1 to 10, A stage that holds and is movable with the substrate, A scope that detects a substrate mark provided on the substrate and a stage mark provided on the stage through the mold, A control unit that controls the detection of the mark by the scope such that the scope detects the substrate mark through the first portion of the pattern region of the mold and the scope detects the stage mark through the second portion of the pattern region. An imprint apparatus characterized by comprising.

12. A step of forming a pattern on a substrate using the imprint apparatus according to claim 11, A step of processing the substrate on which the pattern is formed, and includes, A method for manufacturing an article, characterized by manufacturing an article from the processed substrate.

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