Imprinting method, imprinting apparatus, and method for manufacturing an article

Abstract

To provide a technique advantageous in accurately forming a pattern of an imprint material on a substrate having a dimension smaller than a dimension of a holding surface of a substrate stage.SOLUTION: An imprint method of forming, using a mold, a pattern of an imprint material on a substrate having a dimension smaller than a dimension of a holding surface of a substrate stage, the method includes: causing the holding surface of the substrate stage to hold a plate having a dimension larger than the dimension of the substrate; causing the plate to support the substrate; bringing the mold into contact with the imprint material supplied onto the substrate; curing the imprint material on the substrate; and separating the mold from the cured imprint material. Upon in the separating, the holding of the plate by the substrate stage is controlled while maintaining supporting of the substrate by the plate, such that the substrate is deformed into a convex shape together with the plate when separating the mold from the imprint material.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an imprint method, an imprint apparatus, and a method for manufacturing an article.

Background Art

[0002] As a technique for forming a fine pattern on a substrate, an imprint technique for forming a pattern of an imprint material on a substrate using a mold is known. In the imprint technique, a liquid imprint material is supplied onto a substrate, the mold is brought into contact with the imprint material on the substrate, and then the imprint material is cured in that state, and the mold is separated (peeled off) from the cured imprint material. Thereby, a pattern of the imprint material can be formed on the substrate.

[0003] In the imprint technique, in the separation step of separating the mold from the cured imprint material, distortion or defects may occur in the pattern of the imprint material formed on the substrate. Patent Document 1 proposes a technique for reducing the distortion or defects of the uneven pattern generated in the separation step by locally deforming the substrate into a convex shape in the separation step.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The imprinting technique may be applied to a substrate having a size smaller than the holding surface of the substrate stage (hereinafter sometimes referred to as a small-diameter substrate). In this case, when the small-diameter substrate is deformed into a convex shape in the separation step as described in Patent Document 1, the holding force for holding the small-diameter substrate on the holding surface of the substrate stage may become insufficient with respect to the release force for releasing the mold. As a result, the small-diameter substrate may come off the substrate stage as the mold is separated.

[0006] Therefore, an object of the present invention is to provide a technique advantageous for accurately forming a pattern of an imprint material on a substrate having a size smaller than the holding surface of a substrate stage.

Means for Solving the Problems

[0007] To achieve the above object, an imprint method according to one aspect of the present invention is an imprint method for forming a turn on a substrate having a size smaller than the holding surface of a substrate stage, including: a step of holding a plate having a size larger than the substrate on the holding surface of the substrate stage; a step of supporting the substrate on the plate; a contact step of bringing an imprint material supplied onto the substrate into contact with the mold; a curing step of curing the imprint material on the substrate; and a separation step of separating the mold from the cured imprint material, wherein in the separation step, when separating the mold from the imprint material, the holding of the plate by the substrate stage is controlled so that the substrate is deformed into a convex shape. of substrate the imprint material supplied onto using a mold pa plate larger than the substrate of a step of holding the plate on the holding surface of the substrate stage; before a step of supporting the substrate on the plate; and a contact step of bringing an imprint material supplied onto the substrate into contact with the mold; a curing step of curing the imprint material on the substrate; and a separation step of separating the mold from the cured imprint material, wherein in the separation step, when separating the mold from the imprint material, the holding of the plate by the substrate stage is controlled so that the substrate is deformed into a convex shape. said contact step of bringing the imprint material and the mold into contact with each other; a curing step of curing the imprint material on the substrate; and a separation step of separating the mold from the cured imprint material, wherein in the separation step, when separating the mold from the imprint material, the holding of the plate by the substrate stage is controlled so that the substrate is deformed into a convex shape. 、 the substrate is is deformed into a convex shape 、 to control the holding of the plate by the substrate stage, characterized in that.

[0008] A further object or other aspect of the present invention will be clarified by the preferred embodiments described below with reference to the accompanying drawings.

Advantages of the Invention

[0009] According to the present invention, for example, it is possible to provide a technique advantageous for accurately forming a pattern of an imprint material on a substrate having a size smaller than the holding surface of a substrate stage.

Brief Description of the Drawings

[0010]

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Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.

[0012] <First Embodiment> The first embodiment according to the present invention will be described. An imprint apparatus is an apparatus that forms a pattern of a cured product in which an uneven pattern of a mold is transferred by bringing an imprint material supplied onto a substrate into contact with the mold and applying energy for curing to the imprint material. For example, the imprint apparatus supplies a liquid imprint material as a plurality of droplets onto a substrate, and irradiates the imprint material with light in a state where a mold having an uneven pattern is brought into contact with the imprint material on the substrate to cure the imprint material. Then, by increasing the distance between the mold and the substrate and separating (peeling) the mold from the cured imprint material, the pattern of the mold can be transferred to the imprint material on the substrate. Such a series of processes is called "imprint process" and is performed for each of a plurality of shot regions on the substrate.

[0013] As the imprint material, a curable composition (sometimes referred to as an uncured resin) that cures when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat, etc. are used. As the electromagnetic wave, for example, light such as infrared rays, visible light, and ultraviolet rays whose wavelength is selected from the range of 10 nm or more and 1 mm or less is used.

[0014] The curable composition is a composition that cures by irradiation with light or by heating. Among these, the photocurable composition that cures by light contains at least a polymerizable compound and a photoinitiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group such as a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component.

[0015] The imprint material is applied in a film form onto the substrate by a spin coater or a slit coater. Alternatively, it may be applied onto the substrate in a droplet form, or in an island or film form formed by connecting a plurality of droplets, by a liquid ejection head. The viscosity of the imprint material (viscosity at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0016] [Configuration of Imprinting Apparatus] The configuration of the imprinting apparatus 100 according to the present embodiment will be described with reference to FIGS. 1 to 2. FIG. 1 is a schematic diagram showing the configuration of the imprinting apparatus 100 according to the present embodiment. FIG. 2 is a top view of the upper surface of the substrate stage ST. In the following description, in a plane parallel to the upper surface of the substrate 1, the directions orthogonal to each other are defined as the X-axis direction and the Y-axis direction, and the direction perpendicular to the surface of the substrate 1 is defined as the Z-axis direction. Note that the "X-axis direction" can be defined to include the +X direction and the -X direction. The same applies to the "Y-axis direction" and the "Z-axis direction".

[0017] The imprinting apparatus 100 according to the present embodiment may include, for example, a substrate stage ST that holds and is movable with the substrate 1, an imprint head IH that holds the mold 10, an irradiation unit 15, a first measurement unit 16, a second measurement unit 17, a supply unit 18, and a control unit 19. The control unit 19 is configured by a computer having, for example, a CPU and a memory, controls each part of the imprinting apparatus 100, and controls the imprinting process for each of a plurality of shot regions on the substrate 1.

[0018] The mold 10 is usually made of a material capable of transmitting ultraviolet rays such as quartz, and an uneven pattern to be transferred to the imprinting material on the substrate is formed in a partial region (pattern region 11) on the surface on the substrate side. The pattern region 11 has, for example, a mesa shape configured by a step of about several tens of μm. As the substrate 1, glass, ceramics, metal, semiconductor, resin, etc. are used, and a member made of a material different from the substrate may be formed on the surface thereof as necessary. Specifically, the substrate 1 is a silicon wafer, a compound semiconductor wafer, quartz glass, etc. Further, before applying the imprinting material, an adhesion layer may be provided as necessary to improve the adhesion between the imprinting material and the substrate.

[0019] The substrate stage ST is configured to hold and move the substrate 1 by a holding surface. The substrate stage ST may include, for example, a substrate chuck 3 that generates a holding force such as a vacuum pressure on the holding surface to hold the substrate 1 on the holding surface, and a movable part 4 that supports the substrate chuck 3 and is movable in the XY direction on the surface plate 8. The holding surface of the substrate chuck 3 may be understood as the upper surface of the substrate chuck 3 (the surface on which the substrate 1 is placed). Further, the movable part 4 is provided with an air guide 21 for floating the movable part 4 from the surface plate 8 by ejecting compressed air toward the surface plate 8, and is driven by a drive mechanism including a beam member 5, a first drive part 6, and a second drive part 7. Thereby, the movable part 4 can move in the XY direction along the upper surface of the surface plate 8 in a state of floating from the surface plate 8.

[0020] The beam member 5 is a member extending in the X direction to guide (guide) the movement of the movable part 4 in the X-axis direction, and is arranged to penetrate an opening (recess) provided in the movable part 4. The beam member 5 may include a guide part 5a for guiding the movement of the movable part 4 and a support part 5b for supporting the guide part 5a at both ends (in the X-axis direction) of the guide part 5a. The movable element 7b of the second drive part 7 described later is provided on the support part 5b, and air guides 22 and 23 are provided. The air guide 22 ejects compressed air toward the surface plate 8 to float the beam member 5 from the surface plate 8, and the air guide 23 ejects compressed air toward the stator 7a of the second drive part 7 to position the beam member 5 in the X-axis direction. Further, as shown in FIG. 2, an air guide 24 is provided on the side surface (the surface on the side of the beam member 5) of the opening provided in the movable part 4. By ejecting compressed air from the air guide 24 toward the side surface of the beam member 5 (guide part 5a), the movable part 4 can be positioned with respect to the beam member 5.

[0021] The first drive unit 6 drives the movable unit 4 in the X-axis direction along the beam member 5. The first drive unit 6 may include, for example, a linear motor composed of a stator 6a having a plurality of coils arranged along the X-axis direction and a mover 6b having a permanent magnet. In the present embodiment, as shown in FIG. 2, the stator 6a of the first drive unit 6 is provided on the beam member 5 (guide portion 5a), and the mover 6b is provided on the movable unit 4. Further, the second drive unit 7 drives the beam member 5 in the Y-axis direction. The second drive unit 7 may include, for example, a linear motor composed of a stator 7a having a plurality of coils arranged along the Y-axis direction and a mover 7b having a permanent magnet. In the present embodiment, the mover 7b of the second drive unit 7 is provided on the support portion 5b of the beam member 5.

[0022] Here, the substrate 1 used in the present embodiment is a substrate (small-diameter substrate) having a dimension smaller than the holding surface of the substrate stage ST (substrate chuck 3), and is held by the substrate stage ST via a plate 2 having a dimension larger than that of the substrate 1 and is supported by the plate 2. The plate 2 is sometimes also called an intermediate tray plate, has a dimension capable of covering the holding surface of the substrate stage ST, and is held by the holding surface of the substrate stage ST by a holding force such as a vacuum pressure. Further, the plate 2 is configured to support (hold) the substrate 1 by the vacuum pressure supplied from the substrate stage ST. By using the plate 2 in this way, even a substrate 1 having a dimension smaller than the holding surface of the substrate stage ST can be held by the substrate stage ST, and the substrate 1 can be driven in the XY directions by the substrate stage ST. As an example, the dimension (diameter) of the plate 2 is 12 inches similar to the outer shape of the holding surface of the substrate stage ST, and the dimension (diameter) of the substrate 1 can be 8 inches or less smaller than the plate 2. The specific configuration of the plate 2 will be described later.

[0023] The imprint head IH may include, for example, a mold chuck 12, a mold stage 13, and a mold drive unit 14. The mold chuck 12 is supported by the mold stage 13 and holds the mold 10 by a holding force such as a vacuum pressure. The mold chuck 12 and the mold stage 13 are provided with an opening (not shown) for allowing the light from the irradiation unit 15 to pass through. Further, the mold stage 13 may be provided with a sensor 20 for detecting the height of the substrate 1 held by the substrate stage ST, a load cell (not shown) for detecting the pressure when the mold 10 is imprinted (pressed) on the imprint material on the substrate, and the like.

[0024] The mold drive unit 14 includes an actuator for moving the mold up and down, and drives the mold 10 in the Z-axis direction together with the mold chuck 12 and the mold stage 13. Specifically, the mold drive unit 14 has a function of driving the mold 10 in the Z-axis direction so as to bring the mold 10 into contact with the imprint material on the substrate or separate (peel) the mold 10 from the cured imprint material. Further, the mold drive unit 14 may have a function of correcting the inclination (posture) of the mold 10 according to the substrate 1.

[0025] The irradiation unit (curing unit) 15 irradiates the imprint material with light (for example, ultraviolet light) through the mold 10 in a state where the mold 10 and the imprint material on the substrate are in contact with each other, and cures the imprint material. The irradiation unit 15 may include, for example, a light source and an optical system (such as a collimator lens) for shaping the light emitted from the light source.

[0026] The first measurement unit 16 may include, for example, a TTM (Through The Mold) scope provided on the mold stage 13. Specifically, the first measurement unit 16 has an optical system and an imaging system for detecting a reference mark provided on the substrate stage ST and / or an alignment mark provided on the substrate 1 via the alignment mark provided on the mold 10. Then, based on the detection result by the TTM scope, the first measurement unit 16 measures the relative position between the mold 10 and the substrate 1 (each shot area) in the XY direction and / or the relative position between the mold 10 and the substrate stage ST.

[0027] The second measurement unit 17 may include an off-axis scope having an optical system and an imaging system for detecting a reference mark provided on the substrate stage ST and / or an alignment mark provided on the substrate 1 without passing through the mold 10. Then, based on the detection result by the off-axis scope, the second measurement unit 17 measures the relative position between the mold 10 and the substrate 1 (each shot area) in the XY direction and / or the relative position between the mold 10 and the substrate stage ST. Thereby, the control unit 19 can control the alignment between the mold 10 and the substrate 1 based on the measurement result of the first measurement unit 16 and / or the measurement result of the second measurement unit 17.

[0028] The supply unit 18 includes a dispenser having a discharge port for discharging an imprint material (for example, a photocurable resin), and supplies the imprint material onto the substrate by discharging (dropping) the imprint material from the dispenser. The supply unit 18 (dispenser) adopts, for example, a piezo jet method or a micro solenoid method, and discharges the imprint material as a plurality of droplets having a minute volume while the substrate 1 is moving in the XY direction by the substrate stage ST. Thereby, the supply unit 18 can supply the imprint material onto the substrate (on each shot area).

[0029] Next, the holding of the substrate 1 by the substrate stage ST will be described with reference to FIGS. 3 to 4. FIG. 3 is a schematic cross-sectional view of the substrate stage ST holding the substrate 1 via the plate 2 (cross-sectional view taken along line A-A in FIG. 2). Further, FIG. 4(a) is a view of the holding surface of the substrate stage ST (substrate chuck 3) as seen from the +Z direction (top view taken along line B-B in FIG. 3), and FIG. 4(b) is a view of the plate 2 held by the substrate stage ST as seen from the +Z direction (top view taken along line C-C in FIG. 3).

[0030] On the holding surface of the substrate stage ST (substrate chuck 3), a holding force for holding the plate 2 is provided so that it can be individually adjusted. In the case of this embodiment, on the holding surface of the substrate stage ST, a first holding region 31 that is disposed at a position overlapping the substrate 1 and holds the central portion of the plate 2, and a second holding region 32 that is disposed around the first holding region 31 and holds the outer peripheral portion of the plate 2 are provided. The first holding region 31 and the second holding region 32 are each constituted by a groove formed in the holding surface of the substrate stage ST. An outer peripheral bank portion 33 is provided on the outer periphery of the second holding region 32, and a central bank portion 34 is provided between the first holding region 31 and the second holding region 32. Further, the groove constituting the first holding region 31 communicates with a pressure adjustment unit 39 (vacuum source) via a flow path 36 formed inside the substrate stage ST (substrate chuck 3 and movable portion 4), and the internal pressure (vacuum pressure) can be adjusted by the pressure adjustment unit 39. The groove constituting the second holding region 32 communicates with a pressure adjustment unit 40 (vacuum source) via a flow path 37 formed inside the substrate stage ST (substrate chuck 3 and movable portion 4), and the internal pressure (vacuum pressure) can be adjusted by the pressure adjustment unit 40. With such a configuration, the holding force (vacuum pressure) generated in the first holding region 31 and the holding force (vacuum pressure) generated in the second holding region 32 can be individually adjusted. Note that a plurality of support pins (not shown) for supporting the plate 2 may be provided in the grooves constituting the first holding region 31 and the second holding region 32.

[0031] On the upper surface of the plate 2 (the surface opposite to the surface held by the substrate stage ST), a support region 30 for supporting (holding) the substrate 1 is provided. In the case of the present embodiment, the support region 30 of the plate 2 is constituted by a groove formed on the upper surface of the plate 2, and is communicated with a supply hole 35a provided on the holding surface of the substrate stage ST through a communication path 2a formed inside the plate. The supply hole 35a is a hole for supplying a vacuum pressure to the plate 2, and is communicated with a pressure adjustment unit 38 (vacuum source) through a flow path 35 formed inside the substrate stage ST (substrate chuck 3 and movable part 4). Thereby, the groove constituting the support region 30 of the plate 2 is communicated with the pressure adjustment unit 38 through the communication path 2a and the flow path 35, and the internal pressure (vacuum pressure) is adjusted by the pressure adjustment unit 38. That is, the plate 2 can hold the substrate 1 by the vacuum pressure supplied from the supply hole 35a to the support region 30 through the communication path 2. Further, since the supply hole 35a is provided in the central mound portion 34 between the first holding region 31 and the second holding region 32 in the substrate stage ST, the vacuum pressure in the support region 30 of the plate 2 can be adjusted independently of the first holding region 31 and the second holding region 32. Note that a plurality of support pins (not shown) for supporting the plate 2 may be provided in the groove constituting the support region 30 of the plate 2.

[0032] [Imprinting process] Next, the imprinting process executed by the imprinting apparatus 100 of the present embodiment will be described. FIG. 5 is a flowchart showing the imprinting process of the present embodiment. Each step of the flowchart shown in FIG. 5 can be controlled by the control unit 19.

[0033] In step S11, the control unit 19 determines whether to use the plate 2. For example, the control unit 19 acquires substrate information regarding the dimensions and / or thickness of the substrate 1 to be subjected to the imprint process, and determines whether to use the plate 2 based on the substrate information. When the dimensions of the substrate 1 in the substrate information are smaller than the dimensions of the holding surface of the substrate stage ST, the control unit 19 determines to use the plate 2 and proceeds to step S12. On the other hand, when the dimensions of the substrate 1 in the substrate information are the same as the dimensions of the holding surface of the substrate stage ST, the control unit 19 determines not to use the plate 2 and proceeds to step S14. Note that the control unit 19 may acquire the substrate information already stored in the storage unit (memory) of the imprint apparatus 100 from the storage unit, or may acquire the substrate information via a user interface or the like of the imprint apparatus 100.

[0034] In step S12, the control unit 19 controls a plate conveyance mechanism (not shown) to convey the plate 2 onto the holding surface of the substrate stage ST (substrate chuck 3), and causes the substrate stage ST to hold the plate 2 on the holding surface. In the case of this embodiment, the control unit 19 causes the substrate stage ST to hold the plate 2 in the first holding region 31 and the second holding region 31 by controlling the pressure adjustment units 39 to 40. Here, when a plurality of types of plates 2 are stored in the imprint apparatus 100, the control unit 19 may select the plate 2 to be used according to the dimensions of the substrate 1 from among the plurality of types of plates 2 based on the substrate information acquired in step S11. In this case, the selected plate 2 is conveyed onto the holding surface of the substrate stage ST by a plate conveyance mechanism (not shown). Note that as the plate conveyance mechanism, a substrate conveyance mechanism (not shown) that conveys the substrate 1 to the substrate stage ST may be used.

[0035] In step S13, the control unit 19 acquires plate information regarding the dimensions and thickness of the plate 2 to be used. The control unit 19 may acquire the plate information already stored in the storage unit (memory) of the imprint apparatus 100 from the storage unit, or may acquire the plate information via a user interface or the like of the imprint apparatus 100. Further, the plate information may include information regarding the dimensions of the support region 30 and / or the position of the communication path 2a in addition to the information regarding the dimensions and thickness of the plate 2.

[0036] In step S14, the control unit 19 controls a substrate transfer mechanism (not shown) to transfer the substrate 1 to the substrate stage ST. When using the plate 2, the control unit 19 transfers it onto the support region 30 of the plate 2, and supports the substrate 1 on the plate 2 by holding the substrate 1 on the holding surface of the substrate stage ST via the plate 2. In the case of the present embodiment, the substrate 1 is supported on the plate 2 in the support region 30 by controlling the pressure adjustment unit 38.

[0037] In step S15, the control unit 19 causes the second measurement unit 17 to measure the positions of marks (alignment marks) provided in each of a plurality of shot regions on the substrate 1, and acquires position information of each shot region of the substrate 1 with respect to the substrate stage ST. The control unit 19 may acquire the position information by causing the second measurement unit 17 to measure the positions of the marks for all the shot regions on the substrate 1, or may acquire the position information by causing the second measurement unit 17 to measure the positions of the marks for some sample shot regions. Further, the control unit 19 may obtain information regarding the shape and orientation (direction) of each shot region based on the positions of the respective marks measured by the second measurement unit 17.

[0038] In step S16, the control unit 19 causes the supply unit 18 to supply an imprint material onto a target shot area for which imprinting is to be performed among a plurality of shot areas on the substrate 1 (supply step). For example, the control unit 19 moves the substrate 1 by the substrate stage ST so that the target shot area is disposed below the supply unit 18, and then causes the supply unit 18 to discharge the imprint material while relatively moving the supply unit 18 and the substrate 1. Thereby, the imprint material can be supplied onto the target shot area.

[0039] In step S17, the control unit 19 brings the pattern area 11 of the mold 10 into contact with the imprint material on the target shot area of the substrate 1 (contact step). For example, the control unit 19 moves the substrate 1 by the substrate stage ST so that the target shot area is disposed below the mold 10 (pattern area 11) based on the position information of each shot area acquired in step S12. Then, the control unit 19 drives the mold 10 in the -Z direction by the imprint head IH (mold drive unit 14) to narrow the distance between the mold 10 and the substrate 1, and brings the pattern area 11 of the mold 10 into contact with the imprint material on the target shot area of the substrate 1. Here, the control of the distance between the mold 10 and the holding surface of the substrate stage ST in the contact step is set assuming the case where the plate 2 is not used. Therefore, when the plate 2 is used, it is necessary to offset the control of the distance between the mold 10 and the holding surface of the substrate stage ST according to the thickness of the plate 2. Therefore, when the plate 2 is used, the control unit 19 may control the distance between the mold 10 and the holding surface of the substrate stage ST in the contact step so as to be offset by the thickness of the plate 2 based on the plate information acquired in step S13.

[0040] In step S18, the control unit 19 aligns the pattern area 11 of the mold 10 with the target shot area of the substrate 1 (alignment process). For example, the control unit 19 causes the first measurement unit 16 to measure the relative position between the alignment mark provided on the mold 10 and the alignment mark provided on the target shot area of the substrate 1. Then, the pattern area 11 of the mold 10 and the target shot area of the substrate 1 are aligned so that the relative position measured by the first measurement unit 16 becomes the target relative position.

[0041] In step S19, the control unit 19 irradiates the imprint material with curing light (e.g., ultraviolet light) by the irradiation unit 15 to cure the imprint material (curing process). The curing process is performed in a state where the pattern area 11 of the mold 10 and the imprint material on the target shot area of the substrate 1 are in contact.

[0042] In step S20, the control unit 19 drives the mold 10 in the +Z direction by the imprint head IH (mold drive unit 14) to increase the distance between the mold 10 and the substrate 1, and separates the mold 10 from the cured imprint material (separation process). As a result, the uneven pattern formed in the pattern area 11 of the mold 10 is transferred to the imprint material on the target shot area of the substrate 1, and the pattern of the imprint material can be formed on the target shot area. Here, the control of the distance between the mold 10 and the holding surface of the substrate stage ST in the separation process is set assuming the case where the plate 2 is not used, similar to the contact process (S17). Therefore, when the plate 2 is used, it is necessary to offset the control of the distance between the mold 10 and the holding surface of the substrate stage ST according to the thickness of the plate 2. Therefore, when the plate 2 is used, the control unit 19 may control the distance between the mold 10 and the holding surface of the substrate stage ST in the separation process so as to be offset by the thickness of the plate 2 based on the plate information acquired in step S13.

[0043] In step S21, the control unit 19 determines whether the shot area where the imprint process should be performed next (the next shot area) is on the substrate 1. If there is a next shot area, the process proceeds to step S16; if there is no next shot area, the process proceeds to step S22. In step S22, the control unit 19 uses a substrate transfer mechanism (not shown) to carry out the substrate 1 from the substrate stage ST.

[0044] In step S23, the control unit 19 determines whether there is a substrate 1 of the same dimensions for which the imprint process should be performed next (the next substrate). If there is a next substrate, the process proceeds to step S14; if there is no next substrate 1, the process proceeds to step S24. In step S24, the control unit 19 uses a plate transfer mechanism (not shown) to carry out the plate 2 from the substrate stage ST.

[0045] Here, in the separation step (S20), distortion or defects may occur in the pattern of the imprint material formed on the substrate 1. In order to reduce such distortion or defects, as described in Patent Document 1, it is preferable to locally deform the substrate 1 into a convex shape in the separation step. On the other hand, when deforming the substrate 1 having dimensions smaller than the holding surface of the substrate stage ST into a convex shape in the separation step, the holding force for holding the substrate 1 by the holding surface of the substrate stage ST may become insufficient with respect to the release force for releasing the mold 10. As a result, there is a possibility that the substrate 1 may come off the substrate stage ST as the mold 10 is separated.

[0046] Therefore, in the present embodiment, when separating the mold 10 from the imprint material on the substrate 1 in the separation step, the holding of the plate 2 by the substrate stage ST is controlled while maintaining the support of the substrate 1 by the plate 2 so that the substrate 1 is deformed into a convex shape together with the plate 2. That is, in the separation step, it may be understood that the substrate 1 is locally deformed into a convex shape together with the plate 2 in a state where the substrate 1 and the plate 2 are integrated. Specifically, among the plurality of holding regions in the substrate stage ST, the holding force of the holding region (for example, the first holding region 31) corresponding to the portion of the substrate 1 where the mold 10 is in contact via the imprint material is made smaller than the holding force of the other holding regions (for example, the second holding region 32). Thereby, it is possible to reduce the distortion and defects that may occur in the pattern of the cured imprint material, and it is possible to avoid the substrate 1 coming off the substrate stage ST in the separation step.

[0047] FIG. 6 is a diagram showing the operation of the imprint apparatus 100 in the separation step, in which the imprint head IH, the mold 10, the substrate stage ST, the substrate 1, and the plate 2 are illustrated. Further, FIG. 6(a) shows the state immediately before starting the separation step (that is, immediately before generating a release force in the imprint head IH), and FIG. 6(b) shows the state in the middle of the separation step.

[0048] The control unit 19 controls the pressure adjustment units 39 to 40 so that the holding force of the first holding region 31 of the substrate stage ST is smaller than the holding force of the second holding region 32 immediately before the separation step shown in FIG. 6(a). That is, it may be understood that the holding force of the first holding region 31 is made smaller than the specified holding force while maintaining the holding force of the second holding region 32 at the specified holding force. The specified holding force is a holding force (target holding force) set so as to be able to sufficiently hold the substrate 1 or the plate 2, and may be the holding force used in the previous steps (for example, the contact step, the curing step).

[0049] For example, assume a case where a vacuum pressure V0 = -70 kPa is supplied as a specified holding force to both the first holding region 31 and the second holding region 32 in the contact step and the curing step. In this case, in the separation step, while maintaining the holding force of the second holding region 32 at the vacuum pressure V0 = -70 kPa, the holding force of the first holding region 31 is changed to the vacuum pressure V1 = -10 kPa. Here, the holding force of the support region 30 of the plate 2 is controlled by the pressure adjustment unit 38 so as to be able to sufficiently support the substrate 1, and is maintained also in the separation step. That is, through the contact step, the curing step, and the separation step, the holding force of the support region 30 of the plate 2 is maintained at the vacuum pressure V0 = -70 kPa.

[0050] Next, as shown in FIG. 6(b), the control unit 19 controls the mold driving unit 14 so that the distance between the mold 10 and the holding surface of the substrate stage ST increases, thereby applying a +Z direction force (release force) to the imprint head IH. At this time, as described above, the holding force of the first holding region 31 of the substrate stage ST is controlled to be smaller than the specified holding force and the holding force of the second holding region 32. Also, the holding force of the second holding region 32 of the substrate stage ST and the holding force of the support region 30 of the plate 2 are controlled to be maintained at the specified holding force. Therefore, when a part of the substrate 1 in contact with the mold 10 through the imprint material is lifted by the release force of the imprint head IH, the substrate 1 and the plate 2 can be locally deformed into a convex shape together. That is, the substrate 1 and the plate 2 can be deformed into a convex shape integrally.

[0051] By controlling such a separation step, the imprint material on the substrate can be gradually peeled from the peripheral portion toward the central portion of the pattern region 11 of the mold 10, so that distortion and defects of the pattern of the imprint material formed on the substrate after the separation step can be reduced. And since the substrate 1 is sufficiently held by the plate 2 in the support region 30 and the plate 2 is sufficiently held by the substrate stage ST in the second holding region 32, it is possible to avoid the substrate 1 and the plate 2 from coming off the substrate stage ST.

[0052] Further, in the present embodiment, a supply hole 35a for supplying a vacuum pressure to the plate 2 is provided in the central ridge portion 34 between the first holding region 31 and the second holding region 32 on the substrate stage ST. Although the plate 2 is deformed into a convex shape in the first holding region 31, the plate 2 is sufficiently held in the second holding region 32, so that the lifting (separation) of the plate 2 with respect to the central ridge portion 34 can be reduced. That is, it is possible to prevent the vacuum pressure supplied to the plate 2 through the supply hole 35a from leaking between the central ridge portion 34 and the plate 2, and the support of the substrate 1 by the plate 2 can be maintained even in the separation step.

[0053] Here, in the above example, the vacuum pressure V0 is -70 kPa and the vacuum pressure V1 is -10 kPa, but the present invention is not limited thereto, and the vacuum pressure V1 may be any pressure higher than the vacuum pressure V0. That is, it is sufficient that the holding force defined by the vacuum pressure V1 is smaller than the holding force defined by the vacuum pressure V0. Further, the vacuum pressure V1 may be any pressure at which the substrate 1 can be deformed into a convex shape together with the plate 2 in the separation step, and may be a positive pressure. The vacuum pressure V0 may be any pressure at which the support of the substrate 1 by the support region 30 of the plate 2 and the holding of the plate 2 by the second holding region 32 of the substrate stage ST can be sufficiently performed.

[0054] Also, in the above example, the substrate 1 and the plate 2 are individually transported (loaded and unloaded) to and from the substrate stage ST, but the present invention is not limited thereto, and the substrate 1 and the plate 2 may be transported to the substrate stage ST in a state where the substrate 1 is disposed on the plate 2. Thereby, since the time required for transporting the substrate 1 and the plate 2 can be shortened, it can be advantageous in terms of throughput.

[0055] <Second Embodiment> A second embodiment according to the present invention will be described. The second embodiment differs from the first embodiment in the configurations of the substrate stage ST (substrate chuck 3) and the plate 2, but the configurations of the other imprint apparatus 100 are as described in the first embodiment. Also, the operations (for example, imprint processing) performed by the imprint apparatus 100 are as described in the first embodiment.

[0056] FIG. 7(a) is a schematic cross-sectional view of a substrate stage ST holding a substrate 1 via a plate 2, and FIG. 7(b) shows a view of the holding surface of the substrate stage ST (substrate chuck 3) as seen from the +Z direction (the D-D top view of FIG. 7(a)). In the first embodiment, the supply hole 35a for supplying a vacuum pressure to the plate 2 was provided in the central land portion 34, but in the present embodiment, as shown in FIGS. 7(a) to 7(b), the supply hole 35a is provided in the partial land portion 41. The partial land portion 41 is disposed at a position surrounded by one of the plurality of holding regions, and in the case of the present embodiment, it is disposed at a position surrounded by the second holding region 32. By providing the supply hole 35a in the partial land portion 41 arranged in this way, the plate 2 is sufficiently held in the second holding region 32 around the partial land portion 41, so that the lifting (separation) of the plate 2 with respect to the partial land portion 41 can be reduced. That is, it is possible to prevent the vacuum pressure supplied to the plate through the supply hole 35a from leaking between the partial land portion 41 and the plate 2, and the support of the substrate 1 by the plate 2 can be maintained even in the separation step.

[0057] <Third Embodiment> A third embodiment according to the present invention will be described. The third embodiment differs from the first embodiment in the configurations of the substrate stage ST (substrate chuck 3) and the plate 2, but the configurations of the other imprint apparatus 100 are as described in the first embodiment. Also, the operations (for example, imprint processing) performed by the imprint apparatus 100 are as described in the first embodiment.

[0058] FIG. 8 is a schematic cross-sectional view of a substrate stage ST that holds a substrate 1 via a plate 2. In the present embodiment, a supply hole 35a for supplying a vacuum pressure to the plate 2 is not provided in the substrate stage ST (substrate chuck 3), and the communication path 2a of the plate 2 is configured to communicate the support region 30 of the plate 2 with the second holding region 32 of the substrate plate ST. That is, in the substrate stage ST of the present embodiment, the vacuum pressure in the support region 30 of the plate 2 can be adjusted by adjusting the vacuum pressure in the second holding region 32 by the pressure adjustment unit 40.

[0059] When using such a plate 2, for example, in step S12 in the flowchart of FIG. 5 described above, the plate 2 is only conveyed onto the holding surface of the substrate stage ST, and the plate 2 is not held by the holding surface of the substrate stage ST. Then, when the substrate 1 is conveyed onto the support region 30 of the plate 2 in step S14, a vacuum pressure is supplied to the second holding region 32 of the substrate stage ST by the pressure adjustment unit 40, and accordingly, a vacuum pressure is also supplied to the support region 30 of the plate 2 via the communication path 2a.

[0060] Also, in the separation step (S20), by simply controlling the vacuum pressure in the second holding region 32 by the pressure adjustment unit 40, a holding force (vacuum pressure) similar to that in the second holding region 32 can be generated in the support region 30 of the substrate stage ST. For example, when deforming the substrate 1 into a convex shape together with the plate 2 in the separation step, as described above, while maintaining the holding force in the second holding region 32 of the substrate stage ST at the vacuum pressure V0, the holding force in the first holding region 31 of the substrate stage ST is changed to the vacuum pressure V1. In this case, even if the holding force in the support region 30 of the plate 2 is not individually controlled, the holding force in the support region 30 of the plate 2 is also maintained at the vacuum pressure V0 according to the holding force in the second holding region 32.

[0061] <Fourth Embodiment> A fourth embodiment according to the present invention will be described. In the fourth embodiment, the configurations of the substrate stage ST (substrate chuck 3) and the plate 2 are different from those in the first embodiment, but the configurations of the other imprint apparatuses 100 are the same as those described in the first embodiment. Further, the operations (for example, imprint processing) performed by the imprint apparatus 100 are also the same as those described in the first embodiment.

[0062] FIG. 9(a) is a schematic cross-sectional view of a substrate stage ST holding a substrate 1 via a plate 2. In the present embodiment, grooves are not formed in the first holding region 31 and the second holding region 32 of the substrate stage ST, and grooves are formed in regions 61 corresponding to the first holding region 31 and regions 62 corresponding to the second holding region 32 on the lower surface of the plate 2. The lower surface of the plate 2 is the surface held by the substrate stage ST. The region 61 is disposed at a position overlapping the support region 30 of the substrate 1 and the plate 2, and its internal pressure is controlled by a pressure adjustment unit 39 via a flow path 36 formed in the substrate stage ST. The region 62 is disposed around the region 61, and its internal pressure is controlled by a pressure adjustment unit 40 via a flow path 37 formed in the substrate stage ST. Further, in the present embodiment, a supply hole 35a for supplying a vacuum pressure to the plate 2 is not provided in the substrate stage ST, and the communication path 2a of the plate 2 is configured to communicate the support region 30 of the plate 2 and the second holding region 32 of the substrate plate ST. With such a configuration, by controlling in the same manner as in the first embodiment, the substrate 1 can be deformed into a convex shape together with the plate 2 in the separation step.

[0063] Furthermore, in the present embodiment, even when the dimensions of the substrate 1 are changed, only the configuration of the plate 2 (i.e., the dimensions of the regions 61 to 62) needs to be changed without changing the configuration of the substrate chuck 3 of the substrate stage ST (i.e., the dimensions of the first holding region 31 and the second holding region 32). For example, FIG. 9(b) shows an example of performing an imprint process on a substrate 1 smaller than the example of FIG. 9(a). As shown in FIGS. 9(a) to 9(b), when performing an imprint process on a plurality of types of substrates 1 having different dimensions, it is only necessary to prepare a plurality of types of plates 2 having different dimensions in the regions 61 to 62 and change the plate 2 according to the type of the substrate 1. That is, since it is not necessary to change the configuration of the substrate stage ST (the positions of the flow paths 36 to 37), the degree of freedom in the dimensions of the substrate 1 on which the imprint process can be performed is expanded, and it can also be advantageous in terms of manufacturing cost.

[0064] Here, the plurality of types of plates 2 may be stored in a storage unit (stock) in the imprint apparatus 100. In this case, in step S12 described above, a plate 2 corresponding to the dimensions of the substrate 1 is selected from the plurality of types of plates 2, and the selected plate 2 can be transported to the substrate stage ST. Also, in the present embodiment, the communication path 2a of the plate 2 is configured to communicate the support region 30 of the plate 2 and the second holding region 32 of the substrate plate ST, but the present invention is not limited thereto. For example, as described in the first embodiment, the communication path 2a of the plate 2 may be configured to communicate the supply hole 35a provided on the holding surface of the substrate stage ST and the support region 30.

[0065] <Fifth Embodiment> The fifth embodiment according to the present invention will be described. The fifth embodiment has a different configuration of the substrate stage ST (substrate chuck 3) compared to the first embodiment, but the configuration of the other imprint apparatus 100 is as described in the first embodiment. Also, the operations (e.g., imprint process) performed by the imprint apparatus 100 are also as described in the first embodiment. Note that the substrate stage ST and the plate 2 are not limited to those described in the first embodiment, and those described in the second to fourth embodiments may be applied.

[0066] FIG. 10(a) is a schematic cross-sectional view of a substrate stage ST that holds a substrate 1 via a plate 2, and FIG. 10(b) shows a view of the holding surface of the substrate stage ST (substrate chuck 3) as seen from the +Z direction (E-E top view of FIG. 10(a)). In the substrate stage ST of the present embodiment, the first holding region 31 is divided into a plurality of partial holding regions. In the example shown in FIG. 10, the first holding region 31 may include a partial holding region 51 disposed at a position corresponding to the central portion of the substrate 1 and a partial holding region 52 disposed at a position corresponding to the outer peripheral portion of the substrate 1 in plan view. The partial holding region 52 is disposed around the partial holding region 51. The partial holding regions 51 to 52 are each constituted by a groove formed in the holding surface of the substrate stage ST and are partitioned from each other by a bank portion 58. Further, the groove constituting the partial holding region 51 communicates with a pressure adjusting unit 56 (vacuum source) via a flow path 54 formed inside the substrate stage ST, and the internal pressure (vacuum pressure) can be adjusted by the pressure adjusting unit 56. The groove constituting the partial holding region 52 communicates with a pressure adjusting unit 57 (vacuum source) via a flow path 55 formed inside the substrate stage ST, and the internal pressure (vacuum pressure) can be adjusted by the pressure adjusting unit 57. With such a configuration, the holding force can be individually adjusted for each of the plurality of partial holding regions 51 to 52 in the first holding region 31. Note that a plurality of support pins (not shown) for supporting the plate 2 may be provided in the grooves constituting the partial holding regions 51 to 52.

[0067] Note that the second holding region 32 of the substrate stage ST and the support region 30 of the plate 2 are as described in the first embodiment. Specifically, the groove forming the second holding region 32 communicates with a pressure adjusting unit 40 (vacuum source) via a flow path 37 formed inside the substrate stage ST, and the internal pressure (vacuum pressure) can be adjusted by the pressure adjusting unit 40. Further, the support region 30 of the plate 2 communicates with a supply hole 35a (not shown in FIG. 10(a)) provided in the central mound portion 34 of the holding surface of the substrate stage ST via the communication path 2a of the plate 2. Then, the groove forming the support region 30 of the plate 2 communicates with the pressure adjusting unit 38 via the communication path 2a and the flow path 35, and the internal pressure (vacuum pressure) is adjusted by the pressure adjusting unit 38.

[0068] FIG. 11 is a diagram showing the operation of the imprint apparatus 100 in the separation process, and shows the imprint head IH, the mold 10, the substrate stage ST, the substrate 1, and the plate 2. Further, FIG. 11(a) shows a state in which the separation process is being performed on the shot region located at the central portion of the substrate 1, and FIG. 11(b) shows a state in which the separation process is being performed on the shot region located at the outer peripheral portion of the substrate 1.

[0069] When performing the separation process on the shot region located at the central portion of the substrate 1, as shown in FIG. 11(a), the pressure adjusting unit 56 is controlled so that the holding force of the partial holding region 51 of the substrate stage ST becomes smaller than that of other regions (partial holding region 52, second holding region 32). Specifically, while maintaining the holding forces of the partial holding region 52 and the second holding region 32 at the vacuum pressure V0, the holding force of the partial holding region 51 is changed to the vacuum pressure V1. At this time, the holding force of the support region 30 of the plate 2 is controlled by the pressure adjusting unit 38 so that the substrate 1 can be sufficiently supported, and specifically, it is maintained at the vacuum pressure V0. Thereby, in the release process for the central portion of the substrate 1, the central portion of the substrate 1 can be locally deformed into a convex shape together with the plate 2 by the release force of the imprint head IH. As a result, distortion and defects in the pattern of the imprint material formed at the central portion of the substrate 1 after the separation process can be reduced.

[0070] Also, when performing a separation process on the shot region located at the outer peripheral portion of the substrate 1, as shown in FIG. 11(b), the pressure adjustment unit 57 is controlled such that the holding force of the partial holding region 52 of the substrate stage ST becomes smaller than that of other regions (partial holding region 51, second holding region 32). Specifically, while maintaining the holding force of the partial holding region 51 and the second holding region 32 at the vacuum pressure V0, the holding force of the partial holding region 52 is changed to the vacuum pressure V1. At this time, the holding force of the support region 30 of the plate 2 is controlled by the pressure adjustment unit 38 so that the substrate 1 can be sufficiently supported, and specifically, it is maintained at the vacuum pressure V0. Thereby, in the release process for the outer peripheral portion of the substrate 1, the outer peripheral portion of the substrate 1 can be locally deformed into a convex shape together with the plate 2 by the release force of the imprint head IH. As a result, distortion and defects in the pattern of the imprint material formed on the outer peripheral portion of the substrate 1 after the separation process can be reduced.

[0071] <Embodiment of the method for manufacturing an article> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The method for manufacturing an article according to the present embodiment includes a step of forming a pattern on an imprint material supplied (coated) onto a substrate using the above-described imprint apparatus (imprint method), and a step of processing the substrate on which the pattern has been formed in such a step. Further, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

[0072] The pattern of the cured product formed using the imprint apparatus is permanently used for at least a part of various articles, or temporarily used when manufacturing various articles. The articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, or molds and the like. Examples of the electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGA. Examples of the mold include a mold for imprinting and the like.

[0073] The pattern of the cured product is used as it is as at least a part of the constituent members of the above articles, or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed.

[0074] Next, a specific manufacturing method of the article will be described. As shown in FIG. 12(a), a substrate 1z such as a silicon wafer on which a workpiece 2z such as an insulator is formed on the surface is prepared, and subsequently, an imprint material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state where a plurality of droplet-shaped imprint materials 3z are applied on the substrate is shown.

[0075] As shown in FIG. 12(b), an imprint mold 4z is opposed with the side on which the concavo-convex pattern is formed facing the imprint material 3z on the substrate. As shown in FIG. 12(c), the substrate 1z to which the imprint material 3z is applied and the mold 4z are brought into contact with each other and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z as energy for curing in this state, the imprint material 3z cures.

[0076] As shown in Fig. 12(d), after curing the imprint material 3z and then separating the mold 4z from the substrate 1z, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. The pattern of this cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the convex portion of the mold corresponds to the concave portion of the cured product. That is, the concavo-convex pattern of the mold 4z has been transferred to the imprint material 3z.

[0077] As shown in Fig. 12(e), when etching is performed using the pattern of the cured product as an etching mask, the portion of the surface of the workpiece 2z where the cured product is absent or remains thinly is removed, resulting in the groove 5z. As shown in Fig. 12(f), when the pattern of the cured product is removed, an article with the groove 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured product has been removed, but it may not be removed after processing and may be used, for example, as a film for interlayer insulation included in a semiconductor element or the like, that is, as a constituent member of the article.

[0078] The invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, claims are appended to disclose the scope of the invention.

Explanation of Reference Numerals

[0079] IH: Imprint head, ST: Substrate stage, 1: Substrate, 2: Plate, 3: Substrate chuck, 4: Movable part, 10: Mold, 30: Support area, 31: First holding area, 32: Second holding area

Claims

1. An imprint method for forming a pattern on an imprint material supplied onto a substrate having a size smaller than the holding surface of a substrate stage, using a mold, comprising: a step of holding a plate having a size larger than the substrate on the holding surface of the substrate stage; a step of supporting the substrate on the plate; a contacting step of bringing the imprint material supplied onto the substrate into contact with the mold; a curing step of curing the imprint material on the substrate; a separating step of separating the mold from the cured imprint material; wherein in the separating step, when separating the mold from the imprint material, the holding of the plate by the substrate stage is controlled so that the substrate is deformed into a convex shape. The imprint method is characterized by this.

2. The holding surface of the substrate stage includes a plurality of holding regions capable of individually adjusting the holding force of the plate, and in the separating step, among the plurality of holding regions, the holding force of the holding region corresponding to the portion of the substrate in contact with the mold via the imprint material is made smaller than the holding force of the other holding regions. The imprint method according to claim 1 is characterized by this.

3. The holding surface of the substrate stage includes a first holding region arranged at a position overlapping the substrate and a second holding region arranged around the first holding region, and in the separating step, the holding force of the first holding region is made smaller than the holding force of the second holding region. The imprint method according to claim 1 or 2 is characterized by this.

4. The plate has a support region for supporting the substrate and a communication path for communicating the support region with the second holding region, and the substrate is supported by a vacuum pressure supplied from the second holding region to the support region through the communication path. The imprint method according to claim 3 is characterized by this.

5. The holding surface of the substrate stage has a supply hole for supplying a vacuum pressure to the plate, and the plate has a support region for supporting the substrate and a communication path for communicating the support region with the supply hole of the substrate stage, and the substrate is supported by a vacuum pressure supplied from the supply hole to the support region through the communication path. The imprint method according to any one of claims 1 to 3 is characterized by this.

6. The holding surface of the substrate stage includes a plurality of holding regions capable of individually adjusting the holding force of the plate. The supply hole is disposed between the plurality of holding regions. The imprinting method according to claim 5, characterized in that.

7. The holding surface of the substrate stage includes a plurality of holding regions capable of individually adjusting the holding force of the plate. The supply hole is disposed at a position surrounded by one of the plurality of holding regions. The imprinting method according to claim 5, characterized in that.

8. In the contact step and the separation step, based on the information of the height of the plate, the distance between the mold and the holding surface of the substrate stage is controlled so as to be offset by the height. The imprinting method according to any one of claims 1 to 6, characterized in that.

9. A forming step of forming a pattern on a substrate using the imprinting method according to any one of claims 1 to 8; A processing step of processing the substrate on which the pattern is formed in the forming step, including: A method for manufacturing an article, characterized in that the article is manufactured from the substrate processed in the processing step.

10. An imprinting apparatus for forming a pattern on an imprinting material supplied onto a substrate having a size smaller than the holding surface of a substrate stage, using a mold, A substrate stage for holding a plate having a size larger than the substrate; A control unit that controls a contact step of bringing the imprinting material supplied onto the substrate into contact with the mold, a curing step of curing the imprinting material, and a separation step of separating the mold from the cured imprinting material; Comprising: The plate supports the substrate. The control unit controls the holding of the plate by the substrate stage so that the substrate is deformed into a convex shape when separating the mold from the imprinting material in the separation step. An imprinting apparatus, characterized in that.

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