Shield Cooling Assembly, Reaction Chamber, and Semiconductor Processing Apparatus

Abstract

The present disclosure provides a shield cooling assembly, a reaction chamber, and a semiconductor processing apparatus. The shield cooling assembly includes an adapter. The adapter is configured to secure a shield in the chamber, and the adapter includes a first surface and a second surface facing the outer surface of the shield and the bottom surface of the bottom wall of the shield, respectively. A predetermined gap is formed between the first surface and the outer surface of the shield, and the second surface is in contact with the bottom surface of the bottom wall of the shield. In addition, the adapter is provided with a cooling passage for delivering a coolant to cool the shield. The shield cooling assembly provided by the present invention not only improves heat transfer efficiency and process quality, but also reduces processing steps and difficulties, cleaning difficulties, and disassembly and assembly difficulties caused by the addition of cooling pipes.

Description

Technical Field

[0001] This disclosure relates to the technical field of semiconductor manufacturing, and more particularly, to a shield cooling assembly, a reaction chamber, and a semiconductor processing apparatus.

Background Art

[0002] Technical Background Physical Vapor Deposition (PVD) technology is widely used in the field of semiconductors. PVD employs sputtering deposition technology to pass an inert gas, such as argon, between a wafer and a target. A high voltage ionizes the inert gas to generate a plasma. A magnetic field enhances the ability to confine electrons so that the generated plasma collides with the target material, depositing atoms or ions of the target material onto the wafer to form a thin film. An existing magnetron sputtering apparatus is shown in FIG. 1. The apparatus includes a reaction chamber 1, a target 2 provided in the reaction chamber 1, a susceptor 5 provided below the target 2 for holding a wafer 6, and a cooling chamber body 3 made of a heat insulating material provided above the target 2. Cooling water for cooling the target 2 is added to a sealed space formed by the cooling chamber body 3 and the target 2. A rotatable magnetron 4 is also provided in the sealed space. During the sputtering process, a power source applies a bias voltage to the target 2, making it negatively biased with respect to the grounded chamber body 3 of the reaction chamber 1. The negative bias can ionize the inert gas flowing into the reaction chamber 1 to form a plasma, and at the same time, attract the positively charged plasma to the target 2. When the plasma energy is high enough and it collides with the target 2 under the action of the magnetic field formed by the rotating magnetron 4, metal atoms or metal ions will escape from the surface of the target and be deposited onto the wafer 6 by diffusion.

[0003] However, even with the confinement effect of the magnetron 4 on the metal atoms, a large number of metal atoms and metal ions will still be deposited on the inner wall of the reaction chamber 1, and will contaminate the wafer and the reaction chamber 1 after peeling off. Therefore, in order to prevent the metal atoms and metal ions from contaminating the reaction chamber 1, the shield 9, the covering 8, and the deposition ring 7 are also provided in the reaction chamber 1. During the magnetron sputtering process, the metal ions and atoms escaping from the target 2 carry a large amount of heat, which will increase the temperature of the shield 9. If the temperature of the shield 9 exceeds the temperature range of the process reaction, it will not help the progress of the process. And a series of problems such as film stress below the standard and whisker defects may occur.

[0004] Currently, various methods are used to perform cooling and other processes for the shield 9, but these methods have problems such as limited cooling capacity, slow heat conduction speed, low efficiency, high cost, and high processing difficulty.

Summary of the Invention

Problems to be Solved by the Invention

[0005] Overview In view of this, embodiments of the present disclosure provide a shield cooling assembly and a semiconductor processing apparatus that can solve problems such as limited cooling capacity, slow heat conduction speed, low efficiency, high cost, and high processing difficulty.

Means for Solving the Problems

[0006] According to one aspect of the embodiments of the present disclosure, a shield cooling assembly including an adapter is provided. The adapter is configured to fix a shield in a chamber. The adapter has a first surface facing the outer surface of the shield and a second surface facing the bottom surface of the bottom wall of the shield respectively. There is a predetermined gap between the first surface and the outer surface of the shield, and the second surface is in contact with the bottom surface of the bottom wall of the shield. In addition, the adapter is provided with a cooling passage for sending a refrigerant to cool the shield.

[0007] Optionally, the adapter includes a cylindrical main body surrounding the shield and a support portion connected to the cylindrical main body to support the bottom wall of the shield. The inner surface of the cylindrical main body is used as the first surface, and the surface of the support portion in contact with the bottom surface of the bottom wall of the shield is used as the second surface.

[0008] The cooling passage is provided inside the cylindrical main body or inside the cylindrical main body and the support portion. Optionally, the cooling passage includes a first passage disposed inside the cylindrical main body. The first passage circumferentially surrounds the cylindrical main body in a predetermined distribution pattern.

[0009] Optionally, the first passage circumferentially surrounds the cylindrical main body and has an annular shape. One end of the first passage along the axial direction of the cylindrical main body extends to a position close to the support portion.

[0010] Optionally, one end of the first passage close to the support portion penetrates the bottom of the cylindrical main body, and an annular blocking member is further provided at the bottom of the cylindrical main body. The annular blocking member is hermetically connected to the cylindrical main body to seal the first passage.

[0011] Optionally, the cooling passage further includes a second passage disposed inside the support portion and circumferentially surrounding the support portion in a predetermined arrangement pattern. The second passage communicates with the first passage.

[0012] Optionally, the inner diameter of the support portion is equal to or greater than the inner diameter of the shield. Optionally, the adapter further includes a fixing portion connected to an end of the cylindrical body far from the supporting portion. The fixing portion is configured to be fixedly connected to the chamber. The cooling passage further includes an inlet passage for refrigerant to enter and an outlet passage for refrigerant to exit, which are disposed inside the fixing portion. One end of each of the inlet passage and the outlet passage communicates with the first passage, and the other end of each of the inlet passage and the outlet passage is located on the surface of the fixing portion positioned outside the chamber.

[0013] Optionally, the inlet passage and the outlet passage are disposed obliquely with respect to the axial direction of the cylindrical body, or both the inlet passage and the outlet passage are perpendicular to the axial direction of the cylindrical body.

[0014] Optionally, the cooling passage further includes two connecting passages disposed in the cylindrical body, and the two connecting passages are used to communicate the inlet passage and the outlet passage with the first passage respectively.

[0015] Optionally, joints are provided at the other ends of each of the inlet passage and the outlet passage for connecting to the inlet pipeline and the return pipeline respectively.

[0016] Optionally, the fixing portion is disposed between the side wall of the chamber and the heat insulating member located above the side wall. A sealing ring is disposed between the fixing portion and the side wall of the chamber, and another sealing ring is disposed between the fixing portion and the heat insulating member.

[0017] According to another aspect of the embodiments of the present disclosure, a reaction chamber is provided, which includes a chamber body and a shield disposed inside the chamber body, and further includes a shield cooling assembly as described above.

[0018] Optionally, the reaction chamber includes a magnetron sputtering reaction chamber. According to another aspect of the embodiments of the present disclosure, a semiconductor processing apparatus is provided, which includes a shield cooling assembly as described above.

[0019] In the shield cooling assembly provided by the present disclosure, a cooling passage is provided in the adapter. The adapter has a first surface facing the outer surface of the shield and a second surface facing the bottom surface of the bottom wall of the shield, and both surfaces can conduct heat from the shield simultaneously, which not only improves the heat transfer efficiency but also achieves uniform cooling of the shield and avoids the local temperature of the shield from becoming too high. Thereby, it effectively prevents the shield from releasing impurities due to high temperature, and thus improves the product quality. Also, by bringing the second surface into contact with the bottom surface of the bottom wall of the shield, the heat contact area between the adapter and the shield can be increased, and the heat transfer efficiency, especially the heat transfer efficiency of the shield, can be further improved. Therefore, it is possible to improve the temperature rise of the wafer near the bottom of the shield by magnetron sputtering and avoid the influence on the wafer and the film caused by the temperature rise in the reaction area. In addition, by providing a cooling passage in the adapter, it is possible to reduce the processing steps and processing difficulty, the cleaning difficulty, and the disassembly and assembly difficulties caused by the addition of the cooling pipeline. At the same time, the adapter has a simple structure and high cooling efficiency and does not require a sealing ring for sealing the cooling pipeline, thereby reducing the risk of leakage.

[0020] The reaction chamber provided by the present disclosure not only improves the heat transfer efficiency and process quality by using the above-mentioned shield cooling assembly provided by the present disclosure, but also can reduce the processing steps and processing difficulty, the cleaning difficulty, and the disassembly and assembly difficulties caused by the addition of the cooling pipeline.

[0021] The semiconductor processing apparatus provided by the present disclosure not only improves the heat transfer efficiency and process quality by using the above-mentioned reaction chamber provided by the present disclosure, but also can reduce the processing steps and processing difficulty, the cleaning difficulty, and the disassembly and assembly difficulties caused by the addition of the cooling pipeline.

[0022] Additional aspects and advantages of embodiments of the present disclosure will be given in part in the following description. They will become apparent from the following description or may be understood through the practice of the present disclosure.

[0023] Description of the Drawings To more clearly explain the technical solutions in embodiments of the present disclosure or in the prior art, the drawings that need to be used in the description of the embodiments or the prior art are briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure. A person skilled in the art can obtain other drawings based on these drawings without exercising creativity.

Brief Description of the Drawings

[0024]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Modes for Carrying Out the Invention

[0025] Description of the Detailed Disclosure The present disclosure will be described in more detail below with reference to the accompanying drawings in which exemplary embodiments of the present disclosure are illustrated. The technical solutions in the embodiments of the present disclosure will be clearly and completely described below together with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without creative efforts shall fall within the protection scope of the present invention. The technical solutions of the present disclosure will be described below in the following various aspects together with the drawings and embodiments.

[0026] For the convenience of the following description, the "left", "right", "up", and "down" referred to below are consistent with the left direction, right direction, up direction, and down direction of the drawing itself. The following "first", "second", etc. are only used for distinguishing descriptions and have no other special meanings.

[0027] Referring to FIG. 2, an embodiment of the present disclosure provides a shield cooling assembly including an adapter 20. The adapter 20 is configured to accommodate the shield 12 in a space formed by the adapter 20 and fix the shield 12 in a chamber formed by the chamber body 10. Specifically, the adapter 20 is connected to the shield 12 by a fixed connection, and the fixed connection includes a screw connection or the like. For example, the shield 12 is fixed to the adapter 20 by screws. Both the adapter 20 and the shield 12 are made of metal.

[0028] The adapter 20 may have various structures. In this embodiment, the adapter 20 has a first surface 2011 and a second surface 2012 that face the outer surface of the shield 12 and the bottom surface of the bottom wall of the shield 12, respectively. There is a predetermined gap 204 between the first surface 2011 and the outer surface of the shield 12, and the second surface 2012 is in contact with the bottom surface of the bottom wall of the shield 12. In addition, the adapter 20 includes a cooling passage 30 for sending a refrigerant to cool the shield.

[0029] In one embodiment, the adapter 20 includes a cylindrical main body 201 surrounding the shield 12 and a support portion 202 connected to the cylindrical main body 201 to support the bottom wall of the shield 12. The inner surface of the cylindrical main body 201 is used as the aforementioned first surface 2011, and the surface of the support portion 202 in contact with the bottom surface of the bottom wall of the shield 12 is used as the aforementioned second surface 2012.

[0030] In one embodiment, as shown in FIG. 3, the cooling passage 30 is provided inside the cylindrical main body 201.

[0031] In another embodiment, as shown in FIG. 4, the cooling passage 30 may also be provided inside the cylindrical main body 201 and the support portion 202.

[0032] Optionally, the cylindrical main body 201 and the support portion 202 may be an integral structure manufactured, for example, by integral molding, or may be separate structures manufactured, for example, by welding.

[0033] In one embodiment, the adapter 20 further includes a fixing portion 203 connected to the end of the cylindrical main body 201 far from the support portion 202, and the fixing portion 203 is used for fixed connection with the chamber. Specifically, the fixing portion 203 is provided between the side wall of the chamber main body 10 and the heat insulating member 11 located above the side wall, that is, the fixing portion 203 is located outside the chamber formed by the chamber main body 10. Both the cylindrical main body 201 and the support portion 202 are located inside the chamber. In addition, in order to ensure the vacuum inside the chamber, a sealing ring 15 is provided between the fixing portion 203 and the side wall of the chamber main body 10, and a sealing ring 14 is provided between the fixing portion 203 and the heat insulating member 11.

[0034] Optionally, the shape of the orthographic projection of the fixing portion 203 on the radial cross-section of the chamber main body 10 is square, and the four corners of the square are chamfered.

[0035] Optionally, the fixing part 203 and the cylindrical main body 201 may be an integral structure manufactured, for example, by integral molding, or may be separate structures manufactured, for example, by welding.

[0036] In the shield cooling assembly provided by the embodiments of the present disclosure, a cooling passage 30 is provided in the adapter 20. The first surface 2011 and the second surface 2012 of the adapter 20 can simultaneously conduct heat from the side surface and the bottom surface of the shield 12, respectively. The heat transfer efficiency is improved, and uniform cooling of the shield 12 can be achieved. The local temperature of the shield 12 is prevented from becoming too high, thereby effectively preventing the shield 12 from releasing impurities due to high temperature, thereby improving the product quality. Also, by bringing the second surface 2012 into contact with the bottom surface of the bottom wall of the shield 12, the heat contact area between the adapter 20 and the shield 12 can be increased, and the heat transfer efficiency, particularly the heat transfer efficiency at the bottom of the shield 12, can be further improved. Therefore, the phenomenon of temperature rise of the wafer located near the bottom of the shield 12 due to magnetron sputtering can be improved, and the influence on the wafer and the film caused by the temperature rise of the reaction area can be avoided. In addition, by providing the cooling passage 30 in the adapter 20, it is possible to reduce the processing steps and processing difficulty, the cleaning difficulty, and the disassembly and assembly difficulty caused by the addition of the cooling pipeline. At the same time, the adapter 20 has a simple structure and high cooling efficiency, and does not require a sealing ring for sealing the cooling pipeline, thereby reducing the risk of leakage.

[0037] Moreover, there is a predetermined gap 204 between the first surface 2011 and the side wall of the shield 12. The size of the gap 204 meets the requirement that the adapter 20 can perform heat transfer with the shield 12 in order to solve problems such as thermal expansion and deformation of the shield 12 at high temperatures. At the same time, sufficient space is ensured between the adapter 20 and the shield 12 while meeting the installation conditions. For example, the width of the gap 204 may be 0.05 - 0.2 mm, and within this range, the requirements for heat conduction and the requirements for ensuring space can be satisfied simultaneously.

[0038] In one embodiment, the support portion 202 has a ring shape. In order to facilitate heat transfer, the thickness of the support portion 202 should not be too large no matter how large it is. In addition, in order to facilitate lifting of the wafer, the inner diameter of the support portion 202 is equal to or greater than the inner diameter of the shield 12. After being installed on the adapter 20, the shield 12 is supported vertically by the support portion 202. By using the support portion 202 to support the shield 12, the bottom surface of the bottom wall of the shield 12 can be brought into close contact with the second surface 2012 under the action of gravity, so that the heat transfer efficiency can be improved.

[0039] Optionally, the inner wall of the fixing portion 203 and the outer wall of the shield 12 are positioned to ensure that they are coaxially arranged.

[0040] In one embodiment, as shown in FIG. 3, the cooling passage 30 includes a first passage 301 provided inside the cylindrical main body 201, and the first passage 301 surrounds the cylindrical main body 201 in a predetermined distribution pattern. The cooling passage 30 can be arranged in various ways. In this embodiment, the first passage 301 surrounds the cylindrical main body 201 in the circumferential direction and has an annular shape. The first passage 301 extends along one end of the cylindrical main body 201 in the axial direction (the end facing downward in FIG. 3) to a position close to the support portion 202 in order to achieve the purpose of improving the efficiency of heat transfer with the bottom wall of the shield 12.

[0041] The first passage 301 may have various processing methods. In one embodiment, the end of the annular passage close to the support portion 202 penetrates the bottom of the cylindrical main body 201. That is, the cylindrical main body 201 can be processed to include an annular passage having an opening facing downward and having a concave shape. An annular closing member 205 is further provided at the bottom of the cylindrical main body 201, and the annular closing member 205 is hermetically connected to the cylindrical main body 201 to seal the annular passage. The annular closing member 205 is connected to the cylindrical main body 201 in a sealed manner, for example, by welding, which is leak-free, stable, and reliable.

[0042] In another embodiment, as shown in FIG. 4, the cooling passage 30 further includes a second passage 304. The second passage 304 is disposed inside the support portion 202 and circumferentially surrounds the support portion 202 in a predetermined arrangement. In addition, the second passage 304 communicates with the first passage 301. With the help of the second passage 304, the cooling efficiency of the internal substrate portion can be further improved.

[0043] The first passage 301 may be connected to a cooling source outside the chamber in various ways. In one embodiment, as shown in FIGS. 3 and 5, the cooling passage 30 further includes an inlet passage 302 provided in the fixing portion 203 for the refrigerant to enter and an outlet passage 302' for the refrigerant to exit. One end of each of the inlet passage 302 and the outlet passage 302' communicates with the first passage 301, and the other end of each of the inlet passage 302 and the outlet passage 302' is located on the surface of the fixing portion 203 outside the chamber, for example, on the outer surface of the fixing portion 203. Specifically, both the inlet passage 302 and the outlet passage 302' are orthogonal to the axial direction of the cylindrical main body 201.

[0044] Optionally, the cooling passage 30 further includes two connection passages 303 disposed in the cylindrical main body 201, and the two connection passages 303 are used to connect the inlet passage 302 and the outlet passage 302' to the first passage 301 respectively. Optionally, the two connection passages 303 are parallel to the axial direction of the cylindrical main body 201. Of course, in actual applications, the two connection passages 303 may also be oblique to the axial direction of the cylindrical main body 201. In addition, in actual applications, the two connection passages 303 may not be provided, and the inlet passage 302 and the outlet passage 302' may communicate directly with the first passage 301.

[0045] During the cooling process, the refrigerant (such as cooling water) provided by the cooling source passes through the inlet passage 302 and the connection passage 303 connected to the inlet passage 302 in sequence, enters the first passage 301, and then the refrigerant passes through another connection passage 303 and the outlet passage 302' in sequence and returns to the cooling source. In one embodiment, the inlet passage 302 and the outlet passage 302' are arranged side by side. Of course, in actual applications, the inlet passage 302 and the outlet passage 302' may also be arranged opposite to the two sides of the shield 12 respectively.

[0046] In one embodiment, joints 16 for connecting to the inlet pipeline and the return pipeline are provided at the other ends of the inlet passage 302 and the outlet passage 302' respectively. In actual applications, connection methods such as welding and sealing rings can be used to connect and seal the joints 16.

[0047] In another embodiment, as shown in FIG. 6, the inlet passage 302 and the outlet passage 302' are arranged obliquely to the axial direction of the cylindrical main body 201. The downwardly inclined ends of the inlet passage 302 and the outlet passage 302' both communicate with the first passage 301, while the upwardly inclined ends are located on the surface of the fixed part 203 outside the chamber for connection to the cooling source. In addition, due to the inclined inlet passage 302 and outlet passage 302', it is also possible to select whether to provide the above two connection passages 303.

[0048] In actual applications, the arrangement of the cooling passages 30 is not limited to the above-described embodiments, and may be in different forms according to the requirements of the cooling section, which will not be repeated here.

[0049] In summary, in the shield cooling assembly provided by the embodiments of the present disclosure, a cooling passage is provided in the adapter. The adapter has a first surface and a second surface that face the outer surface of the shield and the bottom surface of the bottom wall of the shield, respectively, and both of them can conduct heat from the shield simultaneously, which not only improves the heat transfer efficiency, but also achieves uniform cooling of the shield and avoids the local temperature of the shield from becoming too high. Thereby, it can effectively prevent the shield from releasing impurities due to high temperature, and thus improve the product quality. Also, by bringing the second surface into contact with the bottom surface of the bottom wall of the shield, the heat contact area between the adapter and the shield can be increased, and the heat transfer efficiency, especially the heat transfer efficiency of the shield, can be further improved. Therefore, it is possible to improve the temperature rise of the wafer near the bottom of the shield by magnetron sputtering, and avoid the influence on the wafer and the film caused by the temperature rise in the reaction area. In addition, by providing a cooling passage in the adapter, it is possible to reduce the processing steps and processing difficulties, the cleaning difficulties, and the disassembly and assembly difficulties caused by the addition of the cooling pipeline. At the same time, the adapter has a simple structure and high cooling efficiency, and does not require a sealing ring for sealing the cooling pipeline, thereby reducing the risk of leakage.

[0050] In one embodiment, as shown in FIG. 2, an embodiment of the present disclosure also provides a reaction chamber including a chamber body 10, a shield 12 provided on the chamber body 10, and a shield cooling assembly in any of the above-described embodiments.

[0051] In one embodiment, the reaction chamber includes a magnetron sputtering reaction chamber. Of course, in actual applications, the reaction chamber may also be any other chamber that requires a shield to be installed.

[0052] In addition, the reaction chamber further includes a covering 13, a support structure for supporting the covering 13 is provided at the lower end of the shield 12, and the covering 13 and the shield 12 form a sealed reaction space.

[0053] The reaction chamber provided by the present disclosure not only improves the heat transfer efficiency and process quality by using the above-described shield cooling assembly, but can also reduce the processing steps, processing difficulties, cleaning difficulties, and the decomposition and assembly difficulties caused by the addition of cooling pipelines.

[0054] In one embodiment, the embodiments of the present disclosure also provide a semiconductor processing apparatus including a reaction chamber. The reaction chamber is the same as the reaction chamber in the above-described embodiments.

[0055] The semiconductor processing apparatus is, for example, a PVD apparatus such as a magnetron sputtering apparatus.

[0056] The semiconductor processing apparatus provided by the present disclosure not only improves the heat transfer efficiency and process quality by using the above-described reaction chamber, but can also reduce the processing steps, processing difficulties, cleaning difficulties, and the decomposition and assembly difficulties caused by the addition of cooling pipelines.

[0057] In all the technical solutions disclosed in the present disclosure, unless otherwise specifically stated, when the present disclosure discloses a numerical range, the disclosed numerical range is a preferred numerical range, and those skilled in the art should understand that the preferred numerical range is only those having obvious or representative technical effects among many realizable numerical values. Due to the large number of numerical values that cannot be completely enumerated, the present disclosure only discloses some numerical values to illustrate the technical solutions of the present disclosure, and the numerical values listed above should not constitute a limitation on the protection scope of the present disclosure.

[0058] Meanwhile, if the above disclosure discloses or involves parts or structures fixedly connected to each other, unless otherwise specified, the fixed connection may be understood as a removable fixed connection (for example, connected by bolts or screws), or may be understood as a non-removable fixed connection (such as riveting, welding, etc.). Of course, the mutual fixed connection (except when it is clearly impossible to use an integral forming process) can also be replaced by an integral structure (such as using a casting process for integral forming).

[0059] In addition, unless otherwise specified, the terms used to indicate the positional relationship or shape in any of the technical solutions disclosed in this disclosure include states or shapes that approximate, are similar to, or are close to them, unless otherwise specified. Any component provided by this disclosure may be assembled from a plurality of separate components or may be a single component manufactured by an integral forming process.

[0060] The above embodiments are not intended to limit the technical solutions of the present disclosure but are only used for illustration. Although the present disclosure has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that specific realizations of the present invention are still modifiable, or some technical features can be equivalently replaced, and all of them are covered within the scope of the technical solutions claimed by the present disclosure without departing from the spirit of the technical solutions of the present disclosure.

[0061] The description of the present disclosure is provided for example and explanation, is not exhaustive, and does not limit the present disclosure to the disclosed form. Many modifications and changes will be apparent to those skilled in the art. The embodiments are selected and described to better illustrate the principles and actual applications of the present disclosure and to enable those skilled in the art to understand the present disclosure and design various embodiments with various modifications suitable for specific purposes.

Claims

1. A shield cooling assembly configured to cool a shield of a reaction chamber, the shield cooling assembly comprising: an adapter used to fix the shield in the chamber, the adapter including a first surface and a second surface used to face the outer surface of the shield and the bottom surface of the bottom wall of the shield respectively, the first surface of the adapter being used to have a predetermined gap from the outer surface of the shield, the second surface of the adapter being used to contact the bottom surface of the bottom wall of the shield, and a cooling passage for sending a refrigerant for cooling the shield being provided in the adapter; the adapter having a support portion and a cylindrical main body, the cylindrical main body being used to surround the shield, and the cylindrical main body being connected to the support portion to support the bottom wall of the shield; the adapter further including a fixing portion connected to an end of the cylindrical main body far from the support portion, the fixing portion being used to be fixedly connected to the chamber; the fixing portion being used to be provided between a side wall of the chamber and a heat insulating member located above the side wall, and being used to be hermetically connected to both the chamber and the heat insulating member, a shield cooling assembly.

2. The inner surface of the cylindrical main body of the adapter functions as the first surface, and the surface of the support portion of the adapter in contact with the bottom surface of the bottom wall of the shield functions as the second surface; The cooling passage is provided inside the cylindrical main body, or the cooling passage is provided inside the cylindrical main body and the support portion, the shield cooling assembly according to claim 1.

3. The cooling passage includes a first passage disposed inside the cylindrical main body, the first passage surrounding the cylindrical main body in a circumferential direction in a predetermined distribution pattern, the shield cooling assembly according to claim 2.

4. The first passage surrounds the cylindrical main body in the circumferential direction and has an annular shape, and ends of the first passage extend along an axial direction of the cylindrical main body to a position close to the support portion, the shield cooling assembly according to claim 3.

5. The end of the first passage close to the support portion penetrates the bottom of the cylindrical body, and an annular blocking member is provided on the bottom of the cylindrical body. The annular blocking member is connected to the cylindrical body to seal the first passage. The shield cooling assembly according to claim 4, characterized in that.

6. The cooling passage further includes a second passage disposed inside the support portion and surrounding the support portion of the adapter in a predetermined arrangement mode. The second passage communicates with the first passage. The shield cooling assembly according to claim 3, characterized in that.

7. The inner diameter of the support portion of the adapter is not less than the inner diameter of the shield. The shield cooling assembly according to claim 2, characterized in that.

8. The cooling passage further includes an inlet passage provided in the fixing portion for the refrigerant to enter and an outlet passage for the refrigerant to exit. One end of each of the inlet passage and the outlet passage communicates with the first passage, and the other end of each of the inlet passage and the outlet passage is located on the surface of the fixing portion located outside the chamber. The shield cooling assembly according to claim 3, characterized in that.

9. The inlet passage and the outlet passage are arranged obliquely with respect to the axial direction of the cylindrical body, Or, Both the inlet passage and the outlet passage are perpendicular to the axial direction of the cylindrical body. The shield cooling assembly according to claim 8, characterized in that.

10. The cooling passage further includes two connecting passages arranged in the cylindrical body. The two connecting passages are configured to communicate the inlet passage and the outlet passage with the first passage respectively. The shield cooling assembly according to claim 9, characterized in that.

11. A joint is provided at each of the other ends of the inlet passage and the outlet passage for connecting to an inlet pipeline and a return pipeline respectively. The shield cooling assembly according to claim 8, characterized in that.

12. A sealing ring is provided between the fixing portion of the adapter and the side wall of the chamber and between the fixing portion of the adapter and the heat insulating member. The shield cooling assembly according to claim 8, characterized in that.

13. A reaction chamber including a chamber body and a shield disposed inside the chamber body, The reaction chamber further includes a shield cooling assembly according to any one of claims 1 to 12, and is characterized in that it is a reaction chamber.

14. The reaction chamber includes a magnetron sputtering reaction chamber, and is characterized in that it is the reaction chamber according to claim 13.

15. A semiconductor processing apparatus including a reaction chamber, wherein the reaction chamber adopts the reaction chamber according to any one of claims 13 to 14, and is characterized in that it is a semiconductor processing apparatus.

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