Component lifting device and component mounting device

Abstract

This component push-up device comprises: a plurality of push-up tools each including a wafer sheet-attracting surface and a push-up pin; a movable push-up head comprising a tool attachment portion to which the push-up tools are selectively attached; a tool transfer mechanism which comprises a tool storage table capable of supporting each of the plurality of push-up tools in the same posture as in a state of being attached to the tool attachment portion, and a holding member capable of holding the push-up tools, the tool transfer mechanism transferring the push-up tools in a held state; and a control unit which controls the push-up head and the tool transfer mechanism to perform a tool returning operation for detaching the push-up tools from the push-up head and returning the push-up tools to the tool storage table, and / or a tool attachment operation for attaching the push-up tools being supported on the tool storage table to the tool attachment portion of the push-up head.

Description

Technical Field

[0001] The present invention relates to a component lifting device that lifts and peels off a die from below a wafer sheet when picking up a die (bare chip) from a wafer attached to the wafer sheet, and a component mounting device equipped with this component lifting device.

Background Art

[0002] Conventionally, a component mounting device that picks up a die (bare chip) from a diced wafer and mounts it on a substrate is known. In this component mounting device, the wafer carried into a predetermined position (component placement area) in the machine by a wafer feeder is imaged by a wafer camera for wafer recognition, and then the operation of picking up the die with a head having a die holding function is repeated.

[0003] The component mounting device is provided with a component lifting device that peels off the die from the wafer sheet prior to picking up the die by lifting the die from below the wafer attached to the wafer sheet. The component lifting device includes a cylindrical suction housing and one or more lifting pins provided so as to be able to protrude and retract from the central portion thereof. With the wafer sheet being sucked under negative pressure from the lower surface by the suction housing, the die is lifted from below by the lifting pins.

[0004] The sizes of the dies are diverse, and it is necessary to use a suction housing and lifting pins suitable for the size of the die. Therefore, the operator manually exchanges the suction housing and the lifting pins. In recent years, as disclosed in Patent Document 1, there has also been proposed a component lifting device that standby a plurality of types of lifting tools (peeling promotion heads) including a suction housing and lifting pins, and automatically exchanges the lifting tools for the lifting unit (chip peeling promotion unit).

[0005] This component lifting device is a type of component lifting device in which the component lifting unit lifts the die while moving relative to the wafer. The lifting unit is provided with a lifting head (peeling promotion head mounting part) that can rotate between a vertical posture and a horizontal posture, and the lifting tool is detachably mounted on the tool mounting part of this lifting head. The lifting tool during standby is arranged horizontally. When exchanging the lifting tool, the lifting head is displaced from the vertical posture to the horizontal posture, and the lifting head moves in the vertical and horizontal directions and moves to the standby position of the lifting tool. First, the lifting tool mounted on the tool mounting part is locked by the locking arm, and in this state, the lifting head retracts, so that the lifting tool is removed from the tool mounting part. Next, the lifting head moves to the position of the lifting tool at the replacement destination, so that the lifting tool is mounted on the tool mounting part. After that, the lifting head is reset from the horizontal posture to the vertical posture, thereby completing the replacement of the lifting tool.

[0006] As described above, the component lifting device of Patent Document 1 requires a total of four-axis drive mechanism and its control, which includes three axes (X-axis, Y-axis, Z-axis) for linear movement of the lifting head and one axis for rotation, as a drive system for exchanging the lifting tool. In addition, the same number of locking arms and their drive mechanisms as the number of lifting tools to be put on standby are also required. Therefore, the configuration and control of the drive system for exchanging the lifting tool generally become complicated.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

[0008] The present invention has been made in view of the above problems, and its object is to enable automatic replacement of a lifting tool provided with a suction housing and a lifting pin in a component lifting device with a simpler configuration and control.

[0009] The component pushing-up device according to one aspect of the present invention is a component pushing-up device that peels a die from a wafer sheet by pushing up the die from below the wafer attached to the wafer sheet, and includes a suction surface that negatively pressurizes and adsorbs the lower surface of the wafer sheet, and a plurality of pushing-up tools each provided with a pushing-up pin that can protrude and retract from the suction surface toward the wafer sheet side, and a tool mounting portion to which the plurality of pushing-up tools are selectively and detachably mounted in the vertical direction, and a pushing-up head that is movable relative to the wafer sheet in a direction along the wafer sheet and in the vertical direction, and a tool storage table that can support each of the plurality of pushing-up tools in the same posture as the mounted state on the tool mounting portion, and a holding member that can hold the pushing-up tool, and a tool transfer mechanism that transfers the pushing-up tool between the pushing-up head and the tool storage table by moving the holding member in the vertical direction and the horizontal direction while holding the pushing-up tool, and a control unit that executes a tool return operation of removing the pushing-up tool mounted on the tool mounting portion by the holding member and returning it to the tool storage table, and / or a tool mounting operation of holding the pushing-up tool supported by the tool storage table by the holding member and mounting it on the tool mounting portion by controlling the pushing-up head and the tool transfer mechanism.

[0010] In addition, a component mounting device according to one aspect of the present invention includes a component supply unit in which a wafer in a diced state and attached to a wafer sheet is arranged, a head that picks up and transfers a die from the wafer arranged in the component supply unit, and the above-described component pushing-up device that pushes up the die from below the wafer sheet when picking up the die by the head.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

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Figure 8

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Figure 10

Figure 11

Figure 12

DETAILED DESCRIPTION OF THE INVENTION

[0012] [Description of Component Mounting Apparatus 1] FIG. 1 is a plan view in a top view showing the overall configuration of a component mounting apparatus 1 according to an embodiment of the present invention. The component mounting apparatus 1 is a hybrid type component mounting apparatus capable of mounting a die 7a (component) diced from a wafer 7 on a substrate P in addition to completed components such as transistors and capacitors. The component mounting apparatus 1 includes an apparatus main body 100 and a control unit 200 (see FIG. 6). In the figure, XYZ rectangular coordinates are shown for clarifying the direction relationship.

[0013] The apparatus main body 100 includes a base 2, a conveyor 3, a head unit 4, a component supply unit 5, a pushing-up unit 40, and a tool storage unit 60.

[0014] The base 2 is a mounting base for various devices provided in the apparatus main body 100. The conveyor 3 is a conveyance line for the substrate P installed to extend in the X direction on the base 2. The conveyor 3 conveys the substrate P from outside the machine to a predetermined mounting work position, and after the mounting work, conveys the substrate P from the mounting work position to outside the machine. Note that the position where the substrate P is shown in FIG. 1 is the mounting work position. The component supply units 5 are respectively provided on the -Y side and the +Y side with the conveyor 3 interposed therebetween.

[0015] The head unit 4 picks up components in the component supply unit 5, moves to the above-described mounting work position, and mounts the components on the substrate P. The head unit 4 includes a plurality of heads 4H each having a suction nozzle that holds a component by negative pressure adsorption during the pickup. The head 4H is capable of moving forward and backward (lifting and lowering) in the Z direction with respect to the head unit 4 and rotating about an axis. A substrate recognition camera 12 for imaging the substrate P is mounted on the head unit 4. A fiducial mark attached to the substrate P is recognized from a captured image of the substrate recognition camera 12.

[0016] The apparatus main body 100 includes a head unit drive mechanism D1 that enables the head unit 4 to move in the horizontal direction (XY direction) between the component supply unit 5 and the substrate P held at the mounting work position. The head unit drive mechanism D1 includes a pair of Y-axis rails 13, a Y-axis motor 14, and a ball screw shaft 15 provided on the +X side and the -X side respectively on an overhead frame 11, and a support frame 16 installed between the pair of Y-axis rails 13. The ball screw shaft 15 is screwed into a nut provided on the support frame 16. Further, the head unit drive mechanism D1 includes a schematic guide member, an X-axis motor 17, and a ball screw shaft 18 mounted on the support frame 16. The guide member supports the head unit 4 so as to be movable in the X direction, and the ball screw shaft 18 is screwed into a schematic nut provided on the head unit 4.

[0017] By the operation of this head unit drive mechanism D1, the head unit 4 moves horizontally. That is, when the ball screw shaft 15 is rotationally driven by the Y-axis motor 14, the head unit 4 moves in the Y direction integrally with the support frame 16, and when the ball screw shaft 18 is rotationally driven by the X-axis motor 17, the head unit 4 moves in the X direction with respect to the support frame 16.

[0018] The component supply unit 5 includes a first component supply unit 5A located on the -Y axis of the conveyor 3 and a second component supply unit 5B located on the +Y side. A plurality of tape feeders 19 are arranged in parallel along the conveyor 3 in the first component supply unit 5A. The tape feeder 19 is a type of component supply device that supplies a tape in which completed components such as the aforementioned transistors and capacitors are stored at regular intervals while feeding out the tape.

[0019] The second component supply unit 5B is provided with a wafer supply device 6 that supplies a plurality of dies 7a in the form of a wafer 7, a component transfer unit 33 that picks up the die 7a from the wafer 7 and transfers it to a predetermined delivery position with respect to the head unit 4, a wafer camera 39, and a component recognition camera 10.

[0020] The wafer supply device 6 includes a wafer storage elevator 22, a wafer table 20, and a wafer extraction unit 23. The wafer storage elevator 22 stores the wafer sheets 8a with the wafers 7 attached in a vertically multi-stage manner while being held by the wafer holders 8. The wafer storage elevator 22 raises and lowers the wafers 7 stored in multiple stages integrally and arranges an arbitrary wafer 7 at a height corresponding to the height of the wafer table 20.

[0021] The wafer table 20 is arranged on the -Y side of the wafer storage elevator 22. The wafer table 20 is a workbench for component extraction that holds the wafer holders 8 (wafers 7). The wafer supply device 6 is provided with a wafer table drive mechanism D2 that enables the wafer table 20 to move in the horizontal direction (XY direction).

[0022] FIG. 2 is a plan view showing a wafer table 20 and a wafer table drive mechanism D2. The wafer table drive mechanism D2 includes a pair of X-axis rails 30 on the +Y side and the -Y side, an X-axis motor 31 and a ball screw shaft 32, and a plate-shaped support frame 26 installed on the pair of X-axis rails 30. The ball screw shaft 32 is screwed into a nut provided on the support frame 26. Further, the wafer table drive mechanism D2 includes a pair of Y-axis rails 27 on the +X side and the -X side provided on the support frame 26, a Y-axis motor 28, and a ball screw shaft 32. The ball screw shaft 32 is screwed into a nut provided on the wafer table 20.

[0023] By the operation of this wafer table drive mechanism D2, the wafer table 20 moves in the horizontal direction. That is, when the X-axis motor 31 rotationally drives the ball screw shaft 32, the wafer table 20 moves in the X direction integrally with the support frame 26, and when the Y-axis motor 28 rotationally drives the ball screw shaft 29, the wafer table 20 moves in the Y direction with respect to the support frame 26. When picking up the die 7a by the head 4H, the target die 7a is arranged at a predetermined pickup position P1 defined by XY coordinates by the movement of the wafer table 20.

[0024] The wafer extraction unit 23 takes in and out the wafer holder 8 between the wafer storage elevator 22 and the wafer table 20. The wafer extraction unit 23 includes a draw head 24 capable of locking the wafer holder 8, and a draw head drive device 25 that moves the draw head 24 in the Y direction.

[0025] The wafer extraction unit 23 moves the wafer holder 8 by moving the draw head 24 in the Y direction with the wafer holder 8 locked by the draw head 24. That is, the wafer 7 is taken in and out of the wafer storage elevator 22 together with the wafer holder 8. The taking in and out of the wafer holder 8 is made possible by arranging the wafer table 20 at a predetermined wafer taking in and out position that is close to and faces the -Y side of the wafer storage elevator 22.

[0026] The component transfer unit 33 includes a transfer head 34 that picks up the die 7a disposed at the pickup position P1 from the wafer 7, a transfer table 38 for delivering the die 7a to the head unit 4, and a transfer head drive mechanism D3 that enables the transfer head 34 to move.

[0027] The transfer head 34 includes a suction nozzle 34a that holds the die 7a by negative pressure adsorption. The transfer head 34 picks up the die 7a by negatively pressure adsorbing the die 7a at the pickup position P1. The suction nozzle 34a can move forward and backward (up and down) in the Z direction with respect to the base portion of the transfer head 34 and rotate about a horizontal axis. By the transfer head 34 rotating about the horizontal axis, the posture of the die 7a can be turned upside down.

[0028] Note that the negative pressure passage for supplying negative pressure to the suction nozzle 34a is provided with a negative pressure sensor Se4 (see FIG. 6) capable of detecting the negative pressure level. Also, a position sensor Se5 (see FIG. 6) such as an encoder is built into a motor (not shown) for moving the transfer head 34 forward and backward, and based on the position information detected by this position sensor Se5, the Z coordinate, that is, the height of the transfer head 34 can be detected. The "negative pressure level" detected by the negative pressure sensor Se4 and the "position information" detected by the position sensor Se5 are information capable of detecting the height of the push-up tool 45 mounted on the push-up head 41, as will be described later. Therefore, in this example, the negative pressure sensor Se4 and the position sensor Se5 correspond to the "acquisition unit" of the present invention.

[0029] The transfer table 38 is a delivery table for delivering the die 7a held by the suction nozzle 34a to the head 4H of the head unit 4. The transfer table 38 is disposed at a predetermined delivery position close to the mounting operation position.

[0030] The transfer head drive mechanism D3 includes a rail 37 that movably supports the transfer head 34, a ball screw shaft 36 arranged in parallel with this rail 37, and a motor 35. The ball screw shaft 36 is screwed into a nut provided on the transfer head 34. The transfer head drive mechanism D3 moves the transfer head 34 in the space between the pickup position P1 and the transfer table 38 by rotationally driving the ball screw shaft 36 with the motor 35.

[0031] The wafer camera 39 images a part of the wafer 7 held on the wafer table 20 at the pickup position P1, that is, the die 7a within the camera's field of view, from above. Based on this captured image, the position of the die 7a to be picked up is recognized. The wafer camera 39 is supported by an overhead frame (not shown) so as to be located above the transfer head 34 in a state where the transfer head 34 is arranged at the pickup position P1. This avoids interference with the transfer head 34.

[0032] The component recognition camera 10 is arranged at a position adjacent to the +X side of the transfer table 38. The component recognition camera 10 images the components (die 7a and completed components) adsorbed to the head 4H of the head unit 4 from below before mounting them on the substrate P. Based on this captured image, the adsorption state of the components by the head 4H is recognized.

[0033] Figure 3 is a schematic perspective view of the push-up unit 40 and the tool storage unit 60. As shown in Figures 2 and 3, the push-up unit 40 and the tool storage unit 60 are arranged below the component supply unit 5, specifically, below the support frame 26 of the wafer table drive mechanism D2. The wafer table 20 is provided with a circular opening 20a, and the support frame 26 is provided with an opening (not shown) at a position that can overlap with this opening 20a. The push-up unit 40 is arranged below these openings. That is, when the wafer holder 8 is held on the wafer table 20, the wafer 7 is arranged inside the opening 20a. The push-up unit 40 pushes up the die 7a through the openings of the support frame 26 and the wafer table 20.

[0034] The lifting unit 40 includes a lifting head 41 and a lifting head drive mechanism D6. As shown in FIGS. 3 and 4(a), the lifting head 41 includes a shaft-shaped head main body portion 42 extending in the Z direction and a lifting tool 45 attached to the upper end portion thereof. Note that FIG. 4(a) is a cross-sectional view of the tip portion of the lifting head 41.

[0035] The lifting head 41 is arranged such that the head main body portion 42 is located at the pickup position P1. The head main body portion 42 has a cylindrical shape and is provided around a lifting spindle 44 that moves forward and backward (up and down) in the Z direction.

[0036] The lifting tool 45 includes a suction housing 46 (sometimes referred to as a "suction dome") for sucking the wafer sheet 8a from below and a pin holder 48 disposed inside thereof. The suction housing 46 is a member having a toped cylindrical shape including a suction surface portion 46a having a circular suction surface in plan view for sucking the wafer sheet 8a under negative pressure and a cylindrical portion 46b extending downward from around it. A plurality of pin holes 47 are formed in the suction surface portion 46a in a predetermined arrangement.

[0037] The lifting tool 45 is detachably attached to the tip (upper end) of the head main body portion 42 via the suction housing 46. Specifically, a tool mounting portion 43 having a smaller diameter than other portions is formed at the tip of the head main body portion 42, and the cylindrical portion 46b of the suction housing 46 is fitted into the tool mounting portion 43, whereby the lifting tool 45 is attached to the head main body portion 42. In the following description, for convenience, there may be cases where it is said that the lifting tool 45 is attached to the lifting head 41.

[0038] The pin holder 48 is a member in which one or a plurality of push-up pins 50 are erected on a disc-shaped pin base 49, and is held by the suction housing 46 in a state of being movable in the Z direction along the inner peripheral surface of the cylindrical portion 46b. As shown in Fig. 4(b), the pin holder 48 is pushed up against the suction housing 46 by the forward (upward) movement of the push-up spindle 44. Thereby, the push-up pin 50 protrudes upward from the suction surface portion 46a through the pin hole 47. When the push-up spindle 44 moves backward (downward), the pin holder 48 descends with respect to the suction housing 46 by its own weight or the biasing force of an elastic member (such as a spring) not shown. Thereby, the push-up pin 50 retracts into the suction housing 46 (pin hole 47). That is, the push-up pin 50 is provided so as to be able to protrude and retract upward from the suction surface portion 46a.

[0039] In addition, when picking up the die 7a, a negative pressure is supplied into the suction housing 46 through the head main body portion 42. By this negative pressure, the wafer sheet 8a is adsorbed through the pin hole 47. That is, with the wafer sheet 8a being negatively pressure adsorbed through the suction surface portion 46a of the suction housing 46, when the push-up pin 50 protrudes from the suction surface portion 46a, the die 7a is pushed up through the wafer sheet 8a.

[0040] Note that the number, arrangement, size (diameter, length), and tip shape of the push-up pins 50, etc. have different suitable modes according to the size of the die 7a and the circuits formed thereon. In the tool storage unit 60 described later, a plurality of push-up tools 45 with different modes are held and stored. When picking up the die 7a, the push-up tool 45 determined in advance for each type of the die 7a (wafer 7) is attached to the push-up head 41.

[0041] The push-up head drive mechanism D6 is constituted by, for example, a cylinder mechanism using air as a drive source. By the operation of the push-up head drive mechanism D6, the push-up head 41 moves forward and backward (up and down) at the pickup position P1. Specifically, it moves forward and backward between a predetermined push-up height position where the suction surface portion 46a abuts against the lower surface of the wafer sheet 8a and a predetermined standby height position (the position shown in FIG. 3) that has retreated downward from the push-up height position. Note that on the -Y side of the push-up head 41 disposed at the standby height position, a first tool detection sensor Se1 (corresponding to the "sensor" of the present invention) capable of detecting the presence or absence of the push-up tool 45 at the tip portion of the push-up head 41 is disposed.

[0042] As shown in FIGS. 2 and 3, the tool storage unit 60 is provided adjacent to the +X side of the push-up unit 40. The tool storage unit 60 includes a tool storage section 60A and a tool transfer mechanism 60B. The tool storage section 60A holds and stores a plurality of types of push-up tools 45, and the tool transfer mechanism 60B transports the push-up tool 45 between the push-up unit 40 and the tool storage section 60A.

[0043] The tool storage section 60A includes a tool storage table 61 that holds the push-up tool 45, a storage table drive mechanism D4 that moves the tool storage table 61, and a code reading sensor Se3.

[0044] As shown in FIGS. 2 and 3, the tool storage table 61 is disposed at a position adjacent to the +X side with respect to the head main body portion 42 of the push-up head 41. The tool storage table 61 is rectangular in plan view and elongated in the X direction, and is provided with a plurality of tool holding portions 62 on the upper surface. The tool holding portion 62 is a circular recess formed on the upper surface of the tool storage table 61. The inner diameter of the tool holding portion 62 is set to a dimension such that the push-up tool 45 (suction housing 46) can be fitted, and the push-up tool 45 is supported on the tool storage table 61 in a state where its lower end portion is loosely fitted into the tool holding portion 62.

[0045] In the present example, the tool storage table 61 is provided with three tool holding portions 62 arranged in a row at equal intervals in the X direction. As shown in FIG. 2, in a plan view, each tool holding portion 62 is provided such that the center of each is located on a straight line L1 extending in the X direction passing through the center of the head main body portion 42 of the push-up head 41. And, the first tool 45A is placed in the tool holding portion 62 at the -X side end (appropriately referred to as the first tool holding portion 62A), the second tool 45B is placed in the middle tool holding portion 62 (appropriately referred to as the second tool holding portion 62B), and the third tool 45C is placed in the tool holding portion 62 at the +X side end (appropriately the third tool holding portion 62C). In FIGS. 2 and 3, the first tool 45A is attached to the push-up head 41, and thus the first tool holding portion 62A is empty.

[0046] FIG. 5 is a perspective view showing the head main body portion 42 of the push-up head 41, the push-up tool 45, and the tool storage table 61. As shown in FIG. 5, a positioning convex portion 43a is provided on the outer peripheral surface of the tool mounting portion 43 of the head main body portion 42, and a positioning concave portion 56 is provided on the outer peripheral surface of the push-up tool 45 (adsorption housing 46). The push-up tool 45 is mounted on the tool mounting portion 43 in a state of being positioned around the vertical axis by the fitting of the positioning convex portion 43a and the positioning concave portion 56. On the other hand, a positioning convex portion 63 is provided on the inner peripheral surface of each tool holding portion 62 of the tool storage table 61, and the push-up tool 45 is held in the tool holding portion 62 in a state of being positioned around the vertical axis by the fitting of the positioning convex portion 63 and the positioning concave portion 56.

[0047] Here, the positioning convex portion 43a of the head main body portion 42 and each positioning convex portion 63 of each tool holding portion 62 are both on the straight line L in a plan view and are both provided on the -X side. That is, the push-up tool 45 is held in the tool storage table 61 in the same posture as the mounting state on the tool mounting portion 43 of the head main body portion 42 (in the present example, the vertical direction and the direction around the axis are both the same state). In addition, a second tool detection sensor Se2 is embedded in the inner bottom surface of each tool holding portion 62, and the presence or absence of the push-up tool 45 in each tool holding portion 62 can be detected.

[0048] The storage table drive mechanism D4 is configured by, for example, a screw feed mechanism using a motor as a drive source. By the operation of this storage table drive mechanism D4, the tool storage table 61 horizontally moves in the X direction, so that the push-up tools 45 (45A to 45B) held on the tool storage table 61 are selectively arranged at a predetermined tool loading / unloading position P2 (corresponding to the "holding position" of the present invention) defined by XY coordinates. Note that the storage table drive mechanism D4 may be configured by a cylinder mechanism using air as a drive source.

[0049] The code reading sensor Se3 (corresponding to the "first reading unit" and "second reading unit" of the present invention) is a sensor that reads the identification mark of each push-up tool 45 held on the tool storage table 61. The code reading sensor Se3 is arranged on the -Y side of the tool loading / unloading position P2, and reads the identification information recorded in the identification information recording unit provided on the side surface of the push-up tool 45 arranged at the tool loading / unloading position P2.

[0050] Specifically, as shown in FIG. 5, in the outer peripheral portion on the -Y side of the cylindrical portion 46b of the push-up tool 45 (suction housing 46), a notch-shaped flat surface portion 52 for a code is formed, and a one-dimensional or two-dimensional identification code 54 is provided on this flat surface portion 52 for a code as an identification information recording unit, for example. The code reading sensor Se3 reads this identification code 54. Note that the identification mark is not limited to one-dimensional or two-dimensional identification codes, and various sensors capable of reading the identification mark can also be applied to the code reading sensor Se3.

[0051] As shown in FIGS. 2 and 3, the tool transfer mechanism 60B includes a chuck head 65 and a chuck head drive mechanism D5 that moves the chuck head 65 in the Z direction and the X direction. The chuck head 65 is an electrically driven or air-driven parallel opening / closing type chuck device having a pair of claws 66 that can open and close in the X direction. The chuck head 65 holds the push-up tool 45 by sandwiching the push-up tool 45 from both sides in the X direction with the pair of claws 66.

[0052] The chuck head drive mechanism D5 includes, for example, a slider 72 that moves in the X direction by a screw feed mechanism using a motor as a drive source, and similarly, a base frame 68 that moves in the Z direction by a screw feed mechanism using a motor as a drive source. The chuck head 65 is assembled to the base frame 68. By the operation of the chuck head drive mechanism D5, the base frame 68 moves in the X direction together with the slider 72, and the base frame 68 moves in the Z direction with respect to the slider 72. Thereby, the chuck head 65 moves in the X direction and the Z direction. Note that the chuck head drive mechanism D5 may be configured to move the slider 72 and the base frame 68 by a cylinder mechanism using air as a drive source.

[0053] As shown in FIG. 2, in a plan view, the pair of claws 66 are arranged at positions intersecting the straight line L, and by the operation of the chuck head drive mechanism D5, the chuck head 65 moves only in the X direction and the Z direction. Therefore, the chuck head 65 clamps the push-up tool 45 on the straight line L.

[0054] Note that, of the outer peripheral portions of the cylindrical portion 46b of the push-up tool 45 held by the tool holding portion 62 on the +X side and the -X axis, notch-shaped chucking flat portions 53 are provided respectively. The chucking flat portions 53 are surfaces parallel to each other. On the other hand, each claw 66 has a clamping surface parallel to the flat portion 53, and the chuck head 65 clamps the chucking flat portion 53 of the push-up tool 45 with the clamping surfaces of the pair of claws 66. Therefore, the push-up tool 45 is held and conveyed by the chuck head 65 while maintaining the posture of being placed on the tool holding portion 62.

[0055] [Basic Operation of Component Mounting Apparatus 1] In the above-described component mounting apparatus 1, the basic operation when mounting the die 7a on the substrate P is as follows. First, the wafer table 20 is disposed at the wafer loading / unloading position, and the wafer holder 8 is pulled out from the wafer storage elevator 22 to the wafer table 20 by the wafer extraction unit 23. Thereby, the wafer sheet 8a to which an aggregate (wafer 7) of a large number of dies 7a, 7a... is adhered is disposed on the wafer table 20.

[0056] Next, by the movement of the wafer table 20, the die 7a to be picked up is disposed at the pickup position P1, and the wafer camera 39 images the die 7a. At this time, the transfer head 34 of the component transfer unit 33 retracts from the pickup position P1. The imaging by the wafer camera 39 is for the recognition of the die 7a to be adsorbed by the transfer head 34 in the subsequent picking operation.

[0057] When the imaging of the die 7a is completed, the transfer head 34 is disposed at the pickup position P1, and the adsorption nozzle 34a picks up the die 7a recognized by the imaging by the wafer camera 39. At this time, the die 7a is pushed up by the push-up head 41. Specifically, the push-up head 41 is displaced (raised) from the standby height position to the push-up height position, and the wafer sheet 8a is sucked by negative pressure on the adsorption surface portion 46a. Thereafter, by the operation of the push-up spindle 44, the push-up pin 50 protrudes from the adsorption surface portion 46a, and thereby the die 7a is pushed up through the wafer sheet 8a.

[0058] After the picking of the die 7a, the transfer head 34 moves from above the wafer table 20 to above the transfer table 38. Here, when the die 7a is delivered to the head unit 4 while being adsorbed by the adsorption nozzle 34a, the die 7a is released onto the transfer table 38. Thereafter, the transfer head 34 retracts from above the transfer table 38, and the head unit 4 moves above the transfer table 38, and the head 4H picks up the die 7a from the transfer table 38. After the picking of the die 7a, the head unit 4 moves above the substrate P at the mounting operation position via above the component recognition camera 10 and descends. Thereby, the die 7a is mounted on the substrate P.

[0059] On the other hand, when the die 7a is transferred to the head unit 4 in a posture that is vertically inverted from the suction posture by the suction nozzle 34a, for example, the suction nozzle 34a rotates and moves above the transfer table 38, thereby vertically inverting the posture of the die 7a. Then, the head unit 4 moves above the transfer head 34, and the die 7a is directly picked up by the head 4H from the suction nozzle 34a. After picking up the die 7a, similarly to the above, the head unit 4 moves above the substrate P at the mounting operation position via above the component recognition camera 10. Thereby, the die 7a is mounted on the substrate P.

[0060] Thereafter, while the wafer table 20 moves so that the die 7a to be picked up is disposed at the pickup position P1, the operation of picking up the die 7a by the transfer head 34 and mounting the die 7a on the substrate P by the head 4H is repeated.

[0061] Note that, as described above, the optimal form of the push-up tool 45 used when picking up the die 7a differs according to the size of the die 7a and the circuit formed thereon. Therefore, when the variety of the die 7a is changed, the push-up tool 45 mounted on the push-up head 41 is exchanged accordingly. This point will be described in detail later.

[0062] [Explanation of the control system of the component mounting apparatus 1] FIG. 6 is a block diagram showing the control system of the component mounting apparatus 1. As described above, the component mounting apparatus 1 includes a control unit 200, and further includes a display unit 90 that displays various information related to component mounting processing and the like, and an input unit 91 that receives input operations of various commands to the control unit 200.

[0063] The control unit 200 is configured to include a CPU, a ROM, a RAM, and peripheral circuits, etc. The control unit 200 controls the operations of the respective components of the apparatus main body 100 by the CPU executing the control program stored in the ROM. As the main functional configurations, the control unit 200 includes an implementation control unit 81, a conveyance control unit 82, a component supply control unit 83, a component pushing-up control unit 84, an imaging control unit 85, a storage unit 86, and a display control unit 87.

[0064] The implementation control unit 81 comprehensively controls the operations of component mounting processes in the apparatus main body 100, mainly the operations of the head unit drive mechanism D1 and the drive mechanism of the head 4H. The conveyance control unit 82 controls the conveyance operation of the substrate P by the conveyor 3.

[0065] The component supply control unit 83 controls the supply operation of the die 7a. That is, it controls the operations of the respective parts 22, 23, D2 of the wafer supply device 6 and the operation of the component transfer unit 33. Also, the component supply control unit 83 controls the operation of the tape feeder 19.

[0066] The component pushing-up control unit 84 comprehensively controls the operations of the pushing-up unit 40 and the tool storage unit 60. In particular, when changing the type of the die 7a (wafer 7) to be mounted, in response to the input operation of the operator by the input unit 91, the pushing-up tool 45 mounted on the pushing-up head 41 is exchanged with another pushing-up tool 45 held on the tool storage table 61, and the following tool exchange process is executed. Also, based on the input signals from the sensors Se1 to Se5, various determination processes are executed in the tool exchange process.

[0067] The imaging control unit 85 controls the imaging operations by the component recognition camera 10, the substrate recognition camera 12, and the wafer camera 39. The imaging control unit 85 includes an image processing unit 85a, and generates a digital image of the subject based on the image signals output from the respective cameras 10, 12, 39. Specifically, it generates digital images of the component adsorbed by the head 4H, the fiducial mark of the substrate P, and the die 7a.

[0068] The storage unit 86 stores various programs executed in component mounting processing and correction data acquisition processing, and various data referred to when executing the programs. The various data includes board data and tool data. The board data includes information such as the type of the board P, the components mounted on each type of board P, and the mounting positions (coordinates) of the components. The tool data (tool information) is information regarding the suction nozzle and the push-up tool 45. This tool data includes data that defines the push-up tool 45 (identification information) used for pushing up for each type of die 7a, and data such as the number and arrangement of the push-up pins 50 provided on each push-up tool 45.

[0069] The display control unit 87 controls the display by the display unit 90 (corresponding to the "notification unit" of the present invention), and causes the display unit 90 to display various information and images according to the status of the component mounting processing. Note that the display unit 90 is composed of a liquid crystal display device or the like, and the input unit 91 is composed of a keyboard and a mouse. Note that the display unit 90 and the input unit 91 may be integrally configured like a touch panel.

[0070] In this example, among the component mounting apparatus 1, mainly, the push-up unit 40, the tool storage unit 60, and the control unit 200 (component push-up control unit 84) correspond to the "component push-up apparatus" of the present invention.

[0071] [Control of Push-up Tool Replacement Processing] Next, the control of the replacement processing of the push-up tool 45 by the control unit 200 will be described based on the flowchart of FIG. 7 with reference to FIGS. 8 to 12.

[0072] The control shown in FIG. 7 is executed in accordance with the variety switching of die 7a (wafer 7). Specifically, it is executed after the wafer holder 8 on the wafer table 20 is returned to the wafer storage elevator 22 and before the switched wafer holder 8 is pulled out onto the wafer table 20. In this case, based on the substrate data and tool data stored in the storage unit 86, the identification information of the push-up tool 45 corresponding to the switched die 7a and the execution button for tool exchange are displayed on the display unit 90. On the other hand, when the operator operates the execution button via the input unit 91, the control according to the flowchart is started. Note that the replacement process of the push-up tool 45 may be started in synchronization with the variety switching of die 7a (wafer 7) regardless of the operator's operation.

[0073] First, the control unit 200 determines whether or not the push-up tool 45 is mounted on the push-up head 41 based on the output signal from the first tool detection sensor Se1 (step S1). Here, if Yes, the control unit 200 proceeds to step S3. If No, the control unit 200 controls the tool storage unit 60 and executes a tool return process (corresponding to the "tool return operation" of the present invention) for returning the push-up tool 45 mounted on the push-up head 41 to the tool storage table 61 (step S21).

[0074] The operations of the respective parts of the tool storage unit 60 in the tool return process are as follows. Here, the description is based on the states of the push-up unit 40 and the tool storage unit 60 as shown in FIGS. 3 and 8. FIG. 8 is an explanatory diagram of the operations of the respective parts during the push-up tool replacement, (a) is a plan view, and (b) is a side view from the -Y side, each schematically showing the push-up unit 40 and the tool storage unit 60.

[0075] In FIGS. 3 and 8, the first tool 45A is attached to the push-up head 41, so the first tool holding portion 62A of the tool storage table 61 is empty. The tool storage unit 60 is arranged such that the second tool holding portion 62B is located at the tool access position P2, and the chuck head 65 is arranged at a standby position above the tool access position P2. The push-up head 41 is arranged at the standby height position.

[0076] In the process of step S21, first, as shown in FIG. 9(a), the chuck head 65 moves from the standby position above the push-up head 41, descends on the spot, and clamps the first tool 45A attached to the push-up head 41 with the claws 66. Thereby, the chuck head 65 holds the first tool 45A. Next, as shown in FIG. 9(b), with the first tool 45A held, the chuck head 65 rises, moves above the standby position, i.e., above the tool access position P2, and descends. In this case, depending on the presence or absence of a signal output from the second tool detection sensor Se2, an empty tool holding portion 62 (i.e., the first tool holding portion 62A) is detected. If the empty tool holding portion 62 is not arranged at the tool access position P2, the position of the tool storage table 61 is adjusted so that the empty tool holding portion 62 is arranged at the tool access position P2.

[0077] Next, as shown in FIG. 9(c), after opening the claws 66 and releasing the first tool 45A to the first tool holding portion 62A, the chuck head 65 rises. Thereby, the first tool 45A is removed from the push-up head 41 and returned to the tool storage table 61 (the first tool holding portion 62A).

[0078] In the process of step S21, the first tool 45A is held by the chuck head 65 in the same posture as when it is mounted on the push-up head 41, with the chucking flat portion 53 being clamped by the claw 66. Therefore, the first tool 45A returned to the first tool holding portion 62A can be positioned by the positioning recess 56 and the positioning projection 63, and thereby, the first tool 45A is held by the first tool holding portion 62A in the same posture as when it is mounted on the push-up head 41.

[0079] When the process of step S21 ends, the control unit 200 shifts the process to step S3. In step S3, the control unit 200 determines whether the recognition of the identification code 54 of each push-up tool 45 has been completed. Here, if it is Yes, the control unit 200 shifts the process to step S5. On the other hand, if it is No, the control unit 200 briefly moves the tool storage table 61 in the X direction, and reads the identification code 54 of the push-up tools 45 (45A to 45C) held by each tool holding portion 62A to 62C with the code reading sensor Se3 (step S23). Thereby, the control unit 200 recognizes which push-up tool 45 (tool 45A to 45C) is held by each of the tool holding portions 62 (62A to 62C) of the tool storage table 61, and determines whether the push-up tool 45 to be mounted is included. Here, if the push-up tool 45 to be mounted is not included, the control unit 200 shifts the process to step S25 to be described later. Note that the reading of the identification code 54 in step S23 corresponds to the function as the "first reading unit" of the present invention by the code reading sensor Se3.

[0080] In step S5, the control unit 200 controls the tool storage unit 60 and executes a tool mounting process (corresponding to the "tool mounting operation" of the present invention) for mounting the push-up tool 45 on the push-up head 41 (head main body portion 42). The operations of each part of the tool storage unit 60 in the tool mounting process of step S5 are as follows.

[0081] First, as shown in FIG. 10(a), the tool storage table 61 moves in the X direction, and the push-up tool 45 (here, the third tool 45C) to be mounted is placed at the tool loading / unloading position P2. In this case, based on the recognition result in step S23, the tool storage table 61 moves so that the push-up tool 45 to be mounted is placed at the tool loading / unloading position P2.

[0082] When the third tool 45C is placed at the tool loading / unloading position P2, the identification code 54 of the third tool 45C is read and stored by the code reading sensor Se3. The reading of the identification code 54 here corresponds to the function as the "second reading unit" of the present invention by the code reading sensor Se3.

[0083] Next, as shown in FIG. 10(b), the chuck head 65 descends from the standby position to hold the third tool 45C. Then, as shown in FIG. 10(c), the chuck head 65 ascends, moves above the head main body 42 of the push-up head 41, and then descends. As a result, the third tool 45C is mounted on the push-up head 41. After the third tool 45C is mounted on the push-up head 41, the chuck head 65 moves to the standby position above the tool loading / unloading position P2 as shown in FIG. 10(d).

[0084] When the replacement process of the push-up tool 45 is completed, the control unit 200 determines whether the push-up tool 45 (the third tool 45C) mounted on the push-up head 41 is the push-up tool 45 defined by the tool data, that is, whether it is the push-up tool 45 corresponding to the die 7a after switching, based on the identification code 54 (identification information) of the third tool 45C read by the code reading sensor Se3 in the process of step S5 (step S7).

[0085] If the result is No here, the control unit 200 executes a predetermined error process. For example, the control unit 200 displays an error message on the display unit 90, stops the component mounting apparatus 1 (step S25), and ends the control of the flowchart.

[0086] When it is determined Yes in step S7, the control unit 200 determines whether or not the pushing tool 45 is properly attached to the pushing head 41 (head main body 42) based on the signal output from the first tool detection sensor Se1 (step S9). Specifically, it is determined whether or not the pushing tool 45 is detected by the first tool detection sensor Se1. If No here, the control unit 200 transfers the process to step S25 and executes the above-described error process.

[0087] When it is determined Yes in step S9, the control unit 200 controls the wafer camera 39 and images the suction surface portion 46a of the pushing tool 45 attached to the pushing head 41 (step S11). The pushing head 41 and the wafer camera 39 are arranged at the pickup position P1. However, during the pushing tool replacement process, as described above, the wafer holder 8 is not held on the wafer table 20. Therefore, the wafer camera 39 can image the suction surface portion 46a of the third tool 45C from above through the openings of the wafer table 20 and the support frame 26.

[0088] Next, the control unit 200 determines whether or not the pushing pins 50 are appropriate for the pushing tool 45 based on the image data of the suction surface portion 46a obtained in the process of step S11 and the tool data of the pushing tool 45 (step S13). Specifically, the control unit 200 recognizes the number and arrangement of the pushing pins 50 from the acquired image and determines whether or not the number and arrangement match the tool data. If No here, the control unit 200 transfers the process to step S25 and executes the above-described error process.

[0089] For example, assume that the data of the push-up pins 50 of the third tool 45C in the tool data is arranged at four locations around the center O of the suction surface portion 46a as shown in FIG. 11(a). In this case, as shown in FIG. 11(b), when the number of push-up pins 50 in the acquired image does not match the number of push-up pins 50 in the tool data, or as shown in FIG. 11(c), when the arrangement of the push-up pins 50 in the acquired image does not match the arrangement of the push-up pins 50 in the tool data, the control unit 200 determines No in step S13.

[0090] When it is determined Yes in step S13, the control unit 200 controls the wafer supply device 6 to pull out the wafer holder 8 holding the wafer 7 to be switched to the wafer table 20. Further, the component transfer unit 33 and the push-up unit 40 are controlled, and using the transfer head 34, the height of the push-up tool 45 mounted on the push-up head 41, that is, the height detection process of the suction surface portion 46a is executed (step S18).

[0091] Specifically, the push-up head 41 is arranged at the push-up height position, and the wafer sheet 8a is negatively pressure adsorbed by the suction surface portion 46a of the push-up tool 45. In this state, while approaching the die 7a from above the die 7a with the suction nozzle 34a, the height of the third tool 45C is detected based on the output signal from the negative pressure sensor Se4. Specifically, as shown in FIG. 12, while lowering the suction nozzle 34a from the measurement start height Sp above the die 7a to the measurement end height Ep, the change point of the detected negative pressure level of the negative pressure sensor Se4, that is, the tip height of the suction nozzle 34a when the suction nozzle 34a adsorbs the die 7a is detected as the height of the push-up tool 45. Note that the tip height of the suction nozzle 34a is obtained based on the position information detected by the position sensor Se5 (encoder).

[0092] Next, the control unit 200 determines whether the mounting state of the push-up tool 45 is appropriate based on the height of the third tool 45C detected in the process of step S18. Specifically, it is determined whether the height of the third tool 45C is within the allowable value Ar, that is, whether it is between the upper limit value Uh and the lower limit value Lh shown in FIG. 12. The symbol Sh in FIG. 12 indicates the reference value, which is equal to the upper surface height of the die 7a when the push-up tool 45 is normally mounted on the push-up head 41.

[0093] If the answer in step S19 is No, the control unit 200 transfers the process to step S25 and executes the above-described error processing. On the other hand, if the answer in step S19 is Yes, the control of this flowchart ends. Thereby, the mounting operation of mounting the switched die 7a on the substrate P is started.

[0094] [Function and Effect] In the component mounting apparatus 1 described above, as described above, by the control of the tool storage unit 60 by the control unit 200, the tool return process of removing the push-up tool 45 mounted on the push-up head 41 (tool mounting portion 43) and returning it to the tool storage table 61, and the push-up tool 45 (45A to 45C) supported by the tool storage table 61 are held by the chuck head 65 and mounted on the push-up head 41 (tool mounting portion 43). Therefore, the automation of the replacement work of the push-up tool 45 is achieved.

[0095] Moreover, the push-up tool 45 is detachably mounted in the vertical direction with respect to the push-up head 41 (tool mounting portion 43), and the push-up tools 45 (45A to 45C) are supported on the tool storage table 61 in the same posture as the mounting state on the push-up head 41. And the tool transfer mechanism 60B is configured such that the chuck head 65 moves only in the Z direction and the X direction to transfer the push-up tool 45. Therefore, according to this component mounting apparatus 1, it is possible to automate the replacement work of the push-up tool 45 with a very simple mechanism and control that only linearly move the chuck head 65 in the Z direction and the X direction.

[0096] Also, in the component mounting device 1, based on the tool data stored in the storage unit 86 and the identification code 54 (identification information) read by the code reading sensor Se3 in the process of step S23, the push-up tool 45 to be mounted is specified from among the plurality of push-up tools 45 (45A to 45C) held in the tool storage table 61, and the tool mounting process is executed. Therefore, it becomes possible to accurately specify the push-up tool 45 corresponding to the type of the die 7a and execute the tool mounting process.

[0097] Moreover, when the tool mounting process is executed, the identification code 54 of the push-up tool 45 arranged at the tool loading / unloading position P2 is read by the code reading sensor Se3, and it is determined whether or not the push-up tool 45 is the push-up tool 45 defined by the tool data (step S7 in FIG. 7). And if they are different, an error message is displayed on the display unit 90 and the component mounting device 1 is stopped. Therefore, even if an inappropriate push-up tool 45 is mounted on the push-up head 41 in relation to the die 7a after the type change, the picking operation of the die 7a will not start as it is.

[0098] Also, in the component mounting device 1, after the execution of the tool mounting process, it is determined whether or not the push-up tool 45 is mounted on the push-up head 41 based on the presence or absence of a signal output from the first tool detection sensor Se1 (step S9 in FIG. 7). If it is not mounted, the above-described error process is executed. Therefore, it is possible to prevent the picking operation of the die 7a from starting while the push-up tool 45 is not mounted on the push-up head 41.

[0099] In the component mounting device 1, after the tool mounting process is executed, the pushing-up head 41 (adsorbing surface portion 46a) is imaged by the wafer camera 39. Then, based on the image data, it is determined whether the pushing-up pins 50 (number and arrangement) provided on the pushing-up tool 45 are appropriate (steps S11 and S13 in FIG. 7). If they are not appropriate, the aforementioned error processing is executed. Therefore, it is possible to prevent the picking operation of the die 7a from starting while the pushing-up tool 45 having inappropriate pushing-up pins 50 remains mounted on the pushing-up head 41.

[0100] In the component mounting device 1, after the tool mounting process is executed, the height of the pushing-up tool 45 mounted on the pushing-up head 41 is detected, and it is determined whether this height is within the allowable value Ar (steps S18 and S19). If it is outside the allowable value Ar, the aforementioned error processing is executed. Therefore, it is possible to prevent the picking operation of the die 7a from starting while an incomplete mounting state such as floating of the pushing-up tool 45 occurs.

[0101] The component mounting device 1 described above is an example of an embodiment of the component mounting device according to the present invention (a component mounting device provided with the component pushing-up device of the present invention). The specific configurations of the component mounting device 1 and the component pushing-up device (the pushing-up unit 40 and the tool storage unit 60) can be appropriately changed without departing from the gist of the present invention.

[0102] For example, the component mounting device 1 of the embodiment picks up the die 7a from the wafer 7 with the transfer head 34 of the component transfer unit 33, and transfers the die 7a indirectly via the transfer table 38 or directly from the transfer head 34 to the head 4H of the head unit 4. However, the component mounting device 1 may be configured to pick up the die 7a directly from the wafer 7 by, for example, the head 4H of the head unit 4. In this case, the processes in steps S18 and S19 in FIG. 7 may be performed based on the negative pressure level of the negative pressure passage for supplying negative pressure to the head 4H and the position information detected by a position sensor such as an encoder built in the motor for moving the head 4H up and down.

[0103] Also, in the embodiment, when it is determined that the height of the push-up tool 45 is outside the allowable value Ar in the process of step S19 in FIG. 7, immediately, an error message is displayed on the display unit 90 and the component mounting apparatus 1 is stopped. However, when it is determined that the height of the push-up tool 45 is outside the allowable value Ar, a retry operation may be executed. Specifically, the push-up tool 45 is held by the chuck head 65, and after the chuck head 65 is once raised and then lowered. And after the retry operation, the height detection process of the push-up tool 45 is performed again, and when the height of the push-up tool 45 is outside the allowable value Ar, the above-described error process may be executed. According to this configuration, it is possible to automatically correct an incomplete mounting state of the push-up tool 45 such as floating of the push-up tool 45.

[0104] Note that, in the embodiment, the height of the push-up tool 45 mounted on the push-up head 41 is detected based on the information acquired by the negative pressure sensor Se4 and the position sensor Se5. However, for example, the height of the push-up tool 45 mounted on the push-up head 41 may be directly detected by an optical sensor or the like.

[0105] Also, in the embodiment, the identification code 54 of the push-up tool 45 arranged at the tool loading / unloading position P2 is read by the code reading sensor Se3, and based on the identification information recorded in the identification code 54, it is determined whether the push-up tool 45 is the push-up tool 45 defined by the tool data (step S7 in FIG. 7). However, the reading of the identification code 54 for the determination process in step S7 may be performed by a code reading sensor different from the code reading sensor Se3. In this case, the other code reading sensor (corresponding to the "second reading unit" of the present invention) may be provided so as to be able to read the identification code 54 at any position within the movement path of the push-up tool 45 held and moved by the chuck head 65.

[0106] In the above-described component mounting apparatus 1, the push-up head 41 is disposed at the pick-up position P1, and the wafer 7 moves in the XY direction with respect to the push-up head 41, so that the die 7a to be picked up is disposed at the pick-up position P1. However, the reverse configuration may also be employed. That is, the push-up head 41 side may move in the XY direction with respect to the fixedly disposed wafer 7 and be disposed below the die 7a to be picked up. In this case, the push-up head 41 is moved to a predetermined tool exchange area, and the tool storage unit 60 is disposed at a position adjacent to the tool exchange area so that tool exchange is performed with respect to the push-up head 41 disposed in the tool exchange area.

[0107] [Invention included in the above-described embodiment] A component push-up device according to an aspect of the present invention is a component push-up device that peels a die from a wafer sheet by pushing up the die from below the wafer adhered to the wafer sheet, and includes a suction surface that sucks the lower surface of the wafer sheet with negative pressure, and a plurality of push-up tools each provided with a push-up pin that can protrude and retract from the suction surface toward the wafer sheet side, a tool mounting portion to which the plurality of push-up tools are selectively and detachably mounted in the vertical direction, a push-up head that is movable relative to the wafer sheet in a direction along the wafer sheet and in the vertical direction, a tool storage table that can support each of the plurality of push-up tools in the same posture as the mounted state on the tool mounting portion, a holding member that can hold the push-up tool, and a tool transfer mechanism that transfers the push-up tool between the push-up head and the tool storage table by moving the holding member in the vertical direction and the horizontal direction while holding the push-up tool, and a control unit that executes a tool return operation of removing the push-up tool mounted on the tool mounting portion by the holding member and returning it to the tool storage table and / or a tool mounting operation of holding the push-up tool supported by the tool storage table by the holding member and mounting it on the tool mounting portion by controlling the push-up head and the tool transfer mechanism.

[0108] According to this component pushing-up device, by controlling the pushing-up head and the tool transfer mechanism by the control unit, a tool return operation of removing the pushing-up tool mounted on the pushing-up head and returning it to the tool storage table, and / or a tool mounting operation of holding the pushing-up tool supported by the tool storage table with a holding member and mounting it on the tool mounting portion of the pushing-up head is executed. That is, automation of the replacement operation of the pushing-up tool for the pushing-up head is achieved.

[0109] Moreover, in this component pushing-up device, the pushing-up tool is detachably mounted in the vertical direction with respect to the tool mounting portion, and the tool storage table supports the pushing-up tool in the same posture as the mounting state to the tool mounting portion. And, by moving the holding member in the vertical direction and the horizontal direction while holding the pushing-up tool, the tool transfer mechanism is configured to transfer the pushing-up tool between the pushing-up head and the tool storage table. Therefore, it is possible to automate the replacement operation of the pushing-up tool with a simple mechanism and control that only linearly moves the holding member.

[0110] In the above component pushing-up device, each of the plurality of pushing-up tools includes a recording unit in which respective identification information is recorded, and the component pushing-up device further includes a first reading unit capable of reading the identification information recorded in the information recording unit of the pushing-up tool supported by the tool storage table, and a storage unit in which tool information, which is information regarding each pushing-up tool, is stored. The tool information includes information defining a correspondence relationship between the type of the die and the pushing-up tool used for the type. The control unit specifies a pushing-up tool to be mounted from among the plurality of pushing-up tools supported by the tool storage table based on the tool information and the identification information read by the first reading unit, and executes the tool mounting operation.

[0111] According to the configuration of this component pushing-up device, it is possible to accurately specify the pushing-up tool corresponding to the die from among the plurality of pushing-up tools supported by the tool storage table in response to a change in the type of the die or the like, and execute the tool mounting operation.

[0112] In this case, when the tool mounting operation is executed, a second reading unit capable of reading the identification information is preferably further provided at any position within the movement path of the pushing tool from the holding position where the pushing tool supported by the tool storage table is held by the holding member to the position where the pushing tool is mounted on the tool mounting portion.

[0113] According to the configuration of this component pushing device, it becomes possible to stop the device due to an error or the like based on the reading result of the second reading unit. Therefore, it is possible to prevent the die picking operation from starting while an inappropriate pushing tool remains mounted on the tool mounting portion.

[0114] Further, in the above component pushing device, a common reading unit is provided as the first reading unit and the second reading unit, and the common reading unit is provided so as to be movable relative to the tool storage table and is configured to read the identification information of the pushing tool disposed at the holding position.

[0115] According to this configuration, it becomes possible to read the identification information of each of the plurality of pushing tools supported by the tool storage table with a common (single) reading unit.

[0116] Further, in the above component pushing device, a sensor for detecting the pushing tool when the pushing tool is mounted on the tool mounting portion is provided, and the control unit may be configured to determine whether or not the pushing tool is mounted on the tool mounting portion based on whether or not the pushing tool is detected by the sensor after the tool mounting operation is executed.

[0117] According to this configuration, in the tool mounting operation, it is possible to confirm that the pushing tool is mounted on the tool mounting portion, so that it is possible to prevent the die picking operation from starting while the pushing tool is not mounted.

[0118] Further, in the above-described component pushing-up device, after the execution of the tool mounting operation, an imaging unit for imaging the suction surface of the pushing-up tool is further provided, and the control unit recognizes the pushing-up pins from the image of the suction surface imaged by the imaging unit, and based on this recognition result, the control unit may be configured to determine the suitability of the pushing-up pins provided on the pushing-up tool.

[0119] According to this configuration, the determination of the suitability of the pushing-up pins provided on the pushing-up tool, that is, the number and arrangement of the pushing-up pins, etc., is automated. Therefore, it is possible to prevent the picking operation of the die from starting while an inappropriate pushing-up tool is still mounted.

[0120] Further, in the above-described component pushing-up device, after the tool mounting operation, an acquisition unit for acquiring information capable of detecting the height of the pushing-up tool mounted on the pushing-up head is further provided, and the control unit may be configured to determine the quality of the mounting state of the pushing-up tool based on the information acquired by the acquisition unit.

[0121] According to this configuration, it is possible to prevent the picking operation of the die from starting in the state where the pushing-up tool is in an incomplete mounting state with respect to the tool mounting portion, such as a state where the pushing-up tool floats with respect to the tool mounting portion.

[0122] In this case, when the control unit determines that the mounting state of the tool is not good, the control unit may execute a retry operation of once raising and then lowering the holding member while holding the pushing-up tool by the holding member.

[0123] According to this configuration, when an incomplete mounting state of the pushing-up tool is detected, it is possible to correct the incomplete mounting state without depending on manual work by an operator.

[0124] In the above-described component pushing-up device, when there is no pushing-up tool to be mounted among the plurality of pushing-up tools supported by the tool storage table, a notification unit for performing error notification may be further provided.

[0125] According to this configuration, it is possible to notify the operator that there is no pushing-up tool to be mounted and quickly arrange the desired pushing-up tool on the tool storage table.

[0126] The component mounting device according to one aspect of the present invention includes a component supply unit on which a wafer in a state of being diced and adhered to a wafer sheet is arranged, a head that picks up and transfers a die from the wafer arranged in the component supply unit, and any one of the above-described component pushing-up devices that pushes up the die from below the wafer sheet when the head picks up the die.

[0127] According to the configuration of this component mounting device, since it is provided with the component pushing-up device as described above, it is possible to automate the replacement operation of the pushing-up tool with a simple mechanism and control.

Claims

1. A component pushing-up device that peels a die from a wafer sheet by pushing up the die from below the wafer attached to the wafer sheet, comprising: a plurality of pushing-up tools each having a suction surface for sucking the lower surface of the wafer sheet under negative pressure and a pushing-up pin provided so as to be able to project and retract from the suction surface toward the wafer sheet side; a tool mounting portion to which the plurality of pushing-up tools are selectively and detachably mounted in the vertical direction, and a pushing-up head that is movable relative to the wafer sheet in a direction along the wafer sheet and in the vertical direction; a tool storage table capable of supporting each of the plurality of pushing-up tools in the same posture as the mounted state on the tool mounting portion; a recording portion provided in each of the plurality of pushing-up tools and recording respective identification information; a tool transfer mechanism including a holding member capable of holding the pushing-up tool, and moving the holding member in the vertical direction and the horizontal direction while holding the pushing-up tool to transfer the pushing-up tool between the pushing-up head and the tool storage table; a control unit that controls the pushing-up head and the tool transfer mechanism to remove the pushing-up tool mounted on the tool mounting portion by the holding member and return it to the tool storage table, and / or execute a tool mounting operation of holding the pushing-up tool supported by the tool storage table by the holding member and mounting it on the tool mounting portion; a first reading unit capable of reading the identification information recorded in the recording portion of the pushing-up tool supported by the tool storage table; a storage unit that stores tool information which is information regarding each pushing-up tool; the tool information includes information defining a correspondence relationship between the die type and the pushing-up tool used for the type; the control unit identifies a pushing-up tool to be mounted from among the plurality of pushing-up tools supported by the tool storage table based on the tool information and the identification information read by the first reading unit, and executes the tool mounting operation; when the tool mounting operation is executed, the component pushing-up device moves the pushing-up tool from the holding position where the pushing-up tool supported by the tool storage table is held by the holding member to the... The component pushing-up device further includes a second reading unit capable of reading the identification information at any position within the movement path of the pushing-up tool to the position where it is mounted on the tool mounting portion.

2. In the component pushing-up device according to Claim 1, it includes a common reading unit as the first reading unit and the second reading unit, the common reading unit is provided so as to be movable relative to the tool storage table, and reads the identification information of the pushing-up tool arranged at the holding position. The component pushing-up device is characterized by this.

3. In the component pushing-up device according to Claim 1 or 2, it includes a sensor that detects the pushing-up tool when the pushing-up tool is mounted on the tool mounting portion, after the execution of the tool mounting operation, the control unit determines whether or not the pushing-up tool is mounted on the tool mounting portion based on whether or not the pushing-up tool is detected by the sensor. The component pushing-up device is characterized by this.

4. In the component pushing-up device according to Claim 1 or 2, after the execution of the tool mounting operation, it further includes an imaging unit that images the suction surface of the pushing-up tool, the control unit recognizes the pushing-up pin from the image of the suction surface imaged by the imaging unit, and determines the suitability of the pushing-up pin provided on the pushing-up tool based on this recognition result. The component pushing-up device is characterized by this.

5. In the component pushing-up device according to Claim 1 or 2, after the tool mounting operation, it further includes an acquisition unit that acquires information capable of detecting the height of the pushing-up tool mounted on the pushing-up head, the control unit determines the quality of the mounting state of the pushing-up tool based on the information acquired by the acquisition unit. The component pushing-up device is characterized by this.

6. In the component pushing-up device according to Claim 5, when the control unit determines that the mounting state of the pushing-up tool is not good, it executes a retry operation of once raising and then lowering the holding member while holding the pushing-up tool with the holding member. The component pushing-up device is characterized by this.

7. In the component pushing-up device according to Claim 1 or 2, it further includes a notification unit that performs an error notification when there is no pushing-up tool to be mounted among the plurality of pushing-up tools supported by the tool storage table. The component pushing-up device is characterized by this.

8. A component lifting device for peeling a die from a wafer sheet by lifting the die from below the wafer attached to the wafer sheet, a plurality of lifting tools each having a suction surface for sucking the lower surface of the wafer sheet under negative pressure and a lifting pin provided so as to be able to protrude and retract from the suction surface toward the wafer sheet side, a tool mounting portion to which the plurality of lifting tools are selectively and detachably mounted in the vertical direction, and a lifting head that is movable relative to the wafer sheet in a direction along the wafer sheet and in the vertical direction, a tool storage table capable of supporting each of the plurality of lifting tools in the same posture as the mounted state on the tool mounting portion, a holding member capable of holding the lifting tool, and while holding the lifting tool, a tool transfer mechanism for transferring the lifting tool between the lifting head and the tool storage table by moving the holding member in the vertical direction and the horizontal direction, a control unit that controls the lifting head and the tool transfer mechanism to remove the lifting tool mounted on the tool mounting portion by the holding member and return it to the tool storage table, and / or to hold the lifting tool supported by the tool storage table by the holding member and mount it on the tool mounting portion, an acquisition unit that acquires information capable of detecting the height of the lifting tool mounted on the lifting head after the tool mounting operation, and the control unit determines the quality of the mounting state of the lifting tool based on the information acquired by the acquisition unit, and when it is determined that the mounting state of the lifting tool is not good, executes a retry operation of once raising and then lowering the holding member while holding the lifting tool by the holding member. A component lifting device characterized by this.

9. a component supply unit in which a wafer in a diced state and attached to a wafer sheet is arranged, a head for picking up and transferring a die from the wafer arranged in the component supply unit, A component mounting apparatus comprising: the component lifting device according to any one of claims 1, 2, and 8, which pushes up the die from below the wafer sheet when picking up the die by the head.

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