Component lifting device and component mounting device

Abstract

This component push-up device comprises: a push-up tool comprising a wafer sheet-attracting surface and a push-up pin; a push-up head comprising a tool attachment portion to which the push-up tool is attached; and a tool transfer mechanism which comprises a holding member capable of holding the push-up tool, and which holds and transfers the push-up tool by means of the holding member, and attaches or detaches the push-up tool with respect to the tool attachment portion. The tool attachment portion is formed such that the push-up tool can be attached or detached by moving the push-up tool relatively in a first direction. The holding member comprises a head portion for holding the push-up tool, and a head support portion for supporting the head portion so as to be elastically deformable in a second direction orthogonal to the first direction.

Description

Technical Field

[0001] The present invention relates to a component lifting device that lifts and separates a die from below a wafer sheet when picking up a die (bare chip) from a wafer adhered to the wafer sheet, and a component mounting device equipped with this component lifting device.

Background Art

[0002] Conventionally, a component mounting device that picks up a die (bare chip) from a diced wafer and mounts it on a substrate is known. In this component mounting device, the wafer carried into a predetermined position (component placement area) in the machine by a wafer feeder is imaged by a wafer camera for wafer recognition, and then the operation of picking up the die with a head having a die holding function is repeated.

[0003] The component mounting device is provided with a component lifting device that lifts the die from below the wafer adhered to the wafer sheet to separate the die from the wafer sheet prior to picking up the die. The component lifting device includes a cylindrical suction housing and one or more lifting pins provided so as to be able to project in and out of the central portion thereof. With the wafer sheet negatively pressure-sucked from below by the suction housing, the die is lifted from below by the lifting pins.

[0004] The sizes of the dies are diverse, and it is necessary to use a suction housing and lifting pins suitable for the size of the die. Therefore, the operator manually exchanges the suction housing and the lifting pins. In recent years, as disclosed in Patent Document 1, there has also been proposed a component lifting device that waits for a plurality of types of lifting tools (peeling promotion heads) equipped with a suction housing and lifting pins, and automatically exchanges the lifting tools for the lifting unit (chip peeling promotion unit).

[0005] This component lifting device is a type of component lifting device in which the component lifting unit lifts the die while moving relative to the wafer. The lifting unit is provided with a lifting head (peeling promotion head mounting part) that can rotate between a vertical posture and a horizontal posture, and the lifting tool is detachably mounted on the tool mounting part of this lifting head. The lifting tool during standby is arranged horizontally. When exchanging the lifting tool, the lifting head is displaced from the vertical posture to the horizontal posture, and the lifting head moves in the vertical and horizontal directions and moves to the standby position of the lifting tool. First, the lifting tool mounted on the tool mounting part is locked by the locking arm, and in this state, the lifting head retracts, so that the lifting tool is removed from the tool mounting part. Next, the lifting head moves to the position of the lifting tool at the replacement destination, so that the lifting tool is mounted on the tool mounting part. After that, the lifting head is reset from the horizontal posture to the vertical posture, thereby completing the replacement of the lifting tool.

[0006] In the component lifting device of Patent Document 1 as described above, it is conceivable that the smooth attachment and detachment of the head to the tool mounting part (mounting hole) are hindered due to the misalignment between the tool mounting part (mounting hole) and the lifting tool caused by individual differences and movement errors of the lifting tool. Such a phenomenon leads to deterioration of the fitting state due to wear of the lifting tool and the tool mounting part, and a decrease in the service life of these components, and ultimately affects the die lifting performance, so countermeasures are necessary. However, Patent Document 1 does not mention this point.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

[0008] The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique that contributes to the smooth attachment and detachment of a lifting tool to a tool mounting part in a component lifting device capable of automatically exchanging the lifting tool.

[0009] A component pushing-up device according to an aspect of the present invention is a component pushing-up device that peels a die from a wafer sheet by pushing up the die from below the wafer attached to the wafer sheet, and includes an adsorption surface that negatively adsorbs the lower surface of the wafer sheet and a pushing-up tool having a pushing-up pin that can protrude and retract from the adsorption surface toward the wafer sheet side, a pushing-up head having a tool mounting portion on which the pushing-up tool is mounted, and a holding member that can hold the pushing-up tool. The holding member holds and transports the pushing-up tool, and a tool transfer mechanism that attaches and detaches the pushing-up tool to and from the tool mounting portion. The tool mounting portion is formed such that the pushing-up tool can be attached and detached by relatively moving the pushing-up tool in a first direction. The holding member includes a head portion that holds the pushing-up tool and a head support portion that supports the head portion so as to be elastically displaceable in a second direction orthogonal to the first direction.

[0010] Further, a component mounting device according to an aspect of the present invention includes a component supply unit in which a wafer in a state of being diced and attached to a wafer sheet is arranged, a head that picks up and transfers a die from the wafer arranged in the component supply unit, and the component pushing-up device according to any one of claims 1 to 6 that pushes up the die from below the wafer sheet when the die is picked up by the head.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

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Figure 11

DETAILED DESCRIPTION OF THE INVENTION

[0012] [Description of the Component Mounting Apparatus 1] FIG. 1 is a plan view in a top view showing the apparatus main body 100 of the component mounting apparatus 1 according to an embodiment of the present invention. The component mounting apparatus 1 is a hybrid type component mounting apparatus capable of mounting dies 7a (components) diced from a wafer 7 onto a substrate P in addition to completed components such as transistors and capacitors. In the figure, XYZ rectangular coordinates are shown for clarity of the direction relationship.

[0013] The apparatus main body 100 includes a base 2, a conveyor 3, a head unit 4, a component supply unit 5, a push-up unit 40, and a tool storage unit 60. The base 2 is a mounting base for various devices included in the apparatus main body 100. The conveyor 3 is a conveyance line for the substrate P installed on the base 2 so as to extend in the X direction. The conveyor 3 carries the substrate P from outside the machine to a predetermined mounting operation position and carries the substrate P out of the mounting operation position to the outside of the machine after the mounting operation. Note that the position where the substrate P is shown in FIG. 1 is the mounting operation position. The component supply unit 5 is provided on the -Y side and the +Y side respectively with the conveyor 3 interposed therebetween.

[0014] The head unit 4 picks up components at the component supply unit 5, moves to the above-described mounting operation position, and mounts the components on the substrate P. The head unit 4 includes a plurality of heads 4H each having a suction nozzle that holds the component by negative pressure adsorption during the above-described pickup. The head 4H is capable of moving forward and backward (lifting and lowering) in the Z direction with respect to the head unit 4 and rotating about an axis. A substrate recognition camera 12 for imaging the substrate P is mounted on the head unit 4. The fiducial mark attached to the substrate P is recognized from the captured image of the substrate recognition camera 12.

[0015] The apparatus main body 100 includes a head unit drive mechanism D1 that enables the head unit 4 to move in the horizontal direction (XY direction) between the component supply unit 5 and the substrate P held at the mounting operation position. The head unit drive mechanism D1 includes a pair of Y-axis rails 13, a Y-axis motor 14, and a ball screw shaft 15 provided on the +X side and the -X side, respectively, on the elevated frame 11, and a support frame 16 installed between the pair of Y-axis rails 13. The ball screw shaft 15 is screwed into a nut provided on the support frame 16. Further, the head unit drive mechanism D1 includes a schematic guide member, an X-axis motor 17, and a ball screw shaft 18 mounted on the support frame 16. The guide member supports the head unit 4 so as to be movable in the X direction, and the ball screw shaft 18 is screwed into a schematic nut provided on the head unit 4.

[0016] By the operation of this head unit drive mechanism D1, the head unit 4 moves in the horizontal direction. That is, when the ball screw shaft 15 is rotationally driven by the Y-axis motor 14, the head unit 4 moves in the Y direction integrally with the support frame 16, and when the ball screw shaft 18 is rotationally driven by the X-axis motor 17, the head unit 4 moves in the X direction with respect to the support frame 16.

[0017] The component supply unit 5 includes a first component supply unit 5A located on the -Y axis of the conveyor 3 and a second component supply unit 5B located on the +Y side. A plurality of tape feeders 19 are arranged in parallel along the conveyor 3 in the first component supply unit 5A. The tape feeder 19 is a type of component supply device that supplies a tape in which completed components such as the aforementioned transistors and capacitors are stored at regular intervals while feeding it out.

[0018] The second component supply unit 5B is provided with a wafer supply device 6 that supplies a plurality of dies 7a in the form of a wafer 7, a component transfer unit 33 that picks up the dies 7a from the wafer 7 and transfers them to a predetermined delivery position with respect to the head unit 4, a wafer camera 39, and a component recognition camera 10.

[0019] The wafer supply device 6 includes a wafer storage elevator 22, a wafer table 20, and a wafer extraction unit 23. The wafer storage elevator 22 stores the wafer sheets 8a with the wafers 7 attached in a vertically multi-stage manner while holding them with the wafer holders 8. The wafer storage elevator 22 raises and lowers the wafers 7 stored in multiple stages integrally and arranges an arbitrary wafer 7 at a height corresponding to the height of the wafer table 20.

[0020] The wafer table 20 is arranged on the -Y side of the wafer storage elevator 22. The wafer table 20 is a workbench for component extraction that holds the wafer holder 8 (wafer 7). The wafer supply device 6 is provided with a wafer table drive mechanism D2 that enables the wafer table 20 to move in the horizontal direction (XY direction).

[0021] FIG. 2 is a plan view showing a wafer table 20 and a wafer table drive mechanism D2. The wafer table drive mechanism D2 includes a pair of X-axis rails 30 on the +Y side and the -Y side, an X-axis motor 31 and a ball screw shaft 32, and a plate-shaped support frame 26 installed on the pair of X-axis rails 30. The ball screw shaft 32 is screwed into a nut provided on the support frame 26. The wafer table drive mechanism D2 further includes a pair of Y-axis rails 27 on the +X side and the -X side provided on the support frame 26, a Y-axis motor 28, and a ball screw shaft 32. The ball screw shaft 32 is screwed into a nut provided on the wafer table 20.

[0022] By the operation of this wafer table drive mechanism D2, the wafer table 20 moves in the horizontal direction. That is, when the ball screw shaft 32 is rotationally driven by the X-axis motor 31, the wafer table 20 moves in the X direction integrally with the support frame 26, and when the ball screw shaft 29 is rotationally driven by the Y-axis motor 28, the wafer table 20 moves in the Y direction with respect to the support frame 26. When the die 7a is picked up by the transfer head 34 described later, the target die 7a is arranged at a predetermined pickup position P1 defined by XY coordinates by the movement of the wafer table 20.

[0023] The wafer extraction unit 23 takes in and out the wafer holder 8 between the wafer storage elevator 22 and the wafer table 20. The wafer extraction unit 23 includes a draw head 24 capable of locking the wafer holder 8 and a draw head drive device 25 that moves the draw head 24 in the Y direction.

[0024] The wafer extraction unit 23 moves the wafer holder 8 by moving the draw head 24 in the Y direction with the wafer holder 8 locked by the draw head 24. That is, the wafer 7 is taken in and out of the wafer storage elevator 22 together with the wafer holder 8. The taking in and out of the wafer holder 8 is made possible by arranging the wafer table 20 at a predetermined wafer taking in and out position that is close to and faces the -Y side of the wafer storage elevator 22.

[0025] The component transfer unit 33 includes a transfer head 34 that picks up the die 7a disposed at the pickup position P1 from the wafer 7, a transfer table 38 for delivering the die 7a to the head unit 4, and a transfer head drive mechanism D3 that enables the transfer head 34 to move.

[0026] The transfer head 34 includes a suction nozzle 34a that holds the die 7a by negative pressure adsorption. The transfer head 34 picks up the die 7a by negatively pressure adsorbing the die 7a at the pickup position P1. The suction nozzle 34a is capable of moving forward and backward (up and down) in the Z direction and rotating around a horizontal axis with respect to the base portion of the transfer head 34. When the transfer head 34 rotates around the horizontal axis, the posture of the die 7a can be turned upside down.

[0027] The transfer table 38 is a delivery table for delivering the die 7a held by the suction nozzle 34a to the head 4H of the head unit 4. The transfer table 38 is disposed at a predetermined delivery position close to the mounting operation position.

[0028] The transfer head drive mechanism D3 includes a rail 37 that movably supports the transfer head 34, a ball screw shaft 36 disposed parallel to the rail 37, and a motor 35. The ball screw shaft 36 is screwed into a nut provided on the transfer head 34. The transfer head drive mechanism D3 moves the transfer head 34 in the space between the pickup position P1 and the transfer table 38 by rotationally driving the ball screw shaft 36 with the motor 35.

[0029] The wafer camera 39 images, from above, a part of the wafer 7 held on the wafer table 20 at the pick-up position P1, that is, the die 7a within the camera's field of view. Based on this captured image, the position of the die 7a to be picked up is recognized. The wafer camera 39 is supported by an overhead frame (not shown) so as to be located above the transfer head 34 in a state where the transfer head 34 is disposed at the pick-up position P1. This avoids interference with the transfer head 34.

[0030] The component recognition camera 10 is disposed at a position adjacent to the +X side of the transfer table 38. The component recognition camera 10 images, from below, the components (die 7a and completed components) adsorbed to the head 4H of the head unit 4 before mounting them on the substrate P. Based on this captured image, the adsorption state of the components by the head 4H is recognized.

[0031] FIG. 3 is a schematic perspective view of the pushing-up unit 40 and the tool storage unit 60. In this example, the pushing-up unit 40 and the tool storage unit 60 correspond to the "component pushing-up device" of the present invention, and in the following description, the pushing-up unit 40 and the tool storage unit 60 may be referred to as the "component pushing-up device".

[0032] As shown in FIGS. 2 and 3, the pushing-up unit 40 and the tool storage unit 60 are disposed below the component supply unit 5, specifically, below the support frame 26 of the wafer table drive mechanism D2. The wafer table 20 is provided with a circular opening 20a, and the support frame 26 is provided with an opening (not shown) at a position that can overlap with this opening 20a. The pushing-up unit 40 is disposed below these openings. That is, when the wafer holder 8 is held on the wafer table 20, the wafer 7 is disposed inside the opening 20a. The pushing-up unit 40 pushes up the die 7a through the openings of the support frame 26 and the wafer table 20.

[0033] The lifting unit 40 includes a lifting head 41 and a lifting head drive mechanism D6. As shown in FIGS. 3 and 4(a), the lifting head 41 includes a shaft-shaped head main body portion 42 extending in the Z direction and a lifting tool 45 attached to the upper end portion thereof. Note that FIG. 4(a) is a cross-sectional view of the tip portion of the lifting head 41.

[0034] The lifting head 41 is arranged such that the head main body portion 42 is located at the pickup position P1. The head main body portion 42 has a cylindrical shape and is provided around a lifting spindle 44 that moves forward and backward (up and down) in the Z direction.

[0035] The lifting tool 45 includes a suction housing 46 (sometimes referred to as a "suction dome") for sucking the wafer sheet 8a from below and a pin holder 48 disposed inside thereof. The suction housing 46 is a member having a toped cylindrical shape including a suction surface portion 46a having a circular suction surface in plan view for sucking the wafer sheet 8a under negative pressure and a cylindrical portion 46b extending downward from the periphery thereof. A plurality of pin holes 47 are formed in the suction surface portion 46a in a predetermined arrangement.

[0036] The lifting tool 45 is detachably attached to the tip (upper end) of the head main body portion 42 via the suction housing 46. Specifically, a tool mounting portion 43 having a smaller diameter than other portions is formed at the tip of the head main body portion 42, and the cylindrical portion 46b of the suction housing 46 is fitted into the tool mounting portion 43, whereby the lifting tool 45 is attached to the head main body portion 42. That is, by relatively moving the lifting tool 45 in the Z direction (corresponding to the "first direction" of the present invention) with respect to the tool mounting portion 43, the lifting tool 45 can be attached to and detached from the tool mounting portion 43. The mounting structure of the lifting tool 45 to the head main body portion 42 may be, for example, a structure in which a circular recess is formed as the tool mounting portion 43 at the tip of the head main body portion 42 and the lifting tool 45 is fitted into the circular recess. In the following description, for convenience, there may be a case where the lifting tool 45 is attached to the lifting head 41.

[0037] The pin holder 48 is a member in which one or a plurality of push-up pins 50 are erected on a disc-shaped pin base 49, and is held by the suction housing 46 in a state of being movable in the Z direction along the inner peripheral surface of the cylindrical portion 46b. As shown in FIG. 4(b), the pin holder 48 is pushed up with respect to the suction housing 46 by the forward (upward) movement of the push-up spindle 44. As a result, the push-up pin 50 protrudes upward from the suction surface portion 46a through the pin hole 47. When the push-up spindle 44 moves backward (downward), the pin holder 48 descends with respect to the suction housing 46 by its own weight or the biasing force of an elastic member (such as a spring) not shown. As a result, the push-up pin 50 retracts into the suction housing 46 (pin hole 47). That is, the push-up pin 50 is provided so as to be able to protrude and retract upward from the suction surface portion 46a.

[0038] When picking up the die 7a, a negative pressure is supplied into the suction housing 46 through the head main body portion 42. The wafer sheet 8a is sucked through the pin hole 47 by this negative pressure. That is, with the wafer sheet 8a being sucked by negative pressure through the suction surface portion 46a of the suction housing 46, when the push-up pin 50 protrudes from the suction surface portion 46a, the die 7a is pushed up through the wafer sheet 8a.

[0039] The number, arrangement, size (diameter, length), and tip shape of the push-up pins 50, etc. are different in suitable modes according to the size of the die 7a and the circuits formed thereon. In the tool storage unit 60 described later, a plurality of push-up tools 45 with different modes are held and stored. When picking up the die 7a, the push-up tool 45 determined in advance for each type of the die 7a (wafer 7) is attached to the push-up head 41.

[0040] As shown in Fig. 5, a tapered portion 461 is formed at the opening edge of the cylindrical portion 46b of the push-up tool 45 (suction housing 46), and a tapered portion 431 is formed on the outer peripheral surface of the tip of the tool mounting portion 43. With this configuration, when the push-up tool 45 is mounted on the tool mounting portion 43, the push-up tool 45 is guided so that the center of the tool mounting portion 43 coincides with the center of the push-up tool 45. Note that Fig. 5 is a cross-sectional view of the push-up tool and the head main body portion in a separated state.

[0041] The push-up head drive mechanism D6 is constituted by, for example, a cylinder mechanism using air as a drive source. By the operation of this push-up head drive mechanism D6, the push-up head 41 moves forward and backward (up and down) at the pickup position P1. Specifically, it moves forward and backward between a predetermined push-up height position where the suction surface portion 46a abuts against the lower surface of the wafer sheet 8a and a predetermined standby height position (the position shown in Fig. 3) that has retreated downward from the push-up height position. A first tool detection sensor Se1 capable of detecting the presence or absence of the push-up tool 45 at the tip portion of the push-up head 41 is arranged on the -Y side of the push-up head 41 arranged at the standby height position.

[0042] As shown in Figs. 2 and 3, the tool storage unit 60 is provided adjacent to the +X side of the push-up unit 40. The tool storage unit 60 includes a tool storage portion 60A and a tool transfer mechanism 60B. The tool storage portion 60A holds and stores a plurality of types of push-up tools 45, and the tool transfer mechanism 60B conveys the push-up tool 45 between the push-up unit 40 and the tool storage portion 60A.

[0043] The tool storage portion 60A includes a tool storage table 61 for holding the push-up tool 45, a storage table drive mechanism D4 for moving the tool storage table 61, and a code reading sensor Se3.

[0044] As shown in FIGS. 2 and 3, the tool storage table 61 is disposed at a position adjacent to the head main body 42 of the push-up head 41 on the +X side. The tool storage table 61 is rectangular in plan view and elongated in the X direction, and has a plurality of tool holding portions 62 on its upper surface. The tool holding portion 62 is a circular recess formed on the upper surface of the tool storage table 61. The inner diameter of the tool holding portion 62 is set to a dimension such that the push-up tool 45 (suction housing 46) can be fitted therein, and the push-up tool 45 is supported on the tool storage table 61 in a state where its lower end portion is loosely fitted into the tool holding portion 62.

[0045] In this example, the tool storage table 61 is provided with three tool holding portions 62 arranged in a row at equal intervals in the X direction. As shown in FIG. 2, in plan view, each tool holding portion 62 is provided such that the center of each is located on a straight line L1 extending in the X direction passing through the center of the head main body 42 of the push-up head 41. Then, the first tool 45A is stored in the tool holding portion 62 at the -X side end (appropriately referred to as the first tool holding portion 62A), the second tool 45B is stored in the middle tool holding portion 62 (appropriately referred to as the second tool holding portion 62B), and the third tool 45C is stored in the tool holding portion 62 at the +X side end (appropriately referred to as the third tool holding portion 62C). In FIGS. 2 and 3, the first tool 45A is mounted on the push-up head 41, and thus the first tool holding portion 62A is empty.

[0046] FIG. 6 is a perspective view showing the head main body 42 of the push-up head 41, the push-up tool 45, and the tool storage table 61. As shown in FIG. 6, a positioning convex portion 43a is provided on the outer peripheral surface of the tool mounting portion 43 of the head main body 42, and a positioning concave portion 56 is provided on the outer peripheral surface of the push-up tool 45 (suction housing 46). The push-up tool 45 is mounted on the tool mounting portion 43 in a state of being positioned around the vertical axis by the fitting of the positioning convex portion 43a and the positioning concave portion 56. On the other hand, a positioning convex portion 63 is provided on the inner peripheral surface of each tool holding portion 62 of the tool storage table 61, and the push-up tool 45 is held in the tool holding portion 62 in a state of being positioned around the vertical axis by the fitting of the positioning convex portion 63 and the positioning concave portion 56.

[0047] Here, the positioning convex portion 43a of the head main body portion 42 and the positioning convex portions 63 of the respective tool holding portions 62 are both on the straight line L in a plan view and are both provided on the -X side. That is, the push-up tool 45 is held on the tool storage table 61 in the same posture as the state of being mounted on the tool mounting portion 43 of the head main body portion 42 (in this example, the vertical direction and the direction around the axis are both the same state). Note that a second tool detection sensor Se2 is embedded in the inner bottom surface of each tool holding portion 62, and the presence or absence of the push-up tool 45 in each tool holding portion 62 can be detected.

[0048] The storage table drive mechanism D4 is constituted by, for example, a screw feed mechanism having a motor as a drive source. By the operation of this storage table drive mechanism D4, the tool storage table 61 horizontally moves in the X direction, and the push-up tools 45 (45A to 45B) held on the tool storage table 61 are selectively arranged at a predetermined tool loading / unloading position P2 defined by XY coordinates. Note that the storage table drive mechanism D4 may be constituted by a cylinder mechanism having air as a drive source.

[0049] The code reading sensor Se3 is a sensor that reads the identification label of each push-up tool 45 held on the tool storage table 61. The code reading sensor Se3 is arranged on the -Y side of the tool loading / unloading position P2, and reads the identification information recorded in the identification information recording portion provided on the side surface of the push-up tool 45 arranged at the tool loading / unloading position P2.

[0050] Specifically, as shown in FIG. 6, in the outer peripheral portion on the -Y side of the cylindrical portion 46b of the push-up tool 45 (adsorption housing 46), a notch-shaped flat surface portion 52 for a code is formed, and a one-dimensional or two-dimensional identification code 54 is provided on this flat surface portion 52 for a code as the identification information recording portion. The code reading sensor Se3 reads this identification code 54. Thereby, the push-up tool 45 held in each tool holding portion 62 is recognized.

[0051] As shown in FIGS. 2 and 3, the tool transfer mechanism 60B includes a chuck head 65 and a chuck head drive mechanism D5 that moves the chuck head 65 in the Z direction and the X direction. The chuck head 65 is an electrically driven or air-driven parallel opening and closing type chuck device provided with a pair of claws 66 that can be opened and closed in the X direction on the -Y side surface of the head main body 65a having a substantially rectangular parallelepiped shape. The chuck head 65 holds the push-up tool 45 by sandwiching the push-up tool 45 from both sides in the X direction with the pair of claws 66.

[0052] The chuck head drive mechanism D5 includes, for example, a slider 72 that moves in the X direction by a screw feed mechanism having a motor as a drive source, and a base frame 68 that moves in the Z direction by a screw feed mechanism having a motor as a drive source in the same manner. The base frame 68 is a block-shaped structure that is flat in the vertical direction, and the chuck head 65 is supported by the base frame 68. By the operation of the chuck head drive mechanism D5, the base frame 68 moves in the X direction together with the slider 72, and the base frame 68 moves in the Z direction with respect to the slider 72. As a result, the chuck head 65 moves in the X direction and the Z direction. Note that the chuck head drive mechanism D5 may be configured to move the slider 72 and the base frame 68 by a cylinder mechanism having air as a drive source.

[0053] FIG. 7(a) is a perspective view showing the support structure of the chuck head 65 in the base frame 68. As shown in the figure, the chuck head 65 is supported on the upper surface of the base frame 68 via a connecting portion 80 and a plurality of positioning portions 82.

[0054] The connecting portion 80 is interposed between the base frame 68 and the chuck head 65 to connect them. By partially or entirely elastically deforming, it allows the chuck head 65 to be displaced in the XY direction (i.e., the horizontal direction / corresponding to the "second direction" of the present invention) with respect to the base frame 68. The connecting portion 80 includes, for example, a shaft portion fixed to one side of either the lower surface of the head main body portion 65a or the upper surface of the base frame 68, a cylindrical portion fixed to the other side with the shaft portion inserted therein, and an elastic body such as rubber, resin, or spring interposed between the shaft portion and the cylindrical portion. The elastic deformation of the elastic body allows the displacement of the chuck head 65 in the XY direction.

[0055] The positioning portion 82 positions the chuck head 65 with respect to the base frame 68 in the XY direction. The positioning portion 82 is composed of a positioning convex portion 84 provided on the upper surface of the base frame 68 and a positioning concave portion 87 provided on the lower surface side of the chuck head 65.

[0056] The positioning convex portion 84 is composed of, for example, a well-known ball plunger, and includes a cylinder portion 85a vertically arranged on the upper surface of the base frame 68, a sphere 85b held at its tip (upper end) so as to be able to protrude, retract, and roll, and a coil spring 85c that biases the sphere 85b toward the tip of the cylinder portion 85a. The positioning concave portion 87 is provided on the lower surface of a positioning block 86 fixed to the lower surface of the chuck head 65. The positioning concave portion 87 is a conical concave portion that is recessed upward so that the inner diameter gradually decreases from bottom to top, and the tip of the positioning convex portion 84, that is, the sphere 85b, is pressed against the central portion thereof. As a result, the chuck head 65 is positioned at a position where the center of the positioning concave portion 87 coincides with the center of the positioning convex portion 84.

[0057] FIG. 7(b) is a schematic plan view showing the arrangement of the connecting portion 80 and the positioning convex portion 84. As shown in this figure, in a plan view of the chuck head 65, for example, the connecting portion 80 is arranged at the center of gravity position of the head main body portion 65a, and the positioning portions 82 are arranged at four locations surrounding the connecting portion 80. Each positioning portion 82 is arranged such that the linear distance d1 between their centers C2 and the center C1 of the connecting portion 80 is equal, and the linear distance d2 between the centers of those adjacent to each other in the X direction and the Y direction is equal. Then, the position where no deformation occurs in the elastic body of the connecting portion 80 is defined as the reference position Rp of the chuck head 65, and the chuck head 65 is positioned by the positioning portions 82 at this reference position Rp.

[0058] As shown in FIG. 2, in a plan view, the pair of claws 66 are arranged at positions intersecting the straight line L, and by the operation of the chuck head drive mechanism D5, the chuck head 65 moves in the X direction and the Z direction. Therefore, the chuck head 65 clamps the push-up tool 45 on the straight line L.

[0059] Of the outer peripheral portions on the +X side and the -X axis of the cylindrical portion 46b of the push-up tool 45 held by the tool holding portion 62, notch-shaped chuck flat portions 53 are provided respectively. Each chuck flat portion 53 is a surface parallel to each other. On the other hand, each claw 66 has a clamping surface parallel to the flat portion 53, and the chuck head 65 clamps the chuck flat portion 53 of the push-up tool 45 with the clamping surfaces of the pair of claws 66. Therefore, the push-up tool 45 is held and conveyed by the chuck head 65 while maintaining the posture placed on the tool holding portion 62.

[0060] In this example, the chuck head 65, the base frame 68, the connecting portion 80, and the positioning portion 82 correspond to the "head holding member" of the present invention, the chuck head 65 corresponds to the "head portion" of the present invention, the base frame 68, the connecting portion 80, and the positioning portion 82 correspond to the "head support portion" of the present invention, and the base frame 68 corresponds to the "base portion" of the present invention.

[0061] [Basic Operation of Component Mounting Apparatus 1] In the above-described component mounting apparatus 1, the basic operation for mounting the die 7a on the substrate P is as follows. First, the wafer table 20 is disposed at the wafer loading / unloading position, and the wafer holder 8 is pulled out from the wafer storage elevator 22 to the wafer table 20 by the wafer extraction unit 23. Thereby, the wafer sheet 8a with the aggregate (wafer 7) of a number of dies 7a, 7a... adhered thereto is disposed on the wafer table 20.

[0062] Next, by the movement of the wafer table 20, the die 7a to be picked up is disposed at the pickup position P1, and the wafer camera 39 images the die 7a. At this time, the transfer head 34 of the component transfer unit 33 retracts from the pickup position P1. The imaging by the wafer camera 39 is for recognizing the die 7a to be adsorbed by the transfer head 34 in the subsequent picking operation.

[0063] When the imaging of the die 7a is completed, the transfer head 34 is disposed at the pickup position P1, and the adsorption nozzle 34a picks up the die 7a recognized by the imaging by the wafer camera 39. At this time, the die 7a is pushed up by the push-up head 41. Specifically, the push-up head 41 is displaced (raised) from the standby height position to the push-up height position, and the wafer sheet 8a is sucked by negative pressure on the suction surface portion 46a. Thereafter, by the operation of the push-up spindle 44, the push-up pin 50 protrudes from the suction surface portion 46a, whereby the die 7a is pushed up through the wafer sheet 8a.

[0064] After the die 7a is picked up, the transfer head 34 moves from above the wafer table 20 to above the transfer table 38. Here, when the die 7a is to be transferred to the head unit 4 while being held in the suction posture of the suction nozzle 34a, the die 7a is released onto the transfer table 38. Thereafter, the transfer head 34 retracts from above the transfer table 38, and the head unit 4 moves above the transfer table 38, and the die 7a is picked up from the transfer table 38 by the head 4H. After the die 7a is picked up, the head unit 4 moves above the substrate P at the mounting operation position via above the component recognition camera 10 and descends. Thereby, the die 7a is mounted on the substrate P.

[0065] On the other hand, when the die 7a is transferred to the head unit 4 in a posture that is vertically inverted from the suction posture by the suction nozzle 34a, for example, the suction nozzle 34a rotates and moves above the transfer table 38, thereby inverting the posture of the die 7a. Thereafter, the head unit 4 moves above the transfer head 34, and the die 7a is directly picked up by the head 4H from the suction nozzle 34a. After the die 7a is picked up, the head unit 4 moves above the substrate P at the mounting operation position via above the component recognition camera 10 in the same manner as described above. Thereby, the die 7a is mounted on the substrate P.

[0066] Thereafter, while the wafer table 20 moves so that the die 7a to be picked up is disposed at the pickup position P1, the operation of picking up the die 7a by the transfer head 34 and mounting the die 7a on the substrate P by the head 4H is repeated.

[0067] Note that the lifting tool 45 used when picking up the die 7a has different optimal modes depending on the size of the die 7a and the circuits formed thereon, as described above. Therefore, when the variety of the die 7a is changed, the lifting tool 45 mounted on the lifting head 41 is replaced accordingly.

[0068] [Operation and Effect of the Replacement of the Lifting Tool 45] Next, the replacement operation of the push-up tool 45 will be described with reference to FIGS. 8 to 12. Here, the operation starting from the states of the push-up unit 40 and the tool storage unit 60 shown in FIGS. 3 and 8 will be described. FIG. 8 is an explanatory diagram of the operation of each part during the replacement of the push-up tool. (a) is a plan view, and (b) is a side view from the -Y side, schematically showing the push-up unit 40 and the tool storage unit 60, respectively.

[0069] In FIGS. 3 and 8, the first tool 45A is attached to the push-up head 41. Therefore, the first tool holding part 62A of the tool storage table 61 is empty. The tool storage unit 60 is arranged such that the second tool holding part 62B is located at the tool insertion / removal position P2. Also, the chuck head 65 is arranged at the standby position above the tool insertion / removal position P2.

[0070] First, as shown in FIG. 9(a), the chuck head 65 moves from the standby position above the push-up head 41, descends on the spot, and clamps the first tool 45A attached to the push-up head 41 with the claws 66. Thereby, the chuck head 65 holds the first tool 45A. Next, as shown in FIG. 9(b), with the first tool 45A held, the chuck head 65 rises, moves to the standby position, that is, above the tool insertion / removal position P2, and descends. In this case, depending on the presence or absence of a signal output from the second tool detection sensor Se2, an empty tool holding part 62 (that is, the first tool holding part 62A) is detected. If the empty tool holding part 62 is not arranged at the tool insertion / removal position P2, the tool storage table 61 moves so that the empty tool holding part 62 is arranged at the tool insertion / removal position P2.

[0071] Next, as shown in FIG. 9(c), after the chuck head 65 releases the first tool 45A to the first tool holding part 62A, it rises. Thereby, the first tool 45A is returned to the tool storage table 61 (the first tool holding part 62A), and the tool return operation is completed.

[0072] In this tool return operation, the first tool 45A is held by the chuck head 65 in the same posture as when it is mounted on the push-up head 41 because the chucking flat surface portion 53 is clamped by the claw 66. Therefore, the first tool 45A returned to the first tool holding portion 62A can be positioned by the positioning concave portion 56 and the positioning convex portion 63, and is held by the first tool holding portion 62A in the same posture as when it is mounted on the push-up head 41.

[0073] When the first tool 45A is returned to the tool storage table 61, the tool mounting operation is started. First, as shown in Fig. 10(a), the tool storage table 61 moves in the X direction, and the push-up tool 45 (here, the third tool 45C) to be mounted is arranged at the tool insertion / removal position P2.

[0074] When the third tool 45C is arranged at the tool insertion / removal position P2, as shown in Figs. 10(b) and (c), the chuck head 65 descends from the standby position to hold the third tool 45C, rises and moves above the head main body portion 42 of the push-up head 41, and then descends. Thereby, the third tool 45C is mounted on the push-up head 41.

[0075] The operation of the chuck head 65 in this case will be described in detail with reference to Fig. 11. Fig. 11 is a schematic side view of the chuck head in the tool mounting operation.

[0076] For example, when the third tool 45C is attached to the tool mounting portion 43, due to movement errors of the chuck head 65 or the like, as shown in FIG. 11(a), a misalignment state occurs in which the central axis Ax1 of the cylindrical portion 46b of the third tool 45C and the central axis Ax2 of the tool mounting portion 43 are displaced from each other in the XY direction. In this case, when the third tool 45C approaches the head main body portion 42, the third tool 45C is guided by the tapered portion 461 of the third tool 45C and the tapered portion 431 of the tool mounting portion 43 so that the central axes Ax1 and AX2 coincide with each other. This guidance applies a lateral (XY direction) load to the third tool 45C. At this time, as described above, the chuck head 65 is supported by the base frame 68 so as to be elastically displaceable in the XY direction. Therefore, when the load of the third tool 45C is input as an external force, as shown in FIG. 11(b), it is displaced together with the third tool 45C. That is, the chuck head 65 is displaced from the reference position Rp with respect to the base frame 68 together with the third tool 45C so that the load acting on the third tool 45C is canceled.

[0077] Therefore, when the third tool 45C is attached to the tool mounting portion 43, it is suppressed or prevented that the third tool 45C is forcibly attached to the tool mounting portion 43 while a load is generated on the third tool 45C.

[0078] When the attachment of the third tool 45C is completed, the chuck head 65 moves to the standby position above the tool insertion / removal position P2 as shown in FIG. 10(d). Thereby, the tool return operation is completed.

[0079] In addition, when the attachment of the third tool 45C is completed and the claws 66 are opened and the third tool 45C is released from the chuck head 65, the chuck head 65 is reset to the reference position Rp by the elastic force of the connecting portion 80 (elastic body) as shown in FIG. 11(c). Thereby, the chuck head 65 is positioned at the reference position Rp by the positioning portion 82.

[0080] As described above, in the component pushing-up device (pushing-up unit 40 and tool storage unit 60) of the component mounting device 1, when a load is generated on the pushing-up tool 45 when the pushing-up tool 45 is mounted on the head main body 42 (tool mounting portion 43), the chuck head 65 is displaced in the XY direction together with the pushing-up tool 45 so that the load is eliminated. Thereby, the pushing-up tool 45 is mounted in a state where the load on the pushing-up tool 45 is suppressed or eliminated.

[0081] Such a situation also occurs during the removal operation of the pushing-up tool 45 mounted on the head main body 42. That is, as shown in FIGS. 9(a) and 9(b), when the pushing-up tool 45 is held by the chuck head 65, if the opening / closing center of the pair of claws 66 is displaced to either the left or right (X direction) from the center of the pushing-up tool 45, a lateral (XY direction) load can be generated on the pushing-up tool 45 when the pushing-up tool 45 is clamped. Also in this case, the chuck head 65 is displaced in the XY direction with respect to the base frame 68 so that the load is eliminated.

[0082] Therefore, according to the above-described component pushing-up device, the operations of mounting and removing the pushing-up tool 45 with respect to the head main body 42 become smoother. That is, the replacement operation of the pushing-up tool 45 is performed more smoothly. Thus, inconveniences caused by mounting or removing the pushing-up tool 45 while the load remains, for example, deterioration of the fitting state due to wear of the pushing-up tool 45 or the head main body 42 (tool mounting portion 43), and consequently, a decrease in the pushing-up performance of the die can be effectively suppressed or prevented.

[0083] In this case, since the chuck head 65 is provided so as to be elastically displaceable with respect to the base frame 68, it is possible to displace the chuck head 65 by a necessary minimum amount of movement corresponding to the magnitude of the load to eliminate the load.

[0084] In addition, in the above-described component pushing-up device, the chuck head 65 is positioned at the reference position Rp by the positioning portion 82, and this positioning state is released and the chuck head 65 is displaced only when the load is applied. Therefore, while controlling the operation of the chuck head 65 based on the reference position Rp, the chuck head 65 can be displaced as described above only when necessary, and it is possible to suppress the deterioration of the positioning accuracy due to the instability of the position of the chuck head 65 during the conveyance of the pushing-up tool 45.

[0085] In this component pushing-up device, when the chuck head 65 is displaced in the XY direction from the reference position Rp, in addition to the elastic force of the connecting portion 80 (elastic body), the chuck head 65 is reset to the reference position Rp by the biasing force of the positioning portion 82. Therefore, it is possible to more reliably reset the chuck head 65 displaced from the reference position Rp to the reference position Rp. Specifically, the diameter of the positioning recess 87 of the positioning portion 82 is set based on the assumed value of the core deviation so that the spherical body 85b of the positioning projection 84 is positioned within the positioning recess 87. Thereby, within the range in which the chuck head 65 is displaced with respect to the base frame 68 by the load, the positioning portion 82 is always configured such that the spherical body 85b is pressed against the inclined surface of the positioning recess 87 by the elastic force of the coil spring 85c. That is, the positioning portion 82 is configured to generate a biasing force that biases the chuck head 65 displaced from the reference position Rp toward the reference position Rp. Therefore, according to this component pushing-up device, it is possible to reliably reset the chuck head 65 displaced from the reference position Rp to the reference position Rp.

[0086] Moreover, as shown in FIG. 7(b), since the four positioning portions 82 are arranged so as to evenly surround the connecting portion 80, the chuck head 65 can be stably positioned at the reference position Rp by the centering effect.

[0087] The component mounting device 1 described above is an example of an embodiment of a component mounting device according to the present invention (a component mounting device provided with the component pushing-up device of the present invention). The specific configurations of the component mounting device 1 and the component pushing-up device (the pushing-up unit 40 and the tool storage unit 60) can be appropriately changed without departing from the gist of the present invention.

[0088] For example, the configuration in which the chuck head 65 is elastically displaceable in the XY direction with respect to the base frame 68 and the structure for positioning the chuck head 65 at the reference position Rp are not limited to the structures of the embodiment and can be appropriately changed.

[0089] Also, in the above-described component mounting device 1, the pushing-up head 41 is disposed at the pickup position P1, and the wafer 7 moves in the XY direction with respect to the pushing-up head 41, so that the die 7a to be picked up is disposed at the pickup position P1. However, the reverse configuration may also be used. That is, a configuration in which the pushing-up head 41 side moves in the XY direction and is disposed below the die 7a to be picked up with respect to the fixedly disposed wafer 7 may be used. In this case, the pushing-up head 41 may be moved to a predetermined tool exchange area, and the tool storage unit 60 may be disposed at a position adjacent to the tool exchange area so that tool exchange is performed for the pushing-up head 41 disposed in this tool exchange area.

[0090] [The invention included in the above embodiment] A component pushing-up device according to an aspect of the present invention is a component pushing-up device that peels a die from a wafer sheet by pushing up the die from below the wafer attached to the wafer sheet, and includes a suction surface that negatively sucks the lower surface of the wafer sheet and a pushing-up tool having a pushing-up pin that can protrude and retract from the suction surface toward the wafer sheet side, a pushing-up head having a tool mounting portion to which the pushing-up tool is mounted, and a holding member capable of holding the pushing-up tool, the holding member holding and transporting the pushing-up tool and attaching and detaching the pushing-up tool to and from the tool mounting portion. The tool mounting portion is formed such that the pushing-up tool can be attached and detached by relatively moving the pushing-up tool in a first direction. The holding member includes a head portion that holds the pushing-up tool and a head support portion that supports the head portion so as to be elastically displaceable in a second direction orthogonal to the first direction.

[0091] According to the configuration of this component pushing-up device, for example, when the pushing-up tool held by the holding member is mounted on the tool mounting portion, the head portion that holds the pushing-up tool is displaced in the second direction with respect to the head support portion together with the pushing-up tool so that the pushing-up tool fits into the tool mounting portion without load. Similarly, when the pushing-up tool is held by the holding member and removed from the tool mounting portion, the head portion is displaced in the second direction so that the pushing-up tool is removed without load. Therefore, the attachment and detachment of the pushing-up tool to and from the tool mounting portion are performed more smoothly.

[0092] In the above component pushing-up device, the head support portion includes a base portion and a connecting portion interposed between the base member and the head portion to connect them, and the connecting portion is configured to displace the head portion in the second direction with respect to the base member by elastic deformation of a part or all of it.

[0093] In the configuration of this component pushing-up device, the connecting part interposed between the base part and the head part elastically deforms, causing the head part to displace in the second direction. According to this configuration, when a load is generated on the pushing-up tool during fitting to the tool mounting part (when an external force in the second direction is input), the connecting part deforms according to the magnitude of the load so that the load is eliminated. That is, it becomes possible to displace the head part in the second direction by an amount of movement corresponding to the magnitude of the load.

[0094] In the above component pushing-up device, the head support part further includes a positioning part that positions the head part at a predetermined reference position with respect to the base part in the second direction, and the positioning part is configured to allow displacement of the head part in the second direction when an external force in the second direction is input to the head part.

[0095] According to the configuration of this component pushing-up device, when a load is generated on the pushing-up tool during fitting to the tool mounting part (when an external force in the second direction is input), the head part displaces in the second direction from the reference position, and at other times, the head part is positioned at the reference position by the positioning part. Therefore, it becomes possible to displace the head part only when a load is generated on the pushing-up tool during fitting to the tool mounting part while maintaining the positional accuracy of the head part.

[0096] In this case, the positioning part is configured to generate a biasing force that biases the head part toward the reference position in a state where the head part is displaced in the second direction from the reference position.

[0097] According to the configuration of this component pushing-up device, it becomes possible to more reliably reset the head part displaced in the second direction from the reference position to the reference position.

[0098] In the above component pushing-up device, the positioning part may be provided at a plurality of positions surrounding the connecting part. According to this configuration, it becomes possible to more accurately reset the head part displaced in the second direction from the reference position to the reference position.

[0099] In the above-described component lifting device, a tool storage table capable of supporting each of the plurality of lifting tools is further provided, and the tool transfer mechanism removes the lifting tool mounted on the lifting head by the holding member and returns it to the tool storage table. And / or a tool mounting operation of holding the lifting tool supported by the tool storage table by the holding member and mounting it on the tool mounting portion of the lifting head.

[0100] According to the configuration of this component lifting device, in the tool return operation and the tool mounting operation, it is possible to smoothly attach and detach the lifting tool to and from the tool mounting portion.

[0101] In the above-described component lifting device, the tool mounting portion may be formed so that the lifting tool is fitted. In this case, at least one of the tool mounting portion and the lifting tool is provided with a tapered portion for guiding the lifting tool with respect to the tool mounting portion.

[0102] According to the configuration of this component lifting device, when the lifting tool is mounted on the tool mounting portion, the lifting tool can be smoothly fitted into the tool mounting portion while guiding the lifting tool so that their centers coincide.

[0103] The component mounting device according to an aspect of the present invention includes a component supply unit on which a wafer in a state of being diced and attached to a wafer sheet is disposed, a head that picks up and transfers a die from the wafer disposed in the component supply unit, and the When picking up the die by the head, the above-described component lifting device that pushes up the die from below the wafer sheet.

[0104] According to the configuration of this component mounting device, since it is provided with the component lifting device as described above, it is possible to make the attachment and detachment of the lifting tool to and from the tool mounting portion smoother.

Claims

1. A component pushing-up device that peels a die from a wafer sheet by pushing up the die from below the wafer attached to the wafer sheet, comprising: A pushing-up tool having a suction surface for sucking the lower surface of the wafer sheet under negative pressure and a pushing-up pin that can protrude and retract from the suction surface toward the wafer sheet side; A pushing-up head having a tool mounting portion on which the pushing-up tool is mounted; A tool transfer mechanism that includes a holding member capable of holding the pushing-up tool, holds and transports the pushing-up tool by the holding member, and attaches and detaches the pushing-up tool to and from the tool mounting portion; The tool mounting portion is formed such that the pushing-up tool can be attached and detached by relatively moving the pushing-up tool in a first direction; The holding member includes a head portion that holds the pushing-up tool and a head support portion that supports the head portion so as to be elastically displaceable in a second direction orthogonal to the first direction; The head support portion includes a base portion, a connecting portion interposed between the base portion and the head portion to connect them, and a positioning portion that positions the head portion with respect to the base portion at a predetermined reference position in the second direction; The connecting portion displaces the head portion in the second direction with respect to the base portion by elastic deformation of a part or all of it; The positioning portion allows displacement of the head portion in the second direction when an external force in the second direction is input to the head portion. A component pushing-up device characterized by this.

2. In the component pushing-up device according to Claim 1, The positioning portion generates a biasing force that biases the head portion toward the reference position in a state of being displaced in the second direction from the reference position. A component pushing-up device characterized by this.

3. In the component pushing-up device according to Claim 1 or 2, The positioning portion is provided at a plurality of positions surrounding the connecting portion. A component pushing-up device characterized by this.

4. In the component pushing-up device according to Claim 1 or 2, Further provided is a tool storage table capable of supporting each of the plurality of pushing-up tools. ​ The tool transfer mechanism performs a tool return operation of removing the pushing tool mounted on the pushing head by the holding member and returning it to the tool storage table, and / or a tool mounting operation of holding the pushing tool supported on the tool storage table by the holding member and mounting it on the tool mounting portion of the pushing head. A component pushing device characterized by this.

5. In the component pushing device according to claim 1 or 2, The tool mounting portion is formed so that the pushing tool is fitted therein. A component pushing device characterized in that at least one of the tool mounting portion and the pushing tool is provided with a tapered portion for guiding the pushing tool with respect to the tool mounting portion.

6. A component supply unit on which a wafer in a state of being diced and adhered to a wafer sheet is disposed, A head that picks up and transfers dies from the wafer disposed in the component supply unit, A component mounting device comprising: the component pushing device according to claim 1 or 2, which pushes up the die from below the wafer sheet when picking up the die by the head.

Images