Apparatus for cleaning the blue film at the bottom of a wafer

Abstract

To provide an apparatus for cleaning a blue film on a bottom portion of a wafer.SOLUTION: An apparatus for cleaning a blue film on a bottom portion of a wafer includes a base, a water tank, one or more rollers, one or more roller drive devices, two lifting scraper mechanisms, and a water receiving tray. The one or more rollers are mounted inside a water tank with a portion thereof being exposed to the outside beyond the water tank. The two lifting scraper mechanisms are mounted on the base so as to be located on both the left and right sides of the front of the water tank, and each of the lifting scraper mechanism has a scraper, a water collecting tank, and a lifting drive device. The scraper is located above a water collecting tank. The water collecting tank is mounted in the lifting drive device. The lifting drive device is mounted on the base and drives the water collecting tank and scraper to move them upward and downward. The water receiving tray is mounted on the base so as to be located below the water tank, the two scrapers, and the two water collecting tanks.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a cleaning technology after wafer inspection, and more particularly to an apparatus for cleaning the blue film at the bottom of a wafer.

Background Art

[0002] In the wafer inspection process, a liquid medium close to the refractive index of the blue film is used on the blue film at the bottom of the wafer to produce a clear image effect. After the inspection is completed, the liquid medium on the blue film is cleaned. The cleaning device for wafer inspection equipment disclosed in Patent Document 1 moves the wafer relative to the roller while watering the roller, and then wipes and cleans the blue film at the bottom of the wafer with the watered roller, and wipes the water on the surface of the blue film with a scraper.

[0003] In actual cleaning of the blue film, it is necessary to clean not only once but several times to completely remove the medium attached to the blue film at the bottom of the wafer. In contrast, the technology disclosed in Patent Document 1 waters the roller by a method of moving in a single direction, wipes and cleans the blue film at the bottom of the wafer with the watered roller, and then wipes the water with a scraper. Therefore, after the step of moving the wafer relative to the roller is completed, the wafer must be moved upward and returned to the position before cleaning before the next step, that is, the cleaning operation can proceed. Also, since no cleaning operation is performed until the wafer is moved to the position before the next cleaning, not only time is wasted in the whole process, but also the efficiency is not good. In other words, the technology disclosed in Patent Document 1 does not meet the current needs and there is room for improvement.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The main object of the present invention is to provide an apparatus for cleaning the blue film on the bottom of a wafer. The apparatus for cleaning the blue film on the bottom of a wafer improves the cleaning efficiency by reciprocating the wafer and simultaneously cleaning the blue film on the bottom of the wafer, thus exceeding the prior art.

Means for Solving the Problems

[0006] To solve the above-mentioned problems, the apparatus for cleaning the blue film on the bottom of a wafer includes a base, a water tank, one or more rollers, one or more roller driving devices, two elevating scraper mechanisms, and a water receiving tray. The water tank is disposed on the base and has an upward opening and an interior for containing water. One or more rollers are mounted on the water tank by both ends in the front-rear direction of the long axis, a part of which is located inside the water tank, a part of which is exposed above the opening, and extends beyond the water tank. One or more roller driving devices are mounted on the base, connected to one or more rollers, and drive and rotate one or more rollers. Two elevating scraper mechanisms are mounted on the base so as to be located on the left and right sides of the surface of the water tank, each having a scraper, a water collecting tank, and an elevating driving device. The scraper is disposed above the water collecting tank. The water collecting tank is disposed on the elevating driving device. The elevating driving device is mounted on the base and raises and lowers the water collecting tank and the scraper. The water receiving tray is disposed on the base so as to be located below the water tank, the two scrapers, and the two water collecting tanks.

[0007] Due to the above-described structural features, the present invention can reciprocate the wafer and simultaneously clean the blue film on the bottom of the wafer, improving the cleaning efficiency, thus exceeding the prior art.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, the technical features of the present invention will be described with reference to the drawings.

[0010] (One Embodiment) As shown in FIGS. 1 to 5, in one embodiment of the present invention, a device 10 for cleaning a blue film on the bottom of a wafer includes a base 11, a water tank 21, two rollers 31, two roller driving devices 41, two elevating scraper mechanisms 51, and a water receiving tray 61.

[0011] The water tank 21 is disposed on the base 11 and has an upward opening 22. Cleaning water (not shown in the figure) is accommodated inside the water tank 21.

[0012] The two rollers 31 are mounted on the water tank 21 by both ends in the front-rear direction of the long axis, a part is located inside the water tank 21, a part is exposed above the opening 22, and extends beyond the water tank 21. In the present embodiment, the two rollers 31 are composed of sponges capable of absorbing water, and each rubs and cleans the blue film 92 on the bottom of the wafer 91 at the top.

[0013] The two roller driving devices 41 are mounted on the base 11, connected to the two rollers 31, and drive and rotate the two rollers 31. When driving the two rollers 31, the rotation direction of the rollers 31 is determined according to the actual needs. Generally speaking, the rotation directions of the two rollers 31 are opposite. When viewed from the top, the two rollers 31 rotate facing each other. Even if the wafer 91 is moved left and right with respect to the two rollers 31 in the above-described state, the tangential direction in which the top of the roller 31 rotates to separate the last wafer 91 is opposite to the moving direction of the wafer 91. Also, when the roller 31 rotates, as long as the tangential direction at the top is opposite to the moving direction of the wafer 91, the two rollers 31 may be controlled to rotate in the same direction. In the present embodiment, the roller driving device 41 is a motor.

[0014] The two elevating scraper mechanisms 51 are mounted on the base 11 so as to be located on the left and right sides of the surface of the water tank 21, and each has a scraper 52, a water collecting tank 54, and an elevating drive device 56. The scraper 52 is disposed above the water collecting tank 54. The water wiped off by the scraper 52 falls into the water collecting tank 54. The water collecting tank 54 is disposed in the elevating drive device 56. The elevating drive device 56 is mounted on the base 11 and raises and lowers the water collecting tank 54 and the scraper 52. In the present embodiment, the elevating drive device 56 is an air cylinder.

[0015] The water receiving tray 61 is disposed below the base 11, the water tank 21, the two scrapers 52, and the two water collecting tanks 54 in order to catch the water dripping from the two elevating scraper mechanisms 51 and the water tank 21. When the cleaning operation is actually in progress, the water receiving tray 61 can surely catch the water dripping evenly, so that water droplets do not fall outside the water receiving tray 61.

[0016] In this embodiment, the water tank 21 has two water guiding eaves 24. The two water guiding eaves 24 are formed to extend downward from both sides of the water tank 21, and the end portions thereof are respectively located above the water collecting tank 54 of the elevating scraper mechanism 51. Each water collecting tank 54 has a water receiving eaves 541. The water receiving eaves 541 are formed to extend upward and obliquely from the water collecting tank 54 toward the water tank 21, and the tip end portion is located below the water guiding eaves 24. The longitudinal length of each water guiding eaves 24 is larger than the length of the two rollers 31. The longitudinal length of each water collecting tank 54 is larger than the longitudinal length of the water guiding eaves 24. Due to the above-described structural features, if water droplets drip out of the water tank 21 from the blue film 92 at the bottom of the wafer 91, each water guiding eaves 24 catches the dripping water droplets and guides them to the water collecting tank 54. Subsequently, each water receiving eaves 541 catches the water droplets dripping from the water guiding eaves 24. If the water guiding eaves 24 and the water receiving eaves 541 were not arranged, the dripping water droplets would be caught by the water receiving tray 61.

[0017] In this embodiment, the scraper 52 of the elevating scraper mechanism 51 moves up and down between the highest position H and the lowest position L by the driving force of the elevating drive device 56. When the scraper 52 of the elevating scraper mechanism 51 is set at the highest position H, the top of the scraper 52 is higher than the water tank 21. When the scraper 52 of the elevating scraper mechanism 51 is set at the lowest position L, the top of the scraper 52 is lower than the highest position H and the top of the roller 31. Due to the above-described structural features, when cleaning the blue film 92 of the wafer 91, if the scraper 52 is set at the highest position H, the water on the blue film 92 can be wiped off. If the scraper 52 is set at the lowest position L, it does not contact the blue film 92 and does not wipe off the water.

[0018] The above is the description of the structure of this embodiment. Subsequently, the operating state of this embodiment will be described.

[0019] As shown in FIG. 4, in the wafer inspection process, first, the wafer 91 is moved from left to right to the device 10 for cleaning the blue film on the bottom of the wafer. The method of moving the wafer 91 is a conventional technology, so the description is omitted. Next, the blue film 92 on the bottom of the wafer 91 is brought into contact with the two rollers 31, or the wafer 91 is lowered and pressed against the two rollers 31 to clean the blue film 92. At this time, the two rollers 31 rub and clean the blue film 92, and improve the friction and cleaning effect by rotating relatively in the opposite direction. The scraper 52 of the right-side lifting scraper mechanism 51 rises to the highest position H and wipes off the water on the blue film 92 cleaned by the two rollers 31. The scraper 52 of the left-side lifting scraper mechanism 51 does not wipe off the water on the blue film 92 and remains at the lowest position L. The wiped water flows along the scraper 52 into the water collection tank 54. Most of the water droplets dripping from the blue film 92 flow through the water guide eaves 24 into the water collection tank 54, and a small portion falls into the water receiving tray 61. The cleaning operation of the wafer 91 moving from left to right continues until the wafer 91 has completely passed the scraper 52 on the right side.

[0020] As shown in Fig. 5, the wafer 91 is then moved from right to left to the device 10 for cleaning the blue film on the bottom of the wafer. Prior to this, the scraper 52 on the right side is lowered to the lowest position L, and the scraper 52 on the left side is raised to the highest position H. The blue film 92 is then scraped and cleaned by the two rollers 31. At this time, the scraper 52 on the right side does not wipe off the water on the blue film 92, but remains at the lowest position L. The scraper 52 on the left side wipes off the water on the blue film 92.

[0021] As shown in Figures 4 and 5, multiple cleaning operations can be performed by moving the wafer 91 back and forth. In other words, the present invention is superior to the prior art in that the blue film 92 is cleaned every time the wafer 91 is moved back and forth, thereby improving cleaning efficiency.

[0022] As shown in FIG. 6, the present invention is not limited to two rollers 31 and two corresponding roller driving devices 41, and only one roller 31' and one corresponding roller driving device (not shown in the figure) may be used. When the roller 31' rotates, as long as the tangential direction at the top is opposite to the moving direction of the wafer 91, the operation of rubbing and cleaning the blue film 92 with the roller 31' can be ensured.

[0023] As described above, the present invention is not limited to the above-described embodiments, and can be implemented in various forms without departing from the spirit of the invention.

Explanation of Reference Numerals

[0024] 10: Device for cleaning the blue film at the bottom of the wafer 11: Base 21: Water tank 22: Opening 24: Water guiding eaves 31, 31': Rollers 41: Roller driving device 51: Lifting scraper mechanism 52: Scraper 54: Water collecting tank 541: Water receiving eaves 56: Lifting driving device 61: Water receiving tray 91: Wafer 92: Blue film H: Highest position L: Lowest position

Claims

1. A device for cleaning the blue film on the bottom of a wafer, comprising a base, a water tank, one or more rollers, one or more roller driving devices, two lifting scraper mechanisms, and a water receiving tray, wherein the water tank is arranged on the base and has an upward opening and an interior for containing water, one or more of the rollers are mounted on the water tank by both ends in the front-rear direction of the long axis, a part is located inside the water tank, and a part is exposed above the opening and extends beyond the water tank, one or more of the roller driving devices are mounted on the base and drive and rotate one or more of the rollers after being connected to one or more of the rollers, the two lifting scraper mechanisms are mounted on the base so as to be located on the left and right sides of the surface of the water tank, and each has a scraper, a water collecting tank, and a lifting driving device. The scraper is arranged above the water collecting tank, the water collecting tank is arranged on the lifting driving device, and the lifting driving device is mounted on the base and then lifts and lowers the water collecting tank and the scraper, the water receiving tray is arranged on the base so as to be located below the water tank, the two scrapers, and the two water collecting tanks.

2. In each of the lifting scraper mechanisms, the water collecting tank catches the water dripping along the scraper. The device for cleaning the blue film on the bottom of a wafer according to Claim 1.

3. The water receiving tray catches the water dripping from the two lifting scraper mechanisms and the water tank. The device for cleaning the blue film on the bottom of a wafer according to Claim 1.

4. The water tank has two water guiding eaves, and the two water guiding eaves are formed by extending downward from both sides of the water tank, and the end parts of each are located above the water collecting tank of the lifting scraper mechanism, each of the water collecting tanks has a water receiving eaves, and the water receiving eaves are formed by extending upward and obliquely from the water collecting tank toward the water tank, and the tip parts are located below the water guiding eaves. The device for cleaning the blue film on the bottom of a wafer according to Claim 1.

5. The longitudinal length of each of the water guiding eaves is greater than the length of one or more of the rollers, The apparatus for cleaning the blue film at the bottom of the wafer according to claim 4, characterized in that the longitudinal length of each of the water collecting tanks is greater than the longitudinal length of the water guiding eaves.

6. The number of the rollers is two, and the two rollers are parallel. The number of the roller driving devices is two. The two roller driving devices are connected to the two rollers and rotate the two rollers in opposite directions. In contrast, when viewed from the top, the two rollers rotate facing each other. The apparatus for cleaning the blue film at the bottom of the wafer according to claim 1.

7. The apparatus for cleaning the blue film at the bottom of the wafer according to claim 1, characterized in that one or more of the rollers are composed of sponges.

8. In each of the elevating scraper mechanisms, the scraper moves up and down between the highest position and the lowest position. When the scraper is placed at the highest position, the top of the scraper is higher than the water tank. When the scraper is placed at the lowest position, the top of the scraper is lower than the highest position and the top of the roller. The apparatus for cleaning the blue film at the bottom of the wafer according to claim 1.

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