Moisture detection tag

Abstract

To easily set detection wires to a state in use while protecting them when being not in use in a moisture detection tag for detecting generation of moisture by detecting a conduction state of the detection wires provided on a base material.SOLUTION: A detection tag 1 detects a conduction state of two detection wires 13a and 13b formed on a base material 10 and contactlessly transmits the detection result via an antenna 12 to detect generation of moisture on a detection object area. A waterproof sheet 20 stuck to the base material 10 to cover the antenna 12, the detection wires 13a and 13b and an IC chip 11, includes a separation part 22 delimitedly formed at a partial area straddling the two detection wires 13a and 13b so as to be separable from the waterproof sheet 20 via perforations 21, where the separation part 22 is not stuck to the base material 10 or peelably stuck thereto.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a moisture detection tag that is attached to a detection area and detects the presence of moisture in the detection area. [Background technology]

[0002] Generally, there is a risk of water leaks occurring under sinks in kitchens, bathrooms, etc. of homes, and various countermeasures have been implemented to prevent this. One of these countermeasures is to place a sensor that can detect the generation of moisture under the sink in a kitchen, bathroom, etc. of a home, and use this sensor to detect the generation of moisture due to water leaks, etc.

[0003] Here, Patent Document 1 discloses a moisture detection sensor in which a pair of conductive patterns is formed on a base substrate, and when moisture is generated, the moisture shorts the pair of conductive patterns, and the occurrence of moisture is detected by reading, via an antenna, whether the pair of conductive patterns is in a non-conductive or conductive state. By using this technology, it becomes possible to detect the above-mentioned water leak. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-124657 Summary of the Invention [Problem to be solved by the invention]

[0005] In the device disclosed in Patent Document 1, the conductive pattern formed on the base substrate is exposed to allow moisture to easily adhere to it. This raises the risk of deterioration due to oxidation during storage or physical damage due to friction during transportation. If the conductive pattern deteriorates or is damaged in this way, it becomes impossible to detect moisture generation during use.

[0006] The present invention has been made in view of the problems of the conventional technology as described above, and in a moisture detection tag that detects the generation of moisture by detecting the conduction state of a detection wiring provided on a base substrate, it is an object to provide a moisture detection tag that can be easily brought into a used state while protecting the detection wiring when not in use.

Means for Solving the Problems

[0007] To achieve the above object, the present invention includes a base substrate, an antenna and two detection wirings provided on the base substrate, detection means connected to the ends of the antenna and the detection wirings respectively, provided on the base substrate, detecting the conduction state of the detection wiring, and non-contact transmitting the detection result via the antenna, and a moisture detection tag having a protective sheet adhered to the base substrate so as to cover the antenna, the two detection wirings, and the detection means, wherein the protective sheet has a separation portion partitioned so as to be separable from the protective sheet via a cut-off line in a partial region straddling the two detection wirings, and the separation portion is not adhered to the base substrate or is adhered thereto in a peelable manner.

[0008] In the present invention configured as described above, since the two non-conductive detection wirings provided on the base substrate are exposed, when moisture is generated around the moisture detection tag, the generated moisture adheres to the detection wirings and the two detection wirings are in a conductive state. The conductive state is non-contact transmitted from the detection means via the antenna, so that the generation of moisture is detected. However, when not in use, the detection wirings are covered by the protective sheet adhered to the base substrate, so that the detection wirings are prevented from deteriorating due to oxidation during storage or being physically damaged due to rubbing or the like during transportation. Further, although the protective sheet is adhered to the base substrate, a separation portion is partitioned in a part of the region straddling the two detection wirings so as to be separable from the protective sheet via a cut line. Since this separation portion is not adhered to the base substrate or is detachably adhered, during use, the two detection wirings can be exposed simply by breaking the cut line and separating the separation portion from the protective sheet, and the state during use can be easily achieved.

[0009] Further, if the separation portion has a conductive layer for conducting the two detection wirings on the surface facing the base substrate, in a state where the separation portion is not separated from the separation sheet, since the two detection wirings are in a conductive state via the conductive layer, by confirming that the two detection wirings are in a conductive state in the detection means, it is possible to detect that the detection wirings are not disconnected at an unintended portion in the state before use or that there is a conduction failure due to misalignment of the mounting of the IC chip.

[0010] Further, if the protective sheet has a water-resistant configuration, the antenna and the detection means are protected from moisture during use.

[0011] Further, the base substrate, the antenna and the two detection wirings provided on the base substrate, detection means that are respectively connected to the ends of the antenna and the detection wirings and provided on the base substrate, detect the conductive state of the detection wirings, and non-contact transmit the detection result via the antenna A moisture detection tag having a protective sheet adhered to the base substrate so as to cover the antenna, the two detection wirings, and the detection means, except for a partial region straddling the two detection wirings. It has a covering piece that is removably adhered to the base substrate, covering a portion of the two detection wirings that is not covered by the protective sheet.

[0012] In the present invention configured as described above, since the two non-conductive detection wirings provided on the base substrate are exposed, when moisture is generated around the moisture detection tag, the generated moisture adheres to the detection wirings and the two detection wirings become conductive. The conduction state is non-contact transmitted from the detection means via the antenna, and thus the generation of moisture is detected. However, when not in use, the detection wirings are covered by the protective sheet adhered to the base substrate and the covering piece, so that the detection wirings are prevented from deteriorating due to oxidation during storage or being physically damaged due to rubbing during transportation. Also, since the covering piece is removably adhered to the base substrate, during use, the two detection wirings can be exposed simply by peeling the covering piece from the base substrate, and the state during use can be easily achieved.

Advantages of the Invention

[0013] According to the present invention, in a moisture detection tag that detects the generation of moisture by detecting the conduction state of detection wirings provided on the surface of a base substrate, the detection wirings are covered by a protective sheet adhered to the base substrate. The protective sheet has a separation portion that is separated from the protective sheet via a cut line and is partitioned so as to be separable in a partial region straddling the two detection wirings. This separation portion is not adhered to the base substrate or is removably adhered. Thus, when not in use, the detection wirings are covered by the protective sheet, and when in use, the detection wirings can be exposed simply by breaking the cut line and separating the separation portion from the protective sheet. It is possible to easily achieve the state during use while protecting the detection wirings when not in use.

[0014] Furthermore, in the case where the separation part has a conductive layer on the surface facing the base substrate for conducting the two detection wires, when the separation part is not separated from the separation sheet, the two detection wires are in a conductive state via the conductive layer. Therefore, by confirming that the two detection wires are in a conductive state using the detection means, it is possible to detect that the detection wires are not broken in an unintended part before use, or that there is poor conductivity due to misalignment of the IC chip.

[0015] Furthermore, if the protective sheet is water-resistant, it can protect the antenna and the detection means from moisture during use.

[0016] Furthermore, in a moisture detection tag that detects the generation of moisture by detecting the electrical continuity of detection wiring provided on a base substrate, the detection wiring is covered by a protective sheet and covering piece attached to the base substrate, and the covering piece is removably attached to the base substrate, so that when not in use the detection wiring is covered by the protective sheet and covering piece, and when in use the detection wiring can be exposed simply by peeling the covering piece off the base substrate, so that the detection wiring can be protected when not in use while easily returned to its state when in use. [Brief explanation of the drawings]

[0017] [Figure 1] 1A and 1B are diagrams showing a first embodiment of the moisture detection tag of the present invention, in which (a) is a diagram seen from the surface, (b) is a cross-sectional view taken along line A-A' in (a), (c) is a cross-sectional view taken along line B-B' in (a), and (d) is a diagram showing the configuration in which the waterproof sheet and adhesive layer shown in (a) have been removed. [Figure 2] FIG. 2 is a diagram for explaining how to use the moisture detection tag shown in FIG. [Diagram 3] 2A and 2B are diagrams showing an example of how the moisture detection tag shown in FIG. 1 is used, in which (a) is an external perspective view, and (b) is a plan view seen from the direction of arrow A shown in (a). [Figure 4]This is a diagram for explaining the operation when moisture occurs in the moisture detection area with the moisture detection tag shown in FIG. 1 attached to the moisture detection area as shown in FIG. 3. (a) is a diagram showing the state when no moisture is occurring in the moisture detection area, and (b) is a diagram showing the state when moisture has occurred in the moisture detection area. [Figure 5] FIG. 3 is a diagram showing an example of a system for detecting water leakage in a moisture detection area using the moisture detection tag shown in FIG. 1. [Figure 6] FIG. 6 is a flowchart for explaining a method of detecting water leakage in a moisture detection area when the moisture detection tag shown in FIG. 1 is attached to the moisture detection area as shown in FIG. 3 in the system shown in FIG. 5. [Figure 7] FIG. 9 is a diagram showing a second embodiment of the moisture detection tag of the present invention. (a) is a view seen from the surface, (b) is a cross-sectional view taken along line A-A' shown in (a), (c) is a cross-sectional view taken along line B-B' shown in (a), and (d) is a diagram showing the configuration with the waterproof sheet and the adhesive layer removed as shown in (a). [Figure 8] FIG. 12 is a flowchart for explaining a method of inspecting a conduction failure of the moisture detection tag shown in FIG. 7 in the system shown in FIG. 5. [Figure 9] FIG. 15 is a diagram showing a third embodiment of the moisture detection tag of the present invention. (a) is a view seen from the surface, (b) is a cross-sectional view taken along line A-A' shown in (a), (c) is a cross-sectional view taken along line B-B' shown in (a), and (d) is a diagram showing the configuration with the waterproof sheet and the adhesive layer removed as shown in (a).

Embodiments for Carrying Out the Invention

[0018] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0019] (First Embodiment) FIG. 1 is a diagram showing a first embodiment of the moisture detection tag of the present invention, (a) is a view seen from the surface, (b) is a cross-sectional view taken along line A-A' shown in (a), (c) is a cross-sectional view taken along line B-B' shown in (a), and (d) is a diagram showing a configuration in which the waterproof sheet 20 and the adhesive layer 30a shown in (a) are removed. As will be described later, a moisture-proofing layer 50 is laminated on the adhesive layer 30a. However, in order to show the positional relationship between the detection wirings 13a and 13b and the moisture-proofing layer 50, the moisture-proofing layer 50 is shown in FIG. 1(d).

[0020] As shown in FIG. 1, in this embodiment, a moisture detection tag 1 is configured such that a waterproof sheet 20 having water resistance is laminated and adhered to the surface of a base substrate 10, and a release paper 40 is removably adhered to the back surface of the base substrate 10.

[0021] The base substrate 10 is made of a material having hygroscopicity such as paper, for example, and has a rectangular shape. On one surface of the base substrate 10, an antenna 12 for non-contact communication and two detection wirings 13a and 13b are formed, and an IC chip 11 serving as a detection means is mounted.

[0022] The antenna 12 is formed on one surface of the base substrate 10 such that two isosceles triangle conductors are arranged with a gap therebetween. Note that the shape of the antenna 12 is not limited to this, and various shapes such as two strip-shaped conductors arranged linearly with a gap therebetween or a conductor composed of one conductor are conceivable.

[0023] One end of each of the two detection wirings 13a and 13b is connected to the IC chip 11, and they extend in parallel with each other in a direction away from the IC chip 11 and terminate in front of the end side of the base substrate 10.

[0024] The IC chip 11 is provided with two antenna terminals (not shown) and two detection terminals (not shown). The surface on which these antenna terminals and detection terminals are provided serves as the mounting surface, and it is mounted on the surface of the base substrate 10 where the antenna 12 and the detection wirings 13a and 13b are formed, and is fixed by an anisotropic conductive paste (not shown). The antenna terminals of the IC chip 11 are respectively connected to the antenna 12, and the detection terminals of the IC chip 11 are connected to one end of each of the detection wirings 13a and 13b. Through the anisotropic conductive paste, the antenna terminals are electrically connected to the antenna 12, and the detection terminals are electrically connected to the detection wirings 13a and 13b respectively. The IC chip 11 detects the resistance value between the detection wirings 13a and 13b by flowing the current obtained by non-contact communication through the antenna 12 through the detection wirings 13a and 13b, detects the conduction state of the detection wirings 13a and 13b based on the resistance value, converts the detection result into digital information, and transmits it non-contact through the antenna 12.

[0025] The waterproof sheet 20 serves as the protective sheet in the present invention. The waterproof sheet 20 has an adhesive layer 30a laminated on the entire surface of one side, and is laminated to cover the antenna 12, the detection wirings 13a and 13b, and the IC chip 11 on the entire surface of the surface of the base substrate 10 where the antenna 12 and the detection wirings 13a and 13b are provided, and is adhered by the adhesive layer 30a. As the waterproof sheet 20, a waterproof tack paper having an adhesive layer 30a laminated on one side of the waterproof sheet 20 can be used. Thus, since the IC chip 11 is covered by the waterproof sheet 20, the antenna 12 and the IC chip 11 can be protected from moisture. Further, the waterproof sheet 20 has a perforation 21 serving as a separation line connecting two side edges parallel to the detection wirings 13a and 13b among the side edges of the waterproof sheet 20, formed along the side edge close to the end of the detection wirings 13a and 13b on the side opposite to the IC chip 11. Through this perforation 21, the side facing the end of the detection wirings 13a and 13b on the side opposite to the IC chip 11 becomes a separation portion 22, and is partitioned to be separable from the waterproof sheet 20. Thereby, in the waterproof sheet 20, a separation portion 22 is partitioned to be separable in a partial region straddling the detection wirings 13a and 13b.

[0026] In a region of the adhesion surface of the adhesive layer 30a facing the separation portion 22 with respect to the base substrate 10, a paste-killing layer 50 is laminated to eliminate the adhesive force of the adhesive layer 30a for adhering the base substrate 10 and the waterproof sheet 20. Note that the paste-killing layer 50 can be laminated by curing after applying UV varnish, or by pasting a narrow strip of paper having the width of the paste-killing layer 50 onto the adhesive layer 30a.

[0027] Thereby, the waterproof sheet 20 is adhered to the base substrate 10 by the adhesive layer 30a in a region of the base substrate 10 other than the separation portion 22, and is not adhered to the base substrate 10 by the paste-killing layer 50 in the separation portion 22.

[0028] The release paper 40 is formed by applying a release agent (not shown) to one surface of a release backing paper (not shown), and is releasably adhered to the base substrate 10 by the adhesive layer 30b.

[0029] Hereinafter, the usage method of the moisture detection tag 1 configured as described above and the operation at that time will be described.

[0030] FIG. 2 is a diagram for explaining the usage method of the moisture detection tag 1 shown in FIG. 1.

[0031] When the moisture detection tag 1 shown in FIG. 1 is unused, that is, in the state before use, all of the detection wirings 13a and 13b are covered with the waterproof sheet 20 as described above.

[0032] When using the moisture detection tag 1 shown in FIG. 1, as shown in FIG. 2(a), the separation portion 22 is separated by breaking the perforation 21. Although the waterproof sheet 20 is adhered to the base substrate 10 by the adhesive layer 30a, the separation portion 22 is not adhered to the base substrate 10 by the paste-killing layer 50 laminated on the adhesive layer 30a, so it can be separated from the waterproof sheet 20 and separated from the base substrate 10.

[0033] 2(b), when the separation portion 22 is cut and separated from the waterproof sheet 20, a portion of each of the detection wirings 13a and 13b is exposed. As described above, the separation portion 22 faces the ends of the detection wirings 13a and 13b opposite the IC chip 11. Therefore, when the separation portion 22 is cut and separated from the waterproof sheet 20, the ends of the detection wirings 13a and 13b opposite the IC chip 11 are exposed.

[0034] When moisture adheres to the exposed portions of the detection wirings 13a and 13b, the generated moisture is detected.

[0035] 3A and 3B are diagrams showing an example of how the moisture detection tag 1 shown in FIG. 1 is used, where (a) is an external perspective view and (b) is a plan view seen from the direction of arrow A shown in (a).

[0036] 1 can be attached to the floor surface 3 of the moisture detection area 2, which is the detection area, as shown in Fig. 3, and used to detect moisture generated in the moisture detection area 2. In this case, the release paper 40 is peeled off, and the moisture detection tag 1 is attached to the side of the L-shaped angle 7 using the exposed adhesive layer 30b.

[0037] Figure 4 is a diagram for explaining the effect when moisture occurs in the moisture detection area 2 when the moisture detection tag 1 shown in Figure 1 is attached to the moisture detection area 2 as shown in Figure 3, where (a) is a diagram showing the state when no moisture has occurred in the moisture detection area 2, and (b) is a diagram showing the state when moisture has occurred in the moisture detection area 2.

[0038] When the moisture detection tag 1 shown in Figure 1 is attached to the moisture detection area 2 as shown in Figure 3 and moisture is not generated in the moisture detection area 2 due to water leakage or the like, there is no conductivity between the detection wirings 13a and 13b, as shown in Figure 4(a), and therefore the detection wirings 13a and 13b are in a non-conductive state.

[0039] On one hand, when the moisture detection tag 1 shown in Fig. 1 is attached to the moisture detection area 2 as shown in Fig. 3 and moisture is generated in the moisture detection area 2 due to water leakage or the like, as shown in Fig. 4(b), the generated moisture 4 adheres between the ends of the detection wiring 13a and 13b that are not covered by the waterproof sheet 20. As a result, the two detection wirings 13a and 13b are short-circuited by the moisture 4 and become conductive. By detecting the conductive state between the detection wirings 13a and 13b, it is detected that moisture has been generated in the moisture detection area 2 due to water leakage or the like.

[0040] In this way, when no moisture is generated in the moisture detection area 2 due to water leakage or the like, the detection wirings 13a and 13b are in a non-conductive state. On the other hand, when moisture is generated in the moisture detection area 2 due to water leakage or the like, the detection wirings 13a and 13b are in a conductive state. Therefore, by detecting the conductive state of the detection wirings 13a and 13b, it is possible to detect that moisture has been generated in the moisture detection area 2 due to water leakage or the like. Also, as shown in Fig. 3, instead of attaching the moisture detection tag 1 to the floor surface 3 of the moisture detection area 2, by attaching it to the side surface of the L-shaped angle 7 and attaching it to the moisture detection area 2, if the moisture detection tag 1 is attached to the L-shaped angle 7 so that the ends of the detection wirings 13a and 13b protruding from the waterproof sheet 20 are on the lower side, when moisture accumulates on the floor surface 3 of the moisture detection area 2, the time can be gained from when the detection wirings 13a and 13b become conductive due to the generated moisture until the IC chip 11 and the antenna 12 are submerged by the generated moisture. Also, as shown in Fig. 3, instead of attaching the moisture detection tag 1 to the side wall of the moisture detection area 2, by attaching it to the side surface of the L-shaped angle 7 and attaching it to the moisture detection area 2, the working efficiency is improved especially when the moisture detection area 2 is narrow.

[0041] As described above, in the moisture detection tag 1 shown in FIG. 1, since the two non-conductive detection wirings 13a and 13b provided on the base substrate 10 are exposed, when moisture is generated around the moisture detection tag 1, the generated moisture adheres to the detection wirings 13a and 13b, and the two detection wirings 13a and 13b are in a conductive state. The conductive state is non-contact transmitted from the IC chip 11 via the antenna 12, so that the generation of moisture is detected. However, when not in use, the detection wirings 13a and 13b are covered by the waterproof sheet 20 adhered to the base substrate 10, so that the detection wirings 13a and 13b are prevented from deteriorating due to oxidation during storage or being physically damaged by rubbing or the like during transportation. Further, although the waterproof sheet 20 is adhered to the base substrate 10, a separation portion 22 that is not adhered to the base substrate 10 is partitioned and formed in a part of the region straddling the two detection wirings 13a and 13b so as to be separable from the waterproof sheet 20 via the perforation 21. During use, the two detection wirings 13a and 13b can be exposed simply by breaking the perforation 21 and separating the separation portion 22 from the waterproof sheet 20, and the state during use can be easily achieved. Further, since the waterproof sheet 20 is laminated and adhered to the entire surface of the base substrate 10, when manufacturing the moisture detection tag 1 using a strip-shaped sheet body in which a plurality of moisture detection tags 1 are arranged in a row, there is no step compared to the case of manufacturing in a state where the separation portion is previously separated, and it becomes easier to handle in the process of winding the sheet body into a roll shape or the like.

[0042] In addition, in the moisture detection tag 1 shown in FIG. 1, a deadening layer 50 is laminated in a region of the adhesion surface of the adhesive layer 30a with the base substrate 10 that faces the separation portion 22, whereby the separation portion 22 is not adhered to the base substrate 10 by the deadening layer 50. However, the separation portion 22 may be configured to be detachably adhered to the base substrate 10. In that case, a corner cut or the like may be provided in the separation portion 22 so that the separation portion 22 can be easily peeled off from the base substrate 10.

[0043] The following describes a specific method for detecting the occurrence of water leakage in the moisture detection area 2 using the moisture detection tag 1 by utilizing the above-described operation.

[0044] FIG. 5 is a diagram showing an example of a system for detecting water leakage in the moisture detection area 2 using the moisture detection tag 1 shown in FIG. 1.

[0045] As a system for detecting water leakage in the moisture detection area 2 shown in FIG. 3 using the moisture detection tag 1 shown in FIG. 1, as shown in FIG. 5, a system having a reader / writer 5 serving as a reading means capable of non-contact communication with the moisture detection tag 1 and an administrative personal computer 6 serving as a processing means connected to the reader / writer 5 via wire or wirelessly can be considered. Note that it is also conceivable to use a handy terminal having not only the reading means but also the processing means built therein as the reader / writer, in which case the administrative personal computer becomes unnecessary.

[0046] FIG. 6 is a flowchart for explaining a method of detecting water leakage in the moisture detection area 2 when the moisture detection tag 1 shown in FIG. 1 is attached to the moisture detection area 2 as shown in FIG. 3 in the system shown in FIG. 5.

[0047] In the moisture detection tag 1 shown in FIG. 1, when the reader / writer 5 is shielded within the communicable range of the moisture detection tag 1 and the moisture detection tag 1 is detected by the reader / writer 5 (step 1), first, power is supplied from the reader / writer 5 to the moisture detection tag 1, and a command for detecting the conduction state of the detection wirings 13a and 13b and transmitting the detection result is transmitted to the moisture detection tag 1 (step 2).

[0048] When the power supplied from the reader / writer 5 is obtained by the moisture detection tag 1 and the command transmitted from the reader / writer 5 is received by the IC chip 11 via the antenna 12 of the moisture detection tag 1 (step 3), current is supplied to the detection wirings 13a and 13b by the power supplied from the reader / writer 5.

[0049] In the IC chip 11, by detecting the resistance value between the detection wirings 13a and 13b using the supplied current, the conduction state of the detection wirings 13a and 13b is detected (step 4). Here, when the moisture detection tag 1 is attached to the moisture detection area 2 as shown in FIG. 3 and there is no water leakage in the moisture detection area 2, the detection wirings 13a and 13b are in a non-conductive state. In that state, even if a current is supplied to the detection wirings 13a and 13b by the power supplied from the reader / writer 5, since the detection wirings 13a and 13b are in a non-conductive state, no current flows through the detection wirings 13a and 13b, and thus, the resistance value detected in the IC chip 11 becomes almost infinite.

[0050] In the IC chip 11, when the detected resistance value is almost infinite, it is determined that the detection wirings 13a and 13b are in a non-conductive state, and the determination result is converted into digital information as the detection result of the conduction state of the detection wirings 13a and 13b and wirelessly transmitted to the reader / writer 5 via the antenna 12 (step 5). Note that when the detection wirings 13a and 13b are in a conductive state, the resistance value detected by the IC chip 11 is, as will be described later, the resistance value when the detection wiring 13a and the detection wiring 13b are short-circuited by the moisture 4, that is, at most, the resistance value when the detection wiring 13a and the detection wiring 13b are connected to each other between the portions exposed from the waterproof sheet 20. Therefore, in the IC chip 11, as the resistance value for determining that the detection wirings 13a and 13b are in a non-conductive state, instead of almost infinite, a certain threshold value greater than the resistance value when the detection wiring 13a and the detection wiring 13b are connected to each other between the portions exposed from the waterproof sheet 20 may be used.

[0051] On one hand, as shown in Fig. 3, the moisture detection tag 1 is attached to the moisture detection area 2. When water leakage occurs in the moisture detection area 2, as described above, the detection wiring 13a and the detection wiring 13b are short-circuited by the moisture 4, so that the detection wiring 13a and 13b are in a conductive state. Therefore, in the IC chip 11, the resistance value connected between the detection wiring 13a and the detection wiring 13b in the area where the moisture 4 adheres is detected.

[0052] When the detection wiring 13a and the detection wiring 13b are in a conductive state due to being short-circuited by the moisture 4, as described above, the detected resistance value is at most the resistance value connected between the portions where the detection wiring 13a and the detection wiring 13b protrude from the waterproof sheet 20. Therefore, in the IC chip 11, when the detected resistance value is less than or equal to the resistance value connected between the portions where the detection wiring 13a and the detection wiring 13b protrude from the waterproof sheet 20, it is determined that the detection wiring 13a and 13b are in a conductive state, and the determination result is converted into digital information as the detection result of the conductive state of the detection wiring 13a and 13b and non-contact transmitted to the reader / writer 5 via the antenna 12. When the detection wiring 13a and 13b are in a non-conductive state, the resistance value detected by the IC chip 11 is almost infinite as described above. Therefore, as the resistance value for determining that the detection wiring 13a and 13b are in a conductive state in the IC chip 11, a value less than or equal to a certain fixed threshold larger than the resistance value connected between the portions where the detection wiring 13a and the detection wiring 13b protrude from the waterproof sheet 20 may be used.

[0053] In this way, in the reader / writer 5, the conductive state of the detection wiring 13a and 13b detected by the moisture detection tag 1 is non-contact transmitted via the antenna 12.

[0054] When the detection result non-contact transmitted from the moisture detection tag 1 to the reader / writer 5 as described above is received by the reader / writer 5 (step 6), the detection result received by the reader / writer 5 is transferred to the management personal computer 6 (step 7).

[0055] When the detection result transferred from the reader / writer 5 is received by the management personal computer 6 (step 8), in the management personal computer 6, based on the detection result that is non-contact transmitted from the moisture detection tag 1 to the reader / writer 5 and transferred to the management personal computer 6, it is determined whether water leakage has occurred in the moisture detection area 2 (step 9). Specifically, in the detection result transferred from the reader / writer 5 to the management personal computer 6, if the detection wiring 13a and 13b are in a non-conductive state, it is determined that no water leakage has occurred in the moisture detection area 2, and if the detection wiring 13a and 13b are in a conductive state, it is determined that water leakage has occurred in the moisture detection area 2.

[0056] In this way, by attaching the moisture detection tag 1 to the moisture detection area 2 and checking the conduction state of the detection wiring 13a and 13b of the moisture detection tag 1 in a non-contact state with the reader / writer 5, it is possible to detect the occurrence of moisture due to water leakage or the like in the moisture detection area 2. Therefore, for example, when the moisture detection area 2 is under a sink in a kitchen or a washroom of a house, etc., even in a place where it is impossible to confirm the occurrence of moisture due to water leakage or the like without opening a door or pulling out a drawer, it is possible to easily detect the occurrence of moisture due to water leakage or the like.

[0057] (Second Embodiment) FIG. 7 is a diagram showing a second embodiment of the moisture detection tag of the present invention, (a) is a view seen from the surface, (b) is a cross-sectional view taken along the line A-A' shown in (a), (c) is a cross-sectional view taken along the line B-B' shown in (a), and (d) is a diagram showing a configuration in which the waterproof sheet 20 and the adhesive layer 30a shown in (a) are removed. As will be described later, a conductive layer 60 is laminated on the adhesive layer 30a via a degumming layer 50. However, in order to show the positional relationship between the detection wiring 13a and 13b and the conductive layer 60, the conductive layer 60 is shown in FIG. 7(d).

[0058] As shown in Figure 7, this embodiment is a moisture detection tag 101 that differs from that shown in Figure 1 in that a conductive layer 60 is laminated on the adhesive layer 30a via an adhesive-killing layer 50 at the separation portion 22 of the waterproof sheet 20.

[0059] In the moisture detection tag 101 configured as described above, when the separation part 22 is not separated from the waterproof sheet 20, the two detection wires 13a, 13b are electrically connected via the conductive layer 60. Therefore, by checking this electrically connected state, it is possible to check that the detection wires 13a, 13b are not disconnected in unintended locations before use and to detect electrical continuity defects due to misalignment of the IC chip 11.

[0060] In this embodiment, the conductive layer 60 is laminated on the glue-killing layer 50, so that the conductive layer 60 is in the form of a strip along the edge of the waterproof sheet 20, but the conductive layer 60 only needs to be arranged between the detection wirings 13a, 13b so as to straddle at least two detection wirings 13a, 13b.

[0061] FIG. 8 is a flowchart for explaining a method for inspecting the moisture detection tag 101 shown in FIG. 7 for a continuity defect in the system shown in FIG.

[0062] In the moisture detection tag 101 shown in Figure 7, when the reader / writer 5 is brought close to the moisture detection tag 101 while the separation portion 22 is not separated from the waterproof sheet 20 and the reader / writer 5 detects the moisture detection tag 1 (step 11), as in the processing in the flowchart shown in Figure 6, the reader / writer 5 first supplies power to the moisture detection tag 1 and sends a command to the moisture detection tag 1 to detect the conductivity state of the detection wiring 13a, 13b and transmit the detection results (step 12).

[0063] Power supplied from the reader / writer 5 is obtained by the moisture detection tag 101, and when a command transmitted from the reader / writer 5 is received by the IC chip 11 via the antenna 12 of the moisture detection tag 101 (step 13), current is supplied to the detection wirings 13a and 13b by the power supplied from the reader / writer 5.

[0064] In the IC chip 11, by detecting the resistance value between the detection wirings 13a and 13b using the supplied current, the conduction state of the detection wirings 13a and 13b is detected (step 14). Here, if the detection wirings 13a and 13b of the moisture detection tag 101 are not disconnected at an unintended part in the state before use or there is no conduction failure due to misalignment of mounting of the IC chip 11, since the detection wirings 13a and 13b are in a conductive state via the conductive layer 60, in the IC chip 11, the resistance value at which the detection wiring 13a and the detection wiring 13b are connected via the conductive layer 60 is detected.

[0065] When the detection wiring 13a and the detection wiring 13b are in a conductive state via the conductive layer 60, since the detected resistance value is the resistance value at which the detection wiring 13a and the detection wiring 13b are connected via the conductive layer 60, in the IC chip 11, when the detected resistance value is equal to or less than the resistance value at which the detection wiring 13a and the detection wiring 13b are connected via the conductive layer 60, it is determined that the detection wirings 13a and 13b are in a conductive state, and the determination result is converted into digital information as the detection result of the conduction state of the detection wirings 13a and 13b and non - contact transmitted to the reader / writer 5 via the antenna 12 (step 15). Note that since the resistance value detected by the IC chip 11 when the detection wirings 13a and 13b are in a non - conductive state becomes almost infinite as will be described later, in the IC chip 11, as the resistance value for determining that the detection wirings 13a and 13b are in a conductive state, not the resistance value at which the detection wiring 13a and the detection wiring 13b are connected via the conductive layer 60 but a value equal to or less than a certain threshold larger than that may be used.

[0066] On the other hand, if the detection wiring 13a and 13b of the moisture detection tag 101 are disconnected at an unintended part in the state before use or there is a conduction failure due to misalignment of the mounting of the IC chip 11, although the detection wiring 13a and the detection wiring 13b are connected via the conductive layer 60, even if current is supplied to the detection wiring 13a and 13b by the power supplied from the reader / writer 5, no current flows through the detection wiring 13a and 13b. As a result, the resistance value detected by the IC chip 11 becomes almost infinite.

[0067] In the IC chip 11, when the detected resistance value is almost infinite, it is determined that the detection wiring 13a and 13b are in a non-conductive state, and the determination result is converted into digital information as the detection result of the conduction state of the detection wiring 13a and 13b and non-contact transmitted to the reader / writer 5 via the antenna 12. Incidentally, when the detection wiring 13a and 13b are in a conductive state, since the resistance value detected by the IC chip 11 is the resistance value at which the detection wiring 13a and the detection wiring 13b are connected via the conductive layer 60 as described above, in the IC chip 11, as the resistance value for determining that the detection wiring 13a and 13b are in a non-conductive state, instead of being almost infinite, a certain threshold value larger than the resistance value at which the detection wiring 13a and the detection wiring 13b are connected via the conductive layer 60 may be used.

[0068] In this way, in the reader / writer 5, the conduction state of the detection wiring 13a and 13b detected by the moisture detection tag 101 is non-contact transmitted via the antenna 12.

[0069] When the detection result non-contact transmitted from the moisture detection tag 101 to the reader / writer 5 as described above is received by the reader / writer 5 (step 16), the detection result received by the reader / writer 5 is transferred to the management personal computer 6 (step 17).

[0070] When the detection result transferred from the reader / writer 5 is received by the management personal computer 6 (step 18), in the management personal computer 6, based on the detection result non - contact - transmitted from the moisture detection tag 101 to the reader / writer 5 and then transferred to the management personal computer 6, it is determined whether the detection wirings 13a and 13b are disconnected at an unintended part in the state before use or there is a conduction failure due to the misalignment of the mounting of the IC chip 11 (step 19). Specifically, in the detection result transferred from the reader / writer 5 to the management personal computer 6, if the detection wirings 13a and 13b are in a conductive state, it is determined that the detection wirings 13a and 13b are not disconnected at an unintended part in the state before use and there is no conduction failure due to the misalignment of the mounting of the IC chip 11; if the detection wirings 13a and 13b are in a non - conductive state, it is determined that there is a conduction failure such as the detection wirings 13a and 13b being disconnected at an unintended part in the state before use or there being a conduction failure due to the misalignment of the mounting of the IC chip 11.

[0071] In addition, in this embodiment, the case where the conductive layer 60 is laminated on the adhesive - killing layer 50 in the separation part 22 of the waterproof sheet 20 has been described as an example. However, the conductive layer 60 may be laminated in the region facing the separation part 22 of the base substrate 10. However, in that case, when the separation part 22 is separated from the waterproof sheet 20, the conductive layer 60 also needs to be configured to be separated from the base substrate 10.

[0072] Also, if the conductive layer 60 also serves as the adhesive - killing layer 50, there is no need to specifically provide the adhesive - killing layer 50.

[0073] Also, in the above-described two embodiments, although the case where the two detection wirings 13a and 13b terminate in front of the end side of the base substrate 10 has been described as an example, they may extend to the end side of the base substrate 10. However, when the two detection wirings 13a and 13b terminate in front of the end side of the base substrate 10, since the detection wirings 13a and 13b are completely covered by the waterproof sheet 20 in a state where the separation portion 22 has not separated from the waterproof sheet 20, it is possible to surely obtain the effect of avoiding the detection wirings 13a and 13b from deteriorating due to oxidation or suffering physical damage. On the other hand, in the case where the two detection wirings 13a and 13b extend to the end side of the base substrate 10, since the ends of the detection wirings 13a and 13b protrude from the end side of the moisture detection tag 1, even without using the above-described conductive layer 60, in a state where the separation portion 22 has not separated from the waterproof sheet 20, by checking the conduction state of the detection wirings 13a and 13b in the IC chip 11, it is possible to detect that the detection wirings 13a and 13b are not disconnected at an unintended portion in the state before use and conduction failure due to misalignment of the mounting of the IC chip 11.

[0074] (Third Embodiment) FIG. 9 is a diagram showing a third embodiment of the moisture detection tag of the present invention, (a) is a view seen from the surface, (b) is a cross-sectional view taken along the line A-A' shown in (a), (c) is a cross-sectional view taken along the line B-B' shown in (a), and (d) is a diagram showing a configuration in which the waterproof sheet 20 and the adhesive layer 30a shown in (a) are removed. Note that, similar to that shown in FIG. 1, a masking layer 50 is laminated on the adhesive layer 30a, but in FIG. 9(d), the masking layer 50 is shown in order to show the positional relationship between the detection wirings 213a and 213b and the masking layer 50.

[0075] As shown in FIG. 9, in this embodiment, the moisture detection tag 201 has a different shape of the detection wirings 213a and 213b from that shown in FIG. 1.

[0076] In the moisture detection tag 201 of this embodiment, a part of the two detection wirings 213a and 213b is formed to be parallel to the perforation 21 in a region facing the separation part 22 of the waterproof sheet 20. Then, in the portion parallel to the perforation 21, the two detection wirings 213a and 213b are short-circuited by moisture and become conductive, so that the moisture is detected.

[0077] In addition, in the above-described three embodiments, the perforation 21 for making the separation part 22 separable is formed so as to connect the two end sides of the waterproof sheet 20, and one region becomes the separation part 22 through this perforation 21 and is partitioned so as to be separable from the waterproof sheet 20. However, if the separation part 22 is provided in a partial region straddling the two detection wirings 13a, 13b, 213a, 213b, it may be in a form that is partitioned so as to be separable by being cut out from the waterproof sheet 20 by a perforation consisting of three sides or four sides.

[0078] Also, in the above-described three embodiments, the two detection wirings 13a, 13b, 213a, 213b are described by taking as an example those extending in parallel to each other. However, the two detection wirings do not have to extend in parallel to each other. Further, the shape of the two detection wirings may be comb-shaped or the like, and is not limited to the linear shape as shown in the above-described three embodiments.

[0079] (Other Embodiments) In the above-described embodiment, the detection wirings 13a, 13b, 213a, and 213b are covered by the separable partition 22 formed in the waterproof sheet 20 when not in use, and are exposed when in use. However, separately from the waterproof sheet 20, a covering piece may be provided that covers a part of the detection wirings 13a, 13b, 213a, and 213b when not in use and exposes the detection wirings 13a, 13b, 213a, and 213b when in use. In that case, the waterproof sheet is adhered to the base substrate so as to cover the antenna 12, the detection wirings 13a, 13b, 213a, and 213b, and the IC chip 11, except for a partial region straddling the two detection wirings 13a, 13b, 213a, and 213b. The covering piece is configured to cover the portions of the detection wirings 13a, 13b, 213a, and 213b that are not covered by the waterproof sheet 20 and is detachably adhered to the base substrate 10.

[0080] Also in the moisture detection tag configured as described above, since the two non-conductive detection wirings 13a, 13b, 213a, and 213b provided on the base substrate 10 are exposed, when moisture is generated around the moisture detection tag, the generated moisture adheres to the detection wirings 13a, 13b, 213a, and 213b and the two detection wirings 13a, 13b, 213a, and 213b become conductive. The conduction state is non-contact transmitted from the IC chip 11 via the antenna 12, and thus the generation of moisture is detected. However, when not in use, the detection wirings 13a, 13b, 213a, and 213b are covered by the waterproof sheet 20 and the covering piece adhered to the base substrate 10, so that the detection wirings 13a, 13b, 213a, and 213b are prevented from deteriorating due to oxidation during storage or being physically damaged by rubbing or the like during transportation. Further, since the covering piece is detachably adhered to the base substrate 10, when in use, the two detection wirings 13a, 13b, 213a, and 213b can be exposed simply by peeling the covering piece from the base substrate 10, and the state during use can be easily achieved.

Explanation of Reference Numerals

[0081] 1,101,201 Moisture Detection Tag 2 Moisture Detection Area 3 Floor Surface 4 Moisture 5 Reader / Writer 6 Management Personal Computer 7 L - Angle 10 Base Substrate 11 IC Chip 12 Antenna 13a, 13b, 213a, 213b Detection Wiring 20 Waterproof Sheet 21 Stitching 22 Separation Part 30a, 30b Adhesive Layer 40 Release Paper 50 Glue - Killing Layer 60 Conductive Layer

Claims

1. A base substrate, An antenna and two detection wirings provided on the base substrate, Detection means that are respectively connected to the ends of the antenna and the detection wirings, are provided on the base substrate, detect the conduction state of the detection wirings, and non - contact - transmit the detection result via the antenna, A moisture detection tag having the base substrate, the antenna, the two detection wirings, the detection means, and a protective sheet adhered to the base substrate so as to cover the antenna, the two detection wirings, and the detection means, The protective sheet has a separation portion that is partition - formed so as to be separable from the protective sheet via a cut - off line in a partial region straddling the two detection wirings, The separation portion is a moisture detection tag that is not adhered to the base substrate.

2. A base substrate, An antenna and two detection wirings provided on the base substrate, Detection means that are respectively connected to the ends of the antenna and the detection wirings, are provided on the base substrate, detect the conduction state of the detection wirings, and non - contact - transmit the detection result via the antenna, A moisture detection tag having the base substrate, the antenna, the two detection wirings, the detection means, and a protective sheet adhered to the base substrate so as to cover the antenna, the two detection wirings, and the detection means, The protective sheet has a separation portion that is partition - formed so as to be separable from the protective sheet via a cut - off line in a partial region straddling the two detection wirings, The separation portion is a moisture detection tag that is not adhered to the base substrate or is detachably adhered, and has a conduction layer for conducting the two detection wirings on the surface facing the base substrate.

3. In the moisture detection tag according to Claim 1 or Claim 2, The protective sheet has water resistance, the moisture detection tag.

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