Processing system and method for selecting inspection target

Abstract

To efficiently detect abnormality occurring in a workpiece without degrading processing efficiency of the workpiece.SOLUTION: A processing system includes a processing device for processing a workpiece, and an inspection device for inspecting the workpiece. The processing device includes a processing unit for processing the workpiece held by a chuck table, and an abnormality detection part for detecting abnormality occurring while the workpiece is processed by the processing unit. The inspection device includes a camera unit for photographing the workpiece after processing and forming a photographed image, an inspection part which processes the photographed image and inspects a state of the workpiece, and a recording part for recording the photographed image and an inspection result by the inspection part, and further includes an inspection object selection part which selects the workpiece which is processed by the processing device when the abnormality detection part detects abnormality as an inspection object of the inspection device.SELECTED DRAWING: Figure 9

Description

Technical Field

[0001] The present invention relates to a processing system having a processing device for processing a workpiece and an inspection device for inspecting the workpiece, and a method for selecting an inspection target to be inspected by the inspection device in the processing system.

Background Art

[0002] When a plurality of devices are formed on the surface of a thin plate-like wafer and the wafer is divided for each device, device chips to be mounted on electronic devices can be formed. For dividing workpieces such as wafers, for example, processing devices such as a cutting device that can cut a workpiece with an annular cutting blade and a laser processing device that irradiates a workpiece with a laser beam for processing are used. In a processing device, a workpiece is processed under predetermined processing conditions in order to obtain a predetermined processing result.

[0003] However, due to defects in factory facilities where the processing device is installed, defects in tools provided in the processing device, or defects in the processing device, etc., the workpiece may not be properly processed by the processing device. And, there are cases where the workpiece or the chip is damaged, or the obtained chip becomes a defective product. Therefore, in order to confirm that the processing of the workpiece has been appropriately performed, the workpiece processed by the processing device is photographed and inspected by a camera unit (see Patent Document 1 and Patent Document 2).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] In order to accurately inspect the presence or absence of abnormalities in the workpiece processed by the processing apparatus or the obtained chips, it is preferable to photograph the entire area of the processed workpiece at high resolution with a camera unit. However, it takes a great deal of time to photograph the entire area of the workpiece at high resolution with the camera unit.

[0006] Therefore, in order to inspect the workpieces successively processed by the processing apparatus and detect abnormalities without omission, it is conceivable to prepare a number of inspection apparatuses and operate them in parallel. However, the cost of preparing and operating a large number of inspection apparatuses is high, and securing an area for installing the inspection apparatuses also poses a problem, which becomes a factor in reducing the processing efficiency of the workpiece.

[0007] The present invention has been made in view of such problems, and an object thereof is to provide a processing system and a method for selecting an inspection target that can efficiently detect abnormalities occurring in a workpiece without reducing the processing efficiency of the workpiece.

Means for Solving the Problems

[0008] According to one aspect of the present invention, there is provided a processing system including a processing apparatus for processing a workpiece and an inspection apparatus for inspecting the workpiece, the processing apparatus including a processing unit for processing the workpiece held by a chuck table, and an abnormality detection unit for detecting an abnormality occurring while the processing unit processes the workpiece, the inspection apparatus including a camera unit for photographing the processed workpiece to form a photographed image, an inspection unit for processing the photographed image to inspect the state of the workpiece, and a recording unit for recording the inspection result by the inspection unit together with the photographed image, and further including an inspection target selection unit for selecting, as an inspection target, the workpiece being processed by the processing apparatus when the abnormality detection unit detects the abnormality. If the abnormality detection unit does not detect the abnormality while the workpiece is being processed by the processing unit, the workpiece is not made an inspection target of the inspection device, and the workpiece is not sent to the inspection device. There is provided a processing system characterized by the above. Further, according to one aspect of the present invention, there is provided a processing system including a processing device that processes a workpiece and an inspection device that inspects the workpiece. The processing device includes a processing unit that processes the workpiece held by a chuck table, and an abnormality detection unit that detects an abnormality occurring while the processing unit processes the workpiece. The inspection device includes a camera unit that captures an image of the processed workpiece to form a captured image, an inspection unit that processes the captured image to inspect the state of the workpiece, and a recording unit that records the inspection result by the inspection unit together with the captured image. The processing system further includes an inspection target selection unit that selects, as an inspection target of the inspection device, the workpiece that the processing device was processing when the abnormality detection unit detected the abnormality, and preferentially inspects, with the inspection device, the workpiece having a high necessity of inspection.

[0009] Preferably, the abnormality detection unit detects as the abnormality that any one of vibration, current, voltage, load, speed, torque, pressure, temperature, and flow rate observed by the processing device is out of the allowable range.

[0010] Also preferably, the inspection target selection unit further selects, as the inspection target of the inspection device, the workpiece to be first processed after the maintenance of the processing device or after the setting change.

[0011] And preferably, the inspection device further includes a support table that supports the workpiece, and a moving unit that relatively moves the camera unit and the support table. The captured image is formed based on a plurality of small images obtained by sequentially capturing the workpiece with the camera unit for each small area while changing the imaging area of the camera unit by relatively moving the support table that supports the workpiece and the camera unit by the moving unit.

[0012] More preferably, the inspection device further includes a display unit, and the display unit can display, together with an enlarged image of a part of the captured image, the area shown in the enlarged image on the workpiece.

[0013] Also preferably, the inspection device further includes a support table provided with a transparent body that supports the workpiece. The camera unit includes an upper camera that directly captures the workpiece supported by the support table from above, and a lower camera that captures the workpiece from below through the transparent body. The recording unit records the captured image composed of a set in which an upper camera image obtained by the upper camera capturing a part of the workpiece and a lower camera image obtained by the lower camera capturing the same part of the workpiece are associated with each other. More preferably, the inspection unit of the inspection device inspects the workpiece with content set according to the content of the abnormality detected by the abnormality detection unit while the processing unit processes the workpiece.

[0014] According to another aspect of the present invention, in a processing system having a processing device that processes a workpiece with a processing unit and an inspection device that inspects the state of the workpiece by photographing the workpiece with a camera unit, a method for selecting an inspection target for selecting the workpiece to be inspected by the inspection device, comprising: a processing step of processing the workpiece with the processing unit in the processing device; a determination step of determining whether or not the workpiece processed by the processing device is to be an inspection target of the inspection device; and an inspection step of inspecting the workpiece determined to be the inspection target in the determination step with the inspection device, wherein in the processing step, an abnormality detection unit provided in the processing device detects an abnormality occurring while the workpiece is being processed by the processing unit, and in the determination step, when the abnormality detection unit detects the abnormality, the workpiece being processed by the processing device is selected as the inspection target of the inspection device. If the abnormality detection unit does not detect the abnormality, the workpiece is not made an inspection target of the inspection device. There is provided a method for selecting an inspection target, characterized in that. Further, according to another aspect of the present invention, there is provided a method for selecting an inspection target of a workpiece to be inspected by an inspection device in a processing system including a processing device that processes the workpiece with a processing unit and an inspection device that captures an image of the workpiece with a camera unit to inspect the state of the workpiece. The method includes a processing step of processing the workpiece with the processing unit in the processing device, a determination step of determining whether or not the workpiece processed by the processing device is to be an inspection target of the inspection device, and an inspection step of inspecting, with the inspection device, the workpiece determined to be the inspection target in the determination step. In the processing step, an abnormality detection unit provided in the processing device detects an abnormality occurring while the processing unit processes the workpiece. In the determination step, when the abnormality detection unit detects the abnormality, the workpiece being processed by the processing device is selected as the inspection target of the inspection device, and the workpiece having a high necessity of inspection is preferentially inspected with the inspection device.

[0015] Preferably, the abnormality detection unit detects as the abnormality that any one of vibration, current, voltage, load, speed, torque, pressure, temperature, and flow rate observed in the processing device has gone out of the allowable range.

[0016] Furthermore, preferably, in the determination step, after the maintenance of the processing device or after the setting change, the first workpiece processed is determined to be the inspection target of the inspection device. More preferably, in the inspection step, the workpiece is inspected based on the content set by referring to the content of the abnormality detected by the abnormality detection unit in the processing step.

Advantages of the Invention

[0017] In the processing system and the method for selecting an inspection target according to one aspect of the present invention, while an abnormality detection unit provided in the processing device detects an abnormality occurring while the workpiece is being processed by the processing device, the workpiece is processed by the processing unit.

[0018] If an abnormality is detected by the abnormality detection unit before the processing is completed, the processed workpiece is selected as an inspection target of the inspection device. The selected workpiece is inspected by the inspection device. On the other hand, if no abnormality is detected by the abnormality detection unit before the processing of the workpiece is completed, since the possibility of an abnormality occurring in the workpiece is low, the workpiece is carried out from the processing system without being sent to the inspection device.

[0019] In this case, since not all of the workpieces processed by the processing device are inspected by the inspection device, that is, since the number of workpieces to be inspected can be reduced, the monetary and time costs required for inspection can be reduced, and it is not necessary to prepare a large number of inspection devices. That is, the processing efficiency of the workpieces in the processing system can be improved. Moreover, since the workpieces with a high necessity for inspection in which an abnormality is detected by the abnormality detection unit are preferentially inspected by the inspection device, it is also difficult for a detection omission of the abnormality occurring in the workpiece to occur.

[0020] Therefore, according to the present invention, there is provided a processing system and a method for selecting an inspection target that can efficiently detect an abnormality occurring in a workpiece without reducing the processing efficiency of the workpiece.

Brief Description of the Drawings

[0021]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Embodiments for Carrying Out the Invention

[0022] With reference to the accompanying drawings, an embodiment according to an aspect of the present invention will be described. FIG. 2 is a perspective view schematically showing a processing system 2 according to the present embodiment. The processing system 2 according to the present embodiment includes a processing apparatus 4 for processing a workpiece and an inspection apparatus 56 for inspecting the workpiece.

[0023] First, the workpiece will be described. The workpiece is, for example, a substantially disk-shaped wafer made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors. Alternatively, the workpiece is a substrate or the like made of a material such as sapphire, glass, or quartz. Further, the workpiece may be a package substrate or the like including a plurality of device chips encapsulated with a molding resin or the like.

[0024] FIG. 1 is a perspective view schematically showing a wafer as an example of a workpiece 1. The surface 1a of the workpiece 1 is partitioned by, for example, division planned lines called a plurality of streets 3 that intersect each other. Devices 5 such as ICs (Integrated Circuits) and LSIs (Large-Scale Integrated circuits) are formed in each region partitioned by the streets 3 on the surface 1a of the workpiece 1. When the workpiece 1 is divided along the streets 3, individual device chips can be formed.

[0025] However, the workpiece 1 processed by the processing system 2 according to this embodiment is not limited to this, and devices may not be formed on the surface 1a. Hereinafter, the processing system 2 according to this embodiment will be described by taking as an example the case where the workpiece 1 is a wafer on which a plurality of devices 5 are formed and which is divided along the street 3.

[0026] Before the workpiece 1 is carried into the processing apparatus 4, as shown in FIG. 1, the workpiece 1 is integrated with an annular frame 9 and a tape 7 attached so as to close the opening of the frame 9, and a frame unit 11 is formed. The workpiece 1 adhered to the tape 7 and attached to the frame 9 via the tape 7 is carried into the processing apparatus 4 and divided in this state. Then, the formed individual chips are supported by the tape 7. When the frame unit 11 is formed, it becomes easy to handle the workpiece 1 and the chips.

[0027] For dividing the workpiece 1, for example, a laser processing apparatus that irradiates the workpiece 1 with a laser beam along the street 3 to laser-process the workpiece 1 is used. Alternatively, a cutting apparatus that cuts the workpiece 1 along the street 3 with an annular cutting blade is used. Hereinafter, the processing system 2 according to this embodiment will be described by taking as an example the case where the processing apparatus 4 is a cutting apparatus, but the processing apparatus 4 included in the processing system 2 according to this embodiment is not limited to a cutting apparatus.

[0028] In the processing system 2 according to this embodiment, in order to confirm that the workpiece 1 has been appropriately processed by the processing apparatus 4, the processed workpiece 1 is sent to the inspection apparatus 56, and the workpiece 1 is photographed and inspected by the camera unit. In the inspection apparatus 56, for example, the workpiece 1 is inspected along the street 3, and the formation position and width of the processing marks, the shape, size, distribution, etc. of the chips called chipping formed on the workpiece 1 along the processing marks are investigated. Also, the size of the device chips formed by dividing the workpiece 1 is confirmed.

[0029] The processing system 2 according to this embodiment is connected to a processing device 4 and an inspection device 56. However, the processing device 4 and the inspection device 56 may be independent of each other, and the processing system 2 may include a plurality of processing devices 4 and a plurality of inspection devices 56. FIG. 2 is a perspective view schematically showing the processing system 2 in which one processing device 4 and one inspection device 56 are connected to each other. In FIG. 2 and the like, some configurations such as the housings constituting the processing device 4 and the inspection device 56 are omitted.

[0030] The processing device 4 includes a base 6a that supports each component. At the front corner of the base 6a, a liftable cassette support 6b is provided. On the upper surface of the cassette support 6b, a cassette (not shown) that houses a plurality of frame units 11 is placed.

[0031] At a position adjacent to the cassette support 6b on the upper surface of the base 6a, a rectangular opening 10 that is long in the X-axis direction (processing feed direction) is formed. In the opening 10, a chuck table 14, an X-axis direction moving mechanism (not shown) that moves the moving table 12 on which the chuck table 14 is placed in the X-axis direction, and a dust and drip-proof cover 10a that covers the X-axis direction moving mechanism are provided.

[0032] The processing device 4 is provided with a transfer unit 16 that transfers the frame units 11 housed in the cassette placed on the cassette support 6b in and out. The transfer unit 16 has a pair of guide rails 18 parallel to the Y-axis direction disposed on the front surface of the standing portion 6c of the base 6a. A moving body 20 is slidably attached to the pair of guide rails 18. A nut portion (not shown) is provided on the rear surface side of the moving body 20, and a ball screw 22 parallel to the guide rail 18 is screwed into this nut portion.

[0033] One end of the ball screw 22 is connected to a pulse motor 24. When the ball screw 22 is rotated by the pulse motor 24, the moving body 20 moves in the Y-axis direction along the guide rail 18. A lower end of the moving body 20 is connected with an arm portion 26 extending along the X-axis direction via a lifting mechanism. A plurality of suction portions 28 arranged corresponding to the size of the frame 9 are disposed on a lower surface of the arm portion 26. Further, a push-pull mechanism 30 facing the cassette support base 6b is disposed at a center of the arm portion 26.

[0034] Also, a pair of conveying rails 8 provided so as to straddle the opening 10 are disposed on an upper surface of the base 6a. The pair of conveying rails 8 are spaced apart from each other with a width smaller than the diameter of the frame 9, but are movable in a direction away from each other.

[0035] The conveying unit 16 can move in the Y-axis direction and insert a tip of the push-pull mechanism 30 into a cassette placed on the cassette support base 6b to grip the frame 9 of the frame unit 11 accommodated in the cassette. When the frame 9 is gripped by the push-pull mechanism 30 and the arm portion 26 is moved in the reverse direction along the Y-axis direction, the frame unit 11 can be pulled out onto the pair of conveying rails 8.

[0036] Thereafter, the gripping of the frame 9 by the push-pull mechanism 30 is released, the suction portion 28 of the conveying unit 16 is brought into contact with the frame 9 from above, and the frame 9 is sucked and held by the suction portion 28. Then, the frame unit 11 is pulled up from the conveying rail 8, the interval between the pair of conveying rails 8 is widened, and the frame unit 11 is lowered, whereby the frame unit 11 can be conveyed onto the chuck table 14.

[0037] A porous member is disposed on the upper surface of the chuck table 14 that holds the workpiece 1, and the upper surface of the porous member serves as a holding surface for holding the frame unit 11. The porous member is connected to a suction source (not shown) via a suction passage (not shown) formed inside the chuck table 14. When this suction source is operated, a negative pressure acts on the frame unit 11 (workpiece 1) via the suction passage and the porous member, and the chuck table 14 can suction and hold the frame unit 11.

[0038] FIG. 3 is a plan view schematically showing the configuration of the processing system 2. The processing apparatus 4 includes a processing unit 32 for processing the workpiece 1. The processing unit 32 is, for example, a cutting unit including an annular cutting blade 34, a spindle inserted through a through hole of the cutting blade 34, and a spindle housing 36 that houses one end of the spindle.

[0039] The spindle serves as a rotation axis when rotating the cutting blade 34. The spindle housing 36 houses a rotation drive source such as a motor (not shown) for rotating the spindle. When the rotating cutting blade 34 is cut into the workpiece 1 held by the chuck table 14, the workpiece 1 is cut.

[0040] Note that, although two processing units 32 for cutting the workpiece 1 are mounted on the processing apparatus 4 shown in FIG. 3, the processing apparatus 4 is not limited to this. For example, the number of processing units 32 included in the processing apparatus 4 may be one. Also, when the processing apparatus 4 is a laser processing apparatus, the processing unit 32 becomes a laser processing unit for laser-processing the workpiece 1.

[0041] As shown in FIGS. 2 and 3, the processing apparatus 4 has an opening 38 at a position adjacent to the opening 10 on the upper surface of the base 6a. Inside the opening 38, a cleaning apparatus 40 capable of cleaning the workpiece 1 processed by the processing unit 32 is disposed. The workpiece 1 after processing is conveyed onto the cleaning table of the cleaning apparatus 40 by the conveying unit 16 or the like, and the workpiece 1 can be cleaned by ejecting high-pressure cleaning liquid from a nozzle (not shown) onto the workpiece 1 while rotating the cleaning table on which the workpiece 1 is placed at high speed.

[0042] Note that the loading of the workpiece 1 into the cleaning apparatus 40 may be performed by the conveying unit 42. The conveying unit 42 has a pair of guide rails 44 parallel to the Y-axis direction disposed on the front surface of the standing portion of the base 6a. A moving body 46 is slidably attached to the pair of guide rails 44. A nut portion (not shown) is provided on the rear surface side of the moving body 46, and a ball screw 48 parallel to the guide rail 44 is screwed into this nut portion.

[0043] One end of the ball screw 48 is connected to a pulse motor 50. When the ball screw 48 is rotated by the pulse motor 50, the moving body 46 moves in the Y-axis direction along the guide rail 44. A wrist portion 52 is connected to the lower end of the moving body 46 via a lifting mechanism. The wrist portion 52 is provided with a holding mechanism 54 having a plurality of suction portions (not shown) disposed corresponding to the size of the frame 9.

[0044] For example, a plurality of devices 5 are formed on the surface of the workpiece 1, and when the workpiece 1 is divided for each device 5 by the processing unit 32 of the processing apparatus 4, individual device chips are formed. In order to confirm that the workpiece 1 has been appropriately processed, the workpiece 1 after processing is inspected by the inspection apparatus 56.

[0045] After the cleaning of the workpiece 1 by the cleaning device 40 is completed, the workpiece 1 is held by the holding mechanism 54 and conveyed to the inspection device 56 by the conveying unit 42. Note that the workpiece 1 may be conveyed to the inspection device 56 by the conveying unit 16 instead of the conveying unit 42. Here, if the orientation of the cleaning table is adjusted in advance before the workpiece 1 is held by the conveying units 16 and 42, the orientation of the workpiece 1 carried into the inspection device 56 can be adjusted to a predetermined orientation.

[0046] For example, in the inspection device 56, the workpiece 1 is inspected along the split groove (processing mark) formed on the workpiece 1, and the shape, size, distribution, etc. of the chip called chipping formed on the workpiece 1 along the split groove are investigated. In addition, the size of the device chip formed by splitting the workpiece 1 is confirmed.

[0047] The inspection device 56 can simultaneously observe a part of the workpiece 1 from both the upper surface side (surface 1a side) and the lower surface side (back surface 1b side). When the inspection device 56 is connected to the processing device 4 as shown in FIG. 2 etc., the workpiece 1 after processing can be inspected immediately. However, the inspection device 56 is not limited to this.

[0048] FIG. 4 is a perspective view schematically showing the inspection device 56. The inspection device 56 includes a base 60 that supports each component of the inspection device 56. An opening 62 is formed in the base 60 along the X-axis direction. The inspection device 56 includes a support table 58 that is disposed so as to straddle the opening 62 of the base 60 and can hold the workpiece 1, and a camera unit 82 that can photograph the workpiece 1 held by the support table 58.

[0049] The inspection device 56 includes an X-axis moving unit 64a that can relatively move the support table 58 and the camera unit 82 along the X-axis direction, and a Y-axis moving unit 64b that can relatively move them along the Y-axis direction. FIG. 5(A) schematically shows a perspective view of the X-axis moving unit 64a of the inspection device 56 and the support table 58. FIG. 5(B) schematically shows a perspective view of the camera unit 82.

[0050] The X-axis moving unit 64a includes a guide rail 66a extending along the X-axis direction on the side of the opening 62 on the upper surface of the base 60. Further, on the side of the opening 62 on the opposite side of the guide rail 66a on the upper surface of the base 60, a guide rail 66b extending parallel to the guide rail 66a is provided. A moving body 68a is slidably mounted on the guide rail 66a, and a moving body 68b is slidably mounted on the guide rail 66b.

[0051] On the moving bodies 68a and 68b, a bridge-shaped support structure 74 is disposed so as to straddle both moving bodies 68a and 68b. Further, a nut portion (not shown) is provided at one lower end of the moving body 68a and the moving body 68b, and a ball screw 70 parallel to the guide rails 66a and 66b is screwed into this nut portion.

[0052] A pulse motor 72 is connected to one end of the ball screw 70. When the ball screw 70 is rotated by the pulse motor 72, the moving bodies 68a and 68b move in the X-axis direction along the guide rails 66a and 66b, and the bridge-shaped support structure 74 moves in the X-axis direction. The support table 58 is supported by the support structure 74 at a position overlapping the opening 62 of the base 60. The X-axis moving unit 64a can move the support table 58 in the X-axis direction by moving the support structure 74 along the X-axis direction.

[0053] The support table 58 has a disk-shaped transparent body 76 exposed vertically. The transparent body 76 is formed of a material such as glass or resin, for example. The upper surface of the transparent body 76 becomes a placement surface 76a on which the workpiece 1 is placed via the tape 7. The support table 58 can support the workpiece 1 placed on the placement surface 76a.

[0054] FIG. 6 includes a cross-sectional view schematically showing the support table 58. Since the transparent body 76 is also exposed on the back side opposite to the placement surface 76a, the workpiece 1 placed on the placement surface 76a can be observed from the lower surface side through the transparent body 76.

[0055] The support table 58 includes a tape holding portion 78 having a tape suction holding surface 78b on the outer peripheral side of the placement surface 76a. The tape holding portion 78 has a suction groove 78a formed in the tape suction holding surface 78b. A suction source (not shown) is connected to the suction groove 78a via a suction path (not shown). The support table 58 further includes an annular frame support portion 80 disposed around the tape holding portion 78 and capable of supporting the frame 9 of the frame unit 11.

[0056] When the frame unit 11 is placed on the support table 58 such that the frame support portion 80 and the frame 9 overlap, and the suction source is activated, the workpiece 1 is suction-held on the support table 58 via the tape 7. At this time, since the space between the support table 58 and the tape 7 is suctioned and the tape 7 adheres to the entire placement surface 76a, the workpiece 1 held on the support table 58 does not shift during inspection.

[0057] For example, even when the workpiece 1 is a wafer or the like having warpage, when the workpiece 1 is held on the support table 58, the tape 7 adheres to the entire placement surface 76a. Therefore, the workpiece 1 is suction-held on the support table 58 in a state where the warpage is relaxed. When the warpage of the workpiece 1 held on the support table 58 is relaxed, it becomes difficult for the focus of the camera to shift from the workpiece 1 when photographing each region of the workpiece 1 one by one, so that the workpiece 1 can be photographed more clearly.

[0058] Here, it is preferable that the height of the placement surface 76a of the transparent body 76 is lower than the height of the tape suction holding surface 78b of the tape holding portion 78. Further, the suction groove 78a formed in the tape suction holding surface 78b may reach the transparent body 76. In this case, when the frame unit 11 is placed on the support table 58, a gap is formed between the tape 7 and the placement surface 76a, and when the suction source connected to the suction groove 78a is activated, the region of the tape 7 overlapping the workpiece 1 is quickly suctioned through the gap.

[0059] FIG. 6 schematically shows a cross-sectional view of the frame unit 11 and the support table 58 when the workpiece 1 is sucked and held by the support table 58. As shown in FIG. 6, when the suction source is activated, the gap between the tape 7 and the mounting surface 76a is evacuated, and the tape 7 and the mounting surface 76a come into close contact with each other.

[0060] Note that after the inspection of the workpiece 1 is completed, when the suction source is stopped and the frame unit 11 is removed from the support table 58, for example, the mounting surface 76a may be coated with a fluororesin so that the tape 7 can be easily peeled off from the mounting surface 76a.

[0061] Next, the camera unit 82 will be described. As shown in FIG. 4, the camera unit 82 is supported, for example, by a gantry support structure 84 disposed on the base 60 so as to straddle the opening 62, the X-axis moving unit 64a, and the support table 58. On the support structure 84, a Y-axis moving unit 64b for moving the camera unit 82 along the Y-axis direction is disposed.

[0062] The Y-axis moving unit 64b includes a pair of guide rails 86 disposed along the Y-axis direction on the upper surface of the support structure 84. A moving body 88 that supports the camera unit 82 is slidably mounted on the pair of guide rails 86. A nut portion (not shown) is provided on the lower surface of the moving body 88, and a ball screw 90 parallel to the pair of guide rails 86 is screwed into this nut portion.

[0063] One end of the ball screw 90 is connected to a pulse motor 92. When the ball screw 90 is rotated by the pulse motor 92, the moving body 88 moves along the guide rails 86 in the Y-axis direction, and the camera unit 82 moves in the Y-axis direction. The X-axis moving unit 64a and the Y-axis moving unit 64b function as a moving unit that can relatively move the support table 58 and the camera unit 82 in a direction parallel to the mounting surface 76a in cooperation.

[0064] The camera unit 82 includes an upper camera 106a disposed above the transparent body 76 of the support table 58 and a lower camera 106b disposed below the transparent body 76. As shown in FIG. 5(B), the camera unit 82 further includes a connecting portion 108 that connects the upper camera 106a and the lower camera 106b.

[0065] The upper camera 106a is supported by a columnar support structure 94a. On the front surface of the columnar support structure 94a, an elevating mechanism 96a for raising and lowering the upper camera 106a is disposed. The elevating mechanism 96a includes a pair of guide rails 98a along the Z-axis direction, a moving body 100a slidably mounted on the guide rails 98a, and a ball screw 102a screwed into a nut portion provided on the rear surface of the moving body 100a.

[0066] The upper camera 106a is fixed to the front surface of the moving body 100a. One end of the ball screw 102a is connected to a pulse motor 104a. When the ball screw 102a is rotated by the pulse motor 104a, the moving body 100a moves along the Z-axis direction along the guide rails 98a, and the upper camera 106a fixed to the moving body 100a moves up and down.

[0067] The upper end of the connecting portion 108 is connected to, for example, the lower end portion on the rear surface side of the support structure 94a, and the lower end of the connecting portion 108 is connected to the upper end portion on the rear surface side of a columnar support structure 94b that supports the lower camera 106b. On the front surface of the support structure 94b, an elevating mechanism 96b having the same configuration as the elevating mechanism 96a disposed on the support structure 94a is disposed.

[0068] The elevating mechanism 96b includes a pair of guide rails 98b along the Z-axis direction, a moving body 100b slidably mounted on the guide rails 98b, and a ball screw 102b screwed into a nut portion provided on the rear surface of the moving body 100b. One end of the ball screw 102b is connected to a pulse motor 104b. When the ball screw 102b is rotated by the pulse motor 104b, the lower camera 106b fixed to the front surface of the moving body 100b moves up and down.

[0069] The upper camera 106a faces downward and can directly photograph the workpiece 1 supported on the support table 58 from above. The lower camera 106b faces upward and can photograph the workpiece 1 from below through the transparent body 76 and the tape 7. The upper camera 106a and the lower camera 106b are, for example, area cameras, line cameras, 3D cameras, or infrared cameras, etc.

[0070] When photographing the workpiece 1 through the transparent body 76 and the tape 7, the contrast of the obtained photographed image may be reduced due to the influence of spherical aberration. Therefore, the lower camera 106b may have a correction unit composed of a correction ring or the like that can reduce the influence of the spherical aberration.

[0071] In the camera unit 82, the upper camera 106a and the lower camera 106b are connected to each other by a connecting portion 108 so that their positions in the direction parallel to the mounting surface 76a are the same. That is, the same position on the upper surface side and the lower surface side of the workpiece 1 can be photographed. And the connecting portion 108 is formed in a shape that does not interfere with the support table 58 regardless of which location of the workpiece 1 is used as the photographing location.

[0072] The processing apparatus 4 will be further described with reference to FIG. 2. The processing apparatus 4 includes a display unit 110 having a touch panel. An operator who operates the processing apparatus 4 inputs, for example, the processing conditions and the like performed in the processing apparatus 4 through the touch panel of the display unit 110. The display unit 110 also has functions such as displaying various information, displaying an input screen, and displaying various alarms.

[0073] In addition, the processing device 4 includes a control unit 112 that controls each component of the processing device 4. The control unit 112 is constituted by a computer including, for example, a processing device such as a processor typified by a CPU (Central Processing Unit), a main storage device such as a DRAM (Dynamic Random Access Memory), an SRAM (Static Random Access Memory), and a ROM (Read Only Memory), and an auxiliary storage device such as a flash memory, a hard disk drive, and a solid state drive.

[0074] The auxiliary storage device stores software including a predetermined program. By operating the processing device according to this software, the functions of the control unit 112 are realized. Then, by operating the processing device according to software such as the program stored in the auxiliary storage device, it functions as a specific means in which the software and the processing device (hardware resources) cooperate. Details of the configuration and functions of the control unit 112 will be described later.

[0075] The inspection device 56 includes a display unit 114 having a touch panel. An operator who operates the display unit 114 performs, for example, input of inspection conditions to be implemented in the inspection device 56 using the touch panel of the display unit 114, selection of an image to be displayed on the display unit 114, and the like. Further, the display unit 114 has functions of displaying various types of information, displaying an input screen, and displaying various types of warnings.

[0076] In addition, the inspection device 56 includes a control unit 116 that controls each component of the inspection device 56. The control unit 116 is configured in the same manner as the control unit 112 of the processing device 4, for example. Details of the configuration and functions of the control unit 116 will be described later.

[0077] Here, in the processing system 2 according to the present embodiment, the control units 112 and 116 may be connected by wiring or may be connected by wireless communication. Alternatively, the processing system 2 may include an integrated single control unit that controls the processing apparatus 4 and the inspection apparatus 56. Further, the processing system 2 may include a single display unit that also functions as the display unit 110 of the processing apparatus 4 and the display unit 114 of the inspection apparatus 56.

[0078] In the processing system 2, the workpieces 1 are successively drawn out from the cassettes placed on the cassette support bases 6b, processed by the processing apparatus 4, inspected by the inspection apparatus 56, and then returned to the cassettes again. Here, due to malfunctions in the factory facilities where the processing system 2 is installed, or malfunctions in the processing apparatus 4, etc., the workpieces 1 may not be properly processed, resulting in damage to the workpieces 1 or chips, or the obtained chips may be defective. The inspection apparatus 56 inspects for abnormalities such as damage to the workpieces 1 or chips and processing defects.

[0079] Also, in the processing system 2 according to the present embodiment, the processing apparatus 4 and the inspection apparatus 56 may be separated. In this case, for example, an operator loads the workpiece 1 into the processing apparatus 4, processes the workpiece 1 with the processing apparatus 4, transports the processed workpiece 1 from the processing apparatus 4 to the inspection apparatus 56, and inspects the workpiece 1 and chips with the inspection apparatus 56.

[0080] Furthermore, the processing system according to the present embodiment may include a plurality of processing apparatuses and may include a plurality of inspection apparatuses. FIG. 7 is a perspective view schematically showing a configuration example of a processing system 2a including three processing apparatuses 4 and one inspection apparatus 56. For example, the workpiece 1 is processed by any one of the three processing apparatuses 4, and the processed workpiece 1 is inspected by the inspection apparatus 56.

[0081] Here, in the inspection apparatus 56, in addition to the captured image in which the surface 1a of the workpiece 1 is imaged, a captured image in which the back surface 1b of the workpiece 1 is imaged may be obtained. As described above, the support table 58 of the inspection apparatus 56 includes a transparent body 76 that supports the workpiece 1, and the camera unit 82 includes a lower camera 106b that images the workpiece 1 from below through the transparent body 76. Therefore, the back surface 1b of the workpiece 1 can be imaged.

[0082] And the inspection apparatus 56 can image the same location of the workpiece 1 from above and below simultaneously with the camera unit 82. The captured image may be composed of a set in which an upper camera image obtained by the upper camera 106a imaging a part of the workpiece 1 and a lower camera image obtained by the lower camera 106b imaging the same part of the workpiece 1 are associated. Thereby, since each region of the workpiece 1 can be confirmed from the surface 1a side and the back surface 1b side, the abnormality generated in the workpiece 1 can be analyzed in more detail. Note that the lower camera image obtained by imaging the workpiece 1 from the back surface 1b side may be inverted vertically or horizontally so as to be easily compared with the upper camera image obtained by imaging the workpiece 1 from the surface 1a side.

[0083] Note that an abnormality may occur at any location on the workpiece 1. Therefore, it is preferable that the entire area of the workpiece 1 is imaged by the camera unit 82, and it is preferable that the entire area of the workpiece 1 is shown in the captured image. However, it is difficult to clearly image the entire area of the workpiece 1 at once with the camera unit 82. If the definition of the captured image is insufficient, it is conceivable that the cause of the abnormality generated in the workpiece 1 cannot be investigated.

[0084] Therefore, it is advisable to image the workpiece 1 in high definition by magnifying it for each small area with the camera unit 82 and form a captured image based on the obtained small images. That is, when obtaining a captured image, the support table 58 that supports the workpiece 1 and the camera unit 82 are relatively moved by the X-axis moving unit 64a and the Y-axis moving unit 64b to change the imaging area while imaging the workpiece 1. Then, a captured image is formed based on a plurality of small images obtained by sequentially imaging the workpiece 1 for each small area with the camera unit 82.

[0085] FIG. 8 is a plan view schematically showing a photographing area of the workpiece 1 photographed for each small area. In FIG. 8, the small area 134 already photographed by the camera unit 82 is shown by a solid line, and the small area 136 to be photographed by the camera unit 82 hereafter is shown by a broken line.

[0086] When photographing the workpiece 1, the workpiece 1 is photographed in one small area, the support table 58 or the like is moved by a distance corresponding to one side of the small area, and the workpiece 1 is photographed in the next small area. By repeating this, the entire area of the workpiece 1 is photographed to obtain a plurality of small images. Note that each small area photographed by the camera unit 82 may partially overlap with an adjacent small area.

[0087] By combining the obtained plurality of small images, a photographed image can be formed. Since the obtained photographed image is an aggregate of high-definition and clear small images, each part of the workpiece 1 can be analyzed in detail by enlarging it as necessary. However, since it takes an enormous amount of time to photograph the entire area of the workpiece 1 for each small area, there is a problem that the photographing of the workpiece 1 that is successively processed by the processing apparatus 4 cannot keep up, and the number of workpieces 1 waiting for inspection increases.

[0088] On the other hand, in order to inspect the workpiece 1 successively processed by the processing apparatus 4 and detect abnormalities without omission, it is conceivable to prepare a large number of inspection apparatuses 56 and operate them in parallel. However, the cost of preparing and operating a large number of inspection apparatuses 56 is large, and securing an area for installing the inspection apparatuses 56 also becomes a problem, which is a factor in reducing the processing efficiency of the workpiece 1.

[0089] Therefore, in the processing system 2 according to the present embodiment, instead of inspecting all of the processed workpieces 1 so as to efficiently detect abnormalities occurring in the workpiece 1 without reducing the processing efficiency of the workpiece 1, the workpiece 1 to be inspected is selected and inspected. Hereinafter, the description of the processing system 2 according to the present embodiment will be continued centering on the configuration related to the selection of the inspection target.

[0090] FIG. 9 is a block diagram schematically showing the configurations of the processing device 4 and the inspection device 56 that constitute the processing system 2a shown in FIG. 7. Since the configurations of the processing device 4 and the inspection device 56 of the processing system 2 shown in FIG. 2 and the like are the same as those of the processing device 4 and the inspection device 56 of the processing system 2a shown in FIG. 7, explanations can be appropriately referred to each other.

[0091] The inspection device 56 has an inspection unit 120 that processes a captured image formed by the camera unit 82 capturing the workpiece 1 and inspects the state of the workpiece 1. The inspection unit 120, for example, detects a split groove (processing mark) formed in the workpiece 1 along the street 3 based on the captured image and inspects the quality of this split groove (processing mark). This inspection operation is also called a kerf check.

[0092] The inspection unit 120 detects split grooves from the captured image by image recognition technology and evaluates the formation position of the split grooves in the street 3, the width of the split grooves, the shape, size, quantity, distribution, etc. of the chipping formed on both side wall sides of the split grooves. Then, for each item, when a predetermined standard is satisfied, it is determined that the processing result is normal, and when the predetermined standard is not satisfied, it is determined that an abnormality has occurred in the workpiece 1.

[0093] Note that the inspection unit 120 may inspect the presence or absence of an abnormality in the workpiece 1 at a position away from the split groove, or may detect an abnormality that appears at a position away from the split groove of the workpiece 1. For example, it may be inspected whether there is damage such as a crack in the device 5, or whether there is contamination attached to the electrodes of the device 5, etc.

[0094] The inspection device 56 includes a recording unit 118 in the control unit 116 that records the inspection result of the workpiece 1 by the inspection unit 120 together with the captured image formed by the camera unit 82. The recording unit 118 records the captured image and the inspection result in association with each other. These pieces of information can be used for analyzing abnormalities occurring in the workpiece 1 and analyzing the causes of the abnormalities.

[0095] In addition, the processing device 4 includes a measurement unit 122 that measures physical quantities generated by the processing device 4 during the processing of the workpiece 1, and the control unit 112 is provided with an abnormality detection unit 124 that detects an abnormality that occurs while the workpiece 1 is being processed by the processing unit 32. The abnormality detection unit 124 detects the occurrence of an abnormality based on the physical quantities measured by the measurement unit 122. The measurement unit 122 measures, for example, vibration, current, voltage, speed, torque, rotation amount, pressure, temperature, flow rate, etc. as physical quantities.

[0096] The measurement unit 122 is, for example, a vibration sensor attached to the processing unit (cutting unit) 32. The vibration sensor detects vibrations generated as the cutting blade 34 rotates and vibrations that occur when the cutting blade 34 cuts into the workpiece 1. Alternatively, the vibration sensor may be attached to the chuck table 14 and detect vibrations generated as the chuck table 14 moves.

[0097] In addition, the measurement unit 122 is, for example, a voltmeter that measures the voltage applied to the processing fluid used in the processing device 4. In the processing device 4, a processing fluid such as pure water is supplied to the cutting blade (tool) 34 and the workpiece 1. When an electric current is passed through the processing fluid used and the voltage is measured, the specific resistance value of the processing fluid can be measured, and knowledge about the amount of impurities contained in the processing fluid can be obtained. Alternatively, the voltmeter is used to measure the output voltage of a non-contact setup device used for adjusting (setting up) the height of the cutting blade 34.

[0098] In addition, the measurement unit 122 is, for example, an ammeter provided in the power supply path that supplies power to the processing unit 32. The power supply path is connected to a motor that rotates a spindle connected to the cutting blade 34, and the ammeter can monitor the current of the power supplied to the motor. When there is an abnormality in the processing unit 32 or the like, an abnormal current transition may be observed by the ammeter. In addition, the ammeter may be used to measure the specific resistance value of the processing fluid.

[0099] Further, the measurement unit 122 is, for example, a speedometer that measures the moving speeds of the processing unit 32 and the chuck table 14 that move relative to each other by the moving unit. Further, the measurement unit 122 is a torque detection unit or a rotation amount detection unit that detects the torque or rotation amount of a motor included in the moving unit or a motor that rotates the chuck table 14.

[0100] Further, the measurement unit 122 is, for example, a pressure gauge. The pressure gauge measures the pressure of the air supplied to the spindle or the spindle housing 36 of the processing unit 32. Alternatively, the pressure gauge measures the negative pressure applied by the chuck table 14 that sucks the workpiece 1 or the cleaning table of the cleaning device 40 to the workpiece 1, the supply pressure of the processing fluid or the cleaning fluid, or the pressure of the drying air of the cleaning device 40.

[0101] Further, the measurement unit 122 is, for example, a thermometer. The thermometer measures the temperature of the cooling water or air supplied to the spindle housing 36, the temperature of the processing fluid, the temperature inside and outside the processing device 4, the temperature of the motor of the moving unit, the temperature of the ball screw included in each moving unit, etc. Further, the measurement unit 122 is a flow meter. The flow meter measures the flow rate of the processing fluid or the cleaning fluid, or the flow rate of various types of air.

[0102] Note that the measurement unit 122 included in the processing device 4 is not limited to this, and the measurement unit 122 may be a measuring instrument that can measure other physical quantities. When an abnormality occurs in the processing device 4, values of physical quantities different from normal may be detected by various measurement units 122.

[0103] The processing device 4 includes an allowable range storage unit 126 in which an allowable range for the physical quantity observed by the measurement unit 122 is registered in the control unit 112. The abnormality detection unit 124 reads out the allowable range registered in the allowable range storage unit 126 and detects this as an abnormality when any of the values of these physical quantities observed by the measurement unit 122 is outside the allowable range.

[0104] Further, the processing apparatus 4 further includes an inspection target selection unit 128 in the control unit 112 that selects the workpiece 1 to be inspected in the inspection apparatus 56. The inspection target selection unit 128 classifies the workpieces 1 successively processed by the processing apparatus 4 into a workpiece 1 to be inspected and a workpiece 1 not to be inspected according to a predetermined condition.

[0105] For example, when the abnormality detection unit 124 detects an abnormality, the inspection target selection unit 128 selects the workpiece 1 being processed by the processing apparatus 4 as the inspection target of the inspection apparatus 56. If the abnormality detection unit 124 has detected that an abnormality has occurred in the processing apparatus 4 while the workpiece 1 is being processed, there is a high probability that high-precision processing has not been performed on the workpiece 1 and the workpiece 1 has not been processed with the intended quality. Such a workpiece 1 should be preferentially inspected by the inspection apparatus 56. In the inspection apparatus 56, the workpiece 1 selected as the inspection target is inspected.

[0106] On the other hand, if the abnormality detection unit 124 has not detected that an abnormality has occurred in the processing apparatus 4 while the workpiece 1 is being processed, there is a high probability that high-precision processing has been performed on the workpiece 1 and the workpiece 1 has been processed with the intended quality. Therefore, the necessity of inspecting such a workpiece 1 with the inspection apparatus 56 is low, and the inspection may be omitted. The workpiece 1 not selected as the inspection target may be directly carried out of the processing system 2.

[0107] As described above, according to the processing system 2 according to the present embodiment, the inspection target selection unit 128 determines whether or not to inspect each workpiece 1 with the inspection apparatus 56, and while inspecting some of the workpieces 1 with the inspection apparatus 56, the inspection of other workpieces 1 is omitted. And the workpieces 1 with a high necessity of inspection can be preferentially inspected.

[0108] Therefore, the monetary cost and time cost required for inspecting the workpiece 1 can be reduced, the inspection efficiency is increased, and thus the processing efficiency of the processing system 2 can be improved. And when there is some margin in the operating status of the inspection apparatus 56, the workpiece 1 to be inspected can be inspected with more time, so the inspection accuracy can be improved.

[0109] Note that the requirement for the inspection target selection unit 128 to select the workpiece 1 to be inspected is not limited to the abnormal detection unit 124 detecting an abnormality. Specific situations where the workpiece 1 is likely to have an abnormality may be set as the selection requirements for the workpiece 1 to be inspected. For example, the inspection target selection unit 128 may further select, as the inspection target of the inspection device 56, the workpiece 1 that is first processed after the maintenance of the processing device 4 or after the setting is changed.

[0110] During the process of continuously processing the workpiece 1, some parts of the processing device 4 are consumed and deteriorated, so the parts are periodically replaced. Or, in order to inspect the state of each part, the operation is periodically stopped for maintenance. Furthermore, the settings of the processing device 4 may be changed when the type of the workpiece 1 processed by the processing device 4 is changed, or when the processing conditions of the workpiece 1 are changed.

[0111] Also, when the processing device 4 is a cutting device, clogging or blunting may occur in the cutting blade 34 mounted on the processing unit 32, and the cutting ability of the cutting blade 34 may decrease. Therefore, in the cutting device, in order to restore the cutting ability of the cutting blade 34, a process called dressing is periodically performed, in which a plate called a dressing board is cut by the cutting blade 34 to moderately wear the cutting blade 34.

[0112] When maintenance, setting change, or dressing of the processing device 4 is performed and the processing device 4 is in a new state, it is not always the case that the processing device 4 in this state can appropriately process the workpiece 1. Therefore, regardless of whether the abnormal detection unit 124 has detected an abnormality, the inspection target selection unit 128 selects, as the inspection target of the inspection device 56, the workpiece 1 that is first processed after the maintenance or the like of the processing device 4. And it is preferable that it is confirmed by the inspection of the inspection device 56 that the processing device 4 can process the workpiece 1 without problems.

[0113] Incidentally, the processing apparatus 4 may be provided with an information transmission unit 130 capable of transmitting information to the inspection apparatus 56 by wireless communication or wired communication. The information transmission unit 130 may transmit the details of the abnormality detected by the abnormality detection unit 124 and the physical quantity observed by the measurement unit 122 to the inspection apparatus 56. Then, the inspection apparatus 56 may be provided with an information reception unit 132 capable of receiving various information transmitted from the information transmission unit 130 of the processing apparatus 4.

[0114] For example, when the processing apparatus 4 and the inspection apparatus 56 are independent of each other, the information transmission unit 130 is an antenna capable of transmitting radio waves, and the information reception unit 132 is an antenna capable of receiving the radio waves. Also, for example, when the processing apparatus 4 and the inspection apparatus 56 are integrated, the information transmission unit 130 and the information reception unit 132 are the wiring connecting the processing apparatus 4 and the inspection apparatus 56.

[0115] Also, when the functions of the control unit 116 and the control unit 112 are realized by one integrated control unit, the information transmission unit 130 and the information reception unit 132 are electronic circuits and the like included in the control unit.

[0116] Incidentally, the functions of the information transmission unit 130 and the information reception unit 132 may be swapped with each other, and the information transmission unit 130 and the information reception unit 132 may be used for the transmission of information from the inspection apparatus 56 to the processing apparatus 4.

[0117] The inspection apparatus 56 may change the inspection content for the workpiece 1 according to the details of the abnormality detected by the abnormality detection unit 124 received from the information transmission unit 130 and the physical quantity observed by the measurement unit 122. Also, in the recording unit 118 of the inspection apparatus 56, the details of the abnormality and the physical quantity may be linked to the captured image formed by the camera unit 82 and recorded. In this case, when an abnormality is detected in the workpiece 1 or the like, the cause of the abnormality can be investigated from various angles.

[0118] Furthermore, each workpiece 1 may be provided with ID information for identification. In this case, the ID information read from the workpiece 1 may be linked to the captured image and recorded in the recording unit 118. Also, information regarding the accommodation position in the cassette that housed the workpiece 1 when it was carried into the processing apparatus 4 may be sent to the recording unit 118, and this information may be linked to the captured image and recorded in the recording unit 118.

[0119] In the processing system 2 according to the present embodiment, the display unit 114 may be able to display the captured images recorded in the recording unit 118. FIG. 10 is a plan view schematically showing the display unit 114 that displays the captured image of the workpiece 1. The control unit 116 of the inspection apparatus 56 reads various information and images from the recording unit 118 and causes them to be displayed on the display unit 114.

[0120] As shown in FIG. 10, for example, an upper camera image 13a and a lower camera image 13b are arranged and displayed at the upper part of the display unit 114. Also, at the lower part of the display unit 114, enlarged image display areas 15a, 15b are provided in which a plurality of enlarged images 17a, 17b obtained by enlarging a part of each of the upper camera image 13a and the lower camera image 13b are arranged and displayed.

[0121] For example, a panoramic view of the workpiece 1 is displayed in each of the upper camera image 13a and the lower camera image 13b. Then, the areas of the workpiece 1 shown in the enlarged images 17a, 17b are indicated by the upper camera image 13a and the lower camera image 13b in which the panoramic view of the workpiece 1 is displayed. For example, frames 21a, 21b indicating the areas where the enlarged images 17a, 17b are shown are superimposed and displayed on the upper camera image 13a and the lower camera image 13b.

[0122] Also, on the screen of the display unit 114, the operator may be able to move the frames 21a, 21b by a touch operation. In this case, other enlarged images 17a, 17b showing the areas shown by the moved frames 21a, 21b may be displayed at the lower part of the display unit 114. Note that, in order to be able to simultaneously check a specific area of the workpiece 1 from the front surface 1a side and the back surface 1b side, it is preferable that when one of the frames 21a, 21b is moved, the other frame 21a, 21b moves in conjunction.

[0123] Also, when it is desired to more precisely and accurately specify the areas shown in the enlarged images 17a, 17b, it is preferable that the upper camera image 13a and the lower camera image 13b shown at the upper part of the screen can be enlarged. For example, the display unit 114 may display zoom buttons 19a, 19b for changing the magnification of the upper camera image 13a and the lower camera image 13b. Then, when the operator touches the zoom buttons 19a, 19b, the size and magnification of the upper camera image 13a and the lower camera image 13b may change.

[0124] Note that various kinds of information may be further displayed on the display unit 114. For example, when various physical quantities measured by the measurement unit 122 are transmitted from the processing apparatus 4 and recorded in the recording unit 118, the display unit 114 may display the various physical quantities. Also, the display unit 114 may display information such as the type, production number, and production date and time of the workpiece 1, and the processing date and time of the workpiece 1. There is no limitation on the content of the information display displayed on the screen.

[0125] Next, in the processing system 2 according to the present embodiment, a process of processing the workpiece 1 with the processing apparatus 4, selecting the workpiece 1 to be inspected, and inspecting the selected workpiece 1 with the inspection apparatus 56 will be described. FIG. 11 is a flowchart for explaining the flow of each step of a method for selecting an inspection target for selecting the workpiece 1 to be inspected in the processing system 2 having the processing apparatus 4 and the inspection apparatus 56.

[0126] First, a cassette containing the workpiece 1 and the frame unit 11 is placed on the cassette support 6b of the processing apparatus 4 shown in FIG. 2. Then, the frame unit 11 is pulled out from the cassette by the transfer unit 16, and the frame unit 11 is transferred by the transfer unit 16 onto the chuck table 14 of the processing apparatus 4, and the frame unit 11 is sucked and held by the chuck table 14.

[0127] Next, the processing step S10 is performed. In the processing step S10, the workpiece 1 is processed by the processing unit 32. While the workpiece 1 is being processed, the measuring unit 122 (see FIG. 9) that measures various physical quantities is operated to measure various physical quantities. Then, the frame unit 11 is transferred by the transfer unit 42 to the cleaning apparatus 40, and the workpiece 1 is cleaned by the cleaning apparatus 40.

[0128] Here, the abnormality detection unit 124 of the control unit 112 detects as an abnormality that any of the physical quantities such as vibration, current, voltage, load, speed, torque, pressure, temperature, and flow rate observed in the processing apparatus 4 is outside the allowable range. That is, the abnormality detection unit 124 refers to the allowable ranges of various physical quantities stored in the allowable range storage unit 126, and when the observed physical quantity does not satisfy the allowable range, it detects that an abnormality has occurred in the processing apparatus 4.

[0129] Then, a determination step S20 is performed to determine whether or not the workpiece 1 processed by the processing apparatus 4 is to be the inspection target of the inspection apparatus 56. In the determination step S20, the inspection target selection unit 128 of the control unit 112 determines the necessity of inspection for each workpiece 1 and selects the workpiece 1 to be the inspection target.

[0130] In the determination step S20, the inspection target selection unit 128 selects the workpiece 1 being processed by the processing apparatus 4 as the inspection target of the inspection apparatus 56 when the abnormality detection unit 124 detects an abnormality. In addition to this, after the maintenance of the processing apparatus 4 or after the setting is changed, the workpiece 1 processed first may be selected as the inspection target of the inspection apparatus 56.

[0131] Furthermore, when the processing device 4 is a cutting device, the inspection target selection unit 128 may select the workpiece 1 that is first processed (cut) after dressing of the cutting blade 34 of the processing unit (cutting unit) 32 as the inspection target of the inspection device 56.

[0132] In the determination step S20, the workpiece 1 that is not the inspection target is returned to the cassette placed on the cassette support base 6b with the inspection step S30 described below omitted (S21). On the other hand, the workpiece 1 that is the inspection target in the determination step S20 is sent to the inspection device 56 and inspected by the inspection device 56 (S21).

[0133] Next, the inspection step S30 performed on the workpiece 1 that is the inspection target in the determination step S20 will be described. The inspected workpiece 1 is transported by the transport unit 42 from the cleaning device 40 onto the support table 58 of the inspection device 56 and is sucked and held by the support table 58.

[0134] Then, the camera unit 82 photographs the workpiece 1 to obtain a photographed image of the workpiece 1. First, the focus of the upper camera 106a and the lower camera 106b is adjusted to the respective photographed surfaces of the workpiece 1 by operating the elevating mechanisms 96a, 96b, etc. Then, while scanning the camera unit 82 by operating the moving units 64a, 64b in the manner shown in FIG. 8, each part of the workpiece 1 is photographed by the upper camera 106a etc. of the camera unit 82. The photographed image formed by the camera unit 82 is recorded in the recording unit 118.

[0135] After photographing and inspecting the workpiece 1, the frame unit 11 including the workpiece 1 is carried into the cassette supported by the cassette support base 6b by the transport unit 42 and the transport unit 16. Then, the cassette is carried out of the processing system 2. When the workpiece 1 is processed by the processing device 4, individual chips are obtained. The formed individual chips are picked up from the tape 7 and mounted on a predetermined mounting target.

[0136] Here, the workpiece 1 that was the inspection target in the determination step S20 may be handled differently from the workpieces 1 that are no longer the inspection targets. For example, contaminants or the like may adhere to the inspected workpiece 1, and it is conceivable that contaminants or the like may detach from the workpiece 1 during conveyance and contaminate the conveyance path. Therefore, for the conveyance of the inspected workpiece 1, a dedicated conveyance mechanism different from the conveyance mechanism used for the conveyance of other workpieces 1 may be used.

[0137] Furthermore, the inspected workpiece 1 may be accommodated in a dedicated cassette different from the cassette in which other workpieces 1 are finally accommodated and then carried out of the processing system 2. Alternatively, when the inspected workpiece 1 and other workpieces 1 are accommodated in the same cassette, information regarding the accommodation position of the inspected workpiece 1 in the cassette may be associated with the captured image and recorded in the recording unit 118.

[0138] In addition, in the inspection step S30, it is preferable to evaluate the quality of the processing marks formed on the workpiece 1 by using the obtained captured image. Also, it is confirmed by the inspection unit 120 of the control unit 116 whether an abnormality has occurred in the workpiece 1. And when it is determined that an abnormality has occurred in the workpiece 1, the cause of the abnormality may be considered.

[0139] Also, when the abnormality detection unit 124 has detected an abnormality while the workpiece 1 is being processed by the processing device 4, in the inspection device 56, the content of the inspection to be carried out may be set according to the content of the abnormality. For example, information regarding the abnormality detected by the abnormality detection unit 124 in the processing step S10 is sent to and recorded in the recording unit 118 of the inspection device 56. And when the workpiece 1 is inspected by the inspection device 56, the content of the abnormality recorded in the recording unit 118 is referred to and the content of the inspection is set.

[0140] In addition, the captured image formed by capturing the workpiece 1 with the camera unit 82 is stored in the recording unit 118. At this time, the physical quantity observed by the processing device 4 may be linked to the captured image and recorded in the recording unit 118. Further, when the quality of the processing marks is evaluated by the inspection device 56, the evaluation result may be linked to and recorded in the captured image.

[0141] As described above, according to the method for selecting a workpiece according to the present embodiment, the workpiece 1 that requires a high degree of inspection is preferentially inspected by the inspection device 56, and the inspection of other workpieces 1 can be omitted. Therefore, compared with the case where all the workpieces 1 processed by the processing device 4 are inspected by the inspection device 56, the time cost and financial cost required for inspection can be reduced. On the other hand, it is also difficult for detection omission of abnormalities occurring in the workpiece 1 to occur. Therefore, the abnormalities occurring in the workpiece 1 can be efficiently detected without reducing the processing efficiency of the workpiece 1.

[0142] Note that one aspect of the present invention is not limited to the description of the above embodiment, and various modifications can be made and implemented. For example, in the above embodiment, the case where there is one inspection device 56 included in the processing system 2 has been described, but one aspect of the present invention is not limited to this. That is, the processing system 2 may have a plurality of inspection devices 56.

[0143] Further, in the above embodiment, the case where the inspection device 56 inspects the workpiece 1 when the abnormality detection unit 124 detects an abnormality while the workpiece 1 is being processed by the processing device 4, or immediately after maintenance of the processing device 4 or the like has been performed has been described. However, the processing system 2 and the method for selecting a workpiece according to the present embodiment are not limited to this.

[0144] For example, if the abnormality detection unit 124 does not detect an abnormality in the processing apparatus 4 while the workpieces 1 are successively processed by the processing apparatus 4, there may be no workpiece 1 sent to the inspection apparatus 56, and the operating time of the inspection apparatus 56 may be reduced. Therefore, the inspection target selection unit 128 of the control unit 112 of the processing apparatus 4 may select a workpiece 1 with a low necessity for inspection as an inspection target when the operating time of the inspection apparatus 56 is short.

[0145] When there is room in the operating state of the inspection apparatus 56, even if the workpiece 1 processed by the processing apparatus 4 is randomly selected and inspected by the inspection apparatus 56, the processing efficiency and inspection efficiency of the workpiece 1 will not decrease. And even for a workpiece 1 with a low necessity for inspection, there is still a non-zero possibility that some abnormality will be detected by the inspection using the inspection apparatus 56. When there is room in the operating state of the inspection apparatus 56 and the number of workpieces 1 to be inspected is increased within the range where no workpiece 1 waiting for inspection occurs, the operating time of the inspection apparatus 56 is increased, and the inspection efficiency is further improved.

[0146] In addition, the structures, methods, etc. according to the above embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention.

Explanation of Reference Numerals

[0147] 1 Workpiece 1a Surface 1b Back surface 3 Street 5 Device 7 Tape 9 Frame 11 Frame unit 13a Upper camera image 13b Lower camera image 15a, 15b Enlarged image display area 17a, 17b Enlarged image 19a, 19b Zoom button 21a, 21b Frame 2, 2a Processing system 4 Processing apparatus 6a Base 6b Cassette support base 6c Standing part 8 Conveyor rail 10 Opening 10a Dust and drip cover 12 Moving table 14 Chuck table 16,42 Conveyor unit 18,44,66a,66b,86,98a,98b Guide rail 20,46,68a,68b,88,100a,100b Moving body 22,48,70,90,102a,102b Ball screw 24,50,72,92,104a,104b Pulse motor 26,52 Arm part 28 Suction part 30 Push-pull mechanism 32 Processing unit 34 Cutting blade 36 Spindle housing 38 Opening 40 Cleaning device 54 Holding mechanism 56 Inspection device 58 Support table 60 Base 62 Opening 64a,64b Moving unit 74,84,94a,94b Support structure 76 Transparent body 76a Placing surface 78 Tape holding part 78a Suction groove 78b Tape suction holding surface 80 Frame support part 82 Camera unit 96a,96b Lifting mechanism 106a Upper camera 106b Lower camera 108 Connecting part 110,114 Display unit 112,116 Control unit 118 Recording part 120 Inspection part 122 Measurement Unit 124 Abnormality Detection Unit 126 Tolerance Range Memory Unit 128 Inspection Target Selection Unit 130 Information Transmission Unit 132 Information Reception Unit 134, 136 Small Compartments

Claims

1. A processing system having a processing device for processing a workpiece and an inspection device for inspecting the workpiece, wherein the processing device comprises a processing unit for processing the workpiece held by a chuck table, and an abnormality detection unit for detecting an abnormality occurring during the processing of the workpiece by the processing unit, and the inspection device comprises a camera unit for photographing the processed workpiece to form a photographed image, an inspection unit for processing the photographed image to inspect the state of the workpiece, and a recording unit for recording the inspection result by the inspection unit together with the photographed image, further comprising an inspection target selection unit for selecting, as an inspection target of the inspection device, the workpiece being processed by the processing device when the abnormality detection unit detects the abnormality, and characterized in that when the abnormality detection unit does not detect the abnormality during the processing of the workpiece by the processing unit, the workpiece is not made an inspection target of the inspection device and is not sent to the inspection device.

2. A processing system having a processing device for processing a workpiece and an inspection device for inspecting the workpiece, wherein the processing device comprises a processing unit for processing the workpiece held by a chuck table, and an abnormality detection unit for detecting an abnormality occurring during the processing of the workpiece by the processing unit, and the inspection device comprises a camera unit for photographing the processed workpiece to form a photographed image, an inspection unit for processing the photographed image to inspect the state of the workpiece, and a recording unit for recording the inspection result by the inspection unit together with the photographed image, further comprising an inspection target selection unit for selecting, as an inspection target of the inspection device, the workpiece being processed by the processing device when the abnormality detection unit detects the abnormality, and characterized in that the workpiece with a high necessity of inspection is preferentially inspected by the inspection device.

3. The abnormality detection unit according to claim 1 or claim 2, wherein the abnormality detection unit detects that any one of vibration, current, voltage, load, speed, torque, pressure, temperature, and flow rate observed by the processing device is out of an allowable range as the abnormality.

4. The inspection target selection unit according to claim 2, further characterized in that the inspection target selection unit selects, as the inspection target of the inspection device, the workpiece that is first processed after the maintenance of the processing device or after the setting change.

5. The inspection device comprises a support table for supporting the workpiece, It further includes a moving unit that relatively moves the camera unit and the support table. The captured image is formed based on a plurality of small images obtained by sequentially capturing the workpiece with the camera unit for each small area while changing the imaging area of the camera unit by relatively moving the support table that supports the workpiece and the camera unit by the moving unit. The processing system according to any one of claims 1 to 4, characterized in that.

6. The inspection device further includes a display unit. The display unit can display a region in the workpiece that appears in the enlarged image together with an enlarged image of a part of the captured image. The processing system according to claim 5, characterized in that.

7. The inspection device further includes a support table having a transparent body that supports the workpiece. The camera unit includes an upper camera that directly captures the workpiece supported on the support table from above, and a lower camera that captures the workpiece from below through the transparent body. The recording unit records the captured image composed of a set in which an upper camera image of a part of the workpiece captured by the upper camera and a lower camera image of the part of the workpiece captured by the lower camera are associated with each other. The processing system according to any one of claims 1 to 4, characterized in that.

8. The inspection unit of the inspection device inspects the workpiece with the content set according to the content of the abnormality detected by the abnormality detection unit while the workpiece is being processed by the processing unit. The processing system according to any one of claims 1 to 7, characterized in that.

9. In a processing system having a processing device that processes a workpiece with a processing unit and an inspection device that inspects the state of the workpiece by capturing the workpiece with a camera unit, a method for selecting an inspection target for selecting the workpiece to be inspected by the inspection device, A processing step of processing the workpiece with the processing unit in the processing device. A determination step of determining whether or not the workpiece processed by the processing device is to be an inspection target of the inspection device. An inspection step of inspecting the workpiece determined to be the inspection target in the determination step with the inspection device. It has, In the processing step, an abnormality occurring while the workpiece is being processed by the processing unit is detected by an abnormality detection unit provided in the processing device. In the judgment step, when the abnormality detection unit detects the abnormality, the workpiece being processed by the processing device is selected as the inspection object of the inspection device, and when the abnormality detection unit does not detect the abnormality, the workpiece is not selected as the inspection object of the inspection device.

10. In a processing system having a processing device that processes a workpiece with a processing unit and an inspection device that photographs the workpiece with a camera unit to inspect the state of the workpiece, a method for selecting an inspection target to be inspected by the inspection device, comprising: a processing step of processing the workpiece with the processing unit in the processing device; a determination step of determining whether or not the workpiece processed by the processing device is to be inspected by the inspection device; an inspection step of inspecting the workpiece selected as the inspection target in the determination step by the inspection device, In the processing step, an abnormality occurring while the workpiece is being processed by the processing unit is detected by an abnormality detection unit provided in the processing device; In the judgment step, when the abnormality detection unit detects the abnormality, the workpiece being processed by the processing device is selected as the inspection object of the inspection device, and the workpiece that is most in need of inspection is inspected preferentially by the inspection device.

11. The method for selecting an inspection object according to claim 9 or 10, characterized in that the abnormality detection unit detects that any of vibration, current, voltage, load, speed, torque, pressure, temperature, and flow rate observed in the processing device is outside an allowable range as the abnormality.

12. The method for selecting an inspection object according to any one of claims 9 to 11, characterized in that in the determination step, the workpiece that is first processed after maintenance of the processing device is performed or after a setting change is performed is determined to be the inspection object of the inspection device.

13. 13. The method for selecting an inspection object according to claim 9, wherein in the inspection step, the workpiece is inspected with the set content by referring to the content of the abnormality detected by the abnormality detection unit in the processing step.

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