Display panel, method for manufacturing a display panel, and machine for manufacturing a display panel

Abstract

The present application provides a display panel, a manufacturing method for the display panel, and a machine for manufacturing the display panel, in which an overspray area of ​​the organic electronic functional layer covers a part of the contact pad pattern, and an overspray area of ​​the cathode covers the overspray area of ​​the organic electronic functional layer and another part of the contact pad pattern, thereby simultaneously solving the problems of the prior art, such as simplifying the process of the display panel and bonding the cathode film layer to the metal wiring.

Description

Technical Field

[0001] This application relates to the technical field of display panels, and particularly to display panels, manufacturing methods of display panels, and machines for manufacturing display panels.

Background Art

[0002] In recent years, due to the potential of the printing process IJP (Ink Jet Printing) to significantly reduce manufacturing costs, organic light-emitting diodes (OLEDs) are more cost-competitive in product applications including televisions and tablet computers. For OLED panels, their manufacturing still requires the use of an evaporation process (EV) or a sputtering process (SPT) in addition to using the inkjet printing process (IJP). Due to material limitations of the inks for ETM (electron transport material) and EIM (electron injection material), currently, in OLED panels, the IJP process is used to deposit OLED functional layers such as HIL (hole injection layer), HTL (hole transport layer), and EML (emitting layer), and the EV / SPT process is used to deposit OLED functional layers such as ETL (electron transport layer), EIL (electron injection layer), and CAT (cathode).

[0003] The CAT needs to be bonded and conduct electricity with the metal wiring on the substrate in order to realize the control of the light emission of the OLED by the driving circuit. One method is to directly bond the CAT film layer with the metal wiring. Therefore, due to the different sizes of the mask openings required for the deposition of CAT and the mask openings required for the deposition of ETL and EIL, different film-forming regions are realized, thereby avoiding the conductive ETL film and EIL film being covered by the metal wiring and affecting the bonding and conduction between the CAT and the metal wiring.

[0004] For the evaporation production line of an OLED panel, in the station design, it is necessary to design different cycle flows according to different masks. Based on the design that the sizes of the mask openings required for the deposition of the above-mentioned CAT and the mask openings required for the deposition of ETL and EIL are different, at least two cycle flows are required in the layout of the stations on the production line, resulting in high equipment investment costs.

[0005] Therefore, currently, it is urgent to simplify the process of the above display panel and simultaneously solve the problem of the bonding between the CAT film layer and the metal wiring.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a machine for manufacturing a display panel to solve problems such as the simplification of the process of the display panel and the bonding between the cathode film layer and the metal wiring in the prior art.

Means for Solving the Problems

[0007] According to the embodiments of the present application, a display panel partitioned into a display area and a contact pad area, a substrate, a contact pad pattern provided on the substrate and located in the contact pad area, an anode provided on the substrate and located in the display area, a light-emitting layer provided on the anode, an organic electronic functional layer covering the light-emitting layer, and a cathode covering the organic electronic functional layer, wherein the organic electronic functional layer further covers a part of the contact pad pattern, and the cathode further covers another part of the contact pad pattern, and a display panel is provided.

[0008] In the display panel described in another embodiment of the present application, the organic electronic functional layer includes a stacked electron transport layer and an electron injection layer.

[0009] In the display panel described in other embodiments of the present application, the organic electronic functional layer extends from the display area to the contact pad area, and the cathode extends from the display area to the contact pad area.

[0010] The display panel described in other embodiments of the present application further includes a driving circuit layer provided on the substrate, a planarization layer covering the driving circuit layer, an anode provided on the planarization layer, and a pixel definition layer provided on the planarization layer and covering a part of the anode. An opening is formed in the pixel definition layer, a hole injection layer and a hole transport layer are laminated and provided in the opening, and the light emitting layer is provided on the hole transport layer.

[0011] In the display panel described in other embodiments of the present application, the organic electronic functional layer covers the light emitting layer, a part of the pixel definition layer and a part of the driving circuit layer, and includes an electron transport layer in contact with the contact pad pattern, and covers the electron transport layer, in contact with the contact pad pattern, and covers a part of the contact pad pattern. And an electron injection layer, and the cathode covers the electron injection layer and another part of the contact pad pattern.

[0012] In another aspect, according to the present application, providing a substrate partitioned into a display area and a contact pad area, including a contact pad pattern provided in the contact pad area and a light emitting layer provided in the display area; depositing an organic electronic functional layer to cover the light emitting layer and a part of the contact pad pattern; depositing a cathode to cover the organic electronic functional layer and another part of the contact pad pattern, a method for manufacturing a display panel is provided.

[0013] In the method for manufacturing a display panel according to another embodiment of the present application, by using the same mask, depositing the organic electronic functional layer to cover the light-emitting layer and a part of the contact pad pattern, and depositing the cathode to cover the organic electronic functional layer and the other part of the contact pad pattern are performed.

[0014] In the method for manufacturing a display panel according to another embodiment of the present application, the step of covering the light-emitting layer and a part of the contact pad pattern by depositing the organic electronic functional layer includes the step of depositing the organic electronic functional layer by a vapor deposition method, and the overspray region of the organic electronic functional layer covers a part of the contact pad pattern.

[0015] In the method for manufacturing a display panel according to another embodiment of the present application, the step of covering the light-emitting layer and a part of the contact pad pattern by depositing the organic electronic functional layer further includes the step of reducing the distance between the vapor deposition source and the substrate so as to reduce the overspray region of the organic electronic functional layer.

[0016] In the method for manufacturing a display panel according to another embodiment of the present application, the step of covering the light-emitting layer and a part of the contact pad pattern by depositing the organic electronic functional layer further includes the step of changing the vapor deposition angle of the vapor deposition source so as to reduce the overspray region of the organic electronic functional layer.

[0017] In the method for manufacturing a display panel according to another embodiment of the present application, the step of covering the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode includes the step of depositing the cathode by a vapor deposition method, and the overspray region of the cathode covers the overspray region of the organic electronic functional layer and the other part of the contact pad pattern.

[0018] In the method for manufacturing a display panel according to another embodiment of the present application, the step of covering the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode further includes the step of changing the deposition angle of the evaporation source so as to increase the overspray area of the cathode.

[0019] In the method for manufacturing a display panel according to another embodiment of the present application, the step of covering the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode further includes the step of increasing the distance between the evaporation source and the substrate so as to increase the overspray area of the cathode.

[0020] In the method for manufacturing a display panel according to another embodiment of the present application, the step of covering the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode further includes the step of increasing the distance between the mask and the substrate so as to increase the overspray area of the cathode.

[0021] In the method for manufacturing a display panel according to another embodiment of the present application, the step of covering the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode includes the step of depositing the cathode by a sputtering method, and the overspray area of the cathode covers the overspray area of the organic electronic functional layer and the other part of the contact pad pattern.

[0022] In the method for manufacturing a display panel according to another embodiment of the present application, the step of covering the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode further includes the step of increasing the distance between the sputtering target and the substrate so as to increase the overspray area of the cathode.

[0023] In the method for manufacturing a display panel according to another embodiment of the present application, in the step of depositing the cathode to cover the organic electronic functional layer and another part of the contact pad pattern, the method further includes the step of increasing the distance between the mask and the substrate so as to increase the overspray area of the cathode.

[0024] In another aspect, according to the present application, there is provided a machine for manufacturing a display panel that executes the method for manufacturing a display panel according to any one of the above items, a buffer chamber for transporting and accommodating the substrate, a mask alignment chamber for coating the surface of the substrate so as to align the mask with the substrate, a step of depositing the organic electronic functional layer on the substrate to cover the light-emitting layer and a part of the contact pad pattern, and a step of depositing the cathode to cover the organic electronic functional layer and another part of the contact pad pattern, and a vapor deposition / sputtering chamber for performing these steps, a mask separation chamber for removing the mask from the substrate, and a machine for manufacturing a display panel is provided.

[0025] The machine for manufacturing a display panel according to another embodiment of the present application further includes a mask rotation chamber, and one of the buffer chambers is provided between the mask rotation chamber and the mask alignment chamber and between the mask rotation chamber and the mask separation chamber, and the two buffer chambers engage with the mask rotation chamber so as to select an appropriate mask and transport it to the mask alignment chamber to perform alignment of the mask.

[0026] In the machine for manufacturing a display panel according to another embodiment of the present application, one of the buffer chambers is further provided in the vicinity of the mask alignment chamber. The buffer chamber receives and accommodates the substrate printed with the hole injection layer, the hole transport layer, and the light emitting layer from outside the machine for manufacturing a display panel, and transports the substrate to the mask alignment chamber to perform alignment of the mask.

Advantages of the Invention

[0027] The beneficial effects of the present application are as follows. According to the present application, in the display panel, the manufacturing method of the display panel, and the machine for manufacturing the display panel, the overspray region of the organic electronic functional layer covers a part of the contact pad pattern, and the overspray region of the cathode covers the overspray region of the organic electronic functional layer and another part of the contact pad pattern, thereby simultaneously solving problems such as simplification of the process of the display panel and bonding between the cathode film layer and the metal wiring in the prior art.

Brief Description of the Drawings

[0028] Hereinafter, with reference to the drawings, the specific embodiments of the present application will be described in detail to clarify the technical solution means and other beneficial effects of the present application.

[0029]

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Mode for Carrying Out the Invention

[0030] The details of the specific structures and functions disclosed in this specification are merely representative and are for the purpose of explaining the exemplary embodiments of the present application. However, the present application can be specifically realized in many alternative forms and should not be construed as being limited to the embodiments described in this specification.

[0031] In the description of the present application, the orientation or positional relationship indicated by terms such as "center", "lateral direction", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is merely for the purpose of easily explaining the present application and simplifying the description, and does not indicate or imply that the indicated device or component must have a specific orientation and be configured and operate in a specific orientation. Therefore, it should not be understood as limiting the present application. Also, the terms "first" and "second" are merely for the purpose of explaining the object, and should not be understood as indicating or suggesting relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present invention, unless otherwise specifically explained, "a plurality" means two or more. Also, the term "comprising" and any variations thereof are intended to cover non-exclusive inclusion.

[0032] In the description of the present invention, unless otherwise clearly specified and limited, the terms "mounting", "connecting", and "attaching" should be understood in a broad sense. For example, it may be a support connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, a connection through an intermediate medium, or a communication between two components. A person skilled in the art can understand the specific meaning of the above terms in the present application according to the specific situation.

[0033] Note that the terms used in this specification are only for explaining specific embodiments and are not intended to limit the exemplary embodiments. Unless clearly indicated otherwise from the context, the singular expressions "one" and "an item" used in this specification are intended to include the plural cases. The terms "comprising" and / or "including" used in this specification and the like define the presence of the described features, integers, steps, operations, units and / or components, and it should be understood that the presence or addition of one or more other features, integers, steps, operations, units, components and / or combinations thereof is not excluded.

[0034] Hereinafter, the present application will be further described with reference to the drawings and embodiments.

[0035] As shown in FIG. 1, FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present application. According to an embodiment of the present application, there is provided a display panel 100 partitioned into a display area AA and a contact pad area BA, including a substrate SB, a contact pad pattern BP provided on the substrate SB and located in the contact pad area BA, an anode AN provided on the substrate SB and located in the display area AA, a light-emitting layer EL provided on the anode AN, an organic electronic functional layer OEL covering the light-emitting layer EL, and a cathode CA covering the organic electronic functional layer OEL, wherein the organic electronic functional layer OEL further covers a part of the contact pad pattern BP, and the cathode CA further covers another part of the contact pad pattern BP.

[0036] Specifically, in the display panel 100 of another embodiment of the present application, the contact pad area BA is, for example, a peripheral circuit area other than the display area AA.

[0037] In the display panel 100 according to another embodiment of the present application, the organic electronic functional layer OEL includes a stacked electron transport layer ETL and an electron injection layer EIL.

[0038] Specifically, the display panel 100 according to another embodiment of the present application includes a driving circuit layer DCL provided on a substrate SB, a planarization layer PLN covering the driving circuit layer DCL, an anode AN provided on the planarization layer PLN, and a pixel definition layer PDL provided on the planarization layer PLN and covering a part of the anode AN. An aperture is formed in the pixel definition layer PDL, and a hole injection layer HIL and a hole transport layer HTL are laminated and provided in the aperture. The light-emitting layer EL is provided on the hole transport layer HTL. The electron transport layer ETL covers a part of the light-emitting layer EL, the pixel definition layer PDL, and the driving circuit layer DCL, and contacts the contact pad pattern BP. The electron injection layer EIL covers the electron transport layer ETL, contacts the contact pad pattern BP, and covers a part of the contact pad pattern BP. The cathode CA covers the electron injection layer EIL and the other part of the contact pad pattern BP.

[0039] Specifically, the driving circuit layer DCL includes a driving transistor and circuit wiring, and the wiring is connected to the anode AN, the contact pad pattern BP, etc. through an aperture. The driving circuit layer DCL further includes a passivation layer to provide appropriate insulation of the wiring, for example, insulation from the electron transport layer ETL. Since the driving circuit layer DCL is not the focus of this case, its details are not illustrated.

[0040] Specifically, as shown in FIG. 9, FIG. 9 is a schematic curve diagram of the deposition film thickness of the evaporation method and the sputtering method according to the embodiment of the present application with respect to the horizontal distance. Specifically, the opening edge of the mask MK is between the horizontal distances 0 to 0.5 in the figure. In the deposition process, since the mask MK and the substrate SB cannot be completely adhered, the deposit accumulates to a position where the mask MK does not open slightly beyond the opening position of the mask MK, and this region is called an overspray region. Specifically, in the sputtering method SPT, the sputtering direction of the particles is random, but in the evaporation method EV, the particles are restricted by the evaporation angle. Therefore, the overspray region SOA formed by the sputtering method SPT is larger than the overspray region EOA formed by the evaporation method EV.

[0041] Specifically, as shown in FIGS. 3 and 4, FIG. 3 is a schematic structural diagram in the manufacturing process of the display panel according to the embodiment of the present application, and FIG. 4 is a partial enlarged view of FIG. 3. Applied to the embodiment of the present application, the above organic electronic functional layer OEL further covers a part of the above contact pad pattern BP, and the above cathode CA further covers another part of the above contact pad pattern BP. The method of forming the structure includes the overspray area EOA of the above organic electronic functional layer OEL but Covering a part of the above contact pad pattern BP and , the overspray area COA of the above cathode CA but , covering the above overspray area EOA of the above organic electronic functional layer OEL and another part of the above contact pad pattern BP make it so including that.

[0042] Specifically, the above cathode CA can be in direct contact with another part of the above contact pad pattern BP through the overspray area COA, and the overspray area EOA of the above organic electronic functional layer OEL is not interposed between the overspray area COA of the above cathode CA and another part of the above contact pad pattern BP. Therefore, a good electrical connection between the above cathode CA and the above contact pad pattern BP can be provided, and the problem of poor bonding between the cathode and the contact pad pattern in the prior art can be solved.

[0043] As shown in FIG. 2, FIG. 2 is a flowchart of the manufacturing method of the display panel according to the embodiment of the present application. In another aspect, according to the present application, Providing a substrate partitioned into a display area and a contact pad area, including a contact pad pattern provided in the above contact pad area and a light-emitting layer provided in the above display area, S100; depositing an organic electronic functional layer to cover the above light-emitting layer and a part of the above contact pad pattern, S200; depositing a cathode to cover the above organic electronic functional layer and another part of the above contact pad pattern, S300. A manufacturing method of a display panel is provided.

[0044] Specifically, as shown in FIG. 10, FIG. 10 is a schematic structural diagram of a substrate according to an embodiment of the present application. In the method for manufacturing a display panel according to another embodiment of the present application, the substrate SB(IJP) provided in S100 further includes a driving circuit layer DCL provided on the substrate SB, a planarization layer PLN covering the driving circuit layer DCL, an anode AN provided on the planarization layer PLN, and a pixel definition layer PDL provided on the planarization layer PLN and covering a part of the anode AN. An opening is formed in the pixel definition layer PDL, and a hole injection layer HIL and a hole transport layer HTL are laminated and provided in the opening. The light-emitting layer EL is provided on the hole transport layer HTL.

[0045] Specifically, the hole injection layer HIL, the hole transport layer HTL, and the light-emitting layer EL are manufactured by a printing process IJP (Ink Jet Printing).

[0046] Specifically, as shown in FIGS. 11 and 12, FIGS. 11 and 12 are schematic structural diagrams of a display panel in the manufacture of a display panel according to an embodiment of the present application. In the method for manufacturing a display panel according to another embodiment of the present application, S200 that covers the light-emitting layer and a part of the contact pad pattern by depositing an organic electronic functional layer includes a step of covering a part of the light-emitting layer EL, the pixel definition layer PDL, and the driving circuit layer DCL and contacting the contact pad pattern BP by depositing an electron transport layer ETL, and a step of covering the electron transport layer ETL, contacting the contact pad pattern BP, and covering a part of the contact pad pattern BP by depositing an electron injection layer EIL.

[0047] Specifically, as shown in FIG. 1, in the method for manufacturing a display panel according to another embodiment of the present application, S300 that covers the organic electronic functional layer and another part of the contact pad pattern by depositing a cathode includes a step of covering the electron injection layer EIL and another part of the contact pad pattern BP by depositing a cathode CA.

[0048] As shown in FIGS. 2, 3, and 4, FIG. 2 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application. In the method for manufacturing a display panel according to another embodiment of the present application, by using the same mask MK, by depositing the organic electronic functional layer, the S200 that covers the light-emitting layer and a part of the contact pad pattern, and by depositing the cathode, the S300 that covers the organic electronic functional layer and the other part of the contact pad pattern are performed.

[0049] Specifically, in the method for manufacturing a display panel according to an embodiment of the present application, a part of the contact pad pattern BP is covered by the overspray region EOA of the organic electronic functional layer OEL, and the overspray region EOA of the organic electronic functional layer OEL and the other part of the contact pad pattern BP are covered by the overspray region COA of the cathode CA. Therefore, the cathode CA can directly contact the other part of the contact pad pattern BP through the overspray region COA, and since the overspray region EOA of the organic electronic functional layer OEL does not intervene between the overspray region COA of the cathode CA and the other part of the contact pad pattern BP, by using the same mask MK, by depositing the organic electronic functional layer, the S200 that covers the light-emitting layer and a part of the contact pad pattern, and by depositing the cathode, the S300 that covers the organic electronic functional layer and the other part of the contact pad pattern can be performed, without the need to use two masks with different aperture sizes, while providing a good electrical connection between the cathode CA and the contact pad pattern BP and at the same time solving the problem of poor bonding between the cathode and the contact pad pattern in the prior art.

[0050] As shown in FIGS. 2, 4, and 5, FIG. 5 is a schematic configuration diagram of a vapor deposition method according to an embodiment of the present application. In a method for manufacturing a display panel according to another embodiment of the present application, the S200 that coats the light-emitting layer and a part of the contact pad pattern by depositing the organic electronic functional layer includes a step of depositing the organic electronic functional layer OEL by a vapor deposition method, and an overspray region EOA of the organic electronic functional layer OEL covers a part of the contact pad pattern BP.

[0051] As shown in FIGS. 2, 4, and 5, in a method for manufacturing a display panel according to another embodiment of the present application, the S200 that coats the light-emitting layer and a part of the contact pad pattern by depositing the organic electronic functional layer further includes a step of reducing the distance d1 between the vapor deposition source EM and the substrate SB so as to reduce the overspray region EOA of the organic electronic functional layer OEL.

[0052] Specifically, the distance from the intersection of the normal line NL of the center of the surface TS of the vapor deposition source EM and the surface SS of the substrate SB to the surface TS of the vapor deposition source EM is d1. The vapor deposition source EM is provided on a heating base EH that heats and evaporates the vapor deposition source EM and applies it to the surface of the substrate SB through a mask MK. The longer the distance d1, the more difficult it is to control the traveling direction of the vapor deposition particles, and thus the length of the overspray region EOA becomes longer.

[0053] As shown in FIGS. 2, 4, and 5, in a method for manufacturing a display panel according to another embodiment of the present application, the S200 that coats the light-emitting layer and a part of the contact pad pattern by depositing the organic electronic functional layer further includes a step of changing the vapor deposition angle EA of the vapor deposition source EM so as to reduce the overspray region EOA of the organic electronic functional layer OEL.

[0054] Specifically, angle adjustment plates AP for adjusting the evaporation angle EA are provided on both sides of the evaporation source EM. The evaporation source EM is provided on a heating base EH that heats and evaporates the evaporation source EM, restricts it with the angle adjustment plate AP, and applies it to the surface of the substrate SB by the mask MK. By adjusting the angle adjustment plate AP, the larger the evaporation angle EA, the shorter the length of the overspray region EOA.

[0055] Specifically, for both the deposition of the cathode CA and the deposition of the organic electronic functional layer OEL, if the evaporation method is used, when depositing the cathode CA, by changing the evaporation angle EA to be smaller, the length of the overspray region EOA of the cathode CA is increased, and when depositing the organic electronic functional layer OEL, by changing the evaporation angle EA to be larger, the length of the overspray region EOA of the organic electronic functional layer OEL can be decreased.

[0056] As shown in FIGS. 2, 4, and 6, FIG. 6 is a schematic configuration diagram of the sputtering method according to an embodiment of the present application. In the method for manufacturing a display panel according to another embodiment of the present application, S300 that covers the organic electronic functional layer and another part of the contact pad pattern by depositing the cathode includes a step of depositing the cathode CA by an evaporation method or a sputtering method, and the overspray region COA of the cathode CA covers the overspray region EOA of the organic electronic functional layer OEL and another part of the contact pad pattern BP.

[0057] Specifically, taking the deposition of the cathode CA by the sputtering method as an example, the sputtering target SM is provided on the sputtering platform STP and connected to a negative power supply. By introducing positively charged argon ions Ar+ to impact the sputtering target SM, atomic clusters in the sputtering material are scattered and applied to the surface of the substrate SB by the mask MK. The sputtering direction of the particles generated by the sputtering method is random. Therefore, compared with the evaporation method, the overspray region generated by the sputtering method is larger.

[0058] As shown in FIGS. 2, 4, and 6, in the method for manufacturing a display panel according to another embodiment of the present application, in the step S300 of covering the organic electronic functional layer and another part of the contact pad pattern by depositing the cathode, the method further includes increasing the distance d2 between the vapor deposition source EM or the sputtering target SM and the substrate SB so as to increase the overspray region of the cathode.

[0059] Specifically, taking the deposition of the cathode CA by sputtering as an example, the distance between the surface TS of the sputtering target SM and the surface SS of the substrate SB is d2. Similar to the vapor deposition method, the longer the distance d2, the more the traveling direction of the sputtering particles is disturbed, and the longer the length of the overspray region COA. Conversely, by reducing the distance d2, the length of the overspray region COA of the cathode can be reduced.

[0060] As shown in FIGS. 2, 4, and 7, FIG. 7 is a schematic cross-sectional configuration diagram of a mask and a substrate according to an embodiment of the present application. In the method for manufacturing a display panel according to another embodiment of the present application, in the step S300 of covering the organic electronic functional layer and another part of the contact pad pattern by depositing the cathode, the method further includes increasing the distance MSD between the mask MK and the substrate SB so as to increase the overspray region COA of the cathode CA. The present application does not limit the specific manner of increasing the distance MSD between the mask MK and the substrate SB.

[0061] Specifically, in the method for manufacturing a display panel according to another embodiment of the present application, a spacer SR is provided between the mask MK and the substrate SB so as to increase the distance MSD. The spacer SR is, for example, a protrusion formed on the mask MK by means such as etching, pressing, or welding casting, or a gasket provided between the mask MK and the substrate SB. The present application does not limit the manufacturing method of the protrusion or the gasket, nor does it limit the shape of the protrusion or the gasket.

[0062] Specifically, by increasing the overspray region COA of the cathode CA and / or reducing the overspray region EOA of the organic electronic functional layer OEL, the contact area between the overspray region COA of the cathode CA and the contact pad pattern BP can be increased, thereby providing a good electrical connection between the cathode CA and the contact pad pattern BP and solving the problem of poor bonding between the cathode and the contact pad pattern in the prior art.

[0063] As shown in FIGS. 2 and 8, FIG. 8 is a schematic configuration diagram of a machine for manufacturing a display panel according to an embodiment of the present application. In another aspect, according to the present application, there is provided a machine PM for manufacturing a display panel that executes the method for manufacturing a display panel according to any one of the above items, including a buffer chamber BC for transporting and accommodating the substrate SB(IJP), a mask alignment chamber AC for coating the surface of the substrate SB(IJP) so as to align the mask MK with the substrate SB(IJP), an evaporation / sputtering chamber E / SC for performing S200 for coating the light-emitting layer and a part of the contact pad pattern by depositing the organic electronic functional layer on the substrate SB(IJP), and S300 for coating the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode, and a mask separation chamber SC for removing the mask MK from the substrate SB(IJP).

[0064] Specifically, the buffer chamber BC receives and accommodates the substrate SB(IJP) on which the hole injection layer HIL, the hole transport layer HTL, and the light-emitting layer EL are printed. The substrate SB(IJP) is transported to the mask alignment chamber AC for alignment of the mask MK.

[0065] Specifically, the machine base PM for manufacturing the display panel further includes a mask rotation chamber TC, and includes one buffer chamber BC each between the mask rotation chamber TC and the mask alignment chamber AC and between the mask rotation chamber TC and the mask separation chamber SC. The two buffer chambers BC engage with the mask rotation chamber TC so as to select an appropriate mask MK and convey it to the mask alignment chamber AC for alignment of the mask MK.

[0066] Specifically, in the method for manufacturing a display panel according to the embodiment of the present application, a part of the contact pad pattern BP is covered by the overspray region EOA of the organic electronic functional layer OEL, and the overspray region COA of the cathode CA covers the overspray region EOA of the organic electronic functional layer OEL and the other part of the contact pad pattern BP. Therefore, the cathode CA can directly contact the other part of the contact pad pattern BP through the overspray region COA, and the overspray region EOA of the organic electronic functional layer OEL does not intervene between the overspray region COA of the cathode CA and the other part of the contact pad pattern BP. Therefore, in the evaporation / sputtering chamber E / SC, by using the same mask MK, the organic electronic functional layer is deposited to cover the light-emitting layer and part of the contact pad pattern, i.e., S200, and the cathode is deposited to cover the organic electronic functional layer and the other part of the contact pad pattern, i.e., S300. There is no need to use two masks with different aperture sizes, so there is no need for two cycle flows in the layout of the stations of the additional production line. The process of the display panel is simplified, the cost is reduced, and a good electrical connection between the cathode CA and the contact pad pattern BP is provided, solving the problem of poor bonding between the cathode and the contact pad pattern in the prior art.

[0067] According to the present application, in the above display panel, the manufacturing method of the above display panel, and the machine for manufacturing the above display panel, the overspray region of the above organic electronic functional layer covers a part of the above contact pad pattern, and the overspray region of the above cathode covers the above overspray region of the above organic electronic functional layer and another part of the above contact pad pattern, thereby simultaneously solving problems such as the simplification of the process of the display panel and the bonding between the cathode film layer and the metal wiring in the prior art.

[0068] The above display panel, the manufacturing method of the above display panel, and the machine for manufacturing the above display panel according to the embodiments of the present application are described in detail above.

[0069] For the specific implementation of each of the above operations, reference can be made to the previous embodiments, and the description is omitted here.

[0070] As described above, preferred embodiments of the present application are disclosed. However, the above preferred embodiments do not limit the present application. Those skilled in the art can make various deformations and modifications without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application is based on the content defined in the claims.

Claims

1. Providing a substrate divided into a display area and a contact pad area, including a contact pad pattern provided in the contact pad area and a light-emitting layer provided in the display area; Depositing an organic electronic functional layer to cover the light-emitting layer and a part of the contact pad pattern; Depositing a cathode to cover the organic electronic functional layer and the other part of the contact pad pattern, including: In the deposition process, the inclined region formed by the deposit exceeding the opening position of the mask and depositing at the non-opening position of the mask is called the overspray region. The overspray region of the organic electronic functional layer covers a part of the contact pad pattern, and the overspray region of the cathode completely covers the overspray region of the organic electronic functional layer and contacts the other part of the contact pad pattern. By using the same mask, Depositing the organic electronic functional layer to cover the light-emitting layer and a part of the contact pad pattern; Depositing the cathode to cover the organic electronic functional layer and the other part of the contact pad pattern, A method for manufacturing a display panel.

2. The step of depositing the organic electronic functional layer to cover the light-emitting layer and a part of the contact pad pattern includes the step of depositing the organic electronic functional layer by vapor deposition. The method for manufacturing a display panel according to Claim 1.

3. The step of depositing the organic electronic functional layer to cover the light-emitting layer and a part of the contact pad pattern further includes the step of reducing the distance between the vapor deposition source and the substrate so as to reduce the overspray region of the organic electronic functional layer. The method for manufacturing a display panel according to Claim 2.

4. The step of depositing the organic electronic functional layer to cover the light-emitting layer and a part of the contact pad pattern further includes the step of changing the vapor deposition angle of the vapor deposition source so as to reduce the overspray region of the organic electronic functional layer. The method for manufacturing a display panel according to Claim 2.

5. The step of covering the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode includes the step of depositing the cathode by a vapor deposition method. The method for manufacturing a display panel according to claim 1.

6. The step of covering the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode further includes the step of changing the deposition angle of the deposition source so as to increase the overspray area of the cathode. The method for manufacturing a display panel according to claim 5.

7. The step of covering the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode further includes the step of increasing the distance between the deposition source and the substrate so as to increase the overspray area of the cathode. The method for manufacturing a display panel according to claim 5.

8. The step of covering the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode further includes the step of increasing the distance between the mask and the substrate so as to increase the overspray area of the cathode. The method for manufacturing a display panel according to claim 5.

9. The step of covering the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode includes the step of depositing the cathode by a sputtering method. The method for manufacturing a display panel according to claim 1.

10. The step of covering the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode further includes the step of increasing the distance between the sputtering target and the substrate so as to increase the overspray area of the cathode. The method for manufacturing a display panel according to claim 9.

11. The step of covering the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode further includes the step of increasing the distance between the mask and the substrate so as to increase the overspray area of the cathode. The method for manufacturing a display panel according to claim 9.

12. A machine for manufacturing a display panel that executes the method for manufacturing a display panel according to claim 1, A buffer chamber for transporting and accommodating the substrate, A mask alignment chamber that coats the surface of the substrate so as to align the mask with the substrate; A deposition / sputtering chamber that performs a step of coating the light-emitting layer and a part of the contact pad pattern by depositing the organic electronic functional layer on the substrate, and a step of coating the organic electronic functional layer and the other part of the contact pad pattern by depositing the cathode; A mask separation chamber that removes the mask from the substrate, and includes: A machine for manufacturing a display panel.

13. Further includes a mask rotation chamber, One of the buffer chambers is provided between the mask rotation chamber and the mask alignment chamber and between the mask rotation chamber and the mask separation chamber, The two buffer chambers engage with the mask rotation chamber so as to select an appropriate mask, convey it to the mask alignment chamber, and perform alignment of the mask; The machine for manufacturing a display panel according to claim 12.

14. One of the buffer chambers is further provided near the mask alignment chamber, The buffer chamber receives and accommodates the substrate on which the hole injection layer, the hole transport layer, and the light-emitting layer are printed from the outside of the machine for manufacturing a display panel, and conveys the substrate to the mask alignment chamber to perform alignment of the mask; The machine for manufacturing a display panel according to claim 13.

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