Coating device, coating uniformity correction method and optical device

Abstract

The invention discloses a coating device, a coating uniformity correction method and an optical device. The coating device comprises a coating workpiece disc, a first rotating mechanism, a coating source and a target coating correction plate, the first rotating mechanism is used for driving the coating workpiece disc to rotate; the film coating workpiece disc comprises a film coating surface facing one side of the film coating source; the plurality of substrates are positioned on the coating film surface; the target coating correction plate is positioned between the coating source and the coating workpiece disc; the target coating correction plate comprises a plurality of shielding parts, and the shielding parts are symmetrical about the central axis of the target coating correction plate; the coating source is used for gasifying the coating material, and the target coating correction plate prevents part of the coating material from being deposited on the surface of the substrate. By adopting the technical means, a uniform and compact dielectric film with an approximately rectangular effective area can be plated on the substrate, the film plating uniformity of the substrate is ensured, the product performance is further improved, and the film plating efficiency is high.

Description

Technical Field

[0001] The present invention relates to the field of optical technology, and in particular to a coating device, a coating uniformity correction method, and an optical device. Background Art

[0002] 3D optical parts such as spherical surfaces have numerous uses in optics, electronics, aerospace and other fields due to their unique curved surface structure and performance. In order to achieve good use effects, vacuum coating processing is required. In the coating process, the uniformity of film thickness and the quality of the film layer are crucial. The coating of such optical parts is usually carried out using a planetary mechanism. When the curvature of the coating surface is large, in order to obtain good uniformity, the inclination angle of the planetary disk is generally large, but too large an inclination angle of the planetary disk will often cause the film to become loose, which in turn leads to a decrease in the quality of the film layer. Especially when a planetary disk is loaded with multiple products and uniform coating is required in specific areas of the product, the existing technology cannot achieve the expected coating effect. Summary of the Invention

[0003] The embodiments of the present invention provide a coating device, a coating uniformity correction method, and an optical device to coat a uniform and dense dielectric film in a nearly rectangular effective area on a substrate, thereby ensuring the coating uniformity of the substrate, thereby improving product performance, and having high coating efficiency.

[0004] In a first aspect, an embodiment of the present invention provides a coating device, including a coating workpiece disk, a first rotating mechanism, a coating source, and a target coating correction plate;

[0005] The first rotating mechanism is used to drive the coating workpiece disk to rotate;

[0006] The coating workpiece disk includes a coating surface facing the coating source; a plurality of substrates are located on the coating surface;

[0007] The target film correction plate is located between the film source and the film workpiece disk; the target film correction plate includes a plurality of shielding parts, and the shielding parts are symmetrical about the central axis of the target film correction plate;

[0008] The coating source is used to vaporize the coating material, and the target coating correction plate blocks a portion of the coating material from being deposited on the surface of the substrate.

[0009] Optionally, the coating device further comprises: a coating correction rod;

[0010] The coating correction rod is arranged on the central axis of the target coating correction plate, the plane where the coating correction rod is located is parallel to the reference plane of the coating surface, and the projection of the coating correction rod on the reference plane of the coating surface passes through the center of the coating surface.

[0011] Optionally, a distance H1 between the plane where the coating correction rod is located and the coating surface satisfies: 15 mm ≤ H1 ≤ 20 mm.

[0012] Optionally, a minimum distance H2 between the top of the coating surface of the substrate and the target coating correction rod satisfies: 5mm≤H2≤13mm.

[0013] Optionally, on one side of the central axis of the target coating correction plate, the distance from the outer edge of the shielding portion to the central axis of the target coating correction plate changes periodically, and the amount of the periodic change corresponds to the number of the substrates.

[0014] Optionally, the coating device further includes: a second rotating mechanism;

[0015] The second rotating mechanism includes a rotating shaft and a rotating structure connected thereto; the rotating structure is connected to the first rotating mechanism and is used to drive the coating workpiece disk and the target coating correction plate to rotate around the rotating shaft;

[0016] The plane where the rotating structure is located intersects with the coating surface.

[0017] In a second aspect, an embodiment of the present invention further provides a method for correcting film uniformity, which is applied to the film coating device according to any one of the first aspects. The method for correcting film uniformity includes:

[0018] A coating workpiece disk, a first rotating mechanism, a coating source, and a coating correction rod are provided; the coating workpiece disk includes a coating surface facing the coating source; a plurality of substrates are located on the coating surface; the coating correction rod is located between the coating source and the coating workpiece disk;

[0019] A target coating correction plate is provided; the target coating correction plate is located between the coating source and the coating workpiece disk, and the target coating correction plate includes a plurality of shielding portions, the shielding portions are fixedly disposed on the coating correction rod, and the shielding portions are symmetrical about the central axis of the coating correction rod;

[0020] The substrate is coated according to the target coating correction plate so that the coating thickness of the coating surface of the substrate meets a preset thickness.

[0021] Optional target coating correction plate is available, including:

[0022] Determine a point on the coating correction rod corresponding to the center of the coating surface as a first point;

[0023] determining a plurality of target test points on the coating correction rod;

[0024] Determine a point on the coating correction rod corresponding to an edge test point of the substrate located on a side of the coating surface away from the center of the coating surface as a second point;

[0025] Determining a plurality of concentric circles with the first point as the center; wherein the maximum radius of the plurality of concentric circles is greater than or equal to the distance between the first point and the second point; and the test point is located on a specific concentric circle;

[0026] According to the positions of the concentric circles and the test points, a barrier strip with a preset arc length is arranged on the coating correction rod to form a test coating correction plate;

[0027] Performing a coating test on the substrate through the test coating correction plate, and adjusting the arc length of the blocking bar according to the coating thickness corresponding to each test point to form a target test coating correction plate;

[0028] According to the length of the blocking strip of the target test coating correction plate, the shielding portion of the target coating correction plate is determined to obtain the target coating correction plate.

[0029] Optionally, determining a point corresponding to the center of the coating surface on the coating correction rod as the first point includes:

[0030] Determine the corresponding point on the coating correction rod of the line connecting the center of the coating source and the top ends of the respective circles of substrates located on one side of the center of the coating surface;

[0031] A test bar is arranged at the corresponding point position to form a first coating correction bar;

[0032] Performing a first set of coating tests on the substrate using the first coating correction rod to adjust the test bars to correspond to the top ends of each circle of the substrate to form a second coating correction rod;

[0033] Symmetrically flipping the second coating correction bar and each of the substrates, and performing a second set of coating tests on each of the symmetrically flipped substrates to adjust the test bars to correspond to the top ends of each circle of the symmetrically flipped substrates;

[0034] The first point is determined according to the corresponding point on the coating correction rod of the midpoint between the substrate close to the center of the coating surface before the symmetrical flipping and the substrate close to the center of the coating surface after the symmetrical flipping.

[0035] Optionally, symmetrically flipping the second coating correction rod and the substrate includes:

[0036] The second coating correction rod is symmetrically flipped with the straight line where the center of the coating surface is located as the axis of symmetry; the plane where the axis of symmetry is located is perpendicular to the coating surface, or the second coating correction rod is symmetrically flipped with the corresponding point of the center of the coating surface on the coating correction rod as the center of symmetry.

[0037] Optionally, the concentric circles include a first concentric circle and a second concentric circle that are adjacently arranged;

[0038] The radius R1 of the first concentric circle and the radius R2 of the second concentric circle satisfy: 5 mm ≤ | R1 − R2 | ≤ 8 mm.

[0039] Optionally, determining a plurality of target test points on the coating correction rod includes:

[0040] Determine a plurality of initial test points according to intersections of lines connecting the top of the substrate in each circle and the center of the coating source and the coating correction rod;

[0041] An initial stop bar is set at each of the initial test points to form an initial coating correction bar;

[0042] The substrate is subjected to a coating test according to the initial coating correction rod to adjust the position of each initial stop bar and determine a plurality of target test points.

[0043] In a third aspect, an embodiment of the present invention further provides an optical device, prepared by a coating device as described in any one of the first aspects, wherein the coating surface of the optical device is a part of a spherical surface or an ellipsoidal surface, the optical device includes a coating surface, the coating surface includes multiple coating points, the maximum coating thickness of the coating points is D1, and the minimum coating thickness of the coating points is D2; wherein (D1-D2) / (D1+D2)≤2%.

[0044] The technical solution provided by the embodiment of the present invention is that a plurality of substrates are located on the coating surface of the coating workpiece disk and are evenly arranged on the coating surface. The target coating correction plate is located between the coating source and the coating workpiece disk, so that during the coating process, the target coating correction plate can block the coating material from being deposited on the surface of the substrate. The target coating correction plate includes a plurality of shielding portions, and the shielding portions are symmetrical about the central axis of the target coating correction plate. In this way, the target coating correction plate blocks part of the coating material after being vaporized by the coating source from being deposited on the surface of the substrate, thereby enabling coating on the surface of the substrate and ensuring the uniformity of the coating, thereby improving the performance of the optical device and achieving high coating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A schematic structural diagram of a film coating device provided by an embodiment of the present invention;

[0046] Figure 2A schematic top view of a target coating correction plate provided by an embodiment of the present invention;

[0047] Figure 3 A schematic side view of a substrate provided in an embodiment of the present invention;

[0048] Figure 4 A schematic top view of a substrate provided in an embodiment of the present invention;

[0049] Figure 5 A schematic flow chart of a first method for correcting coating uniformity provided by an embodiment of the present invention;

[0050] Figure 6 A schematic flow chart of a second method for correcting coating uniformity provided by an embodiment of the present invention;

[0051] Figure 7 A schematic diagram of concentric circles provided by an embodiment of the present invention;

[0052] Figure 8 A schematic diagram of a test coating correction plate provided by an embodiment of the present invention;

[0053] Figure 9 A simulation schematic diagram of a target coating correction plate provided by an embodiment of the present invention;

[0054] Figure 10 A schematic flow chart of a third method for correcting coating uniformity provided by an embodiment of the present invention;

[0055] Figure 11 A schematic structural diagram of a first coating correction rod provided by an embodiment of the present invention;

[0056] Figure 12 A schematic diagram of the structure of a second coating correction rod after symmetrically flipping provided by an embodiment of the present invention;

[0057] Figure 13 A side view of the arrangement of substrates on a coating workpiece disk is provided for an embodiment of the present invention. DETAILED DESCRIPTION

[0058] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0059] Before introducing the technical solutions of the embodiments of the present invention in detail, the chip packaging structure in the prior art is first described.

[0060] Figure 1A schematic structural diagram of a film coating device provided by an embodiment of the present invention is shown in FIG. Figure 2 A schematic top view of a target coating correction plate provided by an embodiment of the present invention is shown as follows: Figure 1 and Figure 2 As shown, the coating device includes a coating workpiece disk 10, a first rotating mechanism 20, a coating source 30 and a target coating correction plate 40; the first rotating mechanism 20 is used to drive the coating workpiece disk 10 to rotate; the coating workpiece disk 10 includes a coating surface 101 facing the coating source 30; a plurality of substrates 50 are located on the coating surface 101; the target coating correction plate 40 is located between the coating source 30 and the coating workpiece disk 10; the target coating correction plate 40 includes a plurality of shielding portions 401, and the shielding portions 401 are symmetrical about the central axis M of the target coating correction plate 40; the coating source 30 is used to vaporize the coating material, and the target coating correction plate 40 blocks part of the coating material from being deposited on the surface of the substrate 50.

[0061] Specifically, the coating workpiece disk 10 includes a coating surface 101 facing the coating source 30, and a plurality of substrates 50 can be arranged in an array on the coating surface 101. For ease of presentation, Figure 1 Only one substrate 50 located on the coating surface 101 is shown. For example, the coating workpiece disk 10 may be a two-stage planetary disk, and the rotation speed of the coating workpiece disk 10 during coating may be 50 rpm.

[0062] Exemplarily, the substrate 50 is in an arc shape, more specifically, a hemispherical optical device.

[0063] Specifically, the first rotating mechanism 20 is a rotation mechanism, which can drive the coating workpiece disk 10 to rotate during the coating process of the substrate 50 , so that the substrate 50 located on the coating surface 101 can rotate along with the coating workpiece disk 10 .

[0064] Specifically, the coating source 30 is used to vaporize the coating material, which is then deposited on the surface of the substrate 50 and the coating surface 101 of the coating workpiece disk 10 not covered by the substrate 50. A target coating correction plate 40 is positioned between the coating source 30 and the coating workpiece disk 10. The target coating correction plate 40 includes a plurality of shielding portions 401, which are symmetrical about the central axis M of the target coating correction plate 40. During the coating process, the target coating correction plate 40 blocks some of the coating material from being deposited on the surface of the substrate 50, thereby ensuring a high degree of coating uniformity on the surface of the substrate 50 and improving the performance of the optical device.

[0065] As a comparative example, in the prior art, a single planetary disk can only carry the constraint of one product, that is, only one substrate can be coated at a time, so the coating efficiency is low. The coating device provided in the embodiment of the present invention can coat multiple substrates on the coating surface at the same time, so the coating efficiency is higher.

[0066] For example, Figure 3 A side view of a substrate provided by an embodiment of the present invention is shown. Figure 4 A schematic top view of a substrate provided in an embodiment of the present invention is shown as follows: Figure 3 and Figure 4 As shown, the diameter D of the substrate 50 can be 53.3 mm, the convex surface curvature radius R3 can be 54.08 mm, and the concave surface curvature radius R4 can be 40.74 mm. Ultimately, a uniform dielectric film with a nearly rectangular effective area of approximately 53 mm by 35 mm can be deposited on the convex surface to achieve the functions of the optical device. It should be noted that substrates 50 having other parameters can also be used in embodiments of the present invention, and the parameters of the substrate 50 are not specifically limited in the embodiments of the present invention.

[0067] For example, the substrate 50 may be made of heavy flint glass, which has a relatively high refractive index and dispersion characteristics. At a wavelength of 550 nanometers, the refractive index of the material is 1.80.

[0068] In the coating device provided by an embodiment of the present invention, a plurality of substrates are located on the coating surface of the coating workpiece disk and are evenly arranged on the coating surface. A target coating correction plate is located between the coating source and the coating workpiece disk, so that during the coating process, the target coating correction plate can block the coating material from being deposited on the surface of the substrate. The target coating correction plate includes a plurality of shielding portions, and the shielding portions are symmetrical about the central axis of the target coating correction plate. In this way, the target coating correction plate blocks part of the coating material after being vaporized by the coating source from being deposited on the surface of the substrate, thereby enabling coating on the surface of the substrate and ensuring the uniformity of the coating, thereby improving the performance of the optical device and achieving high coating efficiency.

[0069] Optional, continue to refer to Figure 1 and Figure 2 The coating device also includes: a coating correction rod 60; the coating correction rod 60 is arranged on the central axis of the target coating correction plate 40, the plane where the coating correction rod 60 is located is parallel to the reference plane of the coating surface 101, and the projection of the coating correction rod 60 on the reference plane of the coating surface 101 passes through the center of the coating surface 101.

[0070] Specifically, the coating correction rod 60 is used to secure the blocking portion 401 to form the target coating correction plate 40. The plane on which the coating correction rod 60 lies is parallel to the reference plane of the coating surface 101. The reference plane of the coating surface 101 can be understood as the surface covered by the multiple substrates 50, i.e., the surface of the secondary planetary disk near the coating source 30. The projection of the coating correction rod 60 on the reference plane of the coating surface 101 passes through the center of the coating surface 101. In other words, the projection of the coating correction rod 60 on the reference plane of the coating surface 101 forms a rectangular virtual image of the coating correction rod. This rectangular virtual image passes through the center of the coating surface 101. This ensures that the coating correction rod 60 is aligned with the center of the coating surface 101, thereby ensuring that the target coating correction plate 40 effectively blocks the coating material, thereby ensuring coating uniformity.

[0071] Optional, continue to refer to Figure 1 The distance H1 between the plane where the coating correction rod 60 is located and the coating surface 101 satisfies: 15mm≤H1≤20mm.

[0072] For example, when H1 is less than 15 mm, it indicates that the distance between the plane where the coating correction rod 60 is located and the coating surface 101 is small, which in turn causes the distance between the plane where the coating correction rod 60 is located and the top of the coating surface of the substrate 50 to be small. In this way, the degree of freedom in setting the gear bar on the coating correction rod 60 is small, and the adjustable range of the gear bar is small, and thus, it is impossible to plate a uniform and dense dielectric film in a nearly rectangular effective area on the surface of the substrate 50.

[0073] For example, when H1>20mm, it means that the distance between the plane where the coating correction rod 60 is located and the coating surface 101 is large, which will cause the distance between the plane where the coating correction rod 60 is located and the top of the coating surface of the substrate 50 to be large. In this way, the freedom of setting the gear bar on the coating correction rod 60 is large, and the gear bar can be adjusted in a large range, but a wider gear bar needs to be set on the coating correction rod 60, and thus a uniform and dense dielectric film in a nearly rectangular effective area cannot be plated on the surface of the substrate 50.

[0074] Specifically, the embodiment of the present invention sets 15 mm ≤ H1 ≤ 20 mm, indicating that the distance between the plane where the coating correction rod 60 is located and the coating surface 101 is moderate, which is conducive to ensuring the blocking effect of the target coating correction plate 40 on part of the coating material, and then coating a uniform and dense dielectric film in a nearly rectangular effective area on the surface of the substrate 50, thereby ensuring the optical performance of the substrate 50.

[0075] Exemplarily, H1 = 18.3 mm.

[0076] Optional, continue to refer to Figure 1The minimum distance H2 between the top of the coating surface of the substrate 50 and the target coating correction rod 60 satisfies: 5mm≤H2≤13mm.

[0077] For example, when H2 is less than 5 mm, it indicates that the minimum distance between the top of the coating surface of the substrate 50 and the target coating correction rod 60 is small. Thus, the freedom in setting the gear bar on the coating correction rod 60 is small, and the adjustable range of the gear bar is small, and the coating effect cannot be achieved.

[0078] For example, when H2>13mm, it means that the minimum distance between the top of the coating surface of the substrate 50 and the target coating correction rod 60 is larger. In this way, the freedom of setting the gear bar on the coating correction rod 60 is greater, and the gear bar can be adjusted in a larger range. However, it is necessary to set a wider gear bar on the coating correction rod 60, and the thickness of the coating material deposited on the surface of the substrate 50 is uneven, which will affect the optical performance of the substrate 50.

[0079] Specifically, the embodiment of the present invention sets 5mm≤H2≤13mm, and the minimum distance between the top of the coating surface of the substrate 50 and the target coating correction rod 60 is moderate, which can ensure the shielding effect of the shielding portion 401 set on the target coating correction rod 60 on the coating material, and then coat a uniform and dense dielectric film in a nearly rectangular effective area on the surface of the substrate 50, thereby improving the optical performance of the substrate 50.

[0080] Exemplarily, 5mm≤H2≤10mm.

[0081] Optional, continue to refer to Figure 1 and Figure 2 On one side of the central axis M of the target coating correction plate 60, the distance from the outer edge of the shielding portion 401 to the central axis M of the target coating correction plate 60 changes periodically, and the number of periodic changes corresponds to the number of substrates.

[0082] Specifically, the distance between the outer edge of each shielding portion 401 and the central axis M of the target coating correction plate 60 may be different. The distance between the outer edge of each shielding portion 401 and the central axis M of the target coating correction plate 60 can be understood as half of the entire shielding portion 401. Exemplarily, half of each shielding portion 401 can be one period, corresponding to one substrate 50. Exemplarily, half of each shielding portion 401 can be multiple periods, corresponding to two or even multiple substrates 50.

[0083] Optional, continue to refer to Figure 1The coating device also includes: a second rotating mechanism 70; the second rotating mechanism 70 includes a rotating shaft 701 and a rotating structure 702 that are connected; the rotating structure 702 is connected to the first rotating mechanism 20, and is used to drive the coating workpiece disk 10 and the target coating correction plate 40 to rotate around the rotating shaft 701; the plane where the rotating structure 702 is located intersects with the coating surface 101.

[0084] Specifically, the second rotating mechanism 70 can be understood as a revolution mechanism. The first rotating mechanism 20 can revolve around the rotation axis 701 while rotating on its own. That is, the rotating structure 702 drives the coating workpiece disk 10 and the target coating correction plate 40 to rotate around the rotation axis 701, and then the substrate 50 can also rotate around the rotation axis 701, thereby ensuring that the thickness of the surface coating material of the substrate 50 is better uniform, which is beneficial to ensuring the performance of the optical device.

[0085] For example, the angle between the plane where the rotating structure 702 is located and the coating surface 101 may be 50° to ensure the coating effect on the surface of the substrate 50 .

[0086] In summary, the coating device provided in the embodiment of the present invention can realize coating on the surface of the substrate by setting a coating workpiece disk, a first rotating mechanism, a coating source, a target coating correction plate, a coating correction rod and a second rotating mechanism, and can ensure the uniformity of the coating, thereby improving the performance of the optical device, and the coating efficiency is high.

[0087] Based on the same inventive concept, an embodiment of the present invention further provides a method for correcting coating uniformity. Figure 5 A schematic flow chart of a first method for correcting coating uniformity provided by an embodiment of the present invention is shown in FIG. Figure 5 As shown, the coating uniformity correction method includes:

[0088] S101, provide a coating workpiece disk, a first rotating mechanism, a coating source and a coating correction rod; the coating workpiece disk includes a coating surface facing the coating source; multiple substrates are located on the coating surface; the coating correction rod is located between the coating source and the coating workpiece disk.

[0089] For details, please refer to Figure 1 and Figure 2 The coating workpiece tray 10, the first rotating mechanism 20, and the coating source 30 are arranged in the coating chamber. Multiple substrates 50 are placed on the coating surface 101. The multiple substrates 50 can be arranged in an array on the coating surface 101. Furthermore, a coating correction rod 60 is fixed to the first rotating mechanism 20 and positioned between the coating source 30 and the coating workpiece tray 10.

[0090] S102. Provide a target coating correction plate; the target coating correction plate is located between the coating source and the coating workpiece disk, and the target coating correction plate includes a plurality of shielding parts, the shielding parts are fixedly arranged on the coating correction rod, and the shielding parts are symmetrical about the central axis of the coating correction rod.

[0091] For details, please refer to Figure 1 and Figure 2 The target coating correction plate 40 is located between the coating source 30 and the coating workpiece disk 10. The target coating correction plate 40 includes a plurality of shielding portions 401, and the shielding portions 401 are symmetrical about the central axis M of the target coating correction plate 40. In this way, during the coating process, the target coating correction plate 40 can block part of the coating material from being deposited on the surface of the substrate 50, thereby ensuring a high coating uniformity on the surface of the substrate 50, thereby improving the performance of the optical device.

[0092] S103 , coating the substrate according to the target coating correction plate, so that the coating thickness of the coating surface of the substrate meets a preset thickness.

[0093] Specifically, the preset thickness can be understood as a thickness set according to the optical performance of the substrate.

[0094] For details, please refer to Figure 1 and Figure 2 The coating source 30 can vaporize the coating material, and the target coating correction plate 40 blocks part of the coating material from being deposited on the surface of the substrate 50, so that the thickness of each position within the coating surface of the substrate is approximately equal, that is, the thickness of each position within the coating surface is approximately equal to the preset thickness, which can ensure the uniformity of the coating, thereby improving the performance of the optical device and having high coating efficiency.

[0095] The coating uniformity correction method provided in an embodiment of the present invention coats a substrate according to a target coating correction plate so that the coating thickness of the coating surface of the substrate meets a preset thickness, thereby ensuring the uniformity of the coating and thereby improving the performance of the optical device, and having high coating efficiency.

[0096] Optional, Figure 6 A schematic flow chart of a second method for correcting coating uniformity provided by an embodiment of the present invention is provided. Figure 6 Based on the above embodiment, the operation of providing the target coating correction plate is described in detail. Figure 6 As shown, the coating uniformity correction method includes:

[0097] S201, provide a coating workpiece disk, a first rotating mechanism, a coating source and a coating correction rod; the coating workpiece disk includes a coating surface facing the coating source; multiple substrates are located on the coating surface; the coating correction rod is located between the coating source and the coating workpiece disk.

[0098] S202: Determine the corresponding point of the center of the coating surface on the coating correction rod as the first point.

[0099] Specifically, the center of the coating surface can be understood as the center of the coating surface of the secondary planetary disk. The first point can be understood as being located on the coating correction rod and corresponding to the center of the coating surface.

[0100] Specifically, the center of the circle can be determined by setting the first point, so that a shielding portion can be set on the coating correction rod to form a target coating correction plate.

[0101] S203: Determine multiple target test points on the coating correction rod.

[0102] Specifically, multiple initial test points are determined based on the intersection of the line connecting the top of each circle of substrates and the center of the coating source and the coating correction rod; an initial gear bar is set at the position of each initial test point to form an initial coating correction rod; and a coating test is performed on the substrate according to the initial coating correction rod to adjust the position of each initial gear bar and determine multiple target test points.

[0103] Specifically, the center of the coating source can be understood as the center of the upper surface of the coating source.

[0104] Continue to refer Figure 1 Taking each circle of substrates 50 as an example, a line segment a is formed by connecting the top of each circle of substrates 50 with the center of the coating source 30. The intersection of line segment a and the coating correction rod 60 can be determined as an initial test point A. Similarly, multiple initial test points are determined for the intersection of the line connecting the top of each circle of substrates with the center of the coating source and the coating correction rod. Initial stop bars are set at the positions of the multiple initial test points to form initial coating correction rods. Coating tests are performed on the substrates 50 according to the initial coating correction rods to adjust the positions of the initial stop bars so that the initial stop bars correspond to the top of each circle of substrates. The positions corresponding to the adjusted stop bars are then determined as target test points.

[0105] It should be noted that, since the second rotating mechanism 70 drives the coating workpiece disk 10 to rotate around the rotating axis 701, during the revolution, the top of the substrate 50 is connected to the center of the closest coating source 30. Figure 1 When the coating workpiece disk 10 is located above the coating source 30 on the right, a line is drawn between the top of the substrate 50 and the center of the coating source 30 on the right to determine the initial test point.

[0106] S204 , determining a corresponding point on the coating correction rod of an edge test point of the substrate located on a side of the coating surface away from the center of the coating surface as a second point.

[0107] Specifically, the second point can be understood as the intersection of the coating correction rod and the line connecting the edge test point of the substrate located on the outermost circle and the center of the coating source.

[0108] Specifically, Figure 7 A schematic diagram of concentric circles provided in an embodiment of the present invention, further reference is made to Figure 1 and Figure 7 The line connecting the edge test point of the substrate 50 located at the outermost edge of the coating surface 101, which is away from the center of the coating surface 101, and the center of the coating source is b, and the intersection of the line segment b and the coating correction rod 60 is the second point B, so that multiple concentric circles can be determined based on the first point and the second point.

[0109] It should be noted that before determining the second point B, a test bar is first set at the intersection of line segment b and the coating correction rod 60, and a coating test is performed. The position of the bar is adjusted according to the coating test results until the position of the bar corresponds to the edge test point, and then the position corresponding to the adjusted bar is determined as the second point.

[0110] It should also be noted that the first point can be used as the center of the concentric circles, and the second point can be used as the point through which the outermost circle of the concentric circles passes.

[0111] S205 , determining a plurality of concentric circles with the first point as the center; the maximum radius of the plurality of concentric circles is greater than or equal to the distance between the first point and the second point; and the test point is located on a specific concentric circle.

[0112] For details, please refer to Figure 1 and Figure 7 , multiple concentric circles are determined with the first point A as the center, and the maximum radius of the multiple concentric circles, that is, the maximum radius corresponding to the outermost concentric circle, is greater than or equal to the distance between the first point A and the second point B.

[0113] The test points are located on specific concentric circles, that is, each concentric circle corresponds to a test point. In other words, each test point on the coating correction rod corresponds to a concentric circle, that is, the concentric circles and test points correspond one to one.

[0114] It should be noted that the maximum radius of the concentric circles does not exceed the radius of the coating workpiece disk.

[0115] Optional, continue to refer to Figure 7 The concentric circles include a first concentric circle 100 and a second concentric circle 200 that are adjacently arranged; the radius R1 of the first concentric circle 100 and the radius R2 of the second concentric circle 200 satisfy: 5mm≤|R1-R2|≤8mm.

[0116] Specifically, the concentric circles may be equidistant concentric circles, that is, the distance between any two connected concentric circles is equal.

[0117] Specifically, it is not the case that the denser the test points are, the better. The radius R1 of the first concentric circle 100 and the radius R2 of the second concentric circle 200 satisfy: 5mm≤|R1-R2|≤8mm, that is, the difference between the radii of two adjacent concentric circles satisfies: 5mm≤|R1-R2|≤8mm. This can ensure that the spacing between any two adjacent concentric circles is moderate, so that after the subsequent coating according to the equidistantly spaced fan-shaped concentric circle annular strips can be observed, obvious color difference positions can be observed on the substrate.

[0118] It should be noted that the difference in radius between adjacent equidistant concentric circles depends on the number of measurement points in the substrate diameter direction (the same direction as the radius of the coating workpiece disk).

[0119] It should also be noted that, continue to refer to Figure 1 Since the plane where the coating correction rod 60 is located is parallel to the coating workpiece disk 10, the evaporation angle within each circle of the substrate 50 on the coating surface 101 is the same as the angle within the corresponding coating correction rod 60, that is, the angle POB is equal to the angle NOM. In the two-dimensional graph, the same triangle is a parallel line with the same angle, that is, the triangle OPB and the triangle ONM are an approximate triangle. Therefore, the radius difference of each equidistant concentric circle drawn on the coating correction rod 60 should be slightly smaller than the spacing distance of the equidistant measurement points on the substrate 50.

[0120] For example, if you want to take 10 measurement points in the diameter direction on a 53 mm substrate, you can set the radius difference of the equidistant concentric circles to 5 mm, and each measurement point corresponds to a circle of equidistant concentric rings on the coating correction rod.

[0121] S206 , setting a barrier strip with a preset arc length on the coating correction rod according to the concentric circles and the positions of the test points to form a test coating correction plate.

[0122] Specifically, Figure 8 A schematic diagram of a test coating correction plate provided by an embodiment of the present invention, referring to Figure 7 and Figure 8 As shown, a barrier strip 300 with a preset arc length is provided on the coating correction rod 60 according to the concentric circles and the positions of the test points, that is, a preset sector angle θ can be intercepted in the concentric circles to form a test coating correction plate.

[0123] It should be noted that there is a corresponding relationship between the preset sector angle θ and the preset arc length of the barrier bar. The larger the preset sector angle θ, the longer the preset arc length; the smaller the preset sector angle θ, the shorter the preset arc length. The preset sector angle θ can be manually set, and the preset arc length can be determined based on the preset sector angle θ.

[0124] For example, the preset sector angle θ may be 60°, and the corresponding preset arc length may be 1 / 6 of the circumference of each concentric circle; the preset sector angle θ may be 45°, and the corresponding preset arc length may be 1 / 8 of the circumference of each concentric circle.

[0125] S207 , performing a coating test on the substrate by using the test coating correction plate, and adjusting the arc length of the blocking bar according to the coating thickness corresponding to each test point to form a target test coating correction plate.

[0126] Specifically, a coating test is performed on a substrate using a test coating correction plate. The predetermined fan angle θ is adjusted based on the coating thickness corresponding to each test point compared with a preset thickness. If the coating thickness corresponding to the test point is too thick, the fan angle θ is decreased, correspondingly reducing the arc length of the stop bar. Conversely, if the coating thickness corresponding to the test point is too thin, the fan angle θ is increased, correspondingly increasing the arc length of the stop bar, until the coating thickness corresponding to the test point equals the preset thickness. This results in a target arc length and a target test coating correction plate.

[0127] It should be noted that the preset thickness may be a film thickness that can ensure the optical performance of the substrate.

[0128] For example, continue to refer to Figure 8 , obvious color difference can be observed on the substrate 50. The position where the film thickness is relatively thick on the substrate 50, that is, the area 400 corresponds to the position not blocked by the barrier bar. This position appears yellow on the actual substrate 50. In this way, the arc length of the barrier bar can be adjusted at the position corresponding to the yellow area.

[0129] S208: Determine the shielding portions of the target coating correction plate based on the length of the barrier strip of the target test coating correction plate to obtain the target coating correction plate. The target coating correction plate is positioned between the coating source and the coating workpiece disk and includes a plurality of shielding portions fixedly mounted on a coating correction rod and symmetrically arranged about the central axis of the coating correction rod.

[0130] Specifically, when the coating thickness corresponding to the test point is equal to the preset thickness, the corresponding target sector angle θ is determined, and then the corresponding target arc length is determined. The target coating correction plate can be obtained by setting the shielding portion according to the target arc length. Figure 9 A simulation diagram of a target coating correction plate provided by an embodiment of the present invention is shown in FIG. Figure 9 As shown, the adjacent equidistant concentric rings after adjusting the sector angles are connected in sequence, and the test and adjustment are carried out one by one according to the measurement results to draw the final Figure 2 The target coating correction plate shown is used to coat the substrate according to the target coating correction plate so that the coating thickness of the coating surface of the substrate meets the preset thickness, that is, a uniform and dense dielectric film can be coated on the substrate in a nearly rectangular effective area, thereby improving the optical performance of the substrate.

[0131] S209 , coating the substrate according to the target coating correction plate, so that the coating thickness of the coating surface of the substrate meets a preset thickness.

[0132] The coating uniformity correction method provided by an embodiment of the present invention determines multiple concentric circles with a first point as the center, and sets a baffle with a preset arc length on a coating correction rod according to the positions of the concentric circles and test points to form a test coating correction plate. The substrate is subjected to a coating test using the test coating correction plate, and the arc length of the baffle is adjusted according to the coating thickness corresponding to each test point to form a target test coating correction plate. According to the length of the baffle of the target test coating correction plate, the shielding portion of the target coating correction plate is determined to obtain the target coating correction plate. In this way, it can be ensured that a uniform and dense dielectric film is deposited in a nearly rectangular effective area on the substrate, thereby improving the optical performance of the substrate.

[0133] Optional, Figure 10 A schematic flow chart of a third method for correcting coating uniformity provided by an embodiment of the present invention is provided. Figure 10 Based on the above embodiment, the operation of determining the corresponding point of the center of the coating surface on the coating correction rod as the first point is described in detail. Figure 10 As shown, the coating uniformity correction method includes:

[0134] S301, provide a coating workpiece disk, a first rotating mechanism, a coating source and a coating correction rod; the coating workpiece disk includes a coating surface facing the coating source; multiple substrates are located on the coating surface; the coating correction rod is located between the coating source and the coating workpiece disk.

[0135] S302, determining corresponding points on the coating correction rod of a line connecting the center of the coating source and the top ends of the respective circles of substrates located on one side of the center of the coating surface.

[0136] Specifically, a line is drawn between the center of the coating source and the top of each circle of substrates, and the intersection of this line segment and the coating correction rod is a corresponding point. Each time the line is drawn, a corresponding point can be formed on the coating correction rod.

[0137] S303: Setting a test bar at the corresponding point position to form a first coating correction bar.

[0138] Specifically, Figure 11 A schematic structural diagram of a first coating correction rod provided by an embodiment of the present invention is shown in FIG. Figure 11 As shown, test bars are positioned at corresponding points, that is, bars are positioned at corresponding points on the coating correction rod, with the plane of the bars parallel to the coating surface. For example, taking corresponding points A1, A2, and A3 as examples, the test bars corresponding to the three corresponding points are a1, a2, and a3, respectively. The three test bars are fixedly mounted on the first coating correction rod 60 to form the first coating correction rod.

[0139] S304 , performing a first set of coating tests on the substrates according to the first coating correction rod, so as to adjust the test bars to correspond to the top ends of the respective circles of substrates, thereby forming a second coating correction rod.

[0140] Specifically, the first set of coating tests is performed on the substrate according to the first coating correction rod. Since there is obstruction at the position corresponding to the test bar on the substrate and the film thickness is thin, there will be obvious color difference. Therefore, according to the color difference of the appearance of the substrate plated with the test bar, the position of the test bar is continued to be adjusted for testing until all circles of test bars are adjusted to the position corresponding to the top of the substrate, forming a second coating correction rod.

[0141] S305 , symmetrically flipping the second coating correction bar and each substrate, and performing a second set of coating tests on each substrate after the symmetrical flipping, so as to adjust the test bar to correspond to the top of each circle of substrates after the symmetrical flipping.

[0142] For details, please refer to Figure 1 As a feasible implementation method, the second coating correction rod is symmetrically flipped with the straight line W where the center of the coating surface is located as the symmetry axis; the plane where the symmetry axis is located is perpendicular to the coating surface, that is, the symmetry axis passes through the center of the coating surface and is perpendicular to the coating surface. In this way, the second coating correction rod is flipped along the symmetry axis to perform a second coating test.

[0143] Specifically, Figure 12 A schematic diagram of the structure of a second coating correction rod after symmetrically flipping is provided in an embodiment of the present invention, as shown in FIG. Figure 12 As shown, after the positions of the test bars are determined, the other end of each circle is flipped as a whole, that is, the second coating correction rod is flipped symmetrically, and the substrates on the coating surface are flipped symmetrically, and the coating test is performed again until the other end of each circle of test bars is adjusted to correspond to the top position of the substrate. At this time, the test bars are a1', a2' and a3' respectively.

[0144] As another feasible implementation method, the corresponding point of the center of the coating surface on the coating correction rod is used as the symmetry center, and the second coating correction rod is symmetrically flipped. That is, a line is drawn with the center of the coating surface and the center of the coating source, and the intersection of this line segment and the coating correction rod is used as the symmetry center to flip it. The second coating correction rod is symmetrically flipped, and each substrate on the coating surface is symmetrically flipped, and the coating test is performed again until the test bars at the other end are adjusted to correspond to the top position of the substrate.

[0145] S306 , determining a first point according to a corresponding point on the coating correction rod between a midpoint between the substrate near the center of the coating surface before symmetrical flipping and the substrate near the center of the coating surface after symmetrical flipping.

[0146] Specifically, Figure 13The embodiment of the present invention provides a side view of the arrangement of substrates on the coating workpiece disk, such as Figure 13 As shown, the midpoint Z of the line connecting the center of substrate 501 near the center of the coating surface before symmetrical flipping and the center of substrate 502 near the center of the coating surface after symmetrical flipping is determined as the first point on the coating correction rod. In other words, the midpoint of the line connecting the two substrates near the center of the coating surface is determined as the first point. This allows the center of the circle to be determined, allowing multiple concentric circles to be determined based on the first point for subsequent design of the target coating correction plate. Furthermore, the position of the first point determined in this manner is more accurate, thereby improving coating efficiency and accuracy.

[0147] It should be noted that the number of substrates that can be placed on the side view of the coating workpiece disk is an odd number (a substrate is placed alone at the center of the coating workpiece disk, but because it is always blocked by the pole, this substrate is not corrected and is discarded).

[0148] S307: Determine multiple target test points on the coating correction rod.

[0149] S308 , determining a corresponding point on the coating correction rod of an edge test point of the substrate located on a side of the coating surface away from the center of the coating surface as a second point.

[0150] S309 , determining a plurality of concentric circles with the first point as the center; the maximum radius of the plurality of concentric circles is greater than or equal to the distance between the first point and the second point; and the test point is located on a specific concentric circle.

[0151] S310 , setting a barrier strip with a preset arc length on the coating correction rod according to the concentric circles and the positions of the test points to form a test coating correction plate.

[0152] S311 , performing a coating test on the substrate by using a test coating correction plate, and adjusting the arc length of the blocking bar according to the coating thickness corresponding to each test point to form a target test coating correction plate.

[0153] S312: Determine the shielding portions of the target coating correction plate based on the length of the barrier strip of the target test coating correction plate to obtain the target coating correction plate. The target coating correction plate is positioned between the coating source and the coating workpiece disk and includes a plurality of shielding portions fixedly mounted on a coating correction rod and symmetrically arranged about the central axis of the coating correction rod.

[0154] S313 , coating the substrate according to the target coating correction plate so that the coating thickness of the coating surface of the substrate meets a preset thickness.

[0155] The coating uniformity correction method provided by an embodiment of the present invention utilizes a first coating correction rod, a second coating correction rod, and symmetrically flips the second coating correction rod and each substrate. A second set of coating tests is then performed on each substrate after the symmetrical flipping, adjusting the test bar to correspond with the top of each circle of substrates after the symmetrical flipping. The first point is then determined as the corresponding point on the coating correction rod, which is the midpoint between the substrate near the center of the coating surface before the symmetrical flipping and the substrate near the center of the coating surface after the symmetrical flipping. This allows the center of the circle to be determined, allowing multiple concentric circles to be determined based on the first point for subsequent design of target coating correction plates. Furthermore, the position of the first point determined in this manner is more accurate, thereby improving coating efficiency and accuracy.

[0156] Based on the same inventive concept, an embodiment of the present invention further provides an optical device, wherein the coating surface of the optical device is a portion of a spherical surface or an ellipsoidal surface, the optical device includes a coating surface, the coating surface includes multiple coating points, the maximum coating thickness of the coating points is D1, and the minimum coating thickness of the coating points is D2; wherein (D1-D2) / (D1+D2)≤2%.

[0157] Specifically, the optical device can be a 3D substrate, and the coating surface includes multiple coating points. The maximum coating thickness of the coating points is D1, and the minimum coating thickness of the coating points is D2; wherein (D1-D2) / (D1+D2)≤2%, that is, the maximum coating thickness is approximately equal to the minimum coating thickness, which can ensure that the thickness of the coating surface is relatively uniform, thereby improving the optical performance of the optical device.

[0158] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A film coating device, characterized in that: It includes a coating workpiece disk, a first rotating mechanism, a coating source and a target coating correction plate; The first rotating mechanism is used to drive the coating workpiece disk to rotate; The coating workpiece disk includes a coating surface facing the coating source; a plurality of substrates are located on the coating surface; The target film correction plate is located between the film source and the film workpiece disk; the target film correction plate includes a plurality of shielding parts, and the shielding parts are symmetrical about the central axis of the target film correction plate; The coating source is used to vaporize the coating material, and the target coating correction plate blocks a portion of the coating material from being deposited on the surface of the substrate.

2. The coating device according to claim 1, characterized in that The coating device further includes: a coating correction rod; The coating correction rod is arranged on the central axis of the target coating correction plate, the plane where the coating correction rod is located is parallel to the reference plane of the coating surface, and the projection of the coating correction rod on the reference plane of the coating surface passes through the center of the coating surface.

3. The coating device according to claim 1, characterized in that The distance H1 between the plane where the coating correction rod is located and the coating surface satisfies: 15mm≤H1≤20mm.

4. The coating device according to claim 1, characterized in that The minimum distance H2 between the top of the coating surface of the substrate and the target coating correction rod satisfies: 5mm≤H2≤13mm.

5. The coating device according to claim 1, characterized in that: On one side of the central axis of the target coating correction plate, the distance from the outer edge of the shielding portion to the central axis of the target coating correction plate changes periodically, and the number of the periodic changes corresponds to the number of the substrates.

6. The coating device according to claim 1, characterized in that: The coating device further includes: a second rotating mechanism; The second rotating mechanism includes a rotating shaft and a rotating structure connected thereto; the rotating structure is connected to the first rotating mechanism and is used to drive the coating workpiece disk and the target coating correction plate to rotate around the rotating shaft; The plane where the rotating structure is located intersects with the coating surface.

7. A method for correcting coating uniformity, characterized in that: Applied to the coating device according to any one of claims 1 to 6, the coating uniformity correction method comprises: A coating workpiece disk, a first rotating mechanism, a coating source, and a coating correction rod are provided; the coating workpiece disk includes a coating surface facing the coating source; a plurality of substrates are located on the coating surface; the coating correction rod is located between the coating source and the coating workpiece disk; A target coating correction plate is provided; the target coating correction plate is located between the coating source and the coating workpiece disk, and the target coating correction plate includes a plurality of shielding portions, the shielding portions are fixedly disposed on the coating correction rod, and the shielding portions are symmetrical about the central axis of the coating correction rod; The substrate is coated according to the target coating correction plate so that the coating thickness of the coating surface of the substrate meets a preset thickness.

8. The method for correcting coating uniformity according to claim 7, wherein: Provide target coating correction plate, including: Determine a point on the coating correction rod corresponding to the center of the coating surface as a first point; determining a plurality of target test points on the coating correction rod; Determine a point on the coating correction rod corresponding to an edge test point of the substrate located on a side of the coating surface away from the center of the coating surface as a second point; Determining a plurality of concentric circles with the first point as the center; wherein the maximum radius of the plurality of concentric circles is greater than or equal to the distance between the first point and the second point; and the test point is located on a specific concentric circle; According to the positions of the concentric circles and the test points, a barrier strip with a preset arc length is arranged on the coating correction rod to form a test coating correction plate; Performing a coating test on the substrate through the test coating correction plate, and adjusting the arc length of the blocking bar according to the coating thickness corresponding to each test point to form a target test coating correction plate; According to the length of the blocking strip of the target test coating correction plate, the shielding portion of the target coating correction plate is determined to obtain the target coating correction plate.

9. The method for correcting coating uniformity according to claim 8, wherein: Determining a point on the coating correction rod corresponding to the center of the coating surface as a first point includes: Determine the corresponding point on the coating correction rod of the line connecting the center of the coating source and the top ends of the respective circles of the substrates located on one side of the center of the coating surface; A test bar is arranged at the corresponding point position to form a first coating correction bar; Performing a first set of coating tests on the substrate using the first coating correction rod to adjust the test bars to correspond to the top ends of each circle of the substrate to form a second coating correction rod; Symmetrically flipping the second coating correction bar and each of the substrates, and performing a second set of coating tests on each of the symmetrically flipped substrates to adjust the test bars to correspond to the top ends of each circle of the symmetrically flipped substrates; The first point is determined according to the corresponding point on the coating correction rod of the midpoint between the substrate close to the center of the coating surface before the symmetrical flipping and the substrate close to the center of the coating surface after the symmetrical flipping.

10. The method for correcting coating uniformity according to claim 9, wherein: Symmetrically flipping the second coating correction rod and the substrate, comprising: The second coating correction rod is symmetrically flipped with the straight line where the center of the coating surface is located as the axis of symmetry; the plane where the axis of symmetry is located is perpendicular to the coating surface, or the second coating correction rod is symmetrically flipped with the corresponding point of the center of the coating surface on the coating correction rod as the center of symmetry.

11. The method for correcting coating uniformity according to claim 8, wherein: The concentric circles include a first concentric circle and a second concentric circle that are adjacently arranged; The radius R1 of the first concentric circle and the radius R2 of the second concentric circle satisfy: 5 mm ≤ | R1 − R2 | ≤ 8 mm.

12. The method for correcting coating uniformity according to claim 8, wherein: Determine a plurality of target test points on the coating correction rod, including: Determine a plurality of initial test points according to intersections of lines connecting the top of the substrate in each circle and the center of the coating source and the coating correction rod; An initial stop bar is set at each of the initial test points to form an initial coating correction bar; The substrate is subjected to a coating test according to the initial coating correction rod to adjust the position of each initial stop bar and determine a plurality of target test points.

13. An optical device, characterized in that: Prepared by the coating device according to any one of claims 1 to 6, the coating surface of the optical device is a portion of a spherical surface or an ellipsoidal surface, the coating surface includes multiple coating points, the maximum coating thickness at the coating points is D1, and the minimum coating thickness at the coating points is D2; wherein (D1-D2) / (D1+D2)≤2%.

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