Light source device

Abstract

To provide a light source device having a package structure capable of achieving both retention of airtightness and active alignment.SOLUTION: A light source device 1 includes: a base body 3 having a support portion 10 and a frame 20 provided on the support portion 10; a lid 4 fixed in close contact with the frame 20 via a sealing material 7; and a semiconductor laser element 2 disposed in a sealing space 1a formed by the lid 4, the base body 3, and the sealing material 7, wherein the lid 4 includes an optical element 4a that imparts an optical effect to laser light emitted from the semiconductor laser element 2, and the lid body 4 and the frame body 20 are joined via a joining material 8 on the opposite side of the sealing material 7 from the sealing space 1a side.SELECTED DRAWING: Figure 1B

Description

[Technical Field]

[0001] The present disclosure relates to a light source device including a semiconductor laser element. [Background technology]

[0002] Semiconductor laser elements have advantages such as long life, high efficiency, and small size, and are therefore used as light sources for a variety of products such as projectors, optical discs, vehicle headlamps, lighting devices, laser processing devices, etc. In recent years, research and development has been progressing on nitride-based semiconductor laser elements that cover wavelength bands from ultraviolet to blue.

[0003] A semiconductor laser element is packaged as a light source device and mounted in various products. Specifically, the light source device includes a semiconductor laser element and a package that houses the semiconductor laser element. Conventionally, as this type of light source device, a light source device that includes a package in which the semiconductor laser element is hermetically sealed is known (for example, Patent Document 1).

[0004] In the light source device disclosed in Patent Document 1, a coating made of ethylene-polyvinyl alcohol copolymer (EVOH) is used to hermetically seal the package. EVOH is a resin material with excellent gas barrier properties. Therefore, even if volatile organic gases are generated from components present in the internal space of the package, the coating made of EVOH can prevent the volatile organic gases from leaking out of the package to the outside. Conversely, the coating made of EVOH can also prevent low-molecular-weight siloxanes or volatile organic gases present outside the light source device (in the atmosphere) from entering the internal space of the package. In this way, the use of EVOH makes it possible to hermetically seal the internal space of the package containing the semiconductor laser element. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-38819 Summary of the Invention [Problem to be solved by the invention]

[0006] Known packages for housing semiconductor laser elements include, for example, a metal housing having an opening such as a frame, a light-transmitting optical member that covers the opening of the housing, and a metal support that supports the housing. For example, a TO-CAN package includes a metal cap that serves as the housing, a metal stem base that serves as the support, and a glass plate that is arranged to cover the opening of the cap.

[0007] In such a package, the housing to which the optical element is attached and the support are fixed by resistance welding. For example, when a frame is used as the housing, the connection between the frame to which the optical element is attached and the support is joined by resistance welding, thereby fixing the frame and the support.

[0008] In this case, if an optical member having a lens function is used as the optical member attached to the frame, it is necessary to align the optical member with the semiconductor laser element. Specifically, the optical member and the semiconductor laser element are aligned so that the laser light emitted from the semiconductor laser element passes through the optical axis of the optical member.

[0009] For the alignment of the optical member and the semiconductor laser element, active alignment is sometimes used, in which the alignment between the semiconductor laser element and the optical member is performed while the semiconductor laser element is driven to emit laser light.

[0010] However, with the package structure of conventional light source devices, it is difficult to perform active alignment while ensuring airtightness. In other words, in conventional light source devices, maintaining the airtightness of the package and performing active alignment must be separated, making it difficult to achieve both maintaining the airtightness of the package and performing active alignment.

[0011] The present disclosure has been made to solve such problems, and has an object to provide a light source device having a package structure that can achieve both airtightness and active alignment. [Means for solving the problem]

[0012] In order to achieve the above object, one aspect of a light source device according to the present disclosure includes a base having a support and a frame provided on the support, a lid that is tightly attached to the frame via a sealing material, and a nitride-based semiconductor laser element that is placed in a sealed space formed by the lid, the base, and the sealing material, wherein the lid includes an optical element that imparts an optical effect to laser light emitted from the nitride-based semiconductor laser element, and the lid and the frame are joined together via a bonding material on the side of the sealing material opposite to the sealed space. [Effects of the Invention]

[0013] According to the present disclosure, it is possible to realize a light source device having a package structure that can maintain airtightness and achieve active alignment at the same time. [Brief explanation of the drawings]

[0014] [Figure 1A] FIG. 1A is a top view of a light source device according to Embodiment 1. FIG. [Figure 1B] FIG. 1B is a cross-sectional view of the light source device according to the first embodiment. [Figure 2] FIG. 2 is a top view of the light source device according to the first embodiment when the lid and the bonding material are omitted. [Figure 3] FIG. 3 is a diagram for explaining a method of manufacturing the light source device according to the first embodiment. [Figure 4A] FIG. 4A is a top view of the light source device according to the second embodiment. [Figure 4B] FIG. 4B is a cross-sectional view of the light source device according to the second embodiment. [Figure 5A] FIG. 5A is a top view of the light source device according to the third embodiment. [Figure 5B] FIG. 5B is a cross-sectional view of the light source device according to the third embodiment. [Figure 6A] FIG. 6A is a top view of the light source device according to the fourth embodiment. [Figure 6B] FIG. 6B is a cross-sectional view of the light source device according to the fourth embodiment. [Figure 7A] FIG. 7A is a top view of the light source device according to the fifth embodiment. [Figure 7B] FIG. 7B is a cross-sectional view of the light source device according to the fifth embodiment. [Figure 8] FIG. 8 is a top view of the light source device according to the fifth embodiment when the lid and the bonding material are omitted. [Figure 9] FIG. 9 is a cross-sectional view of a light source device according to a modification of the fifth embodiment. [Figure 10] FIG. 10 is a cross-sectional view of a light source device according to the sixth embodiment. [Figure 11] FIG. 11 is a diagram illustrating a method for manufacturing a light source device according to the sixth embodiment. [Figure 12] FIG. 12 is a cross-sectional view of a light source device according to a modification of the sixth embodiment. [Figure 13] FIG. 13 is a cross-sectional view of a light source device according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that each of the embodiments described below represents a specific example of the present disclosure. Therefore, the numerical values, shapes, materials, components, the arrangement and connection of the components, steps (processes), and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Therefore, among the components in the following embodiments, components that are not described in the independent claims that represent the superordinate concept of the present disclosure will be described as optional components.

[0016] Furthermore, each figure is a schematic diagram and is not necessarily an exact illustration. Therefore, the scales and the like do not necessarily match in each figure. In each figure, the same reference numerals are used to denote substantially the same components, and redundant explanations will be omitted or simplified.

[0017] (Embodiment 1) First, the configuration of light source device 1 according to embodiment 1 will be described with reference to FIGS. 1A, 1B, and 2. FIG. 1A is a top view of light source device 1 according to embodiment 1. FIG. 1B is a cross-sectional view of light source device 1. FIG. 2 is a top view of light source device 1 without lid body 4 and bonding material 8. That is, FIG. 2 shows light source device 1 with bonding material 8 and lid body 4 removed. Note that in the plan views of FIGS. 1A and 2, the same members as in FIG. 1A are hatched in the same way for convenience. The hatching in these plan views is also applied to the subsequent drawings.

[0018] 1A, 1B, and 2, light source device 1 is a semiconductor laser light emitting device having a semiconductor laser element 2. Light source device 1 includes semiconductor laser element 2, a base 3 having a support portion 10 and a frame 20, and a lid 4 fixed to base 3. Light source device 1 in this embodiment further includes a mirror 5 that reflects laser light emitted from semiconductor laser element 2.

[0019] In the light source device 1, a package is formed by a base 3 and a lid 4, and a semiconductor laser element 2 is housed in this package. As shown in FIG. 1B, the internal space of the package formed by the base 3 and the lid 4 is a hermetically sealed sealed space 1a. Therefore, the semiconductor laser element 2 is disposed in the sealed space 1a. In this embodiment, a plurality of semiconductor laser elements 2 are disposed in the sealed space 1a.

[0020] The semiconductor laser element 2 is a laser chip that emits laser light. In this embodiment, the semiconductor laser element 2 is a nitride-based semiconductor laser element made of a nitride-based semiconductor material. As an example, the semiconductor laser element 2 is a GaN-based semiconductor laser element that emits blue laser light.

[0021] The semiconductor laser element 2 is disposed on the base 3 together with a mirror 5. In this embodiment, the semiconductor laser element 2 is disposed on the base 3 via a submount 6. The submount 6 functions as a base for supporting the semiconductor laser element 2, and also functions as a heat sink for dissipating heat generated by the semiconductor laser element 2. As an example, the submount 6 is made of a ceramic material such as aluminum nitride (AlN) or a metal material such as copper.

[0022] The base 3 is a housing on which the semiconductor laser elements 2 and mirrors 5 are mounted. In this embodiment, a plurality of semiconductor laser elements 2 and a plurality of mirrors 5 are mounted on the base 3. Specifically, the plurality of semiconductor laser elements 2 and the plurality of mirrors 5 are mounted on a support portion 10 of the base 3. The plurality of semiconductor laser elements 2 and the plurality of mirrors 5 are each arranged in a matrix. As shown in FIG. 2, as an example, 16 semiconductor laser elements 2 and 16 mirrors 5 are each arranged in 4 rows and 4 columns.

[0023] The 16 semiconductor laser elements 2 are electrically connected in a 4-in-4 parallel configuration. Power is supplied to the four serially connected semiconductor laser elements 2 via a pair of lead pins 2a. One of the pair of lead pins 2a is a cathode terminal and the other is an anode terminal. The four serially connected semiconductor laser elements 2 are electrically connected to each other by, for example, gold wires (not shown).

[0024] The support 10 of the base 3 is a support for supporting the semiconductor laser element 2, the mirror 5, and the submount 6. Specifically, the support 10 is a mounting substrate for mounting the semiconductor laser element 2, the mirror 5, and the submount 6. Each of the multiple semiconductor laser elements 2 is mounted on the support 10 via the submount 6. Each semiconductor laser element 2 is mounted parallel to the upper surface of the support 10. Therefore, the optical axis of the laser light emitted from each semiconductor laser element 2 is parallel to the upper surface of the support 10.

[0025] The support 10 may be, for example, a metal substrate made of a metal material, a ceramic plate made of a ceramic material, a glass plate made of a glass material, or a resin substrate made of a resin material. In order to efficiently conduct the heat generated by the semiconductor laser element 2 to the support 10, the support 10 is preferably made of a material with high thermal conductivity, such as a metal material. Examples of metal materials with high thermal conductivity that are practical for use as a mounting substrate include copper and aluminum. The shape of the support 10 is generally flat and the shape of the support 10 when viewed from above is generally rectangular, but this is not limited to this.

[0026] Furthermore, the base 3 includes a frame body 20 in addition to the support portion 10. As shown in FIG. 2, the frame body 20 is a frame-shaped member having a substantially rectangular shape when viewed from above. The frame body 20 is provided on the support portion 10. Specifically, the frame body 20 is fixed to the support portion 10 so as to surround all of the semiconductor laser elements 2. As shown in FIG. 1B, the frame body 20 is provided so as to be fitted into the support portion 10, but it may also be provided on the upper surface of the support portion 10.

[0027] As shown in FIGS. 1B and 2, the frame body 20 has a frame-shaped frame body main body 21 and a frame-shaped partition portion 22. The frame body main body 21 is fixed to the support portion 10. The cross-sectional shape of the frame body main body 21 is approximately rectangular. As shown in FIG. 2, a recessed portion 21a is provided on the upper surface of the frame body main body 21. The recessed portion 21a is a groove formed around the entire periphery of the frame body main body 21. The recessed portion 21a has a rectangular frame shape when viewed from above. The partition portion 22 is provided so as to stand on the upper surface of the frame body main body 21. The partition portion 22 is provided outside the recessed portion 21a. Specifically, the partition portion 22 is provided so that the outer side wall surface of the partition portion 22 coincides with the outer surface of the frame body main body 21.

[0028] The frame 20 is made of a metal material such as, but not limited to, copper or aluminum. The frame main body 21 and the partition portion 22 are integrally formed, but may be separate bodies.

[0029] A lid 4 is fixed to the frame 20. The lid 4 is fixed to the frame 20 so as to close the opening of the frame 20.

[0030] The cover 4 is an example of an optical member, and includes an optical element 4a (optical element) that imparts an optical effect to the laser light emitted from the semiconductor laser element 2. In this embodiment, the optical element 4a is a lens that has a lens effect. That is, the optical element 4a imparts a lens effect to the laser light emitted from the semiconductor laser element 2 by, for example, refracting the laser light. Specifically, the optical element 4a is a convex lens that focuses light. Therefore, the laser light emitted from the semiconductor laser element 2 is focused by the optical element 4a.

[0031] The cover 4 includes a plurality of optical elements 4a. Each of the optical elements 4a is provided corresponding to a corresponding one of the semiconductor laser elements 2. That is, the optical elements 4a, the mirror 5, and the semiconductor laser elements 2 are provided in one-to-one correspondence. In this embodiment, each optical element 4a is a convex lens, and therefore, the laser light emitted from each semiconductor laser element 2 is condensed by each optical element 4a.

[0032] 1A and 1B, the cover 4 is composed of a flat, translucent plate portion 30a and a plurality of convex portions 30b provided on the plate portion 30a. Each of the convex portions 30b is a part of an optical element 4a, which is a convex lens. Specifically, each optical element 4a is composed of a flat plate portion 30a and a convex portion 30b.

[0033] In this embodiment, the plurality of protrusions 30b are provided on the outer surface of the flat plate portion 30a. Therefore, each of the plurality of protrusions 30b has a convex surface that protrudes in the direction opposite to the sealed space 1a. The convex surface of each protrusion 30b is a curved surface, such as a spherical surface.

[0034] The light incident surface of each optical element 4a, on which the laser light is incident, forms part of the sealed space 1a. In this embodiment, the light incident surface of each optical element 4a, on which the laser light is incident, is the inner surface of the flat plate portion 30a.

[0035] The flat plate portion 30a and the plurality of convex portions 30b are integrally formed. Therefore, the flat plate portion 30a and the plurality of convex portions 30b are made of the same light-transmitting material. In this embodiment, the lid body 4 is a light-transmitting member made only of the flat plate portion 30a and the convex portions 30b. Therefore, the entire lid body 4 is made of a light-transmitting material. As an example, the lid body 4 is made of a transparent material such as a transparent resin material or glass. In this embodiment, the lid body 4 is made of glass.

[0036] The lid body 4 is placed on the frame body 20 so as to close the opening of the frame body 20. Specifically, as shown in Fig. 1B, the lid body 4 is fixed to the frame body 20 so that the peripheral portion of the flat plate portion 30a of the lid body 4 is placed on the upper surface of the frame body main body 21 of the frame body 20. The flat plate portion 30a of the lid body 4 is surrounded by the partition portion 22 of the frame body 20, and the side surface (end surface) of the flat plate portion 30a and the inner surface of the partition portion 22 face each other with a gap therebetween.

[0037] The height of the light exit surface of the optical element 4a of the lid 4, from which the laser light is emitted, is preferably lower than the height of the upper surface of the frame 20, with the support part 10 as the reference. Specifically, the maximum height of the convex surface of the convex part 30b, which is the light exit surface of the optical element 4a of the lid 4, is preferably lower than the height of the upper end surface of the partition part 22, which is the upper surface of the frame 20.

[0038] The lid body 4 is fixed in close contact with the frame body 20 via the sealing material 7. That is, the lid body 4 and the frame body 20 are fixed together with the sealing material 7 interposed between them. The sealing material 7 is an example of a joining member that joins the lid body 4 and the frame body 20 together.

[0039] As shown in FIG. 1B, the sealing material 7 is formed as a thin layer between the frame body main body 21 of the frame body 20 and the lid body 4. As shown in FIG. 2, in this embodiment, the sealing material 7 is formed in a ring shape when viewed from above. Specifically, the sealing material 7 is filled in the gap between the inner surface of the peripheral portion of the flat portion 30a of the lid body 4 and the upper surface of the frame body main body 21 of the frame body 20, over the entire periphery of the lid body 4 and the frame body 20. The thickness of the sealing material 7 is, for example, 1 mm or less. In this embodiment, the thickness of the sealing material 7 is 0.2 mm. As shown in FIG. 1B, the sealing material 7 is also filled in the recess 21a formed in the frame body main body 21, but the recess 21a does not necessarily need to contain the sealing material 7. The sealing material 7 spreads laterally when melted, but because the recess 21a is provided, the sealing material 7 that melts and spreads toward the inside of the frame body 20 enters the recess 21a. This prevents the melted sealing material 7 from reaching the support part 10.

[0040] In this way, the airtightness of the sealed space 1a is maintained by tightly contacting the frame 20 and the lid 4 via the sealing material 7. In other words, the sealed space 1a is hermetically sealed by the base 3, the lid 4, and the sealing material 7.

[0041] The sealing material 7 is preferably made of a material that does not contain silicone. The sealing material 7 is also preferably made of a soft material. As such a sealing material 7, ethylene vinyl alcohol copolymer (EVOH) or indium can be used. In this embodiment, the sealing material 7 is made of EVOH.

[0042] 1B, the lid body 4 and the frame body 20 are bonded together by a bonding material 8. Specifically, the lid body 4 and the frame body 20 are bonded together via the bonding material 8 on the side of the sealing material 7 opposite to the sealed space 1a side. The bonding material 8 is filled between the partition portion 22 of the frame body 20 and the end face of the flat plate portion 30a of the lid body 4. The bonding material 8 is an example of a bonding member that bonds the lid body 4 and the frame body 20 together.

[0043] In this way, by bonding the lid body 4 and the frame body 20 using the bonding material 8 in addition to the sealing material 7, the lid body 4 and the frame body 20 can be firmly fixed together. The bonding material 8 is made of resin. A thermosetting adhesive can be used as the bonding material 8. As an example, the resin that forms the bonding material 8 is epoxy resin. For example, a thermosetting adhesive made of epoxy resin that hardens at a temperature between room temperature and 160°C can be used as the bonding material 8. Note that the bonding material 8 may not be a thermosetting adhesive, but may be a photocurable adhesive such as an ultraviolet curable adhesive made of resin or the like.

[0044] In this embodiment, the bonding material 8 has a higher bonding strength than the sealing material 7. In other words, the adhesive strength of the bonding material 8 is greater than the adhesive strength of the sealing material 7. By using the bonding material 8 having a higher bonding strength than the sealing material 7 in this way, even when a sealing material 7 having a relatively weak adhesive strength such as EVOH is used, the lid body 4 and the frame body 20 can be firmly fixed together.

[0045] The laser light emitted from the semiconductor laser element 2 is incident on the cover 4 by the mirror 5. The mirror 5 reflects the laser light emitted from the semiconductor laser element 2 and makes it incident on the optical element 4a. As shown in FIG. 1B, in this embodiment, the semiconductor laser element 2 is mounted parallel to the upper surface of the support 10, so the laser light emitted from the semiconductor laser element 2 travels laterally, not in the direction of the optical element 4a located above. For this reason, the mirror 5 is configured to reflect the laser light traveling laterally so that it rises upward. In other words, the mirror 5 is a rising mirror and has a reflective surface that reflects the incident light so that it rises upward.

[0046] The reflecting surface of the mirror 5 is an inclined surface that is inclined with respect to the upper surface of the support portion 10. As an example, the inclination angle of the reflecting surface of the mirror 5 with respect to the upper surface of the support portion 10 is 45 degrees. In this case, the laser light from the semiconductor laser element 2 that is emitted in a direction parallel to the upper surface of the support portion 10 is reflected by the reflecting surface of the mirror 5, travels in a direction perpendicular to the upper surface of the support portion 10, and is incident on the optical element 4a of the lid 4. Each of the multiple mirrors 5 is arranged so that the optical axis of the laser light reflected by each mirror 5 coincides with the optical axis of the optical element 4a of the lid 4.

[0047] Next, a method for manufacturing the light source device 1 according to the present embodiment will be described with reference to Fig. 3. Fig. 3 is a diagram for explaining the method for manufacturing the light source device 1 according to the first embodiment.

[0048] First, as shown in FIG. 3(a), a base 3 having a support 10 and a frame 20 is prepared. Next, as shown in FIG. 3(b), a semiconductor laser element 2 and a mirror 5 are mounted on the upper surface of the support 10 of the base 3. In this embodiment, a plurality of semiconductor laser elements 2 and a plurality of mirrors 5 are mounted on the support 10. Specifically, each semiconductor laser element 2 is mounted on the support 10 via a submount 6. In this case, the submount 6 to which the semiconductor laser element 2 is bonded is mounted on the support 10.

[0049] Next, as shown in FIG. 3(c), a sheet-shaped sealing material 7S is placed on the frame 20 of the base 3. Specifically, the sealing material 7S is placed on the upper surface of the frame main body 21 around the entire periphery of the frame 20. As the sealing material 7S, for example, a resin sheet made of resin can be used. In this embodiment, a ring-shaped EVOH sheet made of EVOH is used as the sealing material 7S. Note that an indium sheet made of indium may also be used as the sheet-shaped sealing material 7S. Furthermore, the sealing material 7S may not be a ring-shaped, integral sheet material, but may be a plurality of separate sheet pieces. In this case, it is preferable to arrange the plurality of sheet pieces continuously or intermittently in a ring shape and place them on the frame main body 21.

[0050] Next, as shown in FIG. 3(d), the lid body 4, which has been prepared in advance, is placed on the frame body 20 on which the sealing material 7S has been placed. Specifically, the lid body 4 is placed on the frame body main body 21 of the frame body 20 so as to cover the opening of the frame body 20. At this time, the lid body 4 is placed on the sealing material 7S. As a result, the sealing material 7S is sandwiched between the peripheral portion of the flat plate portion 30a of the lid body 4 and the frame body main body 21 of the frame body 20. In this way, with the sealing material 7S interposed between the lid body 4 and the frame body 20, the internal space surrounded by the base body 3 and the lid body 4 becomes a hermetically sealed sealed space 1a. At this point, the lid body 4 and the frame body 20 are not fixed together by the sealing material 7S.

[0051] Furthermore, when the lid body 4 is placed on the frame body 21, a gap exists between the side surface (end surface) of the flat plate portion 30a of the lid body 4 and the inner surface of the partition portion 22.

[0052] Next, as shown in Fig. 3(e), the lid body 4 placed on the frame body 20 is aligned with the sealing material 7S interposed therebetween. That is, the lid body 4 is aligned with the internal space surrounded by the base body 3 and the lid body 4 being the sealed space 1a.

[0053] In this embodiment, the position of the lid body 4 is adjusted by active alignment in a state where the internal space surrounded by the base body 3 and the lid body 4 is the sealed space 1a. Specifically, in a state where the semiconductor laser element 2 is driven to emit laser light, the position of the lid body 4 is adjusted so that this laser light passes through the optical axis of the optical element 4a of the lid body 4. In this case, the position of the lid body 4 can be adjusted by moving the lid body 4 in a direction parallel to the upper surface of the support part 10 (horizontal direction).

[0054] At this time, the sealing material 7S has not yet melted, so even if the sealing material 7S is sandwiched between the lid body 4 and the frame body 20, the lid body 4 can be shifted horizontally. In other words, the position of the lid body 4 can be adjusted. Furthermore, when aligning the lid body 4, by using a sheet material made of a soft material such as EVOH or indium as the sealing material 7S, distortion that occurs when aligning the lid body 4 can be reduced.

[0055] In this embodiment, the lid 4 is surrounded by the partition section 22 of the frame 20, but a gap exists between the side surface of the flat plate section 30a of the lid 4 and the inner surface of the partition section 22, allowing the lid 4 to be moved horizontally. In other words, this gap is a space for aligning the lid 4.

[0056] After the lid body 4 is aligned, the sealing material 7S is melted by heating. In this embodiment, an EVOH sheet is used as the sealing material 7S, so the sealing material 7S can be melted by heating at approximately 220°C.

[0057] At this time, the sealing material 7S spreads laterally as it melts, but because the recess 21a is provided in the frame body 21, the sealing material 7S that melts and spreads toward the inside of the frame body 20 enters the recess 21a, as shown in Fig. 3(f). This makes it possible to prevent the molten sealing material 7S from reaching the support part 10. In other words, the recess 21a is an escape recess for allowing the molten sealing material 7S to escape.

[0058] Thereafter, heating is stopped, and the sealing material 7S hardens. As a result, the lid body 4 and the frame body 20 are fixed together by the sealing material 7. Specifically, the flat plate portion 30a of the lid body 4 and the frame body main body 21 of the frame body 20 are fixed together by the sealing material 7. In this way, the sealing material 7 is interposed between the lid body 4 and the frame body 20. Note that the sealing material 7S may also be hardened by actively cooling the sealing material 7.

[0059] Next, as shown in FIG. 3(g), a bonding material 8 is inserted between the lid 4 and the frame 20 to fix the lid 4 and the frame 20. Specifically, the bonding material 8 is inserted so as to fill the gap between the side surface of the flat plate portion 30a of the lid 4 and the inner surface of the partition portion 22. In this embodiment, a thermosetting adhesive made of epoxy resin is used as the bonding material 8. In this case, a fluid liquid bonding material 8 is applied to the gap between the side surface of the flat plate portion 30a of the lid 4 and the partition portion 22 of the frame 20. Thereafter, the bonding material 8 is heated to harden the bonding material 8.

[0060] When heating the bonding material 8, the bonding material 8 may be heated using a heating device such as a heater, or the bonding material 8 may be heated by driving the semiconductor laser element 2. In other words, the bonding material 8 may be heated by the heat generated from the semiconductor laser element 2 without using a separate heating device. By driving the semiconductor laser element 2, the ambient temperature can be raised to about 160°C.

[0061] In this way, by heating and hardening the bonding material 8, the lid body 4 and the frame body 20 are bonded together by the bonding material 8. In other words, the lid body 4 and the frame body 20 are fixed together by the bonding material 8. In this way, the light source device 1 is completed.

[0062] The bonding material 8 may be hardened by natural drying instead of being actively heated. Also, an ultraviolet-curable adhesive may be used as the bonding material 8 instead of a heat-curable adhesive. In this case, the bonding material 8, which is an ultraviolet-curable adhesive, is applied to the gap between the lid body 4 and the frame body 20, and the bonding material 8 can be hardened by irradiating it with ultraviolet light.

[0063] Furthermore, when the semiconductor laser element 2 is driven to thermally harden the bonding material 8, the bonding material 8 may be applied and hardened while the lid 4 is being positioned by active alignment.

[0064] As described above, the light source device 1 according to this embodiment includes the base 3 having the support portion 10 and the frame body 20, the lid body 4 including the optical element 4a, and the semiconductor laser element 2 arranged in the sealed space 1a formed by the lid body 4, the base 3, and the sealing material 7, and the lid body 4 is fixed in close contact with the frame body 20 via the sealing material 7, and the lid body 4 and the frame body 20 are joined via the bonding material 8 on the side opposite to the sealed space 1a side of the sealing material 7.

[0065] As described above, in this embodiment, the lid body 4, which is an optical member, is not functionally separated, but rather the joining member that joins the lid body 4 and the frame body 20 is functionally separated. Specifically, the lid body 4 has both the function of covering the opening of the frame body 20 to ensure the airtightness of the package and the function of providing an optical effect (light collection, etc.) by the optical element 4a, while the joining members that join the lid body 4 and the frame body 20 use a sealing material 7 to ensure the airtightness of the package constituted by the lid body 4 and the base body 3, and a joining material 8 to fix the lid body 4 and the frame body 20 together.

[0066] With this configuration, before fixing the lid body 4 and the frame body 20, the lid body 4 can be aligned by active alignment in a state where the internal space of the package formed by the lid body 4 and the base body 3 is hermetically sealed with the sealing material 7 to form the sealed space 1a. In other words, active alignment of the lid body 4 including the optical element 4a can be performed while ensuring the airtightness of the package formed by the lid body 4 and the base body 3. Therefore, it is possible to realize a light source device 1 having a package structure that can achieve both airtightness and active alignment.

[0067] Furthermore, as described above, the cover 4 can be used as a single component having both the functions of ensuring airtightness and optical action, without being functionally separated. This also simplifies the structure of the light source device 1.

[0068] Moreover, in this embodiment, the lid body 4 and the frame body 20 are joined together using two joining members, the sealing material 7 and the joining material 8, so that the lid body 4 and the frame body 20 can be firmly fixed together.

[0069] Furthermore, in this embodiment, since no member is required between the optical element 4a (lens) and the semiconductor laser element 2, it is possible to shorten the distance between the semiconductor laser element 2 and the optical element 4a, thereby making it possible to achieve a smaller size and a lower height of the light source device 1.

[0070] In the light source device 1 according to the present embodiment, the bonding material 8 has a higher bonding strength than the sealing material .

[0071] When active alignment is performed with the sealing material 7 sandwiched between the lid body 4 and the frame body 20, it is desirable that the sealing material 7 be a soft material. However, if the sealing material 7 is a soft material, and the bonding strength of the bonding material 8 is lower than that of the sealing material 7, there is a risk that the desired bonding strength may not be obtained even when the lid body 4 and the frame body 20 are bonded with the bonding material 8. Therefore, by using a bonding material 8 with a higher bonding strength than the sealing material 7, it is possible to improve the adhesive strength between the lid body 4 and the frame body 20 even when a sealing material 7 made of a soft material is used.

[0072] In the light source device 1 according to this embodiment, the light incident surface of the optical element 4a of the lid 4, on which the laser light from the semiconductor laser element 2 is incident, forms part of the sealed space 1a.

[0073] In this way, the light incident surface of the optical element 4a forms part of the sealed space 1a, so that the tweezers effect in which a minute object is trapped by the laser light emitted from the semiconductor laser element 2 can be suppressed.

[0074] In the light source device 1 according to the present embodiment, the optical element 4a of the cover 4 is a lens.

[0075] With this configuration, the optical element 4a can control the distribution of laser light emitted from the semiconductor laser element 2. For example, by making the optical element 4a a convex lens, the laser light from the semiconductor laser element 2 can be focused.

[0076] Furthermore, in the light source device 1 according to the present embodiment, the sealing material 7 is made of a material that does not contain silicone.

[0077] This configuration makes it possible to suppress the optical tweezers effect caused by the photochemical reaction of siloxane contained in silicone.

[0078] In the light source device 1 according to the present embodiment, the sealing material 7 is made of ethylene vinyl alcohol copolymer (EVOH).

[0079] Since EVOH does not contain siloxane, the optical tweezers effect caused by the photochemical reaction of siloxane can be suppressed by using EVOH for the sealing material 7. Moreover, EVOH is a resin material with high gas permeation prevention capability and excellent gas barrier properties, so it can prevent siloxane present outside the light source device 1 (in the atmosphere) from flowing into the sealed space 1a, thereby suppressing the optical tweezers effect caused by the photochemical reaction of siloxane.

[0080] In the light source device 1 according to the present embodiment, the bonding material 8 is made of resin. Specifically, the resin that forms the bonding material 8 is epoxy resin.

[0081] This allows the lid body 4 and the frame body 20 to be fixed together with resin, making it possible to manufacture the light source device 1 at low cost and with good mass productivity compared to joining the lid body 4 and the frame body 20 by other joining methods such as seam welding. Furthermore, since the hardening temperature of a resin joining material is generally equal to or lower than the operating temperature of the semiconductor laser element 2, by forming the joining material 8 from a resin such as epoxy resin, the joining material 8 can be hardened to join the lid body 4 and the frame body 20 when the lid body 4 is being aligned by active alignment.

[0082] In the light source device 1 according to the present embodiment, a plurality of semiconductor laser elements 2 are arranged in the sealed space 1a, and a plurality of optical elements 4a of the lid 4 are provided for each of the plurality of semiconductor laser elements 2.

[0083] In this way, by arranging a plurality of semiconductor laser elements 2, it is possible to increase the optical output of the entire light source device 1. Furthermore, when a plurality of semiconductor laser elements 2 are arranged, the size difference between the lid body 4 and the frame body 20 increases as the sizes of the lid body 4 and the frame body 20 increase, which may result in a decrease in airtightness, but in this embodiment, airtightness can be ensured as described above, so that a decrease in airtightness can be effectively prevented even when a plurality of semiconductor laser elements 2 are arranged.

[0084] In addition, the light source device 1 according to this embodiment further includes a mirror 5 that reflects the laser light emitted from the semiconductor laser element 2 and makes it incident on the optical element 4a, and the semiconductor laser element 2 is mounted parallel to the upper surface of the support portion 10.

[0085] In this way, by mounting the semiconductor laser element 2 parallel to the upper surface of the support part 10, it is possible to efficiently conduct heat generated in the semiconductor laser element 2 to the support part 10, thereby improving the heat dissipation of the semiconductor laser element 2. Furthermore, even if the semiconductor laser element 2 is mounted parallel to the upper surface of the support part 10, the laser light emitted from the semiconductor laser element 2 can be deflected by a mirror, so that it is possible to prevent geometric interference between the upper surface of the support part 10 and the optical element 4a.

[0086] The height of the light emission surface of the optical element 4a of the cover 4 from which the laser light is emitted is preferably lower than the height of the upper surface of the frame 20 with the support portion 10 as the reference.

[0087] This configuration can prevent external objects from hitting the optical element 4a when the light source device 1 is moved, thereby preventing damage to the optical element 4a.

[0088] (Embodiment 2) Next, a light source device 1A according to embodiment 2 will be described with reference to Fig. 4A and Fig. 4B. Fig. 4A is a top view of light source device 1A according to embodiment 2, and Fig. 4B is a cross-sectional view of light source device 1A.

[0089] The light source device 1A according to the present embodiment differs from the light source device 1 according to the above-described embodiment 1 in the shape of the lid body 4A. Specifically, in the above-described embodiment 1, the convex portions 30b constituting each optical element 4a in the lid body 4 are provided on the outer surface of the flat plate portion 30a, but in the present embodiment, the convex portions 30b constituting each optical element 4a in the lid body 4A are provided on the inner surface of the flat plate portion 30a.

[0090] Therefore, in this embodiment, the convex portion 30b of each optical element 4a has a convex surface that protrudes toward the sealed space 1a. That is, the convex portion 30b protrudes toward the support portion 10. In this embodiment, each optical element 4a is also a convex lens, and the convex surface of the convex portion 30b is a curved surface such as a spherical surface. All of the convex portions 30b are provided on the inner surface of the flat plate portion 30a.

[0091] Also in this embodiment, the light incident surface of each optical element 4a, through which the laser light is incident, forms part of the sealed space 1a, but in this embodiment, the convex portion 30b is provided on the inner surface of the flat portion 30a, and therefore the light incident surface of each optical element 4a, through which the laser light is incident, includes the convex surface of the convex portion 30b.

[0092] In addition, the configuration of the light source device 1A in this embodiment is the same as that of the light source device 1 in the above embodiment, except for the lid body 4A.

[0093] Therefore, similarly to the above-described first embodiment, the light source device 1A according to this embodiment also includes a base 3 having a support portion 10 and a frame body 20, a lid body 4A including an optical element 4a, and a semiconductor laser element 2 arranged in a sealed space 1a formed by the lid body 4A, the base 3, and a sealing material 7, and the lid body 4A is fixed in close contact with the frame body 20 via the sealing material 7, and the lid body 4A and the frame body 20 are joined via a bonding material 8 on the side opposite to the sealed space 1a side of the sealing material 7.

[0094] As a result, light source device 1A according to this embodiment achieves the same effects as light source device 1 in the above-described embodiment 1. Specifically, active alignment of lid body 4A including optical element 4a can be performed while ensuring airtightness of the package formed by lid body 4A and base body 3, thereby achieving an effect such as realizing light source device 1A having a package structure that can achieve both airtightness and active alignment.

[0095] Furthermore, in the light source device 1A of the present embodiment, the convex portions 30b constituting each optical element 4a are provided on the inner surface of the flat plate portion 30a, not on the outer surface of the flat plate portion 30a. Therefore, the lower end of the lid body 4A is closer to the support portion 10 than the upper end of the frame body 20. Specifically, the apex of the convex portion 30b at the lower end of the lid body 4A is located closer to the support portion 10 than the upper edge of the partition portion 22 at the upper end of the frame body 20. In the present embodiment, the apex of the convex portion 30b is located closer to the support portion 10 than the upper surface of the frame body main body 21.

[0096] With this configuration, external objects do not collide with the optical element 4a when the light source device 1A is moved, thereby preventing damage to the optical element 4a. In particular, since the convex portion 30b of the optical element 4a, which is a convex lens, is provided on the inner surface of the flat portion 30a and is not exposed to the outside, damage to the convex portion 30b can be prevented.

[0097] Also in this embodiment, the height of the light exit surface of the optical element 4a of the lid 4A, from which the laser light is emitted, is lower than the height of the upper surface of the frame 20, with the support 10 as the reference. Specifically, in this embodiment, the flat surface that is the outer surface of the flat plate portion 30a, which is the light exit surface of the optical element 4a of the lid 4A, is lower than the height of the upper end surface of the partition portion 22, which is the upper surface of the frame 20. This makes it possible to prevent the outer surface of the lid 4A from being damaged by hitting an external object. As an example, the difference in height between the outer surface of the flat plate portion 30a and the upper end surface of the partition portion 22 is approximately 0.8 mm to 1.0 mm.

[0098] (Embodiment 3) Next, a light source device 1B according to embodiment 3 will be described with reference to Fig. 5A and Fig. 5B. Fig. 5A is a top view of light source device 1B according to embodiment 3, and Fig. 5B is a cross-sectional view of light source device 1B.

[0099] In the light source device 1 according to the first embodiment, the sealing material 7 is a sheet material, which is melted and then hardened, but in the light source device 1B according to the present embodiment, the sealing material 7B is made of liquid metal. The liquid metal sealing material 7B is a liquid metal that does not solidify above a certain temperature. Indium gallium (InGa), which is made of indium and gallium, can be used as the liquid metal sealing material 7B. The indium gallium used in the present embodiment is liquid at temperatures above 50°C and solid below 50°C. In other words, indium gallium is solid at room temperature.

[0100] Furthermore, the sealing material 7B is disposed in a recess 23 provided in the frame body 20. In the present embodiment, the recess 23 is provided in the frame body main body 21 of the frame body 20. Specifically, the recess 23 is provided in a portion of the frame body main body 21 facing the lid body 4. The recessed portion of the recess 23 forms a cavity between the frame body 20 and the lid body 4.

[0101] The recess 23 is a groove formed around the entire circumference of the frame body 21. Therefore, the recess 23 is formed in a ring shape. As an example, the shape of the recess 23 when viewed from above is a rectangular frame shape. The sealing material 7B arranged in the recess 23 is present around the entire circumference of the recess 23. Therefore, the sealing material 7B is arranged in a ring shape. Specifically, the shape of the sealing material 7B when viewed from above is a rectangular frame shape.

[0102] The sealing material 7B arranged in the recess 23 supports the lid body 4. Therefore, the upper surface of the sealing material 7B arranged in the recess 23 contacts the inner surface of the flat plate portion 30a of the lid body 4. Note that the upper part of the sealing material 7B protrudes from the recess 23, but this is not limited to this.

[0103] The light source device 1B configured in this manner can be manufactured in accordance with the manufacturing method of the light source device 1 according to the first embodiment.

[0104] Specifically, first, similarly to the first embodiment, a base 3 having a support portion 10 and a frame body 20 is prepared. At this time, the frame body 20 used has a frame body main body 21 with a recess 23 formed in it. Next, similarly to the first embodiment, a semiconductor laser element 2 and a mirror 5 are mounted on the upper surface of the support portion 10 of the base 3.

[0105] Next, liquid sealing material 7B is placed on frame 20 of base 3. Liquid metal is used as sealing material 7B. Specifically, liquid sealing material 7B is applied to recess 23 provided in frame main body 21 of frame 20. At this time, sealing material 7B is applied to recess 23 so that the upper part of sealing material 7B protrudes from recess 23 due to surface tension. Note that sealing material 7B made of liquid metal is heated as necessary to become liquid (fluid).

[0106] Next, similarly to the first embodiment, the lid 4 prepared in advance is placed on the frame 20 on which the sealing material 7B is placed. At this time, the lid 4 is placed on the sealing material 7B. As a result, the sealing material 7B is interposed between the lid 4 and the frame 20, and the internal space surrounded by the base 3 and the lid 4 becomes a hermetically sealed sealed space 1a. In this embodiment, the lid 4 is placed on the frame 20 at room temperature. At this time, the sealing material 7B may be solid or liquid.

[0107] Next, as in the first embodiment, the lid 4 placed on the frame 20 is aligned via the sealing material 7B. That is, the lid 4 is aligned with the internal space enclosed by the base 3 and the lid 4 as the sealed space 1a. In this embodiment, the lid 4 is aligned by active alignment with the internal space enclosed by the base 3 and the lid 4 as the sealed space 1a. Note that in this embodiment, the active alignment of the lid 4 is performed at room temperature. At this time, the sealing material 7B may be solid or liquid as long as it can support the lid 4. At this time, the sealing material 7B spreads laterally, but since the frame main body 21 has the recess 21a, the sealing material 7B spreading toward the inside of the frame 20 enters the recess 21a. This prevents the sealing material 7B from reaching the support portion 10. That is, the recess 21a is an escape recess for allowing the sealing material 7B to escape.

[0108] Next, similarly to the first embodiment, the bonding material 8 is inserted between the lid body 4 and the frame body 20 to fix the lid body 4 and the frame body 20. As a result, the lid body 4 and the frame body 20 are bonded together by the bonding material 8. In other words, the lid body 4 and the frame body 20 are fixed together by the bonding material 8. With the above steps, the light source device 1B is completed.

[0109] As described above, the light source device 1B according to this embodiment also includes, similarly to the above-described first embodiment, a base 3 having a support portion 10 and a frame body 20, a lid body 4 including an optical element 4a, and a semiconductor laser element 2 arranged in a sealed space 1a formed by the lid body 4, the base 3, and the sealing material 7B, and the lid body 4 is fixed in close contact with the frame body 20 via the sealing material 7B, and the lid body 4 and the frame body 20 are joined via a bonding material 8 on the side opposite to the sealed space 1a side of the sealing material 7B.

[0110] As a result, light source device 1B according to this embodiment achieves the same effects as light source device 1 in the above-described embodiment 1. Specifically, since active alignment of lid body 4 including optical element 4a can be performed while ensuring airtightness of the package formed by lid body 4 and base body 3, it is possible to achieve an effect such as realizing light source device 1B having a package structure that can achieve both airtightness and active alignment.

[0111] Furthermore, in light source device 1B of the present embodiment, a cavity is formed between frame body 20 and lid body 4, and sealing material 7B is disposed in this cavity. Specifically, frame body 20 has recess 23 in a portion facing lid body 4, and the cavity between frame body 20 and lid body 4 is the recessed portion of recess 23.

[0112] This configuration makes it possible to prevent the sealant 7B from moving more than a specified amount due to changes in the positional relationship between the frame 20 and the cover 4 when the cover 4 is aligned by active alignment. This increases the sealing effect of the sealant 7B on the sealed space 1a. In other words, it is possible to further ensure the airtightness of the sealed space 1a.

[0113] In the light source device 1B according to the present embodiment, the sealing material 7B is a liquid metal made of indium gallium.

[0114] Since indium gallium does not contain siloxane, forming the sealing material 7B from indium gallium can suppress the optical tweezers effect caused by the photochemical reaction of siloxane. Furthermore, since liquid metal is a liquid that can be changed into any shape while maintaining contact with an object, using liquid metal as the sealing material 7B can suppress a decrease in airtightness when aligning the lid body 4 by active alignment. Furthermore, since indium gallium is solid at room temperature and becomes liquid at temperatures above 50°C, using liquid metal made of indium gallium as the sealing material 7B makes it easy to perform active alignment of the lid body 4 by raising the temperature to 60°C.

[0115] In this embodiment, the lid 4A in the second embodiment may be used instead of the lid 4.

[0116] (Fourth embodiment) Next, a light source device 1C according to embodiment 4 will be described with reference to Fig. 6A and Fig. 6B. Fig. 6A is a top view of light source device 1C according to embodiment 4, and Fig. 6B is a cross-sectional view of light source device 1C.

[0117] The light source device 1C according to the present embodiment is configured such that, in the light source device 1B according to the third embodiment, the sealing material 7B made of liquid metal is replaced with a sealing material 7C made of a circular wire. In the present embodiment, the sealing material 7C, which is a circular wire, may also be made of a soft material. A metal wire with a wire diameter of about 1 mm may be used as the sealing material 7C, which is a circular wire. The sealing material 7C may be, for example, a metal wire containing indium. The metal wire containing indium is a soft wire. As such a sealing material 7C, an indium metal wire, an indium alloy wire made of an indium alloy, or the like may be used.

[0118] The sealing material 7C is disposed in a recess 23 provided in the frame 20. Because the sealing material 7C is a circular wire, the sealing material 7C disposed in the recess 23 exists around the entire circumference of the recess 23. In this case, the sealing material 7C, which is a circular wire, may be a continuous ring-shaped material, or may be a string-like metal wire that is routed around the entire circumference of the recess 23. In this state, the sealing material 7C, which is a circular wire disposed in the recess 23, functions as a packing. This ensures the airtightness of the sealed space 1a.

[0119] The sealing material 7C arranged in the recess 23 supports the lid 4. Therefore, the upper surface of the sealing material 7C arranged in the recess 23 contacts the inner surface of the flat plate portion 30a of the lid 4. In the present embodiment, the upper portion of the sealing material 7C protrudes from the recess 23, but this is not limited to this. Note that if the sealing material 7C is a metal wire containing indium, the sealing material 7C will be plastically deformed by being pressed against the lid 4.

[0120] The configuration other than the sealing material 7C is the same as that of the light source device 1B according to the above-described embodiment 3. Furthermore, the light source device 1C according to the present embodiment can be manufactured in accordance with the manufacturing method of the light source device 1B according to the above-described embodiment 3.

[0121] Therefore, similarly to the above-described third embodiment, the light source device 1C according to this embodiment also comprises a base 3 having a support portion 10 and a frame body 20, a lid body 4 including an optical element 4a, and a semiconductor laser element 2 arranged in a sealed space 1a formed by the lid body 4, the base 3, and a sealing material 7C, and the lid body 4 is fixed in close contact with the frame body 20 via the sealing material 7C, and the lid body 4 and the frame body 20 are joined via a bonding material 8 on the side opposite to the sealed space 1a side of the sealing material 7C.

[0122] As a result, light source device 1C according to the present embodiment achieves the same effects as light source device 1B according to the above-described embodiment 3. Specifically, since active alignment of lid body 4 including optical element 4a can be performed while ensuring airtightness of the package formed by lid body 4 and base body 3, it is possible to achieve an effect such as realizing light source device 1C having a package structure that can achieve both airtightness and active alignment.

[0123] In the light source device 1C according to the present embodiment, the sealing material 7C is a circular wire.

[0124] With this configuration, the sealing material 7C can be arranged without gaps all around the sealed space 1a, so that the airtightness of the sealed space 1a can be easily ensured.

[0125] In addition, in light source device 1C according to the present embodiment, specifically, sealing material 7C is made of indium.

[0126] Since indium does not contain siloxane, by forming the sealing material 7C from indium, it is possible to suppress the optical tweezers effect caused by the photochemical reaction of siloxane.

[0127] In this embodiment, the lid 4A in the second embodiment may be used instead of the lid 4.

[0128] (Embodiment 5) Next, a light source device 1D according to embodiment 5 will be described with reference to Figs. 7A, 7B, and 8. Fig. 7A is a top view of light source device 1D according to embodiment 5, and Fig. 7B is a cross-sectional view of light source device 1D. Fig. 8 is a top view of light source device 1D without lid body 4 and bonding material 8.

[0129] In the light source device 1D of this embodiment, the base 3D has a support portion 10 and a frame body 20D, similar to the light source device 1 of embodiment 1 above, but the shape of the frame body 20D of the light source device 1D of this embodiment is different from that of the light source device 1 of embodiment 1 above.

[0130] Specifically, in light source device 1D according to the present embodiment, frame body 20D includes side frame body 21D and inner frame body 22D located inside side frame body 21D. As shown in Fig. 8, side frame body 21D and inner frame body 22D each have a rectangular frame shape when viewed from above. Side frame body 21D and inner frame body 22D are made of a metal material such as copper or aluminum.

[0131] Frame body 20D is provided on support part 10. Specifically, as shown in FIG. 7B, side frame body 21D of frame body 20D is provided on the upper surface of support part 10. In the present embodiment, side frame body 21D is placed on the upper surface of support part 10 in an upright position on support part 10 and fixed to support part 10.

[0132] The inner frame 22D has an outer peripheral portion 22Da that is outer than the lid 44 (including the fixing portion) in a top view, and an inner peripheral portion 22Db that is located inside the outer peripheral portion 22Da. The outer peripheral portion 22Da of the inner frame 22D is fixed to the upper end of the side frame 21D. Therefore, an opening through which laser light passes is provided inside the inner peripheral portion 22Db. The inner frame 22D has a recess 23. In this embodiment, the recess 23 is provided in the inner peripheral portion 22Db of the inner frame 22D.

[0133] 7B, recess 23 is provided in a portion of inner frame 22D facing lid 4. The recessed portion of recess 23 forms a cavity between frame 20D and lid 4.

[0134] The recess 23 is a groove formed around the entire periphery of the inner frame 22D. Therefore, as shown in Fig. 8, the recess 23 is formed in an annular shape. As an example, the shape of the recess 23 when viewed from above is a rectangular frame shape.

[0135] A sealing material 7D is disposed in the recess 23. The sealing material 7D disposed in the recess 23 exists around the entire circumference of the annular recess 23. Therefore, the sealing material 7D is disposed in an annular shape. Specifically, the shape of the sealing material 7D in a top view is a rectangular frame shape.

[0136] A gap exists between the upper end surface of the outer wall of the recess 23 and the flat plate portion 30a of the lid 4. This allows the lid 4 to be easily shifted when aligning the lid 4 by active alignment. At this time, the sealing material 7D spreads laterally, but since the frame main body 22D has the recess 22Dc, the sealing material 7D spreading toward the inside of the frame 22D enters the recess 22Dc. This prevents the sealing material 7D from reaching the support portion 10. In other words, the recess 22Dc is an escape recess for allowing the sealing material 7D to escape.

[0137] 7B, the inner frame 22D has a bent portion 24. The cross-sectional shape of the bent portion 24 is, for example, a crank-like bent shape having two right angles. In this way, the inner frame 22D has the bent portion 24, so that the frame 20D has flexibility in a direction (horizontal direction) intersecting the direction in which the lid 4 covers the frame 20D. In other words, the frame 20D has flexibility in a direction parallel to the inner surface of the flat plate portion 30a of the lid 4 (a direction parallel to the upper surface of the support portion 10).

[0138] The lid body 4 is disposed on the frame body 20D so as to close the opening of the frame body 20D. In the present embodiment, the lid body 4 is supported by an inner frame body 22D of the frame body 20D. Specifically, the lid body 4 is fixed to an inner peripheral portion 22Db of the inner frame body 22D.

[0139] Also in this embodiment, similarly to the first embodiment, the height of the light emission surface of the optical element 4a of the lid 4 from which the laser light is emitted may be lower than the height of the upper surface of the frame 20D, using the support 10 as a reference. Specifically, the maximum height of the convex surface of the convex portion 30b, which is the light emission surface of the optical element 4a of the lid 4, may be lower than the height of the upper end surface of the frame 20D.

[0140] Also in this embodiment, the lid body 4 is fixed in close contact with the frame body 20D via the sealing material 7D. That is, the lid body 4 and the frame body 20D are fixed together with the sealing material 7D interposed between them. In this way, the inner peripheral portion 22Db of the frame body 20D and the lid body 4 are tightly contacted with each other via the sealing material 7D, thereby maintaining the airtightness of the sealed space 1a. That is, the sealed space 1a is hermetically sealed by the base body 3D, the lid body 4, and the sealing material 7D.

[0141] The sealing material 7D may be made of a material that does not contain silicone. As the sealing material 7D, a sheet material made of EVOH or indium may be used as in the first embodiment, a liquid metal made of indium gallium may be used as in the third embodiment, or a circular wire such as a metal wire containing indium may be used as in the fourth embodiment.

[0142] In this embodiment as well, the lid body 4 and the frame body 20D are bonded together by the bonding material 8. Specifically, the lid body 4 and the frame body 20D are bonded together via the bonding material 8 on the side opposite to the sealed space 1a side of the sealing material 7D. More specifically, the bonding material 8 bonds the inner periphery 22Db of the frame body 20D to the end of the flat plate portion 30a of the lid body 4. This prevents the lid body 4 from shifting, and allows the lid body 4 and the frame body 20D to be fixed together.

[0143] Here, the bent portion 24 of the inner frame 22D is formed on the outer periphery 22Da and is formed inside the position where the side frame 21D and the inner frame 22D are fixed. In other words, it is located between the side frame and the lid in a top view. That is, the bent portion 24 is formed in a substantially annular shape inside the side frame 21D (on the sealed space 1a side) and outside the inner periphery 22Db.

[0144] The light source device 1D according to the present embodiment can be manufactured in accordance with the manufacturing methods of the light source devices 1 to 1C according to the first to fourth embodiments, depending on the material of the sealing material 7D.

[0145] As described above, the light source device 1D according to this embodiment, like the first embodiment, includes a base 3D having a support portion 10 and a frame body 20D, a lid body 4 including an optical element 4a, and a semiconductor laser element 2 arranged in a sealed space 1a formed by the lid body 4, the base 3D, and a sealing material 7D, and the lid body 4 is fixed in close contact with the frame body 20D via the sealing material 7D, and the lid body 4 and the frame body 20D are joined via a bonding material 8 on the side of the sealing material 7D opposite to the sealed space 1a side.

[0146] As a result, light source device 1D according to the present embodiment achieves the same effects as light source device 1 according to the above-described embodiment 1. Specifically, active alignment of lid body 4 including optical element 4a can be performed while ensuring airtightness of the package formed by lid body 4 and base body 3D, thereby achieving an effect such as realizing light source device 1D having a package structure that can achieve both airtightness and active alignment.

[0147] Furthermore, in the light source device 1D according to this embodiment, the frame body 20D includes a side frame body 21D and an inner frame body 22D located inside the side frame body 21D, and the lid body 4 is fixed to the inner frame body 22D.

[0148] This configuration allows the metal frame 20D to have a bent portion formed between the side frame 21D and the inner frame 22D. In this embodiment, the inner frame 22D has a bent portion 24. This allows stress caused by the difference in thermal expansion coefficient between the cover 4 and the frame 20D to be alleviated.

[0149] Furthermore, in light source device 1D according to the present embodiment, frame body 20D has flexibility in a direction intersecting the direction in which lid body 4 covers frame body 20D.

[0150] When the lid 4 including the optical element 4a is bonded to the metal frame 20D, stress such as thermal distortion occurs, and this stress occurs in a direction intersecting the direction in which the lid 4 covers the frame 20D. Therefore, by configuring the frame 20D to have flexibility in a direction intersecting the direction in which the lid 4 covers the frame 20D, this stress such as thermal distortion can be alleviated.

[0151] In this embodiment, inner frame body 22D is provided with bent portions 24, and frame body 20D is configured to have flexibility due to these bent portions 24. In other words, bent portions 24 function as a stress absorbing structure. Furthermore, the flexibility of bent portions 24 can be increased by reducing the thickness of inner frame body 22D that forms bent portions 24.

[0152] In the light source device 1D according to the present embodiment, the inner frame 22D has an outer peripheral portion 22Da and an inner peripheral portion 22Db located inside the outer peripheral portion 22Da, and the lid 4 is fixed to the inner peripheral portion 22Db.

[0153] This configuration can prevent external objects from hitting the optical element 4a when the light source device 1D is moved, thereby preventing damage to the optical element 4a.

[0154] As in the light source device 1E shown in FIG. 9, in this embodiment, the lid 4A in the second embodiment may be used instead of the lid 4.

[0155] (Embodiment 6) Next, a light source device 1F according to the sixth embodiment will be described with reference to Fig. 10. Fig. 10 is a cross-sectional view of the light source device 1F according to the sixth embodiment.

[0156] A light source device 1F according to this embodiment differs from the light source device 1 according to the first embodiment in the shape of a frame body 20F and the shape of a lid body 4F in a base body 3F.

[0157] The frame body 20F is a frame-shaped member having a substantially rectangular shape when viewed from above. The frame body 20F is provided on the support part 10. Specifically, the frame body 20F is provided on the upper surface of the support part 10. The frame body 20F is fixed to the support part 10. The frame body 20F is made of a metal material such as copper or aluminum.

[0158] A recess 23 is provided on the upper surface of the frame body 20F. The recess 23 is a groove formed around the entire circumference of the frame body 20F. Therefore, the recess 23 is formed in a ring shape. As an example, the shape of the recess 23 when viewed from above is a rectangular frame shape. In this embodiment, the bottom surface of the recess 23 is a curved surface, but it may also be a flat surface.

[0159] The recess 23 is provided in a portion of the frame 20F facing the lid 4F. Specifically, the recess 23 is provided in a portion of the frame 20F facing the outer edge lid 32 of the lid 4F. The recessed portion of the recess 23 forms a cavity between the frame 20F and the lid 4F.

[0160] A sealing material 7F is disposed in the recess 23. The sealing material 7F disposed in the recess 23 exists around the entire periphery of the recess 23. Therefore, the sealing material 7F is disposed in a ring shape. Specifically, the sealing material 7F has a rectangular frame shape when viewed from above.

[0161] The lid body 4F is disposed on the frame body 20F so as to close the opening of the frame body 20F. The lid body 4F is fixed to the frame body 20F. Specifically, the lid body 4F is fixed to the upper end portion of the frame body 20F.

[0162] In this embodiment, the lid body 4F includes a lid body main body 31 including the optical element 4a and an outer edge lid body 32 located outside the lid body main body 31. The outer edge lid body 32 of the lid body 4F is supported by the frame body 20F. Specifically, the outer edge lid body 32 is tightly attached to the frame body 20F via a sealing material 7F. The lid body main body 31 and the outer edge lid body 32 are bonded together by a bonding material 33. As an example, the lid body main body 31 is made of glass, and the outer edge lid body 32 is made of a metal material such as copper or aluminum. In this case, it is preferable to use low-melting-point glass as the bonding material 33. The outer edge lid body 32 has an outer peripheral portion 32Da located outside the lid body main body 31 (including the fixing portion) in a top view, and an inner peripheral portion 32Db located inside the outer peripheral portion 32Da. Therefore, an opening through which laser light passes is provided inside the inner peripheral portion 32Db. Specifically, the lid body main body 31 is fixed to the inner peripheral portion 32Db.

[0163] The lid body main body 31 has the same configuration as the lid body 4 in the above-described embodiment 1. Therefore, the lid body main body 31 has a flat plate portion 30a and a plurality of protrusions 30b provided on the flat plate portion 30a. The plurality of protrusions 30b are also provided on the outer surface of the flat plate portion 30a.

[0164] A gap is provided between the inner surface of the frame body 20F and the surface of the outer edge cover 32 that faces the inner surface of the frame body 20F. Specifically, the outer edge cover 32 has a bent portion 34, and a gap is provided between the bent portion 34 and the frame body 20F.

[0165] The cross-sectional shape of the bent portion 34 is, for example, a U-shaped bent shape. In this way, the lid body 4F has the bent portion 34, so that the lid body 4F has flexibility in a direction (horizontal direction) intersecting the direction in which the lid body 4F covers the frame body 20F. In other words, the lid body 4F has flexibility in a direction parallel to the inner surface of the flat plate portion 30a of the lid body main body 31 (a direction parallel to the upper surface of the support portion 10).

[0166] In the lid 4F, the maximum height of the convex surface of the convex portion 30b, which is the light exit surface of the optical element 4a of the lid main body 31, is preferably lower than the height of the upper surface of the outer edge lid 32. This makes it possible to prevent the optical element 4a from being damaged by a collision with an external object.

[0167] The lid body 4F is placed on the frame body 20F so as to close the opening of the frame body 20F. Specifically, the lid body 4F is fixed to the frame body 20F so that the outer edge lid body 32 is placed on the upper surface of the frame body 20F.

[0168] In this embodiment, the lid body 4F is also fixed in close contact with the frame body 20F via the sealing material 7F. That is, the outer edge lid body 32 of the lid body 4F is fixed to the frame body 20F with the sealing material 7F interposed between the lid body 4F and the frame body 20F.

[0169] The sealing material 7F may be made of a material that does not contain silicone. As in the first embodiment, the sealing material 7F may be a sheet material made of EVOH or indium, or as in the third embodiment, a liquid metal made of indium gallium may be used. In this case, the sealing material 7F spreads laterally. However, since the frame main body 20F has a recess 20Fa, the sealing material 7F spreading toward the inside of the frame body 20F enters the recess 20Fa. This prevents the sealing material 7F from reaching the support portion 10. In other words, the recess 20Fa is an escape recess for allowing the sealing material 7F to escape. Alternatively, as in the fourth embodiment, a circular wire such as a metal wire containing indium may be used.

[0170] By closely adhering the frame 20F and the outer peripheral portion 32Da of the lid 4F via the sealing material 7F, the sealed space 1a is maintained airtight. In other words, the sealed space 1a is hermetically sealed by the base 3F, the lid 4F, and the sealing material 7F. In this case, by using a soft material such as EVOH as the material of the sealing material 7F and providing a bent portion 34 in the outer peripheral lid 32, stress generated in the lid 4F can be alleviated while maintaining the airtightness of the low-melting-point glass portion, which is the joint between the lid main body 31 and the outer peripheral lid 32. In other words, by using low-melting-point glass as the bonding material 33 that bonds the lid main body 31 and the outer peripheral lid 32, stress generated in the lid 4F can be alleviated compared to when the bonding material 33 is made of a metal or ceramic material and the lid main body 31 and the outer peripheral lid 32 are fixed together with a metal or ceramic material.

[0171] In the present embodiment as well, the lid body 4F and the frame body 20F are bonded together by the bonding material 8. Specifically, the lid body 4F and the frame body 20F are bonded together via the bonding material 8 on the side of the sealing material 7F opposite to the sealed space 1a side. More specifically, the bonding material 8 bonds the frame body 20F to the end of the outer circumferential portion 32Da.

[0172] Here, the bent portion 34 of the outer edge lid 32 is formed on the outer periphery 32Da, and is formed inside the position where the outer edge lid 32 and the frame 20F are fixed together by the sealing material 7F. In other words, it is located between the frame 20F and the lid main body 31 in top view. That is, the bent portion 24 is formed in a substantially annular shape inside (on the sealed space 1a side) the position where the outer edge lid 32 and the frame 20F are fixed together by the sealing material 7F, and outside the position where the lid main body 31 and the outer edge lid 32 are joined together by the joining material 33.

[0173] Next, a method for manufacturing the light source device 1F according to the present embodiment will be described with reference to Fig. 11. Fig. 11 is a diagram for explaining the method for manufacturing the light source device 1F according to embodiment 6. The light source device 1F in this embodiment can be manufactured in accordance with the method for manufacturing the light source device 1 according to embodiment 1 above.

[0174] First, as shown in Fig. 11(a), a base 3F having a support 10 and a frame 20F is prepared. Next, as shown in Fig. 11(b), a semiconductor laser element 2 and a mirror 5 are mounted on the upper surface of the support 10 of the base 3F. The semiconductor laser element 2 is mounted on the support 10 via a submount 6.

[0175] 11(c), the sealing material 7F is placed in the recess 23 of the frame 20F of the base 3F. At this time, the sealing material 7F is placed in the recess 23 so that the upper part of the sealing material 7F protrudes from the recess 23.

[0176] 11(d), a lid body 4F is prepared in advance by bonding a lid body main body 31 and an outer edge lid body 32 with a bonding material 33 made of low-melting point glass, and this lid body 4F is placed on a frame body 20F on which a sealing material 7F is placed. Specifically, the lid body 4F is placed on the frame body 20F so as to cover the opening of the frame body 20F. At this time, the lid body 4F is placed so that the outer edge lid body 32 is placed on the sealing material 7F. As a result, the sealing material 7F is interposed between the lid body 4F and the frame body 20F, and the internal space surrounded by the base body 3F and the lid body 4F becomes a hermetically sealed sealed space 1a.

[0177] Next, as shown in FIG. 11(e), the lid 4F placed on the frame 20F is aligned via the sealing material 7F. That is, the lid 4F is aligned with the internal space enclosed by the base 3F and the lid 4F as the sealed space 1a. In this embodiment, the lid 4F is aligned by active alignment with the internal space enclosed by the base 3F and the lid 4F as the sealed space 1a. At this time, the sealing material 7F spreads laterally. However, since the frame main body 20F has a recess 22Fa, the sealing material 7F spreading toward the inside of the frame 20F enters the recess 20Fa as shown in FIG. 11(f). This prevents the sealing material 7F from reaching the support 10. That is, the recess 20Fa is an escape recess for allowing the molten sealing material 7F to escape.

[0178] 11(f), the lid body 4F and the frame body 20F are joined by applying and curing the bonding material 8. As a result, the lid body 4F and the frame body 20F are fixed by the bonding material 8. In this way, the light source device 1F is completed.

[0179] As described above, the light source device 1F according to this embodiment, like the first embodiment, includes a base 3F having a support portion 10 and a frame body 20F, a lid body 4F including an optical element 4a, and a semiconductor laser element 2 arranged in a sealed space 1a formed by the lid body 4F, the base 3F, and the sealing material 7F, and the lid body 4F is fixed in close contact with the frame body 20F via the sealing material 7F, and the lid body 4F and the frame body 20F are joined via a bonding material 8 on the side of the sealing material 7F opposite to the sealed space 1a side.

[0180] As a result, the light source device 1F according to this embodiment achieves the same effects as the light source device 1 according to the above-described embodiment 1. Specifically, since active alignment of the lid body 4F including the optical element 4a can be performed while ensuring airtightness of the package formed by the lid body 4F and the base body 3F, it achieves the effect of realizing the light source device 1F having a package structure that can achieve both airtightness and active alignment.

[0181] Furthermore, in the light source device 1F according to this embodiment, the lid body 4F includes a lid body main body 31 including the optical element 4a and an outer edge lid body 32 located outside the lid body main body 31, and the outer edge lid body 32 is fixed to the frame body 20F.

[0182] With this configuration, by bonding the lid body main body 31 including the optical element 4a and the outer edge lid body 32 with an adhesive such as low-melting point glass, active alignment of the lid body 4F can be performed while maintaining a strong bond between the lid body main body 31 and the outer edge lid body 32.

[0183] Furthermore, the light source device 1F according to the present embodiment has a gap between the inner surface of the frame body 20F and the surface of the outer edge cover 32 of the cover body 4F that faces the inner surface of the frame body 20F.

[0184] This configuration allows for a margin for position adjustment between the frame body 20F and the lid body 4F when aligning the lid body 4F by active alignment. In other words, the gap between the frame body 20F and the outer edge lid body 32 can be used as an adjustment gap when performing active alignment of the lid body 4F.

[0185] Furthermore, in the light source device 1F according to the present embodiment, the lid body 4F has flexibility in a direction intersecting the direction in which the lid body 4F covers the frame body 20F.

[0186] When the lid 4F including the optical element 4a is bonded to the metal frame 20F, stress such as thermal distortion occurs, and this stress occurs in a direction intersecting the direction in which the lid 4F covers the frame 20F. Therefore, by configuring the frame 20F to have flexibility in a direction intersecting the direction in which the lid 4F covers the frame 20F, this stress such as thermal distortion can be alleviated.

[0187] In this embodiment, the outer edge cover 32 of the cover 4F has a bent portion 34, and the bent portion 34 is used to provide flexibility to the cover 4F. In other words, the bent portion 34 functions as a stress absorbing structure. Furthermore, the flexibility of the bent portion 34 can be increased by reducing the thickness of the outer edge cover 32 that forms the bent portion 34.

[0188] Furthermore, since the outer edge cover 32 of the cover 4F has the bent portion 34, it is possible to alleviate stress caused by the difference in thermal expansion coefficient between the cover 4F and the frame 20D.

[0189] 12, a lid 4G may be used instead of the lid 4F. In the lid main body 31G of the lid 4G in this modification, the convex portion 30b constituting the optical element 4a is provided on the inner surface of the flat portion 30a. Therefore, the convex portion 30b of the optical element 4a has a convex surface that protrudes toward the sealed space 1a.

[0190] (Variation) Although the light source device according to the present disclosure has been described above based on the first to sixth embodiments, the present disclosure is not limited to the first to sixth embodiments.

[0191] For example, in the first embodiment, the upper end of the partition 22 of the frame 20 in the base 3 is located above the upper surface of the flat plate 30a of the lid 4, but this is not limiting. Specifically, as in light source device 1H shown in Fig. 13, the upper end of the partition 22H of the frame 20H in the base 3H may be located below the upper surface of the flat plate 30a of the lid 4. In this case, as shown in Fig. 13, the bonding material 8 may be formed so as to ride up onto the partition 22H.

[0192] Furthermore, in the above-described first to sixth embodiments, the optical element 4a (optical device) in the cover 4, 4A, and 4F is a lens, but this is not limited thereto. For example, the optical element 4a may be a deflection element such as a mirror or prism having a concave or flat inclined surface. In other words, the optical element 4a is not particularly limited as long as it is a light distribution control element that can control the light distribution of the laser light emitted from the semiconductor laser device 2.

[0193] Furthermore, in the third embodiment, the cavity between the frame body 20 and the lid body 4 (i.e., the location where the sealing material 7B is disposed) is the recessed portion of the recess 23 provided in the frame body 20, but this is not limited to this. For example, the cavity between the frame body 20 and the lid body 4 may be the recessed portion of the recess provided in the lid body 4. In other words, the recess that forms the cavity between the frame body 20 and the lid body 4 may be provided in either the frame body 20 or the lid body 4, or may be provided in both the frame body 20 and the lid body 4. This may also be applied to the fourth to sixth embodiments.

[0194] In addition, in the fifth and sixth embodiments, the bent portion 34 is provided to relieve stress caused by the difference in thermal expansion coefficient between the cover 4F and the frame 20D, but this is not limiting. For example, a stress relief structure such as a bellows may be provided to relieve stress.

[0195] In addition, this disclosure also includes forms obtained by applying various modifications that a person skilled in the art would conceive of to each embodiment and variant, and forms realized by arbitrarily combining the components and functions of each embodiment and variant within the scope that does not deviate from the intent of this disclosure. [Industrial Applicability]

[0196] The light source device according to the present disclosure is useful as a light source for products in various fields, such as image display devices such as projectors, automotive parts such as in-vehicle headlamps, lighting fixtures such as spotlights, or industrial equipment such as laser processing devices. [Explanation of symbols]

[0197] 1, 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H Light source device 1a Sealed space 2. Semiconductor laser element 2a lead pin 3, 3D, 3F, 3H base 4, 4A, 4F, 4G lid 4a Optical Elements 5. Mirror 6 Submount 7, 7S, 7B, 7C, 7D, 7F Sealing material 8 Bonding material 10 Support part 20, 20D, 20F, 20H frame 21 Frame body 21a, 22Dc, 20Fa recess 21D Side frame 22, 22H Partition 22D internal frame 22Da outer periphery 22Db inner circumference 23 Recess 24 Bend 30a flat plate part 30b Convex part 31, 31G Lid body 32 Outer edge lid 33 Bonding material 34 Bend

Claims

1. a base body having a support portion and a frame body provided on the support portion; a lid body that is fixed to the frame body in close contact with the frame body via a sealing material; a nitride semiconductor laser element disposed in a sealed space formed by the lid, the base, and the sealing material, the lid includes an optical element that imparts an optical effect to the laser light emitted from the nitride-based semiconductor laser element, the lid body and the frame body are joined via a joining material on the side of the sealing material opposite to the sealed space side, the lid body and the frame body are fixed together with the sealing material interposed between them, A cavity is provided between the frame and the lid, The sealant is disposed within the cavity; the frame has a recess in a portion facing the lid, The cavity is a recessed portion of the recess. Light source device.

2. When the recess is a first recess, the frame has a second recess inside the first recess. The light source device according to claim 1 .

3. The sealing material is made of a liquid metal.

3. The light source device according to claim 1.

4. The sealing material is a circular wire.

3. The light source device according to claim 1.

5. The circular wire is made of indium. The light source device according to claim 4 .

6. a base body having a support portion and a frame body provided on the support portion; a lid body that is fixed to the frame body in close contact with the frame body via a sealing material; a nitride semiconductor laser element disposed in a sealed space formed by the lid, the base, and the sealing material, the lid includes an optical element that imparts an optical effect to the laser light emitted from the nitride-based semiconductor laser element, the lid body and the frame body are joined via a joining material on the side of the sealing material opposite to the sealed space side, the lid body includes a lid body main body including the optical element, and an outer edge lid body located outside the lid body main body, The outer edge cover is supported by the frame, The outer periphery cover has an outer periphery and an inner periphery located inside the outer periphery, The lid body is fixed to the inner periphery, The frame is fixed to the outer periphery. Light source device.

7. a gap is provided between an inner surface of the frame body and a surface of the outer edge cover body facing the inner surface; The light source device according to claim 6 .

8. the outer circumferential portion has a bent portion on the inside of a position where the frame body is fixed to the outer circumferential portion, The light source device according to claim 6 .

9. The bonding material is made of resin.

9. The light source device according to claim 1, 2, or 6 to 8.

10. The resin is an epoxy resin. The light source device according to claim 9 .

11. The lid body and the outer edge lid are joined by low-melting point glass. The light source device according to any one of claims 6 to 8.

12. the optical element is a lens; The lens has a convex surface that protrudes toward the sealed space.

9. The light source device according to claim 1, 2, or 6 to 8.

13. a height of a light emission surface of the optical element from which the laser light is emitted is lower than a height of an upper surface of the frame body, with the support portion as a reference; 9. The light source device according to claim 1, 2, or 6 to 8.

14. The sealing material is made of a material that does not contain silicone.

9. The light source device according to claim 1, 2, or 6 to 8.

15. The sealing material is composed of an ethylene vinyl alcohol copolymer.

9. The light source device according to claim 1, 2, or 6 to 8.

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