Suction device and component mounting machine equipped with same

Abstract

This suction device is provided with a placement plate, a box-shaped member, first and second negative pressure generators, and a control device. The placement plate includes a plurality of placement portions for placing a substrate on each of the upper surfaces within a first region and a second region, and a through-hole is provided in each of the plurality of placement portions. The box-shaped member includes a space which is closed by the placement plate when the placement plate is placed on the box-shaped member, and the space is divided into a first space corresponding to the first region and a second space corresponding to the second region. The first negative pressure generator sets the interior of the first space at a negative pressure. The second negative pressure generator sets the interior of the second space at a negative pressure. The control device activates the first and second negative pressure generators when the placement plate is placed on the box-shaped member. The control device continues the activation of the first and second negative pressure generators when a first pressure inside the first space and a second pressure inside the second space are lower than a set value, and stops the second negative pressure generator when the first pressure is lower than the set value and the second pressure is higher than the set value.

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a suction device and a component mounter equipped with the same. [Background technology]

[0002] JP 2016-539019 A discloses a suction gripping device. This device has a negative pressure supply device that sucks and grips objects placed at multiple suction points using the negative pressure supply device. Each of the multiple suction points is provided with a suction valve, which slides between an open position and a closed position to open and close the suction point. In this device, when the suction point is covered by an object, the suction valve is positioned in the open position to suck and grip the object. On the other hand, when the suction point is not covered by an object, the suction valve moves from the open position to the closed position to prevent negative pressure from being supplied to the suction point. Summary of the Invention [Problem to be solved by the invention]

[0003] In JP2016-539019A, the supply of negative pressure to the suction point is controlled by moving the suction valve between an open position and a closed position. This requires providing a suction valve for each of the multiple suction points, which complicates the device configuration. This specification proposes a technology that can change the manner in which negative pressure is supplied through simple control. [Means for solving the problem]

[0004] The suction device disclosed herein includes a mounting plate having a first region and a second region, a box-shaped member on which the mounting plate is placed, a first negative pressure generator, a second negative pressure generator, a first sensor, a second sensor, and a control device. The mounting plate has a plurality of mounting sections on the upper surface within the first region and the second region, each of which has a through-hole. The box-shaped member has a space that is closed by the mounting plate when the mounting plate is placed on the box-shaped member with the through-holes of the mounting sections closed by the substrates, and the space is divided into a first space corresponding to the first region and a second space corresponding to the second region. The first negative pressure generator is connected to the first space and generates a negative pressure in the first space. The second negative pressure generator is connected to the second space and generates a negative pressure in the second space. The first sensor detects the pressure in the first space. The second sensor detects the pressure in the second space. The control device controls the first negative pressure generating device and the second negative pressure generating device. The control device activates the first negative pressure generating device and the second negative pressure generating device when the loading plate is placed on the box-shaped member. The control device continues activation of the first negative pressure generating device and the second negative pressure generating device in a first case where the first pressure detected by the first sensor and the second pressure detected by the second sensor are lower than predetermined set values, and stops operation of the second negative pressure generating device in a second case where the first pressure is lower than the set value and the second pressure is higher than the set value.

[0005] In the above-described suction device, when the mounting plate is placed on the box-shaped member with substrates placed on the mounting section, a space is formed inside the box-shaped member, enclosed by the mounting plate. Because the through-holes are blocked by the substrates, activating the negative pressure generator in this state reduces the pressure in the formed space (i.e., supplies negative pressure). In this suction device, the formed space is divided into a first space corresponding to the first region of the mounting plate and a second space corresponding to the second region. When each negative pressure generator is activated, if the pressure in the first space and the pressure in the second space are both lower than the set value (for example, if all of the through-holes in the first and second regions of the mounting plate are blocked by substrates and negative pressure is being supplied appropriately), the control device continues operating each negative pressure generator (i.e., continues suction of all substrates placed on the mounting plate). On the other hand, if the pressure in the second space is higher than the set value (for example, if some of the through-holes of the multiple mounting sections in the second area are not blocked by substrates and negative pressure is not being supplied appropriately to the second space), the control device stops activation of the second negative pressure generating device (i.e., stops suction of the substrates placed in the second area). In this way, in the above-mentioned suction device, by dividing the internal space of the box-shaped member into a first space and a second space and providing a negative pressure generating device corresponding to each space, it is possible to change the manner in which negative pressure is supplied to each area corresponding to each divided space.

[0006] This specification also discloses a component mounter. The component mounter includes the suction device disclosed in this specification and a mounting unit that mounts components onto the board. In the first case, the mounting unit mounts the components onto the board placed in the first area and the second area of the mounting plate, and in the second case, the mounting unit does not mount the components onto the board placed in the second area of the mounting plate.

[0007] In the above-described component mounter, the mounting unit mounts components only onto boards placed in the area corresponding to the space to which negative pressure is supplied. In other words, components are mounted only onto boards that are properly fixed by the applied negative pressure, allowing for highly accurate component mounting. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a block diagram showing the configuration of a control system of the component mounter according to the embodiment. [Figure 2] FIG. 2 is a perspective view showing the configuration of a suction device. [Figure 3] FIG. [Figure 4] FIG. 2 is a cross-sectional view showing the configuration of a suction device. [Figure 5] FIG. 2 is a diagram schematically illustrating the configuration of a suction device. [Figure 6] 10 is a timing chart for explaining an example of mounting processing. [Figure 7] 10 is a timing chart for explaining another example of the mounting process. DETAILED DESCRIPTION OF THE INVENTION

[0009] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0010] In one embodiment of the present technology, the set value may be set according to the type of the substrate placed on the upper surface of the mounting plate.

[0011] The negative pressure required to properly suck the substrate varies depending on the type (e.g., size and weight) of the substrate placed on the mounting plate. Therefore, in this configuration, by changing the setting value depending on the type of substrate, an appropriate negative pressure can be supplied to each space.

[0012] In one embodiment of the present technology, the loading plate may be configured such that when the substrate is placed on all of the loading sections in the first area, the substrate is placed on the loading section in the second area.

[0013] In this configuration, even if the number of substrates to be placed is small compared to the number of placement sections provided on the placement plate, substrates can be placed on all of the placement sections in the first area, thereby making it possible to effectively supply negative pressure to the first space corresponding to the first area.

[0014] (Example) Hereinafter, a component mounter 100 according to an embodiment will be described with reference to the drawings. The component mounter 100 according to this embodiment is a device that mounts components onto a board 4. The component mounter 100 is also called a component placement device or a chip mounter. Typically, the component mounter 100 is installed alongside other board work machines such as a solder printer and a board inspection machine, forming a continuous mounting line.

[0015] As shown in FIG. 1, the component mounter 100 includes a mounting unit 60 and a transport unit 62. The mounting unit 60 mounts components supplied from a component supply device at predetermined positions on a board 4. The mounting unit 60 is configured, for example, by a head provided with a nozzle and an XY robot that drives the head in the X and Y directions. The mounting unit 60 picks up components supplied from the component supply device using the nozzle and positions the head at a predetermined position relative to the board 4, thereby mounting the components picked up by the nozzle onto the board 4. The transport unit 62 carries the board 4 into the component mounter 100, positions it at the mounting position, and carries it out of the component mounter 100. After the transport unit 62 carries the board 4 into the component mounter 100 and positions it at the predetermined mounting position, the mounting unit 60 mounts the components on the board 4. The transport unit 62 is configured, for example, by a pair of belt conveyors and a drive device that drives the belt conveyors.

[0016] In the component mounter 100, after the board 4 is positioned at a predetermined mounting position, the board 4 is sucked from below, thereby applying a negative pressure to the underside of the board 4 (i.e., fixing the board 4), and components are mounted. For this reason, in this embodiment, the component mounter 100 is equipped with a suction device 10 for fixing the board 4 by suction. As shown in FIGS. 1 to 4, the suction device 10 is equipped with a mounting plate 12, a box-shaped member 20, a lifting device 26, a lifting sensor 42 (see FIGS. 1 and 5), a suction unit 30 (see FIG. 1), suction pipes 44, 46, and a control device 50.

[0017] A plurality of substrates 4 are placed on the upper surface of the mounting plate 12. As shown in FIG. 2, the mounting plate 12 has a generally rectangular flat plate shape. As shown in FIGS. 2 and 4, the mounting plate 12 has a first region 14 and a second region 16. As shown in FIGS. 2 to 4, the mounting plate 12 has a plurality of mounting sections 13 in each of the first region 14 and the second region 16, and a through hole 18 formed in each of the plurality of mounting sections 13. Each mounting section 13 is provided on the upper surface of the mounting plate 12. Each mounting section 13 is a rectangular recess. In this embodiment, 12 mounting sections 13 (i.e., 24 in total) are formed along each longitudinal side of the mounting plate 12. Furthermore, 12 mounting sections 13 are formed in each of the first region 14 and the second region 16. As shown in FIGS. 3 and 4, a through hole 18 is formed in each mounting section 13. Through-hole 18 penetrates from the bottom surface of mounting portion 13 to the underside of mounting plate 12. As shown in Fig. 3, substrate 4 is placed in mounting portion 13 so as to cover through-hole 18. The shape of mounting portion 13 is not particularly limited and may be changed as appropriate depending on the size and shape of substrate 4 to be placed thereon.

[0018] 2 and 4, the box-shaped member 20 has a box shape with an open top. As will be described in detail later, as shown in FIG. 4, the suction device 10 is used with a mounting plate 12 placed on the top surface of the box-shaped member 20. The box-shaped member 20 has a space that is closed by the mounting plate 12 when the mounting plate 12 is placed on its top surface. This space is divided into a first space 22 and a second space 24 by a partition 21 provided inside the box-shaped member 20.

[0019] As shown in FIGS. 2 and 4, one end of a suction pipe 44 is connected to the first space 22. One end of a suction pipe 46 is connected to the second space 24. Although not shown in FIGS. 2 and 4, the other ends of the suction pipes 44, 46 are connected to the suction unit 30 (see FIGS. 1 and 5). For ease of explanation, FIG. 4 depicts the suction pipes 44, 46 as being connected to opposite side surfaces of the box-shaped member 20. However, the positions at which the suction pipes 44, 46 are connected are not particularly limited as long as they are connected to the first space 22 and the second space 24, respectively. The suction unit 30 supplies negative pressure to the first space 22 and the second space 24 by sucking air from the first space 22 and the second space 24 via the suction pipes 44, 46.

[0020] The lifting device 26 is configured to be movable in the Z direction (up and down direction) by driving an actuator (not shown). The lifting device 26 supports the box-shaped member 20 on its upper surface and raises and lowers the box-shaped member 20 in the up and down direction. The lifting sensor 42 is attached to the lifting device 26. The lifting sensor 42 is, for example, a sensor that measures the distance to an object using laser light and is arranged so that its light-receiving surface faces upward. The lifting sensor 42 is configured to turn on when the distance to an object present in the direction of irradiation of the laser light (i.e., above) becomes equal to or less than a predetermined threshold. In this embodiment, the predetermined threshold is set to the distance between the light-receiving surface of the lifting sensor 42 and the upper surface of the box-shaped member 20. An output signal from the lifting sensor 42 is input to the control device 50.

[0021] The control device 50 is configured by a computer including a CPU 52 and a memory 54. The control device 50 controls the operation of each part of the suction device 10 in accordance with a program stored in the memory 54. The memory 54 stores board data 56 that describes the type (size, weight, etc.) of the board 4 to be produced.

[0022] 5, the suction device 10 further includes a relay 32, a first valve 34, a second valve 36, a first pressure sensor 38, and a second pressure sensor 40. Although the box-shaped member 20 and the lifting device 26 are depicted in separate positions in FIG. 5, in reality, the box-shaped member 20 is supported by the lifting device 26.

[0023] The relay 32 is provided between a power supply (not shown) and the first valve 34 and the second valve 36. The relay 32 switches between supplying and blocking current from the power supply to the first valve 34 and the second valve 36. The relay 32 has a first switch and a second switch (not shown). The relay 32 switches the first switch between an ON state in which current is supplied from the power supply to the first valve 34 and an OFF state in which current from the power supply to the first valve 34 is blocked. The relay 32 also switches the second switch between an ON state in which current is supplied from the power supply to the second valve 36 and an OFF state in which current from the power supply to the second valve 36 is blocked. The relay 32 switches the first switch and the second switch between an ON state and an OFF state in accordance with a control signal output from the control device 50.

[0024] The first valve 34 is provided on the suction pipe 44. The second valve 36 is provided on the suction pipe 46. Each of the valves 34, 36 may be, for example, a solenoid valve. The first valve 34 is closed by the biasing force of a spring when the current is interrupted by the relay 32 (i.e., not energized). When current is supplied via the relay 32 (i.e., when energized), the first valve 34 opens, thereby connecting the first space 22 and the suction unit 30 via the suction pipe 44. Similarly, the second valve 36 is closed when not energized, and opens when energized, thereby connecting the second space 24 and the suction unit 30 via the suction pipe 46. The suction unit 30 and the first valve 34 are an example of a "first negative pressure generator," and the suction unit 30 and the second valve 36 are an example of a "second negative pressure generator."

[0025] The first pressure sensor 38 detects the pressure in the first space 22. The first pressure sensor 38 is configured to turn on when the detected pressure is lower than a predetermined set value. The second pressure sensor 40 detects the pressure in the second space 24. The second pressure sensor 40 is configured to turn on when the detected pressure is lower than the set value. This set value is not particularly limited, but may be set appropriately based on, for example, substrate data 56 (i.e., the type of substrate 4 to be produced (placed on the mounting plate 12)) stored in the memory 54. Because the negative pressure values required for optimally sucking the substrate 4 vary, setting the set value based on the substrate data 56 allows appropriate negative pressure to be supplied to each space 22, 24. Furthermore, for example, the set value may be a predetermined value or may be set by an operator. Output signals from the first pressure sensor 38 and the second pressure sensor 40 are input to the control device 50.

[0026] As described above, the component mounter 100 applies negative pressure to the underside of the board 4 to suction and fix the board 4, and mount components on the board 4. Below, the procedure for the mounting process of mounting components on the board 4 using the suction device 10 will be described.

[0027] 3, the substrates 4 are placed on each of the plurality of placement sections 13 provided on the placement plate 12. At this time, the substrates 4 are placed on the placement sections 13 in the first region 14 of the placement plate 12 in order. That is, after the substrates 4 have been placed on all the placement sections 13 in the first region 14, the substrates 4 are placed on the placement sections 13 provided in the second region 16. Once the substrates 4 have been placed on all the placement sections 13 in the first region 14 and the second region 16, the substrates 4 are placed on the placement sections 13 of another (next) placement plate 12 in order.

[0028] The mounting plate 12, on which the substrates 4 have been placed on all of the mounting sections 13, is carried into the mounter 100 by the transport section 62 (for example, a pair of belt conveyors). Then, as shown in Fig. 2, the mounting plate 12 is positioned above the box-shaped member 20 by the transport section 62 (not shown in Fig. 2). Here, the mounting plate 12 is positioned with respect to the box-shaped member 20 so that the first region 14 of the mounting plate 12 is located above the first space 22 and the second region 16 of the mounting plate 12 is located above the second space 24.

[0029] Once the mounting plate 12 is positioned, as shown in Fig. 5, a command S to start the suction operation is input from a host control device (not shown) to the control device 50. The host control device controls the operation of the entire component mounter 100 (e.g., the mounting unit 60, the transport unit 62). When the command S is input, the control device 50 operates the suction unit 30 to start suction. The control device 50 also switches the first switch and the second switch of the relay 32 from an off state to an on state, supplying current to each of the valves 34, 36. As a result, each of the valves 34, 36 changes from a closed state to an open state, connecting the first space 22 and the second space 24 with the suction unit 30, and sucking air from the first space 22 and the second space 24.

[0030] The control device 50 also raises the lifting device 26. At this time, the lifting sensor 42 measures the distance to the mounting plate 12 located above the box-shaped member 20. When the mounting plate 12 abuts against the upper surface of the box-shaped member 20, the measured distance becomes equal to or less than a threshold, and the lifting sensor 42 turns on. The control device 50 monitors the output signal from the lifting sensor 42, and stops driving the lifting device 26 in response to the lifting sensor 42 turning on.

[0031] Since all of the through holes 18 provided in the mounting portion 13 are blocked by the substrates 4, when the mounting plate 12 is placed on the box-shaped member 20, the first space 22 and the second space 24 are sealed. At this time, the suction portion 30 continues to apply suction, so negative pressure is supplied to the first space 22 and the second space 24. The negative pressure in the first space 22 and the second space 24 acts on the lower surface of each substrate 4 through each through hole 18, and the positions of each substrate 4 and the mounting plate 12 are fixed.

[0032] Once the position of each board 4 is fixed, the mounting unit 60 mounts components on each board 4. When mounting of predetermined components on the board 4 is completed, the control device 50 switches the first switch and second switch of the relay 32 from the on state to the off state, thereby cutting off the current to each of the valves 34, 36. This stops the supply of negative pressure to the first space 22 and the second space 24. The control device 50 also stops the operation of the suction unit 30 and lowers the lifting device 26. Thereafter, the transport unit 62 carries out the mounting plate 12 on which the boards 4 after component mounting are placed from the component mounter 100. The process of mounting components on the boards 4 is performed according to the above procedure.

[0033] In the above example, the mounting process was described in a situation where boards 4 were placed on all of the mounting sections 13. However, in reality, depending on the number of boards 4 to be produced, some of the mounting sections 13 on the mounting plate 12 may not have any boards 4 placed on them. In this embodiment, the control device 50 determines that such a situation has occurred and can supply an appropriate negative pressure depending on the situation. Below, the mounting process in a situation where the number of boards 4 placed on the mounting sections 13 varies will be described with reference to FIGS. 6 and 7.

[0034] First, the mounting process in a situation where substrates 4 are placed on all of the placement sections 13 of the placement plate 12 (i.e., all of the placement sections 13 in the first area 14 and the second area 16), as in the example described above, will be explained with reference to the timing chart of Figure 6.

[0035] When the mounting plate 12 is carried into the component mounter 100 by the transport unit 62 and positioned at a predetermined mounting position, a command S (i.e., a command to start the suction operation) is input from the upper control unit to the control unit 50 at timing t1 in Fig. 6. The control unit 50 then activates the suction unit 30 and switches the first switch and second switch of the relay 32 from the OFF state to the ON state, thereby opening the valves 34, 36. This starts suction of air from the first space 22 and the second space 24. Also at timing t1, the control unit 50 raises the lifting device 26.

[0036] At timing t2, when the upper surface of the box-shaped member 20, which has been moved upward by the lifting device 26, abuts against the lower surface of the mounting plate 12, the lifting sensor 42 turns on. As a result, the first space 22 and the second space 24 are sealed, and negative pressure is supplied into the first space 22 and the second space 24 by the suction unit 30. Because both the first space 22 and the second space 24 are sealed, the pressure in the first space 22 and the second space 24 is gradually reduced. In response to the lifting sensor 42 turning on, the control device 50 stops driving the lifting device 26.

[0037] At timing t3, when the pressure in the first space 22 and the second space 24 becomes lower than a set value, the first pressure sensor 38 and the second pressure sensor 40 turn on. The set value is set to a negative pressure value necessary to ensure the accuracy of mounting components on the board 4. When the control device 50 detects that the first pressure sensor 38 and the second pressure sensor 40 have turned on at timing t3, the mounting unit 60 starts mounting components on the board 4.

[0038] After that, at timing t4, when mounting of predetermined components on the board 4 is completed, the control device 50 switches the first switch and the second switch of the relay 32 from the on state to the off state, thereby closing the valves 34, 36. This blocks communication between the first space 22 and the second space 24 and the suction unit 30, and stops the supply of negative pressure.

[0039] At timing t5, when the pressures in the first space 22 and the second space 24 become higher than the set values, the first pressure sensor 38 and the second pressure sensor 40 turn off. Then, the control device 50 lowers the lifting device 26.

[0040] As the box-shaped member 20 moves downward by the lifting device 26, the lifting sensor 42 turns off at timing t6. As a result, the mounting plate 12 changes from being supported by the box-shaped member 20 to being supported by the transport unit 62. Then, the mounting plate 12, on which the board 4 after component mounting is placed, is carried out of the component mounter 100 by the transport unit 62, and the mounting process is completed.

[0041] As described above, in this embodiment, the substrates 4 are placed on the placement portions 13 in the first area 14 in order. For this reason, among the placement plates 12 carried into the predetermined mounting position, there may be some placement portions 13 in the first area 14 with substrates 4 placed on them, but some placement portions 13 in the second area 16 with no substrates 4 placed on them. The mounting process in such a situation will be described below with reference to the timing chart in FIG. 7.

[0042] Timing t10 in FIG. 7 is the same as t1 in FIG. 6. At timing t11, the lift sensor 42 turns on. In response to the lift sensor 42 turning on, the control device 50 stops driving the lift device 26. Here, the first space 22 corresponding to the first region 14 is sealed. However, because some of the through-holes 18 in the second region 16 are not blocked by the substrate 4, the second space 24 corresponding to the second region 16 is not sealed. For this reason, while a negative pressure is appropriately supplied to the first space 22, the negative pressure supplied to the second space 24 leaks through some of the through-holes 18.

[0043] As a result, at a subsequent timing t12, the pressure in the first space 22 becomes lower than the set value, while the pressure in the second space 24 remains higher than the set value. Therefore, at timing t12, the first pressure sensor 38 turns on, but the second pressure sensor 40 does not turn on.

[0044] When the control device 50 detects that the second pressure sensor 40 is not turned on while the lift sensor 42 is turned on, it determines that the negative pressure required to ensure the accuracy of mounting components on the board 4 is not being supplied to the second space 24. Therefore, at timing t13, the control device 50 switches the second switch of the relay 32 from the on state to the off state. This closes the second valve 36, stopping the supply of negative pressure to the second space 24. The control device 50 then outputs a signal to the host control device indicating that negative pressure is being applied to the boards 4 in the first area 14 but not to the boards 4 in the second area 16. Upon detecting this signal, the host control device causes the mounting unit 60 to mount components only on the boards 4 placed in the first area 14.

[0045] Thereafter, at timing t14, when mounting of predetermined components on the board 4 placed in the first area 14 is completed, the control device 50 switches the first switch of the relay 32 from the on state to the off state, thereby closing the first valve 34. This blocks communication between the first space 22 and the suction unit 30, and stops the supply of negative pressure to the first space 22.

[0046] At timing t15, when the pressure in the first space 22 becomes higher than the set value, the first pressure sensor 38 turns off. Then, the control device 50 lowers the lifting device 26. Timing t16 is the same as timing t6 in Fig. 6. Thereafter, as in the description of Fig. 6, the mounting process is completed when the mounting plate 12 is carried out of the component mounter 100 by the transport unit 62.

[0047] As described above, in this embodiment, the mounting plate 12 is placed on the box-shaped member 20 with the substrate 4 placed on the mounting section 13, and negative pressure is applied to the underside of the substrate 4, thereby suction-fixing the substrate 4 and mounting components. In the suction device 10 of this embodiment, the space formed inside the box-shaped member 20 is divided into a first space 22 corresponding to the first region 14 of the mounting plate 12 and a second space 24 corresponding to the second region 16. After operating the suction section 30 (after timing t1 in FIG. 6 ), if the pressure in the first space 22 and the pressure in the second space 24 both become lower than the set values (timing t3 in FIG. 6 ), the control device 50 maintains the first valve 34 and the second valve 36 in an open state. As a result, suction continues on all of the substrates 4 placed on the mounting plate 12, and components are mounted on all of the substrates 4 by the mounting section 60. On the other hand, if the pressure in the second space 24 remains higher than the set value (timing t12 in FIG. 7) after the suction unit 30 is operated (after timing t10 in FIG. 7), the control device 50 switches the second valve 36 to a closed state. As a result, the control device 50 stops the supply of negative pressure into the second space 24. Then, the mounting unit 60 mounts components only on the board 4 placed in the first region 14. As described above, in this embodiment, by dividing the internal space of the box-shaped member 20 into the first space 22 and the second space 24 and providing valves 34, 36 corresponding to each of the spaces 22, 24, the manner in which negative pressure is supplied can be changed for each of the regions 14, 16 corresponding to the divided spaces 22, 24.

[0048] Furthermore, in this embodiment, after the substrates 4 have been placed on all of the placement sections 13 in the first area 14, the substrates 4 are placed on the placement sections 13 provided in the second area 16. With this configuration, even if the number of substrates 4 to be placed is small compared to the number of placement sections 13 provided on the placement plate 12, the substrates 4 can be placed on all of the placement sections 13 in the first area 14, and therefore, negative pressure can be suitably applied to the lower surfaces of the substrates 4 in the first area 14.

[0049] Although specific examples of the technology disclosed in this specification have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. Modifications of the above examples are listed below.

[0050] In the above-described embodiment, the interior of the box-shaped member 20 is divided into the first space 22 and the second space 24 by the partition 21, but the interior space of the box-shaped member 20 may be divided into three or more spaces. In this case, by providing a pressure sensor and a valve corresponding to each space, the manner in which negative pressure is supplied to each space can be changed, and the negative pressure acting on each area of the mounting plate 12 corresponding to each space can be controlled in more detail.

[0051] Furthermore, in the above-described embodiment, the pressure sensor is configured to turn on when all of the through holes 18 in a certain region are blocked by the substrate 4. However, even if a substrate 4 is not placed on some of the placement sections 13 in that region, the pressure sensor may be configured to turn on when the pressure in the space of the box-shaped member 20 corresponding to that region reaches a value necessary to ensure the mounting accuracy of components.

[0052] Furthermore, in the above-described embodiment, the substrates 4 are placed in order starting from the placement sections 13 in the first region 14 of the placement plate 12, but the order in which the substrates 4 are placed is not particularly limited, and for example, the substrates 4 may be placed on the multiple placement sections 13 in a random order.

[0053] The lift sensor 42 may also be another sensor such as a contact sensor.

[0054] The technical elements described in this specification or drawings exhibit technical utility either alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technologies illustrated in this specification or drawings simultaneously achieve multiple objectives, and achieving one of those objectives is itself technically useful.

Claims

1. a mounting plate having a first region and a second region, the mounting plate having a plurality of mounting portions on an upper surface of each of the first region and the second region, the mounting portion having a through hole, the mounting plate; a box-shaped member on which the mounting plate is placed, the box-shaped member having a space that is closed by the mounting plate when the mounting plate is placed on the box-shaped member with the through holes of each of the mounting portions closed by the board, the space being divided into a first space corresponding to the first region and a second space corresponding to the second region; a first negative pressure generating device connected to the first space and configured to create a negative pressure in the first space; a second negative pressure generating device connected to the second space and configured to create a negative pressure in the second space; a first sensor that detects a pressure in the first space; a second sensor that detects the pressure in the second space; a control device that controls the first negative pressure generating device and the second negative pressure generating device; It is equipped with the control device activates the first negative pressure generating device and the second negative pressure generating device when the loading plate is placed on the box-shaped member; In a first case where the first pressure detected by the first sensor and the second pressure detected by the second sensor are lower than predetermined set values, continuing to activate the first negative pressure generating device and the second negative pressure generating device; stopping the second negative pressure generator in a second case where the first pressure is lower than the set value and the second pressure is higher than the set value; Suction device.

2. The suction device according to claim 1 , wherein the set value is set according to the type of the substrate placed on the upper surface of the loading plate.

3. 3. The suction device according to claim 1, wherein the mounting plate is configured such that when the substrates are placed on all of the mounting portions in the first area, the substrates are placed on the mounting portions in the second area.

4. The suction device according to any one of claims 1 to 3; a mounting section that mounts components on the substrate; It is equipped with The mounting section In the first case, the components are mounted on the board placed in the first area and the second area of the mounting plate; In the second case, the components are not mounted on the board placed in the second area of the mounting plate. Component mounting machine.

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