Heat Treatment Equipment

Abstract

To improve maintainability.SOLUTION: A thermal processing device comprises a heating part, a bottom wall, a chamber, and a guide part. The heating part supports and heats a substrate to which a processing liquid is supplied. The bottom wall surrounds the substrate supported by the heating part. The chamber includes a top plate covering the heating part and a side wall provided between the bottom wall and the top plate, and is freely attachable / detachable to / from a base part at which the heating part is provided. The guide part guides the movement of the chamber from a mounting position surrounding the substrate on the heating part by a space in the chamber along a predetermined movable direction along an upper surface of the heating part.SELECTED DRAWING: Figure 14

Description

[Technical Field]

[0001] The present disclosure relates to a thermal processing apparatus. [Background technology]

[0002] Patent Document 1 discloses a heat treatment device configured such that an air current flowing from an inlet for introducing gas to an outlet is generated in one direction above the hot plate along the surface of the hot plate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-185471 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a heat treatment device that is useful for improving maintainability. [Means for solving the problem]

[0005] A heat treatment apparatus according to one aspect of the present disclosure includes a heating unit, a bottom wall, a chamber, and a guide unit. The heating unit supports and heats a substrate supplied with a processing liquid. The bottom wall surrounds the substrate supported by the heating unit. The chamber includes a top plate covering the heating unit and a side wall provided between the bottom wall and the top plate, and is detachable from a base unit on which the heating unit is provided. The guide unit guides movement of the chamber in a predetermined movable direction along the upper surface of the heating unit from a mounting position where the space within the chamber surrounds the substrate on the heating unit. [Effects of the Invention]

[0006] According to the present disclosure, a heat treatment device useful for improving maintainability is provided. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a perspective view schematically illustrating an example of a substrate processing system. [Figure 2] FIG. 2 is a side view schematically showing an example of a coating and developing apparatus. [Figure 3] FIG. 3 is a side view schematically showing an example of the heat treatment unit. [Figure 4] FIG. 4 is a top view schematically showing an example of a chamber and an exhaust unit. [Figure 5] FIG. 5 is a bottom view schematically illustrating an example of a chamber and an exhaust unit. [Figure 6] 6(a) and 6(b) are side views schematically showing an example of the chamber. [Figure 7] FIG. 7 is a top view schematically showing an example of the interior of the chamber. [Figure 8] FIG. 8 is a perspective view schematically illustrating an example of a flow path adjusting section. [Figure 9] FIG. 9 is a top view schematically showing an example of the interior of the chamber. [Figure 10] 10(a) and 10(b) are side views that schematically show an example of the shutter section. [Figure 11] FIG. 2 is a side view schematically illustrating an example of a shutter unit and surrounding members. [Figure 12] FIG. 12 is a perspective view schematically illustrating an example of the inside of the exhaust unit. [Figure 13] FIG. 13 is a perspective view schematically showing an example of a state in which the chamber is attached. [Figure 14] FIG. 14 is a perspective view schematically showing an example of a state when the chamber is removed. [Figure 15] 15(a) and 15(b) are side views schematically showing an example of the operation of attaching and detaching the chamber. [Figure 16] FIG. 16 is a block diagram illustrating an example of a hardware configuration of the control device. [Figure 17] FIG. 17 is a flowchart showing an example of a series of steps executed in the heat treatment. [Figure 18] 18(a) and 18(b) are schematic diagrams showing an example of the state of the heat treatment. [Figure 19] FIG. 19 is a schematic diagram showing an example of the heat treatment. [Figure 20] 20(a) and 20(b) are schematic diagrams showing an example of how the chamber is removed. [Figure 21] 21(a) and 21(b) are schematic diagrams showing an example of a configuration for attaching and detaching a chamber. [Figure 22] 22(a) and 22(b) are schematic diagrams showing an example of how the chamber is removed. [Figure 23] 23(a) and 23(b) are schematic diagrams showing an example of a configuration for attaching and detaching a chamber. [Figure 24] 24(a) and 24(b) are schematic diagrams showing an example of how the chamber is removed. [Figure 25] Figure 25(a) is a plan view schematically showing an example of a base member, and Figure 25(b) is a schematic view showing an example of how the base member is removed. DETAILED DESCRIPTION OF THE INVENTION

[0008] An embodiment will be described below with reference to the drawings. In the description, identical elements or elements having identical functions are given the same reference numerals, and duplicated explanations will be omitted. Some drawings show a Cartesian coordinate system defined by an X-axis, a Y-axis, and a Z-axis. In the following embodiment, the Z-axis corresponds to the vertical direction, and the X-axis and Y-axis correspond to the horizontal direction.

[0009] The substrate processing system 1 shown in FIG. 1 is a system that forms a photosensitive coating on a workpiece W, exposes the photosensitive coating, and develops the photosensitive coating. The workpiece W to be processed is, for example, a substrate, or a substrate on which a film, circuit, or the like has been formed by performing a predetermined process. One example of the substrate is a silicon wafer. The workpiece W (substrate) may be circular. The workpiece W may also be a glass substrate, a mask substrate, or an FPD (Flat Panel Display), etc. The photosensitive coating is, for example, a resist film.

[0010] 1 and 2, the substrate processing system 1 includes a coating and developing apparatus 2 (substrate processing apparatus) and an exposure apparatus 3. The exposure apparatus 3 is an apparatus that exposes a resist film (photosensitive coating) formed on a workpiece W (substrate). Specifically, the exposure apparatus 3 irradiates an exposure target portion of the resist film with energy rays by a method such as immersion exposure.

[0011] [Coating and developing equipment] The coating and developing apparatus 2 applies a resist (chemical solution) to the surface of the workpiece W to form a resist film before exposure processing by the exposure apparatus 3, and then develops the resist film after exposure processing. The coating and developing apparatus 2 (heat treatment apparatus) includes a carrier block 4, a processing block 5, an interface block 6, and a control device 100.

[0012] The carrier block 4 introduces the workpiece W into the coating and developing apparatus 2 and removes the workpiece W from the coating and developing apparatus 2. For example, the carrier block 4 can support multiple carriers C for the workpiece W and has a built-in transport device A1 including a transfer arm. The carrier C accommodates, for example, multiple circular workpieces W. The transport device A1 removes the workpiece W from the carrier C and passes it to the processing block 5, and receives the workpiece W from the processing block 5 and returns it to the carrier C. The processing block 5 has processing modules 11, 12, 13, and 14.

[0013] The processing module 11 incorporates a liquid processing unit U1, a heat processing unit U2, and a transport device A3 that transports the workpiece W to these units. The processing module 11 forms an underlayer film on the surface of the workpiece W using the liquid processing unit U1 and the heat processing unit U2. The liquid processing unit U1 applies a processing liquid for forming the underlayer film onto the workpiece W. The heat processing unit U2 performs various heat treatments associated with the formation of the underlayer film. In the processing module 11, multiple heat processing units U2 may be stacked.

[0014] The processing module 12 incorporates a liquid processing unit U1, a heat processing unit U2, and a transport device A3 that transports the workpiece W to these units. The processing module 12 forms a resist film on the underlying film using the liquid processing unit U1 and the heat processing unit U2. The liquid processing unit U1 applies a processing liquid for forming the resist film onto the underlying film. The heat processing unit U2 performs various heat treatments associated with the formation of the resist film. In the processing module 12, multiple heat processing units U2 may be stacked.

[0015] The processing module 13 incorporates a liquid processing unit U1, a heat processing unit U2, and a transport device A3 that transports the workpiece W to these units. The processing module 13 forms an upper layer film on the resist film using the liquid processing unit U1 and the heat processing unit U2. The liquid processing unit U1 applies a processing liquid for forming the upper layer film onto the resist film. The heat processing unit U2 performs various heat treatments associated with the formation of the upper layer film. In the processing module 13, multiple heat processing units U2 may be stacked.

[0016] The processing module 14 incorporates a liquid processing unit U1, a thermal processing unit U2, and a transport device A3 that transports the workpiece W to these units. The processing module 14 uses the liquid processing unit U1 and the thermal processing unit U2 to perform development processing of the exposed resist film and thermal processing associated with the development processing. The liquid processing unit U1 supplies a developer onto the surface of the exposed workpiece W and then rinses it away with a rinse liquid to form a resist pattern (development processing of the resist film). The thermal processing unit U2 performs various thermal processing associated with the development processing. Specific examples of thermal processing include a post-exposure bake (PEB) before the development processing and a post-exposure bake (PB) after the development processing. Multiple thermal processing units U2 may be stacked in the processing module 14.

[0017] A shelf unit U10 is provided on the carrier block 4 side within the processing block 5. The shelf unit U10 is divided into multiple cells arranged in the vertical direction. A transport device A7 including a lifting arm is provided near the shelf unit U10. The transport device A7 raises and lowers the workpiece W between the cells of the shelf unit U10.

[0018] A shelf unit U11 is provided on the interface block 6 side in the processing block 5. The shelf unit U11 is divided into a plurality of cells arranged in the vertical direction.

[0019] The interface block 6 transfers the workpiece W to and from the exposure apparatus 3. For example, the interface block 6 has a built-in transport device A8 including a transfer arm, and is connected to the exposure apparatus 3. The transport device A8 transfers the workpiece W placed on the shelf unit U11 to the exposure apparatus 3. The transport device A8 receives the workpiece W from the exposure apparatus 3 and returns it to the shelf unit U11.

[0020] The control device 100 (controller) is configured to control the various devices included in the coating and developing apparatus 2. The control device 100 controls the various devices of the coating and developing apparatus 2 to perform coating and developing processing, for example, in the following procedure. First, the control device 100 controls the transport device A1 to transport the workpiece W in the carrier C to the shelf unit U10, and then controls the transport device A7 to place the workpiece W in a cell for the processing module 11.

[0021] Next, the control device 100 controls the transport device A3 to transport the workpiece W on the shelf unit U10 to the liquid processing unit U1 and the heat processing unit U2 in the processing module 11. The control device 100 also controls the liquid processing unit U1 and the heat processing unit U2 to form an underlayer film on the surface of the workpiece W. Thereafter, the control device 100 controls the transport device A3 to return the workpiece W on which the underlayer film has been formed to the shelf unit U10, and controls the transport device A7 to place the workpiece W in a cell for the processing module 12.

[0022] Next, the control device 100 controls the transport device A3 to transport the workpiece W on the shelf unit U10 to the liquid processing unit U1 and the heat processing unit U2 in the processing module 12. The control device 100 also controls the liquid processing unit U1 and the heat processing unit U2 to form a resist film on the underlying film of the workpiece W. Thereafter, the control device 100 controls the transport device A3 to return the workpiece W to the shelf unit U10, and controls the transport device A7 to place the workpiece W in a cell for the processing module 13.

[0023] Next, the control device 100 controls the transport device A3 to transport the workpiece W on the shelf unit U10 to each unit in the processing module 13. The control device 100 also controls the liquid processing unit U1 and the heat processing unit U2 to form an upper layer film on the resist film of the workpiece W. Thereafter, the control device 100 controls the transport device A3 to transport the workpiece W to the shelf unit U11.

[0024] Next, the control device 100 controls the transport device A8 to send the workpiece W on the shelf unit U11 to the exposure device 3. Thereafter, the control device 100 controls the transport device A8 to receive the workpiece W that has been subjected to the exposure process from the exposure device 3 and place it in a cell for the processing module 14 in the shelf unit U11.

[0025] Next, the control device 100 controls the transport device A3 to transport the workpiece W from the shelf unit U11 to each unit in the processing module 14, and controls the liquid processing unit U1 and the heat processing unit U2 to perform development processing of the resist film on the workpiece W. Thereafter, the control device 100 controls the transport device A3 to return the workpiece W to the shelf unit U10, and controls the transport devices A7 and A1 to return the workpiece W into the carrier C.

[0026] This completes the coating and developing process for one workpiece W. The control device 100 controls the various devices of the coating and developing apparatus 2 so that the coating and developing process is performed on each of the subsequent multiple workpieces W in the same manner as described above. The specific configuration of the coating and developing apparatus 2 is not limited to the configuration exemplified above. The coating and developing apparatus 2 may be any type as long as it is equipped with a unit that performs heat treatment.

[0027] [Heat treatment unit] Next, an example of the heat treatment unit U2 will be described in detail with reference to Figures 3 to 15. The heat treatment unit U2 (heat treatment device) is configured to perform heat treatment on at least the workpiece W. As shown in Figure 3, the heat treatment unit U2 includes, for example, a housing 20, a transport unit 30, and a heat treatment unit 40.

[0028] (Housing) The housing 20 houses some of the components of the heat-treating unit U2. The housing 20 may be formed to extend along one horizontal direction (for example, the X-axis direction in the figure). The internal space formed by the housing 20 may be rectangular parallelepiped-shaped. One side wall in the longitudinal direction of the housing 20 is provided with an inlet 21 for loading the workpiece W into the housing 20. In the following description, the longitudinal direction of the housing 20 is referred to as the "front-rear direction," and the horizontal direction perpendicular to the longitudinal direction of the housing 20 (for example, the Y-axis direction in the figure) is referred to as the "left-right direction." In the front-rear direction, the inlet 21, the transport section 30, and the heat-treating section 40 are arranged in this order.

[0029] (Transportation section) The transport unit 30 transports the workpiece W and cools the workpiece W. The transport unit 30 has, for example, a cooling plate 31, a connecting unit 32, a drive unit 33, and a guide rail 34. The cooling plate 31 supports and cools the workpiece W. A refrigerant flow path (not shown) through which a cooling refrigerant flows is formed inside the cooling plate 31. The connecting unit 32 is connected to the cooling plate 31. The connecting unit 32 is movable in the front-to-rear direction within the housing 20. The housing 20 may be provided with a base 24 that divides its internal space into upper and lower sections. The cooling plate 31 is disposed above the base 24, and the connecting unit 32 is provided to penetrate the base 24 from top to bottom.

[0030] The drive unit 33 includes a drive source such as an electric motor, and moves the connecting unit 32 along guide rails 34 extending in the front-to-rear direction. The movement of the connecting unit 32 causes the cooling plate 31 to move in the front-to-rear direction. The drive unit 33 drives the connecting unit 32 so that the cooling plate 31 moves back and forth between a heating position in the heat treatment unit 40 where the workpiece W is heated, and a standby position between the heating position and the carry-in entrance 21. The transport unit 30 (cooling plate 31) cools the workpiece W at the standby position.

[0031] (heat treatment section) The heat treatment unit 40 heats the workpiece W at the heating position. The heat treatment unit 40 includes a heating unit 42, an elevator unit 44, a chamber 50, a partition unit 60, a shutter unit 70, an exhaust unit 80, and a switching unit 90. First, an overview of the heat treatment unit 40 will be described. The heating unit 42 supports and heats the workpiece W on which a film of processing liquid has been formed. The elevator unit 44 transfers the workpiece W to and from the cooling plate 31 of the transport unit 30.

[0032] The chamber 50 is disposed so as to surround the workpiece W supported by the heating unit 42. The chamber 50 is a lid body and forms a space (hereinafter referred to as "internal space S") for heating the workpiece W. The partition unit 60 separates the internal space S within the chamber 50 into a processing space S1 (first space) to which the workpiece W on the heating unit 42 is exposed, and an evacuation space S2 (second space) located above the processing space S1. The shutter unit 70 is a member that opens and closes a loading / unloading port 57 for the workpiece W, which is provided on the side wall of the chamber 50. The shutter unit 70 closes the loading / unloading port 57 to form the internal space S, and the workpiece W is heated with the internal space S formed.

[0033] The exhaust unit 80 exhausts gas from the internal space S within the chamber 50 through exhaust ports 58 located around the heating unit 42. During heating of the workpiece W, sublimates are generated from the film of processing liquid formed on the surface of the workpiece W. The exhaust unit 80 exhausts (exhausts) the gas, thereby recovering the sublimates generated within the internal space S. The exhaust ports 58 include a first exhaust port 58a that opens into the processing space S1 and a second exhaust port 58b that opens into the evacuation space S2.

[0034] The switching unit 90 switches between a state in which the exhaust unit 80 exhausts gas through the processing space S1 (hereinafter referred to as the "first exhaust state") and a state in which the exhaust unit 80 exhausts gas through the evacuation space S2 (hereinafter referred to as the "second exhaust state"). In the first exhaust state (first state), the exhaust unit 80 exhausts gas from the processing space S1 through the first exhaust port 58a, but does not exhaust gas from the evacuation space S2 through the second exhaust port 58b. In the second exhaust state (second state), the exhaust unit 80 exhausts gas from the evacuation space S2 through the second exhaust port 58b, but does not exhaust gas from the processing space S1 through the first exhaust port 58a.

[0035] In the front-to-rear direction, a standby position where the cooling plate 31 cools the workpiece W, the shutter unit 70, the chamber 50 (heating unit 42), and the exhaust unit 80 are arranged in this order. The exhaust unit 80 may be arranged so that most of it protrudes outward from the housing 20. An example of each member included in the heat processing unit 40 will be described in detail below.

[0036] <Heating part> The heating unit 42 is fixed at a predetermined position within the housing 20. The heating unit 42 is supported, for example, by a base 25. The base 25 is fixed to the bottom wall or side wall of the housing 20. The base 25 may be connected to the base 24. The heating unit 42 has a heat plate 43 formed in a disk shape. A heater is provided inside the heat plate 43. The diameter of the heat plate 43 may be larger than the diameter of the workpiece W. The workpiece W is supported on the upper surface of the heat plate 43, and the workpiece W is heated as the temperature of the heat plate 43 increases.

[0037] <Lifting section> The lifting unit 44 raises and lowers the workpiece W above the hot plate 43. The lifting unit 44 raises and lowers the workpiece W, for example, between a processing height at which the workpiece W is supported (placed) on the heating unit 42 and a delivery height above the heating unit 42 and away from the heating unit 42, at which the workpiece W is delivered to and from the transport unit 30. The lifting unit 44 has a plurality of lifting pins 45 and a lifting drive unit 46. The lifting pins 45 are pins that support the workpiece W from below and penetrate the heating unit 42 in the vertical direction. The lifting drive unit 46 includes a power source such as an electric motor or a cylinder, and moves the lifting pins 45 in the vertical direction.

[0038] <Chamber bottom wall> The heating processing unit 40 has a bottom wall 56 (see FIG. 5). The chamber 50 covers the workpiece W supported by the heating unit 42, and together with the bottom wall 56 and the shutter unit 70, forms the internal space S. The internal space S is a closed space that can sufficiently heat the film of processing liquid formed on the workpiece W. As shown in FIG. 4 or 5, the chamber 50 is formed to extend in the front-to-rear direction in a plan view (viewed from above). The outer edge of the chamber 50 may be formed as a rectangle with one side missing in a portion closer to the standby position, and may be formed as an arc in a portion away from the standby position. At the outer edge of the chamber 50, one side of the rectangle is deformed into an arc, and the arc-shaped side is formed to protrude outward.

[0039] The chamber 50 has a top plate 51, a side wall 52, a side wall 53, a side wall 54, and a side wall 55. The top plate 51 is a plate-shaped member that covers the heating unit 42. In a plan view, the outer edge of the top plate 51 surrounds the outer edge of the heating unit 42 (hot plate 43), and the area of the top plate 51 is larger than the area of the heating unit 42. The outer edge of the top plate 51 forms the outer edge of the chamber 50. The top surface of the internal space S is defined by the top plate 51.

[0040] The bottom wall 56 surrounds the workpiece W supported by the heating unit 42. In a plan view, the outer edge of the bottom wall 56 surrounds the outer edge of the heating unit 42 (hot plate 43), and the area of the region surrounded by the outer edge of the bottom wall 56 is larger than the area of the heating unit 42. In a plan view, the outer edge of the bottom wall 56 may approximately coincide with the outer edge of the top plate 51. The top plate 51 may cover the heating unit 42 and the bottom wall 56. The bottom wall 56 may be connected to the lower ends of each side wall of the chamber 50, or may be formed integrally with the chamber 50. The following describes an example in which the chamber 50 and the bottom wall 56 are formed integrally.

[0041] As shown in FIG. 5, an exposure hole 56a for exposing the heating section 42 is formed in the bottom wall 56 (see also FIG. 7). The exposure hole 56a may be smaller than the outer edge of the heating section 42. In a plan view, a portion of the bottom wall 56 may cover the peripheral edge of the heating section 42 (see also FIG. 11). In the vertical direction, the lower part of the bottom wall 56 may be positioned at the same height as the upper part of the heating section 42. The lower surface of the internal space S is defined by the bottom wall 56 and the heating section 42.

[0042] Side walls 52, 53, 54, and 55 are provided between the top plate 51 and the bottom wall 56. The side walls 52, 53, 54, and 55 are each formed to extend downward from the peripheral edge of the top plate 51. The side walls 52, 53, 54, and 55 define a portion of the side of the internal space S. The side walls 52 and 53 are arranged side by side in the front-to-rear direction with the heating unit 42 sandwiched therebetween. The side walls 54 and 55 are arranged side by side in the left-to-right direction with the heating unit 42 sandwiched therebetween. The side wall 52 is arranged closer to the shutter unit 70 (or the above-mentioned position) than the side wall 53. In this case, the shutter unit 70, side wall 52, and side wall 53 are arranged in this order in the front-to-rear direction.

[0043] The side wall 52 is formed to extend in the left-right direction. One end of the side wall 52 in the left-right direction is connected to the side wall 54, and the other end of the side wall 52 in the left-right direction is connected to the side wall 55. The side wall 54 and the side wall 55 are each formed to extend in the front-rear direction. In the front-rear direction, the length of the side wall 54 may be approximately the same as the length of the side wall 55.

[0044] One end of the side wall 53 is connected to the side wall 54, and the other end is connected to the side wall 55, and the side wall 53 is formed in an arc shape in a plan view. The length of the side wall 53 in the left-right direction may be approximately the same as the length of the side wall 52. In a plan view, the side wall 53 may extend in a circumferential direction around the center of the heating unit 42 (or the center of the hot plate 43). The thickness of the central portion of the side wall 53 in the left-right direction may be greater in the front-to-back direction than other portions. The central portion of the side wall 53 in the left-right direction may protrude in a direction away from the shutter unit 70. The protruding portion of the central portion of the side wall 53 in the left-right direction may be surrounded by the side wall opposite the side wall on which the loading entrance 21 of the housing 20 is provided.

[0045] As shown in FIG. 6(a), a loading / unloading port 57 for the workpiece W is formed in the side wall 52. The loading / unloading port 57 is an opening for loading and unloading the workpiece W. The workpiece W is loaded into the chamber 50 through the loading / unloading port 57, and the workpiece W is unloaded from the chamber 50 through the loading / unloading port 57. The loading / unloading port 57 is formed to allow the cooling plate 31 supporting the workpiece W to pass through. The loading / unloading port 57 is formed to extend in the left-right direction, and its width is greater than the diameter of the workpiece W. The vertical length of the loading / unloading port 57 may be approximately half the vertical length of the chamber 50.

[0046] As shown in FIG. 6(b), the side wall 53 is formed with exhaust ports 58 including a first exhaust port 58a and a second exhaust port 58b. The exhaust ports 58 are openings for discharging gas from the internal space S of the chamber 50. The first exhaust port 58a and the second exhaust port 58b (exhaust ports 58) are formed in the center of the side wall 53 in the left-right direction. The left-right lengths of the first exhaust port 58a and the second exhaust port 58b are shorter than the left-right length of the loading / unloading port 57. The first exhaust port 58a and the second exhaust port 58b are aligned vertically, and the second exhaust port 58b is positioned higher than the first exhaust port 58a. In the front-rear direction, the loading / unloading port 57 and the exhaust ports 58 (the first exhaust port 58a and the second exhaust port 58b) sandwich the heating unit 42 therebetween.

[0047] <Partition and flow path adjustment section> As shown in FIG. 3, the internal space S within the chamber 50 is divided into a processing space S1 and a retreat space S2 by a partition 60. The processing space S1 is a space where the workpiece W supported by the heating unit 42 is exposed, and the retreat space S2 is a space located above the processing space S1. The partition 60 may be formed, for example, in a plate shape and cover the entire heating unit 42 and a portion of the bottom wall 56. A heater may be provided inside the partition 60. Heating the partition 60 by the heater increases the temperature of the partition 60 and the components connected to the partition 60, making it difficult for sublimates to adhere to these components. FIG. 7 shows a cross section taken along line AA in FIG. 3, where line AA passes through the processing space S1.

[0048] The processing space S1 is defined by the sidewall 53, the sidewall 54, the sidewall 55, the bottom wall 56, the heating unit 42, the shutter unit 70, and the underside of the partition unit 60. The first exhaust port 58a is formed in a portion of the sidewall 53 that defines the processing space S1. In a plan view (viewing the heating unit 42 from above), the direction connecting the center of the heating unit 42 and the center of the first exhaust port 58a corresponds to the front-rear direction. In a plan view, the direction perpendicular to the direction connecting the center of the heating unit 42 (the center of the hot plate 43) and the center of the first exhaust port 58a corresponds to the left-right direction (width direction). The first exhaust port 58a is an opening for exhausting gas from the processing space S1. The first exhaust port 58a opens into the processing space S1. When gas is exhausted from the processing space S1, the gas flows toward the first exhaust port 58a in the processing space S1. The length of the first outlet 58a in the left-right direction is smaller than the length of the heating unit .

[0049] The heating processing unit 40 may include a flow path adjustment unit 62. The flow path adjustment unit 62 forms a flow path for gas toward the first exhaust port 58a between the side wall 53. The formation of the flow path adjustment unit 62 makes it easier for gas in the processing space S1 to flow toward the first exhaust port 58a. The flow path adjustment unit 62 is disposed between the heating unit 42 and the side wall 53 in a plan view. The flow path adjustment unit 62 includes, for example, an inner wall 63 and an inner wall 64.

[0050] The inner wall 63 is disposed around the heating unit 42 in the processing space S1. The inner wall 63 is formed to separate the processing space S1 into an accommodation space S11 including the heating unit 42 and an adjustment space S12 including the first exhaust port 58a. As shown in FIG. 8 , the inner wall 63 extends vertically between the bottom wall 56 and the partition 60. The upper end of the inner wall 63 is connected to the lower surface of the partition 60, and the lower end of the inner wall 63 is connected to the upper surface of the bottom wall 56. One left-right end of the inner wall 63 is connected to the side wall 54, and the other left-right end of the inner wall 63 is connected to the side wall 55. In a plan view, the inner wall 63 may be formed in an arc shape extending circumferentially around the center of the heating unit 42. The length of the inner wall 63 in the left-right direction may be greater than the length of the workpiece W on the heating unit 42.

[0051] The inner wall 63 has a plurality of discharge holes 63a formed in the inner wall 63 and aligned along the extension direction of the inner wall 63. Each of the discharge holes 63a is an opening that connects the accommodation space S11 and the adjustment space S12. Gas in the accommodation space S11 is introduced into the adjustment space S12 through the discharge holes 63a. Each of the discharge holes 63a is formed to penetrate the inner wall 63 along the front-rear direction. Penetrating the inner wall 63 along the front-rear direction means that the inner wall forming the through hole (opening) penetrates the inner wall 63 so as to extend along the front-rear direction.

[0052] The multiple discharge holes 63a formed in the inner wall 63 are scattered in the left-right direction. In the left-right direction, the distance between the ends of the area in the inner wall 63 where the multiple discharge holes 63a are formed may be greater than 90% of the diameter of the workpiece W, or may be greater than the diameter of the workpiece W. The distance between the ends of the area in which the discharge holes 63a are formed is defined as the shortest distance in the left-right direction between the right end of the rightmost discharge hole 63a and the left end of the leftmost discharge hole 63a.

[0053] The inner wall 64 (second inner wall) is disposed between the inner wall 63 and the side wall 53. The inner wall 64 is formed to separate the adjustment space S12 into a buffer space including the inner wall 63 and a discharge space including the first discharge port 58a. As shown in FIG. 8 , the inner wall 64 extends vertically between the bottom wall 56 and the partition 60. The upper end of the inner wall 64 is connected to the lower surface of the partition 60, and the lower end of the inner wall 64 is connected to the upper surface of the bottom wall 56. One left-right end of the inner wall 64 is connected to the side wall 54, and the other left-right end of the inner wall 64 is connected to the side wall 55. The inner wall 64 may be formed in an arc shape so as to extend circumferentially around the center of the heating unit 42 (hot plate 43). The length of the inner wall 64 in the left-right direction may be approximately the same as the length of the inner wall 63.

[0054] The inner wall 64 is formed with a plurality of discharge holes 64a (a plurality of second discharge holes) aligned along the direction in which the inner wall 64 extends. Each of the plurality of discharge holes 64a is an opening that connects the buffer space and the discharge space. Gas within the accommodation space S11 is introduced into the buffer space via the plurality of discharge holes 63a formed in the inner inner wall 63, and then introduced into the discharge space via the plurality of discharge holes 64a formed in the outer inner wall 64. Each of the plurality of discharge holes 64a is formed to penetrate the inner wall 64 in the front-to-rear direction.

[0055] The multiple discharge holes 64a formed in the inner wall 64 are scattered in the left-right direction. The multiple discharge holes 64a are formed so that the flow rate of gas flowing through the multiple discharge holes 63a formed in the inner wall 63 is dispersed (so that the left-right imbalance is reduced) by exhaust through the first discharge port 58a. The first discharge port 58a is located in the left-right center of the processing space S1. Therefore, if the inner wall 64 (multiple discharge holes 64a) were not present and multiple discharge holes 63a were formed in the inner wall 63 at approximately equal intervals, the gas flow rate would be higher in some discharge holes 63a located in the left-right center than in other areas. In this case, the gas flow would be stronger above the left-right center of the workpiece W on the heating unit 42 than in other areas.

[0056] The arrangement of the plurality of discharge holes 63a in the inner wall 63 is different from the arrangement of the plurality of discharge holes 64a in the inner wall 64. For example, the number of the plurality of discharge holes 63a is different from the number of the plurality of discharge holes 64a, and the manner in which the spacing between adjacent discharge holes is changed is different. At least a portion of the plurality of discharge holes 64a does not overlap with the plurality of discharge holes 63a when viewed from the front-to-rear direction.

[0057] 9 shows a cross section taken along line BB in FIG. 3, where line BB passes through evacuation space S2. Partition 60 is fixed to side wall 54, side wall 55, and side wall 53. Partition 60 may be formed integrally with chamber 50. Evacuation space S2 is defined by the upper surface of partition 60, side wall 52, side wall 53, side wall 54, side wall 55, and the lower surface of top plate 51.

[0058] The second exhaust port 58b is formed in a portion of the side wall 53 that defines the evacuation space S2. In a plan view, the center (center in the left-right direction) of the second exhaust port 58b may substantially coincide with the center (center in the left-right direction) of the first exhaust port 58a. The second exhaust port 58b is an opening for exhausting gas from the evacuation space S2. The second exhaust port 58b opens into the evacuation space S2. When gas is exhausted from the evacuation space S2, the gas flows toward the second exhaust port 58b in the evacuation space S2. In the left-right direction, the length of the second exhaust port 58b is shorter than the length of the heating unit 42.

[0059] The evacuation space S2 and the processing space S1 are connected to each other via a connection port 69. The connection port 69 is formed between the partition 60 and the side wall 52. The connection port 69 is located between the side wall 52 and the heating unit 42 (the workpiece W on the heating unit 42) in the front-rear direction. The connection port 69 opens to extend along the side wall 52. The length of the connection port 69 in the left-right direction may be greater than the diameter of the workpiece W in the heating unit 42. In the left-right direction, the length of the connection port 69 is greater than the length of the second discharge port 58b. The evacuation space S2 may include a flow path S21 (first flow path) including the connection port 69, and a flow path S22 (second flow path) whose width in the left-right direction is smaller than that of the flow path S21.

[0060] The heating processing unit 40 may include a flow path forming member 66 and a flow path forming member 67. The flow path forming member 66 and the flow path forming member 67 are members that divide the evacuation space S2 into an area where gas flows toward the second exhaust port 58b and an area where gas does not flow. In a plan view, the flow path forming member 66 and the flow path forming member 67 are symmetrical with respect to an imaginary line that passes through the center of the chamber 50 in the left-right direction and extends in the front-rear direction. The flow path forming member 66 and the flow path forming member 67 are inner walls extending between the upper surface of the partition unit 60 and the lower surface of the top plate 51. The upper ends of the flow path forming member 66 and the upper ends of the flow path forming member 67 are connected to the lower surface of the top plate 51, and the lower ends of the flow path forming member 66 and the lower ends of the flow path forming member 67 are connected to the upper surface of the partition unit 60. The flow path forming member 66 includes an inner wall 66a and an inner wall 66b, and the flow path forming member 67 includes an inner wall 67a and an inner wall 67b.

[0061] One end of the inner wall 66a is connected to a portion of the side wall 54 closer to the connection port 69, and the inner wall 66a extends at an angle in both the left-right direction and the front-rear direction. The position of the other end of the inner wall 66a in the left-right direction substantially coincides with the position of the end of the second discharge port 58b closer to the side wall 54. One end of the inner wall 66b is connected to the other end of the inner wall 66a. The inner wall 66b extends to the side wall 53 in the front-rear direction.

[0062] One end of the inner wall 67a is connected to a portion of the side wall 55 closer to the connection port 69, and the inner wall 67a extends at an angle in both the left-right direction and the front-rear direction. The position of the other end of the inner wall 67a in the left-right direction substantially coincides with the position of the end of the second discharge port 58b closer to the side wall 55. One end of the inner wall 67b is connected to the other end of the inner wall 67a. The inner wall 67b extends in the front-rear direction to the side wall 53.

[0063] The distance between the inner walls 66a and 67a in the left-right direction decreases as they approach the second exhaust port 58b. The distance between the inner walls 66b and 67b in the left-right direction remains substantially constant regardless of the position in the front-rear direction. With the above configuration, the evacuation space S2 is formed with two regions through which gas does not flow: a flow path S21 and a flow path S22. The flow path S21 is a region of the evacuation space S2 between the side wall 52 and an imaginary plane connecting the connection between the inner wall 66a and the inner wall 66b and the connection between the inner wall 67a and the inner wall 67b. The flow path S22 is a region of the evacuation space S2 between the imaginary plane and the second exhaust port 58b. The two regions through which gas does not flow are regions of the evacuation space S2 other than the flow paths S21 and S22.

[0064] In a plan view, at least a portion of the flow path S22 is provided at a position overlapping with the heating unit 42. In a plan view, the boundary between the flow paths S21 and S22 overlaps with the heating unit 42. In the processing space S1, the flow path is narrowed in a region around the heating unit 42 near the first exhaust port 58a, whereas in the evacuation space S2, the flow path is narrowed at a position overlapping with the heating unit 42. Wiring, sensors, etc. may be provided in the region of the evacuation space S2 where gas does not flow.

[0065] <Shutter section> 10(a) and 10(b) illustrate the operation of the shutter unit 70. The shutter unit 70 is disposed in a position where it can cover the loading / unloading opening 57 formed in the side wall 52 from the side. The shutter unit 70 may be provided on the base 24. The shutter unit 70 has, for example, a shutter member 72 and a drive unit 74.

[0066] The shutter member 72 is a member that covers the loading / unloading opening 57 from the side. The shutter member 72 is formed in a plate shape and extends along a plane (the YZ plane in the figure) that intersects with the front-to-rear direction. When viewed from the front-to-rear direction, the size of the shutter member 72 is larger than the loading / unloading opening 57. The drive unit 74 includes a drive source such as an electric motor or a cylinder, and moves the shutter member 72 in the up-and-down direction. When the shutter member 72 is driven by the drive unit 74, it is switched between a closed state in which the loading / unloading opening 57 is covered from the side, and an open state in which the loading / unloading opening 57 is open.

[0067] When the shutter member 72 is positioned by the drive unit 74 at a position closest to the base 24, the shutter member 72 covers the entire area of the load / unload opening 57 when viewed from the side, and the load / unload opening 57 is in a closed state. At this time, an internal space S is formed inside the chamber 50 by the inner wall of the shutter member 72 and the chamber 50. When the shutter member 72 is positioned by the drive unit 74 at a position farthest from the base 24, the shutter member 72 does not overlap with the load / unload opening 57 when viewed from the side, and the load / unload opening 57 is in an open state. In this way, the shutter member 72 switches between a closed state in which it covers the load / unload opening 57 from the side, and an open state in which it opens the load / unload opening 57.

[0068] 11 shows a schematic side view of the shutter member 72 and a portion of the chamber 50. The shutter member 72 may be provided on the base 24 so as not to come into contact with other members, except for the portion connecting to the drive unit 74. The shutter member 72 is disposed with a gap g1 between it and the side wall 52 of the chamber 50. A gap is also provided between the shutter member 72 and the bottom wall 56. The shutter member 72 does not come into contact with the chamber 50 in either the closed state or the open state.

[0069] In the closed state (when closest to the base 24), the shutter member 72 is disposed with a gap g2 between it and the base 24. The gap g2 is formed below the shutter member 72. The gap g1 may be larger than the gap g2. For example, the gap g1 (the size of the gap g1) is approximately 0.8 mm to 1.6 mm, and the gap g2 (the size of the gap g2) is approximately 0.2 mm to 0.7 mm. The base 24 may be provided with a support portion that supports a portion of the lower surface of the shutter member 72. In this case, the gap g2 corresponds to the space between the lower surface of the shutter member 72 and the base 24 excluding the support portion.

[0070] <Exhaust section> 12 schematically shows an example of the interior of the exhaust unit 80 and an example of the switching unit 90. The exhaust unit 80 is configured to be able to exhaust gas from each of the processing space S1 and the evacuation space S2. The exhaust unit 80 has a pipe 82 and a pipe 84. The pipe 82 is a member that forms a flow path C1 and a flow path C2. The flow path C1 (first flow path) is connected to a first exhaust port 58a that opens into the processing space S1, and exhaust gas exhausted from the processing space S1 flows through the flow path C1. The flow path C2 (second flow path) is connected to a second exhaust port 58b that opens into the evacuation space S2, and exhaust gas exhausted from the evacuation space S2 flows through the flow path C2.

[0071] The piping 82 is formed to extend, for example, in the front-to-rear direction. The flow paths C1 and C2 are formed to be aligned in the up-down direction. A connection port 81a connected to the first exhaust port 58a is provided at the upstream end of the flow path C1, and a connection port 81b connected to the second exhaust port 58b is provided at the upstream end of the flow path C2. In this disclosure, the terms "upstream" and "downstream" are used based on the gas flow. Due to exhaust by the exhaust unit 80, gas flows from upstream to downstream within the chamber 50 and the exhaust unit 80.

[0072] The pipe 84 is a member that forms a common flow path C3 that is connected to each of the flow paths C1 and C2. The common flow path C3 is connected to the flow path C1 via a connection port 87a provided at the downstream end of the flow path C1, and is connected to the flow path C2 via a connection port 87b provided at the downstream end of the flow path C2. The connection port 87a may be an opening formed by penetrating the inner wall in the front-rear direction, and the connection port 87b may be an opening formed by penetrating the inner wall in the up-down direction. The connection port 87b is located downstream of the connection port 87a in the front-rear direction and is located at a higher position than the connection port 87a.

[0073] In the common flow path C3, the exhaust gas introduced from the flow path C1 or the flow path C2 may flow downward. The downstream end of the common flow path C3 (the exhaust port 81c formed at the lower end of the pipe 84) is connected to another exhaust pipe. The other exhaust pipe may be connected to the pipes of the exhaust parts of the multiple heat treatment units U2. While the coating and developing apparatus 2 is operating, exhaust from the other exhaust pipe via the exhaust port 81c and the common flow path C3 continues.

[0074] The exhaust unit 80 (piping 82) is attached to the side wall 53 of the chamber 50 via a fixing member. The exhaust unit 80 is detachable from the chamber 50. In other words, the exhaust unit 80 is detachably attached to the chamber 50. As shown in FIG. 4 or 5, the exhaust unit 80 has a flange 83 and a pair of mounting portions 88. The flange 83 is formed at the upstream end of the piping 82 so as to extend outward from the outer wall of the piping 82. When viewed from the front-to-rear direction, the outer edge of the flange 83 may be rectangular (see also FIG. 12).

[0075] The pair of mounting portions 88 are formed to extend downstream from both left and right ends of the flange 83. Each of the pair of mounting portions 88 is provided at a position spaced outward from the pipe 82. The mounting portions 88 are arranged with a gap between them in the left and right direction. A fixing member 89 that fixes the chamber 50 and the exhaust unit 80 is attached to each of the pair of mounting portions 88. The fixing member 89 may be any member as long as it is capable of fixing the chamber 50 and the exhaust unit 80 together.

[0076] The fixing member 89 includes, for example, a hook portion that fits into a receiving portion formed on the side of the protruding portion of the side wall 53 of the chamber 50, thereby fixing the chamber 50 and the exhaust unit 80 to each other. When fixing the chamber 50 and the exhaust unit 80 to each other, the fixing member 89 may be switched to a fixed state by an operator's operation. When releasing the fixation between the chamber 50 and the exhaust unit 80, the fixing member 89 may be switched to a released state by an operator's operation. Unlike the above examples, the exhaust unit 80 may be formed integrally with the chamber 50.

[0077] <Switching section> Returning to FIG. 12 , a switching unit 90 is provided inside the exhaust unit 80. The switching unit 90 connects the flow path C1 to the common flow path C3 in the first exhaust state, in which gas is exhausted through the processing space S1 without being exhausted from the evacuation space S2. While exhaust from the common flow path C3 continues, the switching unit 90 opens the flow path C1 and closes the flow path C2, thereby exhausting gas from the processing space S1 without being exhausted from the evacuation space S2. While exhaust from the common flow path C3 continues, the switching unit 90 opens the flow path C2 and closes the flow path C1, thereby exhausting gas from the evacuation space S2 without being exhausted from the processing space S1.

[0078] The switching unit 90 has, for example, a closing member 92, a shaft member 94, and a drive unit 96. The closing member 92 is a member configured to close (either) the connection port 87a between the flow path C1 and the common flow path C3 and the connection port 87b between the flow path C2 and the common flow path C3. The closing member 92 is connected to the shaft member 94. The shaft member 94 is formed to extend in the left-right direction and is provided to be rotatable about its central axis.

[0079] The drive unit 96 includes a drive source such as an electric motor and rotates the shaft member 94 about the axis. The closing member 92 rotates about the central axis in accordance with the rotation of the shaft member 94. The closing member 92 rotates about the central axis between a first position where it closes the connection port 87b and a second position where it closes the connection port 87a.

[0080] When the blocking member 92 is placed in the first position where it blocks the connection port 87b, the flow path C1 and the common flow path C3 are opened (connected) and the flow path C2 is blocked, resulting in a first exhaust state in which gas is not exhausted from the evacuation space S2 through the second exhaust port 58b and the flow path C2, but is exhausted from the processing space S1 through the first exhaust port 58a and the flow path C1.

[0081] When the closing member 92 is positioned at the second position where it closes the connection port 87a, the flow path C2 and the common flow path C3 are opened (connected) and the flow path C1 is closed. This results in a second exhaust state in which gas is not exhausted from the processing space S1 via the first exhaust port 58a and the flow path C1, but is exhausted from the evacuation space S2 via the second exhaust port 58b and the flow path C2. As described above, switching between the first exhaust state and the second exhaust state is performed by switching the position of the closing member 92 of the switching unit 90. The closing member 92 is configured to open the flow path C1 and close the flow path C2 in the first exhaust state, and to close the flow path C1 and open the flow path C2 in the second exhaust state.

[0082] (Attaching and detaching the chamber) 13, 14, 15(a), and 15(b) illustrate examples of how the chamber 50 is attached and detached. The chamber 50 is configured to be detachable from the base of the heat-processing unit U2. The base of the heat-processing unit U2 is a member that fixes or supports various components in predetermined positions in the heat-processing unit U2. In the heat-processing unit U2, the heating unit 42 is provided on the base, and the shutter unit 70 (shutter member 72) is provided on the base. The base of the heat-processing unit U2 includes, for example, a housing 20, a base 24, and a base 25. The chamber 50 is detachably attached to the base of the heat-processing unit U2. When the chamber 50 is detached, the heating unit 42 and the shutter unit 70 remain on the base.

[0083] The chamber 50 can be removed from the base portion and attached to the base portion with its top plate 51 and side walls 52, 53, 54, and 55 integrally (as a single unit). That is, with the top plate 51 and side walls 52 to 55 connected to one another, the entire chamber 50 can be removed from the base portion and attached to the base portion. When the bottom wall 56 is fixed to the chamber 50, the chamber 50 and the bottom wall 56 can be removed from the base portion and attached to the base portion as a single unit (as a single unit). When the partition unit 60 is fixed to the chamber 50, the partition unit 60 can move together with the chamber 50 relative to the base portion. That is, when the chamber 50 is removed, the partition unit 60 is also removed, and when the chamber 50 is attached, the partition unit 60 is also attached.

[0084] The chamber 50 may be attached to the base by being placed at the mounting position in the heat-treating unit U2 and fixed to the base via fixing members such as bolts. When the chamber 50 is placed at the mounting position, the space inside the chamber 50 surrounds the heating section 42 (the workpiece W on the heating section 42), and the above-mentioned internal space S may be formed. The chamber 50 may be removed from the base by releasing the fixing member and moving the chamber 50 from the mounting position (for example, moving it outside the housing 20). The chamber 50 may be attached and removed by an operator using a jig.

[0085] The thermal processing unit U2 has a guide member 210. The guide member 210 is a member that guides the movement of the chamber 50 in a predetermined direction along the upper surface of the heating member 42 (or the upper surface of the hot plate 43). The direction in which the chamber 50 is guided by the guide member 210 (hereinafter referred to as the "movable direction") may be the front-rear direction. In this case, when removing the chamber 50, the chamber 50 may be removed from the base member while sliding in the front-rear direction, and when attaching the chamber 50, the chamber 50 may be placed on the base member while sliding in the front-rear direction. When the movable direction is the front-rear direction, the exhaust member 80 exhausts gas from the internal space S of the chamber 50 so that the gas flows toward one side along the movable direction.

[0086] When attaching the chamber 50, the guide section 210 guides the movement of the chamber 50 toward the attachment position. When attaching the chamber 50, the chamber 50 slides in the direction from the heating section 42 toward the shutter section 70, and the chamber 50 is disposed in the attachment position. When removing the chamber 50, the guide section 210 guides the movement of the chamber 50 from the attachment position. When removing the chamber 50, the chamber 50 slides in the direction from the shutter section 70 toward the heating section 42, and the chamber 50 is taken out of the housing 20.

[0087] The guide section 210 includes a rail member 212 and fixed members 214, 214. The rail member 212 is formed to extend along the movable direction. The rail member 212 may extend along the front-rear direction. The rail member 212 is disposed outward from the chamber 50 in the left-right direction. As shown in FIG. 13 , the rail member 212 is disposed so as to face one side wall (e.g., side wall 55) of the chamber 50 in the left-right direction when the chamber 50 is disposed in the mounting position. The length of the rail member 212 in the front-rear direction may be approximately the same as the length of the side wall 55 of the chamber 50.

[0088] The fixing members 214, 214 are members that fix the rail member 212 to the base portion. The rail member 212 is supported by the fixing members 214, 214, and is thereby fixed at a predetermined position within the housing 20. The thermal processing unit U2 may have another guide member 210, or a pair of guide members 210 may be provided so as to sandwich the heating member 42 and the chamber 50 therebetween in the left-right direction.

[0089] An overhanging portion 242 and a roller 244 are provided on an outer wall (for example, the outer surface of the side wall 55) of the chamber 50 in the left-right direction. The overhanging portion 242 is formed to overhang outward from the side wall of the chamber 50 and to extend along the movable direction. The roller 244 is a member that is rotatable relative to the chamber 50. The roller 244 is arranged to be aligned with the overhanging portion 242 in the movable direction, and is located closer to the shutter section 70 (the side wall 52 on which the loading / unloading opening 57 is formed) than the overhanging portion 242. In other words, when the chamber 50 is placed in the mounting position, the shutter section 70 (or the side wall 52), the roller 244, and the overhanging portion 242 are arranged in this order in the front-rear direction.

[0090] The rail member 212 includes a rail main body 212a and a recessed portion 212b recessed below the upper surface of the rail main body 212a. The recessed portion 212b is formed at the end of the rail member 212 (rail main body 212a) that is closer to the shutter section 70. Figure 13 or Figure 15(a) shows an example of a state in which the chamber 50 is placed in the mounting position. When the chamber 50 is placed in the mounting position, the lower surface of the protruding portion 242 is supported by the rail main body 212a, and the roller 244 provided in the chamber 50 is housed in the recessed portion 212b.

[0091] The guide unit 210 may have a roller 218. The roller 218 is provided on the inner surface of the rail main body 212a (the surface facing the side wall of the chamber 50). The roller 218 is rotatable relative to the rail member 212. The roller 218 is provided at a position different from the recess 212b in the movable direction. The protrusion 242 provided on the chamber 50 is formed with a storage portion 242a in which the roller 218 is stored when the chamber 50 is placed in the mounting position. With the above configuration, when the chamber 50 is placed in the mounting position, the roller 244 provided on the chamber 50 is stored in the recess 212b of the rail member 212. Furthermore, the roller 218 provided on the rail member 212 is stored in the storage portion 242a of the protrusion 242 provided on the chamber 50.

[0092] 14 or 15(b) illustrate an example of the chamber 50 (chamber 50, bottom wall 56, and partition 60) being removed from the mounting position, or the chamber 50 (chamber 50, bottom wall 56, and partition 60) being attached to the mounting position. When the chamber 50 moves along the movable direction, rollers 244 provided on the chamber 50 run on the rail main body 212a (move while rotating). A protrusion 243 is provided on the side of the chamber 50 below the protrusion 242. The amount of protrusion 243 protruding from the side of the chamber 50 is smaller than the amount of protrusion of the protrusion 242.

[0093] When the chamber 50 moves, the rollers 244 travel and the protruding portion 243 is supported by the rollers 218 of the guide portion 210, and is guided along the movable direction. The chamber 50 may be moved along the movable direction by an operator applying a force in the movable direction while holding one end of the chamber 50. When the chamber 50 is attached or detached (mounted or removed), the side wall where the exhaust portion 80 of the housing 20 is located may be opened.

[0094] (Control device) The control device 100 is configured with one or more control computers. The control device 100 controls the switching unit 90 to switch from the second exhaust state (exhaust through the evacuation space S2) to the first exhaust state (exhaust through the processing space S1) at least while the heating unit 42 is heating the workpiece W.

[0095] The control device 100 includes, for example, a circuit 120 shown in Fig. 16. The circuit 120 includes one or more processors 122, a memory 124, a storage 126, an input / output port 128, and a timer 132. The storage 126 includes a computer-readable storage medium such as a hard disk. The storage medium stores a program for causing the control device 100 to execute a substrate processing method described below. The storage medium may be a removable medium such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk.

[0096] Memory 124 temporarily stores programs loaded from a storage medium in storage 126 and calculation results by processor 122. Processor 122 executes the programs in cooperation with memory 124. Input / output port 128 inputs and outputs electrical signals between liquid processing unit U1, heat processing unit U2, etc. in accordance with instructions from processor 122. Timer 132 measures elapsed time, for example, by counting reference pulses at a fixed interval.

[0097] [Substrate processing method] Next, as an example of a substrate processing method (heat treatment method), a series of processes executed by the control device 100 in heat treatment of the workpiece W will be described. This series of processes is executed while exhaust by the exhaust unit 80 continues and heating of the hot plate 43 by the heater in the heating unit 42 continues. Fig. 17 is a flowchart showing the series of processes executed by the control device 100 in heat treatment of one workpiece W.

[0098] The control device 100 first executes step S91 when the exhaust unit 80 is in the first exhaust state and is capable of exhausting, and when the workpiece W on which a film of processing liquid has been formed is supported on the cooling plate 31 of the transport unit 30. In step S91, for example, the control device 100 causes the drive unit 74 to raise the shutter member 72, thereby switching from a closed state in which the loading / unloading port 57 for the workpiece W into the chamber 50 is closed to an open state in which the loading / unloading port 57 is open.

[0099] Next, the control device 100 executes step S92. In step S92, for example, the control device 100 controls the transfer unit 30 and the lifting unit 44 so that the workpiece W is carried into the chamber 50 from the cooling plate 31 and then transferred from the cooling plate 31 to the heating unit 42. Fig. 18(a) illustrates an example of carrying the workpiece W into the chamber 50.

[0100] Next, the control device 100 executes step S93. In step S93, for example, the control device 100 controls the switching unit 90 so that the exhaust unit 80 is in the second exhaust state and ready to exhaust. In one example, the control device 100 drives the closing member 92 using the driving unit 96 so that the flow path C1 connected to the processing space S1 and the first exhaust port 58a is closed and the flow path C2 connected to the evacuation space S2 and the second exhaust port 58b is opened to the common flow path C3. This allows the exhaust unit 80 to exhaust air from the evacuation space S2.

[0101] Next, the control device 100 executes step S94. In step S94, for example, the control device 100 controls the shutter unit 70 so that the loading / unloading opening 57 is closed and covered from the side. The control device 100 may also control the drive unit 74 to move the shutter member 72 downward. When the shutter member 72 covers the loading / unloading opening 57, the shutter member 72, the heating unit 42, and the chamber 50 form an internal space S for heating the workpiece W, and heating of the workpiece W begins.

[0102] Before the shutter member 72 closes, the exhaust unit 80 is in the second exhaust state and ready to exhaust, so once the internal space S is formed, the exhaust unit 80 exhausts gas from the evacuation space S2, as shown in FIG. 18(b). A gap g1 is formed between the shutter member 72 and the side wall 52, and gas is introduced into the internal space S through the gap g1. The gas introduced into the internal space S from the gap g1 flows through the connection port 69, the evacuation space S2 (flow paths S21, S22), the flow path C2 of the exhaust unit 80, and the common flow path C3. This makes it possible to reduce the generation of airflow in the processing space S1 during the initial stage of heating the workpiece W.

[0103] Next, the control device 100 executes step S95. In step S95, for example, the control device 100 waits until a predetermined switching time has elapsed from the end of step S94 (the timing when heating starts). The switching time is determined in advance and is set, for example, to a time that allows the film of the processing liquid on the workpiece W to be processed to solidify to some extent. The switching time may be set to about several tens of seconds.

[0104] Next, the control device 100 executes step S96. In step S96, for example, the control device 100 controls the switching unit 90 to switch from the second exhaust state to the first exhaust state. In one example, the control device 100 controls the driving unit 96 to drive the closing member 92 so that the flow path C1 connected to the processing space S1 and the first exhaust port 58a is opened to the common flow path C3 and the flow path C2 connected to the evacuation space S2 and the second exhaust port 58b is closed. As a result, exhaust by the exhaust unit 80 switches from the second exhaust state to the first exhaust state during heating of the workpiece W. By switching to the first exhaust state, as shown in FIG. 19 , gas in the processing space S1 is exhausted via the first exhaust port 58a and the flow path C1. As a result, sublimates generated in the processing space S1 during heating of the workpiece W can be exhausted to the outside of the chamber 50.

[0105] Next, the control device 100 executes step S97. In step S97, for example, the control device 100 waits until a predetermined heating time has elapsed from the end of step S94 (the timing when heating starts). The heating time is determined in advance and may be approximately 1.5 to 5.0 times the switching time.

[0106] Next, the control device 100 executes steps S98 and S99. In step S98, for example, the control device 100 controls the shutter unit 70 so that the workpiece W loading / unloading port 57 is opened and the space within the chamber 50 is opened (the drive unit 74 raises the shutter member 72). In step S99, for example, the control device 100 controls the transport unit 30 and the lifting unit 44 so that the workpiece W is transferred from the heat processing unit 40 to the cooling plate 31 of the transport unit 30 and the workpiece W is transported out of the chamber 50.

[0107] This completes the series of processes executed by the control device 100 in the heat treatment of one workpiece W. The control device 100 may repeatedly execute the series of processes of steps S91 to S99 for each of the subsequent multiple workpieces W. The series of processes described above is an example and can be modified as appropriate. In the series of processes described above, the control device 100 may execute one step and the next step in parallel, or may execute each step in an order different from the example described above. The control device 100 may execute a process in each step different from the example described above.

[0108] [Maintenance method] When heat treatment is repeated in the heat treatment unit U2, sublimates adhere to the chamber 50 and the partition 60, which define the processing space S1. Therefore, maintenance, including cleaning of the chamber 50 and the partition 60, must be performed periodically. The following maintenance method is performed by an operator when the coating and developing apparatus 2 (substrate processing system 1) is not in operation.

[0109] The worker first performs the step of removing the exhaust unit 80 from the chamber 50. For example, the worker unlocks the fixing member 89 attached to the mounting portion 88 of the exhaust unit 80, and then removes the exhaust unit 80 from the chamber 50. The worker may also remove the exhaust unit 80 from other piping to which the common flow path C3 of the exhaust unit 80 is connected (for example, a piping to which exhaust from multiple heat treatment units U2 converge). Figure 20(a) illustrates an example of removing the exhaust unit 80 from the chamber 50.

[0110] Next, the worker removes the chamber 50 from the base of the heat-treating unit U2. By removing the chamber 50, the bottom wall 56, the partition 60, the flow path adjusting section 62, and the flow path forming members 66, 67 are also removed along with the chamber 50. The worker releases the lock state of fixing members such as bolts that secure the chamber 50 to the base. This allows the chamber 50 to move relative to the base.

[0111] Then, the worker lifts the chamber 50 from the mounting position upward, and slides the chamber 50 in a direction away from the shutter section 70. The worker lifts the chamber 50 to such an extent that the rollers 244 housed in the recesses 212b of the rail member 212 are placed on the rail main body 212a of the rail member 212, and the protruding section 243 is placed on the rollers 218. Thereafter, the worker slides the chamber 50 in the front-rear direction along the guide section 210, and removes it from inside the heat-treating unit U2. Figure 20(b) illustrates an example of how the chamber 50 is lifted once, and then slid in the front-rear direction to be removed.

[0112] Next, the worker performs a process of cleaning the interior of the chamber 50, etc., to remove sublimates adhering to the interior of the chamber 50, etc. After cleaning, the worker performs a process of installing (mounting) the chamber 50 in the heat-treating unit U2. The installation work of the chamber 50 is performed in the reverse order of the removal work of the chamber 50. The worker slides the chamber 50 along the guide portion 210 toward the shutter portion 70 until the roller 244 is accommodated in the recess 212b and the roller 218 is accommodated in the accommodation portion 242a. This places the chamber 50 in the installation position. Then, the worker fixes the chamber 50 to the base portion of the heat-treating unit U2 with fixing members such as bolts.

[0113] Next, the worker attaches the exhaust unit 80 to the chamber 50, and also attaches the common flow path C3 of the exhaust unit 80 to other piping. This completes the maintenance work on one heat-treating unit U2.

[0114] (Variation 1) The configuration for attaching and detaching the chamber is not limited to the above example. The rail member 212 may be movable up and down. As shown in FIG. 21(a), the heating processing unit 40 may have a guide unit 210A instead of the guide unit 210. The guide unit 210A has a rail member 212, a fixed member 214, and an actuator 219. In the guide unit 210A, for example, an actuator 219 including a cylinder or a motor may be provided below the fixed member 214 as a lifting mechanism for the rail member 212, and the fixed member 214 holding the rail member 212 may be movable up and down relative to a base unit such as the base 24. As shown in FIG. 21(a) or 21(b), a bulge 252 may be provided on the outer wall (outer surface of the side wall) of the chamber 50, and a roller 254 may be provided below the bulge 252.

[0115] 22(a) and 22(b) illustrate an example of a state in which the chamber 50 is being removed from the attached position. When sliding the chamber 50, first, the rail member 212 is raised by the actuator 219. Because the chamber 50 and the bottom wall 56 are supported by the rail member 212 via the bulge 252, the chamber 50 and the bottom wall 56 are raised as the rail member 212 is raised. Then, the rollers 254 run on the upper surface of the rail member 212, thereby guiding the chamber 50 while sliding laterally. Note that the guide portion 210A does not need to be provided with a recess for accommodating the rollers 254, and the lower surface of the bulge 252 or the bottom wall 56 may be supported by the rail member 212. In the configuration according to the above-described first modification, before the chamber 50 is pulled out and moved, the rail member 212 is raised by the lifting mechanism to ensure a movement path for the chamber 50 so as not to interfere with other members, and then the chamber 50 can be safely pulled out.

[0116] (Variation 2) The chamber and the bottom wall may be formed separately, or the attachment and detachment of the chamber and the attachment and detachment of the member forming the bottom wall may be performed at different times. As shown in FIGS. 23(a) and 23(b), the heating processing unit 40 may have a chamber 50B and a base member 260 instead of the chamber 50, bottom wall 56, and guide member 210. The chamber 50B and the base member 260 are formed separately. The chamber 50B is detachably attached to the base member 260, and is therefore detachably attached to a base member such as the base 24. The base member 260 has the same function as the bottom wall 56 described above and also functions as a guide member that guides the movement of the chamber 50B when it is attached or detached.

[0117] 24(a) and 24(b) illustrate the chamber 50B being removed from the base. FIG. 24(a) schematically illustrates a cross section taken along line CC in FIG. 24(b). A roller 254 may be provided on the lower portion of a sidewall extending in the front-rear direction of the chamber 50B. When the chamber 50B is in the attached position, the roller 254 may be housed in a recess provided in the base member 260, or the sidewall of the chamber 50B may be supported by the base member 260. When the chamber 50B is removed, the roller 254 travels along the upper surfaces of both ends of the base member 260 in the left-right direction, thereby guiding the movement of the chamber 50B. The chamber 50B may not have a bottom wall connected thereto, and may have a top plate 51 and sidewalls 52, 53, 54, and 55. The sidewall 53 of the chamber 50B may be formed to extend in the left-right direction.

[0118] After the chamber 50B is removed, the base member 260 remains on a base portion such as the base 24. As shown in FIG. 25(a), the base member 260 includes a bottom wall 261 and rail portions 262, 262. The bottom wall 261 has an exposure hole 261a formed therein for exposing the hot plate 43. Rail portions 262 are provided on both side surfaces of the bottom wall 261 in the left-right direction. The rail portions 262 are formed integrally with the bottom wall 261 and are located on the sides (periphery) of the hot plate 43 when performing heat treatment. The rail portions 262 extend in the front-rear direction and are formed so that the rollers 254 can run on them.

[0119] In the above configuration, the bottom wall 261 and rail portion 262 are physically separable from the top plate and side walls of the chamber 50B and are detachably attached to the base portion independently of the chamber 50B. The chamber 50B moves (is pulled out) while being guided along the rail portion 262 via the rollers 254. In other words, the portion including the top plate and side walls that do not interfere with components in the internal space S, such as the hot plate 43, in the pulling direction of the chamber 50B can be pulled out without requiring a large lifting motion. After the chamber 50B is removed, the bottom wall 261 and rail portion 262 remain on the base portion of the base 24, etc.; however, for easy attachment and detachment, the bottom wall 261 and rail portion 262 may simply rest on the base portion of the base 24, etc., due to their own weight. Alternatively, the bottom wall 261 and rail portion 262 may be fixed, while still on the base portion of the base 24, etc., at a position downstream in the pulling direction visible to the operator, similar to the fixing member described above. After the chamber 50B is removed, as shown in FIG. 25(b), the base member 260 including the bottom wall 261 and the rail portion 262 is removed from the base portion such as the base 24 while sliding in the front-rear direction.

[0120] [Effects of the embodiment] The coating and developing apparatus 2 described above includes a heating unit 42, a bottom wall 56, 261, a chamber 50, 50B, and a guide unit. The heating unit 42 supports and heats the workpiece W supplied with a processing liquid. The bottom wall 56, 261 surrounds the workpiece W supported by the heating unit 42. The chamber 50, 50B includes a top plate 51 covering the heating unit 42 and side walls 52, 53, 54, 55 provided between the bottom wall 56 and the top plate 51, and is configured to be detachable from a base unit on which the heating unit 42 is provided. The guide unit guides movement of the chamber 50, 50B from an attached position where the space within the chamber 50, 50B surrounds the workpiece W on the heating unit 42, along a predetermined movable direction along the upper surface of the heating unit 42.

[0121] In this coating and developing apparatus 2, the chambers 50, 50B, including the side walls and top plate, can be slid in a movable direction along the upper surface of the heating unit 42 to remove the chambers 50, 50B from the base unit. Therefore, even if the vertical length of the space housing the chambers 50, 50B is small, the chambers 50, 50B can be easily removed, which is useful for improving maintainability.

[0122] The guide unit 210 may have a rail member 212 formed to extend along the movable direction. The rail member 212 may include a rail main body 212a along which rollers 244 provided on the chamber 50 run, and a recess 212b into which the rollers 244 are accommodated when the chamber 50 is positioned at the attached position. If the chamber 50 is slid in the movable direction from the attached position, the upper surface of the heating unit 42 may come into contact with the chamber 50. With the above configuration, when removing the chamber 50 from the attached position, it is necessary to first remove the rollers 244 from the recess 212b. This allows the chamber 50 to be removed by first lifting the chamber 50 and then sliding it in the movable direction. This reduces the possibility of the upper surface of the heating unit 42 coming into contact with the chamber 50 when the chamber is attached or detached.

[0123] The coating and developing apparatus 2 described above may further include an exhaust unit 80. The exhaust unit 80 may exhaust gas from the space within the chamber 50 (internal space S) so that the gas flows toward one side along the movement direction. In this case, an exhaust port for exhausting gas can be formed on the side of the space within the chamber 50, and the chamber 50 can be configured so that the bottom wall, side walls, and top plate can be moved as a unit. This allows many of the components included in the chamber 50 to be removed from the base during maintenance. This improves the maintainability of the apparatus for performing heat treatment.

[0124] The coating and developing apparatus 2 described above may further include a partition unit 60 and a switching unit 90. The partition unit 60 separates the space within the chamber 50 into a processing space S1, where the workpiece W on the heating unit 42 is exposed, and an evacuation space S2 located above the processing space S1. The switching unit 90 switches between a first exhaust state in which gas is exhausted through the processing space S1 and a second exhaust state in which gas is exhausted through the evacuation space S2. The partition unit 60 may be movable together with the chamber 50 relative to the base. In this case, during heating of the workpiece W to be processed, gas can be exhausted from the evacuation space S2 during periods when the airflow generated by the gas exhaust unit 80 has a significant impact on the film thickness distribution, and gas can be exhausted from the processing space S1 during periods when the airflow has a small impact on the film thickness distribution. Furthermore, since the partition unit 60 moves together with the chamber 50, maintenance of the partition unit 60 is easy. Therefore, efficient recovery of sublimates and reduced impact on the film thickness distribution can be achieved while maintaining ease of maintenance.

[0125] In the coating and developing apparatus 2 described above, the exhaust unit 80 may be detachable from the chamber 50. By detaching the exhaust unit 80 from the chamber 50, the chamber 50 can be easily removed from the base unit and attached to the base unit. Furthermore, maintenance of the exhaust unit 80 itself is easier than when the exhaust unit 80 is fixed to the chamber 50. Therefore, maintainability can be further improved.

[0126] In the coating and developing apparatus 2 described above, the exhaust unit 80 may include a pipe 82 that forms flow paths C1, C2 for flowing exhaust gas from the internal space S of the chamber 50 and extends along the movement direction, and a mounting portion 88 that is located outwardly away from the pipe 82 and to which a fixing member 89 that fixes the chamber 50 and the exhaust unit 80 is attached. Since gas is exhausted from the internal space S during heat treatment of the workpiece W, the temperature of the pipe 82 may rise. Since the mounting portion 88 is located away from the pipe 82, a temperature rise in the fixing member 89 is suppressed. This makes it easy to release the fixation between the chamber 50 and the exhaust unit 80. Therefore, maintainability can be further improved.

[0127] The coating and developing apparatus 2 described above may further include a shutter member 72. The shutter member 72 may be arranged with a gap g1 between it and the sidewall 52 of the chamber 50 when the shutter member 72 is arranged in the above-described mounting position. The shutter member 72 may be switched between a closed state in which it laterally covers the workpiece W loading / unloading opening 57 provided in the sidewall 52, and an open state in which it exposes the loading / unloading opening 57. The shutter member 72 may be provided on the base portion. The exhaust unit 80 may exhaust gas from the space within the chamber 50 through an exhaust port 58 provided around the heating unit 42. The loading / unloading opening 57 and the exhaust port 58 may be arranged to sandwich the heating unit 42 in the movable direction. In this case, a portion of the shutter member 72 forms a space for heating the workpiece W. However, since an airflow is generated from the loading / unloading opening 57 toward the exhaust port 58 as the gas is exhausted, sublimates are less likely to adhere to the shutter member 72. Therefore, during maintenance, there is no need to remove the chamber 50 together with the member covering the workpiece W loading / unloading port, and therefore the configuration of the device for attaching and detaching the chamber 50 to the base portion can be simplified.

[0128] In the coating and developing apparatus 2 described above, the guide portion may have a rail portion 262 formed to extend along the movable direction and on which the roller 254 provided in the chamber 50B runs. The rail portion 262 may be formed integrally with the bottom wall 261. The rail portion 262 and the bottom wall 261 may be provided independently of the chamber 50B and detachably attached to the base portion. If the bottom wall is moved directly along the movable direction, it may interfere with other components such as the heating unit. In the above configuration, the chamber and the bottom wall are detachable independently of each other, so the amount of vertical movement of the chamber can be reduced when attaching or detaching the chamber. This further improves maintainability. [Explanation of symbols]

[0129] 2...coating and developing apparatus, W...workpiece, U2...heat treatment unit, 42...heating section, 50, 50B...chamber, 51...top plate, 52 to 55...side walls, 56...bottom wall, 57...loading / unloading port, 58...exhaust port, 58a...first exhaust port, 58b...second exhaust port, S...internal space, 60...partition section, S1...processing space, S11...storage space, S12...adjustment space, S2...refuge space, S21, S22...flow path, 6 2...flow path adjustment portion, 63...inner wall, 63a...discharge hole, 64...inner wall, 64a...discharge hole, 72...shutter member, g1, g2...gap, 80...exhaust portion, C1, C2...flow path, 90...switching portion, 92...blocking member, 100...control device, 210, 210A...guide portion, 212...rail member, 212a...rail main body, 212b...recess, 244...roller, 261...bottom wall, 262...rail portion.

Claims

1. A housing forming an internal space; a heating unit disposed in the internal space, the heating unit supporting and heating the substrate supplied with the processing liquid; a bottom wall surrounding the substrate supported by the heating unit; a chamber including a top plate covering the heating unit and a side wall provided between the bottom wall and the top plate, the chamber being detachable from a base portion on which the heating unit is provided; a guide unit that guides movement of the chamber from a mounting position where a space within the chamber surrounds the substrate on the heating unit along a predetermined moving direction along an upper surface of the heating unit; Equipped with The heat treatment apparatus, wherein the movable direction is a direction in which the substrate loading opening provided in the housing and the heating unit are aligned.

2. A heating unit that supports and heats a substrate to which a processing liquid has been supplied; a bottom wall surrounding the substrate supported by the heating unit; a chamber including a top plate covering the heating unit and a side wall provided between the bottom wall and the top plate, the chamber being detachable from a base portion on which the heating unit is provided; a guide unit that guides movement of the chamber from a mounting position where a space within the chamber surrounds the substrate on the heating unit along a predetermined moving direction along an upper surface of the heating unit, the guide portion has a rail member formed to extend along the movable direction, The heat treatment apparatus, wherein the rail member includes a rail body along which rollers provided in the chamber run, and a recess in which the rollers are housed when the chamber is positioned at the mounting position.

3. an exhaust section that exhausts gas from a space within the chamber so that the gas flows toward one side along the moving direction; a partition that separates the space within the chamber into a first space to which the substrate on the heating unit is exposed and a second space located above the first space; The heat treatment apparatus according to claim 1 , further comprising a switching unit that switches between a first state in which gas is discharged through the first space and a second state in which gas is discharged through the second space.

4. A heating unit that supports and heats a substrate to which a processing liquid has been supplied; a bottom wall surrounding the substrate supported by the heating unit; a chamber including a top plate covering the heating unit and a side wall provided between the bottom wall and the top plate, the chamber being detachable from a base portion on which the heating unit is provided; a guide unit that guides movement of the chamber from a mounting position where a space within the chamber surrounds the substrate on the heating unit along a predetermined moving direction along an upper surface of the heating unit; an exhaust section that exhausts gas from a space within the chamber so that the gas flows toward one side along the moving direction; a partition that separates the space within the chamber into a first space to which the substrate on the heating unit is exposed and a second space located above the first space; a switching unit that switches between a first state in which gas is discharged through the first space and a second state in which gas is discharged through the second space, The partition is movable together with the chamber relative to the base.

5. A heating unit that supports and heats a substrate to which a processing liquid has been supplied; a bottom wall surrounding the substrate supported by the heating unit; a chamber including a top plate covering the heating unit and a side wall provided between the bottom wall and the top plate, the chamber being detachable from a base portion on which the heating unit is provided; a guide unit that guides movement of the chamber from a mounting position where a space within the chamber surrounds the substrate on the heating unit along a predetermined moving direction along an upper surface of the heating unit; an exhaust unit that exhausts gas from a space within the chamber so that the gas flows toward one side along the moving direction, The heat treatment apparatus, wherein the exhaust unit is detachable from the chamber.

6. A heating unit that supports and heats a substrate to which a processing liquid has been supplied; a bottom wall surrounding the substrate supported by the heating unit; a chamber including a top plate covering the heating unit and a side wall provided between the bottom wall and the top plate, the chamber being detachable from a base portion on which the heating unit is provided; a guide unit that guides movement of the chamber from a mounting position where a space within the chamber surrounds the substrate on the heating unit along a predetermined moving direction along an upper surface of the heating unit; an exhaust unit that exhausts gas from a space within the chamber so that the gas flows toward one side along the moving direction, The exhaust unit includes a pipe that forms a flow path for exhaust gas from the space within the chamber and extends along the moving direction, and a mounting unit that is located at a position spaced outward from the pipe and to which a fixing member that fixes the chamber and the exhaust unit is attached.

7. A heating unit that supports and heats a substrate to which a processing liquid has been supplied; a bottom wall surrounding the substrate supported by the heating unit; a chamber including a top plate covering the heating unit and a side wall provided between the bottom wall and the top plate, the chamber being detachable from a base portion on which the heating unit is provided; a guide unit that guides movement of the chamber from a mounting position where a space within the chamber surrounds the substrate on the heating unit along a predetermined moving direction along an upper surface of the heating unit; an exhaust section that exhausts gas from a space within the chamber so that the gas flows toward one side along the moving direction; a shutter member that is disposed with a gap between itself and the side wall of the chamber when the chamber is disposed at the mounting position, and that switches between a closed state that covers the substrate loading / unloading port provided on the side wall from the side and an open state that opens the loading / unloading port, the shutter member is provided on the base portion, the exhaust unit exhausts gas from the space within the chamber through an exhaust port provided around the heating unit; The heat treatment apparatus is configured such that the loading / unloading port and the discharging port sandwich the heating unit in the movable direction.

8. A heating unit that supports and heats a substrate to which a processing liquid has been supplied; a bottom wall surrounding the substrate supported by the heating unit; a chamber including a top plate covering the heating unit and a side wall provided between the bottom wall and the top plate, the chamber being detachable from a base portion on which the heating unit is provided; a guide unit that guides movement of the chamber from a mounting position where a space within the chamber surrounds the substrate on the heating unit along a predetermined moving direction along an upper surface of the heating unit, the guide portion is formed to extend along the movable direction and has a rail portion on which a roller provided in the chamber runs; The rail portion is integrally formed with the bottom wall, The heat treatment apparatus, wherein the rail portion and the bottom wall are provided independently of the chamber and detachably attached to the base portion.

Images