Electronic Component Module

Abstract

To provide an electronic component module capable of improving a cooling property and maintenance easiness.SOLUTION: An electronic component module 10 comprises a cooler 11, a plurality of semiconductor elements 13, and a plurality of fuses 15. The plurality of semiconductor elements 13 and fuses 15 are disposed at the side of a first arrangement surface 11A and the side of a second arrangement surface 11B in a thickness direction of the cooler 11. A plurality of first fuses 15a is disposed in such a manner that at least a predetermined portion of a second fuse 15b is visible from between adjacent first fuses 15a in a view in the thickness direction of the cooler 11. A plurality of second fuses 15b is disposed in such a manner that at least a predetermined portion of the first fuse 15a is visible from between adjacent second fuses 15b in a view in the thickness direction of the cooler 11.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD An embodiment of the present invention relates to an electronic component module. [Background technology]

[0002] 2. Description of the Related Art Conventionally, there is a cooler that includes a plurality of heat generating elements mounted on both sides of a container that forms a flow path for a refrigerant. In the case of a module that mounts various electronic components, including multiple heat-generating elements, it is necessary to arrange the various electronic components densely in order to reduce the overall module size while ensuring the desired cooling performance. However, if electronic components that require maintenance or replacement at appropriate intervals are arranged densely, it may not be possible to ensure the desired ease of maintenance. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2019 / 180762 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide an electronic component module that can improve cooling performance and ease of maintenance. [Means for solving the problem]

[0005] An electronic component module according to an embodiment includes a support member, a plurality of electronic components, and a plurality of first electronic components and a plurality of second electronic components among the plurality of electronic components. The support member has a pair of first and second arrangement surfaces facing each other in a predetermined direction. The plurality of electronic components are arranged on the first arrangement surface side and the second arrangement surface side in the predetermined direction. The plurality of electronic components are arranged offset from each other when viewed from the predetermined direction. Each of the plurality of first electronic components has a first protruding portion that protrudes from the support member on the first arrangement surface side in a direction parallel to the first arrangement surface. Each of the plurality of second electronic components has a second protruding portion that protrudes from the support member on the second arrangement surface side in a direction parallel to the second arrangement surface. The plurality of first electronic components are arranged such that at least a predetermined portion of the second protruding portion is visible between adjacent first protruding portions when viewed from the predetermined direction. The plurality of second electronic components are arranged such that at least a predetermined portion of the first protruding portion is visible between adjacent second protruding portions when viewed from the predetermined direction. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a perspective view showing a configuration of an electronic component module according to an embodiment. [Figure 2] 3 is a diagram showing the arrangement of a plurality of semiconductor elements and a plurality of fuses in the electronic component module of the embodiment as viewed from the X-axis direction. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, an electronic component module according to an embodiment will be described with reference to the drawings. Fig. 1 is a perspective view showing the configuration of an electronic component module 10 according to an embodiment. Fig. 2 is a view showing the arrangement of a plurality of semiconductor elements 13 and a plurality of fuses 15 in the electronic component module 10 according to the embodiment as viewed from the X-axis direction. Hereinafter, the X-axis, Y-axis, and Z-axis directions, which are orthogonal to each other in three-dimensional space, are directions parallel to each other. For example, as shown in Fig. 1, the Z-axis direction is parallel to the arrangement direction of multiple electronic components in electronic component module 10. The Y-axis direction is parallel to the thickness direction of electronic component module 10. The X-axis direction is parallel to the depth direction of the cooler in electronic component module 10.

[0008] The electronic component module 10 of the embodiment constitutes, for example, a part of a power conversion unit mounted on a panel provided in electrical equipment, etc. The panel is a power distribution board, a distribution panel, a control panel, etc. that constitutes a power supply device, a motor drive device, etc. The power conversion unit includes various circuit components, for example, semiconductor elements, conductors, fuses, capacitors, transformers, switches, circuit breakers, and measuring instruments.

[0009] As shown in FIGS. 1 and 2, an electronic component module 10 includes, for example, a housing 10a, a cooler 11, a plurality of semiconductor elements 13, a plurality of fuses 15, a conductive member 17, and a connecting member 19. The housing 10a has an outer shape of, for example, a rectangular box, and accommodates, for example, a cooler 11, a plurality of semiconductor elements 13, a plurality of fuses 15, a conductive member 17, and a connecting member 19 inside.

[0010] The cooler 11 is, for example, a heat sink that cools an object to be cooled by a liquid or gaseous refrigerant flowing inside. The cooler 11 has, for example, a rectangular box shape. The cooler 11 includes a supply unit 11a and a discharge unit 11b that connect a refrigerant flow path formed inside the cooler 11 with the outside. Each of the supply unit 11a and the discharge unit 11b includes, for example, a connector for connecting an external pipe.

[0011] The cooler 11 includes, for example, a pair of first and second arrangement surfaces 11A and 11B on which a plurality of objects to be cooled are arranged. The pair of first and second arrangement surfaces 11A and 11B are arranged, for example, on both sides in the thickness direction (Y-axis direction) of the cooler 11, facing each other and along the flow path of the refrigerant inside the cooler 11.

[0012] The semiconductor elements 13 are, for example, a plurality of switching elements and rectifying elements that are bridge-connected in each of the three phases to form a bridge circuit. The switching elements are transistors such as IGBTs (Insulated Gate Bipolar Transistors) or MOSFETs (Metal Oxide Semiconductor Field Effect Transistors). The rectifying elements are diodes connected in parallel to each transistor.

[0013] The plurality of semiconductor elements 13 includes, for example, a plurality of first semiconductor elements 13a arranged on the first arrangement surface 11A of the cooler 11 and a plurality of second semiconductor elements 13b arranged on the second arrangement surface 11B while ensuring a desired electrical insulation distance. The multiple first semiconductor elements 13a are arranged, for example, in a row at predetermined intervals along the Z-axis direction on the first arrangement surface 11A. The multiple second semiconductor elements 13b are arranged, for example, in a row at predetermined intervals along the Z-axis direction on the second arrangement surface 11B. The positions of the multiple first semiconductor elements 13a in the X-axis direction and the positions of the multiple second semiconductor elements 13b in the X-axis direction are, for example, the same.

[0014] For example, the positions of the multiple first semiconductor elements 13a in the Z-axis direction are different from the positions of the multiple second semiconductor elements 13b in the Z-axis direction. The multiple first semiconductor elements 13a and the multiple second semiconductor elements 13b are arranged offset from each other when viewed in the thickness direction (Y-axis direction) of the cooler 11.

[0015] 2, when viewed from the X-axis direction, the plurality of first semiconductor elements 13a and the plurality of second semiconductor elements 13b are arranged in a so-called staggered arrangement along the Z-axis direction. When viewed from the X-axis direction, the plurality of first semiconductor elements 13a and the plurality of second semiconductor elements 13b are arranged alternately by being shifted in position along the parallel arrangement directions (i.e., the Z-axis direction).

[0016] As shown in FIGS. 1 and 2, each of the plurality of fuses 15 includes, for example, a fuse body 21, a microswitch 23, and a fastening member 25. The fuse body 21 is connected to the semiconductor element 13 for each of the three phases. The microswitch 23 is connected to the fuse body 21. The microswitch 23 outputs a signal, for example, when the fuse body 21 melts. The fastening member 25 is, for example, a fastening screw or the like to which a predetermined tightening torque is set. The fastening member 25 fastens and fixes the fuse body 21 to the connecting member 19, which will be described later.

[0017] The plurality of fuses 15 includes, for example, a plurality of first fuses 15a arranged on the first arrangement surface 11A side in the thickness direction (Y-axis direction) of the cooler 11 and a plurality of second fuses 15b arranged on the second arrangement surface 11B side, while ensuring a desired electrical insulation distance. The first fuses 15a are connected to, for example, two first semiconductor elements 13a for each of the three phases. The second fuses 15b are connected to, for example, two second semiconductor elements 13b for each of the three phases.

[0018] The multiple first fuses 15a are arranged, for example, in a row at predetermined intervals along the Z-axis direction on the first arrangement surface 11A side. The multiple second fuses 15b are arranged, for example, in a row at predetermined intervals along the Z-axis direction on the second arrangement surface 11B side. The positions of the multiple first fuses 15a in the X-axis direction and the positions of the multiple second fuses 15b in the X-axis direction are, for example, the same. For example, the positions of the multiple first fuses 15a in the Z-axis direction are different from the positions of the multiple second fuses 15b in the Z-axis direction. The multiple first fuses 15a and the multiple second fuses 15b are arranged offset from each other when viewed in the thickness direction (Y-axis direction) of the cooler 11.

[0019] 2, when viewed from the X-axis direction, the plurality of first fuses 15a and the plurality of second fuses 15b are arranged in a staggered manner along the Z-axis direction. When viewed from the X-axis direction, the plurality of first fuses 15a and the plurality of second fuses 15b are arranged alternately by being shifted in position along the parallel arrangement direction (i.e., the Z-axis direction).

[0020] For example, the entirety of each of the multiple first fuses 15a protrudes from the cooler 11 on the first arrangement surface 11A side in a direction parallel to the first arrangement surface 11A. For example, the entirety of each of the multiple second fuses 15b protrudes from the cooler 11 on the second arrangement surface 11B side in a direction parallel to the second arrangement surface 11B. The direction parallel to the first arrangement surface 11A and the direction parallel to the second arrangement surface 11B are, for example, the same X-axis direction.

[0021] 2, the multiple first fuses 15a are arranged such that, for example, at least a predetermined portion of the second fuse 15b can be seen between adjacent first fuses 15a when viewed in the thickness direction (Y-axis direction) of the cooler 11. The predetermined portion of the second fuse 15b includes at least the fastening member 25 of the second fuse 15b and a portion to which the fastening member 25 is attached.

[0022] The second fuses 15b are arranged so that, for example, at least a predetermined portion of the first fuse 15a can be seen between adjacent second fuses 15b when viewed in the thickness direction (Y-axis direction) of the cooler 11. The predetermined portion of the first fuse 15a includes at least the fastening member 25 of the first fuse 15a and a portion to which the fastening member 25 is attached.

[0023] 1, the conductive member 17 is connected to, for example, a plurality of semiconductor elements 13. The conductive member 17 includes, for example, a positive conductive member 17a and a negative conductive member 17b that are connected to an external power supply. The connection members 19 connect, for example, the plurality of semiconductor elements 13 and the plurality of fuses 15. The connection members 19 include, for example, first connection members 19a that connect two first semiconductor elements 13a and fuse bodies 21 of first fuses 15a in each of the three phases, and second connection members 19b that connect two second semiconductor elements 13b and fuse bodies 21 of second fuses 15b in each of the three phases.

[0024] According to the embodiment described above, the electronic component module 10 is provided with a plurality of semiconductor elements 13 and a plurality of fuses 15 that are arranged offset from each other when viewed in the thickness direction (Y-axis direction) of the cooler 11, thereby making it possible to prevent the electronic component module 10 from becoming large while ensuring the desired electrical insulation distance and cooling performance.

[0025] The multiple first fuses 15a are arranged such that, when viewed from the thickness direction (Y-axis direction), at least a predetermined portion of the second fuse 15b is visible between adjacent first fuses 15a. The multiple second fuses 15b are arranged such that, when viewed from the thickness direction (Y-axis direction), at least a predetermined portion of the first fuse 15a is visible between adjacent second fuses 15b. This ensures space for inserting and accessing a tool such as a torque wrench along the thickness direction (Y-axis direction) to the fastening members 25 of each fuse 15a, 15b and easily performing desired work. This ensures the desired ease of maintenance for electronic components that require maintenance work, such as replacement or tightening torque management, at appropriate intervals, such as periodically.

[0026] For example, the multiple fuses 15 can be arranged compactly so that they do not extend too far vertically or horizontally relative to the arrangement of the multiple semiconductor elements 13. It is possible to secure both the space required for attaching the fastening members 25 of each fuse 15 and the desired electrical insulation distance. By staggering the multiple semiconductor elements 13 along the Z-axis direction, by shifting them in the Z-axis direction rather than facing each other in the thickness direction, it is possible to disperse heat generation points while facilitating mutual connection. For example, compared to arranging multiple semiconductor elements 13 or multiple fuses 15 in a line along the Z-axis direction, it is possible to suppress heat transfer between multiple semiconductor elements 13 or multiple fuses 15 along the arrangement direction.

[0027] The following describes modified examples. In the above-described embodiment, the plurality of semiconductor elements 13 and the plurality of fuses 15 are arranged on the cooler 11, but this is not limiting. For example, the plurality of semiconductor elements 13 and the plurality of fuses 15 may be arranged on a predetermined support member instead of the cooler 11. The predetermined support member may be, for example, a cooling plate equipped with a plurality of heat dissipation fins or a plate-like member such as a drive board that drives and controls switching elements and the like of the plurality of semiconductor elements 13.

[0028] In the above-described embodiment, each fuse 15 protrudes from the cooler 11 in a direction parallel to each arrangement surface 11A, 11B (for example, the X-axis direction, etc.), but this is not limited to this. For example, only a predetermined portion of each fuse 15 may protrude from the cooler 11. The predetermined portion of each fuse 15 includes at least the fastening member 25 and a portion to which the fastening member 25 is attached.

[0029] In this case, the multiple first fuses 15a are arranged so that, for example, at least a predetermined portion of the protruding portion (second protruding portion) of the second fuse 15b can be seen between the protruding portions (first protruding portions) of adjacent first fuses 15a when viewed in the thickness direction (Y-axis direction) of the cooler 11. The predetermined portion of the second fuse 15b includes at least the fastening member 25 of the second fuse 15b and a portion to which the fastening member 25 is attached.

[0030] The second fuses 15b are arranged such that, for example, at least a predetermined portion of the protruding portion (first protruding portion) of the first fuse 15a can be seen between the protruding portions (second protruding portions) of adjacent second fuses 15b when viewed in the thickness direction (Y-axis direction) of the cooler 11. The predetermined portion of the first fuse 15a includes at least the fastening member 25 of the first fuse 15a and a portion to which the fastening member 25 is attached.

[0031] According to at least one of the embodiments described above, the electronic component module 10 includes a plurality of semiconductor elements 13 and a plurality of fuses 15 that are arranged offset from each other when viewed in the thickness direction (Y-axis direction) of the cooler 11, thereby preventing the electronic component module 10 from becoming large while ensuring the desired electrical insulation distance and cooling performance.

[0032] The multiple first fuses 15a are arranged such that, when viewed from the thickness direction (Y-axis direction), at least a predetermined portion of the second fuse 15b is visible between adjacent first fuses 15a. The multiple second fuses 15b are arranged such that, when viewed from the thickness direction (Y-axis direction), at least a predetermined portion of the first fuse 15a is visible between adjacent second fuses 15b. This ensures space for inserting and accessing a tool such as a torque wrench along the thickness direction (Y-axis direction) to the fastening members 25 of each fuse 15a, 15b and easily performing desired work. This ensures the desired ease of maintenance for electronic components that require maintenance work, such as replacement or tightening torque management, at appropriate intervals, such as periodically.

[0033] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, as well as within the scope of the invention described in the claims and their equivalents. [Explanation of symbols]

[0034] 10...electronic component module, 10a...housing, 11...cooler (support member), 11A...first placement surface, 11B...second placement surface, 13...semiconductor element (electronic component, heat-generating element), 13a...first semiconductor element (third electronic component), 13b...second semiconductor element (fourth electronic component), 15...fuse (electronic component), 15a...first fuse (first electronic component, first protruding portion), 15b...second fuse (second electronic component, second protruding portion), 17...conductive member, 19...connecting member, 21...fuse main body, 23...microswitch, 25...fastening member (predetermined portion).

Claims

1. a support member having a pair of first and second placement surfaces facing each other in a predetermined direction; a plurality of electronic components arranged on the first arrangement surface side and the second arrangement surface side in the predetermined direction, and arranged so as to be shifted from one another when viewed from the predetermined direction; Among the plurality of electronic components, a first protruding portion protruding from the support member on the first placement surface side in a direction parallel to the first placement surface or a second protruding portion protruding from the support member on the second placement surface side in a direction parallel to the second placement surface; a plurality of first electronic components on the first arrangement surface side and a plurality of second electronic components on the second arrangement surface side, which are arranged such that, when viewed from the predetermined direction, at least predetermined portions of the second protruding portions are visible between adjacent first protruding portions and at least predetermined portions of the first protruding portions are visible between adjacent second protruding portions; Equipped with The plurality of electronic components include: a third electronic component disposed on the first placement surface and connected to the first electronic component; a fourth electronic component disposed on the second placement surface and connected to the second electronic component, the support member is a cooler having a refrigerant flow path formed therein, the first electronic component and the second electronic component are fuses, the third electronic component and the fourth electronic component are heat generating elements; Electronic component module.

2. 2. The electronic component module according to claim 1, wherein the plurality of electronic components arranged on the first arrangement surface side and the plurality of electronic components arranged on the second arrangement surface side are arranged alternately when viewed from the predetermined direction and a direction perpendicular to the arrangement direction by being shifted in position along each of the parallel arrangement directions.

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