Film forming apparatus, film forming method, and article manufacturing method

Abstract

To provide an advantageous technique for reducing deformation of a substrate holder supported by a movable stage. [Solution] The film forming apparatus comprises a movable stage, a substrate holding section supported by the movable stage and holding a substrate, a connecting section connecting the movable stage and the substrate holding section, and a curing section curing a curable composition on the substrate, the connecting section including a kinematic coupling and an attractive force generator between the movable stage and the substrate holding section that generates an attractive force to fix the substrate holding section to the movable stage.

Description

[Technical Field]

[0001] The present invention relates to a film forming apparatus, a film forming method, and an article manufacturing method. [Background technology]

[0002] A technique for planarizing the surface of a substrate by forming a film on the substrate using a spin coater is widely used, but this method is insufficient for planarizing the steps of the substrate at the nanoscale. Therefore, planarization methods that apply imprinting technology have attracted attention. In planarization methods that apply imprinting technology, a planarized film is formed by contacting a flat member called a superstrate with a curable composition applied to a substrate to spread the curable composition, and then curing the curable composition.

[0003] The curable composition can be cured by irradiating it with curing energy such as light. Therefore, when processing a large number of substrates, undesirable temperature distribution can occur in the movable stage that holds the substrate and the substrate holder supported by the movable stage. This can cause deformation of the substrate holder, which in turn can deform the substrate. If a planarization film is formed on a deformed substrate and the substrate returns to a thermal equilibrium state, the flatness of the surface of the planarization film can deteriorate. Problems caused by deformation of the movable stage and substrate holder can also occur in imprinting apparatuses that transfer patterns to substrates and exposure apparatuses that expose substrates by projecting the pattern of a master onto the substrate using a projection optical system.

[0004] Patent Document 1 describes a method in which a resin layer is irradiated with energy rays while the resin layer is being pressed with a transfer mold, the irradiation of the energy rays is interrupted halfway through the curing stage of the resin layer, the pressure is removed to release the stress, and then the irradiation of the energy rays to the resin layer is resumed. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-23868 Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide an advantageous technique for reducing deformation of a substrate holder supported by a movable stage. [Means for solving the problem]

[0007] One aspect of the present invention relates to a film forming apparatus, the film forming apparatus including: a movable stage; a substrate holding unit supported by the movable stage and holding a substrate; a connecting unit connecting the movable stage and the substrate holding unit; and a curing unit curing a curable composition on the substrate. A control unit; the coupling unit includes a kinematic coupling and an attractive force generator that generates an attractive force between the movable stage and the substrate holder to fix the substrate holder to the movable stage. fruit , The control unit deactivates the attraction force generator during a curing step in which the curable composition on the substrate is cured in the curing unit. . [Effects of the Invention]

[0008] The present invention provides an advantageous technique for reducing deformation of a substrate holder supported by a movable stage. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram schematically illustrating a configuration of a film forming apparatus according to an embodiment. [Figure 2] FIG. [Figure 3] 1 is a top view of the movable stage 4. FIG. [Figure 4] FIG. 2 is a diagram showing an example of the configuration of an attractive force generator. [Figure 5] FIG. 10 is a diagram showing another example of the configuration of an attractive force generator. [Figure 6] 3A to 3C are diagrams showing the operation (film formation process) of the film forming apparatus. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0011] In this specification and drawings, directions are indicated in an XYZ coordinate system, with the XY plane being a plane parallel to the surface of the substrate held by the substrate holder. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are defined as the X-direction, Y-direction, and Z-direction, respectively. The +Z direction is defined as up, and the -Z direction is defined as down.

[0012] FIG. 1 schematically shows the configuration of a film forming machine (FFM) according to one embodiment. The film forming machine FFM can be configured to form a film made of a cured product of a curable composition on a substrate 1. The film forming machine FFM can be configured as, for example, a planarizing machine or an imprinting machine, and the following describes an example in which the film forming machine FFM is configured as a planarizing machine. When the film forming machine FFM is configured as an imprinting machine, a mold having a pattern is used instead of the planarizing member 2 described below, and the pattern can be transferred to the curable composition on the substrate 1.

[0013] The substrate 1 may be, for example, a plate-like member made of glass, quartz glass, ceramics, metal, semiconductor (e.g., silicon, compound semiconductor), or resin, or a member having one or more layers on such a plate-like member. The substrate 1 may have multiple shot areas. The substrate 1 may also have marks for measuring the distortion of each shot area, the arrangement of the multiple shot areas, etc.

[0014] The planarizing member 2 is made of, for example, glass, ceramics, metal, semiconductor, resin, or the like, and the flat portion of its surface comes into contact with the curable composition on the substrate 1, and a flat liquid film can be formed due to the surface tension of the curable composition. The outer diameter (dimension) of the planarizing member 2 is preferably the same as or larger than the outer diameter (dimension) of the substrate 1.

[0015] The film-forming apparatus FFM may include an applicator 7 that applies a curable composition onto the substrate 1. However, the film-forming apparatus FFM may also be provided with a substrate 1 on which the curable composition has been applied by an external device. The curable composition is a composition that cures when curing energy is applied. Examples of curing energy include electromagnetic waves and heat. Examples of electromagnetic waves include infrared light, visible light, and ultraviolet light, each having a wavelength selected from the range of 10 nm to 1 mm. A photocurable composition that cures with light contains at least a polymerizable compound and a photopolymerization initiator and may optionally contain a non-polymerizable compound or solvent. The non-polymerizable compound is at least one selected from the group consisting of sensitizers, hydrogen donors, internal mold release agents, surfactants, antioxidants, and polymer components. The viscosity of the curable composition (at 25°C) is, for example, 1 mPa·s to 100 mPa·s. The applicator 7 may be configured to apply droplets of the curable composition onto the substrate 1. The term "coating" encompasses, for example, an action of discharging droplets of the curable composition and disposing the droplets discretely on the substrate 1. In one example, the curable composition can be coated onto the substrate 1 by discharging droplets of the curable composition from the applicator 7 while driving the substrate 1 with the driving mechanism 12.

[0016] The film-forming apparatus FFM may include an operating unit 6 that operates a planarizing member 2, which is a type of mold used to mold the curable composition applied to the substrate 1. The planarizing member 2 may also be called a superstrate. The operating unit 6 may be configured to perform a contacting step of bringing the planarizing member 2 into contact with the curable composition applied to the substrate 1, and a separating step of separating the planarizing member 2 from a film made of the cured product of the curable composition on the substrate 1. However, the unit that performs the contacting step and the unit that performs the separating step may be provided separately. The film-forming apparatus FFM may further include a separation mechanism 8 that separates the planarizing member 2 from the film made of the cured product of the curable composition on the substrate 1. In this case, the separation mechanism 8 operates to sever the bond between the film made of the cured product of the curable composition on the substrate 1 and the planarizing member 2, and then the operating unit 6 may operate to recover the planarizing member 2 from the substrate 1. The separation mechanism 8 may be provided, for example, in the substrate holder 3 described below. The operation of severing the bond between the film made of the cured product of the curable composition on the substrate 1 and the planarizing member 2 may be performed by both the separation mechanism 8 and the operation unit 6. The operation unit 6 may include a chuck 62 that holds the planarizing member 2, and a drive mechanism 61 that raises and lowers the chuck 62.

[0017] The film forming apparatus FFM may include a curing unit 5 that cures the curable composition on the substrate 1. The curing unit 5 may cure the curable composition on the substrate 1 by applying curing energy to the curable composition. As described above, various types of curing energy may be employed. The curing unit 5 may be configured to irradiate the curing energy onto the curable composition between the substrate 1 and the planarizing member 2, for example, through the planarizing member 2.

[0018] The film-forming apparatus FFM may include a movable stage 4, a substrate holder 3 supported by the movable stage 4, and a coupling unit 100 coupling the movable stage 4 and the substrate holder 3. The substrate holder 3 may include a chuck (e.g., a vacuum chuck or an electrostatic chuck) for holding the substrate 1. The film-forming apparatus FFM may also include a drive mechanism 12 that drives the movable stage 4 to drive the substrate 1. The film-forming apparatus FFM may also include a surface plate 11, and the drive mechanism 12 may drive the movable stage 4 so that the movable stage 4 moves along the upper surface of the surface plate 11. The drive mechanism 12 may drive the substrate holder 3 (substrate 1) to a coating position where a coating step is performed by the coating unit 7, a curing position where a curing step is performed by the curing unit 5, or an operation position where a contact step and a separation step are performed by the operation unit 6. The drive mechanism 12 may also drive the substrate holder 3 (substrate 1) to a position where the substrate 1 is loaded and unloaded.

[0019] The coupling unit 100 may include a kinematic coupling 110. The coupling unit 100 may also include an attractive force generator 120 that generates an attractive force between the movable stage 4 and the substrate holder 3 to fix the substrate holder 3 to the movable stage 4. The attractive force is a term that encompasses, for example, a vacuum attractive force, an electromagnetic attractive force, an electrostatic attractive force, and the like.

[0020] When the curing unit 5 irradiates the curable composition with curing energy, the substrate 1, the curable composition, and the planarizing member 2 can be heated, as well as the substrate holding unit 3 and the movable stage 4. The substrate holding unit 3 and the movable stage 4 can be deformed (expanded) by heat. Note that the substrate holding unit 3 includes, for example, a pin chuck, and even if the substrate holding unit 3 is deformed (expanded) by heat, the flatness of the surface supporting the substrate 1 can be maintained with high precision.

[0021] 2 and 3 show configuration examples of the kinematic coupling 110. Here, FIG. 2 is a view of the substrate holder 3 as viewed from below, and FIG. 3 is a view of the movable stage 4 as viewed from above. The kinematic coupling 110 can be configured to constrain the substrate holder 3 with respect to six degrees of freedom. The kinematic coupling 110 has, for example, multiple (typically three) constraint units, and each constraint unit can be composed of a V-groove 112 and a ball 111 that engages with the V-groove 112. The V-groove 112 can be provided on the substrate holder 3, and the ball 111 can be provided on the movable stage 4. Alternatively, the V-groove 112 can be provided on the movable stage 4, and the ball 111 can be provided on the substrate holder 3. Gravity acting on the substrate holder 3 causes the V-groove 112 and the ball 111 to abut against each constraint unit, thereby positioning the substrate holder 3 with respect to the movable stage 4 with respect to six degrees of freedom. The V-groove 112 can be formed by processing the substrate holder 3 or the movable stage 4. Alternatively, a component having the V-groove 112 can be fastened to the substrate holder 3 or the movable stage 4. The ball 111 can be fastened to the movable stage 4 or the substrate holder 3.

[0022] 4 schematically shows an example configuration of the attractive force generator 120. The attractive force generator 120 includes a first portion 121 provided on the movable stage 4 and a second portion 122 provided on the substrate holder 3, and can generate an attractive force between the first portion 121 and the second portion 122. The coupling unit 100 may further include an elastic member 123. The elastic member 123 can support the first portion 121 or the second portion 122 so that the first portion 121 and the second portion 122 contact each other when the attractive force generator 120 generates an attractive force, and so that the first portion 121 and the second portion 122 do not contact each other when the attractive force generator 120 does not generate an attractive force.

[0023] The elastic member 123 may be, for example, a spring such as a leaf spring. The generation of the attractive force by the attractive force generator 120 may be controlled by the control unit 9, which will be described later. The attractive force generator 120 may be configured to generate, for example, an electrostatic attractive force. In one example, the first portion 121 of the attractive force generator 120 may be an electrode for generating the electrostatic attractive force, and the second portion 122 of the attractive force generator 120 may be a pad attracted by the first portion 121. When the attractive force generator 120 is not generating an attractive force, the movable stage 4 and the substrate holder 3 are coupled by the kinematic coupling 110 with a first coupling force. On the other hand, when the attractive force generator 120 is generating an attractive force, the movable stage 4 and the substrate holder 3 are coupled by the kinematic coupling 110 and the attractive force generator 120 with a second coupling force greater than the first coupling force. The attractive force generator 120 may be configured to adjust the magnitude of the attractive force it generates.

[0024] The attraction generator 120 may generate, for example, an electromagnetic attraction force. In this case, at least one of the first portion 121 and the second portion 122 may be configured with an electromagnet to generate a controllable electromagnetic attraction force between the first portion 121 and the second portion 122. In one example, the first portion 121 may be configured with an electromagnet, and the second portion may be configured with an iron core.

[0025] The attractive force generator 120 may generate a vacuum suction force. Fig. 5 schematically shows a configuration example in which the attractive force generator 120 generates a vacuum suction force. In the example shown in Fig. 5, the first part 121 and the elastic member 123 are integrated, and the elastic member 123 is provided with a vacuum suction line 124. The second part 122 may be formed, for example, on the lower surface (bottom part) of the substrate holder 3.

[0026] The elastic member 123 may be a deformable member made of, for example, resin or metal. Instead of the elastic member 123, a component capable of minute deformation, such as a piezoelectric element, may be used.

[0027] As illustrated in FIG. 2, the substrate holder 3 may have a circular or disk-like shape. However, the substrate holder 3 may have other shapes, such as a rectangular or rectangular parallelepiped shape. The three V-grooves 112 may be arranged at 120-degree intervals on an imaginary circle that is concentric with the central axis of the substrate holding region 33 that holds the substrate 1 and is larger than the outer shape of the substrate 1. Each V-groove 112 may be arranged so that its center line (the line forming the valley) faces the central axis of the holding region 33. Each sphere 111 is arranged opposite its corresponding V-groove 112.

[0028] When the substrate 1 is heated by irradiation of curing energy by the curing unit, and the heat of the substrate 1 is transferred to the substrate holding unit 3 and the movable stage 4, the substrate holding unit 3 and the movable stage 4 may deform independently. However, if the movable stage 4 and the substrate holding unit 3 are connected only by a kinematic coupling 110, the substrate holding unit 3 is not affected by the deformation of the movable stage 4. Therefore, the deformation of the substrate holding surface of the substrate holding unit 3 (the surface defined by the portion that contacts the substrate 1) and the substrate 1 is very small and negligible. Therefore, the surface flatness of the film made of the cured product of the curable composition formed on the substrate 1 can be maintained even when the temperature of the substrate 1 returns to thermal equilibrium.

[0029] The second portion 122 preferably has, for example, a circular shape concentric with the central axis of the substrate holding area 33, and the radius thereof is smaller than the radius of the substrate 1. The second portion 122 may be made up of a plurality of concentric members.

[0030] The film-forming apparatus FFM may include a control unit 9. The control unit 9 may be configured, for example, by a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), a general-purpose or dedicated computer with an embedded program, or a combination of all or part of these. The control unit 9 controls the application unit 7, the operation unit 6, the curing unit 5, the drive mechanism 12, and the attractive force generator 120. In this way, the control unit 9 controls the film-forming process for forming a cured film of the cured product of the curable composition on the substrate 1. The film-forming process may include, for example, an application step of applying the curable composition to the substrate, a contact step of bringing a planarizing member (mold) into contact with the curable composition on the substrate, a curing step of curing the curable composition, and a separation step of separating the planarizing member from the cured film of the curable composition. The film-forming process may further include a driving step of driving the substrate. During the curing step, it is preferable to deactivate the attractive force generator 120. On the other hand, during the contacting step and the driving step, it is preferable to activate the attractive force generator 120. During the application step, the attractive force generator 120 can be controlled in accordance with the acceleration of the movable stage 4. For example, when the acceleration is such that the positioning accuracy of the substrate holder 3 relative to the movable stage 4 can be maintained by the kinematic coupling 110 even when the attractive force generator 120 is deactivated, the attractive force generator 120 can be deactivated. On the other hand, when the acceleration is such that the positioning accuracy of the substrate holder 3 relative to the movable stage 4 is not guaranteed when the attractive force generator 120 is deactivated, the attractive force generator 120 can be activated.

[0031] The control unit 9 can be configured to control the state of the attractive force generator 120 according to the progress of the film formation process. In one aspect, the control unit 9 can, for example, deactivate the attractive force generator 120 at least during the curing step. In another aspect, the control unit 9 can be configured to make the attractive force generated by the attractive force generator 120 during the curing step smaller than the attractive force generated by the attractive force generator 120 during the driving step.

[0032] FIG. 6 exemplifies the flow of the film formation process controlled by the control unit 9. In step S601, the control unit 9 controls the drive mechanism 12 to position the substrate holder 3 at the receiving position for the substrate 1, and the substrate 1 is supplied to the substrate holder 3. Alternatively, the control unit 9 may cause a substrate transfer robot (not shown) to supply the substrate 1. In step S602, the control unit 9 activates the attractive force generator 120 to fix the substrate holder 3 to the movable stage 4 with the second coupling force. In step S603, the control unit 9 controls the drive mechanism 12 to position the substrate holder 3 (substrate 1) at the coating position. In step S604, which is an optional step, the control unit 9 deactivates the attractive force generator 120 to release the substrate holder 3 from the movable stage 4. As a result, the coupling force of the substrate holder 3 to the movable stage 4 is only the coupling force due to the kinematic coupling 110, i.e., the first coupling force, which is smaller than the second coupling force. In step S604, the control unit 9 may cause the attractive force generated by the attractive force generator 120 to be smaller than the attractive forces in steps S602 and S603. In step S605, the control unit 9 controls the applicator 7 and the drive mechanism 12 so that the curable composition is applied onto the substrate 1. Step S606 is performed when step S604 is performed, and the control unit 9 activates the attractive force generator 120 to fix the substrate holder 3 to the movable stage 4 with the second bonding force.

[0033] In step S607, the control unit 9 controls the drive mechanism 12 to position the substrate holding unit 3 (substrate 1) below the operation unit 6. In step S608, the control unit 9 controls the operation unit 6 to bring the planarizing member 2 into contact with the curable composition on the substrate 1. Note that in step S608, if the first bonding force is sufficient to bond the substrate holding unit 3 to the movable stage 4, the control unit 9 may deactivate the attractive force generator 120, and in that case, the control unit 9 activates the attractive force generator 120 after step S608 is completed.

[0034] In step S609, the control unit 9 controls the drive mechanism 12 to position the substrate holding unit 3 (substrate 1) below the curing unit 5. In step S610, the control unit 9 deactivates the attractive force generator 120 and releases the substrate holding unit 3 from the movable stage 4. As a result, the bonding force of the substrate holding unit 3 to the movable stage 4 is the bonding force exerted by the kinematic coupling 110 alone, i.e., the first bonding force, which is smaller than the second bonding force. In step S611, the control unit 9 controls the curing unit 5 to irradiate the curable composition between the substrate 1 and the planarizing member 2 with curing energy, thereby curing the curable composition. As a result, a cured film made of the cured product of the curable composition is formed.

[0035] In step S612, the control unit 9 activates the attractive force generator 120 to fix the substrate holding unit 3 to the movable stage 4 with the second bonding force. In step S613, the control unit 9 controls the drive mechanism 12 to position the substrate holding unit 3 (substrate 1) below the operation unit 6. In step S614, the control unit 9 controls the operation unit 6 and the separation mechanism 8 to separate the planarizing member 2 from the cured material on the substrate 1. In step S614, the substrate holding unit 3 must be bonded to the movable stage 4 with the second bonding force. In step S615, the control unit 9 controls the drive mechanism 12 to position the substrate holding unit 3 at a transfer position for the substrate 1, and transfers the substrate 1 from the substrate holding unit 3 to the substrate transfer robot.

[0036] Below, an article manufacturing method for manufacturing an article such as a semiconductor device will be described. The article manufacturing method may include a film formation step in which a cured film is formed on a substrate using a film forming apparatus FFM, and a processing step in which the substrate that has undergone the film formation step is processed to obtain an article. The film forming apparatus FFM may be configured as a planarization apparatus or an imprint apparatus. When the film forming apparatus FFM is configured as a planarization apparatus, a planarization film is formed on a substrate having irregularities by the film forming apparatus FFM, and the subsequent processing step may include a lithography step using an exposure apparatus. When the film forming apparatus FFM is configured as an imprint apparatus, a pattern made of a cured film is formed on the substrate by an imprint process.

[0037] The present specification and drawings include the following disclosure. (Item 1) A movable stage; a substrate holder supported by the movable stage and holding a substrate; a coupling portion that couples the movable stage and the substrate holder; a curing unit that cures the curable composition on the substrate, The coupling portion is Kinematic coupling and an attractive force generator between the movable stage and the substrate holder, which generates an attractive force for fixing the substrate holder to the movable stage; A film forming apparatus characterized by: (Item 2) a control unit that controls a state of the attractive force generator according to progress of a process of forming a film of the curable composition on the substrate; 2. The film forming apparatus according to item 1, (Item 3) the treatment includes a curing step of curing the curable composition on the substrate by applying curing energy to the curable composition; The control unit deactivates the attraction force generator at least during the curing step. 3. The film forming apparatus according to item 2, (Item 4) the treatment includes a driving step of driving the substrate and a curing step of curing the curable composition on the substrate by applying curing energy to the curable composition, the control unit makes the attractive force generated by the attractive force generator in the hardening step smaller than the attractive force generated by the attractive force generator in the driving step. 3. The film forming apparatus according to item 2, (Item 5) the attractive force generator includes a first portion provided on the movable stage and a second portion provided on the substrate holder, and generates an attractive force between the first portion and the second portion; The coupling portion further includes an elastic member, the elastic member supports the first part or the second part so that the first part and the second part are in contact with each other when the gravity generator generates an attractive force, and the first part and the second part are not in contact with each other when the gravity generator does not generate an attractive force. 4. The film forming apparatus according to any one of items 1 to 3, characterized in that: (Item 6) The elastic member includes a leaf spring. 6. The film forming apparatus according to item 5, (Item 7) the attractive force generator includes a first portion provided on the movable stage and a second portion provided on the substrate holder, and generates an attractive force between the first portion and the second portion; the first portion includes an elastic member; The first part is configured so that the first part and the second part come into contact with each other when the gravity generator generates an attractive force, and so that the first part and the second part do not come into contact with each other when the gravity generator does not generate an attractive force. 4. The film forming apparatus according to any one of items 1 to 3, characterized in that: (Item 8) The attractive force includes at least one of an electrostatic attraction force, a vacuum attraction force, and an electromagnetic attraction force. 8. The film forming apparatus according to any one of items 1 to 7, characterized in that: (Item 9) further comprising a drive mechanism for driving the movable stage; the attractive force generator is put into an operating state when the movable stage is driven by the driving mechanism; 9. The film forming apparatus according to any one of items 1 to 8, characterized in that: (Item 10) 10. The film forming apparatus according to any one of items 1 to 9, configured as a planarization apparatus. (Item 11) 10. The film forming apparatus according to any one of items 1 to 9, configured as an imprint apparatus. (Item 12) A method for manufacturing an article, A film forming step of forming a cured film on a substrate using the film forming apparatus according to any one of items 1 to 11; a processing step of obtaining an article by processing the substrate that has undergone the film forming step; A method for manufacturing an article, comprising:

[0038] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0039] 1: substrate, 2: planarizing member (mold), 3: substrate holder, 4: movable stage, 5: curing unit, 110: kinematic coupling, 120: attraction force generator, FFM: film forming device,

Claims

1. A movable stage; a substrate holder supported by the movable stage and holding a substrate; a coupling portion that couples the movable stage and the substrate holder; a curing section that cures the curable composition on the substrate; A control unit; Equipped with The coupling portion is Kinematic coupling and an attractive force generator between the movable stage and the substrate holder that generates an attractive force for fixing the substrate holder to the movable stage; the control unit deactivates the attraction force generator during a curing step in which the curable composition on the substrate is cured in the curing unit. A film forming apparatus characterized by:

2. The control unit activates the attraction generator in at least one process other than the hardening process.

2. The film forming apparatus according to claim 1.

3. The control unit controls the state of the attraction generator according to the progress of the process of forming a film of the curable composition on the substrate.

2. The film forming apparatus according to claim 1.

4. A movable stage; a substrate holder supported by the movable stage and holding a substrate; a coupling portion that couples the movable stage and the substrate holder; a curing section that cures the curable composition on the substrate; A control unit; Equipped with The coupling portion is Kinematic coupling and an attractive force generator between the movable stage and the substrate holder that generates an attractive force for fixing the substrate holder to the movable stage; the control unit controls the attractive force generated by the attractive force generator in the curing step of curing the curable composition on the substrate in the curing unit to be smaller than the attractive force generated by the attractive force generator in the driving step of driving the substrate. A film forming apparatus characterized by:

5. the attractive force generator includes a first portion provided on the movable stage and a second portion provided on the substrate holder, and generates an attractive force between the first portion and the second portion; The coupling portion further includes an elastic member, the elastic member supports the first part or the second part so that the first part and the second part come into contact with each other when the gravity generator generates an attractive force, and the first part and the second part do not come into contact with each other when the gravity generator does not generate an attractive force.

2. The film forming apparatus according to claim 1.

6. The elastic member includes a leaf spring.

6. The film forming apparatus according to claim 5.

7. the attractive force generator includes a first portion provided on the movable stage and a second portion provided on the substrate holder, and generates an attractive force between the first portion and the second portion; the first portion includes an elastic member; The first part is configured so that the first part and the second part come into contact with each other when the gravity generator generates an attractive force, and so that the first part and the second part do not come into contact with each other when the gravity generator does not generate an attractive force.

2. The film forming apparatus according to claim 1.

8. The attractive force includes at least one of an electrostatic attraction force, a vacuum attraction force, and an electromagnetic attraction force.

2. The film forming apparatus according to claim 1.

9. further comprising a drive mechanism for driving the movable stage; the attractive force generator is put into an operating state when the movable stage is driven by the driving mechanism; 2. The film forming apparatus according to claim 1.

10. 10. The film forming apparatus according to claim 1, which is configured as a planarization apparatus.

11. 10. The film forming apparatus according to claim 1, which is configured as an imprinting apparatus.

12. A film formation method for forming a film on a substrate using a film formation apparatus, comprising: a driving step of driving the substrate; a curing step of curing the curable composition on the substrate; Including, The film forming apparatus includes: A movable stage; a substrate holder supported by the movable stage and holding the substrate; a coupling portion that couples the movable stage and the substrate holder; a curing unit that cures the curable composition on the substrate in the curing step; Equipped with The coupling portion is Kinematic coupling and an attractive force generator between the movable stage and the substrate holder that generates an attractive force for fixing the substrate holder to the movable stage; In the curing step, the attraction force generator is deactivated. A film forming method comprising:

13. A film formation method for forming a film on a substrate using a film formation apparatus, comprising: a driving step of driving the substrate; a curing step of curing the curable composition on the substrate; Including, The film forming apparatus includes: A movable stage; a substrate holder supported by the movable stage and holding the substrate; a coupling portion that couples the movable stage and the substrate holder; a curing section that cures the curable composition on the substrate; Equipped with The coupling portion is Kinematic coupling and an attractive force generator between the movable stage and the substrate holder that generates an attractive force for fixing the substrate holder to the movable stage; the attractive force generated by the attractive force generator in the hardening step is smaller than the attractive force generated by the attractive force generator in the driving step; A film forming method comprising:

14. A method for manufacturing an article, a film forming step of forming a cured film on a substrate using the film forming apparatus according to any one of claims 1 to 9; a processing step of obtaining an article by processing the substrate that has undergone the film forming step; A method for manufacturing an article, comprising:

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