earphones

Abstract

An earphone is provided that includes a housing defining an audio opening configured to be positioned in or facing towards a wearer's ear canal when the earphone is in a worn position, a speaker driver positioned within the housing, the speaker driver having a diaphragm facing towards the audio opening and defining an audio channel between the diaphragm and the opening, and a body temperature measurement module positioned within the audio channel, the body temperature measurement module including a reflector and a temperature sensor, the temperature sensor configured to receive infrared light transmitted through the audio opening and reflected by the reflector.

Description

[Technical Field]

[0001] The present disclosure relates generally to earphones, and more particularly to earphones capable of measuring and / or monitoring the temperature of the body (tympanic membrane) of a wearer of the earphones, and more particularly to in-ear earphones capable of measuring and / or monitoring the temperature of the body (tympanic membrane) of a wearer of the earphones. [Background technology]

[0002] In recent years, due to various reasons, such as Covid-19, people have been paying more and more attention to measuring body temperature. Many kinds of thermometers exist, such as ear thermometers. However, there are still some inconveniences associated with these thermometers. For example, these thermometers are not portable enough, and / or people usually do not carry the thermometer with them, and therefore cannot find it when needed.

[0003] Earphones, such as in-ear earphones, semi-in-ear earphones, or TWS earphones, are becoming increasingly popular and are often carried by people in daily life these days. Some attempts have been made to incorporate a body temperature measurement module into such earphones. However, due to the limited space within the earphones, there are difficulties in integrating a body temperature measurement module into the earphones without substantially obstructing the audio channel, resulting in degradation of audio performance.

[0004] There is a need for an earphone with a temperature measurement module that has improved audio performance. Summary of the Invention [Means for solving the problem]

[0005] According to one aspect of the disclosure, there is provided an earphone including: a housing defining an audio opening, the audio opening configured to be positioned within or facing towards the ear canal of a wearer when the earphone is worn; a speaker driver positioned within the housing, the speaker driver facing towards the audio opening and defining an audio channel between a diaphragm and the opening; and a body temperature measurement module positioned within the audio channel, the body temperature measurement module including a reflector and a temperature sensor, the temperature sensor configured to receive infrared light transmitted through the audio opening and reflected by the reflector.

[0006] In accordance with one or more embodiments of the present disclosure, the temperature measurement module further includes an optical filter at or near the audio opening.

[0007] In accordance with one or more embodiments of the present disclosure, the light filter is configured to allow selected wavelengths of IR light to pass while substantially absorbing other wavelengths of light.

[0008] In accordance with one or more embodiments of the present disclosure, the reflector includes a shaped inner surface of the housing and a coating applied to the shaped inner surface.

[0009] According to one or more embodiments of the present disclosure, the coating is a silver coating.

[0010] In accordance with one or more embodiments of the present disclosure, the contoured inner surface and coating are curved and configured to reflect and focus infrared light onto the temperature sensor.

[0011] In accordance with one or more embodiments of the present disclosure, the temperature sensor is an FIR sensor.

[0012] In accordance with one or more embodiments of the present disclosure, the temperature sensors are arranged in a horizontal orientation with the photosurface of the temperature sensor substantially parallel to the axis of the audio channel.

[0013] In accordance with one or more embodiments of the present disclosure, the temperature sensor is mounted on a flexible PCB.

[0014] In accordance with one or more embodiments of the present disclosure, the temperature sensor is a single chip FIR sensor.

[0015] According to one or more embodiments of the present disclosure, the earphones are in-ear earphones or TWS earphones.

[0016] Other systems, methods, features, and advantages of the disclosure will be or become apparent to one with skill in the art upon examination of the following figures and detailed description. It is intended that all such additional systems, methods, features, and advantages be included within this description, be within the scope of the disclosure, and be protected by the following claims. The present specification also provides, for example, the following: (Item 1) An earphone, a housing defining an audio opening, the audio opening configured to be positioned within or facing towards the ear canal of a wearer when the earphone is in a worn position; a speaker driver positioned within the housing, the speaker driver having a diaphragm facing toward the sound opening and defining an audio channel between the diaphragm and the opening; a body temperature measurement module positioned within the audio channel, the body temperature measurement module including a reflector and a temperature sensor, the temperature sensor configured to receive infrared light transmitted through the audio opening and reflected by the reflector; The earphones comprising: (Item 2) Item 10. The earphone of item 1, wherein the body temperature measurement module further includes an optical filter at or near the sound opening. (Item 3) 3. The earphone of claim 2, wherein the optical filter is configured to allow IR light of a selected wavelength to pass while substantially absorbing light of other wavelengths. (Item 4) 10. The earphone of claim 1, wherein the reflector includes a contoured inner surface of the housing and a coating applied to the contoured inner surface. (Item 5) Item 5. The earphone of item 4, wherein the coating is a silver coating. (Item 6) Item 5. The earphone of item 4, wherein the shaped inner surface and the coating are curved surfaces and configured to reflect and focus the infrared light onto the temperature sensor. (Item 7) 10. The earphone of claim 1, wherein the temperature sensor is an FIR sensor. (Item 8) 10. The earphone of claim 1, wherein the temperature sensor is arranged in a horizontal orientation with the photo surface of the temperature sensor substantially parallel to the axis of the audio channel. (Item 9) 10. The earphone of claim 1, wherein the temperature sensor is mounted on a flexible PCB. (Item 10) 10. The earphone of claim 1, wherein the temperature sensor is a single chip FIR sensor. (Item 11) 10. The earphone according to any one of the preceding items, wherein the earphone is an in-ear earphone or a TWS earphone.

[0017] The disclosure can be better understood with reference to the following drawings and description. The components in the drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the disclosure. Moreover, in the drawings, like reference characters designate corresponding parts throughout the different views. [Brief explanation of the drawings]

[0018] [Figure 1] 1 shows a cross-sectional view of an earphone 100 in accordance with one or more embodiments of the present disclosure. [Figure 2A] FIG. 2 is an enlarged view of FIG. 1 showing the earphone portion. [Figure 2B] 2A and 2B are views similar to FIG. 2A and illustrating key dimensions of a portion of an earphone according to one or more embodiments of the present disclosure. [Figure 2C] 1 illustrates another cross-sectional view of an earphone in accordance with one or more embodiments of the present disclosure. [Figure 3A] 1 illustrates an ear tube according to one or more embodiments of the present disclosure. [Figure 3B] 1 illustrates an ear tube according to one or more embodiments of the present disclosure. [Figure 3C] 1 illustrates an ear tube according to one or more embodiments of the present disclosure. [Figure 4] 1A illustrates an optical filter according to one or more embodiments of the present disclosure; and FIG. 1B illustrates an optical filter according to one or more embodiments of the present disclosure. [Figure 5] 1A and 1B illustrate an FIR sensor assembly according to one or more embodiments of the present disclosure; [Figure 6]1 shows a frequency response curve chart, where the solid line is the frequency response curve of an earphone according to one or more embodiments of the present disclosure, including an FIR sensor arranged in a horizontal orientation, and the dotted line is the frequency response curve of a comparable embodiment of the earphone, including an FIR sensor arranged in a vertical orientation. DETAILED DESCRIPTION OF THE INVENTION

[0019] Preferred embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings.

[0020] As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly dictates otherwise. As used herein, the terms "comprises," "comprising," "includes," and / or "including" specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or steps thereof. As used herein, the term "and / or" and the symbol " / " are meant to include any and all combinations of one or more of the associated listed items. In addition, terms such as first, second, etc. may be used herein to describe various elements, components, steps, or calculations, and these elements, components, steps, or calculations should not be limited by these terms; rather, these terms are only used to distinguish one element, component, step, or calculation from another. For example, a first component may be termed a second component, similarly a first calculation may be termed a second calculation, and similarly a first step may be termed a second step, all without departing from the scope of the present disclosure.

[0021] As used herein, the term "audio channel" refers to the channel defined by the earphone housing between the speaker driver and the earphone's audio opening, such as between the speaker driver's diaphragm and the earphone's audio opening. The term "effective audio channel" refers to the unobstructed portion of the audio channel after the portion of the audio channel has been occupied by the temperature measurement module. The term "wearing position" refers to the position of the earphone when worn by a wearer. The term "audio opening" refers to the opening in the earphone housing through which sound produced by the earphone or speaker driver is transmitted to the wearer's ear. The earphone's audio opening is normally positioned in and / or toward the wearer's ear canal in the earphone's wearing position, i.e., when the earphone is worn by a wearer. The sound opening is usually provided with a mesh that allows sound produced by the earphone or speaker driver to pass through while preventing dust or debris from entering the sound channel of the earphone.

[0022] To clarify its use in the pending claims and to provide notice to the public below, the phrase " 、 , …and <n> At least one of" or "< / n> 、 、… <n>, or combinations thereof" is defined by the applicant in the broadest sense and takes precedence over any other implied definition, either before or after, unless expressly stated to the contrary by the applicant, to mean one or more elements selected from the group including A, B, ... and N, and any combination of one or more of the elements A, B, ... or N includes any one element alone or in combination with one or more of the other elements, which may also include additional elements not listed in combination.

[0023] In earphone wearing positions, such as in-ear earphones or TWS earphones, i.e., when the earphones are worn by a wearer, the sound channel of the earphones may be partially positioned within the wearer's ear canal. Thus, the sound channel of the earphones may normally have relatively small dimensions, so that the earphones can be partially positioned within the wearer's ear canal. For example, some in-ear earphones or TWS earphones have sound channels with a diameter of 4 to 5 millimeters.

[0024] A FIR (Far-Infra-Red) sensor has a photo surface (the side of the FIR sensor having a sensor element mounted thereon) for receiving FIR light, and the photo surface usually has a relatively large area compared to the other side of the sensor. To use a FIR (Far-Infra-Red) sensor to measure ear temperature, the FIR sensor usually needs to be positioned in a vertical orientation, where the large photo surface of the FIR sensor faces the wearer's ear canal or eardrum, so that the photo surface can receive FIR light from the wearer's ear canal or eardrum. However, due to the small diameter of the earphone's audio channel, an FIR sensor positioned in the audio channel in a vertical orientation may substantially obstruct the audio channel, resulting in a small portion of the audio channel remaining unobstructed, i.e., a small effective audio channel, and poor audio performance of the earphone.

[0025] The present disclosure provides an earphone, the earphone including a body temperature measurement module positioned within an audio channel of the earphone, the audio channel being defined between a speaker driver and an audio opening of the earphone, the body temperature measurement module including a reflector and a temperature sensor, the temperature sensor configured to receive infrared light transmitted through the audio opening and reflected by the reflector.

[0026] By providing a reflector in the audio channel of the earphone, incident infrared light can be reflected and redirected to the temperature sensor. Thus, the temperature sensor may be arranged in a different orientation than a vertical orientation. That is, the temperature sensor may be arranged in an orientation in which the temperature photosurface does not face the wearer's ear canal or eardrum. For example, the temperature sensor may be arranged in a horizontal orientation in which the photosurface is substantially parallel to the axis x of the audio channel. In the horizontal orientation, the portion of the audio channel blocked by the temperature sensor is greatly reduced, leaving a relatively large effective audio channel, resulting in improved audio performance compared to earphones with a temperature sensor arranged in a vertical orientation.

[0027] In one or more embodiments of the present disclosure, a reflector is shaped and positioned relative to the temperature sensor so that IR light reaching the reflector is reflected and focused onto the temperature sensor, resulting in improved sensitivity and accuracy of the temperature measurement.

[0028] FIG. 1 illustrates a cross-sectional view of an earphone 100 according to one or more embodiments of the present disclosure. As shown in FIG. 1 , the earphone 100 includes a housing, which is composed of a rear housing 102, a front housing 104, and an ear tube 106. The rear housing 102 and the front housing 104 are connected together to define an interior chamber for the receiving element and components of the earphone 100 therein. The ear tube 106 is connected to the front housing 104 and protrudes forward from the front housing 104 to define an opening 108 of the earphone 100, which functions as an audio opening for the earphone 100. The earphone 100 further includes a main PCB 112, a battery 114, and a speaker driver 122 disposed within the interior chamber defined by the rear housing 102 and the front housing 104. The main PCB 112 has various electronic elements, such as an MCU, mounted thereon. The speaker driver 122 includes a diaphragm (not shown). The front housing 104 and the ear tube 106 define an audio channel 124 between the speaker driver 122 (the speaker driver diaphragm) and the opening 108. The earphone 100 further includes a body temperature measurement module 130 positioned within the audio channel 124.

[0029] FIG. 2A is an enlarged view of FIG. 1 showing a portion of the earphone 100. As shown in FIG. 2A, the body temperature measurement module 130 includes an FIR sensor assembly 210, a reflector 220, and an optical filter 230. The optical filter 230 is aligned with a mesh 260, and together they cover the opening 108 of the ear tube 220, i.e., the audio opening of the earphone. When the earphone is worn by a wearer, FIR light 250 from the wearer's ear canal or eardrum can pass through the optical filter 230 and reach the reflector 220. The optical filter 230 allows IR light of a selected wavelength to pass through while substantially absorbing light of other wavelengths. The FIR light 250 is reflected and redirected by the reflector 220 to the FIR sensor 212 of the FIR sensor assembly. In one or more embodiments of the present disclosure, the reflector 220 is a reflective coating applied to the inner surface of the ear tube 106. As shown, the FIR sensor 212 is in a horizontal orientation with its photo surface facing upward. The FIR sensor assembly 210 is supported by a support plate 216. The support plate 216 divides the audio channel 124 into an upper portion and a lower portion, the upper portion housing the FIR sensor assembly 210 and the lower portion being the unobstructed portion of the audio channel, i.e., the active audio channel.

[0030] FIG. 2B is a view similar to FIG. 2A showing key dimensions of a portion of the earphone 100, according to one or more embodiments of the present disclosure. FIG. 2C shows another cross-sectional view of the earphone 100. As shown in FIG. 2B, the FIR sensor assembly 210 (FIR sensor 212, flexible PCB 214, and support plate 216) has an overall height of H. The FIR sensor 212 has a length of L, and the top surface (photo surface) of the FIR sensor 212 is spaced from the top of the inner surface of the audio channel by a distance of D2. The entire audio channel has an overall height of D1. According to one or more embodiments of the present disclosure, H is approximately 1.35 millimeters, D1 is approximately 4.5 millimeters, D2 is approximately 1.20 millimeters, and L is approximately 3.7 millimeters. With the horizontal orientation of the FIR sensor 212 shown in FIG. 2B, the body temperature measurement module 130 has an overall height of approximately 2.55 millimeters (D2 + H). In comparison, when the FIR sensor 212 is positioned in a vertical orientation, the overall height of the FIR sensor 212 is dimension L, or approximately 3.7 millimeters. Thus, by providing a reflector and arranging the FIR sensor 212 in a horizontal orientation, the overall height of the FIR sensor assembly can be reduced from approximately 3.7 millimeters to approximately 2.55 millimeters, or a factor of one-third. As shown in Figures 2A and 2B, the arrangement of the present disclosure allows the earphone 100 to achieve a relatively large effective audio channel, resulting in improved audio performance of the earphone 100.

[0031] 3A-3C illustrate an ear tube 106 according to one or more embodiments of the present disclosure. The reflector 220 includes a shaped inner surface of the ear tube 106 and a reflective coating applied to the inner surface. As shown in FIGS. 2A and 3A-3C, the shaped inner surface is a curved surface. The inner surface is shaped and positioned relative to the FIR sensor 212 such that the reflective coating applied to the inner surface can reflect and redirect incident FIR light to the sensor elements of the FIR sensor 212. In one or more embodiments of the present disclosure, the inner surface is shaped and positioned relative to the FIR sensor 212 such that substantially all of the FIR light that reaches the reflective coating reflects and redirects the incident FIR light to the sensor elements of the FIR sensor 212. The area of the reflective coating can be much larger than the sensor elements of the FIR sensor 212, so that FIR light that reaches the reflective coating is reflected and focused onto the FIR sensor, resulting in improved sensitivity and accuracy of the FIR sensor 212.

[0032] In some one or more embodiments of the present disclosure, the reflective coating is a silver coating, which has a high reflection coefficient to reflect incident FIR light to FIR sensor 212. In other embodiments of the present disclosure, the reflective coating can be any type of suitable coating as long as it can reflect incident FIR light to FIR sensor 212.

[0033] 4A-4B illustrate light filter 230, according to one or more embodiments of the present disclosure. As shown, light filter 230 essentially covers an upper portion of the sound opening, and mesh 260 essentially covers a lower portion of the sound opening. In one or more embodiments of the present disclosure, light filter 230 may be made of any suitable material that allows selected wavelengths of IR light to pass through while substantially absorbing other wavelengths of light.

[0034] 5A-5B illustrate an FIR sensor assembly 210 according to one or more embodiments of the present disclosure. The FIR sensor assembly 210 includes a flexible PCB 214 and an FIR sensor 212 mounted on the flexible PCB 214. The FIR sensor 212 includes a sensor element 212a for receiving and detecting FIR light. The FIR sensor may be a single-chip FIR sensor with very low power consumption during standby mode (<2uA) and working mode. Thus, compared to earphones without a body temperature measurement module, the earphones of the present disclosure can provide body temperature measurement or monitoring without substantially reducing the earphone's playback time. The flexible PCB 214 includes an electrical circuit that electrically connects the FIR sensor 212 to the main PCB 112, such as an MCU mounted on the main PCB 112.

[0035] In the wearing position of the earphones 100, i.e., when the earphones are worn by a wearer, IR or FIR light from the wearer's ear canal or eardrum may pass through the optical filter 230 and reach the reflector 220. The FIR or IR light may be reflected, redirected, and focused onto a sensor element in the FIR or IR sensor 212. The FIR or IR sensor 212 generates an electrical signal in response to the received FIR or IR light. The electrical signal generated by the sensor 212 is transmitted to the MCU mounted on the main PCB 112 via an electrical circuit in the flexible PCB 214. After the MCU receives the electrical signal from the FIR or IR sensor, it performs calculations and algorithmic calibration to determine the body temperature, ear temperature, or eardrum temperature.

[0036] FIG. 6 shows a frequency response curve chart, in which the solid line in the chart represents the frequency response curve of an earphone according to one or more embodiments of the present disclosure, including a horizontally aligned FIR sensor, and the dotted line represents the frequency response curve of a comparable embodiment of the earphone, including a vertically aligned FIR sensor. As shown in FIG. 6, the earphone according to one or more embodiments of the present disclosure has better frequency response performance, particularly in the frequency range above 6 kilohertz or below 50 hertz. Generally, the frequency response curve of the earphone according to the present disclosure (solid line) is about 5 to 15 decibels higher than the comparable embodiment (dotted line) in the frequency range from 6 kilohertz to about 15 kilohertz.

[0037] While the present disclosure has been described in connection with TWS earbuds, the present disclosure is not limited thereto and may be applied to any type of suitable earphone, such as an in-ear earphone or a semi-in-ear earphone. In the embodiments shown in FIGS. 1, 2A-2C, and 5A-5B, the FIR sensor assembly includes a flexible PCB and a single chip FIR sensor mounted on the flexible PCB. However, the present disclosure is not limited thereto. In some embodiments, the FIR sensor assembly may include a rigid PCB and a single chip FIR sensor mounted on the PCB. In some embodiments, the present disclosure may employ any suitable temperature sensor, such as an IR sensor. In the illustrated embodiment, the reflector includes a shaped inner surface within the ear tube and a coating applied to the inner surface. However, the present disclosure is not limited thereto. In some embodiments, the reflector may be a separate part that may be mounted within the audio channel of the earphone. In the embodiment shown, the temperature sensors are arranged in a horizontal orientation, where the photosurface of the temperature sensor is substantially parallel to the axis x of the audio channel. However, the present disclosure is not limited thereto, and the temperature sensors may be arranged in other orientations where the photosurface of the temperature sensor is at an angle relative to the axis x of the audio channel.

[0038] According to some embodiments of the disclosure, the present disclosure can be implemented as follows.

[0039] Item 1: Earphones, a housing defining an audio opening, the audio opening configured to be positioned within or facing towards the ear canal of a wearer when the earphone is in a worn position; a speaker driver positioned within the housing, the speaker driver having a diaphragm facing toward the sound opening and defining an audio channel between the diaphragm and the opening; a body temperature measurement module positioned within the audio channel, the body temperature measurement module including a reflector and a temperature sensor, the temperature sensor configured to receive infrared light transmitted through the audio opening and reflected by the reflector; The earphones comprising:

[0040] Item 2: The earphone described in Item 1, wherein the body temperature measurement module further includes an optical filter at or near the audio opening.

[0041] Item 3: An earphone described in any one of items 1 to 2, wherein the optical filter is configured to allow IR light of a selected wavelength to pass through while substantially absorbing light of other wavelengths.

[0042] Item 4: The earphone according to any one of Items 1 to 3, wherein the reflector includes a shaped inner surface of the housing and a coating applied to the shaped inner surface.

[0043] Item 5: The earphone according to any one of Items 1 to 4, wherein the coating is a silver coating.

[0044] Item 6: An earphone described in any one of items 1 to 5, wherein the shaped inner surface and the coating are curved surfaces and configured to reflect and focus the infrared light onto the temperature sensor.

[0045] Item 7: The earphone according to any one of Items 1 to 6, wherein the temperature sensor is an FIR sensor.

[0046] Item 8: An earphone described in any one of Items 1 to 7, wherein the temperature sensor is arranged in a horizontal orientation with the photo surface of the temperature sensor substantially parallel to the axis of the audio channel.

[0047] Item 9: The earphone according to any one of items 1 to 8, wherein the temperature sensor is mounted on a flexible PCB.

[0048] Item 10: The earphone according to any one of Items 1 to 9, wherein the temperature sensor is a single chip FIR sensor.

[0049] Item 11: The earphone according to any one of Items 1 to 10, wherein the earphone is an in-ear earphone or a TWS earphone.

[0050] Systems and methods have been described in general terms to aid in understanding the details of the disclosure. In some instances, well-known structures, materials, and / or operations have not been specifically shown or described in detail to avoid obscuring aspects of the disclosure. In other instances, specific details have been given to provide a thorough understanding of the disclosure. Those skilled in the art will recognize that the disclosure can be embodied in other specific forms, for example, to adapt to particular systems or devices or situations or materials or components without departing from the spirit or essential characteristics thereof. Therefore, the disclosures and descriptions herein are intended to be illustrative, not limiting, of the scope of the disclosure. Accordingly, the disclosure is not to be limited except in light of the appended claims and their equivalents.< / n>

Claims

1. An earphone, the earphone comprising: a housing defining an audio opening configured to be positioned within or facing towards the ear canal of a wearer when the earphone is in a worn position; a speaker driver positioned within the housing, the speaker driver including a diaphragm facing toward the sound opening and defining an audio channel between the diaphragm and the sound opening; a body temperature measurement module positioned within the audio channel, the body temperature measurement module including a reflector and a temperature sensor, the temperature sensor configured to receive infrared light from the wearer's ear canal or eardrum that is transmitted through the audio opening and reflected by the reflector, the infrared light being reflected by the reflector only once before reaching the temperature sensor; Equipped with the reflector is a reflective coating applied to the inner surface of the audio channel; The earphone further includes a support plate dividing the audio channel into an upper portion and a lower portion, the upper portion housing the temperature sensor and the lower portion being an unobstructed portion of the audio channel, the temperature sensor being supported by the support plate in a horizontal orientation with a photo surface of the temperature sensor facing upward.

2. The earphone of claim 1 , wherein the temperature measurement module further comprises an optical filter at or near the sound opening.

3. 3. The earphone of claim 2, wherein the optical filter is configured to allow IR light of a selected wavelength to pass therethrough while substantially absorbing light of other wavelengths.

4. The earphone of any one of claims 1 to 3, wherein the reflector includes a shaped inner surface of the housing and a coating applied to the shaped inner surface.

5. The earphone of claim 4 , wherein the coating is a silver coating.

6. The earphone of claim 4 , wherein the contoured inner surface and the coating are curved surfaces and configured to reflect and focus the infrared light onto the temperature sensor.

7. The earphone according to any one of claims 1 to 6, wherein the temperature sensor is an FIR sensor.

8. An earphone as described in any one of claims 1 to 7, wherein the photo surface of the temperature sensor is substantially parallel to the axis of the audio channel.

9. The earphone of any one of claims 1 to 8, wherein the temperature sensor is mounted on a flexible PCB.

10. The earphone of any one of claims 1 to 9, wherein the temperature sensor is a single chip FIR sensor.

11. The earphone according to any one of claims 1 to 10, wherein the earphone is an in-ear earphone or a TWS earphone.

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