mold

Abstract

To provide a mold capable of uniform temperature distribution on a heating surface.SOLUTION: A mold has a mold body having a heating surface and a heater that is partially housed inside the mold body and capable of heating the heating surface. The heater includes a rod-shaped housing part having a heated wire part with an electric heating wire contained therein and a non-heated wire part without an electric heating wire contained therein. One end of the housing part is located outside the mold body in a direction in which the housing part extends, and the non-heated wire part is located at one end of the housing part.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a mold equipped with a heater. [Background technology]

[0002] Patent Document 1 discloses a seal bar that includes a rod-shaped main body having a sealing surface and a rod-shaped heater provided inside the main body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2018-103995 Summary of the Invention [Problem to be solved by the invention]

[0004] The heater may have an area at the end of the heater extension direction where the heating wire is not housed. In this case, with the seal bar of Patent Document 1, the temperature of the sealing surface facing the area where the heating wire of the heater is not housed may be lower than the temperature of the sealing surface facing the area where the heating wire of the heater is housed, and the temperature distribution of the sealing surface may not be uniform.

[0005] The present disclosure provides a mold capable of achieving a uniform temperature distribution on the heating surface. [Means for solving the problem]

[0006] A mold according to one embodiment of the present disclosure includes: a mold body having a heated surface; a heater that is partially housed inside the mold body and is capable of heating the heating surface; Equipped with The heater is The heater includes a rod-shaped housing having an electrically heated section in which an electrically heated wire is housed and an electrically non-heated section in which an electrically heated wire is not housed, One end of the housing portion in the extending direction is located outside the mold body, The non-heated wire portion is disposed at the one end portion. [Effects of the Invention]

[0007] According to the mold of the above aspect, it is possible to realize a mold that can make the temperature distribution of the heating surface uniform. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing a processing device equipped with a mold according to an embodiment of the present disclosure. [Figure 2] FIG. 1 is a plan view showing a mold according to an embodiment of the present disclosure. [Figure 3] FIG. 3 is a plan view showing a first modified example of the mold of FIG. 2. [Figure 4] FIG. 3 is a plan view showing a second modified example of the mold of FIG. 2. [Figure 5] 1 is a plan view of a first embodiment of a mold to which the present disclosure is applied, viewed along the short side direction. [Figure 6] FIG. 10 is a plan view of a second embodiment of a mold to which the present disclosure is applied, viewed along the short side direction. [Figure 7] FIG. 10 is a plan view of an example of a conventional mold as viewed along the short side direction. [Figure 8] FIG. 8 is a plan view of the molds of FIGS. 5 to 7 as viewed along the longitudinal direction. [Figure 9] 8 is a graph showing the relationship between the temperature and the position on the heating surface of the molds shown in FIGS. 5 to 7. DETAILED DESCRIPTION OF THE INVENTION

[0009] An example of the present disclosure will be described below with reference to the accompanying drawings. In the following description, terms indicating specific directions or positions (e.g., terms including "upper," "lower," "right," and "left") are used as necessary. However, the use of these terms is intended to facilitate understanding of the present disclosure with reference to the drawings, and the meanings of these terms do not limit the technical scope of the present disclosure. Furthermore, the following description is merely exemplary in nature and is not intended to limit the present disclosure, its applications, or its uses. Furthermore, the drawings are schematic, and the proportions of the dimensions and the like do not necessarily correspond to reality.

[0010] A mold 10 according to an embodiment of the present disclosure constitutes a part of a processing device 1, as shown in Fig. 1, for example. The processing device 1 is, for example, a heat sealing device that forms a package by thermocompression bonding a packaging material 100, and is equipped with a pair of molds 10. Each mold 10 has a heating surface 21, and the heating surfaces 21 are arranged so as to face each other.

[0011] 2, each mold 10 includes a mold body 20 having a heating surface 21, and a heater 30 configured to be able to heat the heating surface 21. A portion of the heater 30 is housed inside the mold body 20.

[0012] As an example, the mold body 20 is made of a substantially rectangular parallelepiped member having thermal conductivity, and one of its outer surfaces constitutes the heating surface 21. In this embodiment, the mold body 20 has a hole 22 that opens at one end in the longitudinal direction. The hole 22 extends in the longitudinal direction of the mold body 20 and is configured to be able to accommodate the heater 30.

[0013] The heater 30 is configured, for example, as a sheath heater or a cartridge heater. The heater 30 includes a rod-shaped housing 31. The housing 31 is configured, for example, of stainless steel, and one end of the housing 31 in the direction in which it extends (hereinafter referred to as a first end 311) is located outside the mold body 20. In this embodiment, the housing 31 is substantially linear, is housed in a hole 22 of the mold body 20, and faces the heating surface 21 in a direction intersecting the heating surface 21 (for example, the vertical direction in FIG. 2). In addition, a wiring 200 is connected to the first end 311 of the housing 31.

[0014] The housing 31 has an electrically heated section 32 that houses an electrically heated wire therein, and a non-electrically heated section 33 that does not house an electrically heated wire therein. In this embodiment, the non-electrically heated section 33 is arranged at each end of the housing 31 in the direction in which the housing 31 extends. The non-electrically heated section 33, which is arranged at the other end (hereinafter referred to as the second end 312) of the housing 31 opposite the first end 311 in the direction in which the housing 31 extends, is located inside the mold body 20.

[0015] The mold 10 can provide the following effects.

[0016] The mold 10 comprises a mold body 20 having a heating surface 21, and a heater 30 partially housed inside the mold body 20 and capable of heating the heating surface 21. The heater 30 includes a rod-shaped housing 31 having an electrically heated portion 32 containing an electric heating wire and an electrically unheated portion 33 containing no electric heating wire. One end of the housing 31 in the direction in which it extends is located outside the mold body 20, and the electrically unheated portion 33 is located at one end of the housing 31 in the direction in which it extends. With this configuration, the area of the heating surface 21 facing the electrically unheated portion 33 of the heater 30 can be reduced, thereby realizing a mold 10 that can achieve a uniform temperature distribution on the heating surface 21.

[0017] The wiring 200 is connected to one end of the housing 31 in the direction in which the housing 31 extends. With this configuration, the influence of heat radiation from the wiring 200 on the heater 30 can be suppressed.

[0018] The mold body 20 has a hole 22 for accommodating the heater 30. With this configuration, the heater 30 can be easily accommodated in the mold body 20.

[0019] The heater 30 is a sheath heater or a cartridge heater. With this configuration, it is possible to realize a mold 10 that can make the temperature distribution of the heating surface 21 uniform with a simple configuration.

[0020] The mold 10 can also be configured as follows.

[0021] The mold body 20 has a heating surface 21 and can have any configuration that can accommodate a portion of the heater 30. For example, the hole 22 that accommodates the heater 30 may be omitted or may be replaced with a groove that can accommodate the heater 30.

[0022] The heater 30 is not limited to a sheath heater or a cartridge heater, and other heaters may also be used.

[0023] The wiring 200 is not limited to being connected to the first end 311 of the housing 31, but may also be connected to the second end 312.

[0024] 3, the mold 10 may be configured so that the second end 312 of the housing 31 is located outside the mold body 20. By configuring it in this way, the area of the heating surface 21 facing the non-heated wire portion 33 of the heater 30 can be more reliably reduced.

[0025] 3, the mold 10 may be configured so that the electrically heated wire section 32 of the housing section 31 has a first section 321 and a second section 322, with the second section 322 of the electrically heated wire section 32 being located outside the mold body 20. The second section 322 is disposed adjacent to the non-electrically heated wire section 33 and has a heating wire density lower than that of the first section 321 (for example, approximately 50% of the heating wire density of the first section 321). This configuration allows only the first section 321 of the electrically heated wire section 32 to face the heating surface 21, thereby realizing a mold 10 that can more reliably achieve a uniform temperature distribution on the heating surface 21.

[0026] The housing portion 31 is not limited to being substantially linear, and may be substantially U-shaped as shown in FIG. 4. In the mold 10 of FIG. 4, the mold body 20 has two holes 22 spaced apart in the short-side direction of the heating surface 21 (e.g., the vertical direction in FIG. 4). The heater 30 has two housing portions 31 and a curved housing portion 34 connected to second ends 312 of the two housing portions 31. The housing portion 34 has a smaller heating wire density than the housing portions 31 (e.g., approximately 50% of the heating wire density of the first portion 321) and is located outside the mold body 20. As such, the mold of the present disclosure allows the use of heaters of various shapes, providing a high degree of design freedom.

[0027] Various embodiments of the present disclosure have been described in detail above with reference to the drawings. Finally, various aspects of the present disclosure will be described. Note that in the following description, reference numerals will also be used as examples.

[0028] The mold 10 of the first embodiment of the present disclosure comprises: a mold body 20 having a heating surface 21; a heater 30 that is partially housed inside the mold body 20 and can heat the heating surface 21; Equipped with The heater 30 The device includes a rod-shaped housing portion 31 having an electric heating wire portion 32 in which an electric heating wire is housed and an electric heating wire-less portion 33 in which no electric heating wire is housed, One end of the housing portion 31 in the extending direction is located outside the mold body 20, The non-heated wire portion 33 is disposed at the one end portion.

[0029] The mold 10 according to the second embodiment of the present disclosure comprises: A wiring 200 is connected to the one end of the housing part 31 .

[0030] The mold 10 of the third embodiment of the present disclosure comprises: The other end of the casing portion 31 opposite to the one end in the extending direction of the casing portion 31 is located outside the mold body 20 .

[0031] The mold 10 according to the fourth aspect of the present disclosure comprises: the electrically heated wire portion 32 has a first portion 321 and a second portion 322 that is disposed adjacent to the non-electrically heated wire portion 33 and has a lower density of the heating wire than the first portion 321; The second portion 322 is located outside the mold body 20 .

[0032] The mold 10 according to the fifth aspect of the present disclosure comprises: The mold body 20 has a hole 22 or groove that accommodates the heater 30 .

[0033] The mold 10 according to the sixth aspect of the present disclosure includes: The heater 30 is a sheath heater or a cartridge heater.

[0034] Any of the various embodiments or modifications described above can be combined appropriately to achieve the effects of each. In addition, combinations of embodiments, combinations of examples, or combinations of embodiments and examples are possible, and combinations of features from different embodiments or examples are also possible.

[0035] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art, and such changes and modifications are to be understood as being included within the scope of the present disclosure as defined by the appended claims unless they depart therefrom. [Example]

[0036] The present disclosure will be explained in more detail below by showing examples, but the present disclosure is not limited to these examples in any way.

[0037] (Implementation method) The temperature distribution of the heating surface 21 was measured using molds 311, 312, and 313 shown in Figures 5 to 7. The molds 311 and 312 in Figures 5 and 6 are examples of molds to which the present disclosure is applied, and the mold 313 in Figure 7 is an example of a conventional mold.

[0038] (Mold) Molds 311, 312, and 313 shown in FIGS. 5 to 7 were used. The molds 311, 312, and 313 were made of steel and included mold bodies 321, 322, and 323 having substantially the same cross-sectional shape, and two heaters 30 (see FIG. 8) housed in the mold bodies 321, 322, and 323. Each heater 30 was a 200 W cartridge heater. In the mold 311 of FIG. 5, the heater 30 was housed in the mold body 321 with the non-heated wire portion 33 on the first end 311 side exposed to the outside. In the mold 312 of FIG. 6, the heater 30 was housed in the mold body 322 with the non-heated wire portion 33 on the first end 311 side and the second portion 322 of the electrically heated wire portion 32 exposed to the outside. In the mold 313 of FIG. 7, the heater 30 was housed entirely in the mold body 323. The mold bodies 321, 322, and 323 have the same shape and dimensions except for their longitudinal dimensions.

[0039] (Conditions for implementation) When the ambient temperature was 25°C, the temperature was measured at nine locations indicated as P1 to P9 on the heating surface 21 using temperature sensors. Thermocouples were used as the temperature sensors. The target temperature of the temperature sensor at P5 was set to 140°C, and the heater 30 was PID controlled.

[0040] (result) The measurement results are shown in Figure 9. The vertical axis of Figure 9 represents temperature (°C) when the temperature measured at P5 on heated surface 21 is set to 0.0, and the horizontal axis of Figure 9 represents the location where the temperature of heated surface 21 was measured. In Figure 9, the temperature of heated surface 21 of mold 311 in Figure 5 is shown by a solid line, the temperature of heated surface 21 of mold 312 in Figure 6 is shown by a dashed line, and the temperature of heated surface 21 of mold 313 in Figure 7 is shown by a dashed line.

[0041] It was found that the molds 311 and 312 of the present disclosure had slightly lower uniformity of temperature distribution at P6 to P9 of the heated surface 21 than the conventional mold 313, but higher uniformity of temperature distribution at P1 to P4 of the heated surface 21 than the conventional mold 313, and overall the temperature distribution of the heated surface 21 was more uniform than that of the conventional mold 313. It was also found that the mold 312 of Figure 6 had very high uniformity of temperature distribution at P1 to P5, and overall the temperature distribution of the heated surface 21 was the most uniform. In other words, it was found that the temperature distribution of the heated surface 21 can be made more reliably uniform by configuring the mold so that not only the non-electric heating wire portion 33 but also the second portion 322 of the electric heating wire portion 32 is located outside the mold body. [Industrial Applicability]

[0042] The mold of the present disclosure is not limited to electric heaters, but can also be applied to heaters equipped with an electric heating element that generates heat by resistance heating, such as fuses, conductors, and power lines. [Explanation of symbols]

[0043] 1 Processing equipment 10. Mold 20 Mold body 21 Heating surface 22 holes 30 Heater 31 Housing 311 First end 312 Second end 32 Electric heating wire section 321 Part 1 322 Part 2 33 No hot wire department 34 casing part 100 Packaging Materials 200 Wiring

Claims

1. a mold body having a heated surface; a heater that is partially housed inside the mold body and is capable of heating the heating surface; Equipped with The heater is The heater includes a rod-shaped housing having an electrically heated section in which an electrically heated wire is housed and an electrically non-heated section in which an electrically heated wire is not housed, One end of the housing portion in the extending direction is located outside the mold body, The non-heated wire portion is disposed at the one end portion, the electrically heated wire portion has a first portion and a second portion disposed adjacent to the non-electrically heated wire portion and having a lower density of the heating wire than the first portion, The mold, wherein the second portion is located outside the mold body.

2. The mold according to claim 1 , wherein wiring is connected to the one end of the housing portion.

3. The mold according to claim 1 or 2, wherein the other end of the housing portion opposite to the one end in the extending direction of the housing portion is located outside the mold body.

4. The mold of claim 1 , wherein the mold body has a hole or groove for accommodating the heater.

5. The mold according to claim 1 , wherein the heater is a sheath heater or a cartridge heater.

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