Optical circuit device package structure and manufacturing method thereof

Abstract

This package structure (1) of an optical circuit device is a package structure of an optical circuit device to be connected to an optical component, and comprises, on an electric wiring component (15), an optical circuit device (11) that has a core (116) and a cladding (114, 117), a resin core (12) that is cured by irradiating a photocurable resin with light and connected to an end surface of the core (116), and a mold resin (13) that covers the optical circuit device (11) and the resin core (12). The refractive index of the mold resin (13) at least around the resin core (12) is lower than the refractive index of the resin core (12).　Consequently, the present invention can provide a package structure of an optical circuit device, which has a high degree of flexibility in layout and can be easily manufactured.

Description

[Technical Field]

[0001] The present invention relates to a package structure for an optical circuit device that connects an optical circuit device and an optical component, and a method for manufacturing the same. [Background technology]

[0002] In order to cope with the recent rapid increase in Internet traffic, there is a need to expand the communication capacity of datacenter networks. In order to further expand transmission capacity and reduce power consumption, optical interconnections that transmit data using light are being introduced even for short- to medium-distance applications.

[0003] In a typical optical interconnection system, signal processing is achieved by transmitting signals between light-emitting elements such as laser diodes (LDs) and light-receiving elements such as photodiodes (PDs) arranged on a printed circuit board using optical transmission media such as optical waveguides or optical fibers.

[0004] Depending on the transmission method, optical modulators and other elements are integrated with the optical light-emitting elements or are connected discretely, and a driver that performs electrical-optical conversion is also connected. A configuration including these optical light-emitting elements, optical modulators, drivers, etc. is mounted on an electrical packaging substrate such as a printed circuit board (PCB) as an optical transmitter.

[0005] Similarly, optical processors and the like are appropriately integrated or discretely connected to the optical receiving elements, and electrical amplifier circuits and the like that perform optical-to-electrical conversion are further connected. A configuration including these optical receiving elements, optical processors, electrical amplifier circuits, etc. is mounted on a printed circuit board as an optical receiver. Optical transceivers that integrate these optical transmitters and optical receivers are mounted in packages or on printed circuit boards, and optically connected to optical transmission media such as optical fiber to achieve optical interconnection. Depending on the topology, this can also be achieved via repeaters such as optical switches.

[0006] As the optical light-emitting element, optical light-receiving element, and optical modulation element, elements using semiconductors such as silicon and germanium, and III-V group semiconductors represented by indium phosphide (InP), gallium arsenide (GaAs), indium gallium arsenide (InGaAs), etc. have been put to practical use. In recent years, along with these elements, optical waveguide optical transceivers that integrate silicon optical circuits (silicon photonics) and indium phosphide optical circuits having an optical propagation mechanism have been developed. In addition to semiconductors, optical modulation elements may also use materials such as ferroelectrics such as lithium niobate and polymers.

[0007] Furthermore, optical functional elements such as planar lightwave circuits made of quartz glass may be integrated with the above-mentioned optical emitters, receivers, and modulators. Optical functional elements include splitters, wavelength multiplexers / demultiplexers, optical switches, polarization control elements, and optical filters. Hereinafter, devices that integrate the above-mentioned optical emitters, receivers, modulators, optical functional elements, and amplifiers, which have the optical propagation and waveguiding mechanisms, will be referred to as optical waveguide devices. Among optical waveguide devices, optical waveguide devices using silicon photonics offer excellent integration capabilities, mass productivity, and compatibility with electrical components, and are attracting attention as key devices for realizing next-generation optical interconnections.

[0008] One typical method for connecting an optical circuit device to an optical waveguide, such as an optical fiber, is to butt-join the optical circuit and the optical waveguide to one or more end faces that handle the optical input and output of the optical circuit. For example, an optical fiber, which is one type of optical waveguide, is integrated with glass or the like having a V-groove formed therein to form an optical fiber array, and the cores of the optical fiber in this array structure are aligned and connected to the cores of the optical circuit device. In this case, to minimize connection loss, it is necessary to position (hereinafter referred to as alignment) and fix each core of the optical circuit device and each core of the optical fiber to the submicron level. This alignment involves inputting and outputting light, monitoring the power, and simultaneously aligning (optical alignment), and then fixing the optical fiber by applying an adhesive or the like (Non-Patent Document 1). [Prior art documents] [Non-patent literature]

[0009] [Non-Patent Document 1] Kota Shikama, Yoshiteru A, Be, Toshiki Kishi, Koji Takeda, Takuro Fujii, Hidetaka Nishi, Takashi Matsui, Atsushi Aratake, Kazuhide Nakajima, and Shinji Matsuo, "Multicore-Fiber Receptacle With Compact Fan-In / Fan-Out Device for SDM Transceiver Applications," J.Lightwave Technol. 36, 5815-5822 (2018). Summary of the Invention [Problem to be solved by the invention]

[0010] However, when connecting an optical circuit device to an optical waveguide, the input and output end faces of the optical circuit and the optical waveguide must be flush and parallel to each other, which requires dicing or polishing the end faces, increasing the workload of the manufacturing process.

[0011] In addition, in a known semiconductor device package structure 6, as shown in FIG. 13A, an electric element 64 is mounted on an electric wiring component 65, and the entire structure is molded with resin 63. The electric wiring component 65 is an electric wiring component made of, for example, ceramic and metal wiring layers. Pads for electrical contacts and multilayer electric wiring sections are omitted. The electric element 64 is mounted on the electric wiring component 65, and is electrically connected via the electric wiring of the electric wiring component. The optical circuit device 61 is any of various optical circuit devices, and is mounted on the electric wiring component and covered with molded resin 63.

[0012] 13B, in order to realize a mounting structure of an optical circuit device by optical connection such as butt connection, the input / output end face 68 of the optical circuit device 61 must be exposed from the molded resin 63. Therefore, the optical circuit device 61 must be arranged around the edge of the electrical wiring component 65, which has been a factor in restricting the package structure and layout of the optical circuit device 61. In addition, a process of dicing or polishing the optical circuit device 61 together with the molded resin 63 and the electrical wiring component 65 is required, and it is a heavy burden to precisely perform these processes simultaneously on many different materials. [Means for solving the problem]

[0013] In order to solve the above-mentioned problems, the package structure of an optical circuit device according to the present invention is a package structure of an optical circuit device to be connected to an optical component, and comprises an optical circuit device having a core and a clad on an electric wiring component, a resin core that is hardened by irradiating a photocurable resin with light and connected to an end face of the core, a first molding resin that covers the resin core, and a second molding resin that covers portions other than the resin core and the first molding resin, and the refractive index of the first molding resin at least around the resin core is lower than the refractive index of the resin core. The end face of the optical circuit device including the end face of the core is inclined toward the electrical wiring component, and the resin core is disposed at a predetermined angle with respect to the longitudinal direction of the core. It is characterized by:

[0014] Furthermore, a manufacturing method of a package structure for an optical circuit device according to the present invention comprises the steps of: arranging an optical circuit device on an electric wiring component; filling a photocurable resin around at least an input / output end face of the optical circuit device; guiding resin-curing light into a core of the optical circuit device, emitting the light from the input / output end face and irradiating the light-curable resin to form a resin core; removing an uncured portion of the photocurable resin; and filling a molding resin around at least the resin core and curing the molding resin, wherein the molding resin comprises a first molding resin that covers the resin core and a second molding resin that covers a portion other than the resin core and the first molding resin. The input / output end faces are inclined toward the electrical wiring component, and the resin core is formed at a predetermined angle with respect to the longitudinal direction of the core. do. [Effects of the Invention]

[0015] According to the present invention, it is possible to provide a package structure for an optical circuit device that has a high degree of freedom in layout and can be easily manufactured. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a schematic side view showing the configuration of a package structure for an optical circuit device according to a first embodiment of the present invention. [Figure 2] FIG. 2 is an enlarged schematic side view showing the configuration in the vicinity of the input / output end face in the package structure of the optical circuit device according to the first embodiment of the present invention. [Figure 3] FIG. 3 is an enlarged schematic top perspective view showing the configuration in the vicinity of the input / output end faces in the package structure of the optical circuit device according to the first embodiment of the present invention. [Figure 4A] FIG. 4A is a schematic side view showing an example of the configuration of the mounting structure of the optical circuit device according to the first embodiment of the present invention. [Figure 4B] FIG. 4B is a schematic side view showing an example of the configuration of the mounting structure of the optical circuit device according to the first embodiment of the present invention. [Figure 4C] FIG. 4C is a schematic side view showing an example of the configuration of the mounting structure of the optical circuit device according to the first embodiment of the present invention. [Figure 5A] FIG. 5A is a schematic side view showing an example of the configuration of the package structure of the optical circuit device according to the first embodiment of the present invention. [Figure 5B] FIG. 5B is a schematic side view showing an example of the configuration of the package structure of the optical circuit device according to the first embodiment of the present invention. [Figure 6A] FIG. 6A is an enlarged schematic side view showing an example of the configuration in the vicinity of the input / output end face in the package structure of the optical circuit device according to the first embodiment of the present invention. [Figure 6B] FIG. 6B is an enlarged schematic side view showing an example of the configuration in the vicinity of the input / output end face in the package structure of the optical circuit device according to the first embodiment of the present invention. [Figure 6C]FIG. 6C is an enlarged schematic side view showing an example of the configuration in the vicinity of the input / output end face in the package structure of the optical circuit device according to the first embodiment of the present invention. [Figure 7] FIG. 7 is a schematic side view showing the configuration of a package structure of an optical circuit device according to the second embodiment of the present invention. [Figure 8A] FIG. 8A is a schematic side view showing the configuration of a package structure of an optical circuit device according to a third embodiment of the present invention. [Figure 8B] FIG. 8B is a schematic side view showing the configuration of the package structure of the optical circuit device according to the third embodiment of the present invention. [Figure 9A] FIG. 9A is a schematic side view showing the configuration of a package structure of an optical circuit device according to a fourth embodiment of the present invention. [Figure 9B] FIG. 9B is a schematic side view showing the configuration of the mounting structure of the optical circuit device according to the fourth embodiment of the present invention. [Figure 10A] FIG. 10A is a schematic side view showing the configuration of a package structure of an optical circuit device according to a fifth embodiment of the present invention. [Figure 10B] FIG. 10B is a schematic side view showing the configuration of the mounting structure of the optical circuit device according to the fifth embodiment of the present invention. [Figure 11A] FIG. 11A is a schematic side view showing an example of the configuration of a mounting structure for an optical circuit device according to a fifth embodiment of the present invention. [Figure 11B] FIG. 11B is a schematic side view showing an example of the configuration of the mounting structure of the optical circuit device according to the fifth embodiment of the present invention. [Figure 12] FIG. 12 is a schematic side view showing an example of the configuration of a package structure of an optical circuit device according to the fifth embodiment of the present invention. [Figure 13A] FIG. 13A is a schematic side view showing the configuration of a package structure of a conventional optical circuit device. [Figure 13B] FIG. 13B is a schematic side view showing the configuration of a conventional mounting structure for an optical circuit device. DETAILED DESCRIPTION OF THE INVENTION

[0017] First Embodiment A package structure of an optical circuit device according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 6C.

[0018] <Package structure of optical circuit device> 1, the optical circuit device package structure 1 according to this embodiment includes an optical circuit device 11, a photocurable resin core (hereinafter referred to as "resin core") 12 connected to an optical input / output end face 113 of the optical circuit device 11, and a mold resin 13 covering the optical circuit device 11 and the resin core 12. Here, the optical circuit device 11 includes a substrate 111 and a waveguide layer 112. A BOX layer (not shown) is also provided between the substrate 111 and the waveguide layer 112.

[0019] An electrical element 14 may also be provided.

[0020] Hereinafter, in the horizontal plane (substrate surface), the direction in which light is guided in the waveguide core near the input / output end face 113 of the optical circuit device 11 (X direction in the drawing) is referred to as the "longitudinal direction of the optical circuit core," the direction perpendicular to the longitudinal direction (Y direction in the drawing) is referred to as the "width direction," the direction perpendicular to the horizontal plane (substrate surface) (Z direction) is referred to as the thickness direction, and the side on which the optical circuit device 11 is placed relative to the electrical wiring component 15 is referred to as the "upper" direction, and the opposite direction is referred to as the "lower" direction.

[0021] As an example, the package structure 1 of the optical circuit device is formed on an electric wiring component 15, and the optical circuit device 11 and the electric element 14 are mounted face down and electrically connected via electric contacts 16. For face down mounting, a well-known flip chip connection is used.

[0022] The electrical wiring component 15 has an electrical wiring layer (not shown) and electrical connection pads for flip-chip connection on its upper surface, and may have multi-layer electrical wiring formed as needed. Although not shown in the drawings, it may also have another electrical element 14 such as a capacitor or coil mounted thereon, or a structure having a similar effect formed integrally therewith.

[0023] Electrical wiring is formed in the thickness direction (Z direction) of the electrical wiring component 15 using through vias or inner layer wiring to electrically connect the upper and lower surfaces. Electrical contacts 16 (gold bumps, copper pillars, solder balls, etc.) are also formed on the lower surface directly opposite the flip chip connection surface, and are electrically connected to the electrical mounting board via the electrical contacts 16 on the lower surface.

[0024] The electrical mounting substrate is, for example, a known PCB or build-up substrate. The electrical contacts 16 on the underside are formed by solder terminals, such as known BGA, LGA, or PGA. Note that, similar to flip-chip connections, electrical contacts may also be made by metal bumps (gold bumps, copper pillars, etc.).

[0025] The electrical wiring component 15 may be any known interposer, such as silicon, glass, ceramic (LTCC, HTCC), glass epoxy substrate, etc. It may also be called an interposer, subcarrier, package, etc.

[0026] If necessary, the electrical wiring component 15 and the electrical mounting board may be connected by known wire bonding instead of using the electrical connection via the aforementioned gold bumps, copper pillars, solder balls, etc. The electrical wiring component 15 may also be configured from a thin-film electrical wiring layer called a rewiring layer.

[0027] The thin-film electrical wiring layer is a multilayer wiring layer in which, for example, copper foil layers and insulating resin layers are alternately stacked, and when manufactured using fan-out wafer-level package (FOWLP) technology or fan-out panel-level package (FOPLP) technology, it is generally called a re-distribution layer (RDL).

[0028] The electrical element 14 may be any electrical element, such as a driver, a transimpedance amplifier circuit, a retimer, an FPGA, an ASIC, a DSP, a CPU / GPU, or a clock circuit. The electrical element 14 is disposed on the electrical wiring component 15 and mounted by flip-chip mounting. Note that the mounting form of the electrical element is not the focus of the present invention, and therefore does not necessarily have to be face-down mounting; face-up mounting using, for example, wire bonding may also be used. The electrical element 14 and the optical circuit device 11 are electrically connected to the electrical wiring (not shown) of the electrical wiring component 15 via their respective electrical contacts 16.

[0029] The optical circuit device 11 is a known silicon photonics chip, with an optical waveguide layer formed on a BOX layer on a substrate, and the thickness of the waveguide substrate is, for example, 625 μm, which is the standard thickness of a silicon wafer. In addition to the optical waveguide layer, it also has an electrical wiring layer (not shown) with connection pads. Although not shown in the drawing, it also integrates light-emitting elements, light-receiving elements, modulation elements, optical functional elements, and other elements as described in the background.

[0030] Furthermore, the optical circuit device 11 is hybrid-integrated with an optical transmitting element or an optical modulating element made of a compound semiconductor, etc. In the optical circuit device 11, a plurality of optical circuit cores are arranged in the depth direction (width direction, Y direction) of the paper.

[0031] A silicon photonics chip has an optical input / output section that inputs and outputs light to the outside at at least one optical input / output end face, and spot size converters (SSCs) and other devices are integrated into the optical circuit as edge couplers. Generally, the mode field diameter of the optical propagation mode in a silicon photonics optical circuit is very small, at 1 μm or less, but the edge coupler expands the mode field diameter to approximately 3 μm to 10 μm before the light beam is emitted (incident).

[0032] The following description will be given taking the light output from the silicon photonics chip 11 as an example, but the operation when light is incident on the silicon photonics chip 11 also operates reversibly, and the present invention is naturally independent of the input / output direction of light.

[0033] As shown in FIG. 1, a resin core 12 made of a photocurable resin is formed in the longitudinal direction (X direction) of the optical circuit core in contact with the core end face that handles optical input / output of the optical circuit device 11.

[0034] Photocurable resins are known resins that react to specific wavelengths and undergo a curing reaction. Examples include acrylic resins, epoxy resins, silicone resins, urethane resins, oxetane resins, organic-inorganic hybrids, and their modified or substituted forms. Materials known as photoresists may also be used. The curing wavelength can be freely designed by adding initiators and dyes, but wavelengths ranging from ultraviolet light to visible light can be used, for example. Here, the light used for photocurable resins is referred to as "resin curing light" 10.

[0035] As shown in FIG. 1, on the electrical wiring component 15, the electrical element 14, the optical circuit device 11, and the resin core 12 are filled with a molding resin 13.

[0036] The mold resin 13 can be a known mold resin 13 used in the package structure of a semiconductor device, and has a lower refractive index in the signal wavelength band than the resin core 12 and functions as a cladding around the resin core 12. Known acrylic resins, epoxy resins, silicone resins, urethane resins, oxetane resins, etc. can be used as the resin cladding material, and halogen-substituted resins such as fluorinated resins may be used as appropriate to adjust the refractive index.

[0037] 2, in the region of the optical input / output end surface 113 of the package structure of the optical circuit device 11, the optical circuit device 11 includes, in this order, a Si substrate 111, a BOX layer 114, a Si waveguide (hereinafter also referred to as "another core") 115, a second waveguide core (hereinafter also referred to as "core") 116 covering the Si waveguide 115, and an overclad 117. Here, the waveguide layer 112 is the Si waveguide 115, the second waveguide core 116, and the overclad 117.

[0038] The tip of the Si waveguide 115 is spaced apart from the optical input / output end face 113. That is, the Si waveguide 115 is not disposed near the optical input / output end face 113, and only the second waveguide core 116 is disposed as an optical waveguide layer. Here, the tip of the Si waveguide 115 may be configured to contact the optical input / output end face 113.

[0039] Resin core 12 is connected to the end face of second waveguide core 116 .

[0040] A molding resin 13 is filled around the optical circuit device 11 and the resin core 12 .

[0041] In addition, as shown in FIG. 3, in the optical circuit device 11, the second waveguide core 116 covering the Si waveguide 115 is branched, and the resin curing light 10 is incident on an end face (the opposite end face in this embodiment) different from the light input / output end face 113 of the branched second waveguide core (hereinafter also referred to as the "branch core") 116_2.

[0042] The edge coupler at the tip of the Si waveguide 115 has a spot size converter (SSC, arrow 118 in Figure 3) that has a tapered shape in which the width of the thin wire (waveguide) narrows in the longitudinal direction (X+ direction) of the optical circuit core. The tapered shape of the Si waveguide 115 may be a nonlinear tapered shape, a multi-step tapered shape, or an SSC structure consisting of a discontinuous Si core and glass material, known as a segmented SSC.

[0043] In the SSC, a second waveguide core 116 is provided around the Si waveguide 115. The signal light wavelength transitions to the second waveguide core 116 after the mode field is expanded in the Si waveguide 115 by a taper or the like, and the second waveguide core 116 serves as a substantial core at the light input / output end face 113 of the optical circuit device 11. In this case, the second waveguide core 116 is made of a material capable of propagating resin curing light, and is made of, for example, glass, SiON, SiN, polymer, or the like.

[0044] The photocurable resin core 12 is formed by gradually curing uncured resin due to resin curing light 10 emitted from the end face of the second waveguide core 116, and is in contact with the second waveguide core 116.

[0045] 3, second waveguide core 116 is branched off from the Si fine wire as necessary at a location other than the SSC section, and is provided with a resin-curing light input section 119. Resin-curing light input section 119 of second waveguide core 116 may be provided on the same end face as input / output end face 113 that contacts resin core 12, or it may be provided on a different end face or within the circuit. The resin-curing light may be input by any known method, and any method can be applied, such as the above-mentioned butt connection via optical fiber or the like, mirror coupling, or a grating coupler.

[0046] At this time, the cross section of the photocurable resin core 12 can be any shape, but is formed as a shape similar to the mode distribution from the optical fiber core for the resin curing light. For example, if it is a Gaussian beam, the cross section will be close to a circular shape. In fact, it may be elliptical depending on the mode shape. Before filling the surrounding molding resin 13, the uncured portion of the photocurable resin is removed and a different material is filled in.

[0047] Depending on the resin properties, the photocurable resin may be used as it is as a molding material. For example, by using a resin with a different refractive index after curing depending on the curing wavelength, curing mechanism, or addition of a copolymer, the refractive index can be kept lower than that of the photocurable resin core 12, and the resin can be used as it is as a molding material.

[0048] 4A to 4C, in the mounting structure of the optical circuit device according to this embodiment, the package structure of the optical circuit device is mounted on an electrical mounting component, and an optical waveguide such as an optical fiber 21 is connected to it. The optical fiber 21 is fixed as a known optical fiber array housed with an adhesive in a fiber fixing component 22 consisting of a glass component with a V-groove formed therein and a lid component.

[0049] 4A, the optical fiber 21 and the resin core 12 are positioned and connected to each other. The positioning is performed with high precision using a known method such as active alignment or passive alignment, and they are fixed together using an adhesive.

[0050] 4B and 4C, optical connection is achieved by spatial coupling via a lens mechanism 23 or the like. At this time, the core 116 of the optical circuit device 11 and the resin core 12 are optically coupled after the resin core 12 is formed. Furthermore, the resin core 12 and the optical fiber 21 are optically connected, thereby achieving optical connection between the optical circuit device 11 and the optical fiber 21 via the resin core 12.

[0051] As described above, in a package structure in which the molded resin 13 is filled around the optical circuit device 11 mounted on an electric wiring component, an optical waveguide mechanism is provided which is made up of the resin core 12 that contacts the input / output end face 113 of the optical circuit device 11 and extends in the longitudinal direction (X direction) of the optical circuit core, and the clad of the molded resin 13, thereby enabling optical connection between the optical waveguide such as the optical fiber 21 and the optical circuit device 11.

[0052] <Method of manufacturing a package structure for an optical circuit device> An example of a method for manufacturing a package structure for an optical circuit device will be described below.

[0053] First, the optical circuit device 11 is mounted on the electrical wiring component 15. The electrical element 14 may also be mounted thereon.

[0054] Next, a photocurable resin is filled so as to cover the optical circuit device 11 and the electric element 14. Here, it is only necessary to fill the photocurable resin at least around the input / output end face 113 of the optical circuit device 11.

[0055] Next, resin curing light is guided into the core 116 of the optical circuit device 11, emitted from the input / output end face 113, and irradiated onto the photocurable resin. As a result, the portion of the photocurable resin irradiated with the resin curing light becomes the resin core 12.

[0056] Next, the uncured portion of the photocurable resin is removed.

[0057] Finally, the molding resin 13 is filled and cured so as to cover the optical circuit device 11 and the electrical element 14, including the area where the uncured portion of the photocurable resin has been removed. Here, the molding resin 13 is filled at least around the resin core 12 and cured.

[0058] In this manner, the package structure of the optical circuit device according to this embodiment is manufactured.

[0059] <Effects> The effects of the package structure of the optical circuit device according to this embodiment will be described below.

[0060] In conventional optical circuit package structures filled with mold resin, processes such as dicing and polishing were required to expose the input and output end faces of the optical circuit in order to achieve low-loss optical connection between the optical circuit device and external optical waveguides such as optical fibers. As a result, it became necessary to place the optical circuit near the edge of the electrical wiring components, which placed restrictions on the package structure and the layout of the optical circuit device.

[0061] For example, in order to connect electrical contacts on an optical circuit to a package and then unfold the wiring with the electrical wiring component to connect to the electrical contacts on an electrical mounting board, it has been necessary to unfold the electrical wiring component at a long distance from its edge.

[0062] As a result, it was necessary to adjust the position of electrical contacts on the optical circuit layout and to devise a layout for electrical wiring in electrical wiring components, which had the disadvantage of increasing the overall size.

[0063] On the other hand, the package structure for the optical circuit device according to this embodiment eliminates the need to expose the input / output end faces of the optical circuit device for connection with the optical waveguide, which eliminates the need to place the optical circuit device on the edge of the electrical wiring component, thereby eliminating the layout constraints on the package structure and the optical circuit device.

[0064] Furthermore, in the conventional configuration, precision processing such as dicing and polishing of different materials is required to expose the optical input / output end faces.

[0065] On the other hand, according to the package structure for an optical circuit device according to this embodiment, it is not necessary to process the optical circuit device, and the number of materials is reduced, so that the process load can be significantly reduced.

[0066] In this embodiment, an example has been shown in which both the electric elements and the optical circuit devices are mounted face down, but either or both of the electric elements and the optical circuit devices may be mounted face up.

[0067] For example, as shown in Fig. 5A, the optical circuit device 11 may be mounted face-up and connected to the electrical wiring component 15 by wire bonding 24. Alternatively, as shown in Fig. 5B, both may be mounted face-up and the optical circuit device 11 and electrical element 14 may be connected by wire bonding 24. Furthermore, although not shown, the optical circuit device 11 and electrical element 14 may be connected by flip chip, resulting in a two-story flip chip connection with the electrical wiring board.

[0068] In this embodiment, an example is shown in which silicon photonics is used as the optical circuit device, but it is equally applicable to, for example, an InP integrated circuit, a quartz PLC, an LN circuit, etc. Also, any known optical fiber may be used as the optical fiber 21. Also, the optical fiber can be similarly used as another optical waveguide device, for example, a polymer waveguide.

[0069] 6A and 6B, the resin core 12 may be tapered. This provides the resin core 12 with a beam diameter expansion or contraction function, thereby converting the beam diameter to a desired value so as to minimize the connection loss with the optical fiber, thereby reducing the connection loss. In other words, by inserting the resin core 12 into the molded resin 13, a new optical function can be imparted.

[0070] 6C, resin core 12 may be terminated midway through molded resin 13. In this case, since the signal light propagates through molded resin 13, it is preferable that molded resin 13 be transparent to the signal light. Also, a structure that exhibits a lens function may be provided at the end of resin core 12.

[0071] This allows the resin core portion and the resin propagation portion to be given a beam diameter expansion or beam diameter reduction function, thereby converting the beam diameter to the desired diameter so as to minimize the connection loss with the optical fiber and reducing the connection loss.

[0072] <Second embodiment> A package structure of an optical circuit device according to a second embodiment of the present invention will be described with reference to FIG.

[0073] <Package structure of optical circuit device> In the optical circuit device package structure 2 according to this embodiment, the basic components are the same as those in the first embodiment, the optical circuit device 11 is a silicon photonics chip, and the electrical wiring substrate is an RDL substrate made of a polyimide thin film and copper wiring.

[0074] The difference from the first embodiment is that two types of molding resins are used, as shown in Fig. 7. The first molding resin 13 exists only around the photocurable resin core 12, and like the first embodiment, its refractive index is set to an appropriate value lower than that of the resin core 12, and it functions as a cladding for the resin core propagation part.

[0075] On the other hand, the second molding resin 13_2 molds the periphery of the optical circuit device 11 and the electric element 14 except for the portion covered by the first molding resin 13.

[0076] This embodiment can achieve the same effects as those of the first embodiment. That is, by extending the resin core from the optical circuit device and using it as an intermediate part for connection with the optical waveguide, it is no longer necessary to arrange the optical circuit device at the edge of the electrical wiring component 15, and it is possible to eliminate restrictions on the package structure and layout of the optical circuit device.

[0077] Furthermore, the optical circuit device does not need to be diced or polished after the molding resin is filled, which significantly reduces the process load.

[0078] Furthermore, in this embodiment, a resin different from the molding resin used for general semiconductor packages is used as the molding resin around the resin core.

[0079] Few molding resins for general semiconductor packages have a refractive index that matches the cladding of the resin core. Also, refractive index adjustment does not necessarily match other important functions of molding resins, such as processability and durability.

[0080] According to the package structure of the optical circuit device of this embodiment, the first molding resin used as the cladding is used separately from the second molding resin used as a general package mold, so that the resin can be easily selected while making the most of all the properties.

[0081] <Third embodiment> A package structure of an optical circuit device according to a third embodiment of the present invention will be described with reference to FIGS. 8A and 8B.

[0082] <Package structure of optical circuit device> In the optical circuit device package structure 3 according to this embodiment, the basic components are the same as those in the first embodiment, and the electrical wiring components are made of the same RDL material as in the second embodiment.

[0083] The difference from the first and second embodiments is that, as shown in FIGS. 8A and 8B, an optical function block 31 is inserted in the longitudinal direction of the photocurable resin core.

[0084] Any component having an optical function can be used as the optical function block 31. For example, a lens component can be used. The lens can provide a function such as reducing the beam diameter that has expanded during propagation through the resin core. Additionally, any known spatial optical system bulk component such as a polarization control element, a wavelength multiplexing / demultiplexing element, or a splitter element can be used.

[0085] 8B, an optical circuit device 11_2 is used as an optical function block in a broad sense, which allows the connection between optical circuits to be realized via a resin core within the molding resin.

[0086] This embodiment can achieve the same effects as the first embodiment. That is, by extending the resin core from the optical circuit device and using it as an intermediate part for connection with the optical waveguide, it is no longer necessary to place the optical circuit device on the edge of the electrical wiring component, and it is possible to eliminate restrictions on the package structure and layout of the optical circuit device. Furthermore, as mentioned in the problem section, dicing and polishing processes after filling with molding resin are no longer required for the optical circuit device, which greatly reduces the process load.

[0087] As in the second embodiment, a resin different from the general molding resin is used for the molding resin around the resin core, which allows various optical functions and multiple optical circuit devices to be integrated in the resin core waveguide on the electrical wiring component, and optical functionality can be imparted without substantially deteriorating the optical properties while making effective use of the space inside the package.

[0088] In this embodiment, as in the first embodiment, an example in which one molded resin is used is shown, but as in the second embodiment, a structure can be used in which a first molded resin that functions as a cladding for the resin core is filled around the resin core, and the other parts are filled with a second molded resin.

[0089] <Fourth embodiment> A package structure of an optical circuit device according to a fourth embodiment of the present invention will be described with reference to FIGS. 9A and 9B.

[0090] <Package structure of optical circuit device> In the optical circuit device package structure 4 according to this embodiment, the basic components are the same as those in the first embodiment.

[0091] The difference from the first to third embodiments is that the longitudinal direction of the resin core is different from the longitudinal direction (X direction) of the optical circuit (optical waveguide) core, as shown in FIGS. 9A and 9B.

[0092] That is, the resin core 12 is formed at a predetermined angle upward with respect to the longitudinal direction (X direction) of the optical circuit (optical waveguide) core.

[0093] This configuration can be formed by inclining the input / output end face 113 of the optical circuit device 11 in advance, as shown in FIG. 9A.

[0094] In detail, if the refractive index of the uncured photocurable resin differs from that of the core at the optical input / output end face 113 of the optical circuit device 11, the resin curing light is emitted from the input / output end face 113 of the optical circuit device 11 at an angle determined by Snell's law. The photocurable resin core 12 is formed along the resin curing light, and therefore is formed at a predetermined angle with respect to the longitudinal direction (X direction) of the optical circuit (optical waveguide) core.

[0095] Furthermore, the end face of the molded resin 13 on the side that is connected to an optical component such as an optical fiber 21 may be inclined with respect to the thickness direction (Z direction) of the wiring component. In this case, as shown in Fig. 9B, for example, the optical fiber array can also be connected by adjusting the angle of the end face of the molded resin 13. The combination of these angles is determined appropriately by design, and the end face of the molded resin 13 may be left in the thickness direction (Z direction) of the wiring component without being inclined.

[0096] This embodiment can achieve the same effects as the first embodiment. That is, by extending the resin core from the optical circuit device and using it as an intermediate part for connection with the optical waveguide, it is no longer necessary to place the optical circuit device on the edge of the electrical wiring component, and it is possible to eliminate restrictions on the package structure and layout of the optical circuit device.

[0097] Furthermore, the optical circuit device does not need to be diced or polished after the molding resin is filled, which significantly reduces the process load.

[0098] Furthermore, in this embodiment, the angle of the longitudinal direction of the resin core can be set arbitrarily, so that the optical axis can be offset with respect to the thickness direction (Z direction) of the electrical wiring component.

[0099] This allows the position of the end of the resin core 12 at the end of the molded resin on the side to be connected to an optical component such as an optical fiber to be separated (raised) above the electrical wiring component.

[0100] In conventional configurations, the fiber fixing parts and other components are large, and when the package is mounted on the electrical mounting board, there are cases where the electrical mounting board and the fiber fixing parts and other components interfere with each other mechanically.

[0101] According to the package structure of the optical circuit device of this embodiment, as shown in FIGS. 9A and 9B, by raising the position of the end of the resin core or by tilting the angle of the connection end face, the fiber fixing component and the electrical mounting board can be mounted without coming into contact with each other.

[0102] In this embodiment, as in the first embodiment, an example in which one molded resin is used is shown, but as in the second embodiment, a structure can be used in which a first molded resin that functions as a cladding for the resin core is filled around the resin core, and the other parts are filled with a second molded resin.

[0103] <Fifth embodiment> A package structure of an optical circuit device according to a fifth embodiment of the present invention will be described with reference to FIGS. 10A to 11B.

[0104] <Package structure of optical circuit device> In the package structure of the optical circuit device according to this embodiment, the basic components are the same as those in the first embodiment.

[0105] The difference from the first to fourth embodiments is that, as shown in Figures 10A and 10B, an optical path conversion component 41, i.e., a mirror, is arranged as the optical function block in the third embodiment, and the position of the end of the photocurable resin core 12_2 is located on the upper surface of the package structure (mold resin 13) of the optical circuit device 11.

[0106] In the first to fourth embodiments, the end of the photocurable resin core is provided on the molding resin end face perpendicular to the core longitudinal direction (X direction) of the optical circuit.

[0107] On the other hand, in this embodiment, the end of the photocurable resin core 12_2 is provided on a surface (for example, the upper surface) of the molding resin 13 parallel to the longitudinal direction (X direction) of the optical circuit core.

[0108] In detail, the resin core is composed of a first resin core 12_1 whose longitudinal direction is the core longitudinal direction of the optical circuit (the light waveguide direction of the optical circuit device, the X direction) and a second resin core 12_2 whose longitudinal direction is the thickness direction (the Z direction), and an optical path conversion component 41 is mounted between the first resin core 12_1 and the second resin core 12_2.

[0109] In this manner, the second resin core end face 12_2 to be connected to an optical component (for example, an optical fiber 21) is disposed on the upper surface of the mold resin 13.

[0110] The mirror is preferably a micromirror, and preferably has sufficient reflectivity for both the signal wavelength and the resin curing light.

[0111] This embodiment can achieve the same effects as the first embodiment. That is, by extending the resin core from the optical circuit device and using it as an intermediate part for connection with the optical waveguide, it is no longer necessary to place the optical circuit device on the edge of the electrical wiring component, and it is possible to eliminate restrictions on the package structure and layout of the optical circuit device.

[0112] Furthermore, the optical circuit device does not need to be diced or polished after the molding resin is filled, which significantly reduces the process load.

[0113] Furthermore, in this embodiment, the output end face of the resin core is disposed on the upper surface of the molded resin.

[0114] In conventional structures, the fiber fixing parts and other components are large, and when the package is mounted on the electrical mounting board, there is a possibility that the electrical mounting board and the fiber fixing parts may interfere with each other mechanically.

[0115] In this embodiment, as shown in FIG. 10A, the end face of the resin core where it connects to the fiber fixing component 22 is rotated 90° to face up, so that the fiber fixing component 22 and the electrical mounting board can be mounted without coming into contact with each other.

[0116] Furthermore, when the package structure of the optical circuit device is manufactured at the wafer level, light can be input and output from the upper surface of the wafer, which provides excellent inspectability and allows for easy inspection.

[0117] In this embodiment, as in the first embodiment, an example in which one molded resin is used is shown, but as in the second embodiment, a structure can be used in which a first molded resin that functions as a cladding for the resin core is filled around the resin core, and the other parts are filled with a second molded resin.

[0118] In addition, the package structure of the optical circuit device may have an end of the resin core 12_2 on the upper surface (the surface facing the electrical wiring component 15) of the package structure (mold resin 13) as shown in FIG. 11A, and may be configured to be connected to an optical waveguide such as an optical fiber 21.

[0119] In this configuration, the molding resin on the upper surface of the package is removed by polishing or grinding, and as a result, the thickness of the molding resin 41 can be reduced, and the resin core 12_2 can be shortened.

[0120] Furthermore, compared to when optical fibers or the like are mounted on the side of a resin mold, there are no electrical contacts and no need to process electrical wiring components, which significantly reduces the burden on the manufacturing process.

[0121] Furthermore, it is possible to polish the upper surface all at once at wafer level, which can greatly improve manufacturing efficiency.

[0122] Furthermore, as shown in FIG. 11B, another optical path changing component 41_2 may be provided on the fiber fixing component 22 side so that the longitudinal direction of the optical fiber 21 and the optical circuit core longitudinal direction (X direction) are approximately parallel to each other.

[0123] In this embodiment, an example in which one molded resin is used has been shown, as in the first embodiment. However, as shown in FIG. 12, as in the second embodiment, a structure can be used in which a first molded resin 13 that functions as a cladding for the resin core is filled around the resin core, and the other parts are filled with a second molded resin 13_2.

[0124] In the embodiments of the present invention, examples of the structure, dimensions, materials, etc. of each component in the configuration of the package structure for an optical circuit device, the manufacturing method, etc., have been shown, but the present invention is not limited to these examples. Anything that can demonstrate the function and effect of the package structure for an optical circuit device may be used. [Industrial Applicability]

[0125] The present invention relates to a package structure for an optical circuit device, and can be applied to equipment and systems such as optical communications. [Explanation of symbols]

[0126] 1. Package structure of optical circuit devices 11 Optical circuit devices 114, 117 Clad 116 cores 12 Resin Core 13 Molding resin 15 Electrical wiring parts

Claims

1. A package structure of an optical circuit device to be connected to an optical component, On the electrical wiring components, an optical circuit device having a core and a cladding; a resin core that is hardened by irradiating a photo-curable resin with light and connected to the end surface of the core; a first molding resin covering the resin core; a second molding resin covering the resin core and portions other than the first molding resin; Equipped with the refractive index of at least the first molding resin around the resin core is lower than the refractive index of the resin core; The end face of the optical circuit device including the end face of the core is inclined toward the electrical wiring component, and the resin core is disposed at a predetermined angle with respect to the longitudinal direction of the core.

1. A package structure for an optical circuit device, comprising:

2. The end face of the resin core on the side connected to the optical component, the end face of the first molding resin, and the end face of the second molding resin are substantially flush with each other.

2. The package structure of an optical circuit device according to claim 1.

3. The end face of the resin core opposite to the end face connected to the core is closer to the optical circuit device than the end face of the first molding resin.

2. The package structure of an optical circuit device according to claim 1.

4. The resin core has a lens at the tip end thereof on the end surface on the side where the resin core is connected to the optical component.

4. The package structure of an optical circuit device according to claim 1.

5. the resin core is composed of a first resin core whose longitudinal direction is the optical waveguide direction of the optical circuit device and a second resin core whose longitudinal direction is the thickness direction, an optical path changing component is provided between the first resin core and the second resin core; The end face of the second resin core that is connected to the optical component is disposed on the upper surface of the first molding resin.

5. The package structure of an optical circuit device according to claim 1.

6. The end face of the second resin core that is connected to the optical component is provided with another optical path changing component.

6. The package structure of an optical circuit device according to claim 5.

7. disposing an optical circuit device on an electrical wiring component; filling a photocurable resin around at least the input / output end faces of the optical circuit device; a step of guiding resin curing light into a core of the optical circuit device, emitting the light from the input / output end face, and irradiating the light curing resin to form a resin core; removing uncured portions of the photocurable resin; a step of filling a molding resin at least around the resin core and hardening the molding resin; Equipped with the molding resin includes a first molding resin covering the resin core and a second molding resin covering portions other than the resin core and the first molding resin, The input / output end faces are inclined toward the electrical wiring components, and the resin core is formed at a predetermined angle with respect to the longitudinal direction of the core.

10. A method for manufacturing a package structure for an optical circuit device, comprising:

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