Grinding device

Abstract

To provide a polishing device and a polishing method which can reduce the time needed for polishing process to stabilize the quality of a seal surface, and to provide a machine component in which the quality of the seal surface is stabilized.SOLUTION: A polishing device according to an embodiment comprises: a supporting unit for supporting a polishing tool; a stage for holding an object to be polished; a first drive unit for causing the support unit and the stage to move relative to one another in accordance with a shape of a polishing surface; and a second drive unit for causing the support unit to rotate synchronously with the first drive unit such that one end of a polishing member attached to the polishing tool faces a movement direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] An embodiment of the present disclosure relates to a polishing apparatus, a polishing method, and a machine part. [Background technology]

[0002] In the manufacturing process of various electronic components such as semiconductor devices and display panels for display devices, processing is performed in a vacuum. At the contact points between components constituting a vacuum container used in such processing in a vacuum, grooves are formed in one or both of the contacting components, and a sealing member such as an O-ring is installed in the groove to ensure the sealing of the interior of the container. Patent Document 1 discloses a cutting method in which a workpiece is cut using a hale-bite cutting tool. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 06-126520 Summary of the Invention [Problem to be solved by the invention]

[0004] Grooves provided in seal members are usually formed by cutting the seal surface using a rotary cutting tool such as an end mill. After cutting the grooves into the desired shape, slight irregularities and cutting debris may remain on the seal surface, and polishing is required to remove these. Polishing of the seal surface is often performed manually by workers, but this takes a long time to complete and the surface roughness of the polished surface varies depending on the experience and skill of the worker, resulting in problems such as inconsistent quality of the seal surface.

[0005] In view of the above problems, one embodiment of the present disclosure aims to provide a polishing device and a polishing method that can shorten the time required for polishing processing and stabilize the quality of the sealing surface.

[0006] Another object of one embodiment of the present disclosure is to provide a mechanical component having a stable quality of a sealing surface. [Means for solving the problem]

[0007] A polishing apparatus according to one embodiment of the present disclosure includes a support part for supporting a polishing tool, a stage for holding an object to be polished, a first drive part for moving the support part and the stage relatively along the shape of the polishing surface, and a second drive part for rotating the support part in synchronization with the first drive part so that one end of a polishing member attached to the polishing tool faces the direction of movement.

[0008] A polishing method according to one embodiment of the present disclosure is a method for polishing a polishing surface on hard anodized aluminum, comprising: a first step of polishing the polishing surface with a first polishing member at a first pressing strength; and a second step of polishing the polishing surface with a second polishing member at a second pressing strength after the first step, wherein the first pressing strength is lower than the second pressing strength.

[0009] A mechanical component according to one embodiment of the present disclosure has a hard anodized aluminum surface, and a polished surface on a portion of the hard anodized aluminum surface, the polished surface having a waviness of 0.2 μm or less and a surface roughness of 0.4 μm or less. [Effects of the Invention]

[0010] According to one embodiment of the present disclosure, the polishing process is automated using a machine, thereby shortening the time required for polishing and stabilizing the quality of the sealing surface. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a diagram illustrating an example of a configuration of a polishing apparatus according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a functional block diagram of a polishing apparatus according to an embodiment. [Figure 3]1 is a schematic view showing an example of a polishing tool used in a polishing apparatus according to an embodiment. [Figure 4] 1 is a schematic view showing an example of a polishing tool used in a polishing apparatus according to an embodiment. [Figure 5] 1 is a schematic view showing an example of a polishing tool used in a polishing apparatus according to an embodiment. [Figure 6] FIG. 2 is a schematic exploded view of a jig of a polishing tool used in a polishing apparatus according to one embodiment. [Figure 7] FIG. 1 is a plan view of an example of an object to be polished, as viewed from above. [Figure 8] 10 is a schematic view for explaining the movement route of the second polishing member when polishing a non-circular polishing surface of an object to be polished. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings, etc. However, the present invention can be implemented in many different forms, and should not be construed as being limited to the description of the embodiments exemplified below. To clarify the explanation, the drawings may show the width, thickness, shape, etc. of each part more schematically than the actual form, but these are merely examples and are not intended to limit the interpretation of the present disclosure.

[0013] In order to clarify the description, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment, but these are merely examples and do not limit the interpretation of the present invention. Furthermore, in this specification and drawings, elements having the same function as those described in the previous drawings may be given the same reference numerals, and duplicated explanations may be omitted. Furthermore, in this specification and drawings, identical parts or parts having similar functions may be given the same reference numerals or similar reference numerals (reference numerals consisting of only a number followed by A, B, etc.), and repeated explanations may be omitted.

[0014] In this specification, when a component or region is described as being "on (or under)" another component or region, unless otherwise specified, this includes not only the case where it is directly above (or directly under) the other component or region, but also the case where it is above (or under) the other component or region, i.e., the case where another component is included between the component or region and above (or under) the other component or region.

[0015] Furthermore, in this specification, unless otherwise specified, expressions such as "α includes A, B, or C," "α includes any one of A, B, and C," and "α includes one selected from the group consisting of A, B, and C" do not exclude cases where α includes multiple combinations of A to C. Furthermore, these expressions do not exclude cases where α includes other elements.

[0016] A polishing apparatus 10 according to an embodiment of the present disclosure will now be described with reference to the drawings.

[0017] 1 is a diagram illustrating an example of the configuration of a polishing apparatus 10 according to an embodiment of the present disclosure. As shown in FIG. 1, the polishing apparatus 10 includes a support unit 101, a stage 103, a first drive unit 105, and a second drive unit 107.

[0018] The support part 101 supports the grinding tool 201. The grinding tool 201 will be described later. The support part 101 is rotatably attached to a first driving part 105.

[0019] The stage 103 holds the object to be polished 203. The object to be polished 203 is a part of a mechanical component and is not particularly limited. For example, the object to be polished 203 may be a component constituting a vacuum device used in a vacuum apparatus. In this case, the object to be polished 203 has a sealing surface of a vacuum vessel. The sealing surface may be, for example, hard anodized. The polishing tool 201 can polish the hard anodized aluminum film of the object to be polished 203. In this embodiment, the film formed on the object to be polished 203 is not limited to hard anodized aluminum. For example, the surface hardness of the object to be polished 203 is about Hv 350 to 450.

[0020] The first driving unit 105 moves the support unit 101 and the stage 103 relatively along the shape of the polishing surface of the object 203. In other words, the first driving unit 105 has a mechanism for moving the positions of one or both of the support unit 101 and the stage 103 so that the polishing tool 201 can move along the shape of the polishing surface. The first driving unit 105 includes a first moving unit 109, a first guide unit 111, a second guide unit 113, a second moving unit 115, and a third guide unit 117.

[0021] The first moving unit 109 moves the support unit 101 in the z direction. The first guide unit 111 is provided on the main body 119 of the polishing apparatus 10 to extend in the z direction. The first guide unit 111 guides the movement of the first moving unit 109 in the z direction. For example, the first guide unit 111 may be a rail extending in the z direction, and the first moving unit 109 may slide in the z direction along the first guide unit 111. The first moving unit 109 and the first guide unit 111 constitute a first moving mechanism 112 that moves the support unit 101.

[0022] The second guide portion 113 guides the movement of the stage 103 in the x direction. The second guide portion 113 may be a rectangular plate having a pair of sides along the x direction and a pair of sides along the y direction. The stage 103 is supported by the second guide portion 113 so as to be slidable in the x direction. For example, the stage 103 may be disposed so as to sandwich the edges of the pair of sides along the x direction of the second guide portion 113, and slide along the edges of the pair of sides along the x direction.

[0023] The second moving unit 115 moves the second guide unit 113, which supports the stage 103, in the y direction. The third guide unit 117 is provided on the main body 119 of the polishing apparatus 10 to extend in the y direction. The third guide unit 117 guides the movement of the second guide unit 113 in the y direction. For example, the third guide unit 117 may be a rail extending in the y direction, and the second guide unit 113 may slide in the y direction along the third guide unit 117.

[0024] The second guide portion 113 , the second moving portion 115 , and the third guide 117 may constitute a second moving mechanism 118 that moves the stage 103 .

[0025] Although an example of the configuration of the first driving unit 105 has been described above, in this embodiment, the configuration of the first driving unit 105 is not limited to the above. For example, the first driving unit 105 may further include a movement mechanism that moves the support unit 101 in the x direction and / or the y direction. The first driving unit 105 may also further include a movement mechanism that moves the stage 103 in the z direction.

[0026] The second driving unit 107 rotates the support unit 101 that supports the grinding tool 201. The second driving unit 107 can also rotate the support unit 101 in synchronization with the first driving unit 105 so that one end of the grinding member attached to the grinding tool 201 always faces the direction in which the grinding tool 201 moves along the grinding surface.

[0027] Although not shown, the polishing apparatus 10 includes a plurality of motors. The first driving unit 105 and the second driving unit 107 move and rotate the support unit 101 and the stage 103 using these motors.

[0028] 2 is an example of a functional block diagram of the grinding apparatus 10. As shown in FIG.

[0029] The input operation unit 121 is a device such as an operation panel, operation buttons, or touch panel, and outputs a signal corresponding to the input operation to the control unit 122. An operator engaged in polishing work can control the operation of the first driving unit 105 and the second driving unit 107 of the polishing apparatus 10 via the input operation unit 121. For example, the operator can use the input operation unit 121 to start and stop the polishing process performed by the polishing apparatus 10, set or change the rotation speed of the support unit 101, and the movement speed and direction of the support unit 101 and the stage.

[0030] The control unit 122 includes an arithmetic processing circuit such as a CPU, and a storage unit. The control unit 122 executes a control program stored in the storage unit using the CPU, controls the operations of the first driving unit 105 and the second driving unit 107, and causes the grinding apparatus 10 to realize a grinding function.

[0031] 3, 4, and 5 are schematic diagrams showing an example of a grinding tool 201 supported by the support portion 101 of the grinding apparatus 10 according to this embodiment.

[0032] The polishing process of the workpiece 203 performed by the polishing apparatus 10 according to this embodiment includes a first stage in which the polishing surface is polished with a first pressing force by a first polishing member, and a second stage in which the polishing surface is polished with a second pressing force by a second polishing member after the first stage. The first polishing member and the second polishing member are made of different materials. The first pressing force and the second pressing force are different from each other. Here, the pressing force refers to the load applied to the polishing jig when the polishing member comes into contact with the surface of the workpiece 203 during the polishing process.

[0033] 3 is a schematic diagram showing an example of a polishing tool 201A used in the first stage of the polishing process. The polishing tool 201A includes a jig 303 and a first polishing member 305A attached to the jig 303 via a polishing member holder 307. The first polishing member 305A may be a brush made of, for example, ceramic fiber or nylon. In other words, the first stage of the polishing process is a polishing process using a brush.

[0034] 6 is an example of a schematic exploded view of the jig 303. As shown in FIGS.

[0035] The fixed part 309 is fixed to the support part 101 of the polishing apparatus 10. The holder 311 is joined to the fixed part 309. A hollow storage part 312 is provided inside the holder 311, and a coil spring 315 is inserted into the storage part 312. The spring constant of the coil spring 315 of the polishing tool 201A used in the first stage is 1 N / mm or more and 5 N / mm or less. The coil spring 305 inserted into the jig 303 forms a float mechanism.

[0036] The polishing member holder 307 is inserted into and fixed in the storage portion 312 of the fixed portion 309. The polishing member holder 307 is inserted into the storage portion 312 so as to compress the coil spring 315 via the washer 316. At this time, the polishing member holder 307 compresses the coil spring 315 without completely sealing it. The polishing member holder 307 has a hollow portion 308. A first polishing member 305A is detachably attached to the hollow portion 308.

[0037] A pair of holes 317 are formed in the holder 311. Steel balls 319 are inserted into the holes 317, respectively. A cover 313 is placed over the holes 317 so as to cover the holes 317 into which the steel balls 319 have been inserted, and the cover 313 is fixed with two retaining rings 321 to prevent it from shifting.

[0038] 4 is a schematic diagram showing an example of a polishing tool 201B used in the second stage of the polishing process. The polishing tool 201B has substantially the same configuration as the polishing tool 201A shown in FIGS. 3 and 6, except that the material of the second polishing member 305B attached to the jig 303 is different from the material of the first polishing member 305A, and the coil spring 315 inside the jig 303 has a different spring constant than the coil spring 315 inserted inside the jig 303 of the polishing tool 201A shown in FIGS.

[0039] In the polishing tool 201B shown in Fig. 4, the second polishing member 305B is a sponge abrasive coated with abrasive grains such as aluminum oxide, titanium oxide, or zirconium. In other words, the second stage of the polishing process is a polishing process using the sponge. The shape of the polishing member 305 may be, for example, cylindrical.

[0040] The spring constant of the coil spring 315 inserted into the jig 303 of the polishing tool 201B is different from the spring constant of the coil spring 315 inserted into the jig 303 of the polishing tool 201A used in the first stage. The spring constant of the coil spring 315 inserted into the jig 303 of the polishing tool 201B is greater than 1 N / mm and not more than 10 N / mm. The spring constant of the coil spring 315 inserted into the jig 303 of the polishing tool 201B is higher than the spring constant of the coil spring 315 inserted into the jig 303 of the polishing tool 201A.

[0041] After the first stage using polishing tool 201A is completed, a worker engaged in the polishing process performed by polishing apparatus 10 may remove polishing tool 201A from support unit 101 of polishing apparatus 10 and attach polishing tool 201B to support unit 101. Alternatively, the worker may disassemble jig 303 of polishing tool 201A, remove coil spring 315 having a spring coefficient of 1 N / mm or more and 5 N / mm or less from polishing tool 201A used in the first stage, and replace it with coil spring 315 having a spring coefficient of more than 1 N / mm and 10 N / mm or less to be used in the second stage, thereby fabricating polishing tool 201B. In this case, the worker may replace coil spring 315 of jig 303, remove first polishing member 305A attached to polishing tool 201A, and detachably attach second polishing member 305B.

[0042] 5 is a schematic diagram showing an example of a polishing tool 201C used in the second stage of the polishing process. A second polishing member 305C attached to the jig 303 of the polishing tool 201C is another example of a second polishing member, different from the second polishing member 305B shown in FIG. 4. The polishing tool 201C has substantially the same configuration as the polishing tool 201B shown in FIGS. 3 and 6, except that the shape of the second polishing member 305C attached to the jig 303 is different from the shape of the second polishing member 305B.

[0043] The material of the second polishing member 305C of the polishing tool 201C is the same as the material of the second polishing member 305B of the polishing tool 201B. On the other hand, the shape of the second polishing member 305C may be different from that of the second polishing member 305B, for example, hemispherical.

[0044] After the first stage using polishing tool 201A is completed, an operator engaged in the polishing process performed by polishing apparatus 10 may remove polishing tool 201A from support unit 101 of polishing apparatus 10 and attach polishing tool 201C to support unit 101. Alternatively, the operator may disassemble jig 303 of polishing tool 201A, remove coil spring 315 having a spring coefficient of 1 N / mm or more and 5 N / mm or less from polishing tool 201A used in the first stage, replace it with coil spring 315 having a spring coefficient of more than 1 N / mm and 10 N / mm or less to be used in the second stage, and remove first polishing member 305A attached to polishing tool 201A and detachably attach second polishing member 305C to produce polishing tool 201C.

[0045] Both the polishing tool 201B shown in Fig. 4 and the polishing tool 201C shown in Fig. 5 can be used in the second stage of the polishing process performed by the polishing apparatus 10. The polishing tool 201B shown in Fig. 4 is preferably used when the polishing surface of the object 203 to be polished is circular. On the other hand, the polishing tool 201C is preferably used when the polishing surface of the object 203 to be polished is non-circular.

[0046] FIG. 7 is a plan view of an example of the object to be polished 203, seen from above. The object to be polished 203 is, for example, a component of a vacuum chamber, and is made of an aluminum alloy, stainless steel, or the like. The object to be polished 203 has a sealing surface 701. The sealing surface 701 is hard anodized, and the thickness of the hard anodized coating may be approximately 30 μm to approximately 100 μm. The sealing surface 701 includes a plurality of polishing surfaces. Here, the polishing surfaces refer to surfaces on the sealing surface 701 that are polished by the polishing tool 201. The polishing surfaces include circular polishing surfaces 703a to 703j and non-circular polishing surfaces 705a to 705c.

[0047] When polishing the circular polishing surfaces 703a-703j, it is preferable to use the polishing tool 201B shown in Fig. 4 in the second stage. In the second stage, the second driving unit 107 of the polishing apparatus 10 rotates the support unit 101 supporting the polishing tool 201B at a predetermined rotational speed. In other words, the second polishing member 305B of the polishing tool 201B polishes the circular polishing surfaces 703a-703j while rotating at the predetermined rotational speed.

[0048] When polishing the non-circular polishing surfaces 705a-705c, it is preferable to use the polishing tool 201C shown in Fig. 5 in the second stage. The second driving unit 107 of the polishing apparatus 10 rotates the support unit 101 so that a predetermined end of the second polishing member 305C attached to the polishing tool 201C always faces in the direction in which the polishing tool 201C moves, along the shape of the polishing surfaces 705a-705c.

[0049] FIG. 8 is a schematic diagram illustrating the movement route of the second polishing member 305C attached to the polishing tool 201C when polishing a non-circular polishing surface. In FIG. 8, the non-circular polishing surface is the non-circular polishing surface 705b shown in FIG. 7. The movement direction of the polishing tool 201C is indicated by a dashed arrow. As shown in FIG. 8, in the second stage, the second driving unit 107 rotates the support unit 101 so that a predetermined end 801a of the second polishing member 305C always faces the movement direction of the polishing tool 201C along the shape of the polishing surface 705b.

[0050] The surface roughness of the polished surface of the object to be polished 203 after the polishing process including the first and second stages performed by the polishing apparatus 10 is preferably such that the waviness is 0.2 μm or less, the standard deviation of the waviness is 0.2 μm or less, the surface roughness is 0.4 μm or less, and the standard deviation of the surface roughness is 0.3 μm or less. It is more preferable that the surface roughness of the polished surface of the object to be polished 203 is 0.2 μm or less. Here, the larger of the undulations at different intervals on the polished surface is referred to as "waviness." To distinguish between "waviness" and "roughness," which is a smaller undulation, the reference length (cutoff value) defined in JIS B0633 can be used.

[0051] In this embodiment, the polishing process performed by polishing apparatus 10 includes a first stage in which the polishing surface is polished with a first pressure strength using first polishing member 305A, and a second stage in which the polishing surface is polished with a second pressure strength using second polishing member 305B or 305C after the first stage. Because the spring constant of coil spring 315 inserted into jig 303 of polishing tool 201A to which first polishing member 305A is attached differs from the spring constant of coil spring 315 inserted into jig 303 of polishing tools 201B and 201C to which second polishing members 305B and 305C are attached, the pressure strength applied to polishing tools 201A and 201B and 201C can be changed between the first stage, which is a polishing process using a brush, and the second stage, which is a polishing process using a sponge containing abrasive grains. Specifically, the second pressure strength can be higher than the first pressure strength.

[0052] This allows the polishing process to be automated, shortening the time required for polishing and stabilizing the quality of the sealing surface. Furthermore, the waviness and surface roughness of the polished surface can be reduced compared to those of a surface polished manually by an operator, improving the airtightness of the sealing surface.

[0053] Furthermore, by having the second driving unit 107 rotate the support unit 101 so that a predetermined end of the second polishing member 305C always faces the direction of movement of the polishing tool 201C, the polishing process can be automated by machine even if the polishing surface is non-circular. [Example]

[0054] Example 1 [Polishing equipment and polishing object] An aluminum alloy A6061 with dimensions of φ360 mm x t40 mm was prepared as the object to be polished, and its surface was hard anodized to form a hard anodized coating with a thickness of 80 μm. The surface of the object to be polished was polished using the polishing device according to this embodiment. The polished surface of the object to be polished was the same as the polished surface of the object to be polished 203 shown in FIG. 7. A ROBODRILL manufactured by FANUC was used as the polishing device, and a float holder (FH-ST12-SL10) manufactured by XEBEC was used as the polishing jig.

[0055] [Polishing tools] In the first stage of the polishing process performed by the polishing machine, a polishing tool (hereinafter referred to as the first polishing tool) was used, which was fabricated by inserting a coil spring (WL10-35, spring coefficient: 1 N / mm) manufactured by Misumi Corporation into the jig and attaching an XBEC brush (A11-EB06M) with a brush length adjusted to 12 mm to the jig. In the second stage of the polishing process performed by the polishing machine, when polishing a circular surface, a polishing tool (hereinafter referred to as the second polishing tool A) was used, which was fabricated by inserting a coil spring (WT10-35, spring coefficient: 2 N / mm) manufactured by Misumi Corporation into the jig and cutting a 3M sponge abrasive (Super Fine) into a cylindrical shape with a diameter of 21 mm and a thickness of 5 mm and attaching it to the jig. In addition, when polishing a non-circular polishing surface in the second stage of the polishing process performed by the polishing device, a polishing tool (hereinafter referred to as the second polishing tool B) was used, which was made by inserting a coil spring (WT10-35, spring coefficient: 2N / mm) manufactured by Misumi Corporation into the inside of the jig, cutting out a sponge abrasive (super fine) manufactured by 3M Corporation to a width of 6 mm and a length of 40 mm, machining the tip to a hemispherical shape with a diameter of 5 mm, and attaching it to the jig.

[0056] [Circular polishing process] (First stage) In the first stage of the polishing process, for each of 10 circular polishing surfaces of the workpiece (see polishing surfaces 703a-703j in FIG. 7), the first polishing tool was rotated at a speed of 5000 rpm and a feed rate of 2000 mm / min, moving from helical Z: 2.0 mm to Z: -1.0 mm at a position with a radius of 7.5 mm, polishing was performed five times in an arc with a radius of 7.5 mm, followed by a shift of 1.75 mm and polishing five times in a spiral path. Thereafter, for each of the 10 circular polishing surfaces of the workpiece, the rotation speed of the first polishing tool was changed to 8000 rpm, and the feed rate was 2000 mm / min, moving from helical Z: 2.0 mm to Z: -1.0 at a position with a radius of 7.5 mm, polishing was performed five times in an arc with a radius of 7.5 mm, followed by a shift of 1.75 mm and polishing five times in a spiral path.

[0057] (Second stage) In the second stage of the polishing process, for each of 10 circular polishing surfaces of the object to be polished, the second polishing tool A was lowered to a helical Z of -3.0 mm at a rotation speed of 30 rpm, and stop polishing was performed for 10 seconds, which constituted one set, and two sets were performed.

[0058] [Polishing process for non-circular polished surfaces] (First stage) In the first stage of the polishing process, for each of three non-circular polishing surfaces of the workpiece (see polishing surfaces 705a to 705c in FIG. 7), the rotation speed of the first polishing tool was set to 5000 rpm and the feed rate to 2000 mm / min, the first polishing tool was lowered to helical Z: -1.0 mm, and polishing surfaces 705a and 705b were polished 10 times, and polishing surface 705c was polished 5 times, constituting one set. This was performed two times for each of polishing surfaces 705a, 705b, and 705c. Thereafter, the rotation speed of the first polishing tool was changed to 8000 rpm, the first polishing tool was lowered to helical Z: -0.5 mm, and polishing surfaces 705a and 705b were polished 20 times, and polishing surface 705c was polished 10 times. This was performed two times for each of polishing surfaces 705a, 705b, and 705c.

[0059] (Second stage) In the second stage of the polishing process, for each of the three non-circular polishing surfaces of the object to be polished (see polishing surfaces 705a to 705c shown in Figure 7), the feed rate of the second polishing tool B was set to 2000 / min in the R section and 4000 / min in the straight section, and the second polishing tool B was lowered to helical Z: -1.0 mm. One set consisted of polishing surfaces 705a and 705b 20 times each and polishing surface 705c 10 times, and six such sets were performed.

[0060] <Comparative Example 1> As Comparative Example 1, circular polishing surfaces 703a to 703j and non-circular polishing surfaces 705a to 705c of an object to be polished that is the same as the object to be polished used in Example 1 were polished manually by an operator. The manual polishing process was as follows.

[0061] First, the same object to be polished as in Example 1 was used. As in Example 1, the polishing surface of the object to be polished was the same as the polishing surface of the object to be polished 203 shown in FIG. 7. Next, a masking seal exposing ten circular polishing surfaces (see polishing surfaces 703a-703j in FIG. 7) and three non-circular polishing surfaces (see polishing surfaces 705a-705c in FIG. 7) of the object to be polished was attached to the sealing surface (701) of the object to be polished. A reinforcing seal was further attached to the masking seal. After this, Salkrat (manufactured by Kyodo Yushi Co., Ltd.) was applied to each of the polishing surfaces 703a-703j and 705a-705c, and each of the polishing surfaces 703a-703j and 705a-705c was manually polished for 1.5 hours using a sponge abrasive (fine) manufactured by 3M. Next, each of the polished surfaces 703a to 703j and 705a to 705c was polished manually for 1.5 hours using a sponge abrasive (Super Fine) manufactured by 3M Co. After that, each of the polished surfaces 703a to 703j and 705a to 705c was wiped with a clean wiper with NEI Clean 2 attached, and the masking seal was peeled off from the polished surface (701).

[0062] The surface roughness (Ra) and working time of the polished surface after the polishing process described in Example 1 described above are shown in Table 1 below. The surface roughness (Ra) and working time of the polished surface after the polishing process of Comparative Example 1 are shown in Table 2 below. [Table 1] [Table 2]

[0063] Comparing Example 1 and Comparative Example 1, it can be seen that polishing using the polishing device according to this embodiment can achieve better results than manual polishing or results that are substantially the same as manual polishing while significantly reducing the time required for the polishing process. Furthermore, it can be seen that Example 1 has a smaller difference in surface roughness depending on the polishing position than Comparative Example 1, making it possible to stabilize the quality of the sealing surface.

[0064] <Example 2> Circular polishing surfaces 703a, 703e, and 703j and non-circular polishing surfaces 705a to 705c of the same object to be polished as that used in Example 1 above were polished by a polishing process substantially similar to that of Example 1. However, unlike Example 1 above, in the second stage using second polishing tool A or second polishing tool B, the second stage described in Example 1 above was counted as one cycle, and the sponge was replaced after each cycle, for a total of three cycles.

[0065] Table 3 below shows the waviness and surface roughness of the circular polished surfaces (703a, 703e, 703j) that underwent the polishing process according to Example 2, and Table 4 shows the waviness and surface roughness of the non-circular polished surfaces (705a to 705c) that underwent the polishing process according to Example 2. The cutoff value for separating waviness from surface roughness was set to 200 μm. [Table 3] [Table 4]

[0066] As shown in Tables 3 and 4, by performing the polishing process using the polishing apparatus according to this embodiment, the waviness of the polished surface was 0.2 μm or less for both the circular polished surface and the non-circular polished surface, and the standard deviation of the waviness was 0.2 μm or less. Furthermore, the surface roughness of the polished surface was 0.2 μm or less for both the circular polished surface and the non-circular polished surface, and the standard deviation of the surface roughness was 0.3 μm or less. In particular, the surface roughness of the polished surface was 0.2 μm or less for both the circular polished surface and the non-circular polished surface. Furthermore, the waviness of the circular polished surface was reduced to 0.1 μm or less.

[0067] <Comparative Example 2> As Comparative Example 2, circular polishing surfaces 703a, 703e, and 703j and non-circular polishing surfaces 705a to 705c of the same object to be polished as that used in Example 1 were polished manually by an operator. The polishing was performed according to the following procedure.

[0068] First, a masking seal exposing the circular polishing surfaces 703a, 703e, and 703j and the noncircular polishing surfaces 705a-705c of the polishing object was attached to the sealing surface (701) of the polishing object. A reinforcing bar was then attached to the masking seal. After this, Salkrat (manufactured by Kyodo Yushi Co., Ltd.) was applied to each polishing surface 703a, 703e, 703j, and 705a-705c, and each polishing surface 703a, 703e, 703j, and 705a-705c was manually polished for 1.5 hours using a 3M sponge abrasive (fine). Next, each polishing surface 703a, 703e, 703j, and 705a-705c was manually polished for 1.5 hours using a 3M sponge abrasive (super fine). Thereafter, a clean wiper with NEI Clean 2 applied thereto was used to wipe the polished surfaces 703a, 703e, 703j, and 705a to 705c, and the masking seal was peeled off from the polished surface (701).

[0069] Table 5 below shows the waviness and surface roughness of the circular polished surfaces (703a, 703e, 703j) that underwent the above-mentioned manual polishing process, and Table 6 shows the waviness and surface roughness of the non-circular polished surfaces (705a to 705c) that underwent the above-mentioned manual polishing process. The cutoff value for separating waviness from surface roughness was set to 200 μm. [Table 5] [Table 6]

[0070] As shown in Tables 5 and 6, the waviness of the polished surface was greater for both the manually polished circular and non-circular polished surfaces than in Example 2. In addition, the surface roughness and standard deviation of the surface roughness of the manually polished non-circular polished surface were greater than in Example 2. Although the surface roughness and standard deviation of the surface roughness of the manually polished circular polished surface were slightly smaller than in Example 2, the difference in surface roughness and standard deviation of the surface roughness depending on the polishing position was greater than the difference in surface roughness and standard deviation of the surface roughness depending on the polishing position for the circular polished surface in Example 2.

[0071] As described above, when Example 2 and Comparative Example 2 are compared, it is clear that polishing using the polishing apparatus according to this embodiment provides better results than manual polishing, or results that are substantially the same as those obtained.

[0072] [Variations] While an example of an embodiment of the present disclosure has been described above, the present disclosure is not limited to the above embodiment. Below, a description will be given of modified examples of the polishing process performed by the polishing apparatus of the present disclosure.

[0073] The first stage polishing process using a brush as the polishing member may include a front-end process for roughing and a rear-end process for finishing. In this case, it is preferable to insert springs having different spring coefficients into the polishing tool jig for the front-end process and the rear-end process, so that the pressing strength applied to the polishing tool used in the front-end process is different from the pressing strength applied to the polishing tool used in the rear-end process. More specifically, it is preferable that the pressing strength applied to the polishing tool used in the front-end process is higher than the pressing strength applied to the polishing tool used in the rear-end process. In other words, it is preferable that the spring coefficient of the spring inserted into the polishing tool jig used in the front-end process is higher than the spring coefficient of the spring inserted into the polishing tool jig used in the rear-end process.

[0074] The above-described embodiment and modifications of the present disclosure may be combined as appropriate as long as they are not mutually inconsistent. Furthermore, a configuration in which a person skilled in the art appropriately adds or deletes components or modifies the design, or adds or omits steps or modifies conditions based on the configuration described in the embodiment, is also included in the scope of the invention as long as it includes the gist of the present disclosure.

[0075] Even if there are other effects and advantages different from those brought about by the aspects of the above-described embodiments, those that are clear from the description in this specification or that can be easily predicted by a person skilled in the art are naturally understood to be brought about by the present invention. [Explanation of symbols]

[0076] 10: Polishing device, 101: Support unit, 103: Stage, 105: First driving unit, 107: Second driving unit, 109: First moving unit, 111: First guide unit, 112: First moving mechanism, 113: Second guide unit, 115: Second moving unit, 117: Third guide unit, 118: Second moving mechanism, 119: Main body, 121: Input operation unit, 122: Control unit, 201: Polishing tool, 203: Polishing pair Object, 303: jig, 305 (305A to 305C): polishing member, 307: polishing member holding portion, 308: hollow portion, 309: fixing portion, 311: holder, 312: storage portion, 313: cover, 315: coil spring, 317: hole, 319: steel ball, 321: retaining ring, 701: sealing surface, 703a to 703j: circular polishing surface, 705a to 705c: non-circular polishing surface

Claims

1. A support part for supporting a shaft-shaped polishing tool to which a polishing member is attached that contacts a polishing surface of an object to be polished to polish said polishing surface; a stage for holding the object to be polished; a first driving unit that moves the support unit and the stage relatively along the shape of the polishing surface; a second driving unit that rotates the support unit in synchronization with the first driving unit; and The polishing member is attached to the tip of the polishing tool, a polishing apparatus in which, when the polishing member is brought into contact with the polishing surface and the support part and the stage are moved relatively by the first drive part, the second drive part rotates the support part around the axis of the polishing tool so that one end of the polishing member is always at the forefront in the direction of movement from the start to the end of the movement.

2. 2. The polishing apparatus according to claim 1, wherein the first driving unit moves the support unit and the stage relatively in a non-circular manner along the shape of the polishing surface.

3. 3. The polishing apparatus according to claim 2, wherein the polishing surface is a part of one surface of the object to be polished and has a non-circular shape surrounding a non-polishing surface of the one surface.

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