Radiation-sensitive composition, interlayer insulating film and method for producing the same, and display element
JP7732797B2Pending Publication Date: 2025-09-02JSR CORPORATION
Patent Information
- Application Number
- JP2021128528
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-08-04
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2041-08-04
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Abstract
To provide a radiation-sensitive composition that makes it possible to form a cured film with high radiation sensitivity, a good pattern shape, and small film thickness change before and after heat curing.SOLUTION: The radiation-sensitive composition contains (A) a polymer component, (B) a quinonediazide compound, and (C) a solvent. The component (A) includes, in a first polymer or in a different polymer: a first structural unit derived from an α,β-unsaturated compound having a heterocyclic ring structure with a ring member number of 5 or more and having a methyl group, a fluorine atom, a trifluoromethyl group, or an alkoxyalkyl group at position α; a second structural unit having an acidic group; and a third structural unit having a cyclic ether group with a ring member number of 3 or 4. The heterocyclic ring structure is at least one structure selected from the group consisting of a cyclic ether structure (except tetrahydrofuran structures), a cyclic ester structure, a cyclic imide structure, and a triazole ring-containing structure.SELECTED DRAWING: None
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Citation Information
Patent Citations
Photosensitive resin composition, photosensitive resin transfer material and image forming method
JP2003005357A
Radiation-sensitive resin composition and formation of interlayer insulation film and microlens
JP2007101761A
Photosensitive resin composition for dielectrics
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