Radiation-sensitive composition, interlayer insulating film and method for producing the same, and display element

JP7732797B2Pending Publication Date: 2025-09-02JSR CORPORATION
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Patent Information

Application Number
JP2021128528
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-08-04
Publication Date
2025-09-02
Estimated Expiration
2041-08-04

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Abstract

To provide a radiation-sensitive composition that makes it possible to form a cured film with high radiation sensitivity, a good pattern shape, and small film thickness change before and after heat curing.SOLUTION: The radiation-sensitive composition contains (A) a polymer component, (B) a quinonediazide compound, and (C) a solvent. The component (A) includes, in a first polymer or in a different polymer: a first structural unit derived from an α,β-unsaturated compound having a heterocyclic ring structure with a ring member number of 5 or more and having a methyl group, a fluorine atom, a trifluoromethyl group, or an alkoxyalkyl group at position α; a second structural unit having an acidic group; and a third structural unit having a cyclic ether group with a ring member number of 3 or 4. The heterocyclic ring structure is at least one structure selected from the group consisting of a cyclic ether structure (except tetrahydrofuran structures), a cyclic ester structure, a cyclic imide structure, and a triazole ring-containing structure.SELECTED DRAWING: None
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Citation Information

Patent Citations

  • Photosensitive resin composition, photosensitive resin transfer material and image forming method

    JP2003005357A

  • Radiation-sensitive resin composition and formation of interlayer insulation film and microlens

    JP2007101761A

  • Photosensitive resin composition for dielectrics

    KR1020090062900A