Component supply device, calibration method, and component supply system

Abstract

To make it possible to efficiently adjust the origin of a needle height.SOLUTION: A component mounting device includes: an ejector on which a measurement component is placed and which includes a needle capable of pushing up the placed measurement component and an elevating unit capable of raising and lowering the needle; a calculation unit that calculates the height of the needle in a raising / lowering direction of the needle; an imaging unit that takes an image of the measurement component placed on an upper surface of the ejector from above, as the needle is raised and lowered by the elevating unit; and a correction unit that detects the measurement component from the image taken by the imaging unit, calculates an amount of positional deviation in the raising / lowering direction of the needle based on an outer shape of the detected measurement component and the height of the needle calculated by the calculation unit, and corrects the height of the needle based on the calculated amount of positional deviation.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a component supply device, a calibration method, and a component supply system. [Background technology]

[0002] Patent Document 1 discloses a die push-up operation management system that automatically measures the push-up height of the push-up pot and push-up pins of a die supply device, as well as the XY-directional position of the push-up pins. When lowering a suction nozzle to pick up a die on a dicing sheet, the die push-up operation management system raises the push-up pot, and with the dicing sheet attached to the upper surface of the push-up pot, causes the push-up pins in the push-up pot to protrude upward from the upper surface of the push-up pot. The die push-up operation management system uses the push-up pins to push up the dicing sheet at the portion of the die to be picked up, partially peeling the attached portion of the die from the dicing sheet while adsorbing the die to the suction nozzle and picking it up from the dicing sheet. The die push-up operation management system performs the push-up operation without setting a wafer pallet above the push-up pot. It includes a camera that captures an image of the side of the push-up pot while it is raised, and an image processing means that processes the side image of the push-up pot output from the camera to detect the height position of the upper surface of the push-up pot during the push-up operation. The cameras are provided separately: a camera for capturing a side image of the push-up pin in the X direction, and a camera for capturing a side image of the push-up pin in the Y direction. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-45988 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the die push-up operation management system takes side images of the push-up pin in the X direction and the Y direction each time a die is picked up, and measures the height position and position in the X and Y directions of the push-up pin, which could reduce the efficiency of die (component) supply.

[0005] The present disclosure has been devised in view of the above-described conventional circumstances, and aims to provide a component supply device, a calibration method, and a component supply system that efficiently adjust the origin of the needle height. [Means for solving the problem]

[0006] The present disclosure provides a component mounting device comprising: an ejector on which a measurement component is placed, the ejector having a needle capable of pushing up the placed measurement component and a lifting unit capable of raising and lowering the needle; a calculation unit that calculates the height of the needle in the lifting direction of the needle; an imaging unit that images the measurement component placed on the upper surface of the ejector from above as the needle is raised and lowered by the lifting unit; and a correction unit that detects the measurement component from the image captured by the imaging unit, calculates the amount of positional deviation of the needle in the lifting direction based on the outline of the detected measurement component and the height of the needle calculated by the calculation unit, and corrects the height of the needle using the lifting unit based on the calculated amount of positional deviation.

[0007] The present disclosure also provides a calibration method executed by at least one computer, which includes placing a measurement part on an upper surface of an ejector, raising and lowering a needle provided on the ejector and capable of pushing up the measurement part, calculating the height of the needle as the needle rises and falls in the raising and lowering direction, capturing an image of the measurement part placed on the upper surface of the ejector from above, detecting the measurement part from the captured image, calculating a positional deviation amount of the needle in the raising and lowering direction based on the outline of the detected measurement part and the calculated height of the needle, and correcting the height of the needle using the lifting unit based on the calculated positional deviation amount.

[0008] The present disclosure also provides a component mounting system including a component mounting device that mounts components on a board and at least one computer that can communicate with the component mounting device, wherein the component mounting device places a measurement component on an upper surface of an ejector, raises and lowers a needle that is provided on the ejector and can push up the measurement component, calculates a height of the needle as the needle rises and falls in a raising and lowering direction, images the measurement component placed on the upper surface of the ejector from above, and compares the calculated height of the needle with the image of the needle. Measuring parts and transmits the captured image to the computer, the computer detects the measurement component from the transmitted captured image, calculates the amount of positional deviation of the needle in the lifting and lowering direction based on the outer shape of the detected measurement component and the calculated height of the needle, and transmits the calculated amount of positional deviation to the component mounting device, and the component mounting device corrects the height of the needle using the lifting and lowering unit based on the transmitted amount of positional deviation. [Effects of the Invention]

[0009] According to the present disclosure, the origin of the needle height can be adjusted efficiently. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a plan view showing a schematic configuration of a component mounting device according to an embodiment; [Figure 2] FIG. 1 is a plan view showing a schematic configuration of a first component supply device according to an embodiment; [Figure 3] A0-A0 cross-sectional view of the carrier holding section shown in Figure 2 [Figure 4] FIG. 10 is a plan view showing a schematic configuration of a carrier holding unit; [Figure 5] FIG. 10 is a plan view showing a schematic configuration of the carrier holding section when no carrier is being held; [Figure 6] FIG. 10 is a plan view showing the configuration of an ejector. [Figure 7] FIG. 1 is a plan view showing a schematic configuration of a holding unit main body; [Figure 8] FIG. 1 is a plan view showing a schematic configuration of a carrier held by a carrier holding portion; [Figure 9] A diagram explaining the procedure for holding a carrier by a carrier holding unit. [Figure 10] A2-A2 sectional view and A3-A3 sectional view of the carrier held by the carrier holding portion [Figure 11] Diagram explaining the measurement chip table [Figure 12] Enlarged cross-sectional view of the ejector [Figure 13] FIG. 3 is a plan view of the pickup unit with the cover removed as shown in FIG. 2; [Figure 14] Schematic side view of the pickup unit [Figure 15] FIG. 1 is a side view showing a schematic configuration of a holding head changer; [Figure 16] A diagram explaining the positional relationship between the ejector and the penetration part during calibration. [Figure 17] A5-A5 cross-sectional view of the pickup unit shown in FIG. 13 [Figure 18] A5-A5 cross-sectional view of the pickup unit shown in FIG. 13 [Figure 19] Block diagram showing an example of the internal configuration of a management computer [Figure 20] A block diagram showing an example of the internal configuration of a component mounting device. [Figure 21] 1 is a flowchart showing an example of an operation procedure at the time of equipment start-up of a component mounting device according to an embodiment. [Figure 22] 1 is a flowchart showing an example of an operation procedure at the start of production of a component mounting device according to an embodiment. [Figure 23] 10 is a flowchart showing an example of an operation procedure during calibration of the component mounting device according to the embodiment. [Figure 24] 1 is a flowchart showing an example of an origin adjustment process procedure of a component mounting device according to an embodiment; [Figure 25] 1 is a flowchart showing an example of an origin adjustment process procedure of a component mounting device according to an embodiment; [Figure 26]A diagram explaining the origin adjustment processing procedure [Figure 27] FIG. 10 is a diagram illustrating an image analysis process of an image captured by a component imaging unit. [Figure 28] Diagram explaining how to detect broken needles DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, with reference to the drawings as appropriate, detailed descriptions of each embodiment specifically disclosing the component supply device, calibration method, and component supply system according to the present disclosure will be described in detail. However, more detailed descriptions than necessary may be omitted. For example, detailed descriptions of well-known matters or redundant descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter recited in the claims.

[0012] The configuration of a component mounting device 1 according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a plan view showing a schematic configuration of the component mounting device 1 according to an embodiment. The component mounting device 1 includes a component supply device 2 and a component mounting unit 7.

[0013] The component supply device 2 is a device that supplies various components to the component mounting unit 7. The component mounting unit 7 is a mechanism that mounts the components supplied from the component supply device 2 onto a board 9. In the following drawings, the X and Y directions are directions that are perpendicular to each other in a horizontal plane. The Z direction is the height direction (up and down direction) that is perpendicular to the X and Y directions.

[0014] The component supply device 2 includes a plurality of different types of component supply devices capable of supplying various components to be mounted on the substrate 9. As an example, the component supply device 2 in this embodiment is a first component supply device 3 capable of supplying dies DI1, which are components cut out from the wafer W1, and a second component supply device 5 capable of supplying components stored or contained in a tray feeder, stick feeder, tape feeder, or the like. Note that the first component supply device 3 and the second component supply device 5 described above are merely examples and are not limited to these. The component supply device 2 in this embodiment may be realized by the first component supply device 3 capable of supplying at least dies DI1.

[0015] Here, the die DI1 is a part formed in a substantially rectangular parallelepiped or cubic shape, and has a first surface and a second surface opposite to the first surface.

[0016] The component mounting unit 7 includes a mounting head 11 that mounts components on the board 9, and a head movement mechanism 13 that moves the mounting head 11. The mounting head 11 is provided so that it can move in horizontal directions (X and Y directions) by the head movement mechanism 13. The head movement mechanism 13 is, for example, a Cartesian coordinate table having an X-axis table 13A and a Y-axis table 13B. The X-axis table 13A allows the mounting head 11 to move in the X direction. The Y-axis table 13B allows the mounting head 11 to move in the Y direction.

[0017] The component mounting device 1 is equipped with a component recognition camera 15 that captures images of components to be mounted on the board 9, and a board recognition camera 17 that captures images of the board 9 transported by the board transport unit 8 to a predetermined board transport position.

[0018] The component recognition camera 15 is provided between the board transport unit 8 and the component supply device 2, and captures images of the components from below (the -Z direction side) as they are transported by the mounting head 11 from a predetermined supply position to a predetermined component mounting position on the board 9. The component recognition camera 15 is controlled by the control unit C1, and outputs the captured images to the control unit C1 (see FIG. 20). The control unit C1 measures the orientation, posture, etc. of the components being transported by the mounting head 11 based on the captured images captured by the component recognition camera 15.

[0019] The board recognition camera 17 is configured integrally with the mounting head 11 and is moved horizontally (in the X and Y directions) by the head moving mechanism 13. The board recognition camera 17 is controlled by the control unit C1, and outputs an image of the board 9 on which components are to be mounted, taken from above (in the Z direction), to the control unit C1 (see FIG. 20). The control unit C1 measures the position, orientation, etc. of the board 9 transported by the board transport unit 8 based on the image taken by the board recognition camera 17. The control unit C1 controls the head moving mechanism 13 based on the measurement results of the orientation, orientation, etc. of the component and the measurement results of the position, orientation, etc. of the board 9, and causes the mounting head 11 to mount the component at a predetermined component mounting position on the board 9.

[0020] Next, the configuration of the first component supply device 3 will be described with reference to Fig. 2 and Fig. 3. Fig. 2 is a plan view showing a schematic configuration of the first component supply device 3 in an embodiment. Fig. 3 is a cross-sectional view taken along line A0-A0 of the carrier holding section 21 shown in Fig. 2. Note that, for ease of understanding, part of the top plate 19 of the first component supply device 3 shown in Fig. 2 is omitted from illustration.

[0021] 2 and 3, the first component supply device 3 in this embodiment includes a carrier holding unit 21, a pickup unit 23, and an ejector 25. The carrier holding unit 21 holds a carrier 27 that supports a wafer W1 from which a die DI1 has been cut out. The pickup unit 23 picks up the die DI1 held by the carrier 27 of the carrier holding unit 21.

[0022] The pickup unit 23, which is an example of a pickup section, sucks and holds the die DI1 pushed up onto the carrier holding section 21 by the ejector 25. The ejector 25 pushes the die DI1 held by the carrier holding section 21 from below (the -Z direction side) toward the pickup unit 23. The ejector 25 is controlled by an ejector control section C5, and pushes up the die DI1 upward (the Z direction side). Here, the carrier 27 is an adhesive sheet that has elasticity and adhesive force and adheres and holds the wafer W1 by its adhesive force.

[0023] In the first component supply device 3, a wafer W1 from which a die DI1 has been cut out is housed in a magazine 29 with the wafer W1 held by a carrier 27. The magazine 29 is provided, for example, outside (on the +Y direction side) the carrier holding unit 21. The carrier 27 in the magazine 29 is transported by a carrier transport unit 31 toward the carrier holding unit 21. The transported carrier 27 is held by the carrier holding unit 21.

[0024] <Carrier holding part> Fig. 4 is a plan view showing a schematic configuration of carrier holding section 21. Fig. 5 is a plan view showing a schematic configuration of carrier holding section 21 in a state where carrier 27 is not being held. As shown in Figs. 4 and 5, carrier holding section 21 in this embodiment is provided so as to be movable in the horizontal direction. Carrier holding section 21 has a holder movement mechanism 33 that moves carrier holding section 21 (specifically, movement base 37, which will be described later).

[0025] The holder movement mechanism 33 moves the carrier holder 21 in one direction (Y direction). The holder movement mechanism 33 has, for example, a motor 33A, a feed screw 33B, and a guide rail 33C. The feed screw 33B is controlled by the pickup control unit C2 (see FIG. 20), and linearly moves the carrier holder 21 in the Y direction by the rotational motion of the motor 33A. The feed screw 33B is provided to extend in the Y direction. The guide rail 33C supports the carrier holder 21 so that it can slide in the Y direction. The guide rail 33C is provided to extend in the Y direction, for example, and supports both X-direction end portions of the carrier holder 21.

[0026] The carrier holding unit 21 has a holding unit main body 35 that holds the carrier 27, and a moving base 37 that supports the holding unit main body 35. The moving base 37 is a base member that is connected to the feed screw 33B and is movable in the Y direction.

[0027] <Ejector> Fig. 6 is a plan view showing a schematic configuration of the ejector 25 according to the embodiment. Although the example shown in Fig. 6 shows an example having a plurality of ejectors 25A and 25B, the number of ejectors provided in the ejector 25 may be one or more.

[0028] Each of the multiple ejectors 25A, 25B is selectively controlled by an ejector control unit C5 based on, for example, the type of component carried on the carrier 27. Each of the multiple ejectors 25A, 25B is configured to be movable in the Y direction by a selection unit 155.

[0029] As shown in FIG. 3, the ejector 25 is formed to extend in the vertical direction (Z-axis direction) and is configured to be able to be raised and lowered by a needle lifting unit 156, which is an example of a lifting unit. This needle lifting unit 156 is provided for each ejector and is controlled by an ejector control unit C5 to lift and lower each ejector. Specifically, the ejector 25A is raised and lowered by the needle lifting unit 156A. The ejector 25B is raised and lowered by the needle lifting unit 156B.

[0030] Each of the ejectors 25A and 25B is provided on a base member 157. The base member 157 is movable in the X direction by an ejector movement mechanism 159. The ejector movement mechanism 159 has a motor 159A, a feed screw 159B, and a guide rail 159C, and moves the base member 157 in one direction (the X direction).

[0031] Feed screw 159B is provided to extend in the X direction, and allows base member 157 to move in the X direction by rotational motion of motor 159A. Guide rails 159C support both ends of base member 157 in the Y direction and also support base member 157 so that it can slide in the X direction.

[0032] Fig. 7 is a plan view showing a schematic configuration of the holding portion main body 35. Fig. 8 is a plan view showing a schematic configuration of the carrier 27 held by the carrier holding portion 21.

[0033] 7, the holder body 35 has an opening 45 penetrating in the vertical direction (Z direction). The holder body 35 holds the carrier 27 so as to close and cover the opening 45. The holder body 35 has a pressing member 39 and a support base 41. The opening 45 is formed according to the shape of the wafer W1 held by the carrier 27 and is formed larger than the wafer W1. The opening 45 is formed, for example, in a circular shape larger than the circular wafer W1.

[0034] The pressing member 39 is a member that presses the annular member 43 downward, and enables the carrier holding portion 21 to hold the carrier 27.

[0035] The support base 41 is connected to the moving base 37 below the pressing member 39. The support base 41 has carrier guides 41A that guide the movement of the carriers 27 transported by the carrier transport unit 31 (see FIG. 2). The carrier guides 41A are formed, for example, at both ends of the support base 41 in the X direction, extending in the Y direction, and regulate the movement of the carriers 27 in the X direction. The support base 41 also has support portions 41B that are formed to extend upward (in the Z direction) and can maintain the expanded state of the carriers 27 when the support base 41 is lowered. An opening 45 is formed inside the support portion 41B. Here, the support portion 41B in the embodiment is formed in an annular shape.

[0036] 8, the carrier 27 held by the holder main body 35 holds the cut wafer W1. In this embodiment, the outer edge of the carrier 27 is held by an annular member 43.

[0037] Here, the procedure for holding carrier 27 by carrier holding unit 21 will be described with reference to Fig. 9. Fig. 9 is a diagram for explaining the procedure for holding carrier 27 by carrier holding unit 21. Note that carrier holding unit 21 shown in Fig. 9 is a cross-sectional view taken along A1-A1 of the carrier holding unit shown in Fig. 5.

[0038] 2 is transported by the carrier transport unit 31 toward the carrier holding unit 21, and is inserted into the space between the pressing member 39 and the support base 41, as shown in FIG. 9. As a result, the annular member 43 of the carrier 27 covers the opening 45 and is supported by the support base 41.

[0039] The support base 41 is connected via a rod 49 to a drive unit 47 that can raise and lower the support base 41 in the vertical direction (Z direction). The support base 41 is lowered integrally with the rod 49 by the drive unit 47 with the annular member 43 of the carrier 27 supported by the support base 41. When the pressing member 39 is lowered below the upper end of the support unit 41B, the carrier 27 is expanded in the horizontal direction by the support unit 41B and is held in this expanded state by the carrier holding unit 21. As a result, in the first component supply device 3, the carrier 27 is expanded, widening the gap between the dies DI1 cut out from the wafer W1, making it easier for the pickup unit 71 to pick up the dies DI1.

[0040] 10 is a cross-sectional view taken along the lines A2-A2 and A3-A3 in a state where the carrier 27 is held by the carrier holding portion 21. FIG.

[0041] 5, the moving base 37 has an opening 51 penetrating in the vertical direction (Z direction) and is provided below (in the -Z direction) the opening 45 of the holding unit main body 35. The opening 51 is, for example, larger than the opening 45 of the holding unit main body 35. The ejector 25 raises the needle ND in the carrier 27 arranged above the moving base 37 through the opening 51. The ejector 25 pushes the die DI1 up from below with the raised needle ND and pushes it toward the pickup unit 23 (see FIG. 3).

[0042] The moving base 37 in this embodiment has a through-hole 52 that penetrates in the vertical direction at a position outside the opening that is horizontally outward of the opening 51. The first component supply device 3 performs calibration in the horizontal direction (i.e., the X and Y directions) between the pickup unit 23 and the ejector 25 through the through-hole 52. The through-hole 52 is, for example, an opening provided in the moving base 37. Note that the through-hole 52 is not limited to an opening, and may be configured by cutting out an edge of the moving base 37. The through-hole 52 is provided at the inner end (-Y direction end) of the moving base 37.

[0043] The moving base 37 is provided so that the holding unit main body 35 (see FIG. 7) can be turned in a horizontal plane, and is provided with a turning gear 53 that turns the holding unit main body 35. As shown in FIG. 10, the turning gear 53 turns (rotates) in mesh with a driven gear 55 provided on the holding unit main body 35 when a motor 54 connected to the turning gear 53 so as to be able to transmit power therebetween rotates.

[0044] The movable base 37 has a plurality of support rollers 57 that rotatably support the holder main body 35 (see FIG. 7) in a horizontal plane. Each of the support rollers 57 is provided at the four corners of the movable base 37 and extends upward on the movable base 37 to rotate the holder main body 35. As shown in FIG. 10, the support rollers 57 rotatably support a swivel guide 59 that extends downward on the holder main body 35. As shown in FIGS. 5 and 10, the support rollers 57 are provided outside the swivel guide 59 that extends circumferentially on the outer periphery of the opening 45.

[0045] The through-holes 52 are formed so that at least a portion of the through-holes 52 penetrates in the vertical direction even when the holder body 35 is rotated by the rotation gear 53. Specifically, the outer edge of the through-holes 52 is formed horizontally outward of the rotation trajectory of the outer edge of the holder body 35. This allows the first component supply device 3 to calibrate the position between the pickup unit 23 and the ejector 25 in the horizontal direction (i.e., the X and Y directions) even when the holder body 35 is rotated.

[0046] The measurement chip table 34 will be described with reference to Fig. 11. Fig. 11 is a diagram for explaining the measurement chip table 34.

[0047] The moving base 37 is provided with a holding head changer 61. The holding head changer 61 is provided so that the component holding head 77 (see FIG. 3) of the pickup unit 23 can be replaced.

[0048] A measurement chip table 34 , which is an example of a mounting stage, is provided on the moving base 37 and adjacent to the holding head changer 61 .

[0049] The holding head changer 61 includes one or more component holding heads 77 attached to the head holding portion 85, and one or more adjustment heads 77A (see Figure 17) attached to the head holding portion 85 and used for the origin adjustment process of the needle ND.

[0050] The measurement chip table 34 holds one or more measurement chips DT. The measurement chip table 34 shown in Fig. 11 can hold each of the three measurement chips DT, but it is sufficient if it can hold one or more measurement chips DT.

[0051] The measuring chip DT, which is an example of a measuring component, is a chip used for calibrating the needle ND in the height direction. The measuring chip DT may be a chip of a type corresponding to each type of one or more needles ND possessed by the ejector 25. When the origin adjustment process starts, the measuring chip DT is taken out from the measuring chip table 34 by the pickup unit 71 and transported to above the ejector 25. Furthermore, when the origin adjustment process ends, the measuring chip DT is taken out from above the ejector 25 by the pickup unit 71 and transported to the measuring chip table 34.

[0052] Fig. 12 is an enlarged cross-sectional view of the ejector. Note that the number of needles ND that can be attached to the ejector 25 shown in Fig. 12 is an example and is not limited to this.

[0053] The ejector 25 includes one or more needles ND, one or more needle holes NH, and a needle lifting unit 156 that moves each of the needles ND up and down.

[0054] Each of the multiple needle holes NH is provided corresponding to the arrangement position of one or more needles ND provided in the ejector 25, and enables the needle ND raised by the needle lifting unit 156 to protrude above the ejector 25. This enables the needle ND to push up the die DI1 or measurement chip DT placed on the upper surface of the ejector 25. Here, the upper surface height H2 shown in FIG. 12 indicates the height direction of the upper surface of the ejector 25.

[0055] The needle lifting unit 156 is controlled by an ejector control unit C5 (see FIG. 20) and moves each needle ND up and down.

[0056] <Holding head drive mechanism> The holding head drive mechanism 87 will now be described. Fig. 13 is a plan view of the pickup unit 23. Fig. 14 is a schematic side view of the pickup section 71. The pickup unit 23 shown in Fig. 13 is a plan view of the pickup unit 23 with the cover 67 shown in Fig. 2 removed. Fig. 14 is a side view showing the schematic configuration of the pickup section 71 with the component holding head 77 rotated in the -Z direction connected to the moving piece 123.

[0057] As shown in Figure 13, the pickup unit 23 has a holding head drive mechanism 87 in the cover 67 (see Figure 2). The holding head drive mechanism 87 is a cam mechanism. The holding head drive mechanism 87 has a cam drive motor 107, a first cam 109, and a second cam 111.

[0058] The cam drive motor 107 rotates each of the first cam 109 and the second cam 111. The cam drive motor 107 rotates the first cam 109, thereby rotating the first lever 113 around the support shaft 115 as the central axis. The cam drive motor 107 rotates the second cam 111, thereby rotating the second lever 117.

[0059] The head holding unit 85 is provided with a guide member 129 that guides the radial movement of the component holding head 77 connected to the first rotating shaft 81 (i.e., the radial direction with the first rotating shaft 81 as the central axis). The guide member 129 is provided with a cam follower 131 that radially engages with the moving piece 123. The cam follower 131 moves along a cylindrical cam 132 when the rotating member 83 rotates.

[0060] The guide member 129 is provided to bias the component holding head 77 radially inward by an elastic member 133 such as a spring. Except when picking up the die DI1 or the measurement chip DT, and when transferring the die DI1 to the relay component holding head 89, the turning radius R1 of the component holding head 77 is constant.

[0061] When the component holding head 77 faces up or down, the cam follower 131 is connected to the moving piece 123 and moves the component holding head 77 up or down together with the moving piece 123.

[0062] The relay component holding head 89 is a turning mechanism that is turned by the relay unit 73 (see FIG. 3). This turning mechanism has a second turning shaft 93 that is turned by a motor 92, and a turning member 95 that turns in conjunction with the rotation of the second turning shaft 93. The second turning shaft 93 turns the relay unit 73 in the up-down direction. The turning member 95 is formed, for example, in a disk shape.

[0063] <Holding head changer> 15 is a side view showing a schematic configuration of the holding head changer 61. The holding head changer 61 includes a storage section 135 for storing the component holding head 77, and a stopper 137.

[0064] The storage section 135 stores, for example, each of the multiple types of component holding heads 77. The storage section 135 is formed in a substantially rectangular shape and stores each of the multiple component holding heads 77 along the longitudinal direction (X direction).

[0065] The stopper 137 partially covers the upper side (Z direction) of the storage unit 135. The stopper 137 has an opening (not shown) that penetrates in the vertical direction. The stopper 137 allows the component holding head 77 stored in the storage unit 135 to be inserted or removed by driving a stopper driving unit 139. The holding head changer 61 has an elevator unit 145 that moves the storage unit 135 in the vertical direction. The elevator unit 145 raises the storage unit 135 in the Z direction when replacing the component holding head 77 attached to the head holding unit 85 with one of the component holding heads 77 stored in the storage unit 135.

[0066] 16 is a diagram illustrating the positional relationship between the ejector 25 and the through-hole 52 during calibration. The ejector 25 and the through-hole 52 shown in FIG. 16 are cross-sectional views taken along the line A4-A4 shown in FIG.

[0067] In executing the origin adjustment process for the ejector 25, the ejector control unit C5 moves the ejector 25 to be calibrated to below the penetrating portion 52, and then drives the needle lifting unit 156 to raise the tip side of the ejector 25 (i.e., the side where the needle ND is housed) to a height where it penetrates the penetrating portion 52. This allows the component imaging unit 75 to image the ejector 25 and the measurement tip DT placed on the ejector 25 through the penetrating portion 52. Note that here, the ejector control unit C5 may simply move the ejector 25 to below the penetrating portion 52 without raising the ejector 25 to a height where it penetrates the penetrating portion 52.

[0068] <Pickup unit> The pickup unit 23 will now be described. FIG. 17 is a cross-sectional view of the pickup unit 23 shown in FIG. 13 taken along the line A5-A5. FIG. 18 is a cross-sectional view of the pickup unit 23 shown in FIG. 13 taken along the line A5-A5. Note that the pickup unit 23 shown in FIG. 18 does not show the component holding head 77 and the swivel member 83 for ease of understanding. Each of FIGS. 17 and 18 shows the pickup unit 23 during calibration of the needle ND, and illustrates an example in which the measurement tip DT is placed on the ejector 25 that has been raised above the penetrating portion 52 (not shown) or moved below the penetrating portion 52.

[0069] The pickup unit 23 is provided so as to be movable on the top board 19 by a unit moving mechanism 63 (see FIG. 1). The pickup unit 23 is provided so as to be movable in one direction (for example, the X direction).

[0070] The unit movement mechanism 63 is configured to have, for example, a motor 63A (see FIG. 2), a feed screw 63B, and a guide rail 63C. The feed screw 63B moves the pickup unit 23 linearly in the X direction by rotational motion caused by the motor 63A. The feed screw 63B is provided to extend in the X direction. The guide rail 63C supports the pickup unit 23 so that it can slide in the X direction. The guide rail 63C is provided on the top plate 19, for example, to extend in the X direction, and supports both ends of the pickup unit 23 in the Y direction.

[0071] The top plate 19 has an opening 65 (see FIG. 1) that penetrates in the vertical direction (Z direction) and extends in the X direction. The pickup unit 23 picks up the die DI1 or the measurement chip DT held by the carrier 27 through the opening 65. An opening 69 that penetrates in the vertical direction is provided on the top surface of a cover 67 that forms the outer shell of the pickup unit 23. The pickup unit 23 delivers the picked-up die DI1 to the mounting head 11 (see FIG. 1) through this opening 69. At this time, the mounting head 11 receives the die DI1 from the pickup unit 23 under the control of a control unit C1 (see FIG. 20) based on an image of the die DI1 captured by, for example, a board recognition camera 17 (see FIG. 1).

[0072] As shown in FIG. 3, the pickup unit 23 includes a pickup section 71, a relay section 73, and a component imaging section 75.

[0073] <Pickup section> The pickup unit 71 picks up the die DI1 held on the carrier 27 or the measurement chip DT placed on the ejector 25. In other words, the pickup unit 71 picks up the die DI1 or measurement chip DT placed on the ejector 25 or pushed up by the needle ND of the ejector 25. The pickup unit 71 has a component holding head 77 that can hold the die DI1 or measurement chip DT, and sucks and holds the die DI1 or measurement chip DT at the tip end (lower end) of the component holding head 77, and moves the die DI1 or measurement chip DT away from the carrier 27 or the ejector 25.

[0074] The component holding head 77 is rotated in the radial direction around a first rotation axis 81 by the moving mechanism 79. After picking up a die DI1 while facing downward (-Z direction), the component holding head 77 is rotated 180° around the first rotation axis 81 by the moving mechanism 79 so that it faces upward (Z direction) and repeatedly transfers the die DI1 held at its tip to the mounting head 11 (see FIG. 3).

[0075] For example, when the first surface of the die DI1 held by the carrier 27 faces upward (Z direction), the component holding head 77 picks up the die DI1 facing downward (-Z direction) with the first surface facing upward (Z direction). When the component holding head 77 is rotated 180° while suction-holding the first surface of the die DI1, the component holding head 77 delivers the die DI1 facing upward (Z direction) with the second surface facing upward (Z direction) to the mounting head 11.

[0076] The die DI1 is picked up from the carrier 27 by the component holding head 77 with its first surface facing up, and after the component holding head 77 is rotated to change its orientation so that its second surface faces up, this second surface is sucked and held (i.e., handed over) by the mounting head 11. The die DI1 is held by its second surface by the mounting head 11, and is mounted so that its first surface is in contact with the top surface of the substrate 9. In other words, the die DI1 is a component that is supplied in cases such as flip-chip mounting.

[0077] The moving mechanism 79 is a rotating mechanism that rotates the component holding head 77. The moving mechanism 79 has a first rotating shaft 81 that rotates by a motor 80, and a rotating member 83 (see FIG. 14) that rotates in conjunction with the rotation of the first rotating shaft 81. The first rotating shaft 81 rotates the component holding head 77 in the vertical direction (Z direction). The rotating member 83 is, for example, a plate-like member that extends in the vertical direction (Z direction).

[0078] The component holding head 77 is provided on the rotating member 83, for example, at an end (a radially outer end) of the first rotating shaft 81 that is closer to the center axis of the first rotating shaft 81. The pickup unit 71 has a plurality of component holding heads 77. At least one pair of the component holding heads 77 among the plurality of component holding heads 77 is configured so that the component holding heads 77 face in opposite directions. For example, the pickup unit 71 has a pair of component holding heads 77, where one component holding head 77 and the other component holding head 77 face in opposite directions. Specifically, the tip of one component holding head 77 faces in the opposite direction by approximately 180° relative to the tip of the other component holding head 77. This allows the first component supply device 3 to pick up a die DI1 from the carrier 27 with one component holding head 77 facing downward, while the other component holding head 77 faces upward and transfers the picked-up die DI1 to the mounting head 11.

[0079] The component holding head 77 is detachably mounted on a head holding unit 85 (see FIG. 14 ) and is replaced depending on the type of die DI1 to be picked up (for example, the size, weight, etc. of the die DI1). The component holding head 77 is connected to a swiveling member 83 via the head holding unit 85 and swivels together with the swiveling member 83.

[0080] The component holding head 77 also has a holding head driving mechanism 87 that moves the component holding head 77 in the radial direction away from the central axis of the first rotation shaft 81 .

[0081] The relay unit 73 (see FIG. 3 ) changes the face of the die DI1 held by the component holding head 77 to the other face. For example, when the first face of the die DI1 is to be mounted on the substrate 9, the relay unit 73 receives the die DI1 with its first face held by the component holding head 77, then suction-holds the second face of the die DI1, and hands it over to the mounting head 11. As a result, the mounting head 11 can transport the die DI1 onto the substrate 9 while suction-holding the second face of the die DI1, and mount the die DI1 so that its first face comes into contact with the top surface of the substrate 9.

[0082] <Parts imaging unit> The component imaging unit 75, which is an example of an imaging unit, images the die DI1 held by the carrier 27 or the measurement chip DT placed on the ejector 25. The component imaging unit 75 is configured integrally with the pickup unit 23 and is configured to be movable together with the pickup unit 23 by the unit movement mechanism 63. The component imaging unit 75 has an imaging unit main body 97 extending horizontally and a lens barrel 99 extending vertically connected to it.

[0083] The lens barrel 99 includes an illumination unit 101, a half mirror 103, and a lens 105 inside the lens barrel 99. The illumination light from the illumination unit 101 is reflected by the half mirror 103 and illuminates the die DI1 or measurement chip DT located below (in the -Z direction).

[0084] The half mirror 103 transmits the illumination light from the illumination unit 101, which is emitted from above (Z direction), downward (-Z direction), enabling it to illuminate the die DI1 or measurement chip DT located below. The component imaging unit 75 receives, with the image sensor 98, the light that is reflected by the half mirror 103 from the die DI1 or measurement chip DT (i.e., the subject) illuminated by the illumination unit 101.

[0085] The image sensor 98 is a solid-state image sensor that converts an optical image formed on the imaging surface into an electrical signal. The component imaging unit 75 outputs the captured image of the die DI1 or the measurement chip DT to the control unit C1.

[0086] Next, the component mounting system 1000 according to this embodiment will be described with reference to Fig. 19. Fig. 19 is a block diagram showing an example of the internal configuration of the control computer P1. The component mounting system 1000 includes at least one control computer P1 and at least one component mounting device 1. It goes without saying that the internal configuration shown in Fig. 2 is an example and is not limited to this.

[0087] A management computer P1, which is an example of a computer, is connected to the component mounting apparatus 1 so as to be able to communicate data with the component mounting apparatus 1, and controls the component mounting apparatus 1. The management computer P1 includes a communication unit P10, a management control unit P11, a management memory unit P12, an input unit P13, and a display unit P14.

[0088] The communication unit P10 is connected to at least one component mounting device 1 via the communication network LN so as to be able to communicate data with them. Based on production information relating to the production process input or set in advance by an operator, the communication unit P10 transmits execution commands to the corresponding component mounting device to execute the production process generated by the management control unit P11. The production process here refers to the various processes for producing a board 9 on which various components supplied by the component supply device 2 are mounted.

[0089] The management control unit P11 is configured using, for example, a CPU (Central Processing Unit) or FPGA (Field Programmable Gate Array), and performs various processes and controls in cooperation with the management storage unit P12. Specifically, the management control unit P11 references the programs and data stored in the management storage unit P12 and executes the programs to realize the functions of each unit.

[0090] When the management computer P1 generates calibration data for each needle ND provided in the component mounting device 1, the management computer P1 acquires an image of the needle ND for which calibration data is to be generated from the component mounting device 1, and uses the acquired image to perform the origin adjustment procedure (i.e., generation of calibration data) shown in Figures 24 to 25 described below.

[0091] Furthermore, when the management computer P1 manages the calibration data for each needle ND provided in the component mounting device 1, the management computer P1 stores and manages the calibration data P12B transmitted from the component mounting device 1 in the management memory unit P12. The management computer P1 references and extracts the calibration data P12B stored in the management memory unit P12 based on a control command requesting the calibration data P12B transmitted from the component mounting device 1. The management control unit P11 outputs the extracted calibration data P12B to the communication unit P10, and causes it to be transmitted to the component mounting device 1 that sent the control command.

[0092] The calibration data P12B here is data for adjusting the origin in the height direction of the needle ND provided in the ejector 25, and is generated for each needle ND.

[0093] The management memory unit P12 has, for example, a RAM (Random Access Memory) as a work memory used when executing each process of the management control unit P11, and a ROM (Read Only Memory) that stores programs and data that define the operation of the management control unit P11. The RAM temporarily stores data or information generated or acquired by the management control unit P11. The ROM has written therein programs that define the operation of the management control unit P11. The management memory unit P12 stores production data P12A.

[0094] The production data P12A is data for producing the board 9, and is generated for each board 9. The calibration data P12B is generated for each needle ND provided in the component mounting device 1, and is data that can be used to adjust the origin of the needle ND in the height direction (Z direction), and is data that indicates, for example, the amount of positional deviation of the needle ND in the height direction.

[0095] The input unit P13 is a user interface that accepts operations by the worker, and is configured using, for example, a mouse, keyboard, touch panel, touch pad, pointing device, etc. The input unit P13 outputs a signal based on the worker's operation to the management control unit P11.

[0096] The display unit P14 is configured using a display such as an LCD (Liquid Crystal Display) or an organic EL (Electroluminescence) display.

[0097] Next, the internal configuration of the component mounting device 1 will be described with reference to Fig. 20. Fig. 20 is a block diagram showing an example of the internal configuration of the component mounting device 1. The component mounting device 1 is configured to include at least a communication unit C0, a control unit C1, and a memory unit M1.

[0098] The communication unit C0 is connected to at least one management computer P1 via a communication network LN so as to be able to communicate data with the management computer P1. The communication unit C0 outputs execution commands, production data, calibration data P12B, etc. sent from the management computer P1 to the control unit C1.

[0099] The control unit C1, which is an example of a correction unit, is configured using, for example, a CPU or FPGA and performs various processes and controls in cooperation with the memory unit M1. Specifically, the control unit C1 references programs and data stored in the memory unit M1 and executes the programs to realize the functions of each unit. Note that the units referred to here are the pickup control unit C2, mounting head control unit C3, calculation unit C4, and ejector control unit C5. Furthermore, the control unit C1 realizes the functions of each of these units to realize origin adjustment processing in the height direction for each needle ND.

[0100] In addition, the control unit C1 controls various driving units and mechanisms (e.g., driving unit 47, holding unit moving mechanism 33, motor 54, stopper driving unit 139, lifting unit 145, etc.) that constitute or drive the substrate transport unit 8, carrier transport unit 31, and carrier holding unit 21.

[0101] The pickup control unit C2 controls the various parts and mechanisms that make up the pickup unit 23. The various parts and mechanisms that make up the pickup unit 23 include, for example, the component imaging unit 75, the unit moving mechanism 63, the moving mechanism 79, and the holding head driving mechanism 87.

[0102] The mounting head control unit C3 controls a head moving mechanism 13 that moves the mounting head 11, and a board recognition camera 17 that is configured integrally with the mounting head 11 and that captures an image of the board 9.

[0103] The calculation unit C4 calculates the position of the pickup unit 23 in the horizontal direction (i.e., the X direction and the Y direction) based on the captured image captured by the component imaging unit 75. The calculation unit C4 also calculates the position of the board 9 in the horizontal direction (i.e., the X direction and the Y direction) based on the captured image captured by the board recognition camera 17. The calculation unit C4 also counts the number of times the needle ND is raised to the first height and the second height performed by the needle lifting unit 156, and calculates the amount of positional deviation of the needle ND in the height direction based on the counted number of times the needle ND is raised. The calculation unit C4 outputs the calculated amount of positional deviation of the needle ND in the height direction to the ejector control unit C5.

[0104] The ejector control unit C5 controls an ejector moving mechanism 159 that moves the ejector 25 (specifically, the needle ND) in the horizontal direction, and a needle lifting unit 156 that moves each of the one or more needles ND provided in the ejector 25 up and down. Furthermore, the ejector control unit C5 drives the needle lifting unit 156 based on the amount of positional deviation in the height direction of the needle ND calculated by the calculation unit C4, and executes an origin adjustment process (i.e., calibration) that adjusts (aligns) the height position of the needle ND to the origin position H0.

[0105] The memory unit M1 has, for example, a RAM as a work memory used when executing each process of the control unit C1, and a ROM for storing programs and data that define the operation of the control unit C1. The RAM temporarily stores data or information generated or acquired by the control unit C1. The ROM stores programs that define the operation of the control unit C1. The memory unit M1 stores each piece of position information calculated by the calculation unit C4 and calibration data for each needle ND generated by the calculation unit C4.

[0106] In the following description, various operation procedures executed by the component mounting apparatus 1 and the origin adjustment process of the needle ND executed within these various operation procedures (that is, the origin adjustment process) will be described in detail.

[0107] 21 is a flowchart showing an example of an operation procedure at the time of equipment startup of the component mounting device 1 according to the embodiment. The equipment startup here refers to, for example, the timing at which a test run is performed after the component mounting device 1 is delivered to a user (operator), or the timing at which a test run is performed after the component mounting device 1 is relocated.

[0108] When the power is turned on by an operator at the time of equipment startup (St11), the component mounting device 1 enters a calibration mode and starts adjusting the first component supply device 3 in order to perform origin adjustment processing for each of one or more needles ND provided in the ejector 25 (St12).

[0109] After adjusting the first component supply device 3, the component mounting device 1 performs an origin adjustment process for the needle ND height (St60). The origin adjustment process for the needle ND height shown in step St60 will be described later with reference to FIGS. 24 and 25.

[0110] Here, the position of the ejector 25 in the origin adjustment process of the needle ND, which is executed after the process of step St12, is not limited to a position below the through-hole 52 or a position penetrating the through-hole 52, and may be, for example, inside the opening 45. In such a case, the measuring tip DT is placed on the upper surface of the ejector 25 located inside the opening 45. Furthermore, the component imaging unit 75 is moved by the unit moving mechanism 63 to a position where it can image the measuring tip DT placed on the upper surface of the ejector 25 located inside the opening 45, and images the measuring tip DT from above. As described above, the component mounting device 1 during equipment startup can similarly execute the origin adjustment process of the needle ND height shown in step St60 even at a position other than the through-hole 52 (i.e., inside the opening 45).

[0111] The component mounting apparatus 1 determines whether an error is output in the process of step St60 (St13).

[0112] When it is determined in the process of step St13 that an error has been output (St13, YES), the component mounting device 1 stops the origin adjustment process and generates and outputs an error notification (St14). Note that this error notification may be displayed on a monitor (not shown) provided in the component mounting device 1, or may be transmitted to the management computer P1 and output by the display unit P14 of the management computer P1.

[0113] If it is determined in the process of step St13 that no error has been output (St13, NO), the component mounting device 1 ends the origin adjustment process. The component mounting device 1 stores the height-direction positional deviation amount for each needle ND calculated by the origin adjustment process in the memory unit M1 for each needle ND. Note that the component mounting device 1 may generate calibration data that associates information on the calculated height-direction positional deviation amount for each needle ND with identification information that can identify the corresponding needle ND, and transmit the generated calibration data to the management computer P1 for storage.

[0114] 22 is a flowchart showing an example of an operation procedure at the start of production of the component mounting apparatus 1 according to the embodiment. The start of production here refers to the timing at which production of the board 9 on which components are mounted starts.

[0115] The component mounting device 1 starts production of the board 9 based on the operation by the operator or a control command sent from the management computer P1 (St21).

[0116] The component mounting device 1 measures the position of the component holding head 77 (St22). Specifically, the component mounting device 1 uses the board recognition camera 17 to capture an image of the tip of the component holding head 77 facing in the Z direction. The component mounting device 1 detects the component holding head 77 from the captured image and calculates the difference (i.e., the amount of horizontal positional deviation) between the detected position of the tip of the component holding head 77 and the reference position (origin position) of the component holding head 77 stored in the memory unit M1. The component mounting device 1 adjusts the position of the component holding head 77 based on the calculated difference.

[0117] The component mounting apparatus 1 replaces the component holding head 77 provided in the pickup unit 23 with an adjustment head 77A (see FIG. 17) for origin adjustment processing held by the holding head changer 61 (St23).

[0118] The component mounting device 1 captures an image of the tip of the adjustment head 77A facing in the Z direction using the board recognition camera 17. The component mounting device 1 detects the adjustment head 77A from the captured image and calculates the difference (i.e., the amount of positional deviation in the horizontal direction) between the position of the detected tip of the adjustment head 77A and the reference position (origin position) of the adjustment head 77A stored in the memory unit M1. The component mounting device 1 adjusts the position of the adjustment head 77A based on the calculated difference (St24).

[0119] After adjusting the position of the adjustment head 77A, the component mounting apparatus 1 uses the component imaging unit 75 to capture an image of the upper surface of the ejector 25. Here, the component mounting apparatus 1 uses the component imaging unit 75 to capture an image of the ejector 25 through the opening 45, or to capture an image of the ejector 25 positioned below the through-hole 52 or having penetrated the through-hole 52. The component mounting apparatus 1 detects the ejector 25 from the captured image and calculates the difference (i.e., the amount of positional deviation in the horizontal direction) between the detected center position of the ejector 25 and the reference position (origin position) of the ejector 25 stored in the memory unit M1. The component mounting apparatus 1 adjusts the position of the ejector 25 based on the calculated difference (St25).

[0120] After adjusting the first component supply device 3, the component mounting device 1 performs an origin adjustment process for the needle ND height (St60). The origin adjustment process for the needle ND height shown in step St60 will be described later with reference to FIGS. 24 and 25.

[0121] The component mounting apparatus 1 determines whether an error is output in the process of step St60 (St26).

[0122] When it is determined in the process of step St26 that an error has been output (St26, YES), the component mounting device 1 stops the origin adjustment process and generates and outputs an error notification (St27). Note that this error notification may be displayed on a monitor (not shown) provided in the component mounting device 1, or may be transmitted to the management computer P1 and output by the display unit P14 of the management computer P1.

[0123] On the other hand, if it is determined in the processing of step St26 that no error has been output (St26, NO), the component mounting apparatus 1 ends the origin adjustment processing and replaces the adjustment head 77A with the component holding head 77 (St28). The component mounting apparatus 1 then performs the processing of mounting the die DI1 onto the substrate 9 (St29).

[0124] Fig. 23 is a flowchart showing an example of an operation procedure during calibration of the component mounting apparatus 1 according to the embodiment. The calibration here refers to a predetermined timing of calibration that is executed during the production of the boards 9, and in the example shown in Fig. 23, it is the timing when the production of a predetermined number of boards 9 is completed, but it goes without saying that the calibration is not limited to this.

[0125] The component mounting device 1 starts production of the board 9 based on the operation by the operator or a control command sent from the management computer P1 (St41).

[0126] The component mounting device 1 resets the number k of produced boards (k: an integer equal to or greater than 0) (i.e., k = 0) (St42). The component mounting device 1 then transports the (k+1)th board 9 to a predetermined board loading position using the board transport unit 8, and mounts components on the board 9 (St43).

[0127] After all components have been mounted on the board 9, the component mounting apparatus 1 carries out the (k+1)th board using the board transport unit 8 (St44). The component mounting apparatus 1 increments the number k of produced boards by (k+1) (St45). The component mounting apparatus 1 determines whether the number k of produced boards after the increment is equal to a predetermined number N (N: an integer equal to or greater than 1) (St46).

[0128] When the component mounting device 1 determines in the process of step St46 that the number k of produced boards after the increment is equal to the predetermined number N (St46, YES), it adjusts the first component supply device 3 and then performs an origin adjustment process for the needle ND (St60). The origin adjustment process for the needle ND shown in step St60 will be described later with reference to FIGS. 24 and 25.

[0129] On the other hand, if the component mounting apparatus 1 determines in the process of step St46 that the number k of produced boards after the increment is not the predetermined number N (St46, NO), it returns to the process of step St43.

[0130] The component mounting apparatus 1 determines whether an error is output in the process of step St60 (St47).

[0131] When it is determined in the process of step St47 that an error has been output (St47, YES), the component mounting device 1 stops the origin adjustment process and generates and outputs an error notification (St48). Note that this error notification may be displayed on a monitor (not shown) provided in the component mounting device 1, or may be transmitted to the management computer P1 and output by the display unit P14 of the management computer P1.

[0132] On the other hand, if it is determined in the process of step St47 that an error has not been output (St47, NO), the component mounting apparatus 1 proceeds to the process of step St42.

[0133] Next, the origin adjustment process of the needle ND will be described with reference to Fig. 24 and Fig. 25. Fig. 24 is a flowchart showing an example of the procedure for the origin adjustment process of the component mounting device 1 according to the embodiment. Fig. 25 is a flowchart showing an example of the procedure for the origin adjustment process of the component mounting device 1 according to the embodiment.

[0134] The component mounting device 1 picks up one measurement chip DT placed on the measurement chip table 34 by suction holding it with the adjustment head 77A (St61), and transports the picked-up measurement chip DT onto the carrier 27 (St62).

[0135] The component mounting apparatus 1 raises the ejector 25 to a predetermined height (St63), and places the measurement chip DT at a predetermined position on the carrier 27 that corresponds to a predetermined measurement position on the ejector 25 (St64).

[0136] The component mounting device 1 rotates the rotating member 83 using the movement mechanism 79 to adjust the tip of the adjustment head 77A so that it faces the -Z direction (St65). The component mounting device 1 drives the unit movement mechanism 63 to move the component imaging unit 75 to a position where it can image the measurement chip DT placed at a predetermined position on the carrier 27 (i.e., on the ejector 25) (St66).

[0137] The component mounting device 1 drives the needle lifting unit 156 of the ejector 25 to adjust the height of the needle ND to the origin height H0 (see FIG. 26), which is the measurement start height (St67). The component mounting device 1 resets (i=0) the number of times the needle has been lifted by the needle lifting unit 156 to the current height of the needle ND (i: an integer equal to or greater than 0) (St68).

[0138] The component mounting device 1 increments (i+1) the number of times the needle has been raised by the needle lifting unit 156 to the current height of the needle ND (St69), and determines whether the number of times the needle has been raised after the increment i is equal to the upper limit number of times M (M: an integer greater than or equal to 1) (St70).

[0139] In the process of step St70, if it is determined that the incremented needle lift count i is equal to the upper limit number of lifts M (St70, YES), the component mounting device 1 generates and outputs an error notification (St71). In such a case, if the needle ND cannot push up the measuring tip DT even after being raised by the upper limit number of lifts M, the component mounting device 1 determines that the tip of the needle ND that pushes up the measuring tip DT may be worn down or broken due to wear, and generates an error notification. Note that this error notification may be displayed on a monitor (not shown) provided in the component mounting device 1, or may be sent to the management computer P1 and output on the display unit P14 of the management computer P1.

[0140] On the other hand, if the component mounting device 1 determines in the processing of step St70 that the number of needle rises i after the increment is not equal to the upper limit number of rises M (St70, NO), it raises the needle ND by a first height (e.g., 10 μm, 30 μm, 50 μm, etc.) using the needle lifting unit 156, and images the measurement chip DT using the component imaging unit 75 (St72).

[0141] The component mounting device 1 detects the outer shape or size of the measuring chip DT shown in the captured image captured by the component imaging unit 75. The component mounting device 1 compares the outer shape or size of the detected measuring chip DT with the outer shape or size of the measuring chip DT previously stored in the memory unit M1 (such as the size of the measuring chip DT in the X and Y directions), and calculates the difference in outer shape or size between the detected measuring chip DT and the recorded measuring chip DT. Based on the calculation result, the component mounting device 1 determines whether the difference is equal to or greater than a predetermined area or size (i.e., whether there is a change in the captured measuring chip DT) (St73).

[0142] If the component mounting device 1 determines in the processing of step St73 that the difference is equal to or greater than the predetermined area or predetermined size (St73, YES), it adjusts the height of the needle ND to a height corresponding to the number of times the needle has risen (i-1) (St74).The component mounting device 1 lowers the needle ND by the needle lifting unit 156 by a first height so that the height corresponds to the number of times the needle has risen (i-1).

[0143] On the other hand, when it is determined in the process of step St73 that the difference is not equal to or greater than the predetermined area or the predetermined size (St73, NO), the component mounting apparatus 1 returns to the process of step St69.

[0144] The component mounting apparatus 1 raises the height of the needle ND, which is located at a height corresponding to the needle lift count (i-1), by a second height (e.g., 5 μm, 10 μm, etc.) using the needle lifting unit 156. The component mounting apparatus 1 then uses the component imaging unit 75 to image the measurement tip DT after the needle ND has been lifted (St75). The component mounting apparatus 1 repeatedly executes the process of step St75, and images the measurement tip DT each time the needle lifting unit 156 raises the height of the needle ND by a second height. The second height is smaller than the first height.

[0145] The component mounting device 1 detects the outer shape or size of the measurement chip DT shown in the captured image captured by the component imaging unit 75. The component mounting device 1 compares the outer shape or size of the detected measurement chip DT with the outer shape or size of the measurement chip DT previously stored in the memory unit M1 (such as the size of the measurement chip DT in the X and Y directions), and calculates the difference in outer shape or size between the detected measurement chip DT and the recorded measurement chip DT. Based on the calculation result, the component mounting device 1 determines whether the difference is equal to or greater than a predetermined area or size (i.e., whether there is a change in the captured measurement chip DT) (St76).

[0146] Here, the component mounting device 1 may execute the processing of step St76 for each imaging process by the component imaging unit 75, or may execute the processing of step St76 collectively for each of the multiple captured images captured while the needle lifting unit 156 raises the height of the needle ND from a height corresponding to the needle lift number (i-1) to a height corresponding to the needle lift number i.

[0147] If the component mounting device 1 determines in the processing of step St76 that the difference is greater than or equal to the specified area or size (St76, YES), it calculates the amount of positional deviation of the needle ND height based on the difference between the height of the needle ND when it last determined that the difference was not greater than or equal to the specified area or size and the origin position H0 of the needle ND (St77).

[0148] On the other hand, when it is determined in the process of step St76 that the difference is not equal to or greater than the predetermined area or the predetermined size (St76, NO), the component mounting apparatus 1 proceeds to the process of step St71.

[0149] Based on the calculated positional deviation, the component mounting apparatus 1 adjusts the height of the needle ND to the origin position H0 (see FIG. 26) by the needle lifting / lowering unit 156 (St78).

[0150] After adjusting the origin, the component mounting device 1 drives the holding head driving mechanism 87, and causes the adjustment head 77A to suck and collect the measuring chip DT placed on the carrier 27 (St79).

[0151] The component mounting device 1 lowers the ejector 25 by the ejector control unit C5 (St80), moves it to above the measurement chip table 34 held by the adjustment head 77A, and then places the measurement chip DT at a predetermined position on the measurement chip table 34 (St81).

[0152] The origin adjustment process of the needle ND described in steps St69 to St73 in Fig. 25 will be described with reference to Fig. 26 and Fig. 27. Fig. 26 is a diagram for explaining the procedure of the origin adjustment process. Fig. 27 is a diagram for explaining the image analysis process of the captured image captured by the component imaging unit 75.

[0153] The component mounting apparatus 1 increments the needle lift count i of the needle ND from 0 (zero) to 1 (i=1), and raises the needle ND from the origin height H0 by a first height (here, H0-H1A) to adjust it to a predetermined height H1A. After raising the height of the needle ND to the predetermined height H1A, the component mounting apparatus 1 images the measurement tip DT using the component imaging unit 75. The captured image SC1 shown in FIG. 27 is an image of the measurement tip DT captured when the needle lift count i=1.

[0154] The component mounting apparatus 1 detects the outer shape TP1 of the measurement tip DT from the captured image SC1. The component mounting apparatus 1 compares the outer shape AR of the measurement tip DT recorded in the memory unit M1 with the outer shape TP1 of the detected measurement tip DT, and determines whether there is any change in the outer shape of the captured and detected measurement tip DT. In the example shown in Figure 27, the component mounting apparatus 1 determines that there is no change in the outer shape of the measurement tip DT detected from the captured image SC1 captured when the needle lift count i = 1.

[0155] The component mounting apparatus 1 increments the needle lift count i of the needle ND from 0 (zero) to 1 (i=1), and raises the needle ND from the origin height H1A by a first height (here, H0-H1A) to adjust it to a predetermined height H1B. After raising the height of the needle ND to the predetermined height H1B, the component mounting apparatus 1 images the measurement tip DT using the component imaging unit 75. The captured image SC2 shown in FIG. 27 is an image of the measurement tip DT captured when the needle lift count i=2.

[0156] The component mounting apparatus 1 detects the outer shape TP2 of the measurement tip DT from the captured image SC2. The component mounting apparatus 1 compares the outer shape AR of the measurement tip DT recorded in the memory unit M1 with the outer shape TP2 of the detected measurement tip DT, and determines whether there is any change in the outer shape of the captured and detected measurement tip DT. In the example shown in Figure 27, the component mounting apparatus 1 determines that there is no change in the outer shape of the measurement tip DT detected from the captured image SC2 captured when the needle lift count i = 2.

[0157] The component mounting apparatus 1 repeats the above process and increments the needle lift count i of the needle ND to the needle lift count (i+1) until it is determined that there is a change in the measurement tip DT detected from the captured image. The component mounting apparatus 1 raises the needle ND by a first height (here, H0-H1A) and captures an image of the measurement tip DT using the component imaging unit 75. The component mounting apparatus 1 detects the measurement tip DT from the captured image and determines whether there is a change in the outer shape of the detected measurement tip DT.

[0158] The component mounting apparatus 1 repeatedly executes the above process until the number of times the needle rises i reaches the upper limit number of times M of the needle ND to rise.

[0159] The captured image SC3 is an image captured when the needle has ascended N times (i.e., the upper limit number of times M of the needle ND has ascended). As shown in FIG. 27, the height of the needle ND when the needle has ascended N times is higher by a height H3 than the height H2 of the upper surface of the ejector 25. At this time, the measuring tip DT is pushed up by the tip of the needle ND, which is positioned at the height H3, and is imaged by the component imaging unit 75 in a tilted state. The component mounting apparatus 1 detects the outer shape TP3 of the measuring tip DT from the captured image SC3. The component mounting apparatus 1 compares the outer shape AR of the measuring tip DT stored in the memory unit M1 with the outer shape TP3 of the detected measuring tip DT, and determines whether there has been a change in the outer shape of the measured measuring tip DT. Here, the component mounting apparatus 1 determines that there has been a change in the outer shape of the measuring tip DT detected from the captured image SC3 captured when the needle has ascended N times. If the component mounting apparatus 1 determines that there has been a change in the outer shape of the detected measuring tip DT, it generates and outputs an error notification.

[0160] FIG. 28 is a diagram illustrating a method for detecting a broken needle.

[0161] 28 is an image captured when the needle lift count i=N. The height of the needle ND when the needle lift count shown in FIG. 28 is N is lower by a height H4 than the upper surface height H2 of the ejector 25. At this time, the measuring tip DT is not pushed up by the tip of the needle ND located at the height H4, and is imaged by the component imaging unit 75 in a state where it is placed approximately horizontally on the upper surface of the ejector 25. If the component mounting device 1 determines that there is no change in the outer shape of the detected measuring tip DT based on the difference between the outer shape TP4 of the measuring tip DT detected from the captured image SC4 and the outer shape AR of the measuring tip DT stored in the memory unit M1, it detects a needle breakage of the needle ND that is the target of origin adjustment, and generates and outputs an error notification.

[0162] As described above, the component mounting apparatus 1 in the embodiment includes an ejector 25 on which a measuring tip DT (an example of a measuring component) is placed, the ejector 25 including a needle ND capable of pushing up the placed measuring tip DT and a needle lifting unit 156 (an example of a lifting unit) capable of raising and lowering the needle ND, a calculation unit C4 that calculates the height of the needle ND in the lifting direction of the needle ND, and a component mounting unit 156 that images the measuring tip DT placed on the upper surface of the ejector 25 from above as the needle ND is raised and lowered by the needle lifting unit 156. The device is equipped with an imaging unit 75 (an example of an imaging unit), and a control unit C1 (an example of a correction unit) that detects the measurement chip DT from the image captured by the component imaging unit 75, calculates the amount of positional deviation in the lifting and lowering direction of the needle ND (i.e., the Z direction) based on the outer shape of the detected measurement chip DT (for example, the outer shapes TP1, TP2, TP3, etc. shown in Figure 27) and the height of the needle ND calculated by the calculation unit C4, and corrects the height of the needle ND using the needle lifting and lowering unit 156 based on the calculated amount of positional deviation.

[0163] This allows the component mounting apparatus 1 in this embodiment to adjust (calibrate) the positional deviation in height of each needle ND.

[0164] As described above, the component mounting device 1 in the embodiment further includes a memory unit M1 that stores information on the outline AR of the measuring tip DT (an example of outline information), and when the control unit C1 determines that the difference between the detected outline of the measuring tip DT (for example, outlines TP1, TP2, TP3, etc. shown in FIG. 27) and the outline AR stored in the memory unit M1 is equal to or greater than a predetermined area (for example, an area corresponding to a few percent or 10% of the outline AR), it calculates the amount of positional deviation based on the height of the needle ND when it was last determined that the difference was not equal to or greater than the predetermined area. As a result, the component mounting device 1 in the embodiment can measure the height from the origin height of the needle ND to the height pushed up by the measuring tip DT based on the difference and whether the measuring tip DT has been pushed up by the needle ND, and can adjust the height of the needle ND to the origin position for each needle ND based on the measured length of the needle ND.

[0165] Furthermore, as described above, when the control unit C1 determines that the difference is not equal to or greater than the predetermined area, the ejector 25 in the component mounting apparatus 1 in this embodiment causes the needle lifting unit 156 to further raise the height of the needle ND by a first height (e.g., 10 μm, 30 μm, 50 μm, etc.). After the needle lifting unit 156 raises the needle ND by the first height, the component imaging unit 75 again captures an image of the measuring tip DT from above. The control unit C1 detects the measuring tip DT from the re-captured image and again determines whether the difference is equal to or greater than the predetermined area based on the outline of the detected measuring tip DT. As a result, the component mounting apparatus 1 in this embodiment repeatedly performs the process of raising the needle ND and the process of determining whether the difference is equal to or greater than the predetermined area until the needle ND is pushed up from the origin height of the needle ND to the measuring tip DT, thereby adjusting the height of the needle ND to the origin position for each needle ND based on the measured length of the needle ND.

[0166] Furthermore, as described above, the calculation unit C4 in the component mounting device 1 in the embodiment counts the first number of times the needle ND is raised by the lifting unit for each first height (i.e., the number of times the needle is raised i), and when it determines that the counted number of times the first raised number has exceeded the upper limit number of times M (an example of the upper limit number), it generates and outputs a notification that there is an abnormality in the needle ND. This allows the component mounting device 1 in the embodiment to detect and notify wear, breakage, etc., of the tip of the needle ND that pushes up the measurement tip DT.

[0167] Furthermore, as described above, when the control unit C1 determines that the difference is equal to or greater than the predetermined area, the ejector 25 in the component mounting apparatus 1 according to the embodiment causes the needle lifting unit 156 to lower the height of the needle ND by a first height and then raise it by a second height (e.g., 5 μm, 10 μm, etc.) that is lower than the first height. After the needle lifting unit 156 raises the needle ND by the second height, the component imaging unit 75 images the measuring tip DT from above. The control unit C1 detects the measuring tip DT from the captured image and determines again whether the difference is equal to or greater than the predetermined area based on the outer shape of the detected measuring tip DT. This allows the component mounting apparatus 1 according to the embodiment to more accurately calculate the amount of positional deviation in the height of the needle ND, thereby enabling more accurate origin adjustment (calibration) of the height of the needle ND.

[0168] Furthermore, as described above, when the control unit C1 determines that the difference is not equal to or greater than the predetermined area, the ejector 25 in the component mounting apparatus 1 according to the embodiment causes the needle lifting unit 156 to raise the height of the needle ND by a second height. After the needle lifting unit 156 raises the needle ND by the second height, the component imaging unit 75 captures an image of the measuring tip DT from above. The control unit C1 detects the measuring tip DT from the captured image and determines again whether the difference is equal to or greater than the predetermined area based on the outline of the detected measuring tip DT (e.g., outlines TP1, TP2, TP3, etc. shown in FIG. 27). As a result, the component mounting apparatus 1 according to the embodiment repeatedly performs the process of raising the needle ND and the process of determining whether the difference is equal to or greater than the predetermined area until the needle ND is pushed up from the origin height of the needle ND to the measuring tip DT, thereby enabling the height of the needle ND to be adjusted with high precision to the origin position for each needle ND based on the measured length of the needle ND.

[0169] Furthermore, as described above, the calculation unit C4 in the component mounting apparatus 1 in the embodiment counts the second number of times the needle ND is raised for each second height performed by the needle lifting unit 156 (i.e., the number of times the needle ND is raised for each second height by the needle lifting unit 156), and if it determines that the total raised height of the needle ND based on the counted number of second raises and the second height is equal to or greater than the first height, it generates and outputs a notification that there is an abnormality in the needle ND. Specifically, if the second height is 5 μm and the first height is 50 μm, the control unit C1 determines that the total raised height of the needle ND is equal to or greater than the first height if it determines that the second number of raises is equal to or greater than 10 times. This allows the component mounting apparatus 1 in the embodiment to detect and notify an abnormality in the needle ND that pushes up the measurement tip DT.

[0170] As described above, the component mounting apparatus 1 according to the embodiment further includes a carrier holding unit 21 having an opening 45 and a through-hole 52 penetrating in the vertical direction, and holding a carrier 27 that covers the opening 45 and carries at least one component to be mounted on the board 9. The ejector 25 is disposed below the through-hole 52. The component imaging unit 75 images the measuring chip DT placed on the upper surface of the ejector 25 through the through-hole 52. This allows the component mounting apparatus 1 according to the embodiment to image the measuring chip DT placed on the upper surface of the ejector 25 through the through-hole 52 even when the board 9 is being produced or the carrier 27 is covering the opening 45. In other words, the component mounting apparatus 1 according to the embodiment can perform the origin adjustment process for the needle ND even when the board 9 is being produced or the carrier 27 is covering the opening 45.

[0171] As described above, the component mounting apparatus 1 in the embodiment further includes a measuring chip table 34 (an example of a mounting table) on which the measuring chip DT is placed, and a pickup unit 23 (an example of a pickup section) that can pick up at least one measuring chip DT placed on the measuring chip table 34 and transport the measuring chip DT between the measuring chip table and the ejector 25. After the height of the needle ND is corrected by the control section C1, the pickup unit 23 picks up the measuring chip DT from the upper surface of the ejector 25, transports it to and places it on the measuring chip table 34. This allows the component mounting apparatus 1 in the embodiment to automatically perform the origin adjustment process for the needle ND.

[0172] As described above, the component mounting system 1000 according to the embodiment includes a component mounting device 1 that mounts components on a board 9, and at least one control computer P1 (an example of a computer) that can communicate with the component mounting device 1. The component mounting device 1 places a measuring tip DT on the upper surface of an ejector 25, raises and lowers a needle ND that is provided on the ejector 25 and can push up the measuring tip DT, calculates the height of the needle ND as the needle ND rises and falls in the raising and lowering direction, takes an image of the measuring tip DT placed on the upper surface of the ejector 25 from above, and transmits the calculated height of the needle ND and the captured image of the needle ND to the control computer P1. The control computer P1 detects the measuring tip DT from the transmitted captured image, and calculates the amount of positional deviation of the needle ND in the raising and lowering direction based on the outline of the detected measuring tip DT (for example, outlines TP1, TP2, TP3, etc. shown in FIG. 27 ) and the calculated height of the needle ND, and transmits the calculated amount of positional deviation of the needle ND in the raising and lowering direction to the component mounting device 1. The component mounting device 1 corrects the height of the needle ND based on the transmitted amount of misalignment. This allows the component mounting system 1000 according to the embodiment to adjust (calibrate) the misalignment in height of each needle ND and manage the misalignment in height of each needle ND.

[0173] Although various embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that those skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also fall within the technical scope of the present disclosure. Furthermore, the components of the various embodiments described above may be combined in any manner without departing from the spirit of the invention. [Industrial Applicability]

[0174] The present disclosure is useful as a component supply device, a calibration method, and a component supply system that efficiently adjust the origin of needle height. [Explanation of symbols]

[0175] 1. Component placement device 3. First parts supply device 5 Second parts supply device 9 Substrate 11 Placement head 21 Carrier holding part 23 Pickup unit 25, 25A, 25B Ejector 27 Career 34 Timing chip table 45 Aperture 52 Penetration 63 Unit movement mechanism 75 Parts imaging unit 156, 156A, 156B Needle lifting section 159 Ejector movement mechanism 1000 Component Placement System AR,TP1,TP2,TP3 External shape C1 control section C4 calculation section C5 Ejector control section DI1 die DT Measurement Chip LN Communication Network M1 storage section ND needle P1 Management Computer P10 Communications Department P11 Management and Control Unit P12 Management storage section SC1, SC2, SC3, SC4 captured images

Claims

1. an ejector having a needle on which a measurement component is placed and which can push up the placed measurement component and an elevating unit which can raise and lower the needle; a calculation unit that calculates a height of the needle in a direction in which the needle is raised and lowered; an imaging unit that images the measurement component placed on an upper surface of the ejector from above as the needle is raised and lowered by the lifting unit; a correction unit that detects the measurement part from an image captured by the imaging unit, calculates a positional deviation amount of the needle in the lifting and lowering direction based on an outer shape of the detected measurement part and the height of the needle calculated by the calculation unit, and corrects the height of the needle based on the calculated positional deviation amount. Component placement device.

2. Further, a storage unit that stores external shape information of the measurement component is provided, the correction unit calculates the amount of positional deviation based on the height of the needle when it is determined that the difference between the outer shape of the detected measurement component and the outer shape information stored in the storage unit is equal to or greater than a predetermined area.

2. The component mounting device according to claim 1.

3. When the correction unit determines that the difference is not equal to or greater than the predetermined area, the ejector causes the lifting unit to further raise the height of the needle by a first height, the imaging unit takes an image of the measurement component from above again after the elevating unit has raised the needle by the first height; the correction unit detects the measurement part from the captured image captured again, and determines again whether or not the difference is equal to or greater than the predetermined area based on the outer shape of the detected measurement part.

3. The component mounting device according to claim 2.

4. the calculation unit counts a first number of times the needle is raised to each of the first heights by the lifting unit, and when it determines that the counted first number of times the needle is raised exceeds an upper limit number of times, generates and outputs a notice that there is an abnormality in the needle.

4. The component mounting apparatus according to claim 3.

5. when the correction unit determines that the difference is equal to or greater than the predetermined area, the ejector causes the lifting unit to lower the height of the needle by a first height and then raise the height of the needle by a second height that is lower than the first height; the imaging unit images the measurement component from above after the elevating unit has raised the needle to the second height, the correction unit detects the measurement part from the captured image, and determines again whether or not the difference is equal to or greater than the predetermined area based on the outer shape of the detected measurement part.

3. The component mounting device according to claim 2.

6. When the correction unit determines that the difference is not equal to or greater than the predetermined area, the ejector causes the lifting unit to raise the height of the needle by the second height, the imaging unit images the measurement component from above after the elevating unit has raised the needle to the second height, the correction unit detects the measurement part from the captured image, and determines again whether or not the difference is equal to or greater than the predetermined area based on the outer shape of the detected measurement part.

6. The component mounting apparatus according to claim 5.

7. the calculation unit counts the number of second ascents of the needle performed by the lifting unit for each of the second heights, and when it determines that the total ascent height of the needle based on the counted number of second ascents and the second height is equal to or greater than the first height, generates and outputs a notification that there is an abnormality in the needle.

7. The component mounting device according to claim 5 or 6.

8. a carrier holder that has an opening that penetrates in the vertical direction and a through-hole, and that covers the opening and holds a carrier that carries at least one component to be mounted on the board, The ejector is disposed below the penetration portion, the imaging unit images the measurement component placed on the upper surface of the ejector through the through-hole.

2. The component mounting device according to claim 1.

9. a mounting stage on which the measurement component is mounted; a pickup unit that picks up at least one of the measurement components placed on the placement stage and is capable of transporting the measurement component between the placement stage and the ejector, the pickup unit picks up the measurement component from the upper surface of the ejector after the height of the needle has been corrected by the correction unit, and transports and places the measurement component on the placement stage.

2. The component mounting device according to claim 1.

10. 1. A calibration method implemented by at least one computer, comprising: Place the measurement part on the top of the ejector. Raising and lowering a needle provided in the ejector and capable of pushing up the measurement component; calculating a height of the needle in accordance with the elevation of the needle in an elevation direction; taking an image of the measurement part placed on the upper surface of the ejector from above; Detecting the measurement part from the captured image; calculating a positional deviation amount of the needle in the lifting direction based on the detected outer shape of the measurement component and the calculated height of the needle; correcting the height of the needle based on the calculated amount of positional deviation; Calibration method.

11. a component mounting device that mounts components onto a board; a component placement system including at least one computer capable of communicating with the component placement device, The component mounting device Place the measurement part on the top of the ejector. Raising and lowering a needle provided in the ejector and capable of pushing up the measurement component; calculating a height of the needle in accordance with the elevation of the needle in an elevation direction; taking an image of the measurement part placed on the upper surface of the ejector from above; transmitting the calculated height of the needle and the captured image of the measurement part to the computer; The computer Detecting the measurement part from the transmitted captured image; calculating a positional deviation amount of the needle in the lifting direction based on the detected outer shape of the measurement component and the calculated height of the needle, and transmitting the calculated positional deviation amount to the component mounting device; The component mounting device correcting the height of the needle based on the transmitted positional deviation amount; Parts mounting system.

Images